Power supply device and power supply control method
By connecting a power module in parallel and equipping it with temperature control, overvoltage, overcurrent, data acquisition, and alarm modules, the reliability and safety issues of the power supply under different chip current requirements and harsh environments are solved, achieving flexible current regulation and protection.
Patent Information
- Application Number
- CN202211050749.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-08-29
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2042-08-29
AI Technical Summary
Existing power supply devices are unable to meet the current requirements of different chips, and cannot guarantee high reliability and safety in harsh environments.
Multiple parallel power modules are connected to the chip carrier board and equipped with temperature control, overvoltage, overcurrent, data acquisition and alarm modules. Dynamic current regulation and protection are achieved through the controller to ensure the safety and reliability of the power supply device.
It enables the chip testing requirements to be met under different current demands, improves the safety and reliability of the power supply device, and adapts to severe vibration and harsh environments.
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Figure CN115459413B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of aging test, in particular to a power supply device and a power supply control method. BACKGROUND
[0002] The stability of an electronic device is determined by the quality of a power supply system, so the power supply device is very important in computers, communications, aerospace, instruments, household appliances and the like. With the increasing demand for the power supply device, higher requirements are put forward for the efficiency, size, weight and reliability of the power supply device. The power supply device gradually replaces the linear power supply with low efficiency, bulkiness and heavy weight in many aspects due to its high efficiency, small size and light weight. In the fields of railway, medical treatment and military industry, the demand for the power supply device is increasing because the power supply device is related to public transportation and personal safety, and the high reliability and working safety of the power supply device are considered first. The power supply device must still work normally for a long time under severe vibration or in a harsh environment.
[0003] Nowadays, the power supply device is required to have higher power, efficiency, size, weight, reliability and safety. SUMMARY
[0004] The application mainly solves the technical problem of providing a power supply device and a power supply control method, which can meet the current demand of different chips and have safety and reliability.
[0005] To solve the above problems, the first technical solution adopted by the application is to provide a power supply device, which comprises: a power supply; a power supply module, the power supply module is at least two, and is connected in parallel with each other, and the input end of at least two power supply modules is connected with the power supply; a chip carrier plate, the chip carrier plate is at least one, and each chip carrier plate is connected with the output end of at least two power supply modules; a controller, the controller is connected with the power supply, controls the on-off of the power supply, and the controller is also connected with the power supply module, controls the on-off of each power supply module.
[0006] The power supply device further comprises: a temperature control module, the temperature control module is connected with the power supply and the controller, is powered by the power supply, and is used for detecting the temperature at the chip carrier plate and feeding back to the controller.
[0007] The power supply device further comprises: a motor module, the motor module is connected with the power supply and the controller, is powered by the power supply, and the controller controls the temperature of the chip carrier plate by controlling the motor module.
[0008] The power supply device further comprises a collection module connected to the power supply and the controller, powered by the power supply, collecting data at the chip carrier board and feeding back to the controller to determine whether the chip carrier board is working normally.
[0009] The power supply device further comprises an alarm module connected to the power supply and the controller, powered by the power supply, and the controller controls the alarm module to issue an alarm if the chip carrier board is determined to be abnormal by the controller.
[0010] The power supply device further comprises an overvoltage module connected to the chip carrier board, which detects the voltage of the chip carrier board and cuts off the power module connected to the chip carrier board when the voltage of the chip carrier board is greater than a preset value.
[0011] The overcurrent module is connected to the chip carrier board, which detects the current passing through the chip carrier board and cuts off the power module connected to the chip carrier board when the current passing through the chip carrier board is greater than the preset value.
[0012] To solve the above technical problems, the second technical solution adopted by the present application is to provide a power supply control method, which comprises: receiving the required current of the chip carrier board; according to the required current, analyzing the expected number of parallel power modules required by each chip carrier board, and sending a parallel instruction containing the expected number information through the controller; in response to the parallel instruction of the controller, the expected number of parallel power modules are turned on to supply power to the chip carrier board.
[0013] To solve the above technical problems, the third technical solution adopted by the present application is:
[0014] The beneficial effects of the present application are: different from the prior art, by using multiple parallel power modules to connect a chip carrier board, the test requirements can be met when the chip carrier board is inserted into chips with different current requirements. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 is a structural schematic diagram of a first embodiment of the power supply device of the present application;
[0016] Figure 2 is a structural schematic diagram of a second embodiment of the power supply device of the present application;
[0017] Figure 3 is a structural schematic diagram of a third embodiment of the power supply device of the present application;
[0018] Figure 4is a flowchart of a first embodiment of a power supply control method of the present application;
[0019] Figure 5 is Figure 1 is a structural diagram of a power module in a power supply device;
[0020] Figure 6 is to Figure 5 is a structural diagram of a power supply device in parallel. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.
[0022] If the technical solutions in the present application involve personal information, the product applying the technical solutions in the present application has clearly informed the personal information processing rules before processing the personal information and has obtained the personal independent consent. If the technical solutions in the present application involve sensitive personal information, the product applying the technical solutions in the present application has obtained the personal independent consent before processing the sensitive personal information and at the same time meets the requirement of "explicit consent". For example, at the personal information collection device such as a camera, an explicit and prominent sign is set to inform that the personal information collection range has been entered and the personal information will be collected. If the person voluntarily enters the collection range, it is regarded as the consent to collect the personal information. Or, at the device for processing personal information, the personal information processing rules are informed by using obvious signs / information, and the personal authorization is obtained by means of pop-up information or asking the person to upload the personal information. The personal information processing rules can include the personal information processor, the processing purpose, the processing method, and the type of processed personal information.
[0023] For details, refer to the following description of an embodiment of a power supply device of the present application.
[0024] Please refer to Figure 1 , Figure 1 is a structural diagram of a first embodiment of a power supply device of the present application.
[0025] The first embodiment of a power supply protection method of the present application will be described in detail below.
[0026] The power supply device in the first embodiment of the present application includes a power supply 11, a controller 12, a first power module 13, a second power module 14, and a chip carrier board 15.
[0027] In the embodiment, the power supply 11 is a 12V power supply, and the power supply 11 is connected with the input ends of the first power supply module 13 and the second power supply module 14. It can be understood that the first power supply module 13 and the second power supply module 14 are parallel in circuit, and thus the voltages of the first power supply module 13 and the second power supply module 14 are consistent with the voltage of the power supply 11, which is 10V.
[0028] In other embodiments, the power supply 11 is a 220V alternating current power supply, and the power supply 11 is connected with a power adapter or a transformer to change the 220V power supply 11 into a 12V power supply to meet the voltage requirement of the chip carrier 15.
[0029] Preferably, the power supply 11 is a 48V power supply. Replacing the 12V power supply 11 with a 48V power supply can reduce the power loss caused by the device cable and thus reduce the requirement of the device on the cable.
[0030] In other embodiments, the power supply 11 is a 220V alternating current power supply, and the power supply 11 is connected with a power adapter or a transformer to change the 220V power supply 11 into a 48V power supply to meet the voltage requirement of the chip carrier 15 while reducing the requirement of the device on the cable.
[0031] In the embodiment, the output ends of the first power supply module 13 and the second power supply module 14 are connected with the chip carrier 15 to supply power to the chip carrier 15. It can be understood that the whole of the first power supply module 13 and the second power supply module 14 in parallel is connected in series with the chip carrier 15, and thus when the first power supply module 13 and the second power supply module 14 supply power to the chip carrier 15 at the same time, the current of the chip carrier 15 is the sum of the currents of the first power supply module 13 and the second power supply module 14. It can be understood that the chip carrier 15 can be connected with a chip, and the chip can be various chips to be tested, and the currents required for the normal operation of various chips are different. For example, the current required for the normal operation of a chip A is 8A, and thus the power supply device in the embodiment can be used to supply power, and only one of the first power supply module 13 or the second power supply module 14 is used to supply power to the chip carrier 15, which can meet the requirement of the normal operation of the chip A. The current required for the normal operation of a chip B is 16A, and thus the first power supply module 13 and the second power supply module 14 can be used to supply power to the chip carrier 15 at the same time, which can meet the requirement of the normal operation of the chip B.
[0032] In the embodiment, the controller 12 is connected with the power supply 11 to control the on-off of the power supply 11, and the controller 12 is also connected with the first power supply module 13 and the second power supply module 14 respectively to control the on-off of the first power supply module 13 and the second power supply module 14 respectively, so as to control the current provided to the chip carrier 15.
[0033] Preferably, the controller 12 is a programmable logic controller.
[0034] In other embodiments, the controller 12 is connected with a test computer, and the test computer has a corresponding control system, through which the controller 12 can control the first power module 13 or the second power module 14 to supply power to the chip carrier board 15, or the first power module 13 and the second power module 14 supply power to the chip carrier board at the same time.
[0035] In other embodiments, there are multiple chip carrier boards 15 and multiple power modules, and each chip carrier board 15 is connected with multiple power modules. For example, there are 5 chip carrier boards 15 and a total of 30 power modules, and each chip carrier board 15 is connected with 6 power modules, and each power module is connected with the controller 12, and the controller 12 can control each power module to supply power to the chip carrier board 15 connected therewith, so as to provide various different currents for the chip carrier board 15, and meet the power supply requirements of various chips for normal operation, so as to better complete the test of the chips.
[0036] Referring to Figure 2 , Figure 2 is a structural schematic diagram of a second embodiment of the power supply device of the present application.
[0037] The second embodiment of the power supply device of the present application is described in detail below.
[0038] In this embodiment, the power supply device comprises a power supply 21, a power supply adapter 211, a controller 22, a first power module 23, a second power module 24, a chip carrier board 25, an overvoltage module 251, an overcurrent module 252, a temperature control module 26, a motor module 27, an acquisition module 28, and an alarm module 29.
[0039] In this embodiment, the power supply 21 is a 220V alternating current power supply, and the power supply 21 is connected with the input ends of the first power module 23 and the second power module 24 through the power supply adapter 211, and the power supply adapter 211 can convert the voltage of 220V of the power supply 21 into a voltage of 48V. The same as the first embodiment of the present application is that the first power module 23 and the second power module 24 are connected in parallel, and the voltages provided by the first power module 23 and the second power module 24 are consistent with the voltage converted by the power supply adapter 211, which is 48V. It can be understood that the controller 22 can control the first power module 23 and the second power module 24 to supply power to the chip carrier board 25 to make the chip carrier board 25 obtain a current of 8A or 16A to meet the current required by different chips for normal operation.
[0040] In the embodiment, the chip carrier 25 is also connected with an overvoltage module 251 and an overcurrent module 252. The overvoltage module 251 can detect the voltage of the chip carrier 25, so as to cut off the power supply of the chip carrier 25 when the voltage of the chip carrier 25 is abnormal, thereby protecting the chip from being burnt. The overcurrent module 252 can detect the current of the chip carrier 25, so as to cut off the power supply of the chip carrier 25 when the current of the chip carrier 25 is abnormal, thereby protecting the chip from being burnt. It can be understood that the overvoltage module 251 and the overcurrent module 252 can effectively protect the operation of the chip and the chip carrier 25, thereby increasing the safety of the power supply device.
[0041] In the embodiment, the power supply 21 and the controller 22 are also connected with a temperature control module 26 and a motor module 27. The temperature control module 26 is arranged near the chip carrier 25 and can collect the temperature of the chip carrier 25. The temperature control module 26 can feed back the collected temperature of the chip carrier 25 to the controller 22, and the controller 22 can control the motor module 27 according to whether the temperature fed back by the temperature control module 26 reaches a preset value. The motor module 27 can control the temperature of the environment where the chip carrier 25 is located, thereby providing corresponding temperature conditions for testing the performance of the chip. It can be understood that the temperature control module 26 can cooperate with the motor module 27 to complete the temperature control at the chip carrier 25, thereby completing the corresponding chip test.
[0042] In the embodiment, the power supply 21 and the controller 22 are also connected with a collection module 28 and an alarm module 29. The collection module 28 can collect data information of the chip carrier 25, so as to determine whether the chip carrier 25 works normally, and feed back the data information to the controller 22. The alarm module 29 can issue an alarm to remind the abnormal working of the equipment. It can be understood that the controller 22 judges after receiving the data information collected by the collection module 28. If it is determined that the chip carrier 25 works abnormally, the controller 22 controls the alarm module 29 to issue an alarm, thereby playing a role of reminding the staff, and further increasing the safety and reliability of the equipment.
[0043] Referring to Figure 3 , Figure 3 is a structural schematic view of a third embodiment of the power supply device.
[0044] The third embodiment of the power supply device will be described in detail below.
[0045] In the embodiment, the connection relationship and functions of the power adapter 321, the first power module 33, the second power module 34, the chip carrier 35, the overvoltage module 351, the overcurrent module 352, the temperature control module 36, the motor module 37, the collection module 38 and the alarm module 39 are similar to those in the second embodiment of the application, and will not be described herein.
[0046] In the embodiment, the power supply 31 is connected with the test computer 311, the test computer 311 is connected with each module through the switch 312, the switch 312 is connected with the controller 32, and the controller 32 is used for controlling whether each module is powered on.
[0047] In the embodiment, the power supply 31 is a 220V alternating current power supply, and is used for supplying power to the test computer 311, the switch 312, the controller 32, the power adapter 321, the temperature control module 36, the motor module 37, the acquisition module 38 and the alarm module 39. Preferably, the motor module 37, the acquisition module 38 and the alarm module 39 each have a corresponding voltage conversion device to enable them to work normally.
[0048] In the embodiment, when the power supply device is started, the power supply 31 supplies power to the test computer 311, the switch 312 and the controller 32 in a first stage, that is, when the power supply 31 is started, the above-mentioned devices are immediately powered on, which can reduce the waiting time of the above-mentioned devices. When the controller 32 is powered on, the controller 32 starts a self-checking program to detect faults of each module. If no fault is detected, the controller 32 controls the power adapter 321, the temperature control module 36, the motor module 37, the acquisition module 38 and the alarm module 39 to be supplied with power in a second stage, that is, the controller 32 opens the switches of the above-mentioned devices in the case of no fault in the self-checking, which can effectively guarantee the safety of each device.
[0049] Please refer to Figure 4 , Figure 4 which is a flowchart of the first embodiment of the power supply control method of the application.
[0050] The first embodiment of the power supply control method of the application is described in detail below.
[0051] S410: receiving the required current of the chip carrier.
[0052] In the embodiment, the different chips arranged on each chip carrier cause different required currents, so the required current of the chip on each chip carrier is required, and the required current of the chip carrier is the voltage that can enable the chip to work normally.
[0053] S420: according to the required current, analyzing the expected number of power supply modules required to be connected in parallel for each chip carrier, and sending a parallel instruction containing the expected number information through the controller.
[0054] In the embodiment, the required current of each chip carrier is different, and the number of power modules required for power supply is different. Each chip carrier corresponds to a plurality of power modules. The voltage of each power module is the same, and the current that can be provided is also the same. Therefore, the number of power modules required can be calculated according to the current required by each chip carrier. The controller sends a parallel instruction with the number of power modules required in parallel to make the corresponding number of power modules in parallel to supply power to the chip carrier.
[0055] S430: In response to the parallel instruction of the controller, turn on the expected number of power modules in parallel to supply power to the chip carrier.
[0056] In the embodiment, the corresponding number of power modules in the parallel instruction is connected in parallel to the corresponding chip carrier by the parallel instruction sent by the controller to supply power to the chip carrier, so that the chips connected to the chip carrier work normally.
[0057] In other embodiments, the step S430 further includes: collecting the voltage and / or current of the chip carrier; determining whether the voltage and / or current of the chip carrier is abnormal; in response to the abnormal voltage and / or current of the chip carrier, disconnecting the power module connected to the chip carrier; and sending alarm information of the abnormal voltage and / or current of the chip carrier to the controller. By collecting the voltage or current at the chip carrier and determining whether the voltage or current of the chip carrier is abnormal, that is, whether it is greater than a preset value. If the voltage or current is abnormal, each power module that is abnormal is disconnected from the corresponding chip carrier, which can effectively protect the safety of the chip carrier and the chip. The voltage and current at the chip carrier can also be collected at the same time. As long as any one of them is greater than the preset value, the connection between the chip carrier and the corresponding power module is disconnected. After disconnecting the chip carrier and the corresponding power module, an alarm information is sent.
[0058] In other embodiments, before step S410, it further includes: collecting self-checking information of the controller; determining whether the self-checking information of the controller is abnormal; in response to the abnormal self-checking information of the controller, disconnecting the power supply; and in response to the normal self-checking information of the controller, supplying power to the power module. Before supplying power to the chip carrier, the controller is supplied with first-level power. The controller performs self-checking and determines whether there is a device failure in the self-checking information. If the self-checking information shows that there is a device failure, the power supply is disconnected and the power module is not supplied with second-level power. If the self-checking information shows that there is no device failure, the power module is supplied with second-level power.
[0059] Please refer to Figure 5 and Figure 6 , Figure 5 is a structural schematic diagram of the power module in the first embodiment of the power supply device of the application, Figure 6 is a structural schematic diagram of the power module in the second embodiment of the power supply device of the application, Figure 5Structure diagram of how to parallel connection of middle power module.
[0060] It should be noted that the relational terms herein, such as first and second, and the like, are used solely to distinguish one from another entity or action without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.
[0061] The above description is only some embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A power supply device characterized by comprising: The power supply comprises: a power supply; a plurality of power modules connected in parallel, the input ends of the power modules being connected to the power supply; the power modules comprising a first power module and a second power module, the first power module and the second power module being connected in parallel, and the power supply being connected to the input ends of the first power module and the second power module respectively; a plurality of chip carriers, each of the chip carriers being connected to the output ends of at least two power modules; the whole of the first power module and the second power module being connected in series with one of the chip carriers; a controller connected to the power supply and the power modules, the controller being configured to control the on-off of the power supply and the on-off of each of the power modules, and the controller being configured to control the on-off of at least one of the first power module and the second power module to supply power to the chip carrier.
2. The power supply device according to claim 1, characterized by The power supply further comprises: a temperature control module connected to the power supply and the controller, the temperature control module being powered by the power supply and being configured to detect the temperature of the chip carrier and feed back the temperature to the controller.
3. The power supply device according to claim 2, characterized by The power supply further comprises: a motor module connected to the power supply and the controller, the motor module being powered by the power supply, and the controller being configured to control the temperature of the chip carrier by controlling the motor module.
4. The power supply device according to claim 1, characterized by The power supply further comprises: a collection module connected to the power supply and the controller, the collection module being powered by the power supply and being configured to collect data of the chip carrier and feed back the data to the controller to determine whether the chip carrier is working normally.
5. The power supply device according to claim 4, wherein The power supply further comprises: an alarm module connected to the power supply and the controller, the alarm module being powered by the power supply, and the controller being configured to control the alarm module to send an alarm if the controller determines that the chip carrier is not working normally.
6. The power supply device according to claim 1, wherein The power supply further comprises: an overvoltage module connected to the chip carrier, the overvoltage module being configured to detect the voltage of the chip carrier and cut off the power module connected to the chip carrier when the voltage of the chip carrier is greater than a preset value; an overcurrent module connected to the chip carrier, the overcurrent module being configured to detect the current passing through the chip carrier and cut off the power module connected to the chip carrier when the current passing through the chip carrier is greater than the preset value.
7. A power supply control method characterized by comprising: The power supply control method is based on the power supply device of claims 1-6, and the method comprises: receiving the required current of the chip carrier; analyzing the expected number of power modules required to be connected in parallel for each chip carrier according to the required current, and sending a parallel instruction containing the expected number information through the controller; turning on the expected number of power modules connected in parallel in response to the parallel instruction of the controller to supply power to the chip carrier.
8. The method of claim 7, wherein, After the step of turning on the expected number of power modules connected in parallel in response to the parallel instruction of the controller to supply power to the chip carrier, the method further comprises: collecting the voltage and / or current of the chip carrier; determining whether the voltage and / or current of the chip carrier is abnormal; in response to the voltage and / or current of the chip carrier being abnormal, disconnecting the power module connected to the chip carrier; sending alarm information of the abnormal voltage and / or current of the chip carrier to the controller.
9. The method of claim 7, wherein, The step of receiving the required current of the chip carrier further comprises: collecting self-checking information of the controller; determining whether the self-checking information of the controller is abnormal; in response to the self-checking information of the controller being abnormal, disconnecting the power supply.
10. The method of claim 9, wherein, The step of determining whether the self-checking information of the controller is abnormal further comprises: in response to the self-checking information of the controller being normal, supplying power to the power module.
Citation Information
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