A vacuum adsorption heating annealing device and method

Abstract

The present invention discloses a vacuum adsorption heating annealing device and a heating annealing method, comprising: a heating platform having a sealing ring arranged circumferentially, the sealing ring protruding from the surface of the heating platform and used for supporting a substrate, and the vertical projection of the substrate on the heating platform can completely cover the sealing ring; a vacuum adsorption assembly arranged on the heating platform, the sealing ring is wound around the outside of the vacuum adsorption assembly, and when the vacuum adsorption assembly adsorbs the substrate, the sealing ring is pressed to be flush with the heating platform. By vacuum adsorbing the substrate, the substrate is brought close to the heating platform, the substrate presses the sealing ring, and the sealing ring is deformed under pressure until the substrate is in close contact with the heating platform. Due to the sealing effect of the sealing ring, a sealed connection can be formed between the heating platform and the substrate, avoiding the problems of poor sealing and unstable adsorption effect during the adsorption of the vacuum chuck assembly, thereby forming good heat conduction and uniform heating, and avoiding the problems of warping strain and cracking caused by uneven heating due to poor contact.

Description

Technical Field

[0001] The present invention relates to the technical field of annealing processes, and particularly to a heating annealing device and method with vacuum adsorption. Background Art

[0002] Solar thin-film battery: A solar thin-film battery, also known as a "solar chip" or "photovoltaic cell", is an optoelectronic device that directly generates electricity using sunlight.

[0003] In the production of solar thin-film batteries, large-area glass substrates are required. During the processing of large-area glass substrates, in order to ensure their quality and further ensure the service life of power generation equipment, annealing processes need to be performed on the large-area glass substrates and the film layers thereon to improve the crystallization quality of the film layers. Specifically, the heating annealing process for large-area glass substrates is widely used. For example, in the perovskite field, a large-area perovskite thin film is coated on a glass substrate and then annealed at 100-150 °C to complete film crystallization; in the lithography field, after a photoresist is coated on a glass substrate, thermal annealing is required to evaporate excess solvent, and so on.

[0004] Currently, existing annealing processes usually use a hot plate to heat large-area glass substrates to complete annealing.

[0005] Specifically, the large-area glass substrate is adsorbed on the hot plate by means of vacuum adsorption. Specifically, a plurality of air extraction holes are provided on the hot plate, and the substrate is placed on the hot plate. The substrate is adsorbed on the tabletop by evacuating the air, and heat is transferred between the hot plate and the substrate by heat conduction to complete the heating process.

[0006] However, the above heating method has the following problems:

[0007] I. Local temperature difference: Since the substrate and the hot plate are in hard contact, there will be local gaps between them and they cannot be completely sealed, resulting in the substrate not being able to fully adhere to the tabletop, so that heat cannot be transferred by heat conduction locally, resulting in a lower local temperature and a temperature difference, and then a high fragmentation rate;

[0008] II. Poor crystallization quality: Temperature is very important for the perovskite crystallization process. Uneven local temperature will lead to inconsistent crystallization quality; especially the large number of air extraction holes distributed on the surface of the hot plate will cause a large temperature difference between the hole positions and other areas, resulting in poor crystallization quality of the film layer and unable to precisely control film formation.

[0009] III. Large initial temperature difference: When first placed on the heating table, since adsorption has not been started yet, the adhesion between the substrate and the tabletop is poor, with some areas in contact and others not, resulting in a large temperature difference in a very short time, leading to fragmentation.

[0010] Therefore, how to alleviate the temperature difference to ensure the heating and annealing effect of the substrate is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0011] In view of this, the present invention provides a heating and annealing device with vacuum adsorption to ensure uniform heating of the substrate and thus ensure the annealing effect of the substrate. At the same time, before vacuum adsorption, the sealing ring supports the substrate to prevent the substrate from contacting the heating platform and generating a temperature difference. In addition, the present invention also provides a heating and annealing method with vacuum adsorption.

[0012] To achieve the above object, the present invention provides the following technical solutions:

[0013] A heating and annealing device with vacuum adsorption for heating and annealing a substrate, comprising:

[0014] A heating platform, on which a sealing ring is arranged circumferentially. The sealing ring protrudes from the surface of the heating platform and is used to support the substrate, and the vertical projection of the substrate on the heating platform can completely cover the sealing ring;

[0015] A vacuum adsorption assembly, which is arranged on the heating platform, and the sealing ring is wound around the outside of the vacuum adsorption assembly. When the vacuum adsorption assembly adsorbs the substrate, the sealing ring is pressed to be flush with the heating platform.

[0016] Preferably, in the above heating and annealing device with vacuum adsorption, the shape of the sealing groove is the same as the edge contour of the substrate.

[0017] Preferably, in the above heating and annealing device with vacuum adsorption, the heating platform has a sealing groove, and the sealing ring is limited and clamped or bonded in the sealing groove;

[0018] And the relationship between the height h of the sealing ring protruding from the heating platform when installed in the sealing groove and the diameter D of the sealing ring is:

[0019] 10% D ≤ h ≤ 50% D.

[0020] Preferably, in the above heating and annealing device with vacuum adsorption, the vacuum adsorption assembly includes:

[0021] An adsorption channel for adsorbing the substrate, and the adsorption channel penetrates through the heating platform;

[0022] A vacuum pump, which is communicated with the adsorption channel.

[0023] Preferably, in the above heating and annealing device with vacuum adsorption, the adsorption channel includes:

[0024] The exhaust groove etched on the heating platform;

[0025] The air extraction hole communicated with the exhaust groove, the air extraction hole is opened on the heating platform and can be hermetically communicated with the vacuum extraction assembly, and the diameter of the air extraction hole is smaller than the diameter of the exhaust groove.

[0026] Preferably, in the above-mentioned vacuum adsorption heating annealing device, the vacuum adsorption assembly further includes:

[0027] The solenoid valve for controlling the on-off of the adsorption channel;

[0028] The control assembly, the control assembly is signal-connected to the solenoid valve.

[0029] Preferably, in the above-mentioned vacuum adsorption heating annealing device, the adsorption channels are multiple and are evenly arranged along the circumferential direction of the sealing ring, and all the adsorption channels are communicated with the vacuum pump.

[0030] Preferably, in the above-mentioned vacuum adsorption heating annealing device, it further includes a temperature detection device for obtaining the temperature of the heating platform, and the temperature detection device is signal-connected to the control assembly. When the temperature detection device detects that the temperature is higher than the preset temperature, the control assembly controls the solenoid valve to conduct, and the control assembly controls the heating temperature of the heating platform.

[0031] Preferably, in the above-mentioned vacuum adsorption heating annealing device, the heating platform is an aluminum alloy plate or a stainless steel plate.

[0032] A vacuum adsorption heating annealing method, which is applied to the vacuum adsorption heating annealing device as described in any one of the above, includes the steps:

[0033] Start the heating platform to heat the substrate to reach the set temperature;

[0034] Place the substrate to be processed, the substrate is placed on the sealing ring of the heating platform, and the sealing ring is completely attached to the bottom surface of the substrate;

[0035] Extract the air in the heating space surrounded by the substrate, the heating platform and the sealing ring through the vacuum chuck assembly until the substrate presses the sealing ring to make the substrate and the heating platform hermetically attached;

[0036] Anneal for a preset time until the annealing process is completed;

[0037] Restore the pressure in the heating space through the vacuum chuck assembly, release the substrate, and remove the substrate;

[0038] Turn off the heating function of the heating platform.

[0039] The present invention provides a vacuum adsorption heating and annealing device. By vacuum adsorbing a substrate, the substrate is brought close to a heating platform, causing the substrate to squeeze a sealing ring. The sealing ring is deformed under pressure until the substrate is in close contact with the heating platform. And due to the sealing effect of the sealing ring, a sealed connection can be formed between the heating platform and the substrate, avoiding problems such as poor sealing and unstable adsorption effect during the adsorption of the vacuum adsorption component, thereby forming good heat conduction and uniform heating, and avoiding warping strain and poor contact caused by uneven heating.

[0040] At the same time, before vacuum adsorption, the sealing ring plays a supporting role for the substrate, separating the substrate and the heating platform, and avoiding the generation of temperature difference due to the contact between the substrate and the heating platform before adsorption. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0042] Figure 1 It is the front view of the vacuum adsorption heating and annealing device disclosed in the embodiment of the present invention;

[0043] Figure 2 It is the side view of the vacuum adsorption heating and annealing device disclosed in the embodiment of the present invention before evacuation;

[0044] Figure 3 It is the side view of the vacuum adsorption heating and annealing device disclosed in the embodiment of the present invention after evacuation;

[0045] Figure 4 It is the front view cross-sectional view of the heating platform and the first sealing ring of the uniform heating and annealing device disclosed in the embodiment of the invention;

[0046] Figure 5 It is the flow chart of the uniform heating and annealing method disclosed in the embodiment of the present invention;

[0047] Among them,

[0048] 1 is the heating platform, and 11 is the sealing ring;

[0049] 2 is the communication channel, 21 is the exhaust groove, and 22 is the air extraction hole;

[0050] 3 is the substrate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0051] The present invention discloses a vacuum adsorption heating annealing device to ensure uniform heating of the substrate and guarantee the annealing effect of the substrate. In addition, the present invention also discloses a vacuum adsorption heating annealing method.

[0052] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0053] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0054] As Figure 1 and Figure 2 shown, the present invention discloses a vacuum adsorption heating annealing device for heating and annealing a substrate 3, which specifically includes: a heating platform 1 and a vacuum adsorption component. Among them, the heating platform 1 has a sealing ring 11 arranged circumferentially. The sealing ring 11 protrudes from the surface of the heating platform 1 and is used to support the substrate 3, and the vertical projection of the substrate 3 on the heating platform 1 can completely block the sealing ring 11. Specifically, the above-mentioned sealing ring 11 is a closed annular member, and the sealing ring 11 can deform when pressed. During installation, the sealing ring 11 is fixed on the heating platform. And the above-mentioned vacuum adsorption component is arranged on the heating platform 1, and the sealing ring 11 is wound around the outside of the vacuum adsorption component, and when the vacuum adsorption component adsorbs the substrate 3, the sealing ring 11 is pressed and flush with the heating platform 1.

[0055] It should be limited that the vertical projection of the substrate 3 on the heating platform 1 can completely block the sealing ring 11. In this way, it can be ensured that the sealing ring 11 is completely attached to the substrate 3, and it is ensured that the heating space formed among the substrate 3, the heating platform 1 and the sealing ring 11 is a sealed space.

[0056] During use, the substrate 3 to be processed is placed on the sealing ring 11, and it is ensured that the sealing ring 11 is completely attached to the substrate 3, so that a sealed heating space is formed among the substrate 3, the heating platform 1 and the sealing ring 11; then, the substrate 3 is adsorbed by the vacuum adsorption component, so that the substrate 3 continuously approaches the heating platform 1. During this process, the sealing ring 11 is deformed under pressure until the substrate 3 supported by the sealing ring 11 is completely attached to the heating platform 1, and then the heating platform 1 is started for heating.

[0057] In this application, the substrate 3 is adsorbed by vacuum to make the substrate 3 close to the heating platform 1, so that the substrate 3 presses the sealing ring 11. The sealing ring 11 is deformed under pressure until the substrate 3 is in close contact with the heating platform 1. And due to the sealing effect of the sealing ring 11, the heating platform 1 and the substrate 3 can be hermetically connected, avoiding the problems of poor sealing and unstable adsorption effect during the adsorption of the vacuum adsorption component. Thus, good heat conduction is formed, and the heat is evenly distributed, avoiding the problems of warping strain and poor contact caused by uneven heating.

[0058] In a specific embodiment, the shape of the above-mentioned sealing ring 11 is the same as the edge contour of the substrate 3. As Figure 1 shown, the sealing ring 11 can be set as a rectangular ring. Correspondingly, the substrate 3 is a rectangular plate. Through the above setting, it is convenient for the substrate 3 to contact the sealing ring 11 and ensure that the substrate 3 is stressed circumferentially, preventing the substrate 3 from tilting when being pressed. In practice, when the substrate 3 is a disc, the sealing ring 11 can also be set as a circular ring. Those skilled in the art can understand that the shape of the sealing ring 11 and the edge contour shape of the substrate 3 can be set according to different needs and are all within the protection scope.

[0059] As Figures 2 - 4 shown, a sealing groove is provided on the above-mentioned heating platform 1. During assembly, the above-mentioned sealing ring 11 is limited and clamped or bonded in the sealing groove. Those skilled in the art can understand that the assembly method of the sealing ring 11 can be set according to different needs, as long as it is ensured that the sealing ring 11 can be deformed by extrusion when pressed by the substrate 3.

[0060] In practice, since the sealing ring 11 is assembled in the sealing groove, therefore, the shape of the sealing ring 11 can be limited by limiting the shape of the sealing groove. That is, the sealing groove can be set as a rectangular annular groove. Then, through the limiting effect of the sealing groove, the flexible sealing ring 11 can be snapped into the sealing groove, and at the same time, the shape of the sealing ring 11 is limited.

[0061] Referring to Figures 2 - 4 the content, the above-mentioned sealing groove is an arc groove, and the cross-section of the sealing ring 11 is circular. Specifically, the sealing ring 11 is limited and clamped in the sealing groove through the notch of the sealing groove. A method of assembling the sealing groove and the sealing ring 11 is disclosed here. In practice, in order to provide a margin for the deformation of the sealing ring 11, the arc groove of the sealing groove can be set as an elliptical arc groove, and the major axis of the elliptical arc is slightly larger than the diameter of the sealing ring 11. The specific dimensions and shape of the sealing groove can be set according to the deformation of the sealing ring 11 and the size inside the sealing ring 11.

[0062] During use, when pressurizing, if the height of the sealing ring 11 protruding from the heating platform 1 is too large, it cannot be fully deformed, resulting in poor contact between the substrate 3 and the heating platform 1; if the height of the sealing ring 11 protruding from the heating platform 1 is too small, a good sealing effect cannot be formed. Therefore, the size of the sealing ring 11 is specifically limited, and the relationship between the height h of the sealing ring 11 protruding from the heating platform 1 and the diameter D of the sealing ring 11 is required to be: 10% D ≤ h ≤ 50% D, combined with Figure 4 Content.

[0063] Combined with the above content, the heating platform 1 disclosed in this application can be an aluminum alloy plate, a stainless steel plate or a glass-ceramic heating plate. Using a glass-ceramic heating plate can ensure uniform surface temperature and high heating efficiency.

[0064] The heating method of the heating platform can be set according to different needs.

[0065] In a further embodiment, the above-mentioned vacuum adsorption assembly includes an adsorption channel 2 and a vacuum pump (not shown in the figure). Among them, the adsorption channel 2 penetrates through the heating platform 1, and the vacuum pump realizes vacuum pumping and pressure release of the heating space through the adsorption channel 2. In practice, a chuck structure can also be set, that is, the substrate 3 is adsorbed by vacuum pumping and pressure release of the chuck structure.

[0066] During operation, the air in the heating space can be extracted by starting the vacuum pump, so that the heating space is in a vacuum state, and the substrate 3 is adsorbed through the adsorption channel 2. The pressure condition in the heating space can be set according to different needs. When the extrusion force required by the sealing ring 11 is large, the heating space needs to be in a vacuum state; when the extrusion force required by the sealing ring 11 is not large, the pressure in the heating space can be reduced according to the situation.

[0067] Based on the above technical solutions, the vacuum adsorption assembly in this application further includes a solenoid valve and a control component. Among them, the solenoid valve is used to control the on-off of the adsorption channel 2, and the above-mentioned control component is signal-connected to the solenoid valve to control the on-off of the solenoid valve. By setting the solenoid valve and the control component in this application, the vacuum pumping situation of the adsorption channel 2 can be controlled in real time. Using the solenoid valve and the control component can ensure the response speed and improve the control accuracy.

[0068] A plurality of adsorption channels 2 are disclosed in this application, and these adsorption channels 2 are evenly arranged along the circumference of the sealing ring 11. When the sealing ring 11 is a square ring, there are four adsorption channels 2, and they are located at the center positions of the four sides of the square ring. This can ensure the stable adsorption of the adsorption channel 2 to the substrate 3. The number and distribution of the adsorption channels 2 can be set according to different needs. In practice, a plurality of adsorption channels 2 can also be distributed on the heating platform 1 and inside the sealing ring 11.

[0069] To prevent the substrate 3 from tilting when the adsorption channels 2 adsorb the substrate 3, all the adsorption channels 2 are connected to a vacuum pump. That is, a vacuum pump is used to evacuate multiple adsorption channels 2 simultaneously, ensuring that the adsorption effects of these adsorption channels 2 start and stop synchronously. It is necessary to ensure that the distances from the vacuum pump to each adsorption channel 2 are the same, so as to ensure that when the vacuum pump starts, the pressure drops at all the adsorption channels 2 decrease synchronously and with the same value.

[0070] It should be noted that in practice, the vacuum pumps can also be in one-to-one correspondence with the adsorption channels 2, that is, each vacuum pump controls one adsorption channel 2. During control, all the vacuum pumps need to start and stop synchronously.

[0071] As Figure 2 and Figure 3 shown, the specific structure of the adsorption channel 2 involved above includes: an exhaust groove 21 and an air extraction hole 22. Among them, the exhaust groove 21 is located on the side of the heating platform 1 close to the substrate 3, while the air extraction hole 22 is located on the side of the heating platform 1 far from the substrate 3. The bottom of the exhaust groove 21 is connected to the air extraction hole 22, and their axes coincide. The diameter of the exhaust groove 21 is smaller than that of the air extraction hole 22. The above method forms a stepped channel that penetrates the heating platform 1 for the adsorption channel 2.

[0072] In a further embodiment, the vacuum adsorption heating annealing device further includes a temperature detection device (not shown in the figure) for obtaining the temperature of the heating platform, and the temperature detection device is signal-connected to the control component. When the temperature detection device detects that the temperature is higher than the preset temperature, the control component controls the solenoid valve to conduct.

[0073] During operation, when the temperature detection device detects that the temperature of the heating platform 1 is higher than the preset temperature, in practice, this temperature can be set as the temperature for preheating the substrate 3, such as 45 °C. Thus, when the temperature detection device detects that the heating platform 1 is in the preheating working state, at this time, the control component controls the solenoid valve to conduct, so that the vacuum pump evacuates the adsorption channel 2 to complete the fixation of the substrate by the suction cup. Then, the control component controls the heating platform 1 to raise the temperature until the required heating temperature.

[0074] By adopting the above method, the ineffective work during the heating process of the substrate 3 can be avoided.

[0075] In addition, the present application also discloses a uniform heating annealing method, as Figure 5 shown, which mainly applies the heating annealing device disclosed in the above embodiment, and specifically includes the following steps:

[0076] Step S1: Heating;

[0077] Start the heating platform to reach the preset temperature. The heating temperature of the heating platform can be set according to different needs and is within the protection range.

[0078] In practice, the heating process of the heating platform can be divided into preheating and normal heating to prevent sudden temperature changes in the heating space from affecting the sealing effect.

[0079] It should be noted that the temperature change rate during the heating process can be set according to different needs and is within the protection range.

[0080] Step S2: Assemble the substrate;

[0081] Place the substrate to be processed on the sealing ring of the heating platform heated to the preset temperature. The sealing ring fits with the bottom surface of the substrate, lifting the substrate off the heating platform. During this process, the sealing ring is a complete closed-loop structure and can completely fit with the bottom surface of the substrate, forming a sealed chamber, i.e., the heating space, between the inside of the sealing ring, the substrate, and the heating platform.

[0082] Step S3: Vacuum adsorption;

[0083] Extract the air in the heating space surrounded by the substrate, the heating platform, and the sealing ring through the vacuum chuck assembly until the substrate presses the sealing ring to make the substrate fit tightly with the heating platform. During this process, the working time of the vacuum pump can be adjusted according to different situations to meet the requirements of different vacuum degrees. It is necessary to ensure that during the vacuum pumping process of the vacuum pump, the sealing ring is finally flush with the heating platform, and the above-mentioned substrate fits with the heating platform.

[0084] Step S4: Annealing.

[0085] Conduct annealing treatment on the heated substrate for a preset time until the annealing process is completed. It should be noted that the annealing time for the annealing process needs to be set in combination with the heating temperature of the substrate, etc. Specifically, it can refer to the existing process. The core here is to attach the substrate to the heating platform through the sealing ring.

[0086] Step S5: Sorting and picking up.

[0087] Restore the pressure in the heating space through the vacuum adsorption assembly, release the substrate, and remove the substrate; turn off the heating function of the heating platform.

[0088] In this application, by increasing the pressure difference between both sides of the substrate, the substrate presses the sealing ring, and the sealing ring is deformed under pressure until the substrate is in close contact with the heating platform. And due to the sealing effect of the sealing ring, a sealed connection can be formed between the heating platform and the substrate, avoiding the problems of poor sealing and unstable adsorption results during the adsorption of the vacuum adsorption component. Thus, good heat conduction is formed, and the heating is uniform, avoiding the problems of warping strain and poor contact caused by uneven heating.

[0089] As shown in the present invention and the claims, unless the context clearly indicates an exception, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. An element defined by the statement "comprising one..." does not exclude the existence of another identical element in the process, method, article, or device including the element.

[0090] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0091] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vacuum adsorption heating and annealing device, characterized in that, For heating and annealing a substrate, comprising: A heating platform, on which there is a sealing ring arranged circumferentially. The sealing ring protrudes from the surface of the heating platform and is used to support the substrate, and the vertical projection of the substrate on the heating platform can completely cover the sealing ring; A vacuum adsorption component, which is arranged on the heating platform, and the sealing ring is wound around the outside of the vacuum adsorption component. When the vacuum adsorption component adsorbs the substrate, the sealing ring is pressed to be flush with the heating platform; there is a sealing groove on the heating platform, and the sealing ring is limited and clamped or bonded in the sealing groove. The shape of the sealing groove is the same as the edge contour of the substrate, and the relationship between the height h of the sealing ring protruding from the heating platform when installed in the sealing groove and the diameter D of the sealing ring is: 10% D ≤ h ≤ 50% D; The vacuum adsorption component includes: an adsorption channel for adsorbing the substrate, and the adsorption channel penetrates through the heating platform; a vacuum pump, which is communicated with the adsorption channel; The adsorption channel includes: an exhaust groove etched on the heating platform; an air extraction hole communicated with the exhaust groove, and the air extraction hole is opened on the heating platform and can be hermetically communicated with the vacuum pump. The diameter of the air extraction hole is smaller than the diameter of the exhaust groove.

2. The vacuum adsorption heating and annealing device according to claim 1, wherein The vacuum adsorption component further includes: An electromagnetic valve for controlling the on-off of the adsorption channel; A control component, which is signal-connected to the electromagnetic valve.

3. The vacuum adsorption heating and annealing device according to claim 2, characterized in that, The adsorption channels are multiple and are evenly arranged along the circumference of the sealing ring, and all the adsorption channels are communicated with the vacuum pump.

4. The vacuum adsorption heating and annealing device according to claim 3, characterized in that, It further includes a temperature detection device for obtaining the temperature of the heating platform, and the temperature detection device is signal-connected to the control component. When the temperature detection device detects that the temperature is higher than the preset temperature, the control component controls the electromagnetic valve to conduct, and the control component controls the heating temperature of the heating platform.

5. The vacuum adsorption heating and annealing device according to any one of claims 1-4, characterized in that The heating platform is an aluminum alloy plate or a stainless steel plate.

6. A vacuum adsorption heating annealing method, characterized in that, Applying the heating and annealing device with vacuum adsorption as described in any one of claims 1-5, comprising the steps: Start the heating platform to heat the substrate to reach the set temperature; Place the substrate to be processed on the sealing ring of the heating platform, and the sealing ring is completely attached to the bottom surface of the substrate; Extract the air in the heating space surrounded by the substrate, the heating platform and the sealing ring through the vacuum suction cup component until the substrate presses the sealing ring to make the substrate and the heating platform hermetically attached; Anneal for a preset time until the annealing process is completed; Restore the pressure in the heating space through the vacuum suction cup component, release the substrate, and remove the substrate; turn off the heating function of the heating platform.

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