A molding die and processing technology for a CT slip ring tray

Abstract

The present disclosure relates to a forming mold and a processing technology for a CT slip ring tray. The forming mold includes: a bottom mold, which is in the shape of a circular disc, and its upper surface has several circles of embedding grooves adapted to the copper ring for embedding the copper ring, and the several circles of embedding grooves are arranged in sequence from the inside to the outside around the axis of the bottom mold; an inner mold, which is arranged around the inner edge of the bottom mold; an outer mold, which is arranged around the outer edge of the bottom mold, and the side surfaces of the outer mold and the inner mold cooperate with the upper surface of the bottom mold to form a glue injection molding area; several flattening assemblies, which are arranged above the glue injection molding area, and each group of flattening assemblies has several flattening parts corresponding to the embedding grooves one by one, and the flattening parts can slide in a direction perpendicular to the upper surface of the bottom mold for flattening the copper ring. The processing technology is to obtain the finished CT slip ring tray by glue injection molding using the above-mentioned forming mold. The present disclosure has the advantages of being easy to process, low processing cost, and significantly improved processing efficiency and finished product rate.

Description

Technical Field

[0001] The present disclosure relates to the technical field of slip ring tray processing, and particularly relates to a forming mold and processing technology for a CT slip ring tray. Background Art

[0002] A CT slip ring tray is a type of electrical rotary connector that can achieve rotational transmission of signals and is widely used in medical CT and other devices.

[0003] Due to the need to meet its electrical performance requirements, when a voltage of 500DV is applied, the corresponding insulation resistance of the CT slip ring tray should be greater than 9999Ω. Its materials are limited to non-metallic materials or some special non-metallic composite materials. The outer diameter of the CT slip ring tray ranges from 1200mm to 2000mm, and the thickness generally does not exceed 30mm. Multiple copper rings need to be embedded inside the CT slip ring tray, and the multiple copper rings need to be coaxially arranged with the tray. The CT slip ring tray product has high requirements for parameters such as the roundness of the copper rings, the coaxiality and parallelism of each copper ring.

[0004] When the existing CT slip ring trays are processed, a lathe is generally used to turn a copper plate into an annular structure. In addition, several annular grooves for embedding copper rings are turned out at the bottom of the tray, and then the copper rings are embedded into the annular grooves. This processing method has the following defects in actual application:

[0005] The copper rings are processed from copper plates by a lathe. The material cost of the copper plates is high, and due to the generally large size of the copper rings, the requirements for lathe equipment are very high. On the other hand, since the tray uses non-metallic materials and has a large size, there are few equipment that can meet the turning processing of the tray, and the coaxiality and parallelism of the multiple turned annular grooves are very poor in accuracy. Commonly processed copper rings cannot be embedded into the annular grooves, and the product rejection rate reaches more than 50%. This makes the existing CT slip ring tray processing process have the defects of large processing difficulty, high processing cost, low processing efficiency and low yield. Summary of the Invention

[0006] In order to solve the problems existing in the above-mentioned prior art, the purpose of the present disclosure is to provide a forming mold and processing technology for a CT slip ring tray. The present disclosure has the advantages of being easy to process, low processing cost, and significantly improved processing efficiency and yield.

[0007] A forming mold for a CT slip ring tray described in the present disclosure includes:

[0008] A bottom mold, which is in the shape of a circular ring sheet, and its upper surface has several circles of embedding grooves adapted to the copper rings for embedding the copper rings. The several circles of the embedding grooves are arranged in sequence from the inside to the outside around the axis of the bottom mold;

[0009] An inner mold, which is arranged around the inner edge of the bottom mold;

[0010] An outer mold, which is arranged around the outer edge of the bottom mold. The side surfaces of the outer mold and the inner mold cooperate with the upper surface of the bottom mold to form a glue injection molding area;

[0011] A plurality of flattening assemblies, which are arranged above the glue injection molding area. Each group of the flattening assemblies has a plurality of flattening parts corresponding to the embedding grooves one by one. The flattening parts can slide in a direction perpendicular to the upper surface of the bottom mold for flattening the copper rings.

[0012] Preferably, the flattening assembly further includes a mounting plate. The mounting plate is arranged obliquely to the radial direction of the bottom mold above the glue injection molding area. One end of the mounting plate is detachably connected to the upper edge of the inner mold, and the other end is detachably connected to the upper edge of the outer mold. The mounting plate is formed with a plurality of sliding holes corresponding to the embedding grooves one by one. The sliding holes extend in a direction perpendicular to the upper surface of the bottom mold, and the flattening parts are inserted through the sliding holes.

[0013] Preferably, the sliding holes have internal threads, and the outer side surfaces of the flattening parts have matching external threads. The flattening parts are in threaded cooperation with the sliding holes.

[0014] Preferably, the number of the flattening assemblies is 10 groups. The 10 groups of the flattening assemblies are arranged coplanarly and are equally angularly spaced around the axis position of the bottom mold.

[0015] Preferably, a first sealing ring is filled at the connection position between the bottom mold and the inner mold; a second sealing ring is filled at the connection position between the bottom mold and the outer mold.

[0016] A processing technology of a CT slip ring tray according to the present disclosure includes the following steps:

[0017] Manufacturing copper rings: Taking a plurality of copper strips with required specifications and dimensions, rolling them into circles and connecting the heads and tails to obtain a plurality of copper rings;

[0018] Wire soldering operation: Taking wires and welding them to each of the copper rings for wire soldering operation;

[0019] Spraying release agent: Taking the above-mentioned molding die and spraying a release agent on the inner surface of the glue injection molding area;

[0020] Loading copper rings: Embedding the obtained copper rings into the embedding grooves of the molding die one by one, and flattening each of the copper rings through the flattening assemblies to make the upper surfaces of the copper rings flush;

[0021] Glue injection: Injecting liquid glue into the glue injection molding area until the glue injection molding area is filled;

[0022] Forming and demolding: Let it stand still to cure the liquid glue into a formed shape, and then perform demolding treatment to obtain the finished CT slip ring tray.

[0023] Preferably, the step of manufacturing the copper ring further includes:

[0024] On one end face of the obtained copper ring, several reinforcing holes with internal threads are opened. The depth of the reinforcing holes is 1 / 3 to 1 / 2 of the thickness of the copper ring, and reinforcing bolts are installed in the reinforcing holes.

[0025] Preferably, the step of spraying the mold release agent is specifically:

[0026] Take the forming mold described in any one of claims 1-5, clean the inner surface of the injection molding area, fix the forming mold, and adjust the forming mold so that the upper surface of the bottom mold is in a horizontal state;

[0027] Spray the mold release agent on the inner surface of the injection molding area, and repeat spraying at least 3 times until the inner surface of the injection molding area is evenly covered with the mold release agent.

[0028] Preferably, the step of loading the copper ring is specifically:

[0029] Embed the obtained copper rings one by one into the embedding grooves of the forming mold, install the flattening assembly above the copper rings, and make the flattening parts of each flattening assembly slide downward to flatten the copper rings, so that the upper surfaces of the copper rings are flush through the flattening parts.

[0030] Preferably, in the injection step, the liquid glue is AB glue, which is prepared by the following steps:

[0031] Pour a certain amount of A glue and B glue in proportion and mix them evenly, and then perform vacuum bubble extraction treatment to remove the bubbles in the liquid glue;

[0032] And in the injection step, the liquid glue is injected into the forming mold in two equal amounts;

[0033] The forming and demolding step is specifically:

[0034] Let it stand still for at least 16 hours to cure the liquid glue into a formed shape, and then remove the inner mold, outer mold and bottom mold in sequence to separate the forming mold from the finished CT slip ring tray.

[0035] For the forming mold and processing technology of a CT slip ring tray described in the present disclosure, the advantages are that the present disclosure sets a forming mold with a bottom mold, an inner mold, an outer mold and a flattening assembly. During processing, a copper bar is rolled into a copper ring by a rolling machine, and the copper ring is embedded into the embedding groove of the bottom mold, and then fixed by flattening through the flattening assembly, and a liquid glue is injected into the injection molding area to cure and form to obtain the finished CT slip ring tray.

[0036] The copper ring of the present disclosure is formed by coiling a copper strip, which has low material cost, can meet the processing requirements of various outer diameter copper rings, is especially suitable for the processing of large-size copper rings, and has high processing accuracy and high processing efficiency.

[0037] By means of injection molding with a mold, on the premise of ensuring the accuracy of the mold, in cooperation with the high-precision copper ring obtained by coiling, the matching rate of the copper ring and the embedding groove of the mold is high, which can improve the yield rate in the processing process; and there is no need to carry out complex turning operations, greatly reducing the processing difficulty and processing cost. At the same time, the injection molding method is convenient to operate and can significantly improve the processing efficiency.

[0038] By arranging a flattening assembly above the injection molding area, after loading the copper ring, the copper ring can be flattened by the flattening piece, so that the upper surfaces of the copper rings are flush, thereby ensuring the parallelism of the copper rings, and enabling the formed CT slip ring tray product to meet the requirements regarding the parallelism of the copper rings, which is beneficial to improving the yield rate and product quality. Description of the Drawings

[0039] Figure 1 is a schematic structural diagram of a molding die for a CT slip ring tray described in the present disclosure;

[0040] Figure 2 is Figure 1 a schematic structural diagram of the position A in

[0041] Figure 3 is a top view of a molding die for a CT slip ring tray described in the present disclosure;

[0042] Figure 4 is a partial sectional view of a molding die for a CT slip ring tray described in the present disclosure;

[0043] Figure 5 is a schematic structural diagram of a molding die for a CT slip ring tray described in the present disclosure after embedding a copper ring;

[0044] Figure 6 is a process flow chart of a processing technology for a CT slip ring tray described in the present disclosure.

[0045] Description of the reference numerals: 1 - bottom die, 11 - embedding groove, 2 - inner die, 3 - outer die, 4 - flattening assembly, 41 - flattening piece, 5 - copper ring, 51 - reinforcement hole, a - injection molding area. Detailed Embodiments

[0046] As Figures 1-5 shown, a molding die for a CT slip ring tray described in the present disclosure includes:

[0047] The bottom mold 1 is in the shape of a circular ring plate, and its size is usually designed according to the size of the slip ring tray product to be processed. On the upper surface of the bottom mold 1, there are several circles of embedding grooves 11 adapted to the copper rings 5 for embedding the copper rings 5. The several circles of embedding grooves 11 are arranged in sequence from the inside to the outside around the axis of the bottom mold 1. The cross-section of the embedding groove 11 is rectangular, and its width is slightly larger than the width of the copper ring 5 to facilitate the embedding of the copper ring 5. Corresponding to the structure of 7 common copper rings 5 of the CT slip ring tray, 7 channels of embedding grooves 11 are correspondingly arranged, and they are arranged in circles from the inside to the outside while maintaining a coaxial structure. In a specific embodiment, the bottom mold 1 can be made of an alloy material, and the embedding grooves 11 are formed by turning. It can also be formed by injection molding with a high-temperature resistant plastic material to ensure that the multiple embedding grooves 11 formed have precise coaxiality.

[0048] The inner mold 2 is arranged around the inner edge of the bottom mold 1 and has a certain height to surround the bottom mold 1 from the inner edge of the bottom mold 1.

[0049] The outer mold 3 is arranged around the outer edge of the bottom mold 1, and its height is flush with that of the inner mold 2 to surround the bottom mold 1 from the outer edge of the bottom mold 1. Moreover, the inner side surface of the outer mold 3, the outer side surface of the inner mold 2, and the upper surface of the bottom mold 1 cooperate to form a glue injection molding area a that can accommodate liquid glue. The liquid glue is accommodated in the glue injection molding area a so that after curing and molding, it forms a gelatinous insulating part that wraps around the outside of the copper ring 5.

[0050] Several groups of flattening assemblies 4 are straddled above the glue injection molding area a, and each group of flattening assemblies 4 has several flattening members 41. The number of flattening members 41 matches the number of embedding grooves 11 and is arranged in one-to-one correspondence. The flattening members 41 can slide in a direction perpendicular to the upper surface of the bottom mold 1, so that when sliding downward until the lower end of the flattening member 41 contacts the copper ring 5, the copper ring 5 can be pressed down to flatten the copper ring 5 to a state where the upper surfaces of all the copper rings 5 are flush, meeting the requirement of parallelism for each copper ring 5.

[0051] Further, in this embodiment, the flattening assembly 4 specifically includes a mounting plate. The mounting plate is a rectangular plate that straddles the upper part of the injection molding area a. The mounting plate is inclined in the radial direction of the bottom mold 1 to facilitate the avoidance of interference between adjacent flattening members 41. One end of the mounting plate is detachably connected to the upper edge of the inner mold 2, and the other end is detachably connected to the upper edge of the outer mold 3. Specifically, two waist-shaped holes are machined at both ends of the mounting plate, and mating connection holes are formed at the upper edges of the inner mold 2 and the outer mold 3. After the waist-shaped holes at both ends of the mounting plate are aligned with the two connection holes, they are bolted together to detachably mount the mounting plate above the injection molding area a for easy disassembly and assembly. A number of sliding holes are formed in the mounting holes. The number of sliding holes matches the number of embedding grooves 11 and is arranged in one-to-one correspondence with the embedding grooves 11. The sliding holes extend in a direction perpendicular to the upper surface of the bottom mold 1, and the flattening members 41 are inserted through the sliding holes, enabling the flattening members 41 to slide up and down within the sliding holes.

[0052] More specifically, internal threads are tapped in the sliding holes, and the outer side surface of the flattening member 41 has mating external threads. The flattening member 41 is in threaded engagement with the sliding hole. In the way of threaded engagement between the flattening member 41 and the sliding hole, the flattening member 41 can be rotated to move the flattening member 41 up and down finely, and a relatively large locking force can be applied to flatten the copper ring 5, ensuring that the copper ring 5 fits tightly with the embedding groove 11 and is firmly embedded.

[0053] Furthermore, the number of the flattening assemblies 4 is 10 groups. The 10 groups of flattening assemblies 4 are arranged coplanarly and are equally angularly spaced around the axis position of the bottom mold 1. Specifically, the mounting plates of each group of flattening assemblies 4 are located in the same plane, and the thread sections of each flattening member 41 have the same position and length. The thread section is designed such that when the thread section rotates to the uppermost end and mates with the sliding hole, the lower end of the flattening member 41 presses the copper ring 5 flat and firmly embeds it into the embedding groove 11. Through the cooperation of the multiple sliding holes of a single group of flattening assemblies 4 and multiple groups of flattening members 41, the same approximate position of multiple copper rings 5 can be pressed downward. Through the 10 groups of equally spaced flattening assemblies 4, the positions of each part of the copper ring 5 can be pressed downward, and then each part of multiple copper rings 5 can be pressed flat to the embedded state, ensuring that multiple copper rings 5 can be firmly embedded into the embedding grooves 11 and maintaining a flat upper surface state, meeting the requirements for parallelism between multiple copper rings 5.

[0054] Further, in this embodiment, a first sealing ring is filled at the connection position between the bottom mold 1 and the inner mold 2, and a second sealing ring is filled at the connection position between the bottom mold 1 and the outer mold 3. Specifically, the bottom mold 1 is provided with annular channels below both the inner mold 2 and the outer mold 3, and the first sealing ring and the second sealing ring are respectively filled in the two annular channels. Both the first sealing ring and the second sealing ring are rubber sealing rings, which can improve the sealing performance of the connection position of the molding die and avoid the risk of liquid glue leakage.

[0055] As Figure 6 shown, this embodiment also provides a processing technology for a CT slip ring tray, including the following steps:

[0056] Manufacturing copper rings 5: Take several copper bars of required specifications and dimensions, roll them into circles and connect the head and tail to obtain several copper rings 5. Specifically, determine the actual width of the raw copper bars, and then roll the copper bars of two specifications and dimensions respectively. Exemplarily, for a single CT slip ring tray product, 4 copper bars with a cross-sectional size of 8mm * 8mm and 3 copper bars with a cross-sectional size of 8mm * 12mm are required. Use a rolling machine to roll the copper bars into circles to form copper rings 5 with the required outer diameter, and weld the head and tail positions to fix the shape of the copper rings 5. In a specific embodiment, calculate the circumference of the copper ring 5 according to the required outer diameter of the copper ring 5, intercept copper bars of corresponding length for rolling to obtain copper rings 5 with corresponding outer diameter. Under the condition of ensuring the roundness of the rolled circle, the outer diameter of the copper ring 5 formed by rolling the copper bars of corresponding length will necessarily be close to the required outer diameter. This method significantly reduces the processing difficulty, improves the processing efficiency and processing accuracy compared with the traditional copper plate turning processing method, and enables the size of the copper rings 5 formed by rolling to meet the processing size requirements.

[0057] After rolling and welding to form the copper rings 5, a number of reinforcing holes 51 with internal threads are opened on one end face of the copper rings 5. The depth of the reinforcing holes 51 is 1 / 3 - 1 / 2 of the thickness of the copper rings 5. Reinforcing bolts are installed in the reinforcing holes 51. Specifically, divide 12 regions at equal angular intervals with the axis position of the copper ring 5 as the center, and the radian of each region is 30°. Mark the lines at the boundary of each region, drill holes at the midline position of each region, and the drilling depth is 1 / 3 of the thickness of the copper ring 5, and then tap the thread. Finally, install the matching round head socket head cap screws into each reinforcing hole 51. The structure of the reinforcing holes 51 and the reinforcing bolts can make the liquid glue seep into the reinforcing holes 51 and between the surface of the copper ring 5 and the head of the reinforcing bolt when forming the gel insulation part during subsequent injection of the liquid glue, which can increase the bonding area between the copper ring 5 and the gel insulation part. At the same time, the gel insulation part can be "hooked" by the head of the reinforcing bolt, which can effectively enhance the connection stability between the copper ring 5 and the gel insulation part, reduce the risk of the copper ring 5 falling off, and is beneficial to improving the overall structural stability of the product.

[0058] Wire soldering operation: Take wires and conduct wire soldering with each copper ring 5 to achieve electrical connection. Take wires of corresponding specifications according to the processing requirements, and weld the conductor part at the head of the wire to the copper ring 5, so that the copper ring 5 can conduct electricity through the wire.

[0059] Spraying release agent: Take the above-mentioned molding die, first clean the inner surface of the injection molding area a with wiping water to ensure that there are no sundries on the inner surface, and then place the bottom die 1 horizontally and adjust the molding die so that the upper surface of the bottom die 1 is in a horizontal state.

[0060] Spray a silicone-based mold release agent on the inner surface of the glue injection molding area a. Generally, spray at least 3 times repeatedly to ensure that the inner surface of the glue injection molding area a is evenly covered with the mold release agent, so as to ensure the smooth progress of the subsequent demolding process.

[0061] Install the copper ring 5: First, remove each flattening component 4, align the copper ring 5 and embed it into the corresponding embedding groove 11. After all the copper rings 5 are embedded, take the flattening component 4, align the waist-shaped holes at both ends of the flattening component 4 with the connection holes of the inner mold 2 and the outer mold 3 respectively, and install and fix them with bolts. Repeat this process until all 10 groups of flattening components 4 are installed in the corresponding positions, and then start to rotate each flattening part 41 of each flattening component 4 one by one. Through the threaded engagement structure, the flattening part 41 gradually moves downward until the lower end of the flattening part 41 contacts the copper ring 5 and pushes the copper ring 5 downward. Since the 10 groups of flattening components 4 are arranged coplanarly and have the same structure, when each flattening part 41 is screwed to the upper end of the threaded end and fits with the sliding hole, at this time, the flattening part 41 slides to the lowest position of its stroke, and the lower end surfaces of all the flattening parts 41 are on the same plane. Then, each flattening part 41 flattens the positions of the multiple copper rings 5 to the same plane height. At this time, the installation and flattening operation of the copper ring 5 is completed, and the upper surfaces of all the copper rings 5 can be made flush, meeting the requirements for the parallelism of the copper ring 5.

[0062] Glue injection: Inject liquid glue into the glue injection molding area a until the glue injection molding area a is filled; specifically, the liquid glue is AB glue. First, configure the AB glue according to the following steps:

[0063] Pour a quantitative amount of A glue and B glue in proportion and mix them evenly, and then perform vacuum degassing treatment to remove the bubbles in the liquid glue.

[0064] Exemplarily, the single usage amount of this AB glue is about 9.6 Kg. The liquid glue is usually injected into the molding die in two equal amounts, with each injection amount being 4.8 Kg, and it is mixed separately before each injection.

[0065] First, pour 3.6 Kg of A glue, then pour 1.2 Kg of B glue and stir and mix them evenly. Put the glue into a vacuum machine and evacuate it for 3 - 4 minutes to remove the bubbles. After taking it out, slowly pour it along the same position of the molding die for glue injection.

[0066] After the initial glue injection is completed, repeat the above steps to inject the remaining liquid glue. The glue injection operation is completed. The method of injecting glue in two times can avoid the phenomenon that the amount of liquid glue mixed at one time is too large and the liquid glue at the bottom solidifies, and can ensure that the liquid glue has good fluidity.

[0067] Forming and demolding: Let it stand still to cure the liquid glue into a formed shape, and then perform demolding treatment to obtain the finished CT slip ring tray. Specifically, let it stand still for at least 16 hours to cure the liquid glue into a formed shape, and successively remove the inner mold 2, the outer mold 3, and the bottom mold 1 to separate the forming mold from the CT slip ring tray. After trimming and removing the redundant colloid, the finished CT slip ring tray is obtained.

[0068] In this disclosure, by setting a forming mold with a bottom mold 1, an inner mold 2, an outer mold 3, and a flattening component 4, during processing, the copper bar is wound into a copper ring 5 by a ring rolling machine, and the copper ring 5 is embedded into the embedding groove 11 of the bottom mold 1, and then flattened and fixed by the flattening component 4. After injecting liquid glue into the injection molding area and curing it into a formed shape, the finished CT slip ring tray is obtained.

[0069] The copper ring 5 in this disclosure is formed by winding a copper bar, which has a low material cost, can meet the processing requirements of various outer diameter copper rings 5, is especially suitable for the processing of large-size copper rings 5, and at the same time has high processing accuracy and high processing efficiency.

[0070] In this disclosure, by the method of mold injection molding, on the premise of ensuring the mold accuracy, cooperating with the high-precision copper ring 5 obtained by ring rolling, the matching rate of the copper ring 5 and the embedding groove 11 of the mold is high, which can improve the yield rate of the processing process; and there is no need to perform complex turning operations, greatly reducing the processing difficulty and processing cost. At the same time, the injection molding method is convenient to operate and can significantly improve the processing efficiency.

[0071] In this disclosure, by setting a flattening component above the injection molding area, after loading the copper ring, the copper ring can be flattened by the flattening piece to make the upper surfaces of each copper ring flush, thereby ensuring the parallelism of each copper ring, so that the formed CT slip ring tray product can meet the requirements regarding the parallelism of the copper ring, which is beneficial to improving the yield rate and product quality.

[0072] In the description of this disclosure, it should be understood that the orientation or positional relationship indicated by orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal", and "top, bottom" is usually based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this disclosure and simplifying the description. Without contrary instructions, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, so it cannot be understood as a limitation on the protection scope of this disclosure.

[0073] For those skilled in the art, according to the technical solutions and concepts described above, various corresponding changes and deformations can be made, and all these changes and deformations should fall within the protection scope of the claims of this disclosure.

Claims

1. A molding die for a CT slip ring tray, characterized in that, Comprising: A bottom mold, which is in the shape of a circular ring sheet, and its upper surface has several circles of embedding grooves adapted to the copper rings for embedding the copper rings, and several circles of the embedding grooves are arranged in sequence from inside to outside around the axis of the bottom mold; An inner mold, which is arranged around the inner edge of the bottom mold; An outer mold, which is arranged around the outer edge of the bottom mold, and the side surfaces of the outer mold and the inner mold cooperate with the upper surface of the bottom mold to form a glue injection molding area; Several flattening assemblies, which are arranged above the glue injection molding area, and each group of the flattening assemblies has several flattening parts corresponding to the embedding grooves one by one, and the flattening parts can slide in a direction perpendicular to the upper surface of the bottom mold for flattening the copper rings; The flattening assembly further includes a mounting plate, the mounting plate is arranged above the glue injection molding area obliquely to the radial direction of the bottom mold, and one end of the mounting plate is detachably connected to the upper edge of the inner mold, and the other end is detachably connected to the upper edge of the outer mold; The mounting plate is formed with several sliding holes corresponding to the embedding grooves one by one, the sliding holes extend in a direction perpendicular to the upper surface of the bottom mold, and the flattening parts are inserted through the sliding holes.

2. The molding die of the CT slip ring tray according to claim 1, characterized in that, The sliding hole has internal threads, and the outer side surface of the flattening part has matching external threads, and the flattening part is in threaded cooperation with the sliding hole.

3. The molding die for the CT slip ring tray according to claim 2, characterized in that, The number of the flattening assemblies is 10 groups, and the 10 groups of the flattening assemblies are arranged in the same plane and are equally angularly spaced around the axis position of the bottom mold.

4. The molding die for the CT slip ring tray according to claim 1, characterized in that, A first sealing ring is filled at the connection position between the bottom mold and the inner mold; A second sealing ring is filled at the connection position between the bottom mold and the outer mold.

5. A processing technology for a CT slip ring tray, characterized in that, Including the following steps: Manufacturing copper rings: Taking several copper strips with required specifications and dimensions, rolling them into circles and connecting the heads and tails to obtain several copper rings; Wire soldering operation: Taking wire materials and welding them to each of the copper rings for wire soldering operation; Spraying release agent: Taking the molding die according to any one of claims 1-4, and spraying the release agent on the inner surface of the glue injection molding area; Loading copper rings: Embedding the obtained copper rings into the embedding grooves of the molding die one by one, and flattening each of the copper rings through the flattening assembly to make the upper surfaces of each of the copper rings flush; Glue injection: Injecting liquid glue into the glue injection molding area until the glue injection molding area is filled; Molding and demolding: Standing still to cure the liquid glue into a mold, and then performing demolding treatment to obtain the finished product of the CT slip ring tray.

6. The processing technology of the CT slip ring tray according to claim 5, characterized in that, In the step of manufacturing copper rings, it further includes: Opening several reinforcing holes with internal threads on one end surface of the obtained copper rings, the depth of the reinforcing holes is 1 / 3-1 / 2 of the thickness of the copper rings, and installing reinforcing bolts in the reinforcing holes.

7. The processing technology of the CT slip ring tray according to claim 5, characterized in that, The step of spraying the release agent specifically is: Taking the molding die according to any one of claims 1-4, cleaning the inner surface of the glue injection molding area, fixing the molding die, and adjusting the molding die so that the upper surface of the bottom mold is in a horizontal state; Spraying the release agent on the inner surface of the glue injection molding area, and repeating the spraying at least 3 times until the inner surface of the glue injection molding area is evenly covered with the release agent.

8. The processing technology of the CT slip ring tray according to claim 5, characterized in that, The step of loading copper rings specifically is: Embed the obtained copper rings one by one into the embedding grooves of the forming mold, install the flattening assembly above the copper rings, and make the flattening parts of each flattening assembly slide downward to flatten the copper rings, so that the upper surfaces of the copper rings are flush through the flattening parts.

9. The processing technology of the CT slip ring tray according to claim 5, characterized in that, In the glue injection step, the liquid glue is AB glue, which is prepared through the following steps: Pour a certain amount of A glue and B glue in proportion, mix them evenly, and then perform vacuum bubble extraction treatment to remove the bubbles in the liquid glue; And in the glue injection step, the liquid glue is injected into the forming mold in two equal amounts; The forming and demolding step is specifically as follows: Let it stand for at least 16 hours to cure the liquid glue into a mold, and then remove the inner mold, outer mold and bottom mold in sequence to separate the forming mold from the finished CT slip ring tray.

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