Method and process tool for analyzing an interface of a bonded workpiece

Abstract

The present invention relates to a method for analyzing an interface of a bonded workpiece and a related process tool. The method includes generating electromagnetic radiation directed toward a periphery of a pair of bonded workpieces and toward a radiation sensor disposed behind the periphery of the bonded workpieces. A scan is made along with the electromagnetic radiation. An intensity of the electromagnetic radiation is measured across the scan impinging on the radiation sensor. Measuring the intensity includes recording a plurality of intensity values of the electromagnetic radiation at a plurality of different locations along a vertical axis extending through a top surface and a bottom surface of the pair of bonded workpieces. A location of the interface between the pair of bonded workpieces is determined based on a maximum measured intensity value of the plurality of intensity values. The present invention can improve accuracy of the location of the interface between the bonded workpieces.

Description

Technical Field

[0001] This invention relates to a method and process tool for analyzing the interface of joined workpieces. Background Technology

[0002] Semiconductor device manufacturing is a process used to create integrated circuits found in everyday electronic devices. The manufacturing process is a multi-step sequence including deposition, photolithography, and chemical processing steps, during which electronic circuitry is gradually added to the wafer. In the manufacturing of multidimensional integrated chips (e.g., 3DICs), bonding steps can also be used to bond wafers to each other along the interface between wafers. Summary of the Invention

[0003] An embodiment of this disclosure provides a method for analyzing the interface between joined workpieces, comprising: generating electromagnetic radiation oriented toward the periphery of a pair of joined workpieces and toward a radiation sensor disposed behind the periphery of the pair of joined workpieces; scanning the electromagnetic radiation along a vertical axis extending from below the pair of joined workpieces to above the pair of joined workpieces; measuring the intensity of the electromagnetic radiation impacting the radiation sensor throughout the scan, wherein measuring the intensity includes recording a plurality of intensity values ​​of the electromagnetic radiation at a plurality of different locations along the vertical axis extending through the top and bottom surfaces of the pair of joined workpieces; and determining the location of the interface between the pair of joined workpieces based on the maximum measured intensity value of the plurality of intensity values.

[0004] An embodiment of this disclosure provides a method for analyzing the interface of bonded workpieces, comprising: determining the location of the interface between a pair of bonded workpieces; generating a first beam of electromagnetic radiation oriented toward the periphery of the interface between the pair of bonded workpieces and toward a radiation sensor disposed behind the periphery of the interface; measuring a first intensity of the first beam of electromagnetic radiation impacting the radiation sensor with the radiation sensor; depositing an undercoat at the interface between the pair of bonded workpieces; generating a second beam of electromagnetic radiation oriented toward the periphery of the interface between the pair of bonded workpieces and toward the radiation sensor disposed behind the periphery of the interface; measuring a second intensity of the second beam of electromagnetic radiation impacting the radiation sensor with the radiation sensor; and determining the volume of the undercoat based on the difference between the second intensity and the first intensity.

[0005] An embodiment of this disclosure provides a process tool for analyzing the interface of joined workpieces, comprising: a workpiece receiving structure configured to receive workpieces; radiation source electrodes arranged adjacent to and along the periphery of the workpiece receiving structure, wherein the radiation source electrodes are configured to generate electromagnetic radiation; a radiation sensor disposed along the periphery of the workpiece receiving structure and spaced apart from the radiation source electrodes, wherein the radiation sensor is configured to measure the intensity of the electromagnetic radiation impacting the radiation sensor; and a sensor control circuit coupled to the radiation sensor and configured to determine the position of the interface between a pair of joined workpieces disposed on the workpiece receiving structure, wherein the position of the interface is determined based on the intensity of the electromagnetic radiation measured by the radiation sensor. Attached Figure Description

[0006] The various aspects of this disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with industry standard practice, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of explanation.

[0007] Figure 1 The diagram shows cross-sectional views of some embodiments of a process tool including a radiation source electrode, a radiation sensor, and sensor control circuitry, used to determine the location of the interface between a pair of joined workpieces.

[0008] Figure 2 This shows a top view of some embodiments of a process tool including a radiation source electrode, a radiation sensor, and sensor control circuitry.

[0009] Figure 3 The diagram shows cross-sectional views of some embodiments of the process tool, including a transfer robot and transfer control circuitry.

[0010] Figures 4-6 The diagram illustrates some embodiments of the method for determining the location of the interface between a pair of joined workpieces.

[0011] Figure 7 The flowchart illustrates some embodiments of a method for determining the position of an interface between a pair of joined workpieces.

[0012] Figures 8-16 The diagram illustrates some embodiments of the method for determining the volume of the primer formed along the interface between a pair of joined workpieces.

[0013] Figure 17 The flowchart illustrates some embodiments of a method for determining the volume of a primer formed along the interface between a pair of joined workpieces.

[0014] Figures 18-22The diagram illustrates some embodiments of the method for determining the location of the primer formed along the interface between a pair of joined workpieces.

[0015] Figure 23 The flowchart illustrates some embodiments of a method for determining the location of an adhesive layer formed along the interface between a pair of joined workpieces. Detailed Implementation

[0016] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to simplify this disclosure. Of course, these components and arrangements are merely examples and are not intended to be limiting. For example, in the following description, forming a first feature above or on a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where an additional feature may be formed between the first and second features, such that the first and second features do not need to be in direct contact. Additionally, reference numerals and / or letters may be repeated in various instances of this disclosure. Such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0017] Additionally, for ease of description, spatially relative terms such as “below,” “below,” “under,” “above,” “above,” and “over” are used herein to describe the relationship between one component or feature and another component or feature(s) as shown in the figures. Besides the orientations depicted in the figures, spatially relative terms are intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein shall be interpreted accordingly.

[0018] In semiconductor manufacturing, chips can be bonded to form three-dimensional integrated circuits or other stacked integrated circuits. Typically, chips have beveled edges, leaving gaps along the periphery of the interface between chips. After bonding, one or more chips may undergo one or more thinning processes (e.g., polishing processes). The forces applied to the chips during the thinning process can cause damage at the gaps along the periphery of the interface. For example, as shown, the forces applied to the chip can increase the likelihood of the dielectric layers (e.g., interlayer dielectric (ILD) layers) on the chip experiencing peeling or other damage. To prevent this damage during the thinning process, a sealant (e.g., including a primer) can be formed in the closed path along the periphery of the interface to fill the gaps before performing the thinning process. The sealant can increase the structural integrity of the chip bond around the periphery of the bonded chips, thus reducing the likelihood of peeling or other damage to the chips during the thinning process.

[0019] In some processes, a sealing path (e.g., along the periphery of an interface) can be determined by capturing an image of the periphery of the bonded chip (e.g., using a camera), capturing an image based on the location of the bevel of the bonded chip, and determining the location of the interface between the bonded chip and the location of the bevel. A seal can then be formed along the determined sealing path (e.g., along the periphery of the determined interface). However, this method of determining the sealing path is easily affected by the quality of the bevel of the bonded chip and / or the quality of the bevel image. For example, if the bevel is rounded or otherwise smooth, the image may not clearly show the location of the bevel. Furthermore, if the image is unclear, the location of the bevel may be unclear. Therefore, errors can occur in determining the sealing path, and the seal may form in the wrong location (e.g., not at the interface). Incorrect seal formation can lead to peeling off of the dielectric layer and / or other chip damage during the thinning process.

[0020] Various embodiments and methods disclosed herein relate to determining the position at the interface between a pair of joined workpieces with improved accuracy, along with associated process tools. The method includes generating electromagnetic radiation with a radiation source electrode directed toward the periphery of the joined workpiece pair and a radiation sensor positioned behind the periphery of the joined workpiece pair. The radiation source electrode scans the electromagnetic radiation along a vertical axis extending between the joined workpieces. Furthermore, the radiation sensor measures the intensity of the electromagnetic radiation impacting the radiation source electrode and the radiation sensor throughout the scan. Measuring the intensity includes recording multiple radiation intensity values ​​corresponding to respective positions among multiple different locations along the vertical axis. Finally, the position of the interface between the joined workpiece pair, corresponding to the maximum measured radiation intensity value, is determined based on the radiation source electrode and the position along the vertical axis.

[0021] By using radiation sources and radiation sensors instead of cameras to determine the location of the interface, the accuracy of determining the location of the interface between joined workpieces can be improved. For example, since the radiation sources and radiation sensors do not depend on the quality of the edges of the joined workpieces at the interface, nor on the image quality captured by the camera, errors in determining the interface location can be reduced, thus improving the accuracy of interface determination.

[0022] Figure 1 A cross-sectional view 100 illustrates some embodiments of a process tool including a radiation source 106, a radiation sensor 108, and a sensor control circuit 112, used to determine the location of an interface 128 between a pair of joined workpieces 104. In some embodiments, Figure 1 Shown in the zy plane (e.g., extending along axes 101z and 101y).

[0023] The process tool includes a processing chamber 102. In some embodiments, a chip chuck 124 configured to receive workpieces is disposed within the processing chamber 102. In some embodiments, the workpiece may include a pair of engaged workpieces 104. In some embodiments, the chip chuck 124 is disposed on a rotor device 126 configured to rotate the chip chuck 124 and the pair of engaged workpieces 104 in clockwise 126a and / or counterclockwise 126b directions.

[0024] Radiation source 106 is adjacent to and arranged along the periphery of chip chuck 124. Radiation source 106 is configured to generate electromagnetic radiation 116 toward radiation sensor 108 (e.g., ultraviolet radiation, visible light radiation, infrared radiation, or some other electromagnetic radiation). In some embodiments, radiation source 106 is configured to perform a vertical scan of a pair of joined workpieces 104 with electromagnetic radiation 116 (e.g., between and / or through the top and bottom surfaces of the pair of joined workpieces 104). In some embodiments, radiation source 106 is coupled to a first driver device 118. In some embodiments, the first driver device 118 is configured to move radiation source 106 upward (e.g., 118u) and downward (e.g., 118d) along a vertical axis 101z. In some embodiments, the vertical axis 101z extends from below the pair of joined workpieces 104 to above the pair of joined workpieces 104. In some embodiments, the first driver device 118 is alternately configured to cause the radiation source electrode 106 to move upward and downward.

[0025] Radiation sensor 108 is located adjacent to and arranged along the periphery of chip chuck 124, spaced apart from radiation source 106, and faces radiation source 106. Radiation sensor 108 is configured to measure the intensity of electromagnetic radiation 116 impacting radiation sensor 108. In some embodiments, radiation sensor 108 is mounted on radiation sensor holder 120. Radiation sensor holder 120 may have a fixed position. Radiation sensor 108 may have a sufficiently large sensing area to receive electromagnetic radiation 116 at the height of a pair of joined workpieces 104. For example, the sensing area of ​​radiation sensor 108 may be large enough that radiation sensor 108 does not need to move with radiation source 106 along the vertical axis 101z to measure electromagnetic radiation 116 generated by radiation source 106 at different heights along the vertical axis 101z. In some embodiments, the radiation sensor 108 has a sensing area extending along the vertical axis 101z and at least along the radiation source pole 106 at a height configured to generate electromagnetic radiation (e.g., from the bottom surface of a pair of joined workpieces 104 to the top surface of a pair of joined workpieces 104).

[0026] In some embodiments, the optical component 110 is configured to focus electromagnetic radiation 116 adjacent to the radiation source 106. In some embodiments, the optical component 110 may include one or more lenses and / or mirrors. In some embodiments, one or more components of the optical component 110 (e.g., lenses and / or mirrors) are disposed on the second driver device 122, attached to the radiation source 106, and configured to move one or more components toward (e.g., 122t) and away from (e.g., 122a) the radiation source 106 along the horizontal axis 101y to adjust the focus of the electromagnetic radiation 116 generated by the radiation source 106. In some other embodiments, the position of the optical component 110 relative to the radiation source 106 is fixed. In such embodiments, both the optical component 110 and the radiation source 106 may be configured to move together horizontally along the horizontal axis 101y (e.g., via the first driver device 118).

[0027] Sensor control circuitry 112 is electrically coupled to radiation sensor 108 and radiation source 106. In some embodiments, sensor control circuitry is also electrically coupled to first driver device 118 and / or second driver device 122. Sensor control circuitry 112 is configured to determine a sealing path based on the measured intensity of electromagnetic radiation 116 generated by radiation source 106 and measured by radiation sensor 108. (e.g., the position of interface 128 between a pair of joined workpieces 104 extends more than 360° along the periphery of interface 128.)

[0028] By using a radiation source 106 and a radiation sensor 108 to determine the position of the interface 128 instead of a camera, the accuracy of determining the position of the interface 128 between the joined workpieces 104 can be improved. For example, since the radiation source 106 and the radiation sensor 108 are independent of the mass of the periphery of the joined workpieces 104 at the interface 128 and the image quality captured by the camera, the measurement error of the interface 128 can be reduced, thus improving the accuracy of the measurement.

[0029] Figure 2 This is a top view 200 showing some embodiments of a process tool including a radiation source electrode 106, a radiation sensor 108, and a sensor control circuit 112. In some embodiments, Figure 2 The tooling shown in the top view 200 corresponds to Figure 1 The process tool shown in the cross-sectional view 100. In some embodiments, Figure 2 Shown in the yx plane (e.g., extending along axis 101y and axis 101x).

[0030] In some embodiments, electromagnetic radiation 116 is generated along a path extending between radiation source 106 and radiation sensor 108 and the path is substantially tangent to the periphery of a pair of joined workpieces 104.

[0031] In some embodiments, sensor control circuitry 112 is further configured to determine the volume of primer material (not shown) present along the interface between a pair of bonded workpieces 104. For example, in some embodiments, radiation source 106 generates a first beam of electromagnetic radiation 116 oriented toward the periphery of the interface 128 between the bonded workpieces 104. Radiation sensor 108 measures a first radiation intensity of the first beam of electromagnetic radiation 116 passing through the periphery of the interface 128. Primer is deposited along the periphery of the interface between the pair of bonded workpieces 104. Radiation source 106 generates a second beam of electromagnetic radiation 116 oriented toward the primer along the periphery of the interface 128. Radiation sensor 108 measures a second radiation intensity of the second beam of electromagnetic radiation 116 passing through the primer along the periphery of the interface 128. Sensor control circuitry 112 determines the volume of primer present along the interface 128 based on the difference between the measured first radiation intensity and the measured second radiation intensity (for example, see...). Figures 8-16 and Figure 17 ).

[0032] In some embodiments, sensor control circuitry 112 is further configured to determine the location of the primer material. For example, in some embodiments, radiation source 106 generates a first beam of electromagnetic radiation 116 oriented toward the periphery of interface 128. Radiation sensor 108 measures a first radiation intensity of the first beam of electromagnetic radiation, such that it extends beyond the periphery of interface 128. Radiation source 106 generates a second beam of electromagnetic radiation 116 oriented toward the periphery of interface 128, the second beam having a different beam size than the first beam. Radiation sensor 108 measures a second radiation intensity of the second beam of electromagnetic radiation 116, such that it extends beyond the periphery of interface 128. Sensor control circuitry 112 determines the location of the primer present along interface 128 based on the first and second measured radiation intensities (see example, ...). Figures 18-22 and Figure 23 ).

[0033] Figure 3 A cross-sectional view 300 is shown in some embodiments of a process tool including a transfer robot 302 and a transfer control circuit 304.

[0034] In some embodiments, the transfer robot 302 is arranged in the transfer chamber 316 (e.g., a factory interface). In some embodiments, the transfer control circuitry 304 is configured to control the transfer robot 302. For example, the transfer control circuitry 304 may instruct the transfer robot 302 to move the joined workpiece 104 into and / or out of the processing chamber 102 for further processing.

[0035] In some embodiments, the process tool further includes a loading port 318 coupled to the transfer chamber 316. In some embodiments, the loading port 318 may be configured to receive a carrier 320 that accommodates one or more workpieces (e.g., joined workpieces 104). In various embodiments, the carrier 320 may include a front-opening unified pod (FOUP), a wafer cassette, etc. The transfer robot 302 may be configured to transfer workpieces from the carrier 320 to the processing chamber 102.

[0036] Furthermore, in some embodiments, for example, the bonded workpiece 104 may include a first workpiece 104a and a second workpiece 104b bonded to the first workpiece 104a. In some embodiments, for example, the first workpiece 104a may include a first substrate 306a, a first plurality of semiconductor devices 308a disposed within and / or along the first substrate 306a, a first dielectric structure 310a on the first substrate 306a, and a first interconnect structure 312a within the first dielectric structure 310a.

[0037] Similarly, in some embodiments, for example, the second workpiece 104b may include a second substrate 306b, a second plurality of semiconductor devices 308b disposed within and / or along the second substrate 306b, a second dielectric structure 310b on the second substrate 306b, and a second interconnect structure 312b within the second dielectric structure 310b. In some embodiments, the second workpiece 104b may be flipped relative to the first workpiece 104a (e.g., such that the second substrate 306b is above the second interconnect structure 312b).

[0038] Furthermore, in some embodiments, the radiation sensor 108 is configured to move upward (e.g., 314u) and downward (e.g., 314d) along the vertical axis 101z in a third actuator device 314. In some embodiments, the first actuator device 118 and the third actuator device 314 are configured to move together synchronously (e.g., such that the radiation source 106 and the radiation sensor 108 are kept at the same or similar heights along the vertical axis 101z).

[0039] In some embodiments, a pair of joined workpieces 104 (e.g., a first workpiece 104a and a second workpiece 104b) may be a pair of joined chips (e.g., a first chip and a second chip), a pair of joined substrates, etc. In some embodiments, the chip chuck 124 may also be referred to as a workpiece receiving structure. In some embodiments, for example, the rotor device 126 may be or include a motorized spinning rotor or some other suitable device.

[0040] In some embodiments, the deposition device 114 is attached to the radiation source electrode 106. In some embodiments, the deposition device 114 is adjacent to and spaced apart from the radiation source electrode 106. The deposition device 114 is configured to deposit one or more materials (e.g., primer, etc.) on one or more surfaces of a pair of joined workpieces 104.

[0041] In some embodiments, for example, the radiation source 106 may be or include a laser, a light-emitting diode, or some other suitable device. In some embodiments, the radiation sensor 108 may be or include a photodiode, a phototransistor, some other photodetector, a complementary metal-oxide-semiconductor (CMOS) image sensor, or some other suitable device sensor.

[0042] In some embodiments, for example, the first actuator 118, the second actuator 122, and / or the third actuator 314 may be a motorized actuator, other electric arms, robotic arms, or other suitable devices. In some embodiments, the first actuator 118, the second actuator 122, and / or the third actuator 314 may include a stepper motor or other devices with stepping capabilities, configured to step via different discrete positions. In some embodiments, the optical component 110 may be or include a focusing lens capable of generating a Gaussian beam (e.g., a beam with the same or similar intensity distribution as a Gaussian distribution), other suitable lenses, or other suitable devices.

[0043] In some embodiments, the deposition device 114 may be or include a jet valve, some micro-dispensing valves, some other dispensing valves, or some other suitable deposition device.

[0044] Figures 4-6 Some embodiments of a method for determining the location of an interface between a pair of joined workpieces are illustrated. Although Figures 4-6 It is described in relation to the method, but it should be understood that... Figures 4-6 The structures disclosed in the document are not limited to such methods, but can exist independently of methods as structures.

[0045] like Figure 4 As shown in the cross-sectional view 400, a pair of joined workpieces 104 are transformed into a processing chamber 102. The pair of joined workpieces 104 are placed in the processing chamber 102 (e.g., such that the straight line between the radiation source electrode 106 and the radiation sensor 108 is tangent to the periphery of the pair of joined workpieces 104). In some embodiments, a transfer robot (e.g.) Figure 3 The transfer robot 302) transfers the joined workpiece 104 into the processing chamber 102.

[0046] The radiation source 106 then generates electromagnetic radiation 116 directed toward the periphery of a pair of joined workpieces 104 and a radiation sensor 108 disposed behind the periphery of the pair of joined workpieces 104 and in the path of the electromagnetic radiation 116. The radiation source 106 scans along a vertical axis 101z while generating electromagnetic radiation 116. In some embodiments, the scanning may include positioning the radiation source 106 at multiple different locations. In some embodiments, a first actuator 118 moves the radiation source upward (e.g., upward 118u) throughout the scanning process, moving from below the interface 128 to above the interface 128. In some embodiments, the first actuator 118 moves the radiation source 106 upward throughout the scanning process. In some alternative embodiments, the first actuator 118 alternately moves downward (e.g., downward) throughout the scanning process. Figure 1 The radiation source electrode 106 is moved downwards (118d) from above the interface 128 and below the interface 128. In some other alternative embodiments, the radiation source electrode 106 has a fixed vertical position instead of being scanned along the vertical axis 101z. In some embodiments, the radiation sensor 108 is stationary throughout the scan. In some alternative embodiments, the radiation sensor 108 moves along the vertical axis 101z with the radiation source electrode 106 along a third driver device (e.g., Figure 3 The third driver device 314 in the middle.

[0047] like Figure 5 As shown in the cross-sectional view 500, the electromagnetic radiation 116 is scanned by moving along the vertical axis at multiple different positions (e.g., heights 502h, 504h, and 506h) via the first driver device 118.

[0048] For example, in some embodiments, the generated electromagnetic radiation 116 passes through a first height 502h of a pair of joined workpieces 104, as shown in the first radiation beam cross-section 502. In such an embodiment, the electromagnetic radiation 116 then moves upward along the vertical axis 101z to a second height 504h, as shown in the second radiation beam cross-section 504. In such an embodiment, the electromagnetic radiation 116 then moves upward along the vertical axis 101z as shown in the third radiation beam cross-section 506 to a third height 506h.

[0049] The radiation sensor 108 measures the intensity of the electromagnetic radiation 116 impacting the radiation sensor 108 throughout the entire scanning process. Figure 6 Figure 600 illustrates some exemplary values ​​of electromagnetic radiation 116 at different locations. In some embodiments, measuring the intensity includes recording corresponding locations (e.g., along the vertical axis 101z) at various points. Figure 5 Multiple discrete radiation intensity values ​​(e.g., intensity values ​​602, 604, and 606) at altitudes of 502h, 504h, and 506h. For example, when electromagnetic radiation 116 is located at the first altitude ( Figure 5 At an altitude of 502h, if Figure 5 The first cross-section 502 of the radiation beam is shown, and the measured radiation intensity is quantified by the first radiation intensity value 602. When the electromagnetic radiation 116 is located at the second height ( Figure 5 At an altitude of 504h, if Figure 5 The second radiation beam cross-section 504 is shown, and the measured radiation intensity is quantified by the second radiation intensity value 604. When the electromagnetic radiation 116 is located at the third height ( Figure 5 At an altitude of 506h, if Figure 5 The third radiation beam cross-section 506 is shown, and the measured radiation intensity is quantified by the third radiation intensity value 606. In some embodiments, the pair of joined workpieces 104 are rotated clockwise or counterclockwise throughout the measurement of electromagnetic radiation 116.

[0050] Based on the position along the vertical axis 101z corresponding to the maximum radiation intensity value (e.g., intensity value 604) measured by the sensor control circuit 112 (e.g., position along the vertical axis 101z). Figure 5 The height of the interface 128 between a pair of joined workpieces 104 is determined by the height of the interface 128 (e.g., the height of the interface 128 is 128h). For example, because the maximum measured radiation intensity value is at the second height (504h), the position of the interface 128 between the two joined workpieces 104 is determined. Figure 5 The height 128h of the interface 128 (e.g., the position of the interface 128) was measured at a height of 504h, so the sensor control circuit 112 determines that the height 128h of the interface 128 is equal to the second height ( Figure 5 (Height 504h).

[0051] Although the above examples describe the radiation source 106 generating electromagnetic radiation at three discrete heights and determining the location of the interface based on the corresponding intensity values ​​measured at the three discrete heights, it should be understood that in some embodiments, the radiation source 106 may alternately generate electromagnetic radiation at another number (e.g., four, five, six, seven, etc.) of discrete heights, or the radiation source 106 may alternately generate electromagnetic radiation in a continuous manner along the vertical axis 101z (e.g., as shown in the image). Figure 6 (The black data cable shown).

[0052] Figure 7 Flowcharts illustrating some embodiments of a method 700 for determining the location of an interface between a pair of joined workpieces are provided. Although the disclosed methods (e.g., method 700, method 1700, and / or method 2300) are shown and described below as a series of steps or events, it will be understood that this ordering of steps or events should not be interpreted as limiting. For example, some steps may occur in a different order and / or simultaneously with other steps or events besides those shown and / or described herein. Furthermore, not all the steps shown may be required to implement one or more aspects or embodiments described herein. Additionally, one or more steps described herein may be performed in one or more separate steps and / or periods.

[0053] In step 702, electromagnetic radiation is generated toward the periphery of the pair of joined workpieces. Figure 4 A cross-sectional view 400 is shown, corresponding to some embodiments of step 702.

[0054] In step 704, a scan is performed along the vertical axis using electromagnetic radiation. Figure 4 and Figure 5 Cross-sectional views 400 and 500 corresponding to some embodiments of step 704 are shown.

[0055] In step 706, throughout the scanning process, the intensity of electromagnetic radiation passing through the periphery of a pair of joined workpieces is measured. Figure 6 The diagram 600 corresponds to step 706.

[0056] In step 708, the position of the interface between a pair of joined workpieces is determined based on the position along the vertical axis corresponding to the position of the maximum measured electromagnetic radiation intensity. Figures 4-6 Some embodiments corresponding to step 708 are shown.

[0057] In some embodiments, a pair of engaged workpieces are rotated clockwise or counterclockwise continuously during one or more steps of method 700.

[0058] Figures 8-16 Some embodiments of a method for determining the volume of a primer formed along the interface 128 between a pair of joined workpieces 104 are illustrated. Although Figures 8-16 It is described in relation to the method, but it should be understood that... Figures 8-16 The structures disclosed in the document are not limited to such methods, but can exist independently as structures independent of methods.

[0059] like Figure 8 As shown in the cross-sectional view 800, the location of the interface 128 between a pair of joined workpieces 104 is defined. In some embodiments, the location of the interface 128 can be determined using... Figures 4-6 The method shown is used to determine this. In some other embodiments, the position of interface 128 may have been sensed by sensor control circuitry 112.

[0060] like Figure 9 As shown in the cross-sectional view 900, the radiation source pole (e.g.) Figure 8 The radiation source 106), the first beam 902 that generates electromagnetic radiation 116 is directed toward the periphery of the interface 128 between a pair of joined workpieces 104 and toward a radiation sensor (e.g., a radiation sensor disposed behind the periphery of the interface 128). Figure 8 The radiation sensor 108. A first beam 902 of electromagnetic radiation 116 is generated at a height 128h of interface 128. The radiation sensor measures the first radiation intensity value of the first beam 902 of electromagnetic radiation 116 (e.g., through the periphery of interface 128) striking the radiation sensor.

[0061] Sensor control circuit (e.g., Figure 8 The sensor control circuit 112 in the middle then analyzes the first radiation intensity value. Figure 10 Image 1002 shows the first beam 902 as recorded by a radiation sensor. It can be seen from image 1002 that almost the entire first beam 902 impacts the radiation sensor. This can also be seen in graph 1004, which measures the relationship between electromagnetic radiation intensity and position along line AA′, which overlays image 1002 of the first beam 902. In graph 1004, it can be seen that the intensity is lower near the periphery of the first beam 902 (e.g., at points 1006 and 1010 along line AA′), while the intensity is higher near the center of the first beam 902 (e.g., at point 1008 along line AA′). This is consistent with the properties of a Gaussian beam.

[0062] like Figure 11 As shown in the cross-sectional view 1100, the first layer 1102 of the primer forms a closed path along the periphery of the interface 128 between a pair of bonded workpieces 104. In some embodiments, the first layer 1102 of the primer is formed by using a deposition device (e.g., Figure 8 The deposition device 114 is formed by depositing epoxy resin or some other suitable material along the periphery of the interface 128. In some embodiments, the deposition device may deposit a first layer 1102 of primer via a valve-controlled nozzle, which may deposit primer in a small droplet and non-contact manner (e.g., the deposition device may not be in contact with a pair of bonded workpieces 104).

[0063] like Figure 12 As shown in the cross-sectional view 1200, the second beam 1202 of electromagnetic radiation 116 generated by the radiation source is oriented toward the periphery of the interface 128 and toward the radiation sensor. Furthermore, the radiation sensor measures the second radiation intensity value of the second beam 1202 of electromagnetic radiation 116 striking the radiation sensor.

[0064] Next, the sensor control circuit analyzes the second radiation intensity value. Figure 13 Image 1302 is shown in the second beam 1202 recorded by the radiation sensor. As can be seen in image 1302, a portion of the second beam 1202 (e.g., portion 1202b) did not impact the radiation sensor (e.g., it was blocked by the radiation sensor), while another portion of the second beam 1202 (e.g., indicated by the shaded area) impacted the radiation sensor. This can also be seen in graph 1304, which measures the relationship between electromagnetic radiation intensity and position along line BB′, which covers image 1302 of the second beam 1202. In graph 1304, it can be seen that the intensity is approximately zero for the entire portion of the second beam 1202 that did not impact the radiation sensor (e.g., portion 1202b) (e.g., at point 1306 along line BB′), while the intensity is greater than zero for the entire portion of the second beam 1202 that impacted the radiation sensor (e.g., at points 1308 and 1310 along line BB′).

[0065] Next, the sensor control circuit determines the first volume of the first layer 1102 of the base adhesive based on the difference between the first measured radiation intensity and the second measured radiation intensity. In some embodiments, the sensor control circuit can determine the volume of the first layer 1102 of the base adhesive by comparing the area of ​​electromagnetic radiation sensed by the radiation sensor during the generation of the first beam (i.e., the first beam receiving area) with the area of ​​electromagnetic radiation sensed by the radiation sensor during the generation of the second beam (i.e., the second beam receiving area). For example, in such an embodiment, the sensor control circuit can subtract the area of ​​the latter (i.e., the second beam receiving area) from the area of ​​the former (i.e., the first beam receiving area). In some embodiments, an integral analysis of the first and second measured intensities (e.g., integrating the intensity data recorded during the generation of the first beam 902 and integrating the intensity data recorded during the generation of the second beam 1202) can be used to compare the difference based on the integral analysis and to determine the volume of the first layer 1102 of the base adhesive based on the comparison result.

[0066] In some embodiments, the steps of generating the first beam 902 and measuring the first intensity can be omitted, and the sensor control circuit can use data from determining the position of interface 128 instead of the first intensity data used to determine the volume of the first layer 1102 of the primer. For example, in such an embodiment, the sensor control circuit can analyze the intensity measured at the interface during the step of determining the interface position, and can use this intensity as the first measured radiation intensity to determine the volume of the primer. In other words, the sensor control circuit can determine the volume of the first layer 1102 of the primer based on the difference between a second measured radiation intensity and the maximum measured radiation intensity recorded during the determination of the interface position.

[0067] In some embodiments, portions of the above method are repeated until the desired amount of primer is reached. For example, in some embodiments, more primer may be added at interface 128 and the new volume of primer may be determined, such as... Figures 14-16 As shown in the diagram. In some embodiments, the volume of the primer may be equal to the volume required after a single iteration of the method. In some and embodiments, more than one iteration (e.g., two iterations, three iterations or more) may be used to achieve the required volume of the primer.

[0068] like Figure 14 As shown in the cross-sectional view 1400, a second layer 1402 of the primer is formed in a closed path along interface 128 and above the first layer 1102 of the primer. In some embodiments, the second layer 1402 of the primer is formed by using a deposition device (e.g., Figure 8The deposition device 114 is formed by depositing epoxy resin or some other suitable material along the periphery of the interface 128.

[0069] like Figure 15 As shown in the cross-sectional view 1500, the radiation source pole of the electromagnetic radiation 116 generates a third beam 1502 oriented toward the periphery of the interface 128 and toward the radiation sensor. Furthermore, the radiation sensor measures the third radiation intensity value of the third beam 1502 of the electromagnetic radiation 116 that strikes the radiation sensor.

[0070] Next, the sensor control circuit analyzes the third radiation intensity value. Figure 16 Image 1602 shows the third beam 1502 recorded by a radiation sensor. As seen in image 1602, the portion of the third beam 1502 that did not impact the radiation sensor (e.g., portion 1502b) (e.g., blocked by the radiation sensor), while another portion of the third beam 1502 (e.g., indicated by the shaded area) impacted the radiation sensor. This can also be seen in graph 1604, which measures the relationship between electromagnetic radiation intensity and positions along line C-C', which covers image 1602 of the third beam 1502. In graph 1604, it can be seen that the intensity of the entire portion of the third beam 1502 that did not impact the radiation sensor (e.g., points 1606 and 1608 along line C-C') (e.g., 1502b) is approximately zero, while the intensity of the entire portion of the third beam 1502 that impacted the radiation sensor (e.g., point 1610 along line C-C') is greater than zero.

[0071] Then, the sensor control circuit determines a second volume of the combination of the first layer 1102 and the second layer 1402 of the primer. In some embodiments, the second volume is determined based on the difference between a first measured radiation intensity and a third measured radiation intensity. In some embodiments, the second volume is determined based on the difference between a second measured radiation intensity and a third measured radiation intensity. In other embodiments, the second volume is determined based on the difference between the first measured radiation intensity, the second measured radiation intensity, and the third measured radiation intensity.

[0072] In some embodiments, the sensor control circuit can compare the area of ​​electromagnetic radiation sensed by the periodic radiation sensor of the first beam 902 that generates electromagnetic radiation with the area of ​​electromagnetic radiation sensed by the periodic radiation sensor of the third beam 1502 that generates electromagnetic radiation (e.g., the area of ​​the latter can be subtracted from the area of ​​the former) to determine the second volume of the base adhesive (e.g., a combination of the first layer 1102 and the second layer 1402).

[0073] In some embodiments, it is determined that an integral analysis of the first measured strength and the third measured strength can be used, and the second volume of the base adhesive can be determined based on the difference between the integral analysis.

[0074] Figure 17 The flowchart illustrates some embodiments of a method 1700 for determining the volume of a primer formed along the interface between a pair of joined workpieces.

[0075] In step 1702, the position in the interface between a pair of joined workpieces is determined. Figures 4-6 and Figure 8 Some embodiments corresponding to step 1702 are shown.

[0076] In step 1704, a first beam of electromagnetic radiation (first beam electromagnetic radiation) is generated, the first beam of electromagnetic radiation being directed toward the periphery of the interface between a pair of joined workpieces. Figure 9 A cross-sectional view 900 is shown, corresponding to some embodiments of step 1704.

[0077] At step 1706, the first radiation intensity of the first beam of electromagnetic radiation passing through the periphery of the interface is measured. Figure 9 and Figure 10 Some embodiments corresponding to step 1706 are shown.

[0078] In step 1708, a primer is deposited around the periphery of the interface between a pair of joined workpieces. Figure 11 A cross-sectional view 1100 is shown, corresponding to some embodiments of step 1708.

[0079] In step 1710, a second beam of electromagnetic radiation is generated (second beam electromagnetic radiation) directed toward the periphery of the interface of the substrate deposition. Figure 12 A cross-sectional view 1200 is shown, corresponding to some embodiments of step 1710.

[0080] At step 1712, the second radiation intensity of the second beam of electromagnetic radiation passing through the periphery of the interface of the substrate deposition is measured. Figure 12 and Figure 13 Some embodiments corresponding to step 1712 are shown.

[0081] In step 1714, the volume of the primer present along the interface is determined based on the difference between the first measured radiation intensity and the second measured radiation intensity. Figure 13 Some embodiments corresponding to step 1714 are shown.

[0082] In step 1716, repeat steps 1708 to 1714 until the desired base coat volume is achieved. Figures 14-16Some embodiments corresponding to step 1716 are illustrated. As exemplified, additional primer may be deposited along the periphery of the interface between a pair of bonded workpieces. A third beam of electromagnetic radiation is generated toward the periphery of the primer-deposited interface, along the periphery of the interface between the pair of bonded workpieces. A third radiation intensity of the third beam of electromagnetic radiation passing through the periphery of the primer-deposited interface is measured. Based on the difference between the first and third measured radiation intensities, a new volume of primer present along the interface is determined.

[0083] In step 1718, a thinning process is performed on the pair of joined workpieces. For example, the thinning process may be performed on the top workpiece of the pair of joined workpieces. In some embodiments, the thinning process may include a grinding process, etc. For example, in such an embodiment, a grinding wheel may be applied to the top workpiece of the pair of joined workpieces to thin the top workpiece. In some embodiments, during the thinning process, an undercoat deposited at the interface can help prevent the stripping of the dielectric layer on the pair of joined workpieces.

[0084] In some embodiments, a pair of joined workpieces are rotated clockwise or counterclockwise continuously during one or more steps of method 1700.

[0085] Figures 18-22 Some embodiments of a method for determining the location of a primer formed along the interface 128 between a pair of joined workpieces 104 are illustrated. Although Figures 18-22 It is described in relation to the method, but it should be understood that... Figures 18-22 The structures disclosed in the document are not limited to such methods, but can exist independently of methods as structures.

[0086] like Figure 18 As shown in the cross-sectional view 1800, the location of the interface 128 between a pair of joined workpieces 104 is defined. In some embodiments, the location of the interface 128 can be determined using... Figures 4-6 The method shown is used to determine this. In some other embodiments, the position of interface 128 may have been sensed by sensor control circuitry 112.

[0087] Figure 19 and Figure 20 This illustrates a first example of a method for forming a base coat 1902 along interface 128.

[0088] like Figure 19 Cross-sectional view 1900, radiation source pole (e.g., Figure 18The radiation source 106 generates a first beam 1904 of electromagnetic radiation 116, which is directed toward the periphery of the interface 128 between a pair of joined workpieces 104. A radiation sensor (e.g., Figure 18 The radiation sensor 108 measures the first radiation intensity of the first beam 1904 of electromagnetic radiation 116 impacting the periphery of interface 128 on the radiation sensor.

[0089] Sensor control circuit (e.g., Figure 18 The sensor control circuit 112) analyzes the first radiation intensity. Figure 20 Image 2002 shows the first beam 1904 recorded by the radiation sensor. As can be seen in image 2002, almost no first beam 1904 impacts the radiation sensor (e.g., as indicated by region 1904b). This can also be seen in graph 2004, which measures the relationship between electromagnetic radiation intensity and location along line DD′, which covers image 2002 of the first beam 1904. In graph 2004, it can be seen that the intensity at points 2006, 2008, and 2010 along line DD′ is approximately zero. This is because the adhesive 1902 has blocked almost the entire first beam 1904 from impacting the radiation sensor.

[0090] The radiation source then generates a second beam 1906 of electromagnetic radiation 116 directed toward the periphery of the interface 128. The second beam 1906 has a different beam size than the first beam 1904 (e.g., the second beam 1906 may have a different radius than the first beam 1904). A radiation sensor measures the second radiation intensity of the second beam 1906 of electromagnetic radiation 116 passing through the periphery of the interface 128.

[0091] In some embodiments, when generated via electromagnetic radiation, the position of the optical components is adjusted (e.g., Figure 18 The optical component 110 is used to change the beam size. For example, the second driver (e.g., Figure 18 The second driver 122) can move the lens horizontally along the y-axis to adjust the focal point of the electromagnetic radiation generated by the radiation source pole, thereby adjusting the beam size of the electromagnetic radiation.

[0092] Next, the sensor control circuit analyzes the second radiation intensity. Figure 20Image 2012 shows the second beam 1906 recorded by the radiation sensor. As can be seen in image 2012, almost no second beam 1906 impacts the radiation sensor (e.g., as indicated by region 1906b). This can also be seen in graph 2014, which measures the relationship between electromagnetic radiation intensity and location along line EE′, which covers image 2012 of the second beam 1906. In graph 2014, it can be seen that the intensity along line EE′ is approximately zero at points 2016, 2018, and 2020. This is because the adhesive 1902 has blocked almost the entire second beam 1906 from impacting the radiation sensor.

[0093] The sensor control circuit then determines the location of the adhesive along interface 128 based on the measured first radiation intensity and the measured second radiation intensity. For example, because almost no first beam 1904 and second beam 1906 impact the radiation sensor, the sensor control circuit can determine that the adhesive is indeed located at interface 128 between the pair of joined workpieces 104. In other words, because the two generated beams (e.g., first beam 1904 and second beam 1906) are directed toward the periphery of interface 128, and because neither beam impacts the radiation sensor, the sensor control circuit can determine that the adhesive blocks the beams intended to reach the radiation sensor, and therefore can determine that the adhesive is located at interface 128.

[0094] Figure 21 and Figure 22 The second example of the method is shown, in which the base adhesive 2102 is not located at interface 128.

[0095] like Figure 21 As shown in the cross-sectional view 2100, the first beam of electromagnetic radiation 116 generated by the radiation source is directed toward the periphery of the interface 128 between a pair of joined workpieces 104. A radiation sensor measures the first radiation intensity of the first beam 2104 of electromagnetic radiation 116 passing through the periphery of the interface 128 and impacting the radiation sensor.

[0096] The sensor control circuit analyzes the first radiation intensity. Figure 22 Image 2202 shows the first beam 2104 recorded by the radiation sensor. As can be seen from image 2202, almost the entire first beam 2104 impacts the radiation sensor. This can also be seen in graph 2204, which measures the relationship between electromagnetic radiation intensity and position along line FF′, which covers image 2202 of the first beam 2104. In graph 2204, it can be seen that the intensity along line FF′ is greater than zero at points 2206, 2208, and 2210. This is because the adhesive 2102 provides almost no obstruction to the first beam 2104 impacting the radiation sensor.

[0097] The radiation source then generates a second beam 2106 of electromagnetic radiation 116 directed toward the periphery of the interface 128. The second beam 2106 has a different beam size than the first beam 2104 (e.g., the second beam 2106 may have a different radius than the first beam 2104). A radiation sensor measures the second radiation intensity of the second beam 2106 of electromagnetic radiation 116 passing through the periphery of the interface 128. In some embodiments, by adjusting the position in the lens (e.g., ...), Figure 18 The lens 110 is used to adjust the size of the electromagnetic radiation beam.

[0098] Then the sensor control circuit analyzes the second radiation intensity. Figure 22 Image 2212 shows the second beam 2106 recorded by the radiation sensor. As seen in image 2212, a portion of the second beam 2106 impacts the radiation sensor (e.g., as shown in the shaded area), while a portion of the second beam 2106 (e.g., portion 2106b) does not impact the radiation sensor (e.g., the radiation sensor is blocked). This can also be seen in graph 2214, which measures the relationship between electromagnetic radiation intensity and position along line GG′, which overlays image 2212 of the second beam 2106. In graph 2214, it can be seen that the intensity along line GG′ is approximately zero at point 2216, while the intensity along line EE′ is greater than zero at points 2218 and 2220. This is because the adhesive 2102 blocks a portion of the second beam 2106 from impacting the radiation sensor.

[0099] Next, the sensor control circuit determines the location of the primer 2102 along the interface based on the measured first radiation intensity and the measured second radiation intensity. For example, since almost all of the first beam 2104 impacts the radiation sensor, while only a portion of the second beam 2106 impacts the radiation sensor, the sensor control circuit can determine that the primer 2102 is not at the interface 128 between the pair of joined workpieces 104. In other words, because the two generated beams (e.g., the first beam 1904 and the second beam 1906) are directed toward the periphery of the interface 128, and because the two beams produce different intensity measurements, the sensor control circuit can determine that the primer 2102 is near the interface, but not precisely located at the interface 128.

[0100] Figure 23 The flowchart illustrates some embodiments of a method 2300 for determining the location of an adhesive layer formed along the interface between a pair of joined workpieces.

[0101] In step 2302, the position in the interface between a pair of joined workpieces is determined. Figures 4-6 and Figure 18Some embodiments corresponding to step 2302 are shown.

[0102] In step 2304, a first beam of electromagnetic radiation (first beam electromagnetic radiation) is generated, the first beam of electromagnetic radiation being directed toward the periphery of the interface between a pair of joined workpieces. Figure 19 and / or Figure 21 Cross-sectional views 1900 and / or 2100, respectively, are shown for some embodiments corresponding to step 2304.

[0103] In step 2306, the first radiation intensity of the first beam of electromagnetic radiation passing through the periphery of interface 128 is measured. Figure 20 and / or Figure 22 Some embodiments corresponding to step 2306 are shown.

[0104] In step 2308, a second beam of electromagnetic radiation (second beam electromagnetic radiation) is generated, the second beam of electromagnetic radiation is directed toward the periphery of the interface, and the second beam has a different beam size than the first beam. Figure 19 and / or Figure 21 Cross-sectional views 1900 and / or 2100, respectively, are shown for some embodiments corresponding to step 2308.

[0105] In step 2310, the second radiation intensity of the second beam of electromagnetic radiation passing through the periphery of the interface is measured. Figure 20 and / or Figure 22 Some embodiments corresponding to step 2310 are shown.

[0106] In step 2312, the location of the primer present along the interface is determined based on the measured first radiation intensity and the measured second radiation intensity. Figure 20 and / or Figure 22 Some embodiments corresponding to step 2312 are shown.

[0107] At step 2314, a thinning process is performed on the bonded workpiece pair. In some embodiments, during the thinning process, an undercoat deposited at the interface can help prevent the dielectric layer from peeling off from the bonded workpiece pair.

[0108] In some embodiments, a pair of joined workpieces are rotated clockwise or counterclockwise continuously during one or more steps of method 2300.

[0109] Therefore, this disclosure relates to a method for determining the position in the interface between a pair of joined workpieces in a manner with improved accuracy, and further to a process tool for performing said method.

[0110] Therefore, in some embodiments, the present invention relates to a method. The method includes generating electromagnetic radiation oriented toward the periphery of a pair of joined workpieces and toward a radiation sensor disposed behind the periphery of the pair of joined workpieces. The electromagnetic radiation is scanned along a vertical axis extending from below the pair of joined workpieces to above the pair of joined workpieces. The intensity of the electromagnetic radiation impacting the radiation sensor throughout the scan is measured. Measuring the intensity includes recording multiple intensity values ​​of the electromagnetic radiation at multiple different locations along the vertical axis extending through the top and bottom surfaces of the pair of joined workpieces. The location of the interface between the pair of joined workpieces is determined based on the maximum measured intensity value among the multiple intensity values.

[0111] According to some embodiments of this disclosure, the location of the interface is represented by the position along the vertical axis corresponding to the maximum measured intensity value. According to some embodiments of this disclosure, the method further includes: after determining the location of the interface, forming an adhesive at the interface between the pair of joined workpieces. According to some embodiments of this disclosure, the method further includes: after forming the adhesive at the interface, generating another beam of electromagnetic radiation oriented toward the interface and toward the radiation sensor; and measuring another radiation intensity of the other beam of electromagnetic radiation impacting the radiation sensor using the radiation sensor. According to some embodiments of this disclosure, the method further includes: determining the volume of the adhesive based on the difference between the other radiation intensity and the maximum measured intensity value. According to some embodiments of this disclosure, the method further includes: determining the location of the adhesive based on a measured radiation intensity of a first beam of electromagnetic radiation having a first beam size, and a second measured radiation intensity of a second beam of electromagnetic radiation having a second beam size different from the first beam size. According to some embodiments of this disclosure, a first driver moves a radiation source electrode along the vertical axis, the radiation source electrode being configured to generate the electromagnetic radiation; and a second driver moves the radiation sensor synchronously with the first driver along the vertical axis.

[0112] In other embodiments, the invention relates to a method. The method includes determining the location of the interface between a pair of joined workpieces. A first beam of electromagnetic radiation is generated, oriented toward the periphery of the interface between the pair of joined workpieces and toward a radiation sensor disposed behind the periphery of the interface. A first intensity of the first beam of electromagnetic radiation impacting the radiation sensor is measured using the radiation sensor. An undercoat is deposited at the interface between the pair of joined workpieces. A second beam of electromagnetic radiation is generated, oriented toward the periphery of the interface between the pair of joined workpieces and toward the radiation sensor disposed behind the periphery of the interface. A second intensity of the second beam of electromagnetic radiation impacting the radiation sensor is measured using the radiation sensor. The volume of the undercoat is determined based on the difference between the second intensity and the first intensity.

[0113] According to some embodiments of this disclosure, determining the location of the interface includes scanning along a vertical axis with the first beam of the electromagnetic radiation, and measuring the first intensity of the first beam of the electromagnetic radiation impacting the radiation sensor throughout the scan with the radiation sensor, wherein the vertical axis extends from below the pair of joined workpieces to above the pair of joined workpieces. According to some embodiments of this disclosure, determining the location in the interface further includes determining the maximum intensity measured by the radiation sensor and determining the location along the vertical axis corresponding to the maximum intensity. According to some embodiments of this disclosure, determining the volume of the primer includes subtracting the beam-receiving area of ​​the electromagnetic radiation sensed by the radiation sensor during the period in which the first beam of the electromagnetic radiation is generated from the beam-receiving area of ​​the electromagnetic radiation sensed by the radiation sensor during the period in which the second beam of the electromagnetic radiation is generated. According to some embodiments of this disclosure, determining the volume of the primer includes integrating the intensity data recorded during the period in which the first beam of the electromagnetic radiation is generated and integrating the intensity data recorded during the period in which the second beam of the electromagnetic radiation is generated. According to some embodiments of this disclosure, additional primer is deposited at the interface between the two bonded workpieces. According to some embodiments of this disclosure, a new volume is determined where the primer combines with the additional primer.

[0114] In another embodiment, the invention relates to a process tool comprising a workpiece receiving structure configured to receive workpieces. Radiation sources are arranged adjacent to and along the periphery of the workpiece receiving structure. The radiation sources are configured to generate electromagnetic radiation. A radiation sensor is disposed along the periphery of the workpiece receiving structure and spaced apart from the radiation sources. The radiation sensor is configured to measure the intensity of the electromagnetic radiation impacting the radiation source. A sensor control circuit, coupled to the radiation sensor and configured to determine the position of the interface between a pair of joined workpieces disposed on the workpiece receiving structure. The position of the interface is determined based on the intensity of the electromagnetic radiation measured by the radiation sensor.

[0115] According to some embodiments of this disclosure, the device further includes: a first driver configured to move the radiation source electrode along a vertical axis to generate the electromagnetic radiation at different heights along the vertical axis, wherein the vertical axis extends from below the pair of joined workpieces to above the pair of joined workpieces; and a rotor configured to rotate the workpiece receiving structure. According to some embodiments of this disclosure, the device further includes: a second driver configured to move the radiation sensor synchronously with the first driver along the vertical axis. According to some embodiments of this disclosure, the device further includes: a deposition device configured to deposit an undercoat along the interface without contacting the pair of joined workpieces. According to some embodiments of this disclosure, the device further includes: a lens configured to receive the electromagnetic radiation by the radiation source electrode and generate a Gaussian beam; and a driver configured to move the lens along a horizontal axis to adjust the focus of the electromagnetic radiation. According to some embodiments of this disclosure, a line extending between the radiation source electrode and the radiation sensor is tangent to the periphery of the pair of joined workpieces.

[0116] The foregoing summary outlines features of several embodiments to enable those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art will understand that this disclosure can be readily used as a basis for designing or modifying other processes and structures for achieving the same purposes and / or advantages as the embodiments introduced herein. Those skilled in the art will also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and modifications can be made herein without departing from the spirit and scope of this disclosure.

Claims

1. A method for analyzing the interface of joined workpieces, comprising: Electromagnetic radiation is generated, which is directed toward the periphery of a pair of joined workpieces and toward a radiation sensor disposed behind the periphery of the pair of joined workpieces. The electromagnetic radiation is scanned along a vertical axis extending from below the pair of joined workpieces to above the pair of joined workpieces. The intensity of the electromagnetic radiation from the entire scanning impact on the radiation sensor is measured, wherein measuring the intensity includes recording multiple intensity values ​​of the electromagnetic radiation at multiple different locations along the vertical axis extending through the top and bottom surfaces of the pair of joined workpieces. as well as The position of the interface between the pair of joined workpieces is determined based on the maximum measured strength value among the plurality of strength values.

2. The method of claim 1, wherein the position along the vertical axis corresponding to the maximum measured intensity value represents the position of the interface.

3. The method according to claim 1, further comprising: After determining the location of the interface, a primer is formed at the interface between the pair of joined workpieces.

4. The method according to claim 3, further comprising: After the base adhesive is formed at the interface, another beam of electromagnetic radiation is generated, directed toward the interface and toward the radiation sensor. as well as The radiation intensity of another beam of electromagnetic radiation impacting the radiation sensor is measured using the radiation sensor.

5. The method according to claim 4, further comprising: The volume of the base coat is determined based on the difference between the other radiation intensity and the maximum measured intensity value.

6. The method according to claim 3, further comprising: The location of the base adhesive is determined based on the measured radiation intensity of a first beam of electromagnetic radiation having a first beam size and a second measured radiation intensity of a second beam of electromagnetic radiation having a second beam size different from the first beam size.

7. The method according to claim 1, The first driver moves the radiation source electrode along the vertical axis, and the radiation source electrode is configured to generate the electromagnetic radiation; and The second driver moves the radiation sensor synchronously with the first driver along the vertical axis.

8. A method for analyzing the interface of joined workpieces, comprising: A first beam of electromagnetic radiation is directed toward the periphery of the interface between a pair of joined workpieces and toward a radiation sensor disposed behind the periphery of the interface. Scan along the vertical axis with the first beam of electromagnetic radiation; The first intensity of the first beam of electromagnetic radiation impacting the radiation sensor throughout the scan is measured by the radiation sensor, wherein the vertical axis extends from below the pair of joined workpieces to above the pair of joined workpieces. The location of the interface between the pair of joined workpieces is determined by determining the maximum intensity measured by the radiation sensor and determining the location along the vertical axis corresponding to the maximum intensity; An undercoat is deposited at the interface between the pair of joined workpieces; A second beam that generates the electromagnetic radiation is directed toward the periphery of the interface between the pair of joined workpieces and toward the radiation sensor disposed behind the periphery of the interface. The second intensity of the second beam of electromagnetic radiation impacting the radiation sensor is measured using the radiation sensor. as well as The volume of the base adhesive is determined based on the difference between the second strength and the first strength.

9. The method of claim 8, wherein determining the volume of the base adhesive comprises subtracting the beam-receiving area of ​​the electromagnetic radiation sensed by the radiation sensor during the period in which the first beam of electromagnetic radiation is generated from the beam-receiving area of ​​the electromagnetic radiation sensed by the radiation sensor during the period in which the second beam of electromagnetic radiation is generated from the beam-receiving area of ​​the electromagnetic radiation sensed by the radiation sensor.

10. The method of claim 8, wherein determining the volume of the base adhesive comprises integrating intensity data recorded during the period of the first beam generating the electromagnetic radiation and integrating intensity data recorded during the period of the second beam generating the electromagnetic radiation.

11. The method of claim 8, further comprising: Additional primer is deposited at the interface between the pair of joined workpieces.

12. The method of claim 11, further comprising: Determine the new volume of the base coat combined with the additional base coat.

13. A process tool for analyzing the interface of joined workpieces, comprising: The workpiece housing structure is configured to accommodate the workpiece. Radiation source electrodes are arranged adjacent to the workpiece receiving structure and along the periphery of the workpiece receiving structure, wherein the radiation source electrodes are configured to generate electromagnetic radiation; A radiation sensor is disposed along the periphery of the workpiece receiving structure and spaced apart from the radiation source, wherein the radiation sensor is configured to measure the intensity of the electromagnetic radiation impacting the radiation sensor. as well as A sensor control circuit, coupled to the radiation sensor and configured to determine the position of the interface between a pair of joined workpieces disposed on the workpiece receiving structure, wherein the radiation source is configured to scan the pair of joined workpieces along a vertical axis with the electromagnetic radiation, and the position of the interface is determined based on the intensity of the electromagnetic radiation measured by the radiation sensor.

14. The process tool according to claim 13, further comprising: A first driver is configured to move the radiation source electrode along the vertical axis to generate the electromagnetic radiation at different heights along the vertical axis, wherein the vertical axis extends from below the pair of joined workpieces to above the pair of joined workpieces. as well as The rotor is configured to rotate the workpiece receiving structure.

15. The process tool according to claim 14, further comprising: The second driver is configured to move the radiation sensor synchronously with the first driver along the vertical axis.

16. The process tool according to claim 13, further comprising: A deposition device is configured to deposit an undercoat along the interface without contacting the pair of bonded workpieces.

17. The process tool according to claim 13, further comprising: The lens is configured to receive the electromagnetic radiation from the radiation source and generate a Gaussian beam. as well as The driver is configured to move the lens along the horizontal axis to adjust the focus of the electromagnetic radiation.

18. The process tool of claim 13, wherein the line extending between the radiation source electrode and the radiation sensor is tangent to the periphery of the pair of joined workpieces.

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