A horizontal vibration slide device for a chip

Abstract

The application discloses a horizontal vibration slide table device for a chip, which comprises a vibration table, a track frame, a chip placing table and a guide rail assembly. A circular channel is arranged in the track frame along the horizontal direction. The chip placing table is in a cylindrical shape and coaxially arranged in the circular channel of the track frame. The guide rail assembly is arranged between the track frame and the chip placing table. The guide rail assembly comprises a long guide rail and a sliding block which are matched with each other. The long guide rail is fixedly installed on the bottom of the inner wall of the track frame along the axial direction. The sliding block is fixedly connected with the bottom of the chip placing table. One side end surface of the chip placing table is used for mounting a chip to be tested. The other side end surface of the chip placing table is dynamically connected with the vibration table. The vibration table is used for loading vibration stress on the whole vibration system. In the vibration slide table device, only the chip placing table is connected with the vibration table. The whole vibration system is miniaturized, and the chip function test system can be better integrated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mechanical environment test, in particular to a horizontal vibration slide device for chips. BACKGROUND

[0002] In recent years, the downstream application fields such as 5G, cloud computing, big data, Internet of Things and artificial intelligence have grown rapidly, and chips, as an important part of the entire semiconductor industry, have become the top priority of strategic deployment of various countries. The level of chip industry development reflects the national innovation manufacturing level to some extent.

[0003] The vibration test system can simulate the actual working condition of the test piece and is mainly used for reliability tests such as vibration strength test, impact environment test and environmental stress screening test of the test piece. The reliability test of the chip sometimes needs to test the influence of the mechanical environment on the photoelectric performance of the chip online, which requires the vibration test bench of the chip to have the characteristics of light load, flexible direction and easy integration.

[0004] The vibration test system is generally connected with a horizontal slide device through a vibration table to realize the horizontal vibration test of the device, but most of the existing vibration systems are for large test pieces. The horizontal slide structure is too large for the vibration test of the chip, and the bearing direction and the installation form of the test piece are single, which is difficult to realize good integration with the functional test system of the chip. SUMMARY

[0005] In view of the deficiencies in the prior art, the present application provides a horizontal vibration slide device for chips. The device is suitable for light load vibration detection objects such as chips, and the vibration slide device designed by the present application is only connected with the vibration table through the chip placement table. The whole vibration system is miniaturized, and can be better integrated with the chip functional test system to meet the test requirements of the chip.

[0006] The technical scheme adopted by the present application is as follows:

[0007] A horizontal vibration slide device for chips comprises:

[0008] A vibration table is used to load vibration stress on the whole vibration system;

[0009] A track frame is provided with a circular channel in the horizontal direction;

[0010] A chip placement table is in the form of a cylinder and is coaxially arranged in the circular channel of the track frame. One side end face of the chip placement table is used to install the chip to be tested, and the other side end face of the chip placement table is connected with the vibration table.

[0011] The guide rail assembly arranged between the track frame and the chip placement table comprises a long guide rail and a sliding block matched with each other, the long guide rail is fixedly installed on the bottom of the inner wall of the track frame in the axial direction, and the sliding block is fixedly connected with the bottom of the chip placement table.

[0012] Further, the chip placement table and the vibration table are connected through a connecting rod.

[0013] Further, the connecting rod is connected with the chip placement table and the vibration table in a rigid connection, a flexible connection or a combination of rigid and flexible connections.

[0014] Further, the flexible connection is realized through a floating joint.

[0015] Further, a rectangular groove is formed on the bottom of the inner wall of the track frame in the axial direction, and the long guide rail is fixedly installed in the rectangular groove.

[0016] Further, a blind hole is formed in the chip placement table in the axial direction, and the sliding block is fixed on the outer wall of the chip placement table through the blind hole by using a fastener.

[0017] Further, the upper surface of the sliding block is designed as an arc surface matched with the outer wall surface of the chip placement table.

[0018] Further, a plane is processed on the surface of the chip placement table in the axial direction, and the upper surface of the sliding block is also a plane.

[0019] Further, a debugging support is arranged, the debugging support is provided with a circular channel in the horizontal direction, one side of the debugging support is detachably connected with the end surface of the track frame on the chip mounting side, and the circular channel of the track frame is coaxially arranged with the circular channel of the debugging support.

[0020] Further, a chip function test system is arranged on the chip mounting side.

[0021] The present application has the following advantages:

[0022] 1. Compared with the existing vibration system in which the whole sliding table device is driven to vibrate by the vibration table, only the chip placement table is connected with the vibration table in the horizontal vibration sliding table device designed by the present application, the transmission of horizontal vibration under light load is realized, the present application replaces the heavy horizontal sliding table used in the existing horizontal vibration test, and the whole vibration system can be miniaturized, and is more suitable for vibration experiments of chips.

[0023] 2. The horizontal sliding table has a compact overall structure and small volume, is convenient to integrate with other function test systems of chips, and has a wide application prospect.

[0024] 3. In existing vibration systems, specimens are typically placed in either vertical or horizontal orientations. Especially when horizontal vibration is required, it is mostly achieved using a vibration table and a horizontal slide. However, for vibration testing of lightweight specimens like chips, existing horizontal slides are mostly designed for large, heavy specimens. These large slides often require the entire specimen to be placed on them to achieve horizontal vibration. This installation method hinders the integration of mechanical environment testing with the specimen's functional testing system, making online testing of the specimen's functionality a challenge. Therefore, this application provides a new design that solves the problem of the limited specimen placement options in existing technologies.

[0025] 4. In the horizontal vibration slide device, the chip placement stage and the vibration table employ a combination of flexible and rigid connections / a flexible connection method. This eliminates radial runout in the vibration output of the vibration table, i.e., coaxiality error, enabling the chip placement stage to move (vibrate) at high frequency axially within the enclosed arc or circular space of the track frame. Furthermore, the flexible connection between the connecting rod and the chip placement stage and vibration table is not limited to the horizontal direction; it can be extended to connect the vibration transmission between the vibration table and the test piece in any other direction besides the horizontal. Attached Figure Description

[0026] Figure 1 This is a side view of a horizontal vibration slide device for chips.

[0027] Figure 2 This is a schematic diagram of the left side of the horizontal vibration slide table;

[0028] Figure 3 This is a schematic diagram of the right side of the horizontal vibration slide table;

[0029] In the diagram, 1 is the debugging bracket, 2 is the track frame, 3 is the chip placement platform, 4 is the floating joint, 5 is the guide rail assembly, 6 is the connecting rod, 7 is the vibration table, and 8 is the chip. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention.

[0031] like Figure 1 A horizontal vibration slide device for a chip, as shown, includes:

[0032] The vibration table 7 applies vibration stress to the entire vibration system.

[0033] Track frame 2, with a circular channel running horizontally inside track frame 2.

[0034] The chip placement table 3 is in a cylindrical shape and coaxially arranged in the circular channel of the track frame 2 with a gap therebetween. One side end face of the chip placement table 3 is used to mount the chip 8 to be tested, and the other side end face of the chip placement table 3 is dynamically connected with the vibration table 7.

[0035] The guide rail assembly 5 is arranged between the track frame 2 and the chip placement table 3, and includes a long guide rail and a sliding block. The long guide rail is fixedly installed at the bottom of the inner wall of the track frame 2 and arranged in the axial direction. The upper part of the sliding block is fixedly connected with the bottom of the chip placement table 3. The sliding block and the long guide rail are matched with each other and can move relatively. Therefore, the guide rail assembly 5 facilitates the relative movement between the chip placement table 3 and the track frame 2, and also supports the chip placement table 3.

[0036] In the embodiment, the chip placement table 3 and the vibration table 7 are connected through the connecting rod 6 to realize the transmission of vibration therebetween.

[0037] In the embodiment, the connecting rod 6 and the chip placement table 3 and the vibration table 7 can be connected in a rigid or flexible manner. Specifically, the following connection modes can be adopted:

[0038] Both ends of the connecting rod 6 are rigidly connected with the chip placement table 3 and the vibration table 7, for example, by using a shaft coupling or the like.

[0039] The connecting rod 6 is flexibly connected with the chip placement table 3 and rigidly connected with the vibration table 7.

[0040] Both ends of the connecting rod 6 are flexibly connected with the chip placement table 3 and the vibration table 7.

[0041] More preferably, the flexible connection can be realized by the floating joint 4, that is, the connecting rod 6 connects the chip placement table 3 and / or the vibration table 7 through the floating joint 4. The floating joint 4 can eliminate the radial runout, that is, the coaxiality error, of the vibration output of the vibration table 7, and realize the high-frequency axial movement (vibration) of the chip placement table 3 in the closed circular arc or circular space of the track frame 2. Since the vibration can be transmitted in a flexible manner, the elimination of the coaxiality error is realized. The flexible connection between the connecting rod and the chip placement table and the vibration table is not limited to the horizontal direction, but can be extended to the connection of the vibration table and the measured object in other arbitrary directions in addition to the horizontal direction.

[0042] In the embodiment, in order to facilitate the installation of the long guide rail on the track frame 2, a rectangular groove can be formed in the bottom of the inner wall of the track frame 2 in the axial direction, and the long guide rail is fixedly installed in the rectangular groove.

[0043] In the embodiment, in order to facilitate the installation of the slider on the chip placement table 3, a blind hole is formed in the chip placement table 3 along the axial direction, and the slider is fixed on the outer wall of the chip placement table 3 by using the fastener through the blind hole.

[0044] In the embodiment, since the outer part of the chip placement table 3 is in a cylindrical shape, the upper surface of the slider can be designed as a concave arc surface, which can better fit the wall surface of the chip placement table 3. A plane can also be machined on the surface of the chip placement table 3 along the axial direction, so that the upper surface of the slider is also designed as a plane, which facilitates the fitting between the two.

[0045] In the embodiment, the cooperation between the slider and the long guide rail can only have the matching design between the corresponding groove and the protrusion on the long guide rail, and the protrusion reciprocates along the groove; or a ball can be arranged between the slider and the long guide rail, and the sliding between the two can be converted into rolling by using the ball.

[0046] In the embodiment, in order to facilitate the installation and debugging, the application also designs a debugging support 1; one side of the debugging support 1 is detachably connected with the end surface of the rail frame 2 on the chip 8 installation side, and the circular channel of the rail frame 2 is coaxially arranged with the circular channel of the debugging support 1. After the installation and debugging between the chip placement table 3 and the vibration table 7 are completed, the debugging support 1 can be removed.

[0047] In the embodiment, a blind hole is formed in the chip placement table 3 along the axial direction, a rectangular groove is formed outward along the radial direction at the bottom of the blind hole, a bolt or the like is installed in the rectangular groove, and one end of the bolt extends to the outside of the chip placement table 3. The extended part cooperates with the rail frame 2.

[0048] In the embodiment, the bottom of the debugging support 1 and the bottom of the vibration table 7 are fixedly installed on the base.

[0049] In the embodiment, the bottom of the debugging support 1 can be provided with a reinforcing rib. In the embodiment, a connecting lug is arranged circumferentially on the connecting side of the rail frame 2 and the debugging support 1, and the surface of the rail frame 2 and the debugging support 1 is fixedly connected at the connecting lug by using the fastener.

[0050] In the embodiment, after the installation and debugging between the vibration table 7 and the chip placement table 3 are completed, the integrating sphere and the photoelectric parameter measurement system can be integrated with the vibration system composed of the vibration table 7 and the chip placement table 3, and the photoelectric parameter measurement system is used to test the function of the chip 8, for example, the integrating sphere and the photoelectric parameter measurement system are connected with the right side (the chip installation side) of the chip placement table 3. Therefore, the device can be well integrated with the function test system.

[0051] In the existing vibration test system, the common test piece installation mode of vibration test is generally two kinds of vertical and horizontal directions. Especially when horizontal vibration is needed, it is mostly dependent on the vibration table plus horizontal slide to realize. Relative to the light load vibration test of chip, the existing horizontal slide is mostly designed for large volume and heavy weight test piece. The volume is large, and the test piece is often placed on the large horizontal slide to realize the horizontal vibration of the test piece. This installation mode hinders the integration of mechanical environment test and function test system of test piece (such as photoelectric test of chip), so that the online test of function test of test piece becomes a difficult problem. Therefore, the design of the device can solve the problem of single and heavy installation mode of test piece in the prior art, and the integration is difficult.

[0052] The above examples are only used to illustrate the design idea and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and to implement it, and the protection scope of the present application is not limited to the above examples. Therefore, any equivalent changes or modifications made according to the principles and design ideas disclosed by the present application are within the protection scope of the present application.

Claims

1. A horizontal vibration stage apparatus for a chip, characterized by, The utility model relates to a chip vibration test system, including: a vibration table (7) for loading vibration stress to the whole vibration system; a track frame (2) with a circular channel in the horizontal direction; a chip placement table (3) in the shape of a cylinder coaxially arranged in the circular channel of the track frame (2); one side end face of the chip placement table (3) is used for mounting the chip (8) to be tested, and the other side end face of the chip placement table (3) is dynamically connected with the vibration table (7); a guide rail assembly (5) arranged between the track frame (2) and the chip placement table (3), the guide rail assembly (5) comprising a long guide rail and a sliding block matched with each other, the long guide rail being fixedly installed on the bottom of the inner wall of the track frame (2) in the axial direction, and the sliding block being fixedly connected with the bottom of the chip placement table (3); the chip placement table (3) and the vibration table (7) are connected through a connecting rod (6); the connecting rod (6) is connected with the chip placement table (3) and the vibration table (7) in a flexible manner, and the flexible connection is realized through a floating joint (4).

2. The horizontal vibration stage device for a chip according to claim 1, wherein, The connecting rod (6) is connected with the chip placement table (3) and the vibration table (7) in a rigid manner or a rigid and flexible combined manner.

3. The horizontal vibration stage device for a chip according to claim 1 or 2, wherein A rectangular groove is formed in the bottom of the inner wall of the track frame (2) in the axial direction, and the long guide rail is fixedly installed in the rectangular groove.

4. The horizontal vibration stage device for a chip according to claim 3, wherein A blind hole is formed in the chip placement table (3) in the axial direction, and the sliding block is fixed to the outer wall of the chip placement table (3) through the blind hole by using a fastener.

5. The horizontal vibration stage device for a chip according to claim 4, wherein The upper surface of the sliding block is designed as an arc surface matched with the outer wall surface of the chip placement table (3).

6. The horizontal vibration stage device for a chip according to claim 4, wherein The surface of the chip placement table (3) is processed into a flat surface in the axial direction, and the upper surface of the sliding block is also a flat surface.

7. The horizontal vibration stage device for a chip according to claim 3, wherein The utility model also includes a debugging support (1) with a circular channel in the horizontal direction; the debugging support (1) is detachably connected between one side of the track frame (2) on the chip (8) mounting side and the end face of the track frame (2), and the circular channel of the track frame (2) is coaxially arranged with the circular channel of the debugging support (1).

8. The horizontal vibration stage device for a chip according to claim 3, wherein A chip function test system is arranged on the chip (8) mounting side.

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