Manufacturing process of mini LED board and device thereof

Abstract

The present application relates to the technical field of MiniLED plate manufacturing, in particular to a MiniLED plate manufacturing process, comprising the following steps: S1, taking a substrate, and smoothing and cleaning the surface of the substrate with a grinding brush; S2, setting a circuit on the substrate according to the required setting, and completing pad forming; S3, covering a copper foil layer on the substrate, which is in a frame-shaped structure capable of surrounding the pad; S4, performing laser and over-etching line processes on the substrate circuit board to obtain a copper-clad plate; S5, forming a blind hole on the copper-clad plate by using a drilling process; S6, performing hole-filling electroplating and film-removing processes on the copper-clad plate to obtain an electroplated plate; S7, performing etching on the electroplated plate to obtain a MiniLED plate. The present application also includes a processing clamp for MiniLED plate manufacturing, comprising a clamp table, a positioning table fixedly arranged at the upper end of the clamp table, protruding plates fixedly arranged at both ends of the positioning table in a symmetrical manner, guide holes formed in the protruding plates, and an adsorbing fixing hole formed in the middle position of the positioning table and penetrating through the clamp table.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of MiniLED plate manufacturing, in particular to a MiniLED plate manufacturing process and device. BACKGROUND

[0002] With the rapid development of light-emitting diode (LED) technology, mini light-emitting diode (miniLED) has emerged as the times require and become the focus of research in recent years. Currently, miniLED display is one of the future development trends of existing flat panel displays and is supported by major module manufacturers. MiniLED is defined as an LED device with a chip size of 75-200um. With the rapid development of miniLED display technology, miniLED products have been widely used in ultra-clear display fields such as high-end cinemas, televisions, advertising displays, mobile phone screens, and office displays. The existing miniLED chip preparation process is complex and costly, and the copper uniformity cannot be guaranteed. The spacing difference between adjacent solder pads after etching is large, and there is a copper tooth phenomenon. In addition, the filling effect of the current manufacturing process is not ideal. Furthermore, during the processing of the miniLED chip, it cannot be quickly positioned and fixed, and due to the small size of the miniLED chip, it is not convenient to perform surface processing operations after fixing, which seriously affects the production efficiency and production quality of the miniLED chip. SUMMARY

[0003] The present application aims to provide a MiniLED plate manufacturing process and device to solve the problems raised in the background.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0005] A MiniLED plate manufacturing process, comprising the following steps:

[0006] S1, taking a substrate, smoothing and cleaning the surface of the substrate with a brush;

[0007] S2, setting up a circuit on the substrate as needed and completing the formation of the solder pad;

[0008] S3, covering the substrate with a copper foil layer in a frame-shaped structure that can surround the solder pad;

[0009] S4, performing a laser and over-etching line process on the substrate circuit board to obtain a copper-clad plate;

[0010] S5, forming a blind hole on the copper-clad plate using a drilling process;

[0011] S6, carry out hole filling electroplating and film stripping process on the copper-clad plate to obtain an electroplated plate, the hole filling electroplating adopts a copper sulfate hole filling electroplating solution, the concentration of copper sulfate pentahydrate molecules is 100-280 g / L, the concentration of sulfuric acid molecules is 10-200 g / L, the concentration of chloride ions is 20-100 mg / L, the concentration of formaldehyde molecules is 850-20000 mg / L, and the concentration of oxygen is 6-10 mg / L, formaldehyde is added to the copper sulfate hole filling electroplating solution, and ideal hole filling effect can be achieved after multiple formal hole filling electroplating.

[0012] S7, carry out etching process on the electroplated plate to obtain a MiniLED plate, and the spacing between the etched solder plate and the upper edge of the solder plate is 35-43 um.

[0013] In addition, the manufacturing process steps S1-S7 of the MiniLED plate are completed on the processing clamp.

[0014] A manufacturing process of a MiniLED plate, the processing clamp used in the process includes a clamp table, a positioning table is fixedly arranged at the upper end of the clamp table, two protruding plates are symmetrically fixedly arranged at the two ends of the positioning table, guide holes are formed in the protruding plates, an adsorption fixing hole is formed in the middle position of the positioning table, the adsorption fixing hole penetrates the clamp table, a fixed plate is fixedly arranged on one side of the clamp table, threaded holes are formed in the fixed plate, a connecting through slot is formed in the clamp table between the fixed plate and the positioning table, the connecting through slot penetrates the clamp table, and a MiniLED plate processing positioning mechanism is installed on the clamp table.

[0015] Preferably, the MiniLED plate processing positioning mechanism includes a limiting clamp, a matching piston, a connecting rod, a movable frame, a bearing and a threaded drive rod, and the limiting clamp is symmetrically installed at the two ends of the positioning table.

[0016] Preferably, a guide rod is fixedly arranged at the rear end of the limiting clamp, the guide rod is inserted into the guide hole, and the two limiting clamps are located on the inner side of the protruding plate, and one end of the limiting clamp is fixedly provided with a hinged frame.

[0017] Preferably, the hinged frame is hingedly connected with the connecting rod, the other end of the connecting rod is hingedly connected with the movable frame, the two ends of the movable frame are respectively hingedly connected with the connecting rods, and a bearing hole is formed in the rear end of the movable frame.

[0018] Preferably, a movable pressing rod is fixedly arranged at the lower end of the movable frame, the movable pressing rod is partially inserted into the connecting through slot, and the lower end of the movable pressing rod is located at the lower end of the connecting through slot, in addition, a horizontal slot is formed in front of the lower end of the movable pressing rod, and an inclined slot is formed at the rear side of the horizontal slot.

[0019] Preferably, a bearing is installed in the bearing hole, and a threaded driving rod is matched with the bearing, and the threaded driving rod is threadedly connected in the threaded hole.

[0020] Preferably, the matched piston is inserted in the adsorption fixing hole, and a piston rod is fixedly arranged at the lower end of the matched piston, a matched through hole is arranged on the piston rod, and a pressing rod is fixedly arranged at the lower end of the piston rod.

[0021] Compared with the prior art, the present application has the advantages of reasonable structure and strong functionality, and has the following advantages:

[0022] 1. The method can make the copper surface uniform, the distance difference between adjacent soldering plates after etching is smaller, and there is no copper tooth.

[0023] 2. The MiniLED chip can be quickly positioned under the action of the limiting clamp, and can be quickly fixed under the cooperation of the adsorption fixing hole and the matched piston, so that the MiniLED chip is accurately positioned and fixed, and stable processing is realized.

[0024] 3. When the MiniLED chip is processed, the limiting clamp is away from the MiniLED chip, avoiding interference of the limiting clamp with the processing of the MiniLED chip, so that the processing is smooth, and the efficiency and processing quality of the MiniLED chip processing are improved. BRIEF DESCRIPTION OF DRAWINGS

[0025] Fig. 1 It is a schematic diagram of assembly of the tool clamp;

[0026] Fig. 2 It is an exploded schematic diagram of assembly of the tool clamp;

[0027] Fig. 3 It is a process flow schematic diagram.

[0028] In the figure: 1, clamp table; 11, positioning table; 12, protruding plate; 13, adsorption fixing hole; 14, fixed plate; 15, threaded hole; 16, connecting through slot; 2, limiting clamp; 21, guide rod; 22, hinged frame; 3, matched piston; 31, piston rod; 32, matched through hole; 33, pressing rod; 4, connecting rod; 5, movable frame; 51, bearing hole; 52, movable pressing rod; 53, horizontal slot; 54, inclined slot; 6, bearing; 7, threaded driving rod. DETAILED DESCRIPTION

[0029] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0030] Please refer to Figs. 1 to 3 The present application provides a technical solution:

[0031] Embodiment one:

[0032] A manufacturing process of a MiniLED board, comprising the following steps:

[0033] S1, take a substrate, and smooth and clean the surface of the substrate with a brush grinder;

[0034] S2, set a line on the substrate according to the needs, and complete the pad forming;

[0035] S3, cover a copper foil layer on the substrate, which is in a frame-shaped structure capable of surrounding the pads, and a photosensitive film is arranged on the copper foil layer;

[0036] S4, perform laser and over-etching line processes on the substrate circuit board to obtain a copper-clad plate. In addition, after the over-etching line process, the blind hole is subjected to a carbon powder sinking operation. The copper-clad plate comprises a dielectric layer and copper foils respectively covering both sides of the dielectric layer;

[0037] S5, a drilling process is used to form a blind hole on the copper-clad plate;

[0038] S6, perform hole-filling electroplating and film stripping processes on the copper-clad plate to obtain an electroplated plate. The hole-filling electroplating uses a copper sulfate hole-filling electroplating solution, in which the concentration of copper sulfate pentahydrate molecules is 200 g / L, the concentration of sulfuric acid molecules is 120 g / L, the concentration of chloride ions is 60 mg / L, the concentration of formaldehyde molecules is 10,000 mg / L, and the concentration of oxygen is 8 mg / L. Formaldehyde is added to the copper sulfate hole-filling electroplating solution, and after multiple formal hole-filling electroplating, the ideal hole-filling effect is achieved;

[0039] S7, perform etching process on the electroplated plate to obtain a MiniLED board, and use low spray pressure and fast speed parameters for etching. The spacing between the etched pads and the upper pads is 40 um.

[0040] In addition, the manufacturing process steps S1-S7 of the MiniLED board are completed on a machining clamp.

[0041] Embodiment two:

[0042] A manufacturing process of a MiniLED board, comprising the following steps:

[0043] S1, take the substrate, and polish the substrate surface to smooth and clean;

[0044] S2, set the circuit on the substrate according to the required setting, and complete the pad forming;

[0045] S3, cover the copper foil layer on the substrate, which is a frame-shaped structure capable of surrounding the pad, and the copper foil layer is provided with a photosensitive film;

[0046] S4, laser, over-etching line process is performed on the substrate circuit board to obtain a copper-clad plate, and after the over-etching line process, the blind hole is filled with carbon powder. The copper-clad plate includes a dielectric layer and copper foils covering the two sides of the dielectric layer respectively;

[0047] S5, a drilling process is used to form a blind hole on the copper-clad plate;

[0048] S6, the copper-clad plate is subjected to hole-filling electroplating and film stripping process to obtain an electroplated plate. The hole-filling electroplating uses copper sulfate hole-filling electroplating solution, in which the concentration of copper sulfate pentahydrate molecules is 280g / L, the concentration of sulfuric acid molecules is 200g / L, the concentration of chloride ions is 100mg / L, the concentration of formaldehyde molecules is 20000mg / L, and the concentration of oxygen is 10mg / L. Formaldehyde is added to the copper sulfate hole-filling electroplating solution, and after multiple formal hole-filling electroplating, the ideal hole-filling effect is achieved.

[0049] S7, the electroplated plate is subjected to etching process to obtain a MiniLED plate, and low spray pressure and fast speed parameters are used for etching. The spacing between the etched solder plate and the upper amplitude of the solder plate is 43um.

[0050] In addition, the manufacturing process steps S1-S7 of the MiniLED plate are completed on the processing clamp.

[0051] A manufacturing process for a MiniLED plate, the processing clamp used in the process, comprising a clamp table 1, a positioning table 11 is fixedly arranged at the upper end of the clamp table 1, two convex plates 12 are symmetrically fixedly arranged at the two ends of the positioning table 11, guide holes are formed in the convex plates 12, an adsorbing fixing hole 13 is formed in the middle position of the positioning table 11, the adsorbing fixing hole 13 penetrates the clamp table 1, a fixed plate 14 is fixedly arranged on one side of the clamp table 1, threaded holes 15 are formed in the fixed plate 14, a connecting through slot 16 is formed in the clamp table 1 between the fixed plate 14 and the positioning table 11, the connecting through slot 16 penetrates the clamp table 1, a MiniLED plate processing positioning mechanism is installed on the clamp table 1, and the MiniLED plate processing positioning mechanism comprises limiting clamps 2, cooperating pistons 3, connecting rods 4, movable frames 5, bearings 6 and threaded drive rods 7. The two limiting clamps 2 are symmetrically installed at the two ends of the positioning table 11, and the space formed by the two limiting clamps 2 in the working state is equal in size to the size of the MiniLED plate.

[0052] The rear end of the limiting clip 2 is fixedly provided with a guide rod 21 which is inserted into a guide hole, and the two limiting clips 2 are both located on the inner side of the lug plate 12. One end of the limiting clip 2 is fixedly provided with a hinged frame 22, and the hinged frame 22 is hingedly connected with a connecting rod 4. The other end of the connecting rod 4 is hingedly connected with a movable frame 5. The two ends of the movable frame 5 are respectively hingedly connected with connecting rods 4. The rear end of the movable frame 5 is provided with a bearing hole 51 in which a bearing 6 is installed. The bearing 6 is matched with a threaded driving rod 7 which is threadedly connected in a threaded hole 15. The movable frame 5 is located between the fixed plate 14 and the positioning table 11.

[0053] The lower end of the movable frame 5 is fixedly provided with a movable pressing rod 52 which is partially inserted into the connecting through slot 16, and the lower end thereof is located at the lower end of the connecting through slot 16. In addition, the lower end of the movable pressing rod 52 is provided with a horizontal slot 53 in front thereof, and the rear side of the horizontal slot 53 is provided with a beveled slot 54. In addition, the inner surfaces of the horizontal slot 53 and the beveled slot 54 are smooth and free of burrs.

[0054] The cooperating piston 3 is inserted into the adsorbing fixing hole 13, and the lower end of the cooperating piston 3 is fixedly provided with a piston rod 31 which is provided with a cooperating through hole 32. The lower end of the piston rod 31 is fixedly provided with a pressing rod 33. In the non-working state, the upper end surface of the cooperating piston 3 is flush with the upper end surface of the positioning table 11. In the non-working state, the pressing rod 33 is inserted into the horizontal slot 53, and in the working state, the pressing rod 33 is located in the beveled slot 54. The heights of the horizontal slot 53 and the beveled slot 54 are equal to the diameter of the pressing rod 33. In addition, the width of the movable pressing rod 52 is equal to the width of the cooperating through hole 32.

[0055] In the process of processing the MiniLED board, it is placed between the limiting clamps 2, so that the positioning of the MiniLED board can be realized under the action of the limiting clamps 2, so as to ensure the accurate positioning position, then rotate the threaded drive rod 7, make it move to the direction of the positioning table 11 under the action of the screw, so as to drive the movable frame 5 to move to the direction of the positioning table 11, under the action of the movable frame 5, push the two connecting rods 4 to rotate and move, and the end of the connecting rod 4 away from the movable frame 5 rotates in the opposite direction, so as to push the two limiting clamps 2 to move reversely under the action of the connecting rod 4, so that the limiting clamps 2 move away from the periphery of the MiniLED board, so that the MiniLED board will not hinder the processing of the MiniLED board during processing, facilitating the processing of the MiniLED board, and the movable frame 5 will move the pressure rod 33 into the inclined groove 54 during movement, so that the matching piston 3 will move into the inside of the adsorption fixing hole 13 under the action of the inclined groove 54, because the upper end of the adsorption fixing hole 13 is in a sealed state under the action of the MiniLED board, so when the matching piston 3 moves downward, a negative pressure will be formed in the adsorption fixing hole 13, so that the MiniLED board can be firmly fixed at its positioning position, realizing the fixation of the MiniLED board. Since there is no clamp restriction around the MiniLED board, the processing of the MiniLED board is more smooth, which can greatly improve the processing efficiency and further improve the processing quality, and the operation is simple and convenient. When the MiniLED board needs to be released, only the threaded drive rod 7 needs to be rotated in the opposite direction to reset the limiting clamps 2 and the matching piston 3, and then release the MiniLED board.

[0056] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A manufacturing process for a MiniLED board, comprising the following steps: S1. Take the substrate and use a brush to smooth and clean the surface of the substrate. S2. Set up the circuit on the substrate as required and complete the pad forming; S3. A copper foil layer is laid on the substrate, forming a frame structure that can surround the pads; S4. Perform laser etching and solar etching processes on the substrate circuit board to obtain copper-clad laminate; S5. Drilling process is used to form blind holes on copper-clad laminate; S6. Perform through-hole plating and stripping processes on the copper-clad laminate to obtain an electroplated board. The through-hole plating uses a copper sulfate through-hole plating solution, in which the concentration of copper sulfate pentahydrate molecules is 100-280 g / L, the concentration of sulfuric acid molecules is 10-200 g / L, the concentration of chloride ions is 20-100 mg / L, the concentration of formaldehyde molecules is 850-20000 mg / L, and the concentration of oxygen is 6-10 mg / L. By adding formaldehyde to the copper sulfate through-hole plating solution and performing multiple formal through-hole plating processes, an ideal through-hole filling effect can be achieved. S7. The electroplated plate is etched to obtain a MiniLED board, wherein the spacing between the upper and lower surfaces of the etched solder plate is 35-43µm. In addition, all manufacturing process steps S1-S7 of the MiniLED board are completed on the machining fixture; The processing fixture includes a fixture table (1), a positioning table (11) is fixedly installed at the upper end of the fixture table (1), and convex plates (12) are symmetrically fixed at both ends of the positioning table (11). The convex plates (12) are provided with guide holes. An adsorption fixing hole (13) is provided at the middle position of the positioning table (11). The adsorption fixing hole (13) penetrates the fixture table (1). A fixing plate (14) is fixedly installed on one side of the fixture table (1). A threaded hole (15) is provided on the fixing plate (14). A connecting through groove (16) is provided on the fixture table (1) between the fixing plate (14) and the positioning table (11). The connecting through groove (16) penetrates the fixture table (1). A MiniLED board processing positioning mechanism is installed on the fixture table (1).

2. The manufacturing process of the MiniLED board according to claim 1, characterized in that: The MiniLED board processing positioning mechanism includes a limiting clamp (2), a cooperating piston (3), a connecting rod (4), a movable frame (5), a bearing (6), and a threaded drive rod (7). The limiting clamp (2) consists of two symmetrically installed at both ends of the positioning table (11).

3. The manufacturing process of the MiniLED board according to claim 2, characterized in that: The rear end of the limiting clamp (2) is fixedly provided with a guide rod (21), which is inserted into the guide hole. Both limiting clamps (2) are located inside the protrusion plate (12), and one end of the limiting clamp (2) is fixedly provided with a hinge frame (22).

4. The manufacturing process of the MiniLED board according to claim 3, characterized in that: A connecting rod (4) is hinged on the hinge frame (22), and the other end of the connecting rod (4) is hinged on the movable frame (5). The two ends of the movable frame (5) are respectively hinged with connecting rods (4), and a bearing hole (51) is provided at the rear end of the movable frame (5).

5. The manufacturing process of the MiniLED board according to claim 4, characterized in that: The lower end of the movable frame (5) is fixedly provided with a movable pressure rod (52). The movable pressure rod (52) is partially inserted into the connecting through groove (16), and its lower end is located at the lower end of the connecting through groove (16). In addition, a horizontal groove (53) is provided in front of the lower end of the movable pressure rod (52), and a sloping groove (54) is provided on the rear side of the horizontal groove (53).

6. The manufacturing process of the MiniLED board according to claim 4, characterized in that: A bearing (6) is installed in the bearing hole (51), and the bearing (6) is fitted with a threaded drive rod (7), which is threadedly connected in the threaded hole (15).

7. The manufacturing process of the MiniLED board according to claim 2, characterized in that: The matching piston (3) is inserted into the adsorption fixing hole (13), and a piston rod (31) is fixedly provided at the lower end of the matching piston (3). A matching through hole (32) is opened on the piston rod (31), and a pressure rod (33) is fixedly provided at the lower end of the piston rod (31).

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