A fluorescent camera system

Abstract

The invention discloses a fluorescent camera system, including a filter, a switching power supply, a central processing unit, a video output board, a camera, a display, a light source driver board, a microprocessor, a constant current board and a laser chip, wherein a 220V power input terminal is connected to the filter, and the filter is respectively connected to the central processing unit, the video output board, the light source driver board and the constant current board through the switching power supply, the central processing unit is respectively connected to the video output board and the camera, the video output board is connected to the display, the light source driver board is respectively connected to the microprocessor and the constant current board, and the constant current board is connected to the laser chip. The invention proposes an integrated design for driving and controlling a variety of laser sources in the system, and also specifically processes the risk management of each radiation source, heat source, sensitive equipment and instrument in the system, greatly improving the electromagnetic compatibility stability, heating and heat dissipation stability of the system.

Description

Technical Field

[0001] The invention relates to the field of medical technology, and in particular to a fluorescence camera system. Background Art

[0002] In recent years, diagnosis using fluorescent camera systems has been widely carried out in medical treatment. The fluorescent camera system is an integrated system of an image processing system and an excitation laser, including a handle with a camera and a light source, a fluorescent camera host and a display. The fluorescent camera host is used to process the image information collected by the camera and provide power for driving the handle light source. The handle is used to collect images and trigger the laser, and the display is used to display the image information processed by the fluorescent camera host.

[0003] Generally, the fluorescent camera host only provides image processing functions, while the handle provides image acquisition and laser drive and triggering. However, the handle is small in size due to the frequent activities of operators, and the numerous functions will cause serious electromagnetic compatibility and heating problems.

[0004] Since laser triggering is different in different tissues of the human body, the laser drive, triggering, and control of the handle are also different, resulting in a single host being compatible with only one or two types of handles and unable to be iteratively upgraded, greatly wasting production costs.

[0005] In summary, the present invention designs a fluorescence imaging system. Summary of the invention

[0006] In view of the shortcomings of the prior art, the present invention aims to provide a fluorescent camera system, which proposes an integrated design for driving and controlling multiple laser sources in the system, and provides a complete integrated method for upward iterative compatible upgrades. In addition, the risk management of each radiation source, heat source, sensitive equipment and instrument in the system is targeted, greatly improving the system's electromagnetic compatibility stability, heat and heat dissipation stability, fire resistance and other risk management capabilities.

[0007] In order to achieve the above-mentioned purpose, the present invention is implemented through the following technical scheme: a fluorescent camera system, including a filter, a switching power supply, a central processing unit, a video output board, a camera, a display, a light source driving board, a microprocessor, a constant current board and a laser chip, the 220V power input end is connected to the filter, the filter is respectively connected to the central processing unit, the video output board, the light source driving board and the constant current board through the switching power supply, the central processing unit is respectively connected to the video output board and the camera, the video output board is connected to the display, the light source driving board is respectively connected to the microprocessor and the constant current board, and the constant current board is connected to the laser chip.

[0008] Preferably, the fluorescent camera system also includes a fluorescent camera host, which includes a drive component, a microprocessor, a central processing unit component, a switching power supply, a video output component, a fan, a ferrite magnetic ring module and a filter arranged in a casing, and a switch USB port, a keyboard USB port, a USB reading port and a video input interface are arranged on a side panel of the casing.

[0009] Preferably, the casing comprises a frame, an outer shell and heat dissipation holes, the outer shell is plugged into the frame, and the frame and the outer shell are both provided with heat dissipation holes, the hole spacing of the heat dissipation holes is twice the gap between the frame and the outer shell, and a fan is provided inside the heat dissipation holes.

[0010] Preferably, the driving assembly includes a driving board, a constant current board, a thermally conductive flexible material and a thermally conductive semiconductor, a plurality of constant current boards are plugged into the driving board, a thermally conductive flexible material is arranged on the constant current board, a thermally conductive semiconductor is arranged outside the thermally conductive flexible material, and the constant current board is arranged vertically; the driving board is connected to the power ground of the protective ground. The line flows through a large current, and the low power access can ensure the stability of the zero level of the ground line.

[0011] Preferably, the microprocessor is floating, and its function is to control the constant current board, identify the key signal of the external camera component, and power the LED indicator of the external camera component; the first magnetic bead L1 and the second magnetic bead L2 are connected in series at the power supply port of the microprocessor to prevent the high-frequency clock signal in the microprocessor from being spatially coupled or conducted to the floating power supply wire between the microprocessor and the drive component to generate differential mode radiation; to prevent external radiation coupling to the floating power supply wire between the microprocessor and the drive component and conduction to the microprocessor.

[0012] Preferably, the driver board is provided with an isolated voltage-regulating power supply circuit, and the first capacitor C1, the differential mode filter inductor LDM1, and the second capacitor C2 of the isolated voltage-regulating power supply circuit are equivalent to a third-order π-type low-pass filter, which is used to remove the common-mode radiation current and ripple caused by the large current carried by the front-end driver board 201, so as to achieve the purpose of stabilizing the DC. A safety capacitor CY1 is connected across the signal ground DGND and the power ground GND of the back-end microprocessor to absorb high-voltage interference during the anti-interference test during the electromagnetic compatibility test; the DC-DC isolated voltage-regulating chip U1 is equivalent to the integration of the AC inverter, transformer, and filter rectifier.

[0013] Preferably, the microprocessor adopts a LED drive control dedicated chip U2 with a key scanning interface. The LED drive control dedicated chip U2 has two serial interfaces CLK and DAT. CLK is the data clock input interface, and DAT is the data input and output interface. When DAT is in input mode, the key scan data is transmitted to the microprocessor through the data transmission interface; the key scan is processed by the microprocessor software; when DAT is in input mode, the microprocessor sends data to the LED drive chip to realize LED drive control.

[0014] Preferably, the central processing unit component and the video output component jointly realize the video processing and transmission functions in the fluorescent camera system host. After the camera is powered on, the collected image signal is transmitted to the central processing unit, and the video output board receives the processed video signal from the central processing unit and converts it into the video format required by the display.

[0015] Preferably, the CPU assembly includes a CPU, a CPU shielding heat dissipation shell, a thermally conductive flexible material, a CPU heat dissipation block, and studs. The CPU is fixed to the CPU shielding heat dissipation shell by the studs. The CPU shielding heat dissipation shell is sequentially provided with a thermally conductive flexible material and a CPU heat dissipation block. The CPU generates heat during operation, which is transferred into the CPU heat dissipation block through the CPU shielding heat dissipation shell and the thermally conductive flexible material.

[0016] Preferably, the video output component comprises a video output board, a shielding heat dissipation shell of the video output board, a thermally conductive flexible material and a heat dissipation block of the video output board, wherein the video output board is provided with a shielding heat dissipation shell of the video output board, a thermally conductive flexible material and a heat dissipation block of the video output board in sequence; the video output board generates heat during operation, which is transferred into the heat dissipation block of the video output board through the shielding heat dissipation shell of the video output board and the thermally conductive flexible material; the heat is dissipated outwardly through the designed air duct, so as to prevent the video output board from causing chip frequency reduction due to excessive heat, thereby ensuring the stability of the video output board.

[0017] Preferably, the power supply for the central processing unit and the video output board is protective grounding, and an interface filtering circuit is arranged at the power supply interface. The interface filtering circuit adopts a 5th-order LC filter L3. The B port and PSG port of the 5th-order LC filter L3 are connected to the switching power supply, and the CB port and CG port output power to the central processing unit 401 and the video output board 601; in the equivalent circuit of the 5th-order LC filter L3, the seventh inductor L7, the eighth inductor L8, and the fourth capacitor C4 are equivalent to form a common-mode filter, and the ninth inductor L9 and the fifth capacitor C5 form an LC low-pass filter, which together form a fifth-order low-pass filter.

[0018] Preferably, in the transmission of the video signal line between the central processor and the video output board, the signal is transmitted to the common mode filter U3 at the interface of the image output board. The purpose of the series inductor is to prevent bidirectional high-frequency interference, and the purpose of the common mode filter is to filter out the CPU high-frequency clock signal other than the video signal frequency, so as to prevent the external screen and the screen data line (DVI, HDMI) from becoming an antenna. The purpose of the ESD protector is to prevent the electrostatic test in the electromagnetic compatibility from black screen flickering, and effectively filter and discharge to the ground.

[0019] Preferably, the ferrite ring module comprises a ferrite ring, a conductive flexible material and a ferrite ring fixing piece, and the conductive flexible material is arranged between the ferrite ring and the ferrite ring fixing piece to fill the gap therebetween.

[0020] Beneficial effects of the invention: The invention proposes an integrated design for driving and controlling multiple laser sources in the system, and provides a complete integrated method for upward iterative compatible upgrades. In addition, the invention also specifically processes various radiation sources, heat sources, sensitive equipment and risk management in the system, greatly improving the system's electromagnetic compatibility stability, heat and heat dissipation stability, fire resistance and other risk management capabilities. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments;

[0022] Figure 1 It is a structural framework diagram of the present invention;

[0023] Figure 2 It is a schematic diagram of the structure of the fluorescent camera host of the present invention;

[0024] Figure 3 for Figure 2 Side view of

[0025] Figure 4 It is a schematic diagram of the exploded structure of the casing of the present invention;

[0026] Figure 5 It is a schematic diagram of the layout of the heat dissipation holes of the present invention;

[0027] Figure 6 It is a schematic diagram of the heat dissipation duct of the present invention;

[0028] Figure 7 It is a schematic diagram of the structure of the driving assembly of the present invention;

[0029] Figure 8 This is a schematic diagram of the isolated voltage regulating power supply circuit of the present invention;

[0030] Fig. 9 is a schematic diagram of a microprocessor of the present invention;

[0031] Fig.10It is a partial circuit schematic diagram of the present invention;

[0032] Fig.11 A control circuit diagram of a microprocessor of the present invention;

[0033] Fig.12 It is a structural schematic diagram of the central processing unit component of the present invention;

[0034] Fig.13 It is a structural schematic diagram of the video output component of the present invention;

[0035] Fig.14 The interface filter circuit diagram of the present invention;

[0036] Fig.15 For the present invention Fig.14 Equivalent circuit diagram of

[0037] Fig.16 A circuit diagram of a video signal line transmission circuit in a central processing unit and a video output board of the present invention;

[0038] Fig.17 It is a structural schematic diagram of the ferrite high magnetic permeability wiring assembly of the present invention;

[0039] Fig.18 This is the circuit wiring diagram of the present invention (in the figure, a is a protective grounding wire, b is a mains network line, c is a 12V working voltage line - grounding, d is a 5V working voltage line - floating isolation, e is a constant current power supply line, f is a microprocessor signal line, g is a high-frequency video signal line, and h is an external input signal line). DETAILED DESCRIPTION

[0040] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0041] Reference Figure 1-Figure 18 The present specific implementation adopts the following technical scheme: a fluorescent camera system, including a filter, a switching power supply, a central processing unit, a video output board, a camera, a display, a light source driver board, a microprocessor, a constant current board and a laser chip. The 220V power input end is connected to the filter, and the filter is respectively connected to the central processing unit, the video output board, the light source driver board and the constant current board through the switching power supply. The central processing unit is respectively connected to the video output board and the camera, the video output board is connected to the display, the light source driver board is respectively connected to the microprocessor and the constant current board, and the constant current board is connected to the laser chip.

[0042] The fluorescent camera system also includes a fluorescent camera host, which includes a drive component 2, a microprocessor 3, a central processing unit component 4, a switching power supply 5, a video output component 6, a fan 7, a ferrite magnetic ring module 8 and a filter 9 arranged in a casing 1, and a switch USB port 10, a keyboard USB port 11, a USB reading port 12 and a video input interface 13 are arranged on a side panel of the casing 1.

[0043] The housing 1 includes a frame 101, a shell 102 and a heat dissipation hole 103. The shell 102 is inserted into the frame 101. The frame 101 and the shell 102 are both provided with heat dissipation holes 103. The hole spacing of the heat dissipation holes 103 is twice the gap between the frame 101 and the shell 102. A fan 7 is provided inside the heat dissipation hole 103. The size of the heat dissipation hole 103 meets the requirements of the new version of the mandatory safety standard GB9706.1 to be implemented in 2023, and the hole spacing of the heat dissipation hole 103 meets the risk management requirements of twice the gap between the frame 101 and the shell 102. The purpose is to prevent the intrusion of fingers or foreign objects into the host, resulting in damage to the instrument and personnel safety risks, and to improve the fire protection level of the instrument to ensure the stability of the medical instrument. When designing the heat dissipation holes, the intensity in the horizontal and vertical directions is different according to different radiation frequencies and wavelengths, and targeted adjustments are also made in the arrangement of the inner and outer layer holes. To ensure compliance with electromagnetic compatibility, both radiation emission and radiation anti-interference intensity are improved, thereby improving instrument stability and protecting other instruments from interference.

[0044] The outer shell will reduce the heat dissipation effect of the instrument according to the new version of the mandatory safety specification to ensure the thermal stability of the system. The arrangement position of the fan 7 on the rack 101, and the position, direction, volume and material of each module are comprehensively improved to obtain a good heat dissipation duct, which passes through the main heat source and heat sensitive module of the instrument, without increasing the noise decibel on the basis of ensuring the thermal stability of the instrument.

[0045] The driving assembly 2 includes a driving board 201, a constant current board 202, a thermally conductive flexible material 203 and a thermally conductive semiconductor 204. A plurality of constant current boards 202 are plugged into the driving board 201. The thermally conductive flexible material 203 is arranged on the constant current board 202. The thermally conductive semiconductor 204 is arranged outside the thermally conductive flexible material 203. The constant current board 202 is arranged vertically. The driving board 201 is a power ground for access to protective grounding. The line flows through a large current, and the low access power can ensure the stability of the zero level of the ground line. Among them, the driving board 201 also bears the power supply function of the back-end microprocessor. Due to the different powers of the driving board 201 and the microprocessor 3, different treatment methods are made for the grounding methods of the two during design.

[0046] The constant current plate 202 is the main heat source, and the heat generated is conducted to the heating surface of the heat-conducting semiconductor 204 by the heat-conducting flexible material 203. The heat-conducting semiconductor 204 conducts the heat to the other side in one direction. The air duct is designed to allow the air duct to pass through the heat-conducting semiconductor 204 to take away the heat. Each constant current plate 202 is placed vertically, with sufficient heat dissipation capacity and no reduction in electrical conversion efficiency, thereby ensuring the thermal stability of the constant current plate.

[0047] The constant current plate 202 is connected to the driver board 201 by plugging. The technical design is carried out from the perspective of standardization and modularization to complete the compatibility design and iteration of various handles. According to the power of the laser light source in the handle, any number of standard constant current plates 202 can be added or reduced, greatly reducing the R&D cost and production cost.

[0048] The microprocessor 3 is a floating ground. The microprocessor 3 is used to control the constant current plate 202, identify the button signal of the external camera component, and power the LED indicator of the external camera component. The above requirements are all small current signals, which are easily disturbed, and are used as a floating ground to ensure the stability of this part. The first magnetic bead L1 and the second magnetic bead L2 are connected in series at the power supply port of the microprocessor 3 to prevent the high-frequency clock signal in the microprocessor from spatially coupling or conducting to the floating power supply wire between the microprocessor 3 and the drive component 2, generating differential mode radiation; to prevent external radiation coupling to the floating power supply wire between the microprocessor 3 and the drive component 2, and to conduct to the microprocessor.

[0049] The driver board 201 is provided with an isolated voltage-regulating power supply circuit. The first capacitor C1, the differential mode filter inductor LDM1, and the second capacitor C2 of the isolated voltage-regulating power supply circuit are equivalent to a third-order π-type low-pass filter, which is used to remove the common-mode radiation current and ripple caused by the large current carried by the front-end driver board 201, so as to achieve the purpose of stabilizing the DC. A safety capacitor CY1 is connected across the signal ground DGND and the power ground GND of the back-end microprocessor to absorb high-voltage interference during the electromagnetic compatibility test and the anti-interference test; the DC-DC isolated voltage-regulating chip U1 is equivalent to the integration of the AC inverter, transformer, and filter rectifier, so as to provide a stable and continuous power supply for the microprocessor.

[0050] Microprocessor 3 has the functions of clock signal supply, data transmission, key signal reception, LED drive signal transmission, constant current module relay on-off control, PWM waveform control, etc. Because the number of handle transmission line signals is limited, in order to achieve the function with the minimum number of wires and extremely high electromagnetic compatibility stability, a targeted design is made on the microprocessor.

[0051] The microprocessor 3 adopts a LED drive control dedicated chip U2 with a key scanning interface. The LED drive control dedicated chip U2 has two serial interfaces CLK and DAT. CLK is a data clock input interface, and DAT is a data input and output interface. When DAT is in input mode, the key scan data is transmitted to the microprocessor through the data transmission interface; the key scan is processed by the microprocessor software; when DAT is in input mode, the microprocessor sends data to the LED drive chip to realize LED drive control.

[0052] After driving the LED driver control dedicated chip U2, multiple and fixed analog signal lines susceptible to interference are reduced to only two scalable and compatible digital signal lines. Common mode filters are connected in series on the digital signal lines to ensure the stability of the transmission signal.

[0053] The handle is identified by the DAT terminal of the microprocessor 3, and the relay is controlled by the PB terminal to achieve the adaptation of the number and type of constant current plates 202 required by different laser chips. By changing the constant current plate, the compatibility of various handles and the technical issues of iterative upgrades can be achieved. The PB terminal controls the number and type of relays, and the EN terminal controls the output current of the constant current plate to adjust the optical power of the laser transmitter.

[0054] The central processing unit component 4 and the video output component 6 jointly realize the functions of video processing and transmission in the fluorescent camera system host. After the camera is powered on, the collected image signal is transmitted to the central processing unit, and the video output board receives the processed video signal from the central processing unit and converts it into the video format required by the display.

[0055] The CPU assembly 4 includes a CPU 401, a CPU shielding heat dissipation shell 402, a thermally conductive flexible material 203, a CPU heat dissipation block 403, and a stud 404. The CPU 401 is fixed to the CPU shielding heat dissipation shell 402 through the stud 404. The CPU shielding heat dissipation shell 402 is provided with a thermally conductive flexible material 203 and a CPU heat dissipation block 403 in sequence. The CPU 401 generates heat during operation, which is transferred into the CPU heat dissipation block 403 through the CPU shielding heat dissipation shell 402 and the thermally conductive flexible material 203. The heat is dissipated outwards by the designed action air duct to prevent the CPU 401 from reducing the chip frequency due to excessive heat, thereby ensuring the thermal stability of the CPU 401.

[0056] The CPU 401 generates high-frequency clock frequency and high-frequency video signal frequency when working, and generates electromagnetic wave interference emission in the vertical direction, which will reduce the electromagnetic compatibility of the whole system. The CPU shielding heat dissipation shell 402 is used to shield and absorb the vertical electromagnetic wave interference emission, and discharge it into the protective grounding of the rack 101 through the stud 404, so as to ensure the stability of the transmission signal and electromagnetic compatibility.

[0057] The video output assembly 6 comprises a video output board 601, a shielding heat dissipation shell 602 of the video output board, a thermally conductive flexible material 203 and a heat dissipation block 603 of the video output board. The video output board 601 is provided with the shielding heat dissipation shell 602, the thermally conductive flexible material 203 and the heat dissipation block 603 of the video output board in sequence. The video output board 601 generates heat during operation, which is transferred into the heat dissipation block 603 of the video output board through the shielding heat dissipation shell 602 of the video output board and the thermally conductive flexible material 203. The heat is dissipated outwardly through the designed air duct, so as to prevent the video output board 601 from causing chip frequency reduction due to excessive heat, thereby ensuring the stability of the video output board 601.

[0058] The video output board 601 generates high-frequency clock frequency and high-frequency video signal frequency when working, and generates electromagnetic wave interference emission in the vertical direction, resulting in a decrease in the electromagnetic compatibility of the entire system. The video output board heat sink 603 is used to shield and absorb the vertical electromagnetic wave interference emission and discharge it into the protective grounding of the rack 101, thereby ensuring the stability of the transmission signal and electromagnetic compatibility.

[0059] The power supply of the central processing unit 401 and the video output board 601 is protective grounding, and an interface filter circuit is provided at the power supply interface to prevent the radiation conduction of the large current of the driver board from entering the video signal. The interface filter circuit adopts a 5th-order LC filter L3, and the B port and PSG port of the 5th-order LC filter L3 are connected to the switching power supply 5, and the CB port and CG port output power to the central processing unit 401 and the video output board 601; in the equivalent circuit of the 5th-order LC filter L3, the seventh inductor L7, the eighth inductor L8, and the fourth capacitor C4 are equivalent to form a common mode filter, and the ninth inductor L9 and the fifth capacitor C5 form an LC low-pass filter, which together form a fifth-order low-pass filter. Reduce the ripple intensity in the DC and weaken the radiation interference entering the power supply line due to spatial interference coupling. At the same time, prevent the high-frequency clock signal and EMI radiation conduction in the central processing unit 401 and the video output board 601 from entering other modules or entering the mains network.

[0060] Although the power ground of the driver board 201 and the grounds of the central processing unit 401 and the video output board 601 are all connected to the casing for protective grounding (common ground), because the casing is a large area of ​​conductive material, the casing has a strong radiation discharge capability based on the skin effect, thereby ensuring the stability of the zero potential of the two different common grounds.

[0061] During the transmission of the video signal line between the central processor 401 and the video output board 601, the signal is transmitted to the common mode filter U3 at the interface of the image output board. The purpose of the series inductor is to prevent bidirectional high-frequency interference, and the purpose of the common mode filter is to filter out the CPU high-frequency clock signal other than the video signal frequency, so as to prevent the external screen and the screen data line (DVI, HDMI) from becoming an antenna. The purpose of the ESD protector is to prevent the electrostatic test in the electromagnetic compatibility from black screen flickering, and effectively filter and discharge to the ground.

[0062] The ferrite ring module 8 includes a ferrite ring 801, a conductive flexible material 802 and a ferrite ring fixing part 803. The conductive flexible material 802 is arranged between the ferrite ring 801 and the ferrite ring fixing part 803 to fill the gap between the two. The ferrite ring 801 passes through the mains network and the whole machine working voltage line to prevent external high-frequency interference from being conducted into the host and to prevent the high-frequency clock signal frequency and high-frequency data signal frequency inside the host from being conducted into the mains network.

[0063] The ferrite magnetic ring fixing part 803 and the conductive flexible material 802 together fix the ferrite magnetic ring 801, and because the material with good conductive performance is used, the shielding absorption efficiency can be improved.

[0064] When current flows through the ferrite ring 801 and the ferrite ring fixing part 803 is at zero level, a monopole antenna will be formed due to the gap, and high-frequency radiation will be transmitted outward, resulting in a decrease in system stability. The conductive flexible material 802 is located between the ferrite ring 801 and the ferrite ring fixing part 803 to fill the gap between the two.

[0065] The 220V voltage high-voltage line of the mains network of this specific implementation method avoids other wiring inside the chassis to prevent common-mode interference radiation of the high-voltage circuit. At the same time, the line length is shortened to prevent the formation of a loop antenna due to excessive length and generate radiation emission; the protective grounding line passes through the ferrite magnetic ring and is short and straight to the chassis bottom plate. Due to the skin effect, the high-frequency radiation and high-voltage radiation generated by the internal module of the camera are discharged into the ground through extremely low impedance. This has a strong weakening effect on the broadband radiation of electromagnetic compatibility in the high-frequency signal, ensuring the stability and reliability of the protective grounding of the whole machine; the DC power supply part and the high-frequency data signal do not intersect, ensuring that the high frequency and low frequency do not affect each other, and improving the stability of electromagnetic compatibility; the high voltage 220V of the network and the working voltage 12V of the whole machine are separated, which can prevent the clock signal or data signal of the host from entering the mains network through transmission or spatial coupling, and prevent the mains network from interfering with the host control and power supply part; the 12V working voltage line and the 5V working voltage line are isolated and kept away to ensure the stable operation of the microprocessor and the control accuracy of the external light source.

[0066] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A fluorescence imaging system, characterized in that: The invention comprises a filter, a switching power supply, a central processing unit, a video output board, a camera, a display, a light source driving board, a microprocessor, a constant current board and a laser chip, wherein a 220V power input end is connected to the filter, the filter is respectively connected to the central processing unit, the video output board, the light source driving board and the constant current board through the switching power supply, the central processing unit is respectively connected to the video output board and the camera, the video output board is connected to the display, the light source driving board is respectively connected to the microprocessor and the constant current board, and the constant current board is connected to the laser chip; and further comprises a fluorescent camera host, wherein the fluorescent camera host comprises a driving component (2), a microprocessor (3), a central processing unit component (4), a switching power supply (5), a video output component (6), a fan (7), a ferrite magnetic ring module (8) and a filter (9) arranged in a housing (1), and a switch USB port (10), a keyboard USB port (11), a USB reading port (12) and a video input interface (13) are arranged on a side panel of the housing (1); The driving component (2) comprises a driving board (201), a constant current board (202), a thermally conductive flexible material (203) and a thermally conductive semiconductor (204); a plurality of constant current boards (202) are plugged into the driving board (201); a thermally conductive flexible material (203) is arranged on the constant current board (202); a thermally conductive semiconductor (204) is arranged outside the thermally conductive flexible material (203); and the constant current board (202) is arranged vertically; the driving board (201) is connected to a power ground for protective grounding; an isolated voltage regulating power supply circuit is arranged on the driving board (201); and an isolated voltage regulating circuit is arranged on the driving board (201). The first capacitor (C1), the differential mode filter inductor (LDM1) and the second capacitor (C2) of the voltage power supply circuit are equivalent to a third-order π-type low-pass filter, which is used to remove the common-mode radiation current and ripple caused by the large current carried by the front-end driving board (201), so as to achieve the purpose of stabilizing the direct current; a safety capacitor (CY1) is connected across the signal ground DGND and the power ground GND of the back-end microprocessor, which is used to absorb high-voltage interference during electromagnetic compatibility testing and anti-interference testing; the DC-DC isolation voltage regulator chip (U1) is equivalent to the integration of an AC inverter, a transformer and a filter rectifier.

2. A fluorescence imaging system according to claim 1, characterized in that: The housing (1) comprises a frame (101), an outer shell (102) and a heat dissipation hole (103); the outer shell (102) is inserted into the frame (101); the frame (101) and the outer shell (102) are both provided with heat dissipation holes (103); the hole spacing of the heat dissipation holes (103) is twice the gap between the frame (101) and the outer shell (102); and a fan (7) is provided inside the heat dissipation hole (103).

3. A fluorescence imaging system according to claim 1, characterized in that: The microprocessor (3) is floating, and the microprocessor (3) is used to control the constant current board (202), identify the key signal of the external camera component, and supply power to the LED indicator light of the external camera component; a first magnetic bead (L1) and a second magnetic bead (L2) are connected in series at the power supply port of the microprocessor (3) to prevent the spatial coupling of the high-frequency clock signal in the microprocessor and the generation of differential mode radiation; and to prevent the coupling of external radiation to the floating power supply wire between the microprocessor (3) and the drive component (2) and the microprocessor through conduction.

4. A fluorescence imaging system according to claim 1, characterized in that: The microprocessor (3) adopts a dedicated LED drive control chip (U2) with a key scan interface. The dedicated LED drive control chip (U2) has two serial interfaces CLK and DAT. CLK is a data clock input interface, and DAT is a data input and output interface. When DAT is in input mode, the key scan data is transmitted to the microprocessor through the data transmission interface. The key scan is processed by the microprocessor software. When DAT is in input mode, the microprocessor sends data to the LED drive chip to realize LED drive control.

5. A fluorescence imaging system according to claim 1, characterized in that: The central processing unit component (4) and the video output component (6) jointly realize the functions of video processing and transmission in the host of the fluorescent camera system; after the camera is powered on, the collected image signal is transmitted to the central processing unit, and the video output board receives the processed video signal from the central processing unit and converts it into the video format required by the display.

6. A fluorescence imaging system according to claim 1, characterized in that: The central processing unit component (4) comprises a central processing unit (401), a central processing unit shielding heat dissipation shell (402), a thermally conductive flexible material (203), a central processing unit heat dissipation block (403), and a stud (404); the central processing unit (401) is fixed to the central processing unit shielding heat dissipation shell (402) by the stud (404); the central processing unit shielding heat dissipation shell (402) is provided with a thermally conductive flexible material (203) and a central processing unit heat dissipation block (403) in sequence; the central processing unit (401) generates heat during operation, which is transferred to the central processing unit heat dissipation block (403) through the central processing unit shielding heat dissipation shell (402) and the thermally conductive flexible material (203); the video output component ( 6) comprising a video output board (601), a video output board shielding heat dissipation shell (602), a thermally conductive flexible material (203) and a video output board heat dissipation block (603); the video output board (601) is provided with the video output board shielding heat dissipation shell (602), the thermally conductive flexible material (203) and the video output board heat dissipation block (603) in sequence; the video output board (601) generates heat during operation, which is transferred into the video output board heat dissipation block (603) through the video output board shielding heat dissipation shell (602) and the thermally conductive flexible material (203); the heat is dissipated outwards through a designed air duct, so as to prevent the video output board (601) from causing a chip frequency reduction due to excessive heat, thereby ensuring the stability of the video output board (601).

7. A fluorescence imaging system according to claim 6, characterized in that: The power supply of the central processing unit (401) and the video output board (601) is protective grounding, an interface filter circuit is arranged at the power supply interface, the interface filter circuit adopts a fifth-order LC filter (L3), the B port and the PSG port of the fifth-order LC filter (L3) are connected to the switching power supply (5), and the CB port and the CG port output power to the central processing unit (401) and the video output board (601); in the equivalent circuit of the fifth-order LC filter (L3), the seventh inductor (L7), the eighth inductor (L8), and the fourth capacitor (C4) equivalently form a common mode filter, and the ninth inductor (L9) and the fifth capacitor (C5) form an LC low-pass filter, which together form a fifth-order low-pass filter.

8. A fluorescence imaging system according to claim 6, characterized in that: During the transmission of the video signal line between the central processor (401) and the video output board (601), the signal is transmitted to the common mode filter (U3) at the interface of the image output board.

9. A fluorescence imaging system according to claim 1, characterized in that: The ferrite magnetic ring module (8) comprises a ferrite magnetic ring (801), a conductive flexible material (802) and a ferrite magnetic ring fixing piece (803), wherein the conductive flexible material (802) is arranged between the ferrite magnetic ring (801) and the ferrite magnetic ring fixing piece (803) to fill the gap between the two.

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