Heat dissipation device

Abstract

The present invention discloses a heat dissipation device, which includes a housing, a first plate body, a second plate body, an arc-shaped support structure and a fan. The first plate body is fixed inside the housing, and the arc-shaped support structure is fixed to the first plate body. The arc-shaped support structure has an arc-shaped slot, which extends radially along the center of the arc-shaped support structure and is located on the inner surface of the arc-shaped support structure. The second plate body is connected to the arc-shaped slot and jointly forms a receiving space with the arc-shaped support structure, and the fan is pivotally connected to the second plate body and is received between the arc-shaped support structure and the second plate body.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, and particularly to a heat dissipation device with a fan. Background Art

[0002] With the progress of the times, the demand for electronic products such as notebook computers is increasing day by day, and there is a pursuit of better performance and a thinner and lighter design to bring people a more convenient and rich experience. In the trend of making electronic products smaller in size and thinner in thickness, the space that can be occupied by the fan module provided inside for heat dissipation is also reduced accordingly, making the demand for thin fans increase day by day. In order to improve the heat dissipation efficiency of electronic products, how to design a flow guiding structure that can enhance the efficiency of the fan has become an important issue.

[0003] On some electronic products, the fan may malfunction or make abnormal noises due to the force applied to the outer shell. Therefore, many private enterprises or relevant research institutions have invested a large amount of funds, manpower, and time in researching heat dissipation devices and are eager to improve various characteristics of heat dissipation devices. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide a heat dissipation device that can solve the above problems, which includes a housing, a first plate, a second plate, an arc-shaped support structure, and a fan. The first plate is fixed inside the housing. The arc-shaped support structure is fixed to the first plate, and the arc-shaped support structure has an arc-shaped slot that extends along the central radius of the arc-shaped support structure and is located on the inner surface of the arc-shaped support structure. The second plate is connected to the arc-shaped slot and together with the arc-shaped support structure and the first plate forms an accommodation space. The fan is fixed to the second plate and accommodated in the accommodation space.

[0005] In one or more embodiments of the present invention, the arc-shaped support structure has a plurality of protruding portions, and a plurality of air flow channels are defined between the plurality of protruding portions. The fan is configured to drive air flow through the plurality of air flow channels.

[0006] In one or more embodiments of the present invention, the second plate has a plurality of ventilation holes that surround the connection of the fan to the second plate. The fan is configured to drive air flow through the plurality of ventilation holes.

[0007] In one or more embodiments of the present invention, the second plate has a plurality of ventilation holes that surround the connection of the fan to the second plate, the arc-shaped support structure has a plurality of protruding portions, and a plurality of air flow channels are defined between the plurality of protruding portions. The fan is configured to drive air flow through the plurality of ventilation holes and then through the plurality of air flow channels.

[0008] In one or more embodiments of the present invention, the second plate has a plurality of extension arms and a central portion. The plurality of extension arms surround the central portion and define a plurality of ventilation holes, and the fan is disposed in the central portion.

[0009] In one or more embodiments of the present invention, the heat dissipation device has a fixing member, the arc-shaped support structure has a fixing through hole, and the second plate body has an edge groove. The fixing member is aligned with and passes through the fixing through hole and the edge groove, so as to facilitate the fixing of the second plate body to the arc-shaped support structure.

[0010] In one or more embodiments of the present invention, the arc-shaped support structure has a neck and a head. The head is farther away from the first plate body than the neck, and the width of the head is greater than the width of the neck, wherein an arc-shaped slot is provided in the head.

[0011] In one or more embodiments of the present invention, the arc-shaped support structure has a bottom, the bottom is connected to the first plate body and the width of the bottom gradually increases towards the first plate body.

[0012] In one or more embodiments of the present invention, the second plate body has a side bottom edge, and the arc-shaped support structure is generally U-shaped and has a stepped end. When the second plate body is inserted into the arc-shaped support structure, the side bottom edge is inclined and adjacent to the stepped end to form a notch.

[0013] In one or more embodiments of the present invention, the arc-shaped support structure is integrally formed on the first plate body.

[0014] In summary, the present invention provides a heat dissipation device, which includes an arc-shaped support structure to facilitate the insertion of a plate body. The plate body and the arc-shaped support structure together form an accommodation space to accommodate a fan. Therefore, when the heat dissipation device is pressed, the fan can be protected by the plate body and the arc-shaped support structure, thereby avoiding fan failure or abnormal noise.

[0015] The above is only used to elaborate on the problems to be solved by the present invention, the technical means for solving the problems, and the effects produced thereby, etc. The specific details of the present invention will be introduced in detail in the following embodiments and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To achieve the above advantages and features, the principles briefly described above will be more specifically explained with reference to the embodiments, and the specific embodiments are shown in the drawings. These drawings only illustratively describe the present invention and thus do not limit the scope of the invention. Through the drawings, the principles of the present invention will be clearly explained, and additional features and details will be fully described, wherein:

[0017] Figure 1 A three-dimensional schematic diagram of an electronic device is shown according to one or more embodiments of the present invention;

[0018] Figure 2 A three-dimensional schematic diagram of a heat dissipation device is shown according to one or more embodiments of the present invention;

[0019] Figure 3Top view of a heat dissipation device according to one or more embodiments of the present invention;

[0020] Figure 4 Side view of a heat dissipation device according to one or more embodiments of the present invention;

[0021] Figure 5 And Figure 6 Schematic perspective view of a fan and a second plate body according to one or more embodiments of the present invention, where Figure 5 And Figure 6 Respectively represent different perspectives;

[0022] Figure 7 Schematic perspective view of an arc-shaped support structure according to one or more embodiments of the present invention; and

[0023] Figure 8 And Figure 9 Respectively show Figure 7 Partial enlarged views of the arc-shaped support structure in

[0024] Symbol description:

[0025] 10: Electronic device

[0026] 100: Heat dissipation device

[0027] 110: Housing

[0028] 120: First plate body

[0029] 130: Second plate body

[0030] 131: Ventilation hole

[0031] 133: Extension arm

[0032] 135: Central part

[0033] 136: Edge groove

[0034] 139: Side bottom edge

[0035] 140: Arc-shaped support structure

[0036] 140a: Head

[0037] 140b: Neck

[0038] 140c: Bottom

[0039] 141: Arc-shaped slot

[0040] 143: Protrusion

[0041] 145: Air flow channel

[0042] 146: Fixed through hole

[0043] 149: Step-shaped end

[0044] 150: Fan

[0045] 160: Fastener

[0046] A: Airflow

[0047] W1, W2, W3: Width Detailed implementation manners

[0048] The following will disclose several embodiments of the present invention in the form of diagrams. For the sake of clear description, many practical details will be described together in the following narrative. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, for the purpose of simplifying the diagrams, some conventional structures and elements will be shown in a simple schematic manner in the diagrams.

[0049] Please refer to Figure 1 , Figure 1 a three-dimensional schematic diagram of an electronic device 10 illustrated according to one or more embodiments of the present invention, wherein a heat dissipation device 100 is disposed inside the electronic device 10, and when the electronic device 10 operates, the heat dissipation device 100 can effectively control the temperature of the electronic device 10 to avoid overheating or malfunction of the electronic device 10. In addition, the electronic device 10 can be a desktop computer, a laptop computer, a tablet computer or a smart phone, and the present invention is not limited thereto.

[0050] Please refer to Figures 2 to 4 , Figure 2 a three-dimensional schematic diagram of the heat dissipation device 100 is illustrated. Figure 3 a top view of the heat dissipation device 100 is illustrated. Figure 4Side view of the heat dissipation device 100. In one or more embodiments of the present invention, the heat dissipation device 100 includes a housing 110, a first plate body 120, a second plate body 130, an arc-shaped support structure 140, and a fan 150. The material of the housing 110 may include metal (such as aluminum alloy or steel) or plastic, and the housing 110 may be the outer shell of the electronic device 10, such as the outer shell of a desktop computer, a laptop computer, a tablet computer, or a smart phone. However, the present invention is not limited thereto. For example, the electronic device 10 may be a laptop computer. The first plate body 120 is fixed inside the housing 110. The first plate body 120 may be, for example, the keyboard bracket of the laptop computer. The materials of the first plate body 120 and the second plate body 130 may include metal (such as steel) to provide good mechanical strength. However, the present invention is not limited thereto. The arc-shaped support structure 140 is generally U-shaped and fixed to the first plate body 120, where the arc-shaped support structure 140 may be integrally formed or not integrally formed with the first plate body 120. In addition, the arc-shaped support structure 140 has an arc-shaped slot 141 (please refer to Figure 7 ). The arc-shaped slot 141 extends radially along the center of the arc-shaped support structure 140 and is located on the inner surface of the arc-shaped support structure 140. The arc-shaped support structure 140 may be made by various processing means, such as formed by a stamping process or a subtractive manufacturing process. The arc-shaped slot 141 may be formed by a metal cutting process or a laser cutting. In addition, the fan 150 may be an axial fan or a centrifugal fan to effectively cool the electronic device 10. However, the present invention is not limited thereto.

[0051] In one or more embodiments of the present invention, the second plate body 130 is connected to the arc-shaped slot 141, and the second plate body 130 and the arc-shaped support structure 140 together form a receiving space. The fan 150 is pivotally connected to the second plate body 130 and is received between the arc-shaped support structure 140 and the second plate body 130. In addition, the arc-shaped support structure 140 has a plurality of protrusions 143. The plurality of protrusions 143 are configured to be adjacent to the inner surface of the housing 110, and a plurality of air flow channels 145 are defined between the plurality of protrusions 143, and the plurality of air flow channels 145 are formed between the arc-shaped support structure 140 and the housing 110.

[0052] In addition, as Figure 3 and Figure 4As shown, a plurality of air flow channels 145 are provided between the plurality of protrusions 143 and the housing 110, and the fan 150 is configured to drive the air flow A through the plurality of air flow channels 145. The second plate body 130 has a plurality of ventilation holes 131, and the plurality of ventilation holes 131 surround the connection of the fan 150 to the second plate body 130. The fan 150 is configured to drive the air flow A through the plurality of ventilation holes 131. The fan 150 is configured to drive the air flow A through the plurality of ventilation holes 131, and then the air flow A passes through the plurality of air flow channels 145. Therefore, the plurality of ventilation holes 131 and the air flow channels 145 together define a path for the air flow A to pass through, thereby effectively using the air flow A to dissipate heat from the electronic device 10, but the present invention is not limited thereto. Although the air flow A is shown as flowing from the fan 150 to the ventilation holes 131 and the air flow channels 145, depending on the type of the fan 150, the air flow A may also flow from the ventilation holes 131 and the air flow channels 145 to the fan 150, and the present invention is not limited thereto.

[0053] Please also refer to Figures 1 to 6 , Figure 5 and Figure 6 which shows a three-dimensional schematic view of the second plate body 130 and the fan 150, where Figure 5 and Figure 6 respectively represent different perspectives. In one or more embodiments of the present invention, the second plate body 130 has a plurality of extension arms 133 and a central portion 135. For example, three equally spaced extension arms 133 surround the central portion 135 and define a plurality of ventilation holes 131, where the fan 150 is disposed at the central portion 135, thereby enabling the fan 150 to rotate stably and effectively dissipate heat from the electronic device 10. Specifically, the central portion 135 is annular to facilitate the pivotal connection of the fan 150 to the central portion 135, but the present invention is not limited thereto.

[0054] Please also refer to Figures 1 to 7 , where Figure 7 which shows a three-dimensional schematic view of the arc-shaped support structure 140. In one or more embodiments of the present invention, the arc-shaped support structure 140 has a head 140a and a neck 140b. The head 140a is farther from the first plate body 120 than the neck 140b, and the width W1 of the head 140a is greater than the width W2 of the neck 140b. An arc-shaped slot 141 is provided in the head 140a, thereby enabling the head 140a of the arc-shaped support structure 140 to stably support the first plate body 120, and the neck 140b allows the arc-shaped support structure 140 and the second plate body 130 to maintain a large air circulation space for the 140b to facilitate air flow and effectively dissipate heat from the electronic device 10, but the present invention is not limited thereto.

[0055] In one or more embodiments of the present invention, the arc-shaped support structure 140 has a bottom 140c. The bottom 140c is connected to the first plate body 120, and the width W3 of the bottom 140c gradually increases towards the first plate body 120. Therefore, the bottom 140c can be trapezoidal or semi-circular arc-shaped. The bottom 140c helps the arc-shaped support structure 140 to be stably fixed to the first plate body 120. In addition, the neck 140b is provided between the head 140a and the bottom 140c. The width W3 of the bottom 140c is greater than or equal to the width W2 of the neck 140b, and the width W3 of the bottom 140c gradually decreases towards the neck 140b to facilitate air flow and effectively dissipate heat from the electronic device 10. However, the present invention is not limited thereto.

[0056] Please refer to Figures 1 to 9 。 Figure 8 and Figure 9 respectively show Figure 7 partial enlarged views of the arc-shaped support structure 140 in [the figure]. In one or more embodiments of the present invention, the heat dissipation device 100 has a fixing member 160. The second plate body 130 has an edge groove 136. The arc-shaped support structure 140 has a fixing through hole 146. The fixing member 160 is aligned with and passes through the edge groove 136 and the fixing through hole 146 to facilitate the fixing of the second plate body 130 to the arc-shaped support structure 140. Specifically, the fixing through hole 146 can be a threaded through hole, and the fixing member 160 can be a screw. However, the present invention is not limited thereto.

[0057] In one or more embodiments of the present invention, the second plate body 130 has a side bottom edge 139, and the arc-shaped support structure 140 is generally U-shaped and has a stepped end 149. When the second plate body 130 is inserted into the arc-shaped support structure 140, the side bottom edge 139 is inclined and adjacent to the stepped end 149 to form a notch, so as to facilitate using a tool (such as tweezers) to drive the second plate body 130 to be inserted into or removed from the arc-shaped support structure 140. However, the present invention is not limited thereto.

[0058] In summary, the present invention provides a heat dissipation device, which includes an arc-shaped support structure to facilitate the insertion of a plate body. The plate body and the arc-shaped support structure together form a receiving space to accommodate a fan. Therefore, when the heat dissipation device is pressed, the fan can be protected by the plate body and the arc-shaped support structure, thereby avoiding fan failure or abnormal noise.

[0059] The different embodiments of the present invention have been described above. It should be understood that the different embodiments are presented only as examples and not as limitations. Without departing from the spirit and scope of the present invention, many modifications can be made to the embodiments of the present application according to the disclosure herein. Therefore, the breadth and scope of the present invention should not be limited by the embodiments described above.

Claims

1. A heat dissipation device, characterized in that, Comprising: A housing; A first plate body, fixed within the housing; An arc-shaped support structure, fixed to the first plate body, wherein the arc-shaped support structure has an arc-shaped slot that extends radially along the center of the arc-shaped support structure and is located on the inner surface of the arc-shaped support structure; A second plate body, connecting to the arc-shaped slot and jointly forming an accommodation space with the arc-shaped support structure and the first plate body; And A fan, fixed to the second plate body and accommodated within the accommodation space; The arc-shaped support structure has a plurality of protrusions, and a plurality of air flow channels are defined between these protrusions, and the fan is configured to drive air flow through these air flow channels.

2. The heat dissipation device according to claim 1, wherein, Wherein the second plate body has a plurality of ventilation holes that surround the connection of the fan to the second plate body, and the fan is configured to drive air flow through the ventilation holes.

3. The heat dissipation device according to claim 1, wherein Wherein the second plate body has a plurality of ventilation holes that surround the connection of the fan to the second plate body, the arc-shaped support structure has a plurality of protrusions, and a plurality of air flow channels are defined between these protrusions, and the fan is configured to drive air flow through these ventilation holes and then through these air flow channels.

4. The heat dissipation device according to claim 2 or 3, characterized in that, Wherein the second plate body has a plurality of extension arms and a central portion, these extension arms surround the central portion and define these ventilation holes, and the fan is disposed at the central portion.

5. The heat dissipation device according to claim 1, wherein Wherein the heat dissipation device has a fixing member, the arc-shaped support structure has a fixing through hole, and the second plate body has an edge groove, and the fixing member aligns with and passes through the fixing through hole and the edge groove to facilitate the fixing of the second plate body to the arc-shaped support structure.

6. The heat dissipation device according to claim 1, characterized in that, Wherein the arc-shaped support structure further has a neck and a head, the head is farther from the first plate body than the neck, and the width of the head is greater than the width of the neck, and the arc-shaped slot is disposed on the head.

7. The heat dissipation device according to claim 1 or 6, characterized in that, Wherein the arc-shaped support structure has a bottom, the bottom connects to the first plate body and the width of the bottom gradually increases towards the first plate body.

8. The heat dissipation device according to claim 1, characterized in that, Wherein the second plate body has a side bottom edge, and the arc-shaped support structure is generally U-shaped and has a stepped end. When the second plate body is inserted into the arc-shaped support structure, the side bottom edge is inclined and adjacent to the stepped end to form a notch.

9. The heat dissipation device according to claim 1, wherein Wherein the arc-shaped support structure is integrally formed on the first plate body.

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