A cooling device, a central controller and a vehicle

Abstract

The present application discloses a cooling device, which includes: a cooling plate, comprising a cooling plate body and a cooling flow channel disposed within the cooling plate body; a first heat dissipation plate, disposed on a first side of the cooling plate, and the first heat dissipation plate is used for fitting against a first circuit board. The above cooling device includes a cooling plate and a first heat dissipation plate disposed on the first side of the cooling plate. Through the cooling device with a split structure, heat exchange and dissipation can be carried out on the first circuit board through the first heat dissipation plate, and the cooling plate and the first circuit board can also be isolated by the first heat dissipation plate, avoiding damage to the first circuit board caused by leakage of the cooling flow channel disposed within the cooling plate body, so as to protect the first circuit board from damage.

Description

Technical Field

[0001] The present application belongs to the field of automobile integrated control technology, and in particular relates to a cooling device, a central controller and an automobile. Background Art

[0002] The central controller is the core component of an electric vehicle, which usually includes control components such as a motor controller, a vehicle controller, a vehicle management system and an on-board charger. When these control components are integrated into an integrated central controller circuit board, the area is large and cannot meet the installation and modal requirements. After the central controller circuit board is divided into a multi-layer circuit board, the cooling and heat dissipation requirements are high. How to set up a cooling device to dissipate heat from the circuit board is an urgent problem to be solved in this field. Summary of the Invention

[0003] The present application aims to solve the technical problem of heat dissipation of a multi-layer circuit board to at least a certain extent. To this end, the present application provides a cooling device, a central controller, and a vehicle.

[0004] An embodiment of the present application provides a cooling device, comprising:

[0005] A cooling plate comprising a cooling plate body and a cooling channel arranged in the cooling plate body;

[0006] The first heat dissipation plate is arranged on the first side of the cooling plate, and the first heat dissipation plate is used to be attached to the first circuit board.

[0007] In some embodiments, the cooling device further comprises:

[0008] The second heat dissipation plate is arranged on the second side of the cooling plate, and the second heat dissipation plate is used to fit the second circuit board.

[0009] In some embodiments, at least one first thermally conductive boss is provided on a side of the first heat sink adjacent to the first circuit board, and the first thermally conductive boss is used to be attached to the heating element on the first circuit board; and / or, at least one second thermally conductive boss is provided on a side of the second heat sink adjacent to the second circuit board, and the second thermally conductive boss is used to be attached to the heating element on the second circuit board.

[0010] In some embodiments, the location and number of the first heat-conducting bosses correspond to the heat-generating location and heat-generating amount of the first circuit board; and / or the location and number of the second heat-conducting bosses correspond to the heat-generating location and heat-generating amount of the second circuit board.

[0011] In some embodiments, the cooling channel in the cooling plate flows through at least the first heat-conducting boss and / or the second heat-conducting boss.

[0012] In some embodiments, a thermal conductive adhesive layer is provided between the first thermal conductive boss and the first circuit board, and / or a thermal conductive adhesive layer is provided between the second thermal conductive boss and the second circuit board.

[0013] In some embodiments, the first heat dissipation plate and the cooling plate are correspondingly provided with first positioning holes, and the first heat dissipation plate and the cooling plate are connected through a first connecting member and the first positioning holes; and / or the second heat dissipation plate and the cooling plate are correspondingly provided with second positioning holes, and the second heat dissipation plate and the cooling plate are connected through a second connecting member and the second positioning holes.

[0014] In some embodiments, the first heat dissipation plate and / or the second heat dissipation plate are fixed on the cooling plate by brazing.

[0015] The embodiment of the present application further provides a central controller, and the central controller includes:

[0016] A housing;

[0017] The above-mentioned cooling device is arranged in the housing to divide the housing into

[0018] Adjacent first and second cavities;

[0019] A first circuit board arranged in the first cavity; and

[0020] A second circuit board arranged in the second cavity.

[0021] The embodiment of the present application further provides a vehicle, and the vehicle includes the above-mentioned central controller.

[0022] The embodiment of the present application has at least the following beneficial effects:

[0023] The above-mentioned cooling device includes a cooling plate and a first heat dissipation plate arranged on the first side of the cooling plate. Through the split-type cooling device, the first heat dissipation plate can be used to exchange heat for the first circuit board, and the first heat dissipation plate can also isolate the cooling plate from the first circuit board, avoiding damage to the first circuit board caused by leakage of the cooling flow path arranged in the cooling plate body, so as to protect the first circuit board from damage. Further, the above-mentioned cooling device further includes a second heat dissipation plate arranged on the second side of the cooling plate, that is, in the cooling device of the present application, the first heat dissipation plate and the second heat dissipation plate can be used to cool the circuit boards on both sides of the cooling device at the same time, avoiding the need to separately provide a cooling device for each circuit board, reducing the number of cooling devices and the occupied space. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, a brief introduction will be given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0025] Figure 1 A schematic diagram of the structure of the central controller according to an embodiment of the present application is shown;

[0026] Figure 2 Shown Figure 1 Exploded diagram of the central controller in;

[0027] Figure 3 Shown Figure 2 A schematic structural diagram of the middle frame of the housing of the central controller;

[0028] Figure 4 Shown Figure 3 A schematic structural diagram of the middle frame at another angle;

[0029] Figure 5 Shown Figure 2 A schematic structural diagram of the first cover of the housing of the central controller;

[0030] Figure 6 Shown Figure 2 A schematic structural diagram of the second cover of the housing of the central controller;

[0031] Figure 7 Shown Figure 2 A schematic diagram of the structure of the cooling device of the central controller;

[0032] Figure 8 Shown Figure 7 Exploded diagram of the cooling device in FIG;

[0033] Figure 9 Shown Figure 7 Schematic diagram of the cooling device installed in the middle frame;

[0034] Figure 10 Shown Figure 2 Exploded diagram of the central controller housing and cooling device;

[0035] Figure 11 Shown Figure 2 An exploded view of the housing of the central controller;

[0036] Figure 12 Shown Figure 2 A schematic structural diagram of the first circuit board of the central controller;

[0037] Figure 13 shows the Figure 2 structural schematic diagram of the second circuit board of the central controller in

[0038] Reference numerals:

[0039] 100, housing; 110, middle frame; 111, partition; 112, side plate; 113, first middle frame electromagnetic shielding enclosure; 114, first electromagnetic radiation interruption part; 115, cooling avoidance area; 116, connector avoidance area; 117, first connector electromagnetic shielding enclosure; 118, second connector electromagnetic shielding enclosure; 120, first cover; 121, first cover electromagnetic shielding enclosure; 130, second cover; 200, cooling device; 210, cooling plate; 211, cooling plate body; 212, cooling flow channel; 213, first positioning hole 214, second positioning hole; 220, first heat dissipation plate; 221, first heat dissipation plate body; 222, first heat conduction boss; 230, second heat dissipation plate; 231, second heat dissipation plate body; 300, first circuit board; 310, first edge electromagnetic shielding wire; 400, second circuit board; 410, second edge electromagnetic shielding wire; 500, connecting frame; 1000, central controller. Detailed implementation manners

[0040] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0041] In addition, the present application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0042] Next, the present application will be described in conjunction with the accompanying drawings and with reference to specific embodiments:

[0043] The embodiments of the present application provide a cooling device, as Figure 2 and Figure 8 shown, the cooling device in this embodiment includes:

[0044] A cooling plate, including a cooling plate body and a cooling flow channel provided in the cooling plate body;

[0045] The first heat dissipation plate is disposed on the first side of the cooling plate, and the first heat dissipation plate is used to fit the first circuit board.

[0046] The above cooling device includes a cooling plate and a first heat dissipation plate disposed on the first side of the cooling plate. With the split-type cooling device, heat exchange cooling of the first circuit board can be performed through the first heat dissipation plate, and the cooling plate can be isolated from the first circuit board through the first heat dissipation plate, avoiding damage to the first circuit board caused by leakage of the cooling flow channel provided in the cooling plate body, so as to protect the first circuit board from damage.

[0047] As an alternative embodiment, as Figures 2 to 8 shown, the cooling device further includes:

[0048] A second heat dissipation plate is disposed on the second side of the cooling plate, and the second heat dissipation plate is used to fit the second circuit board.

[0049] That is, in this example, as Figures 7 to 9 shown, the cooling device includes:

[0050] A cooling plate, including a cooling plate body and a cooling flow channel provided in the cooling plate body;

[0051] A first heat dissipation plate is disposed on the first side of the cooling plate, and the first heat dissipation plate is used to fit the first circuit board; and,

[0052] A second heat dissipation plate is disposed on the second side of the cooling plate, and the second heat dissipation plate is used to fit the second circuit board.

[0053] As the integration degree of the circuit board in the central controller increases and the demand for high-computing power AI chips increases, the demand for heat dissipation by the central controller also increases accordingly to avoid electrical heat damage. In this embodiment, the cooling device includes a cooling plate, a first heat dissipation plate disposed on the first side of the cooling plate, and a second heat dissipation plate disposed on the second side of the cooling plate. With the split-type cooling device, heat exchange cooling of the first circuit board can be performed through the first heat dissipation plate, and the cooling plate can be isolated from the first circuit board through the first heat dissipation plate, avoiding damage to the first circuit board caused by leakage of the cooling flow channel provided in the cooling plate body, so as to protect the first circuit board from damage. Similarly, heat exchange cooling of the second circuit board can be performed through the second heat dissipation plate, and the cooling plate can be isolated from the second circuit board through the second heat dissipation plate, avoiding damage to the second circuit board caused by leakage of the cooling flow channel provided in the cooling plate body, so as to protect the first circuit board from damage.

[0054] The cooling device in this embodiment can cool the circuit boards located on both sides of the cooling device through the first heat dissipation plate and the second heat dissipation plate at the same time, avoiding the need to separately provide a cooling device for each circuit board, reducing the number of cooling devices and the occupied space.

[0055] Further, the cooling device of this embodiment can meet the heat dissipation requirements of different circuit boards by replacing the structures of the first heat dissipation plate and the second heat dissipation plate on both sides of the cooling plate, making the cooling plate more widely applicable.

[0056] Further preferably, in the cooling device of this embodiment, cooling water or refrigerant flows through the cooling channels.

[0057] In the related art, the central controller can adopt air cooling for heat dissipation, mainly through air convection. The natural convection heat transfer efficiency of air is 5 - 25 W / ㎡*K, and larger heat dissipation fins are required to meet the heat dissipation requirements in the harsh scenario of 85℃ for the whole vehicle. In this application, water cooling can be adopted, and the forced convection coefficient of water cooling can reach 1000 - 15000 W / ㎡*K. Therefore, adopting water cooling can not only avoid using large heat dissipation fins and reduce the overall volume of the central controller, but also has a higher heat transfer efficiency and can meet the heat dissipation requirements in the harsh environment of the whole vehicle.

[0058] Optionally, as Figures 7 to 9 shown, the cooling channels provided in the cooling plate body are provided with a cooling inlet and a cooling outlet, and the cooling water circuit can be intervened from the whole vehicle. According to the minimum flow rate of 1 L / min, the inlet water temperature of 55℃, and the outlet water temperature of 100℃ (the lowest junction temperature of the vehicle - standard chip is 105℃), for example, the heat transfer area of this cooling plate is 0.2 m2. The heat transfer amount of this cooling device can be roughly calculated by the formula Q = Kwater * 0.2 * 45 (Kwater is 1000 - 15000 W / ㎡*K) to be: 900W - 13500W. Considering the heat transfer loss caused by actual heat - conducting devices, it can also meet the heat dissipation requirement of 500W for the future central controller.

[0059] As an optional implementation manner, as Figures 7 to 9 shown, at least one first heat - conducting boss is provided on the side of the first heat dissipation plate adjacent to the first circuit board, and the first heat - conducting boss is used to fit on the heating elements on the first circuit board; and / or, at least one second heat - conducting boss is provided on the side of the second heat dissipation plate adjacent to the second circuit board, and the second heat - conducting boss is used to fit on the heating elements on the second circuit board.

[0060] The central controller's circuit board utilizes an integrated design. Not only are there many integrated chips on the board, but factors such as board layout area also result in different chip locations, heights, and heat generation, leading to varying heat dissipation requirements. In this embodiment, the cooling device can implement point-selective cooling of the circuit boards. For example, before designing the first and second heat sinks, thermodynamic parameter simulations are conducted on the chips and components on the first and second circuit boards. Based on the simulation results, the first and second heat sinks are then structurally designed. First thermally conductive bosses are positioned on the first heat sink at locations corresponding to the primary heat points on the first circuit board. Similarly, second thermally conductive bosses are positioned on the second heat sink at locations corresponding to the primary heat points on the second circuit board. This allows for targeted heat dissipation of the first and second circuit boards, respectively, through the first and second thermally conductive bosses, improving heat dissipation efficiency.

[0061] As an optional implementation, Figures 7 to 9 As shown, in this embodiment, the cooling channel in the cooling plate passes through at least the first heat-conducting boss and / or the second heat-conducting boss.

[0062] In this embodiment, the first and second heat-conducting bosses are located at locations with higher heat dissipation requirements. To further improve the heat exchange efficiency between the first and second heat-conducting bosses and the cooling plate, the cooling channel within the cooling plate is configured to flow through at least the first and / or second heat-conducting bosses, thereby achieving better heat dissipation. Accordingly, a cooling escape area defined on the middle frame allows the first or second heat-conducting bosses to pass through, dissipating heat from the circuit board.

[0063] As an optional implementation, in this embodiment, a thermally conductive adhesive layer is provided between the first thermally conductive boss and the first circuit board, and / or a thermally conductive adhesive layer is provided between the second thermally conductive boss and the second circuit board.

[0064] In this embodiment, the thermal conductive adhesive layer can be made of heat dissipation silicone material with thermal conductivity.

[0065] By providing a thermally conductive adhesive layer between the first thermally conductive boss and the first circuit board, and / or providing a thermally conductive adhesive layer between the second thermally conductive boss and the second circuit board, flexible contact between each chip on the circuit board and the thermally conductive boss can be achieved, thereby avoiding chip damage due to vibration and other reasons when each chip is in rigid contact with the thermally conductive boss.

[0066] As an optional implementation, Figures 7 to 9As shown, in this embodiment, the first heat sink and the cooling plate are provided with corresponding first positioning holes, and the first heat sink and the cooling plate are connected to each other through a first connecting member and the first positioning holes; and / or, the second heat sink and the cooling plate are provided with corresponding second positioning holes, and the second heat sink and the cooling plate are connected to each other through a second connecting member and the second positioning holes.

[0067] In this embodiment, the first heat sink can be fixedly connected to the cooling plate by passing the first connector through the first positioning hole, and the second heat sink can be fixedly connected to the cooling plate by passing the second connector through the second positioning hole. Optionally, in some cases, the first positioning hole and the second positioning hole can overlap, i.e.

[0068] A connecting piece can sequentially pass through the first heat dissipation plate, the cooling plate and the second heat dissipation plate to realize the positioning connection of the cooling device.

[0069] As a further optional implementation manner, the first heat dissipation plate and / or the second heat dissipation plate in this embodiment is fixed to the cooling plate by brazing.

[0070] In this embodiment, the first and second heat sinks can be pre-positioned on the cooling plate using positioning pins, and then brazing can be used to secure the first and second heat sinks to the cooling plate. Brazing can provide a sealed connection between the first heat conducting plate and the water-cooled plate, and between the second heat conducting plate and the water-cooled plate. The first and second heat conducting plates enclose the cooling channel, preventing leakage from the cooling channel due to machining accuracy, vibration, and other factors from entering the circuit board.

[0071] As a further optional implementation, the first heat-conducting boss of this embodiment is fixed to the first heat dissipation plate by brazing, and the second heat-conducting boss can be fixed to the second heat dissipation plate by brazing.

[0072] In this embodiment, the first heat sink and the first heat-conducting boss are designed separately. The first heat-conducting boss can be flexibly positioned on the first heat sink according to heat dissipation requirements; the same applies to the second heat sink. This allows for the heat sink to be adjusted after the circuit board structure is modified, allowing for maximum mold reuse and reducing production costs.

[0073] As an optional implementation, Figure 2 and 9 As shown, the cooling device can be integrally connected to the middle frame by screwing. Correspondingly, the first circuit board and the second circuit board can also be connected to the middle frame by screwing, so that the first circuit board and the second circuit board are fixed to the middle frame and dissipate heat through the cooling device.

[0074] Further optionally, the middle frame is provided with an assembly positioning portion corresponding to the cooling device and an assembly positioning portion corresponding to the circuit board, so that the cooling device and the circuit board can be accurately assembled to the middle frame and the heat-conducting boss of the cooling device corresponds to the chip on the circuit board.

[0075] Based on the same inventive concept, this application also proposes a central controller. Figures 1 to 6 As shown, the central controller includes:

[0076] Central controller housing;

[0077] a cooling device, disposed in the housing to divide the housing into adjacent first and second cavities;

[0078] a first circuit board, disposed in the first cavity; and

[0079] The second circuit board is arranged in the second cavity.

[0080] In this embodiment, the central controller housing is divided into two cavities by the cooling device. The cooling device can be respectively attached to the first circuit board in the first cavity and the second circuit board in the second cavity, so that the first circuit board and the second circuit board can be cooled and dissipated at the same time.

[0081] As an optional implementation, Figures 1 to 6 As shown, the central controller housing of this embodiment includes:

[0082] It is used to set up the cooling device and has a cooling avoidance area for avoiding the cooling device;

[0083] A first cover body is buckled on a first side of the middle frame to form the first cavity between the first cover body, the middle frame and the cooling device; and

[0084] The second cover is buckled on the second side of the middle frame to form the second cavity between the second cover, the middle frame and the cooling device.

[0085] In this embodiment, the shell is divided into at least a first cavity and a second cavity through the combination of the middle frame and the first cover body and the second cover body. The control components of the central controller can be integrated into at least two circuit boards with smaller areas through the first cavity and the second cavity, so that the circuit boards are arranged in parallel in the shell of the central controller, which reduces the area of a single circuit board, facilitates the installation of the circuit board, improves the mode of the circuit board, and reduces the various vibrations and impact loads that the circuit board bears during operation; at the same time, the circuit boards are arranged in parallel in the first cavity and the second cavity, which can ensure that the volume of the central controller shell is relatively compact, reduce the maximum positive projection area of the shell, and facilitate the setting of the central controller in the car.

[0086] As an alternative implementation, in other embodiments, the central controller housing may include a number of middle frames stacked in sequence. For example, in the housing of the central controller, there are two stacked middle frames, and a first cover and a second cover are respectively arranged on both sides of the two stacked middle frames. The housing is divided into a first cavity, a second cavity, and a central cavity located between the first cavity and the second cavity by the two middle frames, so that three circuit boards can be arranged in the central controller housing.

[0087] As an alternative implementation, in the central controller housing of this embodiment, as Figure 3 and Figure 4 shown, the middle frame of this embodiment includes a partition and side walls surrounding the partition.

[0088] In this embodiment, the partition of the middle frame can divide the housing into a first cavity and a second cavity, thereby forming two installation spaces in the housing for arranging the central controller circuit board. Further, the partition and side walls of the middle frame can be used to fix structures such as circuit boards and cooling devices.

[0089] As an alternative implementation, as Figure 3 and Figure 4 shown, a connector avoidance area for avoiding the board - to - board connector is provided on the partition of this embodiment.

[0090] In this embodiment, a first cavity and a second cavity are provided in the central controller housing. A first circuit board and a second circuit board can be respectively arranged in the first cavity and the second cavity, and the first circuit board and the second circuit board can be connected through a board - to - board connector. A connector avoidance area is provided on the partition, which can enable the board - to - board connector to pass through the middle frame smoothly and be connected to the first circuit board and the second circuit board respectively.

[0091] Optionally, the board - to - board connector can adopt a 3 - cm high - speed board - to - board connector, achieving miniaturization of the projection area while also achieving a communication efficiency of more than 8 Gbps.

[0092] As an alternative implementation, as Figure 3 and Figure 4 shown, a cooling avoidance area for avoiding the cooling device is provided on the partition of this embodiment.

[0093] The circuit board of the central controller integrates multiple chips. Therefore, the heat generated by the circuit board is relatively large, and a corresponding cooling device needs to be set up to dissipate the heat of the circuit board. Cooling devices can be separately set up for the first circuit board and the second circuit board respectively for heat dissipation. In order to make the overall structure of the central controller simpler, preferably, a cooling device is set up inside the housing of the central controller to dissipate the heat of the first circuit board and the second circuit board at the same time. In this embodiment, the cooling device can be set on the first side or the second side of the middle frame, and can dissipate the heat of the circuit board on the other side of the middle frame through the cooling area on the partition of the middle frame.

[0094] In this embodiment, the partition of the middle frame realizes the connection between the first side and the second side of the middle frame by opening avoidance areas such as a connector avoidance area and a cooling avoidance area to facilitate the setting of structures such as inter-board connectors and cooling devices, and retains part of the partition for fixing structures such as circuit boards and cold area devices, and can enhance the structural strength of the middle frame.

[0095] In other embodiments, the middle frame can also be provided with only a surrounding wall without a partition, which is convenient for the setting of inter-board connectors and cooling devices. Optionally, mounting parts for fixing circuit boards and cooling devices can be provided on the surrounding wall to facilitate the setting of circuit boards and cooling devices inside the housing of the central controller.

[0096] As an alternative implementation, as Figure 2 shown, the housing of the central controller in this embodiment further includes:

[0097] A connecting frame, detachably arranged on the middle frame, the first cover or the second cover.

[0098] In the related art, in order to adapt to different vehicle models, central controller housings with different structures need to be set up. In this embodiment, by detachably arranging the connecting frame and fixing the central controller housing in the vehicle through the connecting frame, the central controller housing can be applied across vehicle models. Different connecting frames can be configured for different vehicle models. When applying across vehicle models, only the connecting frame adapted to the vehicle model needs to be replaced, which reduces the production cost of the central controller and improves the economic benefits.

[0099] As an alternative implementation, first electromagnetic shielding layers are respectively arranged on both sides of the first circuit board; second electromagnetic shielding layers are respectively arranged on both sides of the second circuit board;

[0100] A first middle frame electromagnetic shielding surrounding wall is arranged on the first side of the middle frame, and a second middle frame electromagnetic shielding surrounding wall is arranged on the second side of the middle frame;

[0101] A first cover body electromagnetic shielding surrounding wall is arranged on the inner side of the first cover body and is buckled on the first side of the middle frame so that the first cover body electromagnetic shielding surrounding wall abuts against the first middle frame electromagnetic shielding surrounding wall; and,

[0102] An inner side of the second cover body is provided with a second cover body electromagnetic shielding enclosure wall and is buckled on a second side of the middle frame, so that the second cover body electromagnetic shielding enclosure wall abuts against the second middle frame electromagnetic shielding enclosure wall.

[0103] In this embodiment, by respectively providing first electromagnetic shielding layers on two sides of the first circuit board; and respectively providing second electromagnetic shielding layers on two sides of the second circuit board, electromagnetic shielding between the first circuit board and the second circuit board is realized, and electromagnetic shielding towards the surface of the central controller is also realized; further, the housing of the control controller is further provided with mutually cooperating electromagnetic shielding enclosure walls, and electromagnetic shielding towards the periphery of the central controller is realized through the cooperation of the electromagnetic shielding enclosure walls, thereby realizing full shielding of the circuit board. That is, in this embodiment, the first circuit board forms an all-round three-dimensional electromagnetic shielding by the first cover body, the middle frame and the first circuit board itself, and the second circuit board forms an all-round three-dimensional electromagnetic shielding by the second cover body, the middle frame and the second circuit board itself, and electromagnetic shielding between the circuit boards and electromagnetic shielding of the central controller outward are realized through the cooperation of the circuit board and the housing.

[0104] As an alternative embodiment, in other embodiments, an electromagnetic shielding layer may also be provided on the surface of the housing corresponding to the surface of the circuit board to replace the electromagnetic shielding layer provided on the circuit board. For example, an inner side of the first cover body is provided with a first cover body electromagnetic shielding layer, and a first side of the middle frame is provided with a first middle frame electromagnetic shielding layer to replace the first electromagnetic shielding layers on two sides of the first circuit board; similarly, an inner side of the second cover body is provided with a second cover body electromagnetic shielding layer, and a second side of the middle frame is provided with a second middle frame electromagnetic shielding layer to replace the second electromagnetic shielding layers on two sides of the second circuit board. In this embodiment, if the power of the first circuit board and the second circuit board is small, a cooling device may not be provided, that is, a cooling avoidance area is not opened on the partition plate of the middle frame, so that a complete first middle frame electromagnetic shielding layer and a second electromagnetic shielding layer can be formed on the partition plate of the middle frame. In this embodiment, if the power of the first circuit board or the second circuit board is large, a cooling device needs to be provided, and a cooling avoidance area needs to be opened on the partition plate of the middle frame. In order to endow the cooling avoidance area with electromagnetic shielding function, an electromagnetic shielding layer may be provided on any one or several of the cooling plate, the first heat dissipation plate and the second heat dissipation plate of the cooling device to replace the electromagnetic shielding layer on the middle frame, so as to realize electromagnetic shielding between the first circuit board and the second circuit board.

[0105] For the first circuit board, the first cover body electromagnetic shielding layer, the first cover body electromagnetic shielding enclosure wall, the first middle frame electromagnetic shielding layer and the first middle frame electromagnetic shielding enclosure wall form a complete enclosure for the first circuit board, so that the first circuit board can be electromagnetically isolated from the second circuit board and other devices, and electromagnetic shielding of the first circuit board is realized. The electromagnetic shielding of the second circuit board is the same as that of the first circuit board and will not be elaborated here.

[0106] As an alternative embodiment, as Figure 3 and Figure 10 shown, a first electromagnetic radiation interruption part is provided between the first middle frame electromagnetic shielding enclosure wall and the first cover body electromagnetic shielding enclosure wall; a second electromagnetic radiation interruption part is provided between the second middle frame electromagnetic shielding enclosure wall and the second cover body electromagnetic shielding enclosure wall.

[0107] In this embodiment, since the middle frame and the two circuit boards or the two cover bodies cannot be made absolutely parallel, a complete planar shielding cannot be achieved. To improve the shielding effect, the present application sets the first electromagnetic radiation interruption part and the second electromagnetic radiation interruption part, so as to form an electromagnetic shielding grid structure between the middle frame and the first cover body and between the middle frame and the second cover body, so that eddy currents are generated when the electromagnetic field passes through the electromagnetic shielding grid structure, and the electromagnetic field is internally cancelled to finally achieve the electromagnetic shielding effect.

[0108] As an alternative embodiment, as Figure 3 and Figure 10 shown, in this embodiment, the distance between adjacent first electromagnetic radiation interruption parts is 8 cm to 12 cm; the distance between adjacent second electromagnetic radiation interruption parts is 8 cm to 12 cm. Further preferably, the distance between adjacent first electromagnetic radiation interruption parts is 10 cm; the distance between adjacent second electromagnetic radiation interruption parts is 10 cm.

[0109] In this embodiment, through experimental verification, the fundamental harmonic frequency of the in-vehicle device signal frequency < 2 GHz. According to the electromagnetic wave shielding principle formula: λ cut-off = 2a, where a is the aperture of the shielding wall. For example, when the distance a between the first electromagnetic radiation interruption part and the distance a between the second electromagnetic radiation interruption part are both 10 cm, then according to the formula f = c / λ = c / 2a = 2.794 GHz, where c = 3×10^8 m / s. That is, when the distance between the first electromagnetic radiation interruption part and the distance between the second electromagnetic radiation interruption part are 10 cm, the cut-off frequency for electromagnetic waves is 2.794 GHz, that is, the external radiation below this frequency band can be isolated and shielded.

[0110] As an alternative embodiment, the first electromagnetic radiation interruption part of this embodiment includes metal protrusions provided on the side wall of the first side of the middle frame and / or metal protrusions provided on the side wall of the first cover body; the second electromagnetic radiation interruption part includes metal protrusions provided on the side wall of the second side of the middle frame and / or metal protrusions provided on the side wall of the second cover body.

[0111] In this embodiment, by providing metal protrusions on the side walls of the housing, a metal grid structure is formed on the side walls of the housing through the metal protrusions, so as to isolate the external electromagnetic radiation of the central controller through the metal grid structure.

[0112] As an optional implementation manner, in this embodiment, first electromagnetic shielding layers are respectively provided on both sides of the first circuit board; and second electromagnetic shielding layers are respectively provided on both sides of the second circuit board.

[0113] In this embodiment, first electromagnetic shielding layers are respectively provided on both sides of the first circuit board to achieve external electromagnetic radiation shielding of the upper and lower surfaces of the first circuit board, and further external electromagnetic radiation shielding is achieved around the first circuit board by the first cover electromagnetic shielding wall and the first middle frame electromagnetic shielding wall; similarly, second electromagnetic shielding layers are respectively provided on both sides of the second circuit board to achieve external electromagnetic radiation shielding of the upper and lower surfaces of the second circuit board, and further external electromagnetic radiation shielding is achieved around the second circuit board by the second cover electromagnetic shielding wall and the second middle frame electromagnetic shielding wall.

[0114] As an optional implementation, Figure 12 and Figure 13 As shown, in this embodiment, a first edge electromagnetic shielding wire is provided on the edge of the first circuit board; and a second edge electromagnetic shielding wire is provided on the edge of the second circuit board.

[0115] Further preferably, the first edge electromagnetic shielding wire abuts against the first cover electromagnetic shielding wall or the first middle frame electromagnetic shielding wall; the second edge electromagnetic shielding wire abuts against the second cover electromagnetic shielding wall or the second middle frame electromagnetic shielding wall.

[0116] As an optional implementation, Figures 2 to 4 As shown, an inter-board connector is provided between the first and second circuit boards; accordingly, a connector avoidance zone is defined in the middle frame, a first connector electromagnetic shielding wall is provided around the connector avoidance zone on a first side of the middle frame, and a second connector electromagnetic shielding wall is provided around the connector avoidance zone on a second side of the middle frame. Further preferably, connector electromagnetic shielding wires are provided at corresponding positions on the first and second circuit boards surrounding the connector avoidance zone.

[0117] In this embodiment, in order to avoid electromagnetic interference between the first circuit board and the second circuit board through the connector avoidance area, a first connector electromagnetic shielding wall is set around the connector avoidance area in the middle frame to abut against the connector electromagnetic shield line located on the first circuit board, and a second connector electromagnetic shielding wall is set around the connector avoidance area in the middle frame to abut against the connector electromagnetic shield line located on the second circuit board, thereby covering the inter-board connector and avoiding electromagnetic interference between the boards.

[0118] As an optional embodiment, the electromagnetic shielding wall and the electromagnetic shielding layer are made of a metal material. The electromagnetic shielding effect is achieved by the metal material. Optionally, the metal material can be copper.

[0119] Based on the same inventive concept, an embodiment of the present application further provides an automobile, which includes the above-mentioned central controller.

[0120] Since the automobile provided by the present invention includes the central controller of the above technical solution, the automobile provided by the present invention has all the beneficial effects of the above central controller, which will not be elaborated here.

[0121] In the present application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0122] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0123] It should be noted that all the directional indications in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If this specific posture changes, the directional indications will also change accordingly.

[0124] In the present application, unless otherwise clearly defined and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0125] In addition, in this application, descriptions such as "first" and "second" are for descriptive purposes only, and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of this application, "a plurality of" means two or more, unless otherwise specifically defined.

[0126] In the description of this specification, descriptions with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc., mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0127] In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on what can be achieved by those of ordinary skill in the art. When the combination of technical solutions results in contradictions or cannot be achieved, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0128] Although the embodiments of this application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of this application. The scope of this application is defined by the claims and their equivalents.

Claims

1. A cooling device, characterized in that, The cooling device is used to cool the central controller of a vehicle, and the cooling device includes: a cooling plate, including a cooling plate body and a cooling flow channel arranged in the cooling plate body; a first heat dissipation plate, arranged on a first side of the cooling plate, and the first heat dissipation plate is used to be attached to a first circuit board; a second heat dissipation plate, arranged on a second side of the cooling plate, and the second heat dissipation plate is used to be attached to a second circuit board; at least one first heat conduction boss is arranged on a side of the first heat dissipation plate adjacent to the first circuit board, and the first heat conduction boss is used to be attached to a heating element on the first circuit board; the first heat conduction boss is fixed on the first heat dissipation plate by soldering, so as to flexibly adjust the position and quantity of the first heat conduction boss arranged on the first heat dissipation plate; the first heat dissipation plate and / or the second heat dissipation plate is fixed on the cooling plate by soldering, so that a sealed connection is formed between the first heat dissipation plate and the cooling plate and / or a sealed connection is formed between the second heat dissipation plate and the cooling plate.

2. The cooling device according to claim 1, characterized in that, at least one second heat conduction boss is arranged on a side of the second heat dissipation plate adjacent to the second circuit board, and the second heat conduction boss is used to be attached to a heating element on the second circuit board.

3. The cooling device according to claim 2, wherein The setting position and quantity of the first heat conduction boss correspond to the heating position and heating quantity of the first circuit board; and / or, the setting position and quantity of the second heat conduction boss correspond to the heating position and heating quantity of the second circuit board.

4. The cooling device according to claim 3, wherein The flowing path of the cooling flow channel in the cooling plate at least passes through the first heat conduction boss and / or the second heat conduction boss.

5. The cooling device according to claim 3, characterized in that, A heat conduction glue layer is arranged between the first heat conduction boss and the first circuit board, and / or, a heat conduction glue layer is arranged between the second heat conduction boss and the second circuit board.

6. The cooling device according to claim 1 or 2, characterized in that, The first heat dissipation plate and the cooling plate are correspondingly provided with first positioning holes, and the first heat dissipation plate and the cooling plate are connected through a first connecting piece and the first positioning holes; and / or, the second heat dissipation plate and the cooling plate are correspondingly provided with second positioning holes, and the second heat dissipation plate and the cooling plate are connected through a second connecting piece and the second positioning holes.

7. A central controller, characterized in that, The central controller includes: a central controller housing; the cooling device according to any one of claims 1 to 6, arranged in the housing to divide the housing into adjacent first and second cavities; a first circuit board, arranged in the first cavity; and a second circuit board, arranged in the second cavity.

8. A vehicle, characterized in that, The vehicle includes the central controller according to claim 7.

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