Electronic component

Abstract

This invention provides an electronic component that can suppress the peeling off of external terminals. In the coil component, each external terminal electrode on the upper surface has a U-shaped profile, so stress is less likely to concentrate at the inner end compared to external terminal electrodes with angles at the inner end. Therefore, even when, for example, an impact is applied to the coil component, the peeling off of the external terminal electrodes from the upper surface due to stress concentration can be effectively suppressed.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic component. BACKGROUND

[0002] An electronic component in which external terminals are provided on a mounting surface on a mounting substrate side is known. Patent Document 1 below discloses a 4-terminal electronic component in which external terminals are provided on four corners of a mounting surface.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENT

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-111349 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In the above-described electronic component, in a case where the external terminals are peeled from the mounting surface, a defect such as a decrease in element characteristics or non-function of the element can occur.

[0008] The present inventors have repeatedly studied peeling of the external terminals, and have newly found a technology that can effectively suppress a case where the external terminals are peeled from the mounting surface.

[0009] An object of the present application is to provide an electronic component in which peeling of external terminals can be suppressed.

[0010] METHOD FOR SOLVING THE PROBLEMS

[0011] An electronic component according to one aspect of the present application includes: a body having a pair of end surfaces parallel to each other and a mounting surface connecting the pair of end surfaces; and a first external terminal covering at least the mounting surface among surfaces of the body and electrically connected to an internal conductor provided in the body, the first external terminal having a U-shaped outer shape in which an inner side of the first external terminal extends from a rim corresponding to the end surface and an end portion on the inner side is bent, as viewed from the mounting surface side.

[0012] In the above-described electronic component, the external terminal on the mounting surface has the U-shaped outer shape, so stress is difficult to concentrate on the end portion on the inner side of the external terminal. Therefore, even in a case where, for example, an impact is applied to the electronic component, a case where the external terminal is peeled from the mounting surface due to concentration of stress can be effectively suppressed.

[0013] An electronic component according to another aspect of the present application includes: a body having a pair of end surfaces parallel to each other and a mounting surface connecting the pair of end surfaces; and a first external terminal continuously covering the mounting surface and the end surface of the body.

[0014] In the electronic component of another aspect of the present application, the pair of first external terminals each have an inner side end portion with a first curved portion on a side closer thereto and a second curved portion on a side farther therefrom, and the curvature of the first curved portion is smaller than the curvature of the second curved portion.

[0015] In the electronic component of another aspect of the present application, in the outer shape of the pair of first external terminals, the length of a straight line extending from the edge corresponding to the end surface to the first curved portion is shorter than the length of a straight line extending from the edge corresponding to the end surface to the second curved portion.

[0016] In the electronic component of another aspect of the present application, the pair of first external terminals each have an inner side end portion with a first curved portion on a side closer thereto and a second curved portion on a side farther therefrom, and the curvature of the first curved portion is smaller than the curvature of the second curved portion.

[0017] In the electronic component of another aspect of the present application, the mounting surface of the bulk has a rectangular shape, and the pair of first external terminals and the pair of second external terminals are respectively located at the four corners of the mounting surface.

[0018] In the electronic component of another aspect of the present application, the bulk contains metal powder and resin.

[0019] In the electronic component of another aspect of the present application, the bulk has a pair of side surfaces orthogonal to the pair of end surfaces, and in the opposite direction of the pair of side surfaces of the mounting surface, a region in which the mounting surface is exposed from the first external terminal is formed between the outer edge of the mounting surface and the first external terminal.

[0020] Effects of Invention

[0021] According to the present application, an electronic component in which peeling of an external terminal is suppressed is provided. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a schematic perspective view of a coil component of an embodiment.

[0023] Figure 2 is a view showing the inside of the coil component of Figure 1 .

[0024] Figure 3 is an exploded view of the coil shown in Figure 2 .

[0025] Figure 4 is a cross-sectional view of the coil component of Figure 2 along line IV-IV.

[0026] Figure 5 isFigure 2 A V-V line sectional view of the coil member shown.

[0027] Figure 6 Figure 2 A plan view of the coil shown.

[0028] Figure 7 Figure 1 A view of one end face of the bulk of the coil member shown.

[0029] Figure 8 Figure 1 A view of the other end face of the bulk of the coil member shown.

[0030] Figure 9 DETAILED DESCRIPTION

[0031] Hereinafter, an embodiment of the present application will be described in detail with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and repeated description is omitted.

[0032] The electronic component of the embodiment shown below is one of electronic components, and is a coil member including a coil portion as an internal conductor. The coil member 1 of the embodiment is a balun coil. The balun coil is utilized when, for example, a near field wireless communication circuit (NFC circuit) is loaded on a cellular terminal. Conversion between an unbalanced signal of an antenna and a balanced signal of the NFC circuit is performed by the balun coil, and connection of an unbalanced circuit and a balanced circuit is achieved.

[0033] As shown in Figure 1 The coil member 1 includes a bulk 10, a coil structure 20 embedded in the bulk 10, and two pairs of external terminal electrodes 60A, 60B, 60C, 60D provided on the surface of the bulk 10.

[0034] The bulk 10 has an outer shape of a rectangular parallelepiped, and has six faces 10a to 10f. As an example, the bulk 10 is designed to have dimensions of 2.0 mm in length, 1.25 mm in short side, and 0.65 mm in height. Among the faces 10a to 10f of the bulk 10, the end face 10a and the end face 10b are parallel to each other, the upper surface 10c and the lower surface 10d are parallel to each other, and the side face 10e and the side face 10f are parallel to each other. The upper surface 10c of the bulk 10 is a mounting face of the bulk 10 facing the mounting substrate side on which the coil member 1 is mounted, and links the pair of end faces 10a, 10b.

[0035] ​​​​The base material 10 is composed of a metal-containing magnetic powder resin 12, which is a type of magnetic material. The metal-containing magnetic powder resin 12 is an adhesive powder in which metal powder (more specifically, metallic magnetic powder) is bonded together by an adhesive resin. The metallic magnetic powder in the metal-containing magnetic powder resin 12 is composed of, for example, iron-nickel alloys (permalloy), carbonyl iron, amorphous, amorphous or crystalline FeSiCr alloys, iron-silicon-aluminum magnetic alloys, etc. The adhesive resin is, for example, a thermosetting epoxy resin. In this embodiment, the content of metallic magnetic powder in the adhesive powder is 80-92 vol% by volume and 95-99 wt% by mass. From the viewpoint of magnetic properties, the content of metallic magnetic powder in the adhesive powder may also be 85-92 vol% by volume and 97-99 wt% by mass. The metallic magnetic powder in the metal-containing magnetic powder resin 12 may be a powder having a single average particle size or a mixture of powders having multiple average particle sizes.

[0036] The metal-containing magnetic powder resin 12 of the base body 10 integrally covers the coil structure 20 described later. Specifically, the metal-containing magnetic powder resin 12 covers the coil structure 20 from top to bottom and covers the outer periphery of the coil structure 20. In addition, the metal-containing magnetic powder resin 12 fills the inner periphery region of the coil structure 20.

[0037] The coil structure 20 is composed of an insulating substrate 30, an upper coil structure 40A disposed on the upper side of the insulating substrate 30, and a lower coil structure 40B disposed on the lower side of the insulating substrate 30.

[0038] The insulating substrate 30 is designed to have a flat plate shape, extending between the end faces 10a and 10b of the substrate 10, and orthogonal to the end faces 10a and 10b. Furthermore, the insulating substrate 30 extends parallel to the upper surface 10c and lower surface 10d of the substrate 10. Figure 3 As shown, the insulating substrate 30 has an elliptical coil forming portion 31 extending along the long side of the substrate 10, and a pair of frame portions 34A and 34B extending along the short side of the substrate 10 and sandwiching the coil forming portion 31 from both sides. An elliptical opening 32 extending along the long side of the substrate 10 is provided in the central portion of the coil forming portion 31.

[0039] The insulating substrate 30 is made of a non-magnetic insulating material. The thickness of the insulating substrate 30 can be designed to be, for example, in the range of 10 to 60 μm. In this embodiment, the insulating substrate 30 has a structure in which an epoxy resin is impregnated in glass cloth. The resin constituting the insulating substrate 30 is not limited to epoxy resin, but can also be BT resin, polyimide, aramid, etc. The constitutive material of the insulating substrate 30 can also be ceramic or glass. The constitutive material of the insulating substrate 30 can also be a mass-produced printed circuit board material. The constitutive material of the insulating substrate 30 can also be a resin material used for BT printed circuit boards, FR4 printed circuit boards, or FR5 printed circuit boards.

[0040] The upper coil structure 40A is disposed on the upper surface 30a of the coil forming portion 31 of the insulating substrate 30. For example... Figure 2 , 3 As shown, the upper coil structure 40A is composed of a first planar coil 41, a second planar coil 42, and an upper insulator 50A. The first planar coil 41 and the second planar coil 42 are wound adjacent to each other in a parallel manner on the upper surface 30a of the insulating substrate 30.

[0041] The first planar coil 41 is a generally oblong spiral hollow coil wound on the upper surface 30a of the insulating substrate 30 and within the same layer around the opening 32 of the coil forming portion 31. The first planar coil 41 can have one or more turns. In this embodiment, the first planar coil 41 has 3 to 4 turns. The first planar coil 41 has an outer end portion 41a and an inner end portion 41b. The outer end portion 41a is provided on the frame portion 34A and protrudes from the end face 10a of the body 10. The inner end portion 41b is provided at the edge of the opening 32. On the insulating substrate 30, a first through conductor 41c extending in the thickness direction of the insulating substrate 30 is provided at a position overlapping with the inner end portion 41b of the first planar coil 41. The first planar coil 41 is made of, for example, Cu and can be formed by electroplating.

[0042] Similar to the first planar coil 41, the second planar coil 42 is a generally oblong, spiral-shaped hollow coil wound on the upper surface 30a of the insulating substrate 30 and within the same layer around the opening 32 of the coil forming portion 31. The second planar coil 42 is wound adjacent to the first planar coil 41 on the inner circumferential side. The second planar coil 42 can have one or more turns. In this embodiment, the number of turns of the second planar coil 42 is the same as that of the first planar coil 41. The second planar coil 42 has an outer end portion 42a and an inner end portion 42b. Similar to the outer end portion 41a of the first planar coil 41, the outer end portion 42a of the second planar coil 42 is provided in the frame portion 34A and protrudes from the end face 10a of the body 10. The inner end portion 42b of the second planar coil 42 is provided at the edge of the opening 32 and is adjacent to the inner end portion 41b of the first planar coil 41. On the insulating substrate 30, a second through conductor 42c extending in the thickness direction of the insulating substrate 30 is provided at a position overlapping with the inner end 42b of the second planar coil 42. Similar to the first planar coil 41, the second planar coil 42 is made of, for example, Cu and can be formed by electroplating.

[0043] The upper insulator 50A is disposed on the upper surface 30a of the insulating substrate 30 and is a thick-film photoresist patterned by a known photolithography process. The upper insulator 50A divides the plating growth areas of the first planar coil 41 and the second planar coil 42. In this embodiment, as... Figure 4 As shown, the upper insulator 50A integrally covers the first planar coil 41 and the second planar coil 42, more specifically, it covers the sides and upper surfaces of the first planar coil 41 and the second planar coil 42. Figure 5 , 6 As shown, a portion of the upper insulator 50A extends from the interior of the body 10 through the space between the outer end 41a and the outer end 42a to the end face 10a of the body 10, where it is exposed. Additionally, as... Figure 5 , 6 As shown, a portion of the upper insulator 50A extends along the upper surface 30a of the substrate from the interior of the body 10 to the end face 10b, where it is exposed. The thickness of the upper insulator 50A is greater than the thickness of the first planar coil 41 and the second planar coil 42. The upper insulator 50A is made of, for example, epoxy resin.

[0044] The lower coil structure 40B is disposed on the lower surface 30b of the coil forming portion 31 of the insulating substrate 30. For example... Figure 2 , 3As shown, the lower coil structure 40B comprises a first planar coil 41, a second planar coil 42, and a lower insulator 50B. The first planar coil 41 and the second planar coil 42 are wound adjacent to each other in a parallel manner on the lower surface 30b of the insulating substrate 30.

[0045] The first planar coil 41 and the second planar coil 42 of the lower coil structure 40B are symmetrical to the first planar coil 41 and the second planar coil 42 of the upper coil structure 40A. More specifically, the first planar coil 41 and the second planar coil 42 of the lower coil structure 40B have a shape that reverses the shape of the first planar coil 41 and the second planar coil 42 of the upper coil structure 40A about an axis parallel to the short side of the body 10.

[0046] The outer end 41a of the first planar coil 41 of the lower coil structure 40B is disposed on the frame portion 34B and protrudes from the end face 10b of the body 10. The inner end 41b of the first planar coil 41 of the lower coil structure 40B overlaps with the first through conductor 41c disposed on the insulating substrate 30. Therefore, the inner end 41b of the first planar coil 41 of the lower coil structure 40B is electrically connected to the inner end 41b of the first planar coil 41 of the upper coil structure 40A via the first through conductor 41c. The first planar coil 41 of the lower coil structure 40B is made of, for example, Cu and can be formed by electroplating.

[0047] The outer end 42a of the second planar coil 42 of the lower coil structure 40B is disposed on the frame portion 34B and protrudes from the end face 10b of the body 10. The inner end 42b of the second planar coil 42 of the lower coil structure 40B overlaps with the second through conductor 42c disposed on the insulating substrate 30. Therefore, the inner end 42b of the second planar coil 42 of the lower coil structure 40B is electrically connected to the inner end 42b of the second planar coil 42 of the upper coil structure 40A via the second through conductor 42c. The second planar coil 42 of the lower coil structure 40B is made of, for example, Cu and can be formed by electroplating.

[0048] The lower insulator 50B is disposed on the lower surface 30b of the insulating substrate 30 and is a thick-film photoresist patterned by a known photolithography process. Similar to the upper insulator 50A, the lower insulator 50B divides the plating growth areas of the first planar coil 41 and the second planar coil 42. In this embodiment, as... Figure 4As shown, the lower insulator 50B integrally covers the first planar coil 41 and the second planar coil 42, and more specifically, covers the sides and top surfaces of the first planar coil 41 and the second planar coil 42. Similar to the upper insulator 50A, a portion of the lower insulator 50B extends from the interior of the substrate 10 through the space between the outer end 41a and the outer end 42a to the end face 10b of the substrate 10, where it is exposed. Additionally, a portion of the lower insulator 50B extends along the lower surface 30b of the substrate from the interior of the substrate 10 to the end face 10a, where it is exposed. The thickness of the lower insulator 50B is greater than the thickness of the first planar coil 41 and the second planar coil 42. The thickness of the lower insulator 50B may also be the same as the thickness of the upper insulator 50A. The lower insulator 50B is made of, for example, epoxy resin.

[0049] The base body 10 includes a pair of coil portions C1 and C2 constituting a dual-coil structure. The first coil portion C1 is composed of a first planar coil 41 of an upper coil structure 40A disposed on the upper surface 30a of the insulating substrate 30, a first planar coil 41 of a lower coil structure 40B disposed on the lower surface 30b of the insulating substrate 30, and a first through conductor 41c connecting the two first planar coils 41 to each other. In the first coil portion C1, the outer end 41a of the first planar coil 41 of the upper coil structure 40A constitutes a first end, and the outer end 41a of the first planar coil 41 of the lower coil structure 40B constitutes a second end. The second coil section C2 is composed of a second planar coil 42 of an upper coil structure 40A disposed on the upper surface 30a of the insulating substrate 30, a second planar coil 42 of a lower coil structure 40B disposed on the lower surface 30b of the insulating substrate 30, and a second through conductor 42c connecting the two second planar coils 42 to each other. In the second coil section C2, the outer end 42a of the second planar coil 42 of the upper coil structure 40A constitutes a first end, and the outer end 42a of the second planar coil 42 of the lower coil structure 40B constitutes a second end.

[0050] Two pairs of external terminal electrodes 60A, 60B, 60C, and 60D are each configured to cover at least the upper surface 10c of the substrate 10. In this embodiment, each external terminal electrode 60A, 60B, 60C, and 60D is bent into an L-shape, continuously covering the upper surface 10c and end faces 10a and 10b, with one pair disposed on each end face 10a and 10b. The external terminal electrode 60A on end face 10a and the external terminal electrode 60C on end face 10b are disposed at corresponding positions along the long side of the substrate 10. Similarly, the external terminal electrode 60B on end face 10a and the external terminal electrode 60D on end face 10b are disposed at corresponding positions along the long side of the substrate 10.

[0051] In this embodiment, the external terminal electrodes 60A, 60B, 60C, and 60D are made of resin electrodes, for example, of a resin containing Ag powder. Each external terminal electrode 60A, 60B, 60C, and 60D can be formed, for example, by applying electrode paste. In this case, the electrode paste can be transferred onto the substrate 10 using the ribs or rollers of a mold. Alternatively, the electrode paste can be printed onto the substrate 10 by screen printing.

[0052] In a pair of external terminal electrodes 60A and 60B (first external terminals) disposed on end face 10a, external terminal electrode 60A is connected to the outer end 41a of the first planar coil 41 of the upper coil structure 40A, and external terminal electrode 60B is connected to the outer end 42a of the second planar coil 42 of the upper coil structure 40A. Figure 7 As shown, viewed from the end face 10a side, the external terminal electrode 60A is offset from the side face 10f side, covering the vicinity of the side face 10f on the end face 10a. Additionally, the external terminal electrode 60B is offset from the side face 10e side, covering the vicinity of the side face 10e on the end face 10a. Viewed from the end face 10a side, the external terminal electrode 60A and the external terminal electrode 60B are separated by a predetermined uniform width.

[0053] In a pair of external terminal electrodes 60C and 60D (the second external terminal) disposed on end face 10b, external terminal electrode 60C is connected to the outer end 41a of the first planar coil 41 of the lower coil structure 40B, and external terminal electrode 60D is connected to the outer end 42a of the second planar coil 42 of the lower coil structure 40B. Figure 8 As shown, viewed from the end face 10b side, the external terminal electrode 60C is offset from the side face 10f side, covering the vicinity of side face 10f on the end face 10b. Additionally, the external terminal electrode 60D is offset from the side face 10e side, covering the vicinity of side face 10e on the end face 10b. Viewed from the end face 10b side, the external terminal electrode 60C and the external terminal electrode 60D are separated by a specified uniform width.

[0054] On the end face 10a of the base body 10, as Figure 7 As shown, the outer ends 41a of the first planar coil 41 and 42a of the second planar coil 42 are arranged on the upper surface 30a of the insulating substrate 30. Furthermore, on the end face 10a of the body 10, the upper insulator 50A is located in the region between the outer ends 41a of the first planar coil 41 and 42a of the second planar coil 42. Additionally, the lower insulator 50B is located on the end face 10a of the body 10, opposite the upper insulator 50A across the insulating substrate 30. Similarly, on the end face 10b of the body 10, as... Figure 8As shown, the lower insulator 50B exposed on the end face 10b is also located in the region between the outer end 41a of the first planar coil 41 and the outer end 42a of the second planar coil 42. In addition, the upper insulator 50A is located on the end face 10b of the body 10 in a manner opposite to the lower insulator 50B across the insulating substrate 30.

[0055] Next, refer to Figure 9 The shapes of the external terminal electrodes 60A, 60B, 60C, and 60D on the upper surface 10c of the substrate 10 are described.

[0056] like Figure 9 As shown, the external terminal electrodes 60A, 60B, 60C, and 60D are located at the four corners of the rectangular upper surface 10c. Viewed from the upper surface 10c, each external terminal electrode 60A, 60B, 60C, and 60D has a generally U-shaped shape. On the upper surface 10c, each external terminal electrode 60A, 60B, 60C, and 60D extends inward from the edge corresponding to the end faces 10a and 10b. In this embodiment, each external terminal electrode 60A, 60B, 60C, and 60D is spaced a predetermined width away from the outer edge of the upper surface 10c in the opposite direction of a pair of side faces 10e and 10f on the upper surface 10c, forming an exposed area 13 between the outer edge of the upper surface 10c and each external terminal electrode 60A, 60B, 60C, and 60D. In the exposed area 13, the upper surface 10c is exposed from each of the external terminal electrodes 60A, 60B, 60C, and 60D.

[0057] The inner ends 60a of each external terminal electrode 60A, 60B, 60C, and 60D on the upper surface 10c of the substrate 10 have no corners and are curved. In this embodiment, the inner ends 60a of each external terminal electrode 60A, 60B, 60C, and 60D have a first curved portion E1 and a second curved portion E2. Among the external terminal electrodes 60A and 60B extending inward from the edge corresponding to the same end face 10a, the first curved portion E1 is located on the side closer together, and the second curved portion E2 is located on the side farther apart. Similarly, among the external terminal electrodes 60C and 60D extending inward from the edge corresponding to the same end face 10b, the first curved portion E1 is also located on the side closer together, and the second curved portion E2 is also located on the side farther apart. Furthermore, in this embodiment, the curvature of the first curved portion E1 is designed to be less than the curvature of the second curved portion E2. Furthermore, in this embodiment, the length D1 of the straight line extending from the edge corresponding to the end faces 10a and 10b to the first curved portion E1 is designed to be shorter than the length of the straight line extending from the edge corresponding to the end faces 10a and 10b to the second curved portion E2.

[0058] As explained above, in the coil component 1, the external terminal electrodes 60A, 60B, 60C, and 60D on the upper surface 10c have a U-shaped shape. Therefore, compared to external terminal electrodes with angles at their inner ends, stress is less likely to concentrate at the inner end 60a. Thus, even when an impact is applied to the coil component 1, for example, it is possible to effectively prevent the external terminal electrodes 60A, 60B, 60C, and 60D from peeling off from the upper surface 10c due to stress concentration. Furthermore, it is also effective to prevent cracks from forming on the external terminal electrodes 60A, 60B, 60C, and 60D or the body 10 due to stress concentration.

[0059] Furthermore, in coil component 1, each external terminal electrode 60A, 60B, 60C, and 60D only covers two sides (i.e., the upper surface and the end face), and does not cover the corners of the body 10 defined by the upper surface 10c, end faces 10a and 10b, and side faces 10e and 10f. Thus, even with a structure where each external terminal electrode 60A, 60B, 60C, and 60D only covers two sides, each external terminal electrode 60A, 60B, 60C, and 60D can be prevented from being easily peeled off from the upper surface 10c due to its U-shaped shape.

[0060] Furthermore, the present invention is not limited to the embodiments described above, and various modifications can be made.

[0061] For example, the electronic component is not limited to the coil component, but can also be other electronic components (such as capacitors, registers, varistors, etc.). In addition, the number of external terminal electrodes can be appropriately increased or decreased, and there can be one or more external terminal electrodes provided on one end face.

Claims

1. An electronic component, characterized in that, include: The base body has a pair of parallel end faces and a mounting surface connecting the pair of end faces; and The first external terminal covers at least one mounting surface of the substrate and is electrically connected to an internal conductor disposed within the substrate. Viewed from the mounting surface side, the first external terminal has a U-shaped shape extending inward from the edge corresponding to the end face, with the inner end curved. Includes a pair of the first external terminals extending inward from the edge corresponding to the end face. The inner ends of each pair of first external terminals have a first curved portion on a side that is closer together and a second curved portion on a side that is farther apart, wherein the curvature of the first curved portion is less than the curvature of the second curved portion.

2. The electronic component as claimed in claim 1, characterized in that: The first external terminal continuously covers the mounting surface and end face of the substrate.

3. The electronic component as claimed in claim 1, characterized in that: In the shape of the pair of first external terminals, the length of the straight line extending from the edge corresponding to the end face to the first bend is shorter than the length of the straight line extending from the edge corresponding to the end face to the second bend.

4. The electronic component as claimed in claim 1, characterized in that: It includes a pair of first external terminals extending inward from one of the pair of end faces and a pair of second external terminals extending inward from the other of the pair of end faces. The inner ends of each pair of second external terminals have a first curved portion on a side that is closer together and a second curved portion on a side that is farther apart, wherein the curvature of the first curved portion is less than the curvature of the second curved portion.

5. The electronic component as claimed in claim 3, characterized in that: It includes a pair of first external terminals extending inward from one of the pair of end faces and a pair of second external terminals extending inward from the other of the pair of end faces. The inner ends of each pair of second external terminals have a first curved portion on a side that is closer together and a second curved portion on a side that is farther apart, wherein the curvature of the first curved portion is less than the curvature of the second curved portion.

6. The electronic component as claimed in claim 4, characterized in that: The mounting surface of the substrate is rectangular. The pair of first external terminals and the pair of second external terminals are located at the four corners of the mounting surface, respectively.

7. The electronic component as claimed in claim 5, characterized in that: The mounting surface of the substrate is rectangular. The pair of first external terminals and the pair of second external terminals are located at the four corners of the mounting surface, respectively.

8. The electronic component as claimed in any one of claims 1 to 7, characterized in that: The substrate comprises metal powder and resin.

9. The electronic component as claimed in any one of claims 1 to 7, characterized in that: The substrate has a pair of side surfaces orthogonal to the pair of end faces. In the opposite direction of the pair of sides of the mounting surface, an exposed area is formed between the outer edge of the mounting surface and the first external terminal, in which the mounting surface protrudes from the first external terminal.

10. The electronic component as claimed in claim 8, characterized in that: The substrate has a pair of side surfaces orthogonal to the pair of end faces. In the opposite direction of the pair of sides of the mounting surface, an exposed area is formed between the outer edge of the mounting surface and the first external terminal, in which the mounting surface protrudes from the first external terminal.

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