Temperature and Humidity Test Equipment for Chip Production

Abstract

The present invention discloses a temperature and humidity test device for chip production, which relates to the technical field of chip production, and includes a device main body; a transfer mechanism, which is movably arranged on one side of the device main body and is used for transporting chips; a temperature and humidity test mechanism, the number of the temperature and humidity test mechanisms is several, and several temperature and humidity test mechanisms are superposed on each other in the inner cavity of the device main body. The temperature and humidity test mechanism includes a test board; a monitoring terminal; the multiple temperature and humidity test mechanisms provided can form different test environments. Therefore, the working states of chips under multiple environments can be tested simultaneously. Since the sealing mechanism isolates the test tank from the external environment, when multiple groups of chips are tested, they will not interfere with each other. The transfer mechanism provided can automatically transport chips without manual operation, with good stability and high safety. The sealing mechanism can timely close the test tank when the chips enter and exit the test tank, ensuring the stability of the inner cavity environment of the test tank.

Description

Technical Field

[0001] The invention relates to the technical field of chip production, and in particular to temperature and humidity testing equipment for chip production. Background Art

[0002] Chips, also known as integrated circuits, are the core components of contemporary smart electronic products. After the chips are produced by the factory, they need to be functionally tested, that is, to test the stability of the chip under a certain temperature and humidity environment. Therefore, temperature and humidity test equipment for chip production is used;

[0003] The current temperature and humidity test equipment for chip production is as follows: Figure 7 As shown, a heater and a humidifier are arranged inside the device body to control the temperature and humidity inside the device body to ensure that the test chipset is in a set environment. However, the test chipset needs to be manually connected to the terminals on the device body. Therefore, after the test of the test chipset is completed, it needs to be manually taken out. The temperature inside the test chipset needs to be cooled to room temperature before manual operation can be performed, which is inefficient. Summary of the invention

[0004] In order to overcome the above-mentioned technical problems, the purpose of the present invention is to provide temperature and humidity testing equipment for chip production. The multiple temperature and humidity testing mechanisms can form different test environments. Therefore, the working conditions of chips under multiple environments can be tested at the same time. Since the sealing mechanism isolates the test tank from the external environment, when multiple groups of chips are tested, they will not interfere with each other. The set transfer mechanism can automatically transport the chips without manual operation, with good stability and high safety. The sealing mechanism can close the test tank in time when the chip enters and exits the test tank, thereby ensuring the stability of the inner cavity environment of the test tank.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] Temperature and humidity test equipment for chip production, the temperature and humidity test equipment includes:

[0007] Equipment body;

[0008] A transfer mechanism, which is movably arranged on one side of the device body and is used to transport the chip;

[0009] A temperature and humidity test mechanism, wherein the number of the temperature and humidity test mechanisms is several, and the several temperature and humidity test mechanisms are mutually superimposed in the inner cavity of the device body, and the temperature and humidity test mechanism comprises a test plate, one end of the test plate is fixedly connected to a sealing mechanism, and a test groove is opened on the top surface of the test plate, and the sealing mechanism isolates the test groove from the external environment;

[0010] A monitoring terminal is arranged on one side of the equipment body, and is used to control the transport mechanism and the temperature and humidity testing mechanism.

[0011] As a further solution of the present invention: the transfer mechanism includes a sealing side plate, and the four corners of the sealing side plate close to the equipment body are fixedly connected with telescopic rods, and the telescopic rods are hydraulic push rods, pneumatic push rods or electric push rods.

[0012] As a further solution of the present invention: the sealing side plate is fixedly connected to a vertically arranged limit rod close to the side of the equipment body, a lifting plate is nested on the side of the limit rod, a ball nut is provided in the middle position of the lifting plate, a driving screw that fits with the ball nut is inserted into the inner side of the ball nut, and the bottom end of the driving screw is connected to a motor through a gear.

[0013] As a further solution of the present invention: the front side of the lifting plate is connected with two groups of moving blocks through a hydraulic push rod, the front sides of the two groups of moving blocks are connected with clamping rods, a test chip group is clamped between the two clamping rods, and a plurality of chips are installed on the top surface of the test chip group.

[0014] As a further solution of the present invention: a heater and a humidifier are fixedly connected to the rear end of the top surface of the test plate, the heater is used to adjust the temperature in the test tank, and the heater is used to adjust the humidity in the test tank.

[0015] As a further solution of the present invention: the sealing mechanism comprises a fixed plate, a sealing plate is fixedly connected to the top surface of the fixed plate, and a rotating plate is provided between the fixed plate and the sealing plate.

[0016] As a further solution of the present invention: a positioning mechanism is rotatably connected to both sides of the test slot, and the positioning mechanism includes a clamping plate, both ends of the clamping plate are fixedly connected to a rotating shaft, the bottom surface of the rotating shaft is fixedly connected to an inclined plate, the inner side of the clamping plate is provided with a conductor sheet, and the side surface of the test chip group is provided with a conductor sheet that fits with the conductor sheet.

[0017] As a further solution of the present invention: a clamping block is fixedly connected to the inner side of the clamping rod, a clamping groove that fits with the clamping block is opened on one side of the test chip group, and the width of the clamping groove is greater than the width of the clamping plate.

[0018] Beneficial effects of the present invention:

[0019] 1. In the present invention, multiple temperature and humidity test mechanisms are provided to form different test environments. Therefore, the working status of the chip under multiple environments can be tested at the same time. Since the sealing mechanism isolates the test tank from the external environment, multiple groups of chips will not interfere with each other when tested. The provided transfer mechanism can automatically transport the chips without manual operation, with good stability and high safety. The sealing mechanism can timely close the test tank when the chip enters and exits the test tank to ensure the stability of the environment in the test tank cavity.

[0020] 2. In the present invention, a rotating plate is provided between the fixed plate and the sealing plate. During operation, when it is necessary to put the test chip group into the test slot or take the test chip group out of the test slot, the rotating plate can be opened. The rotating plate can be pushed by a hydraulic cylinder to open or close the rotating plate. The environment in the test slot can be isolated from the external environment, ensuring that the temperature and humidity inside the test slot are within a certain range, and also ensuring the stability of the chip test environment.

[0021] 3. In the present invention, through the positioning mechanism, when the bottom surface of the test chip group contacts the inclined plate, the clamping plate will rotate, and the clamping plate will rotate on the top of the test plate through the rotating shaft. The two rotating shafts are synchronously connected through the connecting shaft and the universal joint, which ensures that the two groups of clamping plates will rotate synchronously, so that the test chip group can be automatically clamped, and the conductor plate arranged on the inner side of the clamping plate will contact the conductor plate on the side of the test chip group to turn on the power supply of the chip to ensure the normal operation of the chip. The pressure of the conductor plate on the conductor plate is provided by the gravity decomposition of the test chip group, so that the conductor plate can be effectively in contact with the conductor plate, ensuring that the chip can be tested stably, realizing automatic disassembly and replacement with high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below in conjunction with the accompanying drawings.

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a structural schematic diagram of the transfer mechanism in the present invention;

[0025] Figure 3 yes Figure 2 A partial enlarged view of the middle A;

[0026] Figure 4 It is a schematic diagram of the structure of the temperature and humidity test mechanism of the present invention;

[0027] Figure 5 It is a structural schematic diagram of the sealing mechanism in the present invention;

[0028] Figure 6 It is a structural schematic diagram of the positioning mechanism in the present invention;

[0029] Figure 7 The present invention is a schematic diagram of the structure of a temperature and humidity test device for chip production in the prior art.

[0030] In the figure: 1. Equipment body; 2. Transfer mechanism; 21. Sealing side plate; 22. Telescopic rod; 23. Limit rod; 24. Lifting plate; 25. Moving block; 26. Clamping rod; 261. Clamping block; 27. Test chip set; 271. Clamping slot; 3. Temperature and humidity test mechanism; 31. Test plate; 32. Sealing mechanism; 321. Fixed plate; 322. Sealing plate; 323. Rotating plate; 33. Heater; 34. Humidifier; 35. Test slot; 36. Positioning mechanism; 361. Clamping plate; 362. Inclined plate; 363. Rotating axis; 364. Conductor sheet; 4. Monitoring terminal. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] like Figure 1-Figure 6 As shown, a temperature and humidity test device for chip production includes a device body 1, a transfer mechanism 2 is movably arranged on one side of the device body 1, the transfer mechanism 2 is used to transport chips, there are several temperature and humidity test mechanisms 3, several temperature and humidity test mechanisms 3 are superimposed on each other in the inner cavity of the device body 1, the temperature and humidity test mechanism 3 includes a test board 31, one end of the test board 31 is fixedly connected with a sealing mechanism 32, a test groove 35 is opened on the top surface of the test board 31, the sealing mechanism 32 isolates the test groove 35 from the external environment, and a monitoring terminal 4 is arranged on one side of the device body 1, the monitoring terminal 4 is used to control the transfer mechanism 2 and the temperature and humidity test mechanism 3;

[0033] The multiple temperature and humidity testing mechanisms 3 set up can form different testing environments. Therefore, the working status of the chip under multiple environments can be tested at the same time. Since the sealing mechanism 32 isolates the test slot 35 from the external environment, there will be no interference when multiple groups of chips are tested. The set transfer mechanism 2 can automatically transport the chips without manual operation, with good stability and high safety. The sealing mechanism 32 can close the test slot 35 in time when the chip enters and exits the test slot 35, so as to ensure the stability of the inner cavity environment of the test slot 35.

[0034] like Figure 2As shown, the transfer mechanism 2 includes a sealing side plate 21, and the four corners of the sealing side plate 21 close to the equipment body 1 are fixedly connected with telescopic rods 22. The telescopic rods 22 are hydraulic push rods, pneumatic push rods or electric push rods. When working, the telescopic rods 22 will push the sealing side plate 21 to automatically unfold the sealing side plate 21.

[0035] like Figure 2 As shown, a sealing side plate 21 is fixedly connected to a side close to the device body 1 with a vertically arranged limit rod 23, a lifting plate 24 is nested on the side of the limit rod 23, a ball nut is provided in the middle position of the lifting plate 24, a driving screw which fits with the ball nut is inserted into the inner side of the ball nut, and the bottom end of the driving screw is connected to a motor through a gear. When the motor is turned on, the output shaft of the motor meshes with the gear, so the motor will drive the gear through the output shaft, and the gear is fixedly connected to the bottom end of the driving screw, and when the gear rotates, it will drive the driving screw to rotate synchronously, and the rotating driving screw will cooperate with the ball nut on the lifting plate 24, so that the lifting plate 24 can be freely lifted and lowered on the inner side of the sealing side plate 21.

[0036] like Figure 2 As shown, the front of the lifting plate 24 is connected to two groups of moving blocks 25 through a hydraulic push rod, and the front of the two groups of moving blocks 25 are connected to a clamping rod 26. A test chip group 27 is clamped between the two clamping rods 26, and a plurality of chips are installed on the top surface of the test chip group 27. When working, the two groups of moving blocks 25 will clamp the test chip group 27 through the clamping rod 26, and then transport it to the corresponding test slot 35.

[0037] like Figure 4 As shown, a heater 33 and a humidifier 34 are fixedly connected to the rear end of the top surface of the test plate 31 . The heater 33 is used to adjust the temperature in the test tank 35 , and the heater 33 is used to adjust the humidity in the test tank 35 .

[0038] like Figure 5 As shown, the sealing mechanism 32 includes a fixed plate 321, the top surface of the fixed plate 321 is fixedly connected to a sealing plate 322, and a rotating plate 323 is provided between the fixed plate 321 and the sealing plate 322. During operation, when it is necessary to put the test chip group 27 into the test slot 35 or take the test chip group 27 out of the test slot 35, the rotating plate 323 can be opened, and the rotating plate 323 can be pushed by a hydraulic cylinder to open or close the rotating plate 323 to isolate the environment in the test slot 35 from the external environment, thereby ensuring that the temperature and humidity inside the test slot 35 are within a certain range, and also ensuring the stability of the chip test environment.

[0039] like Figure 6As shown, the two sides of the test slot 35 are rotatably connected with a positioning mechanism 36, and the positioning mechanism 36 includes a clamping plate 361, and the two ends of the clamping plate 361 are fixedly connected with a rotating shaft 363, and the bottom surface of the rotating shaft 363 is fixedly connected with an inclined plate 362. The inner side of the clamping plate 361 is provided with a conductor plate 364, and the side of the test chip group 27 is provided with a conductor plate that fits with the conductor plate 364. When the clamping rod 26 transports the test chip group 27 to the top of the test slot 35, the test chip group 27 can be released, and the test chip group 27 will automatically fall on the positioning mechanism 36 due to gravity.

[0040] Since the bottom surface of the clamping plate 361 is fixedly connected with the inclined plate 362, when the bottom surface of the test chip group 27 contacts the inclined plate 362, the clamping plate 361 will rotate, and the clamping plate 361 will rotate on the top of the test plate 31 through the rotating shaft 363. The two rotating shafts 363 are synchronously connected through the connecting shaft and the universal joint, which ensures that the two groups of clamping plates 361 will rotate synchronously, so that the test chip group 27 can be automatically clamped, and the conductor plate 364 arranged on the inner side of the clamping plate 361 will contact the conductor plate on the side of the test chip group 27 to turn on the power supply of the chip and ensure the normal operation of the chip. The pressure of the conductor plate 364 on the conductor plate is provided by the gravity decomposition of the test chip group 27, so that the conductor plate 364 can ensure effective contact with the conductor plate.

[0041] like Figure 3 As shown, a clamping block 261 is fixedly connected to the inner side of the clamping rod 26, and a clamping groove 271 that fits with the clamping block 261 is opened on one side of the test chip group 27, and the width of the clamping groove 271 is greater than the width of the clamping plate 361. When the chip test is completed, the clamping rod 26 can be placed on both sides of the test chip group 27 through the sealing mechanism 32 to shorten the distance between the two moving blocks 25. The two sets of clamping blocks 261 will be respectively stuck in the clamping grooves 271 on both sides of the test chip group 27, and then the lifting plate 24 can be lifted to separate the test chip group 27 from the positioning mechanism 36, and then the test chip group 27 can be transported out of the temperature and humidity test mechanism 3.

[0042] The working principle of the present invention is as follows: when a test chip is needed, the chip is first installed on the top surface of the test chip set 27, and then the telescopic rod 22 is opened. The telescopic rod 22 will push the sealing side plate 21 to automatically expand the sealing side plate 21, and the test chip set 27 is placed between the two clamping rods 26. The motor is turned on, and the output shaft of the motor is engaged with the gear, so the motor will drive the gear through the output shaft. The gear is fixedly connected to the bottom end of the driving screw, and when the gear rotates, it will drive the driving screw to rotate synchronously, and the rotating driving screw will cooperate with the ball nut on the lifting plate 24, so that the lifting plate 24 can be freely lifted and lowered on the inner side of the sealing side plate 21, and the test chip set 27 is transported to the height of the corresponding temperature and humidity test mechanism 3, and the rotating plate 323 is opened. The two clamping rods 26 will lift the test chip set 27 to the corresponding temperature and humidity test mechanism 3. The chip group 27 is transported to the top of the test slot 35, and the test chip group 27 is released. The test chip group 27 will automatically fall on the positioning mechanism 36 due to gravity. Since the bottom surface of the clamping plate 361 is fixedly connected with the inclined plate 362, when the bottom surface of the test chip group 27 contacts the inclined plate 362, the clamping plate 361 will rotate, and the clamping plate 361 will rotate on the top of the test plate 31 through the rotating shaft 363. The two rotating shafts 363 are synchronously connected through the connecting shaft and the universal joint, which ensures that the two groups of clamping plates 361 will rotate synchronously, so that the test chip group 27 can be automatically clamped, and the conductor plate 364 arranged on the inner side of the clamping plate 361 will contact the conductor plate on the side of the test chip group 27, turn on the power of the chip, and ensure the normal operation of the chip.

[0043] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. Temperature and humidity test equipment for chip production, characterized in that, it includes: equipment main body (1); transfer mechanism (2), the transfer mechanism (2) is movably arranged on one side of the equipment main body (1), and the transfer mechanism (2) is used for transporting chips; temperature and humidity test mechanism (3), the number of the temperature and humidity test mechanisms (3) is several, and several temperature and humidity test mechanisms (3) are superposed on each other in the inner cavity of the equipment main body (1), and the temperature and humidity test mechanism (3) includes a test plate (31), one end of the test plate (31) is fixedly connected with a sealing mechanism (32), a test groove (35) is formed on the top surface of the test plate (31), and the sealing mechanism (32) isolates the test groove (35) from the external environment; monitoring terminal (4), the monitoring terminal (4) is arranged on one side of the equipment main body (1), and the monitoring terminal (4) is used for controlling the transfer mechanism (2) and the temperature and humidity test mechanism (3); the transfer mechanism (2) includes a sealing side plate (21), and telescopic rods (22) are fixedly connected to the four corner positions on the side of the sealing side plate (21) close to the equipment main body (1), and the telescopic rods (22) are hydraulic push rods, pneumatic push rods or electric push rods; a vertically arranged limiting rod (23) is fixedly connected to the side of the sealing side plate (21) close to the equipment main body (1), a lifting plate (24) is nested on the side surface of the limiting rod (23), a ball nut is arranged in the middle of the lifting plate (24), a driving lead screw that fits with the ball nut is inserted inside the ball nut, and the bottom end of the driving lead screw is connected with a motor through a gear; two groups of moving blocks (25) are connected to the front surface of the lifting plate (24) through hydraulic push rods, clamping rods (26) are connected to the front surfaces of the two groups of moving blocks (25), a test chip group (27) is clamped between the two clamping rods (26), and several chips are installed on the top surface of the test chip group (27); positioning mechanisms (36) are rotatably connected to both sides of the test groove (35), the positioning mechanisms (36) include clamping plates (361), rotating shafts (363) are fixedly connected to both ends of the clamping plates (361), inclined panels (362) are fixedly connected to the bottom surfaces of the rotating shafts (363), conductor sheet plates (364) are arranged inside the clamping plates (361), and conductor sheets that fit with the conductor sheet plates (364) are arranged on the side surface of the test chip group (27).

2. The temperature and humidity test equipment for chip production according to claim 1, characterized in that, a heater (33) and a humidifier (34) are fixedly connected to the rear end position of the top surface of the test plate (31), the heater (33) is used for adjusting the temperature in the test groove (35), and the heater (33) is used for adjusting the humidity in the test groove (35).

3. The temperature and humidity test equipment for chip production according to claim 1, characterized in that, The sealing mechanism (32) includes a fixing plate (321), a sealing plate (322) is fixedly connected to the top surface of the fixing plate (321), and a rotating plate (323) is provided between the fixing plate (321) and the sealing plate (322).

4. The temperature and humidity test equipment for chip production according to claim 1, characterized in that a clamping block (261) is fixedly connected to the inner side of the clamping rod (26), a clamping groove (271) that fits with the clamping block (261) is formed on one side of the test chip group (27), and the width of the clamping groove (271) is greater than the width of the clamping plate (361).

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