Electroplating device for heterogeneous steel

Abstract

The present invention relates to the field of electroplating devices, and in particular to an electroplating device for heterogeneous steel materials, comprising a plating pool and a plating barrel placed in the plating pool, wherein the top of the plating barrel is through-opened, an anode member is arranged inside the plating barrel, a cathode member is arranged inside the plating barrel through the top of the plating barrel and does not contact the anode member, a tempering component is arranged outside the plating pool, the tempering component is connected to the bottom of the plating barrel and is used to introduce electroplating solution from the bottom of the plating barrel to the top of the plating barrel for discharge, the tempering component is connected to the plating pool and is used to recover the electroplating solution discharged from the plating barrel, and the cathode member is used to limit the electroplating parts to be placed in the plating barrel. The present invention adopts a cylindrical plating barrel as an electroplating space, and continuously conducts the electroplating solution upward, so that the electroplating solution contacted by the heterogeneous steel plated parts placed in the plating barrel always maintains a constant metal ion concentration, thereby overcoming the obstacles to the electroplating of heterogeneous steel materials caused by changes in metal ion concentration.

Description

Technical Field

[0001] The present invention relates to the field of electroplating devices, and in particular to an electroplating device for heterogeneous steel materials. Background Art

[0002] Electroplating of steel is used to form an electroplated layer on the surface of steel to enhance the steel's excellent properties such as oxidation resistance, surface strength, surface hardness, smoothness, and heat resistance. The electroplating process for the same type of steel is now relatively mature, but in the actual application of steel, dissimilar steels are often combined and connected for integrated electroplating. The one-step electroplating of dissimilar steels simplifies the process flow compared to the step-by-step electroplating before combining the dissimilar steels.

[0003] The electroplating process of heterogeneous steels is quite different from that of the same steels, including the surface treatment of steels before electroplating, the comprehensive selection of electroplating solution, the electroplating temperature and other conditions, which all need to be treated specially. During the electroplating process, steel is used as the cathode material. Due to the differences between heterogeneous steels themselves, the concentration of plating cations in the plating solution has a great influence on the electroplating of heterogeneous steels. In the traditional rack plating process, the plating solution is not easy to be replaced. During the continuous electroplating process, the concentration of plating cations gradually decreases, and it is difficult to maintain a relatively constant concentration. There are major defects in the electroplating processing of heterogeneous steels. Summary of the invention

[0004] The purpose of the present invention is to solve the following problems existing in the prior art: due to the differences between heterogeneous steels themselves, the concentration of plating cations in the electroplating solution has a great influence on the electroplating of heterogeneous steels. The plating solution is not easy to be replaced in the traditional rack plating process. The concentration of plating cations gradually decreases during the continuous electroplating process, and it is difficult to maintain a relatively constant concentration, which has great defects in the electroplating processing of heterogeneous steels.

[0005] In order to solve the problems existing in the prior art, the present invention provides an electroplating device for heterogeneous steel materials, comprising a plating pool and a plating barrel placed in the plating pool, the plating barrel having a through top, an anode component inside the plating barrel, a cathode component placed inside the plating barrel through the top top and not in contact with the anode component, a tempering component outside the plating pool, the tempering component connected to the bottom of the plating barrel, used for introducing electroplating solution from the bottom of the plating barrel to the top top for discharge, the tempering component connected to the plating pool, used for recovering the electroplating solution discharged from the plating barrel, and the cathode component used for limiting the electroplating component to be placed in the plating barrel.

[0006] Preferably, the bottom of the plating barrel has a through cavity, the tempering component is connected to the through cavity, and the through cavity penetrates the inner cavity of the plating barrel upward through a plurality of evenly distributed spray holes.

[0007] Preferably, the inner cavity of the plating barrel is cylindrical, a guide plate spiraling upward is fixed to the inner wall of the plating barrel, and the top of the spray hole is inclined to point to the guide plate.

[0008] Preferably, the tempering component includes a mixing tank, the height of the mixing tank is lower than the height of the plating tank, a liquid storage tank is provided above the mixing component, the plating tank and the liquid storage tank are connected to the mixing tank through a drainage pipe and an injection pipe respectively, a liquid pump is provided outside the mixing tank, the liquid inlet end of the liquid pump is connected to the mixing tank, and the liquid discharge end of the liquid pump is connected to the through cavity through a reflux pipe.

[0009] Preferably, the mixing tank includes an overflow container, the discharge pipe is connected to the overflow container, the overflow container has a spiral plate on the outside, the spiral plate has a containing barrel on the outside, a spiral channel penetrating the containing barrel is formed between the spiral plates, and the injection pipe is connected to the spiral channel.

[0010] Preferably, the overflow container comprises a quantitative cylinder penetrating from top to bottom, the bottom of the quantitative cylinder is slidably adapted with an insert cylinder, the insert cylinder is elastically connected to the quantitative cylinder through a spring, and a regulating valve is provided in the middle of the injection tube, and the regulating valve is placed below the insert cylinder.

[0011] Preferably, the regulating valve includes a valve housing, a slot is opened downwardly from the top of the valve housing, a valve plate is slidably inserted in the slot, the corresponding side of the valve housing has a through guide port, the guide port passes through the slot, the surface of the valve plate has a valve port corresponding to the guide port, the valve plate is connected to the valve housing through a spring, and the guide port is connected to the injection tube.

[0012] Preferably, the top edge of the metering cylinder has an overflow groove.

[0013] Preferably, the cathode component is a container with a through top, the side wall and bottom surface of the cathode component have a gap for conducting the electroplating solution, and the top of the cathode component has a hanging handle for connecting to the edge of the top of the plating barrel.

[0014] Compared with the related art, the electroplating device for heterogeneous steel provided by the present invention has the following beneficial effects:

[0015] 1. The present invention adopts a cylindrical plating barrel as the electroplating space, and continuously conducts the plating solution upward, so that the plating solution contacted by the heterogeneous steel plated parts placed in the plating barrel always maintains a constant metal ion concentration, thereby overcoming the obstacles caused by the change of metal ion concentration to the electroplating of heterogeneous steel;

[0016] 2. The present invention uses a low-height mixing tank and a high-height liquid storage tank to automatically conduct low-concentration plating solution and high-concentration plating solution by gravity, cooperates with the conduction of the spiral channel to achieve the purpose of homogeneous mixing, and cooperates with the liquid pump to conduct the homogeneous plating solution to the plating barrel to achieve a continuous plating solution circulation effect;

[0017] 3. The present invention adopts a telescopic elastic connection between the insert tube and the quantitative tube. The downward movement of the insert tube feeds back the conduction status of the low-concentration plating solution, and cooperates with the pressure of the insert tube on the regulating valve to realize the conduction of high-concentration plating solution along with low-concentration plating solution, thereby achieving the purpose of automatic coordination of liquid discharge. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a schematic diagram of the connection structure between the reflux pipe and the plating barrel of the present invention;

[0020] Figure 3 It is a schematic diagram of the matching structure of the cathode component and the plating barrel of the present invention;

[0021] Figure 4 It is a schematic diagram of the alignment structure of the spray hole and the guide plate of the present invention;

[0022] Figure 5 It is a schematic diagram of the distribution structure of the guide plate of the present invention;

[0023] Figure 6 It is a schematic diagram of the cathode structure of the present invention;

[0024] Figure 7 It is a schematic diagram of the structure of the quenching and tempering component of the present invention;

[0025] Figure 8 It is a schematic diagram of the structure of the mixing tank of the present invention;

[0026] Fig. 9 This is one of the schematic diagrams of the regulating valve structure of the present invention;

[0027] Fig.10 This is the second schematic diagram of the regulating valve structure of the present invention.

[0028] Numbers in the figure: 1. plating pool; 2. plating barrel; 21. guide plate; 22. through cavity; 23. spray hole; 24. anode piece; 3. cathode piece; 31. hanging handle; 4. containing barrel; 41. spiral plate; 42. discharge pipe; 5. liquid storage tank; 51. liquid injection pipe; 6. reflux pipe; 7. liquid pump; 8. regulating valve; 81. valve housing; 82. valve plate; 83. slot; 84. guide port; 85. valve port; 9. metering cylinder; 91. insert cylinder; 92. overflow tank. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0030] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0031] Embodiment 1

[0032] like Figure 1 , 4, 5, a dissimilar steel electroplating device, consisting of an electroplating part and a quenching and tempering component;

[0033] The electroplating part includes a plating pool 1, in which a plurality of cylindrical plating barrels 2 are fixed, the plating barrels 2 have a cylindrical inner cavity and penetrate the top opening thereof, a heating component is arranged on the surface of the plating barrel 2, an anode member 24 is arranged at the bottom of the plating barrel 2, a lead wire of the anode member 24 passes through the plating barrel 2, a through cavity 22 is opened at the lower part of the plating barrel 2, the through cavity 22 penetrates upward through the inner cavity of the plating barrel 2 through a plurality of spray holes 23 with evenly distributed edges, a plurality of spiral upward guide plates 21 are fixed on the inner wall of the plating barrel 2 at equal angles, and the top of the spray hole 23 is inclined to point to the guide plate 21;

[0034] like Figure 3 , 4 As shown in , 6, the cathode component 3 is a container with a through top, the side wall and the bottom surface of the cathode component 3 are formed by a rod of a conductive material, a hanging handle 31 is symmetrically fixed on the top of the cathode component 3, the cathode component 3 is placed in the plating barrel 2, the hanging handle 31 is connected to the edge of the top of the plating barrel 2, the electroplating part is placed in the cathode component 3, and the cathode component is connected to the negative pole of the circuit;

[0035] like Figure 2 , 7 As shown, the quenching and tempering assembly includes a mixing tank, the height of which is lower than that of the plating tank 1, the plating tank 1 is connected to the mixing tank by a drainage pipe 42, and the electroplating liquid in the plating tank 1 is introduced into the mixing tank under the action of gravity, the liquid storage tank 5 is placed above the mixing tank and the plating tank 1, the bottom of the liquid storage tank 5 is connected to the mixing tank through a liquid injection pipe 51, so that the supplementary liquid in the liquid storage tank 5 is introduced into the mixing tank under the action of gravity, the liquid pump 7 is placed outside the mixing tank, the liquid inlet end of the liquid pump 7 is connected to the bottom of the mixing tank through a pipeline, and the liquid outlet end of the liquid pump 7 is connected to the through cavity 22 of each plating barrel 2 through a reflux pipe 6;

[0036] A reserve plating solution with a high cation concentration of the coating is stored in the liquid storage tank 5, and a plating solution with a balanced cation concentration is placed in the plating pool 1. During electroplating, the liquid pump 7 is turned on to conduct the plating solution into the through cavity 22 through the reflux pipe 6, and the plating solution is introduced upward from the spray hole 23 into the plating barrel 2 until the plating solution overflows from the top of the plating barrel 2, so that a plating solution flow that is continuously conducted from bottom to top is formed in the plating barrel 2. At this time, the anode component 24 acts as an anode, and the cathode component 3 and the electroplated parts inside it act as cathodes. The metal cations in the plating solution are attached to the surface of the heterogeneous steel electroplated parts, and the metal cation concentration in the plating solution overflowing the plating barrel 2 is reduced, and it is collected in the plating pool 1 and introduced into the mixing pool along the discharge pipe 42. The high-concentration plating solution in the liquid storage tank 5 is introduced into the mixing pool through the injection pipe 51 to mix with the low-concentration plating solution to form a plating solution with balanced metal cations, and is introduced into the plating barrel 2 again by the reflux pipe 6, so that the heterogeneous steel plated parts are always in the plating solution with balanced metal cations;

[0037] like Figure 4As shown, the spray hole 23 sprays the plating solution upward in an inclined manner, and the plating solution is conducted upward in a spiral along the guide plate 21, so as to guide the plating solution to be discharged, thereby preventing the plating solution from being retained in the plating barrel 2 and maintaining continuous and comprehensive replacement of the plating solution in the plating barrel 2;

[0038] Embodiment 2

[0039] like Figure 8 As shown, the mixing tank includes an overflow container, and the overflow container includes a quantitative cylinder 9 that passes through from top to bottom. The bottom of the quantitative cylinder 9 is slidably adapted to be equipped with an insert cylinder 91, and the insert cylinder 91 is elastically connected to the quantitative cylinder 9 through a spring. A regulating valve 8 is provided in the middle of the injection tube 51, and the regulating valve 8 is placed below the insert cylinder 91. The outside of the quantitative cylinder 9 is provided with a spiral plate 41, and the outside of the spiral plate 41 is provided with a receiving barrel 4. A spiral channel that passes through the receiving barrel 4 is formed between the spiral plates 41. The discharge pipe 42 is connected to the quantitative cylinder 9, and the port of the injection tube 51 is placed on the upper part of the spiral channel. The top edge of the quantitative cylinder 9 is provided with an overflow groove 92.

[0040] The low-concentration plating solution is introduced into the quantitative cylinder 9 through the discharge pipe 42. As the plating solution is continuously introduced, the plating solution overflows from the port of the quantitative cylinder 9 to the spiral channel. The high-concentration plating solution in the liquid storage tank 5 is introduced into the spiral channel through the liquid injection pipe 51. The low-concentration plating solution and the high-concentration plating solution are mixed in the spiral channel and then introduced into the containing barrel 4. Then, the liquid pump 7 guides the plating solution back into the plating barrel 2 through the reflux pipe 6 to continuously maintain the cation concentration of the plating solution.

[0041] like Fig. 9 , 10 As shown, the regulating valve 8 includes a valve housing 81, a slot 83 is downwardly opened on the top of the valve housing 81, a valve plate 82 is slidably inserted in the slot 83, a through flow guide port 84 is provided on the corresponding side of the valve housing 81, the flow guide port 84 passes through the slot 83, a valve port 85 is provided on the surface of the valve plate 82 to correspond to the flow guide port 84, the valve plate 82 is connected to the valve housing 81 through a spring, and the flow guide port 84 is connected to the injection pipe 51;

[0042] During the initial circulation of liquid conduction, the discharge pipe 42 gradually adds low-concentration plating solution into the metering cylinder 9. As the liquid level of the plating solution continues to rise, the pressure on the insert 91 continues to increase. When the plating solution overflows from the port of the metering cylinder 9, the insert 91 overcomes the decrease in elastic force and presses the valve plate 82 to retract into the slot 83, so that the valve port 85 is aligned with the guide port 84, and the passage of the injection pipe 51 is opened, so that the high-concentration plating solution in the liquid storage tank 5 is conducted through the injection pipe 51. When the discharge pipe 42 is cut off, the low-concentration plating solution in the metering cylinder 9 is gradually discharged through the overflow groove 92, so that the pressure on the insert 91 is reduced and gradually moves up. The valve plate 82 loses pressure and moves up, so that the valve port 85 and the guide port 84 are misaligned, the passage of the injection pipe 51 is blocked, and the conduction of the high-concentration plating solution is blocked, thereby ensuring that the high-concentration plating solution is discharged only when the low-concentration plating solution is conducted normally, thereby achieving the purpose of automated coordinated liquid discharge.

Claims

1. An electroplating device for heterogeneous steel, comprising a plating tank (1) and a plating barrel (2) placed in the plating tank (1), characterized in that: The top opening of the plating barrel (2) is through-opened, the plating barrel (2) has an anode component (24) inside, the cathode component (3) is placed inside the plating barrel (2) through the top opening and does not contact the anode component (24), the plating pool (1) has a tempering component outside, the tempering component is connected to the bottom of the plating barrel (2) and is used to introduce electroplating liquid from the bottom of the plating barrel (2) to the top opening for discharge, the tempering component is connected to the plating pool (1) and is used to recover the electroplating liquid discharged from the plating barrel (2), and the cathode component (3) is used to limit the electroplating component to be placed in the plating barrel (2); The bottom of the plating barrel (2) has a through cavity (22), the tempering component is connected to the through cavity (22), and the through cavity (22) penetrates the inner cavity of the plating barrel (2) upwards through a plurality of evenly distributed spray holes (23); The inner cavity of the plating barrel (2) is cylindrical, and a guide plate (21) spiraling upward is fixed to the inner wall of the plating barrel (2), and the top of the spray hole (23) is inclined to point toward the guide plate (21).

2. The electroplating device for different steel materials according to claim 1, characterized in that: The tempering component comprises a mixing pool, the height of the mixing pool is lower than the height of the plating pool (1), a liquid storage tank (5) is provided above the mixing pool, the plating pool (1) and the liquid storage tank (5) are respectively connected to the mixing pool via a discharge pipe (42) and a liquid injection pipe (51), and a liquid pump (7) is provided outside the mixing pool, the liquid inlet end of the liquid pump (7) is connected to the mixing pool, and the liquid discharge end of the liquid pump (7) is connected to the through cavity (22) via a reflux pipe (6).

3. The electroplating device for different steel materials according to claim 2, characterized in that: The mixing tank comprises an overflow container, the discharge pipe (42) is connected to the overflow container, the overflow container has a spiral plate (41) on the outside, the spiral plate (41) has a containing barrel (4) on the outside, a spiral channel penetrating the containing barrel (4) is formed between the spiral plates (41), and the injection pipe (51) is connected to the spiral channel.

4. The electroplating device for different steel materials according to claim 3, characterized in that: The overflow container comprises a quantitative cylinder (9) which is passed through from top to bottom. The bottom of the quantitative cylinder (9) is slidably adapted to be provided with an insert cylinder (91). The insert cylinder (91) is elastically connected to the quantitative cylinder (9) via a spring. The injection tube (51) has a regulating valve (8) in the middle. The regulating valve (8) is disposed below the insert cylinder (91).

5. The electroplating device for different steel materials according to claim 4, characterized in that: The regulating valve (8) comprises a valve housing (81), a slot (83) is provided downwardly on the top of the valve housing (81), a valve plate (82) is slidably inserted in the slot (83), a side surface corresponding to the valve housing (81) has a through flow guide port (84), the flow guide port (84) passes through the slot (83), a surface of the valve plate (82) has a valve port (85) aligned with the flow guide port (84), the valve plate (82) is connected to the valve housing (81) via a spring, and the flow guide port (84) is connected to the injection pipe (51).

6. The electroplating device for different steel materials according to claim 4, characterized in that: The top edge of the metering cylinder (9) is provided with an overflow groove (92).

7. The electroplating device for different steel materials according to claim 1, characterized in that: The cathode component (3) is a container with a through top, the side wall and bottom surface of the cathode component (3) have a gap for conducting the electroplating liquid, and the top of the cathode component (3) has a hanging handle (31), which is used to connect to the edge of the top of the plating barrel (2).

Images