Semiconductor device and electronic apparatus

Abstract

Embodiments provide a semiconductor device capable of being attached to and detached from a printed wiring board and an electronic device. The semiconductor device of the embodiments includes a substrate, a semiconductor chip, a resin, and a terminal. The substrate extends in a first direction. The semiconductor chip is disposed above the substrate in the first direction. The resin covers the semiconductor chip. The terminal is disposed below the substrate in the first direction. The resin includes a first portion and a second portion. A height of the first portion in the first direction is higher than a height of the second portion in the first direction. An end portion of the second portion in a second direction along the first direction is a portion of an end portion of the resin in the second direction.

Description

[0001] This application enjoys priority based on Japanese Patent Application No. 2021-109060 (filed on June 30, 2021). This application incorporates the entire contents of the basic application by reference to that basic application. Technical Field

[0002] The implementation methods involve semiconductor devices and electronic devices. Background Technology

[0003] Semiconductor devices with built-in semiconductor chips are known. These semiconductor chips include, for example, chips that form circuitry capable of storing data in a non-volatile NAND flash memory. The semiconductor devices are mounted on a printed circuit board via solder, sockets, etc. The printed wiring board on which the semiconductor devices are mounted is installed as an electronic device in an information processing apparatus. Summary of the Invention

[0004] The embodiments provide a semiconductor device and an electronic device that can be easily mounted and dismounted relative to a printed circuit board.

[0005] The semiconductor device of the embodiment includes a substrate, a semiconductor chip, a resin, and terminals. The substrate extends along a first surface. The semiconductor chip is disposed above the substrate in a first direction. The resin covers the semiconductor chip. The terminals are disposed below the substrate in the first direction. The resin includes a first portion and a second portion. The height of the first portion in the first direction is greater than the height of the second portion in the first direction. The end of the second portion along the first surface in a second direction is a portion of the end of the resin in the second direction. Attached Figure Description

[0006] Figure 1 This illustrates a structural example of the semiconductor device according to the first embodiment.

[0007] Figure 2 This section illustrates a structural example of the electronic device according to the first embodiment.

[0008] Figure 3 It is along Figure 2 The cross-sectional view along line III-III shows an example of the cross-sectional structure of the electronic device according to the first embodiment.

[0009] Figure 4 This is a block diagram illustrating an example of the configuration of an information processing apparatus equipped with the semiconductor device according to the first embodiment.

[0010] Figure 5 This illustrates a structural example of the semiconductor device involved in the second embodiment.

[0011] Figure 6This illustrates a structural example of the electronic device according to the second embodiment.

[0012] Figure 7 This illustrates a structural example of the semiconductor device involved in the third embodiment.

[0013] Figure 8 This illustrates a structural example of the electronic device according to the third embodiment.

[0014] Figure 9 This illustrates a structural example of the semiconductor device involved in the fourth embodiment.

[0015] Figure 10 This illustrates a structural example of the electronic device according to the fourth embodiment.

[0016] Label Explanation

[0017] 1-4 Semiconductor devices; 5-8 Slots; 10, 20, 30, 40 Terminals; 9, 19, 29, 39 Solder balls; 11, 21, 31, 41 Substrates; 12, 22, 32, 42 Sealing resins; 13, 23, 33, 43 Mounting components; 14, 24, 34, 44 Screws; 15, 25, 35, 45 Printed wiring boards; 16 Control chips; 17 NAND chips; 18a, 18b Leads; 100, 102, 103, 104 Electronic devices; 200 CPUs; 400 ROMs; 500 RAMs; 600 Information processing devices. Detailed Implementation

[0018] The embodiments are described below with reference to the accompanying drawings. Each embodiment illustrates an apparatus or method for embodying the technical concept of the invention. The drawings are schematic or conceptual, and the dimensions and proportions of each drawing are not necessarily the same as those in reality. All descriptions of a particular embodiment are applicable to other embodiments unless explicitly or obviously excluded. The technical concept of the present invention is not determined by the shape, structure, or arrangement of the constituent elements.

[0019] Furthermore, in the following description, constituent elements with substantially the same function and structure will be labeled with the same number. The number following the character constituting the reference number is used to distinguish elements that are referenced by reference numbers containing the same characters and have the same structure from one another. When it is not necessary to distinguish elements represented by reference numbers containing the same characters from one another, these elements are referred to separately by reference numbers containing only characters.

[0020] [1] First Embodiment

[0021] [1-1] Structure (Construction)

[0022] Hereinafter, an example of the structure of the semiconductor device according to the first embodiment will be described.

[0023] Furthermore, in the figures referred to below, the X and Y directions are along the substrate 11 of the semiconductor device 1 described later (e.g., see reference 11). Figure 1 The Z-direction corresponds to the direction of the surface of the substrate 11 described later (e.g., refer to...). Figure 1 The vertical direction of the surface. Additionally, in the accompanying figures referred to below, sometimes the positive direction of the vertical axis is referred to as the upper side, and the negative direction as the lower side. Similarly, sometimes the positive direction of the horizontal axis is referred to as the right side, and the negative direction as the left side.

[0024] For example, in an XY top view viewed from the +Z direction, the top represents the +Y direction and the bottom represents the -Y direction. In the XY top view viewed from the +Z direction, the right side represents the +X direction and the left side represents the -X direction. Similarly, in an XZ top view viewed from the -Y direction, the top represents the +Z direction and the bottom represents the -Z direction. In the XZ top view viewed from the -Y direction, the right side represents the +X direction and the left side represents the -X direction.

[0025] In several figures, shading lines have been appropriately added for easier observation. The shading lines in the figures are not necessarily related to the material or properties of the constituent elements to which they are added. In sectional views, constituent elements such as insulating layers, wiring, and contacts have been appropriately omitted for easier observation.

[0026] [1-1-1] Structure of semiconductor device 1

[0027] Figure 1 This illustrates a structural example of the semiconductor device 1 according to the first embodiment. Figure 1 The image above is a top view (XY plane) taken from the +Z direction of semiconductor device 1. Figure 1 The figure below is a side view (XZ plane) taken from the -Y direction of semiconductor device 1. Semiconductor device 1 is, for example, a packaged device containing a semiconductor chip.

[0028] like Figure 1 As shown, the semiconductor device 1 includes, for example, a plurality of terminals 10, a plurality of solder balls 9, a substrate 11, and a sealing resin 12. The substrate 11 is formed, for example, into a plate shape extending along the XY plane. The substrate 11 includes, for example, an insulator such as ceramic. The substrate 11 includes terminals 10 in its lower portion (the portion on the -Z direction side).

[0029] Solder balls 9 are disposed on the lower surface of substrate 11 (the surface extending from the XY plane in the -Z direction). The solder balls are formed, for example, in a spherical or hemispherical shape. Below substrate 11, the solder balls 9 are arranged in a grid pattern in the XY plane. The number of solder balls 9 can be arbitrarily set. The solder balls 9 include a conductor, such as solder. The solder balls 9 are connected to terminals 10. The solder balls 9 have, for example, a structure such as a BGA (Ball Grid Array) or LGA (Land Grid Array). BGA and LGA are terminal layout methods, used, for example, in cases with many input / output pins and / or in cases where the area observed from the Z direction of semiconductor device 1 is suppressed. The solder balls 9 are used as external terminals of semiconductor device 1. The solder balls 9 are connected to the printed wiring substrate 15 described later (e.g., refer to...). Figure 2 The wiring pattern is connected.

[0030] The sealing resin 12 is located above the substrate 11 (in the +Z direction). The sealing resin 12 has a rectangular shape in the XY plane. The sealing resin 12 has an end in the XY plane that coincides with the end of the substrate 11.

[0031] The sealing resin 12, for example, has a cross-shaped groove 5 extending along the XY plane. The groove 5 will be described in detail below. The height of the sealing resin 12 in the Z direction varies depending on the location. Specifically, the sealing resin 12 includes a first part 12A and a second part 12B. The first part 12A occupies the lower (-Z side) portion of the sealing resin 12 and has a cuboid shape. The second part 12B occupies the upper (+Z side) portion of the sealing resin 12 and has a surface common to the upper surface of the first part 12A (the XY plane viewed from the +Z direction). The first part 12A and the second part 12B are continuously arranged in the Z direction and formed integrally.

[0032] Part 2 12B comprises four sub-parts 12BS (12BSa, 12BSb, 12BSc, and 12BSd). Sub-part 12BSa is located in the upper left portion of the paper along the XY plane within Part 2 12B. In other words, sub-part 12BSa is located on the -X and +Y direction side of the four sub-parts 12BS. Similarly, sub-parts 12BSb, 12BSc, and 12BSd are located in the upper right, lower left, and lower right portions of the paper along the XY plane within Part 2 12B, respectively. In other words, sub-part 12BSb is located on the +X and +Y direction side of the four sub-parts 12BS, sub-part 12BSc is located on the -X and -Y direction side of the four sub-parts 12BS, and sub-part 12BSd is located on the +X and -Y direction side of the four sub-parts 12BS. The four sub-parts 12BS are spaced apart from each other. Each sub-part 12BS has, for example, a cuboid shape. Due to the shape and arrangement of each sub-part 12BS, a groove 5 is formed between each sub-part 12BS. That is, each sub-part 12BS is separately arranged by the groove 5. The bottom surface of the groove 5 corresponds to a part of the upper surface of the first part 12A. The sealing resin 12 has such a shape that its height in the Z direction varies depending on the location. That is, in the region (i.e., groove 5) between sub-parts 12BSa, 12BSb, 12BSc, and 12BSd, the height of the sealing resin 12 in the Z direction is lower than that of sub-parts 12BSa, 12BSb, 12BSc, and 12BSd. The groove 5 refers to the space generated in the region between sub-parts 12BSa, 12BSb, 12BSc, and 12BSd. Therefore, in this embodiment, the groove 5 refers to the space generated due to the height difference of the sealing resin 12 in the Z direction.

[0033] The sealing resin 12 can also be understood as follows. The sealing resin 12 can be divided into a portion having the second part 12B and a portion without the second part 12B. The portion without the second part 12B refers to the portion below the groove 5 in the first part 12A, and the portion having the second part 12B refers to all the sealing resin 12 except for the portion below the groove 5 mentioned above. The height in the Z direction of the portion having the second part 12B is higher than the height of the portion without the second part 12B.

[0034] The groove 5 can be formed, for example, by grinding the portion of the rectangular-shaped sealing resin into which the groove 5 is formed before processing using a grinding machine or the like. Alternatively, the groove 5 can also be formed, for example, by forming an uneven surface corresponding to the groove 5 in a mold or the like that in which liquid resin flows to form the sealing resin 12.

[0035] The depth and shape of slot 5 will be described in detail later. Here, the depth of slot 5 is equivalent to the height of sub-part 12BS in the Z direction.

[0036] [1-1-2] Structure of electronic device 100

[0037] Next, use Figure 2 An example of a structure in which a semiconductor device 1 is mounted on a printed wiring substrate 15 will be described.

[0038] Figure 2 This section illustrates a structural example of the electronic device 100 according to the first embodiment. Figure 2 The image above is a top view of electronic device 100, showing the relationship between... Figure 1 The image above is observed from the same direction. Figure 2 The following image is a side view of electronic device 100, showing the relationship between... Figure 1 The image below is observed from the same direction.

[0039] like Figure 2 As shown, the electronic device 100, for example, has Figure 1 The semiconductor device 1, mounting component 13, screw 14, and printed wiring substrate 15 are shown. Screw 14 is an example of a fixing component.

[0040] The printed wiring substrate 15 is located below the semiconductor device 1 (in the -Z direction). When the semiconductor device 1 is mounted on the printed wiring substrate 15, the printed wiring substrate 15 and the solder balls 9 are electrically connected by contact with the wiring pattern provided on the printed wiring substrate 15. The wiring pattern of the semiconductor device 1 and the printed wiring substrate 15 can be directly connected via the solder balls 9, or they can be connected via other electrodes such as sheet-type slots. The printed wiring substrate 15 has holes for inserting screws 14.

[0041] Mounting member 13 has a cross-shaped portion extending along the XY plane, a portion extending in the Z direction, and a portion that contacts the printed wiring substrate 15. The cross-shaped portion extending along the XY plane, the portion extending in the Z direction, and the portion that contacts the printed wiring substrate 15 are hereinafter sometimes referred to as upper portion 13A, side portion 13B, and contact portion 13C, respectively. Upper portion 13A, side portion 13B, and contact portion 13C are continuously formed as one unit. A portion of upper portion 13A and a portion of side portion 13B are joined at right angles within the allowable tolerances of manufacturing processes. Another portion of side portion 13B is joined at right angles to a portion of contact portion 13C within the allowable tolerances of manufacturing processes.

[0042] The upper portion 13A is a cross shape extending along the XY plane. The upper portion 13A is, for example, the same cross shape as the slot 5 but slightly smaller. The upper portion 13A has a shape that allows it to be inserted into the slot 5. By inserting the upper portion 13A into the slot 5, the mounting member 13 can suppress the offset of the semiconductor device 1 in the XY direction. Furthermore, by inserting the upper portion 13A into the slot 5, the electronic device 100 according to the first embodiment can suppress height in the Z direction.

[0043] The size of the upper portion 13A in the XY direction is sufficient to allow it to be embedded in the slot 5. To suppress offset in the XY direction of the semiconductor device 1, the size of the upper portion 13A in the XY direction is preferably close to the size of the slot 5 in the XY direction. More specifically, for the size of the upper portion 13A in the XY direction to be close to the size of the slot 5 in the XY direction, this includes the widths of the portions of the upper portion 13A forming the cross in the X and Y directions being close to the widths of the portions of the slot 5 forming the cross in the X and Y directions, respectively, and / or the lengths of the upper portion 13A in the X and Y directions being close to the lengths of the slot 5 in the X and Y directions, respectively.

[0044] The height (or thickness) of the upper portion 13A in the Z direction is sufficient to suppress the offset of the semiconductor device 1 in the XY direction, and may exceed the depth of the groove 5. However, in order to suppress the height of the electronic device 100 in the Z direction, the height of the upper portion 13A in the Z direction is preferably controlled within the depth of the groove 5. In addition, the depth of the groove 5 is sufficient to ensure that the upper portion 13A is stably embedded in the groove 5.

[0045] Side portion 13B extends in the Z direction. With upper portion 13A embedded in groove 5, side portion 13B extends along the Z direction from the end of the cross of upper portion 13A to printed wiring substrate 15. In other words, with upper portion 13A embedded in groove 5, side portion 13B extends along the side surface of semiconductor device 1 in the Z direction. The length of side portion 13B in the Z direction is sufficient to suppress offset of semiconductor device 1 in the Z direction when semiconductor device 1 is mounted on printed wiring substrate 15.

[0046] The contact portion 13C has a shape that extends along the XY plane. The contact portion 13C has a hole through which the screw 14 passes. When the semiconductor device 1 is mounted on the printed wiring substrate 15, the contact portion 13C is in contact with the printed wiring substrate 15.

[0047] Thus, the mounting component 13 mainly suppresses the offset of the semiconductor device 1 in the XY direction through the upper part 13A, and mainly suppresses the offset of the semiconductor device 1 in the Z direction through the side part 13B. Together with the screw 14, the semiconductor device 1 is fixed to the printed wiring substrate 15 via the contact part 13C. That is, the mounting component 13 has the function of pressing the semiconductor device 1 onto the printed wiring substrate 15.

[0048] The screw 14 functions to fix the mounting member 13 to the printed wiring substrate 15. The screw 14 passes through a hole provided in the contact portion 13C and is inserted into the hole provided in the printed wiring substrate 15. For example, if the screw 14 has external threads, the interior of the hole in the printed wiring substrate 15 into which the screw 14 is inserted may also have a groove corresponding to the thread teeth provided in the screw 14. By inserting and screwing the screw 14 into the hole provided in the printed wiring substrate 15, the mounting member 13, sandwiched between the screw 14 and the printed wiring substrate 15, is fixed. By fixing the mounting member 13, the semiconductor device 1 is fixed to the printed wiring substrate 15. That is, the screw 14 fixes the mounting member 13 and the semiconductor device 1 to the printed wiring substrate 15. Figure 2 The example shown depicts a case with four screws 14. The number of screws 14 can be arbitrarily set as long as it is sufficient to fix the mounting component 13 to the printed wiring substrate 15. For example, the electronic device 100 can also be fixed to one contact portion 13C by two or more screws.

[0049] The fixing mentioned here refers to fixing by tightening screw 14. Therefore, if it is desired to remove the semiconductor device 1 from the printed wiring substrate 15, it can be easily removed by loosening screw 14.

[0050] As described above, the solder ball 9 of the semiconductor device 1 is connected to, for example, the printed wiring substrate 15 of the electronic device 100. The solder ball 9 and the printed wiring substrate 15 are not fixed in place by soldering, but are detachable. That is, the semiconductor device 1 according to the first embodiment is designed to be portable relative to the printed wiring substrate 15 of the electronic device 100.

[0051] Based on the above, the electronic device 100 according to the first embodiment includes: a sealing resin 12 of a semiconductor device 1 having a groove 5; a mounting member 13 having a shape that is embedded into the groove 5; and the mounting member 13 being easily detachable by means of a screw 14 or the like.

[0052] In the electronic device 100 according to the first embodiment, the shape of the slot 5 of the semiconductor device 1 and the mounting member 13 is such that the upper part 13A can be embedded in the slot 5 and the semiconductor device 1 can be fixed to the printed wiring substrate 15 by the mounting member 13.

[0053] That is, the shape of the cross in the groove 5 and the upper part 13A can be, for example, by bending the two lines that make up the cross, forming a crank shape, or bending. Additionally, the parts of the cross in the groove 5 and the upper part 13A can be not connected at right angles. Furthermore, the shape of the cross in the groove 5 and the upper part 13A can be biased towards either the +X or -X direction, or towards either the +Y or -Y direction.

[0054] Alternatively, the groove 5 and the upper portion 13A may not be cross-shaped, but rather line-shaped or quadrilateral-shaped, for example. Even in this case, by embedding the upper portion 13A into the groove 5, offset of the semiconductor device 1 in the XY direction can be suppressed. A configuration in which the upper portion 13A is embedded into the groove 5 and the semiconductor device 1 can be fixed to the printed wiring substrate 15 by the mounting member 13 includes the following configuration: at least one end of the groove 5 in the XY plane includes the end of the sealing resin 12 in the XY plane. Such a configuration will be described in other embodiments described later.

[0055] Similarly, as long as the upper portion 13A is embedded in the slot 5 and the semiconductor device 1 can be fixed to the printed wiring substrate 15 by the mounting member 13, the shape of the semiconductor device 1 in the XY plane viewed from the +Z direction does not have to be a quadrilateral. The shape of the semiconductor device 1 in the XY plane viewed from the +Z direction can, for example, be a quadrilateral with one of its corners chamfered.

[0056] [1-1-3] Cross-sectional structure of electronic device 100

[0057] Figure 3 It is along Figure 2 The cross-sectional view along line III-III shows an example of the cross-sectional structure of the electronic device 100 according to the first embodiment. For example... Figure 3 As shown, the semiconductor device 1 included in the electronic device 100 is used Figure 1 and Figure 2 In addition to the described structure, it also includes, for example, multiple NAND chips 17 (17a to 17d), a control chip 16, and leads 18a and 18b. The substrate 11 includes an insulating portion 11a and a conductive portion 11b. The semiconductor device 1 is, for example, a storage system such as an SSD (Solid State Drive) or a UFS (Universal Flash Storage) device. Hereinafter, the cross-sectional structure of the electronic device 100 will be described.

[0058] NAND chips 17a-17d, control chip 16, and leads 18a and 18b are disposed above substrate 11 (in the +Z direction). NAND chips 17a-17d, control chip 16, and leads 18a and 18b are covered by sealing resin 12. In other words, NAND chips 17a-17d, control chip 16, and leads 18a and 18b are located between substrate 11 and a portion of sealing resin 12.

[0059] NAND chips 17a-17d are, for example, semiconductor chips in which the circuitry of a NAND flash memory is formed using semiconductor materials. NAND flash memory is a storage device capable of storing data in a non-volatile manner. NAND chips 17a-17d are, for example, formed as plates extending along the XY plane. For example, NAND chip 17a is stacked on top of substrate 11, NAND chip 17b is stacked on top of NAND chip 17a, NAND chip 17c is stacked on top of NAND chip 17b, and NAND chip 17d is stacked on top of NAND chip 17c. The NAND chips 17 are insulated from each other, for example, via an insulating layer.

[0060] For example, NAND chip 17b does not completely overlap with NAND chip 17a, but is arranged in a stepped manner with slight offset in the XY plane. Similarly, NAND chip 17c does not completely overlap with NAND chip 17b, but is arranged in a stepped manner with slight offset in the XY plane. Likewise, NAND chip 17d does not completely overlap with NAND chip 17c, but is arranged in a stepped manner with slight offset in the XY plane. By arranging each NAND chip 17a to 17d in a stepped manner, lead 18a can be connected. That is, the width (amount or size) of the offset is sufficient to connect NAND chip 17a and lead 18a.

[0061] exist Figure 3 The example shows NAND chips 17a to 17d, but the number of NAND chips 17 can be set arbitrarily.

[0062] The control chip 16 is, for example, a semiconductor chip in which the circuitry of a memory controller is formed using semiconductor materials. The memory controller is a control device that controls the NAND flash memory formed on the NAND chip 17.

[0063] Lead 18a electrically connects each of the NAND chips 17a-17d to the control chip 16. Specifically, the NAND chips 17a-17d have pads for connection to NAND flash memory, and the control chip 16 has pads for connection to the memory controller. Furthermore, lead 18a electrically connects a portion of the pads on the NAND chips 17a-17d and a portion of the pads on the control chip 16. In this way, the NAND flash memory chips 17a-17d and the memory controller of the control chip 16 transmit and receive various signals via lead 18a.

[0064] Lead 18b electrically connects the control chip 16 and the conductive portion 11b of the substrate 11. Specifically, lead 18b electrically connects another portion of the pads on the control chip 16 to the conductive portion 11b of the substrate 11. Details will be described later, but the control chip 16 transmits and receives signals from the printed wiring substrate 15 via lead 18b, the conductive portion 11b of the substrate 11, terminal 10, and solder ball 9. Such a connection method as leads 18a and 18b is, for example, called wire bonding. Leads 18a and 18b are also called bonding wires. Leads 18a and 18b, for example, contain gold.

[0065] The conductive portion 11b of the substrate 11 is, for example, a wiring formed within the substrate 11. Such wiring is also referred to as a through-silicon electrode (TSV). The conductive portion 11b of the substrate 11 is electrically connected to the terminal 10 and the solder ball 9.

[0066] Solder balls 9 supply power voltage to semiconductor device 1 from outside the semiconductor device 1 via printed wiring substrate 15, for example. For example, solder balls 9 are used to supply power voltage to NAND chips 17a-17d and control chip 16. Additionally, solder balls 9 are used, for example, to transmit and receive signals from external devices of semiconductor device 1 and control chip 16 via printed wiring substrate 15.

[0067] [1-1-4] Structure of the information processing device 600

[0068] Figure 4 This is a block diagram illustrating an example configuration of an information processing apparatus 600 equipped with the semiconductor device 1 according to the first embodiment. The information processing apparatus 600 includes a ROM (Read Only Memory) 400, a RAM (Random Access Memory) 500, and uses... Figure 2 and Figure 3The printed wiring board 15 has been described. The information processing device 600 is, for example, a laptop PC, a smartphone, a tablet computer, or an in-vehicle device. A CPU (Central Processing Unit), ROM 400, RAM 500, and electronic device 100 (in one example, an SSD) are mounted on the printed wiring board 15. The ROM 400 and RAM 500 can also be connected via connectors or slots provided on the printed wiring board 15.

[0069] ROM 400 stores, for example, the program executed by CPU 200 in a non-volatile manner. This program is loaded from ROM 400 into RAM 500 when electronic device 100 is activated. RAM 500 stores the program loaded from ROM 400. CPU 200 executes the program loaded into RAM 500. CPU 200 uses RAM 500 as its working memory. Furthermore, CPU 200 is connected to electronic device 100. CPU 200 requests data to electronic device 100, such as writing data and reading data. Electronic device 100 includes the semiconductor device 1 according to the first embodiment.

[0070] [1-2] Advantages (Effects) of the First Embodiment

[0071] According to the semiconductor device 1 and the electronic device 100 equipped with the semiconductor device 1 described above in the first embodiment, the semiconductor device 1 can be fixed to the printed wiring substrate 15 by the mounting member 13. Therefore, the semiconductor device 1 can be easily replaced. Furthermore, according to the semiconductor device 1 and the electronic device 100 equipped with the semiconductor device 1 in the first embodiment, even when the mounting member 13 is mounted on the semiconductor device 1, the height of the semiconductor device 1 can be maintained in the Z direction, or the change in the height of the electronic device 100 can be kept to a minimum. The detailed effects of the electronic device 100 according to the first embodiment will be described below.

[0072] There is a desire for easy installation and removal of SSDs mounted on the printed circuit board (PCB) of information processing devices (or electronic devices). For example, laptop PCs may have different SSD storage capacities depending on the product. These SSDs with different storage capacities are sometimes sealed in packages of the same standard or shape. If the SSD can be easily replaced after ensuring that the package standard and shape are the same, then products with different SSD storage capacities can be easily manufactured. That is, product variations can be easily produced separately.

[0073] However, the BGA and LGA used in the semiconductor devices constituting SSDs are designed to be connected to the printed wiring substrate by melting solder. When the printed wiring substrate is connected to the connection terminals of the semiconductor device (solder balls 9 in the semiconductor device 1 according to the first embodiment) by melting solder, it is not easy to remove the SSD.

[0074] Consider the following comparative design: instead of using solder to connect the terminals of the printed wiring board and the semiconductor device, mounting components are placed on the printed wiring board from the semiconductor device.

[0075] However, this comparative example involves a structure that covers the mounting components on a flat semiconductor device, thus increasing the overall height in proportion to the thickness of the mounting components. When the height of an electronic device increases, it consumes more space within the information processing unit, sometimes making it unsuitable for thin laptop PCs.

[0076] In contrast, the electronic device 100 according to the first embodiment is constructed such that the semiconductor device 1 can be easily disassembled without changing the overall height of the electronic device 100 or by keeping the change in the height of the electronic device 100 to a minimum.

[0077] Specifically, the semiconductor device 1 according to the first embodiment has a groove 5 on a portion of the upper surface of the sealing resin 12 of the semiconductor device 1. By embedding the mounting member 13 into a portion of the groove 5, the height of the electronic device 100 in the Z direction can be suppressed.

[0078] That is, when the height of the upper portion 13A of the mounting member 13 in the Z direction is controlled within the depth of the groove 5, the electronic device 100 according to the first embodiment can fix the semiconductor device 1 to the printed wiring substrate by means of the mounting member 13 without changing the height of the electronic device 100. Even when the height of the upper portion 13A of the mounting member 13 in the Z direction exceeds the depth of the groove 5, the electronic device 100 according to the first embodiment can fix the semiconductor device 1 to the printed wiring substrate by means of the mounting member 13 with minimal change in the height of the electronic device 100 compared to the comparative example.

[0079] Furthermore, the electronic device 100 according to the first embodiment facilitates heat dissipation compared to the comparative example. The comparative example has a structure where the entire top surface of the semiconductor device is covered by a mounting member; therefore, heat dissipation from the surface of the semiconductor device is sometimes hindered, making it difficult to dissipate the heat emitted by the semiconductor device. In contrast, in the electronic device 100 according to the first embodiment, the mounting member 13 only covers a portion of the groove 5 of the upper surface of the semiconductor device 1. Therefore, the electronic device 100 according to the first embodiment can dissipate heat from the portion not covered by the mounting member 13. Furthermore, by using a material that facilitates heat dissipation for the mounting member 13, heat dissipation from the portion covered by the mounting member can also be facilitated.

[0080] Furthermore, according to the electronic device 100 of the first embodiment, it is less likely to misalign the direction of fixing the semiconductor device 1 to the printed wiring substrate 15. Specifically, by setting the groove 5 on the upper surface of the sealing resin 12 to be asymmetrical, for example, it is possible to prevent the incorrect orientation of the semiconductor device 1 when fixing it to the printed wiring substrate 15. For example, instead of setting the intersection of the cross of the groove 5 at the center of the sealing resin 12, it can be offset in the X and / or Y directions. For example, instead of making the shape of the groove 5 a linearly symmetrical shape like a cross, it can be made into an asymmetrical shape.

[0081] [2] Second Embodiment

[0082] [2-1] Structure (Construction)

[0083] Hereinafter, an example of the structure of the semiconductor device 2 and electronic device 102 according to the second embodiment will be described. The semiconductor device 2 and electronic device 102 differ from those of the first embodiment in terms of the shape of the mounting components and slots, the number of screws, etc. Regarding other structures and functions, the second embodiment is largely the same as the first embodiment. Hereinafter, the differences between the semiconductor device 2 and electronic device 102 according to the second embodiment and those of the first embodiment will be mainly described.

[0084] [2-1-1] Structure of semiconductor device 2

[0085] Figure 5 This illustrates a structural example of the semiconductor device 2 according to the second embodiment. Figure 5 The image above is a top view (XY plane) observed from the +Z direction of semiconductor device 2, representing the view from the +Z direction. Figure 1 The image above is observed from the same direction. Figure 5 The following figure is a side view (XZ plane) observed from the -Y direction of semiconductor device 2, showing the relationship between... Figure 1 The image below is observed from the same direction.

[0086] like Figure 5 As shown, the semiconductor device 2 includes, for example, a plurality of terminals 20, a plurality of solder balls 19, a substrate 21, and a sealing resin 22. The substrate 21, solder balls 19, and terminals 20 have the same structure and function as the substrate 11, solder balls 9, and terminals 10 according to the first embodiment, therefore, detailed description is omitted.

[0087] The sealing resin 22 is located above the substrate 21 (in the +Z direction). The sealing resin 22 has a rectangular shape in the XY plane. The sealing resin 22 has ends in the XY plane that coincide with the ends of the substrate 21. The sealing resin 22 has a groove 6 shaped to surround the ends of the sealing resin 22 in the XY plane. In other words, the groove 6 has a shape that reduces the area of ​​a portion of the sealing resin 22 by bringing the two ends of the sealing resin 22 in the X direction closer to the center and the two ends in the Y direction closer to the center.

[0088] The groove 6 will now be described in detail. The height of the sealing resin 22 varies in the Z-direction depending on the location. Specifically, as follows: The sealing resin 22 includes a first part 22A and a second part 22B. The first part 22A occupies the lower (-Z side) portion of the sealing resin 22 and has a cuboid shape. The second part 22B occupies the upper (+Z side) portion of the sealing resin 22 and also has a cuboid shape. The first part 22A and the second part 22B are continuously arranged in the Z-direction and formed as a single unit. The second part 22B is not located within the upper surface (XY plane viewed from the +Z direction) of the first part 22A. In the area where the second part 22B is absent, the upper surface (XY plane viewed from the +Z direction) of the first part 22A is exposed. That is, the groove 6 is formed in the area where the upper surface of the first part 22A is exposed and the second part 22B is absent. The sealing resin 22 has such a shape that its height varies in the Z-direction depending on the location. That is, the height of the sealant 22 in the exposed area on the upper surface of the first part 22A in the Z direction is lower than that in other areas. The groove 6 is the space created by the height difference in the Z direction between the exposed portion on the upper surface of the first part 22A and the upper surface of the second part 22B.

[0089] In other words, the sealing resin 22 is constructed such that a second part 22B, having a cuboid shape but a smaller area in the XY plane than the first part 22A, is provided on a first part 22A having a cuboid shape. The second part 22B is configured not to extend beyond the first part 22A in the XY plane. For example, the second part 22B may also have a similar shape to the first part 22A in the XY plane. For example, the center of the second part 22B in the XY plane coincides with the center of the first part 22A in the XY plane. The space created because the second part 22B is smaller than the first part 22A is a groove 6. The groove 6, i.e., the area exposed on the upper surface of the first part 22A, has a certain width in the XY plane and extends along the edge of the second part 22B.

[0090] The groove 6 can be formed using the same method as the groove 5 according to the first embodiment. Details regarding the depth and shape of the groove 6 will be described later. Here, the depth of the groove 6 corresponds to the height of the second portion 22B in the Z direction.

[0091] [2-1-2] Structure of electronic device 102

[0092] use Figure 6 An example of a structure in which a semiconductor device 2 is mounted on a printed wiring substrate 25 will be described.

[0093] Figure 6 This section illustrates a structural example of the electronic device 102 according to the second embodiment. Figure 6 The image above is a top view of electronic device 102, showing the connection between... Figure 5 The image above is observed from the same direction. Figure 6 The following figure is a side view of electronic device 102, showing the relationship between... Figure 5 The image below is observed from the same direction.

[0094] like Figure 6 As shown, the electronic device 102, for example, has Figure 5 The semiconductor device 2, mounting component 23, screw 24, and printed wiring substrate 25 are shown. The printed wiring substrate 25 and screw 24 have the same structure and function as the printed wiring substrate 15 and screw 14 according to the first embodiment, therefore, detailed description is omitted.

[0095] The mounting component 23 has an exposed portion within the upper surface of the first portion 22A of the sealing resin 22, i.e., a portion covering the bottom surface of the groove 6, a portion extending in the Z direction, and a portion contacting the printed wiring substrate 25. The portion covering the bottom surface of the groove 6, the portion extending in the Z direction, and the portion contacting the printed wiring substrate 25 are hereinafter sometimes referred to as the upper portion 23A, the side portion 23B, and the contact portion 23C, respectively. The upper portion 23A, the side portion 23B, and the contact portion 23C are continuously formed as one piece. A portion of the upper portion 23A and a portion of the side portion 23B are joined at right angles within the allowable tolerances of manufacturing. The remaining portion of the side portion 23B and a portion of the contact portion 23C are joined at right angles within the allowable tolerances of manufacturing.

[0096] The upper portion 23A is shaped to surround the end of the sealing resin 22 in the XY plane. The upper portion 23A is, for example, the same shape as the groove 6. The upper portion 23A has a shape that allows it to be inserted into the groove 6. By being inserted into the groove 6, the upper portion 23A can press against the bottom surface of the groove 6. In other words, the upper portion 23A can be positioned where it is inserted into the groove 6. By pressing against the bottom surface of the groove 6 with the upper portion 23A, the mounting member 23 can suppress the offset of the semiconductor device 2 in the XY direction. Furthermore, by having the upper portion 23A located in the groove 6, the electronic device 102 according to the second embodiment can suppress the height in the Z direction in the same way as the electronic device 100 according to the first embodiment.

[0097] The size of the upper portion 23A in the XY direction is sufficient to press the bottom surface of the groove 6. In order to suppress the offset of the semiconductor device 2 in the XY direction, the size of the upper portion 23A in the XY direction is preferably close to the size of the groove 6 in the XY direction. More specifically, for the size of the upper portion 23A in the XY direction to be close to the size of the groove 6 in the XY direction, this includes the widths of each part constituting the upper portion 23A in the X and Y directions being close to the widths of each part constituting the groove 6 in the X and Y directions, respectively, and / or the lengths of the upper portion 23A in the X and Y directions being close to the lengths of the groove 6 in the X and Y directions, respectively.

[0098] The height (or thickness) of the upper portion 23A in the Z direction can be such that it can suppress the offset of the semiconductor device 2 in the XY direction, similar to the first embodiment, and may exceed the depth of the groove 6. However, in order to suppress the height of the electronic device 102 in the Z direction, the height of the upper portion 23A in the Z direction is preferably controlled within the depth of the groove 6. In addition, the depth of the groove 6 can be such that the upper portion 23A is stably embedded in the groove 6.

[0099] Side portion 23B extends in the Z direction. With the upper portion 23A embedded in the groove 6, side portion 23B extends along the Z direction from the end of the quadrilateral of the upper portion 23A to the printed wiring substrate 25. In other words, with the upper portion 23A embedded in the groove 6, side portion 23B extends along the Z direction on the side of the semiconductor device 2. The length of side portion 23B in the Z direction is sufficient to suppress the offset of the semiconductor device 2 in the Z direction when the semiconductor device 2 is mounted on the printed wiring substrate 25.

[0100] The contact portion 23C has a shape that extends along the XY plane. The contact portion 23C has a hole for the screw 24 to pass through. When the semiconductor device 2 is mounted on the printed wiring substrate 25, the contact portion 23C is in contact with the printed wiring substrate 25.

[0101] Thus, the mounting component 23 primarily suppresses the offset of the semiconductor device 2 in the XY direction through its upper portion 23A, and primarily suppresses the offset of the semiconductor device 2 in the Z direction through its side portion 23B. Together with the screw 24, it fixes the semiconductor device 2 to the printed wiring substrate 25 via the contact portion 23C. In other words, the mounting component 23 has the function of pressing the semiconductor device 2 onto the printed wiring substrate 25.

[0102] The fixing mentioned here refers to fixing by tightening the screw 24. Therefore, if it is desired to remove the semiconductor device 2 from the printed wiring substrate 25, it can be easily removed by loosening the screw 24.

[0103] Similar to the first embodiment, the solder ball 19 and the printed wiring substrate 25 are not fixed by melting the solder, but can be detached. That is, the semiconductor device 2 according to the second embodiment is designed to be movable relative to the printed wiring substrate of the electronic device 102.

[0104] Based on the above, the electronic device 102 according to the second embodiment also includes, in the same way as the first embodiment: a sealing resin 22 of the semiconductor device 2 having a groove 6; a mounting member 23 having a shape that is embedded into the groove 6; and the mounting member 23 being easily detachable by means of screws 24 or the like.

[0105] In the electronic device 102 according to the second embodiment, the shape of the slot 6 of the semiconductor device 2 and the mounting member 23 is such that the upper part 23A is embedded in the slot 6 and the semiconductor device 2 can be fixed to the printed wiring substrate 25 by the mounting member 23.

[0106] Similarly, as long as the upper part 23A is embedded in the slot 6 and the semiconductor device 2 can be fixed to the printed wiring substrate 25 by the mounting member 23, the shape of the semiconductor device 2 in the XY plane viewed from the +Z direction does not have to be a quadrilateral shape. For example, the shape of the semiconductor device 2 in the XY plane viewed from the +Z direction can also be a quadrilateral with one of its corners chamfered.

[0107] [2-2] Advantages (Effects) of the Second Embodiment

[0108] The semiconductor device 2 and the electronic device 102 including the semiconductor device 2 described above, in a different configuration than the first embodiment, can also achieve the same effects as the first embodiment.

[0109] The electronic device 102 according to the second embodiment has a groove 6 in the sealing resin 22 of the semiconductor device 2. Therefore, the electronic device 102 according to the second embodiment can fix the semiconductor device 2 to the printed wiring substrate 25 by means of the mounting member 23 in the same way as in the first embodiment. Therefore, even if the mounting member 23 is mounted on the semiconductor device 2, the height of the semiconductor device 2 can be maintained in the Z direction or the change in the height of the electronic device 102 can be kept to a minimum.

[0110] In addition, similar to the first embodiment, the electronic device 102 according to the second embodiment is easier to dissipate heat than the comparative example.

[0111] Furthermore, the electronic device 102 according to the second embodiment, like the first embodiment, makes it less likely to misjudge the direction in which the semiconductor device 2 is fixed to the printed wiring substrate 25 by setting the slot 6 to be non-linearly symmetrical.

[0112] [3] Third embodiment

[0113] [3-1] Structure (Construction)

[0114] Hereinafter, an example of the structure of the semiconductor device 3 and electronic device 103 according to the third embodiment will be described. The semiconductor device 3 and electronic device 103 differ from the first and second embodiments in terms of the shape of the mounting components and slots, the number of screws, etc. Regarding other structures and functions, the third embodiment is largely the same as the first embodiment. Hereinafter, the differences between the semiconductor device 3 and electronic device 103 according to the third embodiment and the first embodiment will be mainly described.

[0115] [3-1-1] Structure of semiconductor device 3

[0116] Figure 7This illustrates a structural example of the semiconductor device 3 according to the third embodiment. Figure 7 The image above is a top view (XY plane) observed from the +Z direction of semiconductor device 3, representing the view from the +Z direction. Figure 1 The image above is observed from the same direction. Figure 7 The following figure is a side view (XZ plane) of semiconductor device 3 viewed from the -Y direction, showing the relationship between the two devices. Figure 1 The image below is observed from the same direction.

[0117] like Figure 7 As shown, the semiconductor device 3 includes, for example, a plurality of terminals 30, a plurality of solder balls 29, a substrate 31, and a sealing resin 32. The substrate 31, solder balls 29, and terminals 30 have the same structure and function as the substrate 11, solder balls 9, and terminals 10 according to the first embodiment, therefore, detailed description is omitted.

[0118] The sealing resin 32 is located above the substrate 31 (in the +Z direction). The sealing resin 32 has a rectangular shape in the XY plane. The sealing resin 32 has an end in the XY plane that coincides with the end of the substrate 31. The sealing resin 32 has two grooves 7 in a shape that extends along the end in the Y direction of the sealing resin 32 in the XY plane. In other words, each groove 7 has, for example, a cuboid shape. There is one groove 7 at each end of the sealing resin 32 in the Y direction.

[0119] The groove 7 will now be described in detail. The sealing resin 32 varies in height in the Z-direction depending on the location. Specifically, the sealing resin 32 includes a first portion 32A and a second portion 32B. The first portion 32A occupies the lower (-Z side) portion of the sealing resin 32 and has a cuboid shape. The second portion 32B occupies the upper (+Z side) portion of the sealing resin 32 and also has a cuboid shape. The first portion 32A and the second portion 32B are continuously arranged in the Z-direction and formed as a single unit. The second portion 32B is not located within the upper surface (XY plane viewed from the +Z direction) of the first portion 32A. In the area where the second portion 32B is absent, the upper surface of the first portion 32A is exposed. That is, the groove 7 is formed in the area where the upper surface of the first portion 32A is exposed and the second portion 32B is absent. The sealing resin 32 varies in height in the Z-direction depending on the location due to its shape. That is, the height of the sealant 32 in the exposed area on the upper surface of the first part 32A in the Z direction is lower than that in other areas. The groove 7 is the space created by the height difference in the Z direction between the exposed portion on the upper surface of the first part 32A and the upper surface of the second part 32B.

[0120] In other words, the sealing resin 32 is constructed as follows: a second portion 32B is provided on a first portion 32A having a cuboid shape, the second portion 32B having a cuboid shape that is smaller (or shorter in length) in the X direction of the XY plane than the first portion 32A. The size of the second portion 32B in the Y direction is the same as that of the first portion 32A in the Y direction. The second portion 32B is configured not to extend beyond the first portion 32A in the XY plane. For example, the center of the second portion 32B in the XY plane coincides with the center of the first portion 32A in the XY plane. The space created because the second portion 32B is smaller than the first portion 32A is a groove 7. The groove 7, i.e., the area exposed on the upper surface of the first portion 32A, has a certain width in the XY plane and extends along the end in the Y direction of the second portion 32B.

[0121] The groove 7 can be formed using the same method as the groove 5 described in the first embodiment. Details regarding the depth and shape of the groove 7 will be described later. Here, the depth of the groove 7 corresponds to the height of the second portion 32B in the Z direction.

[0122] [3-1-2] Structure of electronic device 103

[0123] use Figure 8 An example of a structure in which a semiconductor device 3 is mounted on a printed wiring substrate 35 will be described.

[0124] Figure 8 This section illustrates a structural example of the electronic device 103 according to the third embodiment. Figure 8 The image above is a top view of electronic device 103, showing the relationship between... Figure 7 The image above is observed from the same direction. Figure 8 The following figure is a side view of electronic device 103, showing the relationship between... Figure 7 The image below is observed from the same direction.

[0125] like Figure 8 As shown, the electronic device 103, for example, has Figure 7 The semiconductor device 3, mounting component 33, screw 34, and printed wiring substrate 35 are shown. The printed wiring substrate 35 and screw 34 have the same structure and function as the printed wiring substrate 15 and screw 14 according to the first embodiment, therefore, detailed description is omitted.

[0126] The mounting component 33 has an exposed portion within the upper surface (XY plane viewed from the +Z direction) of the first portion 32A of the sealing resin 32, i.e., a portion covering the bottom surface of the groove 7, a portion extending in the Z direction, and a portion contacting the printed wiring substrate 35. The portion covering the bottom surface of the groove 7, the portion extending in the Z direction, and the portion contacting the printed wiring substrate 35 are hereinafter sometimes referred to as the upper portion 33A, the side portion 33B, and the contact portion 33C, respectively. The upper portion 33A, the side portion 33B, and the contact portion 33C are continuously formed as one piece. A portion of the upper portion 33A and a portion of the side portion 33B are joined at right angles within the allowable tolerances of manufacturing. The remaining portion of the side portion 33B and a portion of the contact portion 33C are joined at right angles within the allowable tolerances of manufacturing.

[0127] The upper portion 33A has a shape that extends along its end in the Y direction within the XY plane of the sealing resin 32. The upper portion 33A, for example, has the same shape as the groove 7 and presses against the bottom surface of the groove 7. In other words, the upper portion 33A is positioned to be embedded in the groove 7. By pressing the bottom surface of the groove 7 with the upper portion 33A, the mounting member 33 can suppress the offset of the semiconductor device 3 in the XY direction. Furthermore, by having the upper portion 33A located within the groove 7, the electronic device 103 according to the third embodiment can suppress height in the Z direction in the same way as the electronic device 100 according to the first embodiment.

[0128] The size of the upper portion 33A in the XY direction is sufficient to press down on the bottom surface of the groove 7. In order to suppress the offset of the semiconductor device 3 in the XY direction, the size of the upper portion 33A in the XY direction is preferably close to the size of the groove 7 in the XY direction. More specifically, for the size of the upper portion 33A in the XY direction to be close to the size of the groove 7 in the XY direction, this includes the widths of each part constituting the upper portion 33A in the X and Y directions being close to the widths of each part constituting the groove 7 in the X and Y directions, respectively, and / or the lengths of the upper portion 33A in the X and Y directions being close to the lengths of the groove 7 in the X and Y directions, respectively.

[0129] The height (or thickness) of the upper portion 33A in the Z direction can be such that it can suppress the offset of the semiconductor device 3 in the XY direction, similar to the first embodiment, and may exceed the depth of the groove 7. However, in order to suppress the height of the electronic device 103 in the Z direction, the height of the upper portion 33A in the Z direction is preferably controlled within the depth of the groove 7. In addition, the depth of the groove 7 should be such that the upper portion 33A is stably embedded in the groove 7.

[0130] Side portion 33B extends in the Z direction. With the upper portion 33A embedded in the groove 7, side portion 33B extends along the Z direction from the end of the quadrilateral of the upper portion 33A to the printed wiring substrate 35. In other words, with the upper portion 33A embedded in the groove 7, side portion 33B extends along the Z direction on the side of the semiconductor device 3. The length of side portion 33B in the Z direction is sufficient to suppress the offset of the semiconductor device 3 in the Z direction when the semiconductor device 3 is mounted on the printed wiring substrate 35.

[0131] The contact portion 33C has a shape that extends along the XY plane. The contact portion 33C has a hole for the screw 34 to pass through. When the semiconductor device 3 is mounted on the printed wiring substrate 35, the contact portion 33C is in contact with the printed wiring substrate 35.

[0132] Thus, the mounting component 33 primarily suppresses the offset of the semiconductor device 3 in the XY direction through its upper portion 33A, and primarily suppresses the offset of the semiconductor device 3 in the Z direction through its side portion 33B. Together with the screw 34, the contact portion 33C secures the semiconductor device 3 to the printed wiring substrate 35. In other words, the mounting component 33 has the function of pressing the semiconductor device 3 onto the printed wiring substrate 35.

[0133] The fixing mentioned here refers to fixing by tightening the screw 34. Therefore, if it is desired to remove the semiconductor device 3 from the printed wiring substrate 35, it can be easily removed by loosening the screw 34.

[0134] Similar to the first embodiment, the solder balls 29 and the printed wiring substrate 35 are not fixed by melting the solder, but can be detached. That is, the semiconductor device 3 according to the third embodiment is designed to be movable relative to the printed wiring substrate, etc., of the electronic device 103.

[0135] Based on the above, the electronic device 103 according to the third embodiment also includes, in the same way as the first embodiment, a sealing resin 32 of semiconductor device 3 having a groove 7; a mounting member 33 having a shape that is embedded into the groove 7; and the mounting member 33 being easily detachable by means of screws 34 or the like.

[0136] In the electronic device 103 according to the third embodiment, the shape of the slot 7 of the semiconductor device 3 and the mounting member 33 is such that the upper part 33A is embedded in the slot 7 and the semiconductor device 3 can be fixed to the printed wiring substrate 35 by the mounting member 33.

[0137] Similarly, as long as the upper part 33A is embedded in the slot 7 and the semiconductor device 3 can be fixed to the printed wiring substrate 35 by the mounting member 33, the shape of the semiconductor device 3 in the XY plane viewed from the +Z direction does not have to be a quadrilateral shape. For example, the shape of the semiconductor device 3 in the XY plane viewed from the +Z direction can also be a quadrilateral with one of its corners chamfered.

[0138] [3-2] Advantages (Effects) of the Third Embodiment

[0139] The semiconductor device 3 and the electronic device 103 including the semiconductor device 3, according to the third embodiment described above, can achieve the same effects as the first embodiment even in a different configuration than the first embodiment.

[0140] The electronic device 103 according to the third embodiment has a groove 7 in the sealing resin 32 of the semiconductor device 3. Therefore, according to the electronic device 103 according to the third embodiment, the semiconductor device 3 can be fixed to the printed wiring substrate 35 by means of the mounting member 33 in the same manner as in the first and second embodiments. Therefore, even if the mounting member 33 is mounted on the semiconductor device 3, the height of the semiconductor device 3 can be maintained in the Z direction, or the change in the height of the electronic device 103 can be kept to a minimum.

[0141] In addition, similar to the first embodiment, the electronic device 103 according to the third embodiment is easier to dissipate heat compared to the comparative example.

[0142] Furthermore, the electronic device 103 according to the third embodiment, by setting the slot 7 to be non-linearly symmetrical in the same way as the first embodiment, makes it less likely to mistake the direction of fixing the semiconductor device 3 to the printed wiring substrate 35.

[0143] [4] Fourth Embodiment

[0144] [4-1] Structure (Construction)

[0145] Hereinafter, an example of the structure of the semiconductor device 4 and electronic device 104 according to the fourth embodiment will be described. The semiconductor device 4 and electronic device 104 differ from those of the third embodiment in terms of mounting components, substrate, sealing resin, screws, the shape of the slots, and the number of screws. Regarding other structures and functions, the fourth embodiment is largely the same as the third embodiment. Hereinafter, the differences between the semiconductor device 4 and electronic device 104 according to the fourth embodiment and those of the third embodiment will be mainly described.

[0146] [4-1-1] Structure of semiconductor device 4

[0147] Figure 9This illustrates a structural example of the semiconductor device 4 according to the fourth embodiment. Figure 9 The image above is a top view (XY plane) observed from the +Z direction of semiconductor device 4, showing the relationship between... Figure 7 The image above is observed from the same direction. Figure 9 The following figure is a side view (XZ plane) viewed from the -Y direction of semiconductor device 4, showing the relationship between... Figure 7 The image below is observed from the same direction.

[0148] like Figure 9 As shown, the semiconductor device 4 includes, for example, a plurality of terminals 40, a plurality of solder balls 39, a substrate 41, and a sealing resin 42. The solder balls 39 and terminals 40 have the same structure and function as the solder balls 29 and terminals 30 according to the third embodiment, therefore, detailed description is omitted.

[0149] The substrate 41 has the same function as the substrate 31 according to the third embodiment, but differs from the substrate 31 in shape. The substrate 41 has a rectangular shape in the XY plane, and at its ends along the Y direction, it has, for example, a semi-circular concave shape. In other words, each end of the substrate 41 extending in the Y direction has a portion that does not extend along the Y direction, and the portion that does not extend along the Y direction has a concave semi-circular shape. A screw 44 (described later) is inserted into the concave portion of the semi-circular shape. Figure 10 ).

[0150] The sealing resin 42 is located above the substrate 41 (in the +Z direction). The sealing resin 42 has an end in the XY plane that coincides with the end of the substrate 41. That is, the sealing resin 42 has a rectangular shape in the XY plane, and has, for example, a semi-circular concave shape at its end along the Y direction. The sealing resin 42 has two grooves 8 in a shape that extends along its end in the Y direction in the XY plane. In other words, each groove 8 has, for example, a cuboid shape. There is one groove 8 at each end of the sealing resin 42 in the Y direction. Each groove 8 includes a concave semi-circular portion.

[0151] The groove 8 will now be described in detail. The height of the sealing resin 42 in the Z direction varies depending on the location. Specifically, the sealing resin 42 includes a first part 42A and a second part 42B. The first part 42A occupies the lower (-Z side) portion of the sealing resin 42. Along both sides of the inner ZY plane of the cuboid, a portion of the first part 42A has an end portion that is, for example, cut into a semi-cylindrical shape in the Z direction. The cut portion extends, for example, in the Z direction, covering the upper surface and the bottom surface of the first part 42A in the Z direction. Specifically, a portion of the four sides extending in the Y direction within the cuboid of the first part 42A is a semi-circular concave shape. Two of the four sides extending in the Y direction of the first part 42A, located on the -X side of the first part 42A, face each other along the Z direction in the semi-circular portion. Similarly, of the four edges extending in the Y direction of part 42A, the two edges located on the +X side of part 42A face each other along the Z direction in the semicircular portion. In other words, the two edges located on the -X side of part 42A are in the same position in the X and Y directions, but in different positions in the Z direction. The two edges located on the +X side of part 42A are in the same position in the X and Y directions, but in different positions in the Z direction.

[0152] Part 2, 42B, occupies the upper (+Z side) portion of the sealing resin 42 and has a cuboid shape. Part 1, 42A, and Part 2, 42B are continuously arranged in the Z direction and formed as a single unit. Part 2, 42B is not located within the upper surface (XY plane viewed from the +Z direction) of Part 1, 42A. In the area where Part 2, 42B is absent, the upper surface of Part 1, 42A is exposed. That is, a groove 8 is formed in the area where the upper surface of Part 1, 42A is exposed and Part 2, 42B is absent. The sealing resin 42, by having such a shape, has a height difference in the Z direction depending on the location. That is, in the exposed area of ​​the upper surface of Part 1, 42A, the height of the sealing resin 42 in the Z direction is lower than in other areas. The groove 8 is a space created by the height difference in the Z direction between the exposed portion of the upper surface of Part 1, 42A and the upper surface of Part 2, 42B.

[0153] In other words, the sealing resin 42 is constructed as follows: On a first portion 42A having a cuboid shape with a portion of its end cut into a semi-cylindrical shape in the Z direction, a second portion 42B having a cuboid shape smaller (or shorter in length) in the X direction of the XY plane than the first portion 42A. The size of the second portion 42B in the Y direction is the same as that of the first portion 42A in the Y direction. The second portion 42B is configured not to extend beyond the first portion 42A in the XY plane. For example, the center of the second portion 42B in the XY plane coincides with the center of the first portion 42A in the XY plane. The space created because the second portion 42B is smaller than the first portion 42A is a groove 8. The groove 8, i.e., the area exposed on the upper surface of the first portion 42A, has a certain width in the XY plane and extends along the end of the second portion 42B in the Y direction. The groove 8 includes a concave semi-circular portion.

[0154] The groove 8 can be formed using the same method as the groove 7 described in the third embodiment. Details regarding the depth and shape of the groove 8 will be described later. Here, the depth of the groove 8 corresponds to the height of the second portion 42B in the Z direction.

[0155] [4-1-2] Structure of electronic device 104

[0156] use Figure 10 An example of a structure in which a semiconductor device 4 is mounted on a printed wiring substrate 45 will be described.

[0157] Figure 10 This section illustrates a structural example of the electronic device 104 according to the fourth embodiment. Figure 10 The image above is a top view of electronic device 104, showing the relationship between... Figure 9 The image above is observed from the same direction. Figure 10 The following figure is a side view of electronic device 104, showing the relationship between... Figure 9 The image below is observed from the same direction.

[0158] like Figure 10 As shown, the electronic device 104, for example, has Figure 9 The semiconductor device 4, mounting component 43, screw 44, and printed wiring substrate 45 are shown. The printed wiring substrate 45 has the same structure and function as the printed wiring substrate 35 according to the third embodiment, therefore, detailed description is omitted.

[0159] Mounting member 43 has a portion that covers the exposed portion of the upper surface (XY plane viewed from the +Z direction) of the first part 42A of the sealing resin 42, i.e., the bottom surface of the groove 8. Unlike mounting members 13, 23, and 33, mounting member 43 lacks a portion extending in the Z direction (corresponding to the sides 13B, 23B, and 33B of mounting members 13, 23, and 33) and a portion that contacts the printed wiring substrate 45 (corresponding to the contact portions 13C, 23C, and 33C of mounting members 13, 23, and 33). In mounting member 43, the functions corresponding to the sides 13B, 23B, and 33B and the contact portions 13C, 23C, and 33C of mounting members 13, 23, and 33 are compensated for by screws 44 and semi-circular recesses provided on the substrate 41 and the sealing resin 42. These details will be described later.

[0160] The mounting member 43 is shaped such that it extends along the end of the sealing resin 42 in the Y direction in the XY plane. The mounting member 43 is, for example, the same shape as the groove 8, and presses against the bottom surface of the groove 8. In other words, the mounting member 43 is positioned to be embedded in the groove 8. By pressing the bottom surface of the groove 8 together with the screw 44, the mounting member 43 can suppress the offset of the semiconductor device 4 in the XY direction. Furthermore, by having the mounting member 43 located in the groove 8, the electronic device 104 according to the fourth embodiment, like the electronic device 103 according to the third embodiment, can suppress the height in the Z direction.

[0161] The size of the mounting member 43 in the XY direction is sufficient to press against the bottom surface of the groove 8. To suppress offset of the semiconductor device 4 in the XY direction, the size of the mounting member 43 in the XY direction is preferably close to the size of the groove 8 in the XY direction. More specifically, for the size of the mounting member 43 in the XY direction to be close to the size of the groove 8 in the XY direction, this includes the widths of each part constituting the mounting member 43 in the X and Y directions being close to the widths of each part constituting the groove 8 in the X and Y directions, respectively, and / or the lengths of the mounting member 43 in the X and Y directions being close to the lengths of the groove 8 in the X and Y directions, respectively.

[0162] Regarding the height (or thickness) of the mounting member 43 in the Z direction, it is sufficient to suppress the offset of the semiconductor device 4 in the XY direction, similar to the third embodiment, and may exceed the depth of the groove 8. However, in order to suppress the height of the electronic device 104 in the Z direction, the height of the mounting member 43 in the Z direction is preferably controlled within the depth of the groove 8. Furthermore, regarding the depth of the groove 8, it is sufficient to produce a depth that allows the mounting member 43 to be stably embedded in the groove 8.

[0163] The screw 44 functions to secure the mounting component 43 and the semiconductor device 4 to the printed wiring substrate 45. A portion of the screw 44 is embedded in a semi-circular recess provided in the substrate 41 and the sealing resin 42. The screw 44 is inserted into a hole provided in the printed wiring substrate 45. For example, if the screw 44 has external threads, the interior of the hole in the printed wiring substrate 45 into which the screw 44 is inserted may also have a groove corresponding to the thread teeth provided in the screw 44. By inserting and screwing the screw 44 into the hole provided in the printed wiring substrate 45, the mounting component 43, sandwiched between the screw 44 and the printed wiring substrate 45, is secured. By securing the mounting component 43, the semiconductor device 4 is fixed to the printed wiring substrate 45.

[0164] Screw 44 extends in the Z direction. When inserted into the semi-circular recess provided in the substrate 41 and the sealing resin 42, screw 44 extends in the Z direction from the end of the semi-circular recess of the mounting member 43 to the printed wiring substrate 45. In other words, when inserted into the semi-circular recess provided in the substrate 41 and the sealing resin 42, screw 44 extends along the Z direction on the side of the semiconductor device 4. The length of screw 44 in the Z direction is sufficient to allow adjustment when the semiconductor device 4 is mounted on the printed wiring substrate 45 to suppress any displacement of the semiconductor device 4 in the Z direction.

[0165] In this way, the screw 44, by being embedded in the semi-circular recesses mainly provided in the mounting member 43, the substrate 41, and the sealing resin 42, suppresses the displacement of the semiconductor device 4 in the XY directions. Furthermore, the screw 44, by being inserted into the holes mainly provided in the printed wiring substrate 45, suppresses the displacement of the semiconductor device 4 in the Z direction, and together with the mounting member 43, fixes the semiconductor device 4 to the printed wiring substrate 45. That is, the screw 44 and the mounting member 43 have the function of pressing the semiconductor device 4 onto the printed wiring substrate 45.

[0166] The fixing mentioned here refers to fixing by tightening screw 44. Therefore, if it is desired to remove the semiconductor device 4 from the printed wiring substrate 45, it can be easily removed by loosening screw 44.

[0167] Similar to the third embodiment, the solder balls 39 and the printed wiring substrate 45 are not fixed by melting the solder, but can be detached. That is, the semiconductor device 4 according to the fourth embodiment is designed to be movable relative to the printed wiring substrate, etc., of the electronic device 104.

[0168] exist Figure 10The example shown depicts two screws 44, but the number of screws 44 can be arbitrarily set as long as it is sufficient to secure the mounting component 43 to the printed wiring substrate 45. For example, the electronic device 104 may also have more than two screws on one of the two slots 8.

[0169] Alternatively, the electronic device 104 may also have a stud or similar component sandwiched between the screw 44 and the printed wiring substrate 45. That is, instead of directly inserting the screw 44 into the hole formed in the printed wiring substrate 45, a portion of the stud is embedded in the hole formed in the printed wiring substrate 45 to secure the stud. The secured stud extends in the Z direction. The stud has a hole at its upper part (+Z side). For example, a groove corresponding to the thread of the screw 44, which is an external thread, may be formed inside the hole of the stud. By inserting and screwing the screw 44 into the hole provided in the stud, the semiconductor device 4 is entirely fixed to the printed wiring substrate 45. In other words, the screw 44 secures the mounting component 43 and the semiconductor device 4 to the printed wiring substrate 45 via the stud.

[0170] Based on the above, the electronic device 104 according to the fourth embodiment also includes, similarly to the third embodiment, a groove 8 in the sealing resin 42 of the semiconductor device 4; a mounting member 43 having a shape that is embedded into the groove 8; and the mounting member 43 being easily detachable by means of a screw 44 or the like. Furthermore, the electronic device 104 according to the fourth embodiment has a semi-circular recess in the mounting member 43, the substrate 41, and the sealing resin 42, which allows a portion of a screw 44 to be embedded.

[0171] In the electronic device 104 according to the fourth embodiment, the shapes of the slot 8 of the semiconductor device 4 and the mounting member 43 are such that the mounting member 43 is embedded in the slot 8 and the semiconductor device 4 can be fixed to the printed wiring substrate 45 by the mounting member 43. The semi-circular recess provided in the mounting member 43, the substrate 41 and the sealing resin 42 can be any shape that can embed a portion of the screw 44, or it can be a shape other than a semi-circle. For example, the recess can also be arc-shaped or polygonal.

[0172] Similarly, as long as the mounting component 43 is embedded in the slot 8 and the semiconductor device 4 is fixed to the printed wiring substrate 45 by the mounting component 43 and screws 44, the XY plane of the semiconductor device 4 viewed from the +Z direction does not have to be a quadrilateral shape. The shape of the semiconductor device 4 viewed from the +Z direction in the XY plane can also be, for example, a quadrilateral with one corner chamfered.

[0173] [4-2] Advantages (Effects) of the Fourth Embodiment

[0174] The semiconductor device 4 and the electronic device 104 including the semiconductor device 4 described above can achieve the same effects as the third embodiment even in a different configuration than the third embodiment.

[0175] The electronic device 104 according to the fourth embodiment has a groove 8 in the sealing resin 42 of the semiconductor device 4. Furthermore, the electronic device 104 according to the fourth embodiment has a semi-circular recess in the mounting member 43, the substrate 41, and the sealing resin 42, which allows a portion of a screw 44 to be inserted. Therefore, according to the electronic device 104 according to the fourth embodiment, similarly to the third embodiment, the semiconductor device 4 can be fixed to the printed wiring substrate 45 by the mounting member 43 and the screw 44. Therefore, even when the mounting member 33 is mounted on the semiconductor device 4, the height of the semiconductor device 4 can be maintained in the Z direction, or the change in the height of the electronic device 104 can be kept to a minimum.

[0176] In addition, similar to the third embodiment, the electronic device 104 according to the fourth embodiment is easier to dissipate heat than the comparative example.

[0177] Furthermore, the electronic device 104 according to the fourth embodiment, like the third embodiment, makes it less likely to misjudge the direction in which the semiconductor device 4 is fixed to the printed wiring substrate 45 by setting the slot 8 to be non-linearly symmetrical.

[0178] [5] Other variations, etc.

[0179] In embodiments 1 to 4, the semiconductor devices 1, 2, 3, 4 and the electronic devices 100, 102, 103, 104 including semiconductor devices 1, 2, 3, 4 may also have other configurations.

[0180] In this specification, "connection" means electrical connection, even if it is separated by other components. For "electrical connection," an insulator may also be present, provided that the connection functions in the same way as if it were electrically connected. "Substantially the same" and "commonly the same" also include errors due to manufacturing variations.

[0181] The first to fourth embodiments of the present invention are provided as examples and are not intended to limit the scope of the invention. The first embodiment can be implemented in a variety of other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. The first embodiment and / or its variations are included within the scope and spirit of the invention, and are included within the scope of the invention as described in the claims and its equivalents.

Claims

1. A semiconductor device comprising: A substrate that extends along the first surface; A semiconductor chip disposed above the substrate in a first direction; Resin, which covers the semiconductor chip; and Terminals, which are disposed below the substrate in the first direction. The resin comprises a first part and a second part, wherein the height of the first part in the first direction is greater than the height of the second part in the first direction. The end of the second portion along the second direction of the first surface is a part of the end of the resin in the second direction. The second portion of the resin is used for mounting components that fix the semiconductor device. The mounting component includes: a third portion disposed above the second portion, a fourth portion having a second hole, and a fifth portion connecting the third portion and the fourth portion. The continuous terrain of the third, fourth, and fifth sections forms a single unit. The height of the third part in the first direction is within the height difference between the height of the first part and the height of the second part in the first direction.

2. The semiconductor device according to claim 1, The second part extends in the second direction.

3. The semiconductor device according to claim 1, The second part includes a first sub-part extending in the second direction and a second sub-part extending in a third direction along the first surface and intersecting the second direction. The end portion of the first sub-part in the second direction is a portion of the end portion of the resin in the second direction. The end of the second sub-part in the third direction is a portion of the end of the resin in the third direction.

4. The semiconductor device according to claim 1, The second part includes a plurality of nth sub-parts extending along a plurality of nth directions along the first surface, wherein, n is an integer greater than or equal to 2. The end of each of the plurality of nth sub-parts in the nth direction is a portion of the end of the resin in the nth direction.

5. The semiconductor device according to claim 1, The second part includes a first sub-part extending in the second direction and a second sub-part extending in the second direction separately from the first sub-part.

6. The semiconductor device according to claim 5, The second part further includes a third sub-part extending along the first surface and in a third direction intersecting the second direction, and a fourth sub-part separated from the third sub-part. The resin further has a first side and a second side arranged in the second direction and a third side and a fourth side arranged in the third direction. The first sub-part includes the first side, and the second sub-part includes the second side. The third sub-part includes the third side, and the fourth sub-part includes the fourth side.

7. An electronic device comprising: The semiconductor device according to claim 1; A printed wiring board having a second terminal and a first hole electrically connected to the terminal; The mounting components; and A fixing component having portions extending over the first hole and the second hole.

8. The electronic device according to claim 7, The fixing component can fix the mounting component to the printed wiring substrate.

9. The electronic device according to claim 7, The fixing component can be attached to or detached relative to the printed wiring substrate.

10. A semiconductor device comprising: A substrate that extends along the first surface; A semiconductor chip disposed above the substrate in a first direction; Resin, which covers the semiconductor chip; and Terminals, which are disposed below the substrate in the first direction. The resin comprises a first part and a second part, wherein the height of the first part in the first direction is greater than the height of the second part in the first direction. The end of the second portion along the second direction of the first surface is a part of the end of the resin in the second direction. The second portion of the resin is used for mounting components that fix the semiconductor device. The mounting component has: a third portion disposed above the second portion; The semiconductor device is secured by the third portion of the mounting component and a fixing component having a fourth portion disposed above the third portion of the mounting component. The heights of the third and fourth portions in the first direction are within the height difference between the first portion and the second portion in the first direction.

11. An electronic device comprising: The semiconductor device of claim 10; a printed wiring substrate having a second terminal and a first hole electrically connected to the terminal; The mounting components; and The fixing component has a fifth portion that is embedded in the first hole and a sixth portion that connects the fourth portion and the fifth portion. The first portion of the resin has a recess. The sixth portion of the fixing member is disposed in the recess.

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