A method for processing panels to be partially non-conductive

Abstract

This invention discloses a processing method for partially non-conductive panels, comprising the following steps: S1, Insulating adhesive preparation: Prepare insulating coating adhesive according to the following mass fractions: 50-60 parts bisphenol A epoxy resin, 15-18 parts polyester resin curing agent, 1-3 parts alcohol accelerator, 20-30 parts organic solvent, 5-8 parts glass fiber material, and 5-10 parts inorganic filler; S2, Mixing the adhesive: Weigh each component according to its corresponding content, and first add bisphenol A epoxy resin, organic solvent, glass fiber material, and inorganic filler to a centrifugal mixer for initial centrifugal mixing; This processing method utilizes the perforated parts of a coating plate to apply insulating adhesive to the non-conductive parts of the panel, which is simple and convenient to operate, improves the production efficiency of the panel, and provides multi-layer coverage coating. The insulating adhesive is applied evenly with high flatness, and the coating does not cover the conductive parts, resulting in obvious local insulation effect.

Description

Technical Field

[0001] This invention relates to the field of panel processing and manufacturing technology, specifically a processing method for making a panel partially non-conductive. Background Technology

[0002] Liquid crystal display (LCD) panels occupy a mainstream position in the current flat panel display field due to their advantages such as high color saturation, small size, and low power consumption. As one of the commonly used electronic components, the panel is the front end of industrial control equipment and home appliances, playing a regulatory role. Existing panel manufacturing processes, such as the LCD panel and LCD panel production control method with application number 202011463197.4, the display panel, array substrate and its production method with application number CN202210332456.2, and the air conditioner control panel production method with application number CN202210530187.0, can all produce insulated control panels, but they cannot make the panel locally non-conductive according to the panel's usage requirements.

[0003] Existing manufacturing processes cannot produce LCD panels that are partially non-conductive, resulting in inaccurate quality control, difficulty in management, and relatively low production efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a processing method for partially non-conductive liquid crystal display panels, in order to solve the problems mentioned in the background art that the existing production processes cannot produce partially non-conductive liquid crystal display panels, and that the quality control of the produced liquid crystal display panels is inaccurate, inconvenient to manage, and has relatively low production efficiency.

[0005] Therefore, the present invention provides a method for processing a panel to be partially non-conductive, comprising the following steps:

[0006] S1. Preparation of insulating adhesive: Prepare the insulating coating adhesive according to the following mass fractions: 50-60 parts of bisphenol A epoxy resin, 15-18 parts of polyester resin curing agent, 1-3 parts of alcohol accelerator, 20-30 parts of organic solvent, 5-8 parts of glass fiber material and 5-10 parts of inorganic filler.

[0007] S2. Mixing: After weighing each component according to its corresponding content, first add the bisphenol A epoxy resin, organic solvent, glass fiber material and inorganic filler to the centrifugal mixer for initial centrifugal mixing. After mixing for 20-30 minutes, add the ingredients in two batches in the order of polyester resin curing agent - alcohol accelerator for fine mixing. The interval between the two additions should be controlled between 10-15 minutes. After mixing, pour into a sealed container for later use.

[0008] S3. Panel material preparation: Prepare multiple laminates, flexible circuit boards, LCD displays, adhesive boards, multiple partially perforated coated boards, and scratch-resistant tempered glass films.

[0009] S4. Lamination: Use a laminating laminator to press the bonding plates together on the outer perimeter of both sides of the flexible circuit board. Then, attach and fix the perforated adhesive plate on the bonding plates on both sides, so that the perforated adhesive plate is aligned with the non-conductive part of the panel to be produced.

[0010] S5. Applying adhesive for insulation: Load the insulating adhesive prepared in step S2 into the adhesive applicator. Apply an appropriate amount of adhesive to the perforated adhesive applicator on both sides of the applicator, smooth it out, and then bake it dry using a baking machine. Repeat this step.

[0011] S6. Demolding and Assembly: After the adhesive has dried, slowly remove the hollowed-out adhesive plate one by one, then clean and flatten the removed parts, and assemble the laminate and LCD display one by one as needed, and encapsulate the panel.

[0012] S7. Cutting and trimming: Place the packaged panel into the cutting machine to trim and flatten the edges of the panel. After trimming, apply sealant to the gaps on the surface of the panel. Then put it into the dryer and dry for 10-15 minutes. Take out the panel and use a sanding device to evenly sand and polish the surface of the panel. Finally, stick the anti-scratch tempered glass film on the surface of the panel.

[0013] S8. Testing: Use testing equipment to test the actual conductivity of the panel, and adjust the ratio and thickness of the insulating adhesive based on the conductivity value until it meets the usage requirements.

[0014] S9. Packaging and Storage: Using packaging equipment, the panels after production are packaged and transferred to a warehouse for unified storage.

[0015] Preferably, in step S1, the alcohol accelerator is any one of methylaminoethanol or ethoxyethanol, the organic solvent is any one of methyl isobutyl ketone, toluene, propylene glycol methyl ether acetate or dimethylformamide, the inorganic filler is ceramic filler particles, wherein the particle size of the ceramic filler particles is controlled at 800 mesh-1200 mesh, and the glass fiber material is alkali-free glass fiber acid-resistant coarse sand.

[0016] Preferably, in step S2, the mixing temperature during the initial mixing is controlled at 30-50 degrees Celsius, the temperature for fine mixing is controlled at 40-60 degrees Celsius, the interval between the two additions of ingredients is controlled at 10-15 minutes, and after the ingredients are added, mixing continues for 30-40 minutes.

[0017] Preferably, in step S3, during the production of the partially perforated adhesive board, a polymer material board without seepage or damage is selected, and it is cut into a board with a size equivalent to the panel to be produced. Then, according to the non-conductive parts of the panel to be produced, adhesive perforations are made on the adhesive board to match the non-conductive parts.

[0018] Preferably, in step S5, the temperature of a single baking and drying process is controlled at 50-70 degrees Celsius, the baking time is controlled at 8-10 minutes, the thickness of the locally coated insulating adhesive layer is controlled at 10-15 μm, and the coating thickness should be flush with the highest point of the panel.

[0019] Preferably, in step S3, the non-stick layer is any one or two or more polymers selected from polytetrafluoroethylene, perfluoroethylene propylene, perfluoroalkoxy resin, polychlorotrifluoroethylene, ethylene-chlorotrifluoroethylene copolymer, ethylene-tetrafluoroethylene copolymer, polyvinylidene fluoride, and polyvinyl fluoride.

[0020] Preferably, in step S7, the sealant is any one of polyurethane adhesive, polyester adhesive, polyesterimide adhesive, or polyimide adhesive.

[0021] The present invention proposes a method for processing panels to be partially non-conductive, the advantages of which are as follows:

[0022] This processing method utilizes the perforated parts of the adhesive plate to apply insulating adhesive to the non-conductive parts of the panel. It is simple and convenient to operate, improves the production efficiency of the panel, and the multi-layer coating ensures even application of the insulating adhesive, high flatness, and does not cover the conductive parts after coating, resulting in obvious local insulation effect.

[0023] By using a specially formulated insulating coating, partial insulation of the panel can be achieved. It has strong thermal stability and excellent insulation performance. It will not have a negative impact on the panel during use and extends the service life of the panel. Detailed Implementation

[0024] The technical solution of the present invention will now be described in detail through specific embodiments.

[0025] Example 1:

[0026] This invention provides a method for processing a panel to be partially non-conductive, comprising the following steps:

[0027] S1. Preparation of insulating adhesive: Prepare the insulating coating adhesive according to the following mass fractions: 50-60 parts of bisphenol A epoxy resin, 15-18 parts of polyester resin curing agent, 1-3 parts of alcohol accelerator, 20-30 parts of organic solvent, 5-8 parts of glass fiber material, and 5-10 parts of inorganic filler; the alcohol accelerator is any one of methyl aminoethanol or ethoxyethanol, the organic solvent is any one of methyl isobutyl ketone, toluene, propylene glycol methyl ether acetate, or dimethylformamide, the inorganic filler is ceramic filler particles, wherein the particle size of the ceramic filler particles is controlled at 800-1200 mesh, and the glass fiber material is alkali-free glass fiber acid-resistant coarse sand;

[0028] S2. Mixing: After weighing each component according to its corresponding content, first add the bisphenol A epoxy resin, organic solvent, glass fiber material, and inorganic filler to a centrifugal mixer for initial centrifugal mixing for 20-30 minutes. Then, add the ingredients in two batches in the order of polyester resin curing agent - alcohol accelerator for fine mixing. The interval between the two additions should be controlled between 10-15 minutes. After mixing, pour into a sealed container for later use. The mixing temperature during the initial mixing should be controlled at 30-50 degrees Celsius, and the temperature during fine mixing should be controlled at 40-60 degrees Celsius. The interval between the two additions should be controlled between 10-15 minutes. After the ingredients are added, continue mixing for 30-40 minutes.

[0029] S3. Panel Material Preparation: Prepare multiple laminates, flexible circuit boards, LCD displays, adhesive boards, multiple partially perforated coated boards, and scratch-resistant tempered glass films. During production, select polymer material boards that are free from seepage and damage, cut them into boards with dimensions equivalent to the panel to be produced, and then create perforations on the coated boards to match the non-conductive parts of the panel to be produced. The non-adhesive layer uses any one or more polymers selected from polytetrafluoroethylene, perfluoroethylene propylene, perfluoroalkoxy resin, polychlorotrifluoroethylene, ethylene-chlorotrifluoroethylene copolymer, ethylene-tetrafluoroethylene copolymer, polyvinylidene fluoride, and polyvinylidene fluoride.

[0030] S4. Lamination: Use a laminating laminator to press the bonding plates together on the outer perimeter of both sides of the flexible circuit board. Then, attach and fix the perforated adhesive plate on the bonding plates on both sides, so that the perforated adhesive plate is aligned with the non-conductive part of the panel to be produced.

[0031] S5. Applying Insulation Adhesive: Load the insulating adhesive prepared in step S2 into the adhesive applicator. Apply an appropriate amount of adhesive to the perforated adhesive plates on both sides of the applicator, smooth it out, and then bake it dry using a baking machine. Repeat this step. The temperature for each baking and drying cycle should be controlled at 50-70 degrees Celsius, and the baking time should be controlled at 8-10 minutes. The thickness of the local insulating adhesive layer should be controlled at 10-15 μm, and the coating thickness should be flush with the highest point of the panel.

[0032] S6. Demolding and Assembly: After the adhesive has dried, slowly remove the hollowed-out adhesive plate one by one, then clean and flatten the removed parts, and assemble the laminate and LCD display one by one as needed, and encapsulate the panel.

[0033] S7. Cutting and Trimming: Place the packaged panel into a cutting machine to trim and flatten the edges. After trimming, apply sealant to the gaps on the panel surface. Then place it in a dryer and dry for 10-15 minutes. Remove the panel and use a sanding device to evenly sand and polish the panel surface. Finally, attach and fix the anti-scratch tempered glass film to the panel surface. The sealant can be any one of polyurethane coating material, polyester coating material, polyesterimide coating material, or polyimide coating material.

[0034] S8. Testing: Use testing equipment to test the actual conductivity of the panel, and adjust the ratio and thickness of the insulating adhesive based on the conductivity value until it meets the usage requirements.

[0035] S9. Packaging and Storage: Using packaging equipment, the panels after production are packaged and transferred to a warehouse for unified storage.

[0036] In this embodiment: the hollowed-out parts of the adhesive plate are used to apply targeted insulating adhesive to the non-conductive parts of the panel. The operation is simple and convenient, which improves the production efficiency of the panel. The multi-layer covering adhesive application ensures uniform application of the insulating adhesive, high flatness, and does not cover the conductive parts after application. The local insulation effect is obvious. The special ratio of insulating coating is used to achieve local coverage insulation of the panel, which has strong thermal stability and excellent insulation performance.

[0037] Example 2:

[0038] This invention provides a method for processing a panel to be partially non-conductive, comprising the following steps:

[0039] S1. Preparation of insulating adhesive: Prepare the insulating coating adhesive according to the following mass fractions: 50-60 parts of bisphenol A epoxy resin, 15-18 parts of polyester resin curing agent, 1-3 parts of alcohol accelerator, 20-30 parts of organic solvent, 5-8 parts of glass fiber material, and 5-10 parts of inorganic filler; the alcohol accelerator is any one of methyl aminoethanol or ethoxyethanol, the organic solvent is any one of methyl isobutyl ketone, toluene, propylene glycol methyl ether acetate, or dimethylformamide, the inorganic filler is ceramic filler particles, wherein the particle size of the ceramic filler particles is controlled at 800-1200 mesh, and the glass fiber material is alkali-free glass fiber acid-resistant coarse sand;

[0040] S2. Mixing: After weighing each component according to its corresponding content, first add bisphenol A epoxy resin, organic solvent, glass fiber material, and inorganic filler to a centrifugal mixer for initial centrifugal mixing for 20-30 minutes. Then, add the ingredients in two batches in the order of polyester resin curing agent - alcohol accelerator for fine mixing. The interval between the two additions should be controlled between 10-15 minutes. After mixing, pour into a sealed container for later use. The mixing temperature during the initial mixing should be controlled at 30-50 degrees Celsius, and the temperature during fine mixing should be controlled at 40-60 degrees Celsius. The interval between the two additions should be controlled between 10-15 minutes. After the ingredients are added, continue mixing for 30-40 minutes. Establish a corresponding simulation model based on the shape of the production panel and the size and non-conductive areas. Test the conductivity of the conductive areas and the insulation performance of the local non-conductive areas of the panel through simulation. Adjust the ratio and coating thickness of the insulating adhesive until it meets the usage requirements.

[0041] S3. Panel Material Preparation: Prepare multiple laminates, flexible circuit boards, LCD displays, adhesive boards, multiple partially perforated coated boards, and scratch-resistant tempered glass films. During production, select polymer material boards that are free from seepage and damage, cut them into boards with dimensions equivalent to the panel to be produced, and then create perforations on the coated boards to match the non-conductive parts of the panel to be produced. The non-adhesive layer uses any one or more polymers selected from polytetrafluoroethylene, perfluoroethylene propylene, perfluoroalkoxy resin, polychlorotrifluoroethylene, ethylene-chlorotrifluoroethylene copolymer, ethylene-tetrafluoroethylene copolymer, polyvinylidene fluoride, and polyvinylidene fluoride.

[0042] S4. Lamination: Use a laminating laminator to press the bonding plates together on the outer perimeter of both sides of the flexible circuit board. Then, attach and fix the perforated adhesive plate on the bonding plates on both sides, so that the perforated adhesive plate is aligned with the non-conductive part of the panel to be produced.

[0043] S5. Applying Insulation Adhesive: Load the insulating adhesive prepared in step S2 into the adhesive applicator. Apply an appropriate amount of adhesive to the perforated adhesive plates on both sides of the applicator, smooth it out, and then bake it dry using a baking machine. Repeat this step. The temperature for each baking and drying cycle should be controlled at 50-70 degrees Celsius, and the baking time should be controlled at 8-10 minutes. The thickness of the local insulating adhesive layer should be controlled at 10-15 μm, and the coating thickness should be flush with the highest point of the panel.

[0044] S6. Demolding and Assembly: After the adhesive has dried, slowly remove the hollowed-out adhesive plate one by one, then clean and flatten the removed parts, and assemble the laminate and LCD display one by one as needed, and encapsulate the panel.

[0045] S7. Cutting and Trimming: Place the packaged panel into a cutting machine to trim and flatten the edges. After trimming, apply sealant to the gaps on the panel surface. Then place it in a dryer and dry for 10-15 minutes. Remove the panel and use a sanding device to evenly sand and polish the panel surface. Finally, attach and fix the anti-scratch tempered glass film to the panel surface. The sealant can be any one of polyurethane coating material, polyester coating material, polyesterimide coating material, or polyimide coating material.

[0046] S8. Testing: Use testing equipment to test the actual conductivity of the panel, and adjust the ratio and thickness of the insulating adhesive based on the conductivity value until it meets the usage requirements.

[0047] S9. Packaging and Storage: Using packaging equipment, the panels after production are packaged and transferred to a warehouse for unified storage.

[0048] In this embodiment: Compared with Embodiment 1, after configuring the adhesive, a corresponding simulation model is established based on the shape and size of the non-conductive areas of the production panel. The conductivity of the conductive areas of the panel and the insulation performance of the locally non-conductive areas are tested through simulation. The ratio and coating thickness of the insulating adhesive are adjusted until they meet the usage requirements. This ensures the quality of the insulating adhesive before the processing of locally non-conductive areas of the panel, thereby improving the quality of the produced panel. The produced panel has strong thermal stability, is safe and reliable, and has a long service life.

[0049] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A processing method for making a panel partially non-conductive, characterized in that: Includes the following steps: S1. Preparation of insulating adhesive: Prepare the insulating coating adhesive according to the following mass fractions: 50-60 parts of bisphenol A epoxy resin, 15-18 parts of polyester resin curing agent, 1-3 parts of alcohol accelerator, 20-30 parts of organic solvent, 5-8 parts of glass fiber material and 5-10 parts of inorganic filler. S2. Mixing: After weighing each component according to its corresponding content, first add the bisphenol A epoxy resin, organic solvent, glass fiber material and inorganic filler to the centrifugal mixer for initial centrifugal mixing. After mixing for 20-30 minutes, add the ingredients in two batches in the order of polyester resin curing agent - alcohol accelerator for fine mixing. The interval between the two additions should be controlled between 10-15 minutes. After mixing, pour into a sealed container for later use. S3. Panel material preparation: Prepare multiple laminates, flexible circuit boards, LCD displays, adhesive boards, multiple partially perforated coated boards, and scratch-resistant tempered glass films. S4. Lamination: Use a laminating laminator to press the bonding plates together on the outer perimeter of both sides of the flexible circuit board. Then, attach and fix the perforated adhesive plate on the bonding plates on both sides, so that the perforated adhesive plate is aligned with the non-conductive part of the panel to be produced. S5. Applying adhesive for insulation: Load the insulating adhesive prepared in step S2 into the adhesive applicator. Apply an appropriate amount of adhesive to the perforated adhesive applicator on both sides of the applicator, smooth it out, and then bake it dry using a baking machine. Repeat this step. S6. Demolding and Assembly: After the adhesive has dried, slowly remove the hollowed-out adhesive plate one by one, then clean and flatten the removed parts, and assemble the laminate and LCD display one by one as needed, and encapsulate the panel. S7. Cutting and trimming: Place the packaged panel into the cutting machine to trim and flatten the edges of the panel. After trimming, apply sealant to the gaps on the surface of the panel. Then put it into the dryer and dry for 10-15 minutes. Take out the panel and use a sanding device to evenly sand and polish the surface of the panel. Finally, stick the anti-scratch tempered glass film on the surface of the panel. S8. Testing: Use testing equipment to test the actual conductivity of the panel, and adjust the ratio and coating thickness of the insulating adhesive based on the conductivity value until it meets the production and use requirements. S9. Packaging and Storage: Using packaging equipment, the panels after production are packaged and transferred to a warehouse for unified storage.

2. The processing method for partially non-conductive panels according to claim 1, characterized in that: In step S1, the alcohol accelerator is any one of methylaminoethanol or ethoxyethanol, the organic solvent is any one of methyl isobutyl ketone, toluene, propylene glycol methyl ether acetate or dimethylformamide, the inorganic filler is ceramic filler particles, wherein the particle size of the ceramic filler particles is controlled at 800 mesh-1200 mesh, and the glass fiber material is alkali-free glass fiber acid-resistant coarse sand.

3. The processing method for partially non-conductive panels according to claim 1, characterized in that: In step S2, the initial mixing temperature is controlled at 30-50 degrees Celsius, the fine mixing temperature is controlled at 40-60 degrees Celsius, the interval between the two additions of ingredients is controlled at 10-15 minutes, and after the ingredients are added, mixing continues for 30-40 minutes.

4. The processing method for partially non-conductive panels according to claim 1, characterized in that: In step S3, during the production of the partially perforated adhesive-coated board, a polymer material board without seepage or damage is selected and cut into a board with a size equivalent to the panel to be produced. Then, according to the non-conductive parts of the panel to be produced, adhesive perforations are made on the adhesive-coated board to match the non-conductive parts.

5. The processing method for partially non-conductive panels according to claim 1, characterized in that: In step S5, the temperature for a single baking and drying process is controlled at 50-70 degrees Celsius, the baking time is controlled at 8-10 minutes, the thickness of the locally coated insulating adhesive layer is controlled at 10-15 μm, and the coating thickness should be flush with the highest point of the panel.

6. The processing method for partially non-conductive panels according to claim 1, characterized in that: In step S3, the non-stick layer is any one or two or more polymers selected from polytetrafluoroethylene, perfluoroethylene propylene, perfluoroalkoxy resin, polychlorotrifluoroethylene, ethylene-chlorotrifluoroethylene copolymer, ethylene-tetrafluoroethylene copolymer, polyvinylidene fluoride, and polyvinylidene fluoride.

7. A method for processing a panel to be partially non-conductive according to claim 1, characterized in that: In step S7, the sealant is any one of polyurethane adhesive, polyester adhesive, polyesterimide adhesive, or polyimide adhesive.

8. A method for processing a panel to be partially non-conductive according to claim 1, characterized in that: In step S2, a corresponding simulation model is established based on the shape of the production panel and the size and area of ​​the non-conductive region. The conductivity of the conductive area and the insulation performance of the local non-conductive region of the panel are tested through simulation. The ratio and thickness of the insulating adhesive are adjusted until they meet the usage requirements.