Substrate alignment device, substrate processing device, substrate alignment method, and substrate processing method

Abstract

The present invention relates to a substrate alignment device, a substrate processing device, a substrate alignment method, and a substrate processing method. The substrate alignment device includes a first support member and a second support member that are arranged to face each other and spaced apart in a plan view, and each supports the outer peripheral end of the substrate from a position below the substrate. In addition, the substrate alignment device includes a first pressing member that is arranged to face the first support member in a plan view, and when the substrate is supported by the first and second support members, presses a portion of the outer peripheral end of the substrate in a first direction from the second support member toward the first support member, thereby moving the substrate. The first support member includes a movement limiting portion that limits the substrate from moving in the first direction beyond a predetermined specified position.

Description

Technical Field

[0001] The present invention relates to a substrate alignment device, a substrate processing device, a substrate alignment method and a substrate processing method. Background Art

[0002] Substrate processing equipment is used to process various substrates, including those used in liquid crystal displays (LCDs) and organic EL (Electro Luminescence) displays, FPD (Flat Panel Display) substrates, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, and solar cell substrates. Substrate cleaning equipment is also used to clean substrates.

[0003] For example, the substrate cleaning device described in Japanese Patent Gazette No. 5904169 includes: two adsorption pads that hold the peripheral portion of the back side of the wafer; a rotating chuck that holds the central portion of the back side of the wafer; and a brush that cleans the back side of the wafer. The two adsorption pads hold the wafer and move it laterally. In the described state, the central portion of the back side of the wafer is cleaned by the brush. Thereafter, the rotating chuck receives the wafer from the adsorption pads, and the rotating chuck holds the central portion of the back side of the wafer and rotates around a vertical axis (rotation axis). In the described state, the peripheral portion of the back side of the wafer is cleaned by the brush. Summary of the Invention

[0004] In the substrate cleaning device, if the wafer is not accurately aligned when it is transferred from the adsorption pad to the rotary chuck, the wafer is adsorbed and held by the rotary chuck in a state where the center of the wafer deviates from the rotation axis. In this case, the substrate rotates in an eccentric state when the rotary chuck rotates. As a result, the airflow around the rotating substrate becomes turbulent. In addition, the contact state of the brush relative to the back peripheral portion of the wafer changes according to the rotation angle of the wafer. In this case, it is difficult to uniformly clean the back peripheral portion of the wafer. Therefore, when placing the wafer on the rotary chuck, it is necessary to position the wafer on the rotary chuck with higher precision.

[0005] An object of the present invention is to provide a substrate alignment device, a substrate processing device, a substrate alignment method and a substrate processing method that can accurately position a substrate at a predetermined position with high precision.

[0006] (1) According to one aspect of the present invention, a substrate alignment device is a substrate alignment device for aligning a substrate, comprising: a first and a second supporting member, which are arranged in a manner opposite to each other and separated in a plan view, and respectively support the outer peripheral end portion of the substrate from a position below the substrate; a first pressing member, which is arranged in a manner opposite to the first supporting member in a plan view, and presses a part of the outer peripheral end portion of the substrate in a first direction from the second supporting member toward the first supporting member when the substrate is supported by the first and second supporting members, thereby moving the substrate on the first and second supporting members; and a first pressing drive portion, which drives the first pressing member; and the first supporting member includes a movement limiting portion for limiting the substrate from moving in the first direction beyond a predetermined specified position.

[0007] In the substrate alignment apparatus, the outer peripheral edge of the substrate is supported from below by first and second supporting members. In this state, the first pressing member presses the substrate in the first direction. As a result, the substrate moves in the first direction on the first and second supporting members. At this time, the movement of the substrate is restricted by the movement restricting member to prevent it from exceeding a predetermined position.

[0008] As a result, by appropriately determining the predetermined position according to the size of the substrate, the substrate supported by the first and second supporting members can be accurately positioned at the predetermined position with high precision.

[0009] (2) The first support member may have a first inclined support surface capable of supporting the outer peripheral end of the substrate and extending obliquely downward toward the second support member, and the second support member may have a second inclined support surface capable of supporting the outer peripheral end of the substrate and extending obliquely downward toward the first support member.

[0010] In this case, when the substrate is supported on the first and second supporting members, the contact area between the first and second supporting members and the substrate can be reduced, thereby reducing the transfer of contaminants and the deterioration of the substrate cleanliness.

[0011] (3) Each of the first and second supporting members may be configured to be movable in a direction parallel to the first direction, and the substrate aligning apparatus may further include: a first supporting driving unit for driving the first supporting member; and a second supporting driving unit for driving the second supporting member.

[0012] In this case, by appropriately adjusting the distance between the first and second supporting members, the substrate supported by the first and second supporting members can be smoothly moved to a position below the first and second supporting members. In addition, since the distance between the first and second supporting members is adjusted according to the size of the substrate, the range of substrate sizes that can be aligned is expanded.

[0013] (4) The substrate alignment device may also include: a second pressing member, which is arranged in a manner opposite to the second supporting member when viewed from above, and presses other parts of the outer peripheral end of the substrate in a second direction opposite to the first direction when the substrate is supported by the first and second supporting members and a part of the substrate is pressed by the first pressing member; and a second pressing drive unit, which drives the second pressing member.

[0014] In this case, since the substrate is firmly fixed between the first pressing member and the second pressing member, a specific process can be appropriately performed on the fixed substrate.

[0015] (5) Each of the first and second pressing members may be configured to be movable in the first and second directions. In this case, by appropriately adjusting the distance between the first and second pressing members, it is possible to easily switch between a state in which the substrate is firmly fixed and a state in which the substrate is loosely fixed. Furthermore, the distance between the first and second pressing members can be adjusted according to the size of the substrate. This expands the range of substrate sizes that can be fixed between the first and second pressing members.

[0016] (6) The second pressing drive unit may drive the second pressing member so that the first pressing member separates from a portion of the substrate before the first pressing member separates from the other portion after the second pressing member presses the other portion of the substrate in the second direction.

[0017] In this case, the second pressing member is separated from the rest of the substrate, so that only the pressing force from the first pressing member acts on the substrate. This allows the substrate to move in the first direction. In this state, the movement limiting portion limits the movement of the substrate to prevent it from exceeding a predetermined position. Therefore, even after the substrate is secured by the first and second pressing members, it can be accurately and easily positioned at a predetermined position with high precision.

[0018] (7) The first pressing member may also include: a first abutting surface in contact with a portion of the substrate; and a first upper end protrusion protruding from the upper end of the first abutting surface toward the first direction; and the second pressing member may include: a second abutting surface in contact with the other portion of the substrate; and a second upper end protrusion protruding from the upper end of the second abutting surface toward the second direction.

[0019] If a portion of the substrate and other portions of the substrate are simultaneously pressed by the first and second pressing members, the substrate may deform. Even in this case, a portion of the substrate is held between the second support member and the first upper protrusion of the first pressing member. Furthermore, the remaining portion of the substrate is held between the first support member and the second upper protrusion of the second pressing member. This prevents the substrate from being dislodged from between the first and second pressing members.

[0020] (8) A substrate processing apparatus according to another aspect of the present invention includes the substrate positioning apparatus, thereby enabling appropriate processing of the substrate.

[0021] (9) According to another aspect of the present invention, a substrate alignment method is a substrate alignment method for aligning a substrate, which includes the following steps: placing the substrate on first and second support members that are arranged in a manner opposite to each other and separated in a plan view, and using the first and second support members to support the outer peripheral end of the substrate from a position below the substrate; in a state where the substrate is supported by the first and second support members, using a first pressing member that is arranged in a manner opposite to the first support member in a plan view to press a part of the outer peripheral end of the substrate in a first direction from the second support member toward the first support member, thereby moving the substrate on the first and second support members; and when the substrate moves on the first and second support members, limiting the movement of the substrate in the first direction beyond a predetermined specified position by a movement limiting portion provided on the first support member.

[0022] In the substrate alignment method, the outer peripheral edge of the substrate is supported from below by first and second supporting members. In this state, the first pressing member presses the substrate in the first direction. As a result, the substrate moves in the first direction on the first and second supporting members. At this time, the movement of the substrate is restricted by a movement restricting portion to prevent it from exceeding a predetermined position.

[0023] As a result, by appropriately determining the predetermined position according to the size of the substrate, the substrate supported by the first and second supporting members can be accurately positioned at the predetermined position with high precision.

[0024] (10) The substrate alignment method may further include the step of moving each of the first and second support members in a direction parallel to the first direction. In this case, by appropriately adjusting the distance between the first and second support members, the substrate supported by the first and second support members can be smoothly moved to a position below the first and second support members. In addition, since the distance between the first and second support members can be adjusted according to the size of the substrate, the size range of substrates that can be aligned is expanded.

[0025] (11) The substrate alignment method may also include the step of: in a state where the substrate is supported by the first and second supporting members and a portion of the substrate is pressed by the first pressing member, using a second pressing member arranged in a manner opposite to the second supporting member in a top view to press other portions of the outer peripheral end portion of the substrate in a second direction opposite to the first direction.

[0026] In this case, since the substrate is firmly fixed between the first pressing member and the second pressing member, a specific process can be appropriately performed on the fixed substrate.

[0027] (12) The substrate alignment method may further include the step of moving each of the first and second pressing members in the first direction and the second direction.

[0028] In this case, by appropriately adjusting the distance between the first and second pressing members, it is possible to easily switch between a state where the substrate is firmly fixed and a state where the substrate is loosely fixed. Furthermore, the spacing between the first and second pressing members can be adjusted according to the size of the substrate. This expands the range of substrate sizes that can be fixed between the first and second pressing members.

[0029] (13) The substrate alignment method may further include the step of separating the second pressing member from the other portion after the second pressing member presses the other portion of the substrate in the second direction and before the first pressing member separates from the portion of the substrate.

[0030] In this case, the second pressing member is separated from the rest of the substrate, so that only the pressing force from the first pressing member acts on the substrate. This allows the substrate to move in the first direction. In this state, the movement limiting portion limits the movement of the substrate to prevent it from exceeding a predetermined position. Therefore, even after the substrate is secured by the first and second pressing members, it can be accurately and easily positioned at a predetermined position with high precision.

[0031] (14) According to another aspect of the present invention, a substrate processing method includes the above-described substrate alignment method, thereby enabling appropriate processing of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic plan view of a substrate cleaning apparatus according to one embodiment of the present invention.

[0033] Figure 2 Yes Figure 1 A three-dimensional appearance diagram of the internal structure of the substrate cleaning device.

[0034] Figure 3 yes Figure 1 and Figure 2 A three-dimensional view of the lower chuck.

[0035] Figure 4 yes Figure 1 and Figure 2 A three-dimensional view of the upper chuck.

[0036] Figure 5 This is a block diagram showing the configuration of a control system of the substrate cleaning apparatus.

[0037] Figure 6 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0038] Figure 7 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0039] Figure 8 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0040] Figure 9 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0041] Figure 10 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0042] Figure 11 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0043] Figure 12 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0044] Figure 13 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0045] Figure 14 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0046] Figure 15 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0047] Figure 16 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0048] Figure 17 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device.

[0049] Figure 18 It is a schematic side view for explaining the details of the holding operation and releasing operation of the substrate by the upper holding device.

[0050] Figure 19 It is a schematic side view for explaining the details of the holding operation and releasing operation of the substrate by the upper holding device. DETAILED DESCRIPTION

[0051] The following describes a substrate alignment device, substrate processing device, substrate alignment method, and substrate processing method according to an embodiment of the present invention using the accompanying drawings. In the following description, the term "substrate" refers to a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, or a solar cell substrate. Furthermore, at least a portion of the substrate used in this embodiment has a circular outer periphery. For example, the outer periphery of the notch for removing the positioning has a circular shape. Furthermore, in the following description, a substrate cleaning device for cleaning the substrate is described as an example of a substrate processing device equipped with the substrate alignment device of the present invention.

[0052] 1. Structure of substrate cleaning device

[0053] Figure 1 It is a schematic plan view of a substrate cleaning apparatus according to one embodiment of the present invention. Figure 2 Yes Figure 1 The external perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1 of this embodiment, mutually orthogonal X direction, Y direction and Z direction are defined to clarify the positional relationship. Figure 1 and Figure 2 In the specific figures below, arrows are used to indicate the X direction, Y direction, and Z direction as appropriate. The X direction and the Y direction are perpendicular to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

[0054] like Figure 1 As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a transfer device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an end cleaning device 80, and a switch device 90. These components are housed in a unit housing 2. Figure 2 In FIG, the unit frame 2 is indicated by a dotted line.

[0055] The unit frame 2 has a rectangular bottom 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening serves as a loading / unloading port 2x for substrates W, used when loading substrates W into and out of the unit frame 2. Figure 2In the following description, the direction from the inside of the unit frame 2 through the load-in / load-out port 2x toward the outside of the unit frame 2 (the direction from the side wall portion 2c toward the side wall portion 2b) in the Y direction is referred to as the front, and the opposite direction (the direction from the side wall portion 2b toward the side wall portion 2c) is referred to as the rear.

[0056] A switch device 90 is provided in the portion of the side wall 2b where the loading / unloading port 2x is formed and in the vicinity thereof. The switch device 90 includes a shutter 91 configured to open and close the loading / unloading port 2x and a shutter drive 92 for driving the shutter 91. Figure 2 In FIG. 1 , a gate 91 is indicated by a thick two-dot chain line. A gate driver 92 drives the gate 91 so as to open the loading / unloading port 2x when a substrate W is loaded into or unloaded from the substrate cleaning apparatus 1. Furthermore, the gate driver 92 drives the gate 91 so as to close the loading / unloading port 2x when the substrate cleaning apparatus 1 is cleaning the substrate W.

[0057] A pedestal device 30 is provided in the center of the bottom portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails extending in the Y direction from near the side wall 2b to near the side wall 2c in a plan view. The movable pedestal 32 is movable in the Y direction along the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction along the linear guide 31.

[0058] On the movable pedestal 32, the lower holding device 20 and the lower surface cleaning device 50 are arranged in the Y direction. The lower holding device 20 includes a suction holding unit 21 and a suction holding drive unit 22. The suction holding unit 21 is a so-called spin chuck having a circular suction surface capable of suction-holding the lower surface of a substrate W. It is configured to rotate about an axis extending in the vertical direction (the Z-axis). In the following description, when the suction holding unit 21 suction-holds the substrate W, the area of the lower surface of the substrate W that the suction holding unit 21 suctions is to hold is referred to as the lower surface center area. On the other hand, the area of the lower surface of the substrate W surrounding the lower surface center area is referred to as the lower surface outer area.

[0059] The suction and holding drive unit 22 includes a motor. The motor of the suction and holding drive unit 22 is mounted on the movable pedestal 32 with its rotational axis protruding upward. The suction and holding unit 21 is attached to the upper end of the rotational axis of the suction and holding drive unit 22. A suction path is formed along the rotational axis of the suction and holding drive unit 22 for suction-holding the substrate W in the suction and holding unit 21. This suction path is connected to a suction device (not shown). The suction and holding drive unit 22 rotates the suction and holding unit 21 about the rotational axis.

[0060] On the movable pedestal 32, a delivery device 40 is also provided near the lower holding device 20. The delivery device 40 includes a plurality of (three in this example) support pins 41, a pin connecting component 42 and a pin lifting drive unit 43. The pin connecting component 42 is formed in a manner of surrounding the adsorption holding portion 21 when viewed from above, and connects a plurality of support pins 41. The plurality of support pins 41 extend upward from the pin connecting component 42 by a certain length while being connected to each other by the pin connecting component 42. The pin lifting drive unit 43 causes the pin connecting component 42 to be raised and lowered on the movable pedestal 32. As a result, the plurality of support pins 41 are raised and lowered relative to the adsorption holding portion 21.

[0061] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush rotation drive unit 55a, a lower surface brush lifting drive unit 55b, and a lower surface brush moving drive unit 55c. The moving support unit 55 is configured to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. Figure 2 As shown in FIG. 1 , a lifting support portion 54 is provided on the movable support portion 55 so as to be movable. The lifting support portion 54 has an upper surface 54u that is inclined obliquely downward in a direction away from the adsorption holding portion 21 (rearward in this example).

[0062] like Figure 1 As shown, the lower surface brush 51 has a circular shape when viewed from above and is relatively large in this embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the suction surface of the suction holding unit 21, for example, 1.3 times the diameter of the suction surface of the suction holding unit 21. Furthermore, the diameter of the lower surface brush 51 is greater than one-third and less than one-half the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0063] The lower surface brush 51 has a cleaning surface that can contact the lower surface of the substrate W. The lower surface brush 51 is attached to the upper surface 54u of the lifting support portion 54 so that the cleaning surface faces upward and is rotatable about an axis extending in the vertical direction through the center of the cleaning surface.

[0064] Each of the two liquid nozzles 52 is mounted on the upper surface 54u of the lifting support 54 so as to be located near the lower surface brush 51 and to face the liquid ejection port upward. Figure 5 The lower surface cleaning liquid supply unit 56 supplies cleaning liquid to the liquid nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the liquid nozzle 52 ejects the cleaning liquid supplied from the lower surface cleaning liquid supply unit 56 onto the lower surface of the substrate W. In this embodiment, clean water is used as the cleaning liquid supplied to the liquid nozzle 52.

[0065] The gas ejection part 53 is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction. The gas ejection part 53 is mounted on the upper surface 54u of the lifting support part 54 so that it is located between the lower surface brush 51 and the adsorption holding part 21 in a plan view and the gas ejection port faces upward. The ejection gas supply part 57 ( Figure 5 The ejection gas supply unit 57 supplies gas to the gas ejection unit 53. In this embodiment, an inert gas such as nitrogen is used as the gas supplied to the gas ejection unit 53. The gas ejection unit 53 ejects the gas supplied from the ejection gas supply unit 57 onto the lower surface of the substrate W when the lower surface brush 51 is used to clean the substrate W, or when the lower surface of the substrate W is dried, as described later. In this case, a belt-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption and holding unit 21.

[0066] The lower surface brush rotation drive unit 55a includes a motor that rotates the lower surface brush 51 when the substrate W is cleaned by the lower surface brush 51. The lower surface brush lifting drive unit 55b includes a stepping motor or a cylinder that lifts and lowers the lifting support unit 54 relative to the movable support unit 55. The lower surface brush moving drive unit 55c includes a motor that moves the movable support unit 55 along the Y direction on the movable table 32. Here, the position of the lower side holding device 20 of the movable table 32 is fixed. Therefore, when the movable support unit 55 is moved in the Y direction by the lower surface brush moving drive unit 55c, the movable support unit 55 moves relative to the lower side holding device 20. In the following description, the position of the lower surface cleaning device 50 on the movable table 32 when it is closest to the lower side holding device 20 is referred to as the approach position, and the position of the lower surface cleaning device 50 on the movable table 32 when it is farthest from the lower side holding device 20 is referred to as the separation position.

[0067] A cup device 60 is also provided in the center of the bottom portion 2a. The cup device 60 includes a cup 61 and a cup driving portion 62. The cup 61 is provided so as to surround the lower holding device 20 and the pedestal device 30 in a plan view and can be raised and lowered. Figure 2 In the figure, the cup 61 is indicated by a dotted line. The cup driver 62 moves the cup 61 between a lower cup position and an upper cup position depending on which portion of the lower surface of the substrate W is cleaned by the lower surface brush 51. The lower cup position is when the upper end of the cup 61 is located below the substrate W held by the suction and holding unit 21. The upper cup position is when the upper end of the cup 61 is located above the suction and holding unit 21.

[0068] A pair of upper holding devices 10A and 10B are positioned at a height position above the cup 61, facing each other across the stage device 30 when viewed from above. The upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive 13A, and an upper chuck drive 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive 13B, and an upper chuck drive 14B. The upper holding devices 10A and 10B constitute the substrate alignment device of the present invention.

[0069] Figure 3 yes Figure 1 and Figure 2 The appearance of the lower chuck 11A, 11B is a three-dimensional diagram. Figure 3 In FIG, the lower chucks 11A and 11B are indicated by thick solid lines. In addition, the upper chucks 12A and 12B are indicated by dotted lines. Figure 3 In order to easily understand the shape of the lower chucks 11A and 11B, the Figure 2 The enlargement and reduction ratios of each part of the three-dimensional appearance diagram are changed.

[0070] like Figure 3 As shown, the lower chucks 11A and 11B are symmetrically arranged about a vertical plane extending in the Y direction (front-back direction) through the center of the suction holding portion 21 in a plan view, and are arranged to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces 200. Each support piece 200 is provided with an inclined support surface 201 and a movement restriction surface 202.

[0071] In the lower chuck 11A, the inclined support surface 201 of each support piece 200 is formed so as to support the outer peripheral end of the substrate W from below and to extend obliquely downward toward the lower chuck 11B. A movement restriction surface 202 extends upward a certain distance from the upper end of the inclined support surface 201, forming a step at the upper end of the lower chuck 11A. On the other hand, in the lower chuck 11B, the inclined support surface 201 of each support piece 200 is formed so as to support the outer peripheral end of the substrate W from below and to extend obliquely downward toward the lower chuck 11A. The movement restriction surface 202 extends upward a certain distance from the upper end of the inclined support surface 201, forming a step at the upper end of the lower chuck 11B.

[0072] The lower chuck drive units 13A and 13B include air cylinders or electric motors as actuators. The lower chuck drive units 13A and 13B move the lower chucks 11A and 11B so that they approach each other or move away from each other. If the target positions of the lower chucks 11A and 11B in the X direction are predetermined, the lower chuck drive units 13A and 13B can individually adjust the positions of the lower chucks 11A and 11B in the X direction based on this target position information. For example, by making the distance between the lower chucks 11A and 11B smaller than the outer diameter of the substrate W, a substrate W can be placed on the multiple inclined support surfaces 201 of the lower chucks 11A and 11B. In this case, each inclined support surface 201 supports the outer peripheral edge of the substrate W.

[0073] Figure 4 yes Figure 1 and Figure 2 The appearance of the upper chuck 12A, 12B is shown in FIG. Figure 4 In FIG, the upper chucks 12A and 12B are indicated by thick solid lines. In addition, the lower chucks 11A and 11B are indicated by dotted lines. Figure 4 In order to easily understand the shape of the upper chucks 12A and 12B, the Figure 2 The appearance of the three-dimensional diagram changes the expansion and contraction rate of each part.

[0074] like Figure 4 As shown, the upper chucks 12A and 12B, like the lower chucks 11A and 11B, are symmetrically arranged in a plan view about a vertical plane extending in the Y direction (front-back direction) through the center of the suction holding portion 21, and are arranged to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces 300. Each holding piece 300 has an abutment surface 301 and a protrusion 302.

[0075] In the upper chuck 12A, the abutment surface 301 of each retaining piece 300 is formed at the lower front end portion of the retaining piece 300 so as to face the upper chuck 12B and be perpendicular to the X-direction. The protrusion 302 is formed so as to protrude a specific distance from the upper end of the abutment surface 301 toward the upper chuck 12B. On the other hand, in the upper chuck 12B, the abutment surface 301 of each retaining piece 300 is formed at the lower front end portion of the retaining piece 300 so as to face the upper chuck 12A and be perpendicular to the X-direction. The protrusion 302 is formed so as to protrude a specific distance from the upper end of the abutment surface 301 toward the upper chuck 12A.

[0076] The upper chuck driving units 14A and 14B include air cylinders or electric motors as actuators. The upper chuck driving units 14A and 14B move the upper chucks 12A and 12B toward each other or away from each other. If the target positions of the upper chucks 12A and 12B in the X direction are predetermined, the upper chuck driving units 14A and 14B can individually adjust the positions of the upper chucks 12A and 12B in the X direction based on the target position information.

[0077] In the upper holding devices 10A and 10B, the upper chucks 12A and 12B move toward the outer peripheral end of the substrate W supported by the lower chucks 11A and 11B. The two abutting surfaces 301 of the upper chuck 12A and the two abutting surfaces 302 of the upper chuck 12B contact multiple portions of the outer peripheral end of the substrate W, thereby holding the outer peripheral end of the substrate W and firmly securing the substrate W. Details of the operations of the upper holding devices 10A and 10B when holding the substrate W and when releasing the substrate W will be described later.

[0078] like Figure 1 As shown, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotation support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0079] The rotation support shaft 71 is supported on the bottom surface 2a by the upper surface cleaning drive unit 74 in a manner extending in the vertical direction and capable of being raised and lowered and rotated. Figure 2 As shown, the arm 72 is provided at a position above the upper holding device 10B so as to extend horizontally from the upper end of the rotation support shaft 71. A spray nozzle 73 is attached to the front end of the arm 72.

[0080] The spray nozzle 73 is connected to the upper surface cleaning fluid supply unit 75 ( Figure 5 The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, clean water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid supplied from the upper surface cleaning fluid supply unit 75 with the gas to produce a mixed fluid, and then sprays the resulting mixed fluid downward.

[0081] The upper surface cleaning drive unit 74 includes one or more pulse motors and air cylinders, and moves the rotary support shaft 71 upward and downward, and rotates the rotary support shaft 71. With this configuration, the entire upper surface of the substrate W can be cleaned by moving the spray nozzle 73 in an arc shape over the upper surface of the substrate W being held and rotated by the suction holding unit 21.

[0082] like Figure 1 As shown, an end cleaning device 80 is provided on the other side of the cup 61 so as to be located near the upper holding device 10A in a plan view. The end cleaning device 80 includes a rotation support shaft 81, an arm 82, an angled brush 83, and an angled brush driving unit 84.

[0083] The rotation support shaft 81 is supported on the bottom surface portion 2a by the bevel brush driving portion 84 in a manner extending in the vertical direction and capable of being raised and lowered and rotated. Figure 2 As shown, the arm 82 is provided above the upper holding device 10A so as to extend horizontally from the upper end of the rotation support shaft 81. At the front end of the arm 82, an angled brush 83 is provided so as to protrude downward and be rotatable around an axis in the vertical direction.

[0084] The upper half of the bevel brush 83 has an inverted truncated cone shape and the lower half has a truncated cone shape. The bevel brush 83 can clean the outer peripheral edge of the substrate W at the center portion in the vertical direction of the outer peripheral surface.

[0085] The bevel brush drive unit 84 includes one or more pulse motors and air cylinders, and moves the rotary support shaft 81 upward and downward, and rotates the rotary support shaft 81. With this configuration, the entire outer edge of the substrate W can be cleaned by bringing the center portion of the outer peripheral surface of the bevel brush 83 into contact with the outer peripheral edge of the substrate W being sucked and held by the suction and holding unit 21 and rotating.

[0086] Here, the bevel brush drive unit 84 also includes a motor built into the arm 82. This motor rotates the bevel brush 83, located at the tip of the arm 82, about a vertical axis. Therefore, when cleaning the outer edge of the substrate W, the rotation of the bevel brush 83 enhances the cleaning power of the bevel brush 83 at the outer edge of the substrate W.

[0087] Figure 5 It is a block diagram showing the configuration of a control system of the substrate cleaning apparatus 1 . Figure 5 The control device 9 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and a storage device. The RAM serves as the CPU's work area. The ROM stores system programs. The storage device stores control programs.

[0088] like Figure 5 As shown, the control unit 9 includes a chuck control unit 9A, a suction control unit 9B, a stage control unit 9C, a transfer control unit 9D, a lower surface cleaning control unit 9E, a cup control unit 9F, an upper surface cleaning control unit 9G, a bevel cleaning control unit 9H, and a carry-in / out control unit 9I as functional units. The functional units of the control unit 9 are implemented by the CPU executing a substrate cleaning program stored in a storage device on RAM. Some or all of the functional units of the control unit 9 may also be implemented using hardware such as electronic circuits.

[0089] The chuck control unit 9A controls the lower chuck driving units 13A and 13B and the upper chuck driving units 14A and 14B to receive a substrate W loaded into the substrate cleaning apparatus 1 and hold it at a position above the suction holding unit 21. The suction control unit 9B controls the suction holding driving unit 22 to suction-hold the substrate W using the suction holding unit 21 and to rotate the suction-held substrate W.

[0090] The stage control unit 9C controls the stage drive unit 33 to move the movable stage 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holding unit 21.

[0091] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejection gas supply unit 57 to clean the lower surface of the substrate W. The cup control unit 9F controls the cup drive unit 62 to catch the cleaning liquid scattered from the substrate W by the cup 61 when cleaning the substrate W held by the suction holding unit 21.

[0092] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by suction by the suction holding unit 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W held by suction by the suction holding unit 21. The loading and unloading control unit 9I controls the gate drive unit 92 to open and close the loading and unloading port 2x of the unit housing 2 when loading and unloading substrates W into and out of the substrate cleaning apparatus 1.

[0093] 2. Overview of the operation of the substrate cleaning device

[0094] Figures 6 to 17 It is used to illustrate Figure 1 Schematic diagram of the general operation of the substrate cleaning device 1. Figures 6 to 17In each figure, the upper section shows a top view of the substrate cleaning device 1. In addition, the middle section shows a side view of the lower holding device 20 and its peripheral portion viewed along the Y direction, and the lower section shows a side view of the lower holding device 20 and its peripheral portion viewed along the X direction. The side view in the middle section corresponds to Figure 1 The AA line side view of the lower section corresponds to the side view of Figure 1 In addition, in order to facilitate understanding of the shape and operation state of each component of the substrate cleaning device 1, the scaling ratio of some components is different between the top view in the upper section and the side views in the middle section and the lower section. Figures 6 to 17 In FIG, the cup 61 is indicated by a two-dot chain line, and the outer shape of the substrate W is indicated by a thicker one-dot chain line.

[0095] In the initial state before the substrate W is loaded into the substrate cleaning apparatus 1, the gate 91 of the switch device 90 closes the loading / unloading port 2x. Figure 1 As shown, the lower chucks 11A and 11B are maintained at a distance sufficiently greater than the diameter of the substrate W. Furthermore, the upper chucks 12A and 12B are also maintained at a distance sufficiently greater than the diameter of the substrate W. Furthermore, the movable pedestal 32 of the pedestal device 30 is positioned so that the center of the lower adsorption holding portion 21 is located at the center of the cup 61 when viewed from above. The lower surface cleaning device 50 is positioned in a close position on the movable pedestal 32. The lifting support 54 of the lower surface cleaning device 50 positions the cleaning surface (upper end) of the lower surface brush 51 below the adsorption holding portion 21.

[0096] Furthermore, in the transfer device 40, the plurality of support pins 41 are positioned further below the adsorption and holding unit 21. Furthermore, in the cup device 60, the cup 61 is positioned in the lower cup position. In the following description, the center position of the cup 61, as viewed from above, is referred to as the plane reference position rp. Furthermore, the position of the movable pedestal 32 on the bottom surface portion 2a when the center of the lower adsorption and holding unit 21 is positioned at the plane reference position rp, as viewed from above, is referred to as the first horizontal position.

[0097] The substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the gate 91 opens the loading / unloading port 2x immediately before the substrate W is loaded. Figure 6 As shown by the thick solid arrow a1 in FIG, the hand (substrate holding portion) RH of the substrate transport robot (not shown) carries the substrate W into the substantially central position of the unit frame 2 through the carry-in / out port 2x. Figure 6 As shown, it is located between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B.

[0098] Next, if Figure 7As shown by the thicker solid arrow a2, the plurality of support pieces 200 ( Figure 3 ) is positioned below the lower peripheral edge of the substrate W, the lower chucks 11A and 11B approach each other. In this state, the hand RH descends and exits from the loading / unloading port 2x. As a result, the portions of the lower peripheral edge of the substrate W held by the hand RH are supported by the plurality of support pieces 200 ( Figure 3 ) support. After the hand RH is withdrawn, the gate 91 closes the entry and exit 2x. Figure 7 Details of the movement of the lower chucks 11A and 11B.

[0099] Next, if Figure 8 As shown by the thicker solid arrow a3, the plurality of retaining pieces 300 ( Figure 4 ) and the outer peripheral end of the substrate W, the upper chucks 12A and 12B approach each other. Figure 4 ) abut against multiple portions of the outer peripheral end portion of the substrate W, and the substrate W supported by the lower chucks 11A and 11B is also held by the upper chucks 12A and 12B. Figure 8 Details of the action of the upper chucks 12A and 12B.

[0100] In addition, if Figure 8 As shown by the thick solid arrow a4 in the figure, the movable pedestal 32 moves forward from the first horizontal position so that the suction holding portion 21 is offset from the plane reference position rp by a specific distance and the center of the lower surface brush 51 is located at the plane reference position rp. At this time, the position of the movable pedestal 32 on the bottom surface portion 2a is referred to as the second horizontal position.

[0101] Next, if Figure 9 As shown by the thicker solid arrow a5 in FIG, the lifting support portion 54 rises in such a manner that the cleaning surface of the lower surface brush 51 contacts the central area of the lower surface of the substrate W. Figure 9 As shown by the thick solid arrow a6 in the middle, the lower surface brush 51 rotates (spins) around the vertical axis. Thus, the lower surface brush 51 physically removes contaminants adhering to the central area of the lower surface of the substrate W.

[0102] exist Figure 9The lower portion of the figure shows an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W, as shown in the white box. As shown in the white box, while the lower surface brush 51 is in contact with the substrate W, the liquid nozzle 52 and the gas ejection unit 53 are held close to the lower surface of the substrate W. At this time, the liquid nozzle 52 ejects cleaning liquid toward the lower surface of the substrate W near the lower surface brush 51, as indicated by the white arrow a51. Consequently, the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W is directed toward the contact portion between the lower surface brush 51 and the substrate W, thereby flushing away contaminants removed from the back surface of the substrate W by the lower surface brush 51. In this manner, in the lower surface cleaning apparatus 50, the liquid nozzle 52 is mounted on the lifting support 54 together with the lower surface brush 51. This allows for efficient supply of cleaning liquid to the portion of the lower surface of the substrate W being cleaned by the lower surface brush 51. This reduces cleaning liquid consumption and prevents excessive scattering of cleaning liquid.

[0103] Here, the upper surface 54u of the lift support 54 is inclined obliquely downward in a direction away from the adsorption holding portion 21. In this case, when cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lift support 54, the cleaning liquid caught by the upper surface 54u is guided in a direction away from the adsorption holding portion 21.

[0104] When the lower surface of the substrate W is cleaned by the lower surface brush 51, the gas ejection unit 53 is as follows: Figure 9 As indicated by the white arrow a52 in the white box, gas is ejected toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding portion 21. In this embodiment, the gas ejection portion 53 is mounted on the lifting support portion 54 so that the gas ejection port extends in the X direction. In this case, when gas is ejected from the gas ejection portion 53 toward the lower surface of the substrate W, a belt-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding portion 21. This prevents the cleaning liquid containing contaminants from scattering toward the adsorption holding portion 21 when the lower surface brush 51 is used to clean the lower surface of the substrate W. Therefore, when the lower surface brush 51 is used to clean the lower surface of the substrate W, the cleaning liquid containing contaminants is prevented from adhering to the adsorption holding portion 21, thereby keeping the adsorption surface of the adsorption holding portion 21 clean.

[0105] In addition, Figure 9 In the example shown in FIG. 5 , the gas ejection unit 53 ejects gas obliquely upward from the lower surface brush 51 as indicated by the white arrow a52. However, the present invention is not limited to this. The gas ejection unit 53 may also eject gas from the gas ejection unit 53 toward the lower surface of the substrate W in the Z direction.

[0106] Next, in Figure 9When the cleaning of the central area of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lifting support 54 is lowered so that the cleaning surface of the lower surface brush 51 is separated from the substrate W by a specific distance. Furthermore, the spraying of the cleaning liquid from the liquid nozzle 52 toward the substrate W is stopped. At this time, the spraying of gas toward the substrate W from the gas ejection unit 53 continues.

[0107] Afterwards, if Figure 10 As indicated by the thicker solid arrow a7 in the figure, the movable pedestal 32 moves rearward so that the suction holding portion 21 is positioned at the plane reference position rp. In other words, the movable pedestal 32 moves from the second horizontal position to the first horizontal position. At this time, the gas ejection portion 53 continues to eject gas toward the substrate W, gradually drying the central area of the lower surface of the substrate W with the gas curtain.

[0108] Next, if Figure 11 As shown by the thicker solid arrow a8 in the figure, the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is located below the adsorption surface (upper end) of the adsorption holding part 21. Figure 11 As shown by the thicker solid arrow a9, the upper chucks 12A and 12B move away from each other in such a way that the plurality of holding pieces of the upper chucks 12A and 12B separate from the outer peripheral end of the substrate W. At this time, the substrate W is supported by the lower chucks 11A and 11B. Figure 11 Details of the action of the upper chucks 12A and 12B.

[0109] Afterwards, if Figure 11 As shown by the thick solid arrow a10, the pin coupling member 42 rises so that the upper ends of the support pins 41 are slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the support pins 41.

[0110] Next, if Figure 12 As shown by the thick solid arrow a11, the lower chucks 11A and 11B move away from each other. At this point, the lower chucks 11A and 11B move to positions where they do not overlap with the substrate W supported by the support pins 41 when viewed from above. As a result, both upper holding devices 10A and 10B return to their initial positions.

[0111] Next, if Figure 13 As shown by the thicker solid arrow a12 in the figure, the pin-connecting member 42 is lowered so that the upper ends of the plurality of support pins 41 are located further below the adsorption holding member 21. As a result, the substrate W supported on the plurality of support pins 41 is received by the adsorption holding member 21. In this state, the adsorption holding member 21 adsorbs and holds the center area of the lower surface of the substrate W. At the same time as the pin-connecting member 42 is lowered or after the pin-connecting member 42 is lowered, as shown in FIG. Figure 13As shown by the thicker solid arrow a13, the cup 61 rises from the lower cup position to the upper cup position.

[0112] Next, if Figure 14 As shown by the thick solid arrow a14, the suction holding unit 21 rotates around the vertical axis (the axis of rotation of the suction holding drive unit 22). As a result, the substrate W suction-held by the suction holding unit 21 rotates in a horizontal posture.

[0113] Next, the rotation support shaft 71 of the upper surface cleaning device 70 rotates and descends. Figure 14 As shown by the thick solid arrow a15 in FIG. 1 , the spray nozzle 73 moves to a position above the center of the substrate W and is lowered so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of cleaning liquid and gas onto the upper surface of the substrate W. In addition, the rotary support shaft 71 rotates. As a result, Figure 14 As indicated by the thick solid arrow a16, the spray nozzle 73 moves to a position above the rotating substrate W. By spraying the mixed fluid onto the entire upper surface of the substrate W, the entire upper surface of the substrate W is cleaned.

[0114] In addition, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotary support shaft 81 of the end cleaning device 80 is also rotated and lowered. Figure 14 As shown by the thicker solid arrow a17, the bevel brush 83 moves to a position above the outer edge of the substrate W. Furthermore, the center portion of the outer peripheral surface of the bevel brush 83 descends so as to contact the outer edge of the substrate W. In this state, the bevel brush 83 rotates (spins) about its vertical axis. Thus, the bevel brush 83 physically removes contaminants adhering to the outer edge of the substrate W. The contaminants removed from the outer edge of the substrate W are rinsed away by the cleaning fluid of the mixed fluid sprayed onto the substrate W from the spray nozzle 73.

[0115] When the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support 54 is raised so that the cleaning surface of the lower surface brush 51 contacts the outer area of the lower surface of the substrate W. Figure 14 As indicated by the thick solid arrow a18, the lower surface brush 51 rotates (spins) about its vertical axis. Furthermore, the liquid nozzle 52 sprays cleaning liquid onto the lower surface of the substrate W, and the gas ejection unit 53 sprays gas onto the lower surface of the substrate W. Thus, the lower surface brush 51 can clean the entire outer area of the lower surface of the substrate W, which is being held and rotated by the suction and holding unit 21.

[0116] The rotation direction of the lower surface brush 51 may be opposite to the rotation direction of the adsorption holding portion 21. In this case, the outer area of the lower surface of the substrate W can be cleaned more efficiently. Figure 14 As shown by the thick solid arrow a19, the movable support portion 55 can also move forward and backward between the approach position and the separated position on the movable stage 32. Even in this case, the lower surface brush 51 can clean the entire outer area of the lower surface of the substrate W that is sucked and held by the suction holding portion 21 and rotated.

[0117] Next, when the cleaning of the upper surface, the outer peripheral end portion, and the outer region of the lower surface of the substrate W is completed, the spraying of the mixed fluid from the spray nozzle 73 toward the substrate W is stopped. Figure 15 As shown by the thicker solid arrow a20, the spray nozzle 73 moves to the position on one side of the cup 61 (the position of the initial state). Figure 15 As indicated by the thicker solid arrow a21, the angled brush 83 moves to the position on the other side of the cup 61 (the initial position). Furthermore, the rotation of the lower surface brush 51 is stopped, and the lifting support 54 is lowered so that the cleaning surface of the lower surface brush 51 is separated from the substrate W by a specific distance. Furthermore, the discharge of cleaning liquid from the liquid nozzle 52 to the substrate W and the injection of gas from the gas ejector 53 to the substrate W are stopped. In this state, the high-speed rotation of the suction and holding unit 21 shakes off the cleaning liquid adhering to the substrate W, drying the entire substrate W.

[0118] Next, if Figure 16 As shown by the thicker solid arrow a22, the cup 61 descends from the upper cup position to the lower cup position. Figure 16 As indicated by the thicker solid arrow a23, the lower chucks 11A and 11B approach each other to a position where they can support a new substrate W.

[0119] Finally, the substrate W is unloaded from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the gate 91 opens the loading / unloading port 2x immediately before the substrate W is unloaded. Figure 17 As indicated by the thick solid arrow a24, the hand (substrate holder) RH of the substrate transport robot (not shown) enters the unit housing 2 through the loading / unloading port 2x. Next, the hand RH receives the substrate W from the suction holder 21 and exits the loading / unloading port 2x. After the hand RH exits, the gate 91 closes the loading / unloading port 2x.

[0120] 3. Details of the Operation of the Upper Holding Devices 10A and 10B

[0121] In the above series of general actions, it is desired that the substrate W before being transferred from the upper holding device 10A, 10B to the adsorption holding part 21 is positioned in such a manner that the center of the substrate W overlaps with the rotation axis of the adsorption holding part 21 (the rotation axis of the adsorption holding drive part 22) when viewed from above. In the above case, when the transfer device 40 transfers the substrate W from the upper holding device 10A, 10B to the lower holding device 20, the center of the substrate W can be accurately and appropriately positioned on the rotation axis of the adsorption holding part 21. Therefore, in this embodiment, the upper holding devices 10A, 10B are based on the above-mentioned method so that the center of the substrate W is positioned on the rotation axis of the adsorption holding part 21 when viewed from above. Figure 5 The following describes the details of the above operation.

[0122] Figure 18 and Figure 19 It is a schematic side view for explaining the details of the holding operation and releasing operation of the substrate W by the upper holding devices 10A and 10B. Figure 18 and Figure 19 Multiple side views and Figure 1 The AA line side view corresponds to the operation state of the upper holding devices 10A and 10B before the substrate W loaded into the substrate cleaning apparatus 1 is transferred to the suction holding portion 21 by the transfer device 40 in a time series.

[0123] exist Figure 18 and Figure 19 In the figure, the lower chucks 11A and 11B of the upper holding devices 10A and 10B are represented by solid lines, and the upper chucks 12A and 12B are represented by dashed lines. Furthermore, the X-direction position of a line extending vertically through the plane reference position rp is represented by the symbol sc. Furthermore, the line extending vertically through the plane reference position rp coincides with a line extending along the rotation axis of the suction holding unit 21 when the movable pedestal 32 is in the first horizontal position.

[0124] Furthermore, when the center wc of the substrate W is located at the plane reference position rp, the position in the X direction at which the outer peripheral end of the substrate W should be supported by the upper holding device 10A is indicated by reference symbol e1. Furthermore, when the center wc of the substrate W is located at the plane reference position rp, the position in the X direction at which the outer peripheral end of the substrate W should be supported by the upper holding device 10B is indicated by reference symbol e2. With the outer peripheral end of the substrate W supported by the upper holding devices 10A and 10B, the positions e1 and e2 are predetermined based on the design dimensions of the various components of the substrate cleaning apparatus 1 and the dimensions of the substrate W so as not to impose an excessive load on the substrate W (so as not to significantly deform the substrate W).

[0125] First, if Figure 18 As shown in the first paragraph of , if the substrate W is loaded into the substrate cleaning device 1, then Figure 6 and Figure 7 Explanation: The lower chucks 11A and 11B are close to each other. Figure 18 As shown in the second paragraph of FIG, the lower chuck 11A moves in the X direction (arrow aa1) so that the movement restriction surface 202 is located at position e1. In other words, the lower chuck 11A moves in the X direction with the target position of the movement restriction surface 202 being position e1. This movement of the lower chuck 11A can be achieved by, for example, performing a teaching operation to actually move the movement restriction surface 202 of the lower chuck 11A to position e1.

[0126] Meanwhile, the lower chuck 11B is moved in the X direction (arrow aa2) such that the movement restriction surface 202 is positioned opposite to position e1 with position e2 as a reference, and the distance between the lower chucks 11A and 11B is smaller than the diameter of the substrate W. Thus, the substrate W is placed on the lower chucks 11A and 11B. Specifically, multiple (in this example, four) inclined support surfaces 201 of the lower chucks 11A and 11B support multiple portions of the outer peripheral end of the substrate W. In this state, the lower chucks 11A and 11B are fixed.

[0127] Then, if Figure 18 As shown in the third section of FIG, the upper chuck 12B moves in the X direction (arrow aa3) so as to approach the upper holding device 10A. Figure 18 As shown in the fourth paragraph of FIG, the upper chuck 12B moves in the X direction until the contact surface 301 is at position e2 (arrow aa4), and then stops. In other words, the upper chuck 12B moves in the X direction with the target position of the contact surface 301 being position e2. This movement of the upper chuck 12B can be achieved by, for example, performing a teaching operation to actually move the contact surface 301 of the upper chuck 12B to position e2.

[0128] During this movement, the abutment surface 301 of the upper chuck 12B presses a portion of the outer peripheral end portion of the substrate W against the inclined support surface 201 of the lower chuck 11B. As a result, the substrate W moves toward the upper holding device 10A.

[0129] When the abutment surface 301 of the upper chuck 12B reaches position e2, that is, when a portion of the outer peripheral end portion of the substrate W reaches position e2, the remaining portion of the outer peripheral end portion of the substrate W abuts against the movement restriction surface 202 of the lower chuck 11A. Thus, the movement of the substrate W is restricted by the movement restriction surface 202 to prevent the remaining portion of the outer peripheral end portion of the substrate W from exceeding position e1. In this state, the center wc of the substrate W is positioned at position sc in the X direction.

[0130] When the substrate W is loaded into the substrate cleaning apparatus 1, a substrate transport robot (not shown) positions the substrate W in the Y direction. Figure 18In the state shown in the fourth section of FIG. 4 , the substrate W is positioned so that the center wc of the substrate W overlaps with the plane reference position rp.

[0131] Here, in Figure 18 Figure 4 and the following description Figure 19 In the side views of the first to third sections, the height position of the portion of substrate W supported by lower chuck 11A is slightly offset from the height position of the portion of substrate W supported by lower chuck 11B. However, this height position difference (offset) is so small that it can be ignored with respect to the diameter of substrate W, and thus has little effect on the positioning accuracy of the center wc of substrate W.

[0132] Thereafter, with the substrate W held between the upper holding devices 10A and 10B, that is, with the substrate W firmly fixed, as shown in FIG. Figure 19 As shown in the first paragraph of FIG, the upper chuck 12A moves in a manner close to the upper holding device 10B (arrow aa5). At this time, the abutment surface 301 of the upper chuck 12A moves to a position closer to the upper holding device 10B than the position e1 and stops. As a result, the substrate W is deformed, and the outer peripheral end of the substrate W is separated from the movement limiting surface 202 of the lower chuck 11A by a small distance. In addition, the substrate W is firmly fixed between the abutment surface 301 of the upper chuck 12A and the abutment surface 301 of the upper chuck 12B. The holding state corresponds to Figure 8 Thus, if you use Figure 9 This demonstrates that the central area of the lower surface of the substrate W can be physically cleaned with an appropriate force.

[0133] Furthermore, when the substrate W is firmly fixed between the abutting surfaces 301 of the upper chuck 12A and 12B, deformation of the substrate W occurs as described above. Even in this case, a portion of the outer peripheral end of the substrate W located on the upper holding device 10B side is held vertically sandwiched between the inclined support surface 201 of the lower chuck 11B and the protrusion 302 of the upper chuck 12B. Furthermore, the remaining portion of the outer peripheral end of the substrate W located on the upper holding device 10A side is held vertically sandwiched between the inclined support surface 201 of the lower chuck 11A and the protrusion 302 of the upper chuck 12A. Consequently, the substrate W is prevented from being dislodged from between the upper chucks 12A and 12B.

[0134] After cleaning the central area of the lower surface of the substrate W, as in the case of Figures 10 to 13As described above, the substrate W held by the upper holding devices 10A and 10B is transferred to the suction holding portion 21 by the transfer device 40. The transfer device 40 moves the substrate W only in the vertical direction by moving the plurality of support pins 41 up and down. Therefore, when the transfer device 40 receives the substrate W from the upper holding devices 10A and 10B, it is desirable to position the substrate W so that its center wc is located at the plane reference position rp.

[0135] Therefore, in this embodiment, when the substrate W is released from the holding state, the upper holding devices 10A and 10B operate so that the center wc of the substrate W is located at the plane reference position rp. Specifically, when the substrate W is released from the holding state of the upper chucks 12A and 12B, as shown in FIG. Figure 19 As shown in the second section of FIG, first, only the upper chuck 12A, which is pressing the remaining portion of the outer peripheral end portion of the substrate W, moves away from the upper holding device 10B in the X direction (arrow aa6). In this case, the pressing force applied by the upper chuck 12A to the substrate W is released, and the remaining portion of the outer peripheral end portion of the substrate W abuts the movement restriction surface 202 of the lower chuck 11A. Meanwhile, a portion of the outer peripheral end portion of the substrate W remains in contact with the abutment surface 301 of the upper chuck 12B. Thus, without a strong pressing force acting on the substrate W, the center wc of the substrate W is positioned at the plane reference position rp.

[0136] Next, if Figure 19 As shown in the third paragraph, the upper chuck 12B, which is in contact with a portion of the outer peripheral end of the substrate W, moves away from the upper holding device 10A in the X direction (arrow aa7). At this time, the center wc of the substrate W is maintained at the plane reference position rp. Figure 11 In this manner, the substrate W is received by the plurality of support pins 41 of the transfer device 40, and the upper holding devices 10A and 10B return to their initial positions. The substrate W received by the plurality of support pins 41 is placed on the suction holding portion 21 with its center wc positioned at the plane reference position rp.

[0137] As described above, in this embodiment, when releasing the substrate W from the holding state of the upper chucks 12A and 12B, the upper chuck 12A moves so that one upper chuck 12A separates from the substrate W before the other upper chuck 12B separates from the substrate W. In this case, when only the upper chuck 12A separates from the substrate W, only the pressing force from the upper chuck 12B acts on a portion of the outer peripheral end of the substrate W. As a result, the substrate W moves toward the upper holding device 10A. In this state, the movement of the substrate W is restricted by the movement restriction surface 202 of the lower chuck 11A to prevent the remaining portion of the outer peripheral end of the substrate W from exceeding position e1. Therefore, even after the substrate W is secured by the upper chucks 12A and 12B, it can be accurately and easily secured at a predetermined position with high precision.

[0138] 4. Effect

[0139] (1) In the substrate cleaning apparatus 1, when a substrate W is loaded by a substrate transport robot (not shown), the outer peripheral edge of the loaded substrate W is supported from below by the support pieces 200 of the lower chucks 11A and 11B. In this state, the lower chuck 11B presses a portion of the outer peripheral edge of the substrate W toward the upper holding device 10A. This causes the substrate W to move on the lower chucks 11A and 11B. At this time, the movement of the substrate W is restricted by the movement restriction surface 202 of the lower chuck 11A to prevent the remaining portion of the outer peripheral edge of the substrate W from exceeding a predetermined position e1.

[0140] As a result, by appropriately determining the positions e1 and e2 according to the size of the substrate W, the substrate W supported by the lower chucks 11A and 11B can be accurately positioned at a predetermined position with high precision.

[0141] (2) As described above, the support plates 200 of the lower chucks 11A and 11B are provided with a plurality of inclined support surfaces 201. Each inclined support surface 201 is formed so as to support the outer peripheral edge of the substrate W and to extend obliquely downward toward the substrate W being supported. In this manner, when the substrate W is supported on the lower chucks 11A and 11B, the contact area between the inclined support surfaces 201 of the lower chucks 11A and 11B and the substrate W can be reduced. This reduces the transfer of contaminants and the degradation of the cleanliness of the substrate W.

[0142] (3) Each of the lower chucks 11A and 11B is configured to be movable in a direction parallel to the X-direction. Therefore, by appropriately adjusting the distance between the lower chucks 11A and 11B, the substrate W supported by the lower chucks 11A and 11B can be smoothly moved to a position below the upper holding devices 10A and 10B. Furthermore, because the distance between the lower chucks 11A and 11B can be adjusted according to the size of the substrate W, the range of substrate W sizes that can be aligned is expanded.

[0143] (4) Each of the upper chucks 12A and 12B is configured to be movable in a direction parallel to the X-direction. Therefore, by appropriately adjusting the distance between the upper chucks 12A and 12B, it is possible to easily switch between a state in which the substrate W is firmly fixed and a state in which the substrate W is loosely fixed. Furthermore, the distance between the upper chucks 12A and 12B can be adjusted according to the size of the substrate W. This increases the range of substrate sizes that can be fixed between the upper chucks 12A and 12B.

[0144] 5. Other Implementation Methods

[0145] (1) In the above embodiment, the substrate W is positioned relative to the adsorption holding portion 21 while being sandwiched between the movement restriction surface 202 of the lower chuck 11A and the contact surface 301 of the upper chuck 12B. However, the present invention is not limited to this.

[0146] Instead of the movement restriction surface 202 of the lower chuck 11A and the abutment surface 301 of the upper chuck 12B, the substrate W may be positioned while being sandwiched between the movement restriction surface 202 of the lower chuck 11B and the abutment surface 301 of the upper chuck 12A. Figure 18 and Figure 19 For example, the upper holding devices 10A and 10B perform a reverse operation in the X direction. Figure 18 and Figure 19 Similarly to the example, by appropriately determining the positions e1 and e2 according to the size of the substrate W, the substrate W supported by the lower chucks 11A and 11B can be accurately positioned at a predetermined position with high precision.

[0147] (2) In the above embodiment, the support pieces 200 of the lower chucks 11A and 11B are provided with inclined support surfaces 201. However, the present invention is not limited to this example. Instead of the inclined support surfaces 201, the support pieces 200 may be provided with flat support surfaces parallel to the XY plane. In this case, the lower surface of the substrate W is in surface contact with the support surface, thus providing a stable support state for the substrate W.

[0148] (3) The upper holding devices 10A and 10B may be configured to allow the lower chucks 11A and 11B and the upper chucks 12A and 12B to move in the vertical direction. In this case, the upper holding devices 10A and 10B may replace the transfer device 40 to transfer the substrate W supported by the lower chucks 11A and 11B to the suction holding portion 21.

[0149] Alternatively, the lower chucks 11A and 11B of the upper holding devices 10A and 10B may receive the substrate W adsorbed and held on the adsorption holding portion 21 and hold the received substrate W at a position above the adsorption holding portion 21 .

[0150] (4) In the substrate cleaning apparatus 1 of the embodiment, as Figures 6 to 17 As shown, although at least a portion of the lower chucks 11A, 11B and the upper chucks 12A, 12B of the upper holding devices 10A, 10B substantially overlaps the cup 61 in a plan view, the present invention is not limited to this configuration. Each of the lower chucks 11A, 11B and the upper chucks 12A, 12B may be configured to be movable in the X direction to a position separated from the cup 61 in a plan view. In this case, the lower chucks 11A, 11B and the upper chucks 12A, 12B may also be configured to be movable in the vertical direction.

[0151] (5) In the above embodiment, the upper holding devices 10A and 10B transfer the substrate W positioned relative to the suction holding unit 21 to the suction holding unit 21. However, the present invention is not limited to this embodiment. For example, assume that a substrate transfer robot (not shown) inserts its hands into the substrate cleaning apparatus 1 to receive the substrate W held by the upper holding devices 10A and 10B and transfer the received substrate W. In this case, the position where the hands receive the substrate W can be predetermined, and the upper holding devices 10A and 10B can position the substrate W at the predetermined receiving position. Thus, the received substrate W is placed at the predetermined hand position. Consequently, the transfer accuracy of the substrate W is improved.

[0152] (6) In the above embodiment, after the substrate W positioned by the upper holding devices 10A and 10B is transferred to the adsorption holding unit 21, the substrate W is subjected to a cleaning process. However, the present invention is not limited to this embodiment. After the substrate W positioned by the upper holding devices 10A and 10B is transferred to the adsorption holding unit 21, the substrate W adsorbed and held by the adsorption holding unit 21 may be subjected to an edge rinse process to remove a film provided on the peripheral edge of the substrate W. Alternatively, an edge exposure process may be performed to expose a film provided on the peripheral edge of the substrate W. Even in such a case, the substrate W adsorbed and held by the adsorption holding unit 21 can be subjected to highly precise processing.

[0153] (7) In the above embodiment, the substrate W positioned by the upper holding devices 10A and 10B is transferred to the adsorption holding unit 21. However, the present invention is not limited to this embodiment. Instead of the adsorption holding unit 21, the substrate W positioned by the upper holding devices 10A and 10B may be transferred to a temperature adjustment plate for performing a heating or cooling process on the substrate W. In this case, the substrate W placed on the temperature adjustment plate can be heated or cooled with high precision.

[0154] (8) In the above embodiment, after the central area of the lower surface of the substrate W is cleaned in the upper holding apparatuses 10A and 10B, the outer areas of the lower surface of the substrate W and the lower surface brush 51 are cleaned in the lower holding apparatus 20. However, the embodiment is not limited to this. After the outer areas of the lower surface of the substrate W and the lower surface brush 51 are cleaned in the lower holding apparatus 20, the central area of the lower surface of the substrate W may be cleaned in the upper holding apparatuses 10A and 10B.

[0155] (9) In the above embodiment, the upper surface of the substrate W is cleaned using the spray nozzle 73, but the embodiment is not limited to this. The upper surface of the substrate W may be cleaned using a brush or a rinsing nozzle that sprays a rinsing liquid. Furthermore, the upper surface of the substrate W may not be cleaned. In such a case, the substrate cleaning apparatus 1 does not include the upper surface cleaning apparatus 70. Similarly, the outer peripheral edge of the substrate W may not be cleaned. In such a case, the substrate cleaning apparatus 1 does not include the edge cleaning apparatus 80.

[0156] (10) In the above embodiment, the substrate cleaning apparatus 1 includes the control device 9, but the embodiment is not limited to this. If the substrate cleaning apparatus 1 is configured to be controllable by an external information processing device, the substrate cleaning apparatus 1 may not include the control device 9.

[0157] (11) In the above embodiment, the substrate W is positioned relative to the suction holding portion 21 while being sandwiched between the movement restriction surface 202 of the lower chuck 11A and the contact surface 301 of the upper chuck 12B. However, the present invention is not limited to this embodiment. Instead of the movement restriction surface 202 of the lower chuck 11A and the contact surface 301 of the upper chuck 12B, the substrate W may be positioned relative to the contact surface 301 of the upper chuck 12B and the contact surface 301 of the upper chuck 12A.

[0158] In this case, when loading a substrate W into the upper holding devices 10A and 10B, for example, the lower chucks 11A and 11B are moved in the X direction so that the distance between them is smaller than the diameter of the substrate W. At this time, the movement restriction surfaces 202 of the lower chucks 11A and 11B are adjusted so that they are not located between positions e1 and e2. In this state, the substrate W is placed on the lower chucks 11A and 11B.

[0159] After that, one abutting surface 301 of the upper chuck 12A, 12B moves to position e1. After one abutting surface 301 of the upper chuck 12A, 12B reaches position e1, the other abutting surface 301 of the upper chuck 12A, 12B moves to position e2. Figure 18 and Figure 19Similarly to the example, by appropriately determining the positions e1 and e2 according to the size of the substrate W, the substrate W supported by the lower chucks 11A and 11B can be accurately positioned at a predetermined position with high precision.

[0160] 6. Correspondence between the constituent elements of the claims and the parts of the embodiments

[0161] Hereinafter, although the corresponding examples of the constituent elements of the claims and the constituent elements of the embodiments are described, the present invention is not limited to the following examples. As the constituent elements of the claims, various other elements having the structures or functions described in the claims can also be used.

[0162] In the embodiment, the upper holding devices 10A and 10B are examples of substrate alignment devices, the lower chuck 11A is an example of a first supporting member, the upper chuck 12B is an example of a first pressing member, the upper chuck drive portion 14B is an example of a first pressing drive portion, the position e1 is an example of a prescribed position, and the movement limiting surface 202 is an example of a movement limiting portion.

[0163] In addition, the inclined support surface 201 of the lower chuck 11A is an example of the first inclined support surface, the inclined support surface 201 of the lower chuck 11B is an example of the second inclined support surface, the lower chuck drive part 13A is an example of the first support drive part, the lower chuck drive part 13B is an example of the second support drive part, the upper chuck 12A is an example of the second pressing part, and the upper chuck drive part 14A is an example of the second pressing drive part.

[0164] In addition, the abutment surface 301 of the upper chuck 12B is an example of a first abutment surface, the protrusion 302 of the upper chuck 12B is an example of a first upper end protrusion, the abutment surface 301 of the upper chuck 12A is an example of a second abutment surface, the protrusion 302 of the upper chuck 12A is an example of a second upper end protrusion, and the substrate cleaning device 1 is an example of a substrate processing device.

Claims

1. A substrate alignment device for aligning a substrate, comprising: The first and second supporting members are arranged to face each other and be spaced apart in a plan view, and each supports an outer peripheral end portion of the substrate from a position below the substrate; a first pressing member disposed so as to face the first supporting member in a plan view, and for pressing a portion of an outer peripheral end portion of the substrate in a first direction from the second supporting member toward the first supporting member when the substrate is supported by the first and second supporting members, thereby moving the substrate on the first and second supporting members; a first pressing driving unit for driving the first pressing member; a second pressing member disposed so as to face the second supporting member in a plan view and pressing the other portion of the outer peripheral end portion of the substrate in a second direction opposite to the first direction; a second pressing driving unit for driving the second pressing member; and control unit; and The first supporting member includes a movement limiting portion for limiting movement of the substrate in the first direction beyond a predetermined position. The control unit In a state where the movement limiting portion is located at the predetermined position, the first pressing drive portion is controlled to move the substrate supported by the first and second supporting members in the first direction, and the other portion of the substrate is brought into contact with the movement limiting portion. After the other part of the substrate abuts against the movement limiting part, in a state where the part of the substrate supported by the first and second supporting parts is pressed by the first pressing part, the second pressing part is controlled to press the other part of the outer peripheral end of the substrate in the second direction.

2. The substrate alignment device according to claim 1 , wherein the first supporting member has a first inclined supporting surface capable of supporting an outer peripheral end portion of the substrate and extending obliquely downward toward the second supporting member. The second supporting member has a second inclined supporting surface capable of supporting an outer peripheral end portion of the substrate and extending obliquely downward toward the first supporting member.

3. The substrate alignment device according to claim 1 or 2, wherein each of the first and second supporting members is configured to be movable in a direction parallel to the first direction, The substrate alignment device further comprises: a first support driving unit for driving the first support member; and The second support driving unit drives the second support member. 4 . The substrate aligning device according to claim 1 , wherein each of the first and second pressing members is configured to be movable in the first direction and the second direction.

5. A substrate alignment device according to claim 4, wherein the control unit controls the second pressing drive unit to separate the second pressing component from the other parts of the substrate after the second pressing component presses the other parts of the substrate in the second direction and before the first pressing component is separated from the part of the substrate.

6. The substrate alignment device according to claim 1 or 2, wherein the first pressing member comprises: a first abutting surface in contact with the portion of the substrate; and a first upper end protrusion protruding from the upper end of the first abutting surface toward the first direction; and The second pressing component includes: a second abutting surface in contact with the other portion of the substrate; and The second upper end protrusion protrudes from the upper end of the second contact surface in the second direction. 7 . A substrate processing apparatus comprising the substrate alignment apparatus according to claim 1 .

8. A substrate alignment method, comprising the following steps: The substrate is placed on first and second supporting members that are spaced apart from each other and face each other in a plan view, thereby supporting the outer peripheral end of the substrate from below the substrate using the first and second supporting members, respectively; and In a state where the substrate is supported by the first and second supporting members, a first pressing member disposed so as to face the first supporting member in a plan view presses a portion of an outer peripheral end portion of the substrate in a first direction from the second supporting member toward the first supporting member, thereby moving the substrate on the first and second supporting members; and The first supporting member includes a movement limiting portion, the movement limiting portion limiting the movement of the substrate in the first direction beyond a predetermined position. In the step of moving the substrate, the substrate supported by the first and second supporting members is moved in the first direction with the movement limiting portion located at the predetermined position, and the other portion of the outer peripheral end portion of the substrate is brought into contact with the movement limiting portion. The substrate alignment method further comprises the following steps After the other part of the substrate abuts against the movement limiting portion, in a state where the part of the substrate supported by the first and second supporting parts is pressed by the first pressing part, the second pressing part arranged in a manner opposite to the second supporting part in a plan view presses the other part of the substrate in a second direction opposite to the first direction. 9 . The substrate alignment method according to claim 8 , further comprising the step of moving each of the first and second supporting members in a direction parallel to the first direction. 10 . The substrate alignment method according to claim 8 , further comprising the step of moving each of the first and second pressing members in the first direction and the second direction.

11. The substrate alignment method according to claim 10 further comprises the following steps: after the second pressing component presses the other parts of the substrate in the second direction and before the first pressing component is separated from the part of the substrate, the second pressing component is separated from the other parts.

12. A substrate processing method, comprising the substrate alignment method according to any one of claims 8 to 11.

Images