Semiconductor wafer cleaning and recovery apparatus

Abstract

The application discloses a semiconductor wafer cleaning and recycling device, which comprises a support frame, a water tank, a wafer fixing device, a cantilever, a cleaning device, a air-drying device and a driving device. The support frame is vertically arranged relative to the ground. The water tank is arranged on the support frame, and the bottom side of the water tank is provided with a water inlet pipe. The wafer fixing device is detachably arranged on the water tank. The cantilever is arranged above the wafer fixing device. The wafer fixing device comprises a tank body, a supporting assembly, a first driving mechanism and an adsorption mechanism. The tank body is detachably arranged on the water tank, and the top wall of the tank body is provided with an opening. The bottom side of the tank body is provided with a sewage discharge pipe. The supporting assembly is rotatably arranged in the tank body. One end of the first driving mechanism is connected with the tank body, and the other end of the first driving mechanism is connected with the supporting assembly. The adsorption mechanism is arranged on the supporting assembly. Thus, the waste of cleaning liquid can be effectively reduced, the water droplets remaining on the wafer can be prevented from adsorbing impurities, and the drying efficiency of the wafer can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductors, and particularly relates to a semiconductor wafer cleaning and recycling device. BACKGROUND

[0002] Wafer cleaning technology is extremely important to the electronic industry, especially the semiconductor industry. In the manufacturing process of semiconductor devices and integrated circuits, almost every process involves cleaning. Wafer cleaning mainly removes various impurity ions adsorbed on the wafer surface, such as particles, organic matter, inorganic metal ions, etc., so that the wafer surface cleanliness meets certain process requirements. With the development of semiconductor wafer technology, in order to meet the demand for electrical properties of wafers, the cleanliness of cleaned wafers is also increasingly high.

[0003] At present, the related cleaning device has low cleaning efficiency, the cleaned wafer dries slowly, water droplets on the surface of the cleaned wafer are easy to adsorb impurities again, and the cleaned cleaning liquid is directly discharged, resulting in a large amount of waste of the cleaning liquid. SUMMARY

[0004] The present application aims to at least solve one of the technical problems in the related art to some extent.

[0005] To this end, one object of the present application is to provide a semiconductor wafer cleaning and recycling device, which can effectively reduce the waste of cleaning liquid, avoid water droplets remaining on the wafer from adsorbing impurities, and effectively improve the drying efficiency of the wafer.

[0006] To achieve the above object, the first aspect of the present application provides a semiconductor wafer cleaning and recycling device, comprising a support frame, a water tank, a wafer fixing device, a cantilever, a cleaning device, a air drying device and a driving device, wherein the support frame is vertically arranged relative to the ground, the water tank is arranged on the support frame, and the bottom side of the water tank is provided with a water inlet pipe; the wafer fixing device is detachably arranged on the water tank, the cantilever is arranged above the wafer fixing device, the wafer fixing device comprises a tank body, a support assembly, a first driving mechanism and an adsorption mechanism, wherein the tank body is detachably arranged on the water tank, and an opening is arranged on the top wall of the tank body, and a sewage discharge pipe is arranged on the bottom side of the tank body; the support assembly is rotatably arranged in the tank body; one end of the first driving mechanism is connected with the tank body, and the other end of the first driving mechanism is connected with the support assembly, for driving the support assembly to rotate; the adsorption mechanism is arranged on the support assembly, for fixing the wafer to be cleaned; the cleaning device is movably arranged on the cantilever, and the cleaning device is connected with the water tank through a pipeline, for pumping the cleaning liquid in the water tank, so as to clean the wafer to be cleaned; the air drying device is movably arranged on the cantilever, for air drying the cleaned wafer; one end of the driving device is connected with the cantilever, and the other end of the driving device is connected with the cleaning device and the air drying device respectively, for driving the cleaning device and the air drying device to move on the cantilever.

[0007] The semiconductor wafer cleaning and recycling device provided by the embodiments of the present application can effectively reduce the waste of cleaning liquid, avoid the absorption of impurities by water droplets remaining on the wafer, and effectively improve the drying efficiency of the wafer.

[0008] In addition, the semiconductor wafer cleaning and recycling device provided by the present application can have the following additional technical features:

[0009] In an embodiment of the present application, a plurality of filter holes are arranged on the bottom wall of the tank body, and filter cotton is arranged on each of the plurality of filter holes, wherein the plurality of filter holes are used to filter the used cleaning liquid into the water tank.

[0010] In an embodiment of the present application, a conical table is arranged on the bottom wall of the tank body, a groove is arranged on the bottom wall of the conical table, the first driving mechanism is detachably arranged in the groove, the support assembly comprises a plurality of balls, a support plate and a plurality of vertical columns, wherein the plurality of balls are rotatably arranged on the conical table respectively, and the plurality of balls are arranged around the groove; the bottom wall of the support plate is provided with an annular sliding groove, the support plate is movably connected with the plurality of balls through the annular sliding groove, and the bottom wall of the support plate is connected with the first driving mechanism; the plurality of vertical columns are vertically arranged on the support plate respectively.

[0011] In one embodiment of the present application, the adsorbing mechanism comprises a support plate and a cylinder, wherein the support plate is detachably arranged on the plurality of columns, and a plurality of suction cups are arranged on the support plate, wherein the plurality of suction cups are connected with the cylinder through a hose; the cylinder is detachably arranged on the support plate, and is used for controlling the plurality of suction cups to adsorb and fix the to-be-cleaned wafer.

[0012] In one embodiment of the present application, the bottom wall of the cantilever is provided with two parallel sliding grooves, the driving device comprises a first threaded rod, a second threaded rod, a belt transmission mechanism and a second driving mechanism, wherein the first threaded rod and the second threaded rod are rotatably arranged in the corresponding sliding grooves respectively, and a first sliding block is sleeved on the first threaded rod, and a second sliding block is sleeved on the second threaded rod, wherein the first sliding block and the second sliding block are slidably arranged in the corresponding sliding grooves respectively; one end of the second driving mechanism is connected with the cantilever; one end of the belt transmission mechanism is connected with the end portions of the first threaded rod and the second threaded rod respectively, and the other end of the belt transmission mechanism is connected with the other end of the second driving mechanism.

[0013] In one embodiment of the present application, the cleaning device comprises a water pump and a spray head, wherein the water pump is detachably arranged on the cantilever, and one end of the water pump is connected with the bottom of the water tank through a pipeline; the spray head is detachably arranged on the bottom wall of the first sliding block, and the spray head is connected with the other end of the water pump through a hose.

[0014] In one embodiment of the present application, the air drying device is detachably arranged on the second sliding block, and the air drying device is a micro fan.

[0015] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 FIG. 1 is a structural schematic diagram of a semiconductor wafer cleaning and recycling equipment according to an embodiment of the present application;

[0018] Figure 2 FIG. 2 is a structural schematic diagram of a semiconductor wafer cleaning and recycling equipment according to another embodiment of the present application;

[0019] Figure 3 FIG. 3 is a structural schematic diagram of a semiconductor wafer cleaning and recycling equipment according to another embodiment of the present application;

[0020] Figure 4 Structure diagram of semiconductor wafer cleaning and recycling equipment according to another embodiment of the application.

[0021] As shown in the figure: 10, support frame; 20, water tank; 21, water inlet pipe; 30, wafer fixing device; 31, box body; 32, support assembly; 321, ball; 322, support plate; 323, column; 33, first driving mechanism; 34, suction mechanism; 341, support disc; 342, air cylinder; 311, opening; 312, drain pipe; 313, filter hole; 314, filter cotton; 315, conical table; 316, groove; 317, annular chute; 3411, suction disc; 40, cantilever; 41, chute; 50, cleaning device; 51, water pump; 52, nozzle; 60, air drying device; 70, driving device; 71, first threaded rod; 72, second threaded rod; 73, belt drive mechanism; 74, second driving mechanism; 711, first sliding block; 721, second sliding block. DETAILED DESCRIPTION

[0022] The embodiments of the present application are described in detail below with reference to the accompanying drawings. The embodiments described below are exemplary and are intended to explain the present application, and should not be understood as limiting the present application. On the contrary, the embodiments of the present application include all changes, modifications and equivalents falling within the spirit and scope of the appended claims.

[0023] The semiconductor wafer cleaning and recycling equipment of the embodiments of the present application is described below in conjunction with the accompanying drawings.

[0024] As Figure 1 and Figure 2 shown, the semiconductor wafer cleaning and recycling equipment of the embodiments of the present application can include a support frame 10, a water tank 20, a wafer fixing device 30, a cantilever 40, a cleaning device 50, an air drying device 60 and a driving device 70.

[0025] The support frame 10 is vertically arranged relative to the ground, the water tank 20 is arranged on the support frame 10, and the water tank 20 is provided with a water inlet pipe 21 on the bottom side. The wafer fixing device 30 is detachably arranged on the water tank 20, the cantilever 40 is arranged above the wafer fixing device 30, and the wafer fixing device 30 can include a box body 31, a support assembly 32, a first driving mechanism 33 and a suction mechanism 34.

[0026] The box 31 is detachably arranged on the water tank 20, and an opening 311 is arranged on the top wall of the box 31, and a drain pipe 312 is arranged on the bottom side of the box 31. The support assembly 32 is rotatably arranged in the box 31, one end of the first driving mechanism 33 is connected with the box 31, and the other end of the first driving mechanism 33 is connected with the support assembly 32, and the first driving mechanism 33 is used for driving the support assembly 32 to rotate. It should be noted that the box 31 described in this embodiment is detachably arranged on the water tank 20, which facilitates the installation and replacement of the box 31. For example, the box 31 can be connected with the water tank 20 by means of clamping, riveting or threaded fasteners.

[0027] It should be noted that the first driving mechanism 33 described in this embodiment can be a servo motor.

[0028] In the embodiments of the present application, in order to improve the sealing between the box 31 and the water tank 20, a sealing ring (not shown in the figure) can also be arranged on the bottom wall of the box 31. In addition, in order to facilitate the water inlet of the water inlet pipe 21 and the sewage discharge of the drain pipe 312, valves (not shown in the figure) can also be arranged on the water inlet pipe 21 and the drain pipe 312, respectively.

[0029] The adsorption mechanism 34 is arranged on the support assembly 32 and is used for fixing the wafer to be cleaned. The cleaning device 50 is movably arranged on the cantilever 40, and the cleaning device 50 is connected with the water tank 20 through a pipeline, and is used for pumping the cleaning liquid in the water tank 20 to clean the wafer to be cleaned. The air drying device 60 is movably arranged on the cantilever 40 and is used for air drying the cleaned wafer.

[0030] One end of the driving device 70 is connected with the cantilever 40, and the other end of the driving device 70 is connected with the cleaning device 50 and the air drying device 60 respectively, and the driving device 70 is used for driving the cleaning device 50 and the air drying device 60 to move on the cantilever 40.

[0031] In order to clearly illustrate the above embodiment, in an embodiment of the present application, as shown in Figure 1 The bottom wall of the box 31 is provided with a plurality of filter holes 313, for example, the plurality of filter holes 313 can be 6, 7, 8, 9, 10 filter holes 313, etc., the specific number is not limited here, and the plurality of filter holes 313 are all provided with filter cotton 314, wherein the plurality of filter holes 313 are used for filtering the used cleaning liquid into the water tank 20, facilitating the recycling of the cleaning liquid.

[0032] Specifically, when the semiconductor wafer needs to be cleaned, the relevant staff first opens the valve on the water inlet pipe 21, and injects a sufficient amount of cleaning liquid into the water tank 20 through the water inlet pipe 21, and then closes the valve. Then, the staff can place the wafer (semiconductor wafer) to be cleaned on the adsorption mechanism 34 by controlling the moving mechanism (which can be a moving chuck), and controls the adsorption mechanism 34 to adsorb and fix the wafer. Then, the staff controls the first driving mechanism (servo motor) 33 to start, and the started first driving mechanism 33 drives the adsorption mechanism 34 to rotate through the support assembly 32, thereby driving the wafer to be cleaned to rotate in the box body 31.

[0033] Then, the staff controls the driving device 70 to drive the cleaning device 50 and the air drying device 60 to move back and forth on the cantilever 40 synchronously and in the same direction. At the same time, the staff controls the cleaning device 50 and the air drying device 60 to operate, at this time, the cleaning device 50 extracts the cleaning liquid in the water tank 20 to clean the wafer to be cleaned. Since the cleaning device 50 moves back and forth on the cantilever 40, the wafer in rotation can be fully washed. At the same time, since the wafer is washed during rotation, most of the cleaning liquid on the wafer is thrown out into the box body 31, and is filtered through the filter cotton 314 in the filter hole 313, and the filtered cleaning liquid is discharged into the water tank for recycling, which can reduce the waste of cleaning liquid.

[0034] At the same time, the air drying device 60 synchronously performs air drying treatment on the residual cleaning liquid on the cleaned wafer, so that the wafer is synchronously and segmentedly dried during the whole segmented cleaning process. For example, the wafer is divided into three ranges for cleaning, the first range is the outermost range of the wafer, and the third range is the innermost range of the wafer. When the cleaning device 50 cleans the second range of the wafer during movement, the air drying device 60 synchronously dries the residual cleaning liquid on the first range of the cleaned wafer. When the cleaning device 50 cleans the innermost range of the wafer, the air drying device 60 dries the second range of the wafer, and so on, thereby effectively improving the drying efficiency of the wafer and avoiding the absorption of impurities by the water droplets remaining on the wafer.

[0035] In addition, when the cleaning liquid in the water tank 20 needs to be discharged, the staff can open the water inlet pipe 21 by opening the valve on the water inlet pipe 21, and discharge the cleaning liquid in the water tank 20. When the filtered impurities in the box body need to be cleaned, the staff can open the drain pipe 312 by opening the valve on the drain pipe 312, and flush the inside of the box body 31 through the water pipe, so that the filtered impurities in the box body 31 are flushed out of the drain pipe.

[0036] In an embodiment of the present application, as shown in Figure 3As shown, the bottom wall of the box body 31 is provided with a conical table 315, the bottom wall of the conical table 315 is provided with a groove 316, and the first driving mechanism 33 is detachably arranged in the groove 316. The support assembly 32 can include a plurality of ball bearings 321, a support plate 322, and a plurality of columns 323.

[0037] The plurality of ball bearings 321 are rotatably arranged on the conical table 315, and the plurality of ball bearings 321 are arranged around the groove 316. For example, the plurality of ball bearings 321 can be 6, 7, 8, 9, 10 ball bearings 321, etc., and the specific number is not limited here. The bottom wall of the support plate 322 is provided with an annular sliding groove 317, and the support plate 322 is movably connected to the plurality of ball bearings 321 through the annular sliding groove 317, and the bottom wall of the support plate 322 is connected to the first driving mechanism 33. The plurality of columns 323 are vertically arranged on the support plate 322, for example, the plurality of columns 323 can be 3, 4, 5 columns 323, etc., and the specific number is not limited here.

[0038] Further, in an embodiment of the present application, the suction mechanism 34 can include a support disc 341 and a gas cylinder 342.

[0039] The support disc 341 is detachably arranged on the plurality of columns 323, and the support disc 341 is provided with a plurality of suction discs 3411, for example, the plurality of suction discs 3411 can be 3, 4, 5 suction discs 3411, etc., and the specific number is not limited here, wherein the plurality of suction discs 3411 are connected to the gas cylinder 342 through a hose. It can be understood that the support disc 341 described in this embodiment is detachably arranged on the plurality of columns 323, which facilitates the installation and replacement of the support disc 341. For example, the support disc 341 can be connected to the plurality of columns 323 by clamping, riveting or threaded fastener connection, etc.

[0040] The gas cylinder 342 is detachably arranged on the support plate 322, and is used to control the plurality of suction discs 3411 to suction and fix the wafer to be cleaned.

[0041] It should be noted that the suction disc 3411 described in this embodiment can be an elastic rubber disc, and the top end of the suction disc 3411 can extend out of a part of the top wall of the support disc 341, and the extended part is locked under the gravity of the wafer itself and is flush with the top wall of the support disc 341. The extended part can be arranged according to actual conditions, which is not described here.

[0042] Specifically, when the semiconductor wafer needs to be cleaned, the relevant staff can place the wafer to be cleaned on the support disc 341 by controlling the mobile machine, then the staff controls the gas cylinder 342 to move, the gas cylinder 342 sucks air through the hose to the suction disc 3411 to perform vacuumizing, and the vacuumized suction disc 3411 fixes the wafer to be cleaned on the support disc 341.

[0043] Then, the relevant staff controls the first driving mechanism (servo motor) 33 to start moving, and the moving first driving mechanism drives the support plate 322 to rotate, and at the same time, with the rotation of the support plate 322, the plurality of balls 321 are driven to rotate, and the rotating plurality of balls 321 support the support plate 322.

[0044] At the same time, the rotating support plate 322 drives the adsorption mechanism 24 to rotate through the plurality of columns 323, thereby driving the wafer to be cleaned to rotate, so that the cleaning device 50 flushes the wafer to be cleaned.

[0045] In an embodiment of the present application, as shown in Figure 3 and Figure 4 The bottom wall of the cantilever 40 is provided with two parallel sliding grooves 41, and the driving device 70 can include a first threaded rod 71, a second threaded rod 72, a belt transmission mechanism 73 and a second driving mechanism 74.

[0046] The first threaded rod 71 and the second threaded rod 72 are respectively rotatably arranged in the corresponding sliding grooves 41, and the first threaded rod 71 is sleeved with a first sliding block 711, and the second threaded rod 72 is sleeved with a second sliding block 721, wherein the first sliding block 711 and the second sliding block 721 are respectively slidably arranged in the corresponding sliding grooves 41.

[0047] One end of the second driving mechanism 74 is connected with the cantilever 40, one end of the belt transmission mechanism 73 is connected with the end of the first threaded rod 71 and the second threaded rod 72 respectively, and the other end of the belt transmission mechanism 73 is connected with the other end of the second driving mechanism 74. It should be pointed out that the second driving mechanism 74 described in this embodiment can be a bidirectional motor.

[0048] It should be pointed out that the belt transmission mechanism 73 described in this embodiment can be composed of two double-groove driven pulleys (not specifically marked in the figure) and two single-groove driving pulleys (not specifically marked in the figure), and one of the double-groove driven pulleys is connected with the end of the first threaded rod 71, the other double-groove driven pulley is connected with the end of the second threaded rod 72, and the two double-groove driven pulleys are connected by a belt. And one of the single-groove driving pulleys is connected with the rotating shaft of the bidirectional motor (second driving mechanism 74), and the other single-groove driving pulley is connected with the end of the first threaded rod 71 or the second threaded rod 72.

[0049] In order to clearly illustrate the above embodiment, in an embodiment of the present application, as shown in Figure 3 The cleaning device 50 can include a water pump 51 and a spray head 52.

[0050] The water pump 51 is detachably arranged on the cantilever 40, and one end of the water pump 51 is connected with the bottom of the water tank 20 through a pipeline. The spray head 52 is detachably arranged on the bottom wall of the first sliding block 711, and the spray head 52 is connected with the other end of the water pump 51 through a hose.

[0051] Further, the air-drying device 60 is detachably arranged on the second sliding block 721, and the air-drying device 60 can be a micro fan.

[0052] Specifically, when the bidirectional motor is started, the rotating shaft of the bidirectional motor rotates intermittently in a forward direction (clockwise) or a reverse direction (counterclockwise), the bidirectional motor can drive the first threaded rod 71 and the second threaded rod 72 to rotate synchronously through the belt transmission mechanism 73, the rotating first threaded rod 71 drives the spray head 52 to move back and forth on the cantilever 40 through the first sliding block 711. At the same time, the staff controls the water pump 51 to start, and the running water pump 51 supplies the cleaning liquid in the water tank 20 to the spray head 52 through the pipeline, and the spray head moves back and forth on the cantilever 40 to comprehensively flush the wafer to be cleaned.

[0053] At the same time, the rotating second threaded rod 72 drives the micro fan (air-drying device 60) to move back and forth on the cantilever synchronously with the spray head 52 through the second sliding block 721, and the cleaning liquid remaining on the surface of the cleaned wafer is air-dried. Thus, the drying efficiency of the cleaned wafer can be effectively improved, and the water droplets remaining on the wafer can be prevented from adsorbing impurities, and the cleaning quality of the wafer can be improved.

[0054] In addition, it should be noted that the first driving mechanism 33, the second driving mechanism 74, the air cylinder 342 and the air-drying device 60 described in the embodiment are connected with a controller (not shown in the figure), and the staff can control the first driving mechanism 33, the second driving mechanism 74, the air cylinder 342 and the air-drying device 60 through the controller.

[0055] In summary, the semiconductor wafer cleaning and recycling equipment of the embodiment of the present application can effectively reduce the waste of cleaning liquid, prevent the water droplets remaining on the wafer from adsorbing impurities, and effectively improve the drying efficiency of the wafer.

[0056] In the description of the present specification, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0057] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0058] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and the person skilled in the art can make changes, modifications, replacements and modifications to the above-described embodiments within the scope of the present application.

Claims

1. A semiconductor wafer cleaning and recycling device, characterized in that, The utility model relates to a kind of wafer cleaning device, including support frame (10), water tank (20), wafer fixing device (30), cantilever (40), cleaning device (50), air drying device (60) and driving device (70), wherein, The support frame (10) is vertically arranged relative to the ground, the water tank (20) is arranged on the support frame (10), and the bottom side of the water tank (20) is provided with a water inlet pipe (21); The wafer fixing device (30) is detachably arranged on the water tank (20), the cantilever (40) is erected above the wafer fixing device (30), and the wafer fixing device (30) comprises a tank body (31), a support assembly (32), a first driving mechanism (33) and an adsorption mechanism (34), wherein, The tank body (31) is detachably arranged on the water tank (20), and an opening (311) is provided on the top wall of the tank body (31), and a sewage discharge pipe (312) is provided on the bottom side of the tank body (31); The support assembly (32) is rotatably arranged in the tank body (31); One end of the first driving mechanism (33) is connected with the tank body (31), and the other end of the first driving mechanism (33) is connected with the support assembly (32), for driving the support assembly (32) to rotate; The adsorption mechanism (34) is arranged on the support assembly (32) for fixing the wafer to be cleaned; The cleaning device (50) is movably arranged on the cantilever (40), and the cleaning device (50) is connected with the water tank (20) through a pipeline for pumping the cleaning liquid in the water tank (20) to clean the wafer to be cleaned; The air drying device (60) is movably arranged on the cantilever (40) for air drying the cleaned wafer; One end of the driving device (70) is connected with the cantilever (40), and the other end of the driving device (70) is connected with the cleaning device (50) and the air drying device (60) respectively, for driving the cleaning device (50) and the air drying device (60) to move on the cantilever (40); A plurality of filter holes (313) are provided on the bottom wall of the tank body (31), and a filter cotton (314) is arranged on each of the plurality of filter holes (313), wherein the plurality of filter holes (313) are used for filtering the used cleaning liquid into the water tank (20); The air drying device (60) simultaneously performs air drying treatment on the residual cleaning liquid on the cleaned wafer, and the entire wafer is segmented and cleaned, and simultaneously segmented air drying is performed.

2. The semiconductor wafer cleaning and recycling apparatus according to claim 1, wherein A conical table (315) is provided on the bottom wall of the tank body (31), a groove (316) is provided on the bottom wall of the conical table (315), the first driving mechanism (33) is detachably arranged in the groove (316), and the support assembly (32) comprises a plurality of balls (321), a support plate (322) and a plurality of vertical columns (323), wherein, A plurality of said balls (321) are rotatably arranged on said conical table (315), and said balls (321) are arranged around said groove (316); A bottom wall of said support plate (322) is provided with an annular sliding groove (317), said support plate (322) is movably connected with said balls (321) through said annular sliding groove (317), and a bottom wall of said support plate (322) is connected with said first driving mechanism (33); A plurality of said vertical columns (323) are vertically arranged on said support plate (322).

3. The semiconductor wafer cleaning and recovery apparatus of claim 2, wherein Said suction mechanism (34) comprises a support disc (341) and a gas cylinder (342), wherein, Said support disc (341) is detachably arranged on said vertical columns (323), and said support disc (341) is provided with a plurality of suction discs (3411), wherein said suction discs (3411) are connected with said gas cylinder (342) through a hose; Said gas cylinder (342) is detachably arranged on said support plate (322), and is used for controlling said suction discs (3411) to adsorb and fix said wafer to be cleaned.

4. The semiconductor wafer cleaning and recovery apparatus of claim 1, wherein A bottom wall of said cantilever (40) is provided with two parallel sliding grooves (41), said driving device (70) comprises a first threaded rod (71), a second threaded rod (72), a belt transmission mechanism (73) and a second driving mechanism (74), wherein, Said first threaded rod (71) and said second threaded rod (72) are rotatably arranged in corresponding said sliding grooves (41), and a first sliding block (711) is sleeved on said first threaded rod (71), and a second sliding block (721) is sleeved on said second threaded rod (72), wherein said first sliding block (711) and said second sliding block (721) are slidably arranged in corresponding said sliding grooves (41); One end of said second driving mechanism (74) is connected with said cantilever (40); One end of said belt transmission mechanism (73) is connected with end portions of said first threaded rod (71) and said second threaded rod (72), and the other end of said belt transmission mechanism (73) is connected with the other end of said second driving mechanism (74).

5. The semiconductor wafer cleaning and recovery apparatus of claim 4, wherein Said cleaning device (50) comprises a water pump (51) and a spray head (52), wherein, Said water pump (51) is detachably arranged on said cantilever (40), and one end of said water pump (51) is connected with a bottom portion of said water tank (20) through a pipeline; Said spray head (52) is detachably arranged on a bottom wall of said first sliding block (711), and said spray head (52) is connected with the other end of said water pump (51) through a hose.

6. The semiconductor wafer cleaning and recovery apparatus of claim 4, wherein Said air drying device (60) is detachably arranged on said second sliding block (721), and said air drying device (60) is a micro fan.

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