A fully automatic high-speed material sorting and packaging equipment
The fully automated high-speed material sorting and packaging equipment enables the automatic sorting, receiving, and vacuum packaging of LED chips, solving the problems of high labor intensity and low efficiency in existing technologies, improving work efficiency, and avoiding material mixing.
Patent Information
- Application Number
- CN202211367590.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-11-03
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2042-11-03
AI Technical Summary
In the existing technology, the process of sorting and shipping LED chips involves high labor intensity, low efficiency, and easy mixing of materials. Furthermore, it lacks automated sorting, receiving, vacuum packaging, and labeling functions.
A fully automatic high-speed material sorting and packaging equipment was designed, including a material conveying device, a code reading and sorting device, a storage bin, a packaging device and a transfer device. The equipment realizes automatic sorting, receiving and vacuum packaging of LED chips through limiting components, code readers, bagging components, vacuum sealing components and labeling components.
It enables automatic sorting, receiving, and vacuum packaging of LED chips, improving work efficiency, avoiding material mixing, and reducing manual labor intensity.
Smart Images

Figure CN115520627B_ABST
Abstract
Description
Technical Field
[0001] This invention mainly relates to the technical field of LED chip outbound processing, specifically a fully automatic high-speed material sorting and packaging equipment. Background Technology
[0002] Currently, chip products are sorted manually by personnel, then bagged, labeled, and shipped out. This process is labor-intensive, inefficient, and prone to mixing of materials. Therefore, a fully automated, high-speed material sorting and packaging device is needed to improve work efficiency.
[0003] According to patent document CN202110848141.9, an automatic LED chip stacking machine includes a mounting frame and a dispensing tray. The mounting frame has two linear motors symmetrically arranged on its upper surface. The moving parts of the two linear motors are fixedly connected to protrusions on the front and rear sides of the dispensing tray. A feeding hopper is located at the upper opening of the dispensing tray, and a discharge pipe is located at the lower opening. The input of the linear motors is electrically connected to the output of an external controller. The dispensing tray is rotatably connected inside the dispensing tray. A first motor is mounted on the center of the front side of the dispensing tray via a flange. The front and rear ends of the output shaft of the first motor are rotatably connected to through holes in the middle of the front side of the dispensing tray. The middle of the output shaft of the first motor is fixedly connected to the middle of the dispensing tray. This automatic and efficient LED chip stacking machine can automatically stack chips, prevent LED chips from bridging each other and causing feeding difficulties, and prevent chip jamming, resulting in higher stacking efficiency.
[0004] The device in the aforementioned patent facilitates automatic chip arrangement, but it is not convenient for automatic sorting, automatic material collection, vacuum packaging, labeling, and outbound delivery of LED chips. Summary of the Invention
[0005] This invention provides a fully automatic high-speed material sorting and packaging device to solve the technical problems mentioned in the background section.
[0006] The technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows:
[0007] A fully automatic high-speed material sorting and packaging device includes a base, a first support frame on top of the base, a material conveying device and a code-reading and sorting device on top of the first support frame, a storage bin on top of the base and located on one side of the first support frame, a second support frame on top of the base, a packaging device on top of the second support frame, a second transfer device on top of the base and located between the code-reading and sorting device and the storage bin, and a first transfer device on top of the base and located on one side of the storage bin. The second transfer device is used to transfer LED chips in the code-reading and sorting device to the storage bin, and the first transfer device is used to transfer LED chips in the storage bin to the packaging device.
[0008] The material conveying device includes a first linear guide rail disposed on the top of the first support frame, a conveying plate with the execution end of the first linear guide rail, and a plurality of limiting components disposed on the top of the conveying plate.
[0009] The storage silo is equipped with multiple distribution silos in sequence.
[0010] The packaging device includes a bagging component, an air-sealing component, and a labeling component, which are sequentially disposed on the top of the second support frame.
[0011] Preferably, the limiting component includes a plurality of limiting rods disposed on the top of the conveyor plate, a limiting frame sleeved on the outer wall of the limiting rods, and a beam plate disposed in the middle of the limiting frame. In this preferred embodiment, the limiting component facilitates the limiting of the LED chip, thereby enabling the LED chip to be conveyed smoothly.
[0012] Preferably, a lifting component is provided at the top of the conveyor plate and at the bottom of the limiting frame. The lifting component includes a miniature telescopic rod located at the top of the conveyor plate and whose actuating end is connected to the bottom of the beam plate; mounting shafts symmetrically arranged at the top of the conveyor plate and on both sides of the miniature telescopic rod; a shaft tube sleeved on the outer wall of the mounting shaft; a top plate located on the outer wall of the shaft tube; and a return spring connected at one end to the top of the conveyor plate and at the other end to one side of the bottom of the top plate. In this preferred embodiment, the lifting component facilitates the lifting of the LED chip within the limiting frame, enabling the handling robot to better transport the LED chip.
[0013] Preferably, the code reading and sorting device includes a material placement platform disposed on top of the first support frame, and a code reader disposed on top of the material placement platform. In this preferred embodiment, the code reading and sorting device reads the data of the LED chips to facilitate the classification of the LED chips.
[0014] Preferably, the bagging component includes an automatic bagging machine disposed on top of the second support frame. In this preferred embodiment, the bagging component facilitates the bagging of LED chips.
[0015] Preferably, the vacuum sealing component includes a vacuum pump located on top of the second support frame, a first air pipe connected to the vacuum pump's suction end, a second air pipe located at the vacuum pump's exhaust end, a first mounting bracket located on top of the second support frame and at the air inlet end of the first air pipe, electric push rods symmetrically arranged on the inner walls of both sides of the first mounting bracket, a heater located at the actuation end of the electric push rods, and a metal sheet located at the actuation end of the heater. In this preferred embodiment, the vacuum sealing component facilitates the vacuum sealing of bagged LED chips.
[0016] Preferably, the labeling component includes a second mounting bracket disposed on the top of the second support frame, a telescopic cylinder disposed at the bottom of the second mounting bracket, an ink cartridge disposed at the actuating end of the telescopic cylinder, and a printing mold disposed at the ink outlet end of the ink cartridge. In this preferred embodiment, the labeling component facilitates the labeling of bagged LED chips.
[0017] Preferably, the first transfer device includes a transverse linear guide rail disposed on the top of the base, a first sliding plate disposed at the actuating end of the transverse linear guide rail, a vertical linear guide rail disposed on the top of the first sliding plate, and a second sliding plate disposed at the actuating end of the vertical linear guide rail. The second transfer device has the same structure as the first transfer device. In this preferred embodiment, the first transfer device facilitates the transfer of LED chips on the material placement platform to the material distribution bin, and the second transfer device facilitates the transfer of LED chips in the material distribution bin to the packaging device.
[0018] Preferably, a clamping component is provided on one side of the second slide plate. The clamping component includes a mounting plate disposed on one side of the second slide plate, a second linear guide rail disposed on the top of the mounting plate, and a gripper disposed on the actuating end of the second linear guide rail. In this preferred embodiment, the clamping component facilitates the clamping of the LED chip.
[0019] Preferably, a transport robot is provided on the top of the first support frame. The transport robot is used to transport the LED chips in the feeding device to the code reading and sorting device. In this preferred embodiment, the transport robot facilitates the transfer of the LED chips in the limiting frame to the placement table, so that the code reader can read the LED chips on the placement table.
[0020] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0021] The equipment in this invention facilitates the automatic sorting, automatic receiving, vacuum packaging, labeling, and outbound delivery of LED chips.
[0022] In this invention, LED chips are transported through a feeding device. The feeding device uses a limiting component to limit the LED chips, which facilitates the smooth transport of the LED chips. The lifting component lifts the LED chips within the limiting frame, which allows the handling robot to better transport the LED chips.
[0023] The data of the LED chips can be read by the code reading and sorting device to facilitate the classification of the LED chips;
[0024] The packaging device facilitates the packaging of LED chips. The packaging device includes a bagging component for easy bagging of LED chips, a vacuum sealing component for easy vacuum sealing of bagged LED chips, and a labeling component for easy labeling of bagged LED chips.
[0025] The second transfer device facilitates the transfer of LED chips from the material placement platform to the material distribution bin, the first transfer device facilitates the transfer of LED chips from the material distribution bin to the packaging device, and the clamping component facilitates the clamping of LED chips.
[0026] The transport robot facilitates the transfer of LED chips within the limit frame to the placement platform, enabling the code reader to read and identify the LED chips on the placement platform.
[0027] The present invention will be explained in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description
[0028] Figure 1 This is an isometric view of the overall structure of the present invention;
[0029] Figure 2 This is an isometric view of the overall structure of the first transfer device of the present invention;
[0030] Figure 3 This is a cross-sectional view of the overall structure of the lifting component of the present invention;
[0031] Figure 4 This is a partial structural cross-sectional view of the vacuum sealing component of the present invention;
[0032] Figure 5 This is a cross-sectional view of the overall structure of the labeling component of the present invention;
[0033] Figure 6 This is an enlarged view of the structure at point A of the present invention;
[0034] Figure 7 This is an enlarged view of the structure at point B of the present invention.
[0035] Figure Descriptions: 10. Base; 11. First Support Frame; 111. Handling Robot; 12. Second Support Frame; 20. Material Conveying Device; 21. First Linear Guide Rail; 22. Conveyor Plate; 23. Limiting Component; 231. Limiting Rod; 232. Limiting Frame; 233. Beam Plate; 24. Lifting Component; 241. Miniature Telescopic Rod; 242. Mounting Shaft; 243. Shaft Tube; 244. Top Plate; 245. Return Spring; 30. Code Reading and Distributing Device; 31. Material Placement Platform; 32. Code Reader; 40. Storage Bin; 41. Distributing Bin; 50. Packing Device; 51. Bagging Component; 511. Automatic Packing Bag making machine; 52. Vacuum sealing component; 521. Vacuum pump; 522. First air pipe; 523. Second air pipe; 524. First mounting bracket; 525. Electric push rod; 526. Heater; 527. Metal sheet; 53. Labeling component; 531. Second mounting bracket; 532. Telescopic cylinder; 533. Ink cartridge; 534. Printing mold; 60. First transfer device; 61. Horizontal linear guide rail; 62. First slide plate; 63. Vertical linear guide rail; 64. Second slide plate; 65. Clamping component; 651. Mounting plate; 652. Second linear guide rail; 653. Gripper; 70. Second transfer device. Detailed Implementation
[0036] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be given below with reference to the accompanying drawings, which illustrate several embodiments of the present invention. However, the present invention can be implemented in different forms and is not limited to the embodiments described in the text. Rather, these embodiments are provided to make the disclosure of the present invention more thorough and complete.
[0037] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0039] Please refer to the appendix carefully. Figure 1 , 3As shown in Figure 6, in a preferred embodiment of the present invention, a fully automatic high-speed material sorting and packaging device includes a base 10. A first support frame 11 is provided on the top of the base 10. A material conveying device 20 and a code-reading and material sorting device 30 are provided on the top of the first support frame 11. A storage bin 40 is provided on the top of the base 10 and on one side of the first support frame 11. A second support frame 12 is provided on the top of the base 10. A packaging device 50 is provided on the top of the second support frame 12. A second transfer device 70 is provided on the top of the base 10 and between the code-reading and material sorting device 30 and the storage bin 40. A first transfer device 60 is provided on the top of the base 10 and on one side of the storage bin 40. The second transfer device 70 is used to transfer LED chips from the code-reading and material sorting device 30 to the storage bin 40, and the first transfer device 60 is used to transfer LED chips from the storage bin 40 to the packaging device 50. The material conveying device 20 includes components disposed on the first support frame. The first linear guide rail 21 at the top of the 11 has a conveyor plate 22 at the execution end of the first linear guide rail 21, and a plurality of limiting components 23 at the top of the conveyor plate 22; the limiting component 23 includes a plurality of limiting rods 231 at the top of the conveyor plate 22, a limiting frame 232 sleeved on the outer wall of the limiting rods 231, and a beam plate 233 in the middle of the limiting frame 232; a lifting component 24 is provided at the top of the conveyor plate 22 and at the bottom of the limiting frame 232. The lifting component 24 includes a miniature telescopic rod 241 disposed on the top of the conveyor plate 22 and whose execution end is connected to the bottom of the beam plate 233, mounting shafts 242 symmetrically disposed on the top of the conveyor plate 22 and located on both sides of the miniature telescopic rod 241, a shaft tube 243 sleeved on the outer wall of the mounting shaft 242, a top plate 244 disposed on the outer wall of the shaft tube 243, and a return spring 245 connected at one end to the top of the conveyor plate 22 and at the other end to one side of the bottom of the top plate 244.
[0040] It should be noted that in this embodiment, when the device starts working, the LED chip is placed in the limiting frame 232, the controller controls the first linear guide 21 to start working, the first linear guide 21 drives the conveyor plate 22 to slide, the conveyor plate 22 drives the limiting frame 232 to slide, so that the LED chip on the limiting frame 232 is conveyed. When the LED chip on the limiting frame 232 is conveyed to the corresponding position of the code reading and sorting device 30, the lifting component 24 lifts the LED chip.
[0041] Furthermore, when the lifting component 24 is working, the controller controls the micro telescopic rod 241 to start working. The execution end of the micro telescopic rod 241 drives the limiting frame 232 to retract along the limiting rod 231 through the beam plate 233. The limiting frame 232 drives one end of the top plate 244 to press down, so that the other end of the top plate 244 tilts up to lift the LED chip.
[0042] Please refer to the appendix carefully. Figure 1 , 2 As shown in Figure 7, in another preferred embodiment of the present invention, a plurality of distributing bins 41 are sequentially arranged inside the storage bin 40; the barcode reading and distributing device 30 includes a material placement platform 31 disposed on the top of the first support frame 11, and a barcode reader 32 disposed on the top of the material placement platform 31; the first transfer device 60 includes a transverse linear guide rail 61 disposed on the top of the base 10, a first sliding plate 62 disposed on the execution end of the transverse linear guide rail 61, a vertical linear guide rail 63 disposed on the top of the first sliding plate 62, and a second sliding plate disposed on the execution end of the vertical linear guide rail 63. 64. The second transfer device 70 has the same structure as the first transfer device 60. A clamping component 65 is provided on one side of the second slide plate 64. The clamping component 65 includes a mounting plate 651 provided on one side of the second slide plate 64, a second linear guide rail 652 provided on the top of the mounting plate 651, and a gripper 653 provided on the execution end of the second linear guide rail 652. A transport robot 111 is provided on the top of the first support frame 11. The transport robot 111 is used to transport the LED chips in the material conveying device 20 to the code reading and sorting device 30.
[0043] It should be noted that in this embodiment, the handling robot 111 transports the LED chip lifted on the limiting frame 232 to the material placement platform 31. The barcode reader 32 reads the LED chip on the material placement platform 31. The controller receives the data read by the barcode reader 32, analyzes and compares the data in the database, and controls the second transfer device 70 to transfer the LED chip to the distribution bin 41 corresponding to the database. When the distribution bin 41 is full of LED chips, the first transfer device 60 transfers the LED chip to the packaging device 50.
[0044] Furthermore, when the clamping component 65 is working, the controller controls the second linear guide rail 652 to start working, and the execution end of the second linear guide rail 652 drives the gripper 653 to slide, and the gripper 653 clamps the LED chip.
[0045] Furthermore, when the first transfer device 60 is working, the controller controls the horizontal linear guide 61 to start working, and the actuator of the horizontal linear guide 61 drives the first slide plate 62 to slide. The controller controls the vertical linear guide 63 to start working, and the actuator of the vertical linear guide 63 drives the second slide plate 64 to slide, so that the clamping component 65 moves to the designated position. The second transfer device 70 works on the same principle as the first transfer device 60.
[0046] Please refer to the appendix carefully. Figure 1 , 4As shown in Figure 5, in another preferred embodiment of the present invention, the packaging device 50 includes a bagging component 51, a vacuum sealing component 52, and a labeling component 53 sequentially disposed on the top of the second support frame 12. The bagging component 51 includes an automatic bagging machine 511 disposed on the top of the second support frame 12. The vacuum sealing component 52 includes a vacuum pump 521 disposed on the top of the second support frame 12, a first air pipe 522 connected to the vacuum pump 521's suction end, a second air pipe 523 disposed on the vacuum pump 521's exhaust end, and a labeling component 53 disposed on the top of the second support frame 12. The first mounting bracket 524 at the air inlet end of the first air pipe 522 includes an electric push rod 525 symmetrically arranged on the inner walls of both sides of the first mounting bracket 524, a heater 526 at the actuating end of the electric push rod 525, and a metal sheet 527 at the actuating end of the heater 526. The labeling component 53 includes a second mounting bracket 531 at the top of the second support frame 12, a telescopic cylinder 532 at the bottom of the second mounting bracket 531, an ink cartridge 533 at the actuating end of the telescopic cylinder 532, and a printing mold 534 at the ink outlet end of the ink cartridge 533.
[0047] It should be noted that in this embodiment, when the first transfer device 60 transfers the LED chip to the packaging device 50, the automatic bagging machine 511 bags the LED chip, the vacuum sealing component 52 vacuum seals the bagged LED chip, and the labeling component 53 labels the vacuum sealed LED chip.
[0048] Furthermore, when the air-sealing component 52 is working, the controller controls the air pump 521 to start working. The air pump 521 draws out the air from the bag through the first air pipe 522 and then discharges the air through the second air pipe 523. When the air in the bag is emptied, the controller controls the electric push rod 525 to start working. The actuator of the electric push rod 525 drives the heater 526 to extend and retract. The heater 526 drives the metal sheet 527 to extend and retract to clamp the bag opening. The heating end of the heater 526 heats the metal sheet 527 to seal the bag opening.
[0049] Furthermore, when the labeling component 53 is working, the controller controls the telescopic cylinder 532 to start working. The actuator of the telescopic cylinder 532 drives the ink cartridge 533 to extend and retract, and the ink cartridge 533 drives the printing mold 534 to extend and retract so that the printing mold 534 can label the packaged LED chip.
[0050] The specific process of this invention is as follows:
[0051] The controller model is "6ES7323-1BL00-0AA0".
[0052] When the equipment starts working, the LED chip is placed in the limiting frame 232. The controller controls the first linear guide 21 to start working. The actuator of the first linear guide 21 drives the conveyor plate 22 to slide. The conveyor plate 22 drives the limiting frame 232 to slide, so that the LED chip on the limiting frame 232 is conveyed. When the LED chip on the limiting frame 232 is conveyed to the corresponding position of the code reading and sorting device 30, the lifting component 24 lifts the LED chip.
[0053] When the lifting component 24 is working, the controller controls the micro telescopic rod 241 to start working. The execution end of the micro telescopic rod 241 drives the limiting frame 232 to retract along the limiting rod 231 through the beam plate 233. The limiting frame 232 drives one end of the top plate 244 to press down, so that the other end of the top plate 244 tilts up to lift the LED chip.
[0054] The handling robot 111 transports the LED chip lifted on the limit frame 232 to the material placement table 31. The barcode reader 32 reads the LED chip on the material placement table 31. The controller receives the data read by the barcode reader 32, analyzes and compares the data in the database, and controls the second transfer device 70 to transfer the LED chip to the distribution bin 41 corresponding to the database. When the distribution bin 41 is full of LED chips, the first transfer device 60 transfers the LED chip to the packaging device 50.
[0055] When the clamping component 65 is working, the controller controls the second linear guide rail 652 to start working, and the execution end of the second linear guide rail 652 drives the gripper 653 to slide, and the gripper 653 clamps the LED chip.
[0056] When the first transfer device 60 is working, the controller controls the horizontal linear guide 61 to start working, and the actuator of the horizontal linear guide 61 drives the first slide plate 62 to slide. The controller controls the vertical linear guide 63 to start working, and the actuator of the vertical linear guide 63 drives the second slide plate 64 to slide, so that the clamping component 65 moves to the designated position. The second transfer device 70 works on the same principle as the first transfer device 60.
[0057] When the first transfer device 60 transfers the LED chip to the packaging device 50, the automatic bagging machine 511 bags the LED chip, the vacuum sealing component 52 vacuum seals the bagged LED chip, and the labeling component 53 labels the vacuum sealed LED chip.
[0058] When the air-sealing component 52 is working, the controller controls the air pump 521 to start working. The air pump 521 draws out the air from the bag through the first air pipe 522 and then discharges the air through the second air pipe 523. When the air in the bag is emptied, the controller controls the electric push rod 525 to start working. The actuator of the electric push rod 525 drives the heater 526 to extend and retract. The heater 526 drives the metal sheet 527 to extend and retract to clamp the bag opening. The heating end of the heater 526 heats the metal sheet 527 to seal the bag opening.
[0059] When the labeling component 53 is working, the controller controls the telescopic cylinder 532 to start working. The actuator of the telescopic cylinder 532 drives the ink cartridge 533 to extend and retract. The ink cartridge 533 drives the printing mold 534 to extend and retract so that the printing mold 534 can label the packaged LED chip.
[0060] The present invention has been described by way of example in conjunction with the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvement made by adopting the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, shall be within the protection scope of the present invention.
Claims
1. A fully automatic high-speed material sorting and packaging device, comprising a base (10), characterized in that... The base (10) is provided with a first support frame (11) on top, and a conveying device (20) and a code reading and dispensing device (30) are provided on top of the first support frame (11). A storage bin (40) is provided on top of the base (10) and on one side of the first support frame (11). A second support frame (12) is provided on top of the base (10), and a packaging device (50) is provided on top of the second support frame (12). A second transfer device (70) is provided on top of the base (10) and between the code reading and dispensing device (30) and the storage bin (40). A first transfer device (60) is provided on top of the base (10) and on one side of the storage bin (40). The second transfer device (70) is used to transfer the LED chips in the code reading and dispensing device (30) to the storage bin (40). The first transfer device (60) is used to transfer the LED chips in the storage bin (40). The chip is transferred to the packaging device (50); the conveying device (20) includes a first linear guide rail (21) on the top of the first support frame (11), a conveyor plate (22) with the execution end of the first linear guide rail (21), and a plurality of limiting components (23) on the top of the conveyor plate (22); the limiting component (23) includes a plurality of limiting rods (231) on the top of the conveyor plate (22), a limiting frame (232) sleeved on the outer wall of the limiting rods (231), and a beam plate (233) in the middle of the limiting frame (232); a lifting component (24) is provided on the top of the conveyor plate (22) and at the bottom of the limiting frame (232), the lifting component (24) is provided on the bottom of the limiting frame (232), the lifting component (24) is provided on the top of the conveyor plate (22) and at ... The component (24) includes a miniature telescopic rod (241) disposed on the top of the conveyor plate (22) and whose actuating end is connected to the bottom of the beam plate (233); mounting shafts (242) symmetrically disposed on the top of the conveyor plate (22) and located on both sides of the miniature telescopic rod (241); a shaft tube (243) sleeved on the outer wall of the mounting shaft (242); a top plate (244) disposed on the outer wall of the shaft tube (243); and one end connected to the conveyor plate (22). The top and the other end are connected to a reset spring (245) on one side of the bottom of the top plate (244); the code reading and dispensing device (30) includes a material placement platform (31) on the top of the first support frame (11) and a code reader (32) on the top of the material placement platform (31); the first transfer device (60) includes a horizontal linear guide rail (61) on the top of the base (10), a first sliding plate (62) on the execution end of the horizontal linear guide rail (61), a vertical linear guide rail (63) on the top of the first sliding plate (62), and a second sliding plate (64) on the execution end of the vertical linear guide rail (63); the second transfer device (70) has the same structure as the first transfer device (60);A clamping component (65) is provided on one side of the second slide plate (64). The clamping component (65) includes a mounting plate (651) on one side of the second slide plate (64), a second linear guide rail (652) on the top of the mounting plate (651), and a gripper (653) on the execution end of the second linear guide rail (652). A plurality of dispensing bins (41) are arranged sequentially in the storage bin (40). The packaging device (50) includes a bagging component (51), a vacuum sealing component (52), and a labeling component (53) arranged sequentially on the top of the second support frame (12). A transport robot (111) is provided on the top of the first support frame (11). The transport robot (111) is used to transport the LED chips in the conveying device (20) to the code reading and dispensing device (30).
2. The fully automatic high-speed material sorting and packaging equipment according to claim 1, characterized in that, The bagging component (51) includes an automatic bagging machine (511) located on top of the second support frame (12).
3. The fully automatic high-speed material sorting and packaging equipment according to claim 1, characterized in that, The vacuum sealing component (52) includes a vacuum pump (521) located on the top of the second support frame (12), a first air pipe (522) connected to the vacuum pump (521) vacuum end, a second air pipe (523) located on the exhaust end of the vacuum pump (521), a first mounting bracket (524) located on the top of the second support frame (12) and at the air inlet end of the first air pipe (522), electric push rods (525) symmetrically arranged on the inner walls of both sides of the first mounting bracket (524), a heater (526) located on the actuation end of the electric push rod (525), and a metal sheet (527) located on the actuation end of the heater (526).
4. The fully automatic high-speed material sorting and packaging equipment according to claim 1, characterized in that, The labeling component (53) includes a second mounting bracket (531) located on the top of the second support frame (12), a telescopic cylinder (532) located at the bottom of the second mounting bracket (531), an ink cartridge (533) located at the actuating end of the telescopic cylinder (532), and a printing mold (534) located at the ink outlet end of the ink cartridge (533).
Citation Information
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