Liquid cooling medium composition suitable for high temperature environments and use thereof

Abstract

The application discloses a liquid cooling medium composition suitable for high-temperature environment, which comprises: a first component selected from at least one perfluoropolyether, a structural formula of the perfluoropolyether being CF3CF2CF2O(CFCF3CF2O) n CF2CF3, wherein n is an integer of 1-5; and a second component selected from perfluorononane or a perfluoroamine compound, the perfluoroamine compound being selected from at least one of perfluorotripentylamine, perfluorotributylamine or perfluorotripropylamine. The cooling medium composition has excellent heat transfer performance, stability, material compatibility, low dielectric constant, safety and environmental protection, and is especially suitable for cooling of a heating component or electronic equipment in a field with large heat generation and high environmental temperature.

Description

Technical Field

[0001] This invention relates to heat transfer fluids, and more particularly to liquid cooling media compositions employing non-phase change direct contact refrigeration, primarily used for cooling heat-generating components in electronic devices with high heat output and high ambient temperatures. Background Technology

[0002] With the advent of the 5G era of the Internet of Things, the demand for high-performance, high-density computing is accelerating, leading to a significant increase in data center energy consumption and heat generation. This, in turn, presents a major challenge: heat dissipation. Poor heat dissipation not only reduces chip stability but also generates excessive thermal stress due to the temperature difference between the module's internal components and the external environment, affecting the chip's electrical performance, operating frequency, mechanical strength, and reliability. The failure rate of electronic components increases exponentially with operating temperature; for every 10°C increase in the temperature of a single semiconductor component, the system's reliability decreases by 50%.

[0003] Currently, data center cooling methods mainly include natural cooling, air conditioning room cooling, heat pipe cooling, and liquid cooling. However, for high-heat-dissipation equipment such as big data centers and the "power walls" of ultra-dense computing, natural cooling and air conditioning room cooling are far from sufficient to meet heat dissipation requirements. Using liquid coolant to replace air for cooling represents a technological revolution for future data centers. Compared to air cooling, liquid cooling technology transfers more heat, lowers temperatures faster, is quieter, and consumes less energy.

[0004] Currently, common liquid cooling technologies include cold plate liquid cooling, immersion liquid cooling, and air-liquid hybrid cooling. Immersion liquid cooling is a cooling technology that uses liquid as a heat transfer medium, immersing heat-generating components in the liquid and exchanging heat through direct contact. Simply put, liquid cooling uses liquid instead of air to remove heat generated by heat-generating components such as CPUs, memory modules, chipsets, and expansion cards.

[0005] Currently commonly used liquid cooling media include:

[0006] 1) Water: It is inexpensive and readily available, but it is not an insulator and its use is limited. It can only be used for indirect contact liquid cooling and is not suitable for immersion non-phase change liquid cooling systems. Moreover, leakage will cause fatal damage to electronic equipment.

[0007] 2) Mineral oil: It is relatively inexpensive, usually non-toxic, odorless and not volatile, but has high viscosity and poor dielectric properties. Under certain conditions, it poses a risk of combustion. Its main application is non-phase change immersion liquid cooling, and it is not suitable for immersion non-phase change liquid cooling systems.

[0008] 3) Fluorinated fluids: Excellent dielectric properties, low viscosity, safe and environmentally friendly, but relatively expensive. Common fluorinated fluids include perfluoroamines, HFCs, HFEs, and HFOs. Among them, HFCs, HFEs, and HFOs are mostly used in phase change cooling systems or non-phase change cooling systems in low-temperature environments. Perfluoroamines have a relatively low dielectric constant but a high GWP value and poor environmental performance. Summary of the Invention

[0009] To address the aforementioned technical problems, this invention proposes a liquid cooling medium composition that exhibits excellent heat transfer performance, good material compatibility, low dielectric constant, safety, and environmental friendliness, and is particularly suitable for high-temperature environments.

[0010] The objective of this invention is achieved through the following technical solution:

[0011] A liquid cooling medium composition suitable for high-temperature environments, the liquid cooling medium composition comprising:

[0012] The first component is selected from at least one perfluoropolyether, wherein the perfluoropolyether has the structural formula CF3CF2CF2O (CFCF3CF2O). n CF2CF3, where n is an integer from 1 to 5;

[0013] The second component is selected from perfluorononane or perfluoroamine compounds, wherein the perfluoroamine compound is selected from at least one of perfluorotripentylamine, perfluorotributylamine, or perfluorotripropylamine.

[0014] In order to make the liquid cooling medium composition of the present invention more suitable for high-temperature environments with large heat generation and fast heating speed, the mass percentage content of the second component is not higher than 50.0%, and preferably, the mass percentage content of the second component is not higher than 30.0%.

[0015] In one specific embodiment, the liquid cooling medium composition comprises: 50-99% of a first component and 1-50% of a second component.

[0016] In a preferred embodiment, the liquid cooling medium composition comprises 70-95% of a first component and 5-30% of a second component.

[0017] In a more preferred embodiment, the liquid cooling medium composition comprises 70-90% of a first component and 10-30% of a second component.

[0018] More preferably, the first component is selected from CF3CF2CF2O(CFCF3CF2)2OCF2CF3, CF3CF2CF2O(CFCF3CF2)3OCF2CF3, and CF3CF2CF2O(CFCF3CF2)4OCF2CF3, and the second component is selected from perfluorononane or perfluorotributylamine.

[0019] In another specific embodiment, the liquid cooling medium does not contain a second component, but only a first component, and the liquid cooling medium composition is a mixture of two or more of the perfluoropolyethers described above.

[0020] Therefore, under normal temperature and pressure, the liquid cooling medium composition of the present invention has a boiling point ≥160℃ and a dielectric constant <1.9 at a frequency of 1KHz. It is particularly suitable for non-phase change direct contact cooling of electronic components or electronic devices in high-temperature environments. It not only cools quickly and effectively, but also does not affect the transmission of electronic signals at all.

[0021] This invention also proposes an application of a liquid cooling medium composition suitable for high-temperature environments, wherein the liquid cooling medium composition acts as a heat transfer medium for cooling via non-phase-change direct contact. Particularly suitable applications include the cooling of heat-generating components in electronic devices.

[0022] The working environment temperature of the liquid cooling medium composition of the present invention is ≤160℃.

[0023] Particularly suitable is the operating ambient temperature of the liquid cooling medium composition between 130 and 160°C.

[0024] In one specific embodiment, the liquid cooling medium composition is used for cooling electronic devices with high heat generation and high ambient temperature, such as supercomputer processors, communication equipment and base stations, and data centers.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0026] 1. The liquid cooling medium composition of the present invention has good compatibility and chemical stability with metals and non-metals, good dielectric properties and thermal conductivity, has little environmental impact and is non-flammable, and can achieve a good cooling effect through direct contact with electronic heating components or equipment.

[0027] 2. The liquid cooling medium composition of the present invention has a high boiling point range (boiling point > 160°C), and is particularly suitable as a non-phase change working medium for electronic devices with high heating temperatures.

[0028] 3. The liquid cooling medium composition of the present invention does not undergo phase change during use, the system as a whole is relatively stable, and has a long service life.

[0029] 4. The liquid cooling medium composition of the present invention is safe and non-toxic, and will not cause harm to the environment and organisms even if leakage occurs during use. Detailed Implementation

[0030] The present invention will be further described below with reference to specific embodiments, but the invention is not limited to these specific embodiments. Those skilled in the art should recognize that the present invention covers all alternatives, improvements, and equivalents that may be included within the scope of the claims.

[0031] The basic physical properties of the components involved in the liquid cooling medium composition of this invention are shown in Table 1 below:

[0032] Table 1 Basic physical properties of each component in the liquid cooling medium composition

[0033]

[0034]

[0035] The liquid cooling medium compositions of the embodiments and comparative examples of the present invention were prepared as follows: They were mixed in liquid form at room temperature and pressure according to the corresponding mass percentages, and stirred until homogeneous and stable liquid cooling medium was obtained. The sum of the mass percentages of the components in each composition was 100%. The compositions of each embodiment and comparative example are shown in Table 1 below:

[0036] Table 2. Composition of Examples and Comparative Examples

[0037]

[0038] The embodiments described in this invention are K-type perfluoropolyethers, characterized by having multiple trifluoromethyl branches in their molecular structure, while the Y-type perfluoropolyether described in Comparative Example 4 does not have trifluoromethyl branches in its molecular structure.

[0039] The liquid cooling medium compositions of the above embodiments and comparative examples were subjected to physical property tests. Appearance was assessed visually; all compositions were clear and transparent, without suspended matter or sediment. Other physical property test results are shown in Table 3 below.

[0040] Table 3. Results of physical property tests

[0041]

[0042]

[0043] Note: Boiling point in the table is tested using SH / T0089, pour point using SH / T0090, kinematic viscosity using GB / T26588, heat transfer coefficient using ASTMD2717, volume resistivity using GB / T5654, and dielectric constant using GB / T1409.

[0044] The compatibility of the above-mentioned examples and comparative examples with the materials was tested using the ASHRAE 97-2007 method, and the test results of their mass change rate are shown in Table 4 below:

[0045] Table 4. Material compatibility test results

[0046]

[0047] As shown in Tables 3-4 above, Comparative Examples 1 and 2 have poorer dielectric properties compared to Examples 1-7, and perfluoroammonia compounds generally have high GWP values, resulting in insufficient environmental performance. Comparative Example 3 has better dielectric properties, but its boiling point and freezing point do not meet the requirements. Comparative Example 4 is a Y-type perfluoropolyether composition, and its boiling point and dielectric properties do not meet the requirements. The cooling medium compositions of Examples 1-7 have superior dielectric properties and are suitable for cooling electronic devices and heat-generating components with more stringent dielectric constant requirements and higher heating temperatures. Furthermore, they exhibit good compatibility and stability with both metallic and non-metallic materials, and other physical properties also meet the requirements for liquid cooling working fluids, thus having a wider range of applications.

[0048] The cooling capacity of the liquid cooling medium composition was tested using the following method: a 50mm diameter circular metal heater was selected for heating at a constant output power, and the heater was completely immersed in the liquid cooling medium composition described in Examples 5-7. The liquid cooling medium composition was stirred using a magnetic stirrer, and the temperature of the heater and the liquid cooling medium composition was measured at different times.

[0049] The test results of the liquid cooling medium composition in Example 5 are shown in Table 5 below:

[0050] Table 5. Cooling capacity test results of the liquid cooling medium composition in Example 5.

[0051]

[0052] The test results of the liquid cooling medium composition in Example 6 are shown in Table 6 below:

[0053] Table 6. Cooling capacity test results of the liquid cooling medium composition in Example 6.

[0054]

[0055] The test results of the liquid cooling medium composition in Example 7 are shown in Table 7 below:

[0056] Table 7. Cooling capacity test results of the liquid cooling medium composition in Example 7.

[0057]

[0058] A control group was set up. Control group 1 used natural cooling to cool down the heater. The heater temperature was measured, and the results are shown in Table 8 below:

[0059] Table 8 Test results of control group 1

[0060]

[0061] The control group 2 used Comparative Example 2 as the liquid cooling medium, and the test results are shown in Table 9 below:

[0062] Table 9. Test results of control group 2

[0063]

[0064] As can be seen from Tables 5 to 9 above, after using the liquid cooling medium compositions described in Examples 5 to 7, the surface temperature of the heater is significantly reduced, and the temperature rise rate of the heater is also significantly reduced. Compared with other liquid cooling media (such as perfluorotributylamine) and natural cooling methods, the liquid cooling medium compositions of the present invention have superior cooling effect and cooling rate.

Claims

1. A liquid cooling medium composition suitable for use in high temperature environments, characterized in that: The liquid cooling medium composition is composed of a first component and a second component: a first component selected from at least one perfluoropolyether having the formula CF3CF2CF2O(CFCF3CF2O) n CF2CF3, wherein n is an integer from 1 to 5; the mass percentage of the first component is 85%; The second component is selected from perfluoride nonane or perfluoride tributylamine; the mass percentage of the second component is 15%; The working environment temperature of the liquid cooling medium composition is between 130-160℃.

2. The liquid cooling medium composition suitable for high temperature environments according to claim 1, characterized in that: The first component includes a mixture of two or more perfluoride polyethers.

3. The liquid cooling medium composition suitable for high temperature environment according to any one of claims 1-2, characterized in that: The boiling point of the liquid cooling medium composition is ≥160℃ at normal temperature and pressure, and the dielectric constant is <1.9 at a frequency of 1KHz.

4. Use of a liquid cooling medium composition according to any one of claims 1 to 3 for high temperature environments, characterized in that: The liquid cooling medium composition is used as a heat transfer medium to cool in a non-phase change direct contact mode.

5. Use of a liquid cooling medium composition according to claim 4, characterized in that: The liquid cooling medium composition is applied to cooling of heat generating components of electronic equipment.

6. Use of a liquid cooling medium composition according to claim 5, suitable for high temperature environments, characterized in that: The liquid cooling medium composition is applied to cooling of supercomputer processors, communication equipment and base stations, and data centers.

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