Temperature measuring device adjusting fixture and semiconductor equipment

Abstract

This invention provides an adjustment and fixing device for a temperature measuring device and a semiconductor device. The temperature measuring device includes a horizontal section and a vertical section connected to the horizontal section. The horizontal section penetrates a semiconductor reaction chamber, extending from the outside to the inside of the semiconductor reaction chamber. The vertical section is located inside the semiconductor reaction chamber, extending from the bottom to the top of the semiconductor reaction chamber. The adjustment and fixing device includes a fixing support assembly and a first adjustment assembly. The fixing support assembly is disposed inside the semiconductor reaction chamber, and the first adjustment assembly is disposed on the fixing support assembly and cooperates with the portion of the horizontal section located inside the semiconductor reaction chamber. It is used to adjust the verticality of the vertical section by adjusting the horizontality of the horizontal section. The adjustment and fixing device for a temperature measuring device and the semiconductor device provided by this invention can improve device stability, thereby improving temperature measurement accuracy, and further improving temperature control accuracy, thus improving semiconductor process results.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more specifically, to an adjustment and fixing device for a temperature measuring device and a semiconductor device. Background Technology

[0002] In semiconductor vertical furnace equipment, a wafer boat carries the wafer into the reaction chamber for semiconductor processing. To increase production capacity, the height of the reaction chamber usually exceeds 1.5m. The temperature uniformity inside the reaction chamber affects the semiconductor process results. Therefore, a temperature measuring device is usually installed inside the reaction chamber. By using the temperature measuring device to detect the temperature inside the reaction chamber, the heating device outside the reaction chamber can be controlled, thereby controlling the temperature inside the reaction chamber and ensuring good temperature uniformity inside the reaction chamber.

[0003] An existing temperature measuring device includes a horizontal section and a vertical section. The horizontal section penetrates the bottom of the reaction chamber, extending from outside the reaction chamber into the reaction chamber. The vertical section connects to the horizontal section and extends vertically from the bottom to the top of the reaction chamber. It detects the temperature of each temperature zone inside the reaction chamber from bottom to top and feeds the detection results back to the heating device, thereby controlling the temperature of the reaction chamber and ensuring good temperature uniformity inside the reaction chamber. Furthermore, to improve the accuracy of temperature control, the vertical section needs to be as close as possible to the crystal boat.

[0004] However, in existing technologies, after the temperature measuring device is installed, the horizontal section is tilted, with the end of the horizontal section near the reaction chamber being lower than the end near the outside of the reaction chamber. This causes the vertical section to also be tilted, gradually approaching the crystal boat from bottom to top. This can lead to interference between the vertical section and the crystal boat. Since both the vertical section and the crystal boat are made of rigid materials, there is a risk of breakage if they collide. Even a slight scratch can cause the surface material to peel off, contaminating the environment inside the reaction chamber and leading to semiconductor process failure. Furthermore, the tilt of the vertical section requires a larger gap between it and the crystal boat, and the distance between the vertical section and the crystal boat varies from bottom to top, resulting in inaccurate temperature measurement, inaccurate control, and poor semiconductor process results. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes an adjustment and fixing device for a temperature measuring device and a semiconductor device, which can improve the stability of the device, thereby improving the accuracy of temperature measurement, and further improving the accuracy of temperature control, thus improving the semiconductor process results.

[0006] To achieve the objectives of this invention, an adjustment and fixing device for a temperature measuring device is provided. The temperature measuring device includes a horizontal section and a vertical section connected to the horizontal section. The horizontal section penetrates a semiconductor reaction chamber, extending from the outside of the semiconductor reaction chamber to its interior. The vertical section is located within the semiconductor reaction chamber, extending from the bottom to the top of the semiconductor reaction chamber. The adjustment and fixing device includes a fixing support assembly and a first adjustment assembly. The fixing support assembly is disposed within the semiconductor reaction chamber. The first adjustment assembly is disposed on the fixing support assembly and cooperates with the portion of the horizontal section located within the semiconductor reaction chamber, for adjusting the verticality of the vertical section by adjusting the horizontality of the horizontal section.

[0007] Optionally, the fixed support assembly includes a fixing component and a bearing component. The fixing component is fixedly disposed within the semiconductor reaction chamber, the bearing component is connected to the fixing component, and the first adjustment component is disposed on the bearing component.

[0008] Optionally, the first adjustment component includes a support member and a first adjustment component. The support member is used to support the horizontal segment, and the first adjustment component is connected to the support member and is vertically and vertically mounted on the bearing member to adjust the levelness of the horizontal segment by adjusting the lifting of the support member.

[0009] Optionally, the first adjusting component includes an adjusting bolt, the bearing component is provided with a first adjusting threaded hole, the adjusting bolt passes through the first adjusting threaded hole and is threadedly engaged with the first adjusting threaded hole, and one end of the adjusting bolt is connected to the support member.

[0010] Optionally, the adjustment and fixing device further includes a second adjustment component, which is disposed on the bearing member and cooperates with the portion of the horizontal section located within the semiconductor reaction chamber, for adjusting the verticality of the vertical section by rotating the horizontal section about its axis.

[0011] Optionally, the second adjustment component includes a fastening component, a second adjustment component, and a third adjustment component. The fastening component is used to fasten to the horizontal segment. The second adjustment component is connected to the bearing component and the fastening component, and is used to adjust the horizontal segment by rotating it in a first rotational direction with the axis of the horizontal segment as the axis. The third adjustment component is connected to the bearing component and the fastening component, and is used to adjust the horizontal segment by rotating it in a second rotational direction opposite to the first rotational direction with the axis of the horizontal segment as the axis.

[0012] Optionally, the fastening component includes a fastening sleeve and a fastening screw. The fastening sleeve is used to fit onto the horizontal section. The fastening sleeve is provided with a fastening threaded hole. The axis of the fastening threaded hole is perpendicular to the axis of the horizontal section. The fastening screw passes through the fastening threaded hole and is threaded into the fastening threaded hole. One end of the fastening screw is used to abut against the horizontal section to fasten the horizontal section.

[0013] Optionally, the second adjusting component includes a tension spring and a connecting member, and the third adjusting component includes an adjusting screw, a top rod, and a top cover. The connecting member is connected to the bearing component. The axis of the tension spring is perpendicular to the axis of the horizontal section and the axis of the fastening threaded hole, respectively. The two ends of the tension spring are connected to the fastening sleeve and the connecting member, respectively. The tension spring is used to drive the fastening sleeve to rotate in the first rotation direction by its own elastic force, so as to adjust the horizontal section by rotation in the first rotation direction.

[0014] The connector is provided with a second adjusting threaded hole, the axis of which is parallel to the axis of the tension spring. The adjusting screw passes through the second adjusting threaded hole, extends into the tension spring, and is threadedly engaged with the second adjusting threaded hole. The fastening sleeve is provided with a receiving groove, the axis of which is parallel to the axis of the second adjusting threaded hole. One end of the push rod is received in the receiving groove, and the other end passes through the receiving groove, extends into the tension spring, and is connected to one end of the adjusting screw. The top cover is placed on the receiving groove. The end of the push rod received in the receiving groove is used to lift the top cover to drive the fastening sleeve to rotate in the second rotation direction, thereby adjusting the horizontal section in the second rotation direction.

[0015] Optionally, the connector is provided with a boss, and the bearing component is provided with a plug interface for the connector to be inserted, and the plug interface is provided with a groove for the boss to slide into.

[0016] Optionally, one end of the push rod is provided with a ball head, the fastening sleeve is provided with a mounting groove, the axis of the mounting groove is parallel to the axis of the receiving groove, the inner peripheral wall of the mounting groove is provided with an internal mounting thread, the outer peripheral wall of the top cover is provided with an external mounting thread, the top cover is installed in the mounting groove, and is threadedly connected to the internal mounting thread through the external mounting thread;

[0017] The bottom of the mounting groove is provided with the receiving groove, which is used to receive the ball head. The bottom of the receiving groove is provided with a limiting hole. The diameter of the limiting hole is smaller than the radial dimension of the ball head and larger than the radial dimension of the push rod, so as to allow the push rod to pass through and to confine the ball head within the receiving groove.

[0018] Optionally, the support member supports the horizontal segment by supporting the fastening sleeve, and the frictional force between the support member and the fastening sleeve ensures that the fastening sleeve cannot move relative to the support member under the action of the pressure difference between the inside and outside of the semiconductor reaction chamber.

[0019] The present invention also provides a semiconductor device, including a semiconductor reaction chamber and a temperature measuring device, wherein the semiconductor reaction chamber includes a chamber body and a support base, the chamber body is disposed on the support base, the temperature measuring device includes a horizontal section and a vertical section connected to the horizontal section, the horizontal section penetrates the support base and extends from the outside of the support base into the interior of the chamber body, the vertical section is located inside the semiconductor reaction chamber and extends from the bottom to the top of the semiconductor reaction chamber, the semiconductor device further includes the adjustment and fixing device as provided by the present invention, the adjustment and fixing device is disposed on the support base and located inside the semiconductor reaction chamber, and cooperates with the portion of the temperature measuring device located inside the semiconductor reaction chamber, for adjusting the verticality of the temperature measuring device.

[0020] The present invention has the following beneficial effects:

[0021] The temperature measuring device adjustment and fixing device provided by the present invention adjusts the horizontality of the horizontal section of the temperature measuring device by means of a first adjustment component, thereby adjusting the verticality of the vertical section of the temperature measuring device. This ensures that the vertical section of the temperature measuring device is in a vertical state, reducing the possibility of interference between the vertical section of the temperature measuring device and the crystal boat in the semiconductor reaction chamber, thereby improving equipment stability. Furthermore, since the vertical section of the temperature measuring device can be kept in a vertical state, the reserved distance between the vertical section of the temperature measuring device and the crystal boat can be reduced, and the uniformity of the distance between the vertical section of the temperature measuring device and the crystal boat from bottom to top can be improved, thereby improving temperature measurement accuracy, and further improving temperature control accuracy, thus improving semiconductor process results.

[0022] The semiconductor equipment provided by the present invention, by cooperating the adjustment and fixing device of the temperature measuring device provided by the present invention with the part of the temperature measuring device located in the semiconductor reaction chamber, can adjust the verticality of the temperature measuring device by means of the adjustment and fixing device of the temperature measuring device provided by the present invention, thereby improving the stability of the equipment, thereby improving the accuracy of temperature measurement, and further improving the accuracy of temperature control, thus improving the semiconductor process results. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the adjustment and fixing device and the semiconductor reaction chamber of the temperature measuring device provided in the embodiments of the present invention;

[0024] Figure 2 for Figure 1A magnified structural diagram of part A in the middle;

[0025] Figure 3 This is an exploded structural diagram of the adjustment and fixing device of the temperature measuring device provided in an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the main structure of the adjustment and fixing device of the temperature measuring device provided in an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of the supporting component of the adjustment and fixing device of the temperature measuring device provided in an embodiment of the present invention;

[0028] Figure 6 An exploded view of the second adjusting component of the adjusting and fixing device of the temperature measuring device provided in an embodiment of the present invention;

[0029] Figure 7 for Figure 6 A partial cross-sectional view of the central fastening jacket;

[0030] Explanation of reference numerals in the attached figures:

[0031] 11-Horizontal section; 12-Vertical section; 2-Adjustment and fixing device; 21-Fixing component; 211-First connecting threaded hole; 22-Bearing component; 221-First adjusting threaded hole; 222-Connecting through hole; 223-Insertion interface; 224-Slide groove; 23-Support component; 231-Second connecting threaded hole; 24-Adjusting bolt; 25-Fastening sleeve; 251-Fastening threaded hole; 26-Fastening screw; 27-Tension spring; 28-Connecting component; 281-Boss; 29-Adjusting screw; 31-Top rod; 32-Top cover; 33-Ball head; 34-Mounting groove; 35-Receiving groove; 36-Limiting hole; 37-Connecting bolt; 41-Cavity body; 42-Support seat; 43-Heating device; 44-Sleeve; 45-Crystal boat; 46-Sleeve nut. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of the present invention, the adjustment and fixing device and semiconductor device of the temperature measuring device provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0033] like Figures 1-7As shown, this embodiment of the invention provides an adjustment and fixing device 2 for a temperature measuring device. The temperature measuring device includes a horizontal section 11 and a vertical section 12 connected to the horizontal section 11. The horizontal section 11 penetrates the semiconductor reaction chamber, extending from the outside of the semiconductor reaction chamber to the inside. The vertical section 12 is located inside the semiconductor reaction chamber, extending from the bottom to the top of the semiconductor reaction chamber. The adjustment and fixing device 2 includes a fixing support assembly and a first adjustment assembly. The fixing support assembly is disposed inside the semiconductor reaction chamber, and the first adjustment assembly is disposed on the fixing support assembly and cooperates with the portion of the horizontal section 11 located inside the semiconductor reaction chamber. It is used to adjust the verticality of the vertical section 12 by adjusting the horizontality of the horizontal section 11.

[0034] The adjustment and fixing device 2 of the temperature measuring device provided in this embodiment of the invention adjusts the horizontality of the horizontal section 11 of the temperature measuring device by means of the first adjustment component, thereby adjusting the verticality of the vertical section 12 of the temperature measuring device. This ensures that the vertical section 12 of the temperature measuring device is in a vertical state, reducing the possibility of interference between the vertical section 12 of the temperature measuring device and the crystal boat 45 in the semiconductor reaction chamber, thereby improving equipment stability. Furthermore, since the vertical section 12 of the temperature measuring device can be in a vertical state, the reserved distance between the vertical section 12 of the temperature measuring device and the crystal boat 45 can be reduced, and the uniformity of the distance between the vertical section 12 of the temperature measuring device and the crystal boat 45 from bottom to top can be improved, thereby improving temperature measurement accuracy, and further improving temperature control accuracy, thus improving semiconductor process results.

[0035] like Figure 1 and Figure 2 As shown, in practical applications, a semiconductor reaction chamber may include a chamber body 41, a support base 42, and a heating device 43. The chamber body 41 is disposed on the support base 42, which is disposed at the bottom of the chamber body 41 to support the chamber body 41. The heating device 43 is disposed outside the chamber body 41 and is used to heat the inside of the chamber body 41 by thermal radiation, thereby heating the wafer on the crystal boat 45 that enters the chamber body 41. The support base 42 may be provided with a through hole. The horizontal section 11 of the temperature measuring device can extend from outside the semiconductor reaction chamber through the through hole into the semiconductor reaction chamber. The vertical section 12 is located inside the chamber body 41 and is connected to the horizontal section 11, extending from the bottom to the top of the semiconductor reaction chamber. A sleeve 44 may be fitted over the horizontal section 11. One end of the sleeve 44 may be connected to the support base 42 by welding. A pressure ring and a sealing ring may be fitted over the part of the horizontal section 11 outside the semiconductor reaction chamber. The sealing ring is embedded in the sealing groove of the sleeve 44. The pressure ring is located between the horizontal section 11 and the sleeve 44 and abuts against the sealing ring. The other end of the sleeve 44 may be connected to a sleeve 44 nut. By tightening the sleeve 44 nut, the pressure ring can squeeze the sealing ring, thereby sealing the semiconductor reaction chamber.

[0036] Optionally, the chamber body 41 can be a quartz tube.

[0037] Optionally, the bottom of the quartz tube is annular, and the support base 42 can also be annular, with the annular shape of the support base 42 matching the annular shape of the bottom of the quartz tube, so that the support base 42 can support the quartz tube from the bottom.

[0038] In this embodiment of the invention, both the fixing support assembly and the first adjustment assembly of the adjusting fixing device 2 are disposed within the semiconductor reaction chamber. The fixing support assembly can be fixedly disposed within the semiconductor reaction chamber, and the first adjustment assembly can be disposed on the fixing support assembly. The fixing support assembly can support the first adjustment assembly. By cooperating with the portion of the horizontal segment 11 located within the semiconductor reaction chamber, the horizontality of the horizontal segment 11 can be adjusted using the first adjustment assembly, so that the end of the horizontal segment 11 located within the semiconductor reaction chamber and the end located outside the semiconductor reaction chamber are at the same height, thereby adjusting the horizontal segment... With section 11 in a horizontal position, the vertical section 12 is positioned vertically. This reduces the likelihood of interference between the vertical section 12 of the temperature measuring device and the crystal boat 45 within the semiconductor reaction chamber, thereby improving equipment stability. Furthermore, since the vertical section 12 of the temperature measuring device can be positioned vertically, the reserved distance between the vertical section 12 of the temperature measuring device and the crystal boat 45 can be reduced, and the uniformity of the distance between the vertical section 12 of the temperature measuring device and the crystal boat 45 from bottom to top can be improved. This improves temperature measurement accuracy, which in turn improves temperature control accuracy and enhances semiconductor process results.

[0039] In practical applications, when the crystal boat 45 descends and exits from inside the semiconductor reaction chamber to outside the semiconductor reaction chamber, the operator can reach into the semiconductor reaction chamber through the opening at the bottom of the semiconductor reaction chamber and adjust the verticality of the vertical section 12 by adjusting the first adjustment component.

[0040] like Figures 2-5 As shown, in one embodiment of the present invention, the fixed support assembly may include a fixed component 21 and a bearing component 22. The fixed component 21 is fixedly disposed in the semiconductor reaction chamber, the bearing component 22 is connected to the fixed component 21, and the first adjustment component is disposed on the bearing component 22.

[0041] Optionally, the fixing component 21 can be fixedly mounted on the inner wall of the support base 42 by welding, thereby enabling the fixing component 21 to be fixedly mounted in the semiconductor reaction chamber. The fixing component 21 is provided with a first connecting threaded hole 211, and the bearing component 22 is provided with a connecting through hole 222. By passing the connecting bolt 37 through the connecting through hole 222 and threading it into the first connecting threaded hole 211, the bearing component 22 and the fixing component 21 can be connected. By connecting the bearing component 22 and the fixing component 21, and mounting the first adjusting component on the bearing component 22, the fixing component 21 can support the bearing component 22, thereby supporting the first adjusting component. However, the mounting method of the fixing component 21 and the connection method between the bearing component 22 and the fixing component 21 are not limited to this.

[0042] Optionally, the number of fixing components 21 can be multiple, and the number of connecting through holes 222 of the bearing component 22 is the same as the number of fixing components 21, so that the bearing component 22 can be connected to all the fixing components 21 by multiple connecting bolts 37, thereby improving the reliability of the support for the bearing component 22. For example, Figure 3 and Figure 4 The number of fixing components 21 and the number of connecting through holes 222 of the bearing component 22 are both two. However, the number of fixing components 21 is not limited to this. For example, the number of fixing components 21 can also be one, three or more.

[0043] Optionally, the fixing component 21 can be a fixing plate, which can be placed horizontally, and the first side of the fixing plate is welded to the inner wall of the support base 42. The first connecting threaded hole 211 penetrates the fixing plate along the thickness direction of the fixing plate. The side of the fixing plate opposite to its first side is the second side of the fixing plate, and both ends of the second side of the fixing plate can have chamfers.

[0044] like Figures 2-4 As shown, in one embodiment of the present invention, the first adjustment component may include a support member 23 and a first adjustment component. The support member 23 is used to support the horizontal segment 11. The first adjustment component is connected to the support member 23 and is vertically and vertically mounted on the bearing component 22. It is used to adjust the levelness of the horizontal segment 11 by adjusting the lifting of the support member 23.

[0045] In other words, the first adjusting component can be adjusted to rise or fall. By adjusting the first adjusting component to rise, the support member 23 connected to the first adjusting component can be raised. Since the support member 23 is used to support the horizontal segment 11, that is, the support member 23 can support the horizontal segment 11 from the bottom of the horizontal segment 11. Therefore, the end of the horizontal segment 11 located in the semiconductor reaction chamber can be raised. By adjusting the first adjusting component to fall, the support member 23 connected to the first adjusting component can be lowered. Since the support member 23 cannot support the horizontal segment 11 to the previous height at this time, the horizontal segment 11 will fall under its own gravity. Thus, the end of the horizontal segment 11 located in the semiconductor reaction chamber can be lowered, thereby adjusting the levelness of the horizontal segment 11.

[0046] like Figures 2-4 As shown, in one embodiment of the present invention, the first adjusting component may include an adjusting bolt 24, the bearing component 22 may be provided with a first adjusting threaded hole 221, the adjusting bolt 24 passes through the first adjusting threaded hole 221 and is threadedly engaged with the first adjusting threaded hole 221, and one end of the adjusting bolt 24 is connected to the support member 23.

[0047] Since the adjusting bolt 24 is threadedly engaged with the first adjusting threaded hole 221 of the bearing component 22, the adjusting bolt 24 can be raised or lowered relative to the bearing component 22 by rotating the adjusting bolt 24, thereby enabling the first adjusting component to be raised or lowered on the bearing component 22. Since one end of the adjusting bolt 24 is connected to the support member 23, the support member 23 can be raised or lowered by raising or lowering the adjusting bolt 24 relative to the bearing component 22.

[0048] Optionally, the support member 23 may be provided with a second connecting threaded hole 231, and one end of the adjusting bolt 24 may be threadedly connected to the second connecting threaded hole 231, thereby realizing the connection between one end of the adjusting bolt 24 and the support member 23.

[0049] like Figures 2-4 and Figure 6 As shown, in one embodiment of the present invention, the adjusting fixing device 2 may further include a second adjusting component. The second adjusting component is disposed on the bearing component 22 and cooperates with the portion of the horizontal segment 11 located in the semiconductor reaction chamber. It is used to adjust the verticality of the vertical segment 12 by rotating the horizontal segment 11 around the axis of the horizontal segment 11.

[0050] This is because the semiconductor reaction chamber may vibrate during actual processing, which could cause the horizontal section 11 to rotate around its axis, resulting in the vertical section 12 tilting. This would cause a change in the distance between the vertical section 12 and the crystal boat 45, leading to inaccurate temperature measurement. The adjustment and fixing device 2 of the temperature measuring device provided in this embodiment of the invention can adjust the verticality of the vertical section 12 by rotating the horizontal section 11 around its axis when the horizontal section 11 rotates around its axis, causing the vertical section 12 to tilt. This allows the vertical section 12 of the temperature measuring device to be kept vertical, thereby improving the accuracy of temperature measurement, which in turn improves the accuracy of temperature control and improves the results of semiconductor processing.

[0051] like Figures 2-4 and Figure 6 As shown, in one embodiment of the present invention, the second adjustment component may include a fastening component, a second adjustment component, and a third adjustment component. The fastening component is used to fasten to the horizontal segment 11. The second adjustment component is connected to the bearing component 22 and to the fastening component, and is used to adjust the horizontal segment 11 by rotating it in a first rotational direction with the axis of the horizontal segment 11 as the axis. The third adjustment component is connected to the bearing component 22 and to the fastening component, and is used to adjust the horizontal segment 11 by rotating it in a second rotational direction opposite to the first rotational direction with the axis of the horizontal segment 11 as the axis.

[0052] By connecting both the second and third adjusting components to the supporting component 22, the supporting component 22 can support the second and third adjusting components. By connecting both the second and third adjusting components to the fastening component, since the fastening component is fastened to the horizontal segment 11, the fastening component can be adjusted by rotating the second adjusting component in the first rotational direction with the axis of the horizontal segment 11 as the axis. This allows the fastening component to drive the horizontal segment 11 to rotate in the first rotational direction with the axis of the horizontal segment 11 as the axis, thereby adjusting the horizontal segment 11 by rotating it in the first rotational direction with the axis of the horizontal segment 11 as the axis. Similarly, by rotating the third adjusting component in the second rotational direction with the axis of the horizontal segment 11 as the axis, the fastening component can drive the horizontal segment 11 to rotate in the second rotational direction with the axis of the horizontal segment 11 as the axis, thereby adjusting the horizontal segment 11 by rotating it in the second rotational direction with the axis of the horizontal segment 11 as the axis. Since the first rotational direction is opposite to the second direction, this allows the horizontal segment 11 to be adjusted by rotating it in the second rotational direction with the axis of the horizontal segment 11 as the axis.

[0053] like Figures 2-4 and Figure 6As shown, in one embodiment of the present invention, the fastening component may include a fastening sleeve 25 and a fastening screw 26. The fastening sleeve 25 is used to be sleeved on the horizontal section 11. The fastening sleeve 25 is provided with a fastening threaded hole 251. The axis of the fastening threaded hole 251 is perpendicular to the axis of the horizontal section 11. The fastening screw 26 passes through the fastening threaded hole 251 and is threadedly engaged with the fastening threaded hole 251. One end of the fastening screw 26 is used to abut against the horizontal section 11 to fasten the horizontal section 11.

[0054] By aligning the axis of the threaded hole 251 with the horizontal plane and perpendicular to the axis of the horizontal segment 11, after the fastening sleeve 25 is fitted onto the horizontal segment 11 and the fastening screw 26 is passed through the threaded hole 251, one end of the fastening screw 26 can extend into the fastening sleeve 25 and abut against the horizontal segment 11 fitted into the fastening sleeve 25. By rotating the fastening screw 26, the fastening screw 26 can be extended into the inside of the fastening sleeve 25 or withdrawn from the outside of the fastening sleeve 25, thereby adjusting the fastening force between the fastening screw 26 and the horizontal segment 11. Thus, the horizontal segment 11 can be fastened into the fastening sleeve 25 by means of the fastening screw 26, achieving a fastening connection between the fastening component and the horizontal segment 11.

[0055] like Figure 3 , Figure 4 and Figure 6 As shown, in one embodiment of the present invention, the second adjusting component may include a tension spring 27 and a connecting member 28, and the third adjusting component may include an adjusting screw 29, a top rod 31, and a top cover 32. The connecting member 28 is connected to the bearing component 22. The axis of the tension spring 27 is perpendicular to the axis of the horizontal section 11 and the axis of the fastening threaded hole 251, respectively. The two ends of the tension spring 27 are connected to the fastening sleeve 25 and the connecting member 28, respectively. The tension spring 27 is used to drive the fastening sleeve 25 to rotate in the first rotation direction through its own elastic force, so as to adjust the horizontal section 11 by rotating in the first rotation direction. The connecting member 28 is provided with a second adjusting threaded hole. The axis is parallel to the axis of the tension spring 27. The adjusting screw 29 passes through the second adjusting threaded hole and extends into the tension spring 27, and is threadedly engaged with the second adjusting threaded hole. The fastening sleeve 25 is provided with a receiving groove 35. The axis of the receiving groove 35 is parallel to the axis of the second adjusting threaded hole. One end of the push rod 31 is received in the receiving groove 35, and the other end passes through the receiving groove 35 and extends into the tension spring 27, and is connected to one end of the adjusting screw 29. The top cover 32 is placed on the receiving groove 35. The end of the push rod 31 received in the receiving groove 35 is used to drive the fastening sleeve 25 to rotate in the second rotation direction by lifting the top cover 32, so as to adjust the horizontal section 11 by rotating in the second rotation direction.

[0056] In practical applications, when the adjusting screw 29 is rotated and raised in the tension spring 27, one end of the push rod 31 is accommodated in the receiving groove 35 of the fastening sleeve 25, and the other end extends through the receiving groove 35 into the tension spring 27 and connects with one end of the adjusting screw 29. Therefore, by raising the adjusting screw 29 in the tension spring 27, one end of the push rod 31 can be driven to rise in the receiving groove 35, so that one end of the push rod 31 can lift the top cover 32 covering the receiving groove 35. Since the connecting piece 28 is connected to the bearing member 22, the force applied by one end of the push rod 31 to the top cover 32 can stretch the tension spring 27 and cause the fastening sleeve 25 to rotate in the second rotation direction, thereby driving the horizontal section 11 to rotate in the second rotation direction. This allows the third adjusting member to rotate and adjust the horizontal section 11 in the second rotation direction with the axis of the horizontal section 11 as the axis.

[0057] When the adjusting screw 29 is rotated and lowered in the tension spring 27, one end of the top rod 31 can be driven to descend in the receiving groove 35. At this time, the tension spring 27 will contract under its own elastic force. Since the two ends of the tension spring 27 are connected to the fastening sleeve 25 and the connecting piece 28 respectively, the elastic force of the tension spring 27 can make the fastening sleeve 25 rotate in the first rotation direction opposite to the second rotation direction, thereby driving the horizontal section 11 to rotate in the first rotation direction, and thus realizing the second adjusting component to rotate and adjust the horizontal section 11 in the first rotation direction with the axis of the horizontal section 11 as the axis.

[0058] Optionally, the push rod 31 may be provided with a third connecting threaded hole, and one end of the adjusting screw 29 may be threadedly connected to the third connecting threaded hole, thereby realizing the connection between one end of the adjusting screw 29 and the other end of the push rod 31.

[0059] Optionally, the two ends of the tension spring 27 can be connected to the fastening sleeve 25 and the connector 28 by welding, respectively.

[0060] Optionally, the fastening sleeve 25 may be provided with a first welding groove, the connector 28 may be provided with a second welding groove, one end of the tension spring 27 may be welded to the first welding groove, and the other end may be welded to the second welding groove to improve the welding stability of the tension spring 27.

[0061] like Figure 5 and Figure 6 As shown, in one embodiment of the present invention, the connector 28 may be provided with a boss 281, and the bearing component 22 may be provided with an insertion interface 223 for the connector 28 to be inserted into, and the insertion interface 223 may be provided with a sliding groove 224 for the boss 281 to slide into.

[0062] In other words, by sliding the boss 281 into the slide groove 224, the connector 28 can be inserted into the insertion interface 223. Since the slide groove 224 can limit the boss 281, the connector 28 can be connected to the bearing component 22.

[0063] Optionally, the supporting component 22 may include a first supporting plate portion, a connecting plate portion, and a second supporting plate portion. The first supporting plate portion may be horizontally positioned and in contact with the fixed plate. A connecting through hole 222 penetrates the first supporting plate portion along its thickness direction. The connecting plate portion is bent. The first side of the connecting plate is connected to the first supporting plate portion. The side of the connecting plate opposite to its first side is the second side of the connecting plate. The first side of the second supporting plate portion is connected to the second side of the connecting plate, and the second supporting plate portion is higher than the first supporting plate portion. A first connecting threaded hole 211 penetrates the second supporting plate portion along its thickness direction. A plug-in interface 223 penetrates the second supporting plate portion along its thickness direction. The side of the second supporting plate portion opposite to its first side is the second side of the second supporting plate portion. The plug-in interface 223 has an opening on its second side for the boss 281 to slide into the plug-in interface 223.

[0064] like Figure 4 , Figure 6 and Figure 7 As shown, in one embodiment of the present invention, one end of the push rod 31 may be provided with a ball head 33, the fastening sleeve 25 may be provided with an installation groove 34, the axis of the installation groove 34 is parallel to the axis of the receiving groove 35, the inner peripheral wall of the installation groove 34 may be provided with an internal installation thread, the outer peripheral wall of the top cover 32 may be provided with an external installation thread, the top cover 32 is installed in the installation groove 34 and is threadedly connected to the internal installation thread groove through the external installation thread; the bottom of the installation groove 34 is provided with a receiving groove 35, the receiving groove 35 is used to receive the ball head 33, the bottom of the receiving groove 35 is provided with a limiting hole 36, the diameter of the limiting hole 36 is smaller than the radial dimension of the ball head 33 and larger than the radial dimension of the push rod 31, for the push rod 31 to pass through and restrict the ball head 33 within the receiving groove 35.

[0065] In practical applications, the other end of the push rod 31 can be inserted into the tension spring 27 by passing through the mounting groove 34, the receiving groove 35 and the limiting hole 36 in sequence, and the ball head 33 at one end of the push rod 31 can be received in the receiving groove 35. Then, the external mounting thread on the outer peripheral wall of the top cover 32 can be threaded to the internal mounting thread on the inner peripheral wall of the mounting groove 34 to install the top cover 32 in the mounting groove 34. Since the diameter of the limiting hole 36 is smaller than the radial dimension of the ball head 33 and larger than the radial dimension of the push rod 31, the ball head 33 can be restricted in the receiving groove 35 and can abut against the top cover 32. In this way, when the push rod 31 rises, the ball head 33 can apply a lifting force to the top cover 32 to drive the fastening sleeve 25 to rotate in the second rotation direction.

[0066] like Figure 2 and Figure 4 As shown, in one embodiment of the present invention, the support member 23 can support the horizontal segment 11 by supporting the fastening sleeve 25, and the friction between the support member 23 and the fastening sleeve 25 is sufficient to prevent the horizontal segment 11 from moving relative to the support member 23 along the axial direction of the horizontal segment 11 under the action of the pressure difference between the inside and outside of the semiconductor reaction chamber.

[0067] This design is due to the fact that in semiconductor processes, the gas pressure inside the semiconductor reaction chamber is lower than the gas pressure outside the semiconductor reaction chamber. In other words, the semiconductor reaction chamber is in a vacuum state relative to the outside. This creates a pressure difference between the portion of the horizontal section 11 outside the semiconductor reaction chamber and the portion inside, which could cause the horizontal section 11 to be drawn into the semiconductor reaction chamber under the influence of this pressure difference, potentially causing the vertical section 12 to collide with the crystal boat 45. However, the adjustment and fixing device 2 of the temperature measuring device provided in this embodiment of the invention ensures that the friction between the support member 23 and the fastening sleeve 25 prevents the fastening sleeve 25 from moving relative to the support member 23 under the influence of the pressure difference between the inside and outside of the semiconductor reaction chamber. Since the horizontal section 11 is fastened in the fastening sleeve 25 by the fastening screw 26, it is prevented from being drawn into the semiconductor reaction chamber. This, in turn, prevents the vertical section 12 from colliding with the crystal boat 45, further improving the stability of the equipment.

[0068] Optionally, the fastening sleeve 25 may include a sleeve ring body and a mounting protrusion. The sleeve ring body may be annular, and the horizontal segment 11 may pass through the sleeve ring body. The fastening threaded hole 251 may pass through the peripheral wall of the sleeve ring body in a first direction. The first direction is horizontal and perpendicular to the axis of the horizontal segment 11. The direction of the sleeve ring body opposite to the first direction is the second direction. The mounting protrusion may be provided on the outer peripheral wall of the sleeve ring body in the second direction and protrude away from the first direction relative to the outer peripheral wall of the sleeve ring body. The mounting groove 34, the receiving groove 35, the limiting hole 36 and the first welding groove may be arranged in the mounting protrusion in a sequential manner from top to bottom.

[0069] Optionally, the support member 23 may include a connecting column and a support plate. The bottom of the connecting column is provided with a second connecting threaded hole 231, and the support plate is provided on the top of the connecting column for contacting the outer peripheral wall of the clamping ring body to support the fastening clamp 25, so that the support member 23 supports the horizontal section 11 by supporting the fastening clamp 25.

[0070] Figure 1 and Figure 2As shown, this embodiment of the invention also provides a semiconductor device, including a semiconductor reaction chamber and a temperature measuring device, as shown in the adjustment and fixing device 2 provided in this embodiment of the invention. The semiconductor reaction chamber includes a chamber body 41 and a support base 42. The chamber body 41 is disposed on the support base 42. The temperature measuring device includes a horizontal section 11 and a vertical section 12 connected to the horizontal section 11. The horizontal section 11 penetrates the support base 42 and extends from the outside of the support base 42 into the interior of the chamber body 41. The vertical section 12 is located inside the semiconductor reaction chamber and extends from the bottom to the top of the semiconductor reaction chamber. The adjustment and fixing device 2 is disposed on the support base 42 and is located inside the semiconductor reaction chamber. It cooperates with the portion of the temperature measuring device located inside the semiconductor reaction chamber and is used to adjust the verticality of the temperature measuring device.

[0071] The semiconductor device provided in this embodiment of the invention, by cooperating the temperature measuring device adjustment and fixing device 2 provided in this embodiment of the invention with the part of the temperature measuring device located in the semiconductor reaction chamber, can adjust the verticality of the temperature measuring device by means of the temperature measuring device adjustment and fixing device 2 provided in this embodiment of the invention, thereby improving the stability of the device, thereby improving the accuracy of temperature measurement, and further improving the accuracy of temperature control, thus improving the semiconductor process results.

[0072] Optionally, the semiconductor equipment provided in this embodiment of the invention can be a semiconductor vertical furnace.

[0073] In summary, the temperature measuring device adjustment and fixing device 2 and the semiconductor equipment provided in the embodiments of the present invention can improve the stability of the equipment, thereby improving the accuracy of temperature measurement, and further improving the accuracy of temperature control, thus improving the semiconductor process results.

[0074] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An adjustment and fixing device for a temperature measuring device, the temperature measuring device comprising a horizontal section and a vertical section connected to the horizontal section, the horizontal section penetrating a semiconductor reaction chamber and extending from the outside of the semiconductor reaction chamber to its interior, the vertical section being located within the semiconductor reaction chamber and extending from the bottom to the top of the semiconductor reaction chamber, characterized in that, The adjustment and fixing device includes a fixed support assembly and a first adjustment assembly. The fixed support assembly is disposed within the semiconductor reaction chamber, and the first adjustment assembly is disposed on the fixed support assembly and cooperates with the portion of the horizontal section located within the semiconductor reaction chamber. It is used to adjust the verticality of the vertical section by adjusting the horizontality of the horizontal section. The adjustment and fixing device further includes a second adjustment component, which is disposed on the fixed support component and cooperates with the portion of the horizontal section located inside the semiconductor reaction chamber. The second adjustment component is used to adjust the verticality of the vertical section by rotating the horizontal section about its axis.

2. The adjusting and fixing device of the temperature measuring device according to claim 1, characterized in that, The fixed support assembly includes a fixed component and a load-bearing component. The fixed component is fixedly disposed within the semiconductor reaction chamber, and the load-bearing component is connected to the fixed component. The first adjustment component is disposed on the load-bearing component.

3. The adjustment and fixing device of the temperature measuring device according to claim 2, characterized in that, The first adjustment component includes a support member and a first adjustment component. The support member is used to support the horizontal segment. The first adjustment component is connected to the support member and is vertically and vertically mounted on the bearing member. It is used to adjust the levelness of the horizontal segment by adjusting the lifting of the support member.

4. The adjustment and fixing device of the temperature measuring device according to claim 3, characterized in that, The first adjusting component includes an adjusting bolt, the bearing component is provided with a first adjusting threaded hole, the adjusting bolt passes through the first adjusting threaded hole and is threadedly engaged with the first adjusting threaded hole, and one end of the adjusting bolt is connected to the support component.

5. The adjusting and fixing device of the temperature measuring device according to claim 3, characterized in that, The second adjustment component is disposed on the bearing component.

6. The adjusting and fixing device of the temperature measuring device according to claim 5, characterized in that, The second adjustment assembly includes a fastening component, a second adjustment component, and a third adjustment component. The fastening component is used to fasten to the horizontal segment. The second adjustment component is connected to the bearing component and the fastening component, and is used to adjust the horizontal segment by rotating it in a first rotational direction with the axis of the horizontal segment as the axis. The third adjustment component is connected to the bearing component and the fastening component, and is used to adjust the horizontal segment by rotating it in a second rotational direction opposite to the first rotational direction with the axis of the horizontal segment as the axis.

7. The adjusting and fixing device of the temperature measuring device according to claim 6, characterized in that, The fastening component includes a fastening sleeve and a fastening screw. The fastening sleeve is used to fit onto the horizontal section. The fastening sleeve is provided with a fastening threaded hole. The axis of the fastening threaded hole is perpendicular to the axis of the horizontal section. The fastening screw passes through the fastening threaded hole and is threaded into the fastening threaded hole. One end of the fastening screw is used to abut against the horizontal section to fasten the horizontal section.

8. The adjusting and fixing device of the temperature measuring device according to claim 7, characterized in that, The second adjusting component includes a tension spring and a connector, and the third adjusting component includes an adjusting screw, a top rod, and a top cover. The connector is connected to the bearing component. The axis of the tension spring is perpendicular to the axis of the horizontal section and the axis of the fastening threaded hole, respectively. The two ends of the tension spring are connected to the fastening sleeve and the connector, respectively. The tension spring is used to drive the fastening sleeve to rotate in the first rotation direction by its own elastic force, so as to adjust the horizontal section by rotating in the first rotation direction. The connector is provided with a second adjusting threaded hole, the axis of which is parallel to the axis of the tension spring. The adjusting screw passes through the second adjusting threaded hole, extends into the tension spring, and is threadedly engaged with the second adjusting threaded hole. The fastening sleeve is provided with a receiving groove, the axis of which is parallel to the axis of the second adjusting threaded hole. One end of the push rod is received in the receiving groove, and the other end passes through the receiving groove, extends into the tension spring, and is connected to one end of the adjusting screw. The top cover is placed on the receiving groove. The end of the push rod received in the receiving groove is used to lift the top cover to drive the fastening sleeve to rotate in the second rotation direction, thereby adjusting the horizontal section in the second rotation direction.

9. The adjusting and fixing device of the temperature measuring device according to claim 8, characterized in that, The connector is provided with a boss, and the bearing component is provided with a plug interface for the connector to be inserted, and the plug interface is provided with a groove for the boss to slide into.

10. The adjusting and fixing device of the temperature measuring device according to claim 8, characterized in that, One end of the top rod is provided with a ball head, the fastening sleeve is provided with a mounting groove, the axis of the mounting groove is parallel to the axis of the receiving groove, the inner peripheral wall of the mounting groove is provided with an internal mounting thread, the outer peripheral wall of the top cover is provided with an external mounting thread, the top cover is installed in the mounting groove and is threadedly connected to the internal mounting thread through the external mounting thread; The bottom of the mounting groove is provided with the receiving groove, which is used to receive the ball head. The bottom of the receiving groove is provided with a limiting hole. The diameter of the limiting hole is smaller than the radial dimension of the ball head and larger than the radial dimension of the push rod, so as to allow the push rod to pass through and to confine the ball head within the receiving groove.

11. The adjusting and fixing device of the temperature measuring device according to claim 7, characterized in that, The support member supports the horizontal section by supporting the fastening sleeve, and the friction between the support member and the fastening sleeve ensures that the fastening sleeve cannot move relative to the support member under the action of the pressure difference between the inside and outside of the semiconductor reaction chamber.

12. A semiconductor device, comprising a semiconductor reaction chamber and a temperature measuring device, wherein, The semiconductor reaction chamber includes a chamber body and a support base. The chamber body is disposed on the support base. The temperature measuring device includes a horizontal section and a vertical section connected to the horizontal section. The horizontal section penetrates the support base and extends from the outside of the support base into the interior of the chamber body. The vertical section is located inside the semiconductor reaction chamber and extends from the bottom to the top of the semiconductor reaction chamber. The semiconductor device further includes an adjustment and fixing device as described in any one of claims 1-11. The adjustment and fixing device is disposed on the support base and located inside the semiconductor reaction chamber, and cooperates with the portion of the temperature measuring device located inside the semiconductor reaction chamber for adjusting the verticality of the temperature measuring device.

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