A chip needle structure for testing electronic wires

Abstract

The present invention discloses a chip needle structure for testing an electronic wire, which includes a chip needle carrier module. The chip needle carrier module includes a carrier body and at least one chip needle assembly. The chip needle assembly includes a plurality of chip needle bodies stacked in sequence. The top of the chip needle body has sawteeth for piercing the electronic wire. The carrier body is provided with an adjusting assembly for adjusting the position of the chip needle assembly. The adjusting assembly includes a slider that can slide back and forth and a differential head connected to the slider and used for adjusting its position. The chip needle assembly is fixed on the slider to adjust the position of the chip needle assembly, so that the electronic wire accurately falls on the sawteeth of the chip needle body; and an elastic pressing copper block module. The elastic pressing copper block module includes at least one gold-plated copper block. The gold-plated copper block presses down with the elastic pressing copper block module to press the electronic wire on the chip needle assembly. The present invention can stably and automatically test the electronic wire.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic wire testing, and particularly to a sheet needle structure for testing electronic wires. Background Art

[0002] At present, the most common methods for testing electronic wires on the market are as follows: The first is to directly poke the electronic wire with an electric pen. This method is the most direct and traditional. However, when the electronic wire is very thin and dense, the electric pen is very likely to accidentally touch the adjacent wire, and the working efficiency is low, which is not suitable for mass production. The second is to transmit signals by contacting the electronic wire with a gold-plated copper block or other conductors. However, this method is unstable because the states of the electronic wires are not the same and are not as perfect as ideal. For example, there will definitely be surface oxidation, too thick solder rosin, surface dirt, etc., and it is not necessarily possible to clean them completely with alcohol. Summary of the Invention

[0003] The present invention aims to solve at least one of the above technical problems in the prior art to a certain extent. For this purpose, an embodiment of the present invention provides a sheet needle structure for testing electronic wires, which can perform stable and automatic testing on electronic wires.

[0004] The sheet needle structure for testing electronic wires according to an embodiment of the present invention includes a sheet needle carrier module. The sheet needle carrier module includes a carrier body and at least one sheet needle assembly. The sheet needle assembly includes a plurality of sheet needle bodies stacked in sequence. The top of the sheet needle body has serrations for piercing the electronic wire. The carrier body is provided with an adjustment component for adjusting the position of the sheet needle assembly. The adjustment component includes a slider that can slide back and forth and a differential head connected to the slider and used to adjust its position. The sheet needle assembly is fixed on the slider to adjust the position of the sheet needle assembly, so that the electronic wire accurately falls on the serrations of the sheet needle body; and an elastic pressing copper block module. The elastic pressing copper block module includes at least one gold-plated copper block. The gold-plated copper block presses down with the elastic pressing copper block module to press the electronic wire on the sheet needle assembly.

[0005] In an optional or preferred embodiment, the carrier body is provided with an installation groove. The slider and the sheet needle body are arranged in the installation groove. The carrier body is provided with a first spring cover at the position of the installation groove. A plurality of first springs are arranged between the first spring cover and the slider. The differential head passes through the carrier body and is connected to the slider.

[0006] In an optional or preferred embodiment, the sheet needle assembly includes a sheet needle base and a sheet needle cover body that are connected to each other. The sheet needle bodies are stacked and fixed in the sheet needle base and the sheet needle cover body.

[0007] In an alternative or preferred embodiment, the needle assembly is connected to the slider by a fastener.

[0008] In an alternative or preferred embodiment, the elastic pressing copper block module includes a plurality of stacked fixing plates, the gold-plated copper block is mounted on the fixing plate, a plurality of guide pins are mounted on the lower side of the fixing plate, and the carrier body is provided with a guide sleeve that cooperates with the guide pins.

[0009] In an alternative or preferred embodiment, a height limiting block is mounted on the lower side of the fixing plate.

[0010] In an alternative or preferred embodiment, a second spring cover plate is mounted on the upper fixing plate, the gold-plated copper block is connected to the second spring cover plate through at least one guiding component, the guiding component includes a linear bearing and a guiding shaft that match each other, the guiding shaft is connected to the gold-plated copper block, and the linear bearing is connected to the spring cover plate.

[0011] In an alternative or preferred embodiment, a plurality of second springs are provided between the gold-plated copper block and the second spring cover plate.

[0012] In an alternative or preferred embodiment, a coil connecting piece connected to the gold-plated copper block is mounted on the second spring cover plate.

[0013] In an alternative or preferred embodiment, the elastic pressing copper block module is driven by a cylinder to press down to achieve automatic testing.

[0014] Based on the above technical solutions, the embodiments of the present invention have at least the following beneficial effects: In the above technical solutions, the product is placed on the needle carrier module, the electronic wire is placed on the needle assembly, and the position of the needle assembly is adjusted by a micrometer head so that the electronic wire accurately falls on the serrations of the needle body. Then, the elastic pressing copper block module presses down. At this time, the electronic wire is below the needle assembly and the gold-plated copper block is above it. Therefore, the electronic wire will be subjected to the downward pressure of the gold-plated copper block and be pierced by the needle body below. There are a plurality of needle bodies in a needle assembly, and not all of the needle bodies are pierced by the electronic wire. The needle bodies that pierce the electronic wire will transmit the signal to the nearby needle bodies, and the nearby needle bodies will then pierce the downward-pressing gold-plated copper block. The gold-plated copper block is then connected to the instrument to obtain data. Because the thickness of the needle body is very thin and there is a gap between the electronic wires, there will definitely be needle bodies that are not pierced by the electronic wire. These needle bodies are not pressed down by the electronic wire but directly contact the gold-plated copper block, and the gold plating process of the needle body and the gold-plated copper block makes its own impedance less than 100 milliohms. The entire testing process is more stable. In practical applications, the elastic pressing copper block module is driven by a cylinder to press down to achieve automatic testing. The present invention can perform stable and automatic testing on electronic wires. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described below in conjunction with the accompanying drawings and embodiments;

[0016] Figure 1 It is a schematic structural diagram of the product;

[0017] Figure 2 It is a schematic structural diagram of an embodiment of the present invention;

[0018] Figure 3 It is an exploded view of the elastic downward pressing copper block module in the embodiment of the present invention Figure 1 ;

[0019] Figure 4 It is an exploded view of the elastic downward pressing copper block module in the embodiment of the present invention Figure 2 ;

[0020] Figure 5 It is a perspective view of the chip pin carrier module in the embodiment of the present invention;

[0021] Figure 6 It is an exploded view of the chip pin carrier module in the embodiment of the present invention;

[0022] Figure 7 It is an exploded view of the chip pin assembly in the embodiment of the present invention;

[0023] Figure 8 It is a schematic structural diagram of the chip pin body in the embodiment of the present invention. Detailed Embodiments

[0024] This part will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The role of the drawings is to supplement the description in the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it should not be construed as a limitation on the protection scope of the present invention.

[0025] In the description of the present invention, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention.

[0026] In the description of the present invention, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0027] In the description of the present invention, unless otherwise clearly defined, terms such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0028] Referring to Figure 1 , the connector 120 on the product 100 is a standard female head, and the electronic wire 110 is led out from the soldering point of the product 100. If the first method described above is adopted, as long as one end of an electric pen is poked into one of the electronic wires and the other electric pen is poked into the corresponding pin of the connector, but this method is extremely cumbersome to operate. The diameter of the electronic wire of the above product is only 0.3 mm, which is very difficult to operate.

[0029] Referring to Figures 2 to 8 , a needle structure for testing electronic wires includes an elastic pressing copper block module 200 and a needle carrier module 300.

[0030] Among them, referring to Figure 5 and Figure 6 , the needle carrier module 300 includes a carrier body 311 and at least one needle assembly 330. The needle assembly 330 includes a plurality of needle bodies 333 stacked in sequence. The top of the needle body 333 has serrations for piercing the electronic wire. In this embodiment, two needle assemblies 330 are provided in total. Specifically, referring to Figure 7 and Figure 8 , the needle assembly 330 includes a needle base 331 and a needle cover 332 connected to each other. The needle bodies 333 are stacked and fixed in the needle base 331 and the needle cover 332. The thickness of each needle body 333 is very thin, usually 0.2 mm.

[0031] In addition, the carrier body 311 is provided with an adjustment component for adjusting the position of the needle assembly 330. The adjustment component includes a slidable slider 341 and a micrometer head 343 connected to the slider 341 and used for adjusting its position. The needle assembly 330 is fixed on the slider 341 to adjust the position of the needle assembly 330, so that the electronic wire 110 accurately falls on the serrations of the needle body 333. Specifically, the needle assembly 330 is connected to the slider 341 through a fastener 351, and the fastener 351 can be a bolt.

[0032] Referring to Figure 3 and Figure 4 , the elastic pressing copper block module 200 includes at least one gold-plated copper block 231. The gold-plated copper block 231 presses down with the elastic pressing copper block module 200 to press the electronic wire 110 onto the needle assembly 330. Correspondingly, two gold-plated copper blocks 231 are provided in the elastic pressing copper block module 200.

[0033] It can be understood that the product 100 is placed on the chip pin carrier module 300, and the electronic wire 110 is placed on the chip pin assembly 330. The position of the chip pin assembly 330 is adjusted by the differential head 343 so that the electronic wire 110 accurately lands on the sawteeth of the chip pin body 333. Then, the elastic pressing copper block module 200 is pressed downwards. At this time, the chip pin assembly 330 is below the electronic wire 110, and the gold-plated copper block 231 is above it. Therefore, the electronic wire 110 will be subjected to the downward pressure of the gold-plated copper block 231 and be pierced by the chip pin body 333 below. There are several chip pin bodies 333 in a chip pin assembly 330, and not all of the chip pin bodies 333 are stuck with the electronic wire 110. The chip pin bodies 333 that are stuck with the electronic wire 110 will transmit signals to the nearby chip pin bodies 333, and the nearby chip pin bodies 333 will then be stuck with the downward-pressed gold-plated copper block 231. Wires are connected to the gold-plated copper block 231 and then to the instrument to obtain data. The chip pin structure for testing electronic wires in this embodiment can overcome the influence of adverse factors such as dirty surface of the electronic wire, residual rosin, and thick soldering tin.

[0034] Because the thickness of the chip pin body is very thin and there is a gap between adjacent electronic wires, there must be chip pin bodies 333 that are not stuck with the electronic wire 11. These chip pin bodies 333 are not pressed down by the electronic wire but directly contact the gold-plated copper block 231. Moreover, the gold-plating process of the chip pin body 333 and the gold-plated copper block 231 makes its own impedance less than 100 milliohms, making the entire testing process more stable.

[0035] In practical applications, the elastic pressing copper block module 200 is driven by a cylinder to press downwards to achieve automatic testing.

[0036] Refer to Figure 6 , an installation groove is provided in the carrier body 311. The slider 341 and the chip pin body 333 are arranged in the installation groove. The carrier body 311 is provided with a first spring cover plate 312 at the position of the installation groove. A number of first springs 342 are arranged between the first spring cover plate and the slider 341. The differential head 343 passes through the carrier body 311 and is connected to the slider 341. Through the cooperation of the differential head 343 and each first spring 342, the position of the chip pin assembly can be adjusted.

[0037] Refer to Figure 3As shown in FIGS. 4, the elastic downward pressing copper block module 200 includes a plurality of stacked fixing plates 211. The gold-plated copper blocks 231 are installed on the fixing plates 211. A plurality of guide pins 221 are installed on the lower side surface of the fixing plates 211. The carrier body 311 is installed with bushings 321 that cooperate with the guide pins 221. A height limiting block 222 is installed on the lower side surface of the fixing plates 211. Further, a second spring cover plate 222 is installed on the upper fixing plate 211. The gold-plated copper blocks 231 are connected to the second spring cover plate 222 through at least one guiding component. The guiding component includes a linear bearing 242 and a guide shaft 241 that match each other. The guide shaft 241 is connected to the gold-plated copper block 231, and the linear bearing 242 is connected to the second spring cover plate 222. A plurality of second springs 243 are arranged between the gold-plated copper blocks 231 and the second spring cover plate 222. Through this solution, the downward movement direction of the gold-plated copper blocks 231 and the downward pressure on the electronic wires can be controlled.

[0038] Specifically, a connection coil 251 connected to the gold-plated copper block 231 is installed on the second spring cover plate 222. The gold-plated copper block 231 is wired to the instrument through the connection coil 251.

[0039] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those of ordinary skill in the art.

Claims

1. A sheet needle structure for testing electronic wires, characterized in that: It includes a sheet needle carrier module, the sheet needle carrier module includes a carrier body and at least one sheet needle assembly, the sheet needle assembly includes a plurality of sheet needle bodies stacked in sequence, the top of the sheet needle body has sawteeth for piercing the electronic wire, the carrier body is provided with an adjusting component for adjusting the position of the sheet needle assembly, the adjusting component includes a slidable slider and a differential head connected to the slider and used for adjusting its position, the sheet needle assembly is fixed on the slider to adjust the position of the sheet needle assembly, so that the electronic wire accurately falls on the sawteeth of the sheet needle body; and an elastic pressing copper block module, the elastic pressing copper block module includes at least one gold-plated copper block, the gold-plated copper block presses down with the elastic pressing copper block module to press the electronic wire on the sheet needle assembly, the electronic wire is pierced by the underlying sheet needle body, a sheet needle assembly has several sheet needle bodies, not all sheet needle bodies are pierced with the electronic wire, the sheet needle body that pierces the electronic wire will transmit the signal to the nearby sheet needle bodies, the nearby sheet needle bodies then pierce the pressing gold-plated copper block, and the gold-plated copper block is then wired to the instrument to obtain data.

2. The sheet needle structure for testing electronic wires according to claim 1, characterized in that: The carrier body is provided with an installation groove, the slider and the sheet needle body are arranged in the installation groove, the carrier body is provided with a first spring cover plate at the position of the installation groove, several first springs are arranged between the first spring cover plate and the slider, and the differential head passes through the carrier body and is connected to the slider.

3. The sheet needle structure for testing electronic wires according to claim 1, characterized in that: The sheet needle assembly includes a sheet needle base and a sheet needle cover body connected to each other, and the sheet needle bodies are stacked and fixed in the sheet needle base and the sheet needle cover body.

4. The sheet needle structure for testing electronic wires according to claim 1, characterized in that: The sheet needle assembly is connected to the slider through a fastener.

5. The sheet needle structure for testing electronic wires according to any one of claims 1 to 4, characterized in that: The elastic pressing copper block module includes several stacked fixing plates, the gold-plated copper block is installed on the fixing plate, several guide pins are installed on the lower side of the fixing plate, and the carrier body is provided with a guide sleeve matched with the guide pins.

6. The sheet needle structure for testing electronic wires according to claim 5, characterized in that: A height limiting block is installed on the lower side of the fixing plate.

7. The sheet needle structure for testing electronic wires according to claim 5, characterized in that: The upper fixing plate is provided with a second spring cover plate, the gold-plated copper block is connected to the second spring cover plate through at least one guiding component, the guiding component includes a linear bearing and a guiding shaft that match each other, the guiding shaft is connected to the gold-plated copper block, and the linear bearing is connected to the spring cover plate.

8. The sheet needle structure for testing electronic wires according to claim 7, characterized in that: Several second springs are arranged between the gold-plated copper block and the second spring cover plate.

9. The sheet needle structure for testing an electronic wire according to claim 7, characterized in that: a connection coil connected to the gold-plated copper block is installed on the second spring cover plate.

10. The sheet needle structure for testing an electronic wire according to claim 5, characterized in that: the elastic downward pressing copper block module is driven by a cylinder to press downward to achieve automatic testing.

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