A processing and forming method for a liquid cooling plate

Abstract

The present invention discloses a processing and forming method for a liquid cooling plate, which adopts an aluminum alloy profile with a high thermal conductivity, and sequentially undergoes pickling and degreasing, coating with anti-composite graphene materials, heat treatment, rolling and compounding, and inflation to prepare a preliminary finished product of the liquid cooling plate, and the hot stamping step can be omitted to achieve non-equivalent interface thermal bonding of double-layer aluminum alloys, so that the bonding between the aluminum alloy plates is good in sealing and strength, and leakage of the coolant in the flow channel loop can be avoided. The prepared liquid cooling plate has higher bending strength, better toughness, and better heat dissipation, and the preparation process is simplified, the processing efficiency is higher, and the production cost is lower; a chamber for the circulation of the coolant is provided inside the liquid cooling plate, the top surface is a heat exchange plate, and the bottom surface is an anti-condensation plate, and an anti-condensation water layer is provided on the side of the anti-condensation plate away from the heat exchange plate. The wall temperature of the entire liquid cooling plate is in a cross-uniform state, which can effectively prevent the generation of condensation and has high safety.

Description

Technical Field

[0001] The invention relates to the technical field of liquid cooling plates, and in particular to a processing and forming method of a liquid cooling plate. Background Art

[0002] Electronic components are components of electronic components and small machines and instruments. They are often composed of several parts and can be used in similar products. They often refer to certain parts of industries such as electrical appliances, radios, and instruments. They are the general term for electronic devices such as capacitors, transistors, hairsprings, and springs. Common ones include diodes, etc. Electronic components include: resistors, capacitors, inductors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystals, quartz, ceramic magnetic materials, substrates for printed circuits, special materials for electronic functional processes, electronic adhesive (tape) products, electronic chemical materials and parts, etc.

[0003] In the processing and forming method of the liquid cooling plate, the traditional stamping and brazing preparation process has the problems of complicated procedures, high cost, environmental pollution, easy leakage, poor heat dissipation effect, etc. The more advanced preparation method of hot rolling, hot stamping, and inflation molding mainly coats the anti-welding material on the pre-designed flow channel loop line, and then hot rolling, hot stamping, and inflation molding, but there are still problems that the preparation method is not streamlined enough and the product quality is not high enough. The present invention adopts aluminum alloy profiles with high thermal conductivity, and successively prepares the liquid cooling plate pre-finished product through pickling and degreasing, coating anti-composite graphene materials, heat treatment, rolling and compounding, and inflation. The hot stamping step can be omitted, which is equivalent to only through the steps of hot rolling and inflation molding to achieve double-layer aluminum alloy non-equivalent interface thermal bonding, so that the bonding between the aluminum alloy plates is good in sealing and strength, and the coolant in the flow channel loop can be prevented from leaking. The prepared liquid cooling plate has higher bending strength, better toughness, and better heat dissipation, and the preparation process is simplified, the processing efficiency is higher, and the production cost is lower. Summary of the invention

[0004] In view of the deficiencies in the prior art, an object of the present invention is to provide a method for processing and forming a liquid cooling plate, wherein the prepared liquid cooling plate has higher bending strength, better toughness, and better heat dissipation, while reducing production costs and use costs.

[0005] To achieve the above object, the present invention adopts the following technical solution:

[0006] A method for processing and forming a liquid cooling plate comprises the following steps:

[0007] (1) A liquid cooling plate is prepared by using an aluminum alloy profile with a high thermal conductivity through pickling and degreasing, coating with anti-composite graphene material, heat treatment, rolling and compounding, and inflation;

[0008] 1.1) The specific process of pickling and degreasing is: first use sandpaper to remove impurities on the surface of the aluminum alloy profile; then pickle to remove the dense oxide film on the surface of the aluminum alloy profile; finally degrease and dry;

[0009] 1.2) The specific process of applying the anti-composite graphene material is as follows: according to the weight ratio of polydimethylsiloxane to graphene being 1:2, polydimethylsiloxane and graphene are uniformly mixed to make the anti-composite graphene material; the anti-composite graphene material is applied on the preset flow channel circuit map;

[0010] 1.3) Heat treatment temperature is controlled at 400-450℃;

[0011] 1.4) The specific process of rolling bonding is: rolling bonding is carried out at a rolling speed of 0.3m / min to 0.6m / min to fully combine the two aluminum alloy profiles.

[0012] Furthermore, in step 1.3), the heat treatment temperature is controlled at 415-450°C.

[0013] Furthermore, in the step 1.2), the size of the graphene is between 0.5 and 3 μm.

[0014] Furthermore, a method for processing and forming a liquid cooling plate is provided, wherein the liquid cooling plate is a rectangular parallelepiped structure, a chamber for cooling liquid to flow is arranged inside, the top surface is a heat exchange plate, and the bottom surface is an anti-condensation plate; a partition plate is arranged at the middle position of the liquid cooling plate to divide the internal chamber of the liquid cooling plate into a cooling liquid inflow channel and a cooling liquid outflow channel; the cooling liquid inflow channel is located directly above the cooling liquid outflow channel, and the cooling liquid inflow channel is close to one side of the device to be cooled;

[0015] A coolant inlet and a coolant outlet are respectively provided on the same side of the liquid cooling plate, and the coolant flows in from the coolant inlet, flows through the coolant inlet channel and the coolant outlet channel in sequence, and finally flows out from the coolant outlet;

[0016] The anti-condensation plate is provided with an anti-condensation water layer with a thickness of 3 to 5 mm on the side away from the heat exchange plate;

[0017] The method for setting the anti-condensation layer is as follows:

[0018] 2.1) The anti-condensation plate of the liquid cooling plate prepared by surface grinding is placed away from the heat exchange plate, and a layer of epoxy resin with a thickness of 0.8 to 1.2 mm is sprayed;

[0019] 2.2) Use an ion spray gun to spray water on the surface of the epoxy resin layer to activate the epoxy resin layer, and then set a layer of SMC composite material layer on the side of the epoxy resin layer away from the heat exchange plate to obtain an anti-condensation layer composed of the epoxy resin layer and the SMC composite material layer;

[0020] 2.3) The surface of the liquid cooling plate is then polished to obtain the liquid cooling plate.

[0021] Furthermore, the volume ratio of the coolant inflow channel to the coolant outflow channel is 1.5 to 2.5:1.

[0022] Furthermore, a 4-5 mm thick anti-condensation water layer is provided on the side of the anti-condensation plate away from the heat exchange plate.

[0023] Furthermore, a layer of epoxy resin with a thickness of 4 to 6 mm is provided on one side of the partition plate close to the coolant outflow channel.

[0024] Furthermore, a plurality of spoilers are provided on one side of the heat exchange plate close to the coolant inflow channel, which play a role in spoiling the coolant in the coolant inflow channel.

[0025] Furthermore, a plurality of protrusions are provided on one side of the partition plate close to the coolant inflow channel, which have a flow disturbing effect on the coolant in the coolant inflow channel.

[0026] Furthermore, in the step 2.3), the surface of the liquid cooling plate pre-finished product is polished with sandpaper with a mesh size of 2000 or above to obtain the liquid cooling plate.

[0027] The present invention discloses a method for processing and forming a liquid cooling plate, which has the following advantages over the prior art: (1) The present invention adopts an aluminum alloy profile with a high thermal conductivity, and sequentially prepares a liquid cooling plate through pickling and degreasing, coating with anti-composite graphene material, heat treatment, rolling and compounding, and inflation. Compared with the traditional stamping and brazing preparation process, the present invention does not have the disadvantages of complicated procedures, high cost, environmental pollution, easy leakage, poor heat dissipation effect, etc. Strong practicality; (2) The present invention adopts aluminum alloy profiles with high thermal conductivity, and prepares the initial liquid cooling plate through pickling and degreasing, coating of anti-composite graphene materials, heat treatment, rolling and compounding, and inflation; compared with the traditional preparation method of hot rolling, hot stamping, and inflation molding, the present application replaces the traditional anti-welding material with anti-composite graphene materials, and coats the anti-composite graphene materials on the pre-designed flow channel loop line, which can omit the hot stamping step, which is equivalent to only needing to perform the hot rolling and inflation molding steps to achieve double-layer aluminum alloy non-equivalent interface thermal bonding, so that the bonding between the aluminum alloy plates is good in sealing and strength, and leakage of the coolant in the flow channel loop can be avoided. The prepared liquid cooling plate has higher bending strength, better toughness, and better heat dissipation, and the preparation process is simplified, the processing efficiency is higher, and the production cost is lower.

[0028] The present invention discloses a processing and forming method for a liquid cooling plate. The graphene size in the anti-composite graphene material used is 0.5-3 μm, and the graphene dispersion can be purchased on the market. In the method of the present invention, the heat treatment temperature is controlled at 400-450° C., and the pickling and degreasing process, the anti-composite graphene material coating process, the rolling composite process, and the inflation process are the same as the traditional hot rolling, hot stamping, and inflation molding preparation processes, and are not described in detail.

[0029] Due to the application of the above technical scheme, the present invention has the following advantages compared with the prior art: the present invention provides a processing and forming method for a liquid cooling plate, in which the top heat exchange plate is close to the side of the device to be cooled, and is affected by the heat dissipation of the device to be cooled. The temperature of the top heat exchange plate is slightly higher than the temperature of the bottom anti-condensation plate, so the coolant inlet channel is arranged directly above the coolant outlet channel. When the coolant flowing out of the coolant inlet channel flows to the coolant outlet channel, the temperature rises, which plays a role in raising the temperature of the bottom anti-condensation plate, so that the wall temperature of the entire liquid cooling plate is in a uniform state, which can effectively prevent the generation of condensation and has high safety. Furthermore, the present invention provides an anti-condensation water layer on the side of the anti-condensation plate away from the heat exchange plate, and the anti-condensation water layer formed by the superposition of the epoxy resin layer and the SMC composite material layer has the effect of preventing condensation and can Avoid condensation and have high safety. The anti-condensation water layer set by the method of the present invention is different from the anti-condensation water layer formed by brushing anti-condensation paint. The anti-condensation paint must be coated with a certain thickness and have a certain moisture absorption volume to be effective, which is not conducive to the overall heat dissipation of the liquid cooling plate and is contrary to the original intention of setting up a heat sink. The anti-condensation water layer formed by superimposing the epoxy resin layer and the SMC composite material layer set by the present invention is ultra-thin. First, an epoxy resin layer is set on the heat exchange plate, and then an ion spray gun is used to spray water on the surface of the epoxy resin layer to activate the epoxy resin layer. Finally, a SMC composite material layer is set on the side of the epoxy resin layer away from the heat exchange plate. It does not affect the heat dissipation, has a super strong anti-condensation effect, is highly safe, and the method for setting the anti-condensation water layer is simple, the bonding part has strong mechanical properties, and does not need to be replaced regularly, while reducing production costs and use costs.

[0030] The present invention discloses a processing and forming method for a liquid cooling plate, wherein the volume ratio of a cooling liquid inflow channel to a cooling liquid outflow channel is 1.5 to 2.5:1, which plays a role in adjusting the temperature difference between a top heat exchange plate and a bottom anti-condensation plate, so that the wall temperature of the entire liquid cooling plate is in a uniform state, which can effectively prevent the generation of condensation and has high safety; a plurality of spoilers are provided, which play a role in disturbing the cooling liquid in the cooling liquid inflow channel, which can avoid the effect of excessive pressure drop between the cooling liquid inlet and the cooling liquid outlet, and play a role in improving the stability of the liquid cooling cycle; a plurality of protrusions are provided, which play a role in disturbing the cooling liquid in the cooling liquid inflow channel, which can avoid the effect of excessive pressure drop between the cooling liquid inlet and the cooling liquid outlet, and further improve the stability of the liquid cooling cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Hereinafter, some specific embodiments of the present application will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0032] Figure 1 It is a schematic structural diagram of the liquid cooling plate of the present invention.

[0033] Figure 2 It is a schematic structural diagram of the anti-condensation layer of the present invention. DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below in conjunction with the accompanying drawings:

[0035] refer to Figure 1-Figure 2 , Figure 1 It is a structural schematic diagram of a liquid cooling plate according to an embodiment of the present invention. Figure 2 It is a schematic structural diagram of the anti-condensation layer of an embodiment of the present invention.

[0036] The present invention discloses a liquid cooling plate, wherein the liquid cooling plate 1 is a rectangular parallelepiped structure, wherein a chamber 11 for cooling liquid circulation is arranged inside, the top surface is a heat exchange plate 12, and the bottom surface is an anti-condensation plate 13; a partition plate 2 is arranged at the middle position of the liquid cooling plate 1 to divide the internal chamber 11 of the liquid cooling plate 1 into a cooling liquid inlet channel 14 and a cooling liquid outlet channel 15; the cooling liquid inlet channel 14 is located directly above the cooling liquid outlet channel 15, and the cooling liquid inlet channel 14 is close to one side of a device to be cooled 3; the top heat exchange plate 12 is close to one side of the device to be cooled 3, and is affected by the heat dissipation of the device to be cooled 3, so the temperature of the top heat exchange plate 12 is slightly higher The temperature of the bottom anti-condensation plate 13 is determined by the cooling liquid inlet channel 14, so the cooling liquid inlet channel 14 is arranged directly above the cooling liquid outflow channel 15. When the cooling liquid flowing out of the cooling liquid inlet channel 14 flows to the cooling liquid outflow channel 15, the temperature rises, which plays a role in raising the temperature of the bottom anti-condensation plate 13, so that the wall temperature of the entire liquid cooling plate 1 is in a cross-uniform state, which can effectively prevent the generation of condensation and has high safety. The device to be cooled 3 here can be any electronic device, and the device to be cooled 3 does not constitute a component of the liquid cooling plate 1 of the present invention. The device to be cooled 3 is mentioned only to illustrate the placement method of the liquid cooling plate 1 when it is used.

[0037] The same side of the liquid cooling plate 1 is provided with a cooling liquid inlet 17 and a cooling liquid outlet 18, respectively. The cooling liquid flows into the cooling liquid inlet 17, flows through the cooling liquid inlet channel 14 and the cooling liquid outlet channel 15 in sequence, and finally flows out from the cooling liquid outlet 18. The cooling liquid inlet 17 and the cooling liquid outlet 18 are arranged on the same side of the liquid cooling plate 1, which means that both are arranged on the left side or the right side of the liquid cooling plate 1 at the same time. Figure 1 As shown, the cooling liquid inlet 17 and the cooling liquid outlet 18 are both arranged on the left side of the liquid cooling plate 1, and in practice, both can also be arranged on the right side of the liquid cooling plate 1;

[0038] The anti-condensation plate 13 is provided with an anti-condensation layer 131 with a thickness of 3 to 5 mm on the side away from the heat exchange plate 12. The anti-condensation layer 131 is formed by superimposing an epoxy resin layer 1311 and an SMC composite material layer 1312. The epoxy resin layer 1311 is provided on the side close to the anti-condensation plate 13. The anti-condensation layer formed by superimposing the epoxy resin layer 1311 and the SMC composite material layer 1312 has the function of preventing condensation, can avoid the generation of condensation, and has high safety. The anti-condensation layer 131 provided by the method of the present invention is different from the anti-condensation layer formed by brushing the anti-condensation coating. The anti-condensation coating must be coated with a certain thickness and have a certain moisture absorption volume to be effective, which is not conducive to the overall performance of the liquid cooling plate. The heat dissipation is contrary to the original intention of setting up the heat dissipation plate. The anti-condensation layer 131 formed by the epoxy resin layer 1311 and the SMC composite material layer 1312 set in the present invention is ultra-thin. First, an epoxy resin layer 1311 is set on the heat exchange plate 12, and then the epoxy resin layer 1311 is activated by spraying water on the surface of the epoxy resin layer using an ion spray gun. Finally, a SMC composite material layer 1312 is set on the side of the epoxy resin layer 1311 away from the heat exchange plate 12. It does not affect the heat dissipation, has a super anti-condensation effect, is highly safe, and the method for setting the anti-condensation layer 131 is simple, the bonding part has strong mechanical properties, and does not need to be replaced regularly, while reducing production costs and use costs.

[0039] Further, as another preferred embodiment, the volume ratio of the coolant inlet channel 14 to the coolant outlet channel 15 is 1.5 to 2.5:1. The coolant inlet and outlet volume ratio is adjusted to adjust the temperature difference between the top heat exchange plate 12 and the bottom anti-condensation plate 13, so that the wall temperature of the entire liquid-cooled plate 1 is in a uniform state, which can effectively prevent the generation of condensation and has high safety. It should be noted that the volume ratio of the coolant inlet channel 14 to the coolant outlet channel 15 refers to the volume ratio of the two halves of the internal chamber 11 divided by the partition plate 2, that is, the volume of the part above the partition plate 2 is the volume of the coolant inlet channel 14, and the volume of the part below the partition plate 2 is the volume of the coolant outlet channel 15. Figure 1In the case shown, the volume ratio of the coolant inflow channel 14 to the coolant outflow channel 15 can also be said to be the ratio of the height of the coolant inflow channel 14 to the height of the coolant outflow channel 15 .

[0040] Furthermore, as another preferred embodiment, the anti-condensation plate 13 is provided with an anti-condensation water layer 131 with a thickness of 4 to 5 mm on the side away from the heat exchange plate 12. The thickness of the anti-condensation water layer 131 affects the anti-condensation effect of the anti-condensation plate 13 and directly affects the overall heat dissipation performance of the liquid cooling plate 1. When the thickness of the anti-condensation water layer 131 is 4 to 5 mm, the anti-condensation and heat dissipation effects are good.

[0041] Furthermore, as another preferred embodiment, a layer of epoxy resin layer 21 with a thickness of 4 to 6 mm is provided on one side of the partition plate 2 close to the coolant outflow channel 15; the epoxy resin layer 21 can partially block the heat exchange between the coolant inflow channel 14 and the coolant outflow channel 15, and play a role in adjusting the temperature difference between the top heat exchange plate 12 and the bottom anti-condensation plate 13, so that the wall temperature of the entire liquid cooling plate 1 is in a uniform state, which can effectively prevent the generation of condensation and has high safety.

[0042] Furthermore, as another preferred embodiment, a layer of epoxy resin layer 21 with a thickness of 5 to 6 mm is provided on one side of the partition plate 2 close to the coolant outflow channel 15; the heat exchange between the coolant inflow channel 14 and the coolant outflow channel 15 can be better blocked, so as to better adjust the temperature difference between the top heat exchange plate 12 and the bottom anti-condensation plate 13, so that the wall temperature of the entire liquid cooling plate 1 is in a uniform state, which can effectively prevent the generation of condensation and has high safety.

[0043] Furthermore, as another preferred embodiment, the heat exchange plate 12 is provided with a plurality of spoilers 4 on one side close to the coolant inlet channel 14, which disturb the coolant in the coolant inlet channel 14, thereby avoiding excessive pressure drop between the coolant inlet 17 and the coolant outlet 18, and improving the stability of the liquid cooling cycle.

[0044] Furthermore, as another preferred embodiment, the partition plate 2 is provided with a plurality of protrusions 22 on one side close to the coolant inlet channel 14, which disturbs the coolant in the coolant inlet channel 14, thereby avoiding excessive pressure drop between the coolant inlet 17 and the coolant outlet 18, and further improving the stability of the liquid cooling cycle.

[0045] Example 1

[0046] The present invention provides a method for processing and forming a liquid cooling plate, and the method for processing and forming the liquid cooling plate 1 comprises the following steps:

[0047] (1) A high thermal conductivity aluminum alloy profile, specifically model 1070, is used, and the liquid cooling plate is prepared by pickling and degreasing, coating with anti-composite graphene material, heat treatment, rolling and compounding, and inflation. (The specific model of the aluminum alloy profile can be selected and used according to the actual situation, and the specific model of the aluminum alloy profile is not limited, as long as it meets the requirement of good thermal conductivity)

[0048] 1.1) The specific process of pickling and degreasing is: first use sandpaper to remove impurities on the surface of the aluminum alloy profile; then pickle to remove the dense oxide film on the surface of the aluminum alloy profile; finally degrease and dry;

[0049] 1.2) The specific process of applying the anti-composite graphene material is as follows: according to the weight ratio of polydimethylsiloxane to graphene of 1:2, polydimethylsiloxane and graphene are uniformly mixed to make the anti-composite graphene material; the anti-composite graphene material is applied on the aluminum alloy substrate with a shielding mold by a graphite film sprayer; the shape of the shielding mold is made according to the position contours of the liquid inlet pipe, the liquid outlet pipe and several flow channel units to obtain the required graphene flow channel circuit diagram, and the anti-composite graphene material is applied on the preset flow channel circuit diagram;

[0050] 1.3) Heat treatment temperature is controlled at 400℃;

[0051] 1.4) The specific process of rolling bonding is: rolling bonding is carried out at a rolling speed of 0.3m / min to fully combine the two aluminum alloy profiles;

[0052] 1.5) The specific process of inflation is: blowing high-pressure gas into the aluminum alloy substrate to expand the anti-composite part according to the flow path map, thereby completing the flow channel forming;

[0053] (2) Setting an anti-condensation layer 131:

[0054] 2.1) Use 800-grit sandpaper to polish the surface of the liquid cooling plate preliminary finished product anti-condensation plate 13 away from the heat exchange plate 12, and use a plasma spray gun to spray a layer of epoxy resin 1311 with a thickness of 0.8 mm;

[0055] 2.2) Using an ion spray gun to spray water on the surface of the epoxy resin layer to activate the epoxy resin layer 1311, and then setting a layer of SMC composite material layer 1312 on the side of the epoxy resin layer 1311 away from the heat exchange plate 13. Specifically, using a high temperature resistant adhesive to bond the SMC composite material layer 1312 to the epoxy resin layer 1311, the anti-condensation layer 131 formed by the epoxy resin layer 1311 and the SMC composite material layer 1312 can be obtained; if an epoxy resin layer 21 is provided, it is also necessary to spray epoxy resin at the corresponding position of the partition plate 2 to form the epoxy resin layer 21;

[0056] 2.3) The surface of the liquid cooling plate pre-finished product is then polished using 2000-grit sandpaper, and the polished surface does not include the anti-condensation layer 131 (if an epoxy resin layer 21 is provided, the polished surface does not include the anti-condensation layer 131 or the epoxy resin layer 21), and the liquid cooling plate 1 is obtained.

[0057] Example 2

[0058] The present invention provides a method for processing and forming a liquid cooling plate, and the method for processing and forming the liquid cooling plate 1 comprises the following steps:

[0059] (1) Using an aluminum alloy profile with a high thermal conductivity, specifically model 1070, the liquid cooling plate is prepared by acid washing and degreasing, coating with anti-composite graphene material, heat treatment, rolling and compounding, and inflation;

[0060] 1.1) The specific process of pickling and degreasing is: first use sandpaper to remove impurities on the surface of the aluminum alloy profile; then pickle to remove the dense oxide film on the surface of the aluminum alloy profile; finally degrease and dry;

[0061] 1.2) The specific process of applying the anti-composite graphene material is as follows: according to the weight ratio of polydimethylsiloxane to graphene of 1:2, polydimethylsiloxane and graphene are uniformly mixed to make the anti-composite graphene material; the anti-composite graphene material is applied on the aluminum alloy substrate with a shielding mold by a graphite film sprayer; the shape of the shielding mold is made according to the position contours of the liquid inlet pipe, the liquid outlet pipe and several flow channel units to obtain the required graphene flow channel circuit diagram, and the anti-composite graphene material is applied on the preset flow channel circuit diagram;

[0062] 1.3) Heat treatment temperature is controlled at 450℃;

[0063] 1.4) The specific process of rolling bonding is: rolling bonding is carried out at a rolling speed of 0.6m / min to fully combine the two aluminum alloy profiles;

[0064] 1.5) The specific process of inflation is: blowing high-pressure gas into the aluminum alloy substrate to expand the anti-composite part according to the flow path map, thereby completing the flow channel forming;

[0065] (2) Setting an anti-condensation layer 131:

[0066] 2.1) Use 1000-grit sandpaper to polish the surface of the liquid cooling plate preliminary finished product anti-condensation plate 13 away from the heat exchange plate 12, and use a plasma spray gun to spray a layer of epoxy resin 1311 with a thickness of 1.2 mm;

[0067] 2.2) Using an ion spray gun to spray water on the surface of the epoxy resin layer to activate the epoxy resin layer 1311, and then setting a layer of SMC composite material layer 1312 on the side of the epoxy resin layer 1311 away from the heat exchange plate 13. Specifically, using a high temperature resistant adhesive to bond the SMC composite material layer 1312 to the epoxy resin layer 1311, the anti-condensation layer 131 formed by the epoxy resin layer 1311 and the SMC composite material layer 1312 can be obtained; if an epoxy resin layer 21 is provided, it is also necessary to spray epoxy resin at the corresponding position of the partition plate 2 to form the epoxy resin layer 21;

[0068] 2.3) The surface of the liquid cooling plate pre-finished product is then polished using 2000-grit sandpaper, and the polished surface does not include the anti-condensation layer 131 (if an epoxy resin layer 21 is provided, the polished surface does not include the anti-condensation layer 131 or the epoxy resin layer 21), and the liquid cooling plate 1 is obtained.

[0069] Comparative Example 1

[0070] The present invention provides a method for processing and forming a liquid cooling plate, and the method for processing and forming the liquid cooling plate 1 comprises the following steps:

[0071] (1) Using an aluminum alloy profile with a high thermal conductivity, specifically model 1070, the liquid cooling plate is prepared by acid washing and degreasing, coating with anti-composite graphene material, heat treatment, rolling and compounding, and inflation;

[0072] 1.1) The specific process of pickling and degreasing is: first use sandpaper to remove impurities on the surface of the aluminum alloy profile; then pickle to remove the dense oxide film on the surface of the aluminum alloy profile; finally degrease and dry;

[0073] 1.2) The specific process of applying the anti-composite graphene material is as follows: according to the weight ratio of polydimethylsiloxane to graphene of 1:2, polydimethylsiloxane and graphene are uniformly mixed to make the anti-composite graphene material; the anti-composite graphene material is applied on the aluminum alloy substrate with a shielding mold by a graphite film sprayer; the shape of the shielding mold is made according to the position contours of the liquid inlet pipe, the liquid outlet pipe and several flow channel units to obtain the required graphene flow channel circuit diagram, and the anti-composite graphene material is applied on the preset flow channel circuit diagram;

[0074] 1.3) Heat treatment temperature is controlled at 415℃;

[0075] 1.4) The specific process of rolling bonding is: rolling bonding is carried out at a rolling speed of 0.6m / min to fully combine the two aluminum alloy profiles;

[0076] 1.5) The specific process of inflation is: blowing high-pressure gas into the aluminum alloy substrate to expand the anti-composite part according to the flow path map, thereby completing the flow channel forming;

[0077] (2) Setting an anti-condensation layer 131:

[0078] 2.1) Use 1000-grit sandpaper to polish the surface of the liquid cooling plate preliminary finished product anti-condensation plate 13 away from the heat exchange plate 12, and use a plasma spray gun to spray a layer of epoxy resin 1311 with a thickness of 1.2 mm;

[0079] 2.2) directly disposing a layer of SMC composite material layer 1312 on the side of the epoxy resin layer 1311 away from the heat exchange plate 13. Specifically, the SMC composite material layer 1312 is bonded to the epoxy resin layer 1311 by using a high temperature resistant adhesive to obtain the anti-condensation layer 131. If an epoxy resin layer 21 is provided, epoxy resin needs to be sprayed at the corresponding position of the partition plate 2 to form the epoxy resin layer 21.

[0080] 2.3) The surface of the liquid cooling plate pre-finished product is then polished using 2000-grit sandpaper, and the polished surface does not include the anti-condensation layer 131 (if an epoxy resin layer 21 is provided, the polished surface does not include the anti-condensation layer 131 or the epoxy resin layer 21), and the liquid cooling plate 1 is obtained.

[0081] Comparative Example 2

[0082] The present invention provides a method for processing and forming a liquid cooling plate, and the method for processing and forming the liquid cooling plate 1 comprises the following steps: (1)

[0084] Aluminum alloy profiles with high thermal conductivity, specifically model 1070, are used, and the liquid cooling plate is prepared by acid washing and degreasing, coating with anti-composite graphene material, heat treatment, rolling and compounding, and inflation.

[0085] 1.1) The specific process of pickling and degreasing is: first use sandpaper to remove impurities on the surface of the aluminum alloy profile; then pickle to remove the dense oxide film on the surface of the aluminum alloy profile; finally degrease and dry;

[0086] 1.2) The specific process of applying the anti-composite graphene material is as follows: according to the weight ratio of polydimethylsiloxane to graphene of 1:2, polydimethylsiloxane and graphene are uniformly mixed to make the anti-composite graphene material; the anti-composite graphene material is applied on the aluminum alloy substrate with a shielding mold by a graphite film sprayer; the shape of the shielding mold is made according to the position contours of the liquid inlet pipe, the liquid outlet pipe and several flow channel units to obtain the required graphene flow channel circuit diagram, and the anti-composite graphene material is applied on the preset flow channel circuit diagram;

[0087] 1.3) Heat treatment temperature is controlled at 415℃;

[0088] 1.4) The specific process of rolling bonding is: rolling bonding is carried out at a rolling speed of 0.6m / min to fully combine the two aluminum alloy profiles;

[0089] 1.5) The specific process of inflation is: blowing high-pressure gas into the aluminum alloy substrate to expand the anti-composite part according to the flow path map, thereby completing the flow channel forming;

[0090] (2) Only an epoxy resin layer is provided as the anti-condensation layer 131, and then the surface of the liquid cooling plate preliminary product is polished using 2000-grit sandpaper, and the polished surface does not include the anti-condensation layer 131 (if an epoxy resin layer 21 is provided, the polished surface does not include either the anti-condensation layer 131 or the epoxy resin layer 21), and the liquid cooling plate 1 can be obtained.

[0091] Comparative Example 3

[0092] The present invention provides a method for processing and forming a liquid cooling plate, and the method for processing and forming the liquid cooling plate 1 comprises the following steps:

[0093] (1) Using an aluminum alloy profile with a high thermal conductivity, specifically model 1070, the liquid cooling plate is prepared by acid washing and degreasing, coating with anti-composite graphene material, heat treatment, rolling and compounding, and inflation;

[0094] 1.1) The specific process of pickling and degreasing is: first use sandpaper to remove impurities on the surface of the aluminum alloy profile; then pickle to remove the dense oxide film on the surface of the aluminum alloy profile; finally degrease and dry;

[0095] 1.2) The specific process of applying the anti-composite graphene material is as follows: according to the weight ratio of polydimethylsiloxane to graphene of 1:2, polydimethylsiloxane and graphene are uniformly mixed to make the anti-composite graphene material; the anti-composite graphene material is applied on the aluminum alloy substrate with a shielding mold by a graphite film sprayer; the shape of the shielding mold is made according to the position contours of the liquid inlet pipe, the liquid outlet pipe and several flow channel units to obtain the required graphene flow channel circuit diagram, and the anti-composite graphene material is applied on the preset flow channel circuit diagram;

[0096] 1.3) Heat treatment temperature is controlled at 415℃;

[0097] 1.4) The specific process of rolling bonding is: rolling bonding is carried out at a rolling speed of 0.6m / min to fully combine the two aluminum alloy profiles;

[0098] 1.5) The specific process of inflation is: blowing high-pressure gas into the aluminum alloy substrate to expand the anti-composite part according to the flow path map, thereby completing the flow channel forming;

[0099] (2) Only an SMC composite material layer is provided as the anti-condensation layer 131. Specifically, the SMC composite material layer is bonded to the anti-condensation plate 13 using a high temperature resistant adhesive; and the surface of the liquid cooling plate pre-finished product is then polished using 2000-grit sandpaper, wherein the polished surface does not include the anti-condensation layer 131 (if an epoxy resin layer 21 is provided, the polished surface does not include either the anti-condensation layer 131 or the epoxy resin layer 21), thereby obtaining the liquid cooling plate 1.

[0100] Comparative Example 4

[0101] The present invention provides a method for processing and forming a liquid cooling plate, and the method for processing and forming the liquid cooling plate 1 comprises the following steps:

[0102] (1) Using aluminum alloy profiles with high thermal conductivity, specifically model 1070, the liquid cooling plate is prepared by pickling and degreasing, applying solder mask, heat treatment, rolling and compounding, and inflation. The heat treatment temperature is controlled at 415°C.

[0103] (2) Setting an anti-condensation layer 131:

[0104] 2.1) Use 1000-grit sandpaper to polish the surface of the liquid cooling plate preliminary finished product anti-condensation plate 13 away from the heat exchange plate 12, and use a plasma spray gun to spray a layer of epoxy resin 1311 with a thickness of 1.2 mm;

[0105] 2.2) Using an ion spray gun to spray water on the surface of the epoxy resin layer to activate the epoxy resin layer 1311, and then setting a layer of SMC composite material layer 1312 on the side of the epoxy resin layer 1311 away from the heat exchange plate 13. Specifically, using a high temperature resistant adhesive to bond the SMC composite material layer 1312 to the epoxy resin layer 1311, the anti-condensation layer 131 formed by the epoxy resin layer 1311 and the SMC composite material layer 1312 can be obtained; if an epoxy resin layer 21 is provided, it is also necessary to spray epoxy resin at the corresponding position of the partition plate 2 to form the epoxy resin layer 21;

[0106] 2.3) The surface of the liquid cooling plate pre-finished product is then polished using 2000-grit sandpaper, and the polished surface does not include the anti-condensation layer 131 (if an epoxy resin layer 21 is provided, the polished surface does not include the anti-condensation layer 131 or the epoxy resin layer 21), and the liquid cooling plate 1 is obtained.

[0107] By comparing the anti-condensation effect and the mechanical properties of the bonding parts of the liquid cooling plate 1 in Example 1-2 and Comparative Example 1-3, it can be seen that the anti-condensation effect and the mechanical properties of the bonding parts of the liquid cooling plate 1 in Example 1-2 are much better than the liquid cooling plate 1 made in Comparative Example 1-3. It can be inferred that the anti-condensation water layer 131 formed by superimposing the epoxy resin layer 1311 and the SMC composite material layer 1312 arranged in the present invention is ultra-thin, does not affect the heat dissipation, and has a super strong anti-condensation effect and high safety. The method of setting the anti-condensation water layer 131 is simple, the mechanical properties of the bonding parts are strong, and no regular replacement is required, while reducing the production cost and the use cost.

[0108] By comparing the performance of the liquid cooling plate 1 formed products in Examples 1-2 and Comparative Example 4, it can be seen that in Examples 1-2, aluminum alloy profiles with high thermal conductivity are used, and the liquid cooling plate is prepared by pickling and degreasing, applying anti-composite graphene material, heat treatment, rolling and compounding, and inflation in sequence; the traditional anti-welding material is replaced by the anti-composite graphene material, and the anti-composite graphene material is applied to the pre-designed flow channel loop line, and the hot stamping step can be omitted, which is equivalent to only needing to pass the steps of hot rolling and inflation molding to achieve double-layer aluminum alloy non-equivalent interface thermal bonding, so that the bonding between the aluminum alloy plates is good in sealing and strength, and leakage of the coolant in the flow channel loop can be avoided. The prepared liquid cooling plate has higher bending strength, better toughness, and better heat dissipation, and the preparation process is simplified, the processing efficiency is higher, and the production cost is lower; in Comparative Example 4, the anti-composite graphene material is replaced with the traditional anti-welding material, and the hot stamping step is omitted. The prepared liquid cooling plate 1 has the disadvantages of easy leakage and poor heat dissipation effect.

[0109] Due to the application of the above technical scheme, the present invention has the following advantages compared with the prior art: the present invention provides a processing and molding method for a liquid cooling plate, the present invention provides an anti-condensation water layer 131 on the side of the anti-condensation plate away from the heat exchange plate, the anti-condensation water layer 131 formed by the superposition of the epoxy resin layer 1311 and the SMC composite material layer 1312 has the function of preventing condensation, can avoid the generation of condensation, and has high safety; the anti-condensation water layer 131 formed by the superposition of the epoxy resin layer 1311 and the SMC composite material layer 1312 arranged in the present invention is ultra-thin, firstly, an epoxy resin layer 1311 is provided on the heat exchange plate 12, and then an ion spray gun is used to spray water on the surface of the epoxy resin layer to activate the epoxy resin layer 1311, and finally, a SMC composite material layer 1312 is provided on the side of the epoxy resin layer 1311 away from the heat exchange plate 12, which does not affect the heat dissipation, has a super strong anti-condensation effect, has high safety, and the anti-condensation water layer 131 is provided. The method is simple, the bonding part has strong mechanical properties, and no regular replacement is required, while reducing production costs and use costs; the volume ratio of the coolant inflow channel to the coolant outflow channel is 1.5-2.5:1, and the coolant inflow and outflow volume ratio is adjusted to adjust the temperature difference between the top heat exchange plate 12 and the bottom anti-condensation plate 13, so that the wall temperature of the entire liquid cooling plate 1 is in a cross-uniform state, which can effectively prevent the generation of condensation and has high safety; multiple spoilers 4 are provided to disturb the coolant in the coolant inflow channel 14, which can avoid the effect of excessive pressure drop between the coolant inlet 17 and the coolant outlet 18, and play a role in improving the stability of the liquid cooling cycle; multiple protrusions 22 are provided to disturb the coolant in the coolant inflow channel 14, which can avoid the effect of excessive pressure drop between the coolant inlet 17 and the coolant outlet 18, and further improve the stability of the liquid cooling cycle.

[0110] Although the present invention has been described in detail above with general descriptions and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements may be made thereto based on the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection claimed by the present invention.

Claims

1. A method for processing and forming a liquid cooling plate, characterized in that: The following steps are involved: (1) A liquid cooling plate is prepared by using an aluminum alloy profile with a high thermal conductivity through pickling and degreasing, coating with anti-composite graphene material, heat treatment, rolling and compounding, and inflation; 1.1) The specific process of pickling and degreasing is: first use sandpaper to remove impurities on the surface of the aluminum alloy profile; then pickle to remove the dense oxide film on the surface of the aluminum alloy profile; finally degrease and dry; 1.2) The specific process of applying the anti-composite graphene material is as follows: according to the weight ratio of polydimethylsiloxane to graphene being 1:2, polydimethylsiloxane and graphene are uniformly mixed to make the anti-composite graphene material; the anti-composite graphene material is applied on the preset flow channel circuit map; 1.3) Heat treatment temperature is controlled at 400-450℃; 1.4) The specific process of rolling bonding is: rolling bonding is carried out at a rolling speed of 0.3m / min to 0.6m / min to fully combine the two aluminum alloy profiles.

2. The method for processing and forming a liquid cooling plate according to claim 1, characterized in that: In the step 1.3), the heat treatment temperature is controlled at 415-450°C.

3. The method for processing and forming a liquid cooling plate according to claim 1, characterized in that: In the step 1.2), the size of the graphene is between 0.5 and 3 μm.

4. The method for processing and forming a liquid cooling plate according to claim 1, characterized in that: The liquid cooling plate is a rectangular parallelepiped structure, and a chamber for cooling liquid to flow is arranged inside, the top surface is a heat exchange plate, and the bottom surface is an anti-condensation plate; a partition plate is arranged at the middle position of the liquid cooling plate to divide the internal chamber of the liquid cooling plate into a cooling liquid inflow channel and a cooling liquid outflow channel; the cooling liquid inflow channel is located directly above the cooling liquid outflow channel, and the cooling liquid inflow channel is close to one side of the device to be cooled; A coolant inlet and a coolant outlet are respectively provided on the same side of the liquid cooling plate, and the coolant flows in from the coolant inlet, flows through the coolant inlet channel and the coolant outlet channel in sequence, and finally flows out from the coolant outlet; The anti-condensation plate is provided with an anti-condensation water layer with a thickness of 3 to 5 mm on the side away from the heat exchange plate; The method for setting the anti-condensation water layer is as follows: 2.1) a liquid cooling plate anti-condensation plate prepared by surface grinding is placed away from the heat exchange plate, and a layer of epoxy resin with a thickness of 0.8 to 1.2 mm is sprayed on the side; 2.2) Use an ion spray gun to spray water on the surface of the epoxy resin layer to activate the epoxy resin layer, and then set a layer of SMC composite material layer on the side of the epoxy resin layer away from the heat exchange plate to obtain an anti-condensation layer composed of the epoxy resin layer and the SMC composite material layer; 2.3) The surface of the liquid cooling plate is then polished to obtain the liquid cooling plate.

5. The method for processing and forming a liquid cooling plate according to claim 4, characterized in that: The volume ratio of the coolant inflow channel to the coolant outflow channel is 1.5 to 2.5:

1.

6. The method for processing and forming a liquid cooling plate according to claim 4, characterized in that: A 4-5 mm thick anti-condensation water layer is arranged on the side of the anti-condensation plate away from the heat exchange plate.

7. The method for processing and forming a liquid cooling plate according to claim 4, characterized in that: A layer of epoxy resin with a thickness of 4 to 6 mm is arranged on one side of the partition plate close to the coolant outflow channel.

8. The method for processing and forming a liquid cooling plate according to claim 4, characterized in that: A plurality of spoilers are arranged on one side of the heat exchange plate close to the coolant inflow channel, which play a role in spoiling the coolant in the coolant inflow channel.

9. The method for processing and forming a liquid cooling plate according to claim 4, characterized in that: The partition plate is provided with a plurality of protrusions on one side close to the coolant inflow channel, which play a role in disturbing the coolant in the coolant inflow channel.

10. The method for processing and forming a liquid cooling plate according to claim 4, characterized in that: In the step 2.3), the surface of the liquid cooling plate is polished by sandpaper with a mesh size of 2000 or above to obtain the liquid cooling plate.

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