A wafer dicing system

Abstract

The present invention discloses a wafer dicing system. The wafer is radially clamped by a first clamping plate and a second clamping plate. Then, after separating a plurality of wafers from the graphite bar by a wire saw mechanism, the wafers will not fall down. By providing a first guard plate and a second guard plate, and making the first guard plate and the second guard plate contact the wafers at both ends of the graphite bar respectively. Then, when the first clamping plate and the second clamping plate are separated, the first guard plate and the second guard plate can effectively prevent the wafers from falling down. When it is necessary to remove the wafers, the staff can take out a plurality of wafers to the wafer rack at one time. Compared with the existing method of protecting the wafers on the graphite bar by hand during cutting and putting the wafers into the wafer rack one by one, the embodiment of the present invention can effectively save manpower.

Description

Technical Field

[0001] The present invention relates to the field of photovoltaic panel production, and in particular to a wafer cutting system. Background Art

[0002] In the process of processing the crystal rod into a chip, it is necessary to first use a steel wire to cut along the radial direction of the crystal rod until the steel wire cuts into the groove position of the graphite bar on the outside of the crystal rod. At this time, since the chip is connected to the graphite bar, in order to remove the chip from the graphite bar, the graphite bar needs to be placed flat on the workbench. Then the staff needs to protect the chip with one hand to prevent the chip cut from the graphite bar from falling over, and place the cut chip on the sponge of the chip rack in turn to prevent the chip from falling over and being damaged. Finally, the chip rack is placed in the kerosene cleaning tank to clean the mud on the chip.

[0003] However, when cutting and removing the wafers from the graphite strip, it is necessary to protect the wafers with hands to prevent the wafers from falling over and being damaged. Therefore, after a wafer is separated from the graphite strip, the cut wafers need to be placed on the wafer rack immediately. This process not only wastes a lot of manpower, but also takes a long time to cut and remove all the wafers. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a wafer cutting system to solve the problem of wasting a lot of manpower in the existing process of cutting a wafer from a graphite bar, where the wafer needs to be protected by hand to prevent the wafer from falling and being damaged, resulting in the need to immediately place the cut wafer on a wafer rack after a wafer is separated from the graphite bar.

[0005] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0006] A wafer cutting system comprises: a workbench, a wire saw mechanism for cutting a graphite strip below a wafer, and a plurality of clamping mechanisms for clamping the wafer;

[0007] The clamping mechanism and the wire saw mechanism are both arranged on the workbench;

[0008] The clamping mechanism includes a power mechanism, a first clamping plate, a second clamping plate, a first guard plate, a second guard plate and a telescopic mechanism;

[0009] The first clamping plate and the second clamping plate are mounted on the power mechanism;

[0010] The power mechanism is used to drive the first clamping plate and the second clamping plate to clamp the wafer radially;

[0011] The first guard plate is provided at the first end of the first clamping plate and is used to fit with the wafer at the first end of the graphite strip;

[0012] The second guard plate is movably provided at the second end of the first clamping plate and is used for laminating with the wafer at the second end of the graphite strip;

[0013] A transverse groove for the second guard plate to pass through is opened along the transverse direction of the first clamping plate;

[0014] The telescopic mechanism is arranged on the outer side of the first clamping plate, and the telescopic mechanism is used to drive the second guard plate to move in the transverse groove.

[0015] Preferably, the wire saw mechanism includes: a first moving mechanism, a first connecting plate, a first column, a second column, a first motor, a first roller, a second roller and a diamond wire;

[0016] The first moving mechanism is movably arranged on the outer side of the second clamping plate;

[0017] The first column is rotatably arranged on the first moving mechanism;

[0018] The first motor is in transmission connection with the first column;

[0019] The first roller is arranged on the first column;

[0020] The first end of the first connecting plate is connected to the first moving mechanism;

[0021] The second column is vertically arranged at the second end of the first connecting plate;

[0022] The second roller is rotatably arranged on the second column;

[0023] The second roller and the first roller are arranged at the same height above the workbench;

[0024] The head and tail of the diamond wire are connected to form a loop, and the diamond wire is wound around the first roller and the second roller.

[0025] Preferably, the first moving mechanism includes: a second motor, a first screw rod, a first slider and a first guide rail;

[0026] The first guide rail is arranged on the workbench, and the first guide rail is parallel to the second clamping plate;

[0027] The second motor is arranged at one end of the first guide rail;

[0028] The first screw rod is in transmission connection with the second motor;

[0029] The first slider is slidably arranged on the first guide rail, and the first slider is provided with a first screw hole matching with the first screw rod.

[0030] Preferably, the first moving mechanism is arranged on the upper end surface of the workbench;

[0031] The first connecting plate includes: a transverse plate and a vertical plate;

[0032] A first moving groove for the second column to pass through and a second moving groove for the vertical plate to pass through are opened along the transverse direction of the workbench;

[0033] The first moving groove is located outside the first clamping plate, and the second moving groove is located outside the second clamping plate;

[0034] The upper end of the vertical plate is fixed to the slider;

[0035] The lower end of the vertical plate is connected to the first end of the cross plate;

[0036] The second vertical column is vertically fixed to the second end of the cross plate.

[0037] Preferably, it further includes: a cleaning pool for cleaning the wafer and a second moving mechanism for moving the clamping mechanism into the cleaning pool;

[0038] Both the cleaning pool and the second moving mechanism are arranged on the workbench.

[0039] Preferably, the second moving mechanism includes: a third motor, a second screw rod, a second slider, a lifting mechanism, a connecting arm and a second guide rail;

[0040] The second guide rail is arranged on one side of the cleaning pool;

[0041] The third motor is arranged at the first end of the guide rail;

[0042] The third motor is in transmission connection with the second screw rod;

[0043] The second slider is slidably arranged on the second guide rail, and the second slider is provided with a second screw hole that cooperates with the second screw rod;

[0044] The lifting mechanism is arranged on the slider and is used to drive the connecting arm to lift;

[0045] The power mechanism is arranged on the connecting arm.

[0046] Preferably, the lifting mechanism includes: a fourth motor, a third screw rod, a third guide rail and a third slider;

[0047] The third guide rail is vertically arranged on one side of the second slider close to the cleaning pool;

[0048] The fourth motor is in transmission connection with the third screw rod;

[0049] The third slider is slidably arranged on the third guide rail;

[0050] The third slider is provided with a third screw hole that cooperates with the third screw rod.

[0051] Preferably, it further includes: a plurality of spray heads for cleaning the wafer.

[0052] Preferably, it further includes: a top cover;

[0053] The top cover is openably and closably arranged on the cleaning pool;

[0054] The spray heads are arranged on the top cover.

[0055] Preferably, the telescopic mechanism is a rodless cylinder, and the second guard plate is fixed to the piston of the rodless cylinder.

[0056] Preferably, a plurality of first spine strips are provided on the inner side of the first clamping plate, and / or a plurality of second spine strips are provided on the inner side of the second clamping plate.

[0057] Preferably, the first guard plate and the second guard plate are arranged in parallel.

[0058] Preferably, both the first clamping plate and the second clamping plate are of a C-shaped structure;

[0059] The opening of the first clamping plate faces the opening of the second clamping plate.

[0060] As can be seen from the above, the present invention discloses a wafer dicing system. The clamping mechanism and the wire saw mechanism are both arranged on the workbench; the first clamping plate and the second clamping plate are installed on the power mechanism; and then the power mechanism can drive the first clamping plate and the second clamping plate to clamp the wafer radially; the first guard plate is arranged at the first end of the first clamping plate and fits with the wafer at the first end of the graphite strip; the second guard plate is movably arranged at the second end of the first clamping plate and fits with the wafer at the second end of the graphite strip; and a transverse groove for the second guard plate to pass through is opened along the transverse direction of the first clamping plate; the telescopic mechanism is arranged outside the first clamping plate, and then the telescopic mechanism drives the second guard plate to move in the transverse groove. Through the wafer dicing system disclosed above, the first clamping plate and the second clamping plate can clamp the wafer radially. Then, after separating a plurality of wafers from the graphite strip by the wire saw mechanism, the wafers will not fall down. By providing the first guard plate and the second guard plate and making the first guard plate and the second guard plate contact the wafers at both ends of the graphite strip respectively, when the first clamping plate and the second clamping plate are separated, the first guard plate and the second guard plate can effectively prevent the wafers from falling down. When it is necessary to take out the wafers, the staff can take out a plurality of wafers to the wafer rack at one time. Compared with the existing method of protecting the wafers on the graphite strip by hand during cutting and putting the wafers into the wafer rack one by one, the embodiment of the present invention can effectively save manpower. Description of the Drawings

[0061] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0062] Figure 1 It is a schematic structural diagram of a wafer dicing system provided by an embodiment of the present invention;

[0063] Figure 2The top view of the wafer dicing system provided by the embodiment of the present invention;

[0064] Figure 3 The side view of the wafer dicing system provided by the embodiment of the present invention;

[0065] Figure 4 The structural schematic diagram of the clamping mechanism provided by the embodiment of the present invention;

[0066] Figure 5 The structural schematic diagram of the first protective plate and the second protective plate provided by the embodiment of the present invention.

[0067] Wherein, the workbench 1, the first moving groove 12, the second moving groove 13; the wire saw mechanism 2, the first moving mechanism 21, the first connecting plate 22, the first upright post 23, the second upright post 24, the first motor 25, the first roller 26, the second roller 27, the diamond wire 28; the clamping mechanism 3, the power mechanism 31, the first clamping plate 32, the first spiny strip 321, the transverse groove 322, the second clamping plate 33, the second spiny strip 331, the first protective plate 34, the second protective plate 35, the telescopic mechanism 4; the cleaning pool 5; the second moving mechanism 6, the third motor 61, the second screw rod 62, the second slider 63, the lifting mechanism 64, the connecting arm 65, the second guide rail 66;

[0068] The first moving mechanism 21: the second motor 211, the first screw rod 212, the first slider 213 and the first guide rail 214;

[0069] The first connecting plate 22: the horizontal plate 221 and the vertical plate 222. Detailed implementation manners

[0070] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0071] In this application, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, the element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.

[0072] The embodiment of the present invention provides a wafer dicing system. Refer to Figures 1 to 5 ,Figure 1 It is a schematic structural diagram of a wafer dicing system. The wafer dicing system includes: a workbench 1, a wire saw mechanism 2 for cutting a graphite bar under the wafer, and a plurality of clamping mechanisms 3 for clamping the wafer;

[0073] Both the clamping mechanism 3 and the wire saw mechanism 2 are arranged on the workbench 1;

[0074] The clamping mechanism 3 includes a power mechanism 31, a first clamping plate 32, a second clamping plate 33, a first protective plate 34, a second protective plate 35, and a telescopic mechanism 4;

[0075] Both the first clamping plate 32 and the second clamping plate 33 are of C-shaped structures;

[0076] The first clamping plate 32 and the second clamping plate 33 are installed on the power mechanism 31, and the opening of the first clamping plate 32 faces the opening of the second clamping plate 33;

[0077] The power mechanism 31 is used to drive the first clamping plate 32 and the second clamping plate 33 to radially clamp the wafer;

[0078] The first protective plate 34 is arranged at the first end of the first clamping plate 32 and is used to fit the wafer at the first end of the graphite bar;

[0079] The second protective plate 35 is movably arranged at the second end of the first clamping plate 32 and is used to fit the wafer at the second end of the graphite bar;

[0080] A transverse groove 322 for the second protective plate 35 to pass through is formed along the transverse direction of the first clamping plate 32;

[0081] The telescopic mechanism 4 is arranged outside the first clamping plate 32, and the telescopic mechanism 4 is used to drive the second protective plate 35 to move in the transverse groove 322.

[0082] It should be noted that the first protective plate 34 is arranged at the first end of the first clamping plate 32 and fits the wafer at the first end of the graphite bar; the second protective plate 35 is movably arranged at the second end of the first clamping plate 32 and fits the wafer at the second end of the graphite bar. Then, after the wafer and the graphite are cut at the groove of the graphite bar by the wire saw mechanism 2, when the first clamping plate 32 and the second clamping plate 33 are separated, the first protective plate 34 and the second protective plate 35 can prevent the wafer between them from falling down.

[0083] And a transverse groove 322 for the second protective plate 35 to pass through is formed along the transverse direction of the first clamping plate 32; the telescopic mechanism 4 is arranged outside the first clamping plate 32, and the telescopic mechanism 4 is used to drive the second protective plate 35 to move in the transverse groove 322. Then, the position of the second protective plate 35 can be adjusted according to the lengths of multiple wafers on the graphite bar, and when the wafer and the graphite are cut by the wire saw mechanism 2 and the first clamping plate 32 and the second clamping plate 33 are separated, the first protective plate 34 and the second protective plate 35 can effectively prevent the wafer between them from falling down.

[0084] It should be noted that when the first protective plate 34 is specifically arranged, the first protective plate 34 can be fixed to the telescopic mechanism 4.

[0085] In the embodiment of the present invention, the clamping mechanism 3 and the wire saw mechanism 2 are both arranged on the workbench 1; the first clamping plate 32 and the second clamping plate 33 are installed on the power mechanism 31; furthermore, the power mechanism 31 can drive the first clamping plate 32 and the second clamping plate 33 to clamp the wafer radially; the first protective plate 34 is arranged at the first end of the first clamping plate 32 and is attached to the wafer at the first end of the graphite strip; the second protective plate 35 is movably arranged at the second end of the first clamping plate 32 and is attached to the wafer at the second end of the graphite strip; and a transverse groove 322 for the second protective plate 35 to pass through is opened along the transverse direction of the first clamping plate 32; the telescopic mechanism 4 is arranged outside the first clamping plate 32, and furthermore, the telescopic mechanism 4 drives the second protective plate 35 to move in the transverse groove 322. Through the wafer cutting system disclosed above, the power mechanism 31 drives the first clamping plate 32 and the second clamping plate 33 to be able to clamp the wafer radially. Furthermore, after the wire saw mechanism 2 separates multiple wafers from the graphite strip, the wafers will not fall down. By arranging the first protective plate 34 and the second protective plate 35, and making the first protective plate 34 and the second protective plate 35 contact the wafers at both ends of the graphite strip respectively, furthermore, when the first clamping plate 32 and the second clamping plate 33 are separated, the first protective plate 34 and the second protective plate 35 can effectively prevent the wafers from falling down. And when it is necessary to remove the wafers, the staff can take out multiple wafers to the wafer rack at one time. Compared with the existing method of protecting the wafers on the graphite strip by hand during cutting and putting the wafers into the wafer rack one by one, the embodiment of the present invention can effectively save manpower.

[0086] Specifically, the wire saw mechanism 2 includes: a first moving mechanism 21, a first connecting plate 22, a first column 23, a second column 24, a first motor 25, a first roller 26, a second roller 27, and a diamond wire 28;

[0087] The first moving mechanism 21 is movably arranged outside the second clamping plate 33;

[0088] The first column 23 is rotatably arranged on the first moving mechanism 21;

[0089] The first motor 25 is in transmission connection with the first column 23;

[0090] The first roller 26 is arranged on the first column 23;

[0091] The first end of the first connecting plate 22 is connected to the first moving mechanism 21;

[0092] The second column 24 is vertically arranged at the second end of the first connecting plate 22;

[0093] The second roller 27 is rotatably arranged on the second column 24;

[0094] The second roller 27 and the first roller 26 are arranged at the same height above the workbench 1;

[0095] The ends of the diamond wire 28 are connected to form a ring, and the diamond wire 28 is wound around the first roller 26 and the second roller 27 .

[0096] It should be noted that the first moving mechanism 21 is movably arranged on the outside of the second clamping plate 33, and the first column 23 is rotatably arranged on the first moving mechanism 21, and the first motor 25 is transmission-connected to the first column 23; the first roller 26 is arranged on the first column 23; the first end of the first connecting plate 22 is connected to the first moving mechanism 21; the second column 24 is vertically arranged at the second end of the first connecting plate 22; the second roller 27 is rotatably arranged on the second column 24; the second roller 27 and the first roller 26 are arranged at the same height above the workbench 1; the ends of the diamond wire 28 are connected to form a ring, and the diamond wire 28 is wound around the first column 23. A roller 26 and a second roller 27, and then under the action of the first motor 25, can drive the first column 23 to rotate, and then drive the first roller 26 installed on the first column 23 to rotate. However, since the diamond wire 28 is a ring structure with the ends connected, and the diamond wire 28 is wound around the first roller 26 and the second roller 27, and the second roller 27 is rotatably arranged on the second column 24, therefore, when the first roller 26 rotates, it can drive the diamond wire 28 to rotate, and then when the first moving mechanism 21 drives the diamond wire 28 to move toward the graphite strip, the diamond wire 28 can cut at the groove of the graphite strip to separate the graphite strip from the wafer.

[0097] It should also be noted that arranging the second roller 27 and the first roller 26 at the same height above the workbench 1 can enable the wire saw to cut the graphite strip groove horizontally and ensure that the diamond wire 28 can be always wound around the first roller 26 and the second roller 27 during the rotation process.

[0098] Furthermore, the first moving mechanism 21 includes: a second motor 211, a first screw 212, a first slider 213 and a first guide rail 214;

[0099] The first guide rail 214 is disposed on the workbench 1 , and the first guide rail 214 is parallel to the second clamping plate 33 ;

[0100] The second motor 211 is disposed at one end of the first guide rail 214;

[0101] The first screw 212 is transmission-connected to the second motor 211;

[0102] The first sliding block 213 is slidably disposed on the first guide rail 214 , and the first sliding block 213 defines a first screw hole that cooperates with the first screw rod 212 .

[0103] It should be noted that the first guide rail 214 is arranged on the workbench 1, and the first guide rail 214 is parallel to the second clamping plate 33; the second motor 211 is arranged at one end of the first guide rail 214; the first screw rod 212 is in transmission connection with the second motor 211; the first slider 213 is slidably arranged on the first guide rail 214, and the first slider 213 is provided with a first threaded hole matching with the first screw rod 212. Thus, under the action of the second motor 211, the first screw rod 212 can be driven to rotate, and the first slider 213 matching with the first screw rod 212 can be moved along the first guide rail 214.

[0104] Specifically, the first moving mechanism 21 is arranged on the upper end surface of the workbench 1;

[0105] The first connecting plate 22 includes: a cross plate 221 and a vertical plate 222;

[0106] A first moving groove 12 for the second column 24 to pass through and a second moving groove 13 for the vertical plate 222 to pass through are formed along the transverse direction of the workbench 1;

[0107] The first moving groove 12 is located outside the first clamping plate 32, and the second moving groove 13 is located outside the second clamping plate 33;

[0108] The upper end of the vertical plate 222 is fixed to the slider;

[0109] The lower end of the vertical plate 222 is connected to the first end of the cross plate 221;

[0110] The second column 24 is vertically fixed to the second end of the cross plate 221.

[0111] It should be noted that the cross plate 221 can be arranged below the workbench 1 or above the workbench 1. When the cross plate 221 is arranged above the workbench 1, the first moving groove 12 for the second column 24 to pass through and the second moving groove 13 for the vertical plate 222 to pass through do not need to be formed on the workbench 1. In the embodiment of the present invention, it is preferably to arrange the cross plate 221 below the workbench 1, and form the first moving groove 12 for the second column 24 to pass through and the second moving groove 13 for the vertical plate 222 to pass through on the workbench 1.

[0112] Furthermore, the wafer dicing system further includes: a cleaning pool 5 for cleaning the wafer and a second moving mechanism 6 for moving the clamping mechanism 3 into the cleaning pool 5;

[0113] Both the cleaning pool 5 and the second moving mechanism 6 are arranged on the workbench 1.

[0114] It should be noted that by providing a cleaning tank 5 for wafer cleaning and a second moving mechanism 6 for moving the clamping mechanism 3 to the cleaning tank 5 on the workbench 1, after the wafer sawing mechanism 2 cuts the wafer from the graphite bar, the second moving mechanism 6 can move the clamping mechanism 3 to the cleaning tank 5, and the wafer on the clamping mechanism 3 can be cleaned in the cleaning tank 5. Compared with the prior art of sequentially placing multiple cut wafers into a wafer rack and then into the cleaning tank 5 for cleaning, the embodiment of the present application can effectively improve the processing efficiency of the wafers.

[0115] Specifically, the second moving mechanism 6 includes: a third motor 61, a second screw 62, a second slider 63, a lifting mechanism 64, a connecting arm 65, and a second guide rail 66;

[0116] The second guide rail 66 is provided on one side of the cleaning tank 5;

[0117] The third motor 61 is provided at the first end of the guide rail;

[0118] The third motor 61 is in transmission connection with the second screw 62;

[0119] The second slider 63 is slidably provided on the second guide rail 66, and the second slider 63 is provided with a second screw hole that mates with the second screw 62;

[0120] The lifting mechanism 64 is provided on the slider and is used to drive the connecting arm 65 to lift;

[0121] The power mechanism 31 is provided on the connecting arm 65.

[0122] It should be noted that the second guide rail 66 is set on one side of the cleaning tank 5; and the third motor 61 is set at the first end of the guide rail; the third motor 61 is connected to the second screw 62 in a transmission manner; the second slider 63 is slidably set on the second guide rail 66, and the second slider 63 is provided with a second screw hole that cooperates with the second screw 62; the lifting mechanism 64 is set on the slider to drive the connecting arm 65 to rise and fall; and the power mechanism 31 is set on the connecting arm 65. When the wafers and the graphite bars on the clamping mechanism 3 are cut by the wire saw mechanism 2, the second screw 62 can be rotated under the action of the third motor 61, and the rotation of the second screw 62 can enable the second slider 63 that cooperates with the second screw 62 to move along the second guide rail 66 moves. Since the lifting mechanism 64 is arranged on the second slider 63, and the lifting mechanism 64 can drive the connecting arm 65 to move up and down, and the power mechanism 31 is also arranged on the connecting arm 65, when the second slider 63 moves, it can drive the power mechanism 31 to move along the second guide rail 66 until the entire clamping mechanism 3 is located above the cleaning tank 5. The lifting mechanism 64 can be used to drive the clamping mechanism 3 to move downward into the cleaning tank 5 for cleaning. When the chip is cleaned, the lifting mechanism 64 can be used to drive the clamping mechanism 3 to move upward to the top of the platform, and then the third motor 61 can be used to drive the second screw 62 to reverse, so that the second slider 63 drives the clamping mechanism 3 to move to the chip cutting position through the connecting arm 65.

[0123] Specifically, the lifting mechanism 64 includes: a fourth motor, a third screw, a third guide rail and a third slider;

[0124] The third guide rail is vertically arranged on one side of the second slider 63 close to the cleaning tank 5;

[0125] The fourth motor is drivingly connected to the third screw;

[0126] The third slider is slidably arranged on the third guide rail;

[0127] The third sliding block is provided with a third screw hole matched with the third screw rod.

[0128] It should be noted that the lifting mechanism 64 can be a mechanism composed of the above-mentioned components, or it can be a hydraulic cylinder, and those skilled in the art can choose according to needs.

[0129] Preferably, the first motor 25 , the second motor 211 , the third motor 61 and the fourth motor are all servo motors.

[0130] Furthermore, the wafer cutting system further includes: a plurality of shower heads for cleaning the wafers.

[0131] It should be noted that by providing a plurality of shower heads, the shower heads can be used to spray the wafers during wafer cleaning, thereby flushing the slurry on the wafers and improving the cleaning efficiency of the wafers.

[0132] Furthermore, the wafer dicing system further includes: a top cover;

[0133] The top cover is disposed on the cleaning tank 5 in an openable and closable manner;

[0134] The spray head is disposed on the top cover.

[0135] It should be noted that since kerosene is usually used for wafer cleaning and kerosene has a pungent smell, therefore, by providing an openable and closable top cover above the cleaning and disposing the spray head on the top cover, when cleaning the wafer, the top cover can be closed, and then kerosene is sprayed on the wafer through the spray head to avoid a large amount of kerosene smell overflowing and affecting the environment.

[0136] Specifically, the telescopic mechanism 4 is a rodless cylinder, and the second guard plate 35 is fixed to the piston of the rodless cylinder.

[0137] It should be noted that the telescopic mechanism 4 can be a rodless cylinder or an ordinary cylinder, and those skilled in the art can select according to requirements. However, in the embodiments of the present invention, it is preferred that the telescopic mechanism 4 is a rodless cylinder.

[0138] Furthermore, a plurality of first spiny ridges 321 are provided on the inner side of the first clamping plate 32, and / or a plurality of second spiny ridges 331 are provided on the inner side of the second clamping plate 33.

[0139] It should be noted that by providing a plurality of first spiny ridges 321 on the inner side of the first clamping plate 32 and a plurality of second spiny ridges 331 on the inner side of the second clamping plate 33, it is possible to avoid direct contact between the first clamping plate 32 and the second clamping plate 33 and the wafer, and the wafer can be firmly clamped, reducing the possibility of wafer damage and improving the yield of the wafer.

[0140] Preferably, the first spiny ridge 321 and / or the second spiny ridge 331 are made of polyurethane material.

[0141] It should be noted that polyurethane, whose full name is polyisocyanate, is a polymer compound with good wear resistance and certain resilience and mechanical properties. Therefore, making the first spiny ridge 321 of polyurethane material can effectively prevent the wafer from being damaged by hard contact with the first clamping plate, and making the second spiny ridge 331 of polyurethane material can effectively prevent the wafer from being damaged by hard contact with the second clamping plate.

[0142] It should also be noted that the first spiny ridge 321 can be made of polyurethane material or other wear-resistant materials, and those skilled in the art can replace it according to requirements.

[0143] The second spinous process strip 331 can be made of polyurethane material or other wear-resistant materials, and those skilled in the art can replace it according to requirements.

[0144] Furthermore, the first guard plate 34 and the second guard plate 35 are arranged in parallel.

[0145] It should be noted that by arranging the first guard plate 34 and the second guard plate 35 in parallel, after the first clamping plate 32 and the second clamping plate 33 are separated, the wafer can lean against the first guard plate 34 or the second guard plate 35, thus avoiding the wafer from toppling.

[0146] Specifically, both the first clamping plate 32 and the second clamping plate 33 are of C-shaped structure;

[0147] The opening of the first clamping plate 32 faces the opening of the second clamping plate 33.

[0148] It should be noted that by setting the first clamping plate 32 and the second clamping plate 33 into a C-shaped structure and making the opening of the first clamping plate 32 face the opening of the second clamping plate 33, when the power mechanism 31 drives the first clamping plate 32 and the second clamping plate 33 to clamp the wafer radially, the contact area between the first clamping plate 32 and the second clamping plate 33 and the wafer can be increased when they contact the wafer on the inner sides of the first clamping plate 32 and the second clamping plate 33, so that the wafer is not easily damaged when being clamped.

[0149] Preferably, the first guard plate 34 and / or the second guard plate 35 is made of polyurethane.

[0150] It should be noted that the first guard plate 34 can be made of polyurethane or other materials, and those skilled in the art can choose according to requirements.

[0151] The second guard plate 35 can be made of polyurethane or other materials, and those skilled in the art can choose according to requirements.

[0152] Each embodiment in this specification is described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for a system or system embodiment, since it is basically similar to a method embodiment, it is described relatively simply. For the relevant parts, reference can be made to the partial description of the method embodiment. The systems and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. A person of ordinary skill in the art can understand and implement it without creative work.

[0153] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

[0154] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer dicing system, characterized in that, Including: A workbench, a wire saw mechanism for cutting a graphite bar under a wafer, a cleaning tank for cleaning the wafer, a plurality of spray heads for cleaning the wafer, a plurality of clamping mechanisms for clamping the wafer, and a second moving mechanism for moving the clamping mechanism into the cleaning tank; The cleaning tank, the second moving mechanism, the clamping mechanism, and the wire saw mechanism are all arranged on the workbench; The clamping mechanism includes a power mechanism, a first clamping plate, a second clamping plate, a first protection plate, a second protection plate, and a telescopic mechanism; The first clamping plate and the second clamping plate are installed on the power mechanism; The power mechanism is used to drive the first clamping plate and the second clamping plate to radially clamp the wafer; The first protection plate is arranged at the first end of the first clamping plate and is used to fit the wafer at the first end of the graphite bar; The second protection plate is movably arranged at the second end of the first clamping plate and is used to fit the wafer at the second end of the graphite bar; A transverse groove for the second protection plate to pass through is formed in the transverse direction of the first clamping plate; The telescopic mechanism is arranged outside the first clamping plate, and the telescopic mechanism is used to drive the second protection plate to move in the transverse groove.

2. The wafer dicing system according to claim 1, wherein The wire saw mechanism includes: a first moving mechanism, a first connecting plate, a first column, a second column, a first motor, a first roller, a second roller, and a diamond wire; The first moving mechanism is movably arranged outside the second clamping plate; The first column is rotatably arranged on the first moving mechanism; The first motor is in transmission connection with the first column; The first roller is arranged on the first column; The first end of the first connecting plate is connected to the first moving mechanism; The second column is vertically arranged at the second end of the first connecting plate; The second roller is rotatably arranged on the second column; The second roller and the first roller are arranged at the same height above the workbench; The head and tail of the diamond wire are connected to form a loop, and the diamond wire is wound around the first roller and the second roller.

3. The wafer dicing system according to claim 2, wherein, The first moving mechanism includes: a second motor, a first screw, a first slider, and a first guide rail; The first guide rail is arranged on the workbench, and the first guide rail is parallel to the second clamping plate; The second motor is arranged at one end of the first guide rail; The first screw is in transmission connection with the second motor; The first slider is slidably arranged on the first guide rail, and a first screw hole matched with the first screw is formed in the first slider.

4. The wafer dicing system according to claim 3, wherein, The first moving mechanism is arranged on the upper end surface of the workbench; The first connecting plate includes: a transverse plate and a vertical plate; A first moving groove for the second column to pass through and a second moving groove for the vertical plate to pass through are formed in the transverse direction of the workbench; The first moving groove is located outside the first clamping plate, and the second moving groove is located outside the second clamping plate; The upper end of the vertical plate is fixed to the slider; The lower end of the vertical plate is connected to the first end of the transverse plate; The second column is vertically fixed to the second end of the transverse plate.

5. The wafer dicing system according to claim 1, characterized in that, The second moving mechanism includes: a third motor, a second screw, a second slider, a lifting mechanism, a connecting arm, and a second guide rail; The second guide rail is arranged on one side of the cleaning tank; The third motor is arranged at the first end of the guide rail; The third motor is in transmission connection with the second screw rod; The second slider is slidably arranged on the second guide rail, and the second slider is provided with a second screw hole matching with the second screw rod; The lifting mechanism is arranged on the slider and is used for driving the connecting arm to lift; The power mechanism is arranged on the connecting arm.

6. The wafer dicing system according to claim 5, wherein The lifting mechanism includes: a fourth motor, a third screw rod, a third guide rail and a third slider; The third guide rail is vertically arranged on one side of the second slider close to the cleaning tank; The fourth motor is in transmission connection with the third screw rod; The third slider is slidably arranged on the third guide rail; The third slider is provided with a third screw hole matching with the third screw rod.

7. The wafer dicing system according to claim 1, characterized in that, It further includes: A top cover; The top cover is arranged on the cleaning tank in an openable and closable manner; The spray head is arranged on the top cover.

8. The wafer dicing system according to claim 1, wherein The telescopic mechanism is a rodless cylinder, and the second guard plate is fixed to the piston of the rodless cylinder.

9. The wafer dicing system according to claim 1, wherein A plurality of first spiny strips are arranged on the inner side of the first clamping plate, and / or a plurality of second spiny strips are arranged on the inner side of the second clamping plate.

10. The wafer dicing system according to claim 1, wherein, The first guard plate is arranged parallel to the second guard plate.

11. The wafer dicing system according to claim 1, wherein Both the first clamping plate and the second clamping plate are of a C-shaped structure; The opening of the first clamping plate faces the opening of the second clamping plate.

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