Array substrate, repair method thereof, and repair machine

Abstract

The present invention provides an array substrate, comprising a base substrate and a metal layer disposed on the base substrate, a multilayer film layer disposed above the metal layer, the multilayer film layer including a flat layer, a disconnection location on the metal layer, a first insulating layer disposed above the multilayer film layer corresponding to the disconnection location; a first conductive pillar disposed on one side of the disconnection location and electrically connected to one end of the disconnected metal layer; a second conductive pillar disposed on the other side of the disconnection location and electrically connected to the other end of the disconnected metal layer, the other ends of the first conductive pillar and the second conductive pillar being exposed from the surface of the first insulating layer; a conductive connecting line disposed above the first insulating layer and electrically connecting the first conductive pillar and the second conductive pillar; and a second insulating layer covering the conductive connecting line. The present invention also relates to a method and machine for repairing an array substrate, which can perform final repairs on metal disconnections in an array substrate having a flat layer, effectively saving time and equipment costs.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an array substrate and a repair method and a repair machine thereof. Background Art

[0002] Liquid crystal display panels have the advantages of good picture quality, small size, light weight, low driving voltage, low power consumption, no radiation and relatively low manufacturing cost, and dominate the field of flat panel displays.

[0003] Pixels in LCD panels are typically composed of data lines and gate lines. Because both data lines and gate lines are made of metal, excessively wide lines can affect the pixel's aperture ratio. As product resolutions increase, data lines, in particular, become increasingly thinner. This makes wire breakage more common during production, impacting product yield.

[0004] For the array substrate of a twisted nematic (TN) display device, since it does not require a thicker planarization layer (OC), after all the film layers of the array substrate are manufactured, the film layers can be removed at the broken lines using a laser machine and laser repair (final repair) can be performed.

[0005] Figure 1 The figure is a schematic cross-sectional view of an array substrate of an existing in-plane switching mode display device. Figure 1 As shown, it includes a first metal layer 2 (including scan lines), a gate insulating layer 3, a second metal layer 4 (including data lines), a first insulating protection layer 5, a flat layer 6, a first electrode layer 7, a third metal layer 8, a second insulating protection layer 9 and a second electrode layer 10, which are sequentially arranged on the base substrate 1. The thickness of the flat layer 6 is about 2.0um-3.0um. Due to the thicker flat layer 6 and the thickness of other film layers located above it, after all the film layers of the array substrate are manufactured, the broken line cannot be removed by a laser machine and repaired by laser, so it can only be repaired online (inline repair) during the manufacturing process.

[0006] Figure 2 This is a production flow chart of an array substrate for an existing in-plane switching mode display device. Please refer to Figure 1 and Figure 2The manufacturing method includes: forming a first metal layer 2 on a base substrate 1, the first metal layer 2 including a scanning line; performing a conductive test on the first metal layer 2 to find the broken line position; performing laser repair on the broken line position; forming a semiconductor layer 3; forming a second metal layer 4; performing a conductive test on the second metal layer 4 to find the broken line position; performing laser repair on the broken line position; forming a first insulating protective layer 5; forming a flat layer 6; forming a first electrode layer 7; forming a third metal layer 8; forming a second insulating protective layer 9; and forming a second electrode layer.

[0007] During the aforementioned manufacturing process, after each metal layer (such as scan and data lines) is completed, a conductivity test is performed to identify the broken wires, and then laser repair is performed. This in-line repair method requires specialized equipment and electrical testing / repair stations, and requires at least two repair steps. This is costly, time-consuming, and labor-intensive, increasing product production cycles. Summary of the Invention

[0008] The object of the present invention is to provide an array substrate and a repair method and a repair machine thereof, which can perform final repair on broken metal wires of an array substrate of an in-plane switching mode display device, effectively saving costs in terms of time and equipment.

[0009] The present invention provides an array substrate, comprising a base substrate and a metal layer arranged on the base substrate, wherein a plurality of film layers are stacked above the metal layer, and the multi-layer film layers include at least a flat layer; the array substrate also comprises a first insulating layer, a first conductive column, a second conductive column, a conductive connecting line, and a second insulating layer; wherein, there is a disconnection position on the metal layer, and the first insulating layer is arranged above the multi-layer film layer corresponding to the disconnection position; the first conductive column is arranged on one side of the disconnection position, and one end of the first conductive column is electrically connected to one end of the disconnected metal layer; the second conductive column is arranged on the other side of the disconnection position, and one end of the second conductive column is electrically connected to the other end of the disconnected metal layer, and the other ends of the first conductive column and the second conductive column are exposed from the surface of the first insulating layer; the conductive connecting line is arranged above the first insulating layer and electrically connects the other ends of the first conductive column and the second conductive column; the second insulating layer covers above the conductive connecting line.

[0010] Furthermore, the array substrate includes a first metal layer, a gate insulation layer and a second metal layer arranged in sequence on the base substrate, and the multi-layer film layer also includes a first electrode layer, a second insulating protection layer and a second electrode layer located above the flat layer; the metal layer is the first metal layer or the second metal layer.

[0011] Furthermore, the circumferential surfaces of the first conductive column and the second conductive column are insulated, and both ends of the first conductive column and the second conductive column are conductive; or, it also includes an insulating hollow tube, and the first conductive column and the second conductive column are respectively arranged in the two insulating hollow tubes.

[0012] Furthermore, the insulating hollow tube has a bell mouth at one end away from the base substrate.

[0013] The present invention also provides a method for repairing an array substrate, the method comprising:

[0014] An array substrate is provided, the array substrate comprising a base substrate and a metal layer disposed on the base substrate, a plurality of film layers are stacked on the metal layer, and the plurality of film layers include at least a planar layer;

[0015] Performing a conductive test on the array substrate to find out the disconnection position of the metal layer;

[0016] A first insulating layer is applied above the multilayer film layer corresponding to the disconnection position; a first conductive pillar is formed on one side of the disconnection position, one end of the first conductive pillar is electrically connected to one end of the disconnected metal layer; a second conductive pillar is formed on the other side of the disconnection position, one end of the second conductive pillar is electrically connected to the other end of the disconnected metal layer; the other ends of the first conductive pillar and the second conductive pillar are exposed from the surface of the first insulating layer;

[0017] forming a conductive connection line connecting the first conductive pillar and the second conductive pillar on the first insulating layer; and

[0018] A second insulating layer is formed on the first insulating layer and covers the conductive connecting line.

[0019] Furthermore, the method for forming the first conductive column and the second conductive column includes: inserting a columnar conductive material having an insulating surface into the array substrate from one side of the broken line position, and forming the first conductive column after cutting off the columnar conductive material; and then inserting a columnar conductive material into the array substrate from the other side of the broken line position, and forming the second conductive column after cutting off the columnar conductive material, wherein both ends of the first conductive column and the second conductive column are conductive.

[0020] Furthermore, the method for forming the first conductive column and the second conductive column includes: inserting an insulating hollow tube on one side of the broken line position, one end of the insulating hollow tube contacts one end of the broken metal layer, injecting conductive silver glue into the insulating hollow tube to form the first conductive column, one end of the other insulating hollow tube contacts the other end of the broken metal layer, inserting another insulating hollow tube on the other side of the broken line position, and injecting conductive silver glue into the other insulating hollow tube to form the second conductive column.

[0021] Furthermore, the insulating hollow tube has a bell mouth at one end away from the substrate.

[0022] The present invention also provides a repair machine for repairing the above-mentioned array substrate, the repair machine includes a spraying part, a piercing part and a glue injection part; the spraying part is used to coat the first insulating layer and / or the second insulating layer; the piercing part is used to form the first conductive column and the second conductive column; the piercing part includes a feeding part and a shearing part, the feeding part is used to pierce the conductive material into the array substrate, and the shearing part is used to cut the conductive material; the glue injection part is used to form the conductive connecting line.

[0023] The present invention also provides a repair machine for repairing the above-mentioned array substrate, the repair machine includes a spraying part, a piercing part and a glue injection part; the spraying part is used to coat the first insulating layer and / or the second insulating layer; the piercing part and the glue injection part are used to form the first conductive column and the second conductive column; the piercing part includes a feeding part and a shearing part, the feeding part is used to pierce the insulating hollow tube into the array substrate, and the shearing part is used to cut the insulating hollow tube; the glue injection part is used to inject conductive silver glue into the insulating hollow tube and to form the conductive connecting line and inject conductive silver glue into the insulating hollow tube.

[0024] The array substrate, repair method, and repair machine provided by the present invention can perform final repair on metal breaks in an array substrate with a flat layer. By placing the metal layer repair step at the last step of the process, multiple metal layers of different types can be completed in the same repair step. There is no need to perform multiple laser repairs on different metal layers during the production of the array substrate, which can effectively improve the product yield of the array substrate and reduce the repair time. The repair machine has a simple structure and does not require dedicated laser equipment and electrical testing / repair stations, effectively saving costs and improving the product production cycle.

[0025] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above-mentioned array substrate and its repair method and repair machine of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and explains it in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The present invention is a schematic diagram of the cross-sectional structure of an array substrate of an existing in-plane switching mode display device.

[0027] Figure 2 This is a flow chart for manufacturing an array substrate of an existing in-plane switching mode display device.

[0028] Figure 3 FIG. 1 is a schematic diagram of the cross-sectional structure of an array substrate according to a preferred embodiment of the present invention.

[0029] Figure 4 It is a schematic cross-sectional structural diagram of a metal layer of an array substrate having a disconnection position according to a preferred embodiment of the present invention.

[0030] Figures 5a to 5f FIG. 1 is a schematic diagram of a repair process of an array substrate according to a preferred embodiment of the present invention.

[0031] Figure 6 This is another cross-sectional structural diagram of the array substrate after the broken position of the metal layer is repaired according to a preferred embodiment of the present invention.

[0032] Figure 7 FIG. 1 is another schematic cross-sectional structural diagram of an array substrate during a repair process according to a preferred embodiment of the present invention.

[0033] Figure 8 This is another schematic cross-sectional view of the array substrate during the repair process according to a preferred embodiment of the present invention.

[0034] Figure 9 FIG. 4 is a flow chart of manufacturing an array substrate according to a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0035] To further illustrate the technical means and effects of the present invention to achieve the intended purpose, the following detailed description of the array substrate, its repair method, and its specific implementation, structure, features, and effects of the repair machine according to the present invention is given in conjunction with the accompanying drawings and preferred embodiments.

[0036] The aforementioned and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiment with reference to the accompanying drawings. Through the description of the specific embodiments, a deeper and more detailed understanding of the technical means and effects adopted by the present invention to achieve the intended objectives can be obtained. However, the accompanying drawings are provided for reference and illustration purposes only and are not intended to limit the present invention.

[0037] Figure 3 FIG. 1 is a schematic diagram of the cross-sectional structure of an array substrate according to a preferred embodiment of the present invention. Figure 4 It is a schematic cross-sectional structural diagram of a metal layer of an array substrate having a disconnection position according to a preferred embodiment of the present invention. Figures 5a to 5f FIG. 1 is a schematic diagram of a repair process of an array substrate according to a preferred embodiment of the present invention.

[0038] Please also refer to Figure 3 、 Figure 4 and Figures 5a to 5f This embodiment discloses an array substrate, which includes a base substrate 100 and a metal layer disposed on the base substrate 100, and a plurality of film layers stacked on the metal layer. Specifically, the array substrate is, for example, an array substrate of an in-plane switching (IPS) display device. Figure 3 As shown, the array substrate includes a first metal layer 110, a gate insulating layer 120, a second metal layer 130, a first insulating protection layer 140, a planarization layer 150, a first electrode layer 160, a third metal layer 170, a second insulating protection layer 180, and a second electrode layer 190, which are sequentially arranged on a base substrate 100. In other words, the multi-layer film layer includes at least the planarization layer 150. The thickness of the planarization layer 150 is approximately 2.0 μm to 3.0 μm.

[0039] The metal layer may be the first metal layer 110 or the second metal layer 130 adjacent to the base substrate 100. The first metal layer 110 includes a scan line 111, and the second metal layer 130 includes a data line 131. The disconnection position may be a first disconnection position 113 (e.g., Figure 4 or Figure 5f ), or it may be a second disconnection position 133 located on the second metal layer 130 (as shown in FIG. Figure 6 As shown in FIG, but not limited thereto, other disconnection positions of the film layer requiring conductivity may also be used.

[0040] In this embodiment, the array substrate further includes a first insulating layer 341 , a first conductive pillar 331 , a second conductive pillar 332 , a conductive connection line 333 , and a second insulating layer 342 .

[0041] Specifically, if Figure 4 or Figure 5fAs shown, a break position (first break position 113) is provided on the metal layer (first metal layer 110), and a first insulating layer 341 is arranged above the multilayer film layer corresponding to the break position; a first conductive column 331 is arranged on one side of the break position, and one end of the first conductive column 331 is electrically connected to one end of the broken first metal layer 110; a second conductive column 332 is arranged on the other side of the broken first metal layer 110, and one end of the second conductive column 332 is electrically connected to the other side of the broken first metal layer 110; the other ends of the first conductive column 331 and the second conductive column 332 are exposed from the surface of the first insulating layer 341, and a conductive connecting line 333 covers the top of the first insulating layer 341 and electrically connects the first conductive column 331 and the second conductive column 332. The second insulating layer 342 covers the conductive connecting line 333 to protect the conductive connecting line 333. The conductive connecting line 333 is, for example, conductive silver glue, and the second insulating layer 342 can prevent the conductive silver glue from oxidizing.

[0042] Among them, the setting position of the first conductive pillar 331 and the second conductive pillar 332 and the position of the metal layer where one end of them is disconnected can be accurately positioned by the AOI defect coordinates x, y and the CCD camera AI of the repair machine, and the positioning accuracy error is less than 0.1um.

[0043] Furthermore, the circumferential surfaces of the first and second conductive pillars 331 and 332 are insulated, while their ends are conductive. Specifically, the outer walls of the first and second conductive pillars 331 and 332 are insulated, the inner cores are made of silver, and the outer walls of the pillar tips are free of insulating material. Insulation coatings can be applied to the outer walls of the first and second conductive pillars 331 and 332 to prevent short circuits and enhance rigidity.

[0044] Specifically, the diameters of the first conductive pillars 331 and the second conductive pillars 332 are, for example, 1 to 5 μm. The first conductive pillars 331 and the second conductive pillars 332 may have different diameters according to different product designs.

[0045] The array substrate disclosed in the present invention is provided with a first conductive column 331 and a second conductive column 332 with an insulated circumferential surface and conductive at both ends. One end of each conductive column is electrically connected to the two sides of the disconnected metal layer, and the other end is electrically connected through a conductive connecting line 333. The disconnected first metal layer 110 is connected through the first conductive column 331, the second conductive column 332 and the conductive connecting line 333 to achieve broken line repair.

[0046] The present invention also relates to a method for repairing an array substrate, the method comprising:

[0047] Providing an array substrate, such as Figure 3As shown, the array substrate includes a base substrate 100 and a metal layer arranged on the base substrate 100 , and a plurality of film layers are stacked on the metal layer, and the plurality of film layers at least include a planar layer 150 .

[0048] In this embodiment, the metal layer is a first metal layer 110 , and the first metal layer 110 includes a scanning line 111 ;

[0049] like Figure 4 As shown, a conductive test is performed on the array substrate to find out the disconnection position of the metal layer, and the disconnection position is, for example, the first disconnection position 113 on the first metal layer 110;

[0050] like Figure 5a As shown, a first insulating layer 341 is coated on top of the multilayer film corresponding to the disconnection position (the first disconnection position 113 ), and the first insulating layer 341 extends to both sides of the disconnection position;

[0051] like Figure 5b 、 5c As shown in Figures 5d and 5d, a first conductive pillar 331 is formed on one side of the disconnection position (the first disconnection position 113), and one end of the first conductive pillar 331 is electrically connected to one end of the disconnected first metal layer 110; a second conductive pillar 332 is formed on the other side of the disconnection position (the first disconnection position 113), and one end of the second conductive pillar 332 is electrically connected to the other end of the disconnected first metal layer 110; the other ends of the first conductive pillar 331 and the second conductive pillar 332 are exposed from the surface of the first insulating layer 341;

[0052] like Figure 5e As shown, a conductive connection line 333 connecting the first conductive pillar 331 and the second conductive pillar 332 is formed on the first insulating layer 341;

[0053] like Figure 5f As shown, a second insulating layer 342 is formed on the first insulating layer 341 and covers the conductive connection line 333 .

[0054] In this embodiment, the method for forming the first conductive column 331 includes: inserting a columnar conductive material having an insulating surface into the array substrate from one side of the broken line position, and cutting off the columnar conductive material to form the first conductive column 331; the method for forming the second conductive column 332 includes: inserting the columnar conductive material into the array substrate from the other side of the broken line position, and cutting off the columnar conductive material to form the second conductive column 332, wherein both ends of the first conductive column 331 and the second conductive column 332 are conductive.

[0055] Figure 6 FIG. 1 is another cross-sectional structural diagram of the metal layer of the array substrate after the broken line position is repaired according to a preferred embodiment of the present invention. Figure 6As shown, the metal layer may also be a second metal layer 130, the second metal layer 130 includes a data line 131, and the disconnection position is, for example, a second disconnection position 133 on the second metal layer 130. No further details will be given here.

[0056] The present invention further relates to a repair machine for repairing the above-mentioned array substrate. The repair machine includes a spraying unit 310 , a binding unit 320 and a glue injection unit 360 .

[0057] like Figure 5a As shown, the spraying unit 310 is used to apply the first insulating layer 341 .

[0058] like Figure 5b and 5c As shown, the piercing part 320 is used to form a first conductive column 331 and a second conductive column 332; the piercing part 320 includes a feeding piece 321 and a shearing piece 322, the feeding piece 321 is used to pierce the conductive material into the array substrate, and the shearing piece 322 is used to cut the conductive material to form a first conductive column 331 and a second conductive column 332 respectively, wherein one end of the first conductive column 331 is electrically connected to one end of the disconnected first metal layer 110; one end of the second conductive column 332 is electrically connected to the other end of the disconnected first metal layer 110; and the other ends of the first conductive column 331 and the second conductive column 332 are exposed from the surface of the first insulating layer 341.

[0059] Among them, the setting position of the first conductive pillar 331 and the second conductive pillar 332 and the position of the metal layer where one end of them is disconnected can be accurately positioned by the AOI defect coordinates x, y and the CCD camera AI of the repair machine, and the positioning accuracy error is less than 0.1um.

[0060] like Figure 5e As shown, the glue injection part 360 is used to form the conductive connection line 333 on the first insulating layer 341 , and the conductive connection line 333 is used to connect the first conductive column 331 and the second conductive column 332 .

[0061] like Figure 5f As shown, the spray coating unit 310 is also used to coat the second insulating layer 342 .

[0062] The array substrate, repair method, and repair machine provided in the embodiments of the present invention can perform final repair on metal breaks in an array substrate having a flat layer. By placing the metal layer repair step at the last step of the process, multiple metal layers of different types can be completed in the same repair step. There is no need to perform multiple laser repairs on different metal layers during the production of the array substrate, which can effectively improve the product yield of the array substrate and reduce the repair time. The repair machine has a simple structure and does not require dedicated laser equipment and electrical testing / repair stations, effectively saving costs and improving the product production cycle.

[0063] Figure 7 FIG. 1 is another schematic cross-sectional structural diagram of an array substrate during a repair process according to a preferred embodiment of the present invention. Figure 8 This is another schematic cross-sectional view of the array substrate during the repair process according to a preferred embodiment of the present invention.

[0064] like Figure 7 As shown, in another embodiment of the present invention, the array substrate further includes an insulating hollow tube 350 , and the first conductive pillar 331 and the second conductive pillar 332 are respectively disposed in the two insulating hollow tubes 350 .

[0065] Furthermore, in another embodiment of the present invention, Figure 8 As shown, the insulating hollow tube 350 has a bell mouth 351 at one end away from the base substrate 100. The bell mouth 351 ensures effective contact between the surface-bridged conductive connecting wire 333 and the first conductive pillar 331 and the second conductive pillar 332 within the insulating hollow tube 350. If the first conductive pillar 331 and the second conductive pillar 332 are made of conductive silver paste, the bell mouth 351 also facilitates the subsequent injection of the conductive silver paste into the insulating hollow tube 350, further facilitating manufacturing.

[0066] The array substrate disclosed in the present invention connects the disconnected first metal layer 110 through the first conductive pillars 331 , the second conductive pillars 332 and the conductive connection lines 333 , thereby repairing the disconnection.

[0067] Another embodiment of the present invention further discloses a method for repairing an array substrate.

[0068] Providing an array substrate, such as Figure 3 As shown, the array substrate includes a base substrate 100 and a metal layer arranged on the base substrate 100 , and a plurality of film layers are stacked on the metal layer, and the plurality of film layers at least include a planar layer 150 .

[0069] In this embodiment, the metal layer is a first metal layer 110 , and the first metal layer 110 includes a scanning line 111 ;

[0070] like Figure 4 As shown, a conductive test is performed on the array substrate to find out the disconnection position of the metal layer, and the disconnection position is, for example, the first disconnection position 113 on the first metal layer 110;

[0071] like Figure 5a As shown, a first insulating layer 341 is coated on top of the multilayer film corresponding to the disconnection position (the first disconnection position 113 ), and the first insulating layer 341 extends to both sides of the disconnection position;

[0072] like Figure 5b 、 5cAs shown in Figures 5d and 5d, a first conductive pillar 331 is formed on one side of the disconnection position (the first disconnection position 113), and one end of the first conductive pillar 331 is electrically connected to one end of the disconnected first metal layer 110; a second conductive pillar 332 is formed on the other side of the disconnection position (the first disconnection position 113), and one end of the second conductive pillar 332 is electrically connected to the other end of the disconnected first metal layer 110; the other ends of the first conductive pillar 331 and the second conductive pillar 332 are exposed from the surface of the first insulating layer 341;

[0073] like Figure 5e As shown, a conductive connection line 333 connecting the first conductive pillar 331 and the second conductive pillar 332 is formed on the first insulating layer 341;

[0074] like Figure 5f As shown, a second insulating layer 342 is formed on the first insulating layer 341 and covers the conductive connection line 333 .

[0075] Among them, such as Figure 7 As shown, the method for forming the first conductive pillar 331 and the second conductive pillar 332 includes: inserting an insulating hollow tube 350 on one side of the disconnection location, with one end of the insulating hollow tube 350 contacting one end of the disconnected first metal layer 110; injecting conductive silver paste into the insulating hollow tube 350 to form the first conductive pillar 331; inserting another insulating hollow tube 350 on the other side of the disconnection location, with one end of the other insulating hollow tube 350 contacting the other end of the disconnected first metal layer 110; and injecting conductive silver paste into the other insulating hollow tube 350 to form the second conductive pillar 332. By injecting conductive silver paste into the two insulating hollow tubes 350, the circumferential surfaces of the first conductive pillar 331 and the second conductive pillar 332 are insulated, while both ends are conductive.

[0076] Among them, the setting position of the two insulating hollow tubes 350 and the position of the metal layer with broken contact at one end can be accurately positioned by the AOI defect coordinates x, y and the CCD camera AI of the repair machine, and the positioning accuracy error is less than 0.1um.

[0077] Furthermore, in another embodiment of the present invention, Figure 8 As shown, to facilitate glue injection, the end of the insulating hollow tube 350 away from the substrate 100 has a bell mouth 351. The bell mouth 351 can also ensure that the surface bridge conductive connection line 333 effectively contacts the first conductive column 331 and the second conductive column 332 in the insulating hollow tube 350.

[0078] The array substrate disclosed in the present invention is formed by injecting conductive silver paste into two insulating hollow tubes 350 to form a first conductive column 331 and a second conductive column 332 with circumferential surface insulation and conductive ends. One end of each conductive column is electrically connected to the two sides of the disconnected metal layer, and the other end is electrically connected through a conductive connecting line 333. By providing two insulating hollow tubes 350 and conductive connecting lines 333, the disconnected first metal layer 110 is connected to achieve broken line repair.

[0079] The present invention also relates to another repairing machine for repairing the array substrate having the insulating hollow tube 350 . The repairing machine includes a spraying unit 310 , a binding unit 320 and a glue injection unit 360 .

[0080] like Figure 5a As shown, the spraying unit 310 is used to apply the first insulating layer 341 .

[0081] Combine Figure 7 and Figure 5f As shown, the glue injection portion 360 is used to form the conductive connection line 333, as shown in FIG. Figure 7 As shown, the glue injection portion 360 is further used to inject conductive silver glue into the insulating hollow tube 350 to form the first conductive column 331 and the second conductive column 332 respectively.

[0082] The piercing part 320 and the glue injection part 360 are used to form the first conductive column 331 and the second conductive column 332; the piercing part 320 includes a feeding part 321 and a shearing part 322, the feeding part 321 is used to pierce the insulating hollow tube 350 into the array substrate, and the shearing part 322 is used to cut the insulating hollow tube 350; the glue injection part 360 is used to inject conductive silver glue into the insulating hollow tube 350 and to form a conductive connecting line 333.

[0083] like Figure 5f As shown, the spraying unit 310 is also used to apply the first insulating layer 341 .

[0084] In the array substrate, repair method thereof, and repair machine provided by the embodiments of the present invention, conductive silver paste is injected into the insulating hollow tube 350 to form the first conductive column 331 and the second conductive column 332. The conductive effect thereof is the same as the conductive effect of the first conductive column 331 and the second conductive column 332 directly formed with conductive material. In addition, since the outer wall is made of insulating material, it can be ensured that the first conductive column 331 and the second conductive column 332 are short-circuited with other metal layers and / or conductive layers in the multi-layer film layer during the repair process.

[0085] Figure 9 FIG. 1 is a flow chart of manufacturing an array substrate according to a preferred embodiment of the present invention. Figure 9 As shown, in the array substrate and the repair method thereof of the present invention, Figure 2Compared with the existing technology, the final repair of the metal wire in the array substrate with a flat layer can be performed, and the step of repairing the metal layer is placed in the last step of the process. Multiple different metal layers can be completed in the same repair step. There is no need to perform multiple laser repairs on different metal layers during the production process of the array substrate, which can effectively improve the product yield of the array substrate and reduce the repair time; the repair machine has a simple structure and does not require special laser equipment, which effectively saves costs in terms of time and equipment.

[0086] The array substrate, its repair method, and repair machine provided by the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. An array substrate, comprising a base substrate (100) and a metal layer arranged on the base substrate (100), wherein a plurality of film layers are stacked on the metal layer, and the plurality of film layers at least include a flat layer (150); characterized in that: The array substrate further comprises a first insulating layer (341), a first conductive column (331), a second conductive column (332), a conductive connecting line (333) and a second insulating layer (342); The metal layer has a disconnection position, and the first insulating layer (341) is arranged above the multilayer film layer corresponding to the disconnection position; the first conductive column (331) is arranged on one side of the disconnection position, and one end of the first conductive column (331) is electrically connected to one end of the disconnected metal layer; the second conductive column (332) is arranged on the other side of the disconnection position, and one end of the second conductive column (332) is electrically connected to the other end of the disconnected metal layer, and the other ends of the first conductive column (331) and the second conductive column (332) are exposed from the surface of the first insulating layer (341); the conductive connecting line (333) is arranged above the first insulating layer (341) and electrically connects the other ends of the first conductive column (331) and the second conductive column (332); the second insulating layer (342) covers the conductive connecting line (333); The array substrate further comprises an insulating hollow tube (350), and the first conductive column (331) and the second conductive column (332) are formed by injecting conductive silver glue into the insulating hollow tube (350).

2. The array substrate according to claim 1, wherein: The array substrate comprises a first metal layer (110), a gate insulating layer (120) and a second metal layer (130) which are sequentially arranged on the base substrate (100); the multilayer film layer further comprises a first electrode layer (160), a second insulating protection layer (180) and a second electrode layer (190) located above the flat layer (150); the metal layer is the first metal layer (110) or the second metal layer (130).

3. The array substrate according to claim 1, wherein: The insulating hollow tube (350) has a bell mouth (351) at one end away from the substrate (100).

4. A method for repairing an array substrate, characterized in that: The repair method includes: An array substrate is provided, the array substrate comprising a base substrate (100) and a metal layer arranged on the base substrate (100), a multilayer film layer being stacked above the metal layer, the multilayer film layer comprising at least a flat layer (150); Performing a conductive test on the array substrate to find out the disconnection position of the metal layer; A first insulating layer (341) is coated on the multilayer film layer corresponding to the disconnection position; a first conductive column (331) is formed on one side of the disconnection position, one end of the first conductive column (331) is electrically connected to one end of the disconnected metal layer; a second conductive column (332) is formed on the other side of the disconnection position, one end of the second conductive column (332) is electrically connected to the other end of the disconnected metal layer; the other ends of the first conductive column (331) and the second conductive column (332) are exposed from the surface of the first insulating layer (341); forming a conductive connection line (333) connecting the first conductive column (331) and the second conductive column (332) on the first insulating layer (341); and forming a second insulating layer (342) on the first insulating layer (341) and covering the conductive connecting line (333); The method of forming the first conductive column (331) and the second conductive column (332) comprises: An insulating hollow tube (350) is inserted into one side of the disconnected position, one end of the insulating hollow tube (350) contacts one end of the disconnected metal layer, and conductive silver glue is injected into the insulating hollow tube (350) to form the first conductive column (331). Another insulating hollow tube (350) is inserted into the other side of the disconnected position, one end of the other insulating hollow tube (350) contacts the other end of the disconnected metal layer, and conductive silver glue is injected into the other insulating hollow tube (350) to form the second conductive column (332).

5. The array substrate repair method according to claim 4, wherein: One end of the insulating hollow tube (350) away from the substrate base (100) has a bell mouth (351).

6. A repair machine, characterized in that: Used for repairing the array substrate as claimed in claim 1, the repair machine comprises a spraying section (310), a piercing section (320) and a glue injection section (360); the spraying section (310) is used to apply the first insulating layer (341) and / or the second insulating layer (342); the piercing section (320) and the glue injection section (360) are used to form the first conductive column (331) and the second conductive column (332); the piercing section (320) comprises a feeding piece (321) and a shearing piece (322), the feeding piece (321) is used to pierce the insulating hollow tube (350) into the array substrate, and the shearing piece (322) is used to cut the insulating hollow tube (350); the glue injection section (360) is used to inject conductive silver glue into the insulating hollow tube (350) and to form the conductive connecting line (333).

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