An anti-shake device, a camera module, and a terminal device

By using the memory metal driving structure in the camera, the problem of insufficient driving force caused by the increase in the lens weight is solved, effective compensation for camera shaking is achieved, and shooting clarity is improved.

CN115484361BActive Publication Date: 2025-07-25KUNSHAN Q TECH CO LTD
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Patent Information

Application Number
CN202110662418.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-06-15
Publication Date
2025-07-25
Estimated Expiration
2041-06-15

AI Technical Summary

Technical Problem

In the prior art, as the weight of the lens increases, the driving force of the driving structure is insufficient, and it is impossible to accurately and promptly drive the lens to the jitter compensation position, affecting the shooting clarity of the camera.

Method used

The memory metal drive structure is adopted, and the photosensitive component is connected to the base through the photosensitive component, and the photosensitive component is driven to move by the deformation force of the memory metal to compensate for the camera jitter.

Benefits of technology

Even if the lens weight increases, the memory metal driving structure can still effectively drive the photosensitive component, improve the camera's shooting clarity, and avoid the problem of insufficient driving force.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses an anti-shake device, a camera module, and a terminal device, which relate to the field of camera technology, and solve the technical problem in the prior art that when a driving structure drives a lens for anti-shake, as the weight of the lens increases, the driving force of the driving structure is insufficient, and the lens cannot be accurately and timely driven to the shake compensation position. The anti-shake device includes a photosensitive component; a base; and a shape memory alloy driving structure, where the shape memory alloy driving structure is arranged on the base; wherein, the photosensitive component is arranged on the shape memory alloy driving structure, and the shape memory alloy driving structure can drive the photosensitive component to move after being powered on. The anti-shake device provided by the present invention drives the photosensitive component to move through the arranged driving component for anti-shake, avoiding the technical problem in the prior art that due to the increase in the weight of the lens, the driving force of the driving structure is insufficient, and the lens cannot be accurately driven to the shake compensation position.
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Description

Technical Field

[0001] The present invention relates to the technical field of cameras, and more specifically, to an anti-shake device, a camera module, and a terminal device. Background Art

[0002] When a camera takes a picture, it is inevitable that the camera shakes, which affects the clarity of the captured image. Therefore, a driving structure is provided in the camera to drive the lens to displace in the opposite direction of the camera shake to achieve shake compensation and improve the clarity of the captured image.

[0003] However, as people's requirements for pixels are getting higher and higher, the volume of the lens has to be made larger and larger, resulting in an increase in the weight of the lens, which requires a higher driving force for the driving structure. Naturally, the size of the driving structure is getting larger and larger. In practice, the larger the driving structure, the higher the failure ratio of the camera reliability, that is, there is a problem that the driving structure cannot accurately and timely drive the lens to the shake compensation position due to insufficient driving force, and the larger the driving structure is also contrary to the requirements of the camera. Summary of the Invention

[0004] In view of this, an object of the present invention is to overcome the deficiencies of the prior art. In a first aspect, an anti-shake device is provided to solve the technical problem in the prior art that the driving structure drives the lens to prevent shake, and as the weight of the lens increases, the driving force of the driving structure is insufficient, and the lens cannot be accurately and timely driven to the shake compensation position.

[0005] The technical solution adopted by the present invention to solve this technical problem is:

[0006] An anti-shake device includes:

[0007] A photosensitive component;

[0008] A base; and,

[0009] A shape memory metal driving structure disposed on the base;

[0010] Wherein, the photosensitive component is disposed on the shape memory metal driving structure, and the shape memory metal driving structure can drive the photosensitive component to move after being powered on.

[0011] Optionally, the shape memory metal driving structure includes a first elastic component and a first shape memory metal component. The first shape memory metal component includes a first shape memory metal. The photosensitive component is disposed on the first elastic component. Two ends of the first shape memory metal are respectively connected to the base and the first elastic component. After the first shape memory metal is powered on, it drives the first elastic component to drive the photosensitive component to twist relative to the base, and the photosensitive component is reset through the first elastic component.

[0012] Optionally, the shape memory metal driving structure further includes a first substrate for carrying the photosensitive component. The first substrate is fixedly connected to the first elastic component, and the photosensitive component is disposed on the first substrate.

[0013] Optionally, the shape memory metal driving structure further includes a second shape memory metal component and a sixth elastic component. One end of the sixth elastic component is fixedly connected to the first substrate, and the second shape memory metal component is connected between the first substrate and the sixth elastic component. The second shape memory metal component drives the photosensitive component to translate relative to the base, and the photosensitive component is reset by the sixth elastic component.

[0014] Optionally, the shape memory metal driving structure further includes a second substrate for carrying the photosensitive component. The second substrate is placed on the sixth elastic component, and the photosensitive component is fixedly placed on the second substrate.

[0015] Optionally, the second shape memory metal component includes a second shape memory metal. Two ends of the second shape memory metal are respectively connected to the first substrate and the sixth elastic component. After the second shape memory metal is powered on, it drives the photosensitive component to translate relative to the base; and / or,

[0016] The second shape memory metal component includes a third shape memory metal. An included angle exists between the third shape memory metal and the second shape memory metal. Two ends of the third shape memory metal are respectively connected to the first substrate and the sixth elastic component. After the third shape memory metal is powered on, it drives the photosensitive component to translate relative to the base.

[0017] Optionally, the anti-shake device further includes a protective shell. The protective shell is fixedly connected to the base. The shape memory metal driving structure is located inside the protective shell, and there is a gap between the shape memory metal driving structure and the inner side wall of the protective shell.

[0018] Optionally, the photosensitive component includes a circuit board and an imaging chip. The imaging chip is fixedly connected to one end of the circuit board, and the projection of the imaging chip is within the projection range of the base.

[0019] Optionally, a hollowed-out part is formed at one end of the circuit board connected to the imaging chip, and the circuit board is bent at the hollowed-out part to form a side-standing structure.

[0020] Optionally, the hollowed-out part includes a first hollowed-out groove and a second hollowed-out groove respectively formed on two sides of the circuit board, and a third hollowed-out groove formed near the other end of the circuit board. The third hollowed-out groove communicates with the first hollowed-out groove and the second hollowed-out groove.

[0021] Optionally, the circuit board is bent at the first hollow groove position to form a first side body, the circuit board is bent at the second hollow groove position to form a second side body, and the circuit board is bent at the third hollow groove position to form a third side body. The first side body, the second side body, and the third side body constitute the side-standing structure.

[0022] Optionally, the first side body, the second side body, and the third side body are all perpendicular to the base, and the third side body is perpendicular to the first side body and the second side body.

[0023] Optionally, a fixing bracket for fixing the imaging chip is provided between the imaging chip and the circuit board, and the fixing bracket is provided with an extension part for preventing the side-standing structure from tipping over.

[0024] Optionally, the circuit board is a flexible circuit board, and the projection of the end of the circuit board having the side-standing structure is within the projection range of the base.

[0025] In a second aspect, the present invention provides a camera module, including a lens and the above-mentioned anti-shake device. The image signal obtained by the lens is transmitted to the photosensitive component, and the shape memory metal drives the photosensitive component to move to compensate for the shake of the camera module.

[0026] In a third aspect, the present invention provides a terminal device, including a main board and the above-mentioned anti-shake device or camera module, and the anti-shake device or the camera module is connected to the main board.

[0027] Compared with the prior art, the beneficial effects of the drive structure provided by the present invention are as follows:

[0028] The shape memory metal drive structure provided by the present invention on the base can drive the photosensitive component arranged on the shape memory metal drive structure to move after being powered on. When the camera shakes, the shape memory metal drive structure can drive the photosensitive component to move in the direction opposite to the shake of the camera to compensate for the shake of the camera and improve the clarity of the image captured by the camera. Moreover, even as the pixel increases and the volume and weight of the lens increase, since the shape memory metal drive structure drives the photosensitive component, the volume and weight of the photosensitive component do not change, thereby effectively avoiding the technical problem in the prior art that due to the increase in the weight of the lens, the driving force of the drive structure is insufficient and the lens cannot be accurately driven to the shake compensation position. Description of the Drawings

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0030] Figure 1 is the top view of some components of the anti-shake device of the present invention;

[0031] Figure 2 is the exploded view of the anti-shake device of the present invention;

[0032] Figure 3 is Figure 2 the enlarged view of part A in

[0033] Figure 4 is the axonometric view of the second substrate in the anti-shake device of the present invention;

[0034] Figure 5 is the top view of some components of the anti-shake device of the present invention without the second substrate;

[0035] Figure 6 is the top view of some components of the anti-shake device of the present invention after the second substrate is provided;

[0036] Figure 7 is the axonometric view of the complete structure of the anti-shake device of the present invention;

[0037] Figure 8 is the axonometric view of some components related to the base metal circuit of the anti-shake device of the present invention;

[0038] Figure 9 is the top view of the anti-shake device of the present invention designed with the base metal circuit;

[0039] Figure 10 is the axonometric view of the circuit board of the anti-shake device of the present invention;

[0040] Figure 11 is the exploded view of the camera module of the present invention;

[0041] Figure 12 is the sectional view of the camera module of the present invention.

[0042] In the figure:

[0043] 10 - Base, 11 - Support member, 12 - Protective case, 13 - First metal circuit, 14 - Second metal circuit, 15 - Third metal circuit, 16 - Fourth metal circuit, 17 - Fifth metal circuit, 18 - Sixth metal circuit, 19 - Seventh metal circuit, 20 - First shape memory metal, 30 - First elastic component, 31 - Fixing member, 32 - First elastic member, 33 - Torsion member, 34 - First side, 35 - Second side, 36 - First extension block, 37 - Second extension block, 40 - Second elastic component, 50 - Third elastic component, 60 - Fourth elastic component, 70 - Fifth elastic component, 80 - First substrate, 81 - First chamfer structure, 82 - Second chamfer structure, 83 - Support platform, 84 - First connecting member, 84A - First strip-shaped block, 84B - Second strip-shaped block, 85 - Second connecting member, 85A - Third strip-shaped block, 85B - Fourth strip-shaped block, 90 - Second shape memory metal, 91 - Third shape memory metal, 92 - Fourth shape memory metal, 93 - Fifth shape memory metal, 100 - Sixth elastic component, 100A - Elastic main body, 100B - Movable end, 101 - First connecting portion, 102 - First elastic body, 103 - Second elastic body, 104 - Bending structure, 105 - Second connecting block, 106 - First connecting block, 107 - Circular portion, 110 - Second substrate, 111 - First bending portion, 112 - Second bending portion, 113 - Third bending portion, 114 - Fourth bending portion, 120 - Circuit board, 121 - Pin socket, 122 - First hollow groove, 123 - Second hollow groove, 124 - Third hollow groove, 125 - Placing groove, 126 - First side body, 127 - Second side body, 128 - Third side body, 130 - Fixing bracket, 131 - Extension portion, 140 - Imaging chip, 150 - Filter, 160 - Driving motor, 161 - Placing hole, 170 - Lens, 180 - Outer cover, 181 - Through hole. Detailed implementation manner

[0044] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation manners obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0045] As is well known, shape memory metal refers to a special metal material that undergoes plastic deformation within a certain temperature range and can restore its original macroscopic shape within another temperature range.

[0046] Embodiment 1:

[0047] This embodiment provides an anti-shake device. Refer to Figure 1As shown, the anti-shake device includes a base 10. The base 10 includes, but is not limited to, a square shape. As is well known, the base 10 is a component for carrying the entire camera. Therefore, the shape of the base 10 is usually designed according to the position where the camera needs to be installed. For example, the base 10 can also be circular or the like. Inside the base 10, several metal circuits are embedded using, but not limited to, in-mold injection molding technology to provide current for the components placed on the base 10, which can avoid setting metal circuits at other positions of the camera, reduce the volume of the camera, and save the space occupied by the camera.

[0048] Referring to Figure 1 As shown, the anti-shake device includes a shape memory alloy drive structure, and the shape memory alloy drive structure includes an elastic component. Specifically, five elastic components are arranged at intervals on the upper end surface of the base 10, namely a first elastic component 30, a second elastic component 40, a third elastic component 50, a fourth elastic component 60, and a fifth elastic component 70. Each elastic component includes a fixing member 31 fixed around the central position of the base 10. The fixing member 31 includes, but is not limited to, a fan shape, and the fixing member 31 is made of a metal material or other conductive materials. It can be understood that the volume of the camera itself is small, so the volumes of the components involved inside the camera are also relatively small. Setting the fixing member 31 in a fan shape is more conducive to fixing the fixing member 31 on the base 10. When using glue bonding, there is enough area between the fixing member 31 and the base 10 for arranging the glue. Of course, to achieve this purpose, setting the fixing member 31 in other shapes, such as a strip shape or a circular shape, is also a feasible implementation.

[0049] Referring to Figure 1 As shown, a first elastic member 32 for forming an elastic component is connected to the side wall of the fixing member 31 close to the center of the base 10, and the included angle between adjacent two first elastic members 32 is 72 degrees. The first elastic member 32 includes, but is not limited to, a leaf spring, and can also be a spring or a leaf spring, etc. Moreover, the first elastic member 32 is made of a metal material or other conductive materials. It can be understood that the longer the length of an elastic member, the smaller the force required to make the elastic member yield when a force is applied to the end of the elastic member. To ensure that the first elastic member 32 is easily yieldable, that is, to ensure that the first elastic member 32 has enough length in a narrow space, for this reason, there is a gap between the side wall of the end of the first elastic member 32 connected to the fixing member 31 and the side wall of the fixing member 31, so that there is an overlapping area between the first elastic member 32 and the fixing member 31 to achieve the purpose of lengthening the first elastic member 32.

[0050] Referring to Figure 1As shown, one end of the first elastic member 32 away from the fixing member 31 is connected with a torsion member 33 for forming an elastic assembly. The torsion members 33 of the five elastic assemblies on the base 10 form a shape including but not limited to a square. There is a gap between adjacent two torsion members 33. And the torsion member 33 is made of a metal material or other conductive materials. At the same time, the torsion members 33 of the first elastic assembly 30 and the second elastic assembly 40 on the same side of the base 10 are located on two side edges in a parallel relationship, that is, a first extension block 36 and a second extension block 37 for conveniently applying a driving force to the torsion member 33 are respectively arranged on the first side edge 34 and the second side edge 35. It can be understood that when a driving force is applied to the torsion member 33, the torsion member 33 will twist and the first elastic member 32 will be bent by yielding and thus have elasticity. When the driving force on the torsion member 33 is withdrawn, under the action of the elasticity of the first elastic member 32, the torsion member 33 can return to its initial position.

[0051] In addition, referring to Figure 2 As shown, in order to reduce the friction force between the torsion member 33 and the base 10, four support members 11 (including but not limited to four support members arranged around the base 10) are further arranged between the torsion member 33 and the base 10. The support member 11 includes but is not limited to a cylinder. For example, it can also be a square block, etc.

[0052] In this embodiment, referring to Figure 1 and Figure 2 As shown, the shape memory metal driving structure further includes a first shape memory metal driving assembly and a first substrate 80. The first shape memory metal assembly includes a first shape memory metal 20. Specifically, at the positions of the first side edge 34 and the second side edge 35 on the end face of the base 10, two first shape memory metals 20 of equal length and parallel to each other are arranged. The first shape memory metal 20 includes but is not limited to a nickel-titanium alloy, and can also be a gold-cadmium alloy or an indium-thallium alloy, etc. The two first shape memory metals 20 both include but are not limited to being in a long roller shape. For example, they can also be in a long strip shape. One end of each of the two first shape memory metals 20 is fixedly connected to the base 10, and the other ends of the two first shape memory metals 20 are respectively fixed to the first extension block 36 and the second extension block 37. Obviously, by arranging the first extension block 36 and the second extension block 37, the two first shape memory metals 20 can be conveniently arranged in parallel. The purpose of arranging the two first shape memory metals 20 in parallel is to more precisely utilize the deformation force generated after the two first shape memory metals 20 are electrified to drive the first elastic assembly 30 and the second elastic assembly 40 to twist, and it is easier to control.

[0053] Specifically, if the two first shape memory metals 20 are not parallel to each other, and the first shape memory metal 20 located on the first side 34 is not parallel to the first side 34, and the first shape memory metal 20 located on the second side 35 is not parallel to the second side 35, as can be understood by those skilled in the art, when the deformation forces generated after the two first shape memory metals 20 are energized act on the first elastic component 30 and the second elastic component 40, they will be dispersed, so that the torsional displacements generated by the torsion members 33 in the first elastic component 30 and the torsion members 33 in the second elastic component 40 are not consistent, which is not conducive to precise control.

[0054] Referring to Figure 8 and Figure 9 As shown, a first metal circuit 13, a second metal circuit 14, a third metal circuit 15, a fourth metal circuit 16, a fifth metal circuit 17, a sixth metal circuit 18, and a seventh metal circuit 19 are sequentially arranged in the base 10 to provide current for the components placed on the base 10.

[0055] In this embodiment, referring to Figure 2 , Figure 8 and Figure 9 As shown, specifically, the second metal circuit 14 in the base 10 is electrically connected to the first shape memory metal 20 located at the first side 34. The fifth metal circuit 17 in the base 10 is electrically connected to the fixing member 31 in the first elastic component 30 to form a current loop, facilitating the provision of the required current for the first shape memory metal 20 located at the first side 34; at the same time, the first metal circuit 13 in the base 10 is electrically connected to the first shape memory metal 20 located at the second side 35, and the seventh metal circuit 19 in the base 10 is electrically connected to the fixing member 31 in the second elastic component 40 to form a current loop, facilitating the provision of the required current for the first shape memory metal 20 located at the second side 35.

[0056] In addition, the connection relationships of the other metal circuits in the base 10 are that the third metal circuit 15 is electrically connected to the fixing member 31 in the fourth elastic component 60, the fourth metal circuit 16 is electrically connected to the fixing member 31 in the fifth elastic component 70, and the sixth metal circuit 18 is electrically connected to the fixing member 31 in the third elastic component 50.

[0057] Referring to Figure 2As shown, the anti-shake device further includes a first substrate 80. The end faces of the torsion members 33 in the first elastic component 30 and the second elastic component 40, which are away from the base 10, are fixedly connected to the first substrate 80. The end faces of the torsion members 33 in the third elastic component 50, the fourth elastic component 60, and the fifth elastic component 70, which are away from the base 10, are in contact with the first substrate 80 to support the first substrate 80 and prevent the first substrate 80 from tipping up when it is only placed on the torsion members 33 of the first elastic component 30 and the second elastic component 40. The first substrate 80 includes, but is not limited to, a square shape, and the first substrate 80 is made of a metal material or other conductive materials. In addition, the first substrate 80 is coaxially arranged with the base 10.

[0058] Furthermore, referring to Figure 2 and Figure 5 As shown, a first chamfer structure 81 and a second chamfer structure 82 are respectively provided at a pair of corner positions of the first substrate 80 that are in a relative relationship. A first connecting member 84 and a second connecting member 85 that extend beyond the periphery of the first substrate 80 are connected to another pair of corner positions of the first substrate 80 that are in a relative relationship. At the same time, on the end face of the first substrate 80 away from the elastic components provided on the base 10, four support platforms 83 are also provided near the four corners of the first substrate 80. The shape of the support platforms 83 includes, but is not limited to, a cylindrical shape, and can also be a cubic shape, etc.

[0059] Specifically, referring to Figure 2 , Figure 3 and Figure 5 As shown, the first connecting member 84 includes a first strip-shaped block 84A and a second strip-shaped block 84B. The end face of the first strip-shaped block 84A is connected to the end side wall of the second strip-shaped block 84B. The end face at the corner position of the first connecting member 84 is connected to the first substrate 80. Among them, the side wall of the first strip-shaped block 84A is perpendicular to the side wall of the first substrate 80 that the first strip-shaped block 84A is close to, and the side wall of the second strip-shaped block 84B is perpendicular to the side wall of the first substrate 80 that the second strip-shaped block 84B is close to.

[0060] The second connecting member 85 includes a third strip-shaped block 85A and a fourth strip-shaped block 85B. The end face of the third strip-shaped block 85A is connected to the end side wall of the fourth strip-shaped block 85B. Among them, the side wall of the third strip-shaped block 85A is perpendicular to the side wall of the first substrate 80 that the third strip-shaped block 85A is close to, and the side wall of the fourth strip-shaped block 85B is perpendicular to the side wall of the first substrate 80 that the fourth strip-shaped block 85B is close to.

[0061] Please refer to Figure 1 and Figure 5As shown, it can be understood that by applying an electric current to the first shape memory metal 20 at the first side 34, after being energized, it deforms and extends to generate a deformation force. Since one end of the first shape memory metal 20 at the first side 34 is fixed to the base 10. Therefore, the deformation force generated by the deformation and extension of the first shape memory metal 20 at the first side 34 will act on the first extension block 36, thereby driving the torsion member 33 in the first elastic component 30. Through the first elastic member 32 of the first elastic component 30, it twists around the fixed member 31 in the first elastic component 30 to generate a torsional displacement, and the first elastic member 32 of the first elastic component 30 is yielded to generate a yield force.

[0062] Meanwhile, by applying an electric current to the first shape memory metal 20 at the second side 35, after being energized, it deforms and contracts to generate a deformation force. Since one end of the first shape memory metal 20 at the second side 35 is fixed to the base 10. Therefore, the deformation force generated by the deformation and contraction of the first shape memory metal 20 at the second side 35 will act on the second extension block 37, thereby driving the torsion member 33 in the second elastic component 40. Through the first elastic member 32 of the second elastic component 40, it twists around the fixed member 31 in the second elastic component 40 to generate a torsional displacement, and the first elastic member 32 of the second elastic component 30 is yielded to generate a yield force.

[0063] Referring to Figure 2 and Figure 5 As shown, since the first substrate 80 is fixed to the torsion members 33 of the first elastic component 30 and the second elastic component 40, therefore, when the two first shape memory metals 20 respectively drive the torsion members 33 of the first elastic component 30 and the second elastic component 40 to generate torsional displacements, the first substrate 80 will undergo a torsional displacement.

[0064] In this embodiment, to achieve the torsion of the first substrate 80, it includes but is not limited to the above methods. For example, it can be understood that only one of the two first shape memory metals 20 can also be retained. For example, only the first shape memory metal 20 at the first side 34 is retained, and it drives the torsion member 33 of the first elastic component 30 to twist, and it can still achieve driving the first substrate 80 to twist. Or two first shape memory metals 20 are provided at both the first side 34 and the second side 35 to enhance the driving force, which is also a feasible implementation method.

[0065] In addition, please refer to Figure 1 and Figure 5As shown, the first shape memory metal 20 at the position of the second side 35 can also be changed to be connected to the torsion member 33 in the third elastic component 50. That is, the two first shape memory metals 20 are respectively connected to the elastic components in a diagonal relationship, which is also a feasible implementation. In addition, after those skilled in the art understand the principle of the present invention, connecting a first shape memory metal 20 to the torsion member 33 in each of the first elastic component 30, the second elastic component 40, the third elastic component 50, and the fourth elastic component 60 to drive the first substrate 80 to twist is also a feasible implementation. Of course, the torsion members 33 in the elastic components for driving the first substrate 80 should all be fixedly connected to the first substrate 80.

[0066] Obviously, the first elastic members 32 provided in both the first elastic component 30 and the second elastic component 40 are beneficial for the torsion member 33 to reset so that the first substrate 80 can be reset. Moreover, the first substrate 80 can have a torsion axis.

[0067] In this embodiment, the ways to twist the first substrate 80 include but are not limited to the above-mentioned methods. For example, a rotating shaft can be provided between the axis of the base 10 and the first substrate 80, and a torsion spring can be sleeved on the rotating shaft. The two first shape memory metals 20 are directly connected to the first substrate 80. Of course, when one end of the first shape memory metal 20 is connected to the first substrate 80 in this way of driving the first substrate 80 to twist, it is necessary to avoid directly connecting to the symmetric center of the first substrate 20. The symmetric center means that if a figure can coincide with another figure after rotating 180 degrees around a certain point, then it means that these two figures are symmetric about this point, and this point is called the symmetric center. That is, in this way, the first shape memory metal 20 is fixed at the end of the first substrate 20 at a non-symmetric center to avoid the situation where the first shape memory metal 20 cannot drive the first substrate 80 to twist. This is also a feasible implementation that can drive the first substrate 80 to twist and also enable the first substrate 80 to be reset.

[0068] Refer to Figure 4 、 Figure 5 and Figure 6As shown, the shape memory alloy drive structure further includes a second substrate 110 and a sixth elastic component 100. Specifically, a square second substrate 110 is placed on the end faces of the four support platforms 83 away from the first substrate 80, and the end face of the second substrate 110 is in contact with the end faces of the four support platforms 83. The side walls of the second substrate 110 at two corner positions away from the first connecting member 84 and the second connecting member 85 both have bending structures facing the first substrate 80, namely, a first bending portion 111, a second bending portion 112, a third bending portion 113, and a fourth bending portion 114. There are gaps between the four bending structures and the first substrate 80. It can be understood that by providing the first chamfering structure 81 and the second chamfering structure 82 on the first substrate 80, interference between the first bending portion 111, the second bending portion 112, the third bending portion 113, and the fourth bending portion 114 and the first substrate 80 can be avoided.

[0069] Referring to Figure 2 , Figure 3 and Figure 5 As shown, four sixth elastic components 100 are provided between the first substrate 80 and the second substrate 110. Each sixth elastic component 100 includes a first connecting portion 101 and a movable end 100B. An elastic main body 100A is provided between the first connecting portion 101 and the movable end 100B. The movable end 100B includes a first connecting block 106, a second connecting block 105, and a circular portion 107. Specifically, the first connecting portion 101 is cube-shaped. The elastic main body 100A is a bent body. The elastic main body 100A includes a first elastic body 102, a second elastic body 103, and a bending structure 104. One end of the first elastic body 102 is connected to the end side wall of the first connecting portion 101, and the other end of the first elastic body 102 is connected to the end of the second elastic body 103 through the bending structure 104. Among them, the arc surface of the bending structure 104 faces the first connecting portion 101. The axis of the first elastic body 102 in the length direction is perpendicular to the axis of the first connecting portion 101 in the length direction. The first elastic body 102, the second elastic body 103, and the bending structure 104 have an upper end face located in the same plane and a lower end face located in the same plane.

[0070] Referring to Figure 3 and Figure 5As shown, the end of the second elastic body 103 not connected to the bending structure 104 is connected to the second connecting block 105, and the second connecting block 105 is in a square shape. In addition, the axis of the second connecting block 105 in the length direction is parallel to the axis of the first elastic body 102 in the length direction, and the end of the second connecting block 105 not connected to the second elastic body 103 is connected to a circular portion 107, the diameter of the circular portion 107 is greater than the length of the end face of the end of the second connecting block 105, and the axis of the second connecting block 105 in the length direction and the center of the circular portion 107 are located on the same straight line, and the circular portion 107, the second connecting block 105 and the second elastic member have an upper end face located in the same plane and a lower end face located in the same plane.

[0071] Reference Figure 3 As shown, the side wall of the second connecting block 105 facing away from the first connecting part 101 is connected to the first connecting block 106, and the first connecting block 106 includes but is not limited to a cube shape. The first connecting block 106 and the second connecting block 105 are arranged vertically, and the first connecting block 106 and the second connecting block 105 have upper end surfaces located in the same plane and lower end surfaces located in the same plane.

[0072] Reference Figure 6 As shown, two sixth elastic components 100 are respectively arranged at the first bending portion 111 and the second bending portion 112, wherein the end face of the first connecting portion 101 of one sixth elastic component 100 is fixedly connected to the end face of the first substrate 80, and the side wall of its circular portion 107 abuts against the side wall of the first bending portion 111 by extruding the elastic body 100A; the end face of the first connecting portion 101 of the other sixth elastic component 100 is fixedly connected to the end face of the first substrate 80, and the side wall of its circular portion 107 abuts against the side wall of the second bending portion 112 by extruding the elastic body 100A.

[0073] Reference Figure 6 As shown, the other two sixth elastic components 100 are respectively arranged at the third bending structure 104 and the fourth bending structure 104. The end face of the first connecting portion 101 of one of the sixth elastic components 100 is fixedly connected to the end face of the first substrate 80, and the side wall of the circular portion 107 abuts against the side wall of the third bending portion 113 by squeezing the elastic body 100A; the end face of the first connecting portion 101 of the other sixth elastic component 100 is fixedly connected to the end face of the first substrate 80, and the side wall of the circular portion 107 abuts against the side wall of the fourth bending portion 114 by squeezing the elastic body 100A.

[0074] It is clear that referring to Figure 6 As shown, by arranging the four sixth elastic components 100 , the second substrate 110 can remain stable when not acted upon by external forces, so that the second substrate 110 will not lose contact with the four support platforms 83 .

[0075] Specifically, if you only set Figure 6 The second substrate 110 will be torsionally displaced counterclockwise around the axis of the second substrate 110 under the elastic force of the upper and lower sixth elastic components 100; if only the sixth elastic components 100 are provided, the second substrate 110 will be torsionally displaced counterclockwise around the axis of the second substrate 110 under the elastic force of the upper and lower sixth elastic components 100; Figure 6 The second substrate 110 will undergo a clockwise torsional displacement around the axis of the second substrate 100 under the elastic force of the left and right sixth elastic components 100. However, the present invention provides four sixth elastic components 100, so that the elastic forces of the upper and lower elastic components 100 and the left and right elastic components 100 in driving the second substrate 110 counterclockwise and clockwise are balanced. However, the elastic forces of the four elastic components 100 do not disappear and still act on the second substrate 110, thereby maintaining the stability of the second substrate 110.

[0076] Of course, those skilled in the art know that the force applied by the squeezed elastic body 100A in the four sixth elastic components 100 to the second substrate 110 should satisfy the condition that the second substrate 110 does not lose contact with the four support platforms 83. For example, if the force applied by the squeezed elastic body 100A in the four sixth elastic components 100 to the second substrate 110 is too small, when the camera is in different states, such as vertical, the second substrate 110 undergoes relative displacement with one or more of the sixth elastic components 100 under the action of its own gravity, which is not a suitable implementation.

[0077] Reference Figure 5 and Figure 6 As shown, a second memory metal 90 is connected between the second bar block 84B and the first connecting block 106 of the sixth elastic component 100 abutting against the side wall of the first bending portion 111. A third memory metal 91 is connected between the third bar block 85A and the first connecting block 106 of the sixth elastic component 100 abutting against the side wall of the second bending portion 112. A fourth memory metal 92 is connected between the second bar block 84B and the first connecting block 106 of the sixth elastic component 100 abutting against the side wall of the fourth bending portion 114. A fifth memory metal 93 is connected between the fourth bar block 85B and the first connecting block 106 of the sixth elastic component 100 abutting against the side wall of the third bending structure 104. Among them, the second memory metal 90 and the fifth memory metal 93 are equal in length and arranged in parallel, the third memory metal 91 and the fourth memory metal 92 are equal in length and arranged in parallel, and the angle between the second memory metal 90 and the third memory metal 91 is 90 degrees. Furthermore, the axis of the third memory metal 91 in the length direction is perpendicular to the side wall of the first strip block 84A.

[0078] Reference Figure 9As shown, current flows from the fifth metal line 17, through the first elastic component 30, the first substrate 80, the second shape memory metal 90, and the sixth elastic component 100 near the first bending portion 111, and then passes through the first substrate 80 again, passes through the second elastic component 40, and then returns to the seventh metal line 19 to form a current loop to provide current for the second shape memory metal 90.

[0079] Refer to Figure 9 As shown, current flows from the sixth metal line 18, through the third elastic component 50, the first substrate 80, the third shape memory metal 91, and the sixth elastic component 100 near the second bending portion 112, and then passes through the first substrate 80 again, passes through the second elastic component 40, and then returns to the seventh metal line 19 to form a current loop to provide current for the third shape memory metal 91.

[0080] Refer to Figure 9 As shown, current flows from the fifth metal line 17, through the first elastic component 30, the first substrate 80, the fourth shape memory metal 92, and the sixth elastic component 100 near the fourth bending portion 114, and then passes through the first substrate 80 again, passes through the fifth elastic component 70, and then returns to the fourth metal line 16 to form a current loop to provide current for the fourth shape memory metal 92.

[0081] Refer to Figure 9 As shown, current flows from the sixth metal line 18, through the third elastic component 50, the first substrate 80, the fifth shape memory metal 93, and the sixth elastic component 100 near the third bending portion 113, and then passes through the first substrate 80 again, passes through the fifth elastic component 70, and then returns to the fourth metal line 16 to form a current loop to provide current for the fifth shape memory metal 93.

[0082] Refer to Figure 9 As shown, it can be understood that the force causing deformation after the second shape memory metal 90 and the fifth shape memory metal 93 are energized drives the second substrate 110 to translate in the length direction of the second shape memory metal 90. For example, current is provided for the second shape memory metal 90 so that the second shape memory metal 90 deforms and extends to generate a deformation force. Since one end of the second shape memory metal 90 is fixed to the second strip-shaped block 84B, therefore, the force causing the second shape memory metal 90 to deform will act on the sixth elastic component 100 near the second shape memory metal 90, causing the sixth elastic component 100 near the second shape memory metal 90 to be stretched and extended. Since the sixth elastic component 100 near the second shape memory metal 90 abuts against the second substrate 110, therefore, when the sixth elastic component 100 near the second shape memory metal 90 extends, it can drive the second substrate 110 to move.

[0083] Meanwhile, current is provided to the fifth shape memory metal 93 to cause the fifth shape memory metal 93 to deform and shorten to generate a deformation force. Since one end of the fifth shape memory metal 93 is fixed to the fourth strip 85B, the force generated by the deformation of the fifth shape memory metal 93 will act on the sixth elastic component 100 near the fifth shape memory metal 93, causing the sixth elastic component 100 near the fifth shape memory metal 93 to be compressed and shortened. Since the sixth elastic component 100 near the fifth shape memory metal 93 abuts against the second substrate 110, the sixth elastic component 100 near the fifth shape memory metal 90 can drive the second substrate 110 to move when it is compressed. Moreover, the direction in which the fifth shape memory metal 93 drives the second substrate 110 to translate by compression deformation is the same as the direction in which the second shape memory metal 90 drives the second substrate 110 to translate. Obviously, by simultaneously driving the second substrate 110 by the second shape memory metal 90 and the fifth shape memory metal 93, the stability of the second substrate 110 during translation along the length direction of the second shape memory metal 90 can be ensured.

[0084] Of course, the current supplied to the second shape memory metal 90 and the fifth shape memory metal 93 should also be the same to ensure that the driving forces generated by the deformation of the second shape memory metal 90 and the fifth shape memory metal 93 after being energized are the same, so as to avoid the second substrate 110 from undergoing a torsional movement due to inconsistent driving forces generated by the second shape memory metal 90 and the fifth shape memory metal 93. For example, if the current supplied to the second shape memory metal 90 is much greater than the current supplied to the fifth shape memory metal 93, then the force that finally drives the second substrate 110 to translate by the second shape memory metal 90 will necessarily be greater than the force that drives the second substrate 110 to translate by the fifth shape memory metal 93, resulting in uneven stress on the second substrate 110, instability during translation of the second substrate 110, and a certain torsional displacement, which affects the accuracy of the second substrate 110 during translation.

[0085] Here, it must be emphasized that, by providing two sixth elastic components 100 close to the second shape memory metal 90 and the fifth shape memory metal 93, on the one hand, the present invention can not only drive the second substrate 110 to reset after power-off of the second shape memory metal 90 and the fifth shape memory metal 93, ensuring the reset accuracy of the second substrate 110. Additionally, in practice, the currents flowing to the second shape memory metal 90 and the fifth shape memory metal 93 are not exactly the same, that is, when powered simultaneously, the amount of electricity obtained by the second shape memory metal 90 may be greater than that of the fifth shape memory metal 93. At this time, the deformation amounts of the second shape memory metal 90 and the fifth shape memory metal 93 are inconsistent, resulting in the displacement amount of the second substrate 110 driven by the second shape memory metal 90 being too large and too fast, causing the second substrate 110 to twist. In the present invention, due to the sixth elastic component 100 provided close to the second shape memory metal 90, since the sixth elastic component 100 provided close to the second shape memory metal 90 exerts a contact force on the second substrate 110, even if the deformation force of the second shape memory metal 90 is greater than that of the fifth shape memory metal 93, but if the additional deformation force of the second shape memory metal 90 compared to the fifth shape memory metal 93 is less than the contact force of the sixth elastic component 100 close to the fifth shape memory metal 93 on the second substrate 110, the second substrate 110 will not twist, thus avoiding the problem of reducing the translation accuracy of the second substrate 110. That is to say, the present invention can also improve the translation accuracy of the second substrate 110 driven by the shape memory metal after deformation by providing the sixth elastic component 110.

[0086] Similarly, referring to Figure 9 As shown, the principle of the third shape memory metal 91 and the fourth shape memory metal 92 driving the second substrate 110 to translate after being powered is the same as that of the first shape memory metal 90 and the fifth shape memory metal 93 driving the second substrate 110 to displace in the length direction of the third shape memory metal 91, and will not be elaborated here.

[0087] Referring to Figure 9 As shown, after those skilled in the art understand the principle of the present invention, it can also be understood that by respectively providing four sixth elastic components 100 at two corner portions of the second substrate 110 in a relative corner relationship, it is also beneficial to effectively control the translation of the second substrate 110, that is, it is more conducive to the directional displacement of the second substrate 110. For example, if the position where the sixth elastic component 100 contacts the second substrate 110 is changed to the middle position of each side wall of the second substrate 110, it will cause the shape memory metal to have too large a tendency to rotate when driving the second substrate 110 to translate, which is not conducive to control.

[0088] It is easy to understand that the translational movement of the second substrate 110 is based on the first substrate 80. Therefore, to ensure that when the second shape memory metal 90, the third shape memory metal 91, the fourth shape memory metal 92, and the fifth shape memory metal 93 drive the second substrate 110 to translate, the first substrate 80 is not driven to move, it is necessary to ensure that the sum of the yield forces of the four sixth elastic components 100 is less than the sum of the yield forces of the first elastic component 30 and the second elastic component 40.

[0089] In this embodiment, it should be noted that to achieve the translation of the second substrate 110, including but not limited to the above method, only the second shape memory metal 90 and the third shape memory metal 91 may be provided. However, to ensure the smooth movement of the second substrate 110, the second shape memory metal 90 and the third shape memory metal 91 should be placed at the axial center position of the first substrate 80 and be perpendicular to each other, which is also a feasible embodiment.

[0090] It must be emphasized that after the connection and layout of the above-mentioned first elastic component 30, second elastic component 40, third elastic component 50, fourth elastic component 60, fifth elastic component 70, first substrate 80, second substrate 110, four sixth elastic components 100, and several shape memory metals in the present invention, the current is transmitted through each component itself to complete the above-mentioned current path, making full use of the positions and connection relationships between the components to provide current for each shape memory metal, which can avoid complicated circuit layouts and save space. For example, if the above method of providing current for each shape memory metal is not adopted, it is necessary to separately layout conductive wires to provide current for each shape memory metal, which will not only increase the volume of the anti-shake device, but also the conductive wires may get stuck on the first substrate 80 or the second substrate 110 when the first substrate 80 and the second substrate 110 move, thus affecting the anti-shake accuracy.

[0091] Refer to Figure 7 As shown in the figure, a circuit board 120 is fixedly connected to the end surface of the second substrate 110 away from the first substrate 80. One end surface of the circuit board 120 is in contact with the end surface of the second substrate 110. The circuit board 120 is usually a flexible circuit board 120, and several signal transmission lines are provided inside the circuit board 120.

[0092] Refer to Figure 10As shown, on both sides of one end of the circuit board 120, hollowed-out parts are provided. Specifically, the hollowed-out parts include a first hollowed-out groove 122, a second hollowed-out groove 123, and a third hollowed-out groove 124. Among them, the first hollowed-out groove 122 and the third hollowed-out groove 124 are located on the peripheries of the circuit board 120 in a relative relationship and are arranged in parallel. The second hollowed-out groove 123 is located at the same end of the first hollowed-out groove 122 and the third hollowed-out groove 124. The end of the first hollowed-out groove 122 is communicated with the end of the second hollowed-out groove 123 through the third hollowed-out groove 124, and the first hollowed-out groove 122 is perpendicular to the third hollowed-out groove 124. It is easy to understand that through the provided hollowed-out parts, the peripheries of the circuit board 120 close to the hollowed-out parts can be folded to form a side-standing structure.

[0093] In this embodiment, it should be noted that providing the hollowed-out parts at both sides of one end of the circuit board 120 includes but is not limited to the above-mentioned method of providing multiple hollowed-out grooves. For example, an arc-shaped hollowed-out groove can also be directly provided at one end of the circuit board 120, and it is still possible to bend the circuit board 120 to form a side-standing structure.

[0094] Refer to Figure 10 and Figure 11 As shown, the side-standing structure includes a first side body 126, a second side body 127, and a third side body 128. On the side wall of the third side body 128, a pin board 121 for the circuit board 120 to interact with the outside world in terms of signals is connected.

[0095] Refer to Figure 11 As shown, the anti-shake device further includes a fixing bracket 130. At the center position of the end face of one end of the circuit board 120 where the side-standing structure is provided, a square placing groove 125 is provided for placing the imaging chip 140. The imaging chip 140 is electrically connected to the circuit board 120. After the imaging chip 140 is placed in the placing groove 125, it is fixed by the fixing bracket 130. And it should be noted that the projection of the imaging chip 140 is within the projection range of the second substrate 110, that is, the imaging chip 140 is located at the position on the second substrate 110 where the memory metal driving structure can apply a driving force, which will not be elaborated here.

[0096] At the same time, refer to Figure 7 and Figure 11 As shown, on the two side walls of the fixing bracket 130 close to the side-standing structures in a relative relationship, that is, on the side walls of the fixing bracket 130 close to the first side body 126 and the second side body 127, there are extension parts 131. The side walls of the two extension parts 131 are respectively in contact with the side walls of the first side body 126 and the second side body 127 to support the side-standing structure and prevent the side-standing structure from tipping over. And at the center position of the end face of the fixing bracket 130, a square hole is provided to facilitate the transmission of image signals to the imaging chip 140. The end face of the fixing bracket 130 away from the imaging chip 140 also has a stepped structure.

[0097] Referring to Figure 2 and Figure 7 As shown, a protective case 12 is further provided on the base 10. The shape memory alloy, the first substrate 80, and the second substrate 110 are all arranged inside the protective case 12, that is, the shape memory alloy drive structure is located inside the protective case 12. Moreover, there are gaps between the shape memory alloy, the first substrate 80, and the second substrate 110 and the inner side wall of the protective case 12 to prevent the first substrate 80 and the second substrate 110 from colliding with the protective case 12 when they are driven to move.

[0098] Meanwhile, referring to Figure 7 As shown, there is also a gap between the circuit board 120 and the protective case 12 to prevent the circuit board 120 from colliding with the protective case 12 when the circuit board 120 is driven to move. Meanwhile, it should be emphasized that the projection of the end of the circuit board 120 provided with the side-standing structure in this embodiment is within the projection range of the base 10. As is known to those skilled in the art, at present, for the circuit board of the existing anti-shake device, in order to avoid affecting the movement of the anti-shake device, the circuit board mostly has a bending structure and is arranged outside the anti-shake device, which increases the volume of the anti-shake device. However, in this embodiment, by setting the side-standing structure, a large part of the circuit board 120 is designed together with the anti-shake device, which can effectively reduce the volume of the anti-shake device.

[0099] It can be understood that when the camera shakes during shooting, for the anti-shake device provided by the present invention, the two first shape memory alloys 20 drive the first substrate 80 to twist. Meanwhile, the second shape memory alloy 90, the third shape memory alloy 91, the fourth shape memory alloy 92, and the fifth shape memory alloy 93 arranged on the first substrate 80 cooperate to drive the second substrate 110 to translate, so as to drive the circuit board 120 and the imaging chip 140 to perform anti-shake compensation.

[0100] Specifically, because the present invention has two first shape memory alloys 20 that finally drive the circuit board 120 to twist, it is equivalent to adding an anti-shake axis. For example, when the camera shakes during shooting, the anti-shake process of the present invention is the twisting of the first substrate 80 plus the translation of the second substrate 110 to drive the imaging chip 140 to move, which can significantly increase the moving speed of the imaging chip 140 and greatly reduce the time required to drive the imaging chip 140 to the anti-shake compensation position, thereby improving the driving accuracy.

[0101] Referring to Figure 7As shown, it can be understood that when the present invention drives the imaging chip 140 to move, the circuit board 120 will be driven to move. However, the pin board 121 connected to the circuit board 120 will be fixed to other devices and cannot move. Although the circuit board 120 has a flexible structure, the resistance when driving the circuit board 120 to move is still relatively large. Therefore, the inventor sets up a side-standing structure on the circuit board 120, so that when the anti-shake device drives the circuit board 120 to move, only the resistance of the side-standing structure needs to be overcome. That is, when the anti-shake device drives the circuit board 120 to move, only the resistance of the first side body 126 and the second side body 127 needs to be overcome, which can greatly reduce the resistance of driving the circuit board 120 to move, improve the driving accuracy, save the driving force, so as to save the current leading to each shape memory metal and save electric energy. For example, when one end of a flexible circuit board is fixedly placed on a platform and a force is applied to its other end to bend it towards its fixed end, it is significantly greater than when one end of a flexible circuit board with a bending part itself is fixedly placed on a platform and a force is applied to its other end to bend it towards its fixed end.

[0102] In addition, it must be pointed out that the anti-shake device provided by the present invention can also use the shape memory metal to drive the first substrate 80 and the second substrate 110 in a static environment to drive the circuit board 120 and the imaging chip 140 to move at high speed, and can capture images in different spaces at the same time to obtain multiple images at the same time. After the multiple images are superimposed, pixel superposition can be realized, and the resolution can be improved. Obviously, after the resolution is improved, the images captured by the camera will be clearer.

[0103] In this embodiment, referring to Figure 6 and Figure 7 As shown, it should be noted that after those skilled in the art understand the principle of the present invention, the anti-shake device can also be used for parts that can finally drive the imaging chip 140 and the circuit board 120 to translate, including removing the second substrate 110, the four sixth elastic components 100, and the four support platforms 83, and directly installing the imaging chip 140 and the circuit board 120 on the first substrate 80, and using the first shape memory metal 20 to finally drive the imaging chip 140 and the circuit board 120 to twist. Cooperating with the prior art to drive lens anti-shake is also an implementation manner; of course, the anti-shake device can also be used for parts that can finally drive the imaging chip 140 and the circuit board 120 to twist, including removing five elastic components and the first substrate 80 placed on the base 10 through the support member 11, and only retaining the part of the anti-shake device that can finally drive the imaging chip 140 and the circuit board 120 to translate. This will not be elaborated here and is also an implementation manner.

[0104] Embodiment 2:

[0105] This embodiment provides a camera module, which includes the anti-shake device provided in Embodiment 1 and a housing 180. Refer to Figure 11 and Figure 12 As shown, the housing 180 has a semi-box structure, and the outer dimensions of the open end of the housing 180 are adapted to the outer dimensions of the protective shell 12. The end faces of the respective side walls of the open end of the housing 180 are in contact and fixed with the end faces of the protective shell 12. For example, the housing 180 and the protective shell 12 can be fixed by means of glue. A through hole 181 is also provided at the center position of the end face of the end of the housing 180 with an end face. Moreover, there is a gap between the inner side wall of the housing 180 and the side-standing structure to prevent the side-standing structure from colliding with the inner side wall of the housing 180 when the circuit board 120 moves.

[0106] Meanwhile, it should be noted that since one end of the circuit board 120 with a side-standing structure in the camera module provided in this embodiment is arranged inside the housing of the camera module, the volume of the camera module can be effectively reduced.

[0107] Refer to Figure 11 and Figure 12 As shown, a driving motor 160 is also fixedly connected inside the housing 180, and one end face of the driving motor 160 is fixedly connected to the inner end face of the housing 180. A placement hole 161 is provided at the center position of the driving motor 160 for placing the lens 170. The axis of the lens 170 is coaxial with the axis of the imaging chip 140.

[0108] Specifically, the driving motor 160 can drive the lens 170 for focusing, and the light incident end of the lens 170 can extend out of the housing 180 through the through hole 181 provided in the housing 180 for focusing.

[0109] Refer to Figure 11 As shown, a filter 150 for light filtering is also placed on the stepped structure of the fixing bracket 130. The filter 150 can also be fixed to the fixing bracket 130 by means of glue. Moreover, the filter 150 is coaxially arranged with the imaging chip 140. By providing the filter 150, the stray light when the camera lens 170 acquires an image is filtered, and the image clarity is improved.

[0110] It can be understood that for the camera module provided by the present invention, due to the anti-shake device provided by the present invention, as the pixel increases and the weight of the lens 170 increases, the anti-shake effect of the camera will not decrease.

[0111] Embodiment Three:

[0112] This embodiment provides a terminal device, including a main board and the anti-shake device of Embodiment 1 or the camera module of Embodiment 2. The main board in the terminal device is connected to the anti-shake device or the camera module. It can be understood that, for the terminal device provided by the present invention, due to the anti-shake device or the camera module provided by the present invention, the anti-shake effect of the terminal device can be effectively improved, and the clarity of the images captured by the terminal device can be increased.

[0113] The above are only the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention.

Claims

1. An anti-shake device, characterized in that, Comprising: A photosensitive component; A base (10); And A shape memory metal drive structure, which is arranged on the base (10); Wherein, the photosensitive component is arranged on the shape memory metal drive structure, and the shape memory metal drive structure can drive the photosensitive component to move after being powered on; The shape memory metal drive structure includes a first elastic component (30) and a first shape memory metal component. The first shape memory metal component includes a first shape memory metal (20). Two ends of the first shape memory metal (20) are respectively connected to the base (10) and the first elastic component (30). After being powered on, the first shape memory metal (20) drives the first elastic component (30) to drive the photosensitive component to twist relative to the base (10), and the photosensitive component is reset through the first elastic component (30); The shape memory metal drive structure further includes a first substrate (80) for carrying the photosensitive component. The first substrate (80) is fixedly connected to the first elastic component (30), and the photosensitive component is arranged on the first substrate (80); The shape memory metal drive structure further includes a second shape memory metal component and a sixth elastic component (100). One end of the sixth elastic component (100) is fixedly connected to the first substrate (80). The second shape memory metal component is connected between the first substrate (80) and the sixth elastic component (100). The second shape memory metal component drives the photosensitive component to translate relative to the base (10), and the photosensitive component is reset through the sixth elastic component (100); The shape memory metal drive structure further includes a second substrate (110) for carrying the photosensitive component. The second substrate (110) is placed on the sixth elastic component (100), and the photosensitive component is fixedly placed on the second substrate (110); The second shape memory metal component includes a second shape memory metal (90). Two ends of the second shape memory metal (90) are respectively connected to the first substrate (80) and the sixth elastic component (100). After being powered on, the second shape memory metal (90) drives the photosensitive component to translate relative to the base (10); and / or The second shape memory metal component includes a third shape memory metal (91). There is an included angle between the third shape memory metal (91) and the second shape memory metal (90). Two ends of the third shape memory metal (91) are respectively connected to the first substrate (80) and the sixth elastic component (100). After being powered on, the third shape memory metal (91) drives the photosensitive component to translate relative to the base (10).

2. The anti-shake device according to claim 1, wherein, The anti-shake device further includes a protective shell (12). The protective shell (12) is fixedly connected to the base (10). The shape memory metal drive structure is located inside the protective shell (12), and there is a gap between the shape memory metal drive structure and the inner side wall of the protective shell (12).

3. The anti-shake device according to any one of claims 1 to 2, characterized in that, The photosensitive component includes a circuit board (120) and an imaging chip (140). The imaging chip (140) is fixedly connected to one end of the circuit board (120), and the projection of the imaging chip (140) is within the projection range of the base (10).

4. The anti-shake device according to claim 3, characterized in that One end of the circuit board (120) connected to the imaging chip (140) is provided with a hollowed-out portion, and the circuit board (120) is bent at the hollowed-out portion to form a standing structure on its side.

5. The anti-shake device according to claim 4, wherein, The hollowed-out portion includes a first hollowed-out groove (122) and a second hollowed-out groove (123) respectively opened on both sides of the circuit board (120), and a third hollowed-out groove (124) opened near the other end of the circuit board (120). The third hollowed-out groove (124) communicates with the first hollowed-out groove (122) and the second hollowed-out groove (123).

6. The anti-shake device according to claim 5, characterized in that The circuit board (120) is bent at the position of the first hollowed-out groove (122) to form a first side body (126), the circuit board (120) is bent at the position of the second hollowed-out groove (123) to form a second side body (127), and the circuit board (120) is bent at the position of the third hollowed-out groove (124) to form a third side body (128). The first side body (126), the second side body (127) and the third side body (128) constitute the standing structure on its side.

7. The anti-shake device according to claim 6, characterized in that, The first side body (126), the second side body (127) and the third side body (128) are all perpendicular to the base (10), and the third side body (128) is perpendicular between the first side body (126) and the second side body (127).

8. The anti-shake device according to claim 4, wherein A fixing bracket (130) for fixing the imaging chip (140) is provided between the imaging chip (140) and the circuit board (120), and the fixing bracket (130) is provided with an extension portion (131) for preventing the standing structure on its side from tipping over.

9. The anti-shake device according to any one of claims 4-8, characterized in that, The circuit board (120) is a flexible circuit board, and the projection of the end of the circuit board (120) having the standing structure on its side is within the projection range of the base (10).

10. A camera module, characterized in that, It includes a lens (170) and the anti-shake device according to any one of claims 1 to 9. The image signal obtained by the lens (170) is transmitted to the photosensitive component, and the shape memory alloy drive structure drives the photosensitive component to move to compensate for the shake of the camera module.

11. A terminal device, characterized in that, It includes a main board and the anti-shake device or the camera module according to any one of claims 1 to 9. The anti-shake device or the camera module is connected to the main board.

Citation Information

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