Improved electronic component implantation device and implantation method

Abstract

The present invention provides an improved electronic component implantation device, comprising: a body, a bearing part fixed to the body, a driver and a spring sheet group; the driver has a screw connected to the driver; one end of the spring sheet group is fixed to the body, and the other end of the spring sheet group is used for the screw to pass through, and the spring sheet group is used to provide elastic restoring force along the reciprocating displacement direction of the screw; the bearing seat is provided with a first sensing member and a second sensing member, which are used to sense with the sensing copper sheet to obtain the reciprocating displacement position of the screw; the screw driven to reciprocate by the driver is used to enable the suction nozzle to implant the electronic component into the carrier; the present invention also provides an implantation method. By providing elastic restoring force with the spring sheet group, the speed of the reciprocating displacement of the screw to periodically implant the electronic component into the carrier is increased, and the positioning accuracy of the reciprocating displacement of the screw is also improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic devices, and in particular to an improved electronic component implantation device and implantation method. Background Art

[0002] In the prior art, when the electronic component implantation device is operated for a long time, the reciprocating motion of the screw rod may easily cause the copper sleeve to be worn out, and even affect the accuracy of the screw rod's reciprocating motion displacement position. In addition, there is a common time-consuming defect problem that the reciprocating speed after the electronic component is implanted is not as good as the speed of the screw rod during the electronic component implantation. Therefore, the prior art does need to propose a better solution. Summary of the invention

[0003] An embodiment of the present invention provides an improved electronic component implantation device.

[0004] The embodiment of the present invention also provides an implantation method.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The improved electronic component implantation device of the present invention comprises: a body, a bearing part, a driver and a spring assembly.

[0007] It is further explained that the bearing portion includes a first bearing seat and a second bearing seat spaced apart from the first bearing seat, and the first bearing seat and the second bearing seat are fixed to the body.

[0008] It is further explained that the driver is arranged between the first bearing seat and the second bearing seat, the driver has a screw connected to the driver, and can be driven by the driver to reciprocate, and the screw passes through the first bearing seat and the second bearing seat.

[0009] It is further explained that a sensing copper sheet is included between the driver and the first bearing seat, wherein the screw rod passes through the sensing copper sheet, and the sensing copper sheet has a convex portion.

[0010] It is further explained that the spring sheet group includes a first spring sheet group and a second spring sheet group, one end of the spring sheet group is fixed to the main body, and the other end of the spring sheet group is used for the screw to pass through, wherein the spring sheet group is used to provide elastic restoring force along the back and forth displacement direction of the screw; furthermore, one end of the screw passes through the first bearing seat and the first spring sheet group in sequence, and the other end of the screw relative to the driver passes through the second bearing seat and the second spring sheet group in sequence.

[0011] It is further explained that the main body includes at least two grooves, at least two positioning columns and at least two pressing pieces. The groove is opened on the other side of the main body relative to the first supporting seat; the two positioning columns correspond to the two grooves respectively, and the two positioning columns are used to penetrate the first spring sheet group and the second spring sheet group, so that one end of the first spring sheet group and one end of the second spring sheet group are fixed to the main body; the two pressing pieces are used to fix the two positioning columns to the two grooves respectively.

[0012] It is further explained that the improved electronic component implantation device of the present invention includes a suction nozzle, wherein the screw rod penetrates the first spring sheet group and sets the suction nozzle in sequence relative to the first supporting seat; the screw rod is used to move the suction nozzle back and forth between the position for implanting the electronic component into the carrier and the position for adsorbing the electronic component.

[0013] It is further explained that the first supporting seat includes a first through-hole and a first sensing member, wherein the first through-hole is used for the first sensing member to pass through; the second supporting seat includes a second through-hole and a second sensing member, wherein the second through-hole is used for the second sensing member to pass through, wherein the first through-hole corresponds to the second through-hole, and there is a distance between the first sensing member and the second sensing member.

[0014] It is further explained that the first supporting seat includes a first step portion and a second step portion arranged adjacent to the first step portion. In addition, the area of ​​the first step portion is larger than the area of ​​the second step portion. The second step portion is located between the first spring plate group and the first step portion. Furthermore, the portion of the screw passing through the first step portion does not overlap with the second step portion.

[0015] It is further explained that the first spring clip group includes multiple first spring clips, multiple second spring clips and multiple third spring clips, wherein one end between the first spring clips is clamped with each of the second spring clips, and the other end between the first spring clips is clamped with the third spring clip; the second spring clip group includes multiple first spring clips, multiple second spring clips and multiple third spring clips, wherein one end between the first spring clips is clamped with the second spring clip, and the other end of the first spring clip is set with the third spring clip, wherein the other end of the first spring clip is the end facing away from the second supporting seat.

[0016] It is further explained that the improved electronic component implantation device of the present invention includes a spring and a positioning piece. Specifically, the screw rod passes through the first step portion, the spring, the positioning piece and the first spring piece assembly in sequence.

[0017] The method of using the improved electronic component implantation device of the present invention comprises the following steps:

[0018] A driver drives a screw connected thereto to move the screw. When a sensing copper sheet driven by the screw contacts a first sensing element to send a first sensing signal to a controller, the controller controls the vacuum degree of a suction nozzle according to the first sensing signal to return the suction nozzle to atmospheric pressure, so that the electronic component sucked by the suction nozzle is implanted into the carrier tape.

[0019] The driver drives the screw rod to move back and forth in a direction away from the suction nozzle. The spring assembly is used to provide elastic restoring force along the direction of the screw rod moving back and forth, so that the sensing copper sheet contacts a second sensing element to send a second sensing signal to the controller. The controller controls the vacuum degree of the suction nozzle according to the second sensing signal so that the suction nozzle is evacuated to absorb the electronic component; and

[0020] The driver drives the screw rod to move back and forth in the direction close to the suction nozzle. The spring assembly is used to provide elastic restoring force along the direction of the screw rod moving back and forth, so that the sensing copper sheet contacts the first sensing element to send the first sensing signal to the controller, thereby performing the electronic component implantation into the carrier as described above.

[0021] It is further explained that the controller is coupled to the driver, the first sensor and the second sensor respectively, so that the controller provides control instructions to the driver, and the controller performs calculations through a program system in a computer software device based on a first sensing signal emitted by the first sensor and a second sensing signal emitted by the second sensor, and calculates the time difference between the carrier moving from the current receiving slot (the receiving slot corresponding to the suction nozzle) to the next receiving slot, and the program calculation is combined to realize the controller providing control instructions to the driver, and controlling the suction nozzle to restore atmospheric pressure and evacuate between the electronic component implantation position and the electronic component adsorption position.

[0022] When the sensing copper sheet contacts the first sensing element, the suction nozzle located at one end of the screw is located at the position for implanting electronic components; when the sensing copper sheet contacts the second sensing element, the suction nozzle located at one end of the screw is located at the position for adsorbing electronic components.

[0023] The beneficial effects of the present invention are:

[0024] By providing elastic restoring force along the reciprocating movement direction of the screw rod, the implantation device can achieve rapid reciprocating motion of the screw rod without the need for high voltage output during the implantation of the electronic component. In detail, the setting of the spring sheet group will help the suction nozzle linked to the screw rod to increase the reciprocating speed between the electronic component implantation position and the electronic component adsorption position.

[0025] The arrangement of the spring sheet group is helpful to improve the positioning accuracy of the screw in the reciprocating motion. The spring sheet group of the present invention replaces the existing copper sleeve to solve the long-standing defective problem of copper sleeve wear caused by the reciprocating motion of the screw, and solves the problem of accurate screw positioning derived from the use of worn copper sleeves. In detail, the spring sheet group itself is fixed to the body in a manner that the first spring sheet group and the second spring sheet group are penetrated by the two positioning columns, and the two pressing pieces are used to fix the two positioning columns to the two grooves respectively. In this way, the first spring sheet group and the second spring sheet group penetrated by the two positioning columns, when the screw is penetrated by the first spring sheet group and the second spring sheet group, can be maintained on the coaxial line in the direction of the reciprocating motion of the screw. In short, the screw penetration holes of the first spring sheet group and the second spring sheet group are located on the coaxial line and correspond to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 One of the three-dimensional schematic diagrams showing the improved electronic component implantation device according to an embodiment of the present invention;

[0027] Figure 2 A second three-dimensional external schematic diagram showing the improved electronic component implantation device according to an embodiment of the present invention;

[0028] Figure 3 A perspective exploded view showing an improved electronic component implantation device according to an embodiment of the present invention;

[0029] Figure 4 A three-dimensional exploded view showing a first spring assembly according to an embodiment of the present invention;

[0030] Figure 5 A perspective exploded view showing a second spring assembly according to an embodiment of the present invention;

[0031] Figure 6 A schematic diagram showing an improved electronic component implantation device in an electronic component implantation carrier tape according to an embodiment of the present invention;

[0032] Figure 7 A flow chart showing the process of implanting electronic components into a carrier tape using the improved electronic component implantation device according to an embodiment of the present invention.

[0033] Description of the accompanying symbols:

[0034] 100: Ontology

[0035] 110: Groove

[0036] 120: Positioning column

[0037] 130: Compressor

[0038] 200: Bearing part

[0039] 210: First bearing seat

[0040] 211: First step

[0041] 212: Second step

[0042] 213: First Punch

[0043] 214: First sensor

[0044] 220: Second bearing seat

[0045] 221: Second piercing

[0046] 222: Second sensor

[0047] 300: Drive

[0048] 310: Screw

[0049] 400: Shrapnel Group

[0050] 410: The first shrapnel group

[0051] 411: The First Shrapnel

[0052] 412: Second Shrapnel

[0053] 413: The Third Shrapnel

[0054] 420: Second shrapnel group

[0055] 500: Induction copper sheet

[0056] 510: convex part

[0057] 600: Nozzle

[0058] 700: Spring

[0059] 800: Positioning piece

[0060] 900: Fixed plate

[0061] 1000: Carrier tape

[0062] 1100: Storage tank

[0063] S71-S73: Steps DETAILED DESCRIPTION

[0064] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0065] refer to Figure 1The improved electronic component implantation device of the present invention comprises: a body 100, a bearing part 200, a driver 300 and a spring assembly 400; in detail, the bearing part 200 comprises a first bearing seat 210 and a second bearing seat 220 spaced apart from the first bearing seat 210, the first bearing seat 210 and the second bearing seat 220 are fixedly arranged on the body 100; the driver 300 is arranged between the first bearing seat 210 and the second bearing seat 220, the driver 300 has a screw rod 310 connected to the driver 300, and the screw rod 310 can be driven by the driver 300 to move back and forth, and the The screw rod 310 passes through the first supporting seat 210 and the second supporting seat 220; the spring sheet group 400 includes a first spring sheet group 410 and a second spring sheet group 420, one end of the spring sheet group 400 is fixed to the main body 100, and the other end of the spring sheet group 400 is used for the screw rod 310 to pass through, wherein the spring sheet group 400 is used to provide elastic restoring force along the back and forth displacement direction of the screw rod 310; furthermore, one end of the screw rod 310 passes through the first supporting seat 210 and the first spring sheet group 410 in sequence, and the other end of the screw rod 310 relative to the driver 300 passes through the second supporting seat 220 and the second spring sheet group 420 in sequence.

[0066] In addition, the driver 300 includes but is not limited to a stepper motor.

[0067] In addition, the improved electronic component implantation device of the present invention includes a suction nozzle 600, wherein the screw 310 sequentially penetrates the first spring plate group 410 and sets the suction nozzle 600 relative to the first supporting seat 210; the screw 310 is used to enable the suction nozzle 600 to move back and forth between the position of implanting the electronic component into the carrier 1000 and the position of adsorbing the electronic component.

[0068] refer to Figure 2 A sensing copper sheet 500 is included between the driver 300 and the first supporting seat 210 , wherein the screw rod 310 passes through the sensing copper sheet 500 , and the sensing copper sheet 500 has a protrusion 510 .

[0069] refer to Figure 3The main body 100 includes two grooves 110, two positioning posts 120 and two pressing pieces 130. The grooves 110 are opened on the other side of the main body 100 relative to the first bearing seat 210; the two positioning posts 120 correspond to the two grooves 110 respectively, and the two positioning posts 120 are used to penetrate the first spring sheet group 410 and the second spring sheet group 420, so that one end of the first spring sheet group 410 and one end of the second spring sheet group 420 are positioned on the main body 100; the two pressing pieces 130 are used to fix the two positioning posts 120 respectively. In the two grooves 110; in addition, the two positioning columns 120 are used to penetrate the first spring sheet group 410 and the second spring sheet group 420, including another positioning sheet 800 and a fixing sheet 900, and the other positioning sheet 800 and the fixing sheet 900 are respectively arranged on the opposite sides of the first spring sheet group 410, and the two positioning columns 120 are penetrated in sequence through the fixing sheet 900, the first spring sheet group 410 and the positioning sheet 800 in the direction close to the main body 100 to enhance the positioning stability of the two positioning columns 120 penetrating the first spring sheet group 410.

[0070] In addition, the two grooves 110 are opened in a direction from the first spring sheet set 410 toward the second spring sheet set 420 .

[0071] In addition, the first bearing seat 210 includes a first step portion 211 and a second step portion 212 adjacent to the first step portion 211. In addition, the area of ​​the first step portion 211 is larger than the area of ​​the second step portion 212. The second step portion 212 is located between the first spring plate group 410 and the first step portion 211. Furthermore, the portion of the screw rod 310 passing through the first step portion 211 does not overlap with the second step portion 212. The first bearing seat 210 includes a first through hole 213, a The first sensor 214, wherein the first through hole 213 is used for the first sensor 214 to pass through; the second supporting seat 220 includes a second through hole 221 and a second sensor 222, the second through hole 221 is used for the second sensor 222 to pass through, wherein the first through hole 213 corresponds to the second through hole 221, and there is a distance between the first sensor 214 and the second sensor 222; in addition, the first sensor 214 and the second sensor 222 include but are not limited to proximity switches.

[0072] In addition, the improved electronic component implantation device of the present invention includes a spring 700 and a positioning piece 800. Specifically, the screw rod 310 passes through the first step portion 211, the spring 700, the positioning piece 800 and the first spring piece assembly 410 in sequence.

[0073] refer to Figure 4The first spring sheet group 410 includes four first spring sheets 411, three second spring sheets 412 and three third spring sheets 413, wherein one end between every two first spring sheets 411 is sandwiched with one second spring sheet 412, and the other end between every two first spring sheets 411 is sandwiched with one third spring sheet 413; it is particularly noted that the screw rod 310 passes through one end of the first spring sheet 411 and the second spring sheet 412, and the positioning column 120 passes through the other end of the first spring sheet 411 and the third spring sheet 413; when the screw rod 310 links the first spring sheet group 410, one end of the first spring sheet group 410 is linked by the screw rod 310, and the other end of the first spring sheet group 410 is fixed to the body 100, so that the first spring sheet group 410 can provide elastic restoring force along the screw rod 310 in the direction of returning to the original position, that is, using the lever principle.

[0074] refer to Figure 5 The second spring sheet group 420 includes four first spring sheets 411, two second spring sheets 412 and three third spring sheets 413, wherein one end between each two first spring sheets 411 is sandwiched with one second spring sheet 412, and one third spring sheet 413 is arranged at the other end of each two first spring sheets 411, wherein the other end of the first spring sheet 411 is facing away from the second bearing seat 220; the screw rod 310 passes through one end of the first spring sheet 411 and the second spring sheet 412, and the positioning column 120 passes through the other end of the first spring sheet 411 and the third spring sheet 413; the screw rod 310 links the second spring sheet 411 with the second spring sheet 412; When the spring sheet group 420 is moved, one end of the second spring sheet group 420 is linked to the screw rod 310, and the other end of the second spring sheet group 420 is fixed to the body 100. In this way, the second spring sheet group 420 can provide elastic restoring force along the forward and backward displacement direction of the screw rod 310, which also utilizes the lever principle; the number and clamping position of the first spring sheet 411, the second spring sheet 412 and the third spring sheet 413 of the present invention include but are not limited to the aforementioned technical features. In other words, the number and clamping position of the first spring sheet 411, the second spring sheet 412 and the third spring sheet 413 can be adjusted according to actual needs.

[0075] refer to Figure 6 and Figure 7 The electronic component implantation method performed by the improved electronic component implantation device of the present invention comprises the following steps:

[0076] (Step S71) A driver 300 drives a screw rod 310 connected thereto to move the screw rod 310. When a sensing copper sheet 500 driven by the screw rod 310 contacts a first sensing member 214 to send a first sensing signal to the controller, the controller controls the vacuum degree of a suction nozzle 600 according to the first sensing signal to return the suction nozzle 600 to atmospheric pressure, so that the electronic component sucked by the suction nozzle 600 is implanted into the carrier tape 1000. Figure 6 drawn;

[0077] (Step S72) The driver 300 drives the screw rod 310 to move back and forth in a direction away from the suction nozzle 600. The spring assembly 400 is used to provide elastic restoring force along the direction of the screw rod 310 moving back and forth, so that the sensing copper sheet 500 contacts a second sensing element 222 to send a second sensing signal to the controller. The controller controls the vacuum degree of the suction nozzle 600 according to the second sensing signal so that the suction nozzle 600 is vacuumed to absorb the electronic component.

[0078] (Step S73) The driver 300 drives the screw 310 to move back and forth in the direction close to the suction nozzle 600. The spring assembly 400 is used to provide elastic restoring force along the back and forth movement direction of the screw 310, so that the sensing copper sheet 500 contacts the first sensing element 214 to send the first sensing signal to the controller, thereby implanting the electronic component into the receiving slot 1100 in the carrier 1000 as described above.

[0079] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications are also within the scope of protection of the present invention.

Claims

1. An improved electronic component implantation device, characterized in that: include: one body; A bearing portion, comprising a first bearing seat and a second bearing seat spaced apart from the first bearing seat, wherein the first bearing seat and the second bearing seat are fixedly mounted on the body; a driver, which is disposed between the first bearing seat and the second bearing seat, and has a screw connected to the driver and driven by the driver to move back and forth, and the screw passes through the first bearing seat and the second bearing seat; and A spring sheet group, comprising a first spring sheet group and a second spring sheet group, one end of the spring sheet group is fixed to the body, and the other end of the spring sheet group is used for the screw rod to pass through, wherein the spring sheet group is used to provide elastic restoring force along the screw rod in the direction of restoring displacement; Among them, one end of the screw rod is sequentially penetrated by the first bearing seat and the first spring sheet group; the other end of the screw rod relative to the driver is sequentially penetrated by the second bearing seat and the second spring sheet group, one end of the first spring sheet group and the second spring sheet group is fixed to the main body, and the other end of the first spring sheet group and the second spring sheet group is linked to the screw rod and moves back and forth.

2. The improved electronic component implantation device according to claim 1, characterized in that: The main body also includes at least two grooves, at least two positioning columns and at least two pressing pieces, wherein the groove is opened on the other side of the main body relative to the first supporting seat; the two positioning columns correspond to the two grooves respectively, and the two positioning columns are used to penetrate the first spring sheet group and the second spring sheet group, so that one end of the first spring sheet group and one end of the second spring sheet group are fixed to the main body; the two pressing pieces are used to fix the two positioning columns to the two grooves respectively.

3. The improved electronic component implantation device according to claim 1, characterized in that: An inductive copper sheet is also included between the driver and the first bearing seat, wherein the screw rod passes through the inductive copper sheet.

4. The improved electronic component implantation device according to claim 3, characterized in that: The inductive copper sheet has a convex portion.

5. The improved electronic component implantation device according to claim 1, characterized in that: Also includes: A suction nozzle, wherein the screw rod penetrates the first spring sheet group and sets the suction nozzle in sequence relative to the first bearing seat; the screw rod is used to move the suction nozzle back and forth between the position where the electronic component is implanted into the carrier and the position where the electronic component is adsorbed.

6. The improved electronic component implantation device according to claim 1, characterized in that: The first supporting seat further includes a first through hole and a first sensing member, wherein the first through hole is used for the first sensing member to pass through.

7. The improved electronic component implantation device according to claim 6, characterized in that: The second supporting seat further includes a second through hole and a second sensing member, wherein the second through hole is used for the second sensing member to pass through, wherein the first through hole corresponds to the second through hole, and a distance is spaced between the first sensing member and the second sensing member.

8. The improved electronic component implantation device according to claim 1, characterized in that: The first supporting seat also includes a first step portion and a second step portion arranged adjacent to the first step portion, wherein the area of ​​the first step portion is larger than the area of ​​the second step portion, and the second step portion is located between the first spring plate group and the first step portion, wherein the portion of the screw passing through the first step portion does not overlap with the second step portion.

9. The improved electronic component implantation device according to claim 1, characterized in that: The first spring sheet group includes a plurality of first spring sheets, a plurality of second spring sheets and a plurality of third spring sheets, wherein the second spring sheet is sandwiched at one end between the first spring sheets, and the third spring sheet is sandwiched at the other end between the first spring sheets.

10. The improved electronic component implantation device according to claim 1, characterized in that: The second spring sheet group includes a plurality of first spring sheets, a plurality of second spring sheets and a plurality of third spring sheets, wherein the second spring sheet is sandwiched at one end between the first spring sheets, and the third spring sheet is arranged at the other end of the first spring sheet, wherein the other end of the first spring sheet is an end facing away from the second supporting seat.

11. The improved electronic component implantation device according to claim 8, characterized in that: It also includes a spring and a positioning sheet, wherein the screw rod passes through the first step portion, the spring, the positioning sheet and the first spring sheet group in sequence.

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