Plastic optical folding element, imaging lens module and electronic device

Abstract

A plastic optical turning element, an imaging lens module and an electronic device are disclosed. The plastic optical turning element includes an entrance surface, an exit surface, a reflection surface and a reflective optical film layer. The entrance surface is configured to allow an imaging light to enter the plastic optical turning element. The exit surface is configured to allow the imaging light to exit the plastic optical turning element. The reflection surface is configured to turn the imaging light. The reflective optical film layer is disposed on a surface of the reflection surface and includes a silver atomic layer, a bottom optical film and a top optical film. The bottom optical film is in direct contact with the silver atomic layer, and the bottom optical film is closer to the reflection surface of the plastic optical turning element than the silver atomic layer. The top optical film has a refractive index lower than that of the bottom optical film, the top optical film is not in direct contact with the silver atomic layer, and the top optical film is farther away from the reflection surface of the plastic optical turning element than the silver atomic layer. In this way, the image restoration can be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a plastic optical turning element and an imaging lens module, and particularly to a plastic optical turning element and an imaging lens module applied to a portable electronic device. BACKGROUND

[0002] In recent years, portable electronic devices, such as smart electronic devices, tablet computers, etc., have been flooded in modern people's lives, and the imaging lens modules and plastic optical turning elements loaded on the portable electronic devices have also developed rapidly. However, as technology continues to advance, users have increasingly high quality requirements for plastic optical turning elements. Therefore, developing a plastic optical turning element that can increase image restoration has become an important and urgent problem in the industry. SUMMARY

[0003] The present disclosure provides a plastic optical turning element, an imaging lens module and an electronic device, which can help improve the image restoration of imaging light through a reflective optical film layer.

[0004] According to an embodiment of the present disclosure, a plastic optical turning element is provided, which includes an entrance surface, an exit surface, a reflection surface, and a reflective optical film layer. The entrance surface is configured to allow an imaging light to enter the plastic optical turning element. The exit surface is configured to allow the imaging light to exit the plastic optical turning element. The reflection surface is configured to turn the imaging light. The reflective optical film layer is disposed on a surface of the reflection surface and includes a silver atom layer, a bottom optical film, a top optical film, and at least one intermediate layer. The silver atom layer is configured to reflect the imaging light entering the entrance surface to the exit surface. The bottom optical film is in direct contact with the silver atom layer, and the bottom optical film is closer to the reflection surface of the plastic optical turning element than the silver atom layer. The top optical film has a refractive index lower than that of the bottom optical film, the top optical film is not in direct contact with the silver atom layer, and the top optical film is farther from the reflection surface of the plastic optical turning element than the silver atom layer. The at least one intermediate layer is disposed between the top optical film and the silver atom layer, and the at least one intermediate layer is in direct contact with the silver atom layer, wherein the at least one intermediate layer includes a metal layer, the metal layer does not include silver atoms, and the metal layer is made of one of Ti, Cr, Ni, or an oxide of Cr or Ni. The bottom optical film has a refractive index of Nb, the bottom optical film has a thickness of db, the top optical film has a refractive index of Nt, the top optical film has a thickness of dt, the silver atom layer has a thickness of dAg, and the reflective optical film layer has a minimum reflectivity of R5459 between wavelengths of 540 nm and 590 nm, which satisfies the following conditions: 1.4 < Nt < Nb < 2.1; 1.6 < Nb < 2.1; 1.4 < Nt < 1.58; 0.05 < db / dAg < 1.2; 0.2 < dAg / dt < 3.5; and 94.0% < R5459 < 99.99%.

[0005] The plastic optical transition element according to the embodiments described above may further include a connecting surface and an injection mark structure, wherein the connecting surface connects the light-incident surface, the light-emitting surface and the reflective surface, and the injection mark structure is disposed on the connecting surface.

[0006] According to the embodiments described above, the plastic optical switching element may have a bottom optical film that is a metal oxide layer.

[0007] According to the plastic optical switching element of the embodiment described above, the thickness of the silver atom layer is dAg, which can satisfy the following condition: 75nm <dAg<200nm。

[0008] According to the embodiments described above, the plastic optical switching element has an underlying optical film that can directly contact the reflective surface of the plastic optical switching element.

[0009] According to the aforementioned embodiment of the plastic optical switching element, the thickness of the bottom optical film is db, and the thickness of the top optical film is dt, which can satisfy the following condition: 0.05 <db / dt<1.1。

[0010] According to one embodiment of the present disclosure, an imaging lens module is provided, comprising a plastic optical reversing element as described in the foregoing embodiments and an optical imaging lens group, wherein the plastic optical reversing element is disposed on one side of the object side and the image side of the optical imaging lens group.

[0011] According to one embodiment of the present disclosure, an electronic device is provided, comprising an imaging lens module and an electronic photosensitive element as described in the foregoing embodiments, wherein the electronic photosensitive element is disposed on an imaging surface of the imaging lens module. Attached Figure Description

[0012] FIG. 1A A perspective view of the electronic device according to the first embodiment of this disclosure is shown;

[0013] FIG. 1B Drawing according to FIG. 1A Exploded view of the electronic device in the first embodiment;

[0014] FIG. 1C Drawing according to FIG. 1A Another exploded view of the electronic device in the first embodiment;

[0015] FIG. 1D Drawing according to FIG. 1A A schematic diagram of the electronic device in the first embodiment;

[0016] FIG. 1E Drawing according to FIG. 1A A schematic diagram of the plastic optical switching element in the first embodiment;

[0017] FIG. 1F Drawing according to FIG. 1A A schematic diagram of the reflectance results of the first embodiment;

[0018] FIG. 2 A schematic diagram of an electronic device according to a second embodiment of this disclosure is shown;

[0019] FIG. 3A A schematic diagram of an electronic device according to a third embodiment of this disclosure is shown;

[0020] FIG. 3B Drawing according to FIG. 3A A perspective view of the plastic optical switching element in the third embodiment;

[0021] FIG. 3C Drawing according to FIG. 3A Another perspective view of the plastic optical switching element in the third embodiment;

[0022] FIG. 3D Drawing according to FIG. 3A A schematic diagram of the incident surface and the reflecting surface of the plastic optical switching element in the third embodiment;

[0023] FIG. 4A A schematic diagram of an electronic device according to the fourth embodiment of this disclosure is shown;

[0024] FIG. 4B Drawing according to FIG. 4A Another schematic diagram of the electronic device in the fourth embodiment;

[0025] FIG. 4C Drawing according to FIG. 4A A schematic diagram of the image in the fourth embodiment;

[0026] FIG. 4D Drawing according to FIG. 4A Another image illustration in the fourth embodiment;

[0027] FIG. 4E Drawing according to FIG. 4A Another image illustration in the fourth embodiment; and

[0028] FIG. 5 A schematic diagram of an electronic device according to the fifth embodiment of this disclosure is shown.

[0029] [Symbol Explanation]

[0030] 10, 20, 30, 40, 50: Electronic devices

[0031] 110, 210, 230, 310: Plastic optical switching elements

[0032] 111,211,231,311: Incident surface

[0033] 112, 212, 232, 312: light exit surface

[0034] 113, 213, 233, 313: reflecting surface

[0035] 114: reflective optical film layer

[0036] 114a: silver atom layer

[0037] 114b: bottom optical film

[0038] 114c: top optical film

[0039] 115, 315: connecting surface

[0040] 116, 316: injection mark structure

[0041] 117: intermediate interlayer

[0042] 121a, 121b, 121c, 121d, 221a, 221b, 221c, 221d: lens

[0043] 122, 222: lens barrel

[0044] 123, 223: fixing ring

[0045] 131: first driving member

[0046] 132: first magnet

[0047] 133: first rolling element

[0048] 134: magnetic member

[0049] 135: first coil

[0050] 141: second driving member

[0051] 142: second magnet

[0052] 143: second rolling element

[0053] 144: elastic element

[0054] 145: second coil

[0055] 150: housing

[0056] 160: carrier

[0057] 170: flexible printed circuit board

[0058] 180, 280, 380: electronic photosensitive element

[0059] 224: drive member

[0060] 320: optical imaging lens group

[0061] 381: imaging surface

[0062] 41: user interface

[0063] 42, 511, 512: ultra-wide camera module

[0064] 43: high-pixel camera module

[0065] 44, 515, 516, 517, 518: telephoto camera module

[0066] 45: imaging signal processing element

[0067] 46, 520: flash module

[0068] 513, 514: wide-angle camera module

[0069] 519: TOF module

[0070] Nb: refractive index of bottom optical film

[0071] db: thickness of bottom optical film

[0072] Nt: refractive index of top optical film

[0073] dt: thickness of top optical film

[0074] NAg: refractive index of silver atomic layer

[0075] dAg: thickness of silver atomic layer

[0076] R5459: minimum reflectance of reflective optical film layer between wavelengths 540 nm and 590 nm DETAILED DESCRIPTION

[0077] The present disclosure provides a plastic optical turning element, which includes an incident surface, an emergent surface, a reflecting surface, and a reflective optical film layer. The incident surface is configured to allow an imaging light to enter the plastic optical turning element. The emergent surface is configured to allow the imaging light to exit the plastic optical turning element. The reflecting surface is configured to turn the imaging light. The reflective optical film layer is disposed on a surface of the reflecting surface and includes a silver atomic layer, a bottom optical film, and a top optical film. The silver atomic layer is configured to reflect the imaging light entering the incident surface to the emergent surface. The bottom optical film is in direct contact with the silver atomic layer, and the bottom optical film is closer to the reflecting surface of the plastic optical turning element than the silver atomic layer. The top optical film has a refractive index lower than that of the bottom optical film, the top optical film is not in direct contact with the silver atomic layer, and the top optical film is farther from the reflecting surface of the plastic optical turning element than the silver atomic layer. The bottom optical film has a refractive index of Nb, the bottom optical film has a thickness of db, the top optical film has a refractive index of Nt, the top optical film has a thickness of dt, and the silver atomic layer has a thickness of dAg, which satisfy the following conditions: 1.4 < Nt < Nb < 2.1; 1.6 < Nb < 2.1; 1.4 < Nt < 1.58; 0.05 < db / dAg < 1.2; and 0.2 < dAg / dt < 3.5.

[0078] Specifically, the plastic optical turning element of the present disclosure is an optical element that sets a silver atomic layer on a reflecting surface made of plastic material to turn an imaging light. The bottom optical film increases the physical adhesion between the silver atomic layer and the reflecting surface made of plastic material, and the bottom optical film can maintain a high refractive index to reduce unnecessary reflection inside the plastic optical turning element and increase the image restoration degree of the imaging light.

[0079] The plastic optical turning element can further include a connecting surface and a sprue mark structure, wherein the connecting surface connects the incident surface, the emergent surface, and the reflecting surface, and the sprue mark structure is disposed on the connecting surface. By disposing the sprue mark structure on the connecting surface, the injection molding efficiency of injection molding can be increased, and by simultaneously molding the incident surface, the emergent surface, and the reflecting surface, the optical flatness and circular symmetry consistency of the incident surface, the emergent surface, and the reflecting surface are better.

[0080] The bottom optical film can be a metal oxide layer. In particular, because the metal oxide layer contains metal material, the metal oxide layer can have better bonding force between the silver atom layer and the plastic material, so the bottom optical film of the metal oxide layer has better bonding force to the metal material than the bottom optical film of the non-metal oxide. In other words, the metal oxide layer can allow the silver atom layer to have better adhesion on the plastic material. It must be pointed out that a general adhesion test method can be to use tape to cover the surface of the optical film layer, and after the tape is torn off, the surface condition of the optical film layer is checked to determine the adhesion. The number of times of taping and tearing off the tape can be increased to achieve more stringent test conditions, but it is not limited thereto. In particular, the material of the bottom optical film can be AI2O3, and the material of the top optical film can be a non-metal oxide, such as SiO2.

[0081] The plastic optical turning element can further include at least one intermediate layer, wherein the intermediate layer is disposed between the top optical film and the silver atom layer. The intermediate layer can protect the silver atom layer from oxidation and improve the acid and alkali corrosion resistance of the silver atom layer, but the effect of the intermediate layer is not limited to the above.

[0082] The intermediate layer can include a metal layer, and the metal layer does not contain silver atoms. In particular, the material of the metal layer can be Ti, Cr, Ni, etc., but it is not limited thereto. The metal layer without silver atoms can increase the surface stability of the silver atom layer, so that it is not easily affected by the external environment, and has better bonding with the silver atom layer.

[0083] The bottom optical film can be in direct contact with the reflective surface of the plastic optical turning element. In this way, the optical reflection degree of the silver atom layer can be increased to maintain a high optical reflectance. In particular, the reflection degree of silver atoms is better than that of aluminum atoms, and the setting of the bottom optical film can make the reflection effect of the silver atom layer not easily affected by the plastic material.

[0084] The thickness of the silver atom layer is dAg, which can satisfy the following condition: 75nm < dAg < 200nm. The appropriate thickness of the silver atom layer can make the reflection effect of the imaging light better, and the reflection degree of different imaging light wavelengths is more consistent. In this way, the restored image of the imaging light can be better, and the reflected image can be more detailed, realistic and soft. It must be pointed out that the silver atom layer with too thick thickness is easy to be uneven, which can make the reflected image distorted.

[0085] The thickness of the bottom optical film is db, and the thickness of the top optical film is dt, which can satisfy the following condition: 0.05 < db / dt < 1.1. The thinner bottom optical film can make the optical properties of the plastic optical turning element better. Specifically, the optical properties can be color rendering of image light, degree of restoration of image light, or detail of image light, but are not limited thereto.

[0086] The reflectivity of the reflective optical film layer has a minimum reflectivity R5459 between wavelengths 540 nm and 590 nm, which can satisfy the following condition: 94.0% < R5459 < 99.99%. Through high reflectivity in the visible light band, the authenticity of the image can be faithfully presented, the additional loss of the original light by the plastic optical turning element is reduced, and the imaging quality is improved.

[0087] The technical features of the plastic optical turning element of the present disclosure can be combined to achieve the corresponding effects.

[0088] The present disclosure provides an imaging lens module, which includes the plastic optical turning element described above and an optical imaging lens group, wherein the plastic optical turning element is arranged on one side of the object side and the image side of the optical imaging lens group. Specifically, the arrangement of the plastic optical turning element can make the imaging lens module suitable for telephoto (i.e., the full viewing angle is less than 40 degrees), thereby effectively reducing the size of the imaging lens module.

[0089] The present disclosure provides an electronic device, which includes the imaging lens module described above and an electronic photosensitive element, wherein the electronic photosensitive element is arranged on an imaging surface of the imaging lens module.

[0090] According to the above embodiments, specific examples are proposed below and are described in detail with reference to the accompanying drawings.

[0091] <First Embodiment>

[0092] Please refer to FIGS. 1A-1D , wherein FIG. 1A a perspective view of the electronic device 10 according to the first embodiment of the present disclosure is shown, FIG. 1B a perspective view of the electronic device 10 according to the first embodiment of the present disclosure is shown, FIG. 1A a perspective view of the electronic device 10 according to the first embodiment of the present disclosure is shown, FIG. 1C a perspective view of the electronic device 10 according to the first embodiment of the present disclosure is shown, FIG. 1A a perspective view of the electronic device 10 according to the first embodiment of the present disclosure is shown, FIG. 1D a perspective view of the electronic device 10 according to the first embodiment of the present disclosure is shown. As can be seen from FIG. 1A a perspective view of the electronic device 10 according to the first embodiment of the present disclosure is shown. As can be seen from FIGS. 1A-1D , the electronic device 10 includes an imaging lens module (not shown in the figure) and an electronic photosensitive element 180, wherein the electronic photosensitive element 180 is arranged on an imaging surface (not shown in the figure) of the imaging lens module.

[0093] Furthermore, the electronic device 10 also includes a housing 150, a first driving mechanism (not shown), a second driving mechanism (not shown), a carrier 160, and a flexible circuit board 170. The first driving mechanism includes a first driving element 131, a first magnet 132, a first rolling element 133, a magnetic element 134, and a first coil 135. The second driving mechanism includes a second driving element 141, a second magnet 142, a second rolling element 143, an elastic element 144, and a second coil 145. Specifically, the first and second driving mechanisms are used to drive the imaging lens module, which is disposed within the carrier 160. The flexible circuit board 170 is disposed on one side of the carrier 160, and the housing 150 is disposed on the other side of the carrier 160.

[0094] The imaging lens module includes a plastic optical reflex element 110 and an optical imaging lens group (not shown), wherein the plastic optical reflex element 110 is disposed on the object side of the optical imaging lens group. Specifically, the configuration of the plastic optical reflex element 110 makes the imaging lens module suitable for telephoto applications (i.e., a full angle of view of less than 40 degrees), thereby effectively reducing the size of the imaging lens module.

[0095] Depend on FIG. 1D It is understood that the optical imaging lens group includes lenses 121a, 121b, 121c, 121d and a fixing ring 123 in sequence from the object side to the image side. Lenses 121a, 121b, and 121c are disposed in a lens barrel 122 of the optical imaging lens group, and lens 121d and fixing ring 123 are disposed in the first driving member 131. The number, structure, surface shape and other optical features of the lenses can be configured according to different imaging requirements and are not limited thereto.

[0096] Please refer to FIG. 1E Its drawing is based on FIG. 1A A schematic diagram of the plastic optical switching element 110 in the first embodiment. (From...) FIGS. 1A-1E As can be seen, the plastic optical reversing element 110 includes an incident surface 111, an emitting surface 112, a reflecting surface 113, and a reflective optical film layer 114. Specifically, the incident surface 111 allows an imaging ray (not shown) to enter the plastic optical reversing element 110, the emitting surface 112 allows the imaging ray to exit the plastic optical reversing element 110, the reflecting surface 113 deflects the imaging ray, and the reflective optical film layer 114 is disposed on a surface of the reflecting surface 113. In the first embodiment, the plastic optical reversing element 110 may be a plastic lens, and the incident surface 111 may have an optical curved surface, but this is not a limitation.

[0097] The reflective optical film layer 114 includes a silver atom layer 114a, a bottom optical film layer 114b, and a top optical film layer 114c. The silver atom layer 114a is used to reflect the imaging light entering the light-in surface 111 to the light-out surface 112. The bottom optical film layer 114b is in direct contact with the silver atom layer 114a, and the bottom optical film layer 114b is closer to the reflective surface 113 of the plastic optical turning element 110 than the silver atom layer 114a. The top optical film layer 114c has a lower refractive index than the bottom optical film layer 114b, the top optical film layer 114c is not in direct contact with the silver atom layer 114a, and the top optical film layer 114c is farther away from the reflective surface 113 of the plastic optical turning element 110 than the silver atom layer 114a.

[0098] Specifically, the plastic optical turning element 110 is an optical element provided with a silver atom layer 114a on the reflective surface 113 of the plastic material to turn the imaging light. The bottom optical film layer 114b increases the physical adhesion between the silver atom layer 114a and the reflective surface 113 of the plastic material, and the bottom optical film layer 114b can maintain a high refractive index to reduce unnecessary reflection inside the plastic optical turning element 110 and increase the image restoration degree of the imaging light.

[0099] From FIG. 1B With FIG. 1E It can be seen that the plastic optical turning element 110 also includes a connecting surface 115, a sprue mark structure 116, and at least one intermediate layer 117. The connecting surface 115 connects the light-in surface 111, the light-out surface 112, and the reflective surface 113. The sprue mark structure 116 is arranged on the connecting surface 115. The intermediate layer 117 is arranged between the top optical film layer 114c and the silver atom layer 114a. By arranging the sprue mark structure 116 on the connecting surface 115, the injection molding efficiency of the injection molding can be increased. By simultaneously molding the light-in surface 111, the light-out surface 112, and the reflective surface 113, the optical flatness and circular symmetry consistency of the light-in surface 111, the light-out surface 112, and the reflective surface 113 are better. Furthermore, the intermediate layer 117 can protect the silver atom layer 114a, so that the silver atom layer 114a is not easily oxidized, and the acid and alkali corrosion resistance of the silver atom layer 114a can be improved. However, the function of the intermediate layer 117 is not limited to the above functions. In the first embodiment, the number of connecting surfaces is two, the number of sprue mark structures is one, and the number of intermediate layers 117 is two.

[0100] It must be pointed out that FIG. 1E The number of intermediate layers 117 in the above is one, but the actual number of intermediate layers 117 can be two or more, and is not limited thereto.

[0101] The bottom optical film 114b is a metal oxide layer. In particular, because the metal oxide layer contains metal material, the metal oxide layer can have better bonding force between the silver atom layer 114a and the plastic material, so the bottom optical film 114b of the metal oxide layer has better bonding force to the metal material than the bottom optical film of the non-metal oxide layer. In other words, the metal oxide layer can allow the silver atom layer 114a to have better adhesion on the plastic material. It should be noted that a general adhesion test method can be to use a tape to cover the surface of the optical film layer, and after the tape is torn off, the surface condition of the optical film layer is checked to determine the adhesion. The number of times of taping and tearing off the tape can be increased to achieve more stringent test conditions, but it is not limited thereto. In the first embodiment, the material of the bottom optical film 114b is AI2O3, and the material of the top optical film 114c is SiO2.

[0102] The intermediate layer 117 includes a metal layer, and the metal layer does not contain silver atoms. The metal layer without silver atoms can increase the surface stability of the silver atom layer, so that it is not easily affected by the external environment, and has better bonding with the silver atom layer. In particular, the material of the metal layer can be Ti, Cr, Ni, etc., but it is not limited thereto.

[0103] The bottom optical film 114b directly contacts the reflective surface 113 of the plastic optical turning element 110. In this way, the optical reflection degree of the silver atom layer 114a can be increased to maintain a high optical reflectance. In particular, the reflection degree of silver atoms is better than that of aluminum atoms, and the setting of the bottom optical film 114b can make the reflection effect of the silver atom layer 114a not easily affected by the plastic material and decreased.

[0104] The refractive index of the bottom optical film 114b is Nb, the thickness of the bottom optical film 114b is db, the refractive index of the top optical film 114c is Nt, the thickness of the top optical film 114c is dt, the refractive index of the silver atom layer 114a is NAg, and the thickness of the silver atom layer 114a is dAg. The parameters satisfy the following conditions.

[0105]

[0106] It should be noted that the refractive index of air is 1, the refractive index of the plastic optical turning element 110 is 1.64678, and the thickness of each intermediate layer 117 is less than the thickness of the silver atom layer 114a.

[0107] Please refer to FIG. 1F and Table II, wherein FIG. 1F the reflectance results of the first embodiment are shown in Table II. FIG. 1A The reflectance results of the first embodiment are shown in Table II.

[0108]

[0109]

[0110]

[0111]

[0112]

[0113]

[0114]

[0115]

[0116]

[0117] <Second Embodiment>

[0118] Please refer to FIG. 2 , which illustrates a schematic diagram of an electronic device 20 according to the second embodiment of the present disclosure. As shown in FIG. 2 , the electronic device 20 comprises an imaging lens module (not shown in the figure) and an electronic photosensitive element 280, wherein the electronic photosensitive element 280 is disposed on an imaging surface (not shown in the figure) of the imaging lens module.

[0119] The imaging lens module comprises plastic optical turning elements 210, 230 and an optical imaging lens group (not shown in the figure), wherein the plastic optical turning element 210 is disposed on the object side of the optical imaging lens group, and the plastic optical turning element 230 is disposed on the image side of the optical imaging lens group. Specifically, the configuration of the plastic optical turning elements 210, 230 can make the imaging lens module suitable for telephoto (i.e. the full angle of view is less than 40 degrees), so as to effectively reduce the volume of the imaging lens module.

[0120] The optical imaging lens group comprises, in order from the object side to the image side, lenses 221a, 221b, 221c, 221d and a fixing ring 223, the lenses 221a, 221b, 221c are disposed in a lens barrel 222 of the optical imaging lens group, and the lens 221d and the fixing ring 223 are disposed in a driving member 224 of the optical imaging lens group, wherein the number, structure, surface shape and other optical characteristics of the lenses can be configured according to different imaging requirements, and are not limited thereto.

[0121] The plastic optical turning element 210 includes an entrance surface 211, an exit surface 212, a reflecting surface 213, and a reflective optical film layer (not shown), and the plastic optical turning element 230 includes an entrance surface 231, an exit surface 232, a reflecting surface 233, and a reflective optical film layer (not shown). In detail, the entrance surfaces 211, 231 are respectively used to make an imaging light (not shown) incident to the plastic optical turning elements 210, 230, the exit surfaces 212, 232 are respectively used to make the imaging light exit the plastic optical turning elements 210, 230, the reflecting surfaces 213, 233 are used to turn the imaging light, and the reflective optical film layers are respectively disposed on a surface of the reflecting surfaces 213, 233. In the second embodiment, the plastic optical turning element 210 can be a plastic lens, and the entrance surface 211 and the exit surface 232 have optical curved surfaces, but are not limited thereto.

[0122] In addition, the structures and configuration relationships of the remaining elements of the second embodiment are the same as those of the first embodiment, and will not be described again.

[0123] <Third Embodiment>

[0124] Please refer to FIG. 3A , which shows a schematic diagram of an electronic device 30 according to a third embodiment of the present disclosure. As shown in FIG. 3A , the electronic device 30 includes an imaging lens module (not shown) and an electronic photosensitive element 380, wherein the electronic photosensitive element 380 is disposed on an imaging surface 381 of the imaging lens module.

[0125] The imaging lens module includes a plastic optical turning element 310 and an optical imaging lens group 320, wherein the plastic optical turning element 310 is disposed on an image side of the optical imaging lens group 320. Specifically, the imaging lens module is suitable for telephoto (the full angle of view is less than 40 degrees), thereby effectively reducing the volume of the imaging lens module.

[0126] Please refer to FIGS. 3B-3D , wherein FIG. 3B a perspective view of the plastic optical turning element 310 according to the third embodiment is shown, FIG. 3A a perspective view of the plastic optical turning element 310 according to the third embodiment is shown, FIG. 3C a schematic diagram of the entrance surface 311 and the reflecting surface 313 of the plastic optical turning element 310 according to the third embodiment is shown, FIG. 3A a schematic diagram of the entrance surface 311 and the reflecting surface 313 of the plastic optical turning element 310 according to the third embodiment is shown, FIG. 3D a schematic diagram of the entrance surface 311 and the reflecting surface 313 of the plastic optical turning element 310 according to the third embodiment is shown, FIG. 3A a schematic diagram of the entrance surface 311 and the reflecting surface 313 of the plastic optical turning element 310 according to the third embodiment is shown, FIGS. 3A-3DAs shown in FIG. 3, the plastic optical turning element 310 includes an entrance surface 311, an exit surface 312, a reflecting surface 313, a reflective optical film layer (not shown), a connecting surface 315, a material injection mark structure 316, and at least one intermediate layer (not shown). In detail, the entrance surface 311 is used for allowing an imaging light (not shown) to enter the plastic optical turning element 310, the exit surface 312 is used for allowing the imaging light to exit the plastic optical turning element 310, the reflecting surface 313 is used for turning the imaging light, the reflective optical film layer is disposed on a surface of the reflecting surface 313, the connecting surface 315 connects the entrance surface 311, the exit surface 312, and the reflecting surface 313, and the material injection mark structure 316 is disposed on the connecting surface 315. In the third embodiment, the number of the reflecting surfaces 313 is four, the number of the connecting surfaces 315 is two, the number of the material injection mark structures 316 is two, and the number of the intermediate layers is two. Two of the reflecting surfaces 313 share a plane with the entrance surface 311 and the exit surface 312, respectively. The actual number of the intermediate layers can be two or more, but is not limited thereto.

[0127] The reflective optical film layer includes a silver atom layer (not shown), a bottom optical film (not shown), and a top optical film (not shown). The silver atom layer is used for reflecting the imaging light entering the entrance surface 311 to the exit surface 312. The bottom optical film is in direct contact with the silver atom layer, and the bottom optical film is closer to the reflecting surface 313 of the plastic optical turning element 310 than the silver atom layer. The top optical film has a refractive index lower than that of the bottom optical film. The top optical film is not in direct contact with the silver atom layer, and the top optical film is farther away from the reflecting surface 313 of the plastic optical turning element 310 than the silver atom layer.

[0128] In the third embodiment, the material of the bottom optical film is Al2O3, and the material of the top optical film is SiO2.

[0129] Further, the entrance surface 311, the exit surface 312, and the reflecting surface 313 each include an optical portion (not shown) and a circular-arc step difference structure (not shown). The circular-arc step difference structure is disposed on the outer periphery of the optical portion, and the circular-arc step difference structure forms a circular arc with the center of the optical portion.

[0130] The refractive index of the bottom optical film is Nb, the thickness of the bottom optical film is db, the refractive index of the top optical film is Nt, the thickness of the top optical film is dt, the refractive index of the silver atom layer is NAg, and the thickness of the silver atom layer is dAg. The parameters satisfy the following three conditions.

[0131]

[0132] It should be noted that the refractive index of air is 1, the refractive index of the plastic optical turning element 310 is 1.64678, and the thickness of each intermediate layer is less than the thickness of the silver atom layer.

[0133] In addition, the third embodiment is identical to the first embodiment in the structures and arrangements of the remaining elements, and thus will not be described again.

[0134] <Fourth Embodiment>

[0135] FIG. 4A A schematic diagram of an electronic device 40 according to a fourth embodiment of the present disclosure is shown, FIG. 4B A schematic diagram of another electronic device 40 according to the fourth embodiment of the present disclosure is shown. As shown in FIG. 4B, the electronic device 40 comprises an imaging lens module (not shown), an electronic photosensitive element (not shown), and a user interface 41, wherein the electronic photosensitive element is disposed on an imaging surface (not shown) of the imaging lens module, the imaging lens module is an ultra-wide-angle camera module 42, a high-pixel camera module 43, and a telephoto camera module 44, and the user interface 41 is a touch screen, but is not limited thereto. FIG. 4A FIG. 4A FIG. 4B As shown in FIG. 4A, the electronic device 40 according to the fourth embodiment of the present disclosure is a smartphone, which comprises an imaging lens module (not shown), an electronic photosensitive element (not shown), and a user interface 41, wherein the electronic photosensitive element is disposed on an imaging surface (not shown) of the imaging lens module, the imaging lens module is an ultra-wide-angle camera module 42, a high-pixel camera module 43, and a telephoto camera module 44, and the user interface 41 is a touch screen, but is not limited thereto. Further, the imaging lens module comprises a plastic optical folding element (not shown) and an optical imaging lens group (not shown), wherein the plastic optical folding element is disposed on one of the object side and the image side of the optical imaging lens group.

[0136] Further, the telephoto camera module 44 can be any of the imaging lens modules in the first embodiment to the third embodiment, but the present disclosure is not limited thereto. In this way, it is helpful to meet the requirements of mass production and appearance of the imaging lens module mounted on the electronic device in the market today.

[0137] Further, the user enters a shooting mode through the user interface 41, wherein the user interface 41 is used to display a picture and has a touch function, and can be used to manually adjust the shooting angle to switch different imaging lens modules. At this time, the imaging lens module converges the imaging light on the electronic photosensitive element, and outputs the electronic signal related to the image to an image signal processing element (ISP) 45.

[0138] FIG. 4B ​​​As can be seen, the electronic device 40 can further include an optical image stabilization (OIS) module (not shown) according to the camera specifications of the electronic device 40. Further, the electronic device 40 can further include at least one focus-assisting module (not shown) and at least one sensing element (not shown). The focus-assisting module can be a flash module 46 for compensating color temperature, an infrared distance measuring element, a laser focus module, etc. The sensing element can have functions of sensing physical momentum and action energy, such as an accelerometer, a gyroscope, a Hall Effect Element, to sense shaking and jitter applied by a user's hand or an external environment, thereby facilitating the automatic focus function of the imaging lens module configuration in the electronic device 40 and the operation of the OIS module, to obtain good imaging quality, and helping the electronic device 40 according to the present disclosure to have multiple modes of shooting functions, such as optimized selfie, low-light source HDR (High Dynamic Range), high-resolution 4K (4K Resolution) video recording, etc. In addition, the user can directly view the shooting picture of the camera on the user interface 41 and manually operate the field of view on the user interface 41 to achieve the automatic focus function of what you see is what you get.

[0139] Further, the imaging lens module, the electronic photosensitive element, the OIS module, the sensing element, and the focus-assisting module can be disposed on a flexible printed circuit board (FPC) (not shown) and electrically connected to the imaging signal processing element 45 and other related elements through a connector (not shown) to perform a shooting process. The current electronic device, such as a smart phone, has a trend of being thin and light. The imaging lens module and related elements are disposed on the FPC, and the circuit is integrated to the mainboard of the electronic device using the connector, which can meet the mechanism design and circuit layout requirements of the limited space inside the electronic device and obtain more margin, and also makes the automatic focus function of the imaging lens module more flexible through the touch screen of the electronic device. In the fourth embodiment, the electronic device 40 can include multiple sensing elements and multiple focus-assisting modules. The sensing elements and the focus-assisting modules are disposed on the FPC and at least one other FPC (not shown) and electrically connected to the imaging signal processing element 45 and other related elements through corresponding connectors to perform a shooting process. In other embodiments (not shown), the sensing elements and the auxiliary optical elements can also be disposed on the mainboard of the electronic device or other forms of carrier boards according to the mechanism design and circuit layout requirements.

[0140] In addition, the electronic device 40 can further include, but is not limited to, a display unit (Display), a control unit (Control Unit), a storage unit (Storage Unit), a random access memory (RAM), a read-only memory (ROM), or a combination thereof.

[0141] FIG. 4C Drawing according to FIG. 4A A schematic diagram of the image in the fourth embodiment. (By...) FIG. 4C It can be seen that the ultra-wide-angle camera module 42 can capture images of a larger range and has the function of capturing more scenery.

[0142] FIG. 4D Drawing according to FIG. 4A Another image illustration from the fourth embodiment. FIG. 4D It can be seen that the high-pixel camera module 43 can capture images within a certain range and also has high pixel count, with high resolution and low distortion.

[0143] FIG. 4E Drawing according to FIG. 4A Another image illustration from the fourth embodiment. FIG. 4E It is known that the telephoto camera module 44 has a high magnification function, which can capture images at a distance and magnify them to a high degree.

[0144] Depend on FIGS. 4C-4E It is understood that by using imaging lens modules with different focal lengths for framing and combining them with image processing technology, the electronic device 40 can achieve the function of zooming.

[0145] <Fifth Embodiment>

[0146] Please refer to FIG. 5 The diagram illustrates an electronic device 50 according to the fifth embodiment of this disclosure. FIG. 5 It is understood that the electronic device 50 is a smartphone, and the electronic device 50 includes an imaging lens module (not shown) and an electronic photosensitive element (not shown). The electronic photosensitive element is disposed on an imaging surface (not shown) of the imaging lens module, and the imaging lens module includes ultra-wide-angle camera modules 511, 512, wide-angle camera modules 513, 514, telephoto camera modules 515, 516, 517, 518 and TOF module (Time-Of-Flight) 519. The TOF module 519 may also be other types of image acquisition devices and is not limited to this configuration.

[0147] Furthermore, the telephoto camera modules 515, 516, 517, and 518 can be any of the imaging lens modules in the first to third embodiments described above, but this disclosure is not limited thereto. This helps to meet the current market requirements for mass production and aesthetics of imaging lens modules mounted on electronic devices.

[0148] Furthermore, telephoto camera modules 517 and 518 are used to deflect light, but this disclosure is not limited to this.

[0149] In response to the camera specifications of the electronic device 50, the electronic device 50 can further include an optical image stabilization component (not shown in the figure), and further, the electronic device 50 can further include at least one focus-assisting module (not shown in the figure) and at least one sensing element (not shown in the figure). The focus-assisting module can be a flash module 520 compensating for color temperature, an infrared ranging element, a laser focus module, etc., and the sensing element can have the function of sensing physical momentum and action energy, such as an accelerometer, a gyroscope, a Hall Effect Element, to sense the shaking and shaking applied by the user's hand or the external environment, thereby facilitating the automatic focus function of the imaging lens module configuration in the electronic device 50 and the play of the optical image stabilization component, to obtain good imaging quality, which helps the electronic device 50 according to the present disclosure to have multiple modes of shooting functions, such as optimized selfie, low-light source HDR (High Dynamic Range, high dynamic range imaging), high-resolution 4K (4K Resolution) video recording, etc.

[0150] In addition, the fifth embodiment is the same as the fourth embodiment in the structure and configuration relationship of the remaining elements, and will not be described again here.

[0151] Although the present application has been disclosed with the above-mentioned embodiments, it is not intended to limit the present application, and anyone with ordinary knowledge in the art can make some changes and modifications without departing from the spirit and scope of the present application, so the protection scope of the present application shall be subject to the scope defined by the appended claims.

Claims

1. A plastic optical turning element, characterized by, Comprising: an incident surface for allowing an imaging light to enter the plastic optical turning element; an exit surface for allowing the imaging light to exit the plastic optical turning element; a reflective surface for reflecting the imaging light; and a reflective optical film layer disposed on a surface of the reflective surface, and comprising: a silver atomic layer for reflecting the imaging light entering the incident surface to the exit surface; a bottom optical film layer in direct contact with the silver atomic layer, and the bottom optical film layer is closer to the reflective surface of the plastic optical turning element than the silver atomic layer; a top optical film layer, the refractive index of the top optical film layer is lower than the refractive index of the bottom optical film layer, the top optical film layer is not in direct contact with the silver atomic layer, and the top optical film layer is farther away from the reflective surface of the plastic optical turning element than the silver atomic layer; and at least one intermediate layer disposed between the top optical film layer and the silver atomic layer, and the at least one intermediate layer is in direct contact with the silver atomic layer, wherein the at least one intermediate layer comprises a metal layer, the metal layer does not contain silver atoms, and the material of the metal layer is one of Ti, Cr, Ni or Cr, Ni oxide; wherein the refractive index of the bottom optical film layer is Nb, the thickness of the bottom optical film layer is db, the refractive index of the top optical film layer is Nt, the thickness of the top optical film layer is dt, the thickness of the silver atomic layer is dAg, the minimum reflectivity of the reflective optical film layer between wavelengths 540nm-590nm is R5459, which satisfies the following conditions: 1.4<Nt<Nb<2.1; 1.6<Nb<2.1; 1.4<Nt<1.58; 0.05<db / dAg<1.2; 0.2<dAg / dt<3.5; and 94.0％<R5459<99.99％。 2. The plastic optical turning element of claim 1, wherein Further comprising: a connecting surface connecting the incident surface, the exit surface and the reflective surface; and a filling mark structure disposed on the connecting surface.

3. The plastic optical turning element of claim 2, wherein The bottom optical film layer is a metal oxide layer.

4. The plastic optical turning element of claim 2, wherein The thickness of the silver atomic layer is dAg, which satisfies the following conditions: 75nm<dAg<200nm.

5. The plastic optical turning element of claim 2, wherein The bottom optical film layer is in direct contact with the reflective surface of the plastic optical turning element.

6. The plastic optical turning element of claim 2, wherein The thickness of the bottom optical film layer is db, and the thickness of the top optical film layer is dt, which satisfy the following conditions: 0.05<db / dt<1.

1.

7. An imaging lens module characterized by comprising: Comprising: the plastic optical turning element of claim 1; and an optical imaging lens group, the plastic optical turning element is disposed on one side of the object side and the image side of the optical imaging lens group.

8. An electronic device, comprising: Comprising: the imaging lens module of claim 7; and an electronic photosensitive element disposed on an imaging surface of the imaging lens module.

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