Battery device and method of manufacturing the same

Abstract

A battery device and a manufacturing method thereof are provided. The battery device includes at least one battery pack having a plurality of battery cells, a BMS for managing the plurality of battery cells, a substrate on which the BMS is mounted and on which at least one insulating layer and at least one conductive layer are stacked, a plurality of wirings extending from the battery cells to the substrate, a plurality of through-holes formed in the substrate and into which the plurality of wirings are respectively inserted, a non-conductive area formed in at least one area around the through-holes, and a soldering portion formed on the through-hole into which the plurality of wirings are inserted.

Description

Technical Field

[0001] This invention relates to a battery device and a method of manufacturing the battery device, and more particularly to a battery device and a method of manufacturing the battery device capable of preventing electrical damage to the BMS when wiring extending from the battery cell is soldered to a board to connect the battery cell to the battery management system (BMS). Background Technology

[0002] Rechargeable secondary batteries, or batteries, are already widely used as energy sources for mobile devices such as smartphones. In addition, batteries have been used as energy sources for electric and hybrid electric vehicles, and have been proposed as a measure to address air pollution caused by fossil fuel-powered gasoline or diesel vehicles.

[0003] Due to the advantages of batteries, the applications using batteries are extremely diverse, and there is a expectation that batteries will be used in even more fields and products than they are now.

[0004] Based on the configuration of electrodes and electrolytes, batteries are classified into lithium-ion batteries, lithium-ion polymer batteries, and lithium polymer batteries, with lithium-ion polymer batteries increasingly being used due to their low risk of electrolyte leakage and ease of manufacture.

[0005] As mentioned above, batteries are widely used as an energy source for various products. However, because batteries contain various flammable materials, they pose a risk of overheating and explosion due to overcharging, overcurrent, and other physical shocks. To prevent these limitations, batteries include safety systems such as protective circuits to block current in cases of overcharging, over-discharging, and overcurrent; positive temperature coefficient (PTC) elements with resistance that increases sharply with temperature to block current; and safety vents to release gas or block current when pressure increases due to gas generation. Medium and large battery packs with structures that combine multiple battery modules include safety systems such as fuses, bimetallic strips, or battery management systems (BMS) to protect battery cells from over-discharging, overcharging, and overcurrent.

[0006] In a safety system, the BMS is electrically connected to multiple battery cells that make up a battery bank. Here, a battery bank is configured to have at least two battery cells connected in parallel, and a battery bank includes at least two battery banks.

[0007] Wiring extending from the battery cells to connect the BMS to the battery cells extends to the board to which the BMS is mounted and is soldered to the board to connect the battery cells to the BMS. When vias are formed in the board, wiring is inserted into the vias, and when the wiring above the vias is soldered, the BMS and battery cells mounted on the board are connected via the wiring. Here, the battery cells must be connected to the BMS sequentially from the lowest to the highest battery cells in the battery assembly to prevent electrical damage to at least one of the multiple integrated circuits (ICs) constituting the BMS. For example, when the first to eighth battery assemblies are arranged from top to bottom, and the first to nth battery cells are arranged in each battery assembly, the battery cells are connected to the BMS sequentially from the nth to the first battery cell of the eighth battery assembly, and in the same manner, from the battery cells of the eighth battery assembly to the battery cells of the first battery assembly.

[0008] However, when the battery packs are not soldered sequentially from the lowest battery pack, electrical damage can occur because cell power is randomly applied to the BMS IC. That is, power is received from the battery cells to operate the IC, and a voltage of 4.2V or higher is applied to the IC's input pins without first connecting ground (e.g., when connecting the intermediate battery cell from the first to the nth battery cell), and two or more battery cells are connected. While applying voltages greater than permissible values ​​to the IC is not allowed to cause electrical damage, electrical damage results in IC malfunction when current or voltage exceeding permissible values ​​is applied.

[0009] [Related Technical Documents]

[0010] [Patent Literature]

[0011] (Patent Document 1) Korean Patent Registration No. 10-1572650 (Patent Document 2) Korean Patent Publication No. 2018-0118920. Summary of the Invention

[0012] Technical issues

[0013] This disclosure provides a battery device and a method of manufacturing the battery device, which is capable of preventing electrical damage to the BMS when wiring extending from the battery cell is soldered to a board to connect the battery cell to the battery management system (BMS).

[0014] This disclosure also provides a battery device that prevents electrical damage to the BMS even when the BMS is not sequentially connected from the battery cells of the low-battery assembly, and a method for manufacturing the battery device.

[0015] Technical solution

[0016] According to an exemplary embodiment, a battery device includes: at least one battery pack including a plurality of battery cells; a battery management system (BMS) configured to manage the plurality of battery cells; a board to which the BMS is mounted and to which at least one insulating layer and a conductive layer are stacked; a plurality of wirings extending from the battery cells to the board; a plurality of through-holes formed in the board and into which the plurality of wirings are respectively inserted; a non-conductive region formed on at least one region surrounding the through-holes; and a soldered portion formed on the through-holes into which the wirings are inserted.

[0017] The battery device may also include conductive patterns formed on a plate, connected to the BMS, and connected to wiring via soldered portions.

[0018] Non-conductive regions may include a non-conductive layer formed on the inner surface of the via.

[0019] The non-conductive layer can be made of a different material than the insulating layer of the board.

[0020] Non-conductive regions may include conductive patterns spaced at a predetermined distance from the outer periphery of the via.

[0021] The conductive pattern can be spaced 0.3 mm to 1 mm from the outer periphery of the via.

[0022] According to another exemplary embodiment, a method of manufacturing a battery device includes the following processes: forming a through hole in a plate on which at least one insulating layer and a conductive layer are stacked; forming a conductive pattern around the through hole on the plate; forming a non-conductive layer on the inner surface of the through hole; inserting wiring extending from a plurality of battery cells into the interior of the non-conductive layer of the through hole; and forming a weld portion configured to connect the wiring above the through hole to the conductive pattern.

[0023] The method may also include a process of mounting the BMS on the board after the formation of the non-conductive layer and before the insertion of wiring.

[0024] Conductive patterns can be formed on the plate from the outer periphery of the via.

[0025] The non-conductive layer can be made of a different material than the insulating layer of the board.

[0026] According to another exemplary embodiment, a method of manufacturing a battery device includes the following processes: forming a plurality of through holes in a plate; forming a conductive pattern around the through holes in the plate; inserting wiring extending from a plurality of battery cells into the interior of the through holes; and forming a welded portion configured to connect the wiring above the through holes to the conductive pattern, wherein the conductive pattern is spaced at a predetermined distance from the periphery of the through holes.

[0027] Conductive patterns can be formed in an area spaced 0.3 mm to 1 mm from the outer periphery of the via.

[0028] Beneficial effects

[0029] In this invention, the wiring may not be electrically connected to the conductive patterns on the board before it is inserted into the through-hole and soldered. That is, since an insulating layer is formed on the inner surface of the through-hole, the wiring inserted into the through-hole may not be connected to the conductive patterns exposed inside the through-hole or the conductive patterns on the board, and since the conductive patterns on the board are spaced at a predetermined distance from the through-hole, the wiring may not be connected to the conductive patterns on the board when it is inserted into the through-hole.

[0030] Therefore, this invention can prevent electrical damage to the BMS when wiring extending from the battery cell is soldered to the board to connect the battery cell and the BMS. In other words, electrical damage can be avoided in the BMS even if it is not sequentially connected from the battery cells of the lower battery pack. Attached Figure Description

[0031] The exemplary embodiments can be understood in more detail from the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 This is a block diagram illustrating the configuration of a battery device according to an exemplary embodiment;

[0033] Figure 2 and Figure 3 These are partial cross-sectional views of a battery device according to an exemplary embodiment and another exemplary embodiment, respectively;

[0034] Figures 4 to 6 These are views used to illustrate a method of manufacturing a battery device according to an exemplary embodiment; and

[0035] Figures 7 to 8 This is a view used to illustrate a method of manufacturing a battery device according to another exemplary embodiment. Detailed Implementation

[0036] In the following, specific embodiments will be described in detail with reference to the accompanying drawings. However, this disclosure may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of this disclosure to those skilled in the art. In the drawings, the dimensions of layers and regions are enlarged for clarity. The same reference numerals always refer to the same elements.

[0037] Figure 1 This is a block diagram illustrating the configuration of a battery device according to an exemplary embodiment. Furthermore, Figure 2 and Figure 3 These are partial cross-sectional views showing battery devices according to an exemplary embodiment and another exemplary embodiment, respectively. That is, Figure 2 and Figure 3 These are partial cross-sectional views of a battery device according to an exemplary embodiment, wherein wiring is welded into through holes defined in a plate.

[0038] Reference Figure 1 A battery device according to an exemplary embodiment may include: a battery pack 100 including a plurality of battery combinations 110 to 150; a battery management system (BMS) 200 for managing the battery pack 100; a board 300 on which the BMS is mounted; wiring 400 extending from the battery pack 100 to connect the battery cells and the BMS 200 on the board 300; and a soldered portion for securing the wiring 400 to the board 300 to achieve an electrical connection between them. The configuration of the battery device according to an exemplary embodiment will now be described in detail.

[0039] Battery pack 100 supplies electrical energy to applications such as smartphones or electric vehicles. Battery pack 100 can be managed by BMS 200 and charged by external power. Here, battery pack 100 may include multiple battery combinations 110 to 150. Furthermore, each of battery combinations 110 to 150 may include multiple rechargeable battery cells 111 and 112. Although each of battery combinations 110 to 150 includes two battery cells 111 and 112 in the figures, each of battery combinations 110 to 150 may include two or more battery cells 111 and 112. Although reference numerals apply only to a single battery... Figure 1The first battery assembly 110 includes battery cells 111 and 112. However, since each of the remaining battery assemblies 120 to 150 also includes the same number of battery cells with the same connection relationship, the reference numerals are not applied to the battery cells of battery assemblies 120 to 150. In the following text, battery cells 111 and 112 refer to all battery cells of battery assemblies 120 to 150. Furthermore, battery cells 111 and 112 of each of battery assemblies 110 to 150 can be connected in parallel. For example, battery cells 111 and 112 of the first battery assembly 110 can be connected in parallel, and battery cells 111 and 112 of each of the second to fifth battery assemblies 120 can also be connected in parallel. However, in addition to parallel connection, battery cells 111 and 112 can be connected in series or in a series-parallel connection. That is, battery cells 111 and 112 can be connected in series, in parallel, or in a series-parallel connection. Here, the invention is not limited to the types of battery cells 111 and 112. For example, battery cells 111 and 112 may include lithium-ion batteries, lithium polymer batteries, nickel-cadmium batteries, nickel-metal hydride batteries, and nickel-zinc batteries. Battery cells 111 and 112 are classified according to the shape of their housings as cylindrical cells in which electrode assemblies are contained in cylindrical or angular metal cans, and pouch cells in which electrode assemblies are contained in pouch-shaped housings made of aluminum laminates. Here, a cylindrical cell is described as an example in an exemplary embodiment.

[0040] The BMS 200 estimates the state of the battery pack 100 and manages the battery pack 100 using the estimated state information. For example, it estimates and manages state information of the battery pack 100, such as its State of Charge (SOC), State of Health (SOH), maximum input / output power margin, and output voltage. Furthermore, it controls the charging or discharging of the battery pack 100 using the state information. According to an exemplary embodiment, the BMS 200 includes a SOC estimation device for estimating the SOC of the battery pack 100. Additionally, the BMS 200 controls balancing to balance the state of charge of each battery cell. That is, battery cells 111 and 112 in a relatively high state of charge can be discharged, and battery cells 111 and 112 in a relatively low state of charge can be charged. Furthermore, a sensing section can be provided for sensing the state of the battery pack 100 to manage the battery pack 100 using the BMS 200. The sensing section may include a current sensor for sensing the current of the battery pack 100, a voltage sensor for sensing the voltage of the battery pack 100, and a temperature sensor for sensing the temperature of the battery pack 100. Here, at least one current sensor, at least one voltage sensor, and at least one temperature sensor can be provided. The BMS performing the various functions described above may include various components and be mounted on board 300. That is, multiple components for estimating SOC, multiple components for cell balancing, multiple components for configuring the sensing section, and other passive components can be mounted on board 300. Although not shown, a charge-discharge protection circuit for protecting the battery pack 100 by controlling the charge-discharge of the battery pack 100 can also be provided. That is, the charge-discharge protection circuit can be mounted on board 300 as a component separate from the BMS 200.

[0041] Board 300 may include a printed circuit board (PCB) in which a circuit pattern is formed on an insulating layer. The necessary circuit pattern of the PCB is formed by attaching a copper sheet to the surface of a phenolic resin insulating layer or an epoxy resin insulating layer, and then etching the copper sheet according to a predetermined pattern. The PCB described above can be used as board 300. Here, depending on the number of circuit layers and insulating layers, single-sided boards, double-sided boards, and multilayer boards can be used as PCBs. Since boards with a large number of layers exhibit excellent electronic component mounting capabilities and are used in high-precision products, the number of layers can be selected according to the number of components mounted to the PCB and the degree of integration. In addition to the multiple components constituting BMS 200, passive components such as capacitors, inductors, and resistors can also be mounted on board 300. Furthermore, a plurality of through-holes 310 can be defined in board 300. Furthermore, a predetermined conductive pattern 320 can be formed on the top surface of board 300. Here, the conductive pattern 320 can be formed around the through-holes 310 on board 300. The conductive pattern 320 can be connected to at least one component mounted on board 300. In other words, the conductive pattern 320 can be connected to at least a portion of the BMS 200.

[0042] Wiring 400 connects battery cells 111 and 112 of battery packs 110 to 150 to BMS 200. That is, wiring 400 extends from battery cells 111 and 112 onto board 300 and connects to BMS 200. Wiring 400 can be made of, for example, copper, aluminum, or their alloys. Wiring 400 extends from battery cells 111 and 112 onto board 300 and is inserted into through-holes 310 of board 300. Furthermore, since a weld portion 410 is formed on the upper side of through-hole 310 by soldering after wiring 400 is inserted into through-hole 310, wiring 400 can be connected to conductive patterns 320 on board 300, and thus battery pack 100 and BMS 200 can be electrically connected to each other.

[0043] Here, because the interior of the through-hole 310 into which the wiring 400 is inserted is not plated in the exemplary embodiment, the battery cells 111 and 112 may not be electrically connected to the BMS 200 before the solder portion 410 is formed. That is, as Figure 2As shown, according to an exemplary embodiment, after a non-conductive layer 330 is formed on the inner surface of the through-hole 310 and the wiring 400 is inserted into the non-conductive layer 330, a welded portion 410 can be formed by soldering the wiring 400 onto the board 300. Because a non-conductive layer 330 is formed on the inner surface of the through-hole 310, the wiring 400 can avoid contacting the conductive material, such as the conductive pattern 320, on the board 300 during insertion into the through-hole 310, and the battery cell and BMS 200 can be electrically disconnected from each other before the welded portion 410 is formed. Here, the non-conductive layer 330 can be made of a different type of material than the board 300. That is, the non-conductive layer 330 can be made of a different material than the insulating layer of the board 300. Alternatively, the non-conductive layer 330 can be made of the same material as the insulating layer of the board 300. Here, the non-conductive layer 330 can be formed in a subsequent process after the formation of the insulating and conductive layers of the board 300. In other words, board 300 can be manufactured into a PCB, multiple insulating layers and conductive patterns can be stacked on the PCB, and through-holes 310 can be formed in the PCB. Then, a non-conductive layer 330 in the through-holes 310 can be formed on the inner surface of the through-holes 310 in the following process.

[0044] Furthermore, in another exemplary embodiment, since the conductive pattern 320 is not formed around the upper side of the via 310, the wiring 400 can be inserted into the via 310 and soldered, and then electrically connected. That is, as Figure 3 As shown, in another exemplary embodiment, since the conductive pattern 320 on the board 300 is spaced at a predetermined distance from the through hole 310, the wiring 400 and the conductive pattern 320 on the board 300 do not contact each other during the process of inserting the wiring 400 into the through hole 310. Therefore, the battery cell and the BMS 200 may not be electrically connected to each other before the solder portion 410 is formed.

[0045] As described above, the exemplary embodiment allows the wiring and the conductive patterns on the board to be electrically disconnected from each other before the wiring is inserted into the through-hole and soldered. That is, because a non-conductive layer is formed on the inner surface of the through-hole, the wiring inserted into the through-hole may not be connected to the conductive patterns exposed inside the through-hole or to the conductive patterns on the board, and because the conductive patterns on the board are spaced a predetermined distance from the through-hole, the wiring may not be connected to the conductive patterns on the board when inserted into the through-hole. Therefore, when wiring extending from the battery cell is soldered to the board to connect the battery cell and the BMS, the exemplary embodiment can prevent electrical damage to the BMS. In other words, electrical damage can be prevented in the BMS even when it is not sequentially connected from the battery cells of the low-battery assembly.

[0046] A method for manufacturing a battery device according to an exemplary embodiment will be described with reference to the accompanying drawings. Here, the exemplary embodiment describes a method focusing on manufacturing through holes defined in a plate.

[0047] Figures 4 to 6 This is a view used to illustrate a method of manufacturing a battery device according to an exemplary embodiment.

[0048] Reference Figure 4 A through hole 310 is formed in a predetermined area of ​​plate 300.

[0049] Board 300 may be a PCB on which a predetermined conductive pattern is formed. That is, board 300 may be a PCB on which at least one insulating layer is formed and on which the predetermined conductive pattern is formed. For example, board 300 may be formed by stacking multiple insulating layers thereon and forming a predetermined conductive pattern between the insulating layers. Multiple vias 310 may be formed in predetermined areas of board 300. The vias 310 may be formed in various ways. For example, vias 310 may be formed at multiple locations where multiple wirings extending from the battery cell are inserted using a press. Here, each of the vias 310 may be formed with a diameter larger than the diameter of the wiring 400 extending from the battery cell, for example, having a diameter two to five times larger than the diameter of the wiring 400. Furthermore, a conductive pattern 320 may be formed on board 300. Here, the conductive pattern 320 may be formed as a predetermined pattern in areas other than the vias 310. That is, the conductive pattern 320 may be formed as a predetermined pattern from an extension line extending perpendicular to the inner surface of the via 310. In other words, the conductive pattern 320 can be formed around the through hole 310 from a region that coincides with the inner surface of the through hole 310 in the vertical direction.

[0050] Reference Figure 5 A non-conductive layer 330 is formed on the inner surface of the through hole 310.

[0051] The non-conductive layer 330 can be formed by applying an insulating material to the inner surface of the via 310, and thus the via 310 can have a diameter smaller than its initial diameter. That is, the via 310 can be formed with a first diameter, and when the non-conductive layer 330 is formed on the inner surface of the via 310, the via 310 can have a second diameter smaller than the first diameter after the non-conductive layer 330 is formed. Here, after the non-conductive layer 330 is formed, the diameter of the via 310 can also be larger than the diameter of the wiring 400. For example, the via 310 can have a diameter 1.5 to 3 times larger than the diameter of the wiring 400. Various processes can be used to form the non-conductive layer 330 on the inner surface of the via 310. For example, the insulating layer can be retained on the inner surface of the via 310 by applying an insulating material to cover the via 310 and then removing the insulating layer from the board and penetrating the via 310 again.

[0052] Reference Figure 6 A solder joint 410 is formed by inserting the wiring 400 into the through hole 310 and then soldering the upper side of the wiring 400. Therefore, the wiring 400 and the conductive pattern 320 can be electrically connected to each other through the solder joint 410.

[0053] In other words, the method of manufacturing a battery device according to an exemplary embodiment may include: a process of preparing at least one battery pack 100 including a plurality of battery cells 111 and 112; a process of forming a plurality of wirings 400 connected to the plurality of battery cells 111 and 112; a process of providing a plate 300 on which at least one insulating layer and a conductive layer are formed and in which a through hole 310 is formed; a process of forming a conductive pattern 320 around the through hole 310 on the plate 300; a process of forming a non-conductive layer 330 on the inner surface of the through hole 310; a process of inserting the wirings 400 into the non-conductive layer 330 of the through hole 310; and a process of forming a weld portion 410 connecting the wirings 400 and the conductive pattern 320 by soldering the wirings 400 over the plate 300. Here, after the non-conductive layer 330 is formed inside the through hole 310 and before the wirings 400 are inserted into the through hole 310, the BMS 200 may be mounted onto the plate 300.

[0054] In addition, the reference can be modified in various ways. Figures 4 to 6 The exemplary embodiments described herein. For example, the via 310 may be formed before the conductive pattern 320 is formed, a non-conductive layer 330 may be formed on the inner surface of the via 310, and then the conductive pattern 320 may be formed around the via 310 on the plate 300. That is, a modified example of the method of manufacturing a battery device according to the exemplary embodiments may include: a process of forming the via 310 in the plate 300; a process of forming a non-conductive layer 330 on the inner surface of the via 310; a process of forming a conductive pattern around the via 310 on the plate 300; a process of inserting a wiring 400 inside the non-conductive layer 330 of the via 310; and a process of forming a weld portion 410 connecting the wiring 400 and the conductive pattern 320 by soldering the wiring 400 over the plate 300.

[0055] As described above, according to the exemplary embodiment, a non-conductive layer 330 can be formed on the inner surface of the through-hole 310, and a wiring 400 can be inserted into the non-conductive layer 330 to form a weld portion 410 by soldering the wiring 400 onto the board 300. Since the non-conductive layer 330 is formed on the inner surface of the through-hole 310, the wiring 400 can avoid contacting the conductive pattern 320 on the board 300 during the process of inserting the wiring 400 into the through-hole 310, and the battery cell and BMS 200 can be electrically disconnected from each other before the weld portion 410 is formed. In other words, in the exemplary embodiment, since there is no electroplating inside the through-hole 310 into which the wiring 400 is inserted, the battery cell and BMS 200 can be electrically disconnected from each other before the weld portion 410 is formed.

[0056] Figures 7 to 8 This is a view illustrating a method of manufacturing a battery device according to another exemplary embodiment. Here, descriptions of another exemplary embodiment that overlap with the description of the exemplary embodiment will be omitted, and features not mentioned in the description of the other example embodiment are the same as those in the exemplary embodiment.

[0057] Reference Figure 7 A through hole 310 is formed in a predetermined area of ​​plate 300.

[0058] Board 300 may be a PCB on which a predetermined conductive pattern is formed. Multiple through-holes 310 may be formed in a predetermined area of ​​board 300. The through-holes 310 may be formed in various ways. For example, through-holes 310 may be formed at multiple locations where multiple traces extending from the battery cell are inserted using a press. Here, each of the through-holes 310 may be formed with a diameter larger than the diameter of the traces 400 extending from the battery cell. Furthermore, conductive patterns 320 may be formed on board 300. Here, conductive patterns 320 may be formed as a predetermined pattern in areas other than the through-holes 310. Furthermore, conductive patterns 320 may be spaced at a predetermined distance from the through-holes 310. For example, conductive patterns 320 may be spaced approximately 0.3 mm from the outer periphery of the through-holes 310. Here, the spacing between conductive patterns 320 and through-holes 310 needs to be such that the traces 400 do not contact the conductive patterns 320 when inserted into the through-holes 310. Furthermore, the spacing between the conductive pattern 320 and the via 310 needs to be maintained to prevent the size of the solder portion 410 from increasing excessively. This is because if the spacing between the conductive pattern 320 and the via 310 is too large, the size of the solder portion 410 will increase excessively. Therefore, considering the size of the via 310, the thickness of the wiring 400, and the size of the solder portion 410, the spacing between the conductive pattern 320 and the via 310 can be maintained in the range of 0.3 mm to 1 mm.

[0059] Reference Figure 8 The solder joint 410 is formed by inserting the wiring 400 into the through hole 310 and then soldering the upper side of the wiring 400. Therefore, the wiring 400 and the conductive pattern 320 can be electrically connected to each other through the solder joint 410.

[0060] That is, a method of manufacturing a battery device according to another exemplary embodiment may include: a process of preparing at least one battery pack 100 including a plurality of battery cells 111 and 112; a process of forming a plurality of wirings 400 connected to the plurality of battery cells 111 and 112; a process of preparing a board 300 having at least one insulating layer and a conductive layer stacked thereon and having a battery management system (BMS) mounted thereon; a process of forming a through hole 310 in the board 300; a process of forming a conductive pattern 320 around the through hole 310 on the board 300; a process of inserting the wirings 400 into the through hole 310; and a process of forming a weld portion 410 connecting the wirings 400 and the conductive pattern 320 by soldering the wirings 400 onto the board 300.

[0061] Here, another exemplary embodiment can be modified in various ways. For example, considering the area where the through-hole 310 is to be formed, the conductive pattern 320 can be formed first, and then the through-hole 310 can be formed to be spaced apart from the conductive pattern 320. That is, a modified example of the method of manufacturing a battery device according to another exemplary embodiment may include: a process of forming the conductive pattern 320 on the plate 300; a process of forming the through-hole 310 inside the conductive pattern 320; a process of inserting the wiring 400 inside the through-hole 310; and a process of forming a weld portion 410 connecting the wiring 400 and the conductive pattern 320 by soldering the wiring 400 above the plate 300.

[0062] As described above, according to another exemplary embodiment, the conductive pattern 320 can be formed on the plate 300 to be spaced apart from the through hole 310, and the solder portion 410 can be formed by soldering the wiring 400 above the plate 300 after the wiring 400 is inserted into the through hole 310. Since the conductive pattern 320 is formed on the plate 300 and spaced apart from the through hole 310, the wiring 400 can avoid contacting the conductive pattern 320 on the plate 300 during the process of inserting the wiring 400 into the through hole 310, and the battery cell and BMS 200 can be decoupled from each other before the solder portion 410 is formed.

[0063] As described above, the technical concept of the present invention has been specifically described with reference to the above embodiments. However, it should be noted that the above embodiments are for illustrative purposes only and do not limit the present invention. Various embodiments may be provided to allow those skilled in the art to understand the scope of the present invention, but the present invention is not limited thereto.

Claims

1. A battery device, comprising: At least one battery pack, which includes multiple battery cells; A battery management system (BMS) configured to manage the multiple battery cells; A board, wherein the BMS is mounted to the board, and a conductive layer and at least one insulating layer are stacked on the board; Multiple wirings extend from the plurality of battery cells to the board; Multiple through holes are formed in the plate, and the multiple wirings are respectively inserted into the multiple through holes; A non-conductive region is formed on at least one region around the through hole, the non-conductive region comprising a non-conductive layer formed on the inner surface of the through hole; A soldered portion is formed on the through hole to which the wiring is inserted; as well as A conductive pattern formed on the plate, connected to the BMS, and connected to the wiring via the soldering portion.

2. The battery device according to claim 1, wherein, The non-conductive layer is made of a material different from the material of the insulating layer of the plate.

3. The battery device according to claim 1, wherein, The conductive pattern is spaced at a predetermined distance from the outer periphery of the through hole.

4. The battery device according to claim 3, wherein, The conductive pattern is spaced 0.3 mm to 1 mm from the outer periphery of the through hole.

5. A method for manufacturing a battery device, comprising the following processes: A through-hole is formed in a plate on which a conductive layer and at least one insulating layer are stacked; A conductive pattern is formed around the through hole on the plate; A non-conductive layer is formed on the inner surface of the through hole; A battery management system (BMS) is installed on the board, wherein, The BMS is configured to manage multiple battery cells of the battery pack, and the conductive pattern is connected to at least a portion of the BMS; A wiring extending from one of the plurality of battery cells is inserted into the interior of the non-conductive layer of the through-hole; as well as A solder portion is formed that is configured to connect the wiring above the through-hole to the conductive pattern.

6. The method according to claim 5, wherein, The conductive pattern is formed on the plate from the outer periphery of the through hole.

7. The method according to claim 5, wherein, The non-conductive layer is made of a material different from the material of the insulating layer of the plate.

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