Electronic device and method of determining a capacitance value
By setting a detection capacitor in the electronic device and a coupling capacitor to form a detection capacitor, and connecting it in parallel to the SAR sensor, the problem of the SAR sensor's detection accuracy being affected by temperature is solved, and accurate detection at different temperatures is achieved.
Patent Information
- Application Number
- CN202211179835.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-09-27
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2042-09-27
AI Technical Summary
The detection accuracy of SAR sensors is affected by the decrease in the dielectric constant of the medium due to temperature.
In an electronic device, a capacitance detection component is connected to a coupling capacitor component to form a detection capacitor, which is then connected in parallel to a SAR sensor. By acquiring the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the target capacitance value at a preset temperature is determined, thus avoiding the influence of temperature.
This achieves the goal of maintaining the detection accuracy of the SAR sensor at different temperatures, thus avoiding the reduction in detection accuracy caused by temperature changes.
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Figure CN115542401B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic technology, specifically relating to an electronic device and a method for determining capacitance values. Background Technology
[0002] With the rapid development of electronic technology, mobile phones, tablets, and other electronic devices are becoming increasingly popular and are gradually becoming an indispensable part of people's daily lives. Among them, SAR sensors, as one of the important components of electronic devices, can detect whether a human body is close to the electronic device based on changes in capacitance. This allows the electronic device to reduce its radiation power when a human body is near, thereby reducing the harm caused by radiation from electronic devices to the human body.
[0003] In related technologies, the change in capacitance of a SAR sensor is related to the dielectric constant of the medium constituting the SAR sensor. Specifically, when a person is close to the electronic device, a higher dielectric constant results in a greater change in capacitance; conversely, when a person is far from the electronic device, a lower dielectric constant results in a smaller change in capacitance. However, the dielectric constant of the medium constituting the SAR sensor is easily affected by temperature, which can lead to a decrease in the detection accuracy of the SAR sensor. Summary of the Invention
[0004] The purpose of this application is to provide an electronic device and a method for determining capacitance values, which can solve the problem of low detection accuracy in current SAR sensors.
[0005] In a first aspect, embodiments of this application provide an electronic device, including:
[0006] A coupling capacitor assembly, the coupling capacitor assembly including a coupling capacitor;
[0007] SAR sensor, wherein the SAR sensor is electrically connected to the coupling capacitor;
[0008] A capacitance detection component is provided, which is configured corresponding to the coupling capacitor component and coupled with the coupling capacitor component to form a detection capacitor. The detection capacitor and the coupling capacitor are connected in parallel to the SAR sensor.
[0009] The SAR sensor detects a first capacitance value when a human body is near the electronic device, so that the electronic device determines the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient. The first capacitance value is the capacitance value at the ambient temperature of the environment where the electronic device is located, the second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
[0010] Secondly, embodiments of this application provide a method for determining capacitance values, applied to the electronic device described in the first aspect, the method comprising:
[0011] When a human body is near the electronic device, the first capacitance value of the SAR sensor is obtained. The first capacitance value is the capacitance value at the ambient temperature of the environment in which the electronic device is located.
[0012] Based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the target capacitance value of the SAR sensor at a preset temperature is determined. The second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the magnitude of the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
[0013] Thirdly, embodiments of this application provide a capacitance value determination device, applied to the electronic device as described in the first aspect, the device comprising:
[0014] The first acquisition module is used to acquire the first capacitance value of the SAR sensor when a human body is close to the electronic device. The first capacitance value is the capacitance value at the ambient temperature of the environment in which the electronic device is located.
[0015] The target capacitance value determination module is used to determine the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient. The second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the magnitude of the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
[0016] Fourthly, embodiments of this application provide an electronic device including a processor and a memory, the memory storing programs or instructions executable on the processor, the programs or instructions, when executed by the processor, implementing the steps of the method described in the second aspect.
[0017] Fifthly, embodiments of this application provide a readable storage medium on which a program or instructions are stored, which, when executed by a processor, implement the steps of the method described in the second aspect.
[0018] In a sixth aspect, embodiments of this application provide a chip, the chip including a processor and a communication interface, the communication interface being coupled to the processor, the processor being used to run programs or instructions to implement the method described in the second aspect.
[0019] In a seventh aspect, embodiments of this application provide a computer program product stored in a storage medium, which is executed by at least one processor to implement the method described in the second aspect.
[0020] In this embodiment, a capacitance detection component is incorporated into the electronic device. This component is connected and coupled with a coupling capacitor component to form a detection capacitor. The detection capacitor and the coupling capacitor are connected in parallel to a SAR sensor, and the connection path between the detection capacitor and the SAR sensor can be either on or off. Thus, when a human body is near the electronic device, the device determines the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient. This allows the capacitance value under various ambient temperatures to be converted to the capacitance value at the preset temperature, thereby preventing changes in the detection accuracy of the SAR sensor at different temperatures. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the structure of an embodiment of the electronic device provided in this application;
[0022] Figure 2 This is a schematic diagram of the circuit topology in an embodiment of the electronic device provided in this application;
[0023] Figure 3 This is another circuit topology diagram in an embodiment of the electronic device provided in this application;
[0024] Figure 4 This is a schematic diagram of a portion of the structure of an embodiment of the electronic device provided in this application;
[0025] Figure 5 This is another schematic diagram of a portion of the structure in an embodiment of the electronic device provided in this application;
[0026] Figure 6 This is another schematic diagram of a portion of the structure in an embodiment of the electronic device provided in this application;
[0027] Figure 7 This is another schematic diagram of a portion of the structure in an embodiment of the electronic device provided in this application;
[0028] Figure 8 This is a schematic diagram of a portion of the main circuit board in an embodiment of the electronic device provided in this application;
[0029] Figure 9 This is another circuit topology diagram in an embodiment of the electronic device provided in this application;
[0030] Figure 10 This is a flowchart illustrating an embodiment of the control method for the electronic device provided in this application;
[0031] Figure 11 This is a schematic flowchart of an embodiment of the capacitance value determination method provided in this application;
[0032] Figure 12 This is a schematic diagram of an embodiment of the capacitance value determination device provided in this application;
[0033] Figure 13 This is a schematic diagram of another embodiment of the electronic device provided in this application;
[0034] Figure 14 This is a schematic diagram of another embodiment of the electronic device provided in this application. Detailed Implementation
[0035] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0036] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0037] The electronic device and capacitance value determination method provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.
[0038] Please see Figure 1 and Figure 2 This application provides an electronic device. For example... Figure 1 and Figure 2 The aforementioned electronic device includes:
[0039] Coupling capacitor assembly 10, which includes a coupling capacitor;
[0040] SAR sensor 20, which is electrically connected to a coupling capacitor;
[0041] The capacitance detection component 30 is provided corresponding to the coupling capacitor component 10 and is coupled with the coupling capacitor component 10 to form a detection capacitor. The detection capacitor and the coupling capacitor are connected in parallel to the SAR sensor 20, and the connection path between the detection capacitor and the SAR sensor 20 can be in a conducting state and a disconnected state, respectively.
[0042] The SAR sensor detects a first capacitance value when a human body is near the electronic device, so that the electronic device determines the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient. The first capacitance value is the capacitance value at the ambient temperature of the environment where the electronic device is located, the second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
[0043] Based on this, by incorporating a capacitance detection component 30 in the electronic device, which is connected and coupled with a coupling capacitor component 10 to form a detection capacitor, and then connecting the detection capacitor and the coupling capacitor in parallel to the SAR sensor 20, the connection path between the detection capacitor and the SAR sensor 20 can be either on or off. Thus, when a human body is near the electronic device, the device determines the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient. This allows the capacitance value under various ambient temperatures to be converted to the capacitance value at the preset temperature, thereby preventing changes in the detection accuracy of the SAR sensor 20 at different temperatures.
[0044] In this embodiment of the application, the above-mentioned electronic device includes a coupling capacitor assembly 10, and the coupling capacitor assembly 10 includes a coupling capacitor.
[0045] The aforementioned coupling capacitor component 10 can be any component capable of coupling to form a coupling capacitor. The capacitance value detected by the SAR sensor 20 includes the capacitance value of this coupling capacitor.
[0046] Specifically, the coupling capacitor assembly 10 may include at least one of the following:
[0047] Main circuit board 11, which has an inter-board coupling capacitor C1;
[0048] The motherboard external capacitor assembly 12 has an external coupling capacitor C3.
[0049] The main circuit board 11 includes an inter-board coupling capacitor C1, which can be formed by coupling two adjacent circuit layers in the main circuit board 11. The inter-board coupling capacitor C1 includes at least one circuit layer coupling capacitor formed by coupling two adjacent circuit layers. Alternatively, the main circuit board 11 may also include a substrate layer (such as epoxy resin), with the substrate layer positioned between any two adjacent circuit layers, serving as the filling medium for the circuit layer coupling capacitor.
[0050] The aforementioned external capacitor assembly 12 of the motherboard can be any component other than the aforementioned main circuit board 11 that can be coupled to form a capacitor.
[0051] Specifically, the aforementioned external capacitor assembly 12 of the motherboard may include:
[0052] The main upper metal layer 121 is electrically connected to the main circuit board 11.
[0053] The detection area metal layer 122 is spaced apart from the main upper metal layer 121.
[0054] A support medium layer 123 is disposed between the main upper metal layer 121 and the detection area metal layer 122.
[0055] The aforementioned main upper metal layer 121 may be a grounding metal layer disposed in the electronic device, and the aforementioned main circuit board 11 is electrically connected to the main upper metal layer 121 to realize the grounding of the main circuit board 11.
[0056] The aforementioned detection area metal layer 122 may be spaced apart from the aforementioned main upper metal layer 121, and the detection area metal layer 122 may couple with the aforementioned main upper metal layer 121 to form a capacitor. Furthermore, when a human body is near the electronic device, the detection area metal layer 122 may couple with the human body to form a human body detection capacitor. For example, the aforementioned detection area metal layer 122 may be an antenna metal layer disposed on the casing of the electronic device, etc.
[0057] The aforementioned support medium layer 123 may be disposed between the main upper metal layer 121 and the aforementioned detection area metal layer 122. The support medium layer 123 can not only serve as the filling medium for the capacitor formed by the coupling between the detection area metal layer 122 and the aforementioned main upper metal layer 121, but also provide support for the housing of electronic devices.
[0058] It should be noted that, in addition to the main upper metal layer 121, the detection area metal layer 122 and the support dielectric layer 123, the aforementioned motherboard external capacitor assembly 12 may also include other dielectric layers.
[0059] For example, the motherboard external capacitor assembly 12 also includes a first housing dielectric layer and a second housing dielectric layer. The first housing dielectric layer is disposed between the detection area metal layer 122 and the second housing dielectric layer. The first metal layer 312 and the second housing dielectric layer, and the first metal layer 312 and the detection area metal layer 122 are spaced apart. The detection area metal layer 122 can couple with the air between the first metal layer 312 and the second housing dielectric layer to form a capacitor. That is, the aforementioned motherboard external coupling capacitor C3 includes the capacitor formed by coupling the detection area metal layer 122 with the aforementioned main upper metal layer 121, and the capacitor formed by coupling the detection area metal layer 122 with the air between the first metal layer 312 and the second housing dielectric layer, etc.
[0060] In this embodiment of the application, the above-mentioned electronic device further includes a SAR sensor 20, and the SAR sensor 20 is electrically connected to a detection capacitor and a coupling capacitor.
[0061] The SAR sensor 20 described above can detect capacitance values to determine whether a human body is close to an electronic device based on the detected capacitance values. The capacitance values detected by the SAR sensor 20 may include the capacitance values of the coupling capacitor. Furthermore, when the connection path between the detection capacitor and the SAR sensor 20 is open, the capacitance values detected by the SAR sensor 20 may also include the capacitance values of the detection capacitor.
[0062] It should be noted that when a human body is near the electronic device, the capacitance value detected by the SAR sensor 20 also includes the capacitance value of the human body detection capacitor. However, when a human body is not near the electronic device, the capacitance value of the human body detection capacitor can be considered 0, meaning its connection path is disconnected. Figure 3 As shown. Of course, the capacitance value detected by the SAR sensor 20 can also include the capacitance values of other capacitors, such as the capacitance value of lumped capacitance, etc.
[0063] In this embodiment of the application, the above-mentioned electronic device further includes a capacitance detection component 30, which is disposed corresponding to the coupling capacitor component 10 and is coupled with the coupling capacitor component 10 to form a detection capacitor.
[0064] The aforementioned capacitance detection component 30 may be a metal component corresponding to the coupling capacitor component 10, and the metal component may be coupled with the metal structure spaced apart in the coupling capacitor component 10 to form the aforementioned detection capacitor.
[0065] In some embodiments, the coupling capacitor assembly 10 includes:
[0066] Main circuit board 11, the main circuit board 11 has a main board inter-board coupling capacitor C1;
[0067] The motherboard external capacitor assembly 12 has an external coupling capacitor C3, and the external coupling capacitor C3 and the motherboard inter-board coupling capacitor C1 are connected in parallel to the SAR sensor 20.
[0068] The capacitance detection component 30 is disposed in at least one of the main circuit board 11 and the external capacitor assembly 12 of the main board.
[0069] Based on this, by setting the capacitance detection component 30 to at least one of the main circuit board 11 and the external capacitor component 12 of the motherboard, the formed detection capacitor is connected in parallel with at least one of the inter-board coupling capacitor C1 and the external coupling capacitor C3 of the motherboard to the SAR sensor 20. This avoids the change in the detection accuracy of the SAR sensor 20 caused by the change in the capacitance value of at least one of the inter-board coupling capacitor C1 and the external coupling capacitor C3 of the motherboard due to temperature.
[0070] The capacitance detection component 30 can be either the main circuit board 11 or the external capacitor assembly 12 of the motherboard; or the capacitance detection component 30 can be either the main circuit board 11 or the external capacitor assembly 12 of the motherboard.
[0071] It should be noted that when the above-mentioned coupling capacitor includes the motherboard inter-board coupling capacitor C1 and the motherboard external coupling capacitor C3, the coupling capacitor can be regarded as a whole. By setting the capacitor detection component 30 on the main circuit board 11 and the motherboard external capacitor assembly 12, the main circuit board 11, the motherboard external capacitor assembly 12 and the capacitor detection component 30 together form a detection capacitor, which corresponds to the coupling capacitor as a whole.
[0072] In some embodiments, the capacitance detection component 30 includes:
[0073] The first metal component 31 is disposed on the main circuit board 11, and the first metal component 31 is coupled with the main circuit board 11 to form a detection capacitor between the main board and the main board. The detection capacitor between the main board and the coupling capacitor between the main board are connected in parallel to the SAR sensor 20.
[0074] The second metal part 32 is set corresponding to the external capacitor assembly 12 of the motherboard. The second metal part 32 is coupled with the external capacitor assembly 12 of the motherboard to form an external detection capacitor of the motherboard. The external detection capacitor of the motherboard and the external coupling capacitor C3 of the motherboard are connected in parallel to the SAR sensor 20.
[0075] Based on this, by setting the first metal part 31 on the main circuit board 11 and setting the second metal part 32 on the external capacitor assembly 12 of the main board, the inter-board detection capacitor and the external detection capacitor of the main board are coupled to form an inter-board detection capacitor and an external detection capacitor. The inter-board detection capacitor can avoid the change in the capacitance value of the inter-board coupling capacitor C1 caused by temperature, which would lead to a change in the detection accuracy of the SAR sensor 20. The external detection capacitor can also avoid the change in the capacitance value of the external coupling capacitor C3 caused by temperature, which would lead to a change in the detection accuracy of the SAR sensor 20. This further improves the detection accuracy of the SAR sensor 20 under temperature changes.
[0076] For example, such as Figure 2 and 3 As shown, the main circuit board 11 can be coupled to form an inter-board coupling capacitor C1, and the first metal part 31 can be coupled to the main circuit board 11 to form a capacitor C1_t corresponding to C1 (i.e., the inter-board detection capacitor); while the external capacitor assembly 12 can be coupled to form an external capacitor C3 (i.e., the external detection capacitor), and the second metal part 32 can be coupled to the external capacitor assembly 12 to form a capacitor C3_t corresponding to C3 (i.e., the above detection capacitors include capacitors C1_t and C3_t), and C1, C1_t, C3 and C3_t are connected in parallel;
[0077] At this time, as Figure 3 As shown, when a human body is not near the electronic device, the motherboard inter-board coupling capacitor C1, the lumped capacitor C2, the motherboard external coupling capacitor C3, and the detection capacitors C1_t and C3_t are connected in parallel to the SAR sensor 20, and the capacitance detected by the SAR sensor 20 is the sum of the capacitance values of C1, the lumped capacitor C2, the motherboard external coupling capacitor C3, and the detection capacitors C1_t and C3_t.
[0078] like Figure 1As shown, when a human body is close to an electronic device, the human body and the metal layer 122 of the detection area are coupled to form a human body detection capacitor C4. The human body detection capacitor is connected in parallel with the motherboard coupling capacitor C1, the lumped capacitor C2, the motherboard external coupling capacitor C3, the detection capacitors C1_t and C3_t to the SAR sensor 20, so that the capacitance detected by the SAR sensor 20 is the sum of the capacitance values of C1, the lumped capacitor C2, the motherboard external coupling capacitor C3, the human body detection capacitor C4, and the detection capacitors C1_t and C3_t.
[0079] The first metal component 31 is disposed on the main circuit board 11, and the capacitance detection component 30 may be disposed at an interval from the main circuit board 11.
[0080] In some implementations, such as Figure 4 and 5 As shown, the first metal component 31 includes a first substrate layer 311 and a first metal layer 312. The first substrate layer 311 is disposed on one side of the main circuit board 11, and the first metal layer 312 is disposed on the side of the first substrate layer 311 away from the main circuit board 11, i.e. Figure 4 As shown; or, the first metal layer 312 is embedded in the first substrate layer 311 and spaced apart from the main circuit board 11, i.e., as shown. Figure 5 As shown.
[0081] In this embodiment, by providing a first substrate layer 311 on one side of the main circuit board 11, and by providing a first metal layer 312 on the side of the first substrate layer 311 away from the main circuit board 11, or by embedding the first metal layer 312 in the first substrate layer 311, the method of providing the first metal component 31 is simpler and easier to implement.
[0082] In the case where a first metal layer 312 is provided on the side of the first substrate layer 311 away from the main circuit board 11, or where the first metal layer 312 is embedded in the first substrate layer 311 and the first metal layer 312 is spaced apart from the main circuit board 11, the first metal layer 312 can be coupled with at least one line layer on the main circuit board 11 to form a capacitor, and the capacitor formed by the coupling of the first metal layer 312 with the main circuit board 11 and the inter-board coupling capacitor C1 are connected to the SAR sensor 20.
[0083] The size and shape of the first metal layer 312 can be set according to actual needs. For example, the projected area of the first metal layer 312 on the main circuit board 11 can be set to account for half or a quarter of the area of the main circuit board 11, etc.
[0084] It should be noted that when the first metal layer 312 is coupled with the main circuit board 11 to form a capacitor, at least a portion of the first substrate layer 311 between the first metal layer 312 and the main circuit board 11 can be regarded as the filling medium for the capacitor formed by the coupling of the first metal layer 312 and the main circuit board 11.
[0085] Alternatively, the first metal component 31 may be disposed on the main circuit board 11, or the capacitance detection component 30 may be embedded in the main circuit board 11.
[0086] Specifically, such as Figure 6 As shown, the main circuit board 11 includes a second substrate layer 111, a second circuit layer 112 and a third circuit layer 113. The second circuit layer 112 and the third circuit layer 113 are disposed on opposite sides of the second substrate layer 111. The first metal component 31 is embedded in the second substrate layer 111 and is spaced apart from the second circuit layer 112 and the third circuit layer 113.
[0087] Based on this, by embedding the first metal component 31 in the substrate layer between two adjacent circuit layers of the main circuit board 11, it is possible to set the first metal component 31 and couple it with the main circuit board 11 to form a capacitor without changing the thickness of the main circuit board 11, thereby reducing the thickness of the electronic device.
[0088] Wherein, when the first metal component 31 is embedded in the second substrate layer 111 between the second circuit layer 112 and the third circuit layer 113, the first metal component 31 may be coupled with at least one of the second circuit layer 112 and the third circuit layer 113 to form a capacitor, such that the first metal component 31 is coupled with the main circuit board 11 to form a capacitor connected in parallel with the inter-board coupling capacitor C1.
[0089] The first metal component 31 is spaced apart from the second circuit layer 112 and the third circuit layer 113. This spacing may be between the first metal component 31 and the third circuit layer 113, but may be different from the spacing between the first metal component 31 and the second circuit layer 112.
[0090] Or, such as Figure 7 As shown, the spacing between the first metal component 31 and the second circuit layer 112 and the third circuit layer 113 is equal, thereby making the coupling capacitor formed between the first metal component 31 and the main circuit board 11 more stable.
[0091] The aforementioned second metal component 32 is disposed on the external capacitor assembly 12 of the motherboard. In the case where the external capacitor assembly 12 of the motherboard includes the aforementioned upper metal layer 121, the detection area metal layer 122, and the support dielectric layer 123, the aforementioned second metal component 32 includes a second metal layer and a third substrate layer. The second metal layer is disposed at a distance from the side of the detection area metal layer 122 away from the support dielectric layer 123. The third substrate layer is disposed between the second metal layer and the detection area metal layer 122. The second metal layer and the detection area metal layer 122 are coupled to form a capacitor. The second metal layer and the detection area metal layer 122 are connected in parallel to the SAR sensor 20, so that the second metal layer and the detection area metal layer 122 are coupled to form a capacitor, and the external coupling capacitor C3 of the motherboard is connected in parallel to the SAR sensor 20.
[0092] In some embodiments, the motherboard external capacitor assembly 12 includes:
[0093] The main upper metal layer 121 is electrically connected to the main circuit board 11.
[0094] The detection area metal layer 122 is spaced apart from the main upper metal layer 121.
[0095] A support medium layer 123 is disposed between the main upper metal layer 121 and the detection area metal layer 122, and a second metal component 32 is disposed on the support medium layer 123.
[0096] Based on this, by setting the second metal part 32 on the support medium layer 123, the second metal part 32 is coupled with the detection area metal layer 122 to form a capacitor connected in parallel with the motherboard external coupling capacitor C3 in the SAR sensor 20. This allows the second metal part 32 to be set without affecting the thickness of the motherboard external capacitor assembly 12, thereby reducing the thickness of the electronic device.
[0097] In this embodiment of the application, the coupling capacitor assembly 10 includes the coupling capacitor. The metal layer coupled into the coupling capacitor in the coupling capacitor assembly 10 can be a whole, so that the coupling capacitor is a single capacitor.
[0098] In some embodiments, the coupling capacitor assembly 10 is provided with N coupling regions, and the coupling capacitor assembly 10 is partially coupled in each coupling region, so that the coupling capacitor assembly 10 forms N coupling sub-capacitors corresponding to the N coupling capacitor regions, where N is an integer greater than 1.
[0099] The capacitance detection assembly 30 includes N detection capacitors, which are correspondingly disposed in N coupling regions. Each detection capacitor is coupled to a portion of the coupling capacitor assembly 10 in its corresponding coupling region, so that the coupling capacitor assembly 10 forms N detection sub-capacitors corresponding to the N coupling sub-capacitors.
[0100] Based on this, when the coupling capacitor assembly 10 forms the above N coupling sub-capacitors, by setting the capacitor detection assembly 30 to include N detection capacitors, the capacitor detection assembly 30 and the coupling capacitor assembly 10 can be coupled to form N detection sub-capacitors corresponding to the N coupling sub-capacitors. This allows the change in the detection accuracy of the SAR sensor 20 caused by the change in capacitance value of the corresponding coupling sub-capacitor due to temperature influence to be avoided through each detection sub-capacitor.
[0101] In the case where the above-mentioned coupling capacitor assembly 10 is coupled to form the above-mentioned N coupling sub-capacitors, the above-mentioned N coupling sub-capacitors can be connected in parallel to the SAR sensor 20.
[0102] The above-mentioned N detection sub-capacitors and N coupling sub-capacitors are arranged in a corresponding manner. Each coupling region's partial coupling capacitor assembly 10 can be provided with a detection capacitor, so that the partial coupling capacitor assembly 10 of the coupling region and the corresponding detection capacitor form a detection sub-capacitor, and the detection sub-capacitor and the coupling sub-capacitor formed by coupling the partial coupling capacitor assembly 10 of the coupling region are connected in parallel to the SAR sensor 20.
[0103] For example, such as Figure 8 As shown, due to the long traces of the main circuit board 11 and their interweaving between multiple circuit layers, the main circuit board 11 forms two motherboard regions A and B with different temperatures. The two motherboard regions are coupled with inter-motherboard coupling sub-capacitors C11 and C12, which are connected in parallel to the SAR sensor 20. In this case, a metal component (i.e., a detection capacitor) can be embedded in each of the two motherboard regions' portions of the main circuit board 11, so that the portions of the two motherboard regions' main circuit boards 11 and their corresponding metal components couple to form detection sub-capacitors C11_t and C12_t. C11_t is correspondingly set to C11 and connected in parallel to the SAR sensor 20; and C12_t is correspondingly set to C12 and connected in parallel to the SAR sensor 20, as shown. Figure 9 As shown;
[0104] Similarly, the aforementioned external capacitor assembly 12 can also form two detection sub-regions with different temperatures, and a portion of the external capacitor assembly 12 in the two detection sub-regions couples to form two external coupling sub-capacitors C31 and C32, which are connected in parallel to the SAR sensor 20. In this case, a metal component (i.e., a detection capacitor component) can be embedded in each portion of the external capacitor assembly 12 in the two detection sub-regions, such that the portion of the external capacitor assembly 12 in the two detection sub-regions couples with its corresponding metal component to form detection sub-capacitors C31_t and C32_t, with C31_t corresponding to C31 and connected in parallel to the SAR sensor 20; and C32_t corresponding to C32 and connected in parallel to the SAR sensor 20.
[0105] In this embodiment, the detection capacitor and the coupling capacitor are connected in parallel. One end of the detection capacitor and the coupling capacitor can be connected to the same capacitor detection terminal of the SAR sensor 20, and the other end of both can be connected to the ground terminal of the SAR sensor 20.
[0106] For example, such as Figure 1 and 3 As shown, C1_t, C1, C3_t, and C3 are all connected between the capacitance detection terminal and the ground terminal of the SAR sensor 20.
[0107] In some implementations, the SAR sensor 20 is provided with a first capacitance detection terminal, a second capacitance detection terminal, and a ground terminal;
[0108] The first end of the coupling capacitor is electrically connected to the detection end of the first capacitor, the first end of the detection capacitor is electrically connected to the detection end of the second capacitor, and the second ends of the coupling capacitor and the second ends of the detection capacitor are connected in parallel to the ground.
[0109] Based on this, by electrically connecting the coupling capacitor and the detection capacitor to different capacitor detection terminals, different connection channels can be formed between the detection capacitor and the SAR sensor 20, and between the coupling capacitor and the SAR sensor 20, thereby avoiding interference from the capacitor detection component 30 to the coupling capacitor component 10.
[0110] For example, such as Figure 10 As shown, the SAR sensor 20 is equipped with a capacitor detection terminal 1, a capacitor detection terminal 2, and a ground terminal. Therefore, the capacitors C1 and C3 can be connected in parallel between the capacitor detection terminal 1 and the ground terminal, while the capacitors C1_t and C3_t are connected in parallel between the capacitor detection terminal 2 and the ground terminal.
[0111] In this embodiment, the connection path between the detection capacitor and the SAR sensor 20 can be in a conductive state and an open state, respectively. Specifically, the capacitor detection component 30 may be provided with a switch, which is disposed on the connection path between the coupled detection capacitor and the SAR sensor 20. When the switch is closed, the connection path between the detection capacitor and the SAR sensor 20 is in a conductive state; and when the switch is open, the connection path between the detection capacitor and the SAR sensor 20 is in an open state.
[0112] For example, a switch S1 can be provided at one end of the detection capacitor C1_t. When the switch S1 is closed, the connection between C1_t and the SAR sensor 20 is in a conductive state; and when the switch S1 is open, the connection between C1_t and the SAR sensor 20 is in a disconnected state.
[0113] Similarly, a switch S2 can be provided at one end of the detection capacitor C3_t. When the switch S2 is closed, the connection between C3_t and the SAR sensor 20 is in a conductive state; when the switch S2 is open, the connection between C3_t and the SAR sensor 20 is in a disconnected state.
[0114] It should be noted that when the connection path between the detection capacitor and the SAR sensor 20 is in a conductive state, the capacitance value detected by the SAR sensor includes the capacitance value of the detection capacitor; while when the connection path between the detection capacitor and the SAR sensor 20 is in a disconnected state, the capacitance value detected by the SAR sensor does not include the capacitance value of the detection capacitor.
[0115] In this embodiment of the application, when a human body is near the electronic device, the SAR sensor detects a first capacitance value, and the electronic device can determine the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient. The second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the magnitude of the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
[0116] The first capacitance value mentioned above can be the capacitance value detected when the connection path between the detection capacitor and the SAR sensor 20 is disconnected.
[0117] Alternatively, the first capacitance value mentioned above can be the capacitance value detected when the connection path between the detection capacitor and the SAR sensor 20 is in a conductive state. In this case, the first capacitance value can be expressed by the following formula (1):
[0118] C 0导通 =C 耦合0 +C 检测0 +C 集总 +C 人体 (1)
[0119] C 0导通 This represents the first capacitance value mentioned above;
[0120] C 耦合0 This indicates the capacitance value of the coupling capacitor in the given environment;
[0121] C 检测0 This indicates the capacitance value of the capacitor being tested under the given environmental conditions.
[0122] C 集总 This indicates the capacitance value of the lumped capacitor (the dielectric of the lumped capacitor can be set to be unaffected by temperature);
[0123] C 人体 This represents the capacitance value of the human body detection capacitor (considered zero when no human body is nearby).
[0124] It should be noted that when the above-mentioned coupling capacitor includes multiple coupling sub-capacitors and the detection capacitor includes multiple detection sub-capacitors corresponding to the multiple coupling sub-capacitors, the above-mentioned connection path is in a conductive state, which can be understood as the connection path between the above-mentioned multiple detection sub-capacitors and the SAR sensor 20 is conductive.
[0125] The aforementioned second capacitance value, third capacitance value, and capacitance change coefficient can be measured by a measuring device and pre-configured in the electronic device.
[0126] For example, before assembling the electronic device, a capacitance tester can be used to measure the second capacitance value of the coupling capacitor at a preset temperature, detect the third capacitance value of the capacitor, and detect the ambient capacitance value of the coupling capacitor at each ambient temperature. The ratio of the ambient capacitance to the second capacitance value can be used as the capacitance change coefficient at each ambient temperature relative to the preset temperature, and so on.
[0127] In some embodiments, before determining the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the method further includes:
[0128] When the electronic device is at the preset temperature, the connection path between the SAR sensor and the detection capacitor is controlled to be in a conducting state, and the fourth capacitance value of the SAR sensor is obtained; and the connection path is controlled to be in a disconnected state, and the fifth capacitance value of the SAR sensor is obtained.
[0129] The third capacitance value is calculated based on the fourth capacitance value and the fifth capacitance value.
[0130] Based on this, by controlling the connection path between the SAR sensor and the detection capacitor value to be in the on and off states respectively at a preset temperature, and determining the third capacitance value of the detection capacitor under the preset environment based on the fourth and fifth capacitance values detected by the SAR sensor, the determined third capacitance value is more accurate, thereby further improving the detection accuracy of the SAR sensor 20.
[0131] It should be noted that the detection of the fourth and fifth capacitance values can be performed when a human body is close to the electronic device, or when a human body is not close to the electronic device; there is no limitation on this.
[0132] For example, when the electronic device leaves the factory, if the ambient temperature of the electronic device is normal (i.e., the preset temperature) and no human body is near the electronic device, the connection path between the detection capacitor and the SAR sensor 20 can be controlled to be in a conductive state. At this time, the fourth capacitance value detected by the SAR sensor 20 can be expressed by the following formula (2):
[0133] C 常_导通 =C 耦合_常 +C 检测_常 +C 集总 (2)
[0134] C 常_导通 This represents the fourth capacitance value mentioned above;
[0135] C 耦合_常 This indicates the capacitance value of the coupling capacitor at room temperature;
[0136] C 检测_常 This indicates the capacitance value of the capacitor being tested at room temperature (i.e., the third capacitance value).
[0137] It is also possible to control the connection path between the detection capacitor and the SAR sensor 20 to be in a disconnected state. At this time, the SAR sensor 20 detects the fifth capacitance value, which can be expressed by the following formula (3):
[0138] C 常_断开 =C 耦合_常 +C 集总 (3)
[0139] C 常_断开 This indicates the fifth capacitance value mentioned above.
[0140] Thus, using formulas (2) and (3) above, the value of the third capacitor can be calculated as follows:
[0141] C 检测_常 =C常_导通 -C 常_断开 (4)
[0142] In some embodiments, before determining the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the method further includes:
[0143] When the electronic device is at the ambient temperature, the connection path between the SAR sensor and the detection capacitor is controlled to be in a conducting state, and the sixth capacitance value of the SAR sensor is obtained; and the connection path is controlled to be in a disconnected state, and the seventh capacitance value of the SAR sensor is obtained.
[0144] The capacitance change coefficient is calculated based on the sixth capacitance value, the seventh capacitance value, and the third capacitance value.
[0145] Based on this, the capacitance value variation coefficient is determined by the sixth, seventh, and third capacitance values, thereby making the determined capacitance value variation coefficient more accurate and further improving the detection accuracy of the SAR sensor 20.
[0146] The SAR sensor 20 detects the sixth and seventh capacitance values at ambient temperature. This can be because the SAR sensor 20 detects the sixth and seventh capacitance values in the current environment of the electronic device; or it can detect the sixth and seventh capacitance values in a preset environment, where the temperature of the preset environment is the same as the temperature of the current environment of the electronic device, i.e., both are the aforementioned ambient temperature.
[0147] It should be noted that the detection of the sixth and seventh capacitance values can be performed when a human body is close to the electronic device, or when a human body is not close to the electronic device; there is no limitation on this.
[0148] The capacitance change coefficient determined based on the sixth, seventh, and third capacitance values can be calculated by the electronic device based on the sixth and seventh capacitance values to obtain the capacitance value of the detection capacitor at the ambient temperature. The ratio of the capacitance value at the ambient temperature to the capacitance value at the preset temperature is then used as the capacitance change coefficient of the detection capacitor at the ambient temperature relative to the preset temperature. Since the detection capacitor and the coupling capacitor are correspondingly configured, their capacitance change coefficients are close to or identical, thus the capacitance change coefficient of the detection capacitor can be determined as the capacitance change coefficient of the coupling capacitor.
[0149] For example, when the electronic device is at the above-mentioned ambient temperature and no human body is near the electronic device, the connection path between the detection capacitor and the SAR sensor 20 can be controlled to be in a conductive state. At this time, the sixth capacitance value detected by the SAR sensor 20 can be expressed by the following formula (5):
[0150] C 环_导通 =C 耦合_环 +C 检测_环 +C 集总 (5)
[0151] C 环_导通 This indicates the value of the sixth capacitor mentioned above;
[0152] C 耦合_环 This indicates the capacitance value of the coupling capacitor at room temperature;
[0153] C 检测_环 This indicates the capacitance value measured at room temperature.
[0154] The above formula (5) can be transformed into the following formula (6):
[0155] C 环_导通 =kC 耦合_常 +kC 检测_常 +C 集总 (6)
[0156] k represents the coefficient of change of the above capacitance value.
[0157] It is also possible to control the connection path between the detection capacitor and the SAR sensor 20 to be in a disconnected state. At this time, the value of the seventh capacitor detected by the SAR sensor 20 can be expressed by the following formula (7):
[0158] C 环_断开 =C 耦合_环 +C 集总 (7)
[0159] C 环_断开 This refers to the seventh capacitor mentioned above.
[0160] Similarly, the above formula (7) can be transformed into the following formula (8):
[0161] C 环_断开 =kC 耦合_常 +C 集总 (8).
[0162] Thus, using the above formulas (6) and (8), we can calculate:
[0163]
[0164] Furthermore, from the above formulas (4) and (9), we can obtain:
[0165]
[0166] In some embodiments, before determining the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the method further includes:
[0167] The second capacitance value is calculated based on the fifth capacitance value, the seventh capacitance value, and the capacitance value variation coefficient.
[0168] Based on this, the second capacitance value is determined by the fifth capacitance value, the seventh capacitance value and the capacitance value change coefficient mentioned above, so that the determined second capacitance value is more accurate and the detection accuracy of the SAR sensor 20 is further improved.
[0169] For example, from the above formulas (3) and (8), we can obtain:
[0170]
[0171] In the above formula (11), C 耦合_常 This represents the second capacitance value mentioned above.
[0172] When the electronic device obtains the second capacitance value, the third capacitance value, and the capacitance value change coefficient, the electronic device can calculate the target capacitance value corresponding to the first capacitance value based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance value change coefficient.
[0173] For example, the above formula (1) can be converted into the following formula (12):
[0174] C 0导通 =kC 耦合_常 +kC 检测_常 +C 集总 +C 人体 (12)
[0175] When a human body detection capacitor is present at room temperature, the target capacitance value when the above connection path is in the conducting state is:
[0176] C 目标 =C 耦合_常 +C 检测_常 +C 集总 +C 人体 (13)
[0177] C 目标 This indicates the target capacitance value.
[0178] Thus, through formulas (12) and (13), we can obtain the following formula (14).
[0179] C 目标 =(1-k)(C 耦合_常 +C 检测_常 )+C 0_导通 (14).
[0180] To facilitate a better understanding of the electronic device in the embodiments of this application, the process of determining the target capacitance value corresponding to the first capacitance value when the above-mentioned coupling capacitor includes the above-mentioned motherboard inter-board coupling capacitor C1 and motherboard external coupling capacitor C3 will be explained in detail as follows:
[0181] Process 1
[0182] like Figure 3 As shown, when a human body is not near the electronic device, the electronic device can determine the capacitance values of the inter-board detection capacitor and the external detection capacitor at room temperature (i.e., the preset temperature), respectively.
[0183] First, control switches S1 and S2 are closed, making the connection path between the inter-board detection capacitor and the external detection capacitor of the motherboard and the SAR sensor 20 conductive. At this time, the capacitance value detected by the SAR sensor 20 is:
[0184] C s1闭_s2闭 =C1_t 常温 +C1 常温 +C2 常温 +C3_t 常温 +C3 常温 (15)
[0185] C s1闭_s2闭 This represents the capacitance value detected by SAR sensor 20 under normal temperature, with S1 and S2 closed;
[0186] C1_t 常温 This indicates the capacitance value of the inter-board detection capacitor on the motherboard at room temperature.
[0187] C1 常温 This indicates the capacitance value of the motherboard inter-board coupling capacitor C1 at room temperature.
[0188] C2 常温 This indicates the capacitance value of the lumped capacitance at room temperature.
[0189] C3_t 常温 This indicates the capacitance value of the external detection capacitor on the motherboard at room temperature.
[0190] C3 常温 This indicates the capacitance value of the external coupling capacitor C3 on the motherboard at room temperature.
[0191] Then, switch S1 is opened and switch S2 is closed. At this time, the capacitance value detected by SAR sensor 20 is:
[0192] C s1断_s2闭 =C1 常温 +C2 常温 +C3_t 常温 +C3 常温 (16)
[0193] C s1断_s2闭 This represents the capacitance value detected by the SAR sensor 20 at room temperature with S1 open and S2 closed.
[0194] From formulas (15) and (16), the capacitance value of the inter-board detection capacitor on the motherboard at room temperature can be obtained:
[0195] C1_t 常温 =C s1闭_s2闭 -C s1断_s2闭 (17)
[0196] C1_t 常温 This indicates the capacitance value of the inter-board detection capacitor on the motherboard at room temperature.
[0197] Similarly, by closing switch S1 and opening switch S2, the capacitance value of the external detection capacitor on the motherboard at room temperature can be obtained:
[0198] C3_t 常温 =C s1闭_s2闭 -C s1闭_s2断 (18)
[0199] C3_t 常温 This indicates the capacitance value of the external detection capacitor on the motherboard at room temperature.
[0200] C s1闭_s2断 This represents the capacitance value detected by the SAR sensor 20 at room temperature with S1 closed and S2 open.
[0201] Process Two
[0202] like Figure 3 As shown, when a human body is not near the electronic device, the electronic device can determine the capacitance change coefficient k1 of the motherboard inter-board coupling capacitor C1 and the capacitance change coefficient k3 of the motherboard external coupling capacitor C3 at extreme temperatures (i.e., ambient temperature) relative to the aforementioned normal temperature, that is:
[0203] First, at extremely low temperatures, both switches S1 and S2 are closed, making the connection path between the inter-board detection capacitor and the external detection capacitor of the motherboard and the SAR sensor 20 conductive. At this time, the capacitance value detected by the SAR sensor 20 is:
[0204] C 非s1闭_s2闭=C1_t 非 +C1 非 +C2 非 +C3_t 非 +C3 非 (19)
[0205] C 非s1闭_s2闭 This represents the capacitance value detected by SAR sensor 20 under very low temperature, with S1 closed and S2 closed;
[0206] C1_t 非 This indicates the capacitance value of the inter-board detection capacitor on the motherboard at extremely high temperatures.
[0207] C1 非 This indicates the capacitance value of the motherboard inter-board coupling capacitor C1 at extremely high temperatures.
[0208] C2 非 This represents the capacitance value of the lumped capacitance at extreme temperatures.
[0209] C3 非 This indicates the capacitance value of the external coupling capacitor C3 on the motherboard at extremely high temperatures;
[0210] C3_t 非 This indicates the capacitance value of the external sensing capacitor on the motherboard at extremely high temperatures;
[0211] The above formula (19) can be converted to:
[0212] C 非s1闭_s2闭 =k1C1_t 常温 +k1C1 常温 +k2C2 常温 +k3C3_t 常温 +k3C3 常温 (20)
[0213] Since the detection capacitors C1_t and C3_t are placed close to C1 and C2 respectively and are in the same temperature environment, their capacitance change coefficients are the same. As for the lumped capacitance C2, because of its good temperature characteristics, k2 can be considered to be 1.
[0214] Then, at extremely low temperatures, switch S1 is open and S2 is closed. At this time, the capacitance value detected by SAR sensor 20 is:
[0215] C 非s1断_s2闭 =k1C1 常温 +k2C2 常温 +k3C3_t 常温 +k3C3 常温 (twenty one)
[0216] C 非s1断_s2闭This represents the capacitance value detected by the SAR sensor 20 under very low temperature conditions, with S1 open and S2 closed.
[0217] From formulas (20) and (21), k1 can be calculated:
[0218]
[0219] Similarly, by closing switch S1 and opening switch S2, k3 can be calculated:
[0220]
[0221] C 非s1闭_s2断 This represents the capacitance value detected by the SAR sensor 20 under very low temperature conditions, with S1 closed and S2 open.
[0222] Process 3
[0223] like Figure 3 As shown, when a human body is not near the electronic device, the electronic device can determine the capacitance value C1 of the inter-board coupling capacitor C1 at room temperature. 常温 The capacitance value of external coupling capacitor C3 to the motherboard. 常温 ,Right now:
[0224] First, at extremely low temperatures, both switches S1 and S2 are open, disconnecting the connection between the inter-board detection capacitor and the external detection capacitor on the main board and the SAR sensor 20. At this time, the capacitance value detected by the SAR sensor 20 is:
[0225] C 非s1断_s2断 =C1 非 +C2 非 +C3 非 =k1C1 常温 +C2 常温 +k3C3 常温 (twenty four)
[0226] C 非s1断_s2断 This represents the capacitance value detected by SAR sensor 20 under very low temperature conditions, with S1 open and S2 open.
[0227] Then, at room temperature, with switch S1 open and S2 open, the capacitance value detected by SAR sensor 20 is:
[0228] C s1断_s2断 =C1 常温 +C2 常温 +C3 常温 (25)
[0229] C s1断_s2断 This represents the capacitance value detected by SAR sensor 20 at room temperature with S1 and S2 disconnected.
[0230] Due to the lumped capacitance C2 常温 Since it is set at the factory, C1 can be obtained by solving equations (24) and (25). 常温 and C3 常温 .
[0231] Process Four
[0232] In the actual use of electronic devices, such as Figure 1 As shown, in the environment where the electronic device is located (the ambient temperature is the aforementioned extreme temperature), when switch S1 is closed and S2 is closed, the capacitance value (i.e., the first capacitance value) that the SAR sensor 20 can detect is:
[0233] C 环s1断_s2闭 =k1C1_t 常温 +k1C1 常温 +k2C2 常温 +k3C3_t 常温 +k3C3 常温 +C4 (26)
[0234] C 环s1断_s2闭 This indicates the first capacitance value.
[0235] At this time, the target capacitance value that the aforementioned SAR sensor 20 can detect at room temperature is:
[0236] C 目标s1闭_s2闭 =C1_t 常温 +C1 常温 +C2 常温 +C3_t 常温 +C3 常温 +C4 (27)
[0237] C 目标s1闭_s2闭 This indicates the target capacitance value that the SAR sensor 20 can detect at room temperature when a human body approaches the electronic device.
[0238] Then, using formulas (26) and (27), and the known C1_t 常温 C1 常温 C3_t 常温 C3 常温 By using k1 and k3, the correspondence between the first capacitance value and the target capacitance value can be obtained.
[0239] It should be noted that when the above-mentioned coupling capacitor includes N sub-coupling capacitors and the detection capacitor includes N sub-detection capacitors, it is also possible to determine the target capacitance value corresponding to the first capacitance value. The implementation principle is similar to the above process, and will not be elaborated here.
[0240] In this embodiment of the application, after the electronic device obtains the target capacitance value, the electronic device can determine whether a human body is close to the electronic device through the target capacitance value, thereby making the detection accuracy of the SAR sensor higher. In this way, the detection distance of the SAR sensor can be further divided into multiple intervals, thereby increasing the detection scenarios of the SAR sensor.
[0241] Please see Figure 11 This is a flowchart illustrating a method for determining capacitance values provided in an embodiment of this application, which is applied to the aforementioned electronic device. Figure 11 As shown, the method includes the following steps:
[0242] Step 1101 When a human body is near the electronic device, control the connection path to be in a conducting state and obtain the first capacitance value of the SAR sensor. The first capacitance value is the capacitance value at the ambient temperature of the environment where the electronic device is located.
[0243] Step 1102: Determine the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, wherein the second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the magnitude of the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
[0244] In some embodiments, before determining the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the method further includes:
[0245] When the electronic device is at the preset temperature, the connection path between the SAR sensor and the detection capacitor is controlled to be in a conducting state, and the fourth capacitance value of the SAR sensor is obtained; and the connection path is controlled to be in a disconnected state, and the fifth capacitance value of the SAR sensor is obtained.
[0246] The third capacitance value is calculated based on the fourth capacitance value and the fifth capacitance value.
[0247] In some embodiments, before determining the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the method further includes:
[0248] When the electronic device is at the ambient temperature, the connection path between the SAR sensor and the detection capacitor is controlled to be in a conducting state, and the sixth capacitance value of the SAR sensor is obtained; and the connection path is controlled to be in a disconnected state, and the seventh capacitance value of the SAR sensor is obtained.
[0249] The capacitance change coefficient is calculated based on the sixth capacitance value, the seventh capacitance value, and the third capacitance value.
[0250] In some embodiments, before determining the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the method further includes:
[0251] The second capacitance value is determined based on the capacitance change coefficient, the fifth capacitance value, and the seventh capacitance value.
[0252] Wherein, the fifth capacitor is the capacitance value detected by the SAR sensor when the electronic device is at the preset temperature and the connection path between the SAR sensor and the detection capacitor is disconnected; the seventh capacitor is the capacitance value detected by the SAR sensor when the electronic device is at the ambient temperature and the connection path between the SAR sensor and the detection capacitor is disconnected.
[0253] The method for determining the capacitance value provided in this application embodiment can achieve... Figures 1 to 10 The various processes implemented in the electronic device embodiments achieve the same effect, and will not be described again here to avoid repetition.
[0254] The capacitance value determination method provided in this application can be executed by a capacitance value determination device. This application uses an example of a capacitance value determination device executing the capacitance value determination method to illustrate the capacitance value determination device provided in this application.
[0255] Please see Figure 12 This is a schematic diagram of an embodiment of the capacitance value determination device provided in this application, applied to the aforementioned electronic device. Figure 12 As shown, the device 1200 includes:
[0256] The first acquisition module 1201 is used to control the connection path to be in a conducting state and acquire the first capacitance value of the SAR sensor when a human body is close to the electronic device. The first capacitance value is the capacitance value at the ambient temperature of the environment where the electronic device is located.
[0257] The target capacitance value determination module 1202 is used to determine the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient. The second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the magnitude of the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
[0258] In some embodiments, the above-described device 1200 further includes:
[0259] The second acquisition module is configured to, when the electronic device is at the preset temperature, control the connection path between the SAR sensor and the detection capacitor to be in a conducting state and acquire a fourth capacitance value of the SAR sensor; and control the connection path to be in a disconnected state and acquire a fifth capacitance value of the SAR sensor.
[0260] The first calculation module is used to calculate the third capacitance value based on the fourth capacitance value and the fifth capacitance value.
[0261] In some embodiments, the above-described device 1200 further includes:
[0262] The third acquisition module is configured to, when the electronic device is at the ambient temperature, control the connection path between the SAR sensor and the detection capacitor to be in a conducting state and acquire the sixth capacitance value of the SAR sensor; and, control the connection path to be in a disconnected state and acquire the seventh capacitance value of the SAR sensor.
[0263] The second calculation module is used to calculate the capacitance change coefficient based on the sixth capacitance value, the seventh capacitance value, and the third capacitance value.
[0264] In some embodiments, the above-described device 1200 further includes:
[0265] The third calculation module is used to calculate the second capacitance value based on the capacitance change coefficient, the fifth capacitance value, and the seventh capacitance value.
[0266] Wherein, the fifth capacitor is the capacitance value detected by the SAR sensor when the electronic device is at the preset temperature and the connection path between the SAR sensor and the detection capacitor is disconnected; the seventh capacitor is the capacitance value detected by the SAR sensor when the electronic device is at the ambient temperature and the connection path between the SAR sensor and the detection capacitor is disconnected.
[0267] The device for determining the capacitance value in this application embodiment can be an electronic device or a component within an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. This application embodiment does not specifically limit the device.
[0268] The device for determining the capacitance value in this application embodiment can be a device with an operating system. This operating system can be Android, iOS, or other possible operating systems; this application embodiment does not specifically limit it.
[0269] The capacitance value determination device provided in this application embodiment can achieve... Figure 11 The various processes implemented in the method implementation examples achieve the same effect, and to avoid repetition, they will not be described again here.
[0270] Optionally, such as Figure 13 As shown, this application embodiment also provides an electronic device 1300, including a processor 1301 and a memory 1302. The memory 1302 stores a program or instructions that can run on the processor 1301. When the program or instructions are executed by the processor 1301, they implement the various steps of the above-mentioned method embodiment for determining the capacitance value and can achieve the same technical effect. To avoid repetition, they will not be described again here.
[0271] It should be noted that the electronic devices in the embodiments of this application include the aforementioned mobile electronic devices and non-mobile electronic devices.
[0272] Figure 14 A schematic diagram of the hardware structure of an electronic device to implement an embodiment of this application.
[0273] The electronic device 1400 includes, but is not limited to, components such as: a radio frequency unit 1401, a network module 1402, an audio output unit 1403, an input unit 1404, a sensor 1405, a display unit 1406, a user input unit 1407, an interface unit 1408, a memory 1409, and a processor 1410. The sensor 1405 includes a SAR sensor 14051.
[0274] Those skilled in the art will understand that the electronic device 1400 may also include a power supply (such as a battery) for supplying power to various components. The power supply may be logically connected to the processor 1410 through a power management system, thereby enabling functions such as managing charging, discharging, and power consumption through the power management system. Figure 14 The electronic device structure shown does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements, which will not be elaborated here.
[0275] The processor 1410 is used for:
[0276] When a human body is near the electronic device, the connection path is controlled to be in a conductive state and the first capacitance value of the SAR sensor is obtained. The first capacitance value is the capacitance value at the ambient temperature of the environment where the electronic device is located.
[0277] Based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the target capacitance value of the SAR sensor at a preset temperature is determined. The second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the magnitude of the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
[0278] In some implementations, the processor 1410 is further configured to:
[0279] When the electronic device is at the preset temperature, the connection path between the SAR sensor and the detection capacitor is controlled to be in a conducting state, and the fourth capacitance value of the SAR sensor is obtained; and the connection path is controlled to be in a disconnected state, and the fifth capacitance value of the SAR sensor is obtained.
[0280] The third capacitance value is calculated based on the fourth capacitance value and the fifth capacitance value.
[0281] In some implementations, the processor 1410 is further configured to:
[0282] When the electronic device is at the ambient temperature, the connection path between the SAR sensor and the detection capacitor is controlled to be in a conducting state, and the sixth capacitance value of the SAR sensor is obtained; and the connection path is controlled to be in a disconnected state, and the seventh capacitance value of the SAR sensor is obtained.
[0283] The capacitance change coefficient is calculated based on the sixth capacitance value, the seventh capacitance value, and the third capacitance value.
[0284] In some implementations, the processor 1410 is further configured to:
[0285] The second capacitance value is calculated based on the capacitance change coefficient, the fifth capacitance value, and the seventh capacitance value.
[0286] Wherein, the fifth capacitor is the capacitance value detected by the SAR sensor when the electronic device is at the preset temperature and the connection path between the SAR sensor and the detection capacitor is disconnected; the seventh capacitor is the capacitance value detected by the SAR sensor when the electronic device is at the ambient temperature and the connection path between the SAR sensor and the detection capacitor is disconnected.
[0287] The electronic device provided in this application embodiment can achieve... Figure 11 The various processes implemented in the method implementation examples achieve the same effect, and to avoid repetition, they will not be described again here.
[0288] It should be understood that, in this embodiment, the input unit 1404 may include a graphics processing unit (GPU) 14041 and a microphone 14042. The GPU 14041 processes image data of still images or videos obtained by an image capture device (such as a camera) in video capture mode or image capture mode. The display unit 1406 may include a display panel 14061, which may be configured in the form of a liquid crystal display, an organic light-emitting diode, or the like. The user input unit 1407 includes at least one of a touch panel 14071 and other input devices 14072. The touch panel 14071 is also called a touch screen. The touch panel 14071 may include a touch detection device and a touch controller. Other input devices 14072 may include, but are not limited to, physical keyboards, function keys (such as volume control buttons, power buttons, etc.), trackballs, mice, and joysticks, which will not be described in detail here.
[0289] The memory 1409 can be used to store software programs and various data. The memory 1409 may primarily include a first storage area for storing programs or instructions and a second storage area for storing data. The first storage area may store the operating system, application programs or instructions required for at least one function (such as sound playback, image playback, etc.). Furthermore, the memory 1409 may include volatile memory or non-volatile memory, or both. The non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct memory bus RAM (DRRAM). The memory 1409 in this embodiment includes, but is not limited to, these and any other suitable types of memory.
[0290] Processor 1410 may include one or more processing units; optionally, processor 1410 integrates an application processor and a modem processor, wherein the application processor mainly handles operations involving the operating system, user interface, and applications, and the modem processor mainly handles wireless communication signals, such as a baseband processor. It is understood that the aforementioned modem processor may also not be integrated into processor 1410.
[0291] This application also provides a readable storage medium storing a program or instructions. When the program or instructions are executed by a processor, they implement the various processes of the above-described method embodiment for determining the capacitance value and achieve the same technical effect. To avoid repetition, they will not be described again here.
[0292] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.
[0293] This application also provides a chip, which includes a processor and a communication interface. The communication interface and the processor are coupled. The processor is used to run programs or instructions to implement the various processes of the above-described method embodiment for determining the capacitance value, and can achieve the same technical effect. To avoid repetition, it will not be described again here.
[0294] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.
[0295] This application provides a computer program product stored in a storage medium. The program product is executed by at least one processor to implement the various processes of the above-described method embodiment for determining capacitance value, and can achieve the same technical effect. To avoid repetition, it will not be described again here.
[0296] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
[0297] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.
[0298] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. An electronic device, characterized in that, include: A coupling capacitor assembly, the coupling capacitor assembly including a coupling capacitor; SAR sensor, wherein the SAR sensor is electrically connected to the coupling capacitor; A capacitance detection component is provided, corresponding to the coupling capacitor component, and coupled with the coupling capacitor component to form a detection capacitor. The detection capacitor and the coupling capacitor are connected in parallel to the SAR sensor. The SAR sensor detects a first capacitance value when a human body is near the electronic device, so that the electronic device determines the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient. The first capacitance value is the capacitance value at the ambient temperature of the environment where the electronic device is located, the second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
2. The electronic device according to claim 1, characterized in that, The coupling capacitor assembly includes: Main circuit board, the main circuit board having inter-board coupling capacitors; The motherboard external capacitor assembly has an external coupling capacitor, and the external coupling capacitor and the motherboard inter-board coupling capacitor are connected in parallel to the SAR sensor. The capacitance detection component is disposed in at least one of the main circuit board and the external capacitor assembly of the motherboard.
3. The electronic device according to claim 2, characterized in that, The capacitance detection component includes: A first metal component is disposed on the main circuit board, and the first metal component is coupled with the main circuit board to form an inter-board detection capacitor. The inter-board detection capacitor and the inter-board coupling capacitor are connected in parallel to the SAR sensor. The second metal component is configured corresponding to the external capacitor assembly of the motherboard. The second metal component is coupled with the external capacitor assembly of the motherboard to form an external detection capacitor of the motherboard, and the external detection capacitor of the motherboard and the external coupling capacitor of the motherboard are connected in parallel to the SAR sensor.
4. The electronic device according to claim 3, characterized in that, The first metal component includes a first substrate layer and a first metal layer. The first substrate layer is disposed on one side of the main circuit board, and the first metal layer is disposed on the side of the first substrate layer away from the main circuit board; or, the first metal layer is embedded in the first substrate layer and spaced apart from the main circuit board.
5. The electronic device according to claim 3, characterized in that, The main circuit board includes a second substrate layer, a second circuit layer and a third circuit layer. The second circuit layer and the third circuit layer are disposed on opposite sides of the second substrate layer. The first metal component is embedded in the second substrate layer and is spaced apart from the second circuit layer and the third circuit layer.
6. The electronic device according to claim 5, characterized in that, The first metal component is spaced equally from the second and third circuit layers.
7. The electronic device according to claim 3, characterized in that, The external capacitor assembly for the motherboard includes: A main upper metal layer, which is electrically connected to the main circuit board; A detection area metal layer, wherein the detection area metal layer is spaced apart from the main upper metal layer; A support medium layer is disposed between the main upper metal layer and the detection area metal layer, and the second metal component is disposed on the support medium layer.
8. The electronic device according to claim 1, characterized in that, The coupling capacitor assembly is provided with N coupling regions, and the coupling capacitor assembly is partially coupled in each of the coupling regions, so that the coupling capacitor assembly forms N coupling sub-capacitors corresponding to the N coupling capacitor regions, where N is an integer greater than 1; The capacitance detection assembly includes N detection capacitors, which are correspondingly disposed in the N coupling regions. Each detection capacitor is coupled to a portion of the coupling capacitor assembly in its corresponding coupling region, so that the coupling capacitor assembly forms N detection sub-capacitors corresponding to the N coupling sub-capacitors.
9. The electronic device according to claim 1, characterized in that, The SAR sensor is equipped with a first capacitance detection terminal, a second capacitance detection terminal, and a ground terminal. The first end of the coupling capacitor is electrically connected to the first capacitor detection terminal, the first end of the detection capacitor is electrically connected to the second capacitor detection terminal, and the second end of the coupling capacitor and the second end of the detection capacitor are connected in parallel to the ground terminal.
10. A method for determining capacitance value, applied to an electronic device as described in any one of claims 1 to 9, characterized in that, The method includes: When a human body is near the electronic device, the first capacitance value of the SAR sensor is obtained. The first capacitance value is the capacitance value at the ambient temperature of the environment in which the electronic device is located. Based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the target capacitance value of the SAR sensor at a preset temperature is determined. The second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the magnitude of the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
11. The method according to claim 10, characterized in that, Before determining the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the method further includes: When the electronic device is at the preset temperature, the connection path between the SAR sensor and the detection capacitor is controlled to be in a conducting state, and the fourth capacitance value of the SAR sensor is obtained; and the connection path is controlled to be in a disconnected state, and the fifth capacitance value of the SAR sensor is obtained. The third capacitance value is calculated based on the fourth capacitance value and the fifth capacitance value.
12. The method according to claim 10, characterized in that, Before determining the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the method further includes: When the electronic device is at the ambient temperature, the connection path between the SAR sensor and the detection capacitor is controlled to be in a conducting state, and the sixth capacitance value of the SAR sensor is obtained; and the connection path is controlled to be in a disconnected state, and the seventh capacitance value of the SAR sensor is obtained. The capacitance change coefficient is calculated based on the sixth capacitance value, the seventh capacitance value, and the third capacitance value.
13. The method according to claim 10, characterized in that, Before determining the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient, the method further includes: The second capacitance value is calculated based on the capacitance change coefficient, the fifth capacitance value, and the seventh capacitance value. Wherein, the fifth capacitor is the capacitance value detected by the SAR sensor when the electronic device is at the preset temperature and the connection path between the SAR sensor and the detection capacitor is disconnected; the seventh capacitor is the capacitance value detected by the SAR sensor when the electronic device is at the ambient temperature and the connection path between the SAR sensor and the detection capacitor is disconnected.
14. A capacitance value determining device, applied to an electronic device as described in any one of claims 1 to 9, characterized in that, The device includes: The first acquisition module is used to acquire the first capacitance value of the SAR sensor when a human body is close to the electronic device. The first capacitance value is the capacitance value at the ambient temperature of the environment in which the electronic device is located. The target capacitance value determination module is used to determine the target capacitance value of the SAR sensor at a preset temperature based on the first capacitance value, the second capacitance value, the third capacitance value, and the capacitance change coefficient. The second capacitance value is the capacitance value of the coupling capacitor at the preset temperature, the third capacitance value is the capacitance value of the detection capacitor at the preset temperature, and the capacitance change coefficient is the magnitude of the change in capacitance value of the coupling capacitor at the ambient temperature relative to the preset temperature.
Citation Information
Patent Citations
Capacitor detection device and wearable equipment
CN113708752A
Methods and apparatus for capacitive sensing
US20110043227A1