Device with improved electromagnetic compatibility

Abstract

Device having a housing with an upper housing part and a lower housing part, which form a receiving space; a circuit board arranged in the receiving space, which has an upper side and a lower side, the lower side being electrically connected to the upper side by means of electrically conductive openings, the circuit board having plug-in elements, which enable a connection to electrical components outside the housing, and having circuit elements; a first electrically conductive partition wall, which electrically connects the upper housing part to the upper side of the circuit board; and a second electrically conductive partition wall, which electrically connects the lower housing part to the lower side of the circuit board, the first and second partition walls extending in a common plane and dividing the receiving space into a first receiving space section on a first side of the first and second partition walls and a second receiving space section on a second side of the first and second partition walls, which is opposite the first side, and the circuit elements being arranged on the circuit board such that they are located only in the first receiving space section, and the plug-in elements being arranged on the circuit board such that they are located only in the second receiving space section.

Description

Technical Field

[0001] This invention relates to a device with improved electromagnetic compatibility. Background Technology

[0002] Devices (such as controllers) are typically tested for electromagnetic compatibility. The issue involved here is whether the electromagnetic radiation generated by the electrical and electronic components of the device might interfere with other devices in the vicinity. The goal is to emit only a limited amount of electromagnetic radiation from the device. This is because when the device transmits excessive electromagnetic radiation to its surroundings, it can interfere with nearby equipment.

[0003] To suppress electromagnetic radiation from reaching the surrounding area, the device is typically equipped with a metal casing. Here, the metal casing acts as a Faraday cage, shielding radiation generated within the casing from propagating outwards.

[0004] However, such devices typically have a plug section. This plug section is used to electrically connect the device to other components outside the device. To enable electrical connection to the surrounding environment, a portion of the metal housing is usually provided with an ausnehmung, allowing the plug element of the plug section to protrude at least partially outward. It is this ausnehmung that ultimately weakens the shielding against electromagnetic radiation, and thus reduces the device's electromagnetic compatibility. Summary of the Invention

[0005] Therefore, the object of the present invention is to provide an apparatus (e.g., a controller) having improved electromagnetic compatibility.

[0006] This task will be accomplished by the device according to this patent.

[0007] The device according to the invention has a housing having a conductive upper housing portion and a conductive lower housing portion, which together or collectively constitute a receiving space of the housing. Furthermore, the device has a circuit board (generally a circuit board module) disposed within the receiving space, the circuit board having an upper side and a lower side, wherein the lower side is electrically connected to the upper side via a conductive via. Such a via is, for example, an electrically metallized through-hole, also called a via. Additionally, the circuit board has electromechanical connectors capable of enabling electrical connection to electrical components outside the housing. Electromechanical connectors include, for example, plug elements and / or socket elements, pins, and other elements necessary for establishing electrical contact with electrical components outside the housing. Furthermore, the circuit board has electrical or electronic circuit devices. These electrical or electronic circuit devices are all devices on the circuit board that are not electromechanical connectors. Examples of electrical or electronic circuit devices include SMD capacitors, MOSFETs, CPUs, processors, etc. Electronic circuit devices within this scope of disclosure are particularly components that transmit high-frequency signals. Electrical or electronic circuit devices within this scope are not power electronic components, especially not power electronic components like inverters or other related or necessary components (e.g., those used in electric or hybrid vehicles, for example, to convert the DC voltage of a battery into the AC voltage of an electric motor). Furthermore, the device according to the invention has a first conductive isolation wall that electrically connects the upper part of the housing to the upper side of the circuit board. Furthermore, the device according to the invention has a second conductive isolation wall that electrically connects the lower part of the housing to the lower side of the circuit board. Here, the first and second isolation walls extend substantially in a common plane. The word "substantially" should indicate that the first and second isolation walls extend within a narrow tolerance range (which is, for example, due to the processing and / or manufacturing of the housing or isolation walls) within a common plane. Here, the two partition walls are arranged such that they divide the housing's accommodating space into a first accommodating space segment on a first side of the two partition walls and a second accommodating space segment on a second side of the two partition walls opposite the first side. In other words, the partition walls divide the housing's accommodating space into two spaced-apart accommodating space segments. In the device according to the invention, the circuit devices are now arranged on the circuit board such that they are placed only in the first accommodating space segment. Conversely, the connectors are arranged on the circuit board such that they are placed only in the second accommodating space segment.

[0008] The device according to the invention is based at least in part on the understanding that two separate Faraday cages are effectively created by means of two conductive insulating walls (which are electrically in contact with the circuit board from above and below, thereby dividing the housing's accommodating space into two separate accommodating space segments). Furthermore, by arranging only electrical or electronic circuit devices (i.e., circuit devices that generate electromagnetic radiation waves) in the first accommodating space segment or the first Faraday cage, and by arranging only electromechanical plug-in devices (i.e., devices capable of generating electrical connections to the outside) in the second accommodating space segment or the second Faraday cage, the transmission of electromagnetic radiation waves generated in the first accommodating space to the second accommodating space segment is suppressed to the greatest extent. In other words, the electromagnetic radiation waves in the first accommodating space segment are almost completely surrounded, thereby preventing the transmission of electromagnetic radiation waves from the first accommodating space segment to the second accommodating space segment, and preventing their transmission from there to the surrounding area. Thus, a device with improved electromagnetic compatibility is obtained. The device according to the invention can be used as a control device, particularly in the field of automotive technology. This is because there are strict regulations regarding electromagnetic compatibility in the field of automotive technology.

[0009] In a preferred embodiment of the device according to the invention, the electrical connection between the first isolation wall and the upper side of the circuit board and / or the electrical connection between the second isolation wall and the lower side of the circuit board is constructed in a segmented manner. This preferred configuration is based at least in part on the understanding that the segmented construction of the electrical connections better compensates for unevenness caused by manufacturing or processing, particularly at the ends of the first and / or second isolation walls. This also ensures reliable electrical contact between the isolation wall and the upper or lower side of the circuit board for components with tolerances.

[0010] In a modified version of the advantageous structure, the electrical connection between the first isolation wall and the upper side of the circuit board, and / or the electrical connection between the second isolation wall and the lower side of the circuit board, is constructed using solder joints. This modification is based, in part, on the understanding that solder joints have a diameter of only a few millimeters (or less), thereby reducing the “segmented” electrical contact between the isolation wall and the circuit board to increasingly smaller segments. This allows for better compensation of existing tolerances or unevenness. Furthermore, the solder joints can be easily applied to the circuit board in terms of manufacturing technology, such as using screen printing methods, thus also providing a cost advantage.

[0011] Particularly advantageous is the staggered arrangement of the solder joints on the upper side of the circuit board relative to those on the lower side. This utilizes the understanding that, in the joining of the upper and lower parts of the housing and thus in electrical contact between the partition wall and the circuit board, especially with the staggered arrangement of the solder joints, a certain tension force is generated, resulting in a certain elastic deformation of the circuit board. This elastic deformation of the circuit board during assembly of the device leads to a restoring force or elastic force, which, particularly in the area of ​​the staggered solder joints, counteracts the deformation of the circuit board applied from the outside. Therefore, it can be said that the circuit board is "pressed" against the partition wall, thereby ensuring better electrical contact.

[0012] In another advantageous configuration of the device according to the invention, the distance between adjacent solder points (measured in the main extension plane of the circuit board) is selected based on the wavelength of the (dominant) electromagnetic radiation wave occurring in the first receiving space section. This configuration utilizes the understanding that a dominant or predominant electromagnetic radiation wave with an associated frequency or wavelength can be generated in the first receiving space section (e.g., when operating electrical or electronic circuitry). Based on this, the distance between adjacent solder points (measured in the main extension plane of the circuit board and along the direction of the end face of the first or second isolation wall) is selected such that the transmission of this radiation wave into the second receiving space section is effectively suppressed. For example, the distance between adjacent solder points can be selected such that it matches the wavelength associated with this radiation wave (e.g., an integer multiple of the wavelength). With this configuration, unwanted electromagnetic radiation waves or unwanted radiation frequencies or bands of electromagnetic radiation waves can be suppressed particularly effectively. Finally, a "radiation filter" can be achieved by adapting to the corresponding requirements and advantageously selecting the distance between adjacent welding points. The radiation filter specifically blocks one or more electromagnetic radiation waves from the first containment space section to the second containment space section.

[0013] In other preferred configurations of the device according to the invention, the conductive vias in the circuit board are arranged substantially in a common plane (in which the first and second isolation walls extend). The word "substantially" is also used here to describe the conductive vias (like the two isolation walls) being arranged in a common plane with narrow tolerances. The conductive vias can also be configured as electrically metallized through-holes. This configuration utilizes the understanding that the spatial and positional proximity between the electrical connections of the isolation walls and the circuit board on one hand, and the electrical connections on the upper and lower sides of the circuit board on the other hand, results in better shielding / isolation of the two Faraday cages at the "transition" between the first and second isolation walls.

[0014] In another advantageous configuration of the device according to the invention, in the first receiving space section (i.e., the area where electrical or electronic circuitry is arranged), the edge region of the circuit board is disposed between the upper and lower portions of the housing, and the edge region is electrically connected to both the upper and lower portions of the housing. This configuration ultimately utilizes the understanding that the first receiving space section, or the first Faraday cage, can be further divided into two Faraday cages via electrically metallized vias of the circuit board between the upper and lower portions of the housing. Thus, there is effectively a Faraday cage above the circuit board and a Faraday cage below the circuit board. This further improves the electromagnetic compatibility of the device.

[0015] According to another advantageous configuration of the device according to the invention, the first partition wall is integrally constructed with the upper part of the housing, and the second partition wall is integrally constructed with the lower part of the housing. This advantageous configuration has particular advantages in manufacturing technology, because the housing of the device can thus ultimately be constructed in two pieces. Attached Figure Description

[0016] Other features and tasks of the invention will be apparent to those skilled in the art through the existing teachings and observation of the accompanying drawings. Wherein:

[0017] Figure 1 A schematic view showing one embodiment of the device according to the invention is provided.

[0018] Figure 2 Along one embodiment of the device according to the invention. Figure 1 A schematic cross-sectional view of section line AA, and

[0019] Figure 3 Along another embodiment of the device according to the invention. Figure 1 A schematic cross-sectional view of section line AA.

[0020] Elements with the same structure or function are represented by the same reference numerals in all the accompanying drawings. Detailed Implementation

[0021] First, referring to the device 10 shown... Figure 1 The device 10 can be, for example, a control device (e.g., a controller).

[0022] The device 10 has a conductive housing, which has a conductive upper housing portion 12 and a conductive lower housing portion 14. The upper housing portion 12 and the lower housing portion 14 together form a receiving space 16 of the housing. In addition, the device 10 has a circuit board or circuit board module 18 disposed in the receiving space 16 of the housing.

[0023] Furthermore, the device 10 has a first isolation wall 20, which is also conductive and Figure 1 In a specific example, it is integrally constructed with the upper part 12 of the housing. Furthermore, the device 10 has a second insulating wall 22, which is also conductive and... Figure 1 In a specific example, it is integrally constructed with the lower housing portion 14. In the context of this invention, the term "integrally" refers, on the one hand, to the material unit of the first partition wall 20 and the upper housing portion 12, and on the other hand, to the material unit of the second partition wall 22 and the lower housing portion 14. Such a unit can be implemented, for example, by casting, pressing, or other methods of manufacturing the upper housing portion 12 or the lower housing portion 14 known to those skilled in the art.

[0024] The first isolation wall 20 establishes electrical contact with the upper side 24 of the circuit board 18. The second isolation wall 22 establishes electrical contact with the lower side 26 of the circuit board 18. Figure 1 In a specific example, the electrical contact is schematically shown on the one hand through corresponding solder points 28 between the end face of the first isolation wall 20 and the upper side 24 of the circuit board 18, and on the other hand through corresponding solder points 28 between the end face of the second isolation wall 22 and the lower side 26 of the circuit board 18. Thus, the first isolation wall 20 establishes an electrical connection between the upper portion 12 of the housing and the upper side 24 of the circuit board 18. The second isolation wall 22 establishes an electrical connection between the lower portion 14 of the housing and the lower side 26 of the circuit board.

[0025] In addition, such as combining Figure 2 and 3 As illustrated, a conductive via is located in the circuit board 18. The conductive via electrically connects the upper side 24 and the lower side 26 of the circuit board. Such conductive vias are known to those skilled in the art, for example, vias.

[0026] In addition, such as in Figure 1 As shown, the two isolation walls 20, 22 extend substantially in a common plane 30. Furthermore, the two isolation walls 20, 22, or the common plane 30, are arranged perpendicular to the main extension plane 32 of the circuit board 18. Here, the main extension plane 32 of the circuit board is the plane on which the devices are mounted on the circuit board 18.

[0027] As in Figure 1 As shown, the circuit board has an electromechanical connector 34, which in... Figure 1The pins are schematically indicated in the diagram. Electromechanical connectors 34 enable electrical connections to electrical components (not shown) outside the housing, as indicated by ausbruchs or durchbruchs in the housing components 12, 14. Furthermore, the circuit board 18 has electrical or electronic circuitry 36, a small number of which are... Figure 1 The diagram schematically shows a rectangular box. Electrical or electronic circuit devices 36 are all other devices besides the non-electromechanical plug-in devices 34. Examples of circuit devices 36 include MOSFETs, capacitors, CPUs, processors, etc.

[0028] As in Figure 1 As can be easily seen, the two partition walls 20 and 22 divide the accommodating space 16 into two adjacent accommodating space segments. Thus, the first accommodating space segment 38 is located on the first side 40 of the first and second partition walls 20 and 22. The second accommodating space segment 42 is located on the second side 44 of the first and second partition walls 20 and 22 opposite to the first side 40.

[0029] In addition, such as in Figure 1 As shown, the circuit device 36 is arranged on the circuit board 18 such that it is installed only in the first receiving space section 38. Conversely, the electromechanical connector 34 is arranged on the circuit board 18 such that it is installed only in the second receiving space section 42.

[0030] In particular, such as in Figure 1 As shown on the right edge, the edge region 46 of the circuit board 18 (schematically indicated by a box) is arranged between the upper portion 12 and the lower portion 14 of the housing. Furthermore, the edge region 46 is electrically connected to the upper portion 12 and the lower portion 14 of the housing. Figure 1 In a specific example, this electrical connection is still established via solder point 48. Furthermore, electrical metallized vias, for example via holes, exist in the edge region 46 of the circuit board 18, allowing the upper side 24 and lower side 26 of the circuit board 18 to be electrically connected.

[0031] Therefore, the first receiving space section 38 constitutes a first Faraday cage, in which only electrical or electronic circuit devices 36 are arranged. Conversely, the second receiving space section 42 constitutes a second Faraday cage, in which only electromechanical plug-in devices 34 are arranged. Furthermore, due to the electrical metallized vias in the edge region 46 of the first receiving space section 38, the first Faraday cage is effectively divided into two additional Faraday cages, one arranged above the circuit board 18 and the other arranged below the circuit board 18.

[0032] By finally positioning the two Faraday cages on opposite sides (or left and right sides) of the isolation walls 20, 22, the transmission of electromagnetic radiation waves (e.g., generated by the operating circuit device 36) from the first receiving space section 38 to the second receiving space section 42 can be effectively suppressed. In particular, the device 10 can suppress or prevent the transmission or propagation of electromagnetic radiation waves via the electromechanical plug-in device 34.

[0033] Now refer to Figure 2 It shows along Figure 1 A schematic cross-sectional view of section line AA. To simplify the view, in... Figure 2 Components 12, 14, 34 and 36 are not shown.

[0034] As in Figure 2 As shown, there are multiple solder points 28 on the upper side 24 and lower side 26 of the circuit board 18, four of which are located on... Figure 2 Reference numeral 28 is provided exemplary in the drawing. The welding point 28 is arranged along the end face of the partition walls 20, 22, i.e., it finally penetrates through them. Figure 1 The drawing plane. The solder points 28 establish segmented electrical contacts between the first isolation wall 20 and the upper side 24 of the circuit board 18, and also establish segmented electrical contacts between the second isolation wall 22 and the lower side 26 of the circuit board 18. The solder points 28 can be applied to the upper side 24 or the lower side 26 of the circuit board 18, for example, by screen printing methods known to those skilled in the art. The distance 50 between two directly adjacent solder points 28 (measured along the direction of the main extension plane 32 of the circuit board 18) is selected based on the wavelength of the electromagnetic radiation wave appearing in the first receiving space section 38. By selecting the appropriate distance 50, the transmission of various frequencies or bands of electromagnetic radiation appearing in the first receiving space section 38 can be effectively suppressed in the second receiving space section 42.

[0035] In addition, Figure 2 The diagram illustrates the combination. Figure 1 The conductive via 52, as already mentioned, serves to electrically connect the upper side 24 of the circuit board 18 to the lower side 26 of the circuit board 18. Figure 2 In a specific example, the conductive holes 52 are arranged between adjacent solder points 28 along the direction of the main extending plane 32. Furthermore, the conductive holes 52 are substantially arranged in a common plane 30 (in which the two isolation walls 20, 22 also extend). In other embodiments not shown, the conductive holes 52 can, of course, be arranged in other advantageous layouts.

[0036] See now Figure 3 It illustrates other implementations along the lines of Figure 1 A schematic cross-sectional view of section line AA. To simplify the view, in... Figure 3 Components 12, 14, 34 and 36 are not shown in the diagram.

[0037] and Figure 2 Compared to the implementation method, in Figure 3 In one embodiment, the solder points 28 on the upper side 24 are arranged alternately with respect to the solder points 28 on the lower side 26 of the circuit board 18. This causes the tension force on the circuit board 18 that has already been mentioned when assembling the device 10.

[0038] exist Figure 3 In some implementations, the distance 54 between directly adjacent solder points 28 can also be selected based on the wavelength of the electromagnetic radiation wave that appears in the first accommodating space section 38 (measured along the main extension plane 32 of the circuit board 18).

[0039] In addition, Figure 3 In a specific example, the conductive holes 52, which are still arranged between adjacent solder points 28, can of course also be arranged in other advantageous layouts in embodiments not shown.

Claims

1. A device (10) having: - A housing having a conductive upper portion (12) and a conductive lower portion (14), which together constitute the housing's receiving space (16). - A circuit board (18) arranged in the receiving space (16), the circuit board having an upper side (24) and a lower side (26), the lower side being electrically connected to the upper side (24) through a conductive hole (52), wherein, The circuit board (18) further includes electromechanical connectors (34) that enable electrical connection to electrical components outside the housing, and includes electrical or electronic circuitry (36). - A first conductive isolation wall (20) electrically connects the upper part (12) of the housing to the upper side (24) of the circuit board (18), and - A second conductive isolation wall (22) electrically connects the lower part (14) of the housing to the lower side (26) of the circuit board (18), wherein the first conductive isolation wall (20) and the second conductive isolation wall (22) extend in a common plane (30) and divide the housing's receiving space (16) into a first receiving space segment (38) on the first side (40) of the first and second conductive isolation walls (20, 22) and a second receiving space segment (42) on the second side (44) of the first and second conductive isolation walls (20, 22) opposite to the first side (40), and wherein the circuit device (36) is arranged on the circuit board (18) such that the circuit device (36) is placed only in the first receiving space segment (38), and the connector (34) is arranged on the circuit board (18) such that the connector (34) is placed only in the second receiving space segment (42). The electrical connection between the first conductive isolation wall (20) and the upper side (24) of the circuit board (18) and / or the electrical connection between the second conductive isolation wall (22) and the lower side (26) of the circuit board (18) is constructed in a segmented manner. The electrical connection between the first conductive isolation wall (20) and the upper side (24) of the circuit board (18) and / or the electrical connection between the second conductive isolation wall (22) and the lower side (26) of the circuit board (18) is constructed by means of solder joints (28). The solder points (28) on the upper side (24) of the circuit board (18) are arranged alternately with respect to the solder points (28) on the lower side (26) of the circuit board (18).

2. The apparatus (10) according to claim 1, wherein, The distances (50, 54) between adjacent solder points (28) measured in the main extension plane (32) of the circuit board (18) are selected based on the wavelength of the electromagnetic radiation wave that appears in the first accommodating space section (38).

3. The apparatus (10) according to claim 1, wherein, The conductive holes (52) are arranged in a common plane (30), and the first and second conductive isolation walls (20, 22) extend in the common plane.

4. The apparatus (10) according to claim 1, wherein, In the first accommodating space section (38), the edge region (46) of the circuit board (18) is arranged between the upper part (12) and the lower part (14) of the housing, and the edge region (46) is electrically connected to the upper part (12) and the lower part (14) of the housing.

5. The apparatus (10) according to claim 1, wherein, The first conductive isolation wall (20) is integrally constructed with the upper part (12) of the housing, and the second conductive isolation wall (22) is integrally constructed with the lower part (14) of the housing.

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