Substrate cleaning device

Abstract

The substrate cleaning apparatus of the present invention includes a substrate holding section, a first cleaning member, a second cleaning member, and a third cleaning member. The substrate holding section holds a circular substrate in a horizontal position. The first cleaning member, when viewed from above, scans above the substrate by passing through a first point on the outer edge of the substrate, thereby cleaning the upper surface of the substrate. The second cleaning member, when viewed from above, cleans the outer peripheral end of the substrate by contacting a second point on the outer edge of the substrate. An imaginary first straight line passing through the first and second points is defined, and an imaginary second straight line passing through the center of the substrate and parallel to the first straight line is defined. The third cleaning member is disposed below the substrate and in a region opposite to the first and second cleaning members, separated by the second straight line, and cleans the lower surface of the substrate.

Description

Technical Field

[0001] This invention relates to a substrate cleaning apparatus for cleaning substrates. Background Technology

[0002] Substrate processing apparatus is used to perform various processing on various substrates, such as substrates for FPD (Flat Panel Display), semiconductor substrates, optical disc substrates, magnetic disk substrates, magneto-optical disc substrates, photomask substrates, ceramic substrates, or solar cell substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices. Substrate cleaning apparatus is used to clean the substrates.

[0003] For example, the substrate cleaning apparatus described in Japanese Patent No. 5904169 includes: two adsorption pads for holding the peripheral portion of the back side of a wafer; a rotating chuck for holding the central portion of the back side of the wafer; and a brush for cleaning the back side of the wafer. The two adsorption pads hold the wafer and move it laterally. In this state, the brush is used to clean the central portion of the back side of the wafer. Then, the rotating chuck receives the wafer from the adsorption pads, and rotates while holding the central portion of the back side of the wafer. In this state, the brush is used to clean the peripheral portion of the back side of the wafer. Summary of the Invention

[0004] In the substrate cleaning apparatus disclosed in Japanese Patent No. 5904169, when cleaning both the back and front sides of the substrate, the substrate must be transferred to another cleaning apparatus used for cleaning the front side. This reduces throughput and increases the overall footprint of the system used for cleaning the substrate. Therefore, a substrate cleaning apparatus that avoids large size requirements and can efficiently clean substrates is desired.

[0005] The purpose of this invention is to provide a substrate cleaning apparatus that prevents substrates from becoming too large and can efficiently clean substrates.

[0006] (1) A substrate cleaning apparatus according to one aspect of the present invention comprises: a substrate holding portion for holding a circular substrate in a horizontal position; a first cleaning member for scanning above the substrate by passing through a first point on the outer edge of the substrate when viewed from above, thereby cleaning the upper surface of the substrate; a second cleaning member for cleaning the outer peripheral end of the substrate by contacting a second point on the outer edge of the substrate when viewed from above; and a third cleaning member for cleaning the lower surface of the substrate; defining an imaginary first straight line passing through the first point and the second point, and an imaginary second straight line passing through the center of the substrate and parallel to the first straight line; and the third cleaning member being disposed below the substrate and in a region opposite to the first cleaning member and the second cleaning member, separated by the second straight line.

[0007] In this substrate cleaning apparatus, the first, second, and third cleaning units are arranged relatively far apart during substrate cleaning. Therefore, even when the upper surface, outer periphery, and lower surface of the substrate are cleaned simultaneously using the first, second, and third cleaning units respectively, there is virtually no risk of contaminants from one cleaning unit adhering to the others. Thus, there is no need to install multiple devices for cleaning different parts of the substrate separately, nor is it necessary to move the substrate between multiple devices. As a result, substrate cleaning can be performed efficiently without requiring a large-scale substrate cleaning apparatus.

[0008] (2) Alternatively, an imaginary third straight line extending from the center of the substrate toward the geometric center of the third cleaning unit when viewed from above, and a third point on the outer edge of the substrate through which the third straight line passes when viewed from above, can be defined. The first, second, and third cleaning units are arranged such that the center of the substrate is located within a triangular region with the first, second, and third points as vertices. In this case, the first, second, and third cleaning units are significantly spaced apart during substrate cleaning. This prevents contaminants generated from any one cleaning unit from adhering to the other cleaning units.

[0009] (3) Furthermore, an imaginary fourth straight line extending from the center of the substrate toward point 1 when viewed from above, and an imaginary fifth straight line extending from the center of the substrate toward point 2 when viewed from above, can be defined. The first angle between the third and fourth straight lines, the second angle between the fourth and fifth straight lines, and the third angle between the fifth and third straight lines are all 80 degrees or more. In this case, during substrate cleaning, the first, second, and third cleaning units are more significantly separated. This more reliably prevents contaminants generated from any one cleaning unit from adhering to the other cleaning units.

[0010] (4) The first angle, the second angle, and the third angle can also be 90 degrees or more. In this case, when cleaning the substrate, the first cleaning unit, the second cleaning unit, and the third cleaning unit are further separated by a large margin. As a result, it is possible to reliably prevent contaminants generated from any one cleaning unit from adhering to the other cleaning units.

[0011] (5) The first angle can also be greater than the second angle. In this case, when cleaning the substrate, the first cleaning element and the third cleaning element are relatively far apart, so even if the third cleaning element is relatively large, the contaminants generated from one of the first cleaning element and the third cleaning element will not adhere to the other. Therefore, the lower surface of the substrate can be cleaned efficiently using the third cleaning element.

[0012] (6) The third angle can also be larger than the second angle. In this case, when cleaning the substrate, the second and third cleaning elements are relatively far apart, so even if the third cleaning element is relatively large, contaminants generated from either the second or third cleaning element will not adhere to the other. Therefore, the lower surface of the substrate can be cleaned efficiently using the third cleaning element.

[0013] (7) The first cleaning unit can also clean the upper surface of the substrate by scanning from the center of the substrate toward the first point when viewed from above. In this case, the contaminants generated from the first cleaning unit hardly adhere to the second or third cleaning unit. Similarly, the contaminants generated from the second or third cleaning unit hardly adhere to the first cleaning unit. Therefore, the upper surface of the substrate can be cleaned efficiently using the first cleaning unit with a simple configuration.

[0014] (8) Alternatively, both the substrate holding portion and the third cleaning component may have a circular shape, with the diameter of the third cleaning component being larger than the diameter of the substrate holding portion. In this case, the lower surface of the substrate can be cleaned efficiently using the relatively large third cleaning component.

[0015] (9) Alternatively, the third cleaning element may have a circular shape, and the diameter of the third cleaning element may be greater than 1 / 3 of the substrate diameter. In this case, the lower surface of the substrate can be cleaned efficiently using the relatively large third cleaning element. Attached Figure Description

[0016] Figure 1 This is a schematic top view of a substrate cleaning apparatus according to an embodiment of the present invention.

[0017] Figure 2 It means Figure 1 A three-dimensional view of the internal structure of the substrate cleaning device.

[0018] Figure 3 It means Figure 1 A block diagram illustrating the configuration of the control system for the substrate cleaning apparatus.

[0019] Figure 4 This is a top view showing the positional relationship of the cleaning components.

[0020] Figure 5 This is a top view showing the preferred positional relationship of the cleaning components.

[0021] Figure 6 It is a top view showing the preferred positional relationship of the cleaning components.

[0022] Figure 7 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0023] Figure 8 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0024] Figure 9 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0025] Figure 10 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0026] Figure 11 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0027] Figure 12 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0028] Figure 13 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0029] Figure 14 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0030] Figure 15 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0031] Figure 16 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0032] Figure 17 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0033] Figure 18 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device. Detailed Implementation

[0034] Hereinafter, the substrate cleaning apparatus according to an embodiment of the present invention will be described using the accompanying drawings. In the following description, "substrate" refers to a semiconductor substrate, a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disc, a substrate for a magnetic disk, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, etc. Furthermore, the substrate used in this embodiment has at least a circular outer periphery. For example, the outer periphery, excluding the positioning groove, is circular.

[0035] (1) Composition of substrate processing device

[0036] Figure 1 This is a schematic top view of a substrate cleaning apparatus according to an embodiment of the present invention. Figure 2 It means Figure 1 A perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1 of this embodiment, the X, Y, and Z directions, which are orthogonal to each other, are defined to clarify the positional relationships. Figure 1 and Figure 2 In subsequent specific diagrams, the X, Y, and Z directions will be indicated by arrows as appropriate. The X and Y directions are orthogonal to each other in the horizontal plane, and the Z direction is equivalent to the vertical direction.

[0037] like Figure 1 As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a base device 30, a transfer device 40, a lower surface cleaning device 50, a protective cover device 60, an upper surface cleaning device 70, an end cleaning device 80, and an opening and closing device 90. These components are housed within the unit housing 2. Figure 2 In the diagram, the unit housing 2 is represented by a dashed line.

[0038] The unit housing 2 has a rectangular bottom portion 2a and four sidewall portions 2b, 2c, 2d, and 2e extending upwards from the four sides of the bottom portion 2a. Sidewall portions 2b and 2c face each other, and sidewall portions 2d and 2e face each other. A rectangular opening is formed in the center of sidewall portion 2b. This opening serves as a loading / unloading outlet 2x for the substrate W, used when loading the substrate W into and unloading it from the unit housing 2. Figure 2 In the diagram, the loading / unloading outlet 2x is represented by a thick dashed line. In the following description, the direction in the Y direction from inside the unit housing 2 through the loading / unloading outlet 2x toward the outside of the unit housing 2 (from side wall 2c toward side wall 2b) is called the front, and its opposite direction (from side wall 2b toward side wall 2c) is called the rear.

[0039] An opening and closing device 90 is provided in the forming portion of the inlet / outlet 2x in the side wall portion 2b and in the surrounding area. The opening and closing device 90 includes a baffle 91 configured to open and close the inlet / outlet 2x, and a baffle drive unit 92 for driving the baffle 91. Figure 2 In the diagram, baffle 91 is indicated by a thick double-dotted line. The baffle drive unit 92 drives baffle 91 to open the inlet / outlet 2x when the substrate W is being moved into and out of the substrate cleaning apparatus 1. Conversely, the baffle drive unit 92 drives baffle 91 to close the inlet / outlet 2x when cleaning the substrate W in the substrate cleaning apparatus 1.

[0040] A base device 30 is disposed at the center of the bottom surface 2a. The base device 30 includes a linear guide rail 31, a movable base 32, and a base drive unit 33. The linear guide rail 31 includes two tracks and is arranged such that it extends from near the side wall 2b to near the side wall 2c in the Y direction when viewed from above. The movable base 32 is arranged such that it can move in the Y direction on the two tracks of the linear guide rail 31. The base drive unit 33 includes, for example, a pulse motor, and moves the movable base 32 in the Y direction on the linear guide rail 31.

[0041] On the movable base 32, the lower holding device 20 and the lower surface cleaning device 50 are arranged side by side in the Y direction. The lower holding device 20 includes an adsorption holding part 21 and an adsorption holding drive part 22. The adsorption holding part 21 is a so-called rotating chuck, which has a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to rotate about an axis extending in the vertical direction (the axis in the Z direction). In the following description, the area on the lower surface of the substrate W that should be adsorbed by the adsorption surface of the adsorption holding part 21 when the substrate W is adsorbed and held by the adsorption holding part 21 is referred to as the central region of the lower surface. On the other hand, the area on the lower surface of the substrate W that surrounds the central region of the lower surface is referred to as the outer region of the lower surface.

[0042] The adsorption-holding drive unit 22 includes a motor. The motor of the adsorption-holding drive unit 22 is mounted on a movable base 32 with its rotation axis projecting upwards. The adsorption-holding unit 21 is mounted on the upper end of the rotation axis of the adsorption-holding drive unit 22. Furthermore, an attraction path for adsorbing and holding the substrate W in the adsorption-holding unit 21 is formed on the rotation axis of the adsorption-holding drive unit 22. This attraction path is connected to a suction device (not shown). The adsorption-holding drive unit 22 rotates the adsorption-holding unit 21 about the rotation axis.

[0043] On the movable base 32, near the lower holding device 20, a connecting device 40 is further provided. The connecting device 40 includes multiple (three in this example) support pins 41, pin connecting members 42, and pin lifting drive 43. The pin connecting members 42 are formed to surround the adsorption holding part 21 when viewed from above, and connect the multiple support pins 41. The multiple support pins 41 extend upward from the pin connecting members 42 by a fixed length while being connected to each other by the pin connecting members 42. The pin lifting drive 43 causes the pin connecting members 42 to rise and fall on the movable base 32. As a result, the multiple support pins 41 rise and fall relative to the adsorption holding part 21.

[0044] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection section 53, a lifting support section 54, a movable support section 55, a lower surface brush rotation drive section 55a, a lower surface brush lifting drive section 55b, and a lower surface brush movable drive section 55c. The movable support section 55 is configured to move relative to the lower holding device 20 in the Y direction within a fixed area on the movable base 32. Figure 2 As shown, a lifting support 54 is provided on the movable support 55 in a way that allows it to be raised and lowered. The lifting support 54 has an upper surface 54u that is inclined downward in a direction away from the adsorption and holding part 21 (rearward in this example).

[0045] like Figure 1 As shown, the lower surface brush 51 has a circular shape when viewed from above, and is formed relatively large in this embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the adsorption surface of the adsorption holding portion 21, for example, 1.3 times the diameter of the adsorption surface of the adsorption holding portion 21. In addition, the diameter of the lower surface brush 51 is greater than 1 / 3 and less than 1 / 2 of the diameter of the substrate W. Furthermore, the diameter of the substrate W is, for example, 300 mm.

[0046] The lower surface brush 51 has a cleaning surface that can contact the lower surface of the substrate W. In addition, the lower surface brush 51 is mounted on the upper surface 54u of the lifting support 54 with the cleaning surface facing upward and the cleaning surface being rotatable about an axis extending in the vertical direction through the center of the cleaning surface.

[0047] Two liquid nozzles 52 are mounted on the upper surface 54u of the lifting support 54, respectively, near the lower surface brush 51 with the liquid outlets facing upwards. The liquid nozzles 52 are connected to the lower surface cleaning fluid supply unit 56. Figure 3 The lower surface cleaning fluid supply unit 56 supplies cleaning fluid to the liquid nozzle 52. When the substrate W is cleaned using the lower surface brush 51, the liquid nozzle 52 sprays the cleaning fluid supplied from the lower surface cleaning fluid supply unit 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning fluid supplied to the liquid nozzle 52.

[0048] The gas ejection section 53 is a slit-shaped gas nozzle with a gas outlet extending in one direction. The gas ejection section 53 is mounted on the upper surface 54u of the lifting support section 54, positioned between the lower surface brush 51 and the adsorption holding section 21 when viewed from above, with the gas outlet facing upwards. The gas ejection section 53 is connected to the ejected gas supply section 57. Figure 3 The ejected gas supply unit 57 supplies gas to the gas ejection unit 53. In this embodiment, an inert gas such as nitrogen is used as the gas supplied to the gas ejection unit 53. The gas ejection unit 53 ejects the gas supplied from the ejected gas supply unit 57 onto the lower surface of the substrate W when cleaning the substrate W with the lower surface brush 51 and when drying the lower surface of the substrate W. In this case, a strip-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding unit 21.

[0049] The lower surface brush rotation drive unit 55a includes a motor and rotates the lower surface brush 51 when cleaning the substrate W using the lower surface brush 51. The lower surface brush lifting drive unit 55b includes a stepper motor or cylinder and raises and lowers the lifting support unit 54 relative to the movable support unit 55. The lower surface brush moving drive unit 55c includes a motor and moves the movable support unit 55 along the Y direction on the movable base 32. Here, the position of the lower holding device 20 in the movable base 32 is fixed. Therefore, when the lower surface brush moving drive unit 55c moves the movable support unit 55 along the Y direction, the movable support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 on the movable base 32 that is closest to the lower holding device 20 is referred to as the approach position, and the position of the lower surface cleaning device 50 on the movable base 32 that is furthest from the lower holding device 20 is referred to as the spaced position.

[0050] A protective cover device 60 is further provided at the center of the bottom surface 2a. The protective cover device 60 includes a protective cover 61 and a protective cover drive unit 62. The protective cover 61 is arranged to surround the lower holding device 20 and the base device 30 when viewed from above, and is capable of being raised and lowered. Figure 2 In the diagram, the shield 61 is indicated by a dashed line. The shield drive unit 62 moves the shield 61 between a lower shield position and an upper shield position based on which portion of the lower surface of the substrate W is cleaned by the lower surface brush 51. The lower shield position is when the upper end of the shield 61 is at a height lower than the substrate W held by the adsorption and holding unit 21. Conversely, the upper shield position is when the upper end of the shield 61 is at a height higher than the adsorption and holding unit 21.

[0051] At a height above the protective cover 61, a pair of upper retaining devices 10A and 10B are arranged facing each other across the base device 30 when viewed from above. The upper retaining device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive unit 13A, and an upper chuck drive unit 14A. The upper retaining device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive unit 13B, and an upper chuck drive unit 14B.

[0052] The lower chucks 11A and 11B are symmetrically arranged about a vertical plane extending in the Y direction (front-back direction) through the center of the adsorption holding part 21 when viewed from above, and are configured to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support plates capable of supporting the lower periphery of the substrate W from below. The lower chuck driving parts 13A and 13B move the lower chucks 11A and 11B by either bringing them closer together or moving them further apart.

[0053] Like the lower chucks 11A and 11B, the upper chucks 12A and 12B are symmetrically arranged about a vertical plane extending in the Y direction (front-back direction) through the center of the adsorption holding portion 21 when viewed from above, and are arranged in a manner that allows them to move in the X direction within a common horizontal plane. The upper chucks 12A and 12B each have two holding tabs configured to hold the outer peripheral end of the substrate W by abutting against two portions of the outer peripheral end of the substrate W. The upper chuck driving portions 14A and 14B move the upper chucks 12A and 12B by either bringing them closer together or moving them further apart.

[0054] like Figure 1 As shown, an upper surface cleaning device 70 is provided on one side of the protective cover 61, near the upper holding device 10B when viewed from above. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0055] The rotating support shaft 71 extends vertically on the bottom part 2a and is supported by the upper surface cleaning drive part 74, allowing it to be raised, lowered, and rotated. Figure 2 As shown, arm 72 is positioned above the upper holding device 10B, extending horizontally from the upper end of the rotary support shaft 71. A spray nozzle 73 is mounted at the front end of arm 72.

[0056] The spray nozzle 73 is connected to the upper surface cleaning fluid supply unit 75. Figure 3The upper surface cleaning fluid supply unit 75 supplies cleaning fluid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning fluid supplied to the spray nozzle 73, and an inert gas such as nitrogen is used as the gas supplied to the spray nozzle 73. When the spray nozzle 73 cleans the upper surface of the substrate W, it mixes the cleaning fluid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0057] The upper surface cleaning drive unit 74 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 71 while simultaneously rotating it. According to this configuration, by moving the spray nozzle 73 in an arc shape on the upper surface of the substrate W, which is held and rotated by the adsorption and holding unit 21, the entire upper surface of the substrate W can be cleaned.

[0058] like Figure 1 As shown, on the other side of the protective cover 61, an end cleaning device 80 is provided in such a way that it is located near the upper holding device 10A when viewed from above. The end cleaning device 80 includes a rotating support shaft 81, an arm 82, an inclined brush 83, and an inclined brush drive unit 84.

[0059] The rotating support shaft 81 is located on the bottom surface 2a and is supported by the inclined brush drive unit 84 in a vertically extending manner, and is capable of both lifting and rotation. Figure 2 As shown, arm 82 is positioned above the upper holding device 10A, extending horizontally from the upper end of the rotary support shaft 81. At the front end of arm 82, a beveled brush 83 is provided, protruding downwards and rotatable about an axis in the vertical direction.

[0060] The upper half of the beveled brush 83 has an inverted frustum shape, and the lower half has a frustum shape. According to this beveled brush 83, the outer peripheral end of the substrate W can be cleaned in the central portion of the outer peripheral surface in the vertical direction.

[0061] The inclined brush drive unit 84 includes one or more pulse motors and cylinders, which simultaneously raise and lower the rotating support shaft 81 and rotate it. According to this configuration, by bringing the central portion of the outer peripheral surface of the inclined brush 83 into contact with the outer peripheral end of the substrate W, which is held and rotated by the adsorption and holding unit 21, the entire outer peripheral end of the substrate W can be cleaned.

[0062] Here, the bevel brush drive unit 84 further includes a motor built into the arm 82. This motor causes the bevel brush 83, which is located at the front end of the arm 82, to rotate about an axis in the vertical direction. Therefore, when cleaning the outer peripheral end of the substrate W, the cleaning force of the bevel brush 83 at the outer peripheral end of the substrate W is increased by the rotation of the bevel brush 83.

[0063] Figure 3 It means Figure 1 A block diagram of the control system of the substrate cleaning apparatus 1. Figure 3 The control unit 9 includes a CPU (Central Processing Unit), RAM (random access memory), ROM (read-only memory), and a storage device. RAM serves as the CPU's operating area. ROM stores the system program. The storage device stores the control program. The CPU controls the operation of each part of the substrate cleaning apparatus 1 by executing the substrate cleaning program stored in the storage device on the RAM.

[0064] like Figure 3 As shown, the control unit 9 mainly receives the substrate W that is brought into the substrate cleaning apparatus 1 and holds it above the adsorption holding unit 21, and controls the lower chuck drive units 13A and 13B and the upper chuck drive units 14A and 14B. In addition, the control unit 9 mainly controls the adsorption holding drive unit 22 to adsorb and hold the substrate W using the adsorption holding unit 21 and to rotate the adsorbed and held substrate W.

[0065] In addition, the control unit 9 mainly controls the base drive unit 33 to move the movable base 32 relative to the substrate W held by the upper holding devices 10A and 10B. In addition, the control unit 9 controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the adsorption holding unit 21.

[0066] In addition, the control unit 9 controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 57 in order to clean the lower surface of the substrate W. Furthermore, the control unit 9 controls the shield drive unit 62 to catch the cleaning liquid splashing from the substrate W when cleaning the substrate W held by the adsorption and holding unit 21.

[0067] Furthermore, the control unit 9 controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by the adsorption and holding unit 21. Additionally, the control unit 9 controls the inclined brush drive unit 84 to clean the outer peripheral end of the substrate W held by the adsorption and holding unit 21. Furthermore, the control unit 9 controls the baffle drive unit 92 to open and close the loading / unloading outlet 2x of the unit housing 2 when the substrate W is loaded into and unloaded in the substrate cleaning apparatus 1.

[0068] (2) Positional relationship of the cleaning items

[0069] In this embodiment, within the same unit housing 2, the upper surface of the substrate W is cleaned using a spray nozzle 73, the outer peripheral end of the substrate W is cleaned using a bevel brush 83, and the outer region of the lower surface of the substrate W is cleaned using a lower surface brush 51. In the following description, the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 are each referred to as a cleaning component.

[0070] Depending on the configuration of multiple cleaning units, contaminants generated from one cleaning unit may sometimes adhere to the others. In this case, the cleaning efficiency of substrate W is reduced because the contaminants adhere from the cleaning units to the substrate W. Therefore, the cleaning units are configured in a way that minimizes their interference with each other.

[0071] Figure 4 This is a top view showing the positional relationship of the parts being cleaned. For example... Figure 4 As shown by the dashed line, the spray nozzle 73, when cleaning the upper surface of the substrate W, utilizes... Figure 1 The upper surface cleaning drive 74 moves upward toward the center P0 of the substrate W. Then, as... Figure 4 As indicated by the thick arrow, the nozzle 73 sprays the mixed fluid while scanning along a circular path on the outer side of the substrate W. The point on the outer edge of the substrate W that connects to the outer edge of the nozzle 73 when viewed from above is called P1.

[0072] When cleaning the outer peripheral end of the substrate W, the angled brush 83 utilizes... Figure 1 The inclined brush drive section 84 contacts the outer peripheral end of the substrate W. The point on the outer edge of the substrate W that contacts the inclined brush 83 when viewed from above is called P2. Here, an imaginary straight line passing through points P1 and P2 is designated as L1. Furthermore, an imaginary straight line passing through the center P0 of the substrate W and parallel to line L1 is designated as L2.

[0073] When the lower surface brush 51 cleans the outer region of the lower surface of the substrate W, it utilizes... Figure 1 The base drive portion 33 is disposed below the substrate W and in the area opposite to the spray nozzle 73 and the beveled brush 83, separated by a straight line L2. Furthermore, as... Figure 4 As shown, in this embodiment, the lower surface brush 51 is configured such that a portion of it protrudes from the substrate W outwards, but the embodiment is not limited to this. The lower surface brush 51 may also be configured such that its outer edge overlaps with the outer edge of the substrate W.

[0074] according to Figure 4 The cleaning components are configured such that the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 are relatively far apart when cleaning the substrate W. Therefore, even if the upper surface, outer peripheral end, and lower surface of the substrate W are cleaned simultaneously using the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 respectively, there is almost no situation where contaminants generated from any one cleaning component adhere to the other cleaning components.

[0075] Figure 5 This is a top view showing the preferred positional relationship of the cleaning components. For example... Figure 5 As shown, an imaginary straight line (semi-straight line) extending from the center P0 of the substrate W toward the geometric center of the lower surface brush 51 when viewed from above is designated as L3. Furthermore, the point on the outer edge of the substrate W through which the straight line L3 passes when viewed from above is designated as P3. In this case, a triangular region R is formed with points P1, P2, and P3 as vertices.

[0076] The spray nozzle 73, the beveled brush 83, and the lower surface brush 51 are preferably arranged such that the center P0 of the substrate W is located within the region R. In this case, during cleaning by the substrate cleaning apparatus 1, the spray nozzle 73, the beveled brush 83, and the lower surface brush 51 are significantly spaced apart. Therefore, it is possible to prevent contaminants generated from any one cleaning element from adhering to the other cleaning elements.

[0077] Figure 6 This is a top view showing the preferred positional relationship of the cleaning components. For example... Figure 6 As shown, an imaginary straight line (half a straight line) extending from the center of substrate W towards point P1 when viewed from above is designated as L4, and an imaginary straight line (half a straight line) extending from the center of substrate W towards point P2 is designated as L5. Furthermore, the angle between line L3 and line L4 is designated as θ1, the angle between line L4 and line L5 is designated as θ2, and the angle between line L5 and line L3 is designated as θ3. Moreover, the sum of angles θ1, θ2, and θ3 is 360 degrees.

[0078] The angles θ1, θ2, and θ3 are preferably 80 degrees or more. In this case, when cleaning the substrate W, the spray nozzle 73, the inclined brush 83, and the lower surface brush 51 are more significantly spaced apart. This more effectively prevents contaminants generated from any one cleaning component from adhering to the other cleaning components.

[0079] Furthermore, angles θ1, θ2, and θ3 are more preferably 90 degrees or more. In this case, the spray nozzle 73, the bevel brush 83, and the lower surface brush 51 are further significantly separated. This effectively prevents contaminants generated from any one cleaning component from adhering to the other cleaning components.

[0080] Preferably, angle θ1 is greater than angle θ2. In this case, since the spray nozzle 73 and the lower surface brush 51 are relatively far apart, even if the lower surface brush 51 is relatively large, contaminants generated from either the spray nozzle 73 or the lower surface brush 51 will not adhere to the other. Therefore, the lower surface of the substrate W can be cleaned efficiently using the relatively large lower surface brush 51.

[0081] Preferably, angle θ3 is greater than angle θ2. In this case, since the inclined brush 83 and the lower surface brush 51 are relatively far apart, even if the lower surface brush 51 is relatively large, contaminants generated by one of the inclined brush 83 and the lower surface brush 51 will not adhere to the other. Therefore, the lower surface of the substrate W can be cleaned efficiently using the relatively large lower surface brush 51.

[0082] (3) General Operation of Substrate Cleaning Equipment

[0083] Figures 7-18 It is used to explain Figure 1 A schematic diagram illustrating the general operation of the substrate cleaning apparatus 1. Figures 7-18 In the figures, the upper section shows a top view of the substrate cleaning apparatus 1. The middle section shows a side view of the lower holding device 20 and its surrounding portion viewed along the Y direction, and the lower section shows a side view of the lower holding device 20 and its surrounding portion viewed along the X direction. The side view of the middle section is similar to... Figure 1 The side view of line AA corresponds to the side view of the lower segment. Figure 1 The BB line side view corresponds to this. Furthermore, to facilitate understanding of the shape and operational status of each component in the substrate cleaning apparatus 1, the scaling factor of some components differs between the top view of the upper section and the side views of the middle and lower sections. Additionally, in Figures 7-18 In the diagram, the shield 61 is represented by a double-dotted line, and the shape of the substrate W is represented by a thick single-dotted line.

[0084] In the initial state before the substrate W is moved into the substrate cleaning apparatus 1, the baffle 91 of the opening and closing device 90 closes the loading / unloading outlet 2x. Additionally, as... Figure 1 As shown, the lower chucks 11A and 11B are maintained with a distance between them that is sufficiently larger than the diameter of the substrate W. Similarly, the upper chucks 12A and 12B are also maintained with a distance between them that is sufficiently larger than the diameter of the substrate W. Furthermore, the movable base 32 of the base device 30 is configured such that, when viewed from above, the center of the adsorption holding portion 21 is located at the center of the protective cover 61. The lower surface cleaning device 50 is positioned close to the movable base 32. In the lifting support portion 54 of the lower surface cleaning device 50, the cleaning surface (upper end) of the lower surface brush 51 is positioned below the adsorption holding portion 21.

[0085] Furthermore, in the transfer device 40, the plurality of support pins 41 are positioned below the adsorption holding part 21. Furthermore, in the protective cover device 60, the protective cover 61 is in the lower protective cover position. In the following description, the center position of the protective cover 61 when viewed from above is referred to as the planar reference position rp. Additionally, the position of the movable base 32 on the bottom surface 2a when the center of the adsorption holding part 21 is at the planar reference position rp when viewed from above is referred to as the first horizontal position.

[0086] The substrate W is moved into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is about to be moved in, the baffle 91 opens the inlet / outlet 2x. Then, as... Figure 7 As indicated by the thick solid arrow a1, the robotic arm (substrate holding section) RH of the substrate transfer robot (not shown) moves the substrate W into the approximate center position inside the cell housing 2 via the inlet / outlet 2x. At this time, the substrate W held by the robotic arm RH is as follows: Figure 7 As shown, it is located between the lower chuck 11A and the upper chuck 12A and between the lower chuck 11B and the upper chuck 12B.

[0087] Next, as Figure 8 As indicated by the thick solid arrow a2, the lower chucks 11A and 11B are positioned below the lower peripheral surface of the substrate W, with the lower chucks 11A and 11B close to each other. In this state, the robot arm RH descends and exits from the loading / unloading outlet 2x. Thus, multiple portions of the lower peripheral surface of the substrate W held by the robot arm RH are supported by the multiple support pieces of the lower chucks 11A and 11B. After the robot arm RH exits, the baffle 91 closes the loading / unloading outlet 2x.

[0088] Next, as Figure 9 As indicated by the thick solid arrow a3, the upper clamps 12A and 12B are brought close together by their multiple retaining tabs abutting against the outer peripheral end of the substrate W. By having the multiple retaining tabs of the upper clamps 12A and 12B abut against multiple portions of the outer peripheral end of the substrate W, the substrate W, supported by the lower clamps 11A and 11B, is further held by the upper clamps 12A and 12B. Additionally, as... Figure 9 As indicated by the thick solid arrow a4, the movable base 32 moves forward from the first horizontal position such that the adsorption and holding part 21 is offset by a specific distance from the planar reference position rp and the center of the lower surface brush 51 is located at the planar reference position rp. At this time, the position of the movable base 32 located on the bottom part 2a is referred to as the second horizontal position.

[0089] Next, as Figure 10 As indicated by the thick solid arrow a5, the lifting support 54 rises when the cleaning surface of the lower surface brush 51 contacts the central region of the lower surface of the substrate W. Additionally, as... Figure 10 As indicated by the thick solid arrow a6, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. This allows the lower surface brush 51 to physically remove contaminants adhering to the central region of the lower surface of the substrate W.

[0090] exist Figure 10The following section shows an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W. As shown in the dialog box, with the lower surface brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection section 53 are held close to the lower surface of the substrate W. At this time, the liquid nozzle 52, as indicated by the hollow arrow a51, sprays cleaning fluid toward the lower surface of the substrate W near the lower surface brush 51. Thus, the cleaning fluid supplied from the liquid nozzle 52 to the lower surface of the substrate W is guided to the contact portion between the lower surface brush 51 and the substrate W, thereby rinsing away contaminants removed from the back side of the substrate W by the lower surface brush 51. In this way, in the lower surface cleaning apparatus 50, the liquid nozzle 52 and the lower surface brush 51 are mounted together on the lifting support section 54. This allows for efficient supply of cleaning fluid to the portion where the lower surface of the substrate W is cleaned using the lower surface brush 51. Therefore, the consumption of cleaning fluid is reduced and excessive dispersion of the cleaning fluid is suppressed.

[0091] Here, the upper surface 54u of the lifting support 54 is inclined downwards in a direction away from the adsorption and holding part 21. At this time, when the cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lifting support 54, the cleaning liquid caught by the upper surface 54u is guided away from the adsorption and holding part 21.

[0092] Additionally, when cleaning the lower surface of the substrate W using the lower surface brush 51, the gas ejection section 53, as shown... Figure 10 As indicated by the hollow arrow a52 in the dialog box, gas is sprayed toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding portion 21. In this embodiment, the gas ejection portion 53 is mounted on the lifting support portion 54 with the gas ejection port extending in the X direction. In this case, when gas is sprayed from the gas ejection portion 53 toward the lower surface of the substrate W, a strip-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding portion 21. As a result, when cleaning the lower surface of the substrate W with the lower surface brush 51, cleaning liquid containing contaminants can be prevented from scattering toward the adsorption holding portion 21. Therefore, when cleaning the lower surface of the substrate W with the lower surface brush 51, cleaning liquid containing contaminants can be prevented from adhering to the adsorption holding portion 21, thereby keeping the adsorption surface of the adsorption holding portion 21 clean.

[0093] In addition, Figure 10 In the example, as shown by the hollow arrow a52, gas is ejected from the gas ejection section 53 towards the lower surface brush 51 at an angle upwards, but the present invention is not limited to this. The gas ejection section 53 may also eject gas in a manner that is directed towards the lower surface of the substrate W along the Z direction.

[0094] Next, in Figure 10Once the cleaning of the central region of the lower surface of the substrate W is complete, the rotation of the lower surface brush 51 stops, and the lifting support 54 descends at a specific distance between the cleaning surface of the lower surface brush 51 and the substrate W. Additionally, the spraying of cleaning fluid from the liquid nozzle 52 onto the substrate W stops. At this time, gas continues to be sprayed onto the substrate W from the gas ejection section 53.

[0095] Then, as Figure 11 As indicated by the thick solid arrow a7, the movable base 32 moves rearward with the adsorption holding part 21 positioned at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, by continuing to spray gas from the gas ejection part 53 onto the substrate W, the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

[0096] Next, as Figure 12 As indicated by the thick solid arrow a8, the cleaning surface of the brush 51 below the lifting support 54 is lowered in a manner that is below the adsorption surface (upper end) of the adsorption holding part 21. Additionally, as... Figure 12 As indicated by the thick solid arrow a9, the upper chucks 12A and 12B are separated from the outer periphery of the substrate W by multiple retaining tabs, thus keeping the upper chucks 12A and 12B far apart from each other. At this time, the substrate W is supported by the lower chucks 11A and 11B.

[0097] Then, as Figure 12 As indicated by the thick solid arrow a10, the pin connecting member 42 rises such that the upper ends of the plurality of support pins 41 are located slightly above the lower clamps 11A and 11B. Thus, the substrate W, supported by the lower clamps 11A and 11B, is received by the plurality of support pins 41.

[0098] Next, as Figure 13 As indicated by the thick solid arrow a11, the lower clamps 11A and 11B are moved away from each other. At this time, the lower clamps 11A and 11B have moved to a position where they do not overlap with the substrate W supported by the multiple support pins 41 when viewed from above. As a result, the upper holding devices 10A and 10B return to their initial state.

[0099] Next, as Figure 14 As indicated by the thick solid arrow a12, the pin-connecting member 42 descends with the upper ends of the plurality of support pins 41 positioned below the adsorption-holding portion 21. Consequently, the substrate W, supported on the plurality of support pins 41, is received by the adsorption-holding portion 21. In this state, the adsorption-holding portion 21 adsorbs and holds the central region of the lower surface of the substrate W. Simultaneously with or after the descent of the pin-connecting member 42, as... Figure 14 As indicated by the thick solid arrow a13, the protective cover 61 rises from the lower protective cover position to the upper protective cover position.

[0100] Next, as Figure 15 As indicated by the thick solid arrow a14, the adsorption and holding portion 21 rotates around an axis in the vertical direction (the axis of rotation of the adsorption and holding drive portion 22). As a result, the substrate W adsorbed and held by the adsorption and holding portion 21 rotates in a horizontal position.

[0101] Next, the rotating support shaft 71 of the upper surface cleaning device 70 rotates and descends. Thus, as... Figure 15 As indicated by the thick solid arrow a15, the spray nozzle 73 moves to a position above the center of the substrate W and descends at a predetermined distance between the nozzle 73 and the substrate W. In this state, the spray nozzle 73 sprays a mixture of cleaning liquid and gas onto the upper surface of the substrate W. Additionally, the rotation support shaft 71 rotates. Thus, as... Figure 15 As indicated by the thick solid arrow a16, the spray nozzle 73 extends outward from the center of the rotating substrate W. Figure 4 The point P1) moves. The entire upper surface of the substrate W is cleaned by spraying the mixed fluid onto the entire upper surface of the substrate W.

[0102] Furthermore, when cleaning the upper surface of the substrate W using the spray nozzle 73, the rotation support shaft 81 of the end cleaning device 80 also rotates and descends. Thus, as... Figure 15 As indicated by the thick solid arrow a17, the beveled brush 83 is moved to a position above the outer peripheral end of the substrate W. Furthermore, the central portion of the outer peripheral surface of the beveled brush 83 contacts the outer peripheral end of the substrate W. Figure 4 The substrate W descends in a manner resembling point P2. In this state, the inclined brush 83 rotates (spins) about an axis in the vertical direction. This physically removes contaminants adhering to the outer peripheral end of the substrate W using the inclined brush 83. The contaminants removed from the outer peripheral end of the substrate W are then washed away by a cleaning solution of mixed fluid sprayed from the nozzle 73 onto the substrate W.

[0103] Furthermore, when cleaning the upper surface of the substrate W using the spray nozzle 73, the lifting support 54 rises such that the cleaning surface of the lower surface brush 51 contacts the outer region of the lower surface of the substrate W. At this time, the lower surface brush 51 is positioned such that, when viewed from above, it is separated by... Figure 4 The straight line L2 is in the area opposite to the spray nozzle 73 and the beveled brush 83. Additionally, as... Figure 15 As indicated by the thick solid arrow a18, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. Furthermore, the liquid nozzle 52 sprays cleaning liquid toward the lower surface of the substrate W, and the gas ejection section 53 sprays gas toward the lower surface of the substrate W. Thus, the entire outer region of the lower surface of the substrate W, which is held and rotated by the adsorption and holding section 21, can be cleaned using the lower surface brush 51.

[0104] The rotation direction of the lower surface brush 51 can also be opposite to the rotation direction of the adsorption and holding portion 21. In this case, the outer region of the lower surface of the substrate W can be cleaned efficiently. In this embodiment, when viewed from above, the rotation direction of the adsorption and holding portion 21 is clockwise, and the rotation direction of the lower surface brush 51 is counterclockwise. Furthermore, when the lower surface brush 51 is not relatively large, such as... Figure 15 As indicated by the thick solid arrow a19, the movable support 55 can also move forward and backward on the movable base 32 between an approaching position and a spaced-out position. In this case, the entire outer region of the lower surface of the substrate W, which is held and rotated by the adsorption holding part 21, can also be cleaned using the lower surface brush 51.

[0105] Next, after cleaning the upper surface, outer peripheral end, and outer region of the lower surface of substrate W, the spraying of the mixing fluid from nozzle 73 onto substrate W is stopped. Additionally, as... Figure 16 As indicated by the thick solid arrow a20, the spray nozzle 73 has moved to a position to one side of the shield 61 (its initial position). Additionally, as... Figure 16 As indicated by the thick solid arrow a21, the angled brush 83 moves to the other side of the shield 61 (the initial position). Then, the lower surface brush 51 stops rotating, and the lifting support 54 descends such that the cleaning surface of the lower surface brush 51 is a specific distance from the substrate W. Furthermore, the spraying of cleaning fluid from the liquid nozzle 52 onto the substrate W stops, as does the spraying of gas from the gas ejection section 53 onto the substrate W. In this state, the adsorption holding section 21 rotates at high speed to shake off the cleaning fluid adhering to the substrate W, allowing the substrate W to dry completely.

[0106] Next, as Figure 17 As indicated by the thick solid arrow a22, the shield 61 descends from the upper shield position to the lower shield position. Additionally, preparations are underway to move the new substrate W into the cell housing 2, as follows... Figure 17 As indicated by the thick solid arrow a23, the lower clamps 11A and 11B approach each other to a position that can support the new substrate W.

[0107] Finally, the substrate W is removed from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is about to be removed, the baffle 91 opens the inlet / outlet 2x. Then, as... Figure 18 As indicated by the thick solid arrow a24, the robotic arm (substrate holding section) RH of the substrate transfer robot (not shown) enters the unit housing 2 through the inlet / outlet 2x. Then, the robotic arm RH receives the substrate W from the adsorption holding section 21 and exits through the inlet / outlet 2x. After the robotic arm RH exits, the baffle 91 closes the inlet / outlet 2x.

[0108] (4) Effect

[0109] In the substrate cleaning apparatus 1 of this embodiment, the spray nozzle 73, the inclined brush 83, and the lower surface brush 51 are arranged relatively far apart when cleaning the substrate W. Therefore, even if the upper surface, outer peripheral end, and lower surface of the substrate W are cleaned simultaneously using the spray nozzle 73, the inclined brush 83, and the lower surface brush 51 respectively, there is almost no situation where contaminants generated from any one cleaning element adhere to the other cleaning elements. Therefore, it is not necessary to provide multiple devices for cleaning multiple parts of the substrate W separately, nor is it necessary to move the substrate W between multiple devices. As a result, the substrate cleaning apparatus 1 can be made larger and the substrate W can be cleaned efficiently.

[0110] Furthermore, the spray nozzle 73 cleans the upper surface of the substrate W by scanning from the center of the substrate W toward point P1 when viewed from above. In this case, almost no contaminants generated from the spray nozzle 73 adhere to the bevel brush 83 or the lower surface brush 51. Similarly, almost no contaminants generated from the bevel brush 83 or the lower surface brush 51 adhere to the spray nozzle 73. Therefore, the upper surface of the substrate W can be cleaned efficiently using the spray nozzle 73 with its simple configuration. Furthermore, the lower surface brush 51 is relatively large, so the lower surface of the substrate W can be cleaned efficiently.

[0111] (5) Other implementation methods

[0112] (a) In the described embodiment, after cleaning the central region of the lower surface of the substrate W in the upper holding devices 10A and 10B, cleaning the outer region of the lower surface of the substrate W is performed in the lower holding device 20. However, the embodiment is not limited to this. It is also possible to clean the central region of the lower surface of the substrate W in the upper holding devices 10A and 10B after cleaning the outer region of the lower surface of the substrate W in the lower holding device 20. Alternatively, cleaning the central region of the lower surface of the substrate W may not be performed. In this case, the substrate cleaning apparatus 1 does not include the upper holding devices 10A and 10B and the transfer device 40.

[0113] (b) In the described embodiment, the spray nozzle 73 cleans the upper surface of the substrate W by scanning from the center P0 of the substrate W toward point P1 when viewed from above, but the embodiment is not limited to this. The spray nozzle 73 may also clean the upper surface of the substrate W by scanning from point P1 toward the center P0 of the substrate W when viewed from above. Alternatively, the upper surface of the substrate W may be cleaned using the spray nozzle 73 that sprays a mixed fluid, but the embodiment is not limited to this. The upper surface of the substrate W may also be cleaned using a brush or a rinsing nozzle that sprays rinsing fluid.

[0114] (c) In the embodiment described above, the substrate cleaning apparatus 1 includes a control unit 9, but the embodiment is not limited thereto. If the substrate cleaning apparatus 1 is configured in a manner that allows it to be controlled by an external information processing device, the substrate cleaning apparatus 1 may not include a control unit 9.

[0115] (6) The correspondence between the constituent elements of the technical solution and the various parts of the implementation method

[0116] Hereinafter, examples of the correspondence between the constituent elements of the technical solution and the elements of the implementation method will be described, but the present invention is not limited to the examples described below. As constituent elements of the technical solution, various other elements having the structure or function described in the technical solution can also be used.

[0117] In the embodiment described above, substrate W is an example of a substrate, adsorption and holding part 21 is an example of a substrate holding part, points P1 to P3 are examples of points 1 to 3 respectively, spray nozzle 73, inclined brush 83 and lower surface brush 51 are examples of cleaning elements 1 to 3 respectively, straight lines L1 to L5 are examples of straight lines 1 to 5 respectively, angles θ1 to θ3 are examples of angles 1 to 3 respectively, and substrate cleaning device 1 is an example of a substrate cleaning device.

Claims

1. A substrate cleaning apparatus, comprising: The substrate holding section holds the circular substrate in a horizontal position; The first cleaning element, when viewed from above, scans above the substrate by passing through a first point on the outer edge of the substrate, thereby cleaning the upper surface of the substrate; The second cleaning component, when viewed from above, cleans the outer peripheral end of the substrate by contacting a second point on the outer edge of the substrate; as well as The third cleaning component cleans the lower surface of the substrate; and Define an imaginary first straight line passing through the first point and the second point, and an imaginary second straight line passing through the center of the substrate and parallel to the first straight line. The third cleaning element is disposed below the substrate and in the region opposite to the first and second cleaning elements, separated by the second straight line; When viewed from above, the second point is located at a different point than the point on the straight line connecting the center of the substrate and the center of the third cleaning element.

2. The substrate cleaning apparatus according to claim 1, wherein an imaginary third straight line extending from the center of the substrate toward the geometric center of the third cleaning element in a top view is further defined, and a third point on the outer edge of the substrate through which the third straight line passes in a top view. The first cleaning element, the second cleaning element, and the third cleaning element are arranged such that the center of the substrate is located within a triangular region with the first point, the second point, and the third point as vertices.

3. The substrate cleaning apparatus according to claim 2, wherein an imaginary fourth straight line extending from the center of the substrate toward the first point when viewed from above, and an imaginary fifth straight line extending from the center of the substrate toward the second point when viewed from above, are further defined. The first angle between the third line and the fourth line, the second angle between the fourth line and the fifth line, and the third angle between the fifth line and the third line are all greater than 80 degrees.

4. The substrate cleaning apparatus according to claim 3, wherein the first angle, the second angle and the third angle are each 90 degrees or more.

5. The substrate cleaning apparatus according to claim 3 or 4, wherein the first angle is greater than the second angle.

6. The substrate cleaning apparatus according to claim 3 or 4, wherein the third angle is greater than the second angle.

7. The substrate cleaning apparatus according to any one of claims 1 to 4, wherein the first cleaning member cleans the upper surface of the substrate by scanning from the center of the substrate toward the first point when viewed from above.

8. The substrate cleaning apparatus according to any one of claims 1 to 4, wherein the substrate holding portion and the third cleaning member each have a circular shape. The diameter of the third cleaning element is larger than the diameter of the substrate holding part.

9. The substrate cleaning apparatus according to any one of claims 1 to 4, wherein the third cleaning element has a circular shape. The diameter of the third cleaning element is greater than 1 / 3 of the diameter of the substrate.

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