Heat dissipation device and antenna assembly using the same

Abstract

A heat dissipation device and an antenna assembly using the same are disclosed. The heat dissipation device according to an embodiment of the present application is configured to cool a circuit substrate including at least one heat generating element, and includes a plate arranged to face the circuit substrate, a plurality of first heat dissipation fins arranged along a first direction on one side of the plate spaced apart from the circuit substrate, and a blowing portion arranged to face one side of the plate and including at least one fan configured to blow air toward one side of the plate, a space between adjacent two first heat dissipation fins being defined as a side passage configured to guide the air blown by the at least one fan.

Description

Technical Field

[0001] This invention relates to a heat dissipation device and an antenna assembly utilizing a heat dissipation device. Background Technology

[0002] The contents described in this section are merely for providing background information for the present invention and do not constitute prior art.

[0003] Existing antenna devices employ convection cooling methods using heat sinks and fans to cool heat-generating components such as RF elements. Specifically, existing convection cooling methods involve heat sinks extending vertically and fans positioned above or below the heat sinks to cool them.

[0004] However, this existing convection cooling method inevitably leads to a longer travel distance for the air flowing between the heat sinks, thus resulting in a decrease in cooling efficiency.

[0005] For example, if a fan is placed at the bottom of the heatsink, the air blown by the fan will cool the lower area of ​​the heatsink before cooling the upper area. In this case, some of the flowing air may leak to the outside, so the amount of air delivered to the upper area of ​​the heatsink is less than the amount delivered to the lower area.

[0006] Furthermore, the air transferred to the upper part of the heatsink may already be at a high temperature because other areas of the heatsink are already heated. Therefore, existing convection cooling methods not only lead to a decrease in overall cooling efficiency, but also result in significant differences in the cooling performance of different areas of the heatsink. Summary of the Invention

[0007] (a) Technical problems to be solved

[0008] Based on this, the main objective of the present invention is to provide a heat dissipation device that can effectively cool a heat-generating element through convection and an antenna assembly utilizing the heat dissipation device.

[0009] (II) Technical Solution

[0010] According to an embodiment of the present invention, a heat dissipation device is configured for cooling a circuit board including at least one heat-generating element, comprising: a plate arranged facing the circuit board; a plurality of first heat sinks arranged along a first direction on one side of the plate spaced apart from the circuit board; and an air supply section arranged facing one side of the plate and including at least one fan configured to blow air toward one side of the plate, wherein the space between two adjacent first heat sinks is defined as a side channel, the side channel being configured to guide the air blown out by the at least one fan.

[0011] (III) Beneficial Effects

[0012] As described above, according to this embodiment, the heat dissipation device and the antenna assembly utilizing the heat dissipation device can effectively cool the heat-generating element and minimize problems that may occur in the heat-generating element at high temperatures, such as performance degradation or even damage to the heat-generating element. Attached Figure Description

[0013] Figure 1 This is a perspective view of an antenna assembly according to an embodiment of the present invention.

[0014] Figure 2 This is a rear perspective view of an antenna assembly according to an embodiment of the present invention.

[0015] Figure 3 This is an exploded perspective view of an antenna assembly according to an embodiment of the present invention.

[0016] Figure 4 This is an exploded perspective view of the rear side of an antenna assembly according to an embodiment of the present invention.

[0017] Figure 5 This is a rear perspective view of an antenna assembly according to an embodiment of the present invention, showing the flow of air along a side channel.

[0018] Figure 6 This is an exploded perspective view of the rear side of the antenna assembly according to a second embodiment of the present invention.

[0019] Figure 7 This is a rear view of an antenna assembly according to a second embodiment of the present invention.

[0020] Figure 8 This is a rear view of an antenna assembly according to a third embodiment of the present invention.

[0021] Figure 9 This is a bottom view of an antenna assembly according to a third embodiment of the present invention.

[0022] Figure 10 This is a rear perspective view of an antenna assembly according to a fourth embodiment of the present invention.

[0023] Figure 11 This is a rear view of an antenna assembly according to a fifth embodiment of the present invention.

[0024] Figure 12 This is a rear view of an antenna assembly according to a sixth embodiment of the present invention. Detailed Implementation

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When labeling the various figures, the same reference numerals are used as much as possible, even if the same constituent elements appear in different figures. Throughout this specification, detailed descriptions of known constituent elements and functions are omitted if it is believed that such detailed descriptions would obscure the subject matter of the present invention.

[0026] In describing the constituent elements according to embodiments of the present invention, symbols such as first, second, i), ii), a), and b) may be used. These symbols are only used to distinguish their constituent elements from other constituent elements, and are not intended to limit the nature, order, or sequence of the corresponding constituent elements. In the specification, if a constituent element "comprises" or "has" another constituent element, unless explicitly stated otherwise, it shall be understood that the constituent element further includes the other constituent element, rather than excluding the other constituent element.

[0027] Figure 1 This is a perspective view of an antenna assembly 10 according to an embodiment of the present invention.

[0028] Figure 2 This is a rear perspective view of an antenna assembly 10 according to an embodiment of the present invention.

[0029] Figure 3 This is an exploded perspective view of an antenna assembly 10 according to an embodiment of the present invention.

[0030] Figure 4 This is an exploded perspective view of the rear side of an antenna assembly 10 according to an embodiment of the present invention.

[0031] Figure 5 This is a rear perspective view of air flowing along the side channel S in an antenna assembly 10 according to an embodiment of the present invention.

[0032] Reference Figures 1 to 4 The antenna assembly 10 may include an antenna cover 11, a circuit board 12, and a heat dissipation device 100.

[0033] The radome 11 can be arranged in front of the antenna assembly 10. Thus, the radome 11 can prevent external impacts and the inflow of foreign objects, thereby protecting the electronic components inside the antenna assembly 10.

[0034] The circuit board 12 may include at least one heat-generating element 13. The at least one heat-generating element 13 may include all or part of RF components for operating the antenna assembly 10, such as amplifiers, filters, FPGAs, etc., but the invention is not limited thereto.

[0035] Because the heat dissipation device 100 is arranged close to the circuit board 12, it can cool the heat generated by the heat-generating element 13 on the circuit board 12. As a result, the temperature of the heat-generating element 13 can be maintained within an appropriate range, thereby preventing the function of the heat-generating element 13 from deteriorating or even being damaged due to high temperature.

[0036] The heat dissipation device 100 may be arranged close to the circuit board 12. For example, the heat dissipation device 100 may be arranged behind the circuit board 12 or may be arranged to cover at least a portion of the circuit board 12.

[0037] The heat dissipation device 100 may include all or part of a plate 110, a plurality of first heat sinks 120 and an air supply section 130.

[0038] The plate 110 can be arranged to face the circuit board 12. The heat generated by the heating element 13 can be transferred to the plate 110.

[0039] The plate 110 can be in direct contact with the circuit board 12. In this case, the heat generated by the heating element 13 can be transferred to the plate 110 through thermal conduction.

[0040] However, the present invention is not limited thereto, and the plate 110 may also be separated from the circuit board 12 by a certain distance. In this case, the heat generated by the heating element 13 can be transferred to the plate 110 by convection.

[0041] Additionally, a heat-conducting portion (not shown) may be provided between the plate 110 and the circuit board 12. The heat-conducting portion may be made of a metal with high thermal conductivity, such as aluminum.

[0042] The heat generated by the heating element 13 can be confined to a portion of the area surrounding the heating element 13. The heat-conducting part can evenly distribute the heat generated locally by the heating element 13 to all areas of the heat-conducting part through heat conduction.

[0043] In this case, the heat generated by the heating element 13 can be transferred to more areas of the plate 110 via the heat-conducting part. Therefore, the heat generated by the heating element 13 can be cooled more effectively.

[0044] The plate 110 may be plate-shaped, or it may be a housing shape used to partially form the outline of the antenna assembly 10. However, the invention is not limited thereto, and the plate 110 may be any shape used to remove heat generated by the heating element 13.

[0045] Multiple first heat sinks 120 may be arranged on one side of a plate 110 that is separated from the circuit board 12, for example, on the back of the plate 110. The multiple first heat sinks 120 are capable of receiving heat transferred from the plate 110 by thermal conduction.

[0046] Therefore, the heat generated by the heating element 13 can be transferred to the first heat sink 120 via the plate 110. The heat transferred to the first heat sink 120 can be cooled by forced convection or natural convection.

[0047] Additionally, multiple first heat sinks 120 can be arranged along a first direction on one side of a plate 110 that is separated from the circuit board 12. The first direction refers to the height direction of each plate 110. Figures 1 to 4 , then it is the Z-axis direction.

[0048] Each of the plurality of first heat sinks 120 may extend along a second direction perpendicular to the first direction on one side of the plate 110. The second direction refers to the width direction of the plate 110. Figures 1 to 4 , then it is the Y-axis direction.

[0049] If the first heat sink 120 extends in the second direction, the airflow path between the first heat sink 120 becomes narrower compared to when the first heat sink 120 extends in the first direction. Therefore, the first heat sink 120 can be cooled by relatively low-temperature air over its entire area. This improves the cooling effect based on the first heat sink 120.

[0050] However, the shape of the first heat sink 120 of the present invention is not limited thereto. For example, the first heat sink 120 may have a shape that is inclined upward from the center of the second direction of the first heat sink 120, that is, a "V" shape, or it may be an overall inclined shape.

[0051] Reference Figure 5 The space between two adjacent first heat sinks 120 can be defined as a side channel S. The side channel S can be formed along a first direction between multiple first heat sinks 120.

[0052] The shape of the side channel S can vary depending on the shape of the first heat sink 120. For example, if the first heat sink 120 extends along the second direction, the side channel S will also extend along the second direction. In this case, the side channel S can guide the air blown by at least one fan 136 to the second direction.

[0053] If the first heat sink 120 is tilted, the side channel S can also be tilted. In this case, the side channel S can guide the air blown by at least one fan 136 in the tilting direction.

[0054] Refer again Figures 1 to 4 Multiple first heat sinks 120 may have the same height and be arranged at the same intervals. However, the present invention is not limited thereto; in order to improve heat dissipation efficiency, the height or interval of the first heat sinks 120 may be set to be different.

[0055] For example, the first heat sink 120 arranged near the heat-generating element that generates more heat and the first heat sink 120 arranged near the heat-generating element that generates less heat can be set to have different heights or intervals.

[0056] The air supply section 130 can be arranged to face one side of the plate 110. More specifically, the air supply section 130 can be arranged behind the plurality of first heat sinks 120.

[0057] The air supply section 130 may include at least one fan 136. The at least one fan 136 may blow air toward one side of the plate 110. The air blown by the fan 136 may flow in the area surrounding the first heat sink 120, for example in the side channel S, and then be discharged to the outside of the antenna assembly 10. Thus, the heat transferred to the plurality of first heat sinks 120 can be cooled by forced convection.

[0058] The air blown by fan 136 can travel in a direction parallel to the first direction and a third direction perpendicular to the second direction, but the present invention is not limited thereto. Here, the third direction refers to the thickness direction of the plate 110, as shown in the figure. Figures 1 to 4 , then it is the X-axis direction.

[0059] The air supply section 130 may include a plurality of fans 136 arranged along a first direction to uniformly cool a plurality of first heat sinks 120 arranged along the first direction.

[0060] The air supply section 130 can be arranged to face the middle area of ​​the plate 110 in the second direction. However, the present invention is not limited to this, and the air supply section 130 can also be arranged biased to either side.

[0061] The operation of fan 136, including its rotation speed, can be controlled by a fan control unit (not shown) inside antenna assembly 10. The fan control unit can control at least one fan 136 based on information about the surrounding environment, the operating status of antenna assembly 10, or the temperature information of heating element 13.

[0062] However, the operation of fan 136 and even the rotation speed of fan 136 can be automatically adjusted by the fan control unit, or it can be manually adjusted by the user.

[0063] The air supply section 130 may further include a fan housing 132 and a fan cover 134.

[0064] The fan 136 can be housed inside the fan housing 132, and can be protected from external impacts or even the ingress of external foreign matter.

[0065] The fan shroud 134 may cover the open rear of the fan housing 132. The fan shroud 134 may include a plurality of grilles 1342 for protecting at least one fan 136.

[0066] The antenna assembly 10 may further include a conduit 140.

[0067] The conduit 140 may be arranged to cover at least a portion of the plurality of first heat sinks 120 and may close at least one side of the side channel S. Based on this, the conduit 140 can prevent air blown by at least one fan 136 from flowing in an unexpected direction, such as behind the antenna assembly 10.

[0068] The conduit section 140 may include a first conduit 142 and a second conduit 144 spaced apart from the first conduit 142 in a second direction.

[0069] The air supply section 130 can be arranged between the first pipe 142 and the second pipe 144. In other words, the first pipe 142 and the second pipe 144 can be arranged on both sides of the second direction with the air supply section 130 as the reference.

[0070] The conduit section 140 may further include a plurality of conduit pins 146 arranged along a second direction on the first conduit 142 and the second conduit 144. Each conduit pin 146 may extend along a first direction on the first conduit 142 and the second conduit 144.

[0071] Multiple conduit pins 146 may be exposed to the outside of the antenna assembly 10 and may be cooled by natural convection. Therefore, at least a portion of the heat transferred to the multiple first heat sinks 120 may be cooled by the multiple conduit pins 146.

[0072] In addition, although Figures 1 to 4 The illustration shows a heat dissipation device 100 according to an embodiment of the present invention applied to an antenna assembly 10, but this is only for illustrative purposes and the present invention is not limited thereto. Therefore, the heat dissipation device 100 according to an embodiment of the present invention can also be applied to other devices including heat-generating elements besides the antenna assembly 10.

[0073] In the following discussion Figure 6 and Figure 10 In the second to fourth embodiments of the present invention shown, the first heat sink is composed of a double-sided heat sink, with a central channel formed between the two heat sinks. This differs from the previous embodiment. Figures 1 to 5 The illustration shows one embodiment of the present invention. The following description will focus on the distinguishing features from the embodiments of the present invention; structures that are essentially the same as an embodiment of the present invention will be omitted from repeated description.

[0074] Figure 6This is an exploded perspective view of the rear side of the antenna assembly 20 according to the second embodiment of the present invention.

[0075] Figure 7 This is a rear view of the antenna assembly 20 according to a second embodiment of the present invention. For ease of explanation, Figure 7 The air supply section and duct section have been omitted.

[0076] Reference Figure 6 and Figure 7 The plurality of first heat sinks 220 may include a plurality of first-side heat sinks 222 and a plurality of second-side heat sinks 224.

[0077] Multiple first-side heat sinks 222 and multiple second-side heat sinks 224 may be arranged along a first direction. The multiple first-side heat sinks 222 and multiple second-side heat sinks 224 may be spaced apart in a second direction.

[0078] The first heat sink 222 and the second heat sink 224 may extend along the second direction. However, the present invention is not limited thereto, and the first heat sink 222 and the second heat sink 224 may also be inclined.

[0079] The space between two adjacent first-side heat sinks 222 can be defined as a first-side channel S1. The first-side channel S1 can be formed along a first direction between a plurality of first-side heat sinks 222.

[0080] The space between two adjacent second-side heat sinks 224 can be defined as a second-side channel S2. The second-side channel S2 can be formed along a first direction between a plurality of second-side heat sinks 224.

[0081] The first side channel S1 and the second side channel S2 can guide the air blown out by at least one fan 236.

[0082] The shapes of the side channels S1 and S2 can vary depending on the shapes of the side heat sinks 222 and 224. For example, if the side heat sinks 222 and 224 extend along the second direction, then the side channels S1 and S2 will also extend along the second direction. In this case, the side channels S1 and S2 can guide the air blown out by at least one fan 236 to the second direction.

[0083] If the side heat sinks 222 and 224 are inclined, then the side channels S1 and S2 can also be inclined. In this case, the side channels S1 and S2 can guide the air blown out by at least one fan 236 to the inclined direction.

[0084] The space between multiple first-side heat sinks 222 and multiple second-side heat sinks 224 can be defined as an intermediate channel C.

[0085] The intermediate channel C can guide the air blown by at least one fan 236 in a first direction. The air blown from the fan 236 can flow along the intermediate channel C in the first direction while cooling one side of the plate 210.

[0086] The intermediate channel C can be connected to the first side channel S1 and the second side channel S2. Therefore, the air blown out from the fan 236 can be transmitted to the first side channel S1 and the second side channel S2 through the intermediate channel C.

[0087] The air blown out by a fan 236 can be transmitted through the middle channel C to the side heat sinks 222 and 224 corresponding to the position of the fan 236, and also to the side heat sinks 222 and 224 that are a certain distance away from the fan 236.

[0088] Therefore, when any one of the multiple fans 236 fails, the side heat sinks 222 and 224 corresponding to the fan 236 can also be cooled by the other fans 236.

[0089] Therefore, the heat dissipation device 200 according to the second embodiment of the present invention may have a redundancy function, which allows the heat sinks 222, 224 to be cooled by the other fans 236 even if some of the multiple fans 236 fail.

[0090] Figure 8 This is a rear view of the antenna assembly 30 according to a third embodiment of the present invention.

[0091] Figure 9 This is a bottom view of the antenna assembly 30 according to a third embodiment of the present invention.

[0092] For ease of explanation, Figure 8 and Figure 9 The air supply section and duct section have been omitted.

[0093] Reference Figure 8 and Figure 9 The plurality of first heat sinks 320 may include a plurality of first-side heat sinks 322 and a plurality of second-side heat sinks 324.

[0094] Multiple first-side heat sinks 322 and multiple second-side heat sinks 324 may be arranged along a first direction. The multiple first-side heat sinks 322 and multiple second-side heat sinks 324 may be spaced apart in a second direction.

[0095] The first heat sink 322 and the second heat sink 324 may extend in the second direction. However, the present invention is not limited thereto, and the first heat sink 322 and the second heat sink 324 may also be inclined.

[0096] The space between two adjacent first-side heat sinks 322 can be defined as a first-side channel S1. The first-side channel S1 can be formed along a first direction between a plurality of first-side heat sinks 322.

[0097] The space between two adjacent second-side heat sinks 324 can be defined as a second-side channel S2. The second-side channel S2 can be formed along a first direction between a plurality of second-side heat sinks 324.

[0098] The first side channel S1 and the second side channel S2 can guide the air blown out by at least one fan 336.

[0099] The space between the multiple first-side heat sinks 322 and the multiple second-side heat sinks 324 can be defined as the intermediate channel C.

[0100] The intermediate channel C can guide the air blown by at least one fan 336 in a first direction. The air blown from the fan 336 can flow along the intermediate channel C in the first direction while cooling one side of the plate 310.

[0101] The intermediate channel C can be connected to the first side channel S1 and the second side channel S2. Therefore, the air blown out from the fan 336 can be transmitted to the first side channel S1 and the second side channel S2 through the intermediate channel C.

[0102] The heat dissipation device 300 may include a plurality of second heat sinks 350 disposed between a plurality of first-side heat sinks 322 and a plurality of second-side heat sinks 324.

[0103] Multiple second heat sinks 350 can be arranged along a second direction, and each second heat sink 350 can extend along a first direction. The heat generated by the heat-generating element can be transferred to the second heat sinks 350 via the plate 310. The heat transferred to the second heat sinks 350 can be cooled by forced convection or natural convection.

[0104] Multiple first-side heat sinks 322 and multiple second-side heat sinks 324 have a first height H1, and multiple second-side heat sinks 350 may have a second height H2, the second height H2 being less than the first height. The first height H1 and the second height H2 are defined with reference to one side of the plate 310.

[0105] The height H2 of the second heat sink 350 is set to be lower than the height H1 of the side heat sinks 322 and 324, so as to prevent the second heat sink 350 from obstructing the flow of air from the middle channel C to the side channels S1 and S2.

[0106] The intermediate channel C may include multiple slave channels C1 and master channels C2.

[0107] The space between two adjacent second heat sinks 350 can be defined as multiple secondary channels C1, and the space from the upper part of the second heat sink 350 to the side heat sinks 322, 324 can be defined as the main channel C2.

[0108] The main channel C2 can be connected to multiple secondary channels C1. Air blown out by the fan can be guided by the main channel C2, and the air guided by the main channel C2 can be delivered to the side channels S1 and S2. This achieves redundancy.

[0109] In addition, at least a portion of the air flowing in the intermediate channel C can be guided by multiple secondary channels C1, and the air guided by multiple secondary channels C1 can cool the second heat sink 350.

[0110] Therefore, the heat dissipation device 300 according to the third embodiment of the present invention can achieve redundant functions from channel C1 and main channel C2, while further obtaining heat dissipation effect through the second heat sink 350.

[0111] Figure 10 This is a rear view of the antenna assembly 40 according to a fourth embodiment of the present invention. For ease of explanation, Figure 10 The air supply section and duct section have been omitted.

[0112] Reference Figure 10 The heat dissipation device 400 may include a plurality of protrusions 460 extending from one side of the plate 410. The plurality of protrusions 460 may be arranged between a plurality of first-side heat sinks 422 and a plurality of second-side heat sinks 424.

[0113] The air blown by at least one fan may collide with multiple protrusions 460 while flowing through the central channel C. In this case, turbulence may occur within the air flowing in the central channel C. This turbulence can promote convection-based cooling. Therefore, the air flowing in the central channel C can cool the plate 410 more effectively.

[0114] Furthermore, the multiple protrusions 460 can receive heat transferred from the plate 410 by heat conduction. Therefore, the heat transferred to the multiple protrusions 460 can be cooled by the air flowing in the intermediate channel C.

[0115] In the following discussion Figure 11 In the fifth embodiment of the present invention shown, the air supply unit includes two types of fans with opposite rotation directions and alternating arrangements, which is different from... Figures 1 to 5 The illustration shows one embodiment of the present invention. Hereinafter, the description will focus on the distinguishing features from the fifth embodiment of the present invention; for structures that are essentially the same as an embodiment of the present invention, repeated descriptions will be omitted.

[0116] Figure 11This is a rear view of the antenna assembly 50 according to a fifth embodiment of the present invention. For ease of explanation, Figure 11 The piping section has been omitted.

[0117] Reference Figure 11 The air supply unit 530 may include a plurality of first fans 5362 that rotate along a first rotation direction and a plurality of second fans 5364 that rotate along the opposite direction of the first rotation direction, i.e., a second rotation direction.

[0118] For example, if the first fan 5362 rotates clockwise, the second fan 5364 can rotate counterclockwise. Conversely, if the first fan 5362 rotates counterclockwise, the second fan 5364 can rotate clockwise.

[0119] The first fan 5362 and the second fan 5364 can be arranged alternately along the first direction. In this case, the degree of air cancellation in the area between two adjacent fans can be minimized.

[0120] For example, the lower region of the first fan 5362, which rotates clockwise, can generate air flowing to the left, and the upper region of the second fan 5364, which rotates counterclockwise, can generate air flowing to the left.

[0121] In other words, the airflow direction can be the same in the region between the first fan 5362 and its adjacent second fan 5364. In this case, the degree of air cancellation generated in the region between the two fans 5362 and 5364 may be reduced compared to the case where two adjacent fans rotate in the same direction.

[0122] Furthermore, as the degree of air offset decreases, the airflow from the area between the two fans 5362 and 5364 increases. Therefore, the forced convection of the multiple fans 536 improves the cooling effect of the first heatsink 520.

[0123] In the following discussion Figure 12 In the sixth embodiment of the present invention shown, the air supply section includes a plurality of fan arrays, which is different from... Figures 1 to 5 The following is an embodiment of the present invention. The description will focus on the distinguishing features from the sixth embodiment of the present invention, and will omit repeated descriptions of structures that are essentially the same as those in an embodiment of the present invention.

[0124] Figure 12 This is a rear view of the antenna assembly 60 according to a sixth embodiment of the present invention. For ease of explanation, Figure 12 The piping section has been omitted.

[0125] Reference Figure 12The air supply unit 630 may include a plurality of third fans 6366 arranged along the first direction and a plurality of fourth fans 6368 arranged along the first direction.

[0126] Multiple third fans 6366 and multiple fourth fans 6368 may be arranged adjacent to each other along the second direction. In other words, the air supply section 630 may include multiple fan rows. In this case, even if a fan fails, the first heat sink 620 corresponding to that fan can still be cooled by other fans adjacent to that fan in the second direction. That is, redundancy can be achieved.

[0127] Furthermore, in order to arrange multiple fans in a limited space, the fans 6366 and 6368 of the air supply unit 630 can have a smaller size. In this case, the number of fans arranged in a fan row can also be increased, thereby further improving redundancy. However, the present invention is not limited to this, and the air supply unit 630 can have medium or large fans.

[0128] The above description is merely illustrative of the technical concept of this embodiment. For those skilled in the art, various modifications and variations can be made without departing from the essential characteristics of this embodiment. Therefore, this embodiment is not intended to limit the technical concept but rather to illustrate it, and the scope of the technical concept is not limited by the embodiments described. The scope of protection of this embodiment should be interpreted based on the following claims, and all technical concepts within the equivalent scope should be interpreted as falling within the scope of the claims of this embodiment.

[0129] Explanation of reference numerals in the attached figures

[0130] 10: Antenna assembly; 12: Circuit board

[0131] 13: Heating element 100: Heat dissipation device

[0132] 110: Plate material; 120: First heat sink

[0133] 130: Air Supply Section; 140: Ductwork Section

[0134] 222: First side heatsink 224: Second side heatsink

[0135] 350: Second heatsink 460: Protrusion

[0136] 5362: First fan; 5364: Second fan

[0137] 6466: Third fan; 6368: Fourth fan

[0138] S: Side passage; C: Middle passage

[0139] C1: Slave Channel C2: Main Channel

[0140] Cross-references to related applications

[0141] This application is based on and claims priority to Korean Patent Application No. 10-2020-0052808, filed on April 29, 2020, the entire contents of which are incorporated herein by reference.

Claims

1. A heat dissipation device, the heat dissipation device being configured for cooling a circuit board including at least one heat-generating element, characterized in that, include: The substrate is arranged to face the circuit board. A plurality of first heat sinks are arranged along a first direction on one side of the plate spaced apart from the circuit board; as well as An air supply unit, arranged to face one side of the plate, includes multiple fans configured to blow air toward one side of the plate. The space between two adjacent first heat sinks is defined as a side channel, which is configured to guide air blown out by at least one of the fans. The air supply section is arranged to face the middle area of ​​the plate in the second direction and is arranged along the first direction. The heat dissipation device further includes: a pipe section arranged to cover at least a portion of the plurality of first heat sinks, the pipe section being configured to open and close at least one side of the side channel. The duct section includes a first duct and a second duct, the second duct being spaced apart from the first duct in the second direction, and the air supply section being arranged between the first duct and the second duct. The pipe section further includes a plurality of pipe pins arranged along a second direction on the first pipe and the second pipe, each pipe pin extending along a first direction on the first pipe and the second pipe, the plurality of pipe pins being exposed to the outside and cooled by natural convection.

2. The heat dissipation device according to claim 1, characterized in that: Each of the plurality of first heat sinks extends on one side of the plate along a second direction perpendicular to the first direction. The side channel is configured to direct the air blown out by the at least one fan to the second direction.

3. The heat dissipation device according to claim 1, characterized in that: The plurality of first heat sinks include a plurality of first-side heat sinks and a plurality of second-side heat sinks. The plurality of first-side heat sinks are arranged along the first direction, and the plurality of second-side heat sinks are arranged along the first direction and spaced apart from the first-side heat sinks in a second direction. The space between two adjacent first-side heat sinks is defined as a first-side channel, which is configured to guide the air blown out by the at least one fan. The space between two adjacent second-side heat sinks is defined as a second-side channel, which is configured to guide the air blown out by the at least one fan.

4. The heat dissipation device according to claim 3, characterized in that: The space between the plurality of first-side heat sinks and the plurality of second-side heat sinks is defined as an intermediate channel, which communicates with the first-side channel and the second-side channel. The intermediate channel is configured to direct the air blown out by the at least one fan to the first direction.

5. The heat dissipation device according to claim 4, characterized in that: The system further includes a plurality of second heat sinks, which are arranged along the second direction between the plurality of first-side heat sinks and the plurality of second-side heat sinks. Each of the plurality of second heat sinks extends along the first direction.

6. The heat dissipation device according to claim 5, characterized in that: The plurality of first-side heat sinks and the plurality of second-side heat sinks have a first height. The plurality of second heat sinks have a second height that is less than the first height.

7. The heat dissipation device according to claim 6, characterized in that: The intermediate channel includes multiple slave channels and a main channel. The multiple slave channels are defined by the space between two adjacent second heat sinks, and the main channel is connected to the multiple slave channels.

8. The heat dissipation device according to claim 3, characterized in that: It further includes a plurality of protrusions that protrude from one side of the plate between the plurality of first-side heat sinks and the plurality of second-side heat sinks.

9. The heat dissipation device according to claim 1, characterized in that: The air supply unit includes a plurality of first fans that rotate along a first rotation direction and a plurality of second fans that rotate along the opposite direction of the first rotation direction, i.e., a second rotation direction. The first fan and the second fan are arranged alternately along the first direction.

10. The heat dissipation device according to claim 1, characterized in that: The air supply unit includes a plurality of third fans arranged along the first direction and a plurality of fourth fans arranged along the first direction. The plurality of third fans and the plurality of fourth fans are arranged adjacent to each other in a second direction perpendicular to the first direction.

11. An antenna assembly, characterized in that, include: The heat dissipation device according to any one of claims 1 to 10; as well as The circuit board including the at least one heating element.

12. The antenna assembly according to claim 11, characterized in that: The heating element includes an RF element.

Images