Cooling device for a computer system

Abstract

The present invention discloses a cooling device for a computer system. The cooling device includes an inlet duct, a first cooling plate, a second cooling plate, an outlet duct, and a heat conductor. The coolant flows through the inlet duct. The first cooling plate has a first inlet surface and a first outlet surface, and the inlet duct is coupled to the first inlet surface. The inlet duct introduces the coolant into the first cooling plate, and one end of the connecting duct is coupled to the first outlet surface. The coolant flows from the first cooling plate to the connecting duct. The second cooling plate has a second inlet surface and a second outlet surface, and the other end of the connecting duct is coupled to the second inlet surface. The outlet duct is coupled to the second outlet surface. The coolant flows from the second cooling plate to the outlet duct.

Description

Technical Field

[0001] This invention relates to a cooling device, and more particularly to electronic components in a server system. Background Technology

[0002] Cooling devices, such as cooling plates, are typically used to dissipate heat generated by electronic components in server systems. One method involves using a liquid coolant to facilitate heat transfer from the electronic components to the cooling device. When using such a device, it is crucial that the coolant flows safely within the cooling system without leaking to any of the server system's components. Furthermore, the design of the cooling system can also affect the server system's cooling efficiency. Another method to assist in transferring heat from high-temperature areas to low-temperature areas is the use of additional components that accelerate heat conduction or convection. Summary of the Invention

[0003] The following embodiments and related terms, such as embodiment, configuration, aspect, example, and option, are intended to broadly represent all the essential aspects of the invention. It should be understood that the use of these terms is not intended to limit the subject matter described herein or to limit the meaning or scope of the claims. The scope of the embodiments covered by this invention is defined by the claims and is not the summary of the invention. This summary provides a high-level overview of various aspects of the invention and introduces some concepts that are further described in the following embodiments. This summary is not intended to identify key or essential features of the claimed claims, nor is it intended to be used alone to determine the scope of the claimed claims. It should be understood that the summary is required by referring to the entire specification of the invention, any or all drawings, and appropriate portions of each claim.

[0004] According to some aspects of the present invention, a cooling device for a computer system is disclosed, comprising an inlet conduit, a first cooling plate, a connecting conduit, a second cooling plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cooling plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit introduces coolant into the first cooling plate. One end of the connecting conduit is coupled to the first outlet surface, and coolant flows from the first cooling plate to the connecting conduit. The second cooling plate has a second inlet surface and a second outlet surface, and the other end of the connecting conduit is coupled to the second inlet surface. The outlet conduit is coupled to the second outlet surface, and coolant flows from the second cooling plate to the outlet conduit. A heat conductor is coupled between the first outlet surface and the second inlet surface.

[0005] The foregoing summary is not intended to represent every embodiment or aspect of the invention. Rather, the foregoing summary provides only examples of some aspects and features set forth herein. The above features and advantages, as well as other features and advantages, of the invention will become apparent when considered in conjunction with the accompanying drawings and the appended claims, based on the following detailed description of representative embodiments and methods for carrying out the invention. Other aspects of the invention will be apparent to those skilled in the art from the detailed description of various embodiments with reference to the accompanying drawings, which are briefly described below.

[0006] The invention, its advantages, and the accompanying drawings will be better understood through the following description of representative embodiments in conjunction with the accompanying drawings. These drawings depict only representative embodiments and should not be considered as limiting the various embodiments or the scope of the claims. Attached Figure Description

[0007] Figure 1 A perspective view of an exemplary cooling system within a rack in a computer system, as described in some aspects of embodiments of the present invention.

[0008] Figure 2A In some aspects of the present invention, Figure 1 A perspective view of a typical connection of conduits in a typical cooling system.

[0009] Figure 2B In some aspects of the present invention, Figure 2A Exploded view of the dissociation element in an exemplary connection of the catheter;

[0010] Figure 3 In some aspects of the present invention, Figure 1 A perspective view of the cooling plate of an exemplary cooling device detached from the electronic device;

[0011] Figure 4A In some aspects of the present invention, Figure 1 Bottom perspective view of the ducts and two cooling plates of an exemplary cooling system;

[0012] Figure 4B In some aspects of the present invention, exemplary catheter connections Figure 1 Top perspective view of the two cooling plates in the middle;

[0013] Figure 4C In some aspects of the present invention, exemplary catheter connections Figure 1 Bottom view of the two cooling plates in the middle;

[0014] Figure 5 In some aspects of the present invention, Figure 1 A cross-sectional view of an exemplary conduit connecting two cooling plates;

[0015] Figure 6 In some aspects of the invention, an exemplary design is a perspective view of a straight conduit and a heat conductor;

[0016] Figure 7 In some aspects of the invention, an exemplary design is a perspective view of a tortuous conduit and a heat conductor.

[0017] Symbol Explanation

[0018] 100: Server System

[0019] 102, 200, 400, 600, 700: Cooling System

[0020] 104: Rack

[0021] 106: Power Supply

[0022] 108: Serial Port

[0023] 110: Input / Output Port

[0024] 112: Platform Controller Hub

[0025] 114: Baseboard Controller

[0026] 116: Dual In-line Memory Module

[0027] 118: PCIe slot

[0028] 120: Network Interface Control Card

[0029] 122: Bottom panel

[0030] 124: Part One

[0031] 126: Part Two

[0032] 128: Part Three

[0033] 130: Part Four

[0034] 132, 134: Electronic components

[0035] 136: Heat conductor

[0036] 138: First cooling plate

[0037] 140: Second cooling plate

[0038] 202: First catheter

[0039] 204: Connector

[0040] 206: Second catheter

[0041] 212: Connecting side

[0042] 214: Outer side

[0043] 216: First Opening

[0044] 218: Second opening

[0045] 220: Protrusion

[0046] 222: Cover

[0047] 224: Thread

[0048] 226: First Terminal

[0049] 228: Second Terminal

[0050] 312: Bottom surface

[0051] 314,510: Part One

[0052] 316,512: Part Two

[0053] 318: Top Part

[0054] 320: Motherboard

[0055] 408, 410: Groove

[0056] 412: First Exit Surface

[0057] 414: Second Inlet Surface

[0058] 416: First base plate

[0059] 418: Second base plate

[0060] 420: First inlet surface

[0061] 422: Second Exit Surface

[0062] 424: First on the board

[0063] 426:Second board

[0064] 500: Cooling components

[0065] 502: First hotspot

[0066] 504: Second hotspot

[0067] 506: First Processing Unit

[0068] 508: Second Processing Unit

[0069] 608: First Connection

[0070] 610: Second Connection

[0071] 612: Third Connection

[0072] 614: Fourth Connection

[0073] 616, 618, 720, 722, 724, 726, 728, 730: Twisted sections

[0074] 650: Inlet catheter

[0075] 652: Internal connecting conduit

[0076] 654: Outlet conduit

[0077] 752: External connecting catheter

[0078] A, B: Distance Detailed Implementation

[0079] This invention relates to a cooling device, particularly a cooling device for cooling electronic components in a server system. The cooling device uses a cooling plate, a heat conductor, and a liquid coolant to efficiently cool the front and rear of the electronic components. The cooling plate and heat conductor assist in transferring heat from the electronic components to the liquid coolant, thereby making the temperature in the flow system more uniform.

[0080] Various different embodiments are illustrated in the figures, with similar reference numerals used throughout the drawings to denote similar or identical elements. These figures are not drawn to scale and are provided merely for illustrative purposes. Some aspects of the invention are described below with reference to exemplary applications for illustrative purposes. It should be understood that many specific details, relationships, and methods are set forth herein to provide a comprehensive understanding of the invention. However, those skilled in the art will readily recognize that the invention can be practiced without one or more specific details or by other methods. In other instances, well-known structures or operations have not been shown in detail to avoid obscuring the invention. The various embodiments are not limited to the illustrated order of actions or events, as some actions may occur in a different order and / or simultaneously with other actions or events. Furthermore, not all actions or events shown are necessary for practicing the method of the invention.

[0081] For the purposes of this detailed description, unless otherwise stated, the singular includes multiples, and vice versa. The word "including" means "including but not limited to". Furthermore, approximate words such as "about", "almost", "substantially", "approximately", etc., may be used herein to indicate "in the vicinity of", "near", or "in the vicinity of". For example, within 3% to 5% of "within the permissible manufacturing tolerances" or "within the acceptable manufacturing tolerances". Similarly, the terms "vertically" or "horizontally" are intended to be further included, respectively, within "3-5%" in the vertical and horizontal directions. Additionally, terms for direction, such as "up", "down", "left", "right", "above", and "below", are intended to be associated with the equivalent directions described in the reference figures, understood from the context of the referenced object or element, such as from the object or element's usual location, or other descriptions within the invention.

[0082] Please refer to Figure 1 The illustration depicts a server system 100, with a cooling system 102 within a rack 104. The illustrated server system 100 also includes a power supply 106, a serial port 108, an input / output port 110, a platform controller hub 112, a baseboard management controller (BMC) 114, a DDR4 (double data rate 4) dual in-line memory modules (DIMMs) 116, a PCIe (peripheral component interconnect express) slot 118, and a network interface controller card 120. In other embodiments, the server system 100 may include more or fewer components than those listed. The rack 104 includes a bottom panel 122, a first portion 124, a second portion 126, a third portion 128, and a fourth portion 130 to surround the electronic components of the server system 100. Part 124 is generally perpendicular to Part 226 and Part 430. Part 124 is generally parallel to Part 328.

[0083] In some embodiments, the cooling system 102 includes a heat conductor 136 and cooling plates 138, 140. The heat conductor 136 may be a heat pipe, thermally conductive tape, thermosyphon, vapor chamber, copper plate, or other thermally conductive component. In this embodiment, the computer system includes electronic components 132, 134, such as a central processing unit, other processors, and memory devices. Electronic components 132, 134 generate heat during operation, therefore the cooling system 102 can be used to reduce the temperature of the electronic components 132, 134 themselves and their surroundings. Electronic components 132, 134 may be placed near a third portion 128 of the rack 104, between a second portion 126 and a fourth portion 130. Electronic components 132, 134 may also be placed on a printed circuit board mounted on a base panel 122. Cooling plates 138 and 140 may be coupled to electronic components 132 and 134, and a heat conductor 136 may be coupled between cooling plates 138 and 140 to assist in heat distribution when the second cooling plate 140 has a higher temperature than the first cooling plate 138. In this embodiment, the heat conductor 136 may extend generally parallel to the second portion 126 and the fourth portion 130. A dual in-line memory module 116 may be located near the second portion 126 and the fourth portion 130 of electronic components 132 and 134. A power supply 106 and a serial port 108 may be located near the third region 128. An input / output port 110 may be located near the first portion 124. A PCIe slot 118 and a network interface controller card 120 may be located near the first region 124 and the fourth region 130. A platform controller hub 112 and a baseboard controller 114 may be located near the first portion 124 and the second portion 126.

[0084] Figure 2A A perspective view of an embodiment of a cooling system 200 including a first cooling plate 138 coupled to a first conduit 202 and a second conduit 206. Figure 2B This is an exploded view of the separated first cooling plate 138, first conduit 202, and second conduit 206. Please refer to... Figure 2A The cooling plate 138 has a connector 204 on the opposite side, and the first conduit 202 and the connector 204 fluidly connect the first conduit 202 to the first cooling plate 138. As shown in the figure, the first conduit 202 and the connector 204 are at the first terminal 226, and the second conduit 206 and the connector 204 are at the second terminal 228 of the first cooling plate.

[0085] The first conduit 202 and the second conduit 206 allow liquid coolant to circulate through the first cooling plate 138 to reduce the temperature of the processing unit itself and its surroundings. Furthermore, as the liquid coolant passes through the first conduit 202, the temperature inside the first cooling plate 138 decreases due to heat transfer to the liquid coolant provided by the first conduit 202. Therefore, the first cooling plate 138, having a relatively low temperature, absorbs heat from the components near it, thereby reducing heat generation. These components can be electronic components, such as electronic component 132 (illustrated in…). Figure 1 It is directly fixed under the first cooling plate 138.

[0086] Please refer to Figure 2B The conduits 202 and 206 are typically hollow tubular structures of approximately the same diameter. Conduits 202 and 206 may be made of a shape-maintaining material, such as metal or a cured polymer. Conduits 202 and 206 may also be made of a flexible material with a shape that can be modified according to the conduit path. In some embodiments, conduits 202 and 206 may include thermal insulation properties to maintain the external temperature of conduits 202 and 206. Alternatively, conduits 202 and 206 may include thermal conductivity properties to reduce the external temperature of conduits 202 and 206. Conduits 202 and 206 may also be pipes, channels, hoses, or other tubular structures. Connector 204 is typically tubular, with a hollow interior and a diameter that varies along connector 204. Connector 204 typically facilitates the coupling of the first cooling plate 138 and the first conduit 202 and the second conduit 206. The connector may be a fitting, adapter, valve, or other type of connector. Conduits 202 and 206 and connector 204 are designed to withstand both high and low temperature fluids while maintaining structural integrity.

[0087] In this embodiment, the first conduit 202 has a connecting side 212 and an outer side 214. The connector 204 has a first opening 216, a second opening 218, a plurality of protrusions 220, a cap 222, and a plurality of threads 224. The protrusions 220 extend from the first opening 216 to the cap 222. Each protrusion 220 can be considered as a barb, such as a barb fitting. The threads 224 extend from the second opening to the cap 222, thus the protrusions 220 secure the conduits 202 and 206 in position relative to the connector 204. The connecting side 212 of the conduits 202 and 206 can seal the first opening 216 and at least a portion of the protrusions 220 of the connector 204. One or more additional materials can be used for sealing between the conduits 202 and 206 and the connector 204, such as welding, O-rings, tape, and adhesives. Therefore, liquid coolant flows directly from the conduits 202 and 206 to the connector 204 without leakage. Therefore, the liquid flowing directly from connector 204 to the first cooling plate 138 flows through without leakage.

[0088] In this embodiment, the cover 222 has five sides; in other embodiments, the cover 222 may have more or fewer than five sides. The outer diameter of the cover 222 is larger than the outer diameter of the protrusion 220 and the thread 224. Therefore, the cover 222 can be used to help the user couple the conduits 202, 206 and the cooling plate 138 to the connector 204 by gripping the cover 222 with a tool or fingers to tighten or loosen the connection.

[0089] Figure 3 A perspective view showing a first cooling plate 138 coupled to an electronic component 132 is illustrated. Prior to installation, the first terminal 226 of the first cooling plate 138 is aligned with a first portion 314 of the electronic component 132. Similarly, the second terminal 228 of the first cooling plate 138 is aligned with a second portion 316 of the electronic component 132. The bottom surface 312 of the first cooling plate 138 is accessible to the top portion 318 of the electronic component 132 for heat conduction. In some embodiments, the first cooling plate 138 is coupled to the electronic component 132 with a fastener, such as a screw, nail, adhesive, clamp, etc. Similarly, the electronic component 132 may be coupled to a motherboard 320. In other embodiments, the electronic component 132 may be directly coupled to a rack. In this embodiment, a portion of the electronic component 132 includes a thermally conductive metal substrate and a thermal paste, a thermal pad, a soldering material, or an interference fit.

[0090] Figures 4A to 4C The cooling device 400 is shown. Figure 4AThis is a lower perspective view of the cooling device 400. A set of heat conductors 136 are coupled between a first cooling plate 138 and a second cooling plate 140. The first cooling plate 138 has a first base plate 416. A first set of recesses 408 are located near a first inlet surface 420 of the first base plate 416. Similarly, a second set of recesses 410 are located near a second outlet surface 422 of a second base plate 418 of the second cooling plate 140. Each set of recesses 408, 410 extends from the first base plate 416 and the second base plate 418 toward a connector 204, but the recesses 408, 410 do not adjoin the connector 204. Each recess in the first set also extends from the first inlet surface 420 toward a first outlet surface 412. Similarly, each recess in the second set also extends from the second outlet surface 422 toward a second inlet surface 414. In this embodiment, each set of recesses 408, 410 has three recesses. In other embodiments, each set of recesses 408, 410 may have more or fewer than three recesses.

[0091] The heat conductor 136 may be a heat pipe, heat-conducting tape, thermosiphon radiator, vapor chamber, copper plate, or other heat-conducting component. The heat conductor 136 assists in heat distribution when the second cooling plate 140 has a higher temperature than the first cooling plate 138. Excess heat in the second cooling plate 140 can be transferred to the first cooling plate 138 via the heat conductor 136 to achieve cooling through heat conduction and phase change.

[0092] In some embodiments, when the heat conductor 136 is a heat pipe, a liquid may be contained within the internal space of the heat conductor 136. In such embodiments, the liquid in the higher-temperature portion absorbs heat from the hotter surface and evaporates into a gas. The gas then travels along the heat pipe 136 to the cooler portion and condenses back into liquid, releasing latent heat. Thus, the heat conductor 136 efficiently transfers heat to cool one or more components. Each heat conductor 136 is substantially the same length and width. The width of the heat conductor 136 is less than the width of the corresponding recesses 408, 410. The length of the heat conductor 136 may vary depending on the system requirements.

[0093] Figure 4B This is a top perspective view of a cooling device 400, which has a heat conductor 136 coupled to a first cooling plate 138 and a second cooling plate 140. In this embodiment, the length of the heat conductor 136 is minimized so that the distance between the first cooling plate 138 and the second cooling plate 140 is close to zero.

[0094] Figure 4CAs shown in the figure, a heat conductor 136 is located in a first set of recesses 408 and a second set of recesses 410, representing a lower view of the cooling device 400. The heat conductor 136 can be joined to the component by welding, embedding, riveting, bolting, brazing, or other means. In this embodiment, the heat conductor 136 is welded to the recesses 408 and 410.

[0095] After the heat conductor 136 engages with the grooves 408 and 410, the first base plate 416 and the second base plate 418 can be smoothed to make them flat surfaces. The connector 204 is adjacent to the heat conductor 136 such that it is closer to the first upper plate 424 and the second upper plate 426 than the heat conductor 136. The first cooling plate 138 has a first inlet connector, and the second cooling plate 140 has a second inlet connector.

[0096] Figure 5 A side cross-sectional view of the first cooling plate 138 and the second cooling plate 140 is shown. (Refer to...) Figure 5 After the heat conductor 136 is added to the first cooling plate 138 and the second cooling plate 140, additional portions can be added to the cooling component 500. The first base plate 416 and the second base plate 418 are coupled to the heat conductor 136, and the first cooling plate 138, the second cooling plate 140, and the heat conductor 136 are encapsulated together in an integral cooling module. In this embodiment, one side of the first base plate 416 and one side of the second base plate 418 are respectively adjacent to the first upper plate 424 and the second upper plate 426. The first upper plate 424 of the first cooling plate 138 includes first fins 514 extending into the interior of the cooling plate 138 to assist in temperature reduction. Similarly, the second cooling plate 140 includes second fins 516 extending from the second upper plate 426 to assist in temperature reduction.

[0097] The first base plate 416 is adjacent to the first thermal interface 502 on one side relative to the first upper plate 424. Similarly, the second base plate 418 is adjacent to the second thermal interface 504 on one side relative to the second upper plate 426. In the direction of contact with the first thermal interface 502 and the second thermal interface 504, the heat conductor 136 is positioned such that the first thermal interface is adjacent to the first electronic component 506, and similarly, the second thermal interface 504 is adjacent to the second electronic component 508. The first electronic component 506 is located in the first portion 510 of the motherboard, and the second electronic component 508 is located in the second portion 512 of the motherboard. A distance A is spaced between the first inlet surface 420 and the second outlet surface 422, and a distance B is spaced between the first outlet surface 412 of the first cooling plate 138 and the second inlet surface 414 of the second cooling plate 140. Distance A may be less than distance B.

[0098] When liquid coolant flows from the first cooling plate 138 to the second conduit 206 (illustrated in...) Figures 2A-2BWhen it enters the second cooling plate 140, the temperature inside the second cooling plate is transferred to the second conduit 206 (shown in the diagram) due to heat conduction. Figures 2A-2B The temperature is reduced by the liquid coolant supplied. Therefore, the relatively lower temperature of the second cooling plate 140 absorbs heat from the components near the second cooling plate 140, thus reducing the heat. The heated liquid coolant circulates to an external heat exchanger or cooling supply (not shown) to remove heat, and the coolant passes through the first conduit 202 (shown in...). Figures 2A-2B Recirculation. The above steps are performed using the first catheter 202 (illustrated in...). Figures 2A-2B ) and the second catheter (illustrated in Figures 2A-2B This process continues continuously, with the circulating liquid coolant used to cool the system.

[0099] The first base plate 416 and the second base plate 418 may be made of a thermally conductive material, such as copper or aluminum, and are typically rectangular prisms. Fins 514 and 516 may be louvered, lanced offset, straight, wavy, or other types of fins placed within the first base plate 416 and the second base plate 418. Additionally, fins 514 and 516 may define an internal parallel channel, a tortuous channel, or a checkerboard channel flow configuration within the cooling plates 138 and 140 to guide the liquid coolant internally. Therefore, the first cooling plate 138 and the second cooling plate 140 include an internal flow channel configuration. Liquid coolant may flow into a connector of the base plates 416 and 418, pass through the fins 514 and 516, and then flow out from another connector 204. The first thermal interface 502 and the second thermal interface 504 may be heat sinks, thermal paste, interfaces, solder, mixtures, or other materials that can be used to ensure thermal contact between the first and second substrates 416, 418 and the first and second processing units 506, 508. The first processing unit 506 and the second processing unit 508 may be a central processing unit, an image processing unit, a digital signal processor, an audio chip / card, an image processing unit, or other integrated circuit packaged processing units.

[0100] The first processing unit 506 and the second processing unit 508 may generate, produce, or radiate heat, thus raising the ambient temperature. In some embodiments, when the cooling component 500 uses a straight conduit design (e.g., Figure 6(As illustrated), the temperature variation between the first processing unit 506 and the second processing unit 508 can be between 1°C and 15°C. For example, the first processing unit may be 7.3°C cooler than the second processing unit. The chassis temperature of the second processing unit 508 after cooling is between 40°C and 90°C, for example, 66.7°C. After cooling with liquid coolant, the temperature variation of the heat conductor 136 can be between 0.005°C and 5°C, for example, 0.4°C. The pressure drop of the coolant after flowing through the component ranges between 1 and 20 kPa, for example, 7.0 kPa.

[0101] In another embodiment, when the cooling component uses a tortuous conduit design (e.g.) Figure 7 (As illustrated), the temperature variation between the first processing unit 506 and the second processing unit 508 can be between 0.005°C and 5°C. For example, the first processing unit may be 0.1°C cooler than the second processing unit. The chassis temperature of the second processing unit 508 after cooling is between 40°C and 90°C, for example, 60.2°C. After cooling with liquid coolant, the temperature variation of the heat conductor 136 can be between 1°C and 15°C, for example, 6.0°C. The pressure drop of the coolant after flowing through the element ranges between 1 and 20 kPa, for example, 9.8 kPa. In other embodiments, the cooling component 500 exhibits different characteristics with different conduit designs.

[0102] Figure 6 A perspective view of an embodiment of a cooling system 600 with a linear conduit design is shown. The cooling system 600 includes a first cooling plate 138, a second cooling plate 140, a heat conductor 136, an inlet conduit 650, an internal connecting conduit 652, and an outlet conduit 654. The heat conductor 136 is coupled to the first cooling plate 138 and the second cooling plate 140. The first cooling plate 138 has a first connection 608 and a second connection 610, and the second cooling plate has a third connection 612 and a fourth connection 614. All four connections 608, 610, 612, and 614 include a connecting device, for example... Figures 2A-2B The connector 204 is illustrated. An inlet conduit 650 is coupled to a first cooling plate 138 at a first connection 608, and the first connection 608 may include an inlet connector. An internal connecting conduit 652 is coupled to the first cooling plate 138 at a second connection 610 and to a second cooling plate 140 at a third connection 612. Therefore, the second connection 610 and the third connection 612 may include an internal conduit connector. An outlet conduit 654 is coupled to the second cooling plate 140 at a fourth connection 614, and the fourth connection 614 may include an outlet connector.

[0103] The outlet conduit 654 may have a first bend 616 and a second bend 618 to ensure efficient placement of the outlet conduit 654 within the server system. In other embodiments, the outlet conduit 654 may have more or fewer two bends. Similarly, the inlet conduit 650 may have one or more bends. The first cooling plate 138 and the second cooling plate 140 are each designed to be positioned above a processing unit, for example... Figure 5 The processing unit described herein can dissipate, generate, produce, or radiate heat; therefore, the cooling system 600 serves as a cooling mechanism.

[0104] The inlet conduit 650, internal connecting conduit 652, and outlet conduit 654 circulate coolant to reduce the temperature of the processing unit itself and its vicinity. Specifically, when liquid coolant flows through the inlet conduit 650, the temperature inside the first cooling plate 138 is transferred to the liquid coolant supplied by the inlet conduit 650, thus lowering its temperature. Therefore, the heat of components near the first cooling plate 138 is reduced due to the relatively lower temperature of the first cooling plate 138 absorbing heat. This component may be an electronic component and is fixed directly below the first cooling plate 138. Similarly, when liquid coolant flows from the first cooling plate 138 to the internal connecting conduit 652 and enters the second cooling plate 140, the temperature inside the second cooling plate 140 is reduced due to the heat transfer to the liquid coolant supplied by the internal connecting conduit 652. Therefore, the relatively lower temperature of the second cooling plate 140 absorbs heat from the area surrounding the components near the second cooling plate 140, thus reducing heat. The outlet conduit 654 then removes the heated liquid coolant from the second cooling plate. The heated liquid coolant is circulated to an external heat exchanger or cooling supply (not shown) to remove heat, and the coolant is recirculated through inlet conduit 650. These steps continue while using inlet conduit 650 and outlet conduit 654, circulating the liquid coolant to cool the system.

[0105] Figure 7 A perspective view of an embodiment of a cooling system 700 with a tortuous conduit design is shown. The cooling system 700 includes a first cooling plate 138, a second cooling plate 140, a heat conductor 136, an inlet conduit 650, an external connecting conduit 752, and an outlet conduit 654. The heat conductor 136 is coupled to the first cooling plate 138 and the second cooling plate 140. The first cooling plate 138 has a first connection 608 and a second connection 610, and the second cooling plate has a third connection 612 and a fourth connection 614. All four connections 608, 610, 612, and 614 include a connecting device, for example... Figures 2A-2BThe connector 204 is illustrated. An inlet conduit 650 is coupled to the first cooling plate 138 at the second connection 610, and the first connection 608 may include an inlet connector. An external connection conduit 752 is coupled to the first cooling plate 138 at the first connection 608 and to the second cooling plate 140 at the fourth connection 614. Therefore, both the first connection 608 and the fourth connection 614 may include an external conduit connector. An outlet conduit 654 is coupled to the second cooling plate 140 at the third connection 612, and the third connection 612 may include an outlet connector.

[0106] The inlet conduit may have a first bend 616 and a second bend 618. The external connection conduit 752 may have a third bend 720, a fourth bend 722, a fifth bend 724, and a sixth bend 726. The outlet conduit 654 has a seventh bend 728 and an eighth bend 730. Each bend ensures that the corresponding conduit is efficiently placed within the server system. The first cooling plate 138 and the second cooling plate 140 are each designed to be placed above a processing unit, for example... Figure 5 The processing unit described herein can dissipate, generate, produce, or radiate heat; therefore, the cooling system 700 serves as a cooling mechanism.

[0107] The inlet conduit 650, external connection conduit 752, and outlet conduit circulate coolant to reduce the temperature of the processing unit itself and its vicinity. Specifically, when liquid coolant flows through the inlet conduit 650, the temperature inside the first cooling plate 138 is transferred to the liquid coolant supplied by the inlet conduit 650, thus lowering the temperature. Therefore, the heat of components near the first cooling plate 138 is reduced due to the relatively lower temperature of the first cooling plate 138 absorbing heat. Similarly, when liquid coolant flows from the first cooling plate 138 to the external connection conduit 752 and enters the second cooling plate 140, the temperature inside the second cooling plate 140 is reduced due to the heat transfer to the liquid coolant supplied by the external connection conduit 752. Therefore, the relatively lower temperature of the second cooling plate 140 absorbs heat from the area surrounding the components near the second cooling plate 140, thus reducing heat. The outlet conduit 654 then removes the heated liquid coolant from the second cooling plate. The heated liquid coolant is circulated to an external heat exchanger or cooling supply (not shown) to remove heat, and the coolant is recirculated through inlet conduit 650. These steps continue while using inlet conduit 650 and outlet conduit 654, circulating the liquid coolant to cool the system.

[0108] Although the invention has been illustrated and described with respect to one or more embodiments, equivalent changes and modifications will be apparent to those skilled in the art upon reading and understanding this specification and the accompanying drawings. Furthermore, while specific features of the invention may be disclosed with respect to only one of several embodiments, such features may be combined with one or more other features of other embodiments, depending on any desired and advantageous given or particular application.

[0109] Although various embodiments of the invention have been described, it should be understood that they are given by way of example only and not by way of limitation. Various changes may be made to the disclosed embodiments based on the invention without departing from the spirit and scope thereof. Therefore, the breadth and scope of the invention should not be limited by any of the foregoing embodiments, but rather defined by the appended claims and their equivalents.

Claims

1. A cooling device for a computer system, the cooling device comprising: Inlet conduit through which coolant flows; A first cooling plate has a first inlet surface and a first outlet surface, and an inlet conduit is coupled to the first inlet surface to introduce the coolant into the first cooling plate. A connecting conduit, the end of which is coupled to the first outlet surface, through which the coolant flows from the first cooling plate to the connecting conduit; The second cooling plate has a second inlet surface and a second outlet surface, and the other end of the connecting conduit is coupled to the second inlet surface; An outlet conduit is coupled to the second outlet surface, through which the coolant flows from the second cooling plate to the outlet conduit; as well as A heat conductor is coupled between the first outlet surface and the second inlet surface, and the heat conductor is parallel to the connecting conduit. The first cooling plate has a first set of grooves at its bottom near the first inlet surface, and the second cooling plate has a second set of grooves at its bottom near the second outlet surface. The heat conductor is located in the first set of grooves and the second set of grooves and connects the first set of grooves and the second set of grooves. The first cooling plate and the second cooling plate each include an inlet connector and an outlet connector for individually connecting to one of the inlet conduit, the connecting conduit, or the outlet conduit. The inlet connector and the outlet connector each include multiple protrusions and a cover, the outer diameter of which is larger than the outer diameter of the protrusion.

2. The cooling device of claim 1, wherein at least one of the first cooling plate and the second cooling plate comprises an internal flow channel configuration; the internal flow channel configuration is a parallel channel configuration, a tortuous channel configuration, or a checkerboard channel configuration.

3. The cooling device as claimed in claim 1, wherein the first outlet surface and the second inlet surface are spaced apart by a distance A, and the first inlet surface of the first cooling plate and the second outlet surface of the second cooling plate are spaced apart by a distance B, wherein the distance A is less than the distance B.

4. The cooling device of claim 1, wherein at least one of the first cooling plate and the second cooling plate has a copper substrate.

5. The cooling device of claim 1, wherein at least one of the first cooling plate and the second cooling plate includes a hot surface directly connected to the heat conductor.

6. The cooling device of claim 5, wherein the hot surface comprises one or more thermal pastes, one or more thermal pads, or solder.

7. The cooling device of claim 1, wherein the first cooling plate, the second cooling plate, and the heat conductor are encapsulated in an integral cooling module.

8. The cooling device of claim 1, wherein the heat conductor comprises one or more copper plates, heat pipes, heat spreaders, or thermosiphon radiators.

Images