A semiconductor lead frame cutting device

Abstract

The present invention provides a semiconductor lead frame cutting device, which relates to the technical field of semiconductor production. It includes a support mechanism, a limiting mechanism, a lifting mechanism and a laser cutting mechanism; the support mechanism includes a longitudinal support member and a transverse support member, and longitudinal support members are connected to both ends of the transverse support member; the limiting mechanism includes a movable block, a suction cup and a vacuum pump. The suction cup is installed on the transverse support member and communicated with the vacuum pump, and the suction cup is used for adsorbing the upper side of the semiconductor; the movable block is located below the suction cup and is used for supporting the lead frame; the lifting mechanism is used for longitudinally moving the movable block; the laser cutting mechanism includes a laser and a plurality of laser heads connected by optical fibers. The laser has a beam splitter, and the laser heads are installed on the transverse support member and are used for cutting the leads. The present invention uses the laser cutting mechanism to cut the leads, and there is no need to frequently replace the worn cutting tool, nor is it necessary to accurately determine or detect the degree of tool wear before replacing the cutting tool.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to a semiconductor lead frame cutting device. Background Art

[0002] In the production and manufacturing process of SMA semiconductors, a metal copper-based lead frame is used to integrally encapsulate several SMA semiconductors (as shown in Figure 1 the two ends of the SMA semiconductor are connected to the lead frame through leads), and then the SMA semiconductor and the leads are sheared off from the lead frame together by a shearing mechanism.

[0003] The patent document with the application number CN202122943164.6 discloses a cutting mechanism for a semiconductor lead frame, which drives a cutter to move towards a support seat through a driver, so that the cutter cuts off the leads on the SMA semiconductor, and the SMA semiconductor and the leads are separated from the lead frame together. Among them, the cutter is detachably installed on the output end of the driver, and when the cutter works a large number of times and wears out, the cutter can be conveniently replaced.

[0004] Although the above solution facilitates the replacement of the cutter by setting the cutter in a detachable form, it is necessary to accurately determine or detect the wear degree of the tool in order to replace the severely worn cutter in a timely manner. Summary of the Invention

[0005] In view of the above situation, the present invention provides a semiconductor lead frame cutting device, aiming to solve the technical problem that the existing cutting mechanism needs to accurately determine or detect the wear degree of the tool in order to replace the severely worn cutter in a timely manner.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] The present invention provides a semiconductor lead frame cutting device, which mainly includes a support mechanism, a limiting mechanism, a lifting mechanism and a laser cutting mechanism;

[0008] The support mechanism includes a longitudinal support member and a transverse support member, and both ends of the transverse support member are connected with longitudinal support members;

[0009] The limiting mechanism includes a movable block, a suction cup and a vacuum pump. The suction cup is installed on the transverse support member and communicated with the vacuum pump, and the suction cup is used for adsorbing the upper side of the semiconductor; the movable block is located below the suction cup and is used for supporting the lead frame;

[0010] The lifting mechanism is used for longitudinally moving the movable block;

[0011] The laser cutting mechanism includes a laser and a plurality of laser heads connected by optical fibers. The laser has a beam splitter, and the laser heads are mounted on the transverse support member through connection components for cutting leads.

[0012] In some embodiments of the present invention, a first accommodation cavity and a second accommodation cavity are provided in the longitudinal support member from top to bottom. The first accommodation cavity is communicated with a vacuum pump. The lifting mechanism includes a piston, a piston rod, a transmission ring, and a return spring;

[0013] The piston is slidably fitted in the first accommodation cavity;

[0014] The middle part of the piston rod is inserted into the longitudinal support member, the upper end is connected to the piston, and the lower end is connected to the transmission ring;

[0015] The transmission ring is slidably fitted in the second accommodation cavity, and the movable block is fixed to the transmission ring;

[0016] The return spring is sleeved on the lower part of the piston rod and is used to move the transmission ring downward to reset.

[0017] In some embodiments of the present invention, the transverse support member is hollow, and the first accommodation cavity is communicated with the vacuum pump through the transverse support member.

[0018] In some embodiments of the present invention, the semiconductor lead frame cutting device further includes a gas collecting member. The gas collecting member is sleeved on the transverse support member, and a plurality of suction cups are detachably connected to the bottom of the gas collecting member;

[0019] The vacuum pump, the gas collecting member, and the suction cups are sequentially communicated to form a first gas path;

[0020] An air guide hole is formed in the transverse support member. The air guide hole is located in the gas collecting member. The vacuum pump, the gas collecting member, the air guide hole, the transverse support member, and the first accommodation cavity are sequentially communicated to form a second gas path.

[0021] In some embodiments of the present invention, a dust suction pipe is connected to the transverse support member. The dust suction pipe, the transverse support member, the air guide hole, the gas collecting member, and the vacuum pump are sequentially communicated to form a third gas path.

[0022] In some embodiments of the present invention, the semiconductor lead frame cutting device further includes a dust collector. The dust collector includes a lower housing, an upper housing, a filter screen, and a support;

[0023] The upper housing is detachably connected to the lower housing;

[0024] The lower housing has an air inlet and an air outlet. The air outlet is connected to the vacuum pump, and the air inlet is connected to the gas collecting member;

[0025] The filter screen is inserted into the support, and the support is inserted into the lower housing.

[0026] In some embodiments of the present invention, the connecting component includes a limiting plate fixed to the lateral support member, and the laser head is inserted into the limiting plate; the laser head has a bump, and the limiting plate is used to limit the downward movement of the bump.

[0027] In some embodiments of the present invention, the vacuum pump is installed on the first bracket, and the first bracket does not contact the support mechanism.

[0028] In some embodiments of the present invention, a slag receiving box filled with water is arranged below the movable block. The top of the slag receiving box is provided with a slag receiving port, and the bottom is provided with a slag discharging port. The slag receiving port is located directly below the laser head.

[0029] In some embodiments of the present invention, the semiconductor lead frame cutting device further includes a second bracket, a hydrocyclone and a circulation pump installed on the second bracket;

[0030] The hydrocyclone has an inlet and a liquid phase outlet. The slag discharging port, the inlet, the liquid phase outlet and the circulation pump are connected in sequence, and the circulation pump is connected to the top of the slag receiving box through a return pipe.

[0031] The embodiments of the present invention have at least the following advantages or beneficial effects:

[0032] 1. Instead of using a cutting knife to cut the lead, the present invention uses a laser cutting mechanism to cut the lead, eliminating the need to frequently replace the worn cutting knife and the steps of accurately determining or detecting the degree of tool wear before replacing the cutting knife.

[0033] 2. The laser has a beam splitter that can split the laser generated by the laser to form multiple optical paths. The light beams in each optical path are then irradiated onto the lead through the laser head to cut the lead; the number and layout of the laser heads can be set accordingly according to the number and position of the leads, facilitating the simultaneous cutting of multiple leads to ensure the cutting efficiency.

[0034] 3. The movable block can move longitudinally under the drive of the lifting mechanism. After the cutting operation is completed, simply lower the movable block, and the lead frame will move down with the movable block, while the semiconductor with the lead remains on the chuck, thus separating the semiconductor and the lead frame and facilitating the separate removal of the semiconductor and the lead frame.

[0035] Other features and advantages of the present invention will be described in the subsequent description, and some will become obvious from the description or be understood by implementing the present invention. Description of the Drawings

[0036] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0037] Figure 1 Structural schematic diagram of a semiconductor, a lead frame, and a lead;

[0038] Figure 2 Structural schematic diagram of a semiconductor lead frame cutting device;

[0039] Figure 3 Structural schematic diagram of a bump;

[0040] Figure 4 For Figure 2 Partial structural schematic diagram of the lateral support member along the upper side in;

[0041] Figure 5 Structural schematic diagram of a longitudinal support member;

[0042] Figure 6 For Figure 2 Partial enlarged view of position A in;

[0043] Figure 7 Structural schematic diagram of a dust collector;

[0044] Figure 8 Structural schematic diagram of a hydrocyclone and a circulation pump.

[0045] Icon:

[0046] 111 - Longitudinal support member, 112 - Lateral support member, 113 - Limiting plate, 114 - First accommodation cavity, 115 - Second accommodation cavity, 116 - Air guide hole,

[0047] 121 - Movable block, 122 - Suction cup, 123 - Vacuum pump, 124 - Suction hole, 125 - First bracket,

[0048] 131 - Piston, 132 - Piston rod, 133 - Transmission ring, 134 - Return spring,

[0049] 141 - Optical fiber, 142 - Laser head, 143 - Bump,

[0050] 15 - Gas collecting member, 151 - First seal, 152 - Second seal,

[0051] 16 - Dust suction pipe,

[0052] 17 - Dust collector, 171 - Lower housing, 172 - Upper housing, 173 - Filter screen, 174 - Support, 175 - Third seal, 176 - Air inlet, 177 - Air outlet, 178 - Frame, 179 - Handle

[0053] 18 - Slag receiving box, 181 - Slag receiving port, 182 - Slag discharging port, 183 - Second support, 184 - Hydrocyclone, 185 - Circulation pump, 186 - Inlet, 187 - Liquid phase outlet, 188 - Return pipe, 189 - Make - up water pipe

[0054] 21 - Semiconductor, 22 - Lead, 23 - Lead frame Specific embodiments

[0055] In the following, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the embodiments of the present invention.

[0056] In the description of the embodiments of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "longitudinal", "lateral", "upper", "lower", "top", "bottom", "inner", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the embodiments of the present invention.

[0057] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present invention, "a plurality" means two or more unless otherwise specifically defined.

[0058] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected or indirectly connected through an intermediate medium, and can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0059] The embodiments of the present invention will be described in detail below with reference to the drawings. Embodiment

[0060] Please refer to Figures 1-8, this embodiment provides a semiconductor lead frame cutting device, which mainly includes a support mechanism, a limiting mechanism, a lifting mechanism and a laser cutting mechanism;

[0061] The support mechanism mainly includes a longitudinal support member 111 and a transverse support member 112. Both ends of the transverse support member 112 are connected to the longitudinal support member 111.

[0062] The limiting mechanism mainly includes a movable block 121, a suction cup 122 and a vacuum pump 123. A plurality of suction holes 124 are distributed on the suction cup 122. The suction cup 122 is installed on the transverse support member 112 and communicated with the vacuum pump 123. The suction cup 122 is used to adsorb the upper side of the semiconductor 21; the movable block 121 is located below the suction cup 122, and the movable block 121 is used to support the lead frame 23.

[0063] The lifting mechanism is used to longitudinally move the movable block 121, and the movable block 121 can drive the lead frame 23 to longitudinally move under the drive of the lifting mechanism.

[0064] The laser cutting mechanism mainly includes a laser (not shown in the figure) connected by an optical fiber 141 and a plurality of laser heads 142. The laser has a beam splitter. The laser heads 142 are installed on the transverse support member 112 through a connecting component, and the laser heads 142 are used to cut the leads 22. The laser cutting mechanism is a prior art. The laser has a beam splitter, and the beam splitter can split the laser generated by the laser to form multiple optical paths. The light beams in each optical path are then irradiated onto the leads 22 through the laser heads 142, thereby cutting the leads 22.

[0065] It should be noted that Figure 2 The number and layout of the shown laser heads 142, suction cups 122 and transverse support members 112 are only schematic. The number and layout of the laser heads 142 can be set accordingly according to the number and position of the leads 22, so as to facilitate cutting multiple leads 22 simultaneously to ensure the cutting efficiency; the number and layout of the suction cups 122 can be set accordingly according to the number and position of the semiconductors 21, so as to facilitate adsorbing each semiconductor 21 through the suction cups 122; the number and layout of the transverse support members 112 can be set accordingly according to the number and layout of the laser heads 142, so as to facilitate supporting each laser head 142.

[0066] In use, the lead frame 23 to be cut can be first placed on the movable block 121. The lead frame 23 is lifted by the movable block 121, and then the movable block 121 and the lead frame 23 are moved upward so that the semiconductor 21 on the lead frame 23 contacts the suction cup 122, thereby fixing the lead frame 23 and the semiconductor 21. Subsequently, the laser can be irradiated onto the lead 22 through each laser head 142 to cut the lead 22. After the cutting operation is completed, only by moving the movable block 121 downward, the lead frame 23 will move downward with the movable block 121, while the semiconductor 21 with the lead 22 still remains on the suction cup 122, thereby separating the semiconductor 21 and the lead frame 23, which is convenient for separately taking away the semiconductor 21 and the lead frame 23.

[0067] Since the semiconductor 21 and the lead frame 23 are separated in the vertical direction after the movable block 121 moves downward, a tool such as a tray can be inserted between the semiconductor 21 and the lead frame 23. After the vacuum pump 123 stops working, the semiconductor 21 can fall onto the tray and be transferred to a designated location with the tray. The lead frame 23 located on the movable block 121 can be grabbed by a corresponding grabbing device.

[0068] The above generally describes the main components and the operating principle of the semiconductor lead frame cutting device. The following will elaborate on the semiconductor lead frame cutting device in more detail.

[0069] In this embodiment, in order to facilitate the disassembly and assembly of the laser head 142 on the horizontal support member 112, preferably, the connection assembly mainly includes a limit plate 113 fixed to the horizontal support member 112, and the laser head 142 is inserted into the limit plate 113. The laser head 142 has a convex block 143, and the limit plate 113 is used to limit the downward movement of the convex block 143. More specifically, the limit plate 113 and the convex block 143 are connected by bolts to improve the stability of the laser head 142 after installation.

[0070] A first accommodation cavity 114 and a second accommodation cavity 115 are provided in the longitudinal support member 111 from top to bottom. The first accommodation cavity 114 communicates with the vacuum pump 123. The lifting mechanism mainly includes a piston 131, a piston rod 131, a transmission ring 133 and a return spring 134. The piston 131 is slidably fitted in the first accommodation cavity 114. The middle part of the piston rod 131 is inserted into the longitudinal support member 111. The upper end of the piston rod 131 is connected to the piston 131, and the lower end of the piston rod 131 is connected to the transmission ring 133. The transmission ring 133 is slidably fitted in the second accommodation cavity 115, and the movable block 121 is fixed to the transmission ring 133. The return spring 134 is sleeved on the lower part of the piston rod 131, and the return spring 134 is used to move the transmission ring 133 downward to reset. When the vacuum pump 123 works, under the action of negative pressure, the piston 131 can drive the transmission ring 133 and the movable block 121 to move upward through the piston rod 131, and the movable block 121 can drive the lead frame 23 to move upward, so that the upper side of the semiconductor 21 contacts the chuck 122, which is convenient for fixing the semiconductor 21 and the lead frame 23 and facilitating the subsequent cutting of the lead 22. After the vacuum pump 123 stops working, the transmission ring 133 can drive the movable block 121 to move downward and reset under the action of the return spring 134.

[0071] Specifically, the transverse support member 112 is hollow, and the first accommodation cavity 114 communicates with the vacuum pump 123 through the transverse support member 112. More specifically, the semiconductor lead frame cutting device may further include a gas collecting member 15. The gas collecting member 15 is sleeved on the transverse support member 112, and a first sealing member 151 is provided between the transverse support member 112 and the gas collecting member 15. A plurality of chucks 122 are connected to the bottom of the gas collecting member 15 by bolts, and a second sealing member 152 is provided between the chuck 122 and the gas collecting member 15. The vacuum pump 123, the gas collecting member 15 and the chuck 122 are connected in sequence to form a first gas path. A gas guiding hole 116 is provided on the transverse support member 112, and the gas guiding hole 116 is located in the gas collecting member 15. The vacuum pump 123, the gas collecting member 15, the gas guiding hole 116, the transverse support member 112 and the first accommodation cavity 114 are connected in sequence to form a second gas path. Through the setting of the first gas path, it is convenient to adsorb the semiconductor 21 through the chuck 122. Through the setting of the second gas path, it is convenient to drive the movable block 121 to move upward through the vacuum pump 123.

[0072] A dust suction pipe 16 is connected to the transverse support member 112. The dust suction pipe 16, the transverse support member 112, the gas guiding hole 116, the gas collecting member 15 and the vacuum pump 123 are connected in sequence to form a third gas path. Through the setting of the third gas path, the fumes generated during the laser cutting of the lead 22 can be sucked away to ensure the production environment of the workshop.

[0073] To increase the service life of the vacuum pump 123, the semiconductor lead frame cutting device may further include a dust collector 17 for filtering large particulate matter in the flue gas. Specifically, the dust collector 17 mainly includes a lower housing 171, an upper housing 172, a filter screen 173, and a support 174; the upper housing 172 is detachably connected to the lower housing 171 by bolts, and a third seal 175 is provided at the connection between the upper housing 172 and the lower housing 171; the lower housing 171 has an air inlet 176 and an air outlet 177, the air outlet 177 is connected to the vacuum pump 123, and the air inlet 176 is connected to the gas collecting member 15; the filter screen 173 is inserted into the support 174, and the support 174 is inserted into the lower housing 171. After removing the upper housing 172 from the lower housing 171, the corresponding filter screen 173 can be replaced separately as needed, or the support 174 and all the filter screens 173 can be taken out of the lower housing 171 together, thus facilitating the overall replacement of all the filter screens 173.

[0074] More specifically, a frame 178 is fixed at the edge of the filter screen 173, and the frame 178 is inserted into the support 174. The support 174 has a lifting lug 179, and the setting of the lifting lug 179 facilitates the movement of the support 174.

[0075] In this embodiment, preferably, the vacuum pump 123 is installed on the first bracket 125, and the first bracket 125 does not contact the support mechanism to avoid the vibration generated during the operation of the vacuum pump 123 from having an adverse effect on the operation of the laser, thereby ensuring the cutting quality.

[0076] A slag receiving box 18 filled with water is provided below the movable block 121. The top of the slag receiving box 18 is provided with a slag receiving port 181, and the bottom is provided with a slag discharging port 182. The slag receiving port 181 is located directly below the laser head 142. When the lead 22 is laser-cut, the molten slag generated at the cut of the lead 22 can fall into the slag receiving box 18 filled with water to facilitate the collection and cooling of the molten slag, thus facilitating the subsequent treatment of the molten slag.

[0077] In order to separate the slag from water, the semiconductor lead frame cutting device may further include a second support 183, a hydrocyclone 184 mounted on the second support 183, and a circulation pump 185; the second support 183 is not in contact with the support mechanism. The hydrocyclone 184 is an existing solid-liquid separation device. The hydrocyclone 184 has an inlet 186 and a liquid phase outlet 187. The slag discharge port 182, the inlet 186, the liquid phase outlet 187, and the circulation pump 185 are connected in sequence. The circulation pump 185 is connected to the top of the slag receiving box 18 through a return pipe 188; a water supply pipe 189 may also be connected to the return pipe 188 to facilitate the replenishment of water into the slag receiving box 18. After the water containing slag enters the hydrocyclone 184, the slag is discharged from the solid phase outlet at the bottom of the hydrocyclone 184, and the water separated from the slag enters the circulation pump 185 from the liquid phase outlet 187. There are fewer impurities entering the circulation pump 185, and the service life of the circulation pump 185 is longer.

[0078] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Without conflict, the embodiments of the present application and the features in the embodiments can be arbitrarily combined with each other. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor lead frame cutting device, characterized in that, It includes a support mechanism, a limit mechanism, a lifting mechanism, and a laser cutting mechanism; The support mechanism includes a longitudinal support member and a transverse support member, and both ends of the transverse support member are connected to the longitudinal support member; The limit mechanism includes a movable block, a suction cup, and a vacuum pump. The suction cup is installed on the transverse support member and is communicated with the vacuum pump. The suction cup is used to adsorb the upper side of the semiconductor; the movable block is located below the suction cup and is used to hold up the lead frame; The lifting mechanism is used to longitudinally move the movable block; The laser cutting mechanism includes a laser and a plurality of laser heads connected by optical fibers. The laser has a beam splitter. The laser heads are installed on the transverse support member through a connecting component and are used to cut leads; A first accommodation cavity and a second accommodation cavity are provided in the longitudinal support member from top to bottom. The first accommodation cavity is communicated with the vacuum pump. The lifting mechanism includes a piston, a piston rod, a transmission ring, and a return spring; The piston is slidably fitted in the first accommodation cavity; The middle part of the piston rod is inserted into the longitudinal support member, the upper end is connected to the piston, and the lower end is connected to the transmission ring; The transmission ring is slidably fitted in the second accommodation cavity, and the movable block is fixed to the transmission ring; The return spring is sleeved on the lower part of the piston rod and is used to move the transmission ring downward to reset; 2. The semiconductor lead frame cutting device according to claim 1, characterized in that, The transverse support member is hollow, and the first accommodation cavity is communicated with the vacuum pump through the transverse support member; 3. The semiconductor lead frame cutting device according to claim 2, wherein The semiconductor lead frame cutting device further includes a gas collecting member. The gas collecting member is sleeved on the transverse support member, and a plurality of the suction cups are detachably connected to the bottom of the gas collecting member; The vacuum pump, the gas collecting member, and the suction cups are sequentially communicated to form a first gas path; A gas guiding hole is provided on the transverse support member. The gas guiding hole is located in the gas collecting member. The vacuum pump, the gas collecting member, the gas guiding hole, the transverse support member, and the first accommodation cavity are sequentially communicated to form a second gas path; 4. The semiconductor lead frame cutting device according to claim 3, characterized in that, A dust suction pipe is connected to the transverse support member. The dust suction pipe, the transverse support member, the gas guiding hole, the gas collecting member, and the vacuum pump are sequentially communicated to form a third gas path; 5. The semiconductor lead frame cutting device according to claim 4, wherein, The semiconductor lead frame cutting device further includes a dust collector. The dust collector includes a lower housing, an upper housing, a filter screen, and a support; The upper housing is detachably connected to the lower housing; The lower housing has an air inlet and an air outlet. The air outlet is connected to the vacuum pump, and the air inlet is connected to the gas collecting member; The filter screen is inserted into the support, and the support is inserted into the lower housing; 6. The semiconductor lead frame cutting device according to claim 1, characterized in that, The connecting component includes a limiting plate fixed to the transverse support member. The laser head is inserted into the limiting plate; a convex block is provided on the laser head, and the limiting plate is used to limit the downward movement of the convex block; 7. The semiconductor lead frame cutting device according to claim 1, characterized in that, The vacuum pump is installed on a first bracket, and the first bracket does not contact the support mechanism; 8. The semiconductor lead frame cutting device according to any one of claims 1-7, characterized in that A slag receiving box filled with water is provided below the movable block. The top of the slag receiving box is provided with a slag receiving port, and the bottom is provided with a slag discharging port. The slag receiving port is located directly below the laser head.

9. The semiconductor lead frame cutting device according to claim 8, wherein the semiconductor lead frame cutting device further comprises a second bracket, a hydrocyclone and a circulation pump mounted on the second bracket; the hydrocyclone has an inlet and a liquid phase outlet, the slag discharge port, the inlet, the liquid phase outlet and the circulation pump are communicated in sequence, and the circulation pump is communicated with the top of the slag receiving box through a return pipe.

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