Connector and connector system

Abstract

The connector system (1) includes: a connector (10) detachably fitted to a mating connector (20) mounted on an external circuit board (30); and a contact member (40) fixed to the external circuit board (30). The connector (10) has: a circuit board (200) connected to an external device via signal lines (300); a conductive first housing (110) through which a terminal portion (201) of the circuit board (200) passes and is electrically connected to the external circuit board (30) via the mating connector (20); and a conductive second housing (120) covering at least a part of a target area, which is an area other than the terminal portion (201) of one main surface (205) of the circuit board (200). The contact member (40) presses at least a part of the connector (10) toward the external circuit board (30).

Description

Technical Field

[0001] The present invention relates to a connector and a connector system. Background Art

[0002] With the high-speedization of communication of servers and the like, the detachable connectors used in devices such as servers have become larger. In response to this, in order to miniaturize the connector, a connector is proposed in Patent Document 1. This connector is fixed only at the fitting portion to the target connector, and the entire receiving circuit board fixed to the base is covered with a conductive shielding case. Therefore, heat can be conducted from the base to the shielding case.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent No. 4613484 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] The connector described in Patent Document 1 is covered with outside air except for the fitting portion. Therefore, in this connector, most of the heat is dissipated to the outside air through the shielding case. However, since the thermal conductivity of air is low, heat is trapped in the shielding case, and it cannot be said that sufficient heat dissipation is achieved.

[0008] The present invention has been made in view of the above problems, and an object thereof is to provide a detachable connector and a connector system having a high heat dissipation effect.

[0009] Solutions for Solving the Problems

[0010] In order to achieve the above object, a connector system according to a first aspect of the present invention includes:

[0011] a connector detachably fitted to a target connector mounted on an external circuit board; and

[0012] a contact member fixed to the external circuit board,

[0013] wherein the connector has: a circuit board connected to an external device by a signal line; a conductive first case through which a terminal portion of the circuit board passes and which is electrically connected to the external circuit board by the target connector; and a conductive second case covering at least a part of an object area which is an area other than the terminal portion of one main surface of the circuit board,

[0014] and the contact member presses at least a part of the connector toward the external circuit board.

[0015] Alternatively, the abutting member fixes a position of the connector that is closer to the end opposite to the terminal portion than the terminal portion to the external circuit board in a detachable manner with respect to the external circuit board.

[0016] Alternatively, in a state where the connector is fixed to the main surface of the external circuit board, a part of the second housing is pressed by the abutting member to fix the connector to the main surface of the external circuit board. The connector further includes a third housing having thermal conductivity, and the third housing covers at least a part of a target area that is an area other than the terminal portion on the other main surface of the circuit board.

[0017] Alternatively, the abutting member covers at least a part of a target area that is an area other than the terminal portion on the other main surface of the circuit board.

[0018] Alternatively, the abutting member has a contact portion that contacts the other main surface of the circuit board.

[0019] Alternatively, the contact portion contacts the circuit board at a position facing a heat generating member disposed on the circuit board with the circuit board therebetween.

[0020] Alternatively, the circuit board is fixed to the second housing.

[0021] Alternatively, the abutting member has a pressing portion that presses and fixes the second housing toward the external circuit board.

[0022] The second housing has an engaging portion for engaging with the pressing portion.

[0023] The pressing portion and the engaging portion are arranged in a direction intersecting with the direction in which the signal line extends and are respectively formed in plural numbers.

[0024] Alternatively, the abutting member has a pressing portion that presses and fixes the second housing toward the external circuit board, and the abutting member is fixed to the external circuit board by a fixing portion provided at least at a position directly below the pressing portion or a peripheral position of the directly below position.

[0025] Alternatively, the pressing portion and the engaging portion are arranged in the direction in which the signal line extends and are respectively formed in plural numbers.

[0026] To achieve the above object, the connector according to the second aspect of the present invention is detachably fitted to a target connector mounted on an external circuit board, wherein

[0027] The connector has: a circuit board which is connected to an external device by signal lines; a conductive first housing through which a terminal portion of the circuit board passes and which is electrically connected to the external circuit board by means of the object connector; and a conductive second housing which covers at least a part of an object area which is an area other than the terminal portion of one main surface of the circuit board,

[0028] The connector is detachably provided on the main surface of the external circuit board by means of an abutting member fixed to the external circuit board.

[0029] Effects of the Invention

[0030] According to the present invention, it is possible to provide a detachable connector and a connector system having a high heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 (a) of is a perspective view of a connector system according to a first embodiment of the present invention. Figure 1 (b) of is Figure 1 an enlarged perspective view of the connector system of part b in (a) of. Figure 1 (c) of is obtained by Figure 1 sectioning the connector system along line Ic - Ic in (a) of.

[0032] Figure 2 is an exploded perspective view of a connector system according to a first embodiment of the present invention.

[0033] Figure 3 (a) of is a top view of a front housing according to a first embodiment of the present invention. Figure 3 (b) of is a rear view of a front housing according to a first embodiment of the present invention. Figure 3 (c) of is a bottom view of a front housing according to a first embodiment of the present invention. Figure 3 (d) of is a perspective view of a front housing according to a first embodiment of the present invention. Figure 3 (e) of is Figure 3 an enlarged perspective view of the +Z side with the main body portion omitted of part e in (a) of. Figure 3 (f) of is obtained by Figure 3 sectioning the front housing along line IIIf - IIIf in (a) of.

[0034] Figure 4 is a view obtained by Figure 3 arranging a part of an upper housing in the enlarged sectional view shown in (f) of.

[0035] Figure 5 (a) of is a top view of a lower housing according to a first embodiment of the present invention. Figure 5Figure (b) is a perspective view of the lower case of the first embodiment of the present invention.

[0036] Figure 6 Figure (a) is a bottom view of the upper case of the first embodiment of the present invention. Figure 6 Figure (b) is a perspective view of the upper case of the first embodiment of the present invention. Figure 6 Figure (c) is obtained by Figure 6 sectioning the upper case along the line VIc-VIc in Figure (a).

[0037] Figure 7 Figure (a) is an enlarged side view of the connector system of the first embodiment of the present invention. Figure 7 Figure (b) is an enlarged front view of the connector system of the first embodiment of the present invention.

[0038] Figure 8 Figure (a) is a perspective view of the circuit board of the first embodiment of the present invention. Figure 8 Figure (b) is a side view of the circuit board of the first embodiment of the present invention.

[0039] Figure 9 Figure (a) is a perspective view of the connector of the first embodiment of the present invention. Figure 9 Figure (b) is obtained by Figure 9 sectioning the connector along the line IXb-IXb in Figure (a).

[0040] Figure 10 Figure (a) is a top view of the abutting member of the first embodiment of the present invention. Figure 10 Figure (b) is a perspective view of the abutting member of the first embodiment of the present invention.

[0041] Figure 11 Figure (a) is a perspective view of the connector of the first embodiment of the present invention before being fitted into the target connector. Figure 11 Figure (b) is Figure 11 an enlarged perspective view of part b in Figure (a). Figure 11 Figure (c) is obtained by Figure 11 sectioning the connector along the line XIc-XIc in Figure (a).

[0042] Figure 12 is an exploded perspective view of the connector system of the second embodiment of the present invention.

[0043] Figure 13 Figure (a) is a perspective view of the connector system of the second embodiment of the present invention. Figure 13 Figure (b) is Figure 13 an enlarged perspective view of part b of the connector system in Figure (a). Figure 13 Figure (c) is withFigure 13 An enlarged perspective view of the connector system obtained by pressing the pressing portion of (b).

[0044] Figure 14 (a) is a perspective view of the upper shell of the second embodiment of the present invention. Figure 14 (b) is a top view of the upper shell of the second embodiment of the present invention.

[0045] Figure 15 (a) is a perspective view of the abutting member of the second embodiment of the present invention. Figure 15 (b) is a top view of the abutting member of the second embodiment of the present invention.

[0046] Figure 16 is obtained by Figure 13 sectioning along line XVI-XVI in (a). A cross-sectional view of the connector system. Detailed Embodiments

[0047] Hereinafter, a connector system including a connector according to each embodiment of the present invention will be described with reference to the drawings. In the drawings, XYZ coordinates orthogonal to each other are set and appropriately referred to. As Figure 1 shown in (a), the Y-axis direction of the XYZ coordinates is the same direction (front-rear direction) as the fitting direction D1 in which the connector 10 moves in order to be fitted to the target connector 20. The Z-axis direction is the same direction (up-down direction) as the thickness direction of the circuit board 200 of the connector 10. The X-axis direction is a direction (width direction) orthogonal to both the Y-axis direction and the Z-axis direction. In addition, the same reference numerals are assigned to the same structural elements.

[0048] [First Embodiment]

[0049] As Figure 1 shown, the connector system 1 is, for example, a unit of an AOC (Active Optical Cable) connector used for a GPU (Graphic Processing Unit), FPGA (Field Programmable Gate Array), etc. in a server. The connector system 1 of the first embodiment includes a connector 10 that is detachably fitted to a target connector 20 connected to an external circuit board 30, and an abutting member 40 disposed on the external circuit board 30.

[0050] The connector 10 is a male connector that is connected to the target connector 20, which is a female connector.

[0051] As Figure 2As shown in the exploded perspective view of the connector system 1, the connector 10 includes a circuit board 200 formed with a printed circuit, semiconductor elements 210 disposed on the circuit board 200, signal lines 300 connected to the semiconductor elements 210, and a housing 100 that houses portions of the circuit board 200 other than the terminal portion 201 and the bases of the signal lines 300.

[0052] On the other hand, Figure 1 of (a) and Figure 2 The target connector 20 shown is connected to a connection terminal 203, and the connection terminals 203 are arranged in the terminal portion 201 of the circuit board 200. The external circuit board 30 transmits and receives electrical signals to and from an external device or the like connected to the connector 10 via the target connector 20. The abutting member 40 detachably fixes the connector 10 fitted to the target connector 20 in a state of being in contact with the main surface 31 of the external circuit board 30 to the main surface 31 of the external circuit board 30.

[0053] The connector 10 receives an optical signal via the signal line 300, and uses the semiconductor element 210 mounted on the circuit board 200 to convert the optical signal into an electrical signal for processing. Then, the electrical signal is sent to the target connector 20 via the printed circuit on the circuit board 200 and the connection terminals 203 arranged in the terminal portion 201. In addition, the connector 10 transmits the electrical signal sent from the target connector 20 to the semiconductor element 210 via the connection terminals 203 arranged in the terminal portion 201 and the printed circuit. Then, the semiconductor element 210 processes the electrical signal, converts it into an optical signal, and sends the optical signal to the outside via the signal line 300.

[0054] Next, the structure of the connector 10 will be described in detail.

[0055] The housing 100 forming the exterior of the connector 10 is, for example, a conductive member made of metal. The housing 100 houses portions of the circuit board 200 other than the terminal portion 201. The housing 100 has a front housing 110 that causes the terminal portion 201 of the circuit board 200 to protrude to the outside (front) of the housing 100 and covers the circuit board 200, a lower housing 120 that fixes the lower portion of the circuit board 200, and an upper housing 130 disposed above the circuit board 200. The front housing 110 is an example of the first housing, the lower housing 120 is an example of the third housing, and the upper housing 130 is an example of the second housing.

[0056] The front housing 110 is a member that causes the terminal portion 201 of the circuit board 200 to protrude to the outside (front) of the housing 100 and covers the circuit board 200. As Figure 3 of (a) to Figure 3As schematically shown in (d) thereof, the front case 110 has a rectangular tube-shaped main body portion 111 and a substantially letter C-shaped locking lever 115 that is rotatably engaged with both end portions of the main body portion 111 in the X-axis direction. The front case 110 is penetrated by the terminal portion 201 and is electrically connected to an external circuit board 30 via the target connector 20.

[0057] The main body portion 111 constitutes the main part of the front case 110, and a through portion 111a equivalent to a hollow portion that penetrates in the Y-axis direction (front-rear direction) is formed in the main body portion 111. As Figure 11 shown in (a) thereof, the front end portion (one end portion) 117 of the main body portion 111 and the terminal portion 201 of the circuit board 200 are fitted together into the target connector 20. As Figure 3 shown in (f) thereof, the rear end portion (the other end portion) 118 of the main body portion 111 is formed to widen along the Z-axis direction (up-down direction). The purpose is to ensure a space for the circuit board 200 to penetrate through the front case 110. In addition, as Figure 3 shown in (f) thereof and Figure 9 shown in (b) thereof, the main body portion 111 has an opposing portion 111b that faces another main surface 204 of the circuit board 200 described later, a covering portion 111c that faces one main surface 205 of the circuit board 200 described later, and a connecting portion 111d that connects the opposing portion 111b and the covering portion 111c. The opposing portion 111b and the covering portion 111c are arranged to face each other in a state of being separated in the Z-axis direction (up-down direction). The connecting portion 111d connects the +Y-direction (front direction) end portion of the opposing portion 111b and the +Y-direction (front direction) end portion of the covering portion 111c. The connecting portion 111d is provided at both ends in the X-axis direction of the front end portion 117 of the main body portion 111. At the front end portion (one end portion) 117 of the main body portion 111, the through portion 111a is formed by a space surrounded by the opposing portion 111b, the covering portion 111c, and the connecting portion 111d.

[0058] As Figure 9 shown in (a) thereof, Figure 9 shown in (b) thereof, the terminal portion 201 of the circuit board 200 penetrates through the through portion 111a, and the terminal portion 201 protrudes from the front end portion 117 of the front case 110.

[0059] As Figure 3 shown in (a) thereof and the enlarged view of its e portion, that is, Figure 3 shown in (e) thereof, engaged portions 112 that are plate-like members having main surfaces in the XZ plane are formed at both end portions of the main body portion 111 in the X-axis direction (width direction). An engaged portion 123 of the lower case 120 described later is engaged with the engaged portions 112.

[0060] In addition, as Figure 3 shown in (c) thereof, Figure 3As shown in Fig. (f), engaging claws 113, which are hook-shaped members, are formed near both ends of the main body portion 111 in the X-axis direction (width direction). The engaging claws 113 engage with convex portions 202 (described later) of the circuit board 200 inserted into the through-hole portion 111a, preventing the circuit board 200 from falling off from the front case 110.

[0061] As Figure 3 shown in Fig. (a), Figure 3 Fig. (d), Figure 3 and Fig. (f), pressing and fixing portions 114 are formed near both ends of the upper wall of the main body portion 111 in the X-axis direction (width direction). The pressing and fixing portions 114 are used to press and fix the circuit board 200 inserted into the through-hole portion 111a. The pressing and fixing portions 114 are formed by L-shaped tongue portions that elastically protrude from the main body portion 111 toward the inside of the through-hole portion 111a. Thus, the pressing and fixing portions 114 press and fix the circuit board 200 passing through the through-hole portion 111a in the -Z direction.

[0062] As Figure 3 shown in Fig. (c), Figure 3 Fig. (d), a solder portion 116a is formed on the -Z side (lower side) of the rear end portion 118 of the main body portion 111. The solder portion 116a has a concave portion in a top view in the XY plane. By disposing a protruding portion 125 (described later) of the lower case 120 in the concave portion of the solder portion 116a, misalignment in the Y-axis direction (front-rear direction) between the front case 110 and the lower case 120 is suppressed. In addition, welding is performed in the gap between the solder portion 116a and the protruding portion 125 to fix the front case 110, the lower case 120, and the circuit board 200 to each other.

[0063] In addition, the solder portion 116a and the protruding portion 125 do not necessarily have to be welded.

[0064] As Figure 3 shown in Fig. (a), Figure 3 Fig. (d), Figure 3 and Fig. (f), an abutting portion 116b is formed on the +Z side (upper side) of the rear end portion 118 of the main body portion 111. The abutting portion 116b has a plate-shaped tongue piece portion that is close to one main surface 205 of the circuit board 200. When the upper case 130 is mounted on the front case 110, as Figure 4 shown, the tongue piece portion of the abutting portion 116b of the front case 110 abuts against the Y-direction (front direction) end portion of an abutting portion 137 (described later) of the upper case 130.

[0065] As Figure 3 shown in Fig. (a), Figure 3As shown in (d), a recess 119 is provided on the +Z side (upper side) of the front end 117 of the main body portion 111. The recess 119 is recessed in the -Z direction (downward direction). The recess of the recess 119 can suppress the shaking of the circuit board 200 disposed in the front case 110.

[0066] As Figure 3 shown in (e), the locking lever 115 is a substantially letter C-shaped member that engages with both ends of the main body portion 111 in the X-axis direction (width direction). And for the locking lever 115, by making both ends thereof located between the opposing portion 111b and the cover portion 111c in the Z-axis direction, it engages with the engaged portion 112 and becomes a rotatable state. As Figure 1 shown in (c), in a state where the terminal portion 201 of the circuit board 200 is connected to the target connector 20, the locking lever 115 is rotated in the D2 direction to be hooked on the wall surface 21 in the +Y direction (front direction) of the target connector 20. Thus, the locking lever 115 can prevent the connector 10 from detaching from the target connector 20.

[0067] On the other hand, as Figure 5 shown in (a), Figure 5 shown in (b), the lower case 120 constituting the housing 100 has a base portion 121, a standing portion 122, and a pair of engaging portions 123. The lower case 120 is a member that covers at least a part of the target area, which is the area of the circuit board 200 other than the terminal portion 201, and supports the circuit board 200.

[0068] The base portion 121 is a substantially rectangular flat plate member. The circuit board 200 is disposed on the main surface 121a of the base portion 121 by means of a fixing material 400 described later.

[0069] A pair of protrusions 125 are formed at the +Y direction (front) end of the base portion 121. The protrusions 125 are flat plate members that are disposed in the concave portion of the solder portion 116a when the lower case 120 is engaged with the front case 110, and the solder portion 116a is provided on the -Z side (lower side) of the rear end 118 of the front case 110.

[0070] A solder portion 126 is formed at the center portion in the +Y direction (front) of the base portion 121. The solder portion 126 has a recess for fixing the front case 110, the lower case 120, and the circuit board 200 using solder.

[0071] The standing portion 122 is a member that forms walls standing up from both ends in the X direction and the -Y direction (rear and side) of the base portion 121.

[0072] A plurality of engaging holes 124 are formed in the upright portion 122 at the end portion (-Y direction, rear end portion). The engaging holes 124 are each formed in a substantially rectangular shape. An engaging portion 136 (described later) of the upper case 130 is engaged with the engaging holes 124.

[0073] The engaging portion 123 is a hook-shaped member formed at the end portion (+Y direction, front end portion) of the upright portion 122 at both ends in the X-axis direction (both ends in the width direction). In a state where the lower case 120 is connected to the front case 110, the engaging portion 123 is engaged with the engaged portion 112. Since the hook-shaped portions of the pair of engaging portions 123 are formed to face outward and the pair of engaged portions 112 are formed outside the engaging portion 123, the engaging portion 123 has a structure that will not simply disengage when engaged with the engaged portion 112.

[0074] In addition, as shown in (a) to Figure 6 (c) of Figure 6 The upper case 130 constituting the housing 100 has a base portion 131, an upright portion 132, a tongue portion 133, an abutting portion 137, and an engaging portion 139. The upper case 130 covers at least a part of the target area (the area except the terminal portion 201) of the circuit board 200.

[0075] The base portion 131 is a flat plate-shaped member having a substantially rectangular shape with a notch formed near the center to form the tongue portion 133. The lengths of the short side and the long side of the base portion 131 of the upper case 130 are slightly longer than the lengths of the short side and the long side of the base portion 121 of the lower case 120, respectively. Thus, the upper case 130 can accommodate the upper end portion of the upright portion 122 of the lower case 120.

[0076] The tongue portion 133 is a member formed by bending from the base portion 131 in the -Z direction (downward direction, the direction in which the semiconductor element 210 is disposed), and is substantially square-shaped in a top view in the XY plane. The tongue portion 133 is a member for promoting the heat dissipation of the semiconductor element 210 (described later) of the circuit board 200. A gap 134 is formed between the base portion 131 and the tongue portion 133, and the air inside the housing 100 heated by the semiconductor element 210 is discharged to the outside through the gap 134.

[0077] The upright portion 132 is a member forming wall surfaces that stand up from the four circumferences of the two ends in the X direction and the two ends in the Y direction of the base portion 131. The two ends in the X direction and the end portion in the -Y direction (width direction and rear direction) of the upright portion 132 of the upper case 130 are arranged to overlap with the two ends in the X direction and the end portion in the -Y direction (width direction and rear direction) of the upright portion 122 of the lower case 120.

[0078] The engaging portion 139 is formed in a substantially rectangular shape near the -Y direction end portions of the walls in the +X and -X directions (left and right directions) of the standing portion 132. The engaging portion 139 is a member that engages with a pressing portion 42 of the abutting member 40 described later and is used to press the entire connector 10 against the external circuit board 30. For the engaging portion 139, a part of the standing portion 132 is bent toward the outside of the connector 10, so that the engaging portion 139 is formed substantially horizontally with respect to the base portion 131. As Figure 7 shown in (a) of Figure 7 , when the connector 10 is disposed on the main surface 31 of the external circuit board 30, the distance h1 from the upper surface of the engaging portion 139 to the main surface 31 is set to be higher than the distance h2 from the lower surface of the pressing portion 42 described later to the main surface 31 and less than the maximum distance h3 from the lower surface of the guiding portion 43 described later to the main surface 31. As

[0079] shown in Figure 6 the (a) of Figure 6 , a through hole 135 for the signal line 300 to pass through is formed near the center of the wall in the -Y direction (rear direction) of the standing portion 132.

[0080] In addition, a plurality of housing engaging portions 136 are formed in the top portion (-Z direction end portion) of the wall in the -Y direction (rear direction) of the standing portion 132 toward the +Y direction (front direction). Each housing engaging portion 136 is a member in a substantially rectangular shape. The housing engaging portion 136 engages with an engaging hole 124 formed in the standing portion 122 of the lower housing 120.

[0081] The abutting portion 137 is a plate-shaped member formed at the -Z direction end portion (lower end portion) of the standing portion 132 at the +Y direction end portion (front end portion). The abutting portion 137 of the upper housing 130 abuts against the +Z direction surface of the main body portion 111 of the front housing 110 and the abutting portion 116b of the front housing 110.

[0082] A plurality of concave portions 138 in a concave shape are formed at the +Y direction (front direction) end portion of the abutting portion 137. In a state where the abutting portion 137 of the upper housing 130 abuts against the front housing 110, welding is performed between adjacent concave portions 138, 138 and the abutting portion 116b of the front housing 110, thereby fixing the upper housing 130 to the front housing 110.

[0083] In addition, for the fixation of the abutting portion 137 to the front housing 110, a thermally conductive adhesive or the like can be used to replace welding, or it can be abutted without fixation.

[0084] The circuit board 200 is an AOC (Active Optical Cable) substrate, asFigure 8 in (a) of Figure 8 as shown in (b) of

[0085] As Figure 2 , Figure 9 as shown in (b) of

[0086] As Figure 8 in (a) of Figure 8 as shown in (b) of

[0087] The convex portion 202 is formed to protrude outward from both ends in the X-axis direction (width direction) of the terminal portion 201. In a state where the circuit board 200 penetrates to a predetermined position of the through portion 111a, the convex portion 202 engages with the hook-shaped portion of the engaging claw 113 to prevent the circuit board 200 from falling off the front case 110.

[0088] A plurality of connection terminals 203 are formed on one main surface 205 of the terminal portion 201. The connection terminals 203 are connected to the connection terminals of the target connector 20.

[0089] The semiconductor element 210 is a heat-generating member having a silicon photonics circuit, including a light-emitting element 212, a light-receiving element 213, electrical terminals, etc. The semiconductor element 210 is mounted on the circuit board 200. In the silicon photonics circuit, components such as an LD (Laser Diode) as the light-emitting element 212, a PD (Photo Diode) as the light-receiving element 213, and other drivers are integrated. The electrical terminals of the semiconductor element 210 are connected to the connection terminals 203 arranged in the terminal portion 201 via the wirings formed on the circuit board 200. As Figure 9 as shown in (b) of

[0090] As Figure 8 in (a) of Figure 8As shown in FIG. (b), the signal line 300 includes an optical fiber 301 and a connection portion 302. One end of the optical fiber 301 is connected to the connection portion 302, and the other end is connected to the outside (such as an external device). The connection portion 302 is connected to the semiconductor element 210. A mirror 303 is disposed in the connection portion 302. The mirror 303 reflects and bends the light emitted from the optical fiber 301 or the light emitted from the light-emitting element 212. The semiconductor element 210 and the signal line 300 are connected by the mirror 303 in a manner capable of transmitting light.

[0091] The fixing material 400 is composed of an adhesive having a higher thermal conductivity than a normal resin-based adhesive, such as silver paste. As Figure 9 shown in FIG. (b), the fixing material 400 is filled between the other main surface 204 of the circuit board 200 including directly below the semiconductor element 210 and the main surface 121a of the base portion 121 of the lower case 120. In addition, when wirings are also formed on the other main surface 204 of the circuit board 200, an insulation process is performed on the surfaces of the wirings. The fixing material 400 has a function of fixing the circuit board 200 to the lower case 120 and a function of conducting the heat of the circuit board 200 to the lower case 120 and dissipating it. In addition, the fixing material 400 is not limited to a solid, and may also be a sol, a gel, or the like. For example, a heat dissipation grease such as thermal grease or a heat sink may also be used.

[0092] The heat conductive materials 410 and 420 are heat conductive members, and in the present embodiment, silver paste is used, for example. The heat conductive material 410 functions to conduct the heat generated in the semiconductor element 210 to the tongue portion 133 of the upper case 130 and dissipate it throughout the upper case 130. On the other hand, the heat conductive material 420 functions to conduct the heat generated in the semiconductor element 210 to the circuit board 200 and conduct it from the circuit board 200 to the lower case 120 via the fixing material 400 and dissipate it throughout the lower case 120.

[0093] As Figure 1 、 Figure 11 shown, the target connector 20 is a female connector mounted on the external circuit board 30. The terminal portion 201 protruding from the connector 10 of the circuit board 200 is inserted into the target connector 20.

[0094] In addition, the target connector 20 only needs to have a structure corresponding to the connector 10. Figure 1 、 Figure 11 shown is an example of the structure of the female connector, and the shape and the like of the target connector 20 can be appropriately changed.

[0095] The external circuit board 30 is formed of, for example, a rigid printed circuit board obtained by applying a copper foil wiring pattern (not shown) to a substrate formed of an epoxy resin material. Contacts and mounting portions (both not shown) are exposed on the main surface 31 of the external circuit board 30. The target connector 20 and the abutting member 40 are mounted on the external circuit board 30. In addition, as Figure 2 shown, a copper foil 32 is also disposed at the position on the main surface 31 of the external circuit board 30 where the lower case 120 abuts, thereby promoting heat conduction from the connector 10 to the external circuit board 30.

[0096] As Figure 10 shown in (a) of Figure 10 , the abutting member 40 disposed on the external circuit board 30 is a metal member having a substantially Japanese katakana "コ" shape in a top view. The abutting member 40 has: a base portion 41 disposed on the external circuit board 30; and a pressing portion 42 having a U shape in a front view, which is engaged with the upper case 130 near both ends of the base portion 41 and presses the connector 10 toward the main surface 31 of the external circuit board 30. In addition, the abutting member 40 has a guiding portion 43 extending in a tapered shape from the end portion in the -Y direction of the pressing portion 42 toward the +Z direction. As Figure 7 shown in (a) of Figure 11 , when the connector 10 and the abutting member 40 are disposed on the main surface 31 of the external circuit board 30, the distance h2 (the distance from the main surface 31 of the external circuit board 30) of the lower surface of the pressing portion 42 is set to be lower than the distance h1 (the distance from the main surface 31 of the external circuit board 30) of the upper surface of the engaging portion 139. On the other hand, the maximum distance h3 of the lower surface of the guiding portion 43 from the main surface 31 is set to be higher than the distance h1. Therefore, when the Figure 11 shown in (a) of Figure 1 connector 10 is moved in the D1 direction, the engaging portion 139 is guided by the guiding portion 43 to move little by little in the -Z direction. After that, as Figure 1 shown in (a) of Figure 7 , when the engaging portion 139 is engaged with the pressing portion 42, since the distance h1 > h2 as described above, the engaging portion 139 is pressed by the pressing portion 42 toward the main surface 31 of the external circuit board 30. In addition, as

[0097] shown in (b) of , since the pressing portion 42 is formed in a substantially letter C shape, the engaging portion 139 engaged with the pressing portion 42 is also pressed toward the main surface 31 of the external circuit board 30 by the acting force of the pressing portion 42. Thus, when the engaging portion 139 is located below the pressing portion 42, the upper case 130 is pressed toward the main surface 31 of the external circuit board 30.

[0097] The contact member 40 is arranged and fixed to the external circuit board 30, and a fixing portion 44 is provided at a position directly below the pressing portion 42 (see Figure 10 (a) of Figure 10 (b)), and / or a fixing portion 45 is provided at a position around the position directly below the pressing portion 42 and fixed to the external circuit board 30 using solder or an adhesive. By doing so, it is possible to prevent unexpected situations such as the peeling of the contact member 40 caused by the reaction force on the pressing portion 42 when the connector 10 is pressed against the external circuit board 30. In addition, the corner portion of the base portion 41 can also be fixed to the external circuit board 30 as a fixing portion 46. Alternatively, a fixing portion 47 can also be provided between the fixing portions 46, 46. The number and position of the fixing portions can be determined according to the required fixing strength, etc.

[0098] (Assembly method of the connector system)

[0099] Next, the assembly method of the connector system 1 having the above structure will be described.

[0100] First, for Figure 8 (a) of Figure 8 (b) of the terminal portion 201 of the circuit board 200 shown, an operator passes the terminal portion 201 of the circuit board 200 through the through-hole portion 111a of the front case 110 with one main surface 205 facing the +Z direction (upward direction). The terminal portion 201 of the circuit board 200 protrudes from the front end portion 117. At this time, the circuit board 200 flexes the pressing and fixing portion 114 shown in Figure 3 (f) in the +Z direction (upward direction) and the circuit board 200 is placed on the engaging claw 113 (pushing the engaging claw 113 in the -Z direction, downward direction), and then the convex portion 202 of the circuit board 200 engages with the engaging claw 113 of the front case 110. In addition, the circuit board 200 is pressed and fixed in the -Z direction by the pressing and fixing portion 114. When the circuit board 200 does not accurately penetrate to the predetermined position of the through-hole portion 111a, the convex portion 202 and the +Z direction standing portion of the engaging claw 113 will interfere and push the engaging claw 113 in the -Z direction. Therefore, it is possible to confirm whether the circuit board 200 has penetrated to the predetermined position based on whether the engaging claw 113 protrudes in the -Z direction. After penetration, the solder portion 116a shown in Figure 3 (b) of Figure 3 (d) of is soldered to the circuit board 200.

[0101] An operator applies a fixing material 400 to another main surface 204 of the circuit board 200. The operator slides the lower case 120 along the another main surface 204 of the circuit board 200 in the D1 direction, and engages the engaging portion 123 of the lower case 120 with the engaged portion 112 provided at the rear end 118 of the front case 110. At this time, the another main surface 204 of the circuit board 200 is fixed to the main surface 121a of the lower case 120 by means of the fixing material 400, and the circuit board 200 and the lower case 120 are connected in a heat-conductive manner.

[0102] An operator applies Figure 8 a heat-conductive material 410 to a region of the main surface 211 of the semiconductor element 210 shown in FIG. except for the portion to which the connecting portion 302 is connected.

[0103] The operator slides the upper case 130 along one main surface 205 of the circuit board 200 in the D1 direction. The abutting portion 137 of the upper case 130 is abutted against the rear end 118 of the main body portion 111 of the front case 110. In addition, the operator engages the engaging portion 136 with the engaging hole 124 of the lower case 120. Then, the erected portion 132 of the upper case 130 is fitted into the erected portion 122 of the lower case 120, and the fitted portion and the portion between the main body portion 111 and the abutting portion 137 of the upper case 130 are welded to form Figure 9 the state shown in (a) of Figure 9 and the state shown in (b) of

[0104] As Figure 11 shown in (a) of Figure 1 FIG., the operator aligns the terminal portion 201 of the completed connector 10 with the target connector 20 mounted on the main surface 31 of the external circuit board 30 and slides the connector 10 in the D1 direction on the main surface 31 of the external circuit board 30. Since the distance from the lower surface of the guiding portion 43 to the main surface 31 of the external circuit board 30 gradually becomes shorter as it advances in the D1 direction, as the upper case 130 slides in the D1 direction, the engaging portion 139 is pressed toward the main surface 31 of the external circuit board 30 by means of the guiding portion 43. When the engaging portion 139 is located below the pressing portion 42, the upper case 130 is further pressed toward the main surface 31 of the external circuit board 30 by the action of the pressing force of the pressing portion 42. In addition, the terminal portion 201 of the connector 10 is fitted into the target connector 20 of the external circuit board 30 to form Figure 1 the state shown in (a) of

[0105] In addition, as Figure 11As shown in (c), the distance h4 from the lower surface of the terminal portion 201 of the connector 10 to the main surface 31 of the external circuit board 30 is substantially equal to the distance h5 from the lower surface of the portion of the mating connector 20 in which the terminal portion 201 is to be fitted to the main surface 31 of the external circuit board 30. Thus, by pressing the engaging portion 139 by the pressing portion 42, a certain range of the main surface 121b of the lower shell 120 can be brought into contact with the main surface 31 of the external circuit board 30.

[0106] With the connector system 1 of this embodiment, the abutting member 40 presses the locking portion 139 of the upper shell 130 toward the main surface 31 of the external circuit board 30, so that the connector 10 abuts against the main surface 31 of the external circuit board 30, and the end of the connector 10 close to the signal line 300 can be suppressed from being lifted from the external circuit board 30. Therefore, since the lower shell 120 of the connector 10 abuts against the main surface 31 of the external circuit board 30, the heat of the connector 10 can be dissipated by means of the external circuit board 30, and a connector and a connector system that can be assembled and disassembled with high heat dissipation effect can be provided. In addition, since the lower shell 120 is thermally conductive, the heat generated in the connector 10 can be effectively conducted to the external circuit board 30.

[0107] In addition, with the connector 10 of this embodiment, the semiconductor element 210 is connected to the tongue 133 of the upper shell 130 by means of the heat conductive material 410 in a heat conductive manner. Therefore, the heat generated by the semiconductor element 210 is diffused to the entire upper shell 130 via the tongue 133, thereby promoting heat dissipation. Therefore, the necessity of the upper shell 130 having a heat sink is reduced. In addition, the connector 10 can be miniaturized without the need for a heat sink.

[0108] In addition, with the connector 10 of this embodiment, the semiconductor element 210 is connected to the circuit board 200 in a heat-conducting manner by means of the heat-conducting material 420. Therefore, the heat generated by the semiconductor element 210 is diffused to the lower shell 120 via the circuit board 200, thereby promoting heat dissipation. Therefore, the necessity of the housing 100 having a heat sink is reduced. In addition, the connector 10 can be miniaturized without the need for a heat sink.

[0109] [Second embodiment]

[0110] In the connector system 1 of the first embodiment, the housing 100 of the connector 10 includes a front shell 110, a lower shell 120, and an upper shell 130. Figure 12 In the exploded perspective view shown in Figure 13 (a) Figure 13 In the connector system 2 of the present embodiment shown in the perspective view in (b), the housing 100A of the connector 10A includes a front shell 110 and an upper shell 130A.

[0111] The front housing 110 of the connector 10A and the circuit board 200 have the same structure as in the first embodiment. The target connector 20 also has the same structure as in the first embodiment. In the connector 10A, the structure of the upper housing 130A is different from that of the first embodiment, and it does not have a lower housing. In addition, a contact member 40A that serves the same function as the lower housing 120 of the first embodiment is arranged on the external circuit board 30.

[0112] The housing 100A is, for example, a conductive member made of metal. As Figure 14 shown in (a) of Figure 14 and (b) of

[0113] The upper housing 130A that constitutes the housing 100A has a flat base 131A, upright portions 132A (wall portions 132A1, 132A2) erected from the ends of the base 131A, a tongue portion 133, and a contact portion 137. The upper housing 130A covers at least a part of the target area, which is the area of the circuit board 200 except for the terminal portion 201. The tongue portion 133, the contact portion 137, and the gap 134 formed around the tongue portion 133 are the same as those in the first embodiment. Figure 13 As shown in (c) of Figure 14 and (b) of

[0114] The upright portion 132A is a member having wall portions 132A1 at both ends of the base 131A in the X direction and wall portions 132A2 erected from the four peripheries at both ends in the Y direction. Different from the upright portion 132 in the first embodiment, the adjacent wall portions 132A1 and 132A2 are independent of each other and do not contact.

[0115] As Figure 14As shown in (a) thereof, near the front ends of the wall portions 132A1, 132A1 and the wall portion 132A2 in the -Y direction, a groove portion 138A capable of clamping the circuit board 200 is formed in a direction horizontal to the base portion 131. When the circuit board 200 is clamped in the groove portion 138A and the connector 10A presses against the abutting member 40A, the other main surface 204 of the circuit board 200 contacts the contact portion 43A described later. In addition, the hole 136A is a hole generated when the standing piece 136A1 is formed in the -Z direction from the base portion 131A. By inserting the standing piece 136A1 into Figure 12 the locking hole 214 formed in the circuit board 200 as shown, the positioning in the Y direction of the upper case 130A and the circuit board 200 is performed.

[0116] Next, Figure 15 as shown in (a) of Figure 15 the abutting member 40A shown in (b) of Figure 16 functions in the same manner as the abutting member 40 of the first embodiment to press the upper case 130A against the external circuit board 30, and covers at least a part of the object area, which is the area of the circuit board 200 other than the terminal portion 201. The abutting member 40A is, for example, a conductive member made of metal. The abutting member 40A has a substantially rectangular base portion 41A and pressing portions 42A erected at the four corners of the base portion 41A. As shown in the enlarged cross-sectional view of

[0117] As shown in Figure 15 the (a) of Figure 15 the (b) of

[0118] the base portion 41A is a flat plate-like member having a substantially rectangular shape. The circuit board 200 is disposed on the main surface 41a of the base portion 41A. A contact portion 43A that contacts the circuit board 200 is formed at a position slightly closer to the +Y direction in the center of the base portion 41A. In addition, a solder hole 45A having a substantially U-shaped top view is formed immediately in front of the contact portion 43A on the base portion 41A. Figure 16 The contact portion 43A is formed such that a tongue-like portion is bent slightly in the +Z direction (the direction in which the circuit board 200 is disposed) from the base portion 41A (see

[0119] The solder hole 45A is a hole for welding the abutting member 40A and the external circuit board 30, which is provided near the contact portion 43A to promote heat dissipation from the semiconductor element 210 to the external circuit board 30.

[0120] The pressing part 42A stands up from near the four corners of the base part 41A, and has a front end part 46A bent in a manner facing the base part 41A at its front end. As shown in (c) of Figure 13 , the distance h6 from the lower surface of the front end part 46A to the external circuit board 30 is slightly shorter than the distance h7 from the base part 131 of the upper case 130 to the external circuit board 30 and slightly longer than the distance h8 from the inclined part 131A11 to the external circuit board 30. After passing the front end part 46A through the through-hole part 139A of the upper case 130, the upper case 130A is slid in the +Y direction (the direction of the front case 110), and the engaging part 131A1 of the base part 131 of the upper case 130A to be described later is engaged (refer to Figure 13 (b)). As the upper case 130A further slides in the +Y direction, the pressing part 42A (the front end part 46A thereof) presses and abuts the upper case 130A against the main surface 41a (the contact part 43A) of the abutting member 40A.

[0121] With the connector system 2 of the second embodiment, the upper case 130A holding the circuit board 200 is moved downward from above the abutting member 40 and then slid in the +Y direction, so that the pressing part 42A of the abutting member 40A presses the engaging part 131A1 of the upper case 130A against the main surface 31 of the external circuit board 30. The other main surface 204 of the circuit board 200 held by the groove part 138A of the upper case 130A in the connector 10A abuts against the main surface 41a (the contact part 43A) of the abutting member 40, and it is possible to suppress the end of the connector 10A near the signal line 300 from tilting up from the external circuit board 30. Therefore, since the circuit board 200 of the connector 10A abuts against the main surface 31 of the external circuit board 30, the connector 10A can be effectively cooled by the external circuit board 30, and a small-sized detachable connector 10A and connector system 2 with a high heat dissipation effect can be provided. In addition, since the abutting member 40A has heat conductivity, the heat generated in the connector 10A can be effectively conducted to the external circuit board 30. And in the connector system 2, since the abutting member 40A also serves as the lower case 120 of the first embodiment, there is no need to separately prepare a lower case, and the number of components and the operation process can be reduced compared with the first embodiment.

[0122] The above has described the embodiments of the present invention, but the present invention is not limited to the above embodiments.

[0123] (Modification example)

[0124] In the above embodiments, an example in which the connectors 10 and 10A are AOC connectors has been described, but they may also be electrical connectors. The semiconductor element 210 may also be a normal circuit without a silicon photonics circuit. The signal line may also not have an optical fiber.

[0125] In addition, in the above-described first embodiment, the housing 100 includes three independent members, namely, the front housing 110, the lower housing 120, and the upper housing 130. However, the front housing 110 and the lower housing 120 or the front housing 110 and the upper housing 130 may be integrally formed. As a result, there is no need to provide a connection portion between the integrally formed housings, so that the connector can be miniaturized. In addition, the manufacturing process and the number of components of the connector can be reduced, the manufacturing process can be shortened, and the cost can be reduced.

[0126] In the above-described first embodiment, the abutting member 40 is substantially in the shape of the Japanese katakana character "コ" in a top view. However, the abutting member may be, for example, substantially in the shape of an inverted letter "U" in a front view and press the base of the upper housing from above, or may be a rubber-like member that can be expanded and contracted and press the base 131 of the upper housing 130 from above. In addition, the base of the abutting member 40 is in the shape of the Japanese katakana character "コ" in a top view. However, the abutting member may also be of other shapes or divided into two. In addition, the number and position of the pressing portions 42 are not limited to the forms shown in the first embodiment. The engaging portions 139 are formed at two locations, but the number of the engaging portions 139 may be increased or decreased as needed, or the position of the engaging portions 139 may be changed.

[0127] In the above-described first embodiment, the abutting member 40 has a pressing portion 42 that is horizontal with respect to the external circuit board 30 in a side view and a guiding portion 43 that is inclined with respect to the external circuit board 30. However, a structure without a pressing portion may be adopted. In addition, a structure may be adopted in which the abutting member does not have a guiding portion, the upper housing 130 is pressed toward the external circuit board 30 and slid toward the target connector 20, and the engaging portion 139 is engaged with and pressed against the pressing portion. Alternatively, the abutting member may not have a guiding portion, and by making the upper surface of the upper housing 130 more toward the +Z direction as it goes more toward the +Y direction in a side view, the connector is slid in the +Y direction and the upper housing is pressed toward the external circuit board 30.

[0128] In the above-described first embodiment, the abutting member 40 has a pressing portion 42, and the upper housing 130 has an engaging portion 139. However, the abutting member may have a pressing portion that is the same as the pressing portion 42A of the second embodiment, and the upper housing may have an engaging portion and an inclined portion that are the same as the engaging portion 131A1 and the inclined portion 131A11 of the second embodiment. In this case, a contact portion that is the same as the contact portion 43A of the second embodiment may be provided at the base of the lower housing, or a structure may be adopted in which all except the lower housing are of the first embodiment and a contact portion is provided at the base of the lower housing.

[0129] In the above-described second embodiment, the structure is such that the connector 10A is pressed against the abutting member 40A by the pressing portion 42A, the through portion 139A, the engaging portion 131A1, etc. However, the structure may also be such that the same engaging portion as in the first embodiment is provided on the upper housing and the same pressing portion as in the first embodiment is provided on the abutting member.

[0130] In the above-described second embodiment, the abutting member 40A has the inclined portion 131A11. However, the structure may also be such that it does not have the inclined portion. For example, by expanding and contracting the substantially C-shaped grooves above and below the groove portion 138A in the +-Z direction, the upper housing is pressed and slid, and the engaging portion is engaged with and pressed against the pressing portion.

[0131] In the above-described second embodiment, the pressing portion 42A, the through portion 139A, the engaging portion 131A1, etc. are provided in two places in the +Y direction and two places in the -Y direction. However, for example, they may not be provided in the +Y direction or may not be provided in the -Y direction, may also be provided at other positions, or the number of them provided on the +X end side and the -X end side may be different.

[0132] In the above-described second embodiment, when the circuit board 200 is held by the groove portion 138A and the connector 10A is pressed against the abutting member 40A, the other main surface 204 of the circuit board 200 contacts the contact portion 43A. However, the main surface 204 of the circuit board 200 may also contact a portion of the base portion 41A other than the contact portion 43A.

[0133] In the above-described second embodiment, the contact portion 43A is provided at one place on the base portion 41A. However, the contact portion may also be provided at one or more other positions on the base portion. Alternatively, the contact portion may not be provided on the base portion, but for example, irregularities may be formed on the entire base portion of the abutting member, and the circuit board 200 may be brought into contact with the base portion of the abutting member.

[0134] In the above-described second embodiment, the groove portion 138A is formed in a substantially C shape near the -Z direction ends of the wall portions 132A1, 132A2. However, for example, the structure may also be such that the lower ends of the wall portions are bent toward the base portion 131A, the lower end of the wall portion 132A2 abuts against one main surface 205 of the circuit board 200, and the upper end of the wall portion 132A1 abuts against the other main surface 204 of the circuit board 200, so as to hold the circuit board 200 in place instead of using the groove portion.

[0135] In the above-described embodiments, the example in which the through holes 135 are provided in the upper housings 130, 130A has been described. However, the through portion may also be provided in the lower housing or the abutting member, and the circuit board may be fixed to the upper housing by a fixing material.

[0136] In the above-described first embodiment, the lower case 120 is fitted with the upper case 130. However, the lower case and the upper case may be fixed by butt-joining the ends of each other and welding them.

[0137] In the above-described first and second embodiments, the tongues 133 are formed in the upper cases 130 and 130A. However, a heat dissipation plate (heat conductive plate) may be disposed between the upper cases 130 and 130A and the semiconductor element 210 of the circuit board 200 without forming the tongues. In this case, the heat dissipation plate (heat conductive plate) conducts the heat generated from the semiconductor element 210 to the upper case 130, and the heat dissipation effect can be improved as well. Alternatively, both the tongue and the heat dissipation plate may be provided.

[0138] The present invention can be provided in various embodiments and modifications without departing from the broad spirit and scope of the present invention. In addition, the above-described embodiments are merely for explaining the present invention and do not limit the scope of the present invention. That is, the scope of the present invention is represented by the claims rather than the embodiments. Moreover, various modifications implemented within the meaning of the claims and the equivalent inventions are considered to be within the scope of the present invention.

[0139] In addition, this application claims priority based on Japanese Patent Application No. 2020-081320 filed on May 1, 2020, and the entire specifications, claims, and drawings of Japanese Patent Application No. 2020-081320 are incorporated herein by reference.

[0140] Explanation of Reference Numerals

[0141] 1. 2. Connector system; 10, 10A. Connector; 20. Object connector; 21. Wall surface; 30. External circuit board; 31. Main surface; 32. Copper foil; 40, 40A. Contact member; 41, 41A. Base; 41a. Main surface; 42, 42A. Pressing portion; 43. Guide portion; 43A. Contact portion; 44, 45, 46, 47. Fixing portion; 45A. Solder hole; 46A. Front end portion; 100, 100A. Housing; 110. First shell (front shell); 120. Third shell (lower shell); 130, 130A. Second shell (upper shell); 111. Main body portion; 111a. Through portion; 111b. Opposite portion; 111c. Cover portion; 111d. Connection portion; 112. Engaged portion; 113. Engaging claw; 114. Pressing and fixing portion; 115. Locking lever; 116a. Solder portion; 116b. Contact portion; 117. One end portion (front end portion); 118. The other end portion (rear end portion); 119. Recess; 121. Base; 121a, 121b. Main surface; 122. Upright portion; 123. Engaging portion; 124. Engaging hole; 125. Protrusion; 126. Solder portion; 127. Restraining claw; 128. Through claw; 131, 131A. Base; 131A1. Engaging portion; 131A11. Inclined portion; 132, 132A. Upright portion; 132A1, 132A2. Wall portion; 133. Tongue portion; 134. Gap; 135. Through opening; 136. Engaging portion; 136A. Hole; 136A1. Standing piece; 137. Contact portion; 138. Recess; 138A. Groove portion; 139. Engaging portion; 139A. Through portion; 200. Circuit board; 201. Terminal portion; 202. Protrusion; 203. Connection terminal; 204. Another main surface; 205. One main surface; 206. Through hole; 210. Semiconductor element; 211. Main surface; 212. Light emitting element; 213. Light receiving element; 214. Locking hole; 300. Signal line; 301. Optical fiber; 302. Connection portion; 303. Reflector; 400. Fixing material; 410. Thermal conductive material; 420. Thermal conductive material; D1, D2. Directions; h1 to h8. Distances.

Claims

1. A connector system, wherein, the connector system includes: a connector detachably fitted to a mating connector mounted on an external circuit board; and a contact member fixed to the external circuit board, the connector having: a circuit board connected to an external device by signal lines; a conductive first housing through which a terminal portion of the circuit board passes and electrically connected to the external circuit board by the mating connector; and a conductive second housing covering at least a part of a target area which is an area other than the terminal portion of one main surface of the circuit board, the contact member presses at least a part of the connector toward the external circuit board, so that a main surface of the connector connected to the circuit board in a heat-conductive manner abuts against the main surface of the external circuit board.

2. The connector system according to claim 1, wherein, in a state where the connector is fixed to the main surface of the external circuit board, a part of the second housing is pressed by the contact member to fix the connector to the main surface of the external circuit board, and the connector further has a heat-conductive third housing covering at least a part of a target area which is an area other than the terminal portion of the other main surface of the circuit board.

3. A connector system, wherein, the connector system includes: a connector detachably fitted to a mating connector mounted on an external circuit board; and a contact member fixed to the external circuit board, the connector having: a circuit board connected to an external device by signal lines; a conductive first housing through which a terminal portion of the circuit board passes and electrically connected to the external circuit board by the mating connector; and a conductive second housing covering at least a part of a target area which is an area other than the terminal portion of one main surface of the circuit board, the contact member presses at least a part of the connector toward the external circuit board, in a state where the connector is fixed to the main surface of the external circuit board, a part of the second housing is pressed by the contact member to fix the connector to the main surface of the external circuit board, and the connector further has a heat-conductive third housing covering at least a part of a target area which is an area other than the terminal portion of the other main surface of the circuit board.

4. The connector system according to claim 1 or 3, wherein, the contact member covers at least a part of a target area which is an area other than the terminal portion of the other main surface of the circuit board.

5. The connector system according to claim 4, wherein, the contact member has a contact portion in contact with the other main surface of the circuit board.

6. The connector system according to claim 5, wherein, the contact portion contacts the circuit board at a position opposite to a heat-generating member disposed on the circuit board with the circuit board therebetween.

7. A connector system, wherein, the connector system includes: a connector detachably fitted to a mating connector mounted on an external circuit board; and A contact member fixed to the external circuit board. The connector includes: a circuit board connected to an external device via signal lines; a conductive first housing through which a terminal portion of the circuit board passes and is electrically connected to the external circuit board by means of the target connector; and a conductive second housing covering at least a part of a target area which is an area other than the terminal portion of one main surface of the circuit board. The contact member presses at least a part of the connector toward the external circuit board. The contact member covers at least a part of a target area which is an area other than the terminal portion of the other main surface of the circuit board. The contact member has a contact portion that contacts the other main surface of the circuit board. The contact portion contacts the circuit board at a position opposite to a heat generating member disposed on the circuit board with the circuit board therebetween.

8. The connector system according to any one of claims 1, 3, and 7, wherein the contact member fixes a position of the connector that is closer to an end opposite to the terminal portion than the terminal portion to the external circuit board in a detachable manner with respect to the external circuit board.

9. The connector system according to any one of claims 1, 3, and 7, wherein the circuit board is fixed to the second housing.

10. The connector system according to any one of claims 1, 3, and 7, wherein the contact member has a pressing portion that presses and fixes the second housing toward the external circuit board, the second housing has an engaging portion for engaging with the pressing portion, the pressing portion and the engaging portion are arranged in a direction crossing the direction in which the signal lines extend and are respectively formed in plural numbers.

11. The connector system according to any one of claims 1, 3, and 7, wherein the contact member has a pressing portion that presses and fixes the second housing toward the external circuit board, and the contact member is fixed to the external circuit board by a fixing portion provided at least at a position directly below the pressing portion or a peripheral position of the directly below position.

12. The connector system according to claim 10, wherein the pressing portion and the engaging portion are arranged in the direction in which the signal lines extend and are respectively formed in plural numbers.

13. A connector detachably fitted to a target connector mounted on an external circuit board, wherein the connector includes: a circuit board connected to an external device via signal lines; a conductive first housing through which a terminal portion of the circuit board passes and is electrically connected to the external circuit board by means of the target connector; and a conductive second housing covering at least a part of a target area which is an area other than the terminal portion of one main surface of the circuit board. The connector is detachably provided on the external circuit board by a contact member fixed to the external circuit board, so that a main surface of the connector thermally connected to the circuit board abuts against a main surface of the external circuit board.

14. A connector detachably fitted to a target connector mounted on an external circuit board, wherein The connector has: a circuit board which is connected to an external device by signal lines; a conductive first housing through which a terminal portion of the circuit board passes and which is electrically connected to the external circuit board by means of the object connector; and a conductive second housing which covers at least a part of an object area which is an area of one main surface of the circuit board other than the terminal portion, The connector is detachably provided on the external circuit board by means of an abutting member fixed to the external circuit board. In a state where the connector is fixed to the main surface of the external circuit board, a part of the second housing is pressed by the abutting member to fix the connector to the main surface of the external circuit board. The connector further has a heat-conductive third housing which covers at least a part of an object area which is an area of the other main surface of the circuit board other than the terminal portion.

15. A connector which is detachably fitted to an object connector mounted on an external circuit board, wherein, The connector has: a circuit board which is connected to an external device by signal lines; a conductive first housing through which a terminal portion of the circuit board passes and which is electrically connected to the external circuit board by means of the object connector; and a conductive second housing which covers at least a part of an object area which is an area of one main surface of the circuit board other than the terminal portion, The connector is detachably provided on the external circuit board by means of an abutting member fixed to the external circuit board. The abutting member covers at least a part of an object area which is an area of the other main surface of the circuit board other than the terminal portion. The abutting member has a contact portion which contacts the other main surface of the circuit board. The contact portion contacts the circuit board at a position facing a heat-generating member disposed on the circuit board with the circuit board therebetween.

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