Vehicle thermal management system, vehicle

Abstract

The present invention relates to the field of thermal management technology for vehicles, and specifically provides a whole vehicle thermal management system and a vehicle, wherein the whole vehicle thermal management system includes a whole vehicle domain controller, a thermal management domain controller, a first thermal management unit, and a second thermal management unit, wherein the whole vehicle domain controller is communicatively connected to the thermal management domain controller, the first / second thermal management unit includes a plurality of first / second thermal management components and a refrigerant / coolant flow channel plate, wherein a plurality of refrigerant / coolant circulation circuits are formed in the refrigerant / coolant flow channel plate, and the first / second thermal management components having a connection relationship are connected to each other through corresponding refrigerant / coolant circulation circuits; wherein the first thermal management component includes an electronic expansion valve and / or an electronic refrigerant valve, and at least a portion of the coils of the electronic expansion valve and / or the electronic refrigerant valve are arranged near the thermal management domain controller. Through such a structure, it is possible to seek to highly integrate the whole vehicle thermal management system.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal management of vehicles, and specifically provides a whole vehicle thermal management system and a vehicle. Background Art

[0002] A car's air conditioning system primarily provides cooling and heating to the passenger compartment. It primarily consists of a refrigerant (coolant) circuit consisting of a compressor, condenser, throttling element, and evaporator. There are two ways to provide cooling and heating to the passenger compartment: one in which both cooling and heating are achieved through the refrigerant circuit, and the other in which only cooling is achieved through the refrigerant circuit, while heat is distributed to the cabin through PTC heating, installed in an air conditioning unit connected to the cabin.

[0003] With the development of electric vehicles, there is a growing need to cool heat-generating components such as motors and to heat or cool the power battery to maintain a certain temperature range in order to improve its range. To ensure that cooling and heat can be exchanged throughout the vehicle, functions related to heat / cooling are integrated into a vehicle thermal management system. For example, a vehicle thermal management system typically includes a refrigerant circulation loop, a coolant circulation loop, and a heat exchanger that allows heat exchange between the two. Current thermal management systems exhibit varying degrees of single-piece design and decentralized layout. This often results in an increase in air conditioning piping, cooling lines, and vehicle wiring harnesses, which inevitably reduces space utilization in the front cabin of electric vehicles. Therefore, improving the integration of vehicle thermal management systems is an urgent issue. Alternatively, there is still room for improvement in how to further enhance the integration of vehicle thermal management systems.

[0004] Accordingly, this field requires a new technical solution to solve the above problems. Summary of the Invention

[0005] The present invention is proposed to solve the above technical problems at least to a certain extent.

[0006] In a first aspect, the present invention provides a whole vehicle thermal management system, comprising a whole vehicle domain controller, a thermal management domain controller, a first thermal management part whose circulating medium is refrigerant, and a second thermal management part whose circulating medium is coolant, the whole vehicle domain controller is communicatively connected to the thermal management domain controller, wherein the first thermal management part comprises a plurality of first thermal management components and a refrigerant flow channel plate, a plurality of refrigerant flow circuits are formed in the refrigerant flow channel plate, and the first thermal management components with a connection relationship are connected to each other through corresponding refrigerant flow circuits; wherein the second thermal management part comprises a plurality of second thermal management components and a coolant flow channel plate, a plurality of coolant flow circuits are formed in the coolant flow channel plate, and the second thermal management components with a connection relationship are connected to each other through corresponding coolant flow circuits; wherein the first thermal management component comprises an electronic expansion valve and / or an electronic refrigerant valve, and at least a part of the coils of the electronic expansion valve and / or the electronic refrigerant valve are arranged at a position close to the thermal management domain controller.

[0007] With this configuration, it is possible to integrate the thermal management system.

[0008] It is understood that those skilled in the art can determine the specific configuration of the first / second thermal management components and the specific principles for meeting the corresponding thermal management requirements based on actual needs. Accordingly, those skilled in the art can determine the specific layout of the refrigerant / coolant circulation circuit in the refrigerant / coolant flow channel plate and the specific connection method between the relevant first / second thermal management components and the refrigerant / coolant circulation circuit based on actual needs.

[0009] By arranging the coil of the electronic expansion valve and / or electronic refrigerant valve close to the controller and by integrating the controller with the coil of the electronic expansion valve and / or electronic refrigerant valve nearby, not only can the connection wiring harness be saved to the greatest extent, but the control accuracy and stability of the electronic expansion valve and / or electronic refrigerant valve can be maintained at the same level as the performance of the valve.

[0010] It is understood that those skilled in the art can determine the degree of proximity and the manner of proximity based on actual needs. For example, the coils of the electronic expansion valve and / or electronic refrigerant valve can be connected to the existing structure of the controller, or an intermediate structure can be added to connect the controller and the coils of the electronic expansion valve and / or electronic refrigerant valve to achieve proximity integration.

[0011] It is understandable that those skilled in the art can determine the number of electronic expansion valves and / or electronic refrigerant valves to be integrated close to the controller and their specific functions in the first thermal management unit according to actual needs. In other words, those skilled in the art can integrate all or part of the electronic expansion valves and / or electronic refrigerant valves close to the controller according to actual needs. For example, it can be: in the thermal management system of the whole vehicle based on the first schematic diagram, the first thermal management unit includes M electronic expansion valves and / or electronic refrigerant valves, and the coils of the M valves are all integrated close to the controller; in the thermal management system of the whole vehicle based on the second schematic diagram, the first thermal management unit includes N electronic expansion valves and / or electronic refrigerant valves, and the coils of a part of the N valves are integrated close to the controller; etc.

[0012] For the above-mentioned vehicle thermal management system, in one possible embodiment, the second thermal management component includes a first water pump and a second water pump, the vehicle thermal management system includes a power supply A and a power supply B, the thermal management domain controller includes a main MCU, and the vehicle domain controller includes controlling the power supply A and / or power supply B to supply power to the main MCU, and thereby supply power to the first water pump and / or the second water pump.

[0013] This configuration ensures reliable operation of the vehicle's thermal management system through a redundant dual power supply design.

[0014] For the above-mentioned vehicle thermal management system, in one possible implementation, the vehicle domain controller includes a first CAN transceiver, the thermal management domain controller includes a second CAN transceiver, the first CAN transceiver and the second CAN transceiver are communicatively connected, the second CAN transceiver is communicatively connected to the main MCU, and the main MCU is communicatively connected to the first water pump and the second water pump respectively.

[0015] With this configuration, the main MCU can control driving of the first water pump and the second water pump.

[0016] For the above-mentioned vehicle thermal management system, in a possible implementation, the thermal management domain controller includes a LIN transceiver that is communicatively connected to the main MCU, and the thermal management domain controller also includes a first function MCU and a second function MCU. The LIN transceiver can communicate with the first function MCU and the second function MCU respectively. The first function MCU is hard-wired to the first water pump, and the second function MCU is hard-wired to the second water pump.

[0017] With this configuration, it is possible to separately drive and control the first water pump and the second water pump using two functional MCUs (with pre-drivers integrated).

[0018] For the above-mentioned vehicle thermal management system, in one possible implementation, the thermal management domain controller includes a power selection circuit, which is configured to: when both power supply A and power supply B are valid, select one of them to supply power to the main MCU, and the power supply A and the power supply B respectively supply power to the second water pump and the first water pump.

[0019] This configuration provides a power supply method when both power source A and power source B are effective.

[0020] For the above-mentioned vehicle thermal management system, in one possible implementation, the thermal management domain controller includes a power management circuit configured on the power supply A, and the power management circuit is configured so that: in the event that the power supply B fails, the power supply A supplies power to the main MCU so that: the main MCU closes the switch of the power management circuit and powers on, thereby: enabling the power supply A to supply power to the first water pump and the second water pump.

[0021] With this configuration, a power supply mode is provided in the event that power source B fails.

[0022] For the above-mentioned vehicle thermal management system, in a possible implementation manner, the power supply B is connected to the first water pump so that: in the event that the power supply A fails, the power supply B supplies power to the main MCU and to the first water pump.

[0023] With this configuration, a power supply mode is provided in the event that power source A fails.

[0024] For the above-mentioned vehicle thermal management system, in a possible implementation manner, the refrigerant flow channel plate and the coolant flow channel plate are connected to each other, and the controller is fixed to the refrigerant flow channel plate and / or the coolant flow channel plate.

[0025] Through such a structure, a specific connection method of the vehicle thermal management system after integration is given.

[0026] For the above-mentioned vehicle thermal management system, in a possible implementation manner, the refrigerant flow channel plate and the coolant flow channel plate are connected to each other through multiple connection points along a thickness direction close to each other.

[0027] Through such a structure, a specific connection method between the refrigerant flow channel plate and the coolant flow channel plate is provided.

[0028] For the above-mentioned vehicle thermal management system, in one possible embodiment, the refrigerant flow channel plate includes a refrigerant main body part and a refrigerant cover plate part, and the refrigerant circulation circuit is formed between the refrigerant main body part and the refrigerant cover plate part; and / or the coolant flow channel plate includes a coolant main body part and a coolant cover plate part, and the coolant main body part and the coolant cover plate part form the coolant circulation circuit.

[0029] Through such a configuration, a specific structural mode of the refrigerant / coolant flow channel plate is provided.

[0030] It is understood that those skilled in the art can determine the specific configuration of the circulation circuit according to actual circumstances. For example, a partial groove (half groove) is provided on the main body and the cover, and the two half grooves are buckled to form a corresponding channel.

[0031] It is understandable that those skilled in the art can determine the material, structure, number and connection relationship between the refrigerant / coolant (main body, cover plate) parts according to actual needs.

[0032] For the above-mentioned vehicle thermal management system, in one possible embodiment, the refrigerant main body is formed with a refrigerant flow channel corresponding to the refrigerant circulation circuit, and the refrigerant cover plate covers the refrigerant flow channel; and / or the coolant main body is formed with a coolant flow channel corresponding to the coolant circulation circuit, and the coolant cover plate covers the coolant flow channel.

[0033] Through such a configuration, a specific structural mode of the refrigerant / coolant flow channel is provided.

[0034] For the above-mentioned vehicle thermal management system, in one possible embodiment, the refrigerant flow channel plate is provided with a refrigerant flow channel opening at a position where it needs to be docked with the first thermal management component, so that: after the first thermal management component with a connection relationship is docked with the refrigerant flow channel plate via the refrigerant flow channel opening, they are connected to each other through the corresponding refrigerant circulation circuit; and / or the coolant flow channel plate is provided with a coolant flow channel opening at a position where it needs to be docked with the second thermal management component, so that: after the second thermal management component with a connection relationship is docked with the coolant flow channel plate via the coolant flow channel opening, they are connected to each other through the corresponding coolant circulation circuit.

[0035] Through such a structure, a specific connection method between the first / second thermal management component and the refrigerant / coolant flow channel plate is provided.

[0036] For the above-mentioned vehicle thermal management system, in one possible embodiment, the first thermal management component is sealed to the refrigerant flow channel plate at a position corresponding to the refrigerant flow channel opening; and / or the second thermal management component is sealed to the coolant flow channel plate at a position corresponding to the coolant flow channel opening.

[0037] Through such a structure, a specific connection mode is provided between the first / second thermal management component and the refrigerant / coolant flow channel outlet and the refrigerant / coolant flow channel plate.

[0038] For the above-mentioned vehicle thermal management system, in one possible embodiment, the first thermal management component includes an internal heat exchanger, which includes a first refrigerant passage corresponding to the high-pressure part on the downstream side of the condenser and a second refrigerant passage corresponding to the low-pressure refrigerant on the downstream side of the evaporator, wherein the first refrigerant passage and the second refrigerant passage are both formed in the refrigerant flow channel plate and both have walls that can transfer heat.

[0039] Through such a structure, deep integration of the vehicle thermal management system is achieved by modifying the first thermal management component itself.

[0040] For the above-mentioned vehicle thermal management system, in one possible embodiment, the controller is a thermal management domain controller, which includes a PCBA board, and the coils of the electronic expansion valve and / or electronic refrigerant valve are integrated with the controller in a manner close to the PCBA board.

[0041] This configuration provides a specific implementation method for controlling the proximity of the coils of an electronic expansion valve and / or electronic refrigerant valve. It will be appreciated that those skilled in the art can determine the specific structure and degree of proximity required to achieve proximity based on actual needs. For example, an intermediate structure is configured adjacent to the PCBA board, and the coils of the electronic expansion valve and / or electronic refrigerant valve are positioned on this intermediate structure.

[0042] For the above-mentioned vehicle thermal management system, in one possible implementation, the controller includes a housing, and the coil of the electronic expansion valve and / or electronic refrigerant valve and the PCBA board are all arranged in the housing.

[0043] Through such a configuration, a specific structural form of thermal management domain controller participating in integration is given.

[0044] In a second aspect, the present invention provides a vehicle comprising any one of the vehicle thermal management systems described above.

[0045] It can be understood that the vehicle has all the technical effects of the vehicle thermal management system described in any of the above items, which will not be repeated here.

[0046] Proposal 1. A vehicle thermal management system, characterized in that the vehicle thermal management system includes a vehicle domain controller, a thermal management domain controller, a first thermal management unit whose circulating medium is a refrigerant, and a second thermal management unit whose circulating medium is a coolant, wherein the vehicle domain controller is in communication with the thermal management domain controller.

[0047] The first thermal management unit includes a plurality of first thermal management components and a refrigerant flow channel plate, wherein a plurality of refrigerant circulation circuits are formed in the refrigerant flow channel plate, and the first thermal management components having a connection relationship are connected to each other through corresponding refrigerant circulation circuits;

[0048] The second thermal management unit includes a plurality of second thermal management components and a coolant flow channel plate, wherein a plurality of coolant circulation loops are formed in the coolant flow channel plate, and the second thermal management components having a connection relationship are connected to each other through the corresponding coolant circulation loops;

[0049] The first thermal management component includes an electronic expansion valve and / or an electronic refrigerant valve, and at least a portion of the coils of the electronic expansion valve and / or the electronic refrigerant valve are arranged near the thermal management domain controller.

[0050] Proposal 2. The vehicle thermal management system according to Proposal 1 is characterized in that the second thermal management component includes a first water pump and a second water pump, the vehicle thermal management system includes power supply A and power supply B, and the thermal management domain controller includes a main MCU.

[0051] The vehicle domain controller can control the power supply A and / or the power supply B to supply power to the main MCU, and thereby supply power to the first water pump and / or the second water pump.

[0052] Proposal 3. The vehicle thermal management system according to Proposal 2 is characterized in that the vehicle domain controller includes a first CAN transceiver, the thermal management domain controller includes a second CAN transceiver, the first CAN transceiver and the second CAN transceiver are communicatively connected, and the second CAN transceiver is communicatively connected to the main MCU.

[0053] The main MCU is communicatively connected to the first water pump and the second water pump respectively.

[0054] Proposal 4. The vehicle thermal management system according to Proposal 3 is characterized in that the thermal management domain controller includes a LIN transceiver that is communicatively connected to the main MCU,

[0055] The thermal management domain controller also includes a first function MCU and a second function MCU. The LIN transceiver can communicate with the first function MCU and the second function MCU respectively. The first function MCU is hard-wired to the first water pump, and the second function MCU is hard-wired to the second water pump.

[0056] Proposal 5. The vehicle thermal management system according to any one of Proposals 2 to 4, wherein the thermal management domain controller includes a power selection circuit configured to:

[0057] When both power supply A and power supply B are valid, one of them is selected to supply power to the main MCU, and

[0058] The power supply A and the power supply B respectively supply power to the second water pump and the first water pump.

[0059] Proposal 6. The vehicle thermal management system according to Proposal 5, characterized in that the thermal management domain controller includes a power management circuit configured in the power supply A, and the power management circuit is configured to:

[0060] In the event that the power supply B fails, the power supply A supplies power to the main MCU so that: the main MCU closes the switch of the power management circuit and powers on, thereby:

[0061] The power supply A is enabled to supply power to the first water pump and the second water pump.

[0062] With this configuration, a power supply mode is provided in the event that power source B fails.

[0063] Proposal 7. The vehicle thermal management system according to Proposal 5, wherein the power source B is connected to the first water pump so as to:

[0064] In the event that the power supply A fails, the power supply B supplies power to the main MCU and to the first water pump.

[0065] Proposal 8. The vehicle thermal management system according to Proposal 1 is characterized in that the refrigerant flow channel plate and the coolant flow channel plate are connected to each other, and the thermal management domain controller is fixed to the refrigerant flow channel plate and / or the coolant flow channel plate.

[0066] Proposal 9. The vehicle thermal management system according to Proposal 8 is characterized in that the refrigerant flow channel plate and the coolant flow channel plate are connected to each other through multiple points along the thickness direction close to each other.

[0067] Proposal 10. The vehicle thermal management system according to Proposal 1 is characterized in that the refrigerant flow channel plate includes a refrigerant main portion and a refrigerant cover portion, and the refrigerant circulation circuit is formed between the refrigerant main portion and the refrigerant cover portion; and / or

[0068] The coolant flow channel plate includes a coolant main body portion and a coolant cover plate portion, and the coolant main body portion and the coolant cover plate portion form the coolant circulation circuit.

[0069] Proposal 11. The vehicle thermal management system according to Proposal 10, characterized in that the refrigerant main body is formed with a refrigerant flow channel corresponding to the refrigerant circulation circuit, and the refrigerant cover portion covers the refrigerant flow channel; and / or

[0070] The coolant main body portion is formed with a coolant flow channel corresponding to the coolant circulation circuit, and the coolant cover plate portion covers the coolant flow channel.

[0071] Proposal 12. The vehicle thermal management system according to Proposal 1 is characterized in that the refrigerant flow channel plate is provided with a refrigerant flow channel opening at a position where it is required to be connected to the first thermal management component, so that: after the first thermal management component, which has a connecting relationship, is connected to the refrigerant flow channel plate through the refrigerant flow channel opening, they are connected to each other through the corresponding refrigerant circulation circuit; and / or

[0072] The coolant flow channel plate is provided with a coolant flow channel opening at a position where it needs to be docked with the second thermal management component, so that: after the second thermal management component with a connection relationship is docked with the coolant flow channel plate through the coolant flow channel opening, they are connected to each other through the corresponding coolant circulation circuit.

[0073] Proposal 13. The vehicle thermal management system according to Proposal 12 is characterized in that the first thermal management component is sealed to the refrigerant flow channel plate at a position corresponding to the refrigerant flow channel opening; and / or

[0074] The second heat management component is sealed and connected to the coolant flow channel plate at a position corresponding to the coolant flow channel opening.

[0075] Proposal 14. The vehicle thermal management system according to Proposal 12, characterized in that the first thermal management component includes an internal heat exchanger, wherein the internal heat exchanger includes a first refrigerant passage corresponding to the high-pressure portion downstream of the condenser and a second refrigerant passage corresponding to the low-pressure refrigerant downstream of the evaporator.

[0076] The first refrigerant passage and the second refrigerant passage are both formed in the refrigerant flow channel plate and both have walls capable of heat transfer.

[0077] Proposal 15. The vehicle thermal management system according to Proposal 1 is characterized in that the thermal management domain controller includes a PCBA board, and the coil of the electronic expansion valve and / or electronic refrigerant valve is integrated with the thermal management domain controller in a manner close to the PCBA board.

[0078] Proposal 16. The vehicle thermal management system according to Proposal 15 is characterized in that the controller includes a shell, and the coil of the electronic expansion valve and / or electronic refrigerant valve and the PCBA board are all arranged in the shell.

[0079] Proposal 17. A vehicle, characterized in that the vehicle includes the vehicle thermal management system according to any one of Proposals 1 to 16. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] The following is a schematic diagram of a specific vehicle thermal management system ( Figure 3 ) and describe preferred embodiments of the present invention with reference to the accompanying drawings, in which:

[0081] Figure 1 A schematic structural diagram illustrating a thermal management integrated module (hereinafter referred to as the thermal management integrated module) in a vehicle thermal management system according to an embodiment of the present invention, viewed from one side (the refrigerant flow channel plate side);

[0082] Figure 2 A schematic structural diagram showing a thermal management integrated module according to an embodiment of the present invention as viewed from the other side (coolant flow channel plate side);

[0083] Figure 3 A schematic diagram showing the principle of a vehicle thermal management system based on a thermal management integrated module according to an embodiment of the present invention;

[0084] Figure 4 A schematic structural diagram of a conventional coaxial tube internal heat exchanger (referred to as coaxial tube) is shown;

[0085] Figure 5 A schematic diagram showing the structure of an internal heat exchanger in a thermal management integrated module according to an embodiment of the present invention;

[0086] Figure 6 A schematic structural diagram showing a refrigerant flow channel plate of a thermal management integrated module according to an embodiment of the present invention as viewed from one side;

[0087] Figure 7 A schematic structural diagram showing a refrigerant flow channel plate of a thermal management integrated module according to an embodiment of the present invention as viewed from the other side;

[0088] Figure 8 A schematic structural diagram showing a coolant flow channel plate of a thermal management integrated module according to an embodiment of the present invention as viewed from one side;

[0089] Figure 9 A schematic structural diagram showing a coolant flow channel plate of a thermal management integrated module according to an embodiment of the present invention as viewed from the other side;

[0090] Figure 10 A schematic structural diagram showing a thermal management domain controller and wiring harness of a thermal management integrated module according to an embodiment of the present invention viewed from one side;

[0091] Figure 11 A schematic structural diagram showing a thermal management domain controller and a wiring harness of a thermal management integrated module according to an embodiment of the present invention viewed from the other side;

[0092] Figure 12 A schematic diagram illustrating the structure of a thermal management domain controller of a thermal management integrated module according to an embodiment of the present invention;

[0093] Figure 13 An electrical block diagram showing the connection between a thermal management domain controller (hereinafter referred to as thermal management domain controller) in a thermal management integrated module and a vehicle according to an embodiment of the present invention;

[0094] Figure 14 An internal electrical block diagram of a thermal management domain controller according to an embodiment of the present invention is shown;

[0095] Figure 15 An electrical block diagram illustrating a dual power supply of a thermal management domain controller according to an embodiment of the present invention is shown;

[0096] Figure 16 A network topology diagram of a thermal management domain controller in a vehicle according to an embodiment of the present invention is shown;

[0097] Figure 17 A schematic structural diagram of a vibration isolation system of a thermal management integrated module according to an embodiment of the present invention is shown;

[0098] Figure 18 A schematic diagram showing the refrigerant flow of a thermal management integrated module in a passenger compartment cooling mode according to an embodiment of the present invention;

[0099] Figure 19 A schematic diagram showing the refrigerant flow direction of a thermal management integrated module in a power battery cooling mode according to an embodiment of the present invention;

[0100] Figure 20 A schematic diagram showing the refrigerant flow direction of a thermal management integrated module in an air source heat pump heating mode according to an embodiment of the present invention;

[0101] Figure 21 A schematic diagram showing the refrigerant flow direction of a thermal management integrated module in a waste heat recovery heat pump heating mode according to an embodiment of the present invention;

[0102] Figure 22 A schematic diagram showing the cooling liquid flow direction of a thermal management integrated module in mode 1 according to an embodiment of the present invention is shown;

[0103] Figure 23 A schematic diagram showing the cooling liquid flow direction of a thermal management integrated module in mode 2 according to an embodiment of the present invention is shown;

[0104] Figure 24 A schematic diagram showing the coolant flow direction of a thermal management integrated module in mode three according to an embodiment of the present invention;

[0105] Figure 25 A schematic diagram showing the cooling liquid flow direction of a thermal management integrated module in mode 4 according to an embodiment of the present invention;

[0106] Figure 26 A schematic diagram showing the cooling liquid flow direction of a thermal management integrated module in mode five according to an embodiment of the present invention;

[0107] Figure 27 A schematic diagram showing the cooling liquid flow direction of a thermal management integrated module in mode six according to an embodiment of the present invention;

[0108] Figure 28 A schematic diagram showing a comparison of the thermal management integrated module according to an embodiment of the present invention and a non-integrated solution in reducing the length of air conditioning pipes;

[0109] Figure 29 A schematic diagram showing a comparison of the thermal management integrated module according to an embodiment of the present invention and a non-integrated solution in reducing the cooling pipe length; and

[0110] Figure 30 A schematic diagram showing a comparison of the reduction in wiring harnesses and connectors in a thermal management integrated module according to an embodiment of the present invention compared to a non-integrated solution. DETAILED DESCRIPTION

[0111] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. For example, although the present embodiment is introduced in combination with pipelines of specific shapes and components such as compressors and heat exchangers that are arranged in clear positions to match the schematic diagram of the thermal management system, this is not intended to limit the scope of protection of the present invention. Without departing from the principles of the present invention, those skilled in the art may make reasonable changes thereto, such as integrating the relevant pipelines and components according to any schematic diagram that can realize thermal management of the entire vehicle, and changing the corresponding pipelines from broken lines to oblique lines according to actual needs, and making appropriate adjustments to the radial size / length (straight length or total length) of the pipelines, etc.

[0112] It should be noted that in the description of the present invention, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. These are merely for ease of description and do not indicate or imply that the device or element described must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0113] Furthermore, it should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "installed," "disposed," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0114] In addition, numerous specific details are provided in the following detailed description to better illustrate the present invention. Those skilled in the art will appreciate that the present invention can be practiced without some of these details. In some instances, principles of vehicle thermal management, which are well known to those skilled in the art, are not described in detail to highlight the main points of the present invention.

[0115] A vehicle thermal management system is primarily used to coordinate cooling and heating to meet vehicle-wide cooling and heating needs, such as cabin cooling / heating, motor cooling, and battery heating / cooling. Some cooling / heating is supplied through methods such as refrigerant circulation, PTC activation, and the coolant's own cooling capacity, while some heat is recovered through methods such as recycling cooling / heating from other components. By integrating some components of a vehicle's thermal management system, an integrated thermal management module is created.

[0116] As in this example, Figure 3 The shaded area in FIG. 1 is the thermal management components and management that constitute the thermal management integrated module. It is understood that those skilled in the art can adjust the components / pipelines that participate in / do not participate in the thermal management integrated module and their positions according to actual needs.

[0117] The following will refer to Figures 1 to 26 The present invention is described in whole or in part.

[0118] Main reference Figures 1 to 3In a possible implementation, the thermal management integrated module 100 mainly includes a refrigerant flow channel plate 200, a coolant flow channel plate 300, and a plurality of thermal management components constituting a thermal management system of the entire vehicle.

[0119] Among them, a plurality of (segments) of refrigerant circulation circuits 201 are formed in the refrigerant flow channel plate 200. Specifically, based on Figure 3 The schematic diagram of the vehicle thermal management system shows that when different refrigerant-side components need to be connected, this connection can be achieved through the refrigerant circulation loops 201 formed at corresponding locations on the refrigerant flow channel plate. Similarly, multiple coolant circulation loops 301 are formed in the coolant flow channel plate 300. When different coolant-side components need to be connected, this connection can be achieved through the coolant circulation loops 301 formed at corresponding locations on the coolant flow channel plate.

[0120] At the same time, the refrigerant flow channel plate 200 and the coolant flow channel plate 300 serve as the carrier (mounting carrier) of the entire thermal management integrated module 100 and can be used to share the task of installing the aforementioned multiple thermal management components. As key components of the thermal management integrated module of the present invention, the refrigerant flow channel plate 200 and the coolant flow channel plate 300 allow multiple thermal management components to be installed on the refrigerant flow channel plate 200 or the coolant flow channel plate 300 according to actual needs, under the premise that they can achieve a connection relationship consistent with the schematic diagram of the vehicle thermal management system. On this basis, the thermal management components with a connected relationship can be connected to each other through the refrigerant circulation circuit 201 or the coolant circulation circuit 301. By adjusting the installation position of each thermal management component on the refrigerant flow channel plate 200 / coolant flow channel plate 300, designing the circuits in the refrigerant flow channel plate 200 and the coolant flow channel plate 300, and connecting the circuits in the refrigerant flow channel plate 200 and the coolant flow channel plate 300 with the aforementioned compressor, external heat exchanger, and evaporator / condenser in the air-conditioning box, the same function as a dispersed vehicle thermal management system can be achieved.

[0121] It is understood that the schematic diagram of the vehicle thermal management system in this embodiment is only one possible form of a vehicle thermal management schematic diagram in actual application. In other words, the internal circuits of the refrigerant flow plate 200 and the coolant flow plate 300, the type / number of thermal management components, and their installation positions on the refrigerant flow plate or the coolant flow plate can be flexibly adjusted based on the refrigerant and coolant flow patterns in any specific schematic diagram of the vehicle thermal management system in actual application, in order to achieve vehicle-wide thermal management while ensuring the piping connections between the thermal management components.

[0122] In one possible embodiment, the refrigerant flow channel plate 200 can be made of Al material. This material can avoid refrigerant leakage, reduce its own weight, and ensure that the refrigerant flow channel plate 200 has sufficient strength, thereby improving its structural stability and durability as the main bearing component of the thermal management integrated module 100. In order to facilitate the molding of the refrigerant flow channel plate 200, a split molding method can be adopted. For example, the refrigerant flow channel plate 200 can be divided into a refrigerant main body part and a refrigerant cover plate part along its thickness direction. The refrigerant main body part forms a refrigerant circulation circuit 201 with an opening. The refrigerant main body part can be molded by processes such as hot forging, cold forging or casting. The refrigerant cover plate part can be formed by processes such as sheet metal stamping. After the main body part is formed, the refrigerant main body part and the refrigerant cover plate part are fixedly connected by welding or the like to obtain the refrigerant flow channel plate 200 of the present invention. The welding method can include but is not limited to vacuum welding, friction welding, laser welding, etc.

[0123] In one possible embodiment, the coolant flow channel plate 300 can be made of a thermal insulation material such as PP, PA66, etc. Such a material can ensure the thermal insulation performance of the coolant flow channel plate while also ensuring that the coolant flow channel plate 300 has sufficient strength. Similarly, in order to facilitate the molding of the coolant flow channel plate 300, a split molding method can also be adopted. For example, the coolant flow channel plate 300 is also divided into a coolant main body part and a coolant cover plate part along its thickness direction, and the coolant main body part forms a coolant circulation circuit 301 with an opening. After the coolant main body part and the coolant cover plate part are respectively molded by the injection molding process, the coolant flow channel plate 300 of the present invention can be obtained by fixing the two by welding methods such as heat welding, friction welding, laser welding, etc. as mentioned above.

[0124] After the refrigerant flow channel plate 200 and the coolant flow channel plate 300 are made, they can be fixedly connected. Figure 5, the coolant flow channel plate 300 is fixedly connected to the refrigerant flow channel plate 200 by a multi-point connection method. Exemplarily, the multi-point connection method is to realize the connection between the refrigerant flow channel plate 200 and the coolant flow channel plate 300 by a threaded connection at multiple installation points. As mentioned above, since the thermal management components included in the thermal management integrated module and the connectivity relationship between the multiple thermal management connection components can be selected according to the actual needs of the thermal management of the whole vehicle (the principle schematic diagram of different whole vehicle thermal management systems). On this basis, under the premise of being able to meet the connection relationship corresponding to the schematic diagram, the installation position of each thermal management component on the refrigerant flow channel plate 200 or the coolant flow channel plate 300 can be flexibly determined according to the connection relationship of the thermal management component in the corresponding whole vehicle thermal management schematic diagram and the outline / size and other details of the actually selected thermal management component. After the installation position is determined, a fixed structure adapted to the thermal management component can be reserved at the corresponding installation position of the refrigerant flow channel plate 200 or the coolant flow channel plate 300.

[0125] Main reference Figure 3 In one possible implementation, the upper portion of the vehicle's thermal management system is related to the refrigerant, such as the evaporator / PTC, which is connected to the cabin space to provide cooling / heating to the passengers. The lower portion is related to the coolant, such as the temperature-adjusted coolant that insulates the power battery. Heat exchange between the refrigerant and coolant can be achieved through heat exchanger 202, thereby enabling thermal management of the entire vehicle.

[0126] Main reference Figure 3 In one possible implementation, the vehicle's thermal insulation components requiring cooling / heating primarily include the power battery 6, while the heat-generating components requiring cooling primarily include the motors. In this example, these components include the front / rear motors, front / rear motor controllers, and the front / rear intelligent power distribution unit central processors (hereinafter collectively referred to as motors 7). The vehicle thermal management system includes a first component related to the refrigerant and a second component related to the coolant.

[0127] In one possible embodiment, the first part mainly includes a heat exchanger 202, an internal heat exchanger 203, a liquid storage drying tank 204, a first electronic expansion valve 205, a second electronic expansion valve 206, a first electronic refrigerant valve 207, a second electronic refrigerant valve 208, a third electronic refrigerant valve 209, a first one-way valve 210, a second one-way valve 211, a first pressure and temperature sensor 212, a second pressure and temperature sensor 213, and a third pressure and temperature sensor 214. In addition, the first part also includes a compressor 2151, an air conditioning box 2152 (which includes a PTC capable of directly operating to generate heat, a condenser capable of dissipating heat to the cabin space (below the PTC), and an evaporator capable of dissipating cooling to the cabin space (below the condenser), and an external heat exchanger 2152 connected to the outside environment.

[0128] Among them, the exhaust port of the compressor is connected to the second side of the external heat exchanger and the second side of the condenser through the second electronic refrigerant valve 208 and the third electronic refrigerant valve 209 respectively, the first side of the external heat exchanger and the first side of the condenser are connected, and a first one-way valve 210 that only allows refrigerant to flow out of the external heat exchanger and a second one-way valve 211 that only allows refrigerant to flow out of the evaporator are arranged between the two in sequence.

[0129] The first side of the external heat exchanger is connected to the inlet of the high-pressure portion of the internal heat exchanger 203 via the second electronic expansion valve 206. The outlet of the high-pressure portion of the internal heat exchanger 203 is connected to the inlet of the low-pressure portion of the internal heat exchanger 203 via the evaporator of the air conditioner, and to the inlet of the low-pressure portion of the internal heat exchanger 203 via the first electronic expansion valve 205 and the refrigerant flow path of the heat exchanger. The outlet of the low-pressure portion of the internal heat exchanger 203 is connected to the return air port of the compressor. The second side of the external heat exchanger is connected to the return air port of the compressor via the first electronic refrigerant valve 207.

[0130] In one possible implementation, the inlet of the liquid storage and drying tank 204 is disposed on the pipeline between the first one-way valve 210 and the second one-way valve 211 , and the outlet of the liquid storage and drying tank 204 is connected to the inlet of the high-pressure part of the internal heat exchanger 203 .

[0131] In one possible embodiment, the first pressure and temperature sensor 212, the second pressure and temperature sensor 213, and the third pressure and temperature sensor 214 are respectively arranged on the downstream side of the exhaust port of the compressor (between the exhaust port of the compressor and the second side of the external heat exchanger / condenser), between the second side of the external heat exchanger and the return air port of the compressor, and between the second side of the refrigerant flow channel of the heat exchanger and the inlet of the low-pressure part of the internal heat exchanger 203.

[0132] In addition, as in this example, an electronic expansion valve can be added between the outlet of the high-pressure portion of the internal heat exchanger 203 and the first side of the evaporator, and a high-pressure charging valve can be configured on the pipeline. A low-pressure charging valve can also be configured between the second side of the evaporator and the inlet of the low-pressure portion of the internal heat exchanger 203.

[0133] The heat-generating components in a vehicle that require cooling primarily include the motors (front and rear), motor controllers (front and rear), and the power battery. The vehicle thermal management system consists of a first component related to the refrigerant and a second component related to the coolant.

[0134] In one possible implementation, the second part primarily includes a multi-way valve 302 (a five-way valve is used in this example), a first water pump 303, a second water pump 304, a first water temperature sensor 305, and a second water temperature sensor 306. The five flow ports of the five-way valve are designated as flow ports (1, 2, 3, 4, and 5). Furthermore, the second part also includes an expansion tank 324 and a radiator 325.

[0135] The outlet of the expansion kettle is first connected to the flow port 1 of the multi-way valve 302 via the coolant flow channel of the heat exchanger. The outlet of the expansion kettle is secondly connected directly to the flow port 4 of the multi-way valve 302. The outlet of the expansion kettle is thirdly connected to the flow port 5 of the multi-way valve 302 via the first water pump 303 and the power battery 7. The outlet of the expansion kettle is fourthly connected to the flow port 2 of the multi-way valve 302 via the second water pump 304 and two parallel branches (the first branch path is the front intelligent power distribution unit, the front motor controller, and the front motor, and the second branch path is the rear intelligent power distribution unit / central processing unit, the rear motor controller, and the rear motor). A first water temperature sensor 305 is provided. The flow port 3 of the multi-way valve 302 is connected to the inlet of the expansion kettle via the radiator.

[0136] In a possible implementation, the first water temperature sensor 305 and the second water temperature sensor 306 are respectively arranged on the pipeline between the outlet of the expansion kettle and the inlet of the second water pump and on the pipeline between the front / rear motor and the connecting port 2 .

[0137] Based on the above schematic diagram, in one possible implementation, the thermal management components that need to be integrated into the refrigerant flow channel plate 200 mainly include a heat exchanger 202, an internal heat exchanger 203, a liquid storage drying tank 204, a first electronic expansion valve 205, a second electronic expansion valve 206, a first electronic refrigerant valve 207, a second electronic refrigerant valve 208, a third electronic refrigerant valve 209, a first one-way valve 210, a second one-way valve 211, a first pressure and temperature sensor 212, a second pressure and temperature sensor 213, and a third pressure and temperature sensor 214. The thermal management components that need to be integrated into the coolant flow channel plate 300 mainly include a multi-way valve 302 (a five-way valve is used in this example), a first water pump 303, a second water pump 304, a first water temperature sensor 305, and a second water temperature sensor 306. The following mainly describes the integration method of the above-mentioned thermal management components on / in the refrigerant flow channel plate 200 or the coolant flow channel plate 30 and the principle of achieving thermal management for the entire vehicle based on the above-mentioned thermal management components (that is, the connection relationship that should exist between the thermal management components and the control logic that needs to be configured).

[0138] The heat exchanger 202 in the thermal management component is equipped with two sets of heat-exchange pipes (referred to as refrigerant flow channels and coolant flow channels, respectively), which are used to circulate refrigerant and coolant, respectively. Therefore, when cooling a power battery or motor, or recovering waste heat from a power battery, the heat exchanger can meet the heat exchange requirements between the refrigerant and coolant fluids.

[0139] Since the heat exchanger is a structure associated with both the refrigerant flow channel plate 200 and the coolant flow channel plate 300, it can theoretically be set on any one of them or between the two (not involved in integration) and then connected to the two separately with the help of corresponding pipes and mounting carriers. In one possible embodiment, the heat exchanger 202 is connected to the refrigerant flow channel plate 200 and the coolant flow channel plate 300 respectively and sealed at the connected position (hereinafter referred to as a connecting seal). In addition, a refrigerant inlet and outlet circuit is formed with the refrigerant flow channel structure and the refrigerant flow channel plate 200, and a coolant inlet and outlet circuit is formed with the coolant flow channel structure and the coolant flow channel plate 300. As mainly referred to Figure 6 and Figure 9 In this example, the refrigerant flow channel structure within heat exchanger 202 is sealed and connected to the refrigerant flow channel openings (223, 224) of the refrigerant flow channel plate 200, and the coolant flow channel structure within heat exchanger 202 is sealed and connected to the coolant flow channel openings (322, 323) of the coolant flow channel plate 300. Under this premise, heat exchanger 202 is fixed to refrigerant flow channel plate 200 using fasteners (such as threaded connections). Obviously, the selection of heat exchanger 202 can be determined based on the actual heat exchange performance requirements.

[0140] Among them, the internal heat exchanger 203 in the thermal management component is mainly used to exchange heat between the two refrigerant circulation circuits carrying high-temperature liquid refrigerant and low-temperature gaseous refrigerant respectively, thereby reducing the subcooling degree before the electronic expansion valve, and thus achieving the purpose of increasing the cooling capacity of the air-conditioning system and the battery cooling capacity.

[0141] At present, the internal heat exchanger in the air conditioning system often adopts the structure of coaxial tube. Specifically, the heat exchange between the refrigerants of different temperatures is achieved through the wall between the outer tube and the inner tube of the coaxial tube. Figure 3 The structure on the left represents the high-pressure part of the coaxial tube, and the structure on the right represents the low-pressure part of the coaxial tube. Figure 4 The annular area outside the coaxial tubes is the high-pressure portion of the internal heat exchanger, while the columnar area in the middle is the low-pressure portion. High-pressure, medium-temperature liquid refrigerant enters the internal heat exchanger through high-pressure inlet 2031 on the left end of the internal heat exchanger 203 and exits through high-pressure outlet 2032 on the right end. Low-pressure, low-temperature gaseous refrigerant enters the internal heat exchanger through low-pressure inlet 2033 on the right end of the internal heat exchanger 203 and exits through low-pressure outlet 2034 on the left end.

[0142] In the thermal management integrated module of the present invention, the structure of the two refrigerant circulation circuits is changed from the traditional coaxial tube structure to the wall heat transfer between the two refrigerant circulation circuits in the refrigerant flow channel plate 200 (processed and formed together with the refrigerant circulation circuit 201). Figure 5 The lower area of ​​the refrigerant flow channel plate 200 is provided with two parallel, roughly W-shaped refrigerant circulation circuits, designated as the first intermediate heat exchange section 203a and the second intermediate heat exchange section 203b. The lower first intermediate heat exchange section 203a corresponds to the high-pressure portion of the coaxial tube, while the upper second intermediate heat exchange section 203b corresponds to the low-pressure portion of the coaxial tube. The two sections are separated by a wall within the refrigerant flow channel plate 200. Therefore, when refrigerants of corresponding shapes flow through the intermediate heat exchange sections (203a, 203b), heat can be exchanged between the two sections through the wall. In this embodiment, the intermediate heat exchange sections (203a, 203b) are two heat exchange sections with opposite flow directions.

[0143] Reference Figure 3It can be seen that the two ports of the intermediate heat exchange section (203a, 203b) are connected to another section of piping. Therefore, for ease of description, two reference lines are added on the left and right sides of the intermediate heat exchange section (203a, 203b) (roughly matching the locations with heat exchange capacity). Based on this, in this example, the two ports corresponding to the reference line on the left are the high-pressure end inlet 2031 and the low-pressure end outlet 2034, respectively. The two ports corresponding to the reference line on the right are the high-pressure end outlet 2032 and the low-pressure end inlet 2033, respectively.

[0144] It is understandable that the relative positions of the lower area, the W-shaped streamlines, and the upper and lower parallelism are only one embodiment, and those skilled in the art can flexibly adjust them according to actual needs. For example, it can be any area within the refrigerant flow channel plate 200, the bend in the middle of the W-shape can be changed from one to multiple, the upper and lower parallelism can be changed to a lower and upper parallelism, or a combination of the two (two intersecting flow paths, the upper and lower parallelism before the intersection, and the lower and upper parallelism after the intersection). In addition, the intermediate heat exchange section (203a, 203b) can also be changed to a combination of multiple sections. If necessary, the flow direction of the refrigerant in the intermediate heat exchange section (203a, 203b) can also be adjusted.

[0145] Taking the combination of multiple sections as an example, if the design of the refrigerant circulation circuit in the refrigerant flow channel plate 200 is limited (for example, the design of a continuous intermediate heat exchange section will affect the layout of other thermal management components to a certain extent), the intermediate heat exchange section (203a, 203b) can be changed to a combination of multiple sections. For example, the flow direction, distribution position and length of each section can be flexibly set according to actual needs. In this way, it is possible to achieve a high degree of integration of the internal heat exchanger in a more flexible way. Moreover, such a flexible setting can better assist the configuration of other thermal management components in the refrigerant flow channel plate 200, and therefore, it is expected to reduce the difficulty of achieving integration.

[0146] This allows heat exchange between refrigerant circuits within refrigerant flow channel plate 200 without the need for coaxial tube heat exchange. Compared to coaxial tube heat exchange, since there is no need for a detour corresponding to the coaxial tube when constructing the vehicle's thermal management system, the length of the air conditioning piping connecting the vehicle's air conditioning system to the refrigerant flow channel plate 200 can be effectively shortened. Clearly, details such as the cross-sectional area, specific streamlines, and length of the two refrigerant circulation circuits of internal heat exchanger 203 can be flexibly set based on actual heat exchange performance requirements.

[0147] Take, for example, the case where the vehicle thermal management system is in passenger compartment cooling / battery cooling mode, as described below. On the one hand, high-pressure, medium-temperature liquid refrigerant enters internal heat exchanger 203 from high-pressure inlet 2031 in the high-pressure portion (left side) of internal heat exchanger 203 and exits internal heat exchanger 203 from high-pressure outlet 2032, further reducing the liquid refrigerant's subcooling and thereby increasing the cooling capacity of the air conditioning system. On the other hand, low-pressure, low-temperature gaseous refrigerant in the low-pressure portion (right side) of internal heat exchanger 203 enters internal heat exchanger 203 from low-pressure inlet 2033 and exits internal heat exchanger 201 from low-pressure outlet 2034, further increasing the gaseous refrigerant's superheat to ensure that the refrigerant entering the compressor's return air port is in a gaseous state.

[0148] The liquid storage and drying tank 204 in the thermal management component is mainly used to separate the refrigerant therein from gas and liquid, thereby ensuring that the refrigerant flowing out of the liquid storage and drying tank 204 is liquid refrigerant. In addition, the liquid storage and drying tank 204 can also dry and filter the refrigerant. In this example, the liquid storage and drying tank 204 is connected and sealed to the refrigerant flow channel plate 200. Based on this, a refrigerant inlet and outlet circuit is formed through the refrigerant flow channel structure inside the liquid storage and drying tank 204 and the refrigerant flow channel plate 200. Mainly refer to Figure 4 In this example, after the liquid storage and drying tank 204 is connected and sealed to the refrigerant flow channel openings (225, 226) of the refrigerant flow channel plate 200, it is fixed to the refrigerant flow channel plate 200 by means of fasteners (such as threaded connections). The selection of the liquid storage and drying tank 204 can be determined based on factors such as the charging platform overlap section of the vehicle thermal management system and the annual refrigerant leakage.

[0149] Among them, among the multiple refrigerant electronically controlled valve components (the first electronic expansion valve 205, the second electronic expansion valve 206, the first electronic refrigerant valve 207, the second electronic refrigerant valve 208 and the third electronic refrigerant valve 209) of the thermal management component, the electronic expansion valve can realize the expansion and full closing functions of the refrigerant by controlling the operation of the valve component, and the electronic refrigerant valve can realize the full opening, expansion and full closing functions of the refrigerant by controlling the operation of the valve component. Each refrigerant electronically controlled valve component is connected and sealed with the refrigerant flow channel plate 200, and forms a refrigerant inlet and outlet circuit with the refrigerant flow channel plate 200 through the corresponding valve component refrigerant flow channel structure. Mainly refer to Figure 6In this example, the first electronic expansion valve 205, the second electronic expansion valve 206, the first electronic refrigerant valve 207, the second electronic refrigerant valve 208, and the third electronic refrigerant valve 209 are respectively connected and sealed with the refrigerant flow channel openings (227, 228, 229, 230, and 231) of the refrigerant flow channel plate 200, and then fixed to the refrigerant flow channel plate 200 by means of fasteners (such as threaded connections). The selection (such as the diameter) of the first electronic expansion valve 205, the second electronic expansion valve 206, the first electronic refrigerant valve 207, the second electronic refrigerant valve 208, and the third electronic refrigerant valve 209 can be determined based on the flow requirements of the vehicle thermal management system.

[0150] Among them, the multiple refrigerant mechanical valves (first one-way valve 210, second one-way valve 211) in the thermal management component are mainly used to achieve the full opening / closing function of the refrigerant through the pressure difference between the front and back of the valve. Each refrigerant mechanical valve is connected and sealed with the refrigerant flow channel plate 200, and forms a refrigerant inlet and outlet circuit with the refrigerant flow channel plate 200 through the corresponding valve refrigerant flow channel structure. Figure 6 In this example, the first one-way valve 210 and the second one-way valve 211 are respectively connected and sealed with the refrigerant flow channel openings (232, 233) of the refrigerant flow channel plate 200, and then fixed to the refrigerant flow channel plate 200 by means of fasteners (such as threaded connections). The selection of the first one-way valve 210 and the second one-way valve 211 (such as the diameter) can be determined according to the flow requirements of the vehicle thermal management system.

[0151] Among them, the multiple pressure and temperature sensors (first pressure and temperature sensor 212, second pressure and temperature sensor 213, third pressure and temperature sensor 214) in the thermal management component are mainly used for the internal pressure and temperature sensing components to detect the pressure and temperature of the refrigerant flowing through the sensor. Each pressure and temperature sensor is connected and sealed with the refrigerant flow channel plate 200. Figure 4 、 Figure 7 After the first pressure and temperature sensor 212, the second pressure and temperature sensor 213, and the third pressure and temperature sensor 214 are connected and sealed to the refrigerant flow channel openings (234, 235, 236) of the refrigerant flow channel plate 200, they are fixed to the refrigerant flow channel plate 200 by means of fasteners (such as by threaded connection). The detection ranges of the first pressure and temperature sensor 212, the second pressure and temperature sensor 213, and the third pressure and temperature sensor 214 can be designed and selected based on the pressure and temperature requirements of the vehicle thermal management system.

[0152] Among them, the multi-way valve 302 in the thermal management component is mainly used to control the on and off of different modes of the cooling system. For example, the multi-way valve in this example is a five-way valve. The five-way valve can be connected to multiple thermal management components through its five flow ports. By switching the on and off states of the flow ports, the on and off states of the corresponding modes in the cooling system can be switched. The multi-way valve is connected and sealed with the coolant flow channel plate 300, and a coolant inlet and outlet circuit is formed with the coolant flow channel plate 300 through the corresponding multi-way valve coolant flow channel structure. Mainly refer to Figure 8 The multi-way valve 302 is secured to the coolant flow channel plate 300 by fasteners (e.g., threaded connections) after the flow ports (1, 3, 2, 5, 4) of the multi-way valve 302 are respectively connected and sealed to the coolant flow channel plate 300. The multi-way valve 302 is secured to the coolant flow channel plate 300 by fasteners (e.g., threaded connections). The number of flow channel ports of the multi-way valve 302 can be selected based on the mode switching requirements of the vehicle thermal management system.

[0153] Among them, in the pump assembly of the thermal management component (the first water pump 303 and the second water pump 304), the first water pump 303 is a power battery water pump, which is mainly used to drive the coolant flow in the battery cooling circuit, and the second water pump 304 is a motor water pump, which is mainly used to drive the coolant flow in the motor cooling circuit. Among them, the power battery water pump and the motor water pump are both connected and sealed with the coolant flow channel plate 300, and form a coolant inlet and outlet circuit with the coolant channel plate 300 through the corresponding water pump coolant flow channel structure. Mainly refer to Figure 8 After the first water pump 303 and the second water pump 304 are connected and sealed to the coolant flow channel openings (318, 319) of the coolant flow channel plate 300, they are fixed to the coolant flow channel plate 300 by means of fasteners (such as threaded connections). The size of the first water pump 303 and the second water pump 304 can be selected according to the coolant flow rate requirements of the vehicle thermal management system.

[0154] Among them, the multiple water temperature sensors (first water temperature sensor 305, second water temperature sensor 306) in the thermal management component are mainly used to detect the temperature of the water flowing through the sensor through the temperature sensing component inside the sensor. The multiple water temperature sensors are connected and sealed with the coolant flow channel plate 300. Figure 8 After the first water temperature sensor 305 and the second water temperature sensor 306 are connected and sealed with the coolant flow channel openings (320, 321) of the coolant flow channel plate 300, they can be fixed to the coolant flow channel plate 300 by means of quick plug connections. The detection range of the first water temperature sensor 305 and the second water temperature sensor 306 can be selected according to the temperature requirements of the vehicle thermal management system.

[0155] In addition, the thermal management integrated module further includes a thermal management domain controller 400 . For example, the thermal management domain controller is fixed to the refrigerant flow channel plate 200 by means of fasteners (such as by threaded connection, etc.).

[0156] In this embodiment, the thermal management integrated module of the present invention includes multiple thermal management components that require electrical control, such as electronic expansion valves, electronic refrigerant valves, water pumps, sensors, etc. While structurally integrating the thermal management components that require electrical control, the thermal management components that require electrical control are also electrically integrated into the thermal management domain controller. Figure 10 and Figure 11 The thermal management domain controller 400 is mainly used to realize the electronic control function of the first electronic expansion valve 205, the second electronic expansion valve 206, the first electronic refrigerant valve 207, the second electronic refrigerant valve 208, the third electronic refrigerant valve 209, the first pressure and temperature sensor 212, the second pressure and temperature sensor 213, the third pressure and temperature sensor 214, the multi-way valve 302, the first water pump 303, the second water pump 304, the first water temperature sensor 305 and the second water temperature sensor 306.

[0157] In one possible implementation, the thermal management domain controller 400 is provided with four connectors, namely, a first connector 401, a second connector 402, a third connector 403, and a fourth connector 404. The connectors (401, 402) are connected to a wiring harness 405 corresponding to the thermal management integrated module 100, while the connectors (403, 404) are used to connect to a low-voltage main wiring harness (not shown) of the entire vehicle. Specifically, the first end of the wiring harness 405 is connected to the connectors (401, 402) of the thermal management domain controller 400 through connectors (406, 407), and the second end is connected to the first pressure and temperature sensor 212, the second pressure and temperature sensor 213, the third pressure and temperature sensor 214, the multi-way valve 302, the first water pump 303, the second water pump 304, the first water temperature sensor 305 and the second water temperature sensor 306 through connectors (408, 409, 410, 411, 412, 413, 414, 415).

[0158] Main reference Figure 12In one possible embodiment, the thermal management domain controller 400 includes a housing, which includes an upper housing 4001 and a lower housing 4002, such as the upper housing and the lower housing are laser welded. The PCBA board 4003 is arranged between the upper and lower housings, and the coils 4004 of the aforementioned five refrigerant valves (two electronic expansion valves and three electronic refrigerant valves) are arranged in the housing and located below the PCBA board. The lower housing serves as a mounting carrier, and the coils of the refrigerant valves are mounted on the lower housing. Each coil is connected to the PCBA board by a hard wire, and the PCBA board is also mounted and fixed on the lower housing 200. The heat sink 4005 is arranged on the upper housing, mainly used to dissipate heat for the MCU and power devices on the PCBA board 4. By integrating the PCBA board with the coils of each refrigerant valve nearby, the connection harness between the PCBA board and the coil can be eliminated to the greatest extent, and on this basis, the control accuracy and stability of each refrigerant valve can be guaranteed to be at the same level as the performance of a single valve (with PCBA).

[0159] Among them, the PCBA board uses the main hardware chip solutions such as the main MCU, functional MCU, motor drive, intelligent power management switch and CAN transceiver (the software adopts an AutoSar-like layered architecture design solution) to realize the drive and control of the aforementioned water pumps (the first water pump and the second water pump), multi-way valve, refrigerant valve ((first, second, third) electronic expansion valve and (first, second, third) electronic refrigerant valve) and sensors (((first, second)) water temperature sensor and (first, second, third, fourth) pressure temperature sensor), and thus realize the FOTA function of the software.

[0160] Main reference Figure 13 and Figure 14 In one possible embodiment, the thermal management domain controller 400 is mainly used to drive and control the thermal management components (electrical components) in the front cabin, wherein these electrical components include not only the electrical components in the thermal management integrated module, but also the electrical components outside the thermal management integrated module. For example, in this example, the electrical components in the thermal management integrated module mainly include the (first and second) electronic expansion valves and the (first, second and third) electronic refrigerant valves, the (first and second) water temperature sensors, the (first, second and third) pressure and temperature sensors (the first pressure and temperature sensor is a high-pressure temperature sensor, and the (second and third) pressure and temperature sensors are both low-pressure temperature sensors, respectively denoted as the (first and second) low-pressure temperature sensors), the (first and second) water pumps, and the multi-way valve. The electrical components outside the thermal management integrated module mainly include the liquid level sensor 3241 in the expansion kettle, the fourth pressure and temperature sensor (the fourth pressure and temperature sensor is also a low-pressure temperature sensor, denoted as the third low-pressure temperature sensor) 237 and the third electronic expansion valve 238.

[0161] The (first, second, and third) electronic refrigerant valves, (first, second) electronic expansion valves, (first, second) water temperature sensors, (first, second, and third) pressure and temperature sensors, and multi-way valve are each hardwired to the fourth connector 404 of the thermal management domain controller 400. The (first and second) water pumps are each hardwired to the third connector 403 of the thermal management domain controller 400. The liquid level sensor, third pressure and temperature sensor, and third electronic expansion valve are each hardwired to the second connector 402 of the thermal management domain controller 400.

[0162] The thermal management domain controller 400 communicates with the vehicle domain controller 800 using CAN. The second connector 402 on the thermal management domain controller 400 is connected to the first CAN transceiver 803 via a CAN line. The thermal management domain controller 400 is powered by the vehicle domain controller 800. Specifically, the first connector 401 and the second connector 402 on the thermal management domain controller 400 are connected to the power supply A intelligent switch 801 and the power supply B intelligent switch 802 via power cables.

[0163] After power supply A and power supply B enter the thermal management domain controller 400 , the two power lines are connected to the first power protection filter module 9011 , the second power protection filter module 9012 , and the third power protection filter module 9013 , respectively.

[0164] Among them, the power supply of the first power protection filter module supplies power to the first intelligent power switch 9021, the first intelligent power switch supplies power to the first function MCU9031 (pre-driver), and controls the first MOS switch component 9041 composed of six MOS switches, thereby driving and controlling the DC brushless motor of the first water pump.

[0165] The power supply of the second power protection filter module supplies power to the second intelligent power switch 9022 and the third intelligent power switch 9023 respectively. The second intelligent power switch supplies power to the second function MCU 9032 (pre-driver) and controls the second MOS switch assembly 9042 composed of six MOS switches, thereby driving the DC brushless motor of the second water pump. Specifically:

[0166] The third intelligent power switch 9023 supplies power to the DC motor driver chip 971 to drive the DC brushed motor that controls the multi-way valve, and the third intelligent power switch also supplies power to the stepper motor driver chip 972 and five stepper motor driver chips 973, which are used to drive and control the third electronic expansion valve 238 and the "(first, second, third) electronic refrigerant valve, (first, second, third) electronic expansion valve" respectively.

[0167] Among them, the third power protection filter module supplies power to the LIN transceiver 9051 and the second CAN transceiver 9052 (since the second CAN transceiver is connected to multiple loads, the second CAN transceiver is configured with an LDO that can achieve a power supply voltage of 5V) respectively, and the second CAN transceiver supplies power to the main MCU 906 and is connected to the liquid level sensor 3241, the fourth pressure and temperature sensor 237, the five position sensors of the multi-way valve, the (first and second) water temperature sensors and the (first, second and third) pressure and temperature sensors.

[0168] The second CAN transceiver within the thermal management domain controller 400 communicates with the first CAN transceiver within the vehicle domain controller 800, receiving control signals from the vehicle domain controller 800, controlling the operation of the aforementioned electrical components, and providing real-time feedback of their operating status and fault signals to the vehicle domain controller 800. The second CAN transceiver within the thermal management domain controller 400 communicates with the main MCU, which in turn communicates with the LIN transceiver, which in turn communicates with the first and second function MCUs, respectively. The main MCU communicates with the DC motor driver chip 9071, the stepper motor driver chip 9072, and the five stepper motor driver chips 9073 (an assembly comprising five stepper motor driver chips) via SPI. The DC motor driver chip collects signals from the multi-way valve 302, the stepper motor driver chip collects signals from the third electronic expansion valve 238, and the five stepper motor driver chips within the assembly collect signals from the five position sensors configured for the (first and second) electronic expansion valves and the (first, second, and third) electronic refrigerant generators, respectively. The main MCU also collects signals from the position sensors (5), (first and second) water temperature sensors, and (first, second, and third) pressure and temperature sensors configured for the multi-way valve.

[0169] Based on the above configuration of using the first intelligent power switch and the second intelligent power switch inside the thermal management domain controller 400, the following functions can be achieved: 1) It can be used for resistive, inductive and capacitive loads; 2) It can replace electromechanical relays, fuses and discrete circuits; 3) Chips with different specifications of current driving capabilities can be selected according to the size of the load operating current, and can withstand high starting current; 4) It can achieve over-temperature, over-current, under-voltage, over-voltage and other protections, and diagnose faults such as open circuit and short circuit.

[0170] Main reference Figure 15 Based on the above configuration of power supply A and power supply B for the thermal management domain controller 400 in the vehicle domain controller, the following functions can be achieved:

[0171] When the thermal management domain controller 400 is operating normally, power supplies A and B jointly power the second CAN transceiver (and LDO). Power selection circuit 9081, consisting of two diodes, selects the higher-voltage power source to power the main MCU. Power supply A supplies power to the second and third intelligent power switches 9022 and 9023, respectively, and ultimately to the second water pump, multi-way valve, (first, second, and third) electronic refrigerant valves, and (first and second) electronic expansion valves. Power supply B supplies power to the first intelligent power switch and ultimately to the first water pump.

[0172] If Power Supply A fails, Power Supply B will continue to power the second CAN transceiver (and LDO) 8052, allowing the main MCU to operate. Furthermore, Power Supply B can continue to power the first intelligent power switch and, ultimately, the first water pump. This ensures that the vehicle's thermal management system will not fail due to a failure of Power Supply A.

[0173] If Power Supply B fails, Power Supply A will continue to power the second CAN transceiver (and LDO) 9052, allowing the main MCU to operate. Furthermore, the main MCU controls the power management circuit 9082 to close and power on. Power Supply A will then power the (first, second, and third) intelligent power switches, ultimately supplying power to the first and second water pumps. This ensures that all loads can operate normally.

[0174] In addition, the power protection circuits of power supplies A and B also include an anti-reverse circuit 9083.

[0175] It can be seen that in the vehicle thermal management system of the present invention, the redundant design scheme based on power supply A and power supply B ensures that in situations such as "CAN communication anomaly between thermal management domain controller 400 and vehicle domain controller 800" and / or "LIN communication anomaly between the main MCU in thermal management domain controller 400 and the first / second functional MCU" at least the first water pump can operate in safe mode (e.g., including two situations: 1) the first water pump operates; 2) both the first water pump and the second water pump operate). This ensures that a certain flow of coolant is maintained in the motor coolant circuit of the vehicle thermal management system, thereby ensuring that the vehicle thermal management system will not fail due to the occurrence of such abnormal situations.

[0176] Reference Figure 16 The use of the thermal management domain controller 400 in the present invention is consistent with the general direction of vehicle ECU integration. From the perspective of various electrical components related to thermal management, it greatly simplifies the CAN / LIN network topology of the vehicle.

[0177] It can be seen that in this embodiment, since the thermal management integrated module 100 integrates multiple thermal management components with rotating motion, such as the first water pump 303 and the second water pump 304, in order to reduce the vibration transmission between these moving components and the entire vehicle, it is necessary to perform vibration isolation design on the thermal management integrated module. Figure 17 , a vibration isolation system including one or more vibration isolation structures can be configured on the thermal management integrated module 100. As in this example, the vibration isolation structures include four, specifically, a vibration isolation structure is respectively configured at the left and right ends of the upper side of the thermal management integrated module, such as these two vibration isolation structures are vibration isolation bushings, recorded as vibration isolation bushings (501, 502). Among them, the vibration isolation bushings (501, 502) serve as the main load-bearing and vibration isolation components in this embodiment, and are screwed and fixed to the entire vehicle. The left and right ends of the lower side are also respectively configured with a vibration isolation structure, such as these two vibration isolation structures are vibration isolation rubber pads, recorded as vibration isolation rubber pads (503, 504). Among them, the vibration isolation rubber pads (503, 504) serve as auxiliary positioning and vibration isolation components in this embodiment, and are limited and matched with the entire vehicle.

[0178] Obviously, the vibration isolation bushings (501, 502) and the vibration isolation rubber pads (503, 504) are only an exemplary description of the vibration isolation system. Those skilled in the art can make detailed designs of the number, setting positions and specific structural forms of the vibration isolation structures included in the vibration isolation system according to the modal requirements of the entire vehicle.

[0179] based on Figure 3 The schematic diagram of the vehicle thermal management system integrates the aforementioned multiple thermal management components, the thermal management domain controller 400, and corresponding piping to form a highly integrated thermal management module 100, with the refrigerant flow plate 200 and the coolant flow plate 300 as mounting carriers. By adding corresponding control logic, the vehicle thermal management system can achieve different thermal management modes.

[0180] In this embodiment, on the one hand, by controlling the on-off of the refrigerant valve, the vehicle thermal management system can be put into "passenger compartment cooling mode or battery cooling mode" and "air source heat pump heating mode or waste heat recovery heat pump heating mode".

[0181] In one possible implementation, the thermal management domain controller 400 opens the first electronic expansion valve 205, closes the second electronic expansion valve 206, closes the first electronic refrigerant valve 207, opens the second electronic refrigerant valve 208, and closes the third electronic refrigerant valve 209, so that the vehicle thermal management system is in passenger compartment cooling mode or battery cooling mode.

[0182] In this mode, the refrigerant flows as follows: the high-pressure, high-temperature gaseous refrigerant generated by the compressor enters the refrigerant flow channel plate 200 from the refrigerant interface 221 (flowing through the first pressure and temperature sensor 212 during this period), then passes through the second electronic refrigerant valve 208, and flows out of the refrigerant flow channel plate 200 from the refrigerant interface 217. After passing through the condenser, the high-pressure, high-temperature gaseous refrigerant is converted into a high-pressure, medium-temperature liquid refrigerant. The high-pressure, medium-temperature liquid refrigerant enters the refrigerant flow channel plate 200 from the refrigerant interface 218, passes through the first one-way valve 210, the liquid storage and drying tank 204, and the internal heat exchanger 203 in sequence, and is then divided into two branches, wherein:

[0183] The first branch flows out of the refrigerant flow channel plate 200 from the flow channel port 219 and enters the evaporator in the air conditioning box to meet the cooling needs of the passengers in the cabin space. Figure 18 .

[0184] The second branch is throttled into a low-pressure, low-temperature gas-liquid two-phase refrigerant through the first electronic expansion valve 205 inside the refrigerant flow channel plate 200, and then heat-exchanged into a low-pressure, low-temperature gas refrigerant through the heat exchanger 202 (during which it will flow through the third pressure and temperature sensor 214), so that it can be used to cool the power battery. Specifically, the coolant inside the coolant flow plate absorbs the cold energy from the refrigerant through the heat exchanger 202, and then uses the cold energy to cool the power battery. In this mode, the flow direction of the refrigerant in the refrigerant flow channel plate 200 is referenced to Figure 19 .

[0185] Among them, the refrigerant in the first branch is converted into a low-pressure, low-temperature gaseous refrigerant after flowing through the evaporator. After passing through the refrigerant flow channel port 220, the low-pressure, low-temperature gaseous refrigerant can merge with the low-pressure, low-temperature gaseous refrigerant at the outlet of the heat exchanger 202 of the second branch, which is converted into a low-pressure, low-temperature gaseous refrigerant after heat exchange through the heat exchanger 202. The refrigerant after merging flows out of the refrigerant flow channel plate 200 from the refrigerant interface 216 and enters the compressor, completing the refrigerant circulation.

[0186] In one possible implementation, by opening the first electronic expansion valve 205, opening the second electronic expansion valve 206, opening the first electronic refrigerant valve 207, closing the second electronic refrigerant valve 208, and opening the third electronic refrigerant valve 209, the vehicle thermal management system can be put into air source heat pump heating or waste heat recovery heat pump heating mode.

[0187] In this mode, the refrigerant flows as follows: the high-pressure, high-temperature gaseous refrigerant generated by the compressor enters the refrigerant flow channel plate 200 from the refrigerant interface 221 (flowing through the first pressure and temperature sensor 212 during this period), and then flows out of the refrigerant flow channel plate 200 from the refrigerant interface 221 through the third electronic refrigerant valve 209. After passing through the condenser in the air-conditioning box, the high-pressure, high-temperature gaseous refrigerant is converted into a high-pressure, medium-temperature liquid refrigerant. The high-pressure, medium-temperature liquid refrigerant enters the refrigerant flow channel plate 200 from the refrigerant interface 222, passes through the second one-way valve 211 and the liquid storage drying tank 204 in sequence, and is divided into two branches, wherein:

[0188] The first branch is throttled into a low-pressure, low-temperature gas-liquid two-phase refrigerant through the second electronic expansion valve 206 inside the refrigerant flow channel plate 200, and flows out of the refrigerant flow channel plate 200 from the refrigerant interface 218. Since the condenser is connected to the cabin space, the air source heat pump heating mode can be realized based on this branch. In this mode, the flow direction of the refrigerant in the refrigerant flow channel plate 200 is referenced to Figure 20 .

[0189] The second branch passes through the high-pressure part of the internal heat exchanger 203 inside the refrigerant flow channel plate 200 and is throttled by the first electronic expansion valve 205 to become a low-pressure, low-temperature gas-liquid two-phase refrigerant. It is then transformed into a low-pressure, low-temperature gas refrigerant after heat exchange in the heat exchanger 202 (it will flow through the third pressure and temperature sensor 214 during this period), realizing the waste heat recovery heat pump heating function. Specifically, since the cabin space at this time requires heat, the heat from the coolant recovered by the heat exchanger can be transferred to the cabin space along with the flow of the refrigerant. In this way, part of the heat used to meet the heating needs of the cabin space is the heat recovered from the coolant. In this mode, the flow direction of the refrigerant in the refrigerant flow channel plate 200 refers to Figure 21 .

[0190] Among them, the low-pressure and low-temperature gaseous refrigerant in the first branch flows through the external heat exchanger and the first electronic refrigerant valve 207 in sequence (it will flow through the second pressure and temperature sensor 213 during the period), and then undergoes heat exchange with the low-pressure part of the second branch that passes through the heat exchanger 202 and the internal heat exchanger in sequence, and then is transformed into a low-pressure and low-temperature gaseous refrigerant. The low-pressure and low-temperature gaseous refrigerant merges, and the merged refrigerant flows out of the refrigerant flow plate 200 from the refrigerant interface 216 and enters the compressor, completing the air conditioning heating cycle.

[0191] In this embodiment, on the other hand, the thermal management integrated module 100 can also realize at least six different circulation modes by controlling the multi-way valve.

[0192] Mode 1:

[0193] In one possible implementation, the thermal management domain controller 400 connects the flow ports 2, 3, and 5 of the multi-way valve 302, thereby placing the thermal management integrated module 100 in mode 1. In this mode:

[0194] On the one hand, the coolant of the motor cooling circuit flows from the coolant interface 308 into the coolant flow channel plate 300 , passes through the flow port 2 of the multi-way valve 302 and is connected to the coolant interface 315 .

[0195] On the other hand, the cooling liquid of the power battery cooling circuit (a circuit for cooling the power battery) flows from the cooling liquid interface 309 into the cooling liquid flow channel plate 300 and is connected to the cooling liquid interface 316 through the flow port 5 of the multi-way valve 302 .

[0196] After the coolant in coolant interface 315 and coolant interface 316 merge, it is connected to coolant interface 314 through the flow port 3 of the multi-way valve 302. The coolant flowing into the coolant flow channel plate 300 from the coolant interface 314 flows out of the coolant flow channel plate 300 through the coolant interface 307 and enters the radiator for heat exchange. After passing through the radiator, the coolant flows back into the coolant flow channel plate 300 from the coolant interface 312. After entering the coolant flow channel plate 300, the coolant is divided into two branches, wherein:

[0197] The coolant in the first branch flows into the second water pump 304 through the coolant interface 319 , and then flows into the motor cooling circuit including the motor and other structures from the coolant flow channel opening 310 .

[0198] The coolant in the second branch flows into the first water pump 303 from the coolant interface 318 , and then flows into the battery cooling circuit of the power battery from the coolant flow channel opening 311 .

[0199] In this mode, the flow direction of the coolant in the coolant channel plate 300 is referenced to Figure 22 .

[0200] Mode 2:

[0201] In one possible implementation, the thermal management domain controller 400 connects the flow ports 1, 2, 3, and 5 of the multi-way valve 302, thereby placing the thermal management integrated module 100 in mode 2. In this mode:

[0202] The coolant of the motor cooling circuit flows into the coolant flow channel plate 300 from the coolant interface 308, connects to the coolant interface (315, 314) through the flow ports (2, 3) of the multi-way valve 302, and flows into the coolant flow channel plate 300. Then, it flows out of the coolant flow channel plate 300 from the coolant interface 307 and enters the radiator for heat exchange. After passing through the radiator, the coolant flows into the coolant flow channel plate 300 from the coolant interface 312 and flows into the second water pump 304 through the coolant interface 319. Finally, it flows into the motor and other components from the coolant flow channel port 310 to form a motor cooling circuit.

[0203] The coolant of the power battery cooling circuit flows into the coolant flow channel plate 300 from the coolant interface 309, connects to the coolant interface (316, 313) through the connecting port (5, 1) of the multi-way valve 302, and then enters the heat exchanger 202 through the coolant interface 322 for heat exchange. After heat exchange in the heat exchanger 302, it flows into the coolant flow channel plate 300 from the coolant flow channel 323, then flows into the first water pump 303 through the coolant interface 318, and finally flows into the power battery again from the coolant flow channel port 311 to form a battery cooling circuit.

[0204] In this mode, the flow direction of the coolant in the coolant channel plate 300 is referenced to Figure 23 .

[0205] Mode 3:

[0206] In one possible implementation, the thermal management domain controller 400 connects the flow ports 1, 2, 4, and 5 of the multi-way valve 302, thereby placing the thermal management integrated module 100 in mode 3. In this mode:

[0207] The coolant of the motor cooling circuit flows into the coolant flow channel plate 300 from the coolant interface 308, connects to the coolant interface 315 and the coolant interface 313 through the flow ports (2, 1) of the multi-way valve 302, and enters the heat exchanger 202 through the coolant interface 322 for heat exchange. The coolant after heat exchange in the heat exchanger 302 flows into the coolant flow channel plate 300 from the coolant flow channel 323, flows into the second water pump 304 through the coolant interface 319, and finally flows into the motor and other components from the coolant flow channel port 310 to form a motor cooling circuit.

[0208] The coolant in the power battery cooling circuit flows from the coolant interface 309 into the coolant flow channel plate 300, and then connects to the coolant interface 316 and the coolant interface 317 through the flow ports (4, 5) of the multi-way valve 302. It then flows through the coolant interface 318 into the first water pump 303, and finally flows into the power battery from the coolant flow channel port 311, forming a power battery cooling circuit.

[0209] In this mode, the flow direction of the coolant in the coolant channel plate 300 is referenced to Figure 24 .

[0210] Mode 4:

[0211] In one possible implementation, the thermal management domain controller 400 connects the flow ports 2, 3, 4, and 5 of the multi-way valve 302, thereby placing the thermal management integrated module 100 in mode 4. In this mode:

[0212] The coolant in the motor cooling circuit flows from coolant port 308 into the coolant flow plate 300, passes through the flow ports (2 and 3) of the multi-way valve 302, and flows out of the coolant ports 315 and 314. Finally, it flows out of the coolant flow plate 300 through the coolant port 307 and enters the radiator for heat exchange. After passing through the radiator, the coolant flows into the coolant flow plate 300 through the coolant port 312, flows into the second water pump 304 through the coolant port 319, and finally flows into the motor through the coolant flow port 310, forming the motor cooling circuit.

[0213] The coolant of the power battery cooling circuit flows from the coolant interface 309 into the coolant flow channel plate 300, passes through the flow ports (4, 5) of the multi-way valve 302, connects to the coolant interface 316 and the coolant interface 317, flows into the first water pump 303 through the coolant interface 318, and finally flows into the power battery from the coolant flow channel port 311 to form a battery cooling circuit.

[0214] In this mode, the flow direction of the coolant in the coolant channel plate 300 is referenced to Figure 25 .

[0215] Mode 5:

[0216] In one possible implementation, the thermal management domain controller 400 connects the flow ports 2, 4, and 5 of the multi-way valve 302, thereby placing the thermal management integrated module 100 in mode 5. In this mode:

[0217] The coolant of the motor cooling circuit flows into the coolant flow channel plate 300 from the coolant interface 308, and is connected to the coolant interface 315 through the flow port 2 of the multi-way valve 302. It merges with the coolant of the battery cooling circuit that flows into the coolant flow channel plate 300 from the coolant interface 309, passes through the communication port 5 of the multi-way valve 302 and is connected to the coolant interface 316. After that, the coolant flows into the coolant interface (318, 319) after passing through the communication port 4 of the multi-way valve 302 and is connected to the coolant interface 317. After that, it is divided into two branches, among which:

[0218] The coolant in the first branch flows from the coolant interface 319 into the second water pump 304 and finally flows from the coolant flow channel opening 310 into the motor, etc. to form a motor cooling circuit.

[0219] The second branch flows from the coolant interface 318 into the first water pump 303 and finally flows from the coolant flow channel opening 311 into the power battery to form a battery cooling circuit.

[0220] In this mode, the flow direction of the coolant in the coolant channel plate 300 is referenced to Figure 26 .

[0221] Mode 6:

[0222] In one possible implementation, the thermal management domain controller 400 connects the flow ports 1, 2, and 5 of the multi-way valve 302, thereby placing the thermal management integrated module 100 in mode 5. In this mode:

[0223] The coolant in the motor cooling circuit flows from the coolant interface 308 into the coolant flow channel plate 300, passes through the flow port 2 of the multi-way valve 302 and connects to the coolant interface 315. It then merges with the coolant in the power battery cooling circuit from the coolant interface 309 into the coolant flow channel plate 300, and after merging with the coolant that passes through the flow port 5 of the multi-way valve 302 and connects to the coolant interface 316, it passes through the flow port 1 of the multi-way valve 302 and connects to the coolant interface 313 and enters the heat exchanger 202 through the coolant interface 322 for heat exchange. After heat exchange in the heat exchanger 302, it flows from the coolant flow channel 323 into the coolant flow channel plate 300. After entering the coolant flow channel plate 300, the coolant is divided into two branches, of which:

[0224] The first branch flows from the coolant interface 319 into the second water pump 304 and finally flows from the coolant flow channel opening 310 into the motor, etc. to form a motor cooling circuit.

[0225] The second branch flows from the coolant interface 318 into the first water pump 303 and finally flows from the coolant flow channel opening 311 into the power battery to form a power battery cooling circuit.

[0226] In this mode, the flow direction of the coolant in the coolant channel plate 300 is referenced to Figure 27 .

[0227] The thermal management integrated module 100 of the present invention can significantly reduce the length of the air conditioning pipeline connected to the thermal management integrated module 100 by integrating multiple thermal management components into the refrigerant flow channel plate 200 and transforming the internal heat exchanger 203 into a structure that can be integrated into the refrigerant flow channel plate 200. Figure 28 In one possible implementation, compared with a non-integrated solution where the air conditioning pipe is connected to the vehicle, the length of the air conditioning pipe connected to the vehicle by the thermal management integrated module 100 of the present invention is reduced by 40%.

[0228] The thermal management integrated module 100 of the present invention can significantly reduce the length of the cooling pipe connected to the thermal management integrated module 100 by integrating multiple thermal management components into the coolant flow channel plate 300. Figure 29 In one possible implementation, compared with a cooling pipe connected to a vehicle in a non-integrated solution, the length of the cooling pipe connected to the vehicle by the thermal management integrated module 100 of the present invention is reduced by 30%.

[0229] The thermal management integrated module 100 of the present invention integrates the electronic control unit of multiple thermal management components through the thermal management domain controller 400 and uses CAN communication with the vehicle domain controller, and only retains two low-voltage connectors, resulting in a significant reduction in the length of the low-voltage wiring harness connected to the thermal management integrated module 100. Figure 30 In one possible implementation, compared with the low-voltage wiring harness and connectors used in a non-integrated solution to connect to the entire vehicle, the length of the low-voltage wiring harness used to connect the thermal management integrated module 100 of the present invention to the entire vehicle is reduced by 70%, and the number of connectors is reduced by 83%.

[0230] It can be seen that the thermal management system of the vehicle of the present invention reduces the length of the air-conditioning pipes, cooling pipes, and low-voltage wiring harnesses, improves the space layout utilization rate of the front cabin of the entire vehicle, and the space saved after the application of the thermal management integrated module 100 realizes the design of increasing the space of the front trunk in the front cabin.

[0231] When applied to a complete vehicle, the vehicle thermal management system of the present invention reduces assembly time by approximately 35% compared to non-integrated solutions. Furthermore, because the thermal management integrated module 100 is integrated with the air conditioning and cooling systems, as well as the vehicle's crossbeams, assembly time can be further reduced, improving the production cycle of the vehicle assembly line.

[0232] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A vehicle thermal management system, characterized in that: The vehicle thermal management system includes a vehicle domain controller, a thermal management domain controller, a first thermal management unit whose circulating medium is a refrigerant, and a second thermal management unit whose circulating medium is a coolant. The vehicle domain controller is in communication with the thermal management domain controller. The first thermal management unit includes a plurality of first thermal management components and a refrigerant flow channel plate, wherein a plurality of refrigerant circulation circuits are formed in the refrigerant flow channel plate, and the first thermal management components having a connection relationship are connected to each other through corresponding refrigerant circulation circuits; The second thermal management unit includes a plurality of second thermal management components and a coolant flow channel plate, wherein a plurality of coolant circulation loops are formed in the coolant flow channel plate, and the second thermal management components having a connection relationship are connected to each other through the corresponding coolant circulation loops; The first thermal management component includes an electronic expansion valve and / or an electronic refrigerant valve, and at least a portion of the coils of the electronic expansion valve and / or the electronic refrigerant valve are arranged near the thermal management domain controller.

2. The vehicle thermal management system according to claim 1, characterized in that: The second thermal management component includes a first water pump and a second water pump, the vehicle thermal management system includes a power supply A and a power supply B, and the thermal management domain controller includes a main MCU. The vehicle domain controller can control the power supply A and / or the power supply B to supply power to the main MCU, and thereby supply power to the first water pump and / or the second water pump.

3. The vehicle thermal management system according to claim 2, characterized in that: The vehicle domain controller includes a first CAN transceiver, the thermal management domain controller includes a second CAN transceiver, the first CAN transceiver and the second CAN transceiver are communicatively connected, and the second CAN transceiver is communicatively connected to the main MCU. The main MCU is communicatively connected to the first water pump and the second water pump respectively.

4. The vehicle thermal management system according to claim 3, characterized in that: The thermal management domain controller includes a LIN transceiver that is communicatively connected to the main MCU. The thermal management domain controller also includes a first function MCU and a second function MCU. The LIN transceiver can communicate with the first function MCU and the second function MCU respectively. The first function MCU is hard-wired to the first water pump, and the second function MCU is hard-wired to the second water pump.

5. The vehicle thermal management system according to any one of claims 2 to 4, characterized in that: The thermal management domain controller includes a power selection circuit, which is configured to: When both power supply A and power supply B are valid, one of them is selected to supply power to the main MCU, and The power supply A and the power supply B respectively supply power to the second water pump and the first water pump.

6. The vehicle thermal management system according to claim 5, characterized in that: The thermal management domain controller includes a power management circuit configured in the power supply A, and the power management circuit is configured to: In the event that the power supply B fails, the power supply A supplies power to the main MCU so that: the main MCU closes the switch of the power management circuit and powers on, thereby: The power supply A is enabled to supply power to the first water pump and the second water pump.

7. The vehicle thermal management system according to claim 5, characterized in that: The power source B is connected to the first water pump so that: In the event that the power supply A fails, the power supply B supplies power to the main MCU and to the first water pump.

8. The vehicle thermal management system according to claim 1, characterized in that: The refrigerant flow channel plate and the coolant flow channel plate are connected to each other, and the thermal management domain controller is fixed to the refrigerant flow channel plate and / or the coolant flow channel plate.

9. The vehicle thermal management system according to claim 8, characterized in that: The refrigerant flow channel plate and the coolant flow channel plate are connected to each other in a multi-point connection manner along a thickness direction close to each other.

10. The vehicle thermal management system according to claim 1, characterized in that: The refrigerant flow channel plate comprises a refrigerant main body portion and a refrigerant cover plate portion, wherein the refrigerant circulation circuit is formed between the refrigerant main body portion and the refrigerant cover plate portion; and / or The coolant flow channel plate includes a coolant main body portion and a coolant cover plate portion, and the coolant main body portion and the coolant cover plate portion form the coolant circulation circuit.

11. The vehicle thermal management system according to claim 10, characterized in that: The refrigerant main body is formed with a refrigerant flow channel corresponding to the refrigerant circulation circuit, and the refrigerant cover plate covers the refrigerant flow channel; and / or The coolant main body portion is formed with a coolant flow channel corresponding to the coolant circulation circuit, and the coolant cover plate portion covers the coolant flow channel.

12. The vehicle thermal management system according to claim 1, characterized in that: The refrigerant flow channel plate is provided with a refrigerant flow channel opening at a position where the refrigerant flow channel plate needs to be docked with the first thermal management component, so that: after the first thermal management component having a connection relationship is docked with the refrigerant flow channel plate through the refrigerant flow channel opening, they are connected to each other through the corresponding refrigerant circulation circuit; and / or The coolant flow channel plate is provided with a coolant flow channel opening at a position where it needs to be docked with the second thermal management component, so that: after the second thermal management component with a connection relationship is docked with the coolant flow channel plate through the coolant flow channel opening, they are connected to each other through the corresponding coolant circulation circuit.

13. The vehicle thermal management system according to claim 12, characterized in that: The first heat management component is sealed to the refrigerant flow channel plate at a position corresponding to the refrigerant flow channel opening; and / or The second heat management component is sealed and connected to the coolant flow channel plate at a position corresponding to the coolant flow channel opening.

14. The vehicle thermal management system according to claim 12, characterized in that: The first heat management component includes an internal heat exchanger including a first refrigerant path corresponding to a high-pressure portion downstream of the condenser and a second refrigerant path corresponding to a low-pressure portion downstream of the evaporator. The first refrigerant passage and the second refrigerant passage are both formed in the refrigerant flow channel plate and both have walls capable of heat transfer.

15. The vehicle thermal management system according to claim 1, characterized in that: The thermal management domain controller includes a PCBA board, and the coils of the electronic expansion valve and / or the electronic refrigerant valve are integrated with the thermal management domain controller in a manner close to the PCBA board.

16. The vehicle thermal management system according to claim 15, characterized in that: The controller includes a housing, and the coil of the electronic expansion valve and / or the electronic refrigerant valve and the PCBA board are all arranged in the housing.

17. A vehicle, characterized in that: The vehicle includes the vehicle thermal management system according to any one of claims 1 to 16.

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