Silicon chip heat dissipation structure for motor

By introducing a silicon wafer heat dissipation structure into the motor, the problems of reduced protection levels and size changes caused by traditional motor heat dissipation methods are solved, and efficient heat dissipation, shock absorption and noise reduction are achieved, ensuring the motor operation stability and minimized environmental impact.

CN115441636BActive Publication Date: 2025-08-26JINGJIANG DONGSHENG ELECTROMECHANICAL EQUIP MFG CO LTD
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Patent Information

Application Number
CN202210936229.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-08-05
Publication Date
2025-08-26
Estimated Expiration
2042-08-05

AI Technical Summary

Technical Problem

Traditional motor heat dissipation methods reduce protection levels and change motor size, generating vibration and noise, affecting the motor operation and working environment.

Method used

The silicon wafer heat dissipation structure is adopted, including a fixed cover, shock absorber, sound insulation mechanism and heat dissipation mechanism. The heat dissipation silicon wafer is filled in the gap between the motor winding and the shell, and combined with shock absorber and sound absorbing cotton, efficient heat dissipation and noise reduction without changing the motor size.

Benefits of technology

Without changing the overall size and protection level of the motor, improve heat dissipation efficiency, reduce vibration and noise, and protect the motor operating environment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention belongs to the field of motor heat dissipation, and in particular to a silicon chip heat dissipation structure for a motor. The existing traditional heat dissipation method not only reduces the protection level of the motor but also changes the size of the motor. At the same time, the motor will generate vibration and noise when rotating, which will inevitably affect the operation of the motor and the working environment. The following scheme is proposed, which includes a fixed cover for fixing the motor, a shock absorbing mechanism is provided in the fixed cover, a sound insulation mechanism is provided on the fixed cover, and a motor housing is provided on the shock absorbing mechanism. The heat dissipation mechanism can be used to dissipate heat from the motor without changing the overall size of the motor, and there is no need to open ventilation holes on the housing, thereby not reducing its protection level. The shock absorbing mechanism can prevent the vibration generated by the motor from affecting the operation of the motor, and the sound insulation mechanism can absorb the noise to avoid affecting the working environment.
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Description

Technical Field

[0001] The present invention relates to the technical field of motor heat dissipation, and in particular to a silicon chip heat dissipation structure for a motor. Background Art

[0002] When a motor is used for a long time, it will generate a lot of heat, which will not only affect the normal use of the motor but also affect the performance of the motor itself, thus reducing the service life of the motor. Therefore, it is necessary to cool the motor during operation. At present, when the motor is powered on, the heat of the motor winding is mainly dissipated in two ways:

[0003] 1. Heat is transferred from the inner surface of the insulation layer to the outer surface by solid conduction, then to the stator core, and finally to the motor housing.

[0004] 2. Heat is transferred from the surface of the winding end to the motor housing by air convection.

[0005] Therefore, the traditional heat dissipation methods are:

[0006] 1. Add ventilation holes on the motor end cover to increase the heat conduction area and reduce the temperature rise, but it also reduces the protection level of the motor.

[0007] 2. Adding a fan to the tail of the motor increases the air convection coefficient and reduces the motor temperature rise. However, the fan will increase the structural space requirements and torque output requirements of the motor. The traditional heat dissipation method not only reduces the protection level of the motor but also changes the size of the motor. At the same time, the motor will generate vibration and noise when rotating, which will inevitably affect the motor operation and working environment. Therefore, we propose a silicon chip heat dissipation structure for the motor to solve the above problems. Summary of the Invention

[0008] The purpose of the present invention is to solve the shortcomings in the prior art that the traditional heat dissipation method reduces the protection level of the motor and changes the size of the motor. At the same time, the motor will generate vibration and noise when rotating, which will inevitably affect the operation of the motor and the working environment. A silicon chip heat dissipation structure for the motor is proposed.

[0009] In order to achieve the above object, the present invention adopts the following technical solutions:

[0010] A silicon chip heat dissipation structure for a motor includes a fixed cover for fixing the motor, a shock-absorbing mechanism is provided in the fixed cover, a sound insulation mechanism is provided on the fixed cover, a motor housing is provided on the shock-absorbing mechanism, a heat dissipation mechanism is provided in the motor housing for dissipating heat from the motor, and the motor housing includes a transmission shaft, a rotor assembly, a motor winding and a stator core for motor operation. The heat dissipation mechanism can be used to dissipate heat from the motor without changing the overall size of the motor, and there is no need to open ventilation holes on the housing, thereby not reducing its protection level. The shock-absorbing mechanism can prevent the vibration generated by the motor from affecting the operation of the motor, and the sound insulation mechanism can absorb noise to avoid affecting the working environment.

[0011] Preferably, the heat dissipation mechanism includes a heat dissipation silicon chip for dissipating heat from the motor. The outer wall and inner wall of the heat dissipation silicon chip are fixedly connected to the inner wall of the motor housing and one side of the motor winding, respectively. Through the heat dissipation silicon chip, the size of the heat dissipation silicon chip can be matched according to the size of the motor, and filled in the gap between the motor winding and the motor housing. Therefore, it can be said that the heat dissipation function of the motor is increased without changing the overall size of the motor, and there is no need to open ventilation holes on the housing. For a closed motor, its protection level will not be reduced.

[0012] Preferably, the shock absorbing mechanism includes a plurality of shock absorbing dampers and a shock absorbing plate, the top and bottom ends of the plurality of shock absorbing dampers are fixedly connected to the bottom inner wall of the fixed cover and the bottom of the shock absorbing plate respectively, the bottom of the motor housing is fixedly connected to the top of the shock absorbing plate, and the two sides of the shock absorbing plate are slidably connected to the two side inner walls of the fixed cover. The shock absorbing plate and the shock absorbing damper can prevent the vibration generated by the motor from affecting the operation of the motor.

[0013] Preferably, the stator core is provided with slot insulation paper for insulation, and the slot insulation paper is located between the stator core and the motor winding, and the slot insulation paper prevents contact friction between the motor winding and the stator core.

[0014] Preferably, the sound insulation mechanism includes two sound insulation boards and two sound-absorbing cottons for sound insulation of the motor. The bottoms of the two sound insulation boards are fixedly connected to the top sides of the fixed cover, and one side of the two sound-absorbing cottons is fixedly connected to one side of the two sound insulation boards. The sound insulation boards and the sound-absorbing cottons absorb the noise generated by the motor to prevent it from affecting the working environment.

[0015] Preferably, the material of the sound-absorbing cotton and the material of the sound insulation board are polyester fiber sound-absorbing cotton and wood fiber sound insulation board respectively. The wood fiber sound insulation board and polyester fiber sound-absorbing cotton can absorb noise more effectively.

[0016] Preferably, multiple grooves are provided on the inner walls on both sides of the fixed cover, and multiple sliders are fixedly connected to both sides of the shock-absorbing plate. One side of the multiple sliders is slidably connected to the inner walls of the multiple grooves. Through the sliders and grooves, the shock-absorbing plate can reduce friction when sliding longitudinally, and slide more smoothly.

[0017] Beneficial effect: Through the heat dissipation silicon chip, the size of the heat dissipation silicon chip can be matched according to the size of the motor, and it is filled in the gap between the motor winding and the motor housing. Therefore, it can be said that the heat dissipation function of the motor is increased without changing the overall size of the motor, and there is no need to open ventilation holes on the housing. For enclosed motors, it does not reduce its protection level.

[0018] The vibration damper is set to prevent the vibration generated by the motor from affecting the motor operation;

[0019] Because sound-absorbing cotton is set up, it absorbs noise and avoids affecting the working environment.

[0020] The present invention has a reasonable structure. Through the heat dissipation mechanism, the heat dissipation of the motor can be carried out without changing the overall size of the motor. At the same time, there is no need to open ventilation holes on the outer shell, so as not to reduce its protection level. The shock absorption mechanism can prevent the vibration generated by the motor from affecting the operation of the motor. The sound insulation mechanism can absorb the noise, which can avoid affecting the working environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a three-dimensional schematic diagram of a silicon chip heat dissipation structure for a motor proposed by the present invention;

[0022] Figure 2 This is a side view schematic diagram of a silicon chip heat dissipation structure for a motor proposed by the present invention;

[0023] Figure 3 A schematic diagram of a motor housing with a silicon chip heat dissipation structure for a motor proposed by the present invention;

[0024] Figure 4 This is a schematic diagram of an internal explosion of a motor using a silicon chip heat dissipation structure for a motor proposed by the present invention;

[0025] Figure 5 This is a schematic diagram of a fixed cover of a silicon chip heat dissipation structure for a motor proposed by the present invention.

[0026] In the figure: 1. Sound insulation board; 2. Motor housing; 3. Fixed cover; 4. Shock absorber; 5. Stator core; 6. Motor winding; 7. Heat dissipation silicon chip; 8. Rotor assembly; 9. Drive shaft; 10. Shock absorber plate; 11. Sound-absorbing cotton; 12. Slider; 13. Groove. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0028] Example 1

[0029] Reference Figure 1-5 A silicon chip heat dissipation structure for a motor includes a fixed cover 3 for fixing the motor, a shock-absorbing mechanism is provided in the fixed cover 3, a sound insulation mechanism is provided on the fixed cover 3, a motor housing 2 is provided on the shock-absorbing mechanism, and a heat dissipation mechanism for dissipating the heat of the motor is provided in the motor housing 2. The motor housing 2 includes a transmission shaft 9, a rotor assembly 8, a motor winding 6 and a stator core 5 for the operation of the motor. The heat dissipation mechanism can be used to dissipate heat from the motor without changing the overall size of the motor, and there is no need to open ventilation holes on the housing, thereby not reducing its protection level. The shock-absorbing mechanism can prevent the vibration generated by the motor from affecting the operation of the motor, and the sound insulation mechanism can absorb the noise to avoid affecting the working environment.

[0030] Example 2

[0031] Improved on the basis of embodiment 1: A silicon chip heat dissipation structure for a motor, comprising a fixed cover 3 for fixing the motor, a shock absorbing mechanism is provided in the fixed cover 3, the shock absorbing mechanism comprises a plurality of shock absorbing dampers 4 and a shock absorbing plate 10, the top and bottom ends of the plurality of shock absorbing dampers 4 are respectively fixedly connected to the bottom inner wall of the fixed cover 3 and the bottom of the shock absorbing plate 10, the bottom of the motor housing 2 is fixedly connected to the top of the shock absorbing plate 10, and the two sides of the shock absorbing plate 10 are slidably connected to the inner walls of the two sides of the fixed cover 3. The shock absorbing plate 10 and the shock absorbing damper 4 can prevent the vibration generated by the motor from affecting the operation of the motor, and the fixed cover 3 is provided with a plurality of shock absorbing dampers 4. A plurality of grooves 13 are provided on the inner walls on both sides of the cover 3, and a plurality of sliders 12 are fixedly connected to both sides of the shock-absorbing plate 10. One side of the plurality of sliders 12 is slidably connected to the inner walls of the plurality of grooves 13. Through the sliders 12 and the grooves 13, the shock-absorbing plate 10 can reduce friction when sliding longitudinally, and slide more smoothly. A sound insulation mechanism is provided on the fixed cover 3, and the sound insulation mechanism includes two sound insulation boards 1 and two sound-absorbing cottons 11 for sound insulation of the motor. The bottoms of the two sound insulation boards 1 are fixedly connected to the two sides of the top of the fixed cover 3, and one side of the two sound-absorbing cottons 11 is fixedly connected to one side of the two sound insulation boards 1. The noise generated by the motor is absorbed by the sound insulation board 1 and the sound absorbing cotton 11 to avoid affecting the working environment. The materials of the sound absorbing cotton 11 and the sound insulation board 1 are polyester fiber sound absorbing cotton 11 and wood wool sound insulation board 1 respectively. The wood wool sound insulation board 1 and the polyester fiber sound absorbing cotton 11 can absorb noise more effectively. A motor housing 2 is provided on the shock absorption mechanism. A heat dissipation mechanism for heat dissipation of the motor is provided in the motor housing 2. The heat dissipation mechanism includes a heat dissipation silicon chip 7 for heat dissipation of the motor. The outer wall and the inner wall of the heat dissipation silicon chip 7 are fixedly connected to the inner wall of the motor housing 2 and one side of the motor winding 6 respectively. Through the heat dissipation silicon chip 7, the heat dissipation The size of the thermal silicon chip 7 can be matched according to the size of the motor and filled in the gap between the motor winding 6 and the motor housing 2. Therefore, it can be said that the heat dissipation function of the motor is increased without changing the overall size of the motor, and there is no need to open ventilation holes on the housing. For a closed motor, its protection level will not be reduced. The motor housing 2 includes a transmission shaft 9 for motor operation, a rotor assembly 8, a motor winding 6 and a stator core 5. The stator core 5 is provided with insulation. Slot insulation paper is located between the stator core 5 and the motor winding 6. The slot insulation paper prevents contact friction between the motor winding 6 and the stator core 5.

[0032] Working principle of the present invention: When the motor starts to rotate, heat is generated inside the motor. Since a heat dissipation silicon chip 7 is added between the surface of the motor winding 6 and the motor housing 2, the heat of the motor winding 6 is conducted to the motor housing 2 in a more efficient manner, thereby increasing the heat dissipation performance of the motor itself, thereby achieving the effect of reducing temperature rise. Since the size of the heat dissipation silicon chip 7 can be matched according to the size of the motor and filled in the gap between the motor winding 6 and the motor housing 2, it can be said that the heat dissipation function of the motor is increased without changing the overall size of the motor, and there is no need to open ventilation holes on the housing. For a closed motor, its protection level will not be reduced. The motor will vibrate when rotating, and the vibration of the motor is transmitted to the shock absorbing plate 10. Since a shock absorbing damper 4 is provided, the vibration generated by the motor can be prevented from affecting the operation of the motor. At the same time, the motor will generate noise when rotating. Since a sound insulation board 1 and sound-absorbing cotton 11 are provided, the material of the sound-absorbing cotton is polyester fiber sound-absorbing cotton 11, which can effectively absorb noise, thereby avoiding affecting the working environment.

[0033] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A silicon chip heat dissipation structure for a motor, comprising a fixing cover (3) for fixing the motor, characterized in that: A shock absorbing mechanism is provided in the fixed cover (3), a sound insulation mechanism is provided on the fixed cover (3), a motor housing (2) is provided on the shock absorbing mechanism, a heat dissipation mechanism for dissipating heat from the motor is provided in the motor housing (2), and the motor housing (2) includes a transmission shaft (9), a rotor assembly (8), a motor winding (6), and a stator core (5) for operating the motor. The heat dissipation mechanism includes a heat dissipation silicon chip (7) for dissipating heat from the motor, and the outer wall and inner wall of the heat dissipation silicon chip (7) are fixedly connected to the inner wall of the motor housing (2) and one side of the motor winding (6) respectively; The shock absorbing mechanism comprises a plurality of shock absorbing dampers (4) and a shock absorbing plate (10), wherein the top and bottom ends of the plurality of shock absorbing dampers (4) are fixedly connected to the bottom inner wall of the fixed cover (3) and the bottom of the shock absorbing plate (10), respectively; the bottom of the motor housing (2) is fixedly connected to the top of the shock absorbing plate (10), and the two sides of the shock absorbing plate (10) are slidably connected to the two side inner walls of the fixed cover (3).

2. The heat dissipation structure of a silicon chip for a motor according to claim 1, characterized in that: Slot insulation paper for insulation is provided in the stator core (5), and the slot insulation paper is located between the stator core (5) and the motor winding (6).

3. The silicon chip heat dissipation structure for a motor according to claim 1, characterized in that: The sound insulation mechanism comprises two sound insulation boards (1) and two sound-absorbing cottons (11) for sound insulation of the motor, the bottoms of the two sound insulation boards (1) are fixedly connected to both sides of the top of the fixed cover (3), and one side of the two sound-absorbing cottons (11) is fixedly connected to one side of the two sound insulation boards (1).

4. The silicon chip heat dissipation structure for a motor according to claim 3, characterized in that: The material of the sound-absorbing cotton (11) and the material of the sound insulation board (1) are respectively polyester fiber sound-absorbing cotton (11) and wood fiber sound insulation board (1).

5. The silicon chip heat dissipation structure for a motor according to claim 1, characterized in that: Multiple grooves (13) are provided on both inner walls of the fixed cover (3), multiple sliders (12) are fixedly connected to both sides of the shock-absorbing plate (10), and one side of the multiple sliders (12) is slidably connected to the inner walls of the multiple grooves (13).

Citation Information

Patent Citations

  • Silicon wafer heat dissipation structure for motor

    CN218301096U