High speed connector

Abstract

An electrical connector for use with ultra-high speed signals including signals at 112 Gbps or higher. Shielding effects through signal paths of the mating electrical connector can be enhanced through the use of one or more techniques including the implementation of double-sided shielding, connections between shielding members and between shielding members and ground structures of a printed circuit board on which the connector is mounted, and selective positioning of lossy materials. The techniques can be implemented simply and reliably in high-density connectors using one or more techniques. The electrical connector can include a core member held by a housing and a leadframe assembly attached to the core member. The core member can include features that are difficult to mold in the housing and can include shielding and lossy materials in locations that are difficult to incorporate in the leadframe assembly.

Description

[0001] Related applications

[0002] This patent application claims priority and benefit to U.S. Provisional Patent Application No. 62 / 966,528, filed January 27, 2020, entitled "HIGH SPEED CONNECTOR," the entire contents of which are incorporated herein by reference. This patent application also claims priority and benefit to U.S. Provisional Patent Application No. 63 / 076,692, filed September 10, 2020, entitled "HIGH SPEED CONNECTOR," the entire contents of which are incorporated herein by reference. Technical Field

[0003] This patent application generally relates to interconnection systems for interconnecting electronic components, such as those that include electrical connectors. Background Technology

[0004] Electrical connectors are used in many electronic systems. It is generally easier and more cost-effective to manufacture a system as separate electronic components (such as printed circuit boards (“PCBs”) that can be connected together using electrical connectors. One known arrangement for connecting several PCBs is to use one PCB as a backplane. Other PCBs, referred to as “daughters” or “daughter cards”, can be connected through this backplane.

[0005] One known backplane is a printed circuit board on which numerous connectors are mounted. Conductive traces in the backplane can be electrically connected to signal conductors in the connectors, enabling signal routing between the connectors. Daughter cards can also have connectors mounted on them. Connectors mounted on the daughter cards can be plugged into connectors mounted on the backplane. In this way, signals can be routed between the daughter cards via the backplane. Daughter cards can be plugged into the backplane at right angles. Therefore, connectors for these applications may include right-angle bends and are commonly referred to as "right-angle connectors."

[0006] In other system configurations, signals can be routed between parallel boards stacked on top of each other. Connectors used in these applications are often referred to as "stack connectors" or "mezzanine connectors." In still other configurations, orthogonal boards can be aligned edge-to-edge. Connectors used in these applications are often referred to as "direct-fit orthogonal connectors." In yet another system configuration, cables can be terminated to connectors, sometimes called cable connectors. Cable connectors can be plugged into connectors mounted on a printed circuit board, allowing signals routed through the system via cables to be connected to components on that printed circuit board.

[0007] Regardless of the specific application, electrical connector design has been adapted to reflect trends in the electronics industry. Electronic systems are generally becoming smaller, faster, and more functionally complex. Due to these changes, the number of circuits in a given area of ​​an electronic system and the frequency of circuit operation have increased significantly in recent years. Current systems transmit more data between printed circuit boards and require electrical connectors that are electrically capable of processing more data at speeds greater than, and even greater than, those used just a few years ago.

[0008] In high-density, high-speed connectors, electrical conductors can be very close to each other, potentially leading to electrical interference between adjacent signal conductors. To reduce interference and to otherwise provide the desired electrical characteristics, shielding is typically placed between or around adjacent signal conductors. Shielding prevents signals carried on one conductor from causing "crosstalk" to another conductor. Shielding can also affect the impedance of each conductor, which can further contribute to the desired electrical characteristics.

[0009] Other techniques can be used to control connector performance. For example, differential signal transmission can also reduce crosstalk. Differential signals are carried on a pair of conductive paths, called a "differential pair." The voltage difference between the conductive paths represents the signal. Typically, differential pairs are designed to have preferential coupling between the pair of conductive paths. For example, the two conductive paths of a differential pair can be arranged to extend closer to each other than adjacent signal paths in the connector. Shielding is not desired between the conductive paths of the pair, but shielding can be used between the differential pairs. Electrical connectors can be designed for both differential and single-ended signals.

[0010] In interconnect systems, connectors are attached to printed circuit boards (PCBs). Typically, PCBs are formed as multilayer assemblies made of stacks of dielectric sheets (sometimes referred to as "prepregs"). Some or all of the dielectric sheets may have conductive films on one or both surfaces. Some of the conductive films may be patterned using lithography or laser printing techniques to form conductive traces, which are used to establish interconnections between components mounted to the PCB. Other conductive films may remain substantially intact and may be used as ground or power planes to supply reference potentials. The dielectric sheets can be formed into a single board structure by heating the stacked dielectric sheets and pressing them together.

[0011] To establish an electrical connection to a conductive trace or a ground / power plane, holes can be drilled through the printed circuit board. These holes, or "vias," are filled or plated with metal so that the vias are electrically connected to one or more of the conductive traces or the planes through which the vias pass.

[0012] To attach a connector to a printed circuit board, the contact "tail" from the connector can be inserted into a via or attached to the conductive pads of the via on the surface of the printed circuit board. Summary of the Invention

[0013] Examples of high-speed, high-density interconnect systems are described.

[0014] Some embodiments relate to sub-assemblies for electrical connectors. The sub-assemblies include: a leadframe assembly comprising a leadframe housing and a plurality of conductive elements held by the leadframe housing and arranged in a row, each conductive element including a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end; and a core member comprising a body and a mating portion extending from the body, the body and the mating portion comprising an insulating material, the mating portion further comprising a dissipative material. A first portion of the plurality of conductive elements is configured as a ground conductor, and a second portion of the plurality of conductive elements is configured as a signal conductor. The leadframe assembly is attached to a first side of the core member such that the conductive elements configured as ground conductors are coupled to each other through the dissipative material.

[0015] Some embodiments relate to an electrical connector. The connector includes: a plurality of leadframe assemblies, each leadframe assembly including a row of conductive elements held by an insulating material, each conductive element including a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end; a plurality of core members, at least one of the plurality of leadframe assemblies being attached to each of the plurality of core members; and a housing including a first outer wall and a second outer wall opposite the first inner wall, and a plurality of inner walls extending between the first outer wall and the second outer wall. The plurality of core members are inserted into the housing such that the inner walls are between the leadframe assemblies of adjacent core members to which the plurality of core members are attached.

[0016] Some embodiments relate to a method of manufacturing an electrical connector. The method includes: molding a connector housing in a mold having a first open / close direction, such that the housing includes at least one opening extending through the housing in a first direction parallel to the first open / close direction; molding a plurality of core members in a mold having a second open / close direction, such that each of the plurality of core members includes a body and features extending from the body in a second direction parallel to the second open / close direction; attaching one or more leadframe assemblies to the core members among the plurality of core members, such that contact portions of lead portions of the one or more leadframe assemblies are adjacent to features of the core members; and inserting at least a portion of the plurality of core members and the contact portions of the lead portions of the attached leadframe assemblies into the at least one opening in the housing, such that the second direction is orthogonal to the first direction.

[0017] Some embodiments relate to an electrical connector. The connector includes: a housing comprising a first portion and a second portion, the second portion including a mating surface of the housing; and at least one conductive element held by the first portion of the housing, the at least one conductive element including a cantilevered mating end extending from the first portion of the housing toward the mating surface. The mating end includes a convex surface facing away from the housing and a distal end inclined toward the housing. The second portion of the housing includes a protrusion between the distal end and the mating surface.

[0018] Some embodiments relate to a method of operating a first electrical connector to mate it with a second electrical connector. The method includes: moving the first electrical connector relative to the second electrical connector in a mating direction such that a plurality of first conductive elements of the first electrical connector are aligned with a plurality of second conductive elements of the second electrical connector in a direction perpendicular to the mating direction. The movement sequentially includes: engaging a convex surface of a mating portion of the plurality of first conductive elements with at least one member extending from the housing of the second connector in a direction perpendicular to the mating direction; riding the at least one member on the convex surface to a apex of the convex surface such that the mating portions of the plurality of first conductive elements deflect away from the mating portions of the plurality of second conductive elements in a direction perpendicular to the mating direction, and causing the distal ends of the plurality of first conductive elements to overlap with the distal ends of the plurality of second conductive elements in the mating direction by at least a predetermined amount; riding the at least one member on the surface of the mating portions of the plurality of first conductive elements past the apex of the convex surface such that the mating portions of the plurality of first conductive elements spring back toward the surfaces of the plurality of second conductive elements; and engaging the plurality of first conductive elements with corresponding conductive elements of the plurality of second conductive elements.

[0019] Some embodiments relate to an electrical connector. The connector includes: a leadframe assembly including a leadframe housing and a plurality of conductive elements held by the leadframe housing and disposed in a plane, each conductive element including a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end, the mounting end being arranged in a column extending in a column direction; a ground shield including a portion parallel to the plane and attached to the leadframe housing; and a plurality of shield interconnects extending from the ground shield, the plurality of shield interconnects being configured to be adjacent to and / or in contact with a ground plane on a surface of a board on which the electrical connector is mounted.

[0020] Some embodiments relate to an electrical connector. The connector includes: a housing; an organizer; and a plurality of leadframe assemblies held by the housing. Each leadframe assembly includes: a column of conductive elements held by an insulating material, each conductive element including a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end; a first shield including: a planar portion disposed on a first side of the column, and a plurality of shielding interconnects extending from the planar portion; and a second shield including: a planar portion disposed on a second side of the column opposite the first side of the column, such that the intermediate portion lies between the first shield and the second shield, and a plurality of shielding interconnects extending from the planar portion. The mounting ends of the conductive elements and the plurality of shielding interconnects of the first and second shields of the plurality of leadframe assemblies extend through the organizer to form a mounting interface of the electrical connector. Each of the plurality of shielding interconnects of the first and second shields includes a compressible member at the mounting interface.

[0021] Some embodiments relate to a sub-assembly for a cable connector. The sub-assembly includes: a lead frame assembly comprising a lead frame housing and a plurality of conductive elements held by the lead frame housing and arranged in a row, each conductive element including a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end, the mounting end of the plurality of conductive elements including a signal end and a ground end; a plurality of cables, each cable including a pair of wires and a cable shield disposed around the pair of wires, the pair of wires being attached to a corresponding signal end of the plurality of conductive elements; and a conductive shield including a first shield portion and a second shield portion. The first shield portion is attached to the second shield portion such that the ground ends of the plurality of conductive elements are electrically connected and mechanically connected between the first shield portion and the second shield portion. The plurality of cables pass through an opening in the conductive shield such that the conductive shield establishes an electrical connection with the cable shield of the plurality of cables.

[0022] Some embodiments relate to a sub-assembly for a cable connector, the sub-assembly comprising: a core member including a body and a mating portion extending from the body, the body and the mating portion comprising an insulating material, the mating portion further comprising a lossy material; a first lead frame assembly including a first lead frame housing and a plurality of first conductive elements held by the first lead frame housing and arranged in a first column, each conductive element including a mating end, a mounting end opposite to the mating end, and an intermediate portion extending between the mating end and the mounting end, the plurality of first conductive elements including a ground conductor and a signal conductor; and a plurality of first cables including wires terminating at the mounting end of the signal conductor among the plurality of first conductive elements. The system comprises: a first overmolded member covering a portion of the plurality of first cables and a portion of the first lead frame assembly; a second lead frame assembly including a second lead frame housing and a plurality of second conductive elements held by the second lead frame housing and arranged in a second column, each conductive element including a mating end, a mounting end opposite to the mating end, and an intermediate portion extending between the mating end and the mounting end, the plurality of second conductive elements including a ground conductor and a signal conductor; a plurality of second cables including wires terminating at the mounting end of the signal conductor among the plurality of second conductive elements; and a second overmolded member covering a portion of the plurality of second cables and a portion of the second lead frame assembly. The first lead frame assembly is attached to a first side of the core member such that the mating ends of the plurality of first conductive elements are adjacent to the mating portions of the core member. The second lead frame assembly is attached to a second side of the core member such that the mating ends of the plurality of second conductive elements are adjacent to the mating portions of the core member. The first overmolded part and the second overmolded part include complementary interlocking features.

[0023] Some embodiments relate to a cable connector comprising: a housing including a cavity and a plurality of walls surrounding the cavity; and a plurality of cable assemblies held within the cavity of the housing. Each cable assembly includes: a lead frame assembly including a lead frame housing and a plurality of conductive elements held by the lead frame housing and arranged in an array, each conductive element including a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end, the mounting end of the plurality of conductive elements including a signal end and a ground end; a plurality of cables, each cable including a pair of wires and a cable shield disposed around the pair of wires, the pair of wires being attached to a corresponding signal end of the plurality of conductive elements; and a conductive cover including a first cover portion and a second cover portion. The ground end of the plurality of conductive elements includes an aperture. The first cover portion and / or the second cover portion includes a post. The first cover portion is attached to the second cover portion such that the post extends through the aperture. The conductive cover includes a cavity between the first cover portion and the second cover portion, such that the attachment between the paired wires of the plurality of cables and the corresponding signal terminals of the plurality of conductive elements is disposed within the cavity.

[0024] Some embodiments relate to a connector assembly. The connector assembly includes: a lead frame housing; and a plurality of conductive elements held by the lead frame housing and arranged in a row, each conductive element including a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end. The plurality of conductive elements includes signal conductive elements and ground conductive elements, and the mounting end of the ground conductive element includes a flexible beam.

[0025] These techniques can be used alone or in any suitable combination. The foregoing description of the invention is provided by way of illustration only and is not intended to be limiting. Attached Figure Description

[0026] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component illustrated in the various views is indicated by similar reference numerals. For clarity, not every component is labeled in every view. In the accompanying drawings:

[0027] Figure 1A This is a perspective view of a plug connector that mates with a complementary right-angle connector according to some embodiments.

[0028] Figure 1B According to some embodiments Figure 1A A side view of two printed circuit boards electrically connected by a connector.

[0029] Figure 2A According to some embodiments Figure 1A A 3D view of a right-angle connector.

[0030] Figure 2B According to some embodiments Figure 2A Exploded view of the right-angle connector.

[0031] Figure 2C According to some embodiments Figure 2A A plan view of a right-angle connector, showing the mounting interface of the right-angle connector.

[0032] Figure 2D According to some embodiments, it is used for Figure 2C Top view of the complementary footprint of the right-angle connector.

[0033] Figure 2E According to some embodiments Figure 2A A perspective view of the organizer of the right-angle connector, showing the board mounting surface.

[0034] Figure 2F The organizer according to some embodiments is in Figure 2E An enlarged view of the portion within the circle marked "2F".

[0035] Figure 2G According to some embodiments Figure 2E A three-dimensional view of the organizer, showing the connector attachment surface.

[0036] Figure 2H The organizer according to some embodiments is in Figure 2G An enlarged view of the portion within the circle marked "2H".

[0037] Figure 3A According to some embodiments Figure 2A A perspective view of the top front side of the front housing of the right-angle connector.

[0038] Figure 3B According to some embodiments Figure 3A Top view of the front shell.

[0039] Figure 3C According to some embodiments Figure 3A Front view of the front shell.

[0040] Figure 3D According to some embodiments Figure 3A Rear view of the front shell.

[0041] Figure 3E According to some embodiments Figure 3A Side view of the front shell.

[0042] Figure 4A This is a perspective view of the core component according to some embodiments.

[0043] Figure 4B According to some embodiments Figure 4A Side view of the core component.

[0044] Figure 4C According to some embodiments Figure 4A A perspective view of the core component after the first injection of the consumable material and before the second injection of the insulating material.

[0045] Figure 4D This is a perspective view of the core component according to some embodiments.

[0046] Figure 4E According to some embodiments Figure 4D Side view of the core component.

[0047] Figure 4F According to some embodiments Figure 4D A perspective view of the core component after the first injection of the consumable material and before the second injection of the insulating material.

[0048] Figure 5A This is a perspective view of a dual insert molded lead frame assembly (IMLA) according to some embodiments.

[0049] Figure 5B According to some embodiments Figure 5A A top view of the dual IMLA assembly, showing the Type A and Type B IMLAs attached to opposite sides of the core component.

[0050] Figure 5C According to some embodiments Figure 5A A first side view of the dual IMLA assembly, showing the type A IMLA attached to the first side.

[0051] Figure 5D According to some embodiments Figure 5A The second side view of the dual IMLA assembly shows the Type B IMLA attached to the second side.

[0052] Figure 5E According to some embodiments Figure 5A A partially cut-out front view of the dual IMLA components.

[0053] Figure 5F It is according to some embodiments along Figure 5D The cross-sectional view of line PP in the figure shows the shielding of type A IMLA through... Figure 4AThe core components are connected to the shielding of the type B IMLA.

[0054] Figure 5G It is a dual IMLA component according to some embodiments. Figure 5F An enlarged view of the portion within the circle marked "B".

[0055] Figure 5H It is according to some embodiments along Figure 5D The cross-sectional view of line PP in the figure shows the shielding of type A IMLA through... Figure 4D The core components are connected to the shielding of the type B IMLA.

[0056] Figure 5I According to some embodiments Figure 5C A three-dimensional diagram of type A IMLA.

[0057] Figure 5J The installation interface of type A IMLA according to some embodiments is in Figure 5I An enlarged view of the portion within the circle marked "5J".

[0058] Figure 5K According to some embodiments Figure 5J A three-dimensional view of this part of type A IMLA.

[0059] Figure 5L According to some embodiments Figure 5J The A-type IMLA portion of the image is attached with a three-dimensional diagram of the tissue.

[0060] Figure 5M According to some embodiments Figure 5L A plan view of the A-type IMLA portion.

[0061] Figure 5N According to some embodiments Figure 5I An exploded view of a type A IMLA, in which the dielectric material has been removed.

[0062] Figure 5O According to some embodiments Figure 5N A partial cross-sectional view of type A IMLA.

[0063] Figure 5P According to some embodiments Figure 5I The floor plan of the Type A IMLA, in which the grounding plate has been removed.

[0064] Figure 5Q According to some embodiments Figure 2C The S-parameter graph of the connector compared to connectors with conventional mounting interfaces in the frequency range shows the S-parameters representing crosstalk from the nearest interference source within the row.

[0065] Figure 6A This is a perspective view of the side IMLA assembly according to some embodiments.

[0066] Figure 6B According to some embodiments Figure 6A A top view of the side IMLA assembly, showing a single Type A IMLA attached to one side of the core component.

[0067] Figure 6C According to some embodiments Figure 6A A side view of the side IMLA assembly, showing the side with the Type A IMLA attached.

[0068] Figure 6D It is according to some embodiments along Figure 6C A cross-sectional view of line MM in the diagram, which shows Figure 6A The mating end of the side IMLA component.

[0069] Figure 6E The side IMLA assembly according to some embodiments is in Figure 6D An enlarged view of the portion within the circle marked "A".

[0070] Figure 6F According to some embodiments Figure 6A A side view of the side IMLA assembly, showing one side of a row of IMLA assemblies at one end.

[0071] Figure 7A According to some embodiments Figure 1A A 3D view of the plug connector.

[0072] Figure 7B According to some embodiments Figure 7A An exploded view of the plug connector.

[0073] Figure 8A According to some embodiments Figure 7A A mating end view of the connector housing of the plug connector.

[0074] Figure 8B According to some embodiments Figure 8A The mounting end view of the connector housing.

[0075] Figure 9A According to some embodiments Figure 7A A perspective view of the dual IMLA assembly of the plug connector.

[0076] Figure 9B According to some embodiments Figure 9A Side view of the dual IMLA components.

[0077] Figure 9C According to some embodiments Figure 9A A partially cut-out mating end view of the dual IMLA components.

[0078] Figure 9D It is according to some embodiments along Figure 9B The cross-sectional view of line ZZ in the diagram.

[0079] Figure 10A According to some embodiments Figure 9A A three-dimensional view of the lead frame assembly of the dual IMLA component.

[0080] Figure 10B According to some embodiments Figure 10A A view of the lead frame assembly facing the core component.

[0081] Figure 10C According to some embodiments Figure 10A Side view of the lead frame component.

[0082] Figure 10D According to some embodiments Figure 10A A view of the lead frame assembly on the side away from the core component.

[0083] Figure 11A According to some embodiments Figure 1A A top-cut view of the mating connector.

[0084] Figure 11B It is based on the interface of some embodiments. Figure 11A An enlarged view of the portion within the circle marked "Y".

[0085] Figures 11C to 11F According to some embodiments Figure 1A An enlarged view of the mating interface of a connector during the successive steps of mating, illustrating one method of mating the connector.

[0086] Figure 11G According to some embodiments Figure 1A The mating connector along Figure 11A A magnified partial plan view of the line marked "11G".

[0087] Figure 12A This is a perspective view of a cable connector according to some embodiments.

[0088] Figure 12B According to some embodiments Figure 12A A partially exploded view of the cable connector.

[0089] Figure 13A This is a perspective view of a dual IMLA cable assembly according to some embodiments.

[0090] Figure 13B According to some embodiments Figure 13A An exploded view of the dual IMLA cable assembly.

[0091] Figure 14A According to some embodiments Figure 13A A 3D view of the Type A IMLA cable in a dual IMLA cable assembly.

[0092] Figure 14B According to some embodiments Figure 13A A 3D view of the B-type IMLA cable in a dual IMLA cable assembly.

[0093] Figure 14C According to some embodiments Figure 13A A 3D view of the Type A IMLA cable in a dual IMLA cable assembly.

[0094] Figure 14D According to some embodiments Figure 13A A 3D view of the B-type IMLA cable in a dual IMLA cable assembly.

[0095] Figure 15A According to some embodiments Figure 14A A 3D view of an IMLA type A cable without an IMLA housing.

[0096] Figure 15B According to some embodiments Figure 15A A 3D diagram of the IMLA type A cable without a hood.

[0097] Figure 15C According to some embodiments Figure 15B A 3D diagram of a Type A IMLA without cables.

[0098] Figure 15D According to some embodiments, the IMLA of type A cable is in Figure 15A An exploded view of the portion within the circle marked "16D".

[0099] Figure 15E It is according to some embodiments along Figure 15A The cross-sectional view of line 16E-16E in the diagram.

[0100] Figure 15F According to some embodiments Figure 14C A perspective view of the Type A cable IMLA without the IMLA housing, showing the side facing the core component.

[0101] Figure 15G According to some embodiments Figure 15F A 3D view of the IMLA of a Type A cable, showing the side away from the core component.

[0102] Figure 15H According to some embodiments Figure 15F An uncovered perspective view of the IMLA type A cable, showing the side facing the core component.

[0103] Figure 15I According to some embodiments Figure 15H A perspective view of the IMLA of a type A cable, showing the side away from the core component.

[0104] Figure 15J According to some embodiments Figure 15H A three-dimensional view of the IMLA Type A cable without the cable, showing the side facing the core component.

[0105] Figure 15K According to some embodiments Figure 15J A 3D view of the IMLA of a Type A cable, showing the side away from the core component.

[0106] Figure 15L and Figure 15M These are based on some embodiments Figure 15F The perspective view of components 1658A and 1658B of the cover shows the side of the component facing the cable accessory.

[0107] Figure 15N According to some embodiments Figure 15F A perspective view of a portion of the Type A cable IMLA cut along the line marked "15N-15N", showing tab 1662 in a deflected state.

[0108] Figure 15O According to some embodiments Figure 15J A perspective view of the IMLA type A cable without insulation and ground plane, showing the side facing the core component.

[0109] Figure 15P According to some embodiments Figure 15O A 3D view of the IMLA of a Type A cable, showing the side away from the core component.

[0110] Figure 16A This is a perspective view of the mounting interface of a right-angle connector according to some embodiments.

[0111] Figure 16B Based on some embodiments Figure 16A A magnified view of the area marked "X".

[0112] Figure 17A According to some embodiments Figure 16A A perspective view of the organizer assembly of the connector, including a compliant shield and an organizer.

[0113] Figure 17B According to some embodiments Figure 17A A three-dimensional view of the organizer without compliant shielding.

[0114] Figure 17C According to some embodiments Figure 17B A three-dimensional view of the first insulating part of the organizer.

[0115] Figure 17D According to some embodiments Figure 17B A three-dimensional view of the second destructive part of the organizer.

[0116] Figure 18 According to some embodiments Figure 17A A perspective view of the optional compliant shielding of the organizer components.

[0117] Figure 19A It is based on some embodiments having Figure 18 A perspective view of a portion of the mounting interface of a connector with compliant shielding.

[0118] Figure 19B Based on some embodiments Figure 19A A magnified end view of the area marked "W".

[0119] Figure 20A This is a plan view of a compliant shield with a compliant beam according to some embodiments.

[0120] Figure 20B According to some embodiments, when the compliant shield is located between the connector and the printed circuit board... Figure 20A A portion of the compliant shielding is shown in the cross-sectional view along line LL.

[0121] Figure 21A This is a plan view of an alternative embodiment of a compliant shield with an optional compliant beam design, according to some embodiments.

[0122] Figure 21B Based on some embodiments Figure 21A A magnified view of the area marked "V" in the middle.

[0123] Figure 22 This is a perspective view of an optional compliant shield according to some embodiments.

[0124] Figure 23AIt is based on some embodiments having Figure 22 A three-dimensional view of the mounting interface of the compliant shielding component and the insulating organizer.

[0125] Figure 23B It is according to some embodiments along Figure 23A The cross-sectional view of line II in the diagram. Detailed Implementation

[0126] The inventors have recognized and understood connector designs that enhance the performance of high-density interconnect systems, particularly connector designs that carry ultra-high frequency signals necessary to support high data rates. The connector designs can be simply constructed, using conventional molding processes for the connector housing, yet remain mechanically robust and can utilize PAM4 modulation to deliver the desired performance at very high frequencies to support high data rates (including 112 Gbps and higher).

[0127] As an example, the inventors have recognized and understood techniques for combining conductive shielding and dissipative materials in locations capable of operation at very high frequencies to support high data rates (e.g., at or above 112 Gbps). To effectively isolate signal conductors at very high frequencies, connectors can include conductive materials coupled to selectively positioned dissipative materials. The conductive material can provide effective shielding in the mating regions where two connectors mate. When two connectors mate, a mating interface shield can be provided between the mating portions of the conductive elements carrying individual signals. The mating interface shield of the connectors can overlap with the internal ground shield of the mating connectors and provide consistent shielding from the connector bodies to their mating interfaces, further reducing crosstalk.

[0128] The inventors have further recognized a technique for connecting a shield within a connector to the ground plane of a printed circuit board on which the connector is mounted to reduce resonance and improve the integrity of signals transmitted through the connector. The connection can be established via a mounting interface shield (which may be compressible). The mounting interface shield may include a compressible component at a selected discrete location. The compressible component may be configured to establish physical contact with the flooded ground plane of the PCB. In some embodiments, the mounting interface shield may be integrally formed with the connector's internal ground shield. As a specific example, the mounting interface shield suppresses resonance occurring at approximately 35 GHz, thereby increasing the connector's frequency range.

[0129] The inventors have also recognized techniques for reducing resonance and improving signal integrity transmitted through connectors with attached cables. These techniques may include connecting a shield within the connector to the shield of a cable attached to the connector. The connection may be achieved through a flexible structure extending from the connector's grounding contact and / or shield and configured to press directly or indirectly against the cable shield. Additionally or optionally, the technique may include features that reduce impedance discontinuities at the attachment point between the connector contacts and the cable conductors.

[0130] Connectors may include housing features configured to prevent mechanical root stubbing of the conductive elements of the connector with those of the conductive elements in the mating connector. Each connector may have protrusions that engage and deflect the ends of the conductive elements from the mating connector during the mating sequence. This deflection increases the spacing between the ends of the conductive elements to be mated, thereby reducing the risk of mechanical root stubbing of these ends, even if the position of these ends may change during the manufacture or use of the connector. Furthermore, this technique allows the ends to have only a short segment between the contact point and the distal end of the conductive element, providing only a short stub extending beyond the contact point. Since a stub can affect signal integrity at frequencies inversely proportional to its length, providing a stub ensures that any impact on signal integrity occurs at high frequencies, thereby providing a large operating frequency range for the connector.

[0131] The connector may include contact tails configured for stable and precise mounting to a printed circuit board with a high-density footprint. The connector may have ground contact tails positioned between groups of signal contact tails. The signal contact tails may have a smaller size than the ground contact tails. Benefits of this configuration include, for example, reduced parasitic capacitance, providing the desired impedance for signal vias within the printed circuit board, and reducing the connector footprint. Conversely, relatively large ground contact tails can assist in precise alignment of the contact tails with corresponding contact holes on the printed circuit board and in holding the connector to the printed circuit board with sufficient adhesion.

[0132] In some embodiments, the connector may include conductive elements held in rows as leadframe assemblies. The leadframe assemblies may be aligned in the row direction. The leadframe assemblies may be attached to the core members before insertion into the housing. The core members may include features that would be difficult to mold in the inner portions of the housing, including relatively fine features conventionally included at the mating interface of the connector. This design allows the housing to have substantially uniform walls without the complex and thin sections required by conventional connector housings to hold the mating portions of the conductive elements. This design also allows the use of materials that would not previously fill conventional housing molds including complex and thin geometries. Furthermore, this design allows the use of additional features that are practically impossible to achieve with front-to-back cores used in conventional connector molding, such as recesses extending in a direction perpendicular to the row and configured to protect the contact tips.

[0133] The core component may have a body portion and a top portion. The body portion of the leadframe assembly may be attached to the body portion of the core component. A row of contact portions of conductive elements extending from the body portion of the leadframe assembly may be parallel to the top portion of the core component. The top portion may be molded with fine features, including elongated edges parallel to the ends of the conductive elements, which would be difficult to reliably mold as part of the housing.

[0134] In some embodiments, high-frequency performance can be achieved by fully shielding two mating connectors, each of which can form a leadframe assembly attached to a core component. This shielding extends from the mounting interface of the first connector to a first circuit board on which the first connector is mounted, through the first connector, through the mating interface to the second connector, through the body of the second connector, and through the mounting interface of the second connector to a second circuit board on which the second connector is mounted. Shielding within the body portion of the leadframe assembly can be provided by a shield attached to the side of the leadframe assembly. At the mating interface, the shield can be inside the top portion of the core component.

[0135] The effectiveness of shielding can be increased by electrically connecting the shielding in the top portion of the core component to the shielding of the leadframe assembly. Furthermore, features for electrically coupling the shielding of the leadframe assembly to a ground plane on the surface of a printed circuit board on which a connector is mounted can be included. In some embodiments, this electrical coupling can be formed with forks extending toward the printed circuit board and selectively positioned in areas of high electromagnetic radiation.

[0136] For example, in some embodiments, each leadframe assembly may include a signal leadframe and at least one ground plane. In some embodiments, the leadframe may be clamped by two ground planes. The connector's mounting interface shield may be formed by compressible members extending from the ground planes. The signal leadframe may include a pair of signal conductive elements. The compressible members extending from the ground planes may be positioned in groups. Each group of compressible members may at least partially surround a pair of signal conductive elements.

[0137] Furthermore, the shield in the top portion of the core component can be electrically coupled to a grounded conductive element in the lead frame assembly. This coupling can be established using a lossy material that suppresses resonance that might otherwise occur due to the far end of the top shield being far from connections to other grounding structures.

[0138] In some embodiments, the central portion of the signal conductive element within the body of the leadframe assembly is shielded on both sides by leadframe assembly shielding, but the contact portion is only adjacent to one top shield within the top portion of the core member. However, double-sided shielding can be provided throughout the signal path by two mating connectors. At the mating interface, the mating contact portions of the two mating connectors are defined on each side by the top portion of the core member of one of the connectors. Thus, each contact portion is defined on both sides by top shielding, one from its respective connector and one from its mating connector. Providing shielding in the same configuration (such as double-sided shielding) throughout the signal path enables high-integrity signal interconnection by avoiding mode switching and other effects that could degrade signal integrity at transitions between shielding configurations.

[0139] Such shielding can be easily and reliably formed in each of the multiple regions of the interconnect system. In some embodiments, the core component can be formed using a two-stage injection molding process. In the first injection, a lossy material can be molded. In some embodiments, the lossy material can be selectively molded onto a conductive material. In the second injection, an insulating material can be used to selectively cover the molded lossy material.

[0140] The aforementioned technologies can be used alone or in any suitable combination.

[0141] exist Figure 1A and Figure 1B An exemplary embodiment of this connector is shown in the figure. Figure 1A and Figure 1B An electrical interconnection system 100 is depicted having a form that can be used in an electronic system. The electrical interconnection system 100 may include two mating connectors, which are shown herein as a right-angle connector 200 and a plug connector 700.

[0142] In the illustrated embodiment, the right-angle connector 200 is attached to the daughter card 102 at mounting interface 114 and mates with the plug connector 700 at mating interface 106. The plug connector 700 can be attached to the backplane 104 at mounting interface 108. At the mounting interface, conductive elements within the connector that serve as signal conductors can be connected to signal traces within the corresponding printed circuit board. At the mating interface, the conductive elements in each connector establish mechanical and electrical connections, such that the conductive traces in the daughter card 102 can be electrically connected to the conductive traces in the backplane 104 via the mating connectors. Similarly, conductive elements within each connector that serve as ground conductors can be connected, such that the grounding structure within the daughter card 102 can be similarly electrically connected to the grounding structure in the backplane 104.

[0143] To support connector mounting to a corresponding printed circuit board, right-angle connector 200 may include contact tails 110 configured to attach to daughter card 102. Plug connector 700 may include contact tails 112 configured to attach to backplane 104. In the illustrated embodiment, these contact tails form one end of a conductive element that passes through the mating connector. When the connector is mounted to the printed circuit board, these contact tails establish an electrical connection with a conductive structure within the printed circuit board that carries a signal or is connected to a reference potential. In the illustrated example, the contact tails are press-fit "eye-on-pin (EON)" contacts designed to press into vias in the printed circuit board, which can then connect to signal traces, ground planes, or other conductive structures within the printed circuit board. However, other forms of contact tails may also be used, such as surface-mount contacts or pressure contacts.

[0144] Figure 2A and Figure 2B Perspective and exploded views of a right-angle connector 200 according to some embodiments are depicted. The right-angle connector 200 can be formed from multiple sub-assemblies, which in this example are T-top assemblies aligned side-by-side in a row. The T-top assembly may include a core member 204 and at least one lead frame assembly 206 attached to the core member. As described in more detail below, these components can be individually configured for ease of manufacture and to provide high-frequency operation during assembly.

[0145] exist Figure 2B The example illustrates three types of T-shaped top assemblies. T-shaped top assembly 202A is located at the first end of the row, and T-shaped top assembly 202B is located at the second end of the row. Multiple third-type T-shaped top assemblies 202C are positioned within the row between T-shaped top assemblies 202A and 202B. The types of T-shaped top assemblies may differ in the number and configuration of the lead frame assemblies.

[0146] The lead frame assembly can hold a row of conductive elements forming signal conductors. In some embodiments, the signal conductors can be shaped and spaced to form single-ended signal conductors (e.g., Figure 2C (208A in the original text). In some embodiments, signal conductors may be formed in pairs and spaced to provide differential signal conductor pairs (e.g., ...). Figure 2C (Referring to 208B). In the illustrated embodiment, each column has four pairs of conductors and one single-ended conductor, but this configuration is exemplary, and other embodiments may have more or fewer pairs of conductors and more or fewer single-ended conductors.

[0147] The signal conductor array may include, or be defined by, conductive elements used as ground conductors (e.g., 212). It should be understood that the ground conductors are not necessarily connected to a ground, but are shaped to carry reference potentials, which may include ground, DC voltage, or other suitable reference potentials. The “ground” or “reference” conductors may have a different shape than the signal conductors, which are configured to provide suitable signal transmission characteristics for high-frequency signals.

[0148] In the illustrated embodiment, signal conductors within a column are grouped in pairs, and these paired signal conductors are positioned for edge coupling to support differential signals. In some embodiments, each pair may be adjacent to at least one ground conductor, and in some embodiments, each pair may be positioned between adjacent ground conductors. These ground conductors may be in the same column as the signal conductors.

[0149] In some embodiments, the T-top assembly may optionally or additionally include a ground conductor offset relative to the column of signal conductors in a row direction orthogonal to the column direction. This ground conductor may have planar regions that separate adjacent columns of signal conductors. This ground conductor can serve as an electromagnetic shield between columns of signal conductors.

[0150] The conductive element may be made of a metal or any other material that is conductive and provides suitable mechanical properties for the conductive element in the electrical connector. Phosphor bronze, beryllium copper, and other copper alloys are non-limiting examples of materials that may be used. The conductive element may be formed from these materials in any suitable manner, including by stamping and / or forming.

[0151] Insert-molded leadframe assemblies can be constructed by stamping conductive elements from a metal sheet. Bending portions and other features of the conductive elements can also be formed as part of the stamping operation or in a separate operation. For example, a row of signal conductors and ground conductors can be stamped from a metal sheet. During the stamping operation, portions of the metal sheet can be left to serve as connecting rods between the conductive elements, holding them in place. The conductive elements can be molded from plastic, which in this example is insulating and serves as part of the connector housing, holding the conductive elements in place. The connecting rods can then be cut off.

[0152] In some embodiments, the signal conductor and ground conductor of the leadframe are held stable by pinch pins. The pinch pins extend from the surface of the mold used in the insert molding operation. In a conventional insert molding operation, pinch pins from opposite sides of the mold clamp the signal conductor and ground conductor between them. This controls the position of the signal conductor and ground conductor relative to the insulating housing molded thereon. When the mold is opened and the IMLA is removed, holes remain in the insulating housing at the pinch pin locations (e.g., ...). Figure 5P (550 holes in the hole). For the completion of IMLA, these holes are generally considered non-functional because they are made using pins with a sufficiently small diameter so that they do not substantially affect the electrical properties of the signal conductor.

[0153] However, in some embodiments, the number of clamping pins that clamp each signal conductor can be selected to provide functional benefits. As a specific example, in conventional connectors, the number of clamping pins and the resulting number of clamping holes can be the same for each signal conductor in a pair of adjacent signal conductors. In some connectors (such as right-angle connectors), one of the signal conductors in a pair can be longer than the other. More clamping pins can be used for the longer signal conductor in each pair. More clamping pins result in more clamping holes and a lower effective dielectric constant of the housing along the length of the longer signal conductor compared to the length of the shorter signal conductor. This configuration can result in more clamping holes along the longer conductor than needed, but it can also reduce in-pair misalignment and otherwise improve connector performance.

[0154] In some embodiments, the conductive elements in different leadframe assemblies can be configured differently. In this example, two types of leadframe assemblies exist, differing only in the position of the signal conductor and ground conductor within the column, such that when the two types of leadframe assemblies are positioned side-by-side, the ground conductor in one leadframe assembly (e.g., type A IMLA206A) is adjacent to the signal conductor in the other leadframe assembly (e.g., type B IMLA206B). In the illustrated example, type A IMLA is positioned to the left of the core member (when viewing the connector from the angle of the mating interface). Type B IMLA is positioned to the right of the core member. This configuration reduces column-to-column crosstalk between leadframe assemblies.

[0155] In the illustrated embodiment, the right-angle connector 200 includes a single Type A IMLAT top assembly 202A at a first end of a row along which the T-top assembly 202 is aligned, a single Type B IMLAT top assembly 202B at a second end of the row opposite to the first end, and a plurality of double IMLAT top assemblies 202C between the first and second ends. The Type A IMLAT T-top assembly 202A has a single lead frame assembly 206A attached to the core member. The Type B IMLAT top assembly 202B has a single lead frame assembly 206B attached to the core member. Therefore, each of the Type A and Type B IMLAT top assemblies has a side not attached to the lead frame assembly. This configuration allows the open sides of the core members of the Type A and Type B IMLAT T-top assemblies 202A and 202B to be used as part of the connector housing.

[0156] The core component of the dual IMLA T-shaped top assembly 202C may have two lead frame assemblies attached to opposite sides of the core component, which are, in this case, type A IMLA and type B IMLA. In some embodiments, the conductive elements in the two lead frame assemblies may be configured to be identical.

[0157] One or more components can hold the T-shaped top assembly in a desired position. For example, support members 222 can be configured side-by-side to hold the top and rear of multiple T-shaped top assemblies respectively. Support members 222 can be formed from any suitable material, such as metal sheets stamped with tabs, openings, or other features that engage corresponding features on the respective T-shaped top assemblies. As another example, the support members can be molded from plastic and can hold other parts of the T-shaped top assembly and serve as part of a connector housing (such as the front housing 300).

[0158] Figure 2CA mounting interface 114 of a right-angle connector 200 according to some embodiments is depicted. The contact tails 110 of the connector 200 can be arranged in an array comprising a plurality of parallel columns 216 offset from each other in a row direction perpendicular to the column direction. The contact tails 110 of each column 216 may include ground contact tails 212 disposed between pairs of signal contacts 208B. In some embodiments, all or a portion of the signal contacts 208B may be manufactured thinner than the ground contacts. The thinner signal contacts provide the desired impedance. The ground contact tails 212 may be thicker to provide good mechanical strength.

[0159] In some embodiments, signal contacts are formed within the same lead frame by stamping a metal sheet into the desired shape. However, the signal contact can be made thinner than the ground contact by reducing the thickness of all or part of it (e.g., by embossing the signal contact). In some embodiments, the thickness of the signal contact can be between 75% and 95% of the thickness of the ground contact. In other embodiments, the thickness of the signal contact can be between 80% and 90% of the thickness of the ground contact.

[0160] In some embodiments, the middle portion of the signal contact may have the same thickness as the middle portion of the ground contact. However, the tail portion of the signal contact may have a reduced thickness. In embodiments where the tail portion of the signal contact is configured for press-fit mounting, this configuration allows the tail portion of the signal contact to fit into a relatively small hole. For example, a drill (such as a 0.35mm drill) with a diameter of 0.3mm to 0.4mm or 0.32mm to 0.37mm can be used to form the hole. The finished hole size may be 0.26mm + / - 10%. In contrast, the ground tail portion can be inserted into a larger hole. For example, a hole can be formed using a 0.4mm to 0.5mm drill (such as a 0.45mm drill), for example, with a finished diameter of 0.31mm to 0.41mm. The contact tail portion may be configured to have a width larger than the finished diameter of the corresponding hole into which it is inserted, and may be compressed to a width that is the same as or smaller than the finished hole diameter.

[0161] Forming contact tails with these dimensions can reduce parasitic capacitance between the signal conductor and the adjacent ground in components using such connectors, for example. Nevertheless, the grounding element provides sufficient attachment force to hold the connector on the printed circuit board to which it is mounted. Furthermore, by stamping the signal and grounding elements from the same metal sheet, even though they have different finish thicknesses, precise positioning of the signal tail relative to the grounding tail can be provided. As measured relative to the position of the grounding contact tail, the position of the signal contact tail can, for example, be within 0.1 mm or less of its designed position. This configuration simplifies connector attachment to the printed circuit board. A more robust grounding contact tail can be used to align the connector relative to the printed circuit board by engaging its corresponding hole. Subsequently, the signal contact tail will be fully aligned with its corresponding hole to enter the hole when the connector is pressed into the board with minimal risk of damage. Therefore, the connector can be installed using a simple tool that presses the connector perpendicularly relative to the printed circuit board, without the need for expensive accessories or other tools.

[0162] Ground contact tails and / or signal contact tails can be configured to support connector-to-printed circuit board mounting in this manner. As can be seen, for example in... Figure 5I In this embodiment, the ground contact tail can be longer than the signal contact tail. The ground contact can extend by an amount that allows it to enter its corresponding hole in the printed circuit board before the tip of the signal contact reaches a plane parallel to the surface of the printed circuit board. In the illustrated embodiment, the contact tail tapers towards the tip. In the illustrated embodiment, the body of the ground contact tail has a through opening that allows the tail to be compressed when inserted into the hole. The distal portion of the tail is elongated, making it narrower than the body and allowing easy access to the hole in the printed circuit board. The signal contact has a shorter, elongated portion at its distal end.

[0163] Connector 200 may include a mounting interface shielded interconnect 214 configured to establish an electrical connection between a ground conductor serving as a shield between signal conductor rows within the connector and a grounding structure within the PCB to which the connector is mounted, for at least high-frequency signals. The shielded interconnect 214 is adjacent to and / or in contact with the immersion ground plane of daughter card 102. In this example, the mounting interface shielded interconnect 214 includes a plurality of forks 520 configured to be adjacent to and / or in physical contact with the immersion ground plane of the daughter card.

[0164] The fork teeth 520 can be positioned to further reduce radiated emissions at the mounting interface 114. In some embodiments, the fork teeth 520 can be arranged as an array of columns 218. Adjacent columns 216 of the contact tail 110 can be separated by one or more columns 218 of the fork teeth 520 of the interface shielding interconnect 214. The fork teeth 520 may have a portion coplanar with the body of the ground conductor, which serves as a shield between columns within the connector. Therefore, a portion of the fork teeth 520 may be offset relative to the contact tail 110 in a row direction perpendicular to the column direction. Additionally, each fork tooth may include a portion bent outward from the plane toward the column of the signal conductor. This portion of the fork teeth 520 may be positioned between the ground contact tail 212 and the signal contact tail 208B.

[0165] In some embodiments, the mounting interface shielding interconnect 214 may be compressible. A compressible interconnect can generate a force that establishes reliable contact with a ground plane on a printed circuit board, for example, by generating contact force and / or ensuring contact despite positional tolerances of the connector relative to the surface of the printed circuit board. In some embodiments, some or all of the forks 214 may establish physical contact with the daughter card 102 when the connector 200 is mounted to the daughter card 102. Optionally or additionally, some or all of the forks 214 may capacitively couple to a ground plane on the daughter card 102 without physical contact, and / or a sufficient number of forks 214 may couple to the ground plane to achieve the desired effect.

[0166] In some embodiments, the mounting interface shielding interconnect 214 may extend from the inner shield of the connector 200 and may be integrally formed with the inner shield of the connector 200. In some embodiments, the mounting interface shielding interconnect 214 may be a compressible member (e.g., extending from the inner shield of the lead frame assembly 206) Figure 5I The compressible member 518 shown is formed, and / or may be a separate compressible component.

[0167] Figure 2D A top view of a occupancy area 230 for a right-angle connector 200 on daughter card 102 is depicted schematically according to some embodiments. Occupancy area 230 may include columns of occupancy area patterns 252 separated by routing channels 250. Occupancy area patterns 252 may be configured to receive mounting structures of leadframe assemblies (e.g., contact tail 110 and compressible member 518 of leadframe assembly 206).

[0168] The occupied area pattern 252 may include signal vias 240 aligned in column 254 and ground vias 242 aligned to column 254. Ground vias 242 may be configured to receive contact tails from ground conductive elements (e.g., 212). Signal vias 240 may be configured to receive contact tails from signal conductive elements (e.g., 208A, 208B). As shown, ground vias 242 may be larger than signal vias 240. When the connector is mounted to the board, the larger and more robust ground contact tail allows the connector to align with the larger ground via. This aligns the signal contact tail with the smaller signal via. This configuration can improve the economics of electronic components by enabling the use of conventional mounting methods (such as press-fit using flat-rock tooling) and eliminating the need for expensive special tools that would otherwise be necessary to mount the connector to the printed circuit board without damaging the thinner signal contact tail, which might otherwise be vulnerable.

[0169] Signal vias 240 can be positioned within corresponding anti-pads 246. The printed circuit board can have layers containing large conductive areas, interspersed with patterned layers having conductive traces. These traces can carry signals, and layers primarily composed of conductive material sheets can serve as ground. Anti-pads 246 can be formed as openings in a ground layer, ensuring that the conductive material of the PCB's ground layer is not connected to the signal vias. In some embodiments, differential pairs of signal conductive elements may share a single anti-pad.

[0170] Via pattern 252 may include a ground via 244 for mounting a compressible member 518 of interface shield interconnect 214. In some embodiments, the ground via 244 may be a shadow via configured to enhance the electrical connection between the internal shield of the connector and the PCB without receiving a ground contact tail. In some embodiments, the shadow via may be below and / or by the compressible member 518 (e.g., through the fork 520 of the compressible member 518). Figure 5K Compression. The size and position of the ground via 244 can be designed to provide sufficient space between the occupancy patterns 252 so that the trace 248 can extend in the routing channel 250. In some embodiments, the ground via 244 may be offset relative to the column 254. In some embodiments, the ground via 244 may be within the width of the antipad 246, such that the width of the antipad 246 defines the width of the row of occupancy patterns 252.

[0171] It should be understood that although some structures such as trace 248 are illustrated for some signal vias, this application is not limited in this respect. For example, each signal via may have a breakout such as trace 248.

[0172] Figure 2D Some structures that can be in a PCB are shown, including structures visible on the surface of the printed circuit board and structures that can be in the inner layers of the PCB. For example, anti-pad 246 can be formed in a ground plane on the surface of the printed circuit board, and / or can be formed in some or all of the ground planes in the inner layers of the PCB. Furthermore, even if formed on the surface of the PCB, the ground plane can still be covered by a solder mask or coating, making it invisible. Similarly, trace 248 can be on one or more inner layers.

[0173] Return to reference Figure 1B and Figure 2B The connector 200 may include an organizer 210 configured to hold contact tails 110 in an array. The organizer 210 may include a plurality of openings sized and arranged such that some or all of the contact tails 110 pass through the organizer 210. In some embodiments, the organizer 210 may be made of a rigid material and may facilitate alignment of the contact tails in a predetermined pattern. In some embodiments, when the connector is mounted to a printed circuit board, the organizer reduces the risk of damage to the contact tails by limiting variations in their position to the location of slots that can be reliably positioned.

[0174] The organizer can be used in conjunction with thin and / or narrow signal contact tails, as described elsewhere herein. In some embodiments, the organizer can be used in conjunction with a leadframe, wherein the ground contact tail location is used to position the leadframe relative to the printed circuit board. In the illustrated embodiment, the opening is elongated in the column direction. The size of the opening can be designed to provide greater restriction on the movement of the contact tail in the direction perpendicular to the column direction than in that column direction. The opening ensures that the contact tail is aligned with the opening in the printed circuit board in the direction perpendicular to the column direction. As described above, the alignment of the ground contact in the leadframe assembly with the hole in the printed circuit board enables the alignment of all contact tails in the leadframe assembly in the column direction. In combination, these two techniques provide precise alignment of the contact tail with the hole in the printed circuit board in two dimensions, thereby enabling the thin and narrow signal contact tail to be aligned with the corresponding small-diameter signal hole in the printed circuit board with low risk of damage.

[0175] In some embodiments, the organizer can reduce the air gap between the connector and the board, which can cause undesirable impedance changes along the length of the conductive element. The organizer can also reduce relative movement between the T-top assemblies 202. In some embodiments, the organizer 210 can be made of an insulating material and can support the contact tail 110 or retain the contact tail 110 to prevent it from shorting together when the connector is mounted to the printed circuit board. In some embodiments, the organizer 210 can include a dissipative material to reduce the degradation of signal integrity of signals transmitted through the connector's mounting interface. The dissipative material can be positioned to connect to or preferentially coupled to a grounded conductive element traveling from the connector to the board. In some embodiments, the dielectric constant of the organizer can be matched to the dielectric constant of the materials used in the front housing 300 and / or the core member 204 and / or the lead frame assembly 206.

[0176] exist Figure 1B In the illustrated embodiment, the organizer is configured to occupy the space between the surfaces of the T-top assembly 202 and the daughter card 102. To provide this functionality, for example, the organizer 210 may have a flat surface for mounting against the daughter card 102. The opposing surface facing the T-top assembly 202 may have a protrusion, which may have any other suitable profile to match the profile of the T-top assembly. In this way, the organizer 210 may facilitate a consistent impedance along the signal conductive elements entering the daughter card 102 via the connector 200. According to some embodiments, Figure 2E and Figure 2G This is a perspective view of the organizer 210 of the right-angle connector 200, which shows the board mounting surface and the connector attachment surface, respectively. Figure 2F and Figure 2H These are the organizers 210 in Figure 2E The circle marked "2F" and in Figure 2G An enlarged view of the portion within the circle marked "2H".

[0177] Organizer 210 may include a body 262 and an island 264 physically connected to the body 262 via a bridging member 266. The island 264 may include a slot 268 sized and positioned to allow a signal contact tail to pass through it. A slot 270 for allowing an interface shielding interconnect 214 to pass through it is formed between the body 262 and the island 264 and separated by the bridging member 266. The body 262 may include a slot 272 configured between adjacent islands to allow a ground contact tail to pass through it.

[0178] The front housing 300 can be configured to retain the mating area of ​​the T-shaped top assembly. Methods for assembling the right-angle connector 200 may include, for example... Figure 2B As shown, the T-shaped top assembly 206 is inserted into the front shell 300 from the rear side. Figures 3A to 3EViews of a front housing 300 according to some embodiments are depicted from various angles. The front housing 300 may include an inner wall 304 configured to separate adjacent T-shaped top assemblies and an outer wall 306 extending substantially perpendicular to the length of the inner wall and connecting the inner wall. The inner wall 304 may extend between an upper outer wall and a lower outer wall. The outer wall 306 may have alignment features 302 between adjacent inner walls. The alignment features 302 are paired and configured to engage mating features of the core components. The T-shaped top assembly 206 can be held in the front housing 300 by the alignment features 302, which allows the inner and outer walls to have substantially similar thicknesses and simplifies housing molding compared to conventional connectors that include thin inner walls and complex thin features to hold mating portions of conductive elements.

[0179] The front shell can be formed of a dielectric material such as plastic or nylon. Examples of suitable materials include, but are not limited to, liquid crystal polymer (LCP), polyphenylene sulfide (PPS), high-temperature nylon or polyphenylene oxide (PPO) or polypropylene (PP). Other suitable materials may be used, as aspects of this disclosure are not limited thereto.

[0180] Figures 4A to 4B A core component 204 according to some embodiments is depicted. In the illustrated embodiment, the core component 204 is made of three parts: a metal shield, a lossy material, and an insulating material. Figure 4C The intermediate state of the core component 204 according to some embodiments, after the first injection of the consumable material and before the second injection of the insulating material, is depicted.

[0181] In some embodiments, the core component 204 can be formed via a two-stage injection molding process. In the first injection, a dissipative material 402 can be selectively molded onto the T-shaped top interface shield 404. The dissipative material 402 can form ribs 406, which are configured to provide connections between grounding conductive elements by, for example, physical contact with grounding conductive elements in the lead frame assembly of the core component. Figure 5E As shown. In conventional connectors without core components, the housing is formed by molding insulating material, without thin features such as ribs 406 of the dissipative material. The dissipative material 402 may include slots 418 through which multiple portions of the interface shield 404 are exposed. This configuration allows the shield within the lead frame assembly to be connected to the interface shield 404, for example, by means of beams passing through slots 418.

[0182] In the second injection, insulating material 408 can be selectively molded onto the dissipative material 402 and the T-shaped top interface shield 404 to form the T-shaped top region 410 of the core component. The T-shaped top region 410 can be configured to hold mating portions of the conductive elements of the lead frame assembly. The insulating material of the T-shaped top region can provide isolation between the signal conductive elements of the lead frame assembly and provide mechanical support for the conductive elements by, for example, forming ribs 416.

[0183] In some embodiments, the injection of the consumable material 402 can be completed in multiple injections (e.g., two injections) to improve the reliability of filling the mold. Similarly, the injection of the insulating material 408 can be completed in multiple injections (e.g., two injections).

[0184] The components of the T-top assembly can be configured for simple and low-cost molding. In conventional connectors without a core component, the mating interface portion of the connector includes a housing molded to have walls between the mating contacts of the conductive elements designed for electrical isolation. Similarly, other fine details (such as a preload holder) can be molded into the housing to support proper connector operation when the IMLA is inserted into the housing.

[0185] The ease with which these features can be reliably molded depends at least in part on their size and shape, and their position relative to other features in the part to be molded. The shape of the molded part is defined by recesses and protrusions on the inner surfaces of mold halves, which are closed to enclose the cavity in which the molded part is formed. The part is formed by injecting molding material (such as molten plastic) into this cavity. During molding, the molding material is intended to flow through the entire cavity to fill it and produce a molded part in the shape of the cavity. Features formed in the mold cavity that are only accessible after the molding material has flowed through a relatively narrow passage are difficult to fill reliably because there may not be enough molding material flowing into these parts of the mold. This can be avoided by using higher pressure during molding or by creating more inlets in the mold cavity into which the molding material can be injected. However, these measures increase the complexity of the molding process and may still leave the risk of unacceptably defective parts.

[0186] Furthermore, it is desirable that during molding operations, when the mold half is opened, the molded part can be easily released from the mold. Features in the molded part formed by protrusions or recesses extending parallel to the direction of movement of the mold half when it is opened or closed can move without obstruction by the molded part when the mold is opened.

[0187] In contrast, the features formed by the orthogonal projections of the mold lead to increased complexity because these projections are located inside the opening or coring of the molded part at the end of the molding operation. These projections can be retracted from the mold to remove the molded part. Molding operations can be performed using retractable projections, but this increases the cost of the mold. Therefore, the cost and / or complexity of molding a connector housing can depend on the direction in which the coring extends into the molded part relative to the direction in which the coring moves relative to the half-mold during opening or closing.

[0188] The inventors have recognized and appreciated connector designs that simplify molding operations, reduce costs, and minimize manufacturing defects. In the illustrated embodiment, a combination of features in the front housing 300 and the core member 204 more easily forms the mating interface, both of which can be shaped to avoid filling the portion of the mold solely through the relatively long and narrow sections of the mold cavity.

[0189] For example, the front housing 300 includes a relatively large opening 312 for receiving the mating interface of the connector. The opening 312 is defined by walls with relatively few features, allowing for reliable filling of the portions formed by these walls of the mold during the molding operation. Furthermore, the housing 300 has the feature of being formed through protrusions in the mold, wherein the half-mold is perpendicular to... Figure 3C and Figure 3D The part moves in the direction of its top and bottom orientation. In a mold, the location where the part needs to be moved may rarely have a core-pulling mechanism (if one exists).

[0190] Several fine features can be formed in the core component 204, including features that support reliable operation of the connector. While these features (if formed in a conventional connector housing) would increase molding complexity or pose a risk of manufacturing defects if formed in a conventional connector housing, they can be reliably formed in a simple molding operation. For example, ribs 416 extending outward from the relatively large body portion 412 are easier to form than complex and thin sections within a conventional connector housing.

[0191] Nevertheless, rib 416 can extend long enough to provide isolation between mating contact portions of adjacent conductive elements, but rib 416 is not filled through a relatively long and narrow passage in the mold cavity.

[0192] Furthermore, these features are located on the open or closed outer surface of the part in the mold in a direction perpendicular to the surface of the body 412. For example, in Figure 4A Features such as ribs 416 and boundary portions 420, which are visible in the design, extend perpendicularly to the surface of the body 412. In this way, the use of moving parts can be reduced or eliminated in the mold.

[0193] Insulating material 408 may extend beyond the T-shaped top region 410 to form the body 412 of the core component. The IMLA may be attached to the body 412. The body 412 may include a retaining feature 414 configured to secure the lead frame assembly attached to the core component, such as a post fitted into a hole in the IMLA or a hole receiving a post from the IMLA.

[0194] The T-shaped top interface shield 404 can be made of metal or any other material that is fully or partially conductive and provides suitable mechanical properties for the shield in the electrical connector. Phosphor bronze, beryllium copper, and other copper alloys are non-limiting examples of materials that can be used. The interface shield can be formed from these materials in any suitable manner, including by stamping and / or forming.

[0195] In the illustrated embodiment, a dissipative material is overmolded onto the shield 404, and subsequently, a second insulating material is injection-molded onto the structure, thereby forming the insulating portion of both the T-shaped top region 410 and the body 412. When the IMLA is attached to the core member 204, the shield 404 is positioned adjacent to the mating contact portion of the conductive element of the IMLA. For the dual IMLA assembly 202C, the shield 404 is positioned between and therefore adjacent to the mating contact portions of the signal conductors of the two IMLAs attached to the core. Positioning the shield 404 adjacent to and parallel to the mating contact portions can reduce signal integrity degradation at the connector mating interface, for example, by reducing crosstalk from one column to the next and / or impedance changes along the length of the signal conductor at the mating interface. The dissipative material electrically coupled to the shield 404 can also reduce signal integrity degradation.

[0196] Any suitable lossy material can be used for the lossy material 402 of the T-shaped top region 410 and other "lossy" structures. Materials that are conductive but somewhat lossy, or materials that absorb electromagnetic energy in the relevant frequency range through another physical mechanism, are generally referred to herein as "lossy" materials. Electrically lossy materials can be formed from lossy dielectric materials and / or poorly conductive electrical materials and / or lossy magnetic materials. Magneticly lossy materials can be formed, for example, from materials conventionally considered ferromagnetic materials, such as those having a magnetic loss tangent greater than about 0.05 in the relevant frequency range. The "magnetic loss tangent" is the ratio of the imaginary part to the real part of the material's complex permittivity. Actual lossy magnetic materials or mixtures containing lossy magnetic materials may also exhibit a useful amount of dielectric loss or conductive loss effect in portions of the relevant frequency range. Electrically lossy materials can be formed from materials conventionally considered dielectric materials, such as those having an electrical loss tangent greater than about 0.05 in the relevant frequency range. The "loss tangent" is the ratio of the imaginary part to the real part of the complex permittivity of a material. Loss-prone materials can also be formed from materials generally considered conductors, but which are relatively weak conductors in the relevant frequency range. These materials contain sufficiently dispersed conductive particles or regions so that they do not provide high conductivity or are otherwise prepared to have this property: this property results in relatively weak bulk conductivity compared to good conductors such as pure copper in the relevant frequency range.

[0197] Electrically dissipative materials typically have a bulk conductivity of about 1 siemen / meter to about 10,000 siemens / meter, and preferably a bulk conductivity of about 1 siemen / meter to about 5,000 siemens / meter. In some embodiments, materials with a bulk conductivity between about 10 siemens / meter and about 200 siemens / meter can be used. As a specific example, a material with a conductivity of about 50 siemens / meter can be used. However, it should be understood that the conductivity of the material can be selected empirically or through electrical simulation using known simulation tools to determine an appropriate conductivity that provides suitable low crosstalk and suitable low signal path attenuation or insertion loss.

[0198] The dissipative material can be a partially conductive material, such as those having a surface resistivity between 1 Ω / square and 100,000 Ω / square. In some embodiments, the dissipative material has a surface resistivity between 10 Ω / square and 1,000 Ω / square. As a specific example, the material may have a surface resistivity between about 20 Ω / square and 80 Ω / square.

[0199] In some embodiments, the dissipative material is formed by adding a filler containing conductive particles to a binder. In such embodiments, the dissipative component can be formed by molding or otherwise shaping the binder and filler into a desired form. Examples of conductive particles that can be used as fillers to form the dissipative material include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles. Metals in the form of powders, flakes, fibers, or other particles can also be used to provide suitable dissipative properties. Alternatively, combinations of fillers can be used. For example, metal-plated carbon particles can be used. Silver and nickel are metal platings suitable for fibers. The plated particles can be used alone or in combination with other fillers such as carbon flakes. The binder or matrix can be any material that will solidify to position the filler, cure to position the filler, or can be otherwise used to position the filler. In some embodiments, the binder can be a thermoplastic material conventionally used in the manufacture of electrical connectors to facilitate molding the dissipative material into the desired shape and into the desired location as part of the manufacture of the electrical connector. Examples of such materials include liquid crystal polymers (LCPs) and nylon. However, many alternative forms of binder materials can be used. Curable materials such as epoxy resins can be used as binders. Alternatively, materials such as thermosetting resins or adhesives can be used.

[0200] While the aforementioned binder materials can be used to form electrically dissipative materials by forming a binder around conductive particulate fillers, the invention is not limited thereto. For example, conductive particles can be impregnated into or coated onto the formed matrix material, for example, by applying a conductive coating to a plastic or metal component. As used herein, the term "binder" includes materials that encapsulate fillers, impregnate fillers, or otherwise act as retaining fillers in a substrate.

[0201] Preferably, these fillers are present in a volume percentage sufficient to allow the formation of conductive paths from particle to particle. For example, when metal fibers are used, the fibers may be present in a volume percentage of about 3% to 30%. The amount of filler can affect the electrical conductivity of the material.

[0202] Filler materials are commercially available, such as those from Celanese under its trademark. Materials sold may be filled with carbon fiber or stainless steel filaments. Consumable materials, such as consumable conductive carbon filled with an adhesive preform, such as those sold by Techfilm of Billerica, Massachusetts, USA, may also be used. This preform may include an epoxy resin binder filled with carbon fiber and / or other carbon particles. The binder surrounds the carbon particles as a reinforcing structure of the preform. This preform may be inserted into a connector wafer to form all or part of a housing. In some embodiments, the preform may be adhered by an adhesive in the preform, which may be cured in a heat treatment process. In some embodiments, the adhesive may be in the form of a separate conductive or non-conductive adhesive layer. In some embodiments, optionally or additionally, the adhesive in the preform may be used to attach one or more conductive elements, such as foil strips, to the consumable material.

[0203] Various forms of reinforcing fibers (woven or non-woven) can be used, either coated or uncoated. Non-woven carbon fiber is a suitable material. Other suitable materials can be used, such as custom blends sold by RTP Corporation, as this application is not limited thereto.

[0204] In some embodiments, the consumable portion can be manufactured by stamping a preform or sheet of consumable material. For example, the consumable portion can be formed by stamping a preform as described above using a suitable opening pattern. However, other materials can be used instead of or in addition to this preform. For example, a sheet of ferromagnetic material can be used.

[0205] However, the dissipative portion can also be formed in other ways. In some embodiments, the dissipative portion can be formed from an interleaved layer of a dissipative material and a conductive material (such as a metal foil). These layers can be rigidly attached to each other, for example, by using epoxy resin or other adhesives, or can be held together by any other suitable means. These layers can have a desired shape before being fixed together, or can be stamped or otherwise shaped after they are held together. As a further alternative, the dissipative portion can be formed by coating plastic or other insulating materials with a dissipative coating (such as a diffused metal coating).

[0206] Figures 4D to 4F Another embodiment of the core component is depicted. Figure 4D This is a three-dimensional view of core component 432. Figure 4E This is a side view of the core component 432. Figure 4FThis is a perspective view of the core component 432 after the first injection of the dissipative material and before the second injection of the insulating material. The core component 432 may include a T-shaped top interface shield 434 having through holes 440, dissipative material 436 selectively molded onto the T-shaped top interface shield 434, and insulating material 442 molded onto the exposed portions of the T-shaped top interface shield 434 and forming a body 450. Multiple portions of the dissipative material 436 may be spaced apart by gaps 438, through which the T-shaped top interface shield 434 may be exposed. The insulating material 442 may be molded onto the exposed areas of the T-shaped top interface shield 434, filling the through holes 440 and forming ribs 444. The insulating material 442 may fill the gaps 438 between the multiple portions of the dissipative material 436 to provide mechanical strength between the body 450 of the core component and the T-shaped top interface shield 434. Figure 4B Similar to the body 412 shown, the body 450 may include a retaining feature 446A for a type A IMLA and a retaining feature 446B for a type B IMLA. Additionally, the body 450 may include an opening 448, the size and position of which may be determined according to the opening 452 of the shield 502 (see, for example, [reference needed]). Figure 5N The design incorporates an opening 448 that allows for electrical connection between the shields 502 of the type A and type B IMLAs attached to the core component 432. These connections can be established through the opening, whether fully or partially conductive. For example, the opening can be filled with a dissipative material. As another example, conductive fingers from the shield 502 can pass through the opening. This configuration can reduce, for example, crosstalk between IMLAs.

[0207] Figures 5A to 5D A dual IMLA assembly 202C according to some embodiments is depicted. The dual IMLA assembly 202C may include a core member 204. A type A IMLA 206A may be attached to one side of the core member 204. A type B IMLA 206B may be attached to the other side of the core member 204. Each IMLA may include a row of conductive elements respectively shaped and positioned for signal and ground. In the illustrated example, the ground conductive elements are wider than the signal conductive elements. The mating contact portion of the ground conductive element may include an opening 530 shaped and positioned to provide a mating force close to the mating force of the mating contact portion of the signal conductive element. Ribs 406 of the dissipative material 402 of the core member 204 may be positioned such that when the IMLA is attached to the core member, the ground conductive elements of the IMLA are electrically coupled to the dissipative material 402 through the ribs 406. In some operating states, the ground conductive elements may be pressed against the ribs 406 and / or may be close enough to be capacitively coupled to the ribs 406.

[0208] The T-shaped top interface shield 404 of the core component 204 may include an extension 510. The extension 510 may extend beyond the mating surface 536 of the IMLA, allowing the extension 510 of the interface shield 404 to extend into the mating connector. This configuration allows the interface shield 404 to overlap with the internal shield of the mating connector, such as... Figures 11A to 11B As shown in the exemplary embodiment, an insulating material 408 can be used to cover the extension 510 of the interface shield 404 with a thickness t1, which may be less than the thickness t2 of the insulating material covering the body of the T-shaped top region 410. In some embodiments, the thickness t1 may be less than 20%, less than 15%, or less than 10% of the thickness t2.

[0209] In addition to extending the ground reference provided by the shield 404 through the mating interface, the relatively thin extension 510 can contribute to the mechanical robustness of the interconnect system. This configuration allows the extension 510 of the interface shield to be inserted into a mating slot in the housing of the mating connector, which can be formed with minimal impact on the mechanical structure of the mating connector housing. In the illustrated embodiment, the mating connector has a similar mating interface. Therefore, connector 200 ( Figure 3A The front housing 300 of the diagram illustrates certain features also present in mating connectors (e.g., plug connector 700). One such feature is a slot 310 configured to receive the extension 510 at the distal end of the T-shaped top region.

[0210] If the core component 204 does not have such an extension 510, but instead has a substantially uniform thickness at the distal end in, for example, a rectangular shape, the receiving housing wall of the mating connector will be shortened to accommodate the extension 510, which will reduce the robustness of the mechanical structure of the connector housing.

[0211] Figure 5E A partially cut-away front view of a dual IMLA assembly 202C according to some embodiments is depicted. As can be seen in the cut-away section, ribs 406 of the dissipative material 402 extend toward a specific number of mating contact portions in each column. These mating contact portions may have grounded conductive elements. Here, the dissipative material 402 is shown occupying a continuous volume, but in other embodiments, the dissipative material may be located in discontinuous regions. For example, the dissipative material 402 on one side of the shield 404 may be substantially disconnected from the dissipative material 402 on the other side of the shield.

[0212] Figure 5F Depicting along according to some embodiments Figure 5D A cross-sectional view of the line PP in the diagram, showing the A-type IMLA through the core component 204 ( Figure 4A Coupled to type B IMLA. Figure 5F As shown in the illustrated embodiment, each IMLA has a shield 502, which is parallel to the middle portion of the conductive element that serves as a signal conductor or ground conductor through the IMLA. A shield 404 is parallel to the mating contact portion of the conductive element. Shields 404 and 502 are electrically connected.

[0213] Figure 5G The following are illustrations based on some embodiments. Figure 5F The enlarged view of the circle marked "B" shows the features used to connect shields 404 and 502. This area includes the opening 422 in the lossy portion of the core member 204 (see also...). Figure 4C Multiple portions of shield 404 are exposed through these openings 422. The exposed portions of shield 404 include features that connect to shield 502. Here, these features are slots 418. Shield 502 may be stamped from a sheet of metal and may be stamped with a structure such as beam 506, which can be inserted into slot 418 when the IMLA is pressed onto the core member 204 to electrically connect shield 404 and 502.

[0214] Figure 5H Depicting along according to some embodiments Figure 5D A cross-sectional view of the line PP in the diagram, showing the A-type IMLA through the core component 432 ( Figure 4D Coupled to a type B IMLA. As shown in the figure, in some embodiments, the T-top can be configured without the T-top shielding slot 418. Omitting the slot 418 allows the connector to have a smaller pitch, such as less than 3 mm, and may be, for example, about 2 mm.

[0215] In some embodiments, features for connecting the shielding element can also be simply formed. For example, opening 422 extends in a direction perpendicular to the surface of the body portion 412 and can be molded without a molded movable portion. Furthermore, a preloading feature 512 is shown, which also extends in a direction perpendicular to the surface of the body portion 412.

[0216] Similarly, the core component 204 may be molded with an opening 508. When the IMLA is mounted to the core component 204, the opening 508 can be configured to receive a beam end of a conductive element. The opening 508 allows the beam end to bend when mated with a mating connector.

[0217] In some embodiments, the core member 204 may include a preload feature 512 configured to preload a conductive element of a mating connector. The preload feature may be positioned distal to the end 532 of the conductive element beyond the IMLA. In this configuration, the preload feature may contact the conductive element before the conductive element of the mating connector reaches the end 532. For example, in mating... Figure 5F When the first connector of the IMLA assembly is coupled to a second connector having a similar mating interface, the preload feature 512 of the first connector can engage the end 532 of the second connector and press it into the opening 508. Therefore, the end 532 of the second connector is pressed out of the path of the first connector, reducing the possibility of short circuits. When the mating interfaces of the first and second connectors are similar, the preload feature 512 of the second connector presses the end 532 of the first connector out of the path of the second connector.

[0218] Figure 5F The preload feature shown differs from the preload holder in conventional connectors, where the beam end of the conductive element is constrained in a partially deflected state by the same connector's preload feature. For example, this design could involve a preload holder resting on a portion of the beam end. In this configuration, a portion of the end extends sufficiently onto the preload holder to be reliably held in place.

[0219] This configuration requires a segment of the conductive element between the convex contraction point of each conductive element and its farthest end. This segment of the conductive element is outside the desired signal path and can constitute an unterminated stub, which can adversely affect the integrity of the signal propagating along the conductive element. The frequency of this effect can be negatively correlated with the length of the stub, making shortening the stub necessary for high-frequency connector operation. Unterminated stubs on grounding conductive elements can similarly affect signal integrity.

[0220] However, in the illustrated embodiment, the end of the conductive element is unrestricted. The section between the convex taper 536 and the distal end of the end 532 does not need to be long enough to engage the preload holder. This design reduces the length of the conductive element's end without increasing the risk of short circuits during mating. In some embodiments, the distance between the convex contact location and the end of the conductive element can be in the range of 0.02 mm to 2 mm and can be any suitable value therebetween, or in the range of 0.1 mm to 1 mm and can be any suitable value therebetween, or less than 0.3 mm, or less than 0.2 mm, or less than 0.1 mm. (Refer to...) Figures 11A to 11F A method is described for operating connectors with this preloaded feature to make them mate with each other.

[0221] Forming these features as part of the core component allows for connector miniaturization because these features will have dimensions proportional to the size of the conductive elements and the spacing between them. However, because these features are formed within the core component, rather than as a thin and complex geometry integrally formed with the front housing 300, they can be formed more reliably. These features can be used in high-speed, high-density connectors where the signal conductive elements are spaced (center-to-center) less than 2 mm, or less than 1 mm, or in some embodiments less than 0.75 mm, such as any suitable value in the range of 0.5 mm to 1.0 mm or between. Pairs of signal conductive elements may be spaced (center-to-center) less than 6 mm, or less than 3 mm, or in some embodiments less than 1.5 mm, such as any suitable value in the range of 1.5 mm to 3.0 mm or between.

[0222] In some embodiments, the lead frame assembly may include an IMLA shield 502 extending parallel to a row of conductive elements 504. The IMLA shield 502 may include a beam 506 extending in a direction substantially perpendicular to the plane along which the IMLA shield extends. The beam 506 may be inserted into an opening 422 and contact a portion of the T-shaped top interface shield 404, such as by insertion into a shielding slot 418. In the illustrated example, the IMLA shield 502 of a type A IMLA is electrically coupled to the IMLA shield of a type B IMLA via the lossy material 402 of the core member 204 and the interface shield 404.

[0223] Figure 5I This is a perspective view of a Type A IMLA 206A according to some embodiments. In the illustrated example, the Type A IMLA 206A includes a lead frame 514 sandwiched between ground planes 502A and 502B. Before attaching ground planes 502A and 502B, the molded lead frame 514 may be selectively covered with a dielectric material 546. Figure 5N This is an exploded view of type A IMLA 206A with dielectric material 546 removed according to some embodiments. Figure 5O According to some embodiments Figure 5N A cross-sectional view of a portion of the A-type IMLA 206A. Figure 5P This is a plan view of type A IMLA 206A according to some embodiments, wherein ground planes 502A and 502B are removed and dielectric material 546 is shown.

[0224] Leadframe 514 may include a row of signal conductive elements. These signal conductive elements may include single-ended signal conductive elements 208A and differential signal pairs 208B, which may be separated by ground conductive elements 212. In some embodiments, conductive element 208A may be used for purposes other than transmitting differential signals, including transmitting, for example, low-speed or low-frequency signals, power, ground, or any suitable signal.

[0225] The shielding surrounding the differential signal pair 208B can be formed by a grounding conductive element together with ground planes 502A and 502B. As shown, the grounding conductive element 212 may be wider than the signal conductive elements 208A and 208B. The grounding conductive element 212 may include an opening 212H. In some embodiments, an insulating material may be selectively molded into the lead frame 514, which may substantially cover the middle portion of the signal conductive element. Ground planes 502A and 502B may be attached to the covered lead frame 514.

[0226] In some embodiments, the lead frame may include a dissipative material that contacts and electrically connects the ground plane and the ground conductor. In some embodiments, the dissipative material may extend through an opening 212H in the ground conductor and / or through openings 452 in the ground planes 502A and 502B to establish electrical contact. In some embodiments, this configuration may be achieved by a second injection molding of the dissipative material after attaching the ground plane. For example, the dissipative material may fill at least a portion of the opening 212H through the openings 452 of the ground planes 502A and 502B to electrically connect the ground conductive element 212 to the ground planes 502A and 502B and seal any gaps between them caused by the overmolding of the insulated lead frame. The opening 212H of the ground conductive element 212 and the openings 452 of the ground planes 502A and 502B may be shaped to increase the tolerance for filling the dissipative material. For example, as Figure 5N As shown, the opening 212H of the grounding conductive element 212 can have an elongated shape compared to the generally circular opening 452. Optionally or additionally, a dissipative material can be molded onto the lead frame assembly to form a hub at the surface. Ground planes 502A, 502B can be attached by pressing the hub through the opening 452.

[0227] Ground planes 502A and 502B can provide shielding for the middle portion of the conductive element on both sides. Ground plane 502A can be configured to face the core member 204, for example, including features attached to the core member 204. Ground plane 502B can be configured to face away from the core member 204. The shielding provided by ground planes 502A and 502B can be connected to the shielding provided by the interface shielding interconnect 214 and the mating interface shielding provided by the T-top attached to the lead frame and another T-top of the mating connector, for example, as... Figure 11B As shown. This configuration achieves high-frequency performance by implementing shielding over the entire range of the two mating connectors.

[0228] The ground plane and / or dielectric portion may include an opening configured to receive a retaining feature (e.g., retaining feature 414) of the core component. It should be understood that although the Type B IMLA 206B has a different configuration of signal conductors and ground conductors than the Type A IMLA, it may also be similarly configured to have a ground plane and retaining feature similar to the Type A IMLA 206A.

[0229] Each type of IMLA may include a structure that connects a ground plane to a grounding structure on a printed circuit board to which a connector having formed the IMLA is mounted. For example, type A IMLA 206A may include a compressible member 518 that can form a mounting interface shielded interconnect 214. Figure 2C The shielded interconnect comprises multiple parts. In some embodiments, the compressible member 518 may be integrally formed with the ground planes 502A and 502B. For example, the compressible member 518 may be formed by stamping and bending a metal sheet forming the ground plane. The integrally formed shielded interconnect simplifies the manufacturing process and reduces manufacturing costs.

[0230] In some embodiments, the shielded interconnect 214 can be configured to support a small connector footprint. For example, the shielded interconnect can be designed to deform upon pressing against the surface of a printed circuit board to generate a relatively small reaction force. The reaction force can be small enough that the press-fit contact tail (e.g.) Figure 5I (As shown) the connector can be adequately held against the reaction force. This configuration reduces the connector footprint because it eliminates the need for retaining features such as screws.

[0231] exist Figures 5J to 5M An enlarged view of the shielded interconnect 214 implemented using a compressible member 518 is shown in the figure. Figure 5J and Figure 5K The A-type IMLA206A according to some embodiments is depicted in Figure 5I An enlarged stereoscopic view of part 516 within the circle marked "5J". Figure 5L and Figure 5M Perspective and plan views of the portion 516 of the type A IMLA206A with the attached tissue 210 are depicted, respectively. The portion 516 of the type A IMLA206A with the attached tissue 210 is also... Figure 2C It is shown inside the circle marked "5L". Figure 5K and Figure 5L A view taken at the neck of the contact tail is shown. A compliant portion may exist on the distal side of the contact tail. Figure 5JThe section shown is the needle eye portion. However, the contact tail portion can be configured in any way other than the needle eye press-fit portion.

[0232] The shielded interconnect 214 can fill the space between the connector and the board, and provide a current path between the board's ground plane and the connector's internal ground structure, such as a ground plane. In some embodiments, a pair of differential signal conductive elements (e.g., 208B) can be partially surrounded by the shielded interconnect 214, which extends from the ground plane holding the lead frame with the pair. The contact tails of the pair can be separated from the shielded interconnect 214 by the dielectric material of the organizer 210.

[0233] In some embodiments, the shielded interconnect 214 may include a body 562 extending from the edge of the IMLA shield. One or more gaps 528 may be cut into the body 562 to create a cantilevered compressible member 518. The distal portion of the compressible member 518 may be formed with forks 520. When the connector is pushed onto the plate, the forks 520 may establish physical contact with the plate, resulting in deflection of the compressible member 518. The compressible member 518 is cantilevered and may be used as a compliant beam in some embodiments. However, in the illustrated embodiment, the deflection of the compressible member 518 produces a relatively low spring force. In this embodiment, the gap 528 includes an enlarged opening 568 at the base of the compressible member 518, which is configured to reduce the spring force by making the compressible member 518 easier to deflect and / or deform. The low spring force prevents the forks from springing back upon contact with the plate, thus preventing the connector from being pushed away from the plate. In some embodiments, the resulting spring force per fork may be in the range of 0.1N to 10N or any suitable value between. The compressible member may or may not make physical contact with the plate. In some embodiments, the compressible member may be adjacent to the plate, which can provide sufficient coupling to suppress emission at the mounting interface.

[0234] In some embodiments, the body 562 and the compressible member 518 may include an in-column portion 522 extending from a ground plane (e.g., 502A or 502B), a distal portion 526 substantially perpendicular to the in-column portion 522, and a transition portion 524 between the in-column portion 522 and the distal portion 526. This configuration allows shielded interconnects 214 extending from two adjacent shields to cooperate to at least partially surround the contact tails of a pair of signal conductive elements. For example, as shown, four shielded interconnects 214 may surround a pair of signal conductive elements, with two shielded interconnects 214 extending on each side of the signal conductive element at each IMLA, and one shielded interconnect 214 on each side of the pair of signal conductive elements.

[0235] exist Figure 5L In the example shown, gaps exist between the shielded interconnects. For example, a gap 542 exists between the distal portions 526 of the shielded interconnects 214 on opposite sides of a pair of signal conductors. A gap 544 also exists between the column portions 522 of the shielded interconnects 214 on the same side of a pair of signal conductors. The bridging element 266 of the organizer 210 may at least partially occupy gaps 542 and 544. Nevertheless, within the desired operating range of the connector (such as up to 112 Gbps or higher using PAM4 modulation), the illustrated configuration effectively reduces resonance in the connector's grounding structure.

[0236] In some embodiments, the fork teeth 520 on the compressible member 518 can be selectively positioned to more effectively suppress resonance. Since the fork teeth 520 provide a path for high-frequency ground return current to flow to or from the ground plane of the PCB, they provide a reference / reference for electromagnetic waves. In the illustrated example, the fork teeth 520 and thus the reference position are positioned at a location with a higher electromagnetic field around the pair of signal conductors, surrounded by the shielded interconnect 214 portion. In the illustrated example, the electromagnetic field around the tails of the pair of signal conductors is strongest between the pairs in the column, but offset by an angle α relative to the center line 216 of the column, where angle α is in the range of 5 to 30 degrees or 5 to 15 degrees, or any suitable number in between. Therefore, the fork teeth 520 positioned at this location relative to the tails of each pair of signal conductors effectively reduce resonance and improve signal integrity.

[0237] In the illustrated example, the fork tooth 520 extends from the distal portion 526. It should be understood that this disclosure is not limited to the illustrated position of the fork tooth 520. In some embodiments, the fork tooth 520 may be positioned, for example, extending from the inner column portion 522 or the transition portion 524. It should also be understood that this disclosure is not limited to the illustrated number of fork teeth 520. Differential signal pairs may be surrounded by four fork teeth 520 as shown, or in some embodiments by more than four fork teeth, or in some embodiments by fewer than four fork teeth. Furthermore, it should be understood that not all fork teeth need to establish physical contact with the ground plane of the mounting plate. For example, depending on the actual surface topology of the mounting plate, the fork teeth may establish physical contact with the mounting plate, or may not establish physical contact with the mounting plate. For example, the fork tooth 520 may be positioned with… Figure 2D The grounding via 244 establishes a physical or capacitive contact.

[0238] Type B IMLAs can similarly have compressible components positioned relative to paired signal conductors, such as... Figure 5J and Figure 5K As shown. However, the configuration within the column can differ between Type A IMLA and Type B IMLA.

[0239] Figure 5Q Simulation results for the S-parameters over the frequency range are shown. The S-parameters represent crosstalk from the nearest interference source within the column. According to some embodiments, the simulation results show S-parameter result 552 for connector 200 with a mounting interface shielded interconnect 214 (compared to S-parameter result 554 for a corresponding connector with a conventional mounting interface). As shown, connector 200 significantly reduces crosstalk while maintaining insertion loss and return loss. In some cases, the operating range of the connector can be set by the magnitude of the S-parameters, which vary with frequency. The operating frequency range can be defined, for example, the frequency range in which the S-parameters are greater than or less than a certain threshold amount. As a specific example, the operating frequency range can be based on S-parameters with values ​​less than -30 dB. Figure 5P In the example, trace 552 shows an operating frequency range exceeding 50 GHz, which is an improvement over the conventional connector represented by trace 554, which has an operating frequency range of less than 45 GHz.

[0240] Figures 6A to 6F A side IMLA assembly 202A according to some embodiments is depicted. The side IMLA assembly 202A may include a core member 204A. For example... Figure 6C As shown, one side of the core component 204 can be attached to type A IMLA 206A. As... Figure 6F As shown, the other side of the core member 204A can form part of the insulating shell of the connector. The core member 204A can be shaped on the side receiving the IMLA 206A in the same manner as the core member 204 described above. The opposite side, which does not need to include the features of the receiving IMLA, can be flat.

[0241] Figure 6D A partial cross-sectional front view of a side IMLA assembly 202A according to some embodiments is depicted. Figure 6D The diagram shows the positioning of the mating contact portion of the dissipative material 402A with rib 406 adjacent to the grounding conductor. The shield 404 is also adjacent to and parallel to the mating contact portion, as shown in... Figure 5E The lossy material 402A beneath the ground conductor electrically connects the ground conductor to the shield 404, and thus reduces crosstalk between pairs of signal conductors spaced apart by the ground conductor.

[0242] Figure 6E Depicting according to some embodiments in Figure 6DAn enlarged view of the circle marked "A" in the image. Although the side IMLA assembly 600 is shown attached to a type A IMLA 206A, it should be understood that the side IMLA assembly can be configured to receive a type B IMLA 206B. Like the core member 204A, the core member for this type B IMLA may have IMLA-receiving features on one side and may be flat or otherwise configured as the outer wall of a connector on the other side. The core member for the type B IMLA assembly differs from core member 204A in that it is configured to receive a type B IMLA with a different conductive element configuration on the side opposite to the type A core member. For example, insulation and conductive ribs may be on this opposite side, as may the preload feature 512.

[0243] Right-angle connectors can be used with plug connectors. Figure 7A and Figure 7B Perspective and exploded views of a plug connector 700 according to some embodiments are depicted. The plug connector 700 may include a row of double IMLA T-shaped top assemblies 702 aligned in a housing 800. The T-shaped top assemblies 702 may include a core member 704 attached to at least one lead frame assembly 706. The plug connector 700 may include an organizer 710 attached to its mounting end.

[0244] Although the plug connector is vertical, rather than perpendicular like connector 200, similar construction techniques can be applied. For example, the lead frame assembly can be formed by molding insulating material above the column and attaching the lead frame assembly shield. These assemblies can be attached to the core components, which are then inserted into the housing to form the connector.

[0245] The mating interface can be configured to complement the mating interface of connector 200. In this embodiment, the IMLA assembly of plug connector 700 is fitted between a type A side IMLA assembly and a type B side IMLA assembly, such that plug connector 700 does not have a separate side IMLA assembly forming the side of plug connector 700. Accordingly, in the illustrated embodiment, all IMLA assemblies of plug connector 700 are dual-sided IMLA assemblies.

[0246] Figure 8A and Figure 8B Mating end view and mounting end view of housing 800 according to some embodiments are depicted respectively. Housing 800 may include mating key 802 configured to be inserted into a mating slot in a mating connector housing, the mating slot being, for example, a mating keyway 308 of housing 300. Figure 3BThe housing 800 may include a wall 804 configured to separate adjacent T-top assemblies 702 and provide isolation and mechanical support. The wall 804 may include a slot (not shown) configured to receive the distal end of the T-top region 410 of the right-angle connector 200. The housing 800 may include a pair of members 806 and a pair of IMLA support features 810. Each pair of members 806 may include an alignment feature 808 configured for aligning and securing the T-top assemblies, and an IMLA support feature 810 configured to provide mechanical support for the lead frame assembly of the T-top assemblies. It should be understood that the housing 800 does not include the complex and thin features required for conventional connectors, and is therefore easier to manufacture. The housing 800 can be readily formed in a direction perpendicular to... Figure 8A and Figure 8B The mold is closed and opened in the direction of the surface shown. Fine features such as insulating and loss-resistance ribs, as well as preload features, can be formed in the T-shaped top portion of the core component, as described above.

[0247] In some embodiments, the dual IMLA assembly 702 of the plug connector 700 may include features similar to those of the dual IMLA assembly 202C of the right-angle connector 200. Figure 9A and Figure 9B A dual IMLA assembly 702 of a plug connector 700 according to some embodiments is depicted. Figure 9C A partially cutaway view of the mating end of a dual IMLA assembly 702 according to some embodiments is depicted. Figure 9D Depicting along according to some embodiments Figure 9B The cross-sectional view of line ZZ in the diagram.

[0248] The dual IMLA assembly 702 may include a core member 704 attached to two leadframe assemblies 706. Each leadframe assembly 706 may include a plurality of conductive elements 910 aligned in a row. The core member 704 may include a T-shaped top interface shield 904, a dissipative material 902 selectively molded on the interface shield 904, and an insulating plastic 908 selectively molded on the dissipative material 902 and the interface shield 904. Although in Figure 9DThe diagram illustrates a gap 914 between two portions of an interface shield 904. It should be understood that the interface shield 904 can be a single, integral piece. The gap 914 can be a cross-sectional view of a hole cut from the shield, allowing other materials (e.g., dissipative material 902 and / or insulating material 908) to flow around the shield 904. The dissipative material 902 may include ribs 912 extending from the interface shield 904 toward a ground conductive element of the lead frame assembly, such that the ground conductive element is electrically connected to the interface shield via the dissipative material 902, which reduces resonance and otherwise improves signal integrity. Although the illustrated example shows only a dual IMLA assembly for a plug connector 700, the plug connector may include side IMLA assemblies, for example, configured similarly to the side IMLA assemblies 202A, 202B of the right-angle connector 200. This configuration would allow the plug to mate with a right-angle connector without side IMLA assemblies. In some embodiments, the IMLA assemblies on opposite sides of the core member may have conductive elements arranged in a sequence complementary to the mating right-angle connector. For example, the IMLA assemblies on opposite sides of the core component may include lead frames that are complementary to the lead frames of type A IMLA 206A and type B IMLA 206B, respectively.

[0249] Figure 10A A perspective view of a lead frame assembly 706 of a dual IMLA assembly 702 according to some embodiments is depicted. Figure 10B A plan view of one side of the lead frame assembly 706 facing the core member 704 according to some embodiments is depicted. Figure 10C A side view of a lead frame assembly 706 according to some embodiments is depicted. Figure 10D A plan view of the side of the lead frame assembly 706 away from the core member 704 according to some embodiments is depicted.

[0250] In some embodiments, the lead frame assembly 706 may be manufactured by the following steps: molding an insulating material 1004 onto the lead frame including columns 910 of conductive elements; attaching a ground plane 1002 to the molded side of the column of conductive elements 910 containing the insulating material 1004; and selectively molding a dissipative material rod 1006. The insulating material 1004 may include protrusions 1004B configured to aid alignment and support. The dissipative material rod may be configured to retain the ground plane 1002 and provide an electrical connection between the ground plane and the column of ground conductive elements while maintaining isolation from the column of signal conductive elements. In some embodiments, the dissipative material rod 1006 may include ribs or other protrusions extending toward the ground conductive element 1022.

[0251] In some embodiments, column 910 of conductive elements may include signal conductive elements (e.g., 1020) separated by ground conductive elements (e.g., 1022). The signal conductive elements may include a signal mating portion and a signal mounting tail. The ground conductive elements may be wider than the signal conductive elements and may include a ground mating portion 1010 and a ground mounting tail 1012.

[0252] In some embodiments, ground plane 1002 may include beam 1008, which is substantially perpendicular to the length of conductive element 910 and extends toward the core member to which lead frame assembly 706 is configured to attach. In some embodiments, beam 1008 may be positioned adjacent to signal conductive element 1020. In this configuration, the ground current path through the IMLA shield and the T-top shield is closer to and generally parallel to the signal conductive element, which can improve shielding effectiveness and enhance signal integrity. In some embodiments, ground plane 1002 may not include beam 1008, for example, as... Figure 9D As shown.

[0253] In some embodiments, the dissipative material rod 1006 may include retaining features such as a protrusion 1016 and an opening 1018. In some embodiments, the core member may include a protrusion and an opening to be inserted into the opening 1018 and to receive the protrusion 1016. In some embodiments, the core member may be configured such that the protrusion 1016 can pass through and be inserted into an opening of a complementary lead frame assembly attached to the same core member. For example, the protrusion 1016 may be configured to attach to an opening of a complementary lead frame assembly attached to the same core member. The opening 1018 may be configured to receive the protrusion of a complementary lead frame assembly attached to the same core member. These retaining features provide mechanical support to the dual IMLA assembly and also provide a current path between the grounding structures of the dual IMLA assembly.

[0254] Similar to the right-angle connector 200, the plug connector 700 may include a mounting interface shielding interconnect. The mounting interface shielding interconnect may be formed, for example, by a compressible member 1014 extending from the shield 1002. The compressible member 1014 may be configured similarly to the compressible member 518.

[0255] Figure 11A A partially cut-away top view of an electrical interconnection system 100 according to some embodiments is depicted. Figure 11B Depicting according to some embodiments in Figure 11A A magnified view of the circle marked "Y" in the middle.

[0256] In the illustrated example, the right-angle connector 200 mates with the plug connector 700 by forming an electrical connection at one or more contact locations 1104 between the conductive element 504 of the right-angle connector 200 and the conductive element 902 of the plug connector 400. Figure 11B A portion of the plug connector 700 and a portion of the right-angle connector 200 are shown in cross-section, where conductive elements from the respective connectors mate. The conductive elements can be signal conductive elements or ground conductive elements, as in the illustrated embodiment, both have the same profile in cross-section.

[0257] In this configuration, the mating portions of conductive elements 504 and 902 are shielded by the T-shaped top interface shield 404 of the core member 204 of the right-angle connector 200 and the T-shaped top interface shield 904 of the core member 704 of the plug connector 700. In this way, a shielding configuration with planar shields on both sides of the conductive elements is carried into the mating interface of the mating connectors. However, instead of providing double-sided shielding via the IML shield 502 or 1002 as for the middle portion of the conductive element within the IML insulation, double-sided shielding is provided by the mating contact portions of the two mating conductive elements being carried by the T-shaped top shields of the two T-shaped tops.

[0258] It should also be understood that when the connectors are mated, the T-shaped top interface shield 404 of the core member 204 of the right-angle connector 200 overlaps with the shield 1002 of the lead frame assembly 706 of the plug connector 700. When the connectors are mated, the T-shaped top interface shield 904 of the core member 704 of the plug connector 700 overlaps with the shield 1002 of the lead frame assembly 206 of the right-angle connector 200. The length of the overlap can be controlled by the length of the extension of the interface shield (e.g., the extension 510 of the T-shaped top interface shield 404). The extension 510 can have a thickness less than the rest of the core member, such that the extension 510 can be inserted into the mating opening of the mating connector. The T-shaped top interface shields 404 and 904 of the core components 204 and 704, as described above, not only provide shielding for the mating portion of the conductive elements at the mating interface 106, but also reduce shielding discontinuities caused by the change from the internal shields (e.g., shields 1002, 1102) of the lead frame assembly to the interface shields (e.g., T-shaped top interface shields 404, 904).

[0259] This document describes methods for manipulating connectors 200 and 700 to mate with each other according to some embodiments. This method allows conductive elements to have a short lead-in section between the contact point and the distal end, which enhances high-frequency performance. However, there may be a low risk of root breakage. Figures 11C to 11F Depicting Figure 1AAn enlarged view of the mating interface of two connectors or connectors in other configurations with similar mating interfaces. Figure 11G The interface along the curve is described. Figure 11A A magnified partial plan view of the line marked "11G". The conductive element may include a bent contact portion 1106 having a contact location on a convex surface. The contact portion 1106 extends from the middle of the conductive element and from the insulating portion of the IMLA into the opening 1110. For mating with another connector, the contact portion may press against the mating conductive element. An end 1108 may extend from the contact portion 1106. Figure 11G As shown, the mating paired signal conductive elements of connectors 200 and 700 may have mating ground conductive elements on their sides to block energy propagation through ground, thereby reducing crosstalk.

[0260] Figures 11C to 11F The mating sequence is illustrated using a shorter end 1108 than in conventional connectors. Unlike connectors where the mating portion of the conductive element can be held in place by features in the housing surrounding the conductive element, end 1108 is free and substantially fully exposed in the opening into which the mating conductive element 902 will be inserted. In conventional connectors, this configuration carries the risk of the conductive element's root breaking off during connector mating. However, root breakage of conductive elements 902 and 504 is avoided because features on the housing surrounding other conductive elements guide each conductive element out of the path of the others.

[0261] The method of operating connectors 200 and 700 can begin by placing the connectors together so that the mating conductive elements are aligned, such as... Figure 11C As shown. In this state, the conductive element 504 of the right-angle connector 200 and the conductive element 902 of the plug connector 700 can be in their respective stationary states and aligned with each other in the mating direction.

[0262] Connectors 200 and 700 can be pressed together further in the mating direction until they reach... Figure 11D The state shown is as follows. In this state, the conductive element 504 of the right-angle connector 200 has engaged with the preload feature 512B of the plug connector 700. To achieve this state, the angled lead portion 1108 slides along the tapered leading edge of the preload feature 512B. The preload feature 512B of the plug connector 700 deflects the conductive element 504 of the right-angle connector 200 from its rest state.

[0263] In this example, the two connectors have similar mating interface elements, and the conductive element 902 of the plug connector 700 has similarly engaged with the preload feature 512A of the right-angle connector 200. The preload feature 512A of the right-angle connector 200 deflects the conductive element 902 of the plug connector 700 from its rest state. As a result, conductive elements 902 and 504 have been deflected in opposite directions, increasing the distance between the farthest portions of their corresponding ends. This increased distance between the ends moves the two ends away from the centerline of the mating conductive elements, reducing the chance that manufacturing or positioning changes during mating will cause the roots of conductive elements 902 and 504 to break off. More specifically, when the connectors are pressed together, the tapered introduction portions of conductive elements 902 and 504 will ride along each other.

[0264] Connectors 200 and 700 can be pressed together further in the mating direction until they reach the desired position. Figure 11E The state shown. In this state, the conductive element 504 of the right-angle connector 200 and the conductive element 902 of the plug connector 400 have been disengaged from the preload features 512A and 512B and are in contact with each other. When each conductive element engages with the corresponding preload feature 512A or 512B, each conductive element is relative to... Figure 11D The state is further deflected. In this state, the convex contact surface of each conductive element presses against the contact surface of the mating conductive element (which may be flat).

[0265] Connectors 200 and 700 can be pressed together further in the mating direction until they reach... Figure 11F The state shown is as follows. In this state, the conductive element 504 of the right-angle connector 200 and the conductive element 902 of the plug connector 400 can be in a fully mated state and make contact with each other at positions 1104A and 1104B. Positions 1104A and 1104B can be located at the apex of the convex surface of the contact portion 1106. This configuration allows the connector to have a small scraping length for the contact portion (e.g., contact portion 1106) before reaching the corresponding contact positions (e.g., positions 1104A, 1104B), such as less than 2.5 mm, and for example, about 1.9 mm.

[0266] Each conductive element has unterminated portions 1108A and 1108B extending beyond their corresponding contact positions 1104A and 1104B, respectively. These unterminated portions can form short posts that support resonance. However, because the posts are short, this resonance can be above the connector's operating frequency range, such as above 35 GHz or above 56 GHz. The lengths of the unterminated portions 1108A and 1108B can have any suitable value in the range of 0.02 mm to 2 mm, or any suitable value in the range of 0.1 mm to 1 mm, or less than 0.8 mm, or less than 0.5 mm, or less than 0.1 mm.

[0267] The right-angle connector can be used with connectors in configurations other than plug 700, such as cable connectors. Figure 12A and Figure 12B Perspective views and partially exploded views of a cable connector 1300 according to some embodiments are depicted. The cable connector 1300 may include a dual IMLA cable assembly 1400 held by a housing 1302. The housing 1302 may include a cavity 1304 surrounded by a wall 1306. The cavity 1304 may be configured to hold a T-top cable assembly 1400. Figure 12B In the example shown, the dual IMLA cable assembly 1400 is inserted into the chamber 1304 from the back of the housing 1302. The wall 1306 of the housing 1302 may include features configured to retain the dual IMLA cable assembly 1400. The retaining features of the wall 1306 may be similar to features of the housing 800 for a plug connector, including, for example, mating keys, alignment features, and IMLA support features. In some embodiments, the housing 1302 of the cable connector 1300 may be configured to have an inner wall (e.g., Figure 8A The wall is 804) or there is no inner wall (e.g., Figure 8A (wall 804). The dual IMLA cable assembly 1400 may include an IMLA housing 1502 that separates adjacent dual IMLA cable assemblies 1400.

[0268] Like the plug 700, the housing 1302 may have only, or primarily, features that can be easily molded in a mold without moving parts. The housing 1302 may, for example, be molded in a mold that opens and closes along the front-rear direction of the housing 1302. Fine features such as ribs or other features separating adjacent conductive elements or aligning with individual conductive elements, and / or features having surfaces extending in a left-right direction perpendicular to the front-rear direction and / or core-pulling features, may be formed as part of components inserted into the housing. These components may include components that are easily molded in a mold that opens and closes along the lateral direction, such as the preload feature 512.

[0269] The housing 1302 may include an opening 1310 configured to receive a retainer 1308. The retainer 1308 may be configured to reliably hold the T-top cable assembly 1400 within the housing 1302. Because the housing 1302 can be molded without fine features perpendicular to the front-back direction as described above, the retainer 1308 can prevent the T-top cable assembly 1400 from sliding out of the housing 1302. The separately moldable retainer 1308 may include fine features such as a bevel 1314 and a compression rib 1312. The bevel 1314 may be located at selected one or more corners of the retainer 1308 such that after the T-top cable assembly 1400 is inserted, the retainer 1308 can be assembled into the housing 1302 in one orientation rather than the opposite direction. Keyed orientation allows the compression rib 1312 to bias the retainer 1308 and the dual IMLA cable assembly 1400 forward toward the mating interface.

[0270] Figure 13A and Figure 13B Perspective and exploded views of a dual IMLA cable assembly 1400 according to some embodiments are depicted. The dual IMLA cable assembly 1400 may include a core member 1402 attached to two cables IMLA 1404A and 1404B. Cables IMLA 1404A and 1404B may have conductive elements terminating the cables and a cover 1658 that provides and thus reduces crosstalk to the conductive elements. Strain-reducing overmolded parts 1502A and 1502B may be molded onto the portions of the cables terminating in each cable IMLA, thereby forming leadframe cable assemblies 1600A and 1600B, which, together with the core member 1402, form the dual IMLA cable assembly 1400.

[0271] In some embodiments, the core member 1402 of the cable connector 1300 may be configured similarly to the core member 704 of the plug connector 700. Figure 13B In the embodiments, IMLAs 1404A and 1404B can be configured identically, but when mounted on opposite sides of the core member 1402 such that the contact surfaces of the conductive elements face away from the core member, the IMLAs can have different conductive element sequences. In the illustrated example, IMLA 1404A has a wider ground conductive element at the first end of the dual IMLA assembly and a single-ended signal conductive element at the second end. For IMLA 1404B, the single-ended signal conductive element is at the first end, and the ground conductive element is at the second end. Therefore, the signal conductors on opposite sides of the dual IMLA assembly are offset in the column direction.

[0272] exist Figure 14C and Figure 14D The text describes the situation based on... Figures 13A to 13BThe illustrated embodiment shows a perspective view of the type A lead frame cable assembly 1600A and the type B lead frame cable assembly 1600B in the dual IMLA cable assembly 1400. According to another embodiment, Figure 14A and Figure 14B A perspective view of a type A leadframe cable assembly 1600A and a type B leadframe cable assembly 1600B is depicted. Although two embodiments are described herein, the features described with respect to these embodiments can be used alone or in any suitable combination.

[0273] Figures 14A to 14D The surface of the leadframe cable assembly mounted against the core member (not shown) is shown. Each leadframe cable assembly may include cable IMLA 1404A or 1404B terminating multiple cables 1606. In the illustrated embodiment, the multiple cables 1606 may be provided as unpushback biaxial cables, such that the signal conductor of each biaxial cable can terminate at the tail of a pair of signal conductive elements within the cable IMLA. In the illustrated embodiment, each cable IMLA may terminate as many biaxial cables as the number of pairs of signal conductive elements present in the IMLA.

[0274] Strain-relieving cable overmolding can be applied to each cable IMLA. In the illustrated example, overmolding 1502A or 1502B is applied to each of cables IMLA 1404A and 1404B. Strain-relieving overmolding 1502A and 1502B may include grommets (not shown) configured to apply appropriate pressure to cable 1606.

[0275] In the illustrated embodiment, overmolded parts 1502A and 1502B have complementary inner surfaces, but they are different to reduce the chance of assembly errors during cable connector assembly. Although the two leadframe cable assemblies 1600A and 1600B are made from cable IMLAs that can be efficiently formed using the same tools, once terminated and overmolded, the connector can only be assembled with leadframe cable assemblies 1600A and 1600B, respectively, on the appropriate sides of the dual IMLA cable assembly 1400.

[0276] exist Figure 14A and Figure 14B In the example shown, the upper portion 1504A of the strain-relief overmolded part 1502A is thinner than the upper portion 1504B of the strain-relief overmolded part 1502B. Conversely, the lower portion 1506A of the strain-relief overmolded part 1502A is thicker than the lower portion 1506B of the strain-relief overmolded part 1502B. As a result, attempts to assemble two identical leadframe cable assemblies into a dual IMLA cable assembly can be easily detected because the leadframe cable assemblies will not be assembled together.

[0277] exist Figure 14C and Figure 14D In the example shown, the strain-relief overmolded member 1502A has a post 1652 configured to extend toward a type B cable assembly 1600B, which can be attached to the same core member as the type A cable assembly 1600A. Conversely, the strain-relief overmolded member 1502B has a hole 1654 configured to receive the post 1652. The post 1652 and the hole 1654 help hold the leadframe cable assemblies 1600A and 1600B together and also prevent two leadframe cable assemblies of the same type from being assembled together.

[0278] Furthermore, both overmolded parts 1502A and 1502B have complementary features that engage with housing 1302, allowing them to be inserted into the housing only in one orientation. Figure 14A and Figure 14B In the example, overmolded parts 1502A and 1502B each have larger openings 1508A and 1508B at the first end of the column of conductive elements. Overmolded parts 1502A and 1502B each have smaller openings 1510A and 1510B at the second end of the column of conductive elements. The inner wall of housing 1302 may have larger and smaller protrusions on opposite walls. The size and position of these protrusions may be designed to engage with openings 1508A and 1508B and 1510A and 1510B only when the dual IMLA assembly is inserted in a predetermined orientation.

[0279] exist Figure 14C and Figure 14D In the example shown, strain-relief overmolded parts 1502A and 1502B each have larger ribs 1656A and 1656B at the first end of the column of conductive elements. Strain-relief overmolded parts 1502A and 1502B each have smaller ribs 1656C and 1656D at the second end of the column of conductive elements. The inner wall of housing 1302 may have larger and smaller recesses on opposite walls. The size and position of these recesses may be designed to engage with ribs 1656A and 1656B and ribs 1656C and 1656D only when the dual IMLA assembly is inserted in a predetermined orientation.

[0280] Strain-relief overmolded parts 1502A and 1502B can be configured to provide mechanical strength and also provide electrical insulation by, for example, preventing molding materials (e.g., plastic) from affecting the area where the cable terminates at conductive elements. Depending on the cable IMLA configuration, strain-relief overmolded parts 1502A and 1502B can completely cover cover 1658, or may not completely cover cover 1658. Figure 14A , Figure 14BIn the example shown, the cover 1658 can be completely covered by strain-relief overmolded parts 1502A and 1502B and is invisible from the outside of the cable IMLA. Figure 13A , Figure 13B In the example shown, cover 1658 may include opening 1660 through which portions of conductive elements and cables and / or lead frames are exposed. To prevent molding material from entering through opening 1660, cover 1658 may be strain-relieved to partially surround but not completely cover portions of molded parts 1502A and 1502B.

[0281] The IMLA cable can be configured to terminate as a non-patch cable, eliminating the need for a patch cord on the 1606 cable and increasing connector density compared to assemblies with patch cords. (See details below.) Figures 15A to 15E and Figures 15F to 15P Described Figures 14A to 14B Implementation examples and Figures 14C to 14D Features of the embodiments. Although two embodiments are described herein, the features described with respect to these embodiments may be used alone or in any suitable combination.

[0282] Figure 15A This is a perspective view of a cable IMLA 1404 terminated with a cable according to some embodiments, prior to the application of an overmolded part. The cable IMLA 1404 may include a cover 1608 connected to the cable IMLA 1404 and holding the cable 1606 to the cable IMLA 1404.

[0283] Figure 15B This is a perspective view of a cable IMLA 1404 according to some embodiments, wherein the wire end serving as the signal conductor of cable 1606 is connected to the tail of the signal conductive element of IMLA 1404 without a cover 1608. Each cable 1606 includes one or more wires 1628 extending through cable insulation 1642, shielding member 1630, and sheath 1632. Shielding member 1630 may be a foil made of conductive material that may be wound around cable insulation 1642. In the illustrated example, cable 1606 includes a pair of wires 1628 configured to transmit a pair of differential signals. Wires 1628 may have a cross-sectional area depending on the specific application of cable connector 1300. A larger cross-sectional area results in lower signal attenuation per unit length of cable. Each wire 1628 may be attached to the tail of the signal conductive element at a conductive joint.

[0284] Figure 15C A perspective view of a lead frame assembly 1604 according to some embodiments is depicted. Figure 15D A lead frame cable assembly 1600A according to some embodiments is depicted. Figure 15AAn exploded view of a portion within the circle marked "15D". Figure 15E Depicting along according to some embodiments Figure 15A The cross-sectional view of line 16E-16E in the diagram.

[0285] The lead frame assembly 1604 may include a row of conductive elements 1610 molded using an insulating material 1644, and ground planes 1612 attached to each side of the insulating material. Dissipative material rods 1614 may be selectively molded over the ground planes 1612 to mechanically secure the ground planes 1612 and attenuate high-frequency signals that would otherwise be present on them. The row of conductive elements 1610 may include signal conductive elements 1616 and ground conductive elements 1618. Each of the conductive elements 1610 may include a mating end 1638, a tail portion of a tab 1640 shaped therein opposite the mating end, and an intermediate portion extending between the mating end 1638 and the tab 1640. The intermediate portion may be substantially surrounded by the insulating material 1644. The mating end 1638 and the tab 1640 may extend outside the insulating material 1644. In some embodiments, the portion of the lead frame assembly 1604 located above the consumable material rod 1614 may be configured similarly to the lead frame assembly 706 of the plug connector 700. The consumable material rod 1614 may be configured similarly to the consumable material rod 1006 of the plug connector 700.

[0286] Signal conductive element 1616 may include tabs 1620 configured to attach wires of a cable. Tabs 1620 may be configured to receive cables ranging in size from, for example, AWG 26 to AWG 32. Wires may be attached to tabs by, for example, soldering, brazing, compression fitting, or any suitable method. In the illustrated example, tabs 1620 of a pair of conductive elements 1616 are attached to corresponding wires 1628 of that pair in cable 1606. In some embodiments, the spacing between the wires of a pair within cable 1606 may be selected to provide a desired impedance in the cable, such as 50 ohms, 85 ohms, 95 ohms, 100 ohms, or 120 ohms. Generally, smaller diameter wires may be spaced (center-to-center) by a smaller amount than larger wires to provide the required impedance.

[0287] The tabs 1620 of a pair of conductive elements 1616 may be spaced apart by a distance d to ensure that the narrowest wire within this range is fitted onto the tab. The tab 1620 may have a width w to ensure that the widest wire within this range is fitted onto the tab. The cable insulator 1642 may extend beyond the shielding member 1630 such that the cable insulator 1642 separates the tab 1620 from the shielding member 1630 and provides isolation therebetween. In some embodiments, the dimension d may be in the range of 0.02 mm to 2 mm, and the dimension w may be in the range of 2 mm to 5 mm.

[0288] In embodiments where the IMLA 1404 cable includes single-ended signal conductors, these single-ended signal conductors may not be used when the cable ends with signal conductor pairs are connected to the IMLA. Alternatively, the single-ended signal assembly may be connected to a single wire or to a cable having two or more wires.

[0289] The grounding conductive element 1618 may include tabs 1622 configured to attach to a cover 1608. In this example, each tab 1622 of the grounding conductive element has an aperture facilitating connection to the cover 1608. The cover 1608 may be conductive. In some embodiments, the cover 1608 may be formed of die-cast metal. The cover 1608 may include a protrusion 1634 and an opening 1646. The tab 1622 may include an opening 1624 configured to receive the protrusion 1634 of the cover 1608. The protrusion 1634 of the cover 1608 may pass through the opening 1624 of the tab 1622. The cover 1608 may establish an electrical connection with the tab 1622, for example, at the location of the protrusion 1634 and / or at other locations where the cover 1608 presses against the tab 1622.

[0290] The cover 1608 can also establish an electrical connection with the shielding member 1630 of the cable 1606 at the opening 1646, so that the grounding conductive element 1618 is electrically coupled to the shielding member 1630 of the cable 1606 through the cover 1608. When preparing to terminate the cable to the cable IMLA, a portion of the sheath 1632 can be removed near the end of the cable. The shielding member 1630 of the cable 1606 can extend beyond the sheath 1632 of the cable 1606, so that the cover 1608 can contact the shielding member 1630 at the portion extending beyond the sheath 1632.

[0291] In the illustrated example, cover 1608 includes two portions 1608A and 1608B. Cable 1606 can be held between the two portions 1608A and 1608B. Cover portions 1608A and 1608B are pressed onto tab 1622 from opposite sides. Cover portions 1608A and 1608B include protrusions 1634 that insert from opposite directions into openings 1624 of tab 1622. After passing through tab 1622, the two portions 1608A and 1608B can be secured to each other, thus holding tab 1622 in place. In this example, portions 1608A and 1608B are secured to each other via an interference fit. A protrusion from one of portions 1608A or 1608B enters into opening 1624 in that portion. Figure 15D and Figure 15E As can be seen in the example, the hole has a different shape than the protrusion, so that when the protrusion is forced into the hole, it can become locked in place. Optionally or additionally, other attachment mechanisms may be used.

[0292] Cover portions 1608A and 1608B each include a pair of openings 1646A and 1646B. These pairs of openings 1646A and 1646B can be positioned such that they are aligned when cover portions 1608A and 1608B are fixed together. Cables can pass through the combined openings of openings 1646A and 1646B, causing cover portions 1608A and 1608B to press against the cable 1606 between cover portions 1608A and 1608B. As a result, cover portions 1608A and 1608B press against the shielding member 1630 of each cable 1606, both establishing electrical contact between the shielding member 1630 and the cover 1608.

[0293] In the illustrated embodiment, the cover 1608 is also electrically connected to a ground plane 1612 attached to each side of each cable IMLA 1404. The ground plane 1612 may include a body 1648 extending substantially parallel to the column of conductive elements 1610, and a tab 1626 extending from the body 1648. The tab 1626 may be configured to establish an electrical connection with the tail of the cover 1608 and / or the grounding conductive element to which the cover 1608 is attached. The tab 1626 may include a contact portion 1636 that may be bent toward the column of conductive elements 1610. The contact portion 1636 may, for example, be configured as a compliant beam that presses against an inclined surface when the two portions of the cover are placed together.

[0294] In the illustrated example, the lead frame assembly 1604 includes two ground planes 1612 attached to opposite sides of the column conductive element 1610. The tabs 1626 of the two ground planes 1612 can be arranged in pairs. Each pair of tabs 1626 can be aligned with the tab 1622 of the ground conductive element 1618 in a direction substantially perpendicular to the column direction in which the column conductive elements 1610 are aligned. The contact portion 1636 of the tab 1626 can contact the cover 1608, such that the ground planes 1612 are electrically connected through the cover 1608 to the ground conductive element 1618 and the shielding member 1630 of the cable 1606. The inventors have found that this configuration provides a simple and reliable grounding path for reducing intra-column crosstalk of the column conductive elements 1610.

[0295] As mentioned above, regarding Figures 15F to 15P Described Figures 14C to 14D Features of the embodiments. Figure 15F and Figure 15G This is a perspective view of a cable IMLA 1688, terminated with cable 1606 according to some embodiments, before the application of an overmolded member, showing the sides facing the core member and away from the core member, respectively. The cable IMLA 1688 may include a cover 1658 connected to the cable IMLA 1688 and holding the cable 1606 to the cable IMLA 1688.

[0296] Similar to cable IMLA 1404, cable IMLA 1688 may include a row of conductive elements 1682, which may include signal pairs 1684 separated by ground conductive elements 1686. The middle portion of the molded conductive elements 1682 may be selectively covered with insulating material 1678. Ground plane 1652 may be disposed on opposite sides of the row of conductive elements 1682 and separated from the signal pairs 1684 by insulating material 1678. Cable IMLA may include a lossy material bar 1680, which may be configured similarly to the lossy material bar 1614.

[0297] Figure 15O and Figure 15P This is a perspective view of IMLA 1688 with the insulation material and ground plane removed, showing the sides facing the core component and away from the core component, respectively. As shown, the grounding conductive element 1686 may include an opening 1666, which may be without insulation material 1678, allowing a lossy material rod 1680 to be held onto the grounding conductive element 1686 through the opening 1666. A portion 1690 of the lossy material rod 1680 may close the gap between the ground planes 1652 on opposite sides of the conductive element, forming a shell substantially surrounding the corresponding signal pair 1684. This configuration reduces crosstalk.

[0298] Figure 15H and Figure 15I This is a perspective view of IMLA 1688, in which the wire 1628, which serves as the signal conductor for cable 1606, is terminated at the tail of signal conductive element 1684, without the cover 1658 installed. Figure 15J and Figure 15K This is a perspective view of IMLA 1688, showing the sides facing the core component and the sides facing away from the core component.

[0299] The tail of the signal conductive element 1684 may include a transition portion 1654 that protrudes away from the core member. This transition portion 1654 allows a tab 1656 extending from the transition portion 1654 to be parallel to but offset relative to a plane along which the middle portion of the column of conductive elements 1682 can extend. Therefore, the line 1628 attached to the tab 1656 can be substantially on the plane of the middle portion of the column of conductive elements 1682. This can reduce impedance discontinuities along the signal conductive path.

[0300] The grounding conductive element 1686 can be configured to establish a direct electrical connection with a cable shield, such as by spring force. In some embodiments, the tail of the grounding conductive element 1686 may include a tab 1662 that may extend beyond the tab 1656 of the signal conductive element 1684. A beam 1664 may extend from the end portion 1692 of the tab 1662 and bend away from the core member. When the wire 1628 is attached to the tab 1656 of the signal conductive element 1684, the beam 1664 may be adjacent to and / or in contact with the shield 1630 surrounding the corresponding wire 1628. The beam 1664 of the grounding conductive element 1686 can be configured to deflect against the shield 1620 when the cover 1658 is mounted. The cover 1658 is here made of two cover members 1658A and 1658B, which are connected to clamp the tab 1692 therebetween. The inner surfaces of the covers 1658A and 1658B can be designed such that, when pressed together, they press against the tabs 1692 to press the beam 1664 against the cable shield 1630, thereby generating a spring force that helps provide a reliable connection between the grounding conductor and the cable shield 1630. Both the cover portion and the strain-relieving overmolded part can be formed with openings to allow the beam 1664 to move during operation, thereby providing this spring force.

[0301] Ground plane 1652 may include tabs 1668 extending between adjacent ground tabs 1662. Ground plane 1652 may include beams 1670 extending from tabs 1668 in the column direction in which the column of conductive elements 1682 can extend. The beams 1670 of ground plane 1652 facing the core member may be bent toward the core member. Conversely, the beams 1670 of ground plane 1652 facing away from the core member may be bent away from the core member.

[0302] The shield 1658 can be configured to be electrically connected to the grounding conductive element 1686 and the ground plane 1652 to provide shielding for cables and conductive elements and reduce crosstalk at the attachment interface. Figure 15L and Figure 15M This is a perspective view of the two parts 1658A and 1658B of the cover 1658, showing the side facing the cable accessory. Figure 15N It is along the lead frame assembly 1688 Figure 15F A three-dimensional view of a section cut open from the line marked "15N-15N".

[0303] As shown in the figure, cover portions 1658A and 1658B may each include a pair of compression slots 1672A and 1672B. The pair of compression slots 1672A and 1672B may be positioned such that they are aligned when cover portions 1658A and 1658B are fixed to each other. Cables may pass through the combined slots of compression slots 1672A and 1672B, such that the surface of the compression slots 1672A and 1672B compresses the shielding member 1630. Cover portion 1658B may include an opening 1660 corresponding to each compression slot 1672B, such that the beam 1664 of the grounding conductive element 1686 can flex at least partially within the corresponding opening 1660. Cover portions 1658A and 1658B may each include recesses 1674A and 1674B. The beam 1670 of the grounding plate 1652 can be held in the recesses 1674A and 1674B and deflected against the corresponding cover portion when the cover portions are fixed to each other, thereby establishing an electrical connection between the cover, the grounding plate, the grounding conductor of the IMLA and the cable shield.

[0304] The inventors have recognized and are aware of techniques for creating a simple and efficient conductive path between the shielding within a connector and the grounding structure within the printed circuit board to which the connector is mounted. These techniques improve the high-frequency performance of interconnect systems by reducing or eliminating discontinuities that would otherwise occur as the signal-conducting elements and internal shielding transition from the connector body to the mounting surface of the printed circuit board (PCB). For example, discontinuities can arise due to gaps between the mounting ends of the connector's internal shielding and the top surface of the PCB. Such discontinuities in the grounding structure can disrupt the current in the ground conductor that serves as a reference for the signal conductor, leading to impedance changes that can cause signal reflections, mode switching, or otherwise degrade signal integrity. Gaps can provide clearance for components, although they can be variable due to manufacturing tolerances. At higher transmission speeds, such discontinuities in the ground return path can reduce the integrity of signals transmitted through the connector.

[0305] The compliant shielding design described herein, combined with the connector and the PCB on which the connector is mounted, provides a simple and efficient current path between the internal shielding within the connector and the grounding structure in the PCB. These paths can extend parallel to the current flow path in the signal conductors from the connector to the PCB. In some embodiments, the compliant shielding can simply integrate dissipative material into the mounting interface, which can further improve the high-frequency performance of the connector.

[0306] In its uncompressed state, the compliant shield may have a first thickness. In some embodiments, the first thickness may be about 20 mils, or in other embodiments between 10 and 30 mils. In some embodiments, the first thickness may be greater than the gap between the mounting end of the connector's inner shield and the mounting surface of the PCB. Because the first thickness of the compliant shield is greater than this gap, the compliant conductive member is compressed by a normal force (e.g., a force normal to the plane of the PCB) when the connector is pressed onto the PCB to engage the contact tail. As used herein, "compression" means that the dimensions of the material decrease in one or more directions in response to the application of force. In some embodiments, compression may be in the range of 3% to 40% or any value or subrange of that range, for example, including, for example, between 5% and 30%, or between 5% and 20%, or between 10% and 30%. Compression may cause a change in the height (e.g., the first thickness) of the compliant shield in the direction normal to the surface of the printed circuit board.

[0307] In some embodiments, the compliant shield can extend from the connector’s internal shield (e.g., the mounting interface shield interconnect 214 described above).

[0308] In some embodiments, the compliant shield may include a fully or partially conductive structure (e.g., a lossy conductor) configured as an internal shield within an electrical contact connector. In some embodiments, the compliant shield may include a plurality of openings configured to allow a contact tail of the connector to pass through it. In some embodiments, at least a portion of the openings may be sized and shaped to receive an organizer (e.g., organizer 210) configured to provide contact tail alignment and isolate the compliant shield from signal conductors. In some embodiments, at least a portion of the openings may be sized and shaped to accommodate internal shielding of the connector that bends away from signal conductors when exiting the connector, preventing signal vias and ground vias on the PCB from shorting.

[0309] In some embodiments, the compliant shield may be formed by stamping or otherwise shaping a sheet of conductive material, and / or may include such a conductive member. In some embodiments, the conductive member may include contact members, each extending substantially perpendicular to the mounting interface from one side of a corresponding opening. Each contact member may contact a corresponding internal shield of the connector along a contact line. In some embodiments, the compliant shield may include rows of contact beams between rows of conductive elements of the connector. In some embodiments, the contact beams may be cantilever beams. In some embodiments, the contact beams may be torsion beams and may, for example, have a herringbone shape.

[0310] In some embodiments, the compliant shield may include a first contact beam bent toward the lead frame assembly to contact the inner shield of the connector, and a second contact beam bent away from the lead frame assembly such that the second contact beam contacts the ground plane of the PCB when the connector is mounted to the PCB.

[0311] In some embodiments, the compliant shield may be formed of or comprise a compliant material. In some embodiments, the compliant shield may include an extension projecting into an opening to contact the surface of an internal shield of the connector. In some embodiments, the compliant shield may include a slit configured to allow a ground contact tail to pass through and contact the compliant shield simultaneously. In some embodiments, a reduction in the thickness of the compliant shield may be caused by a force applied to the compliant structure of the compliant shield.

[0312] Figure 16A This is a perspective view of the mounting interface 1724 of a right-angle connector 1700 according to some embodiments. The connector 1700 can be constructed using the techniques described above in conjunction with connector 200. Figure 16B Depicting according to some embodiments in Figure 16A An enlarged view of the area marked "X" in the diagram. In the illustrated embodiment, connector 1700 includes organizer assembly 1800, which may include organizer 1810 and compliant shield 1806. Figure 17A The surface of the organizer component configured to face the PCB is depicted. Figures 17B to 17D An exemplary embodiment of the organizer 1810 is depicted. Figure 17B The flat surface of organizer 1810 is depicted. In the illustrated example, organizer 1810 includes a first part 1802 and a second part 1804. The first part 1802 may be insulated and may provide isolation between signal contact tails. The second part 1804 may be a lossy conductor and may provide interconnection between ground contact tails and / or ground shielding.

[0313] It should be understood that, in order to demonstrate the purpose of each part, Figure 17C and Figure 17D First part 1802 and second part 1804 are depicted as separate parts. In some embodiments, first part 1802 and second part 1804 may be fabricated separately and subsequently assembled together. In other embodiments, first part 1802 may be molded by a first injection of a non-conductive material. First part 1802 may include an opening for a second part, which is filled in a second injection during the molding operation, thereby enabling different materials to be used for the first and second parts. In some embodiments, the second part may be molded onto first part 1802 by a second injection of a conductive and / or dissipative material. Similarly, compliant shield 1806 is illustrated as a separate sheet of metal that may subsequently be attached to tissue 1810, for example, by tabs or clamps. Optionally or additionally, insulating and / or dissipative portions of tissue 1810 may be molded onto compliant shield 1806.

[0314] like Figure 16A As shown, connector 1700 may include contact tails 1750 aligned along columns 1702. The columns of contact tails may extend from leadframe assemblies (e.g., leadframe assemblies 206A, 206B). In the illustrated example, the contact tails are aligned along eight columns; this is a non-limiting example. A column of contact tails may include pairs of differential signal contact tails 1704 separated by ground contact tails 1708. A column of contact tails may include one or more individual signal contact tails 1706. In the illustrated embodiment, the contact tails have edges and wide sides. The tails are edge-to-edge aligned along column edges such that the tails of the differential signal contacts form edge-coupled pairs. Also in the illustrated embodiment, the tail of the ground conductive element is larger than the tail of the signal conductive element.

[0315] Furthermore, the connector mounting interface may include a shielded interconnect 1752 extending from the IMLA shield. In this embodiment, the shielded interconnect is a tab protruding from the lower edge of the IMLA shield. In this embodiment, the shielded interconnect does not include a compliant member. Nevertheless, the shielded interconnect can be connected to a grounding structure on the surface of the printed circuit board to which the connector is mounted via a compliant shield 1806, which can establish a connection to both the shielded interconnect 1752 and the grounding structure on the surface of the printed circuit board.

[0316] The first part 1802 of the organizer 1810 may include an opening 1710 configured to allow a contact tail 1750 to pass through it. The first part 1802 may be insulating, and the opening 1710 may be aligned with the contact tails of signal conductive elements that are electrically isolated as they pass through the organizer 1810. The second part 1804 may have an opening 1840 through it. The second part 1804 may be dissipative, and the opening 1840 may be aligned with the contact tails of ground conductive elements such that the ground conductive elements are electrically coupled as they pass through the organizer 1810.

[0317] Organizer 1810 may include a slot 1712. Some or all of the slot 1712 may be aligned with a shielded interconnect 1752. The shielded interconnect 1752 may extend into the slot 1712, but in the illustrated embodiment, it does not extend through the slot 1712. In the illustrated embodiment, the slot 1712 is formed between the first part 1802 and the second part 1804 such that the slot 1712 shares a wall from the first part 1802 with the corresponding opening 1710, thereby isolating the shielded interconnect 1752 from the signal contact tail that passes through the opening 1710. The slot 1712 may have a wall opposite to that of the second part 1804 of organizer 1800, such that the shielded interconnect 1752 can be coupled to the ground contact tail through the second part 1804.

[0318] The compliant shield 1806 may include an opening 1718 configured for a contact tail 1750 of a signal conductive element, and an opening 1720 configured to allow a contact tail of a ground conductive element to pass through it. In the illustrated embodiment, the opening 1710 is defined by a raised lip extending through the opening 1718. The size and position of the opening 1718 may be designed to expose a slot 1712 of the tissue, allowing the shielded interconnect 1752 to pass through the compliant shield into the tissue.

[0319] The compliant shield may include a structure that couples the IMLA shield to ground. In the illustrated embodiment, this coupling is established by connecting the shielded interconnect 1752 to a ground structure on the printed circuit board to which the connector 1700 is mounted via the compliant shield. These connections may be established by a first contact beam 1714 bent toward the leadframe assembly to contact the shielded interconnect 1752, thereby establishing a connection to the IMLA shield 502. The compliant shield 1806 may include a second contact beam 1716 bent away from the leadframe assembly and configured to contact the ground plane of the PCB (e.g., daughter card 102). The first contact beam 1714 and the second contact beam 1716 may have a length extending parallel to the direction in which the columns extend. The contact beams 1714 and 1716 may be aligned with a slot 1712 such that the beams may deflect into the slot 1712 when the connector 1700 is pressed onto the printed circuit board. Contact beams 1714 and 1716 enable connection between the connector's internal shield (such as an IMLA shield) and the ground plane on the surface of the printed circuit board without the need for contact tails extending from the internal shield. This configuration achieves a compact PCB footprint.

[0320] Figure 18 A perspective view of an optional shield 1900, which can be used as part of an organizer component according to some embodiments, is depicted. Figure 19A A perspective view depicting a portion of a compliant shield 2000 at the mounting interface of a connector according to some embodiments is provided. In this example, the connector has columns of signal and ground contact tails exposed at the mating interface. The contact tails may have the same pattern described above for connector 1700. The IMLA shield 502 also includes a shield interconnect 1926 extending from its lower edge. As shown, a gap g may exist between the end of the shield interconnect 1926 and the plane extending from the body 2004 of the compliant shield 2000, such that the shield interconnect 1926 does not contact the PCB to which the connector is mounted. In some embodiments, the gap g may be, for example, about 0.2 mils.

[0321] However, in this embodiment, the shielding interconnects 1926 do not extend beyond the mounting surface of the connector. Instead, they are exposed in recesses in the connector, such as those formed between IMLA components when the core component does not extend as far toward the mounting surface as the IMLA component to which it is attached.

[0322] Figure 19B According to some embodiments, the recess 1928 includes such a recess. Figure 19AAn enlarged view of the area marked "W". A portion of the recess is filled by a protrusion 1922A from the organizer 1922. A portion of the compliant shield also extends into the recess 1928, where it can contact the shield interconnect 1926. In this example, this portion is the contact member 1906, which is formed by a tab cut from the same metal sheet as the compliant shield and is operable to generate a force against the shield interconnect 1926 to establish a reliable connection. The contact member 1906 can be included in a compliant shield such as 1900 or 2000.

[0323] In the illustrated example, the compliant shield 2000 is attached to the plate-facing side of the insulating organizer 1922. Like the compliant shield 1900, the compliant shield 2000 has a first opening 1902 configured to allow a signal contact tail to pass through it, and a second opening 1904 to allow a ground contact tail to pass through it. The first opening 1902 has a contact member 1906 extending from one side of the first opening 1902 and substantially perpendicular to the body of the compliant shield 1900. The insulating organizer 1922 has a similar opening, allowing the tail to pass through both the compliant shield 1900 and the organizer 1922 for attachment to a printed circuit board.

[0324] Contact member 1906 is configured to contact shielded interconnect 1926 along line 1908. This line contact configuration reduces the contact resistance compared to point contact configurations.

[0325] The compliant shield 1900 or 2000 can couple the IMLA shield 502 to grounding structures by pressing it against the grounding structure on the PCB to which the connector is mounted. This connection can be formed, for example, by the compliant shield 1900. Alternatively or additionally, a connection to ground can be established via a compliant beam or other contact structure. Figure 19A An embodiment of the compliant shield 2000 is shown, including a compliant beam 2002.

[0326] Figure 20A This is a plan view of the compliant shield 2000 with compliant beam 2002 facing the plate surface according to some embodiments. Figure 20B Depicting along according to some embodiments Figure 20A A cross-sectional view of line LL. Line LL passes through contact tail 2112, which may extend from conductive structure 2110 within the connector. Conductive structure 2110 may be a planar shield between (and part of) the dual IMLA assemblies or otherwise incorporated into the connector. Figure 20AIn the example, for the four columns of contact tails extending from the IMLA component, there are columns of contact tails 2112. Conductive structure 2110 can be grounded. Therefore, as... Figure 20B As shown, the conductive structure 2110 does not need to be isolated from the shield 2000 and can be in contact with the shield 2000.

[0327] Figure 21A An alternative embodiment of a compliant shield that can be used in an organizer assembly as described above is shown. Figure 21A This is a plan view of the compliant shield 2200 facing the plate surface. Like compliant shields 1900 and 2000, compliant shield 2200 has an opening and a contact member 1906 through which a contact tail from the IMLA assembly passes. The contact member 1906 can contact the shield interconnect 1926.

[0328] Similar to the compliant shield 2000, the compliant shield 2200 may include a mechanism for establishing an electrical connection with a grounding structure on the surface of a printed circuit board to which the connector containing the compliant shield 2200 is mounted. In this example, the mechanism is a compliant beam 2202. The compliant member 2202 is a torsion beam.

[0329] Figure 21B Depicting according to some embodiments in Figure 21A An enlarged view of the area marked "V" in the diagram. The compliance beam 2202 may have a herringbone shape, with the ends 2204 configured to contact the PCB. The ends 2204 of the compliance beam 2202 can be bent outward from the body of the compliance shield and generate a reaction force when pressed back towards the body of the compliance shield. In this way, a contact force can be generated to contact the surface ground contact pads 2206 on the PCB. The compliance beam 2002 (e.g., contacting the PCB at a point or along a line) Figure 20A and Figure 20B Compared to (as shown), the end 2204 of the compliant beam 2202 can have a surface that contacts the pad 2205 (e.g., Figure 21B As shown), this reduces contact resistance and allows the compliance beam 2202 to be made with a narrower width, thus reducing the spacing between the columns of the connector's contact tails.

[0330] The compliance of the shield at the mounting interface enables the compliant shield to establish a connection between the shield inside the connector and the ground on the surface of the printed circuit board, regardless of changes in the position of the connector relative to the surface of the printed circuit board in the finished assembly. In some embodiments (such as those described in conjunction with compliant shields 2000 and 2100), the compliance is caused by compressible beams on the shield. In some embodiments, the compliance of the compliant shield may be caused by displacement of the material forming the compliant shield. The material forming the compliant shield may be, for example, rubber, which, when pressed along a direction normal to the mounting surface of the PCB, reduces its height perpendicular to the PCB but expands laterally parallel to the mounting surface of the PCB, such that the volume of the material remains constant. Optionally or additionally, a change in height in one dimension may be caused by a reduction in the volume of the compliant shield, such as when the compliant shield is made of an open-cell foam material, air is expelled from the pores when force is applied to the open-cell foam material. The foam cells collapse, allowing the foam thickness to be reduced to the size of the gap between the grounding shield mounting end and the PCB mounting surface when the connector is pressed onto the PCB.

[0331] In some embodiments, the compliant shielding can be configured to operate at 0.5 gf / mm. 2 With 15gf / mm 2 Between (e.g., 10gf / mm) 2 5gf / mm 2 Or 1.4gf / mm 2 The force required to fill the gap is relatively low. Compliant shields made of open-cell foam may require relatively low applied force to compress the shield to the size of the gap. Furthermore, since open-cell foam does not expand laterally, the risk of it unintentionally contacting the tail of an adjacent signal and shorting it to ground is low.

[0332] Suitable compliant shielding can have a volume resistivity between 0.001 Ohm-cm and 0.020 Ohm-cm. This material can have a Shore A hardness in the range of 35 to 90. This material can be a conductive elastomer, such as a polysiloxane elastomer filled with conductive particles (such as particles of silver, gold, copper, nickel, aluminum, nickel-coated graphite, or combinations or alloys thereof). Optionally or additionally, this material can be a conductive open-cell foam, such as copper- and nickel-plated polyethylene foam. Non-conductive fillers, such as glass fibers, may also be present.

[0333] Optionally or additionally, the compliant shield may be partially conductive or exhibit resistive loss, such that it will be considered a dissipative material as described herein. This result can be achieved by filling all or part of an elastomer, open-cell foam, or other binder with different types or smaller amounts of conductive particles to provide a volume resistivity associated with a material described herein as “dissipative.” In some embodiments, the compliant shield may be die-cut from a sheet of conductive or “dissipative” compliant material having suitable thickness, electrical, and other mechanical properties. In some embodiments, the compliant shield may have an adhesive backing so that it can be bonded to the mounting surface of a plastic organizer and / or connector. In some implementations, the compliant shield may be cast in a mold to have a desired opening pattern to allow the contact tail of the connector to pass through it. Optionally or additionally, compliant material sheets may be cut, for example, in a mold, to provide the desired shape.

[0334] Figure 22 A perspective view of an optional compliant shield 2300 for an organizer assembly according to some embodiments is depicted. For example, the compliant shield 2300 can be bonded to a plastic organizer with an opening that allows a contact tail to pass through it. The opening in the compliant shield 2300 can be aligned with some or all of the openings in the organizer to allow the contact tail to pass through it. For example, opening 2302 can be aligned with an opening through which the tail of a signal conductive element in the organizer passes. Conversely, in the case where the compliant shield will be connected to a connector structure, the compliant shield 2300 can be shaped to contact these structures. Extensions 2304 extending toward these structures can establish a connection. A slit 2306 can also be cut into the compliant shield 2300 such that the sides of the slit will be pressed into a structure passing through the slit.

[0335] Figure 23A An optional perspective view depicts a portion of the mounting interface of a connector having a compliant shield 2300 attached to an organizer, according to some embodiments.

[0336] Figure 23B It is part of the installation interface according to some embodiments. Figure 23A The cross-sectional view of line II in the diagram. It should be understood that, although Figure 23A A portion of the installation interface with two columns of contact tails is shown, but Figure 23B For example, neighboring areas are shown. Figure 23A The two additional columns shown above illustrate a portion of the four-column contact tail.

[0337] The compliant shield 2300 may include a conductive body 2308 and an opening 2302 in the body 2308, the opening 2302 being configured to allow the contact tails of the signal conductive elements of the leadframe assembly to pass through it. The opening 2302 may be shaped to include a protrusion 2304 extending from a side of the opening into the opening 2302. The protrusion 2304 may be configured to establish a connection with the internal shield of the connector, such as by direct contact with the IMLA shield 502 or contact shield interconnect 1752. When the compliant shield is attached to the connector's mounting interface, the protrusion 2304 may be compressed such that the protrusion 2304 presses against these structures of the connector.

[0338] The openings 2302 can be arranged in a row, each configured to receive a contact tail of the leadframe assembly. The compliant shield 2300 may include a slit 2306 configured to receive and contact a ground contact tail that passes through it. The ground contact tail may originate from a respective ground conductive element and / or a contact tail extending from the connector's internal shield. In some embodiments, at least a portion of the plurality of slits of the compliant shield extends in the direction in which the row extends.

[0339] In some embodiments, the compliant shield 2300 is made from the sheet by selectively cutting a sheet of open-cell foam material or otherwise removing material from the sheet to form openings 2302 and slits 2306.

[0340] It should be understood that although embodiments of compliant shielding are shown at the mounting interface of connectors (such as connector 200 assembled with an IMLA assembly having one or more IMLAs attached to a core member), compliant shielding may also be used on other connectors, including, for example, connectors without a core member.

[0341] The inventors have recognized and realized that the internal shield of a connector can be bent relative to the plane extending from the body of the internal shield when it exits the connector (e.g., at a mounting interface). In some embodiments, the internal shield can be bent (jog) away from the column of signal conductors in a direction perpendicular to the column direction, which may be referred to as a "first bend," such that there is sufficient spacing to prevent signal vias on the PCB configured to receive signal contact tails from intersecting ground contact tails on the PCB configured to receive ground contact tails extending from the internal shield (e.g., from...). Figure 10B The protrusion 1016 extends to the contact tail, which is not in Figure 10B Accidental shorting between ground vias (shown but described as optional embodiments). In some embodiments, the inner shield may be bent (jog) toward the signal conductor column, which may be referred to as a "second bend," such that the ground contact tail extending from the inner shield (e.g., Figure 10BThe grounding mounting tail 1012 is aligned with the signal contact tail. The second curved grounding contact tail can be positioned between adjacent differential pairs of the signal contact tail to reduce crosstalk.

[0342] The inventors have recognized and realized that bending elongates the ground return path between the connector's internal shield and the grounding structure in the PCB, thus increasing the inductance associated with the ground return path. Higher inductance in the ground return path can cause or exacerbate ground mode resonance.

[0343] The inventors have recognized and are aware of connector designs in which the first bend of the connector’s internal shield is removed, for example, by removing the ground contact tail that requires the first bend and by electrically connecting the connector’s internal shield to the ground plane of the PCB via a mounting interface structure (e.g., organizer 210, compliant shield 1806, 1900, 2300).

[0344] The inventors have recognized and are aware of connector designs in which a second bend in the connector's internal shield is removed or reduced, for example, by misaligning / out of line with the signal contact tail extending from the internal shield. The inventors have also recognized and are aware that, without the second bend, crosstalk between adjacent column differential pairs of the signal conductive elements increases at the connector's mounting interface. To reduce crosstalk, in some embodiments, ground vias not configured to receive the ground contact tail of the connector's internal shield can be included between column differential pairs.

[0345] In some embodiments, an electrical connector includes: a plurality of leadframe assemblies, each leadframe assembly including: a leadframe housing; a plurality of signal conductive elements held by the leadframe housing and arranged in a row, each conductive element including a mating contact portion, a contact tail, and an intermediate portion extending between the mating contact portion and the contact tail; and a ground shield held by the leadframe housing and separated from the plurality of signal conductive elements by the leadframe housing; and a compliant shield including: a plurality of openings configured to allow contact tails of the plurality of signal conductive elements to pass through therethrough; a plurality of first contact beams bent toward and contacting a respective ground shield of the plurality of leadframe assemblies; and a plurality of second contact beams bent away from the respective ground shields of the plurality of leadframe assemblies and configured to contact a printed circuit board.

[0346] In some embodiments, a plurality of first contact beams extend parallel to a plurality of signal conductive elements arranged in a row of a plurality of lead frame assemblies.

[0347] In some embodiments, the plurality of signal conductive elements include a plurality of signal differential pairs, each signal differential pair having a contact tail edge-coupled along a corresponding column, and each signal differential pair having a contact beam on one side of a plurality of first contact beams and a contact beam on the opposite side of a plurality of second contact beams in the corresponding column.

[0348] In some embodiments, an electrical connector includes: an organizer comprising a plurality of slots configured to allow contact tails of a plurality of signal conductive elements of a plurality of leadframe assemblies to pass through a plurality of openings therethrough, and a plurality of slots configured to allow protrusions of ground shields of the plurality of leadframe assemblies to be inserted therein, a compliant shield being attached to the organizer, and a contact beam of a plurality of first contact beams of the compliant shield contacting a corresponding protrusion of the ground shield of the plurality of leadframe assemblies in a corresponding slot of the organizer.

[0349] In some embodiments, the plurality of second contact beams of the compliant shield bend away from the corresponding slots of the tissue.

[0350] In some embodiments, an electrical connector includes: a plurality of leadframe assemblies, each leadframe assembly including: a leadframe housing; a plurality of signal conductive elements held by the leadframe housing and arranged in a row, each conductive element including a mating contact portion, a contact tail, and an intermediate portion extending between the mating contact portion and the contact tail; and a ground shield held by the leadframe housing and separated from the plurality of signal conductive elements by the leadframe housing; and a compliant shield including: a plurality of openings configured to allow the contact tails of the plurality of signal conductive elements to pass through therethrough; and a plurality of contact members, each contact member extending substantially perpendicular to the body of the compliant shield from one side of a corresponding opening, the plurality of contact members contacting the ground shields of the plurality of leadframe assemblies.

[0351] In some embodiments, the contact members of the compliant shielding member make line contact with the grounding shielding member.

[0352] In some embodiments, the compliant shielding includes a plurality of compliant beams arranged in a row between the contact tails of a plurality of lead frames.

[0353] In some embodiments, a plurality of compliant beams are aligned with a plurality of openings configured to allow a plurality of signal conductive elements to pass through them.

[0354] In some embodiments, the plurality of compliant beams have a herringbone shape such that the ends bend out from the body of the compliant shield, so that the compliant beams generate a reaction force when pressed back toward the body of the compliant shield.

[0355] In some embodiments, an electrical connector includes: a plurality of leadframe assemblies, each leadframe assembly including a leadframe housing, a plurality of signal conductive elements held by the leadframe housing and arranged in a row, each conductive element including a mating contact portion, a contact tail, and an intermediate portion extending between the mating contact portion and the contact tail, a ground shield held by the leadframe housing and separated from the plurality of signal conductive elements by the leadframe housing, and a compliant shield including a conductive body made of foam material, the compliant shield including a plurality of openings configured to allow the contact tails of the plurality of signal conductive elements to pass through therethrough, and a plurality of protrusions extending into corresponding openings and configured to contact a corresponding ground shield of a corresponding leadframe assembly.

[0356] In some embodiments, the foam material is configured such that air is expelled from the foam material when a force is applied to the compliant shield.

[0357] In some embodiments, multiple protrusions of the compliant shield are compressed by a corresponding grounding shield of the corresponding lead frame assembly.

[0358] In some embodiments, a plurality of slits are configured to allow the ground contact tail to pass through and contact the conductive body of the compliant shield.

[0359] In some embodiments, the plurality of openings of the compliant shield are arranged in a plurality of columns, and at least a portion of the plurality of slits of the compliant shield extends in the direction in which the columns extend and connects the openings in one of the plurality of columns.

[0360] In some embodiments, an electronic device includes: a printed circuit board including a surface, a ground plane at an inner layer of the printed circuit board, and a plurality of shadow vias connected to the ground plane; and an electrical connector connected to the printed circuit board, the connector including a surface parallel to the surface, a plurality of rows of conductive elements extending through the surface, and a plurality of internal shields extending parallel to the plurality of conductive elements, the plurality of internal shields including portions that exit the connector in a straight line, the portions of the plurality of internal shields being disposed above a corresponding shadow via and aligned with the corresponding shadow via in a direction substantially perpendicular to the surface of the printed circuit board, the portions of the internal shields of the connector being electrically connected to the ground plane of the printed circuit board through the corresponding shadow vias.

[0361] In some embodiments, the electrical connector includes a compliant shield that provides a current flow path between said portions of the connector’s internal shield and a corresponding shaded via on the printed circuit board.

[0362] In some embodiments, the compliant shielding member presses against a plurality of first portions of the connector’s internal shielding member in a repeating pattern at a first position.

[0363] In some embodiments, the shadow via is positioned in a repeating pattern of second positions, each second position having the same position relative to a corresponding first position.

[0364] In some embodiments, a printed circuit board includes: a surface; a plurality of differential pairs of signal vias arranged in a first column; a ground plane located in an inner layer of the printed circuit board; a plurality of first ground vias connected to the ground plane, the plurality of first ground vias configured to receive ground contact tails of the printed circuit board, the plurality of first ground vias being arranged in a second column offset relative to the first column; and a plurality of second ground vias connected to the ground plane, the plurality of second ground vias being arranged in a third column offset relative to the first column, the third column being offset relative to the second column, the plurality of second ground vias being arranged between adjacent differential pairs of signal vias in the same first column to reduce crosstalk between adjacent differential pairs of signal vias in the same first column.

[0365] In some embodiments, a plurality of first grounding vias have a first diameter, a plurality of second grounding vias have a second diameter, and the second diameter is smaller than the first diameter.

[0366] In some embodiments, the second column is offset relative to the first column in a first direction, and the third column is offset relative to the first column in a second direction opposite to the first direction.

[0367] In some embodiments, the second column is offset by a first distance relative to the first column, and the third column is offset by a first distance relative to the first column.

[0368] In some embodiments, the second column is offset by a first distance relative to the first column, the third column is offset by a second distance relative to the first column, and the second distance is less than the first distance.

[0369] Although details of the specific configurations of the conductive elements, housing, and shielding members have been described above, it should be understood that these details are provided for illustrative purposes only, as the concepts disclosed herein can be implemented in other ways. In this regard, the various connector designs described herein can be used in any suitable combination, as aspects of the invention are not limited to the specific combinations shown in the figures.

[0370] Therefore, given that several embodiments have been described, it should be understood that various changes, modifications, and alterations will readily occur to those skilled in the art. These changes, modifications, and alterations are intended to remain within the spirit and scope of the invention. Thus, the foregoing descriptions and illustrations are merely examples.

[0371] Various changes can be made to the illustrative structures shown and described herein. As a specific example of possible variations, the connector can be configured for a frequency range of interest, which may depend on the operating parameters of the system in which the connector is used, but can typically have an upper limit between approximately 15 GHz and 224 GHz (such as 25 GHz, 30 GHz, 40 GHz, 56 GHz, 112 GHz, or 224 GHz), although higher or lower frequencies may be of interest in some applications. Some connector designs may have a frequency range of interest that spans only a portion of this range (such as 1 GHz to 10 GHz, 5 GHz to 35 GHz, or 56 GHz to 112 GHz).

[0372] The operating frequency range of an interconnect system can be determined based on the frequency range through which an interconnect can be used with acceptable signal integrity. Signal integrity can be measured according to many criteria, which depend on the design application of the interconnect system. Some of these criteria may relate to signal propagation along a single-ended signal path, a differential signal path, a hollow waveguide, or any other type of signal path. Two examples of such criteria are signal attenuation along the signal path or signal reflection from the signal path.

[0373] Other criteria may address the interaction of multiple different signal paths. Such criteria could include, for example, near-end crosstalk, defined as a portion of a signal injected into one signal path at one end of an interconnect system that can be measured at any other signal path at the same end of the interconnect system. Another such criterion could be far-end crosstalk, defined as a portion of a signal injected into one signal path at one end of an interconnect system that can be measured at any other signal path at the other end of the interconnect system.

[0374] As a specific example, it may be required that signal path attenuation not exceed 3dB power loss, reflection power ratio not exceed -20dB, and each signal path contributes no more than -50dB to signal path crosstalk. Since these characteristics are frequency-dependent, the operating range of the interconnect system is defined as the frequency range that meets the specified standards.

[0375] This document describes electrical connector designs that improve signal integrity for high-frequency signals (such as frequencies in the GHz range, including up to about 25 GHz or up to about 40 GHz, up to about 56 GHz or up to about 60 GHz, up to about 75 GHz or up to 112 GHz or higher) while maintaining high density (such as a spacing of about 3 mm or less between adjacent mating contacts, including center-to-center spacing between adjacent contacts in a column, for example, between 1 mm and 2.5 mm or between 2 mm and 2.5 mm). The spacing between columns of mating contact portions can be similar, but it is not required that the spacing between all mating contacts in the connector be the same.

[0376] Manufacturing techniques can also be modified. For example, an embodiment is described in which the daughter card connector 200 is formed by organizing multiple wafers onto a reinforcing member. An equivalent structure can be formed by inserting multiple shielding members and signal sockets into a molded housing.

[0377] Connector manufacturing techniques are described using specific connector configurations as examples. Examples illustrate plug connectors suitable for mounting on a backplane and right-angle connectors suitable for mounting on a daughter card for right-angle insertion into the backplane. The techniques described herein for forming mating and mounting interfaces for connectors are applicable to connectors in other configurations, such as backplane connectors, cable connectors, stacked connectors, mezzanine connectors, I / O connectors, chip sockets, etc.

[0378] In some embodiments, the contact tail is shown as a press-fit "pinhole" compliant section designed to fit within a via on a printed circuit board. However, other configurations, such as surface mount components, solderable pins, etc., may also be used, as aspects of the invention are not limited to attaching the connector to a printed circuit board using any particular mechanism.

[0379] This invention is not limited to the construction details or component configurations illustrated in the foregoing description and / or figures. Various embodiments are provided for illustrative purposes only, and the concepts described herein can be practiced or implemented in other ways. Moreover, the phrasing and terminology used herein are for descriptive purposes and should not be considered limiting. The use of "comprising," "including," "having," "containing," or "involving," and variations thereof, is intended to cover the items listed thereafter (or their equivalents) and / or additional items.

Claims

1. A subassembly for an electrical connector, the subassembly comprising: a leadframe assembly including a leadframe housing and a plurality of conductive elements held by the leadframe housing and arranged in a column, each conductive element including a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end; and a core member including a body and a mating portion extending from the body, the body and the mating portion including an insulative material, the mating portion further including a lossy material, wherein: a first portion of the plurality of conductive elements are configured as ground conductors, and a second portion of the plurality of conductive elements are configured as signal conductors, and the leadframe assembly is attached to a first side of the core member such that the conductive elements configured as ground conductors are coupled to one another by the lossy material.

2. The subassembly of claim 1, wherein: the core member is molded in two shots, the lossy material is formed during one of the two shots, and the insulative material is formed during the other of the two shots.

3. The subassembly of claim 2, wherein: the insulative material of the core member includes a feature extending in a direction perpendicular to the first side, and the feature is configured to protect a tip of the mating end of the conductive elements.

4. The subassembly of claim 3, wherein: the insulative material of the core member includes a further feature extending in a direction perpendicular to the first side, and the further feature is a rib disposed between mating ends of adjacent ones of the conductive elements.

5. The subassembly of claim 2, wherein: the core member includes a shield, and the lossy material is selectively molded on the shield.

6. The subassembly of claim 5, wherein: the shield of the core member extends beyond the mating ends of the plurality of conductive elements in a mating direction.

7. The subassembly of claim 5, wherein: the leadframe assembly includes a shield separated from the plurality of conductive elements by the leadframe housing.

8. The subassembly of claim 7, wherein: the shield of the leadframe assembly includes a beam extending substantially perpendicular to the shield, the beam configured to make electrical contact with the shield of the core member.

9. The subassembly of claim 1, wherein: the leadframe housing includes a plurality of holes arranged along corresponding conductive elements, the plurality of conductive elements includes a first conductive element and a second conductive element, the first conductive element is longer than the second conductive element, a first number of holes of the plurality of holes are arranged along the first conductive element, a second number of holes of the plurality of holes are arranged along the second conductive element, and the first number is greater than the second number.

10. The subassembly of claim 1, wherein: ​ the leadframe assembly is a first leadframe assembly, and the subassembly includes a second leadframe assembly, the second leadframe assembly including a leadframe housing and a plurality of conductive elements held by the leadframe housing and arranged in a column, each conductive element of the plurality of conductive elements including a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end, wherein: the second leadframe assembly is attached to a second side of the core member, the second side opposite the first side, such that conductive elements of the second leadframe assembly configured for ground are coupled to conductive elements of the first leadframe assembly configured for ground through the lossy material.

11. The subassembly of claim 10, wherein, the conductive elements of the second leadframe assembly configured for ground are offset relative to the conductive elements of the first leadframe assembly configured for ground in a column direction.

12. The subassembly of claim 10, wherein: the first leadframe assembly includes a first shield parallel to the column of conductive elements of the leadframe assembly, and the first leadframe assembly is attached to the core member such that the first shield is adjacent the body of the core member; and the second leadframe assembly includes a second shield parallel to the column of conductive elements of the leadframe assembly, and the second leadframe assembly is attached to the core member such that the second shield is adjacent the body of the core member.

13. The subassembly of claim 12, wherein: the core member includes a third shield within the mating portion and between the first leadframe assembly and the second leadframe assembly, the first shield includes a protrusion that contacts the third shield, and the second shield includes a protrusion that contacts the third shield.

14. The subassembly of claim 13, wherein: the first leadframe assembly includes a fourth shield attached to the core member parallel to the first shield and on a side opposite the first shield, and the second leadframe assembly includes a fifth shield attached to the core member parallel to the second shield and on a side opposite the second shield.

15. The subassembly of claim 14, wherein, the subassembly is in a connector including a plurality of similar subassemblies and a support member, the plurality of subassemblies attached to the support member such that the first shield, the second shield, the third shield, the fourth shield, and the fifth shield of each of the subassemblies are parallel.

16. The subassembly of claim 1, wherein: the conductive elements configured as signal conductors are arranged in pairs, and the conductive elements configured as ground conductors are arranged between adjacent pairs.

17. The subassembly of claim 16, wherein: the conductive elements configured as ground conductors are wider than the conductive elements configured as signal conductors.

18. The subassembly of claim 1, wherein: the mounting ends of the plurality of conductive elements include cable mounting ends.

19. An electrical connector comprising: a plurality of leadframe assemblies, each of the leadframe assemblies comprising a column of conductive elements held by an insulative material, each of the conductive elements comprising a mating end, a mounting end opposite the mating end, and an intermediate portion extending between the mating end and the mounting end; a plurality of core members, at least one of the plurality of leadframe assemblies being attached to each of the plurality of core members; and a housing comprising a first outer wall and a second outer wall opposite the first outer wall and a plurality of inner walls extending between the first outer wall and the second outer wall, wherein: the plurality of core members are inserted into the housing such that the inner walls are between leadframe assemblies attached to adjacent ones of the plurality of core members.

20. The electrical connector of claim 19, wherein: the housing comprises an alignment feature and the plurality of core members comprise a complementary alignment feature, and the alignment feature is engaged to the complementary alignment feature.

21. The electrical connector of claim 19, wherein: the plurality of leadframe assemblies comprise a first type of leadframe assembly and a second type of leadframe assembly, ground conductive elements of the second type of leadframe assembly are offset in a column direction relative to ground conductive elements of the first type of leadframe assembly, and for at least some of the plurality of core members, a first type of leadframe assembly is attached on a first side of the core member and a second type of leadframe assembly is attached on an opposite side of the core member.

22. The electrical connector of claim 21, wherein: a single first type of leadframe assembly is attached to a first one of the plurality of core members at a first end of the housing, a single second type of leadframe assembly is attached to a second one of the plurality of core members at a second end of the housing, and the second end is opposite the first end.

23. The electrical connector of claim 19, wherein: the plurality of inner walls and the first and second outer walls bound a plurality of openings extending through the housing in a first direction; each of the plurality of core members comprises a body and a mating portion, the mating portion being adjacent the mating ends of the conductive elements of at least one leadframe assembly attached to the core member; and the mating portion of the core member comprises a protrusion extending in a direction perpendicular to the first direction.

24. The electrical connector of claim 23, wherein: a first portion of the protrusion extends from a first side of the core member and a second portion of the protrusion extends from a second side of the core member opposite the first side.

25. The electrical connector of claim 24, wherein: the protrusion comprises an insulative protrusion and a lossy protrusion.

26. The electrical connector of claim 23, wherein: ​ The projection of each of the plurality of core members includes an insulative rib between adjacent ones of the mating ends of conductive elements of a corresponding leadframe attached to the core member.

27. The electrical connector of claim 26, wherein: The projection of each of the plurality of core members includes a lossy rib aligned with a subset of the mating ends of conductive elements of a corresponding leadframe attached to the core member.

28. The electrical connector of claim 23, wherein: For each of the plurality of core members: The projection includes an elongate projection parallel to a column of conductive elements of a corresponding leadframe assembly attached to the core member; and The elongate projection is adjacent to a distal tip of a mating end of the column of conductive elements.

29. The electrical connector of claim 28, wherein: For a portion of the core members: The at least one of the plurality of leadframe assemblies includes a first leadframe assembly attached to a first side of the core member and a second leadframe assembly attached to a second side of the core member opposite the core member; The elongate projection is a first elongate projection on the first side of the core member; and The core member includes a second elongate projection on the second side of the core member.

30. The electrical connector of claim 28, wherein: For each of the plurality of core members: The core member includes a mating face and at least one opening configured to receive a mating end of a column of conductive elements of a corresponding leadframe assembly when deflected in mating with a mating connector, and The elongate projection is between the mating face and a distal tip of the mating end of the column of conductive elements.

31. The electrical connector of claim 30, wherein: For each of the plurality of core members: The core member includes a distal end extending from the mating face, the distal end including a shield material.

32. The electrical connector of claim 31, wherein: For each of the plurality of core members: The core member includes an insulative material, and A thickness of the insulative material around the shield material of the distal end is less than a thickness of the insulative material adjacent to the at least one opening of the mating portion of the core member.

33. The electrical connector of claim 31, wherein: The electrical connector includes a first electrical connector; The first electrical connector is mated to a second mating connector including a plurality of second core members and a plurality of second leadframe assemblies, at least one of the plurality of second leadframe assemblies attached to each of the plurality of second core members, and each of the plurality of second leadframe assemblies including a shield; and For each of the plurality of core members of the first electrical connector, the shield material overlaps the shield of an adjacent leadframe assembly of the second mating connector. The mating portion of the core member has a T-shaped cross-section.

34. The electrical connector of claim 23, wherein, ​ 35. A method of manufacturing an electrical connector, the method comprising: molding a connector housing in a mold having a first open / close direction, such that the housing includes at least one opening extending through the housing in a first direction parallel to the first open / close direction; molding a plurality of core members in a mold having a second open / close direction, such that each of the plurality of core members includes a body and a feature extending from the body in a second direction parallel to the second open / close direction; attaching one or more leadframe assemblies to a core member of the plurality of core members, such that contact portions of lead portions of the one or more leadframe assemblies are adjacent to the feature of the core member; and inserting at least a portion of the plurality of core members and the contact portions of the lead portions of the attached leadframe assemblies into the at least one opening in the housing, such that the second direction is orthogonal to the first direction.

36. The method of claim 35, wherein, the housing includes a channel extending in the first direction, and inserting at least a portion of the plurality of core members includes sliding a protrusion of the core member in the channel.

37. The method of claim 35, wherein, the feature extending from the body in the second direction includes an insulative protrusion and a lossy protrusion.

38. The method of claim 35, wherein, the feature extending from the body in the second direction includes an insulative rib between adjacent ones of mating ends of conductive elements of a corresponding leadframe attached to the core member.

39. The method of claim 38, wherein, the feature extending from the body in the second direction includes a lossy rib aligned with a subset of mating ends of conductive elements of a corresponding leadframe attached to the core member.

40. The method of claim 35, wherein: the feature extending from the body in the second direction includes an elongate protrusion parallel to a column of conductive elements of a corresponding leadframe assembly attached to the core member; and the elongate protrusion is adjacent to a distal tip of a mating end of the column of conductive elements.

41. The method of claim 40, wherein: for a portion of the core members: the at least one of the plurality of leadframe assemblies includes a first leadframe assembly attached to a first side of the core member and a second leadframe assembly attached to a second side of the core member opposite the core member; the elongate protrusion is a first elongate protrusion on the first side of the core member; and the core member includes a second elongate protrusion on the second side of the core member.

42. The method of claim 40, wherein: for each of the plurality of core members: the core member includes a mating face and at least one opening configured to receive mating ends of conductive elements of a corresponding leadframe assembly when deflected in mating with a mating connector, and the elongate protrusion is between the mating face and a distal tip of a mating end of the column of conductive elements. ​

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