Support device, drying device and cleaning machine

Abstract

The present application discloses a support device, a drying device and a cleaning machine. The support device is used to support a wafer and includes at least two relatively arranged support assemblies. The support assembly includes a plurality of limiting teeth located at the top. The limiting teeth are arranged along the length direction of the support assembly, and tooth grooves are formed between two adjacent limiting teeth. At least one of the support assemblies also includes a support portion arranged beside the tooth groove and made of a water-absorbing material. The top surface of the support portion is higher than the bottom surface of the tooth groove and lower than the top of the limiting teeth, and is used to support the end face of the wafer when the wafer is inserted into the tooth groove. In the support device of the present application, the two side faces of the wafer are limited by the limiting teeth on both sides, and the end face of the wafer is supported on the support portion. Since the support portion is made of a water-absorbing material, the residual water on the wafer can be absorbed by the water-absorbing material. The contact points corresponding to the support portion of the support device do not require a pressure pump for auxiliary drying, and the structure is simple and the cost is low.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing equipment, and in particular to a supporting device, a drying device and a cleaning machine. Background Art

[0002] The tank cleaning machine is used to clean and dry wafers. During the drying process, the drying effect of the part (contact point) where the wafer contacts the support device directly determines the performance of the cleaning machine.

[0003] In the related art, a gas pipeline is added near the contact point and nitrogen is introduced to dry the contact point. This method requires the addition of a pressure pump, and the equipment structure design becomes more complicated, resulting in a higher cost. Summary of the Invention

[0004] In response to the above technical problems, the present application provides a supporting device, a drying device and a cleaning machine, which can improve the problems of complex structure and high cost of the supporting device in the related art.

[0005] To solve the above technical problems, in a first aspect, an embodiment of the present application provides a supporting device for supporting a wafer, wherein the supporting device includes at least two supporting components arranged opposite to each other;

[0006] The support assembly includes a plurality of limiting teeth located at the top, the limiting teeth are arranged along the length direction of the support assembly, and a tooth groove is formed between two adjacent limiting teeth;

[0007] At least one of the support components also includes a support portion arranged beside the tooth groove and made of water-absorbing material; the top surface of the support portion is higher than the bottom surface of the tooth groove and lower than the top of the limiting tooth, and is used to support the end face of the wafer when the wafer is inserted into the tooth groove.

[0008] Optionally, the support portion has a Shore hardness of 55 to 90; and / or,

[0009] The surface contact angle of the support portion is greater than 75°; and / or,

[0010] The support portion is a porous structure for conducting absorbed water.

[0011] Optionally, the porosity of the porous structure is greater than 88%, and the pore size is 0.1-0.5 μm.

[0012] Optionally, the support portion is made of foamed polytetrafluoroethylene or foamed polychlorotrifluoroethylene.

[0013] Optionally, the support assembly further includes:

[0014] The limiting plate includes a first side surface and a second side surface that are oppositely disposed, and a top surface connecting the first side surface and the second side surface, wherein the first side surface and the second side surface respectively extend along the length direction of the support assembly; wherein the limiting teeth are disposed on the top surface of the limiting plate; and the supporting portion is a water-absorbing material plate, disposed on the second side surface;

[0015] A clamping plate is provided on a side of the support portion away from the limiting plate, and clamps and fixes the support portion together with the limiting plate, wherein a top surface of the clamping plate is lower than a top surface of the support portion.

[0016] Optionally, the tooth groove is a U-shaped groove, and the bottom of the U-shaped groove is inclined downward from the second side surface to the first side surface.

[0017] Optionally, the second side surface includes a stepped surface, the stepped surface including a first vertical surface, a step surface extending outward from a lower edge of the first vertical surface, and a second vertical surface extending downward from the step surface;

[0018] The support portion and the clamping plate are correspondingly arranged on the first vertical surface, and a gap is provided between the lower end surface of the support portion and the step surface, and a gap is provided between the lower end surface of the clamping plate and the step surface.

[0019] Optionally, the step surface is an inclined surface, and one end located on the first vertical surface is higher than one end located on the second vertical surface.

[0020] Optionally, the limiting plate is provided with a groove on the first vertical surface, and at least two first bosses are provided in the groove, and the height of the first bosses is equal to the depth of the groove;

[0021] The support device also includes connecting bolts corresponding to the first bosses one by one. The connecting bolts pass through the limit plate and the support portion from the first boss and are connected to the clamping plate so that the limit plate and the clamping plate clamp and fix the support portion.

[0022] Optionally, a second boss corresponding to the first boss is provided on a side of the clamping plate facing the supporting portion, and the connecting bolt passes through the second boss;

[0023] A folded edge is provided on the top surface of the clamping plate, and the folded edge extends toward one side of the supporting portion, and the length of the extension is equal to the height of the second boss.

[0024] Optionally, a notch is provided between two adjacent second bosses of the clamping plate, and the notch is provided along the lower edge of the clamping plate.

[0025] Optionally, the limiting plate is provided with a through hole facing the notch.

[0026] Optionally, a connecting member is further included, wherein the connecting member is connected to the supporting assembly.

[0027] Optionally, the connecting member includes a first connecting plate and a second connecting plate that are arranged opposite to each other;

[0028] The support assembly is arranged in parallel between the first connecting plate and the second connecting plate, and one end of the support assembly is connected to the first connecting plate, and the other end is connected to the second connecting plate.

[0029] Optionally, three support assemblies are provided, and the support assembly located in the middle has the lowest assembly height, so that when the wafer is inserted into the tooth groove, the support parts of the three support assemblies form three-point support for the end face of the wafer. In a second aspect, the embodiments of the present application further provide a drying device, including the support device described in the above embodiments.

[0030] In a third aspect, an embodiment of the present application further provides a cleaning machine, comprising a cleaning tank, a lifting mechanism connected to the cleaning tank, and the supporting device as described in the above embodiments;

[0031] The cleaning tank is used to hold cleaning liquid;

[0032] The supporting device is arranged in the cleaning tank and connected to the lifting mechanism for carrying the wafer;

[0033] The lifting mechanism is used to drive the supporting device to sink into the cleaning liquid to clean the wafer, and to drive the supporting device to rise above the liquid level of the cleaning liquid to dry the wafer.

[0034] Optionally, the cleaning machine further includes:

[0035] An air blowing device is provided on the top surface and / or side surface of the cleaning tank;

[0036] The blowing device is used to blow volatile organic solvent toward the wafer when the lifting mechanism drives the supporting device to rise; and to blow inert gas toward the wafer when the lifting mechanism drives the supporting device to rise above the liquid level of the cleaning liquid.

[0037] As described above, the support device of the present application is provided with a plurality of limiting teeth on the top of the support assembly, and a support portion is provided beside the tooth groove of the limiting teeth of at least one support assembly, and the top surface of the support portion is higher than the bottom surface of the tooth groove and lower than the top of the limiting teeth. When the wafer is inserted into the tooth groove, the two side surfaces of the wafer can be limited by the limiting teeth on both sides, and the end face of the wafer is supported on the support portion, that is, the contact point of the wafer when drying is located on the support portion. At the same time, since the support portion is made of water-absorbing material, the residual water on the wafer can be absorbed by the water-absorbing material after flowing to the contact point, which can avoid the problem that the contact point cannot be dried due to direct contact between the wafer and the bottom surface of the tooth groove. The contact points corresponding to the support portion of the support device of the present application do not require a pressure pump for auxiliary drying, and the structure is simple and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for describing the embodiments. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without inventive work.

[0039] Figure 1 It is a structural schematic diagram of a supporting device in the related art;

[0040] Figure 2 yes Figure 1 Side view of;

[0041] Figure 3 It is a structural schematic diagram of a cleaning device in the related art;

[0042] Figure 4 This is a structural diagram of a support device provided in an embodiment of the present application;

[0043] Figure 5 yes Figure 4 A schematic structural diagram of a support assembly partially cut away along a vertical plane parallel to the length direction;

[0044] Figure 6 This is an exploded view of a support device provided in an embodiment of the present application;

[0045] Figure 7 is a schematic structural diagram of a cross section of a support assembly provided in an embodiment of the present application;

[0046] Figure 8 is a schematic diagram of a partial structure of a support assembly as viewed from a first side surface of a limiting plate provided in an embodiment of the present application;

[0047] Figure 9This is a schematic structural diagram of a limit plate provided in an embodiment of the present application;

[0048] Figure 10 is a schematic cross-sectional view of a support device provided by an embodiment of the present application, taken along a plane parallel to the side surface of the wafer;

[0049] Figure 11 yes Figure 10 Schematic diagram of the enlarged structure of part A;

[0050] Figure 12 This is a schematic structural diagram of a splint provided in an embodiment of the present application;

[0051] Figure 13 It is a structural schematic diagram of a cleaning machine provided in an embodiment of the present application.

[0052] The purpose of this application, its features, and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings. The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and the accompanying text are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of this application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0053] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0054] It should be noted that, in this document, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0055] It should be noted that, in this application, the terms "at least one" and "a plurality of" may refer to one, two, three or more than three if there is no conflict in the solutions.

[0056] It should be further understood that the terms "comprising" and "including" indicate the presence of the described features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or", "and / or", "including at least one of the following", etc. used in this application may be interpreted as inclusive, or mean any one or any combination. For example, "including at least one of the following: A, B, C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C", and for another example, "A, B or C" or "A, B and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0057] It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are merely used to distinguish information of the same type from one another. For example, first information could also be referred to as second information, and similarly, second information could also be referred to as first information without departing from the scope of this document. Depending on the context, as used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context indicates otherwise.

[0058] It should be understood that the terms "top", "bottom", "up", "down", "vertical", "horizontal", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0059] For ease of description, the following embodiments are all described using the orthogonal space formed by the horizontal plane and the vertical direction as an example. This premise should not be understood as a limitation to the present application.

[0060] See also Figure 1 and Figure 2 , Figure 1 This is a structural diagram of a supporting device in the related art. Figure 2 yes Figure 1Side view. The support device includes three parallel support plates 10a and a lifting mechanism 20a connected to the same side end surface of the three support plates 10a. The lifting mechanism 20a is fixed to the support plates 10a by bolts 30a. The top surface of the support plates 10a is provided with multiple limiting teeth 11a. The wafer 101a is inserted between two adjacent limiting teeth 11a for positioning, forming three contact points between the wafer 101a and the support device. Figure 3 , Figure 3 This is a structural diagram of a cleaning device in the related art. After the wafer 101a is cleaned, the lifting mechanism 20a raises the wafer 101a above the liquid level. The cleaning device sprays volatile organic solvent vapor such as IPA (isopropyl alcohol) onto the wafer 101a so that the water on the surface of the wafer 101a is replaced by IPA. Finally, an inert gas such as nitrogen is used to blow dry the remaining water between the wafer 101a and the limiting tooth 11a. However, due to the close contact between the wafer 101a and the limiting tooth 11a, it is difficult for nitrogen to enter the contact point for thorough drying. Based on this, the present application provides a support device and a cleaning machine.

[0061] See also Figure 4 and Figure 5 , Figure 4 is a structural diagram of a support device provided in an embodiment of the present application, Figure 5 yes Figure 4 A schematic structural diagram of a support assembly partially cut away along a vertical plane parallel to the length direction. The support device includes: at least two support assemblies 10 arranged opposite to each other. It should be noted that two, three or more support assemblies 10 can be provided. For ease of description, the length direction of the support assembly 10 is defined as a first direction X, and the support assemblies 10 are arranged opposite to each other. For example, the support assemblies 10 are arranged opposite to each other along a second direction Y, and the first direction X and the second direction Y can be orthogonal in the horizontal plane. The support assemblies 10 can be arranged at a certain distance from each other, or a connector 20 can be provided to connect the support assemblies 10 into a whole. The connector 20 can be connected to both ends of the support assembly 10, or it can be connected to the bottom of the support assembly 10. The embodiment of the present application does not specifically limit the specific shape of the connector 20 and the connection method with the support assembly 10.

[0062] The support assembly 10 includes a plurality of limiting teeth 111, which are arranged at the top of the support assembly 10 along the length direction of the support assembly 10 (i.e., the first direction X). A tooth groove 112 is formed between two adjacent limiting teeth 111. The cross-section of the tooth groove 112 can be a regular rectangle, V-shape, trapezoid, etc., or an irregular shape, which is not particularly limited in this embodiment. Among all the support assemblies 10, at least one support assembly 10 also includes a support portion 12, which is made of a water-absorbing material and is arranged beside the tooth groove 112 of the support assembly 10. The support portion 12 can be arranged only on one side of the tooth groove 112, or on both sides of the tooth groove 112. The support portion 12 can be a plurality of support blocks corresponding one-to-one to the tooth groove 112, or it can be an integral support bar or support plate, which is not particularly limited in this embodiment. The top surface of the support portion 12 is higher than the bottom surface of the tooth groove 112 and lower than the top of the limiting tooth 111, and is used to support the end surface of the wafer 101 when the wafer 101 is inserted into the tooth groove 112. In some optional implementations of this embodiment, each support assembly 10 may include a support portion 12.

[0063] After the wafer 101 is cleaned and inserted into the tooth groove 112, the end face of the wafer 101 can be limited by the limiting teeth 111 on both sides, and the support assembly 10 includes a support part 12. Since the top surface of the support part 12 is higher than the bottom surface of the tooth groove 112 and lower than the top of the limiting tooth 111, the end face of the wafer 101 on the support assembly 10 is not directly supported on the bottom surface of the tooth groove 112, but is supported on the support part 12, that is, the contact point of the wafer 101 when drying is located on the support part 12. At the same time, since the support part 12 is made of water-absorbing material, the residual water on the wafer 101 can be absorbed by the support part 12 after flowing to the contact point, and the absorbed water will be transferred to the lower part of the support part 12 due to gravity and discharged, so that the contact point on the wafer 101 corresponding to the support part 12 is dried, which can avoid the problem that the contact point on the wafer 101 directly contacts the bottom surface of the tooth groove 112 and cannot be dried. In the support device of the present application, the contact points corresponding to the support portion 12 do not require a pressure pump for auxiliary drying, and the structure is simple and the cost is low.

[0064] In some embodiments, the water-absorbing material used to make the support portion 12 has a Shore hardness of 55 to 90, for example, between polytetrafluoroethylene (PTFE) and polyetheretherketone (PEEK), so that the support portion 12 can support the wafer 101 without significant deformation. As an example, the surface contact angle of the support portion 12 is preferably greater than 75° to improve the hydrophobicity of the support portion 12 surface. For example, a low surface energy film or coating can be formed on the surface of the support portion 12. As an example, the support portion 12 has a porous structure to drain water absorbed by the support portion 12. For example, the porous structure has a porosity greater than 88% and a pore size of 0.1 to 0.5 μm. For example, the water-absorbing material can be expanded polytetrafluoroethylene or expanded polychlorotrifluoroethylene (PCTFE). The surface hydrophobicity of these materials is better than that of quartz and PTFE, making it difficult for water to adhere to the surface of the support portion 12. At the same time, due to the fine porous structure inside the support portion 12 (similar to a sponge), water can be quickly discharged through the porous structure without accumulating inside the support portion 12.

[0065] Please continue reading Figure 4 and Figure 6 , Figure 6 : is an exploded view of a support device provided in an embodiment of the present application. As an example, the support device further includes a connector 20, which may include a first connecting plate 21 and a second connecting plate 22 disposed opposite each other. The support assembly 10 is disposed parallel to the first connecting plate 21 and the second connecting plate 22, and one end of the support assembly 10 is connected to the first connecting plate 21 and the other end is connected to the second connecting plate 22. The support device of this embodiment has an overall frame structure, which is simple and lightweight.

[0066] As an example, three support assemblies 10 may be provided, each including a support portion 12, with the support assembly 10 located in the middle having the lowest assembly height. This allows the support portions 12 of the three support assemblies 10 to provide three-point support for the end face of the wafer 101 when the wafer 101 is inserted into the tooth groove 112. That is, the corresponding support points of the three support assemblies 10 are located on the circumference of the wafer 101.

[0067] In one embodiment, the present application provides an example of a structural arrangement of a support assembly. Figure 6 and Figure 7 , Figure 7It is a structural schematic diagram of a cross section of a support assembly provided in an embodiment of the present application. In the support device, the support assembly 10 includes a limit plate 11, a support portion 12 and a clamping plate 13. The limit plate 11 includes a first side surface 113 and a second side surface 114 that are arranged opposite to each other, and a top surface connecting the first side surface 113 and the second side surface 114. The first side surface 113 and the second side surface 114 are respectively parallel to the length direction of the support assembly 10. The limit teeth 111 are arranged on the top surface of the limit plate 11. A connecting member 20 can also be provided. The connecting member 20 is connected to the limit plate 11, and each support assembly 10 is connected into a whole through the limit plate 11. The support portion 12 is a water-absorbing material plate, which is arranged on the second side surface 114 of the limit plate 11. The clamping plate 13 is disposed on the side of the support portion 12 away from the limiting plate 11, that is, the support portion 12 is located between the clamping plate 13 and the limiting plate 11. The clamping plate 13 and the limiting plate 11 clamp and fix the support portion 12. The top surface of the support portion 12 is higher than the top surface of the clamping plate 13 and the bottom surface of the tooth groove 112, and lower than the top of the limiting tooth 111. For example, the limiting plate 11, the support portion 12 and the clamping plate 13 can be connected and fixed by a thread-bolt structure, or the limiting plate 11 and the clamping plate 13 can be directly locked to clamp and fix the support portion 12 in the middle.

[0068] In one embodiment, see Figure 7 and Figure 8 , Figure 8 1 is a partial structural diagram of the support assembly provided by an embodiment of the present application as viewed from the first side of the limit plate. The tooth groove 112 is a U-shaped groove, and the bottom of the U-shaped groove is inclined downward from the second side 114 to the first side 113, that is, the bottom of the tooth groove 112 is inclined downward toward the first side 113, forming an inner drainage channel. When water flows downward from the wafer 101, it is absorbed by the support portion 12 and transferred downward along the support portion 12. A part of it can flow into the tooth groove 112, and the bottom of the tooth groove 112 is inclined toward the first side 113, so that the water can be discharged along the first side 113 in time to prevent accumulation in the tooth groove 112.

[0069] In one embodiment, see Figure 7 and Figure 9 , Figure 9This is a schematic structural diagram of a position limiting plate provided in an embodiment of the present application. The second side surface 114 of the position limiting plate 11 includes a stepped surface, that is, the second side surface 114 can be a stepped surface as a whole, or only a portion thereof. The stepped surface includes a first vertical surface 1141, a stepped surface 1142, and a second vertical surface 1143. The stepped surface 1142 extends outward from the lower edge of the first vertical surface 1141, and the second vertical surface 1143 extends downward from the stepped surface 1142. The support portion 12 and the clamping plate 13 are correspondingly arranged on the first vertical surface 1141, and a gap is provided between the lower end surface of the support portion 12 and the stepped surface 1142, and a gap is provided between the lower end surface of the clamping plate 13 and the stepped surface 1142.

[0070] That is, the area of ​​the upper half of the limiting plate 11 corresponding to the first vertical surface 1141 is thinner, while the area of ​​the lower half corresponding to the second vertical surface 1143 is thicker. The two areas of different thickness are transitioned by a step surface 1142. The first vertical surface 1141 is recessed relative to the second vertical surface 1143 to form an assembly and accommodation space for the support portion 12 and the clamping plate 13. Furthermore, because a gap is provided between the lower end surface of the support portion 12 and the step surface 1142, and a gap is provided between the lower end surface of the clamping plate 13 and the step surface 1142, water drawn into the support portion 12 can flow out through the aforementioned gap to form an external drainage channel. Preferably, the step surface 1142 is an inclined surface, with the end located on the first vertical surface 1141 being higher than the end located on the second vertical surface 1143. This allows water to pass through the support portion 12 and ultimately be discharged from the external drainage channel in a timely manner, preventing water from accumulating within the support portion 12 and reducing drying efficiency.

[0071] In one embodiment, see Figure 9 、 Figure 10 and Figure 11 , Figure 10 : is a cross-sectional schematic diagram of a support device provided in an embodiment of the present application, viewed along a plane parallel to the side surface of the wafer. Figure 11 yes Figure 10 Schematic diagram of the enlarged structure of part A in the middle. The limiting plate 11 is provided with a groove 115 on the first vertical surface 1141, and at least two first bosses 116 are provided in the groove 115. The height of the first boss 116 is equal to the depth of the groove 115. The supporting device also includes a connecting bolt 14 corresponding to the first boss 116. The connecting bolt 14 passes through the limiting plate 11 and the support part 12 from the first boss 116 and is connected to the clamping plate 13 so that the limiting plate 11 and the clamping plate 13 clamp and fix the support part 12. It can be understood that connecting holes corresponding to the connecting bolts 14 can be provided on the limiting plate 11, the support part 12 and the clamping plate 13 to achieve the above-mentioned connection.

[0072] In this embodiment, the height of the first boss 116 is equal to the depth of the groove 115, that is, the end face of the first boss 116 is flush with the first vertical surface 1141, so that the support part 12 can be fixed tightly against the first boss 116 and the first vertical surface 1141, and the support part 12 is clamped and shrunk and deformed only in the area corresponding to the first boss 116 and the first vertical surface 1141. The support part 12 is suspended relative to the groove 115 outside the first boss 116, which can prevent the support part 12 from shrinking due to the clamping force of the entire surface, resulting in reduced water absorption and decreased drainage efficiency.

[0073] In one embodiment, see Figure 11 and Figure 12 , Figure 12 This is a schematic diagram of the structure of a clamp provided in an embodiment of the present application. A second boss 131 corresponding to the first boss 116 is provided on the side of the clamp 13 facing the support portion 12. The connecting bolt 14 passes through the second boss 131. A folded edge 132 is provided on the top surface of the clamp 13. The folded edge 132 extends toward one side of the support portion 12, and the length of the extension is equal to the height of the second boss 131.

[0074] In this embodiment, a second boss 131 and a folded edge 132 are provided on the side of the splint 13 facing the support portion 12, and the support portion 12 is clamped by the second boss 131 and the folded edge 132. A gap is provided between the area of ​​the splint 13 other than the second boss 131 and the folded edge 132 and the support portion 12, so as to prevent the support portion 12 from shrinking due to the clamping force of the entire surface, resulting in reduced water absorption and decreased drainage efficiency.

[0075] Please continue to read Figure 6 、 Figure 7 and Figure 12 A notch 133 may be provided between two adjacent second bosses 131 of the clamping plate 13, and the notch 133 is provided along the lower edge of the clamping plate 13. Figure 6 、 Figure 7 and Figure 9 , a through hole 117 can also be provided on the limiting plate 11 to be opposite to the notch 133. By providing the notch 133 and the through hole 117, the support portion 12 can be exposed to the outside, which is conducive to naturally drying the support portion 12 itself without disassembling the support portion 12.

[0076] The present application also provides a drying device, which may include the support device described in the above embodiments. The drying device may be a standalone device, such as a robotic arm that transfers wafers to the drying device for drying after cleaning. The drying principle of the drying device of this embodiment is described in the description of the above embodiments of the support device of this application, and will not be repeated here.

[0077] Please continue reading Figure 13 , Figure 13 1 is a schematic structural diagram of a cleaning machine provided in an embodiment of the present application, wherein the cleaning machine includes a cleaning tank 100, a lifting mechanism 300 and a supporting device 400 as described in the above embodiments.

[0078] The cleaning tank 100 is used to hold the cleaning liquid, which can be pure water. The supporting device 400 is arranged in the cleaning tank 100 and is connected to the lifting mechanism 300 for carrying the wafer 101; the lifting mechanism 300 can drive the supporting device 400 to perform lifting movements, for example, it can drive the supporting device 400 to sink into the cleaning liquid to clean the wafer, and can also drive the supporting device 400 to rise above the liquid level of the cleaning liquid to dry the wafer.

[0079] In one embodiment, the cleaning machine may further include an air blowing device 200, which may be disposed on the top surface of the cleaning tank 100, or on the side surface of the cleaning tank 100, or may be disposed on both the top surface and the side surface of the cleaning tank 100. The air blowing device 200 is used to blow a volatile organic solvent (e.g., isopropyl alcohol, IPA) toward the wafer 101 when the lifting mechanism 300 drives the support device 400 to rise; and to blow an inert gas (e.g., nitrogen) toward the wafer 101 when the lifting mechanism 300 drives the support device 400 to rise above the liquid level of the cleaning solution.

[0080] As an example, the cleaning and drying process of the cleaning machine of this embodiment may include the following steps:

[0081] Step 1: The lifting mechanism 300 drives the supporting device 400 to sink into the cleaning liquid to clean the wafer. Figure 13 Left picture.

[0082] Step 2: After cleaning is completed, the lifting mechanism 300 drives the supporting device 400 to rise, and at the same time controls the blowing device 200 to blow IPA toward the wafer 101. Figure 13 The middle picture.

[0083] Step 3: After the support device 400 rises above the liquid level of the cleaning solution, the blowing device 200 is controlled to blow N2 toward the wafer 101. Figure 13 While blowing N2, the cleaning liquid in the cleaning tank 100 can be discharged.

[0084] The contact points of the wafers in the cleaning machine of the present embodiment can be dried by the support portion 12, eliminating the need to set up a corresponding vacuum pump to blow nitrogen gas for drying the contact points, resulting in a simpler structure. The working principle of the support device in the cleaning machine of this embodiment is described in the description of the various embodiments of the present application, and will not be repeated here.

[0085] The above describes in detail the support device, drying device, and cleaning machine provided by this application. This article uses specific examples to illustrate the principles and implementation methods of this application. It should be noted that in this application, the descriptions of each embodiment have their own emphases. For parts not described or recorded in detail in one embodiment, please refer to the relevant descriptions of other embodiments.

[0086] The various technical features of the technical solution of this application can be combined arbitrarily. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0087] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A support device for supporting a wafer, the support device comprising at least two supporting components arranged opposite to each other, characterized in that: The support assembly includes a plurality of limiting teeth located at the top, the limiting teeth are arranged along the length direction of the support assembly, and a tooth groove is formed between two adjacent limiting teeth; At least one of the support components also includes a support portion arranged beside the tooth groove and made of water-absorbing material; the top surface of the support portion is higher than the bottom surface of the tooth groove and lower than the top of the limiting tooth, and is used to support the end face of the wafer when the wafer is inserted into the tooth groove.

2. The support device according to claim 1, characterized in that The Shore hardness of the support portion is 55 to 90; and / or, The surface contact angle of the support portion is greater than 75°; and / or, The support portion is a porous structure for conducting absorbed water.

3. The supporting device according to claim 2, characterized in that The porosity of the porous structure is greater than 88%, and the pore diameter is 0.1 to 0.5 μm.

4. The supporting device according to claim 2, characterized in that The support portion is made of foamed polytetrafluoroethylene or foamed polychlorotrifluoroethylene.

5. The supporting device according to claim 1, characterized in that The support assembly further comprises: The limiting plate includes a first side surface and a second side surface that are oppositely disposed, and a top surface connecting the first side surface and the second side surface, wherein the first side surface and the second side surface respectively extend along the length direction of the support assembly; wherein the limiting teeth are disposed on the top surface of the limiting plate; and the supporting portion is a water-absorbing material plate, disposed on the second side surface; A clamping plate is provided on a side of the support portion away from the limiting plate, and clamps and fixes the support portion together with the limiting plate, wherein a top surface of the clamping plate is lower than a top surface of the support portion.

6. The supporting device according to claim 5, characterized in that The tooth groove is a U-shaped groove, and the groove bottom of the U-shaped groove is inclined downward from the second side surface to the first side surface.

7. The supporting device according to claim 5, characterized in that: The second side surface includes a stepped surface, the stepped surface including a first vertical surface, a step surface extending outward from a lower edge of the first vertical surface, and a second vertical surface extending downward from the step surface; The support portion and the clamping plate are correspondingly arranged on the first vertical surface, and a gap is provided between the lower end surface of the support portion and the step surface, and a gap is provided between the lower end surface of the clamping plate and the step surface.

8. The supporting device according to claim 7, characterized in that: The step surface is an inclined surface, and one end located on the first vertical surface is higher than one end located on the second vertical surface.

9. The supporting device according to claim 7, characterized in that: The limiting plate is provided with a groove on the first vertical surface, and at least two first bosses are provided in the groove, and the height of the first bosses is equal to the depth of the groove; The support device also includes connecting bolts corresponding to the first bosses one by one. The connecting bolts pass through the limit plate and the support portion from the first boss and are connected to the clamping plate so that the limit plate and the clamping plate clamp and fix the support portion.

10. The supporting device according to claim 9, characterized in that A second boss corresponding to the first boss is provided on one side of the clamping plate facing the supporting portion, and the connecting bolt passes through the second boss; A folded edge is provided on the top surface of the clamping plate, and the folded edge extends toward one side of the supporting portion, and the length of the extension is equal to the height of the second boss.

11. The support device according to claim 10, characterized in that A notch is provided between two adjacent second bosses of the clamping plate, and the notch is provided along the lower edge of the clamping plate.

12. The supporting device according to claim 11, characterized in that The limiting plate is provided with a through hole directly facing the notch.

13. The supporting device according to any one of claims 1 to 12, characterized in that: It also includes a connecting piece, which is connected to the supporting assembly.

14. The supporting device according to claim 13, characterized in that The connecting member includes a first connecting plate and a second connecting plate arranged opposite to each other; The support assembly is arranged in parallel between the first connecting plate and the second connecting plate, and one end of the support assembly is connected to the first connecting plate, and the other end is connected to the second connecting plate.

15. The supporting device according to claim 14, characterized in that There are three support assemblies, and the support assembly in the middle has the lowest assembly height, so that when the wafer is inserted into the tooth groove, the support parts of the three support assemblies form three-point support for the end surface of the wafer.

16. A drying device, characterized in that: The invention comprises the supporting device according to any one of claims 1 to 15.

17. A cleaning machine, characterized in that: It comprises a cleaning tank, a lifting mechanism connected to the cleaning tank, and the supporting device according to any one of claims 1 to 15; The cleaning tank is used to hold cleaning liquid; The supporting device is arranged in the cleaning tank and connected to the lifting mechanism for carrying the wafer; The lifting mechanism is used to drive the supporting device to sink into the cleaning liquid to clean the wafer, and to drive the supporting device to rise above the liquid level of the cleaning liquid to dry the wafer.

18. The cleaning machine according to claim 17, characterized in that Also includes: A blowing device is arranged on the top surface and / or side surface of the cleaning tank. The blowing device is used to blow volatile organic solvents toward the wafers when the lifting mechanism drives the supporting device to rise; and to blow inert gas toward the wafers when the lifting mechanism drives the supporting device to rise above the liquid level of the cleaning liquid.

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