Method and device for processing thickness of plate, processing equipment and storage medium

Abstract

This invention relates to a method, apparatus, device, and storage medium for processing plate thickness. The method includes: receiving a selected target material and obtaining a first plate thickness corresponding to the target material; determining whether the first plate thickness matches a second plate thickness corresponding to the current material, and obtaining a corresponding thickness matching result; when the thickness matching result fails, adjusting the plate thickness to reach the first plate thickness. This achieves the technical effect of automatically updating and obtaining the correct plate thickness.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of home decoration design technology, and in particular to a method, apparatus, processing equipment and storage medium for processing board thickness. Background Technology

[0002] In the field of home decoration design technology, the design and use of panels are involved. Different materials often have process requirements for panel thickness. When designers apply materials to panels, it is difficult to set the correct panel thickness if the material and panel thickness are not related. This leads to rework when the process requirements cannot be met during the later production stage, wasting panel materials and manpower, and reducing design efficiency and the accuracy of panel thickness usage.

[0003] Therefore, how to automatically update and obtain the correct sheet thickness has become an urgent problem to be solved. Summary of the Invention

[0004] In view of this, in order to solve the above-mentioned technical problem of automatically updating and obtaining the correct board thickness, the present invention provides a method, apparatus, processing device and storage medium for processing board thickness.

[0005] In a first aspect, embodiments of the present invention provide a method for processing the thickness of a plate, comprising:

[0006] Receive the selected target material and obtain the thickness of the first plate corresponding to the target material;

[0007] Determine whether the thickness of the first plate matches the thickness of the second plate corresponding to the current material, and obtain the corresponding thickness matching result;

[0008] If the thickness matching result fails, the thickness of the plate is adjusted to reach the thickness of the first plate.

[0009] In one possible implementation, prior to receiving the selected target material, the method further includes:

[0010] Create a material information database;

[0011] For the same type of board, multiple material information is entered and stored in the material information database. The material information includes at least the material name and the corresponding board thickness.

[0012] In one possible implementation, receiving the selected target material and obtaining the first plate thickness corresponding to the target material includes:

[0013] Obtain the target material name corresponding to the target material;

[0014] The target material name is matched with the material information in the material information database to obtain the matching result of the target material name;

[0015] When the matching result of the target material name is successful, the thickness of the first plate corresponding to the target material name in the material information database is obtained.

[0016] In one possible implementation, the method includes:

[0017] When the matching result of the target material name fails, a reminder message is generated and displayed;

[0018] or,

[0019] When the target material name is successfully matched, it is determined whether the thickness of the first plate of the target material is consistent with the thickness of the second plate of the current material.

[0020] In one possible implementation, when the target material name matching result is successful, determining whether the thickness of the first plate of the target material is consistent with the thickness of the second plate of the current material includes:

[0021] When the thickness of the first plate is the same as the thickness of the second plate, the thickness matching result is determined to be successful, and the thickness of the plate is maintained at the thickness of the second plate.

[0022] or,

[0023] When the thickness of the first plate is inconsistent with the thickness of the second plate, the thickness matching result is determined to be unsuccessful, and the thickness of the plate is updated to the thickness of the first plate.

[0024] In one possible implementation, the method includes:

[0025] The thickness of the first plate is compared with the thickness of the second plate to determine the thickness status of the plate.

[0026] In one possible implementation, the method includes:

[0027] When the thickness of the first board is equal to the thickness of the second board, the thickness of the board is determined to be in a successful application state, and the thickness of the board is maintained at the thickness of the second board.

[0028] or,

[0029] When the thickness of the first plate is greater than the thickness of the second plate, the thickness of the plate is determined to be thin, and the thickness of the plate is increased to make the thickness of the plate reach the thickness of the first plate.

[0030] or,

[0031] When the target thickness data is less than the plate thickness data, the plate thickness is determined to be in a heavy state, and the plate thickness is reduced so that the plate thickness reaches the first plate thickness.

[0032] In one possible implementation, the method further includes:

[0033] When the thickness of the plate is updated to the thickness of the first plate of the target material, a message notification indicating a successful change is generated and sent to the terminal device.

[0034] Secondly, embodiments of the present invention provide an apparatus for processing plate thickness, comprising:

[0035] The receiving module is used to receive the selected target material and obtain the thickness of the first plate corresponding to the target material;

[0036] The judgment module is used to determine whether the thickness of the first plate matches the thickness of the second plate corresponding to the current material, and to obtain the corresponding thickness matching result.

[0037] An adjustment module is used to adjust the thickness of the plate to the first plate thickness when the thickness matching result fails.

[0038] Thirdly, embodiments of the present invention provide a processing device, including: a processor and a memory, wherein the processor is configured to execute a processing program for plate thickness stored in the memory to implement the plate thickness processing method described in any of the first aspects.

[0039] Fourthly, embodiments of the present invention provide a storage medium storing one or more programs, which can be executed by one or more processors to implement the plate thickness processing method described in any of the first aspects.

[0040] The plate thickness processing scheme provided in this embodiment of the invention receives a selected target material and obtains a first plate thickness corresponding to the target material; determines whether the first plate thickness matches a second plate thickness corresponding to the current material, and obtains a corresponding thickness matching result; when the thickness matching result fails, adjusts the plate thickness to reach the first plate thickness. Thus, the technical effect of automatically updating and obtaining the correct plate thickness can be achieved. Attached Figure Description

[0041] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0042] Figure 1A schematic flowchart illustrating a method for processing plate thickness according to an embodiment of the present invention;

[0043] Figure 2 A flowchart illustrating another method for processing plate thickness provided in an embodiment of the present invention;

[0044] Figure 3 A schematic diagram of a plate thickness processing device provided in an embodiment of the present invention;

[0045] Figure 4 This is a schematic diagram of a processing device provided in an embodiment of the present invention. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] In this invention, the terms "comprising" and "having" are used to indicate an open-ended inclusion, meaning that additional elements / components / etc. may exist besides those listed. The terms "first" and "second," etc., are used only as labels and are not intended to limit the number of objects. Furthermore, the different elements and areas in the drawings are only schematic, and therefore the invention is not limited to the dimensions or distances shown in the drawings.

[0048] To facilitate understanding of the embodiments of the present invention, further explanations and descriptions will be provided below with reference to the accompanying drawings and specific embodiments. These embodiments do not constitute a limitation on the embodiments of the present invention.

[0049] Sheet thickness refers to the minimum application thickness of a specific sheet material for an industrially designed sheet component, set under various constraints such as application environment and influencing factors. This thickness standard is used to regulate and define usage criteria. Different sheet materials can be selected, and each material has a defined minimum application thickness standard.

[0050] Figure 1 This is a flowchart illustrating a method for processing plate thickness according to an embodiment of the present invention. The execution entity of the present invention is a software system, based on... Figure 1 The provided diagrams show the specific methods for handling sheet metal thickness, including:

[0051] S101. Receive the selected target material and obtain the thickness of the first plate corresponding to the target material.

[0052] The execution subject of this invention is a software system. The system contains operating software. By selecting a material in the software and comparing it with the thickness corresponding to the current material, it is determined whether the thickness of the plate corresponding to the replacement material needs to be changed.

[0053] The target material mentioned here can be understood as a material that needs to be replaced for the panel material. This material can be, but is not limited to, mahogany, stainless steel, or other materials used in home decoration design. The first panel thickness mentioned here can be understood as a specified thickness requirement for a certain panel material. For this type of material, the required thickness standard is the first panel thickness.

[0054] Furthermore, within the operating software, a specific board material is selected, and the material of the current board material is changed. The material to be replaced is set as the target material, and the required thickness of the board material under the target material condition is obtained as the first board thickness.

[0055] S102. Determine whether the thickness of the first plate matches the thickness of the second plate corresponding to the current material, and obtain the corresponding thickness matching result.

[0056] The second plate thickness mentioned here can be understood as the standard thickness required when a material category is applied to a specified plate. In this invention, the material corresponding to the second plate thickness is the material category applied to the current plate. The thickness matching result mentioned here can be understood as the result of determining whether the thickness meets the thickness requirements for changing the material.

[0057] Furthermore, obtain the current material information corresponding to the current material on the board in the current application, obtain the required second board thickness data corresponding to the current material category, match the board thickness of the current material to be replaced with the board thickness of the target material to be replaced, determine whether the thicknesses of the two boards are the same, and then determine the matching result.

[0058] S103. When the thickness matching result fails, adjust the plate thickness to reach the first plate thickness.

[0059] The failure to match here can be understood as the thickness of the second plate used in the current material condition being different from the thickness of the first plate used in the target material condition.

[0060] Furthermore, when the thickness of the second board used in the current material condition is different from the thickness of the first board used in the target material condition, it is determined that the thickness of the board to be replaced by the target material is different. The thickness of the board in the current material cannot reach the thickness of the board in the target material condition. The thickness data of the second board needs to be adjusted and updated to the thickness of the first board corresponding to the target material. This completes the adjustment process of replacing the board thickness from the current material to the target material, thereby achieving the technical effect of automatic updating and obtaining the correct board thickness.

[0061] The plate thickness processing scheme provided in this invention receives the selected target material and obtains the first plate thickness corresponding to the target material; it determines whether the first plate thickness matches the second plate thickness corresponding to the current material, obtaining the corresponding thickness matching result; when the thickness matching result fails, it adjusts the plate thickness to reach the first plate thickness. A replacement process is performed when applying materials to the plate, and by matching different thicknesses corresponding to different materials, a thickness that meets the standard requirements of the material is obtained, and the plate thickness is automatically updated to the correct thickness. Thus, the technical effect of automatically updating and obtaining the correct plate thickness can be achieved.

[0062] Figure 2 This is a flowchart illustrating another method for processing plate thickness according to an embodiment of the present invention. The executing entity of the present invention is a software system, and the device used in this embodiment can be an application in home decoration design software. Figure 2 This is based on the previous embodiment. Figure 2 The provided diagrams also include specific methods for handling sheet metal thickness:

[0063] S201. Create a material information database.

[0064] The execution subject of this invention is a software system. The system contains operating software. By selecting a material that is pre-stored in the system for a design board in the software, and comparing it with the thickness corresponding to the current material, it is determined whether the thickness of the board corresponding to the replacement material needs to be changed.

[0065] The material information database mentioned here can be understood as a database used to store various material information corresponding to various panels. The material information here can be, but is not limited to, multiple different materials limited to a specific panel. For example, for the door panel in home decoration design, multiple materials can be selected in advance, such as oak, aluminum alloy, tempered glass, etc. In addition to the material type, each material information can also include information such as size, color, and thickness for the same material category.

[0066] Furthermore, a material information database is created through the software system to store material information for various types of panels in the home decoration design software.

[0067] S202. For the same type of board, enter multiple material information and store the multiple material information in the material information database. The material information shall at least include the material name and the corresponding board thickness.

[0068] The material name mentioned here can be understood as a category name set for a specific material type, used to distinguish different types of materials. For example, for a cabinet door panel, the material type could be oak, and oak could be set as the material name. The corresponding panel thickness mentioned here can be understood as the standard required thickness corresponding to the selected material name. This standard required thickness can be used in the design of a specified panel. Each material corresponds to a standard panel thickness, and the standard panel thicknesses for multiple materials can be the same or different.

[0069] Furthermore, after creating the material information database, various material information is collected and stored within it. To enrich the types and quantity covered by the database, information on multiple materials used for various panel types can be collected. For each panel type, multiple possible material information can be stored, allowing for the entry of multiple application panels in home decoration design and expanding the database's application scope. Simultaneously, the database stores multiple material information corresponding to the same panel type, with each stored material information including the corresponding material name and the thickness of the panel to which it is applied. It may also include color or size information for the material.

[0070] In one possible scenario, during the modeling and design process in home decoration software, a material information library is first created to store various material information corresponding to different panels used in the design. This material information can include material name, panel thickness specified by the material, material color, or material size, and is stored in the material information library. When designing cabinet doors in home decoration modeling, the system can select a panel for the cabinet door from the material information. The software system will then display various material information corresponding to the cabinet door, which may include oak, walnut, or tempered glass materials used for the cabinet door. After selecting oak, related material information will also be displayed, which may include, but is not limited to, various selectable colors for oak, changeable dimensions, or information such as a 10 cm thickness specified for the cabinet door.

[0071] S203. Obtain the target material name corresponding to the target material.

[0072] The target material mentioned here can be understood as another material that needs to replace the board material. This material can be, but is not limited to, mahogany, resin, acrylic, stainless steel, or other materials used in home decoration design for different board materials.

[0073] Furthermore, within the operating software, a specific board is selected for design, and the material of the current board is changed. The material to be replaced is set as the target material, and the material name of the corresponding material category for the target material is obtained.

[0074] S204. Match the target material name with the material information in the material information database to obtain the matching result of the target material name.

[0075] The matching result mentioned here can be understood as determining whether material information with the same name as the target material is found in the material information database. For example, when the target material name is oak, if oak is selected as the material for the cabinet door panel being processed, the corresponding oak material category for the cabinet door material information will be searched in the material information database first.

[0076] Furthermore, when the currently processed board is selected and the board material is selected as the target material, the target material name information corresponding to the target material is first obtained. Then, the material information library is searched to see if there is any material information that matches the required target material name. Finally, the matching result is displayed, which may be displayed in the form of a software pop-up window, or in the form of voice or ringtone, to indicate whether the matching result is successful.

[0077] S205. When the target material name is successfully matched, obtain the thickness of the first plate corresponding to the target material name in the material information database.

[0078] The first plate thickness mentioned here can be understood as a specified thickness requirement for a certain type of plate. For the target material, the thickness standard used is set as the first plate thickness.

[0079] Furthermore, when the selected target material name is found to be the same material name in the material information database, the standard thickness set for the corresponding material name is obtained, and the obtained standard thickness is used as the first plate thickness corresponding to the target material.

[0080] S206. When the matching result of the target material name fails, generate a reminder message and display the reminder message.

[0081] The reminder message mentioned here can be understood as a prompt, used to inform the user that the specified target material was not found in the current material information library.

[0082] Furthermore, if the selected target material name is not found in the material information database, it is determined that the target material does not exist in the current material information database, indicating a matching failure. A matching failure reminder message is generated and displayed to prompt the user to take action through a pop-up window or voice prompt.

[0083] Optionally, when the matching result of the target material name fails, the target material name can be manually entered in the processing interface of the design software to obtain the recommended sheet thickness in the online database.

[0084] In one possible scenario, during the modeling process of home decoration design, for the design of door panels, a material, such as aluminum alloy, is first selected in the door material module of the software interface. After receiving the selected aluminum alloy door panel, the system matches it with the door panel category module pre-stored in the material information database. If an aluminum alloy door panel is found in the material information database, the match is considered successful, and the standard thickness of the panel associated with the aluminum alloy door panel in the material information database is used as the thickness of the aluminum alloy door panel. If no aluminum alloy door panel is found in the material information database, the match is considered a failure, indicating that the desired aluminum alloy material is not available in the current material information database. This failure can be displayed as a pop-up message in the software interface, prompting the user to modify or change the material category. Alternatively, the user can manually input the aluminum alloy material in an editable section of the software interface, and obtain the corresponding panel thickness through network recommendations via a network connection.

[0085] S207. When the target material name is successfully matched, determine whether the thickness of the first plate of the target material is consistent with the thickness of the second plate of the current material.

[0086] The second plate thickness mentioned here can be understood as the standard thickness required when a material category is applied to a specified plate. In this invention, the material corresponding to the second plate thickness is the plate thickness corresponding to the material category applied to the current plate. The "whether they are consistent" can be understood as whether the first plate thickness is the same as the second plate thickness of the current material.

[0087] Furthermore, when the selected target material name is found to be the same as the material name in the material information database, the standard thickness set for the corresponding material name is obtained, and the obtained standard thickness is used as the first plate thickness corresponding to the target material. At the same time, the current material information corresponding to the current plate is obtained, and the second plate thickness data corresponding to the standard thickness is obtained according to the current material category. The thickness data here may include not only the thickness value, but also the characteristic parameters of the thickness (such as the thickness load-bearing capacity). The second plate thickness of the current material to be replaced is compared with the first plate thickness corresponding to the target material to be replaced, and it is determined whether the thicknesses of the two plates are the same, thereby determining whether the thicknesses of the first plate and the second plate are consistent.

[0088] S208. When the thickness of the first plate is consistent with the thickness of the second plate, the thickness matching result is confirmed to be successful, and the plate thickness is maintained at the thickness of the second plate.

[0089] Furthermore, the thickness of the second board of the current material to be replaced is compared with the thickness of the first board corresponding to the target material to be replaced, to determine if the two board thicknesses are the same. If the thickness of the first board is the same as the thickness of the second board, then the thickness of the first board is determined to be the same as the thickness of the second board, and the thickness matching is successful. Then, the thickness of the second board corresponding to the current material is set as the thickness of the board of the target material after replacement. That is, when designing for a board, when replacing the current material of the board, only the material information is replaced, and the board thickness is not changed; the current board thickness continues to be used.

[0090] S209. When the thickness of the first plate is inconsistent with the thickness of the second plate, the thickness matching result is determined to be unsuccessful, and the plate thickness is updated to the thickness of the first plate.

[0091] Furthermore, the thickness of the second board component of the current material to be replaced is compared with the thickness of the first board component corresponding to the target material to be replaced, to determine if the two board thicknesses are the same. If the thicknesses of the first and second boards are inconsistent, it is determined that the thicknesses of the first and second boards are different, indicating a thickness matching failure. In this case, the thickness of the second board component corresponding to the current material is used as the thickness of the first board component of the target material after replacement. That is, when designing for a board component, to replace the current material of the board component, first replace it with the target material, then modify the board thickness to match the thickness of the first board component for use.

[0092] In one possible scenario, using home decoration design software to design the flooring components, the software first identifies the current flooring material as marble. When changing the flooring material to oak, after selecting oak, the software extracts the oak material information and compares it with the corresponding flooring component design information in the system's material database. When the corresponding oak material is found, the software determines that the standard thickness of the board used for oak is 8mm, while the standard thickness for marble is 6mm. Then, the software confirms the correct thickness. If the thickness of the floorboards used for the two materials is different, a matching failure message can be displayed in a pop-up window of the software. Simultaneously, the currently used marble flooring can be replaced with oak flooring, and the software will automatically adjust the floorboard thickness to 8mm to match the oak flooring for home decoration design. Similarly, if the standard floorboard thickness for marble is also 8mm, and the thickness of the marble and oak floorboards is determined to be the same, the currently used marble flooring can be replaced with oak flooring, and the currently set floorboard thickness of 8mm can be retained for home decoration design. This completes the replacement of the target material without changing the floorboard thickness.

[0093] S210. Compare the thickness of the first plate with the thickness of the second plate to determine the thickness status of the plate.

[0094] The thickness mentioned here can be understood as the thickness of a sheet metal piece made of one material, while the sheet metal piece made of another material is either thick or thin. This can be, but is not limited to, a thin or heavy state.

[0095] Furthermore, the thickness of the first plate corresponding to the selected target material is compared with the thickness of the second plate corresponding to the current material to determine the relationship between the two, and then the thickness state of the target material is determined.

[0096] S211. When the thickness of the first plate is equal to the thickness of the second plate, the plate thickness is determined to be in the application success state, and the plate thickness is maintained at the thickness of the second plate.

[0097] The term "application success" here can be understood as a state where no changes to the sheet thickness data are required, meaning that after modifying the material, the corresponding sheet thickness does not need to be modified.

[0098] Furthermore, when the thickness of the first board corresponding to the selected target material is compared with the thickness of the second board corresponding to the current material, and the thickness of the first board is equal to the thickness of the second board, it is determined that the standard application board thickness of the current material and the target material is the same. After only changing the current material category to the target material category, the board thickness is not modified, and the board thickness in the software design remains unchanged as the thickness of the second board. The board thickness is determined to be in the application successful state, and the automatic replacement of the board is completed.

[0099] S212. When the thickness of the first plate is greater than the thickness of the second plate, the plate thickness is determined to be thin, and the plate thickness is increased so that the plate thickness reaches the thickness of the first plate.

[0100] The term "thin and light" here can be understood as the current thickness of the board being thin and light, meaning that after modifying the material, the thickness of the board needs to be increased.

[0101] Furthermore, when comparing the thickness of the first board corresponding to the selected target material with the thickness of the second board corresponding to the current material, if the thickness of the first board is greater than the thickness of the second board, it is determined that the thickness of the second board of the current material is thinner than the thickness of the first board corresponding to the target material, thus determining that the thickness of the current board is in a thinner state. The thickness of the current board needs to be increased to meet the requirement of replacing it with the thickness of the first board corresponding to the target material. That is, after changing the current material category to the target material category, the thickness of the current board is modified by increasing the thickness of the board in the software design to adjust it to the thickness of the first board corresponding to the target material, thus completing the automatic replacement of the board.

[0102] S213. When the target thickness data is less than the plate thickness data, the plate thickness is determined to be in a heavy state, and the plate thickness is reduced so that the plate thickness reaches the first plate thickness.

[0103] The term "heavy state" here can be understood as the current plate thickness being heavy, meaning that after modifying the material, the current plate thickness needs to be reduced.

[0104] Furthermore, when comparing the thickness of the first board corresponding to the selected target material with the thickness of the second board corresponding to the current material, if the thickness of the first board is less than the thickness of the second board, it is determined that the thickness of the second board of the current material is heavier than the thickness of the first board corresponding to the target material, thus determining that the thickness of the current board is in a heavy state. The thickness of the current board needs to be reduced to meet the requirement of replacing it with the thickness of the first board corresponding to the target material. That is, after changing the current material category to the target material category, the thickness of the current board is modified. By reducing the thickness of the board in the software design, it is adjusted to the thickness of the first board corresponding to the target material, completing the automatic replacement of the board.

[0105] In one possible scenario, in home design software, a cabinet door is selected as the current design panel. The default material for this door is oak, and the standard thickness for oak doors displayed in the software's designated area is 20mm. When changing the oak door panel, the software selects a resin glass material from the designated display module. By matching this material with the stored material database, the standard thickness for resin glass door panels is found to be 25mm. By comparing the standard thickness values ​​of oak and resin glass, the oak door panel is determined to be the correct material. The standard thickness of the panel is 20mm, which is less than the standard thickness of the resin glass door panel (25mm). This indicates the current software design for the door is too thin. Therefore, the selected resin glass material needs to be replaced with the current oak material. Simultaneously, the currently displayed panel thickness of 20mm should be automatically adjusted to 25mm to match the standard thickness of the selected resin glass material, completing the automatic panel thickness update process. Similarly, when the standard thickness of the corresponding resin glass door panel (25mm) is obtained by matching it with the stored material database, the software will automatically update the panel thickness. 0mm indicates that the standard thickness of the current oak door panel is 20mm, which is equal to the standard thickness of the resin glass panel. This confirms the software's door design is successfully applied. Therefore, the thickness should remain unchanged at 20mm while selecting resin glass to replace the current oak material. Similarly, by matching the standard thickness of the corresponding resin glass door panel (18mm) from the stored material database, and comparing the standard thicknesses of oak and resin glass, it is determined that the oak panel's 20mm thickness is greater than the resin glass panel's 18mm thickness. This indicates the software's door design is too thick. Therefore, the software should select resin glass to replace the current oak material and automatically adjust the displayed panel thickness from 20mm to 18mm, matching the selected resin glass thickness. This completes the automatic thickness update process.

[0106] S214. When the thickness of the board is updated to the thickness of the first board of the target material, a message notification of successful change is generated and sent to the terminal device.

[0107] The terminal devices mentioned here may include, but are not limited to, control devices associated with the design software, external monitoring devices, or devices such as mobile phones and email that can receive message notifications.

[0108] Furthermore, after changing the material category of the current board to the target material category, the board thickness is updated to the first board thickness corresponding to the target material, completing the automatic update processing of the board thickness. At the same time, a message reminder is generated to indicate that the board thickness change event has been successfully completed. The message reminder is sent to a specified email address, mobile phone, or the upper-level management server corresponding to the design software to complete the technical effect of automatic update and obtaining the correct board thickness.

[0109] This invention provides a method for processing the thickness of a board component. By pre-creating a material information database to store various material information corresponding to a given board component, when changing the material category of the current board component, the method first obtains the name of the target material, finds the specified first board component thickness in the material information database, and compares the first board component thickness with the second board component thickness corresponding to the current material. If the two board component thicknesses are the same, the software only needs to modify the current material name to the target material name to automatically update the board component thickness. If the first board component thickness is greater than the second board component thickness corresponding to the current material, it is determined that the current material's board component thickness is in a thin state. By increasing the second board component thickness to reach the first board component thickness, the method automatically updates the board component thickness. Similarly, if the first board component thickness is less than the second board component thickness corresponding to the current material, it is determined that the current material's board component thickness is in a thick state. By decreasing the second board component thickness to reach the first board component thickness, the method automatically updates the board component thickness. A notification message is then sent to the terminal device to notify that the board component thickness update is successful, thus achieving the technical effect of automatically updating and obtaining the correct board component thickness.

[0110] Figure 3 This is a schematic diagram of a plate thickness processing device provided in an embodiment of the present invention. Figure 3 The provided diagram shows that the sheet metal thickness processing device specifically includes:

[0111] The receiving module 31 is used to receive the selected target material and obtain the thickness of the first plate corresponding to the target material;

[0112] The judgment module 32 is used to determine whether the thickness of the first plate matches the thickness of the second plate corresponding to the current material, and to obtain the corresponding thickness matching result;

[0113] The adjustment module 33 is used to adjust the thickness of the plate to the first plate thickness when the thickness matching result fails.

[0114] The door control device of the equipment provided in this embodiment can be as follows: Figure 3 The door control device of the equipment shown can perform actions such as Figure 1-2 All steps of the door control method for the equipment, thereby achieving Figure 1-2For details on the technical effects of the door control method of the device shown, please refer to [link / reference]. Figure 1-2 The relevant descriptions are presented concisely and will not be elaborated upon here.

[0115] Figure 4 This is a schematic diagram of the structure of a processing device provided in an embodiment of the present invention. Figure 4 The processing device 400 shown includes at least one processor 401, a memory 402, at least one network interface 404, and other user interfaces 403. The various components in the processing device 400 are coupled together via a bus system 405. It is understood that the bus system 405 is used to implement communication between these components. In addition to a data bus, the bus system 405 also includes a power bus, a control bus, and a status signal bus. However, for clarity, ... Figure 4 The general designated all buses as Bus System 405.

[0116] The user interface 403 may include a display, keyboard, or clicking device (e.g., mouse, trackball, touchpad, or touchscreen).

[0117] It is understood that the memory 402 in the embodiments of the present invention can be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DRRAM). The memory 402 described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0118] In some implementations, memory 402 stores elements, executable units or data structures, or subsets thereof, or extended sets thereof: operating system 4021 and application program 4022.

[0119] The operating system 4021 includes various system programs, such as the framework layer, core library layer, and driver layer, used to implement various basic business functions and handle hardware-based tasks. The application program 4022 includes various applications, such as a media player and a browser, used to implement various application functions. The program implementing the method of this embodiment can be included in the application program 4022.

[0120] In this embodiment of the invention, by calling the program or instructions stored in the memory 402, specifically the program or instructions stored in the application program 4022, the processor 401 executes the method steps provided in each method embodiment, including, for example:

[0121] Receive the selected target material and obtain the thickness of the first plate corresponding to the target material; determine whether the thickness of the first plate matches the thickness of the second plate corresponding to the current material, and obtain the corresponding thickness matching result; when the thickness matching result fails, adjust the plate thickness to reach the thickness of the first plate.

[0122] The methods disclosed in the above embodiments of the present invention can be applied to processor 401, or implemented by processor 401. Processor 401 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the integrated logic circuit of the hardware in processor 401 or by instructions in the form of software. The processor 401 may be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the methods disclosed in the embodiments of the present invention can be directly embodied in the execution of a hardware decoding processor, or executed by a combination of hardware and software units in the decoding processor. The software units may be located in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. The storage medium is located in memory 402. Processor 401 reads the information in memory 402 and, in conjunction with its hardware, completes the steps of the above method.

[0123] It is understood that the embodiments described herein can be implemented in hardware, software, firmware, middleware, microcode, or a combination thereof. For hardware implementation, the processing unit can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers, microprocessors, other electronic units for performing the functions described herein, or combinations thereof.

[0124] For software implementation, the techniques described herein can be implemented by units that perform the functions described herein. The software code can be stored in memory and executed by a processor. The memory can be implemented in the processor or external to the processor.

[0125] The processing device provided in this embodiment can be as follows: Figure 4 The processing device shown can perform, for example Figure 1-2 All steps of the method for handling the thickness of medium-sized plates, thereby achieving... Figure 1-2 For details on the technical effects of the plate thickness treatment method shown, please refer to [link / reference needed]. Figure 1-2 The relevant descriptions are presented concisely and will not be elaborated upon here.

[0126] This invention also provides a storage medium (computer-readable storage medium). This storage medium stores one or more programs. The storage medium may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as read-only memory, flash memory, hard disk, or solid-state drive; the memory may also include combinations of the above types of memory.

[0127] When one or more programs in the storage medium can be executed by one or more processors to implement the above-described method for processing board thickness executed on the processing device side.

[0128] The processor is used to execute a processing program for board thickness stored in memory to implement the following steps of a board thickness processing method executed on the processing device side:

[0129] Receive the selected target material and obtain the thickness of the first plate corresponding to the target material; determine whether the thickness of the first plate matches the thickness of the second plate corresponding to the current material, and obtain the corresponding thickness matching result; when the thickness matching result fails, adjust the plate thickness to reach the thickness of the first plate.

[0130] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0131] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented in hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0132] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method of treating the thickness of a sheet member, characterized by, The method comprises the following steps: receiving a selected target material, and obtaining a first plate thickness corresponding to the target material; determining whether the first plate thickness matches a second plate thickness corresponding to a current material, and obtaining a corresponding thickness matching result; when the thickness matching result fails, adjusting the plate thickness to the first plate thickness; wherein, before receiving the selected target material, the method further comprises: creating a material information library; entering multiple material information for the same plate, and storing the multiple material information in the material information library, wherein the material information at least includes a material name and a plate thickness corresponding to the material; receiving the selected target material, and obtaining the first plate thickness corresponding to the target material, comprising: obtaining a target material name corresponding to the target material; matching the target material name with the material information in the material information library to obtain a matching result of the target material name; when the matching result of the target material name is successful, obtaining the first plate thickness corresponding to the target material name in the material information library; the method comprises: when the matching result of the target material name fails, generating a reminder message and displaying the reminder message; or, when the matching result of the target material name is successful, determining whether the first plate thickness of the target material matches the second plate thickness of the current material; when the matching result of the target material name is successful, determining whether the first plate thickness of the target material matches the second plate thickness of the current material, comprising: when the first plate thickness matches the second plate thickness, it is determined that the thickness matching result is successful, and the plate thickness is maintained as the second plate thickness; or, when the first plate thickness does not match the second plate thickness, it is determined that the thickness matching result fails, and the plate thickness is updated to the first plate thickness.

2. The method of claim 1, wherein, the method comprises: comparing the first plate thickness with the second plate thickness to determine the thickness state of the plate thickness.

3. The method of claim 2, wherein, the method comprises: when the first plate thickness is equal to the second plate thickness, it is determined that the plate thickness is in an application success state, and the plate thickness is maintained as the second plate thickness; or, when the first plate thickness is greater than the second plate thickness, it is determined that the plate thickness is in a thin state, and the plate thickness is increased to the first plate thickness; or, when the target thickness data is less than the plate thickness data, it is determined that the plate thickness is in a thick state, and the plate thickness is reduced to the first plate thickness.

4. The method of claim 1, wherein, the method further comprises: when the plate thickness is updated to the first plate thickness of the target material, a message reminder of successful change is generated and sent to a terminal device.

5. A device for processing the thickness of a sheet member, characterized by The method comprises the following steps: a receiving module for receiving a selected target material, and obtaining a first plate thickness corresponding to the target material; a determining module for determining whether the first plate thickness matches a second plate thickness corresponding to a current material, and obtaining a corresponding thickness matching result; An adjusting module is configured to adjust the thickness of the plate member to the first plate member thickness when the thickness matching result fails. Before the selected target material is received, a material information library is created, and multiple material information of the same plate member is inputted and stored in the material information library, wherein the material information at least includes a material name and a corresponding plate member thickness. The selected target material is received, and the first plate member thickness corresponding to the target material is obtained, including: A target material name corresponding to the target material is obtained; The target material name is matched with the material information in the material information library to obtain a matching result of the target material name; When the matching result of the target material name is successful, the first plate member thickness corresponding to the target material name in the material information library is obtained; When the matching result of the target material name fails, a prompt message is generated and displayed; When the matching result of the target material name is successful, it is determined whether the first plate member thickness of the target material is consistent with the second plate member thickness of the current material; When the matching result of the target material name is successful, it is determined whether the first plate member thickness of the target material is consistent with the second plate member thickness of the current material, including: When the first plate member thickness is consistent with the second plate member thickness, it is determined that the thickness matching result is successful, and the plate member thickness is maintained as the second plate member thickness; When the first plate member thickness is inconsistent with the second plate member thickness, it is determined that the thickness matching result fails, and the plate member thickness is updated to the first plate member thickness.

6. A processing device, characterized by including: A processor and a memory, wherein the processor is configured to execute a plate member thickness processing program stored in the memory to implement the plate member thickness processing method in any one of claims 1-4.

7. A storage medium, characterized by The storage medium stores one or more programs, which can be executed by one or more processors to implement the plate member thickness processing method in any one of claims 1-4.

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