Multilayer substrate, probe unit, and ultrasonic endoscope

Abstract

A multilayer substrate comprises a surface layer, an intermediate layer, and a back layer stacked along a stacking direction, with an ultrasonic transducer electrically connected to one end in a longitudinal direction perpendicular to the stacking direction. The multilayer substrate includes: a ground terminal connected to a ground wire connected to a plurality of shield wires of the multilayer substrate, the ground terminal forming a portion of the surface layer and a portion of the back layer at the other end in the longitudinal direction; a plurality of signal line connection terminal arrays having a plurality of signal line connection terminals to which signal wires of the plurality of shield wires are respectively connected, the plurality of signal line connection terminal arrays forming a portion of the surface layer and a portion of the back layer near the ground terminal in the longitudinal direction and arranged perpendicular to the longitudinal direction; and a thermally conductive wiring extending from the intermediate layer toward the other end. Thus, a multilayer substrate having a short front-end rigidity is provided.

Description

Technical Field

[0001] The present invention relates to a multilayer substrate, a probe unit and an ultrasonic endoscope. Background Art

[0002] Ultrasonic endoscopes have been widely used in the medical and industrial fields for various examinations. A medical ultrasonic endoscope has an ultrasonic transducer at the distal end of an insertion portion that is inserted into a patient or other subject, and uses ultrasonic waves to acquire in-vivo images of the subject.

[0003] For medical ultrasonic endoscopes, technologies related to miniaturization and reduction of the diameter of the distal end of the insertion portion have been proposed for the purpose of reducing the burden on patients, etc. For example, in Patent Document 1, the distal end of the insertion portion is reduced in diameter by connecting cables staggered in the longitudinal direction to a flexible substrate connected to an ultrasonic transducer.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 4812050 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] However, in Patent Document 1, it is impossible to shorten the length of the tip rigid portion (hereinafter referred to as the tip rigid length) that includes the connection portion between the flexible substrate and the cable.

[0009] The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a multilayer substrate, a probe unit, and an ultrasonic endoscope having a short hard tip length.

[0010] Solutions for solving problems

[0011] In order to solve the above-mentioned problems and achieve the purpose, a multilayer substrate of one embodiment of the present invention has a surface side layer, an intermediate layer and a back side layer stacked along a stacking direction, and the multilayer substrate is electrically connected to an ultrasonic vibrator at one end side of the length direction in a direction orthogonal to the stacking direction, wherein the multilayer substrate includes: a ground terminal, which is connected to a ground wire of a plurality of shielding wires connected to the multilayer substrate, and on the other end side of the length direction, the ground terminal forms a part of the surface side layer and a part of the back side layer; a plurality of signal line connection terminal columns, the plurality of signal line connection terminal columns having a plurality of signal line connection terminals for signal lines respectively connected to the plurality of shielding wires, and near the ground terminal in the length direction, the plurality of signal line connection terminal columns form a part of the surface side layer and a part of the back side layer, and are arranged along a direction orthogonal to the length direction; and wiring, which has thermal conductivity and extends from the intermediate layer to the other end.

[0012] Furthermore, in the multilayer substrate of one aspect of the present invention, when viewed along the stacking direction, the wiring pattern of the wiring provided in the intermediate layer is different from the wiring patterns of the wiring provided in the front-side layer and the back-side layer.

[0013] Furthermore, the multilayer substrate according to one aspect of the present invention includes a heat conducting portion having thermal conductivity and provided between the front surface layer and the intermediate layer and between the back surface layer and the intermediate layer.

[0014] In addition, in a multilayer substrate of one embodiment of the present invention, when looking down at the multilayer substrate along the stacking direction, in the arrangement direction intersecting with the length direction, the two ends of the ground terminal and the signal line connection terminal column are located in an area greater than 0.005 mm and less than 0.2 mm from the end of the multilayer substrate.

[0015] Furthermore, the multilayer substrate according to one aspect of the present invention includes a via hole located near the end portion in the longitudinal direction and electrically connecting the ground terminal of the front-side layer and the ground terminal of the back-side layer.

[0016] Furthermore, in the multilayer substrate according to one aspect of the present invention, the via hole is provided at a position overlapping with the ground terminal along the stacking direction.

[0017] In addition, a multilayer substrate of one embodiment of the present invention includes a plurality of element connection terminal arrays, each of which has a plurality of element connection terminals, each of which is respectively connected to each of the plurality of piezoelectric elements possessed by the ultrasonic vibrator, and is arranged on the one end side of the length direction and configured along a direction orthogonal to the length direction.

[0018] Furthermore, in the multilayer substrate according to one aspect of the present invention, in the arrangement direction of the signal line connection terminals, the width of the signal line connection terminals is larger than the width of the element connection terminals.

[0019] Furthermore, in the multilayer substrate according to one aspect of the present invention, in the arrangement direction of the signal line connection terminals, the width of the signal line connection terminal array is larger than the width of the element connection terminal array.

[0020] In the multilayer substrate according to one aspect of the present invention, the width between the signal line connection terminals and the width between the element connection terminals are smaller than the width of the wiring provided on the front side layer and the back side layer.

[0021] Furthermore, in the multilayer substrate according to one aspect of the present invention, the element connection terminal array forms a portion of the front surface layer or a portion of the back surface layer.

[0022] In addition, a probe unit of one embodiment of the present invention includes: a plurality of shielding wires; and a multi-layer substrate, which has a surface side layer, an intermediate layer and a back side layer stacked along a stacking direction, and the multi-layer substrate is electrically connected to the ultrasonic vibrator at one end side of the length direction in a direction orthogonal to the stacking direction. In the probe unit, the multi-layer substrate has: a ground terminal, which is connected to the ground wire of the plurality of shielding wires connected to the multi-layer substrate, and forms a part of the surface side layer and a part of the back side layer at the other end side in the length direction; a plurality of signal line connection terminal columns, the plurality of signal line connection terminal columns having a plurality of signal line connection terminals for signal lines respectively connected to the plurality of shielding wires, and near the ground terminal in the length direction, the plurality of signal line connection terminal columns form a part of the surface side layer and a part of the back side layer, and are arranged along a direction orthogonal to the length direction; and wiring, which has thermal conductivity and extends from the intermediate layer to the other end.

[0023] Furthermore, an ultrasonic endoscope according to one embodiment of the present invention includes: an ultrasonic transducer that transmits and receives ultrasonic waves; a plurality of shielded wires; and a multilayer substrate having a surface side layer, an intermediate layer, and a back side layer stacked along a stacking direction, the multilayer substrate being electrically connected to the ultrasonic transducer at one end side in a longitudinal direction in a direction orthogonal to the stacking direction. In the ultrasonic endoscope, the multilayer substrate includes: a ground terminal connected to a ground wire of the plurality of shielded wires connected to the multilayer substrate, the ground terminal forming a portion of the surface side layer and a portion of the back side layer at the other end side in the longitudinal direction; a plurality of signal line connection terminal arrays having a plurality of signal line connection terminals to which signal wires of the plurality of shielded wires are respectively connected, the plurality of signal line connection terminal arrays forming a portion of the surface side layer and a portion of the back side layer near the ground terminal in the longitudinal direction and being arranged in a direction orthogonal to the longitudinal direction; and a wiring having thermal conductivity that extends from the intermediate layer to the other end.

[0024] Effects of the Invention

[0025] According to the present invention, a multilayer substrate, a probe unit, and an ultrasonic endoscope having a short hard tip length can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a diagram schematically showing the entire endoscope system including the multi-layer substrate according to the first embodiment.

[0027] Figure 2 It indicates schematically Figure 1 A perspective view of the distal end structure of the insertion portion of the ultrasonic endoscope shown.

[0028] Figure 3 It indicates schematically Figure 1 An exploded perspective view of the distal end structure of the insertion portion of the ultrasonic endoscope shown.

[0029] Figure 4 This is a diagram showing a state where a cable group is connected to a flexible substrate.

[0030] Figure 5 It is a three-dimensional diagram of a flexible substrate.

[0031] Figure 6 This is an enlarged view of the substrate.

[0032] Figure 7 This is an enlarged view of the substrate.

[0033] Figure 8 This is an enlarged view of the substrate.

[0034] Figure 9 This is an enlarged view of the substrate.

[0035] Figure 10 This is a partial projection of the flexible substrate.

[0036] Figure 11 This is a partial projection of the flexible substrate.

[0037] Figure 12 This is a partial projection of the flexible substrate.

[0038] Figure 13 This is an enlarged view of the connection between the cable assembly and the flexible substrate.

[0039] Figure 14 This is an enlarged view of the connection between the cable assembly and the flexible substrate.

[0040] Figure 15 It is a cross-sectional view showing the internal structure of the distal end portion of the ultrasonic endoscope.

[0041] Figure 16 It is a diagram showing the wiring state of the first substrate and the second substrate.

[0042] Figure 17 This is a partial enlarged view of the first substrate.

[0043] Figure 18 This is a partial enlarged view of the first substrate.

[0044] Figure 19 This is a partial cross-sectional view of a multilayer substrate according to the second embodiment.

[0045] Figure 20 This is a side view of the front end of the ultrasonic endoscope.

[0046] Figure 21 This is a cross-sectional view showing the internal structure of the distal end portion of an ultrasonic endoscope.

[0047] Figure 22 This is a cross-sectional view of a multilayer substrate according to a fourth embodiment.

[0048] Figure 23 This is a cross-sectional view showing the internal structure of the distal end portion of an ultrasonic endoscope. DETAILED DESCRIPTION

[0049] Embodiments of the multilayer substrate, probe unit, and ultrasonic endoscope according to the present invention are described below with reference to the accompanying drawings. The present invention is not limited to these embodiments. The present invention is generally applicable to multilayer substrates, probe units, and ultrasonic endoscopes.

[0050] In the drawings, identical or corresponding elements are denoted by the same reference numerals as appropriate. It should be noted that the drawings are schematic, and the dimensional relationships and proportions of the elements may differ from reality. The drawings may also contain portions that differ in dimensional relationships and proportions.

[0051] (Implementation 1)

[0052] (Structure of endoscope system)

[0053] Figure 1 1 is a diagram schematically showing the entire endoscope system including the multilayer substrate of Embodiment 1. The endoscope system 1 is a system for performing ultrasonic diagnosis inside a human subject using an ultrasonic endoscope. Figure 1 As shown, the endoscope system 1 includes an ultrasonic endoscope 2 , an ultrasonic observation device 3 , an endoscopic observation device 4 , a display device 5 , and a light source device 6 .

[0054] The ultrasonic endoscope 2 converts the electrical pulse signal received from the ultrasonic observation device 3 into an ultrasonic pulse (acoustic pulse) at its distal end and irradiates the ultrasonic pulse toward the subject. It also converts the ultrasonic echo reflected by the subject into an electrical echo signal represented by voltage change and outputs the signal.

[0055] The ultrasonic endoscope 2 generally has an imaging optical system and an imaging element, and can be inserted into the digestive tract (esophagus, stomach, duodenum, large intestine) or respiratory organs (trachea, bronchi) of the subject to be examined to photograph the digestive tract and respiratory organs. In addition, ultrasound can be used to photograph the surrounding organs (pancreas, gallbladder, bile duct, biliary tract, lymph nodes, mediastinal organs, blood vessels, etc.). In addition, the ultrasonic endoscope 2 has a light guide that is used to guide the illumination light irradiated onto the subject during optical photography. The front end of the light guide reaches the front end of the insertion portion of the ultrasonic endoscope 2 that is inserted into the subject, and on the other hand, the base end of the light guide is connected to the light source device 6 that generates the illumination light.

[0056] like Figure 1 As shown in FIG. 2 , the ultrasonic endoscope 2 includes an insertion portion 21, an operation portion 22, a universal cable 23, and a connector 24. The insertion portion 21 is a portion that is inserted into the subject. Figure 1As shown, the insertion portion 21 includes a rigid distal end portion 211 disposed at the distal end and holding the ultrasonic transducer 7 for transmitting and receiving ultrasonic waves, a bendable curved portion 212 connected to the proximal end of the distal end portion 211, and a flexible tubular portion 213 connected to the proximal end of the curved portion 212. Within the insertion portion 21, a light guide for transmitting illumination light supplied from the light source device 6 and a plurality of signal cables for transmitting various signals are routed, and a treatment instrument penetration path is formed for the insertion of a treatment instrument, although detailed illustrations are omitted. In this specification, the ultrasonic transducer 7 side of the insertion portion 21 is referred to as the distal end, and the side connected to the operating portion 22 is referred to as the proximal end.

[0057] Figure 2 It is a perspective view schematically showing the distal end structure of the insertion portion of the ultrasonic endoscope according to the present embodiment. Figure 3 : is an exploded perspective view schematically showing the front end structure of the insertion portion of the ultrasonic endoscope of this embodiment. Figure 2 As shown, the ultrasonic transducer 7 is, for example, a convex transducer, but may also be a radial transducer or a linear transducer. In the ultrasonic endoscope 2, an array of, for example, 128 piezoelectric elements is provided as the ultrasonic transducer 7. Scanning is performed electronically by electronically switching the piezoelectric elements involved in transmission and reception, or by applying a delay to the transmission and reception of each piezoelectric element. However, the number of piezoelectric elements is not particularly limited.

[0058] The distal rigid portion 211 includes an ultrasonic functional portion 211A and an endoscope functional portion 211B. The ultrasonic functional portion 211A is provided with an ultrasonic transducer 7. The endoscope functional portion 211B comprises a second housing 215. This second housing 215 includes an observation window 215a, which allows light to enter the imaging optical system, including an objective lens for capturing external light, and an illumination window 215b, which is part of the illumination optical system for focusing illumination light and emitting it externally. A treatment instrument protrusion opening 215c is formed in the second housing 215. This protrusion opening 215c communicates with a treatment instrument through-path formed within the insertion portion 21, allowing treatment instruments to protrude from the distal end of the insertion portion 21. The endoscope functional portion 211B is detachably connected to the ultrasonic functional portion 211A at one end and to the bending portion 212 at the other end.

[0059] The ultrasonic functional unit 211A is formed from a single insulating resin and, as described above, is detachably connected to the endoscope functional unit 211B. Specifically, the ultrasonic functional unit 211A includes the ultrasonic transducer 7 and a first housing 214 for holding the ultrasonic transducer 7. The first housing 214 includes a main body 214a for holding the ultrasonic transducer 7 and a connecting portion 214b protruding from the main body 214a and connected to the endoscope functional unit 211B. Hereinafter, the length of the first housing 214 along the longitudinal direction is referred to as the distal end rigid length L1. The second housing 215 of the endoscope functional unit 211B includes a hole 215d at the end opposite to the side connected to the curved portion 212, which serves as a connection to the first housing 214. The ultrasonic functional unit 211A and the endoscope functional unit 211B are connected by the connecting portion 214b fitting into the hole 215d. At this time, the two may be fixed by a known method such as adhesive or screw fastening.

[0060] return Figure 1 The operation portion 22 is connected to the base end side of the insertion portion 21 and is a portion that receives various operations from doctors and the like. Figure 1 As shown, the operating portion 22 includes a bending knob 221 for bending the bending portion 212 and a plurality of operating members 222 for performing various operations. In addition, the operating portion 22 is formed with a treatment instrument insertion port 223 that communicates with a treatment instrument through-path and is used to insert a treatment instrument into the treatment instrument through-path.

[0061] The universal cable 23 extends from the operation unit 22 and is provided with a plurality of signal cables for transmitting various signals and optical fibers for transmitting illumination light supplied from the light source device 6 .

[0062] The connector 24 is provided at the proximal end of the universal cable 23. The connector 24 includes a first connector portion 241 to a third connector portion 243 to which the ultrasound cable 31, the video cable 41, and the optical fiber cable 61 are connected, respectively.

[0063] The ultrasonic observation device 3 is connected to the ultrasonic cable 31 (see Figure 1 ) is electrically connected to the ultrasonic endoscope 2, outputs a pulse signal to the ultrasonic endoscope 2 via the ultrasonic cable 31, and inputs an echo signal from the ultrasonic endoscope 2. The ultrasonic observation apparatus 3 then performs predetermined processing on the echo signal to generate an ultrasonic image.

[0064] The endoscope observation device 4 is connected to the video cable 41 (see Figure 1 ) is electrically connected to the ultrasonic endoscope 2, and an image signal from the ultrasonic endoscope 2 is input via a video cable 41. Then, the endoscopic observation device 4 performs predetermined processing on the image signal to generate an endoscopic image.

[0065] The display device 5 is configured using liquid crystal, organic EL (Electro Luminescence), a projector, a CRT (Cathode Ray Tube), or the like, and displays ultrasonic images generated by the ultrasonic observation device 3 and endoscopic images generated by the endoscopic observation device 4 .

[0066] The light source device 6 is connected to the optical fiber cable 61 (see Figure 1 ) is connected to the ultrasonic endoscope 2 and supplies illumination light for illuminating the inside of the subject to the ultrasonic endoscope 2 via the optical fiber cable 61.

[0067] (Structure of cable group)

[0068] Figure 3 The cable group 8 shown is connected to the ultrasonic transducer 7 via a flexible substrate inside the first housing 214 . Figure 4 FIG. 1 is a diagram showing a flexible substrate with a cable group connected thereto. Figure 4 As shown, the cable assembly 8 is divided into, for example, four shielded wires 81 to 84. However, the number of shielded wires is not particularly limited. Furthermore, the ground wires 81a to 84a and the 32 signal wires 81b to 84b that pass through the inside of the ground wires 81a to 84a are connected to the substrates 91 to 94, respectively. The total number of signal wires 81b to 84b (128) is the same as the total number of piezoelectric elements of the ultrasonic transducer 7 (128). Each of the plurality of signal wires 81b to 84b is connected to one piezoelectric element of the ultrasonic transducer 7 via the substrates 91 to 94. However, the total number of signal wires 81b to 84b is not particularly limited, as long as it is the same number as the piezoelectric elements.

[0069] (Structure of flexible substrate)

[0070] Figure 5 : is a perspective view of a flexible substrate electrically connected to the piezoelectric element of the ultrasonic vibrator 7 and a plurality of signal lines 81b to 84b. Figure 5 As shown in FIG. 1 , the flexible substrate 9 is a multi-layer substrate having flexibility and is stacked in a stacking direction, and is composed of substrates 91 to 94. Figure 4 The substrates 91 to 94 shown are stacked to form Figure 5 The flexible substrate 9 shown. However, the multi-layer substrate may not be flexible. The flexible substrate 9 has one end ( Figure 5 The shielded wires 81 to 84 of the cable group 8 are connected to the left side of the length direction of the flexible substrate 9, and the other end ( Figure 5The piezoelectric element of ultrasonic transducer 7 is connected to the right side of flexible substrate 9 in the longitudinal direction. Hereinafter, substrate 91 is referred to as the front side, and substrate 94 is referred to as the back side. Specifically, the front side layer is substrate 91, the intermediate layers are substrates 92 and 93, and the back side layer is substrate 94.

[0071] Figures 6 to 9 This is an enlarged view of the substrate. Figure 6 represents a substrate 91, Figure 7 represents a substrate 92, Figure 8 Indicates substrate 93, Figure 9 94 is shown. Hereinafter, the numbers of the terminals and wirings are exemplified, but these numbers are not particularly limited and can be changed according to the number of the ultrasonic transducers 7.

[0072] like Figure 6 As shown, a ground terminal 911G, 32 signal line connection terminals 912T and 913T (signal line connection terminal array), 32 element connection terminals 914T to 917T (element connection terminal array), and a ground terminal 918G are formed on the substrate 91. The ground terminal 911G is provided in the stacking direction (with respect to the stacking direction). Figure 6 The end portion on one side of the longitudinal direction perpendicular to the paper surface) Figure 6 The signal line connection terminal 912T is provided near the ground terminal 911G, and is connected to 32 signal lines 82b. The signal line connection terminal 913T is provided adjacent to the signal line connection terminal 912T, and is connected to 32 signal lines 81b. The signal line connection terminal 912T and the signal line connection terminal 913T are arranged at staggered positions along the longitudinal direction of the flexible substrate 9. The element connection terminal 914T to the element connection terminal 917T are provided at the end portion on one side of the longitudinal direction in the direction orthogonal to the stacking direction ( Figure 6 The element connection terminals 914T to 917T are provided on the surface layer side and are arranged at staggered positions along the longitudinal direction of the flexible substrate 9. The ground terminal 918G is provided at the end portion ( Figure 6 The ground wire of the ultrasonic transducer 7 is connected to the right side of the substrate 91 in the longitudinal direction. Vias 951V through 958V respectively connect ground terminals 911G through 918G to the substrate 92. Wiring 912a through 917a connects the signal line connection terminal 912T through the element connection terminal 917T to vias 952V through 957V, respectively. Wiring 916b is thermally conductive and extends from the element connection terminal 916T to the vertical end of the substrate 91. Wiring 918a is connected to the ground wire of the ultrasonic transducer 7.

[0073] like Figure 7 As shown, wirings 921a and 922a are thermally conductive and extend to the end of substrate 92. Wiring 921b is connected to vias 952V and 955V. Wiring 922b is connected to vias 953V and 954V.

[0074] like Figure 8 As shown, the via holes 971V to 975V are respectively connected to the substrate 94 (refer to Figure 9 ) is connected. The wiring 931a has thermal conductivity and extends from the via 972V to the end of the substrate 93. The wiring 931b is connected to the via 972V and the via 973V.

[0075] like Figure 9 As shown, the substrate 94 is provided with a ground terminal 941G and 32 signal line connection terminals 942T and 943T (signal line connection terminal array). The ground terminal 941G is provided in the stacking direction (with respect to the stacking direction). Figure 9 The end portion on one side of the longitudinal direction in the direction perpendicular to the paper surface) Figure 9 (on the left side in the longitudinal direction of the flexible substrate 9), connected to ground wire 83a and ground wire 84a. Signal line connection terminal 942T is located near ground terminal 941G and is connected to 32 signal lines 83b. Signal line connection terminal 943T is located adjacent to signal line connection terminal 942T and is connected to 32 signal lines 84b. In other words, signal line connection terminal 942T and signal line connection terminal 943T are arranged at offset positions along the longitudinal direction of the flexible substrate 9. Conductive via 971V provides electrical continuity between ground terminal 941G and substrate 93. Conductive via 972V provides electrical continuity between signal line connection terminal 942T and substrate 93. Conductive via 973V provides electrical continuity between substrate 94 and substrate 93. Conductive via 974V provides electrical continuity between substrate 94 and substrate 91 via conductive vias 962V and 956V. Via 975V provides electrical connection between substrate 94 and substrate 91 via vias 963V and 957V. Wiring 942a connects signal line connection terminal 942T to via 972V. Wiring 943a connects signal line connection terminal 943T to via 974V. Wiring 944a connects via 973V to via 975V. Wiring 946a is thermally conductive and extends from via 975V to the end of substrate 94.

[0076] When looking down at the flexible substrate 9 along the stacking direction Figure 6 、 9 In the arrangement direction ( Figure 6 、 Figure 9The two ends (in the vertical direction) are preferably located within a range of 0.005 mm to 0.2 mm from the end of the flexible substrate 9. This is to miniaturize the flexible substrate 9 and, consequently, the distal end of the insertion portion 21. Miniaturizing the distal end of the insertion portion 21 is crucial to further reduce the burden on the patient's body when inserting the ultrasonic endoscope 2 into the body.

[0077] Figures 10 to 12 It is a partial projection of the flexible substrate. Specifically, Figures 10 to 12 Is from Figure 5 The direction indicated by the arrow V ( Figures 6 to 9 When viewing the flexible substrate 9 from below, the terminals, wiring, and vias are projected in the direction of arrow V. Therefore, some terminals, wiring, etc. overlap, and some are shown as a whole, while others are shown as a part. Figure 10 is with Figure 6 The area A1 corresponds to the graph, Figure 11 is with Figure 6 The corresponding figure of area A2 is, Figure 12 is with Figure 6 Region A3 corresponds to the figure.

[0078] Polyimide substrates 95 to 97 are arranged as insulating layers between substrates 91 to 94. Polyimide substrates 95 to 97 have thermally conductive vias formed therein, serving as heat conducting portions. These vias are provided between substrate 91 (the front-side layer) and substrates 92 and 93 (the middle layers), and between substrate 94 (the back-side layer) and substrates 92 and 93 (the middle layers).

[0079] The front surface of substrate 91 and the back surface of substrate 94 are covered with protective layers 98 and 99, respectively. Protective layers 98 and 99 expose only the terminal portions on the front surface of substrate 91 and the back surface of substrate 94, and protect the other portions.

[0080] like Figure 10 As shown, ground terminal 911G and ground terminal 941G face each other in the stacking direction, forming a portion of substrate 91 and a portion of substrate 94. Furthermore, signal line connection terminal 912T and signal line connection terminal 913T and signal line connection terminal 942T and signal line connection terminal 943T face each other in the stacking direction, forming a portion of substrate 91 and a portion of substrate 94.

[0081] The ground terminal 911G and the ground terminal 941G are connected by vias 951V, 961V, and 971V and are set to the same potential. In other words, the flexible substrate 9 includes vias 951V, 961V, and 971V located near the ends in the longitudinal direction and electrically connecting the ground terminal 911G on the surface layer and the ground terminal 941G on the back layer. Furthermore, these vias 951V, 961V, and 971V are provided at positions overlapping with the ground terminal 911G and the ground terminal 941G in the stacking direction. Figure 8 As shown, the via 971V and the via 964V are connected via the electrode 971a. Figure 12 As shown, the via 964V is connected to the ground terminal 918G via the via 958V, whereby the ground terminal 918G has the same potential as the ground terminal 911G and the ground terminal 941G.

[0082] Reference Figures 10 to 12 The signal line connection terminal 912T is connected to the element connection terminal 915T via the wiring 912a, the via 952V, the wiring 921b, the via 955V, and the wiring 915a.

[0083] The signal line connection terminal 913T is connected to the element connection terminal 914T via the wiring 913a, the via 953V, the wiring 922b, the via 954V, and the wiring 914a.

[0084] The signal line connection terminal 942T is connected to the element connection terminal 917T via the wiring 942a, the via 972V, the wiring 931b, the via 973V, the wiring 944a, the via 975V, the via 963V, the via 957V, and the wiring 917a.

[0085] The signal line connection terminal 943T is connected to the element connection terminal 916T via the wiring 943a, the via 974V, the via 962V, the via 956V, and the wiring 916a.

[0086] Figure 13 This is an enlarged view of the connection between the cable assembly and the flexible substrate. Figure 13 As shown, the shielded wires 81 to 84 of the cable assembly 8 are connected to the front and back sides of the signal line connection terminals 912T, 913T, 942T, and 943T of the flexible substrate 9 .

[0087] Figure 14 This is an enlarged view of the connection between the cable assembly and the flexible substrate. Figure 14As shown, on the front side of the flexible substrate 9, ground lines 81a and 82a are connected to ground terminal 911G of substrate 91, signal line 82b is connected to signal line connection terminal 912T, and signal line 81b is connected to signal line connection terminal 913T. Similarly, on the back side of the flexible substrate 9, ground lines 83a and 84a are connected to ground terminal 941G of substrate 94, signal line 83b is connected to signal line connection terminal 942T, and signal line 84b is connected to signal line connection terminal 943T.

[0088] Figure 15 This is a cross-sectional view showing the internal structure of the front end of an ultrasonic endoscope. Figure 15 As shown, the connected cable group 8 and flexible substrate 9 are connected to the piezoelectric element of the ultrasonic transducer 7 and housed in the first housing 214. In this case, by bending the flexible substrate 9 and housing it in the first housing 214, the distal end rigid length L1 can be shortened.

[0089] As described above, the signal line connection terminals 912T, 913T, 942T, and 943T of the flexible substrate 9 are sequentially connected to the element connection terminals 915T, 914T, 917T, and 916T, respectively, thereby connecting the 128 signal lines of the cable assembly 8 to the 128 piezoelectric elements of the ultrasonic transducer 7. With this flexible substrate 9, the cable assembly 8 can be connected to the flexible substrate 9 with both surfaces facing each other, thereby shortening the tip rigid length L1.

[0090] Furthermore, in flexible substrate 9, signal lines 81b, 82b or signal lines 83b, 84b are soldered to one of signal line connection terminals 912T, 913T on substrate 91 or signal line connection terminals 942T, 943T on substrate 94. Then, flexible substrate 9 is flipped over and soldered to the other side. When substrate 91 is soldered after substrate 94, since flexible substrate 9 is composed of four layers of substrates 91 to 94, when signal lines 81b, 82b are soldered to signal line connection terminals 912T, 913T on substrate 91, substrates 92, 93, serving as intermediate layers, reduce heat transfer from substrate 91 to substrate 94. Furthermore, wiring 921a, 922a, 931a, 916a, and 946a dissipate heat from their end surfaces, thereby preventing the solder on substrate 94, which was soldered first, from remelting due to heat. Similarly, when substrate 94 is soldered after substrate 91 is soldered, substrates 92 and 93 are thermally insulated, and wirings 921a, 922a, 931a, 916a, and 946a dissipate heat from the end faces, preventing the solder on substrate 91 from melting again.

[0091] Figure 16It is a diagram showing the wiring state of the first substrate and the second substrate. Figure 16 It will Figure 6 The enlarged view of part B1 shows the wirings of substrate 91 and substrate 92 overlapping each other. Figure 16 In the figure, a portion 9121 of the wiring 912a highlighted by hatching and a portion 9221 of the wiring 922a highlighted by hatching are arranged so that the overlapping area is as small as possible. In this way, the wiring 922a of the substrate 92 as the intermediate layer is arranged in the stacking direction (with respect to the stacking direction). Figure 16 The wiring pattern observed in the direction perpendicular to the paper surface) and the wiring 912a provided on the substrate 91 as the surface side layer along the stacking direction (with Figure 16 As a result, compared to a case where the wiring patterns are the same when viewed along the stacking direction, the distance between wiring 912a and wiring 922a can be increased, and when soldering is performed, the heat transferred from wiring 912a to wiring 922a can be reduced.

[0092] Similarly, portion 9131 (a portion of wiring 913a highlighted by hatching) and portion 9211 (a portion of wiring 921b highlighted by hatching) are arranged so that their overlapping area is minimized. This creates a different wiring pattern along the stacking direction for wiring 921b on substrate 92, the intermediate layer, than for wiring 913a on substrate 91, the front-side layer. As a result, heat transfer from wiring 913a to wiring 921b during soldering can be reduced.

[0093] exist Figure 16 In section B1, it is described that the wiring pattern of the wiring on substrate 92, the intermediate layer, as viewed in the stacking direction differs from the wiring pattern of the wiring on substrate 91, the front-side layer, as viewed in the stacking direction. However, it is preferred that the wiring pattern of the wiring on substrate 92, the intermediate layer, as viewed in the stacking direction differ from the wiring pattern of the wiring on substrate 91, the front-side layer, as viewed in the stacking direction throughout the entire area of ​​flexible substrate 9. Furthermore, it is preferred that the wiring pattern of the wiring on substrate 93, the intermediate layer, as viewed in the stacking direction differ from the wiring pattern of the wiring on substrate 94, the back-side layer, as viewed in the stacking direction. As a result, when soldering is performed across the entire area of ​​flexible substrate 9, heat transfer from the wiring on substrates 91 or 94 to the wiring on substrates 92 or 93 can be reduced.

[0094] Figure 17 、 Figure 18 This is a partial enlarged view of the first substrate. Specifically, Figure 17 It will Figure 6 The enlarged partial view of part B2 is shown. Figure 18 It will Figure 6 An enlarged partial view of part B3. Figure 17 The width dSL of the signal line connection terminal 912T in the arrangement direction is larger than Figure 18 The width dSF of the element connection terminal 914T in the arrangement direction is shown. Thus, in the flexible substrate 9, the widths of the signal line connection terminals 912T, 913T, 942T, and 943T in the arrangement direction are greater than the widths of the element connection terminals 914T through 917T. Furthermore, in the flexible substrate 9, the widths between the signal line connection terminals 912T, 913T, 942T, and 943T, and between the element connection terminals 914T through 917T, in the arrangement direction, are smaller than the widths of the wiring provided on the front and back layers. As a result, the width of the distal end of the flexible substrate 9 (on the ultrasonic transducer 7 side) can be reduced, allowing for a more compact insertion portion 21.

[0095] (Implementation Method 2)

[0096] Figure 19 FIG is a partial cross-sectional view of a multilayer substrate according to Embodiment 2. Figure 19 As shown, flexible substrate 9A includes substrate 91A, polyimide substrates 101 to 103, relay substrate 104, thermally insulating layer 105 having high thermal insulation properties, and relay substrate 106. Substrates 92, 93, 94, polyimide substrates 95 to 97, and protective layer 99 can be the same as those in Embodiment 1, and therefore their description is omitted.

[0097] Ground terminals 911G, signal line connection terminals 912T, and signal line connection terminals 913T are formed on the substrate 91A. The surface of the substrate 91A is protected by a protective layer 98A.

[0098] The ground terminal 911G is set to the same potential as the ground terminal 941G via the via 1011V of the polyimide substrate 101, the via 1021V of the polyimide substrate 102, the via 1031V of the polyimide substrate 103, the via 1051V of the thermal insulation layer 105, and the relay terminal 1061 of the relay substrate 106, and via the same path as in embodiment 1.

[0099] The signal line connection terminal 912T is connected to the element connection terminal 915T via the wiring 912a, the via 1012V of the polyimide substrate 101, the via 1022V of the polyimide substrate 102, the via 1032V of the polyimide substrate 103, the via 1052V of the thermal insulation layer 105 and the relay terminal 1062 of the relay substrate 106, and via the same path as in embodiment 1.

[0100] The signal line connection terminal 913T is connected to the element connection terminal 914T via the wiring 913a, the via 1013V of the polyimide substrate 101, the via 1023V of the polyimide substrate 102, the via 1033V of the polyimide substrate 103, the via 1053V of the thermal insulation layer 105 and the relay terminal 1063 of the relay substrate 106, and via the same path as in embodiment 1.

[0101] As described above, in flexible substrate 9A, thermal insulation layer 105 having high thermal insulation properties is disposed between substrate 91A and substrate 94. Therefore, the effect of reducing heat transfer from substrate 91A to substrate 94 is enhanced. Furthermore, when thermal insulation layer 105 is an anisotropic conductive adhesive, electrical conductivity in the stacking direction is maintained while insulating properties in the layer direction are maintained, further enhancing the effect of reducing heat transfer from substrate 91A to substrate 94.

[0102] (Implementation 3)

[0103] Figure 20 This is a side view of the front end of the ultrasonic endoscope. Figure 20 As shown, in Embodiment 3, the ultrasonic vibrator 7B is a radial vibrator and is held by the first housing 214B. When the ultrasonic vibrator 7B is a radial vibrator, the distal end rigid length L2 is the length of the first housing 214B.

[0104] Figure 21 This is a cross-sectional view showing the internal structure of the front end of an ultrasonic endoscope. Figure 21 As shown, three flexible substrates 9B are connected to the ultrasonic transducer 7B, and three cable groups 8B are connected to the flexible substrates 9B. In this way, a plurality of substrates do not need to be stacked.

[0105] (Implementation 4)

[0106] Figure 22 : is a cross-sectional view of a multilayer substrate according to Embodiment 4. Figure 22As shown, flexible substrate 9C includes substrates 301 to 306, polyimide substrates 307, 308, 312, and 313 disposed between substrates 301 to 306, an adhesive layer 309 for bonding polyimide substrate 308 to substrate 303, an adhesive layer 311 for bonding polyimide substrate 312 to substrate 304, and a thermal insulation layer 310. The front surface of substrate 301 and the back surface of substrate 306 are covered with protective layers 314 and 315, respectively.

[0107] The ground terminal 3011G of the substrate 301 and the ground terminal 3061G of the substrate 306 are arranged opposite each other in the stacking direction. Furthermore, the signal line connection terminals 3012T and 3013T of the substrate 301 and the signal line connection terminals 3062T and 3063T of the substrate 306 are arranged opposite each other. Furthermore, the element connection terminals 3014T to 3016T of the substrate 301 and the element connection terminals 3064T to 3066T of the substrate 306 are arranged opposite each other. Furthermore, the ground terminal 3017G of the substrate 301 and the ground terminal 3067G of the substrate 306 are arranged opposite each other.

[0108] Ground terminal 3011G is connected to ground terminal 3017G via via 3071V, via 3081V, wiring on substrate 303, via 3082V, wiring on substrate 302, via 3083V, wiring on substrate 303, via 3084V, and via 3076V, and the two are set to the same potential. Similarly, ground terminal 3061G is connected to ground terminal 3067G via via 3131V, via 3121V, wiring on substrate 304, via 3122V, wiring on substrate 305, via 3123V, wiring on substrate 304, via 3124V, and via 3136V, and the two are set to the same potential.

[0109] The signal line connection terminal 3012T is connected to the element connection terminal 3016T via the wiring 3012a, the via 3072V, the wiring of the substrate 302, the via 3075V, and the wiring 3016a.

[0110] The signal line connection terminal 3013T is connected to the element connection terminal 3015T via the wiring 3013a, the via 3073V, the wiring of the substrate 302, and the via 3074V. The signal line connection terminal 3013T is also connected to the element connection terminal 3014T via the wiring 3013b.

[0111] The signal line connection terminal 3062T is connected to the element connection terminal 3066T via the wiring 3062a, the via 3132V, the wiring of the substrate 305, the via 3135V, and the wiring 3066a.

[0112] The signal line connection terminal 3063T is connected to the element connection terminal 3065T via the wiring 3063a, the via 3133V, the wiring of the substrate 305, and the via 3134V. The signal line connection terminal 3063T is also connected to the element connection terminal 3064T via the wiring 3063b.

[0113] Figure 23 This is a cross-sectional view showing the internal structure of the front end of an ultrasonic endoscope. Figure 23 As shown, the distal end of the flexible substrate 9C is bent at approximately right angles in two opposite directions and connected to the convex ultrasonic transducer 7C. The distal end of the flexible substrate 9C is housed in the first housing 214C.

[0114] As described above, in the flexible substrate 9C, the highly insulating heat-insulating layer 310 is disposed between the substrate 301 and the substrate 306. This effectively reduces heat transfer from the substrate 301 to the substrate 306. Furthermore, since the ultrasonic transducer 7C can be connected to both sides of the flexible substrate 9C, whose distal end is bent and divided into two parts, the length of the first housing 214C, which represents the distal end rigid length L3, can be shortened.

[0115] Those skilled in the art will readily derive further effects and variations. Therefore, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Therefore, various modifications are possible without departing from the spirit or scope of the general inventive concept defined by the appended claims and their equivalents.

[0116] Description of Reference Numerals

[0117] 1. Endoscope system; 2. Ultrasonic endoscope; 3. Ultrasonic observation device; 4. Endoscope observation device; 5. Display device; 6. Light source device; 7, 7B, 7C, Ultrasonic transducer; 8, 8B, Cable assembly; 9, 9A, 9B, 9C, Flexible substrate; 21. Insertion portion; 22. Operation portion; 23. Universal cable; 24. Connector; 31. Ultrasonic cable; 41. Video cable; 61. Optical fiber cable; 81-84, Multiple shielded wires; 81a-84a, Ground wire; 81b-84b, Signal wire; 91-94, 91A, 301-306, Substrate; 95-97, 101, 102, 103, 307, 308, 312 , 313, polyimide substrate; 98, 99, 314, 315, protective layer; 104, 106, relay substrate; 105, 310, thermal insulation layer; 211, front end portion; 211A, ultrasonic function portion; 211B, endoscope function portion; 212, bending portion; 213, flexible tube portion; 214, 214B, first shell; 214a, main body; 214b, connecting portion; 214c, extension portion; 215, second shell; 215a, observation window; 215b, lighting window; 215c, disposal instrument protrusion; 215d, hole; 221, bending knob; 222, operating member; 223, disposal instrument insertion port; 241, first connection Device portion; 242, second connector portion; 243, third connector portion; 309, 311, adhesive layer; 911G, 918G, 941G, 3011G, 3017G, 3061G, 3067G, ground terminal; 912T, 913T, 942T, 943T, 3012T, 3013T, 3062T, 3063T, signal line connection terminal; 912a, 913a, 914a, 915a, 916a, 916b, 917a, 918a, 921a, 921b, 922a, 922b, 931a, 931b, 942a, 943a, 944a, 946a, 3012a, 30 13a, 3013b, 3016a, 3062a, 3063a, 3066a, wiring; 914T~917T, 3014T~3016T, 3064T~3066T, component connection terminals; 951V~958V, 961V~964V, 971V~975V, 1011V, 1012V, 1021V, 1022V, 1031V, 1032V, 1051V~1053V, 3071V~3076V, 3081V~3084V, 3121V~3124V, 3131V~3136V, via holes; 971a, electrode; 1061, 1062, relay terminals.

Claims

1. A multilayer substrate comprising a surface layer, an intermediate layer, and a back layer stacked in a stacking direction, wherein an ultrasonic transducer is electrically connected to one end of the multilayer substrate in a longitudinal direction perpendicular to the stacking direction, wherein: The multi-layer substrate comprises: a ground terminal connected to a ground line of a plurality of shield lines connected to the multilayer substrate, the ground terminal forming a portion of the surface side layer and a portion of the back side layer at the other end in the longitudinal direction; a plurality of signal line connection terminal arrays, each having a plurality of signal line connection terminals for connecting signal lines of the plurality of shielding lines, the plurality of signal line connection terminal arrays forming a portion of the front side layer and a portion of the back side layer near the ground terminal in the longitudinal direction and arranged in a direction perpendicular to the longitudinal direction; and The wiring has thermal conductivity and extends from the intermediate layer to the other end. When the signal line is soldered to the signal line connection terminal, the wiring can dissipate heat from the end surface.

2. The multi-layer substrate according to claim 1, wherein When viewed along the stacking direction, the wiring pattern of the wiring provided in the intermediate layer is different from the wiring patterns of the wiring provided in the front-side layer and the back-side layer.

3. The multi-layer substrate according to claim 1, wherein The multi-layer substrate includes a heat conducting portion having thermal conductivity and provided between the front surface layer and the intermediate layer and between the back surface layer and the intermediate layer.

4. The multi-layer substrate according to claim 1, wherein When the multilayer substrate is viewed from above along the stacking direction, both ends of the ground terminal and the signal line connection terminal column are located in an area 0.005 mm to 0.2 mm away from the end of the multilayer substrate in an arrangement direction intersecting the longitudinal direction.

5. The multi-layer substrate according to claim 1, wherein The multilayer substrate includes a via hole located near an end portion in the longitudinal direction and electrically connecting the ground terminal of the front surface layer and the ground terminal of the back surface layer. The multi-layer substrate according to claim 5 , wherein: The via hole is provided at a position overlapping with the ground terminal along the stacking direction.

7. The multi-layer substrate according to claim 1, wherein The multilayer substrate includes a plurality of element connection terminal arrays, each of which has a plurality of element connection terminals, each of which is respectively connected to each of the plurality of piezoelectric elements possessed by the ultrasonic vibrator. The plurality of element connection terminal arrays are arranged on the one end side of the longitudinal direction and are configured along a direction orthogonal to the longitudinal direction.

8. The multi-layer substrate according to claim 7, wherein In an arrangement direction of the signal line connection terminals, a width of the signal line connection terminals is greater than a width of the component connection terminals.

9. The multi-layer substrate according to claim 7, wherein In the arrangement direction of the signal line connection terminals, the width of the signal line connection terminal column is greater than the width of the component connection terminal column.

10. The multi-layer substrate according to claim 7, wherein The width between the signal line connection terminals and the width between the element connection terminals are smaller than the width of the wiring provided on the front side layer and the back side layer.

11. The multi-layer substrate according to claim 7, wherein The element connection terminal array forms a portion of the surface-side layer or a portion of the back-side layer.

12. A probe unit comprising: Multiple shielded cables; as well as A multilayer substrate having a surface layer, an intermediate layer, and a back layer stacked in a stacking direction, wherein an ultrasonic vibrator is electrically connected to one end of the multilayer substrate in a longitudinal direction perpendicular to the stacking direction. In this probe unit, The multi-layer substrate has: a ground terminal connected to a ground line of a plurality of shield lines connected to the multilayer substrate, the ground terminal forming a portion of the surface side layer and a portion of the back side layer at the other end in the longitudinal direction; a plurality of signal line connection terminal arrays, each having a plurality of signal line connection terminals for connecting signal lines of the plurality of shielding lines, the plurality of signal line connection terminal arrays forming a portion of the front side layer and a portion of the back side layer near the ground terminal in the longitudinal direction and arranged in a direction perpendicular to the longitudinal direction; as well as The wiring has thermal conductivity and extends from the intermediate layer to the other end. When the signal line is soldered to the signal line connection terminal, the wiring can dissipate heat from the end surface.

13. An ultrasonic endoscope, comprising: an ultrasonic transducer for receiving and transmitting ultrasonic waves; Multiple shielded cables; as well as a multilayer substrate having a surface layer, an intermediate layer, and a back layer stacked in a stacking direction, wherein the multilayer substrate is electrically connected to the ultrasonic vibrator at one end in a longitudinal direction perpendicular to the stacking direction. In this ultrasonic endoscope, The multi-layer substrate has: a ground terminal connected to a ground line of a plurality of shield lines connected to the multilayer substrate, the ground terminal forming a portion of the surface side layer and a portion of the back side layer at the other end in the longitudinal direction; a plurality of signal line connection terminal arrays, each having a plurality of signal line connection terminals for connecting signal lines of the plurality of shielding lines, the plurality of signal line connection terminal arrays forming a portion of the front side layer and a portion of the back side layer near the ground terminal in the longitudinal direction and arranged in a direction perpendicular to the longitudinal direction; as well as The wiring has thermal conductivity and extends from the intermediate layer to the other end. When the signal line is soldered to the signal line connection terminal, the wiring can dissipate heat from the end surface.

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