Laser processing head and laser processing system including the same

Abstract

A laser machining head comprises: a housing including a mounting surface for mounting the laser machining head to a carrier; a plurality of optical components arranged in the housing; and a passage opening formed in the housing for removing or inserting at least one first optical component, the passage opening being formed in the mounting surface.

Description

Technical Field

[0001] The present disclosure relates to a laser processing head, in particular to a laser welding head or a laser cutting head, which has a mounting surface for mounting the laser processing head on a carrier, and to a laser processing system comprising the laser processing head. Background Art

[0002] Generally, a laser processing head used for processing a workpiece using a laser beam is mounted on a surface of its housing, known as the mounting surface, to a carrier of the laser processing system. This carrier supports or moves the laser processing head during the laser processing process. Within the housing, the laser processing head includes the laser beam's optical path, where a number of optical components are located, for example, to focus or collimate the laser beam. During workpiece processing, molten material splashes and fumes are generated. The housing protects the optical components and other parts of the laser processing head from contaminants such as splashes, dust, dirt, and fumes.

[0003] If the optical components become dirty, access to repair or replace the optical components is required. Figure 1 and Figure 2 As shown, the laser processing head 1 comprises a housing 10 with a plurality of horizontal modules 10a, 10b, and 10c. These modules contain various optical components and are vertically interconnected. The interfaces between the modules 10a, 10b, and 10c are visible and represent potential sealing weaknesses. The laser processing head 1 is mounted on a carrier 30 at a mounting surface 11 of the housing 10.

[0004] exist Figure 1 , horizontal channels for optical components are shown (the direction of removal is indicated by a double arrow). Channel openings for servicing optical components (e.g. collimating or focusing optics) included in the horizontal modules 10a, 10b, 10c are vertically located on the front surface, i.e. the surface opposite the mounting surface 11, or on the side surface, i.e. the surface adjacent to the mounting surface 11. These channel openings can be covered by corresponding channel covers, which are screwed to the housing. However, a considerable number of dust particles can still enter the housing through the channel openings, causing undesirable thermal effects and reducing the service life of the optical components. Furthermore, when replacing optical components, it is usually not possible to remove only the optical components, but the larger unit must be removed from the housing. In Figure 1 and Figure 2 In the example, these units are indicated by dashed lines. Figure 1 As shown, when the collimating optical device is replaced, the collimating optical device 42a and the collimating drive unit 42b must be removed together.

[0005] exist Figure 2In FIG, the vertical channels for the optical components are shown. Here, the horizontal modules 10a, 10b, 10c and 10d must be removed in order to remove the corresponding optical components therefrom (the removal direction is indicated by the double arrows). Figure 2 In the illustrated configuration, after the housing is disassembled into its respective modules 10a, 10b, 10c, 10d, some optical components can be removed from the housing horizontally, while others can be removed vertically. Consequently, access to the optical components within the laser processing head is typically provided on all sides of the housing, except for the mounting surface of the housing.

[0006] However, the interfaces and channel openings or channel covers of modules 10a, 10b, 10c, and 10d are heavily soiled by dust, smoke, splashes, and the like. Therefore, before opening the housing, these interfaces and channel openings must be thoroughly cleaned. However, perfect cleaning is often impossible. Sometimes, additional dirt is introduced into the housing during the cleaning process, for example, when compressed air is directed toward the sealing structures of the interfaces or channel openings. Therefore, even with channel covers or sealing structures at the interfaces or channel openings, the housing cannot completely prevent the introduction of dirt particles.

[0007] Furthermore, because access to the optical components is typically provided on the outer surface of the housing, users often find themselves directly opening the housing in the dirty environment of the laser processing system. Furthermore, it is not intuitive to know which optical components should be accessed by the user and which by an experienced service engineer. This can lead to inadvertent opening of the laser processing head, with serious consequences.

[0008] Furthermore, since many interfaces between the modules and access openings or access covers are visible in the mounted state of the laser processing head, only a few areas are available for custom design.

[0009] The current concept of laser processing heads is still based on the design of CO2 laser processing heads, in which simple frontal or side access to optical components is neither rigorous nor practical. However, laser processing heads using lasers with wavelengths in the 400 to 2000 nm range are very sensitive to contaminated optical components, as this laser wavelength range corresponds to the size range of typical dirt particles. Consequently, dirt particles absorb more laser power than in laser processing heads using CO2 lasers with wavelengths of approximately 10 μm. Therefore, in the era of high-performance fiber lasers, this frontal / side access design is no longer current. Summary of the Invention

[0010] An object of the present disclosure is to provide a laser machining head that is well sealed against the ingress of dust particles to ensure that the optical components remain clean and operational for as long as possible, while still allowing access to the optical components of the laser machining head.

[0011] Another object of the present disclosure is to provide a laser processing head that allows convenient and safe access to optical components for repair and replacement.

[0012] Another object of the present disclosure is to provide a laser processing head that ensures that access to at least some optical components is performed by experienced personnel.

[0013] Another object of the present disclosure is to provide a laser machining head having an improved external appearance.

[0014] One or more of these objectives are addressed by the features disclosed herein. Features of preferred embodiments are disclosed.

[0015] According to one aspect of the present disclosure, a laser processing head for processing a workpiece using a laser beam includes: a housing including a mounting surface for mounting the laser processing head to a carrier; a plurality of optical components arranged within the housing, the plurality of optical components including at least one first optical component; and a passage opening formed within the housing for removing or inserting the first optical component, the passage opening being formed in the mounting surface. The laser processing head may be a laser cutting head and / or a laser welding head. If there are multiple first optical components, multiple passage openings may be formed in the mounting surface. Multiple passage openings may be formed in the mounting surface to provide passages for each of the at least one first optical component, i.e., for inserting / removing the at least one first optical component therein. Each first optical component may be removed or inserted through its respective passage opening. A respective passage opening may be provided for each first component, or more than one first optical component may be accessible through a single passage opening.

[0016] The present invention is based on the idea that, among the housing surfaces of a laser machining head, the mounting surface should be minimally exposed to contaminant particles, such as molten metal, dust, dirt, and smoke. Therefore, by providing a passage opening on the mounting surface, the number of dust particles that enter the housing through the passage opening can be reduced. This improves the sealing of the housing, thereby extending the service life of the optical components included in the laser machining head.

[0017] Multiple optical components can define an optical path for the laser processing head, i.e., the path along which the laser beam travels after entering the laser processing head. It will be appreciated that the first optical component need not be the first optical component along the optical path in the direction of laser beam propagation, but can be any optical component arranged within the housing. The optical path can be linear or straight. Alternatively, the optical path of the laser beam can be angled, for example, by including a mirror that reflects the laser beam. Each optical component can have an optical axis. The mounting surface can extend within a plane parallel to the optical path of the laser processing head at an entry point of the laser processing head, where the laser beam enters the housing and / or the laser processing head; and / or extend within a plane parallel to the optical path of the laser processing head at an exit point of the laser processing head, where the laser beam exits the housing and / or the laser processing head. The mounting surface can also extend within a plane parallel to the optical axis of the first component and / or within a plane parallel to the optical axis of a focusing optic included in the optical component.

[0018] The housing can form the exterior of the laser processing head. The housing can include multiple components or modules that together form the exterior of the laser processing head. The carrier can be a carrier used to secure or position the laser processing head during the laser processing process, such as a carrier of a laser processing system. That is, for example, for laser processing, the laser processing head can be mounted on the carrier in a processing position, with the mounting surface at least partially covered by the carrier.

[0019] In addition, a channel cover can be provided for opening or closing the channel opening or at least one of the multiple channel openings. The channel cover can be removably mounted to the housing or mounting surface, for example by screws or similar means. The channel cover can be part of an optical frame or box body that includes the first optical component, which can be accessed through the corresponding channel opening. In addition, in some embodiments, the carrier can be configured to at least partially or completely cover the channel opening when the laser processing head is installed. If multiple channel openings are formed on the mounting surface to provide a channel for at least one of the first optical components, the channel cover can be configured to open or close (i.e., cover) one or more channel openings. There can even be one channel cover for all channel openings. If more than one first optical component can be accessed through a channel opening, the channel opening can be opened or closed by more than one channel cover. However, generally speaking, a channel cover is not required because the function of opening or closing the channel opening can also be performed by the carrier. In this case, a sealing structure is preferably provided between the carrier and the mounting surface.

[0020] The first optical component may include at least one of the following: focusing optics, focusing lenses, collimating optics, collimating lenses, protective windows, mirrors, and beam shaping optics. The first optical component may be insertable / removable through an access opening in a direction perpendicular to the mounting surface and / or its optical axis. The first optical component may be mounted on an optical frame or within a housing. The optical frame or housing may be coupled or connected to an access cover to open or close the corresponding access opening. The housing may be a sealed unit including two protective windows with the first optical component inserted between them. Thus, the optical frame or housing with the first optical component mounted thereon can be removed through the access opening. In other words, the first optical component can be removed while still mounted on the optical frame or housing. The access cover may be connected to the first optical component, in particular to the optical frame or housing. Using these methods, the first optical component or the optical frame or housing with the first optical component can be removed from the laser processing head together with the access cover, thereby simplifying the replacement of optical components. The first optical component may be provided in multiple forms. One or more of the multiple first optical components may be coaxially aligned with one another, i.e., their respective optical axes may extend coaxially.

[0021] The laser processing head may further comprise a drive unit mounted within the housing for moving the first optical element parallel to and / or perpendicular to the optical axis of the first optical element. For example, the first optical element may be a focusing or collimating optical device connected to the drive unit for adjusting its position within the housing. The drive unit may comprise a motor. The drive unit may be a manual drive unit or an automatic or remotely controlled drive unit. In one embodiment, the drive unit for moving the first optical element may be configured to remain mounted within the housing when the first optical element is removed through the access opening. For example, the drive unit for moving the first optical element may be fixedly mounted within the housing.

[0022] The plurality of optical components may include at least one second optical component, such as a protective window. The housing may include an additional opening formed in a housing surface other than the mounting surface for removing or inserting the second optical component. The additional housing surface may extend parallel to the optical path of the laser processing head at an entry point of the laser processing head, where the laser beam may enter the housing and / or the laser processing head. The additional housing surface may extend parallel to the optical path of the laser processing head at an exit point of the laser processing head, where the laser beam may exit the housing and / or the laser processing head. The additional housing surface may also extend within a plane parallel to the optical axis of the first component, within a plane parallel to the optical axis of the second component, and / or within a plane parallel to the optical axis of a focusing optic included in the optical component. The additional housing surface may face the mounting surface, i.e., may be opposite the mounting surface, i.e., spaced apart from and / or extend parallel to the mounting surface. The additional housing surface may be adjacent to and / or extend perpendicular to the mounting surface. For example, the second optical component may be the last optical component of the laser processing head in the direction of laser beam propagation. In other words, the second optical component can be the optical component closest to the processing surface of the processing head and / or the exit point of the laser beam from the housing and / or the laser processing head, such as a protective window. The laser processing head may also include an injection port, and the second optical component can be the optical component adjacent to or closest to the injection port, such as a protective window. The second optical component can be the optical component closest to the entry point of the laser beam into the housing and / or the laser processing head. The laser processing head may also include a fiber coupler for coupling a laser light guide fiber to the laser processing head, and the second optical component can be the protective window or an optical component adjacent to or closest to the fiber coupler.

[0023] The mounting surface may include a grounding area for electrical grounding of the laser processing head. The mounting surface may include alignment means, such as alignment pins or holes, for aligning the laser processing head relative to the carrier. The mounting surface may include fixing means, such as screws, threaded holes, or bolts, for fixing the laser processing head to the carrier. The mounting surface may include a hollowed-out pad or cutout for weight reduction. The mounting surface may include at least one sealing structure surrounding at least one or all of the channel openings, such as a sealing structure for sealing between the mounting surface and at least one of a channel cover, a recess cover, and a mounting cover.

[0024] The mounting surface may include a recessed portion in which at least one access opening is formed. A recessed cover for at least partially or completely opening or closing the recessed portion may be removably mounted to the mounting surface. The mounting surface may include a first recessed portion in which at least one access opening is formed. The one or more access openings may be removably covered by the access cover. The first recessed portion may be formed in a second recessed portion of the mounting surface. That is, the mounting surface may include two steps, i.e., three different levels. The (first and / or second) recessed portion may extend in a plane parallel to a portion of the mounting surface outside the recessed portion. The recessed cover may be configured to open or close the second recessed portion and / or at least one or all of the access covers.

[0025] The laser processing head may include a mounting cover for covering a mounting surface. When the mounting cover covers the mounting surface, a seal may be provided between the mounting cover and / or the mounting surface, i.e., between the mounting cover and the mounting surface. The mounting cover may be hingedly connected to the mounting surface and may be configured to be mounted on a carrier. Specifically, the mounting cover may be rotatably or pivotally coupled to the mounting surface, for example, via at least one hinge unit. The hinge axis or rotational axis of the hinge unit may extend parallel to the mounting surface and / or the optical path of the laser processing head and / or the optical axis of the first optical component. This hinge arrangement allows the laser processing head to be rotated relative to the carrier to expose the mounting surface and the access opening formed therein. Thus, the first optical component can be replaced without removing the laser processing head from the carrier. Optical fibers, electrical connections, etc. do not need to be removed and can remain connected to the laser processing head. Furthermore, this hinged arrangement can be used with conventional carriers for laser processing systems because, in addition to rotatably coupling the mounting cover to the mounting surface via at least one hinge unit, the mounting cover also provides a means for mounting the laser processing head on the carrier.

[0026] The mounting cover can have any shape. However, it is preferred that the mounting cover has a frame shape to reduce weight. The mounting cover can include fixing means, such as screws, threaded holes or bolts, to mount the laser processing head to the carrier.

[0027] Optionally, the laser processing head, in particular the mounting surface and / or the mounting cover, may include a locking device for locking the laser processing head in the processing position on the carrier, wherein the mounting surface is at least partially covered by the carrier. The locking device may include a screw, a bolt, a clip, a lock or the like.

[0028] The housing can include at least one housing surface facing the mounting surface, i.e., opposite the mounting surface, and / or at least one housing surface adjacent to and / or extending perpendicular to the mounting surface, with the housing surfaces forming a continuous or integral surface. A continuous surface here can refer to a surface without openings or interfaces. The housing surface can extend parallel to the mounting surface. This improves the sealing of the housing and its components. Furthermore, a large area can be provided for other functions, such as customizing the exterior of the laser processing head, for example, with decorative adhesive films, or for routing cables or mounting external devices. Therefore, the housing surface can include means for routing cables and / or mounting means for external devices, such as cameras for process monitoring or display.

[0029] The housing may include at least one housing surface facing the mounting surface, i.e., opposite the mounting surface. This housing surface may be referred to as the front surface of the housing. A side surface may connect the mounting surface and the front surface. The side surface may extend parallel to the optical path of the laser processing head. At least one side surface may be formed as a continuous or integral surface. The front surface may be shorter than the two side surfaces. A gap may be formed between the front surface and the bottom surface of the housing. The bottom surface of the housing may be a housing surface extending perpendicular to the optical path at the exit point of the housing. The gap may be sealed by a transparent material. An LED array may be placed within the housing adjacent to the gap, such that light is emitted by the LED array through the transparent material. The LED array may display the operating status of the laser processing head while allowing the front surface to have a solid or smooth appearance. The LED array may include a plurality of LEDs configured to emit light of different colors or the same color.

[0030] The laser processing head, in particular its optical components, can be configured for use with a fiber laser and / or with a laser beam having a wavelength in the range of 400 nm to 2000 nm, or with a laser beam having a wavelength of 970 nm, 1030 nm or 1070 nm, and / or with a laser beam having a laser power of at least 2 kW, at least 6 kW, at least 12 kW, at least 20 kW, at least 30 kW, at least 50 kW or at least 70 kW or up to 100 kW.

[0031] According to another aspect, a laser processing system is provided, comprising an automotive carrier according to any of the embodiments described herein and a laser processing head, wherein the laser processing head is mounted on the carrier. That is, a mounting surface of the laser processing head is mounted on the carrier. During laser processing, the laser processing head can be mounted on the carrier in a processing position, wherein the mounting surface is at least partially covered by the carrier. That is, in the mounted state of the laser processing head, the carrier at least partially covers the mounting surface and / or (at least one or all) the passage openings.

[0032] The laser processing system may include a laser source for providing a laser beam to the laser processing head, for example, via an optical fiber. The laser source may be a fiber laser and / or configured to generate a laser beam having a wavelength in the range of 400 nm to 2000 nm, or a laser beam having a wavelength of 970 nm, 1030 nm, or 1070 nm, and / or a laser beam having a laser power of at least 2 kW, at least 6 kW, at least 12 kW, at least 20 kW, at least 30 kW, at least 50 kW, or at least 70 kW, or up to 100 kW.

[0033] When the laser processing head is mounted on the carrier and / or in the processing position of the laser processing head, the carrier can be configured to block the access cover. The carrier can at least partially block or cover the access cover. Alternatively, the carrier can at least partially surround the access cover. The carrier can be configured to hold or position the laser processing head during the laser processing process, for example, to hold or position the laser processing head relative to the workpiece. The carrier can be mounted on a rail system to enable the laser processing head to move in one direction or in two or three orthogonal directions. In one example, the carrier can include a robot for moving the laser processing head, such as a robot arm having two or more axes, for example six axes, or a portion thereof.

[0034] The laser processing system may comprise a laser source for generating a laser power of at least 50 kW or at least 70 kW and / or for generating a laser beam having a wavelength in the range of 400 nm to 2000 nm or having a wavelength of 970 nm or 1030 nm or 1070 nm.

[0035] A sealing structure may be provided between the mounting surface and the carrier. The sealing structure may be arranged along the circumference or outer edge of the mounting surface. The sealing structure may at least surround the channel opening for sealing, in particular at the processing position of the laser processing head.

[0036] The mounting surface of the laser processing head can be hingedly connected to the carrier, for example, via at least one hinge unit. Thus, the laser processing head can be rotatably coupled to the carrier. This facilitates exposure of the mounting surface and access openings formed therein, which are typically covered or blocked by the carrier. Optionally, the carrier and / or the laser processing head can include locking means for locking the laser processing head to the carrier in a processing position in which the mounting surface is at least partially covered by the carrier. The locking means can include screws, bolts, clips, latches, or similar devices.

[0037] The carrier may comprise a carrier frame mounted on the mounting surface of the laser processing head, the carrier frame exposing the access opening. Thus, the access opening is directly accessible through the carrier frame.

[0038] The carrier may comprise a fully automatic changing device for automatically changing the at least one first optical component. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In the attached figure:

[0040] Figure 1 is a schematic diagram of a prior art laser processing head having a horizontal channel for an optical component;

[0041] Figure 2 is a schematic diagram of another laser processing head of the prior art, the laser processing head having horizontal and vertical channels for optical components;

[0042] Figure 3A is a rear view of a laser processing head according to one embodiment of the present disclosure;

[0043] Figure 3B shows a front view of a laser processing head according to one embodiment of the present disclosure;

[0044] Figures 4A to 4C The rear views of the laser processing head according to another embodiment of the present disclosure are respectively shown, wherein the head is divided into a rear view without a channel cover, a rear view with a channel cover, and a rear view with a recessed cover;

[0045] Figure 5 Shown according to Figures 3A to 4C a side view of a laser processing head according to any of the embodiments shown;

[0046] Figure 6 Shown Figure 5 A view of a laser processing head mounted on a carrier of a laser processing system;

[0047] Figure 7 is a view of a laser processing head having a mounting cover on a carrier of a laser processing system with a hinged mounting according to another embodiment of the present disclosure;

[0048] Figure 8 A view showing a laser processing head hingedly mounted to a carrier of a laser processing system according to another embodiment of the present disclosure; and

[0049] Figure 9 A view illustrating a laser processing system having a carrier frame and a laser processing head mounted on the carrier according to another embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0050] Throughout the present disclosure, the same elements are denoted by the same reference numerals.

[0051] Generally speaking, the laser processing head 1 is mounted to the carrier 30 of the laser processing system at a mounting surface 11 of the housing 10 of the laser processing head 1. In the prior art, the mounting surface 11 has little function other than mounting. Although the drawings and detailed description describe a laser processing head having a linear optical path for the laser beam, this statement also applies to laser processing heads having a curved or tilted optical path for the laser beam, such as that resulting from the action of a mirror or beam splitter. Similarly, although the drawings and detailed description describe a laser processing head having a fiber coupler, the laser processing head may also have other coupling devices for coupling the laser beam into the laser processing head at its entry point.

[0052] According to the present disclosure, the inventors have noted that the mounting surface 11 is the surface of the housing 10 that offers the best protection against dust particles because it is at least partially or even completely covered by the carrier in the installed state, i.e., during the processing process. Therefore, the mounting surface 11 is selected to provide an access opening for the optical components of the laser processing head. By moving the access opening from other housing surfaces to the mounting surface 11, the sealing properties of the housing 10 against dust particles can be improved. Furthermore, in addition to the mounting surface 11, at least one of the other surfaces of the housing 10 can be designed as a monolithic surface, i.e., without gaps, joints, or openings, thereby improving the external appearance. This also increases the user's confidence in the sealing properties of the laser processing head against dust particles. Other surfaces can also be used for other functions. For example, devices for cabling, cameras for monitoring the laser processing, or displays can be mounted on one or more of these other surfaces.

[0053] exist Figure 3A, a rear view of a laser processing head 1 according to the present invention is shown. Specifically, the mounting surface 11 is shown, which can also be referred to as the rear surface of the housing 10. The laser processing head 1 includes multiple optical components arranged in the optical path within the housing 10. For example, these optical components may include a first protective window 41, collimating optics 42, focusing optics 43, and a second protective window 45. The first protective window 41 may be the first optical component in the laser processing head's optical path, i.e., along the direction of laser beam propagation. In other words, the first protective window 41 may be the optical component closest to the fiber coupler or entry point 40 of the laser processing head. Similarly, the second protective window 45 may be the last optical component in the laser processing head's optical path, i.e., along the direction of laser beam propagation. In other words, the second protective window 45 may be the optical component closest to the laser processing head's ejection port 20 or its exit point. Of course, the laser processing head 1 may include additional protective windows, which may be arranged between the first protective window 41 and the second protective window 45. Alternatively, the laser processing head 1 may include only one protective window, i.e., either the protective window 41 or the protective window 45. Although the focusing optical device 43 and the collimating optical device 42 are each shown as a lens, the focusing optical device 43 and the collimating optical device 42 may each include a lens, a lens assembly, a lens module, etc. Optionally, another optical component 44 may be provided, which may be another protective window, a beam splitter, or the like. One or more optical components may be mounted on an optical frame and / or in a housing. In this case, the housing may include at least two protective windows arranged on both sides of the corresponding optical component, such as the collimating optical device 42 or the focusing optical device 43.

[0054] For at least some of these optical components of the laser processing head, an access opening 50 for repairing or replacing each optical component is provided on the mounting surface 11. The access opening 50 can be covered by a access cover 55. However, the access cover 55 is not mandatory. The access opening can be covered by the box body 30 or by a recessed cover 115 (described below) or a mounting cover 60 (described below). When the access cover 55 is removed from the mounting surface 11, the access opening 50 is exposed and the corresponding at least one optical component can be accessed, for example, repaired or replaced. Figure 3A In the example shown, the focusing optics 43 and the optical component 44 can be contacted via the same access opening 50. However, a separate access opening 50 can be provided for each optical component. Likewise, the access cover 55 can cover only one access opening 50 or a plurality of access openings 50.

[0055] like Figure 3AAs shown, in order to mount the laser processing head 1 on the carrier 30, additional fixing means 15, such as threaded holes, screws or bolts, can be provided on the mounting surface 11. In addition, alignment means (not shown), such as pin holes and / or pins, can also be provided on the mounting surface 11 to accurately and repeatably align the laser processing head 1 with the carrier 30. In addition, the mounting surface 11 can include a grounding area for electrical grounding of the laser processing head 1. In order to reduce weight, the mounting surface 11 can be hollowed out, for example by including one or more recessed portions, as described below with respect to Figures 4A to 4C Description.

[0056] Figure 3B A front view of a laser processing head 1 according to one embodiment of the present invention is shown. The front surface 12, i.e., the surface of the housing opposite or facing the mounting surface 11, has a unitary or unified appearance. Alternatively or additionally, a side surface 13 of the housing, which connects the front surface 12 and the mounting surface 11 and extends parallel to the optical path of the laser processing head, may have a unitary or unified appearance. The distance that the front surface 12 extends toward the bottom surface 16 of the housing 10 may be less than the distance that the side surface 13 extends toward the bottom surface 16, so that a gap 14 is formed between the bottom surface 16 and the front surface 12. This gap 14 may be sealed by acrylic glass or other transparent material. An LED array may be provided behind the gap to display the operating status of the laser processing head 1.

[0057] exist Figures 4A to 4C , a rear view of a laser processing head 1 according to another embodiment is shown. Most of the components are the same as Figure 3A Therefore, detailed description of these components is omitted. Figures 4A to 4C In the embodiment shown, the mounting surface 11 is recessed. In the example shown, the mounting surface 11 comprises a first recess 111, in which one or more passage openings 50 are formed, and a second recess 112, in which the first recess 111 is formed. The recesses may be recessed towards the interior of the housing 10. In other words, the mounting surface 11 may comprise three different levels or two steps. However, the second recess 112 is not required, i.e. the mounting surface 11 may also comprise only the first recess 111, i.e. only one step. By recessing the mounting surface 11, the weight of the housing may be reduced. Alternatively or additionally, as Figure 4B As shown, the first recess 111 can serve as a seating area for one or more channel covers 55. In this case, as shown in FIG. Figure 4BAs shown, the first recess 111 can be covered, filled, or closed by the channel cover 55. That is, the channel cover 55 can have the same width and / or the same thickness as the first recess 111 so as to completely fill the first recess 111, or to achieve a step-free surface of the mounting surface 11 and the channel cover 55 when the channel cover 55 closes the respective channel opening 50. Figure 4C In the embodiment, the second recessed portion 112 is covered, filled, or closed by the recessed cover 115. Here, the recessed cover 115 has the same width and thickness as the second recessed portion 112 so as to completely fill the second recessed portion 112 and realize a step-free surface between the mounting surface 11 and the recessed cover 115 when the recessed cover 115 is installed. This step-free surface can improve the appearance.

[0058] exist Figure 5 and Figure 6 In the figure, it is shown that Figures 3A to 4C A side view of the laser processing head 1 according to any of the embodiments shown in FIG. Figure 5 In the figure, the laser processing head 1 has been removed from the carrier 30. The double arrow indicates that the optical component can be replaced in this direction. It can be seen that the replacement is carried out in the horizontal direction through the access opening 50 in the mounting surface 11, that is, perpendicular to the optical axis of the optical component or perpendicular to the mounting surface 11. The dashed line represents the units removed from the housing 10. In particular, the collimating optics 42 can be removed from the housing, while the drive unit 42a (not shown) for moving the collimating optics 42 along its optical axis (arrow) and / or perpendicular to the optical axis can remain in place. Similarly, the focusing optics 43 can be removed without removing the drive unit (not shown) for moving the focusing optics 43a along its optical axis and / or perpendicular thereto.

[0059] Most optical components do not need to be touched during normal operation. By providing access openings 50 for these optical components on the mounting surface 11 on the rear side of the laser processing head 1, the access openings 50 and the optical components can be protected from dust and can be cleaned and maintained. Here, clean access is more important than maintenance. In order to improve the sealing performance against dirt, such as Figure 6 As shown, a sealing structure 33 may be provided between the mounting surface 11 and the carrier 30. Preferably, the sealing structure 33 surrounds all of the access openings 50 or access covers 55. Alternatively, multiple sealing structures 33 may be provided, each surrounding a respective access opening 50 on the mounting surface 11. By providing an access opening 50 for the optical component on the mounting surface 11, the access opening 50 is not visible during normal operation. Furthermore, the access opening 50 is protected to prevent unauthorized access by a normal user. In addition, a seal may be provided between the mounting surface 11 and the access cover 55.

[0060] However, the second protective window 45 may not be accessible via the mounting surface 11. The second protective window 45 is a wear part and must be regularly inspected and replaced during normal operation. Figure 6 As shown, the second protective window 45 can be accessed through another opening 56 on the housing surface 12 opposite to the mounting surface 11, that is, through the front surface of the housing 10. Through these methods, the user can easily access. However, the present invention is not limited to this, and the second protective window 45 can also be accessed through the mounting surface 11. Although Figure 5 and Figure 6 In the figure the first protective window 41 is shown as being accessible through the mounting surface 11, but it can also be accessed through the front surface 12 like the second protective window 45. This is particularly useful if the laser processing head comprises a fiber coupler 40.

[0061] According to other embodiments of the present disclosure, by rotatably connecting the laser processing head 1 to the carrier 30 using one or more hinge units, accessibility to the mounting surface 11 is improved for experienced personnel. Preferably, the laser processing head 1 is rotatable by at least 90° relative to the carrier 30. The axis of rotation can be vertical. In other words, the axis of rotation can be parallel to the optical path of the laser processing head, i.e., parallel to the mounting surface 11. The laser processing head 1 can also include a locking device for locking the laser processing head 1 in the processing position, i.e., for preventing any rotational movement about the hinge unit. The locking device can be a latch mechanism or a similar mechanism.

[0062] In one embodiment, Figure 7 As shown, the laser processing head 1 has a mounting cover 60 that is hingedly connected to the mounting surface 11 of the housing 10 via at least one hinge unit 63. The hinge unit 63 allows for at least 90° of rotation. The mounting cover 60 can be mounted to the carrier 30 of the laser processing system via additional fixing means 65 (such as screws or bolts). Thus, the laser processing head 1 can rotate relative to the mounting cover 60 or relative to the carrier 30 about the rotation axis of the hinge unit 63.

[0063] In another embodiment, Figure 8 As shown, at least one hinge unit 73 is provided on the mounting surface 11 to be hinged to the carrier 30. Therefore, the laser processing head 1 can be rotatably coupled to the carrier 30 directly on its mounting surface 11. In order to fix the laser processing head 1 at the processing position of the carrier 30, a locking device such as a screw and a threaded hole, a latch assembly, a snap mechanism or the like can be provided on the carrier 30 and / or the laser processing head 1. Figure 8 In FIG, a threaded hole 71 is exemplarily shown on the carrier 30 for fixing the laser processing head at a processing position of the carrier 30 by means of screws. The corresponding threaded hole in the processing head 1 is not shown.

[0064] According to other embodiments of the present disclosure, the accessibility of the mounting surface 11 is improved by the carrier 30 including a carrier frame 35. Figure 9 As shown, the carrier frame 35 has a frame shape with an opening in the center. The mounting surface 11 of the laser processing head 1 is mounted to the carrier frame 35, such that the access covers 55 are exposed through the carrier frame 35. Preferably, the carrier frame 35 surrounds all access covers 55 on the mounting surface 11 of the laser processing head. As previously described, a sealing structure 33 can be provided between the carrier frame 35 and the mounting surface 11. Through these methods, the access opening 50 can be used to access optical components without removing the laser processing head 1 from the carrier 30 or rotating the laser processing head 1 relative to the carrier 30. This improves both accessibility of the laser processing head on the carrier and its mounting stability.

[0065] The carrier 30 or carrier frame 35 may include auxiliary devices designed to assist in releasing or guiding the removal of the optical components. Alternatively, the carrier 30 or carrier frame 35 may include an automated replacement device for replacing the optical components. The replacement device may include a drive unit or motor and replacement components for each optical component. This allows for remotely controlled and fully automated replacement of optical components.

[0066] According to the present disclosure, the access opening is moved to the rear surface, or mounting surface 11, of the laser processing head 1. This eliminates the access opening from the user's view. This improves the laser processing head's sealing against dust particles. It also enhances the exterior appearance and allows for customized designs, such as using large, three-dimensional adhesive films to cover multiple housing surfaces.

Claims

1. A laser processing system comprising: A laser processing head (1) and a carrier (30), wherein the laser processing head (1) is mounted on the carrier (30), The laser processing head (1) comprises: a housing (10) comprising a mounting surface (11) for mounting the laser processing head to a carrier (30), a plurality of optical components (41, 42, 43, 44, 45) arranged in the housing (10); and a passage opening (50) for removing or inserting at least one first optical component (41, 42, 43, 44) in said optical components (41, 42, 43, 44, 45), It is characterized in that The passage opening (50) is formed in the mounting surface (11) of the housing (10), and In the mounted state of the laser processing head (1), the carrier (30) at least partially covers the passage opening (50).

2. The laser processing system according to claim 1, wherein: The plurality of optical components (41, 42, 43, 44, 45) include at least one second optical component (45), and a further opening (56) for removing or inserting the second optical component (45) is formed in a housing surface (12) of the housing (10), the housing surface (12) extending perpendicular to the mounting surface (11) or opposite to the mounting surface (11).

3. The laser processing system according to claim 2, wherein: The laser processing head further comprises an ejection port (20), and the second optical component (45) is a protective window adjacent to the ejection port (20) or an optical component closest to the ejection port (20), or The laser processing head further comprises a fiber coupler (40) for coupling a laser light guide fiber to the laser processing head, and the second optical component (45) is a protective window adjacent to the fiber coupler (40) or an optical component closest to the fiber coupler (40).

4. The laser processing system according to claim 2 or 3, wherein: The second optical member (45) is an optical member closest to an entry point allowing the laser beam to enter the housing (10), or an optical member closest to an exit point allowing the laser beam to exit the housing (10).

5. The laser processing system according to any one of claims 1 to 3, wherein: The at least one first optical component (41, 42, 43, 44) comprises at least one of the following: focusing optics, collimating optics (42), a protective window (41), a mirror, and beam shaping optics.

6. The laser processing system according to any one of claims 1 to 3, wherein: The laser processing head further comprises a driving unit (42a, 43a) mounted at the housing (10), the driving unit being used to move the first optical member parallel to and / or perpendicular to the optical axis of the first optical member (42, 43). The drive unit (42a, 43a) is configured to be able to remain mounted on the housing (10) when the first optical component (42, 43) is removed through the passage opening (50).

7. The laser processing system according to any one of claims 1 to 3, wherein: The mounting surface (11) extends in a plane parallel to the optical path of the laser machining head at an entry point to allow the laser beam to enter the housing (10) and / or extends in a plane parallel to the optical path of the laser machining head at an exit point to allow the laser beam to exit the housing (10), and / or extends in a plane parallel to the optical axis of the first optical member (41, 42, 43, 44).

8. The laser processing system according to any one of claims 1 to 3, wherein: The mounting surface (11) comprises alignment means for aligning the laser machining head relative to the carrier (30) and / or fixing means (15) for fixing the laser machining head to the carrier (30).

9. The laser processing system according to any one of claims 1 to 3, wherein: At least one housing surface (12) opposite to the mounting surface (11) and / or at least one housing surface adjacent to the mounting surface (11) and / or extending perpendicularly to the mounting surface is a continuous surface.

10. The laser processing system according to any one of claims 1 to 3, wherein: The laser processing head further comprises: A channel cover (55) is provided for opening or closing the channel opening (50), wherein the channel cover (55) is removably mounted to the housing (10).

11. The laser processing system according to claim 10, wherein: The access cover (55) is part of an optical frame or a box comprising the first optical components (41, 42, 43, 44), which are accessible through the access opening (50).

12. The laser processing system according to any one of claims 1 to 3 and 11, wherein: The mounting surface (11) includes a recessed portion (111, 112), the passage opening (50) is formed in the recessed portion, the laser processing head further includes a recessed cover (115) for opening or closing the recessed portion (111, 112), and / or The laser machining head further comprises a mounting cover (60) hingedly coupled to the mounting surface (11), the mounting cover (60) comprising further fixing means (65) for fixing the laser machining head (1) to the carrier (30).

13. The laser processing system according to any one of claims 1 to 3 and 11, wherein: The laser processing system further includes a sealing structure (33) between the mounting surface (11) and the carrier (30).

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