Light-emitting component, PPG sensor module and electronic device

Abstract

An embodiment of the present application provides a light-emitting component, a light-emitting module, a PPG sensor module, and an electronic device. The light-emitting component includes: a base, a packaging cover, and a light-emitting chip; the base and the packaging cover form a receiving cavity, the light-emitting chip is disposed in the receiving cavity, and the light emitted by the light-emitting chip exits from the packaging cover; the light-emitting chip includes a metal layer, a first electrode layer, an active layer, a second electrode layer, a Bragg reflection layer, and a light-adjusting layer connected in sequence, the light-adjusting layer is disposed on a side of the Bragg reflection layer away from the second electrode layer and is used to adjust the emission angle of the light; the light-adjusting layer includes a plurality of light-adjusting units, and the plurality of light-adjusting units are spaced apart and distributed on the Bragg reflection layer. In this way, the light emitted by the light-emitting chip can be adjusted by the light-adjusting units, so that more light can be emitted in the direction of the photosensing module, improving the effective utilization rate of the light, reducing the power consumption, and avoiding the waste of light energy.

Description

Technical Field

[0001] This application belongs to the field of communication technologies, and particularly relates to a light-emitting component, a PPG sensor module, and an electronic device. Background Art

[0002] With the development of communication technologies, the functions of electronic devices are becoming increasingly rich, and the application scope of electronic devices is also becoming increasingly wide, bringing many conveniences to people's daily lives.

[0003] A PPG (Photoplethysmography) sensor module can be provided in an electronic device. By monitoring waveform signals obtained from changes in blood volume in biological tissues, etc., physiological parameters such as heart rate, blood oxygen saturation, and blood viscosity can be calculated. The PPG sensor module can include a light-emitting component and a photosensitive module arranged at intervals. The light-emitting component is used to emit light, and the photosensitive module is used to receive the light reflected by biological tissues.

[0004] However, during the research on the prior art, the inventors found that since the light-emitting component emits light omnidirectionally, only part of the light can be reflected to the photosensitive module and received. To meet the detection requirements, the power consumption of the light-emitting component needs to be increased, and the effective utilization rate of the light is relatively low, resulting in a waste of light energy. Summary of the Invention

[0005] In view of the above problems, the present invention is proposed to provide a light-emitting component, a PPG sensor module, and an electronic device that overcome the above problems or at least partially solve the above problems.

[0006] To solve the above technical problems, the present application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application provides a light-emitting component, which is characterized in that the light-emitting component includes: a base, a packaging cover, and a light-emitting chip;

[0008] The base and the packaging cover form the accommodation cavity, the light-emitting chip is disposed in the accommodation cavity, and the light emitted by the light-emitting chip exits from the packaging cover;

[0009] The light-emitting chip includes a metal layer, a first electrode layer, an active layer, a second electrode layer, a Bragg reflection layer, and a light modulation layer connected in sequence. The light modulation layer is disposed on a side of the Bragg reflection layer away from the second electrode layer and is used to adjust the exit angle of the light;

[0010] The light modulation layer includes a plurality of light modulation units, and the plurality of light modulation units are spaced apart and distributed on the Bragg reflection layer.

[0011] In a second aspect, an embodiment of the present application provides a light-emitting module, which includes a bracket, a cover plate, and at least one of the light-emitting components;

[0012] The bracket is provided with a recess, the light-emitting component is disposed in the recess, and the cover plate is connected to the bracket to enclose the recess.

[0013] In a third aspect, an embodiment of the present application provides a PPG sensor module, which includes at least one photosensitive module and the light-emitting module;

[0014] The photosensitive module covers the bracket of the light-emitting module and is at least partially opposite to the light-emitting side of the light-emitting module, and the photosensitive module is used to receive light;

[0015] Wherein, the light-emitting module includes a light-emitting component, the light-emitting component is provided with a light-emitting chip, a light-adjusting layer is disposed on the light-emitting side of the light-emitting chip, and the light-adjusting layer is used to adjust the emission angle of the light.

[0016] In a fourth aspect, an embodiment of the present application provides an electronic device, which includes the PPG sensor module described above.

[0017] In the embodiment of the present application, the light-emitting component includes: a base, a packaging cover, and a light-emitting chip; the base and the packaging cover form a receiving cavity, the light-emitting chip is disposed in the receiving cavity, and the light emitted by the light-emitting chip exits from the packaging cover; the light-emitting chip includes a metal layer, a first electrode layer, an active layer, a second electrode layer, a Bragg reflection layer, and a light-adjusting layer connected in sequence, the light-adjusting layer is disposed on a side of the Bragg reflection layer away from the second electrode layer and is used to adjust the emission angle of the light; the light-adjusting layer includes a plurality of light-adjusting units, and the plurality of light-adjusting units are spaced apart and distributed on the Bragg reflection layer. In this way, the light emitted by the light-emitting chip can be adjusted by the light-adjusting units, so that more light can be emitted in the direction of the photosensitive module, improving the effective utilization rate of the light, reducing the power consumption, and avoiding the waste of light energy. Moreover, the structure is simple and easy to implement, without using a complex optical structure, which is beneficial to the compact design of the product.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, wherein:

[0020] Figure 1It is one of the schematic structural diagrams of a light-emitting component described in the embodiments of the present application;

[0021] Figure 2 It is the second of the schematic structural diagrams of a light-emitting component described in the embodiments of the present application;

[0022] Figure 3 It is the schematic structural diagram of a light-emitting chip of a light-emitting component described in the embodiments of the present application;

[0023] Figure 4 It is one of the schematic structural diagrams of a light-emitting module described in the embodiments of the present application;

[0024] Figure 5 It is the second of the schematic structural diagrams of a light-emitting module described in the embodiments of the present application;

[0025] Figure 6 It is the third of the schematic structural diagrams of a light-emitting module described in the embodiments of the present application;

[0026] Figure 7 It is one of the schematic structural diagrams of a PPG sensor module described in the embodiments of the present application;

[0027] Figure 8 It is the second of the schematic structural diagrams of a PPG sensor module described in the embodiments of the present application.

[0028] Reference numerals: 10 - base; 20 - light-emitting chip; 11 - encapsulation cover; 21 - light ray; 22 - light-dimming layer; 23 - metal layer; 24 - first electrode layer; 25 - active layer; 26 - second electrode layer; 27 - Bragg reflection layer; 28 - light-dimming unit; 30 - lens; 33 - groove; 31 - symmetric lens; 32 - polarizing lens; 40 - cover plate; 41 - bracket; 42 - recessed part; 50 - photosensitive module; A - first direction. Detailed Description of the Invention

[0029] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0030] The terms "first", "second" in the description and claims of this application may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the associated objects before and after.

[0031] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0032] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] Refer to Figures 1 to 3 , which shows a schematic structural diagram of a light-emitting component according to an embodiment of this application, where the arrow indicates the emission direction of light. The light-emitting component may specifically include: a base 10, a packaging cover 11, and a light-emitting chip 20;

[0034] The base 10 and the packaging cover 11 form a receiving cavity, the light-emitting chip 20 is disposed in the receiving cavity, and the light 21 emitted by the light-emitting chip 20 exits from the packaging cover 11;

[0035] The light-emitting chip 20 includes a metal layer 23, a first electrode layer 24, an active layer 25, a second electrode layer 26, a Bragg reflector layer 27, and a light-adjusting layer 22 that are connected in sequence. The light-adjusting layer 22 is disposed on a side of the Bragg reflector layer 27 away from the second electrode layer 26 for adjusting the emission angle of the light 21;

[0036] The light-adjusting layer 22 includes a plurality of light-adjusting units 28, and the plurality of light-adjusting units 28 are spaced apart and distributed on the Bragg reflector layer 27.

[0037] In the embodiment of the present application, by providing a dimming layer 22 on the light-emitting chip 20, the light 21 emitted by the light-emitting chip 20 can be emitted at a preset angle through the dimming unit 28 on the dimming layer 22. In this way, more light 21 can be emitted in the direction of the photosensitive module 50, improving the effective utilization rate of the light, reducing the power consumption, and avoiding the waste of light energy. Moreover, the structure is simple and easy to implement, without the need to adopt a complex optical structure, which is conducive to the compact design of the product.

[0038] Specifically, in the embodiment of the present application, the light-emitting chip 20 may include an LED (Light Emitting Diode) chip, an OLED (Organic Light Emitting Diode) chip, etc., and the specific type of the light-emitting chip 20 in the embodiment of the present application may not be limited.

[0039] Exemplarily, the light-emitting chip 20 can emit at least three bands of light 21 for simultaneously detecting physiological parameters such as heart rate, blood oxygen saturation, and blood viscosity. The specific number of the light-emitting chips 20 in the embodiment of the present application may not be limited and can be set according to the needs in actual applications.

[0040] Specifically, in the embodiment of the present application, the light-emitting chip 20 includes a metal layer 23, a first electrode layer 24, an active layer 25, a second electrode layer 26, and a Bragg reflection layer 27 connected in sequence. The dimming layer 22 is connected to the side of the Bragg reflection layer 27 away from the second electrode layer 26. The dimming layer 22 adjusts the light 21 emitted from the Bragg reflection layer 27 to deflect the light 21 towards the position where the photosensitive module 50 is located, improving the efficiency of the light 21 received by the photosensitive module 50.

[0041] Exemplarily, the material of the metal layer 23 may include aluminum (Al), gold (Au), etc., and its reflectivity to the light 21 may include 97% - 0%, having a relatively high reflectivity. The first electrode layer 24 may be a P-type layer and be made of materials such as gallium nitride (GaN) or gallium arsenide (GaAs). The active layer 25 may be a MQW (Multiple Quantum Well). The second electrode layer 26 may be an N-type layer and may be made of materials such as gallium nitride (GaN) or gallium arsenide (GaAs). Specifically, the Bragg reflector layer 27 may be a distributed Bragg reflector layer, simply referred to as a DBR (Distributed Bragg Reflector) layer, and be made of materials such as silicon dioxide (SiO2) or titanium dioxide (TiO2), and its reflectivity is 40% - 60%. Specifically, a resonant cavity is formed between the metal layer 23 and the Bragg reflector layer 27. The spontaneous emission photons of the light 21 are reflected back and forth multiple times before radiation emission, pass through the active layer 25 and are amplified, and then are emitted from the Bragg reflector layer 27.

[0042] Optionally, in the embodiment of the present application, the dimming layer 22 includes a plurality of dimming units 28, and the plurality of dimming units 28 are spaced apart and distributed on the Bragg reflector layer 27 to form a metasurface light-emitting chip. In this way, by setting different spacings between the plurality of dimming units 28 and different width dimensions between the dimming units 28, the light 21 can be deflected and emitted at a preset angle when passing through the dimming layer 22.

[0043] Exemplarily, in the embodiment of the present application, the dimming unit 28 may be a bump protruding from the Bragg reflector layer 27. The spacing between the dimming units 28 and the width dimension of the dimming unit 28 can be set according to actual needs, and the specific dimensions and distribution modes of the dimming units 28 in the embodiment of the present application may not be limited.

[0044] Specifically, in the embodiment of the present application, the shape of the dimming unit 28 may be rectangular, made of silicon (Si), and the thickness of the dimming unit 28 is set to be much smaller than the wavelength of the light 21, so that the plurality of dimming units 28 can introduce a phase mutation of the light 21 within the sub-wavelength dimension range, and the phase of the light 21 is adjusted by adjusting the specific structures of the plurality of dimming units 28, thereby enabling the angle of emission of the light 21 to be adjusted to achieve deflection.

[0045] Optionally, in the embodiment of the present application, the widths of the plurality of dimming units 28 in the first direction A increase sequentially along the first direction A. Wherein, the first direction A is parallel to the Bragg reflector layer 27. In this way, the dimming unit 28 can have a better effect on deflecting the light 21, so that more light 21 can be deflected towards the direction of the photosensitive module.

[0046] In some alternative embodiments of the present application, the light-emitting component further includes a lens 30. The lens 30 is disposed within the encapsulation cover 11 and covers at least one light-emitting chip 20. The lens 30 includes a bottom surface and an arc surface connected to the bottom surface. The metal layer 23 is connected to the bottom surface, and the bottom surface is connected to the base 10. Light rays 21 enter the lens 30 from the bottom surface and exit through the arc surface. The lens 30 can protect the light-emitting chip 20 from being worn, reduce the interface reflection loss between the light-emitting chip 20 and the air, and improve the light extraction efficiency. Moreover, the lens 30 can further shape the light rays 21 emitted by the light-emitting chip 20, improving the light energy utilization rate of the light-emitting component.

[0047] Optionally, in the embodiments of the application, the bottom surface of the lens 30 is provided with a groove 33. The light-emitting chip 20 is embedded in the groove 33, and the dimming layer 22 is attached to the bottom of the groove 33. In this way, the light-emitting chip 20 can be better embedded in the lens 30, enhancing the connection stability between the two and preventing the light-emitting chip 20 from shifting relative to the lens 30 and affecting the polarization effect.

[0048] Exemplarily, in the embodiments of the present application, the material of the lens 30 may include silicone, resin, etc. The embodiments of the present application may not limit the specific material of the lens 30. The shape of the lens 30 may include a hemispherical shape, an ellipsoidal shape, a pyramidal shape, etc. The embodiments of the present application may not limit the specific shape of the lens 30 either.

[0049] Exemplarily, in the embodiments of the present application, the lens 30 may cover 1 light-emitting chip 20, or may cover 4 light-emitting chips 20, or may also cover 2 or 3 light-emitting chips 20, etc. The embodiments of the present application may not limit the specific number of light-emitting chips 20 within the lens 30.

[0050] Optionally, in the embodiments of the present application, the lens 30 is a symmetric lens 31. The arc surface of the symmetric lens 31 is symmetrically distributed with respect to the center axis of the light-emitting chip 20. Specifically, the symmetric lens 31 can be obtained by molding rotational symmetry, which is simple to operate and easy to manufacture. The symmetric lens 31 can protect the light-emitting chip 20 from being worn, reduce the interface reflection loss between the light-emitting chip 20 and the air, and improve the light extraction efficiency. Moreover, the symmetric lens 31 can further shape the light rays 21 emitted by the light-emitting chip 20, improving the light energy utilization rate of the light-emitting component. Through simulation tests, after the light-emitting component is adjusted by the dimming layer 22 of the light-emitting chip 20 and further shaped by the symmetric lens 31, the light efficiency can be increased by about % - 15%, showing a good effect. In addition, the size of the symmetric lens 31 can be designed to be smaller, facilitating the miniaturization and lightweight design of the product.

[0051] In some alternative embodiments of the present application, the lens 30 is a polarizing lens 32. The arc surface of the polarizing lens 32 is asymmetrically distributed with respect to the central axis of the light-emitting chip 20 to adjust the emission angle of the light 21. Specifically, the polarizing lens 32 has a free-form surface structure, and its highest point does not coincide with the central axis of the polarizing lens 32 and can be biased to the right, left, or other directions. That is, the projection of the highest point of the polarizing lens 32 on the bottom surface is misaligned with the projection of the light-emitting chip 20 on the bottom surface. In this way, the light 21 emitted by the light-emitting chip 20 can be deflected after passing through the polarizing lens 32, so that it can be emitted in a direction closer to the photosensitive module 50 according to a preset angle, improving the effective utilization rate of the light 21.

[0052] Specifically, when the lens 30 is a polarizing lens 32, a light-adjusting layer 22 may not be provided on the light-emitting side of the light-emitting chip 20, and only the polarizing lens 32 can achieve a good adjustment effect on the emission angle of the light 21. It can be understood that when the lens 30 is a polarizing lens 32, a light-adjusting layer 22 may also be provided on the light-emitting side of the light-emitting chip 20, and a good adjustment of the emission angle of the light 21 can be achieved through the combined action of the light-adjusting layer 22 and the polarizing lens 32.

[0053] In an embodiment of the present application, optionally, the lens 30 and the light-emitting chip 20 are of an integrally formed structure. The light-emitting chip 20 can be immersed in the lens 30 and sealed into an integral structure by injection molding, so that the lens 30 has a good stabilizing and protecting effect on the light-emitting chip 20, and reduces material loss and manufacturing processes.

[0054] In summary, the light-emitting component described in the embodiment of the present application has at least the following advantages:

[0055] In an embodiment of the present application, the light-emitting component includes: a base, a packaging cover, and a light-emitting chip; the base and the packaging cover form a receiving cavity, the light-emitting chip is disposed in the receiving cavity, and the light emitted by the light-emitting chip exits from the packaging cover; the light-emitting chip includes a metal layer, a first electrode layer, an active layer, a second electrode layer, a Bragg reflector layer, and a light-adjusting layer connected in sequence, and the light-adjusting layer is disposed on a side of the Bragg reflector layer away from the second electrode layer for adjusting the emission angle of the light; the light-adjusting layer includes a plurality of light-adjusting units, and the plurality of light-adjusting units are spaced apart on the Bragg reflector layer. In this way, the light emitted by the light-emitting chip can be adjusted by the light-adjusting units, so that more light can be emitted in the direction of the photosensitive module, improving the effective utilization rate of the light, reducing power consumption, and avoiding waste of light energy. Moreover, the structure is simple and easy to implement, without using a complex optical structure, which is beneficial to the compact design of the product.

[0056] Refer to Figures 4 to 6, which shows a light-emitting module proposed in an embodiment of the present application. The light-emitting module includes a bracket 41, a cover plate 40, and at least one of the light-emitting components. The bracket 41 is provided with a recess 42, the light-emitting component is disposed in the recess 42, and the cover plate 40 is connected to the bracket 41 to enclose the recess 42.

[0057] Specifically, in the embodiment of the present application, the bracket 41 is used for die bonding, providing an installation position and an electrical path basis for the light-emitting component, and providing good heat dissipation conditions for the light-emitting component through the recess 42. At the same time, the cover plate 40 provides a good closing effect on the recess 42, forming a physical isolation from other external structures, avoiding the influence of impurities such as dust and liquid on the function of the light-emitting component, and reducing the signal quality.

[0058] Optionally, in the embodiment of the present application, the number of the light-emitting components is multiple, and the multiple light-emitting components are spaced apart and distributed in the recess 42. The number of the emitted light rays 21 can be increased by the multiple light-emitting components, improving the efficiency of the light-emitting component.

[0059] In summary, the light-emitting module described in the embodiment of the present application can at least include the following advantages:

[0060] In the embodiment of the present application, the light-emitting module includes a bracket, a cover plate, and at least one of the light-emitting components. The bracket is provided with a recess, the light-emitting component is disposed in the recess, and the cover plate is connected to the bracket to enclose the recess. The light-emitting component includes: a base, a packaging cover, and a light-emitting chip; the base and the packaging cover form a receiving cavity, the light-emitting chip is disposed in the receiving cavity, and the light emitted by the light-emitting chip exits from the packaging cover; the light-emitting chip includes a metal layer, a first electrode layer, an active layer, a second electrode layer, a Bragg reflection layer, and a dimming layer connected in sequence, the dimming layer is disposed on a side of the Bragg reflection layer away from the second electrode layer for adjusting the exit angle of the light; the dimming layer includes a plurality of dimming units, and the plurality of dimming units are spaced apart and distributed on the Bragg reflection layer. In this way, the light emitted by the light-emitting chip can be adjusted by the dimming unit, so that more light can be emitted in the direction of the photosensitive module, improving the effective utilization rate of the light, reducing the power consumption, and avoiding the waste of light energy. Moreover, the structure is simple and easy to implement, without the need to adopt a complex optical structure, which is beneficial to the compact design of the product.

[0061] Refer to Figures 7 to 8, which shows a PPG sensor module proposed in an embodiment of the present application. The PPG sensor module includes at least one photosensitive module 50 and the light-emitting module. The photosensitive module 50 covers the bracket 41 of the light-emitting module and is at least partially opposite to the light-emitting side of the light-emitting module. The photosensitive module 50 is used to receive light 21. Among them, the light-emitting module includes a light-emitting component provided with a light-emitting chip 20. A dimming layer 22 is provided on the light-emitting side of the light-emitting chip 20, and the dimming layer 22 is used to adjust the emission angle of the light 21. By arranging at least part of the photosensitive module 50 opposite to the light-emitting side of the light-emitting module, the photosensitive module 50 can easily receive more light 21 emitted by the light-emitting module, improving the efficacy of the PPG sensor module. Generally, in order to enable the PPG sensor module to obtain relatively good signal quality in various scenarios, including motion scenarios and non-motion scenarios, etc., multiple photosensitive modules 50 can generally be set. For example Figure 7 and Figure 8 shows a case where the number of photosensitive modules 50 is 2. The number of photosensitive modules 50 can also be set to 3, 4, etc. The embodiment of the present application does not limit this

[0062] Specifically, the photosensitive module 50 may include a photosensitive bracket and at least one photosensitive element. A photosensitive cavity is provided in the photosensitive bracket, and the photosensitive element is arranged in the photosensitive cavity. The photosensitive element is used to receive the light 21 reflected by biological tissue

[0063] Exemplarily, the photosensitive element may include a PD (Photo Diode) chip to receive the light 21 reflected by biological tissue and calculate physiological parameters such as heart rate, blood oxygen saturation, and blood viscosity

[0064] In the embodiment of the present application, the photosensitive bracket of the photosensitive module 50 and the bracket of the light-emitting component may be an integral structure, that is, the light-emitting component and the photosensitive module 50 share a bracket, and multiple recesses 11 may be provided in the bracket to respectively accommodate the light-emitting component and the photosensitive component. In addition, the photosensitive bracket of the photosensitive module 50 and the bracket of the light-emitting module may also be independent structures with spaced distribution. The embodiment of the present application does not specifically limit this

[0065] Optionally, in the embodiment of the present application, the photosensitive module 50 further includes a photosensitive cover plate. The photosensitive cover plate is connected to the photosensitive bracket and encloses the photosensitive cavity with the photosensitive bracket. The photosensitive cover plate realizes a good sealing effect on the photosensitive cavity, forms a physical isolation from other external structures, avoids the influence of impurities such as dust and liquid on the function of the photosensitive line, and reduces the signal quality

[0066] In summary, the PPG sensor module described in the embodiment of the present application may at least have the following advantages

[0067] In an embodiment of the present application, the PPG sensor module includes at least one photosensitive module and the light emitting module; the photosensitive module covers the bracket of the light emitting module, and at least part of the photosensitive module is opposite to the light emitting side of the light emitting module, and the photosensitive module is used to receive light; wherein, the light emitting module includes a light emitting component, the light emitting component is provided with a light emitting chip, and a light regulating layer is arranged on the light emitting side of the light emitting chip, and the light regulating layer is used to adjust the emission angle of the light. The light emitting module includes a bracket, a cover plate and at least one of the light emitting components. The bracket is provided with a recess, the light emitting component is arranged in the recess, and the cover plate is connected to the bracket to close the recess. The light emitting component includes: a base, a packaging cover and a light emitting chip; the base and the packaging cover form a receiving cavity, the light emitting chip is arranged in the receiving cavity, and the light emitted by the light emitting chip is emitted from the packaging cover; the light emitting chip includes a metal layer, a first electrode layer, an active layer, a second electrode layer, a Bragg reflection layer and a light regulating layer connected in sequence, the light regulating layer is arranged on a side of the Bragg reflection layer away from the second electrode layer, and is used to adjust the emission angle of the light; the light regulating layer includes a plurality of light regulating units, and the plurality of light regulating units are spaced apart and distributed on the Bragg reflection layer. In this way, the light emitted by the light emitting chip can be adjusted by the light regulating units, so that more light can be emitted towards the photosensitive module, improving the effective utilization rate of the light, reducing the power consumption, and avoiding the waste of light energy. Moreover, the structure is simple and easy to implement, without the need to adopt a complex optical structure, which is beneficial to the compact design of the product.

[0068] An embodiment of the present application also provides an electronic device, and the electronic device includes the PPG sensor module described above.

[0069] In an embodiment of the present application, the electronic device may include, but is not limited to, any one of a mobile phone, a tablet computer, and a wearable device. The electronic device may also include a medical device, etc. The specific type of the electronic device in the embodiment of the present application may not be limited.

[0070] In summary, the electronic device described in the embodiment of the present application may at least have the following advantages:

[0071] In the embodiments of the present application, the electronic device includes the PPG sensor module described above, and the PPG sensor module includes at least one photosensitive module and the light-emitting module; the photosensitive module covers the bracket of the light-emitting module and at least partially faces the light-emitting side of the light-emitting module, and the photosensitive module is used to receive light; wherein, the light-emitting module includes a light-emitting component, the light-emitting component is provided with a light-emitting chip, and a dimming layer is arranged on the light-emitting side of the light-emitting chip, and the dimming layer is used to adjust the emission angle of the light. The light-emitting module includes a bracket, a cover plate, and at least one light-emitting component. The bracket is provided with a recess, the light-emitting component is arranged in the recess, and the cover plate is connected to the bracket to close the recess. The light-emitting component includes: a base, a packaging cover, and a light-emitting chip; the base and the packaging cover form a receiving cavity, the light-emitting chip is arranged in the receiving cavity, and the light emitted by the light-emitting chip exits from the packaging cover; the light-emitting chip includes a metal layer, a first electrode layer, an active layer, a second electrode layer, a Bragg reflection layer, and a dimming layer connected in sequence, and the dimming layer is arranged on the side of the Bragg reflection layer away from the second electrode layer and is used to adjust the emission angle of the light; the dimming layer includes a plurality of dimming units, and the plurality of dimming units are spaced apart and distributed on the Bragg reflection layer. In this way, the light emitted by the light-emitting chip can be adjusted by the dimming units, so that more light can be emitted in the direction of the photosensitive module, improving the effective utilization rate of the light, reducing the power consumption, and avoiding the waste of light energy. Moreover, the structure is simple and easy to implement, without the need to adopt a complex optical structure, which is beneficial to the compact design of the product.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0073] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirits of the present invention, and the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A light-emitting component, characterized in that, The light-emitting component includes: a base, a packaging cover, and a light-emitting chip; The base and the packaging cover form a receiving cavity, the light-emitting chip is disposed in the receiving cavity, and the light emitted by the light-emitting chip exits from the packaging cover; The light-emitting chip includes a metal layer, a first electrode layer, an active layer, a second electrode layer, a Bragg reflection layer, and a light-adjusting layer connected in sequence. The light-adjusting layer is disposed on a side of the Bragg reflection layer away from the second electrode layer for adjusting the exit angle of the light; The light-adjusting layer includes a plurality of light-adjusting units, and the plurality of light-adjusting units are spaced apart and distributed on the Bragg reflection layer; The widths of the plurality of light-adjusting units in a first direction increase sequentially along the first direction; Wherein, the first direction is parallel to the Bragg reflection layer.

2. The light-emitting component according to claim 1, characterized in that, The light-emitting component further includes a lens; The lens is disposed in the packaging cover and covers at least one of the light-emitting chips; The lens includes a bottom surface and an arc surface connected to the bottom surface. The metal layer is connected to the bottom surface, the bottom surface is connected to the base, and the light enters the lens from the bottom surface and exits through the arc surface.

3. The light-emitting component according to claim 2, characterized in that, The bottom surface of the lens is provided with a groove, the light-emitting chip is embedded in the groove, and the light-adjusting layer is in contact with the bottom of the groove.

4. The light-emitting component according to claim 2, wherein The lens is a symmetric lens, and the arc surfaces of the symmetric lens are symmetrically distributed with respect to the central axis of the light-emitting chip.

5. The light-emitting component according to claim 2, characterized in that, The lens is a polarizing lens, and the arc surfaces of the polarizing lens are asymmetrically distributed with respect to the central axis of the light-emitting chip to adjust the exit angle of the light.

6. The light-emitting component according to claim 2, wherein The lens and the light-emitting chip are of an integrally formed structure.

7. A light-emitting module, characterized in that, The light-emitting module includes a bracket, a cover plate, and at least one light-emitting component according to any one of claims 1-6; The bracket is provided with a recessed portion, the light-emitting component is disposed in the recessed portion, and the cover plate is connected to the bracket to enclose the recessed portion.

8. The light-emitting module according to claim 7, characterized in that, The number of the light-emitting components is multiple, and the multiple light-emitting components are spaced apart and distributed in the recessed portion.

9. A PPG sensor module, characterized in that, The PPG sensor module includes at least one photosensitive module and a light-emitting module according to any one of claims 7-8; The photosensitive module covers the bracket of the light-emitting module and is at least partially opposite to the light-emitting side of the light-emitting module, and the photosensitive module is used for receiving light; Wherein, the light-emitting module includes a light-emitting component, the light-emitting component is provided with a light-emitting chip, and a light-adjusting layer is disposed on the light-emitting side of the light-emitting chip for adjusting the exit angle of the light.

10. An electronic device, characterized in that, The electronic device includes the PPG sensor module according to claim 9.

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