LED integrated unit, display device, manufacturing method, and manufacturing apparatus

Abstract

The application discloses an LED integrated unit, a display device, a manufacturing method and a manufacturing device. The LED integrated unit comprises a base and an LED wafer arranged on the top of the base. The base comprises a first electrode and a second electrode electrically connected with the LED wafer respectively, and a capacitor electrically connected between the first electrode and the second electrode. The capacitor is arranged to allow an alternating welding current to be transmitted between the first electrode and the second electrode through the capacitor. The alternating welding current melts a first solder in contact with the first electrode and / or a second solder in contact with the second electrode. The application arranges the first electrode and the second electrode electrically connected with the LED wafer respectively and the capacitor electrically connected between the first electrode and the second electrode on the base of the LED integrated unit. The first solder in contact with the first electrode and / or the second solder in contact with the second electrode are melted by the alternating welding current. The LED integrated unit is transferred and welded on a substrate. The structure of the LED integrated unit is simple, and the LED integrated unit is convenient to weld with the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor optoelectronic technology, in particular to an LED integrated unit, a display device, a manufacturing method and a manufacturing equipment. BACKGROUND

[0002] Micro-LED is applied to large-screen display. After the LED is manufactured on a substrate, the LED is separated from the substrate, and then the Micro-LED chip is assembled on a substrate with a larger size and a logic circuit through massive transfer, so as to meet the application requirement of large-size display. In addition, the application of flexible display requires that the LED be transferred to a flexible substrate, and massive transfer is also required to be realized. The massive transfer of Micro-LED display refers to separating the LED chip grown on a source substrate from the source substrate and rapidly, accurately and reliably transferring the chip to a display electronic device through a certain force.

[0003] Since the massive transferred LED is too small, when the LED is transferred and welded to the substrate, there is a problem that electrode welding is very difficult. SUMMARY

[0004] The purpose of the present application is to provide at least one LED integrated unit, a display device, a manufacturing method and a manufacturing equipment, so as to solve the problem that electrode welding is difficult when the LED is transferred and welded to the substrate.

[0005] The first embodiment of the present application provides an LED integrated unit. The LED integrated unit comprises a pedestal and an LED wafer arranged on the top of the pedestal. The pedestal comprises a first electrode and a second electrode electrically connected with the LED wafer respectively, and a capacitor electrically connected between the first electrode and the second electrode. The capacitor is arranged to allow alternating welding current to be transmitted between the first electrode and the second electrode through the capacitor. The alternating welding current causes the first solder in contact with the first electrode and / or the second solder in contact with the second electrode to melt.

[0006] The second embodiment of the present application provides an LED display device. The LED display device comprises a driving backboard and a plurality of LED integrated units. The driving backboard is provided with a plurality of accommodation areas. The plurality of LED integrated units are arranged in the corresponding accommodation areas respectively. Each LED integrated unit comprises a pedestal and an LED wafer arranged on the top of the pedestal. The pedestal comprises a first electrode and a second electrode electrically connected with the LED wafer respectively, and a capacitor electrically connected between the first electrode and the second electrode. Each accommodation area is provided with a third electrode and a fourth electrode. The third electrode is in contact with the first electrode through the first solder, and / or the fourth electrode is in contact with the second electrode through the second solder. The capacitor is arranged to allow alternating welding current to be transmitted between the third electrode and the fourth electrode through the capacitor. The alternating welding current causes the first solder and / or the second solder to melt.

[0007] The third embodiment of the present application provides a manufacturing method of an LED display device, the manufacturing method comprising:

[0008] providing a plurality of LED integrated units, wherein each LED integrated unit comprises a pedestal and an LED wafer disposed on top of the pedestal, the pedestal comprising a first electrode and a second electrode electrically connected to the LED wafer respectively, and a capacitor electrically connected between the first electrode and the second electrode;

[0009] providing a driving backplane, wherein the driving backplane is provided with a plurality of accommodating regions, and the plurality of LED integrated units are respectively disposed in the corresponding accommodating regions, and each accommodating region is provided with a third electrode and a fourth electrode;

[0010] positioning the plurality of LED integrated units into the corresponding accommodating regions respectively, so that the third electrode is in contact with the first electrode through a first solder, and / or the fourth electrode is in contact with the second electrode through a second solder;

[0011] providing an alternating current welding current flowing through the capacitor between the third electrode and the fourth electrode, wherein the alternating current welding current melts the first solder and / or the second solder.

[0012] The fourth embodiment of the present application provides a manufacturing equipment of an LED display device, the manufacturing equipment comprising:

[0013] a container for accommodating a plurality of LED integrated units, wherein each LED integrated unit comprises a pedestal and an LED wafer disposed on top of the pedestal, the pedestal comprising a first electrode and a second electrode electrically connected to the LED wafer respectively, and a capacitor electrically connected between the first electrode and the second electrode;

[0014] a carrier for carrying a driving backplane, wherein the driving backplane is provided with a plurality of accommodating regions, and the plurality of LED integrated units are respectively disposed in the corresponding accommodating regions, and each accommodating region is provided with a third electrode and a fourth electrode;

[0015] a positioning mechanism for positioning the plurality of LED integrated units into the corresponding accommodating regions respectively, so that the third electrode is in contact with the first electrode through a first solder, and / or the fourth electrode is in contact with the second electrode through a second solder;

[0016] an alternating current generator for providing an alternating current welding current flowing through the capacitor between the third electrode and the fourth electrode, wherein the alternating current welding current melts the first solder and / or the second solder.

[0017] Different from the prior art, the first electrode and the second electrode which are electrically connected with the LED wafer respectively and the capacitor which is electrically connected between the first electrode and the second electrode are arranged on the base of the LED integrated unit, then the first solder which is in contact with the first electrode and / or the second solder which is in contact with the second electrode is melted by the alternating welding current, and the LED integrated unit is transferred to the substrate, the structure of the LED integrated unit is simple, and the LED integrated unit is convenient to weld with the substrate.

[0018] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, but not limiting the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 is a structural schematic diagram of an embodiment of the LED integrated unit of the present application;

[0021] Figure 2 is another structural schematic diagram of an embodiment of the LED integrated unit of the present application;

[0022] Figure 3 is a structural schematic diagram of an embodiment of the LED display device of the present application;

[0023] Figure 4 is another structural schematic diagram of an embodiment of the LED display device of the present application;

[0024] Figure 5 is a structural schematic diagram of an embodiment of the manufacturing equipment of the LED display device of the present application;

[0025] Figure 6 is a flow schematic diagram of an embodiment of the manufacturing method of the LED display device of the present application;

[0026] Figure 7 is Figure 6 is a specific flow schematic diagram of step S13 and step S14 in the method;

[0027] Figure 8 is Figure 7 is a specific flow schematic diagram of step S131 in the method;

[0028] Figure 9 is Figure 7 is a specific flow schematic diagram of step S142 in the method. DETAILED DESCRIPTION

[0029] To enable those skilled in the art to better understand the technical solutions of this application, the LED integrated unit, display device, manufacturing method, and manufacturing equipment provided in this application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It is understood that the described embodiments are merely some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0030] The terms "first," "second," etc., used in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0031] This application provides an LED display device to solve the problem of electrode welding difficulties during LED transfer bonding to a substrate. Please refer to [link to relevant documentation]. Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an embodiment of the LED display device of this application. Figure 2 This is another structural schematic diagram of an embodiment of the LED integrated unit of this application.

[0032] like Figure 1 As shown, the LED integration unit 10 includes a base 11 and an LED chip 12 disposed on top of the base 11. Specifically, as... Figure 2 As shown, in this embodiment, the base 11 is arranged in an inverted frustum shape in the direction away from the LED chip 12. Optionally, in this embodiment, the average density of the base 11 is greater than the average density of the LED chip 12.

[0033] Furthermore, such as Figure 2 As shown, the base 11 includes a first electrode 111, a second electrode 112, and a capacitor 113. The first electrode 111 and the second electrode 112 are electrically connected to the LED chip 12, and the capacitor 113 is electrically connected between the first electrode 111 and the second electrode 112. An insulating layer is provided between the capacitor 113 and the LED chip 12.

[0034] The capacitor 113 is configured to allow the AC welding current to pass through the capacitor 113 between the first electrode 111 and the second electrode 112, so that the first solder in contact with the first electrode 111 and / or the second solder in contact with the second electrode 112 is melted, and then the LED integrated unit 10 is welded to the substrate by the first solder and / or the second solder.

[0035] Specifically, the first electrode 111 has a first electrode surface on the peripheral sidewall of the base 11, the second electrode 112 has a second electrode surface on the bottom of the base 11, the first solder is in contact with the first electrode surface, and / or the second solder is in contact with the second electrode surface. The first solder and the second solder can be eutectic solder coated on the electrode surface, can be coated on the first electrode and the second electrode, and / or can be coated on the third electrode and the fourth electrode.

[0036] The first electrode 111 and the second electrode 112 are spaced apart by the capacitor 113, and the base 11 further comprises a flow barrier layer (not shown in the figure) arranged on the outer surface of the capacitor 113. Specifically, the flow barrier layer is a hydrophobic layer, which is used to prevent the melted first solder and / or the melted second solder from flowing between the first electrode 111 and the second electrode 112, thereby preventing the first electrode 111 and the second electrode 112 from being short-circuited.

[0037] Further, the capacitor 113 of the embodiment is configured to store static charges on the first electrode 111 and the second electrode 112, thereby allowing the LED integrated unit 10 to be oriented in a directional electric field. Specifically, within the range of circuit trace tolerance, the embodiment gives the first electrode 111 and the second electrode 112 a stable high voltage, so that a certain size of electric field is generated between the first electrode 111 and the second electrode 112, and the direction and angle of the electric field can be changed by changing the direction of the voltage, so as to change the direction and angle of the LED integrated unit 10.

[0038] As shown in Figure 1 The bottom of the base 11 is provided with a positioning recess 13, and the second electrode 112 is located in the positioning recess 13. Specifically, the second electrode 112 is arranged at the bottom of the positioning recess 13, and the first electrode 111 and the second electrode 112 are isolated by the sidewall of the positioning recess 13, so as to prevent the first electrode 111 and the second electrode 112 from being short-circuited during welding.

[0039] Optionally, the LED wafer 12 of the embodiment can include LEDs of multiple light emitting colors. In order to reduce the welding difficulty, batch welding is adopted, that is, the LED wafers 12 of the same light emitting color are welded simultaneously, and the LEDs of the same batch are welded to a certain distance of the accommodation area 23 to avoid mutual influence.

[0040] The base 11 of the LED integrated unit 10 is provided with a first electrode 111 and a second electrode 112 electrically connected with the LED wafer 12 respectively, and a capacitor 113 electrically connected between the first electrode 111 and the second electrode 112, and then the first solder in contact with the first electrode 111 and / or the second solder in contact with the second electrode 112 is melted by the alternating welding current, so as to realize the transfer of the LED integrated unit 10 to the substrate, and the structure of the LED integrated unit 10 is simple and convenient for welding with the substrate.

[0041] The application further provides an LED display device, referring to Figure 3 and Figure 4 , Figure 3 is a structural schematic diagram of an embodiment of the LED display device of the application, Figure 4 is another structural schematic diagram of an embodiment of the LED display device of the application.

[0042] As Figure 3 shown, the LED display device 20 comprises a driving backboard 21 and a plurality of LED integrated units 22. The LED integrated unit 22 is the LED integrated unit 10 described in the above embodiment, which will not be described here.

[0043] The driving backboard 21 is provided with a plurality of accommodating areas 23, and the plurality of LED integrated units 22 are arranged in the corresponding accommodating areas 23. As Figure 4 shown, the third electrode 231 and the fourth electrode 232 are arranged in each accommodating area 23, the third electrode 231 is in contact with the first electrode 111 through the first solder, and / or the fourth electrode 232 is in contact with the second electrode 112 through the second solder. Further, the capacitor 113 is also arranged to allow the alternating welding current to be transmitted between the third electrode 231 and the fourth electrode 232 through the capacitor 113, so that the first solder and / or the second solder is melted, thereby realizing the welding of the LED integrated unit 22 in the accommodating area 23.

[0044] Specifically, the accommodating area 23 is arranged in a recessed manner, wherein the base 11 and the accommodating area 23 are arranged in an inverted frustum shape in a direction away from the LED wafer 12, and the size of the accommodating area 23 is greater than the size of the base 11, so that the base 11 can be completely arranged in the accommodating area 23.

[0045] The third electrode 231 has a third electrode surface on the circumferential wall of the accommodating area 23, the fourth electrode 232 has a fourth electrode surface on the bottom of the accommodating area 23, the first solder is clamped between the first electrode surface and the third electrode surface, and / or the second solder is clamped between the second electrode surface and the fourth electrode surface. Optionally, the surface of the third electrode 231 is a ring-shaped discontinuous strip electrode, and different connection areas are provided with different thickness and granularity of solder.

[0046] Further, the bottom of the accommodating area 23 is provided with a positioning boss 24 matched with the positioning recess 13, the second electrode 112 is located in the positioning recess 13, and the fourth electrode 232 is located on the positioning boss 24. Wherein, the second solder for welding the second electrode 112 and the fourth electrode 232 is only arranged on the positioning boss 24, and when the second solder is melted, the second solder cannot be welded with the first solder, thereby causing the first electrode 111 and the second electrode 112 to be short-circuited, and / or the third electrode 231 and the fourth electrode 232 to be short-circuited.

[0047] The LED display device 20 of the present application is provided with a plurality of accommodating areas 23, and the third electrode 231 and the fourth electrode 232 are arranged in the accommodating area 23. By arranging the capacitor 113 to allow the alternating current welding current to be transmitted between the third electrode 231 and the fourth electrode 232 through the capacitor 113, the alternating current welding current melts the first solder clamped between the third electrode 231 and the first electrode 111 and / or the second solder clamped between the fourth electrode 232 and the second electrode 112, so as to weld the plurality of LED integrated units 22 arranged in the accommodating area 23 to the LED display device 20. The structure of the LED display device 20 is simple, and the welding is convenient.

[0048] The present application also provides a manufacturing equipment of an LED display device, which is used for manufacturing the LED display device 20 as described in the above embodiments. Please refer to Figure 5 , Figure 5 which is a structural schematic diagram of an embodiment of the manufacturing equipment of the LED display device of the present application.

[0049] As shown in Figure 5 , the manufacturing equipment 30 comprises a container 31, a carrier 32, a positioning mechanism 33, and an alternating current generator 34. Wherein, the container 31 is used for accommodating a plurality of LED integrated units 22, the carrier 32 is used for carrying the driving backboard 21, the positioning mechanism 33 is used for positioning the plurality of LED integrated units 22 into the corresponding accommodating areas 23 respectively, and the alternating current generator 34 is used for providing the alternating current welding current flowing through the capacitor 113 between the third electrode 231 and the fourth electrode 232.

[0050] Specifically, when the plurality of LED integrated units 22 are taken out from the container 31 and arranged in the corresponding accommodating areas 23, i.e. when the LED integrated units 22 stored in the container 31 are transferred to the driving backboard 21, the manufacturing equipment 30 positions the plurality of LED integrated units 22 into the corresponding accommodating areas 23 respectively by the positioning mechanism 33, so as to make the third electrode 231 contact with the first electrode 111 through the first solder, and / or the fourth electrode 232 contact with the second electrode 112 through the second solder.

[0051] The manufacturing apparatus 30 further provides an alternating current welding current through the capacitor 113 between the third electrode 231 and the fourth electrode 232 by the alternating current generator 34, so as to melt the first solder and / or the second solder by the alternating current welding current, and thereby weld the plurality of LED integrated units 22 into the corresponding accommodation regions 23.

[0052] Optionally, in the embodiment, the positioning mechanism 33 is a voltage generator. Since the LED integrated units 22 are loaded with static charges, i.e. the first electrode 111 and the second electrode 112 store static charges, the voltage generator provides a directional voltage to the third electrode 231 and / or the fourth electrode 232, so as to position the LED integrated units 22 into the accommodation regions 23 by the interaction between the directional electric field formed by the third electrode 231 and / or the fourth electrode 232 and the static charges on the LED integrated units 22.

[0053] Specifically, the voltage generator provides a first directional voltage to the fourth electrode 232, so as to attract the LED integrated units 22 into the accommodation regions 23 and form an alignment contact between the second electrode surface and the fourth electrode surface, and further provides a second directional voltage to the third electrode 231 to form an alignment contact between the first electrode surface and the third electrode surface.

[0054] Further, as shown in Figure 5 , the manufacturing apparatus 30 of the embodiment further comprises a charging mechanism 35 for charging the capacitor 113, and thereby storing static charges on the first electrode 111 and the second electrode 112.

[0055] Further, as shown in Figure 5 , the manufacturing apparatus 30 of the embodiment further comprises a conduction detection mechanism 36 for determining whether a current loop is formed between the third electrode 231 and the fourth electrode 232 through the LED integrated units 22 during the existence of the alternating current welding current, and if not, generating an adjustment indication signal to indicate the voltage generator or an additional positioning mechanism to adjust the position of the LED integrated units 22 in the accommodation regions 23.

[0056] Optionally, since the driving backboard 21 is provided with a plurality of accommodation regions 23, and the arrangement of the plurality of accommodation regions 23 is very dense, the LED chips 12 of different light emitting colors or the LED chips 12 of specific intervals can be selected in batches, so as to perform current loop detection on the LED integrated units 22 in the plurality of accommodation regions 23 in batches. Therefore, the manufacturing apparatus 30 further comprises a welding selection control unit 37 for selecting a plurality of accommodation regions 23 of a preset pixel interval as welding objects of a welding program in the welding program.

[0057] Specifically, the voltage generator adjusts the magnitude of the directional voltage on the third electrode 231 and / or the fourth electrode 232 and / or the direction of the directional electric field of the third electrode 231 and / or the fourth electrode 232 in response to the adjustment instruction signal.

[0058] Optionally, in the present embodiment, the position adjustment mechanism can be an acoustic wave generator, which provides low-frequency acoustic waves to the driving backboard 21 and the LED integrated unit 22 in response to the adjustment instruction signal, so that the LED integrated unit 22 jumps in the accommodating area 23; or / and, the acoustic wave generator provides high-frequency acoustic waves to the driving backboard 21 and the LED integrated unit 22 in response to the adjustment instruction signal, so that the LED integrated unit 22 vibrates in the accommodating area 23. On the other hand, since the average density of the base 11 of the LED integrated unit 22 is greater than the average density of the LED wafer 12, the gravity of the LED integrated unit 22 will make the jumping or vibrating LED integrated unit 22 fall down, and by making the LED integrated unit 22 jump and vibrate multiple times, the LED integrated unit 22 will fall into the corresponding accommodating area 23.

[0059] Specifically, the acoustic wave generator includes acoustic waves of multiple frequency bands of long-wave first frequency band and short-wave second frequency band, wherein the first frequency band is used to stimulate the LED integrated unit 22 to jump in a large range, and the second frequency band is used to stimulate the LED integrated unit 22 to vibrate in a small range.

[0060] In another embodiment, the manufacturing device 30 further includes a suspension mechanism, which provides a suspension force to the plurality of LED integrated units 22, so that the plurality of LED integrated units 22 are suspended above the driving backboard 21.

[0061] Wherein, the conduction detection mechanism 36 is used to determine whether a current loop is formed between the third electrode 231 and the fourth electrode 232 through the LED integrated unit 22 after the LED integrated unit 22 is positioned into the accommodating area 23 and before the alternating welding current is generated, and if the current loop is not formed, a repositioning instruction signal is generated, the suspension mechanism changes the suspension force in response to the repositioning instruction signal, or the positioning mechanism 33 changes the positioning force of the LED integrated unit 22 in response to the repositioning instruction signal, or the alternating welding current is turned on again to melt the connection, so that the LED integrated unit 22 is moved out of the accommodating area 23.

[0062] Optionally, the suspension mechanism of the present embodiment includes an air floating system or / and a magnetic suspension system for reducing or offsetting the gravity of the LED integrated unit 22. Wherein, the magnetic suspension system can generate a uniform magnetic field, which can penetrate the driving backboard 21 and offset part of the gravity of the LED integrated unit 22, so that the LED integrated unit 22 is more easily suspended above the driving backboard 21.

[0063] Further, the manufacturing device 30 of the embodiment includes multiple working modes, and the manufacturing device 30 is connected with a controller, and the multiple working modes are switched under the control of the controller. Specifically, a first mode is that, within the tolerance range of the circuit trace, a certain size of electric field is generated between the third electrode 231 and the fourth electrode 232 by giving the third electrode 231 and the fourth electrode 232 a stable high voltage, and the direction and angle of the electric field can be changed by changing the direction of the voltage. A second mode is that, within the tolerance range of the circuit trace, high-frequency alternating current is given to the third electrode 231 and the fourth electrode 232, and the alternating welding current forms a loop by the characteristic of the capacitor 113 to make the first solder between the first electrode 111 and the third electrode 231 and / or the second solder between the second electrode 112 and the fourth electrode 232 melt, thereby realizing the welding function. A third mode is that, the third electrode 231 and the fourth electrode 232 are given normal LED driving current, and the current and voltage conditions are detected by a sensor, and whether the LED integrated unit 22 is well connected with the third electrode 231 and the fourth electrode 232 is judged according to the current and voltage information; and when it is judged that the welding is good, the manufacturing device 30 can record the welding condition and lock the accommodation area 23, and the welding operation is not performed on the accommodation area 23 in the next welding process.

[0064] The manufacturing device 30 of the application realizes the generation of electric field, welding, and detection on the third electrode 231 and the fourth electrode 232, and has a simple structure. On the other hand, the manufacturing device 30 of the application combines electromagnetic force and acoustic wave principle, can adjust the position of the LED integrated unit 22 in the accommodation area 23, and can perform multiple exploratory welding, thereby ensuring the yield of finished products.

[0065] The application further provides a manufacturing method of an LED display device, and the execution subject of the manufacturing method can be the manufacturing device 30 of the LED display device of the above embodiment, which is used to manufacture the LED display device 20 of the above embodiment. Please refer to Figure 6 , Figure 6 which is a flowchart of an embodiment of the manufacturing method of the LED display device of the application. Specifically, as shown in Figure 6 , the wafer testing method of the application can include the following steps:

[0066] Step S11: providing multiple LED integrated units.

[0067] In the embodiment, the multiple LED integrated units 22 can be obtained from the container 31. Specifically, the container 31 can be a small-size substrate, and the multiple LED integrated units 22 on the small-size substrate are transferred to a larger-size substrate with a logic circuit or a flexible substrate by a mass transfer method.

[0068] Wherein, the embodiment can further charge the capacitor 113 through the charging mechanism 35, and then store static electricity on the first electrode 111 and the second electrode 112.

[0069] Step S12: providing a driving backboard.

[0070] Wherein, the embodiment provides a driving backboard 21 arranged on the carrier 32.

[0071] Step S13: positioning the plurality of LED integrated units into the corresponding accommodating areas respectively, so that the third electrode contacts the first electrode through the first solder, and / or the fourth electrode contacts the second electrode through the second solder.

[0072] Wherein, the embodiment positions the plurality of LED integrated units 22 into the corresponding accommodating areas 23 respectively through the positioning mechanism 33, so that the third electrode 231 contacts the first electrode 111 through the first solder, and / or the fourth electrode 232 contacts the second electrode 112 through the second solder.

[0073] Optionally, before positioning the plurality of LED integrated units 22 into the corresponding accommodating areas 23 respectively, the step S15 can be further executed. Specifically, the step is shown as follows:

[0074] Step S15: providing a levitation force to the plurality of LED integrated units, so that the plurality of LED integrated units are levitated above the driving backboard.

[0075] Wherein, the embodiment provides a levitation force to the plurality of LED integrated units 22 through the levitation mechanism, so that the plurality of LED integrated units 22 are levitated above the driving backboard 21.

[0076] Optionally, after positioning the plurality of LED integrated units 22 into the corresponding accommodating areas 23 respectively, the steps S16 and S17 (not shown in the figure) can be further executed. Specifically, the steps are shown as follows:

[0077] Step S16: judging whether a current loop is formed between the third electrode and the fourth electrode through the LED integrated unit.

[0078] Wherein, the embodiment judges whether a current loop is formed between the third electrode 231 and the fourth electrode 232 through the LED integrated unit 22 through the conduction detection mechanism 36, and executes the step S17 when it is judged that the current loop is not formed.

[0079] Step S17: if the current loop is not formed, changing the levitation force or the positioning force of the plurality of LED integrated units to the accommodating areas, or re-inputting the alternating current welding current to make the connection melt, so that the LED integrated unit is moved out of the accommodating area.

[0080] In the embodiment, the on detection mechanism 36 generates a repositioning indication signal, and the levitation mechanism responds to the repositioning indication signal to change the levitation force, or the positioning mechanism 33 responds to the repositioning indication signal to change the positioning force on the LED integrated unit 22, so that the LED integrated unit 22 moves out of the accommodation area 23, thereby adjusting the position of the LED integrated unit 22 in the accommodation area 23.

[0081] Step S14: providing an alternating welding current flowing through the capacitor between the third electrode and the fourth electrode.

[0082] In the embodiment, the alternating current generator 34 provides an alternating welding current flowing through the capacitor 113 between the third electrode 231 and the fourth electrode 232, so that the first solder and / or the second solder is melted.

[0083] Optionally, the process of providing an alternating welding current flowing through the capacitor between the third electrode and the fourth electrode can be as shown in the flowchart of Figure 7 , please continue to refer to Figure 7 , Figure 7 is Figure 6 the specific flowchart of step S13 and step S14 in the embodiment. Specifically, the following steps are included:

[0084] Step S131: providing a directional voltage to the third electrode and / or the fourth electrode to position the LED integrated unit into the accommodation area by the interaction between the directional electric field formed by the third electrode and / or the fourth electrode and the static electric charge on the LED integrated unit.

[0085] In the embodiment, the voltage generator provides a directional voltage to the third electrode 231 and / or the fourth electrode 232 to position the LED integrated unit 22 into the accommodation area 23 by the interaction between the directional electric field formed by the third electrode 231 and / or the fourth electrode 232 and the static electric charge on the LED integrated unit 22.

[0086] Optionally, the process of providing a directional voltage to the third electrode and / or the fourth electrode can be as shown in the flowchart of Figure 8 , please continue to refer to Figure 8 , Figure 8 is Figure 7 the specific flowchart of step S131 in the embodiment. Specifically, the following steps are included:

[0087] Step S1311: providing a first directional voltage to the fourth electrode to attract the LED integrated unit into the accommodation area and form an alignment contact between the second electrode surface and the fourth electrode surface.

[0088] The first directional voltage is provided by the voltage generator to the fourth electrode 232 to attract the LED integrated unit 22 into the accommodating area 23 and form the alignment contact between the second electrode surface and the fourth electrode surface.

[0089] Step S1312: providing the second directional voltage to the third electrode to form the alignment contact between the second electrode surface and the third electrode surface.

[0090] The second directional voltage is further provided by the voltage generator to the third electrode 231 to form the alignment contact between the first electrode surface and the third electrode surface.

[0091] Step S141: judging whether a current loop is formed between the third electrode and the fourth electrode through the LED integrated unit.

[0092] The step S141 is the same as the step S16, and thus is not described herein.

[0093] Step S142: adjusting the position of the LED integrated unit in the accommodating area if the current loop is not formed.

[0094] When the on-off detection mechanism 36 judges that the current loop is not formed between the third electrode 231 and the fourth electrode 232 through the LED integrated unit 22, the position of the LED integrated unit 22 in the accommodating area 23 needs to be adjusted, and the on-off detection mechanism 36 generates an adjustment instruction signal.

[0095] The manufacturing device 30 adjusts the position of the LED integrated unit 22 in the accommodating area 23 according to the adjustment instruction signal generated by the on-off detection mechanism 36. When the positioning mechanism 33 is the voltage generator, the step S1421 is performed; when the position adjustment mechanism is the sound wave generator, the step S1422 or the step S1423 is performed.

[0096] Alternatively, the process of adjusting the position of the LED integrated unit in the accommodating area can be as shown in the flowchart of Figure 9 , and please refer to Figure 9 , Figure 9 , which is a specific flowchart of the step S142. Specifically, the process includes the following steps: Figure 7

[0097] Step S1421: adjusting the size of the directional voltage on the third electrode and / or the fourth electrode and / or the direction of the directional electric field of the third electrode and / or the fourth electrode if the current loop is not formed.

[0098] ​The embodiment adjusts the directional voltage on the third electrode 231 and / or the fourth electrode 232 and / or the directional electric field direction of the third electrode 231 and / or the fourth electrode 232 in response to the adjustment instruction signal through the voltage generator.

[0099] Specifically, the embodiment changes the directional voltage on the third electrode 231 and / or the fourth electrode 232 and / or the directional electric field direction of the third electrode 231 and / or the fourth electrode 232, and further changes the electric field direction and angle between the first electrode 111 and / or the second electrode 112, so as to change the direction and angle of the LED integrated unit 22.

[0100] Step S1422: If the current loop is not formed, low-frequency sound waves are provided to the driving backboard and the LED integrated unit, so that the LED integrated unit generates jumping in the accommodating area.

[0101] The embodiment provides low-frequency sound waves to the driving backboard 21 and the LED integrated unit 22 through the sound wave generator, so that the LED integrated unit 22 generates jumping in the accommodating area 23.

[0102] Step S1423: If the current loop is not formed, high-frequency sound waves are provided to the driving backboard and the LED integrated unit, so that the LED integrated unit generates vibration in the accommodating area.

[0103] The embodiment provides high-frequency sound waves to the driving backboard 21 and the LED integrated unit 22 through the sound wave generator, so that the LED integrated unit 22 generates vibration in the accommodating area 23.

[0104] The above is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent flow transformation, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. An LED integrated unit, characterized by, The LED integrated unit comprises a base and an LED wafer arranged on top of the base, the base comprises a first electrode and a second electrode electrically connected with the LED wafer respectively, and a capacitor electrically connected between the first electrode and the second electrode, wherein the capacitor is arranged to allow an alternating welding current to be transmitted between the first electrode and the second electrode through the capacitor, the alternating welding current melts a first solder in contact with the first electrode and / or a second solder in contact with the second electrode; wherein the first electrode and the second electrode are spaced by the capacitor, the base further comprises a flow barrier layer arranged on an outer surface of the capacitor, the flow barrier layer is used to prevent the melted first solder and / or the melted second solder from flowing between the first electrode and the second electrode; the first electrode has a first electrode surface located on a peripheral sidewall of the base, the second electrode has a second electrode surface located on a bottom of the base, the first solder is in contact with the first electrode surface, and / or the second solder is in contact with the second electrode surface; the bottom of the base is provided with a positioning recess, and the second electrode is located in the positioning recess.

2. The LED integrated unit according to claim 1, characterized in that, The base is arranged in an inverted frustum shape in a direction away from the LED wafer.

3. The LED integrated unit according to claim 1, characterized in that, The average density of the base is greater than the average density of the LED wafer.

4. The LED integrated unit according to claim 1, characterized in that, The capacitor is arranged to store electrostatic charges on the first electrode and the second electrode, thereby allowing the LED integrated unit to be oriented in a directional electric field.

5. An LED display device, characterized by, The LED display device comprises a driving backboard and a plurality of LED integrated units, the driving backboard is provided with a plurality of accommodating areas, and the plurality of LED integrated units are arranged in the corresponding accommodating areas respectively, each of the LED integrated units comprises a base and an LED wafer arranged on top of the base, the base comprises a first electrode and a second electrode electrically connected with the LED wafer respectively, and a capacitor electrically connected between the first electrode and the second electrode, a third electrode and a fourth electrode are arranged in each of the accommodating areas, the third electrode is in contact with the first electrode through a first solder, and / or the fourth electrode is in contact with the second electrode through a second solder, the capacitor is arranged to allow an alternating welding current to be transmitted between the third electrode and the fourth electrode through the capacitor, the alternating welding current melts the first solder and / or the second solder; wherein the first electrode and the second electrode are spaced by the capacitor, the base further comprises a flow barrier layer arranged on an outer surface of the capacitor, the flow barrier layer is used to prevent the melted first solder and / or the melted second solder from flowing between the first electrode and the second electrode; the first electrode has a first electrode surface located on a peripheral sidewall of the base, the second electrode has a second electrode surface located on a bottom of the base, the first solder is in contact with the first electrode surface, and / or the second solder is in contact with the second electrode surface; the bottom of the base is provided with a positioning recess, and the second electrode is located in the positioning recess.

6. The LED display apparatus of claim 5, wherein, The accommodating region is concave, the third electrode has a third electrode surface on the circumferential side wall of the accommodating region, the fourth electrode has a fourth electrode surface on the bottom of the accommodating region, the first solder is clamped between the first electrode surface and the third electrode surface, and / or the second solder is clamped between the second electrode surface and the fourth electrode surface.

7. The LED display apparatus of claim 5, wherein, The base and the accommodating region are arranged in an inverted frustum shape in a direction away from the LED wafer, and the size of the accommodating region is greater than the size of the base; The bottom of the accommodating region is provided with a positioning boss matched with the positioning recess, and the fourth electrode is located on the positioning boss. 8.The LED display device of claim 5, wherein, The third electrode surface is a ring-shaped discontinuous strip electrode, and different connection regions are provided with different thickness and granularity of the solder.

9. A manufacturing method of an LED display device, characterized by, Comprise: A plurality of LED integrated units are provided, wherein each of the LED integrated units comprises a base and an LED wafer arranged on the top of the base, the base comprises a first electrode and a second electrode electrically connected with the LED wafer respectively, and a capacitor electrically connected between the first electrode and the second electrode; A driving backboard is provided, wherein the driving backboard is provided with a plurality of accommodating regions, and the plurality of LED integrated units are arranged in the corresponding accommodating regions respectively, each of the accommodating regions is provided with a third electrode and a fourth electrode; The plurality of LED integrated units are respectively positioned in the corresponding accommodating regions, so that the third electrode is in contact with the first electrode through the first solder, and / or the fourth electrode is in contact with the second electrode through the second solder; An alternating current welding current is provided between the third electrode and the fourth electrode, wherein the alternating current welding current melts the first solder and / or the second solder; The first electrode and the second electrode are spaced by the capacitor, the base further comprises a flow resistance layer arranged on the outer surface of the capacitor, and the flow resistance layer is used to prevent the melted first solder and / or second solder from flowing between the first electrode and the second electrode; The first electrode has a first electrode surface on the circumferential side wall of the base, the second electrode has a second electrode surface on the bottom of the base, the first solder is in contact with the first electrode surface, and / or the second solder is in contact with the second electrode surface; The bottom of the base is provided with a positioning recess, and the second electrode is located in the positioning recess.

10. The manufacturing method according to claim 9, wherein The LED integrated unit is loaded with static electricity; The step of positioning the plurality of LED integrated units in the corresponding accommodating regions respectively comprises: A directional voltage is provided to the third electrode and / or the fourth electrode, so as to position the LED integrated unit in the accommodating region by the interaction between the directional electric field formed by the third electrode and / or the fourth electrode and the static electricity on the LED integrated unit.

11. The manufacturing method according to claim 10, wherein The accommodating region is concave, the third electrode has a third electrode surface on the circumferential side wall of the accommodating region, the fourth electrode has a fourth electrode surface on the bottom of the accommodating region, The step of providing a directional voltage to the third electrode and / or the fourth electrode comprises: providing a first directional voltage to the fourth electrode to attract the LED integrated unit into the accommodating area and form an alignment contact between the second electrode surface and the fourth electrode surface; providing a second directional voltage to the third electrode to form an alignment contact between the second electrode surface and the third electrode surface.

12. The manufacturing method according to claim 10, wherein The step of providing a plurality of LED integrated units comprises: charging the capacitor to store the electrostatic charge on the first electrode and the second electrode.

13. The manufacturing method according to claim 10, wherein The step of providing an alternating welding current through the capacitor between the third electrode and the fourth electrode further comprises: determining whether a current loop is formed between the third electrode and the fourth electrode through the LED integrated unit; if the current loop is not formed, adjusting the position of the LED integrated unit in the accommodating area.

14. The manufacturing method according to claim 13, wherein The step of adjusting the position of the LED integrated unit in the accommodating area comprises: adjusting the magnitude of the directional voltage on the third electrode and / or the fourth electrode and / or the direction of the directional electric field of the third electrode and / or the fourth electrode.

15. The manufacturing method according to claim 13, wherein The step of adjusting the position of the LED integrated unit in the accommodating area comprises: providing a low-frequency sound wave to the driving backboard and the LED integrated unit to make the LED integrated unit jump in the accommodating area; or / and, providing a high-frequency sound wave to the driving backboard and the LED integrated unit to make the LED integrated unit vibrate in the accommodating area.

16. The manufacturing method according to claim 9, wherein Before the step of positioning the plurality of LED integrated units into the corresponding accommodating areas, further comprising: providing a levitation force to the plurality of LED integrated units to make the plurality of LED integrated units levitate above the driving backboard; After the step of positioning the plurality of LED integrated units into the corresponding accommodating areas, further comprising: determining whether a current loop is formed between the third electrode and the fourth electrode through the LED integrated unit; if the current loop is not formed, changing the levitation force or the positioning force of the plurality of LED integrated units into the accommodating areas, or re-energizing the alternating welding current to make the connection melt, so that the LED integrated unit is removed from the accommodating area.

17. A manufacturing apparatus of an LED display device, characterized by comprising: Comprise: a container for accommodating a plurality of LED integrated units, wherein each of the LED integrated units comprises a base and an LED wafer disposed on top of the base, the base comprising a first electrode and a second electrode electrically connected to the LED wafer, respectively, and a capacitor electrically connected between the first electrode and the second electrode; a carrier for carrying a driving backboard, wherein the driving backboard is provided with a plurality of accommodating areas, and the plurality of LED integrated units are respectively disposed in the corresponding accommodating areas, and each of the accommodating areas is provided with a third electrode and a fourth electrode; a positioning mechanism for positioning the plurality of LED integrated units into the corresponding accommodating regions respectively, so that the third electrode is in contact with the first electrode through the first solder and / or the fourth electrode is in contact with the second electrode through the second solder; an AC generator for providing an AC welding current flowing through the capacitor between the third electrode and the fourth electrode, wherein the AC welding current causes the first solder and / or the second solder to melt; wherein the first electrode and the second electrode are spaced by the capacitor, the base further comprises a flow barrier layer arranged on the outer surface of the capacitor, the flow barrier layer is used to prevent the melted first solder and / or second solder from flowing between the first electrode and the second electrode; the first electrode has a first electrode surface located on the peripheral sidewall of the base, the second electrode has a second electrode surface located on the bottom of the base, the first solder is in contact with the first electrode surface and / or the second solder is in contact with the second electrode surface; the bottom of the base is provided with a positioning recess, and the second electrode is located in the positioning recess.

18. The manufacturing apparatus of claim 17, wherein, the LED integrated unit is loaded with static electricity; the positioning mechanism is a voltage generator, the voltage generator provides a directional voltage to the third electrode and / or the fourth electrode, so as to position the LED integrated unit into the accommodating region by the interaction between the directional electric field formed by the third electrode and / or the fourth electrode and the static electricity on the LED integrated unit.

19. The manufacturing apparatus of claim 18, wherein, the accommodating region is recessed, the third electrode has a third electrode surface located on the peripheral sidewall of the accommodating region, and the fourth electrode has a fourth electrode surface located on the bottom of the accommodating region, the voltage generator provides a first directional voltage to the fourth electrode to attract the LED integrated unit into the accommodating region and form an alignment contact between the second electrode surface and the fourth electrode surface, and further provides a second directional voltage to the third electrode to form an alignment contact between the first electrode surface and the third electrode surface.

20. The manufacturing apparatus of claim 18, wherein, the manufacturing device further comprises a charging mechanism for charging the capacitor, so as to store the static electricity on the first electrode and the second electrode.

21. The manufacturing apparatus of claim 18, wherein, the manufacturing device further comprises a conduction detection mechanism for determining whether a current loop is formed between the third electrode and the fourth electrode through the LED integrated unit during the presence of the AC welding current, and if the current loop is not formed, an adjustment instruction signal is generated to instruct the voltage generator or an additional position adjustment mechanism to adjust the position of the LED integrated unit in the accommodating region.

22. The manufacturing apparatus of claim 21, wherein, the voltage generator adjusts the magnitude of the directional voltage on the third electrode and / or the fourth electrode and / or the direction of the directional electric field of the third electrode and / or the fourth electrode in response to the adjustment instruction signal.

23. The manufacturing apparatus of claim 21, wherein, The position adjusting mechanism is a sound wave generator, which provides low frequency sound waves to the driving back plate and the LED integrated unit in response to the adjusting indication signal, so that the LED integrated unit generates jumping within the accommodating area; Or / and, the sound wave generator provides high frequency sound waves to the driving back plate and the LED integrated unit in response to the adjusting indication signal, so that the LED integrated unit generates vibration within the accommodating area.

24. The manufacturing apparatus of claim 23, wherein, The sound wave generator includes sound waves of multiple frequency bands of long wave first frequency band and short wave second frequency band, wherein the first frequency band is used to stimulate large range jumping of the LED integrated unit, and the second frequency band is used to stimulate small range vibration of the LED integrated unit.

25. The manufacturing apparatus of claim 17, wherein, The manufacturing device further includes a suspension mechanism and a conduction detection mechanism, the suspension mechanism provides suspension force to the multiple LED integrated units, so that the multiple LED integrated units are suspended above the driving back plate, and the conduction detection mechanism is used to determine whether a current loop is formed between the third electrode and the fourth electrode through the LED integrated unit after the LED integrated unit is positioned to the accommodating area and before the alternating welding current is generated, if the current loop is not formed, a repositioning indication signal is generated, the suspension mechanism changes the suspension force in response to the repositioning indication signal, or the positioning mechanism changes the positioning force to the LED integrated unit in response to the repositioning indication signal, so that the LED integrated unit is moved out of the accommodating area.

26. The manufacturing apparatus of claim 25, wherein, The suspension mechanism includes an air floating system or / and a magnetic suspension system, which are used to reduce or offset the gravity of the LED integrated unit.

27. The manufacturing apparatus of claim 17, wherein, The manufacturing device further includes a welding gating control unit, which is used to select multiple accommodating areas of a preset pixel interval as welding objects of a welding program in the welding program.

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