Antenna and antenna temperature control system
By setting a temperature control unit layer on the amplification circuit layer of the antenna to adjust the temperature, the performance deterioration caused by temperature changes is solved, and the stability of the antenna's working temperature and performance improvement is achieved.
Patent Information
- Application Number
- CN202180000496.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-03-15
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2041-03-15
AI Technical Summary
In the existing antenna, the dielectric constant of the dielectric layer of the phase shifter changes with temperature, resulting in deterioration of the antenna performance, such as the lifting of the secondary lobe, the reduction of the main lobe, the disorder of the beam direction, etc.
By setting a temperature control unit layer on one side of the amplifier circuit layer, the temperature of the amplifier circuit layer is adjusted, thereby stabilizing the operating temperature of the antenna, suppressing temperature drift, and avoiding deterioration of performance.
Effectively stabilize the operating temperature of the antenna, suppress temperature drift, improve the performance stability of the antenna, and avoid performance degradation caused by temperature changes.
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Figure CN115552725B_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the field of communications, and in particular relates to an antenna and a temperature control system of the antenna. Background Art
[0002] In some antennas, the dielectric constant of the dielectric layer of the phase shifter in the antenna will change significantly with the change of temperature. That is, the increase in temperature will cause the phase shift angle range of the phase shifter to decrease and the insertion loss to increase. The reaction on the antenna will cause the antenna performance to deteriorate, such as the side lobe rising, the main lobe lowering, the beam pointing disorder, etc., which brings great challenges to the simulation design and actual use of the antenna. Summary of the invention
[0003] The present invention aims to solve at least one of the technical problems existing in the prior art and provides an antenna which adjusts the temperature of the amplifying circuit layer through a temperature control unit layer, thereby adjusting the operating temperature of the antenna, so that the operating temperature of the antenna is stabilized within a certain range, thereby suppressing the temperature drift of the antenna and avoiding deterioration of the performance of the antenna.
[0004] In a first aspect, an embodiment of the present disclosure provides an antenna, comprising: a feeding unit layer, a phase shifter layer, and an amplifying circuit layer disposed therebetween, and a temperature control unit layer disposed on one side of the amplifying circuit layer;
[0005] The amplifying circuit layer is configured to amplify the microwave signal fed by the feeding unit layer and transmit it to the phase shifter layer;
[0006] The phase shifter layer is configured to phase shift the microwave signal according to a preset phase shift amount;
[0007] The temperature control unit layer is configured to adjust the temperature of the amplifying circuit layer to adjust the working temperature of the antenna.
[0008] The antenna provided by the embodiment of the present disclosure has a temperature control unit disposed on one side of the amplifying circuit layer. The temperature control unit can adjust the temperature of the amplifying circuit layer, thereby stabilizing the operating temperature of the antenna within a certain range, thereby suppressing the temperature drift of the antenna and avoiding deterioration of the performance of the antenna.
[0009] In some examples, the temperature control unit layer is in direct contact with the amplifying circuit layer.
[0010] In some examples, the feed unit layer includes a first substrate, a plurality of microwave receiving units disposed on the first substrate, and a transmission line power division structure disposed on the first substrate;
[0011] The transmission line power division structure has a plurality of first ports and a plurality of second ports, wherein one of the first ports is connected to a corresponding microwave receiving unit, and a plurality of the first ports correspond to one of the second ports;
[0012] The amplifying circuit layer includes a plurality of amplifying circuits, and one of the amplifying circuits is correspondingly connected to one of the second ports;
[0013] The temperature control unit layer is arranged between the amplifying circuit layer and the first substrate; wherein a plurality of flow channels are arranged in the temperature control unit layer for accommodating the flow of working fluid.
[0014] In some examples, the further comprising: a plurality of microwave connectors, wherein a first end of each of the microwave connectors is connected to one of the second ports, and a second end of each of the microwave connectors is connected to one of the amplifying circuits;
[0015] The temperature control unit layer is provided with a plurality of openings along the thickness direction thereof, so that the microwave connector can pass through the temperature control unit layer through the openings;
[0016] The orthographic projections of the plurality of flow channels on the amplifying circuit layer do not overlap with the orthographic projections of the plurality of openings on the amplifying circuit layer.
[0017] In some examples, the amplifier circuit layer includes a plurality of amplifier circuits; the phase shifter layer includes a plurality of phase shifters, and one phase shifter is connected to one amplifier circuit correspondingly;
[0018] The temperature control unit layer is arranged on a side of the amplifying circuit layer close to the phase shifter layer, and has a plurality of accommodating cavities, each of which wraps the phase shifter therein;
[0019] The temperature control unit layer is provided with a plurality of flow channels for accommodating the flow of working fluid;
[0020] The orthographic projections of the plurality of flow channels on the amplifying circuit layer do not overlap with the orthographic projections of the plurality of accommodating cavities on the amplifying circuit layer.
[0021] In some examples, the phase shifter includes a second substrate and a third substrate disposed opposite to each other, and a first dielectric layer disposed between the second substrate and the third substrate; the first dielectric layers of a plurality of the phase shifters are an integrated structure.
[0022] In some examples, the phase shifter layer includes a plurality of phase shifters; the phase shifter includes a second substrate and a third substrate disposed opposite to each other, and a first dielectric layer disposed between the second substrate and the third substrate;
[0023] The second substrate comprises: a first base; a first temperature adjustment structure disposed on a side of the first base close to the first dielectric layer, for adjusting the operating temperature of the phase shifter; a first transmission line disposed on a side of the first temperature adjustment structure close to the first dielectric layer;
[0024] The third substrate comprises: a second substrate; a second temperature adjustment structure disposed on a side of the second substrate close to the first dielectric layer, which is used to adjust the operating temperature of the phase shifter; a first reference electrode disposed on a side of the second temperature adjustment structure close to the first dielectric layer, the first reference electrode having a first opening; the first reference electrode at least partially overlaps with the orthographic projection of the first transmission line on the first substrate, and the first opening at least partially overlaps with the orthographic projection of the first end of the first transmission line on the first substrate; wherein,
[0025] The orthographic projection of the first temperature adjustment structure on the first substrate and the orthographic projection of the second temperature adjustment structure on the first substrate do not overlap with the orthographic projection of the first transmission line on the first substrate.
[0026] In some examples, the antenna further includes: a plurality of temperature measuring units, disposed on one side of the third substrate or one side of the second substrate of at least part of each of the plurality of phase shifters, for detecting an operating temperature of the phase shifters.
[0027] In some examples, the amplifier circuit layer includes a plurality of amplifier circuits, and one phase shifter is connected to one amplifier circuit accordingly; each phase shifter further includes: a first waveguide structure connected between the phase shifter and the amplifier circuit; the first waveguide structure is configured to transmit a microwave signal by coupling with the first end of the first transmission line through the first opening; wherein,
[0028] The orthographic projection of the first waveguide structure on the first substrate has no overlap with the orthographic projections of the first temperature adjustment structure and the second temperature adjustment structure on the first substrate.
[0029] In some examples, a minimum distance between the first temperature adjustment structure and at least one of the first transmission line and the first waveguide structure is greater than or equal to 0.5 mm, and / or a minimum distance between the second temperature adjustment structure and at least one of the first transmission line and the first waveguide structure is greater than or equal to 0.5 mm.
[0030] In some examples, the first temperature adjustment structure and / or the second temperature adjustment structure is a resistance wire.
[0031] In some examples, the first substrate includes a first sub-substrate and a second sub-substrate, and the second sub-substrate is disposed on a side of the first sub-substrate close to the amplifying circuit layer;
[0032] The microwave receiving unit comprises a first sub-microwave receiving unit and a second sub-microwave receiving unit, wherein the first sub-microwave receiving unit array is arranged on a side of the first sub-baseboard away from the second sub-baseboard, and the second sub-microwave receiving unit array is arranged on a side of the second sub-baseboard close to the first sub-baseboard;
[0033] The transmission line power division structure is arranged on the side of the second sub-substrate close to the first sub-substrate, and one of the first ports is connected to one of the second sub-microwave receiving units correspondingly; wherein,
[0034] The first sub-microwave receiving unit and the second sub-microwave receiving unit are arranged in one-to-one correspondence, and the orthographic projection of the first sub-microwave receiving unit on the second sub-baseboard and the orthographic projection of the corresponding second sub-microwave receiving unit on the second sub-baseboard at least partially overlap.
[0035] In some examples, the second sub-substrate has a plurality of first through holes penetrating along a thickness direction, and each of the second ports corresponds to one of the first through holes;
[0036] The antenna further includes: a plurality of microwave connectors; a first end of each of the microwave connectors passes through one of the first through holes to connect to one of the second ports, and a second end of each of the microwave connectors is connected to one of the amplifying circuits.
[0037] In some examples, it further includes: a waveguide power division structure, which is arranged on a side of the phase shifter layer away from the amplifying circuit layer;
[0038] The waveguide power division structure has n-level sub-waveguide structures, and the number of sub-waveguide structures from the first level to the nth level gradually decreases in the direction from the phase shifter layer to the waveguide power division structure; wherein n≥2;
[0039] The first end of each first-level sub-waveguide structure is connected to one of the phase shifters, and the second ends of at least two first-level sub-waveguide structures are connected to the first end of one second-level sub-waveguide structure;
[0040] The first end of each m-th level sub-waveguide structure is connected to the second ends of at least two m-1-th level sub-waveguide structures, and the second ends of at least two m-th level sub-waveguide structures are connected to the first end of an m+1-th level sub-waveguide structure, wherein 1<m<n;
[0041] The first end of each n-th level sub-waveguide structure is connected to the second ends of at least two n-1-th level sub-waveguide structures, and the second end of each n-th level sub-waveguide structure serves as a combining end of the waveguide power division structure.
[0042] In a second aspect, the present application also provides a temperature control system for an antenna, which includes the above-mentioned antenna.
[0043] In some examples, the temperature control system further includes: a circulation device connected to the flow channel;
[0044] The circulation device comprises a working fluid driving unit and a working fluid temperature control unit. The working fluid driving unit is used to drive the working fluid to flow, and the working fluid temperature control unit is used to control the temperature of the working fluid. BRIEF DESCRIPTION OF THE DRAWINGS
[0045] Figure 1 Schematic diagram of the temperature drift characteristics of the antenna.
[0046] Figure 2 A simplified structural diagram of an antenna according to an embodiment of the present disclosure.
[0047] Figure 3 A simplified structural diagram of another embodiment of the antenna provided in the embodiment of the present disclosure.
[0048] Figure 4 A simplified structural diagram of an antenna according to an embodiment of the present disclosure.
[0049] Figure 5 A simplified structural diagram of another embodiment of the antenna provided in the embodiment of the present disclosure.
[0050] Figure 6 One of the structural schematic diagrams of an embodiment of a feeding unit layer of an antenna provided in an embodiment of the present disclosure.
[0051] Figure 7 The second structural schematic diagram of an embodiment of the feeding unit layer of the antenna provided in the embodiment of the present disclosure.
[0052] Figure 8 The third structural diagram of an embodiment of the feeding unit layer of the antenna provided in the embodiment of the present disclosure.
[0053] Fig. 9 One of the structural schematic diagrams of an embodiment of a phase shifter of an antenna provided in an embodiment of the present disclosure.
[0054] Fig.10 The second structural schematic diagram of an embodiment of the phase shifter of the antenna provided in the embodiment of the present disclosure.
[0055] Fig.11 A third structural schematic diagram of an embodiment of a phase shifter for an antenna provided in an embodiment of the present disclosure.
[0056] Fig.12 A fourth structural schematic diagram of an embodiment of a phase shifter for an antenna provided in an embodiment of the present disclosure.
[0057] Fig.13 A fifth structural diagram of an embodiment of a phase shifter for an antenna provided in an embodiment of the present disclosure.
[0058] Fig.14The sixth structural diagram of an embodiment of the phase shifter of the antenna provided in the embodiment of the present disclosure.
[0059] Fig.15 A structural schematic diagram of an embodiment of a waveguide power division structure of an antenna provided in an embodiment of the present disclosure. DETAILED DESCRIPTION
[0060] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0061] The shapes and sizes of the components in the drawings do not reflect the actual proportions, and are only intended to facilitate understanding of the contents of the embodiments of the present invention.
[0062] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0063] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings have schematic properties, and the shapes of the regions shown in the drawings illustrate the specific shapes of the regions of the elements, but are not intended to be limiting.
[0064] First, participate Figure 2-Figure 5An embodiment of the present disclosure provides an antenna, wherein the antenna includes a feed unit layer 1, a phase shifter layer 3, and an amplifier circuit layer 2 arranged between the feed unit layer 1 and the phase shifter layer 3, and a temperature control unit layer 4 arranged on one side of the amplifier circuit layer 2. The temperature control unit layer 4 can be arranged on the side of the amplifier circuit layer 2 close to the feed unit layer 1, or on the side of the amplifier circuit layer 2 close to the phase shifter layer 3, which is not limited here.
[0065] Specifically, the amplifier circuit layer 2 is configured to amplify the microwave signal fed by the feed unit layer 1 and transmit it to the phase shifter layer 3. The phase shifter layer 3 is configured to phase shift the microwave signal according to a preset phase shift amount. The temperature control unit layer 4 is configured to adjust the temperature of the amplifier circuit layer 2, thereby adjusting the operating temperature of the antenna. If the antenna provided in the embodiment of the present disclosure is used as a receiving antenna, after the feed unit layer 1 receives the microwave signal, it is transmitted to the amplifier circuit layer 2 for amplification, and the amplified microwave signal is then input into the phase shifter for phase shifting and then transmitted to the subsequent circuit.
[0066] join Figure 1 , Figure 1 The curves showing the changes in transmission efficiency of the same antenna at different temperatures are shown. In the figure, curve S1 is when the antenna's operating temperature is 25°, curve S1 is when the antenna's operating temperature is 50°, and curve S1 is when the antenna's operating temperature is 75°. It can be seen from the figure that if the antenna's operating temperature increases, it will become unstable due to temperature drift, resulting in performance deterioration. The antenna provided in the embodiment of the present disclosure has a temperature control unit layer 4 provided on one side of the amplifying circuit layer 2. The temperature control unit layer 4 can adjust the temperature of the amplifying circuit layer 2, so that the antenna's operating temperature can be stabilized within a certain range, thereby suppressing the antenna's temperature drift and avoiding deterioration in the antenna's performance.
[0067] In some examples, participating Figure 4 , Figure 5 Usually, during the operation of the antenna, since the amplifier circuit layer 2 has multiple amplifier circuits and the amplifier circuit has multiple devices, the heat generated by the operation of the antenna itself mainly comes from the amplifier circuit layer 2. In the antenna provided in the embodiment of the present disclosure, the temperature control unit layer 4 can be in direct contact with the amplifier circuit layer 2, so as to better adjust the operating temperature of the amplifier circuit layer 2.
[0068] In some examples, participating Figure 4 , Figure 5The temperature control unit layer 4 can adopt a variety of temperature adjustment methods. For example, a plurality of flow channels can be provided in the temperature control unit layer 4. The flow channels are used to accommodate the flow of working fluids. When the working temperature of the antenna is too high or too low, a working fluid of a certain temperature can be driven to flow into the flow channels in the temperature control unit layer 4. Since the temperature control unit layer 4 is arranged close to the amplifier circuit layer 2, the temperature of the amplifier circuit layer 2 can be adjusted by the working fluid. Specifically, the temperature control unit layer 4 can be a whole layer structure made of a heat-conducting material, for example, metal can be used. If a material with greater strength is used to make the substrate of the temperature control unit layer 4, it can also provide support for the antenna. The shape of the temperature control unit layer 4 is close to the surface of the amplifier circuit layer 2 that is in direct contact with the temperature control unit layer 4. Since the position of the contact surface absorbs the most heat, it is called the cold head 41 of the temperature control unit layer 4, and then a plurality of flow channels are opened in the whole layer structure.
[0069] It should be noted that the working fluid is a medium material that realizes the mutual conversion of thermal energy and mechanical energy, and consumes a certain amount of mechanical energy to drive the working flow to realize the heat exchange and achieve the temperature control effect. Specifically, the working fluid can be water, ammonia, saturated hydrocarbons, etc.
[0070] In some examples, the feed unit layer 1 may specifically include a first substrate, a plurality of microwave receiving units arranged on the first substrate, and a transmission line power division structure arranged on the first substrate, wherein the transmission line power division structure has a plurality of first ports and a plurality of second ports, wherein a first port of the transmission line power division structure is connected to a microwave receiving unit, and the first ports of the plurality of transmission line power division structures correspond to the second port of a transmission line power division structure, that is, the first port is used as the input end of the transmission line power division structure, and the second port is used as the output end of the transmission line power division structure, and the transmission line power division structure and the microwave receiving unit are arranged in the same layer and made of the same material. The amplifier circuit layer 2 includes a plurality of amplifier circuits, and an amplifier circuit is connected to a second port of a transmission line power division structure. If the antenna is used as a receiving antenna, after any microwave receiving unit, the microwave signal is transmitted to the amplifier circuit connected to the second port through the second port connected to the microwave receiving unit for amplification, and then transmitted to the phase shifter in the phase shifter layer 3 through the amplifier circuit. The temperature control unit layer 4 can be arranged between the amplifier circuit layer 2 and the first substrate to adjust the temperature of the amplifier circuit layer 2.
[0071] For some examples, see Figure 6-Figure 8 The antenna provided in the embodiment of the present disclosure may adopt a double-layer feeding structure in which the feeding unit layer 1 includes a first feeding unit 01 and a second feeding unit 02. Specifically, the first substrate may include a first sub-substrate 011 and a second sub-substrate 021, and the second sub-substrate 021 is arranged on the side of the first sub-substrate 011 close to the amplifying circuit layer 2; the microwave receiving unit includes a first sub-microwave receiving unit 012 and a second sub-microwave receiving unit 022, see Figure 7The first microwave receiving sub-units 012 are arranged in an array on the side of the first sub-base 011 away from the second sub-base 021, and participate in Figure 6 , the second sub-microwave receiving units 022 are arranged in an array on the side of the second sub-baseboard 012 close to the first sub-baseboard 011; the transmission line power division structure 013 is set on the side of the second sub-baseboard 021 close to the first sub-baseboard 011, and has a plurality of first ports (for example, p11-p14) and a plurality of second ports (for example, p2), and one first port is connected to one second sub-microwave receiving unit 022. Among them, the first sub-microwave receiving unit 012 and the second sub-microwave receiving unit 022 use a spatial coupling method to transmit microwave signals. Specifically, the first sub-microwave receiving unit 012 and the second sub-microwave receiving unit 022 are set one by one. Figure 8 , that is, the orthographic projection of the first microwave receiving unit 012 on the second sub-substrate 011 and the orthographic projection of the second microwave receiving unit 022 corresponding to the first microwave receiving unit 012 on the second sub-substrate 021 at least partially overlap. In some embodiments, the orthographic projection of the first microwave receiving unit 012 on the second sub-substrate 011 and the orthographic projection of the second microwave receiving unit 022 corresponding to the first microwave receiving unit 012 on the second sub-substrate 021 may completely overlap.
[0072] It should be noted that the feed unit layer 1 of the antenna of the embodiment of the present disclosure may include multiple groups of microwave receiving units, and the figure takes one group, including four microwave receiving units, as an example for illustration. In this embodiment, the microwave receiving unit may be various types of radiation structures, such as a horn antenna, a patch electrode, etc., and the following description takes the microwave receiving unit as a patch electrode as an example.
[0073] In some examples, a second reference electrode 023 is further provided on the side of the second sub-substrate 021 away from the second sub-microwave receiving unit 022 , and the orthographic projection of the second reference electrode 023 on the second sub-substrate 021 at least covers the orthographic projections of multiple second sub-microwave receiving units 022 on the second sub-substrate 021 .
[0074] In some examples, both the first sub-substrate 011 and the second sub-substrate 021 may be printed circuit boards.
[0075] In some examples, participating Figure 4The antenna provided in the embodiment of the present disclosure further includes a plurality of microwave connectors 003, the first end of each microwave connector 003 being connected to the second port of the transmission line power division structure of a feed unit layer 1, and the second end of each microwave connector 003 being connected to an amplifier circuit of an amplifier circuit layer 2. The temperature control unit layer 4 is provided with a plurality of openings along the thickness direction of the temperature control unit layer 4 itself, and a microwave connector 003 passes through an opening to connect the amplifier circuit and the second port. Specifically, the first end of the microwave connector 003 has a first connection port, and the second end of the microwave connector 003 has a second connection port.
[0076] Specifically, the first end of the microwave connector 003 has a first connector, and the second end has a second connector. The first substrate (or the second sub-substrate 021) has a plurality of first through holes Via1, each of which is arranged at the second port, and a plurality of third connectors are arranged at the first through hole Via1 on the side close to the amplifying circuit layer 2, and the third connector is adapted to the first connector. The first connector at the first end of the microwave connector 003 is fixed to the third connector by plugging, and the first connector of the microwave connector 003 has a reference point potential pole and a core pole, and its reference potential pole is connected to the second reference electrode 023 on the second sub-substrate 021, and its core pole passes through the first through hole Via1 and is connected to the second port of the transmission line power division structure on the other side of the second sub-substrate 021; a plurality of fourth connectors are also arranged on the side of the amplifying circuit layer 2 close to the feeding unit layer 1, and the fourth connector is adapted to the second connector, and the second end of the microwave connector 003 is fixed to the fourth connector by plugging the second connector.
[0077] It can be understood that the microwave connector 003 passes through the opening of the temperature control unit layer 4 to connect the feed unit layer 1 and the amplifier circuit layer 2, and the temperature control unit layer 4 has multiple flow channels. Therefore, the orthographic projections of the multiple flow channels on the amplifier circuit layer 2 do not overlap with the orthographic projections of the multiple openings of the temperature control unit layer 4 on the amplifier circuit layer, that is, the setting of the flow channels must not affect the microwave connector 003.
[0078] In some examples, the amplifier circuit layer includes a base substrate, and a plurality of amplifier circuits arranged on the base substrate, each amplifier circuit includes a filter, a noise amplifier and an attenuator arranged on the side of the base substrate close to the feed unit layer 1, a fourth connector, etc.; the base substrate has a plurality of second through holes, and a plurality of second transmission lines are arranged on the side of the base substrate away from the feed unit layer 1, and each second transmission line is connected to the output end of an amplifier circuit on the opposite side of the base substrate through a second through hole. The phase shifter layer 3 includes a plurality of phase shifters 31, and one phase shifter 31 is connected to a corresponding amplifier circuit. Specifically, the phase shifter 31 is connected to the amplifier circuit through a second transmission line. If the phase shifter 31 receives microwave signals by waveguide coupling, the second transmission line on the side of the base substrate of the amplifier circuit layer close to the phase shifter layer 3 can be connected to the female head of the coaxial-to-waveguide structure, and then matched and connected with the male head of the coaxial-to-waveguide structure. A probe is arranged at one end of the male head, and the probe can be inserted into the waveguide structure of the phase shifter to feed the amplified microwave signal into the phase shifter.
[0079] join Figure 5 If the temperature control unit layer 4 is arranged on the side of the amplifier circuit layer 2 close to the phase shifter layer 3, the temperature control unit layer 4 has a plurality of accommodating cavities, each accommodating cavity wraps a phase shifter 31 of the phase shifter layer 3, that is, the entire layer structure of the temperature control unit layer 4 is arranged to fit the shape of the surface of the phase shifter 31 and the amplifier circuit layer 2, so that the temperature control unit layer 4 is close to the amplifier circuit layer 2 and the phase shifter 31. If the operating temperature of the amplifier circuit layer 2 or the phase shifter 31 is too high or too low, the working medium in the plurality of flow channels arranged in the temperature control unit layer 4 can be driven to adjust the temperature of the amplifier circuit layer 2 and the phase shifter 31. In order to avoid the flow channels affecting the phase shifter, it can be understood that the positive projections of the plurality of flow channels on the amplifier circuit layer 2 do not overlap with the positive projections of the plurality of accommodating cavities on the amplifier circuit layer 2.
[0080] In some examples, the phase shifter includes a second substrate and a third substrate arranged opposite to each other, and a first dielectric layer arranged between the second substrate and the third substrate. Among them, each phase shifter receives a signal after a group of microwave receiving units in the feeding unit layer are combined through the transmission line power splitter structure. The phase shifter layer 3 includes a plurality of phase shifters 31, and the plurality of phase shifters 31 can be packaged independently, so that it is convenient to replace and select a single phase shifter 31. Of course, the plurality of phase shifters 31 can also be arranged in an array on a substrate, that is, the first dielectric layer of the plurality of phase shifters 31 is an integrated structure, which is not limited here.
[0081] Specifically, the structure of the phase shifter 31 in the phase shifter layer 3 may include multiple types. Here, the structure of a phase shifter 31 is taken as an example for explanation. According to the different media used in the first dielectric layer, the phase shifter 31 can be divided into multiple types. The following is an example in which the first dielectric layer is liquid crystal and the phase shifter is a liquid crystal phase shifter.
[0082] See also Fig. 9 , Fig.10 , Fig. 9 It is a structural schematic diagram of a phase shifter of an antenna according to an embodiment of the present disclosure; Fig.10 for Fig. 9 The cross-sectional view of the phase shifter taken along line A-A' is shown in FIG. Fig. 9 and Fig.10 As shown, the liquid crystal phase shifter includes a second substrate and a third substrate arranged opposite to each other, and a liquid crystal layer 30 arranged between the second substrate and the third substrate. The second substrate includes a first substrate 10, a first transmission line 11 and a bias line 12 arranged on the side of the first substrate 10 close to the liquid crystal layer 30, and a first alignment layer 13 arranged on the side of the first transmission line 11 and the bias line 12 away from the first substrate 10. The second substrate includes a second substrate 20, a first reference electrode 21 arranged on the side of the second substrate 20 close to the liquid crystal layer 30, and a second alignment layer 22 arranged on the side of the first reference electrode 21 close to the liquid crystal layer 30. Of course, as Figure 1 As shown, the phase shifter not only includes the above structure, but also includes a support structure 40 for maintaining the cell thickness of the liquid crystal cell (between the second substrate and the third substrate), and a frame sealant 50 for sealing the liquid crystal cell, etc., which are not described one by one here.
[0083] like Fig. 9 As shown, the first transmission line 11 has a first transmission end 11a, a second transmission end 11b and a transmission main body; wherein the first transmission end 11a, the second transmission end 11b and the transmission main body 11c all have a first endpoint and a second endpoint; the first endpoint of the first transmission end 11a is electrically connected to the first endpoint of the transmission main body 11c, and the first endpoint of the second transmission end 11b is electrically connected to the second endpoint of the transmission main body 11c. It should be noted here that the first endpoint and the second endpoint are relative concepts. If the first endpoint is the head end, the second endpoint is the end end, otherwise it is the opposite. In addition, in the embodiment of the present disclosure, the first endpoint of the first transmission end 11a is electrically connected to the first endpoint of the transmission main body 11c, and at this time, the first endpoint of the first transmission end 11a and the first endpoint of the transmission main body 11c can be a common endpoint. Correspondingly, the first endpoint of the second transmission end 11b is electrically connected to the second endpoint of the transmission main body 11c, and the first endpoint of the second transmission end 11b and the second endpoint of the transmission main body 11c are a common endpoint.
[0084] The transmission main body 11c includes but is not limited to a meander line, and the number of the meander lines can be one or more. The shape of the meander line includes but is not limited to a bow shape, a wave shape, and the like.
[0085] In some examples, when the transmission main body 11c includes a plurality of meandering lines, the shapes of the meandering lines are at least partially different. That is, the shapes of the meandering lines may be partially the same, or the shapes of all the meandering lines may be different.
[0086] In some examples, when the transmission main body 11c of the first transmission line 11 includes at least one meandering line, the orthographic projection of the first opening 211 of the first reference electrode 21 on the first substrate 10 does not overlap with the projection of at least one meandering line on the first substrate 10, for example: the orthographic projection of the first opening 211 of the reference electrode 21 on the first substrate 10 does not overlap with the projection of each meandering line on the first substrate 10. This avoids the loss of microwave signals.
[0087] In some examples, when the first transmission end 11a is used as a receiving end of a microwave signal, the second transmission end 11b is used as a transmitting end of a microwave signal; correspondingly, when the second transmission end 11b is used as a receiving end of a microwave signal, the first transmission end 11a is used as a transmitting end of a microwave signal. The bias line 12 is electrically connected to the first transmission line 11 and is configured to load a DC bias signal to the first transmission line 11 so that a DC steady-state electric field is formed between the first transmission line 11 and the first reference electrode 21. Microscopically, the liquid crystal molecules of the liquid crystal layer 30 are deflected due to the electric field force. Macroscopically, the dielectric constant of the liquid crystal layer 30 is changed. When a microwave signal is transmitted between the first transmission line 11 and the first reference electrode 21, the dielectric constant of the liquid crystal layer 30 changes, causing the phase of the microwave signal to change accordingly. Specifically, the magnitude of the phase change of the microwave signal is positively correlated with the deflection angle and electric field strength of the liquid crystal molecules, that is, applying a DC bias voltage can change the phase of the microwave signal. This is the working principle of the liquid crystal phase shifter.
[0088] See also Fig.11 , Fig.12 The phase shifter of the antenna of the embodiment of the present disclosure may further include a first waveguide structure 60; wherein the first waveguide structure 60 is located on the side of the third substrate away from the liquid crystal layer 30, and the second substrate and the third substrate in the embodiment of the present disclosure may be Figure 1 The second substrate and the third substrate of the liquid crystal phase shifter in the embodiment have the same structure, that is, the second substrate includes a first substrate 10, a first transmission line 11, a bias line 12 and a first alignment layer 13 arranged on the first substrate 10, and the second substrate includes a second substrate 20, a first reference electrode 21 and a second alignment layer arranged on the second substrate 20. The first waveguide structure 60 is configured to transmit microwave signals by coupling with the first transmission end 11a (i.e., the first end) of the first transmission line 11.
[0089] Correspondingly, as mentioned above, if the phase shifter adopts the first waveguide structure 60 to receive microwave signals, the second transmission line on the side of the base substrate of the amplifying circuit layer 2 close to the phase shifter layer 3 can be connected to the female head of the coaxial-to-waveguide structure, and then matched and connected with the male head of the coaxial-to-waveguide structure. A probe is provided at one end of the male head, and the probe can be inserted into the first waveguide structure 60 of the phase shifter to feed the amplified microwave signal into the phase shifter.
[0090] It should be noted that, in the embodiment of the present disclosure, the phase shifter further includes a first wiring board and a second wiring board; wherein the first wiring board is bound and connected to the first substrate, and is configured to provide a DC bias voltage to the bias line 12. The second wiring board is bound and connected to the second substrate, and is configured to provide a ground signal to the first reference electrode 21. Both the first wiring board and the second wiring board may include various types of wiring boards, such as a flexible printed circuit (FPC) or a printed circuit board (PCB), etc., which are not limited here. The first wiring board may have at least one first pad, one end of the bias line 12 is connected to the first pad (i.e., bonded to the first pad), and the other end of the bias line 12 is the first transmission line 11; the second wiring board may also have at least one second pad, and the second wiring board is electrically connected to the first reference electrode 21 through the second connecting pad.
[0091] In some examples, the phase shifter includes not only the above-mentioned structure, but also includes structures such as a support structure 40 and a frame sealant 50; wherein the frame sealant 50 is arranged between the second substrate and the third substrate, is located in the peripheral area, and surrounds the microwave transmission area, and is used to seal the liquid crystal box of the phase shifter; the support structure 40 is arranged between the second substrate and the third substrate, and its number can be multiple, and each support structure 40 is arranged at intervals in the microwave transmission area to maintain the box thickness of the liquid crystal box.
[0092] In some examples, the bias line 12 is made of high-resistance material. When a DC bias is applied to the bias line 12, the electric field formed by the bias line 12 and the first reference electrode 21 is only used to drive the liquid crystal molecules of the liquid crystal layer 30 to deflect, and for the microwave signal transmitted by the phase shifter, it is equivalent to an open circuit, that is, the microwave signal is only transmitted along the first transmission line 11. In some examples, the material of the bias line 12 includes but is not limited to any one of indium tin oxide (ITO), nickel (Ni), tantalum nitride (TaN), chromium (Cr), indium oxide (In2O3), and tin oxide (Sn2O3). Preferably, the bias line 12 is made of ITO material.
[0093] In some examples, the first transmission line 11 is made of metal material. Specifically, the material of the first transmission line 11 is, but not limited to, made of metal such as aluminum, silver, gold, chromium, molybdenum, nickel or iron.
[0094] In some examples, the first transmission line 11 is a delay line, and the corner of the delay line is not equal to 90°, so as to avoid the microwave signal being reflected at the corner of the delay line and causing the loss of the microwave signal.
[0095] In some examples, the first substrate 10 can be made of a variety of materials. For example, if the first substrate 10 is a flexible substrate, the material of the first substrate 10 can include at least one of polyethylene glycol terephthalate (PET) and polyimide (PI). If the first substrate 1011 is a rigid substrate, the material of the first substrate 10 can also be glass. The thickness of the first substrate 10 can be about 0.1 mm-1.5 mm. The second substrate 20 can also be made of a variety of materials. For example, if the second substrate 20 is a flexible substrate, the material of the second substrate 20 can include at least one of polyethylene glycol terephthalate (PET) and polyimide (PI). If the second substrate 20 is a rigid substrate, the material of the second substrate 20 can also be glass. The thickness of the second substrate 20 can be about 0.1 mm-1.5 mm. Of course, the materials of the first substrate 10 and the second substrate 20 can also be other materials, which are not limited here. The specific thicknesses of the first substrate 10 and the second substrate 20 may also be set according to the skin depth of the electromagnetic wave (radio frequency signal).
[0096] In some examples, the antenna provided by the embodiments of the present disclosure may also be provided with a temperature adjustment structure in the phase shifter, because the medium (such as liquid crystal) in the phase shifter is easily affected by temperature, so as to directly adjust the operating temperature of the phase shifter so that the phase shifter operates at a stable temperature, thereby maintaining stable performance. The temperature adjustment structure may include various types, see Fig.13 , Fig.14The phase shifter may further include a first temperature adjustment structure 001 and a second temperature adjustment structure 002. The first temperature adjustment structure 001 may be arranged on the first substrate 10, and the second temperature adjustment structure 002 may also be arranged on the second substrate 20. Specifically, the second substrate may include the first substrate 10, the first temperature adjustment structure 001 arranged on the side of the first substrate 10 close to the liquid crystal layer 30, the first temperature adjustment structure 001 is used to adjust the working temperature of the phase shifter 31, and the first transmission line 11 arranged on the side of the first temperature adjustment structure 001 close to the liquid crystal layer 30; the third substrate may include the second substrate 30, the second temperature adjustment structure 002 arranged on the side of the second substrate 20 close to the liquid crystal layer 30, the second temperature adjustment structure 002 is used to adjust the working temperature of the phase shifter, and the third substrate of the phase shifter also includes a first reference electrode 21 arranged on the side of the second temperature adjustment structure 002 close to the liquid crystal layer 30, the first reference electrode 21 at least partially overlaps with the orthographic projection of the first transmission line 11 on the first substrate 10, and the first opening 211 at least partially overlaps with the orthographic projection of the first end of the first transmission line 11 (i.e., the first transmission end 11a) on the first substrate 10.
[0097] Furthermore, in order to prevent the heat generated by the first temperature adjustment structure 001 and the second temperature adjustment structure 002 from affecting the signal on the first transmission line 11, the orthographic projection of the first temperature adjustment structure 001 on the first substrate 10 and the orthographic projection of the second temperature adjustment structure 002 on the first substrate 10 do not overlap with the orthographic projection of the first transmission line 11 on the first substrate 10, that is, the first temperature adjustment structure 001 and the second temperature adjustment structure 002 need to have a certain distance from the first transmission line 11.
[0098] Furthermore, if the phase shifter includes the first waveguide structure 60, the orthographic projection of the first waveguide structure 60 on the first substrate 10 does not overlap with the orthographic projections of the first temperature adjustment structure 001 and the second temperature adjustment structure 002 on the first substrate 10, thereby preventing the heat generated by the first temperature adjustment structure 001 and the second temperature adjustment structure 002 from affecting the transmission performance of the phase shifter.
[0099] In some examples, the minimum distance between the first temperature adjustment structure 001 and at least one of the first transmission line 11 and the first waveguide structure 60 is greater than or equal to 0.5 mm, and / or the minimum distance between the second temperature adjustment structure 002 and at least one of the first transmission line 11 and the first waveguide structure 60 is greater than or equal to 0.5 mm.
[0100] In some examples, the first temperature adjustment structure 001 and the second temperature adjustment structure 002 may have a variety of structures and arrangements. For example, the first temperature adjustment structure 001 and / or the second temperature adjustment structure 002 are resistance wires, which may be arranged around the first opening 211 and the periphery of the transmission line 11, may be arranged in a straight line, or may be arranged in a spiral shape, etc., which are not limited here. The material of the resistance wire may be a high-resistance material, such as indium tin oxide, etc., which are not limited here.
[0101] In some examples, the antenna provided by the embodiments of the present disclosure may further include a plurality of temperature measuring units (not shown in the figures), and the plurality of temperature measuring units are disposed in at least some of the phase shifters 31 of the plurality of phase shifters 31 of the phase shifter layer 3, and may be disposed on one side of the second substrate or one side of the third substrate of each phase shifter 31 of the partial phase shifter 31, that is, may be disposed on one side of the second substrate and the third substrate close to or away from the first dielectric layer, and the temperature measuring unit is used to detect the operating temperature of the phase shifter, and the temperature measuring unit may be, for example, a thermistor, a thermocouple, etc.
[0102] In some examples, the antenna provided by the embodiments of the present disclosure may further include a control unit, which is connected to the temperature measuring unit and the first temperature adjustment structure 001 and the second temperature adjustment structure 002. The control unit may control the first temperature adjustment structure 001 and the second temperature adjustment structure 002 to adjust the temperature of the phase shifter 31 according to the working temperature of the phase shifter 31 fed back by the temperature measuring unit.
[0103] For some examples, see Figure 4 , Figure 5 , Fig.13 , Fig.15 The waveguide power division structure 5 including the three-level sub-waveguide structure 51 is taken as an example for explanation, but it does not constitute a limitation to the present invention. The antenna provided in the embodiment of the present disclosure may also include a waveguide power division structure 5, and the waveguide power division structure 5 is arranged on the side of the phase shifter layer 3 away from the amplifying circuit layer 2, and is connected to the phase shifter of the phase shifter layer 3.
[0104] Specifically, the waveguide power division structure 5 may have n-level sub-waveguide structures 51, and the sub-waveguide structures of each level are referred to as the first-level sub-waveguide structure to the n-th-level sub-waveguide structure in the direction pointed to by the phase shifter layer toward the waveguide power division structure 5, and the number of sub-waveguide structures from the first level to the n-th level gradually decreases; wherein n is an integer and n≥2;
[0105] When n=2, the first end of each first-level sub-waveguide structure is connected to a phase shifter, and the second ends of at least two first-level sub-waveguide structures are connected to the first end of a second-level sub-waveguide structure; the second end of each second-level sub-waveguide structure serves as the combining end of the waveguide power division structure 5.
[0106] When n>2, the first end of each first-level sub-waveguide structure is connected to a phase shifter, and the second ends of at least two first-level sub-waveguide structures are connected to the first end of a second-level sub-waveguide structure; the first end of each m-th level sub-waveguide structure is connected to the second ends of at least two m-1-th level sub-waveguide structures, and the second ends of at least two m-th level sub-waveguide structures are connected to the first end of an m+1-th level sub-waveguide structure, wherein m is an integer and 1<m<n; the first end of each n-th level sub-waveguide structure is connected to the second ends of at least two n-1-th level sub-waveguide structures, and the second end of each n-th level sub-waveguide structure serves as the combining end of the waveguide power division structure 5.
[0107] That is to say, the waveguide power division structure 5 is a sub-waveguide structure with multi-level power division, and the multi-channel microwave signals are combined step by step from the 1st to the nth sub-waveguide structures until the last sub-waveguide structure, and the combined signals are the output of the final waveguide power division structure. In some examples, the second terminal signal connector of the last sub-waveguide structure, such as an SMA connector, can also be connected to an external port test connector on the sub-waveguide structure to facilitate testing.
[0108] In some examples, n=4, that is, the waveguide power division structure 5 can have a 4-level sub-waveguide structure 51, and every 4 waveguide structures are combined into one signal, that is, a 4-in-1 power divider is used as the waveguide power division structure, and the transmission line power division structure in the feed unit layer 1 can adopt a 16-in-1 power divider. Based on the above, in some examples, the feed unit layer 1 has 1024 microwave receiving units, which are combined into 64 microwave signals after passing through the 16-in-1 transmission line power division structure, and then enter the 64 amplifier circuits of the amplifier circuit layer 2 after passing through 64 microwave connectors 70 respectively, and then enter the waveguide power division structure 51 with four and one sub-waveguide structures at each level, and finally pass through the 4-level sub-waveguide structure, and go through the 64-16-4-1 signal combining process, and finally combine into one microwave signal to input into the subsequent circuit.
[0109] Further, the connection method of the first-level sub-waveguide structure and the phase shifter can be specifically that each sub-waveguide structure of the first-level sub-waveguide structure is coupled with the second transmission end 11b of the first transmission line 11 of the phase shifter as the output end, that is, each first-level sub-waveguide structure is located on the side of the second substrate of a phase shifter away from the liquid crystal layer 30, and each first-level sub-waveguide structure is configured to transmit microwave signals by coupling with the second transmission end 11b (that is, the second end) of the first transmission line 11 through the first opening 211 on the first reference electrode 21, that is, the orthographic projection of each first-level sub-waveguide structure on the second substrate and the orthographic projection of the first opening 211 of the first reference electrode 21 of the phase shifter corresponding to the sub-waveguide structure on the second substrate at least partially overlap.
[0110] In a second aspect, the present application also provides a temperature control system for an antenna, which includes the above-mentioned antenna.
[0111] In some examples, the temperature control system of the antenna may further include a circulation device, which connects various flow channels of the temperature control unit layer to drive the circulating flow of the working fluid.
[0112] In some examples, the circulation device may include a working fluid driving unit and a working fluid temperature control unit. The working fluid driving unit is used to drive the flow of the working fluid, and may be, for example, a water-cooled pump, a motor, etc. The working fluid temperature control unit is used to control the temperature of the working fluid, and has heating, cooling, and temperature control functions, and can control the temperature of the working fluid to be constant, for example, between 25°C±0.5°C.
[0113] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.
Claims
1. An antenna, wherein: include: A feeding unit layer, a phase shifter layer, an amplifier circuit layer arranged therebetween, and a temperature control unit layer arranged on one side of the amplifier circuit layer; The amplifying circuit layer is configured to amplify the microwave signal fed by the feeding unit layer and transmit it to the phase shifter layer; The phase shifter layer is configured to phase shift the microwave signal according to a preset phase shift amount; The temperature control unit layer is configured to adjust the temperature of the amplifying circuit layer to adjust the working temperature of the antenna; The temperature control unit layer is in direct contact with the amplifying circuit layer; The feeding unit layer includes a first substrate, a plurality of microwave receiving units arranged on the first substrate, and a transmission line power division structure arranged on the first substrate; The transmission line power division structure has a plurality of first ports and a plurality of second ports, wherein one of the first ports is connected to a corresponding microwave receiving unit, and a plurality of the first ports correspond to one of the second ports; The amplifying circuit layer includes a plurality of amplifying circuits, and one of the amplifying circuits is correspondingly connected to one of the second ports; Wherein, a plurality of flow channels are arranged in the temperature control unit layer for accommodating the flow of working fluid.
2. The antenna according to claim 1, wherein: Also includes: A plurality of microwave connectors, wherein a first end of each of the microwave connectors is connected to one of the second ports, and a second end of each of the microwave connectors is connected to one of the amplifier circuits; The temperature control unit layer is provided with a plurality of openings along the thickness direction thereof, so that the microwave connector can pass through the temperature control unit layer through the openings; The orthographic projections of the plurality of flow channels on the amplifying circuit layer do not overlap with the orthographic projections of the plurality of openings on the amplifying circuit layer.
3. The antenna according to claim 1, wherein: The amplifier circuit layer includes a plurality of amplifier circuits; the phase shifter layer includes a plurality of phase shifters, and one phase shifter is correspondingly connected to one amplifier circuit; The temperature control unit layer is arranged on a side of the amplifying circuit layer close to the phase shifter layer, and has a plurality of accommodating cavities, each of which wraps the phase shifter therein; The temperature control unit layer is provided with a plurality of flow channels for accommodating the flow of working fluid; The orthographic projections of the plurality of flow channels on the amplifying circuit layer do not overlap with the orthographic projections of the plurality of accommodating cavities on the amplifying circuit layer.
4. The antenna according to claim 3, wherein: The phase shifter comprises a second substrate and a third substrate which are arranged opposite to each other, and a first dielectric layer which is arranged between the second substrate and the third substrate; the first dielectric layers of a plurality of the phase shifters are an integrated structure.
5. The antenna according to any one of claims 1 to 4, wherein: The phase shifter layer includes a plurality of phase shifters; the phase shifter includes a second substrate and a third substrate arranged opposite to each other, and a first dielectric layer arranged between the second substrate and the third substrate; The second substrate comprises: a first base; a first temperature adjustment structure disposed on a side of the first base close to the first dielectric layer, for adjusting the operating temperature of the phase shifter; a first transmission line disposed on a side of the first temperature adjustment structure close to the first dielectric layer; The third substrate comprises: a second substrate; a second temperature adjustment structure disposed on a side of the second substrate close to the first dielectric layer, which is used to adjust the operating temperature of the phase shifter; a first reference electrode disposed on a side of the second temperature adjustment structure close to the first dielectric layer, the first reference electrode having a first opening; the first reference electrode at least partially overlaps with the orthographic projection of the first transmission line on the first substrate, and the first opening at least partially overlaps with the orthographic projection of the first end of the first transmission line on the first substrate; wherein, The orthographic projection of the first temperature adjustment structure on the first substrate and the orthographic projection of the second temperature adjustment structure on the first substrate do not overlap with the orthographic projection of the first transmission line on the first substrate.
6. The antenna according to claim 5, wherein: The antenna further includes: a plurality of temperature measuring units, which are arranged on one side of the third substrate or one side of the second substrate of at least part of each of the plurality of phase shifters, and are used to detect the operating temperature of the phase shifters.
7. The antenna according to claim 5, wherein: The amplifying circuit layer includes a plurality of amplifying circuits, and one phase shifter is connected to one amplifying circuit accordingly; each phase shifter further includes: a first waveguide structure connected between the phase shifter and the amplifying circuit; the first waveguide structure is configured to transmit a microwave signal through the first opening by coupling with the first end of the first transmission line; wherein, The orthographic projection of the first waveguide structure on the first substrate has no overlap with the orthographic projections of the first temperature adjustment structure and the second temperature adjustment structure on the first substrate.
8. The antenna according to claim 7, wherein: The minimum distance between the first temperature adjustment structure and at least one of the first transmission line and the first waveguide structure is greater than or equal to 0.5 mm, and / or the minimum distance between the second temperature adjustment structure and at least one of the first transmission line and the first waveguide structure is greater than or equal to 0.5 mm.
9. The antenna according to claim 5, wherein: The first temperature adjustment structure and / or the second temperature adjustment structure is a resistance wire.
10. The antenna according to claim 1, wherein: The first substrate includes a first sub-substrate and a second sub-substrate, and the second sub-substrate is arranged on a side of the first sub-substrate close to the amplifying circuit layer; The microwave receiving unit comprises a first sub-microwave receiving unit and a second sub-microwave receiving unit, wherein the first sub-microwave receiving unit array is arranged on a side of the first sub-baseboard away from the second sub-baseboard, and the second sub-microwave receiving unit array is arranged on a side of the second sub-baseboard close to the first sub-baseboard; The transmission line power division structure is arranged on the side of the second sub-base close to the first sub-base, and one of the first ports is connected to one of the second sub-microwave receiving units correspondingly; wherein, The first sub-microwave receiving unit and the second sub-microwave receiving unit are arranged in one-to-one correspondence, and the orthographic projection of the first sub-microwave receiving unit on the second sub-baseboard and the orthographic projection of the corresponding second sub-microwave receiving unit on the second sub-baseboard at least partially overlap.
11. The antenna according to claim 10, wherein: The second sub-substrate has a plurality of first through holes penetrating along the thickness direction, and each of the second ports corresponds to one of the first through holes; The antenna further includes: a plurality of microwave connectors; a first end of each of the microwave connectors passes through one of the first through holes to connect to one of the second ports, and a second end of each of the microwave connectors is connected to one of the amplifying circuits.
12. The antenna according to claim 1, wherein: Also includes: A waveguide power division structure is arranged on a side of the phase shifter layer away from the amplifying circuit layer; The waveguide power division structure has n-level sub-waveguide structures, and the number of sub-waveguide structures from the first level to the nth level gradually decreases in the direction from the phase shifter layer to the waveguide power division structure; wherein n≥2; The first end of each first-level sub-waveguide structure is connected to one of the phase shifters, and the second ends of at least two first-level sub-waveguide structures are connected to the first end of one second-level sub-waveguide structure; The first end of each m-th level sub-waveguide structure is connected to the second ends of at least two m-1-th level sub-waveguide structures, and the second ends of at least two m-th level sub-waveguide structures are connected to the first end of an m+1-th level sub-waveguide structure, wherein 1<m<n; The first end of each n-th level sub-waveguide structure is connected to the second ends of at least two n-1-th level sub-waveguide structures, and the second end of each n-th level sub-waveguide structure serves as a combining end of the waveguide power division structure.
13. A temperature control system for an antenna, wherein: Comprising the antenna described in any one of claims 1-12.
14. The temperature control system according to claim 13, wherein: Also included: a circulation device connected to the flow channel; The circulation device comprises a working fluid driving unit and a working fluid temperature control unit. The working fluid driving unit is used to drive the working fluid to flow, and the working fluid temperature control unit is used to control the temperature of the working fluid.
Citation Information
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