Unloading apparatus for pre-treatment wafer carrier and method thereof

Abstract

The present application is a kind of pre-treatment wafer carrier plate unloading device and its method, which is provided with wafer ring unloading mechanism, wafer unloading mechanism, cover unloading mechanism, carrier plate and mechanical arm on the side of a first displacement mechanism; the first displacement mechanism has a first seat body, and the carrier plate is provided with a plurality of combined components fixed by clamps; each combined component is formed by wafer ring, wafer and cover stacked in sequence; the movable end of the mechanical arm is provided with image acquisition component and loading and unloading mechanism; the loading and unloading mechanism is unlocked first, then the combined component to be unloaded is moved from the carrier plate to the first seat body, and then the cover, wafer and wafer ring are sequentially disassembled and recycled by the cover unloading mechanism, wafer unloading mechanism and wafer ring unloading mechanism.

Description

Technical Field

[0001] This invention relates to an unloading device and method for a pre-cast wafer carrier, and more particularly to an unloading device and method that utilizes a simple mechanism and operation to remove assemblies from the carrier and separately disassemble and recover wafer rings, wafers, and covers. Background Technology

[0002] The general integrated circuit (IC) manufacturing process can be divided into three main parts: silicon wafer manufacturing, integrated circuit fabrication, and integrated circuit packaging. After the silicon ingot is cut into wafers, it still needs to go through many complicated processes such as photolithography, crystal growth, etching, and mechanical polishing to complete the fabrication of the integrated circuit. In the above manufacturing process, when the wafer is tested, cleaned, vapor-deposited, dried, or immersed in organic solvents, in order to effectively fix the wafer for processing and to process a large number of wafers at the same time to improve processing efficiency, multiple wafers are usually fixed on a large area carrier. The carrier simultaneously carries each wafer to perform the above-mentioned processing operations.

[0003] A common carrier disk has a basic structure consisting of a large-area convex (or concave) arc-shaped disk. The carrier disk has multiple cutouts for holding wafers, and multiple clamps for fixing wafers are provided around each cutout. When each wafer is fixed by the clamps above the cutout (the outer convex surface of the convex arc or the inner concave surface of the concave arc), the part of the wafer to be processed can be exposed through the cutout. Therefore, multiple wafers can be accommodated and moved to different processing programs at the same time using this carrier disk, which can effectively increase the efficiency of the overall wafer processing.

[0004] As automated machining becomes increasingly widespread, the use of various automated machines to perform wafer placement and removal operations on carriers is an inevitable trend, saving significant manpower, reducing production costs, and improving processing efficiency. However, due to the extreme fragility of wafers and the extremely high precision requirements of processing, not only are there extremely high requirements for the accuracy of wafer placement and removal operations by related transfer mechanisms, but also precise connections between each transfer mechanism when multiple transfer mechanisms are used to perform wafer and related component assembly and disassembly operations. Otherwise, it can easily affect the overall transfer assembly accuracy and finished product quality, and even cause damage to semi-finished products. Therefore, how to effectively calibrate each transfer mechanism to maintain excellent accuracy not only when a single transfer mechanism performs different object transfer operations, but also to form excellent relative activity correlation between different transfer mechanisms to ensure the operational connection accuracy of each transfer mechanism when transferring the same object is a major issue that all related industries urgently need to address. Summary of the Invention

[0005] In view of the above-mentioned application requirements of existing transfer mechanisms for transferring and disassembling assemblies on a carrier disk, the inventors researched and improved upon these requirements, and finally the present invention came into being.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] An unloading device for a pre-cure wafer carrier, characterized in that it comprises:

[0008] A tray has at least one assembly support portion on its surface for supporting an assembly, and a plurality of clamps are provided around the assembly support portion for fixing the assembly within the assembly support portion.

[0009] A first displacement mechanism is connected to and driven by a control module. The first displacement mechanism has a first base that can reciprocate, and an assembly unloading part is provided on the first base.

[0010] A robotic arm is connected to and driven by the control module. The robotic arm has a movable end that can move between the first base and the carrier. A loading and unloading mechanism that can carry and release the assembly is provided on the movable end.

[0011] A cover unloading mechanism is provided next to the first displacement mechanism, connected to and driven by the control module. The cover unloading mechanism has a cover return seat for returning the cover removed from the assembly. A cover transfer component is provided next to the cover return seat. The cover transfer component can carry and release the cover and can move between the cover return seat and the assembly unloading part of the first seat.

[0012] A wafer unloading mechanism is provided next to the first displacement mechanism, connected to and driven by the control module. The wafer unloading mechanism has a wafer return seat for returning the wafer unloaded from the assembly. A wafer transfer assembly is provided next to the wafer return seat. The wafer transfer assembly has a wafer carrier that can support the wafer, and the wafer carrier can be moved between the wafer return seat and the assembly unloading part of the first seat by the wafer transfer assembly.

[0013] A wafer ring unloading mechanism is disposed next to the first displacement mechanism, connected to and driven by the control module. The wafer ring unloading mechanism has a wafer ring return seat for returning the wafer ring unloaded from the assembly. A wafer ring transfer assembly is disposed next to the wafer ring return seat. The wafer ring transfer assembly can carry and release the wafer ring and move between the wafer ring return seat and the assembly unloading part of the first seat.

[0014] The unloading device for the pre-cure wafer carrier includes: an image acquisition component that can acquire images on the movable end of the robotic arm; and a clamping component that can open and close relative to each other to clamp the assembly, a plurality of clamping operation components that correspond to and unlock each clamp, and a plurality of distance measuring elements that can measure distance.

[0015] The unloading device for the pre-cure wafer carrier, wherein: the plurality of ranging elements are laser light sources capable of generating ranging laser beams, and are respectively disposed at at least three points around the loading and unloading mechanism.

[0016] The unloading device for the pre-cure wafer carrier includes: a second displacement mechanism connected to and driven by the control module is provided on the side of the first displacement mechanism; the second displacement mechanism has a second seat that can reciprocate; and a pivot assembly that can support the carrier is provided on the second seat.

[0017] The unloading device for the pre-cure wafer carrier includes: an unloading part of the assembly is a hollow hole, a support seat is provided in the hollow hole, a groove is recessed on the top surface of the support seat, and a plurality of air suction holes are provided on both sides of the groove; a support seat lifting assembly is provided at the bottom of the support seat, which can drive the support seat to lift; and a plurality of air suction holes are provided on the top surface of the wafer carrier.

[0018] The unloading device for the pre-cure wafer carrier includes: a wafer ring lifting assembly located below the wafer ring return holder, which can drive the wafer ring return holder to move up and down; the wafer ring transfer assembly has a liftable wafer ring transfer slide, on which a wafer ring transfer guide rail capable of lateral reciprocating is provided, and on the wafer ring transfer guide rail a clamping assembly capable of clamping the wafer ring; a wafer lifting assembly located below the wafer return holder, which can drive the wafer return holder to move up and down; and a wafer cassette on the wafer return holder capable of accommodating multiple wafers at intervals. The wafer transfer assembly has a plurality of wafer transfer guides parallel to the first guide rail, and a wafer transfer slide disposed on each of the wafer transfer guides and capable of reciprocating. A telescopic component capable of vertical lifting is provided on the wafer transfer slide, and the wafer holder is disposed at the movable end of the telescopic component. A cover lifting assembly is provided below the cover return seat, and the cover lifting assembly can drive the cover return seat to perform lifting and lowering actions. The cover transfer assembly has a cover transfer slide capable of lifting and lowering, and a cover transfer guide rail capable of horizontal reciprocating is provided on the cover transfer slide. A clamping jaw assembly capable of clamping the cover is provided on the cover transfer guide rail.

[0019] The unloading device for the pre-cure wafer carrier includes: a ring protrusion in the center of the cover that can be clamped by the gripper assembly; and the first seat is disposed on a plurality of parallel extending first guide rails.

[0020] A method for unloading a pre-drilled wafer carrier, using the aforementioned unloading device for the pre-drilled wafer carrier, characterized in that it includes:

[0021] The step of "transferring the tray to a transfer operation position" involves setting up an assembly fixed by a plurality of clamps on a tray and transferring the tray to a preset transfer operation position.

[0022] A program called “the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first seat” is driven by the control module to move the loading and unloading mechanism on the robotic arm to the assembly to be unloaded on the tray to a preset assembly unloading part on the first seat.

[0023] In the "cover unloading mechanism moves and recycles the cover" step, the control module drives the cover unloading mechanism to approach the top of the assembly unloading part of the first seat and moves the top cover of the assembly to be unloaded to the cover return seat.

[0024] In the step of "wafer unloading mechanism moving and recycling the wafer", the control module drives the wafer unloading mechanism to move the wafer carrier of the wafer transfer assembly and place the wafer on the wafer return seat;

[0025] In the step of "wafer ring unloading mechanism moving and recycling the wafer ring", the control module drives the wafer ring unloading mechanism to approach the assembly unloading part of the first base and move the wafer ring to the wafer ring return base.

[0026] A method for unloading a pre-drilled wafer carrier, using the aforementioned unloading device for the pre-drilled wafer carrier, characterized in that it includes:

[0027] The step of "transferring the tray to a transfer operation position" involves setting up an assembly fixed by a plurality of clamps on a tray and transferring the tray to a preset transfer operation position.

[0028] A "loading and unloading mechanism correction loading and unloading operation surface" program is implemented by the control module driving the loading and unloading mechanism on the robotic arm to adjust its position so that the distances measured by each ranging element on the periphery of the assembly to be unloaded at a position to be moved on the pallet are equal. The loading and unloading mechanism can be aligned with the assembly to be unloaded in a preset loading and unloading operation surface, so as to correct the tilt angle of the loading and unloading operation surface of the loading and unloading mechanism. The control module stores the information of the corrected loading and unloading operation surface.

[0029] A program called "Image Capture Component Examines Images of Assemblies to be Unloaded on Cartridges and Corrects Image Capture Surface" is executed by the control module. The image capture component on the robotic arm examines the images of the assemblies to be unloaded and each clamp according to the tilt angle and direction of the loading and unloading operation surface after correction. The image capture component is adjusted so that a preset image capture surface is correctly aligned with the position of the assemblies to be unloaded and each clamp, thereby correcting the position of the image capture surface of the image capture component. The control module stores the information of the corrected image capture surface. At the same time, the control module uses the information of the corrected image capture surface to further correct the relative position of the loading and unloading operation surface, so that the loading and unloading operation surface can accurately correspond to the position of the assemblies to be unloaded and each clamp.

[0030] A program called “the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first seat” is driven by the control module to move the loading and unloading mechanism on the robotic arm to the assembly to be unloaded on the tray to a preset assembly unloading part on the first seat.

[0031] In the "cover unloading mechanism moves and recycles the cover" step, the control module drives the cover unloading mechanism to approach the top of the assembly unloading part of the first seat and moves the top cover of the assembly to be unloaded to the cover return seat.

[0032] In the step of "wafer unloading mechanism moving and recycling the wafer", the control module drives the wafer unloading mechanism to move the wafer carrier of the wafer transfer assembly and place the wafer on the wafer return seat;

[0033] In the step of "wafer ring unloading mechanism moving and recycling the wafer ring", the control module drives the wafer ring unloading mechanism to approach the assembly unloading part of the first base and move the wafer ring to the wafer ring return base.

[0034] The unloading method for the pre-cure wafer carrier, wherein the procedure of "the loading and unloading mechanism moving the assembly to be unloaded onto the first base assembly unloading section" has the following features:

[0035] In the "unlocking of each clamp by the loading and unloading mechanism" step, the control module first drives the loading and unloading mechanism on the robotic arm to move above the assembly to be unloaded, and then uses the clamp operating components to release each clamp.

[0036] In the step of "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first base", the control module drives the loading and unloading mechanism on the robotic arm to clamp the assembly to be unloaded with the clamping component and move the assembly to be unloaded to an assembly unloading part on the first base.

[0037] A method for unloading a pre-drilled wafer carrier, using the aforementioned unloading device for the pre-drilled wafer carrier, characterized in that it includes:

[0038] The step of "transferring the tray to a transfer operation position" involves setting up an assembly fixed by a plurality of clamps on a tray and transferring the tray to a preset transfer operation position.

[0039] A "loading and unloading mechanism correction loading and unloading operation surface" program is implemented by the control module driving the loading and unloading mechanism on the robotic arm to adjust its position so that the distances measured by each ranging element on the periphery of the assembly to be unloaded at a position to be moved on the pallet are equal. The loading and unloading mechanism can be aligned with the assembly to be unloaded in a preset loading and unloading operation surface, so as to correct the tilt angle of the loading and unloading operation surface of the loading and unloading mechanism. The control module stores the information of the corrected loading and unloading operation surface.

[0040] A program called "Image Capture Component Examines Images of Assemblies to be Unloaded on Cartridges and Corrects Image Capture Surface" is executed by the control module. The image capture component on the robotic arm examines the images of the assemblies to be unloaded and each clamp according to the tilt angle and direction of the loading and unloading operation surface after correction. The image capture component is adjusted so that a preset image capture surface is correctly aligned with the position of the assemblies to be unloaded and each clamp, thereby correcting the position of the image capture surface of the image capture component. The control module stores the information of the corrected image capture surface. At the same time, the control module uses the information of the corrected image capture surface to further correct the relative position of the loading and unloading operation surface, so that the loading and unloading operation surface can accurately correspond to the position of the assemblies to be unloaded and each clamp.

[0041] A program called “the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first seat” is driven by the control module to move the loading and unloading mechanism on the robotic arm to the assembly to be unloaded on the tray to a preset assembly unloading part on the first seat.

[0042] In the "cover unloading mechanism moves and recycles the cover" step, the control module drives the cover unloading mechanism to approach the top of the assembly unloading part of the first seat and moves the top cover of the assembly to be unloaded to the cover return seat.

[0043] In the step of "wafer unloading mechanism moving and recycling the wafer", the control module drives the wafer unloading mechanism to move the wafer carrier of the wafer transfer assembly and place the wafer on the wafer return seat;

[0044] In the step of "wafer ring unloading mechanism moving and recycling the wafer ring", the control module drives the wafer ring unloading mechanism to approach the assembly unloading part of the first base and move the wafer ring to the wafer ring return base.

[0045] The unloading method for the pre-cure wafer carrier, wherein the procedure of "the loading and unloading mechanism moving the assembly to be unloaded onto the first base assembly unloading section" has the following features:

[0046] In the "unlocking of each clamp by the loading and unloading mechanism" step, the control module first drives the loading and unloading mechanism on the robotic arm to move above the assembly to be unloaded, and then uses the clamp operating components to release each clamp.

[0047] In the step of "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first base", the control module drives the loading and unloading mechanism on the robotic arm to clamp the assembly to be unloaded with the clamping component and move the assembly to be unloaded to an assembly unloading part on the first base.

[0048] The unloading method for the pre-cure wafer carrier includes a step after the step of "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first base" which is "the loading and unloading mechanism disengages from the assembly to be unloaded and the carrier rotates". This step involves loosening each clamping component from the assembly to be unloaded, and the control module drives the pivoting component to pivot the carrier, so that the part of the assembly that has been moved out pivots to a side position, and the assembly on the other side moves to the position to be moved, forming another assembly to be unloaded.

[0049] The unloading method for the pre-cure wafer carrier, wherein: in the step of "moving the carrier to a transfer operation position", the carrier is placed on a second seat at the end of the second displacement mechanism away from the first displacement mechanism, and then the control module drives the second seat of the second displacement mechanism to move the carrier to a transfer operation position close to the first displacement mechanism.

[0050] The unloading method for the pre-cure wafer carrier includes the following steps: In the "wafer unloading mechanism transfers and recycles the wafer" step, before the wafer carrier transfers the wafer, the control module drives the support lifting assembly of the first displacement mechanism to lift the wafer in the unloading part of the assembly, and uses each suction hole to suck air to adsorb and fix the wafer, and exposes the groove of the support to the outside, so that the control module can drive the wafer transfer assembly of the wafer unloading mechanism to extend the wafer carrier into the groove of the support; then the suction holes of the wafer carrier adsorb the wafer, and each suction hole stops sucking air, and the support lifting assembly drives the support to descend, so that the wafer is supported and transferred by the wafer carrier.

[0051] The main advantage of this invention lies in providing an unloading device and method for a pre-cure wafer carrier. A wafer ring unloading mechanism, a wafer unloading mechanism, a cover unloading mechanism, and a carrier are respectively provided around a first displacement mechanism, and a robotic arm is provided between the first displacement mechanism and the carrier. The first displacement mechanism has a reciprocating first base, and the carrier has a plurality of assemblies fixed by clamps. The movable end of the robotic arm has an image capturing component and a loading / unloading mechanism. The robotic arm can drive the loading / unloading mechanism and the image capturing component to respectively correct their loading / unloading working surfaces and image capturing surfaces, so that the loading / unloading mechanism can be aligned correctly and accurately with the carrier. An assembly to be unloaded is placed at a location on a tray. The loading and unloading mechanism first unlocks the clamp, then moves the assembly to be unloaded from the tray onto the first base, and the tray rotates to move another assembly to the location to be moved. Then, the cover unloading mechanism removes and relocates the cover from the assembly to be unloaded, the wafer unloading mechanism removes and relocates the wafer from the assembly to be unloaded, and the wafer ring unloading mechanism removes and relocates the wafer ring from the assembly to be unloaded. With the above simple structure and smooth operation process, the equipment construction cost can be reduced and the assembly efficiency can be improved.

[0052] Another advantage of the present invention is that it provides an unloading device and method for a pre-cure wafer carrier, wherein the loading and unloading mechanism is provided with a plurality of ranging elements around its periphery. When the loading and unloading mechanism approaches the position to be moved on the carrier with a preset loading and unloading reference value in the direction and angle, the position of the loading and unloading mechanism can be adjusted so that the distances measured by each ranging element around the assembly to be unloaded are equal, thereby correcting the tilt angle of the loading and unloading working surface of the loading and unloading mechanism so that the loading and unloading working surface can be parallel (with the same tilt angle) to the assembly to be unloaded. The image capturing component can approach the position to be moved with the same direction and tilt angle as the corrected loading and unloading working surface and directly capture an image. The position of the image capturing component is then adjusted so that it accurately corresponds to the assembly to be unloaded at the position to be moved, thereby correcting the position of the image capturing surface of the image capturing component. At the same time, the position of the loading and unloading mechanism is corrected using the information of the corrected image capturing surface, so that the loading and unloading working surface of the loading and unloading mechanism can accurately correspond to the assembly to be unloaded and its surrounding components.

[0053] Another advantage of the present invention is that it provides an unloading device and method for a pre-cure wafer carrier, wherein a second displacement mechanism driven by the control module is provided on the side of the first displacement mechanism. The second displacement mechanism can drive the carrier to perform reciprocating movement and pivoting, so that the carrier can be moved from an easy-to-place position to a transfer operation position close to the first displacement mechanism, and each assembly on the carrier can be moved to a position close to the range of motion of the robotic arm to improve the overall operation efficiency.

[0054] To provide a more concrete understanding of the above-mentioned objectives, effects, and features of the present invention, the following description is provided with reference to the accompanying drawings. Attached Figure Description

[0055] Figure 1 This is an exploded perspective view of the overall structure and related components of the present invention.

[0056] Figure 2 This is a partial structural diagram of the present invention; it reveals the structure of the first seat and related supporting seats, etc.

[0057] Figure 3 yes Figure 1 A magnified view of part A; it reveals the structure of the image acquisition component and loading / unloading mechanism mounted on the robotic arm.

[0058] Figure 4 This is a flowchart of the operation of the present invention.

[0059] Figure 5 This is a schematic diagram of the second seat of the present invention, which supports a carrier plate on the outside and carries a plurality of assemblies on the carrier plate.

[0060] Figure 6 This is a diagram illustrating the action of the second seat of the present invention moving the carrier plate to the transfer operation positioning.

[0061] Figure 7 This is a diagram illustrating the action of the loading and unloading mechanism of the present invention, which uses a ranging element to align with the assembly to be unloaded on the carrier plate in order to calibrate the tilt angle of the loading and unloading operation surface.

[0062] Figure 8 This is an action diagram of the image acquisition component of the present invention acquiring an image of the assembly to be unloaded and correcting the position of the image acquisition surface.

[0063] Figure 9 This is a diagram illustrating the action of unlocking the peripheral clamps of the assembly to be unloaded using the loading and unloading mechanism of the present invention.

[0064] Figure 10 This is a diagram (a) illustrating the action of the present invention using a loading and unloading mechanism to transfer the assembly to be unloaded from the carrier plate onto the first seat.

[0065] Figure 11 This is diagram (II) showing the action of the present invention using a loading and unloading mechanism to move the assembly to be unloaded from the carrier plate onto the first seat.

[0066] Figure 12 This is a diagram (a) illustrating the action of the covering and covering component of the present invention.

[0067] Figure 13 This is a diagram (II) illustrating the action of the covering and covering component of the present invention.

[0068] Figure 14 This is a diagram (three) illustrating the action of the covering and covering component of the present invention.

[0069] Figure 15 This is a diagram showing the action of the gripper assembly of the cover-moving component of the present invention disengaging from the cover.

[0070] Figure 16 This is a diagram showing the movement of the first seat body of the present invention moving to the side position of the wafer ring unloading mechanism.

[0071] Figure 17 This is a diagram (a) illustrating the operation of the wafer shifting assembly of the present invention for shifting a wafer.

[0072] Figure 18 This is a diagram (II) illustrating the operation of the wafer transfer assembly of the present invention for transferring a wafer.

[0073] Figure 19 This is a diagram (III) illustrating the operation of the wafer shifting assembly of the present invention for shifting a wafer.

[0074] Figure 20 This is a diagram (four) illustrating the operation of the wafer shifting assembly of the present invention for shifting a wafer.

[0075] Figure 21 This is a diagram (V) illustrating the operation of the wafer transfer assembly of the present invention for transferring a wafer.

[0076] Figure 22 This is a diagram (a) illustrating the operation of the wafer ring transfer assembly of the present invention for transferring the wafer ring.

[0077] Figure 23 This is a diagram (II) illustrating the operation of the wafer ring transfer assembly of the present invention for transferring the wafer ring.

[0078] Figure 24 This is a diagram (III) illustrating the operation of the wafer ring transfer assembly of the present invention for transferring the wafer ring.

[0079] Figure 25 This is a diagram (four) illustrating the operation of the wafer ring transfer assembly of the present invention for transferring the wafer ring.

[0080] Explanation of reference numerals in the attached drawings: 1 First displacement mechanism; 11 First guide rail; 12 First seat; 121 Assembly unloading part; 13 Support seat; 131 Groove; 132 Suction hole; 133 Support seat lifting assembly; 2 Wafer ring unloading mechanism; 21 Wafer ring return seat; 22 Wafer ring lifting assembly; 23 Wafer ring transfer assembly; 231 Wafer ring transfer guide rail; 232 Wafer ring transfer slide; 233 Clamping assembly; 2a Wafer ring; 20a Assembly; 3 Wafer unloading mechanism; 31 Wafer return seat; 32 Wafer lifting assembly; 33 Wafer transfer assembly; 331 Wafer transfer guide rail; 332 Wafer transfer slide; 333 Telescopic assembly; 34 Wafer tray; 341 Vent hole; 3a Wafer; 30a Wafer cassette; 4 Mask unloading mechanism; 41 Mask return seat; 42 Mask lifting assembly; 43 Mask transfer assembly; 431 Mask transfer guide rail; 432 Mask transfer slide; 433 Gripper assembly; 4a Mask; 41a Ring protrusion; 5 Second displacement mechanism; 51 Second guide rail; 52 Second seat; 53 Pivoting assembly; 50 Carrier tray; 501 Assembly support part; 502 Fixture; 6 Robotic arm; 61 Image acquisition assembly; 611 Image acquisition assembly; 62 Loading and unloading mechanism; 621 Range measuring element; 6211 Laser beam; 622 Clamping assembly; 623 Fixture operation assembly; A Figure 1 The image acquisition component and loading / unloading mechanism are located at the following points: S11 The tray is moved to a transfer operation position; P2 The loading / unloading mechanism is corrected for the loading / unloading operation surface; S21 The robotic arm drives the loading / unloading mechanism to approach the tray at a preset loading / unloading reference value, and uses a ranging element to measure the distance to the periphery of the assembly to be unloaded at a transfer position; S22 The control module adjusts the position of the loading / unloading mechanism via the robotic arm so that the measuring distances of each ranging element are equal, in order to correct the tilt angle of its loading / unloading operation surface; P3 The image acquisition component examines the image of the assembly to be unloaded on the tray and corrects the image acquisition surface; S31 The robotic arm drives the image acquisition component to approach the tray at the same tilt angle as the corrected loading / unloading operation surface, and obtains the position images of the assembly to be unloaded and each clamp; The S32 control module adjusts the position of the image acquisition component via the robotic arm to correctly align it with the assembly to be unloaded, thereby correcting the position of its image acquisition surface. The information from this corrected image acquisition surface is then used to correct the loading / unloading operation surface, ensuring it is aligned correctly and accurately with the assembly to be unloaded. The P4 loading / unloading mechanism moves the assembly to be unloaded to the assembly unloading section on the first base. The S41 loading / unloading mechanism unlocks each clamp. The S42 loading / unloading mechanism moves the assembly to be unloaded to the assembly unloading section on the first base. The S43 loading / unloading mechanism detaches from the assembly to be unloaded, and the pallet rotates. The S51 cover unloading mechanism moves and retrieves the cover. The S61 wafer unloading mechanism moves and retrieves the wafer. The S71 wafer ring unloading mechanism moves and retrieves the wafer ring. Detailed Implementation

[0081] Please refer to Figures 1 to 3As shown, the main structure of the present invention includes: a first displacement mechanism 1, a wafer ring unloading mechanism 2, a wafer unloading mechanism 3, a cover unloading mechanism 4, a second displacement mechanism 5, and a robotic arm 6. The first displacement mechanism 1 is connected to and driven by a control module (which may be a computer with computing capabilities, not shown). The first displacement mechanism 1 has a plurality of parallel extending first guide rails 11 and a first seat 12 disposed on each of the first guide rails 11 and capable of reciprocating. An assembly unloading part 121 (which may be a hollow hole) is provided on the first seat 12. A support seat 13 is provided in the assembly unloading part 121 (hollow hole). The support seat 13 is driven by a support seat lifting assembly 133 and can perform lifting and lowering actions. A groove channel 131 is recessed on the top surface of the support seat 13, and a plurality of air suction holes 132 capable of sucking air are provided on both sides of the groove channel 131.

[0082] The wafer ring unloading mechanism 2 is located on one side of the first guide rail 11, connected to and driven by the control module (not shown). The wafer ring unloading mechanism 2 has a wafer ring return seat 21 that can support a plurality of wafer rings 2a, and a wafer ring lifting assembly 22 supported below the wafer ring return seat 21. The wafer ring lifting assembly 22 can drive the wafer ring return seat 21 to perform lifting and lowering actions. A wafer ring transfer assembly 23 is provided on the side of the wafer ring return seat 21. The wafer ring transfer assembly 23 has a liftable wafer ring transfer slide 232. A wafer ring transfer guide rail 231 that can be moved laterally back and forth is provided on the wafer ring transfer guide rail 231. A set of clamping assemblies 233 that can be opened and closed relative to each other are provided on the wafer ring transfer guide rail 231.

[0083] The wafer unloading mechanism 3 is located on one side of the first guide rail 11, connected to and driven by the control module (not shown). The wafer unloading mechanism 3 has a wafer return holder 31 for supporting multiple wafers 3a, and a wafer lifting assembly 32 supported below the wafer return holder 31. The wafer lifting assembly 32 can drive the wafer return holder 31 to move up and down. A wafer transfer assembly 33 is located beside the wafer return holder 31. The wafer transfer assembly 33 has a plurality of wafer transfer guides 331 parallel to the first guide rail 11, and a wafer transfer slide 332 disposed on each of the wafer transfer guides 331 and capable of reciprocating. A telescopic assembly 333 capable of vertical lifting is provided on the wafer transfer slide 332, and a wafer holder 34 is provided at the movable end of the telescopic assembly 333. A plurality of air extraction holes 341 capable of drawing air are provided on the top surface of the wafer holder 34.

[0084] In one feasible embodiment, the wafer return holder 31 is provided with a wafer cassette 30a that can accommodate multiple wafers 3a at intervals. The wafer cassette 30a can simultaneously accommodate multiple wafers 3a and form protection, and has the characteristics of easy storage and relocation.

[0085] The cover unloading mechanism 4 is located on one side of the first guide rail 11, connected to and driven by the control module (not shown). The cover unloading mechanism 4 has a cover return seat 41 that can support a plurality of covers 4a, and a cover lifting assembly 42 supported below the cover return seat 41. The cover lifting assembly 42 can drive the cover return seat 41 to lift and lower. A cover transfer assembly 43 is provided on the side of the cover return seat 41. The cover transfer assembly 43 has a liftable cover transfer slide 432. A cover transfer guide rail 431 that can be moved laterally back and forth is provided on the cover transfer slide 432. A set of relatively openable and closeable gripper groups 433 is provided on the cover transfer guide rail 431.

[0086] In one feasible embodiment, the cover 4a has a central annular protrusion 41a that can be clamped by the gripper assembly 433.

[0087] The second displacement mechanism 5 can be laterally disposed on one side of the first guide rail 11 and connected to and driven by the control module (not shown). The second displacement mechanism 5 has a plurality of parallel extending second guide rails 51 and a second seat 52 disposed on each of the second guide rails 51 and capable of reciprocating. A pivot assembly 53 is provided on the second seat 52, and a carrier plate 50 can be attached to the pivot assembly 53.

[0088] In one feasible embodiment, the carrier disk 50 is a disk-shaped structure with a convex arc surface, and a plurality of component support portions 501 (which may be a hollow portion) are provided on the surface of the carrier disk 50, and a plurality of clamps 502 are provided on the periphery of each component support portion 501 (hollow portion).

[0089] The robotic arm 6 is disposed between the first displacement mechanism 1 and the second displacement mechanism 5, connected to and driven by the control module (not shown). An image acquisition component 61 and a loading and unloading mechanism 62 are provided at the movable end of the robotic arm 6. The image acquisition component 61 has an image acquisition component 611 that can acquire images. The loading and unloading mechanism 62 has two clamping components 622 that can be opened and closed relative to each other, a plurality of clamping operation components 623 corresponding to each clamp 502, and a plurality of ranging elements 621. The plurality of ranging elements 621 can be laser light sources that can generate ranging laser beams 6211, and are respectively disposed at at least three points around the loading and unloading mechanism 62.

[0090] Please refer to Figure 4As shown, the operation method of the present invention includes: a step of "moving the carrier to a transfer operation position" (S11), a procedure of "the loading and unloading mechanism correcting the loading and unloading operation surface" (P2), a procedure of "the image acquisition component viewing the image of the assembly to be unloaded on the carrier and correcting the image acquisition surface" (P3), a procedure of "the loading and unloading mechanism moving the assembly to be unloaded to the assembly unloading part on the first seat" (P4), a step of "the cover unloading mechanism moving and retrieving the cover" (S51), a step of "the wafer unloading mechanism moving and retrieving the wafer" (S61), and a step of "the wafer ring unloading mechanism moving and retrieving the wafer ring" (S71); wherein:

[0091] The "Loading and Unloading Mechanism Correction of Loading and Unloading Working Surface" P2 program is driven by the control module to adjust the position of the loading and unloading mechanism 62 on the robotic arm 6, so that the distances measured by each ranging element 621 to the periphery of the assembly 20a to be moved on the pallet 50 are equal, so that the loading and unloading mechanism 62 is parallel (with the same tilt angle) and directly aligned with the assembly 20a to be unloaded, thereby correcting the tilt angle of the loading and unloading working surface of the loading and unloading mechanism 62, and the control module stores the information of the corrected loading and unloading working surface; it sequentially includes the steps of: "The robotic arm drives the loading and unloading mechanism to approach the pallet at a preset loading and unloading reference value, and the ranging elements measure the distance to the periphery of the assembly to be moved" S21, and "The control module adjusts the position of the loading and unloading mechanism via the robotic arm so that the measured distances of each ranging element are equal, thereby correcting the tilt angle of its loading and unloading working surface" S22.

[0092] The P3 program, "The image acquisition component examines the image of the assembly to be unloaded on the carrier plate and corrects the image acquisition surface," is driven by the control module to have the image acquisition component 61 on the robotic arm 6 examine the images of the assembly 20a to be unloaded and each clamp 502 according to the aforementioned corrected tilt angle and direction of the loading and unloading working surface. The control module adjusts the position of the image acquisition component 61 to correctly correspond to the assembly 20a to be unloaded and its clamps 502, thereby correcting the position of the image acquisition surface of the image acquisition component 61. The control module stores the information of the corrected image acquisition surface and uses this information to further correct the loading and unloading operation. The relative position of the unloading operation surface is such that the unloading operation surface can accurately correspond to the position of the assembly 20a to be unloaded and its fixture 502; it sequentially includes the following steps: "The robotic arm drives the image acquisition component to approach the tray at the same tilt angle as the corrected unloading operation surface, and acquires the position images of the assembly to be unloaded and each fixture" S31 step, "The control module adjusts the position of the image acquisition component via the robotic arm so that it correctly aligns with the assembly to be unloaded, thereby correcting the position of its image acquisition surface, and using the information of the corrected image acquisition surface to correct the unloading operation surface so that it is positive and accurately aligned with the assembly to be unloaded" S32 step.

[0093] The P4 program, "The loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading section on the first base", is driven by the control module to move the assembly 20a to be unloaded to the assembly unloading section 121 on the first base 12. It sequentially includes the steps of "the loading and unloading mechanism unlocks each clamp" (S41), "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading section on the first base" (S42), and "the loading and unloading mechanism disengages from the assembly to be unloaded, and the pallet rotates" (S43).

[0094] The following is the coordination Figures 5 to 25 The above steps are explained in detail, and a practical application example is provided:

[0095] First, in the "transferring the tray to a positioning position" S11 step, assemblies 20a, each composed of a wafer ring 2a, a wafer 3a, and a cover 4a, are respectively placed on the assembly support portion 501 of the tray 50. Each assembly 20a is fixed to the assembly support portion 501 (cutout portion) of the tray 50 via a plurality of clamps 502. The second seat 52 of the second displacement mechanism 5 is moved to the end of each second guide rail 51 away from the first displacement mechanism 1, so that the tray 50, fully equipped with the assemblies 20a, can be placed on the pivot assembly 53 of the second displacement mechanism 5 (e.g., ...). Figure 5 (as shown); then the control module drives the second seat 52 of the second displacement mechanism 5 to move the tray 50 to a position close to the transfer operation position of the first displacement mechanism 1; and at least one wafer cassette 30a (as shown) is provided on the wafer return holder 31. Figure 6 (As shown).

[0096] In step S21, "the robotic arm drives the loading and unloading mechanism to approach the pallet at a preset loading and unloading reference value, and the distance to the periphery of the assembly to be unloaded at a location to be moved is measured by a ranging element," the control module drives the loading and unloading mechanism 62 on the robotic arm 6 to move to a location to be moved on the pallet 50 in a direction and angle according to the preset loading and unloading reference value; and uses each ranging element 621 to detect the distance to the periphery of the assembly 20a to be unloaded at the location to be moved (e.g., ...). Figure 7 (As shown).

[0097] In one feasible embodiment, the ranging element 621 is a laser light source that can be projected onto the periphery of the assembly 20a to be unloaded via a laser beam 6211 to detect distance.

[0098] In step S22, "the control module adjusts the position of the loading and unloading mechanism via the robotic arm to make the measuring distances of each ranging element equal in order to correct the tilt angle of the loading and unloading working surface," the control module drives the loading and unloading mechanism 62 on the robotic arm 6 to adjust its position based on the difference in distances detected by each ranging element 621 (i.e., the projection length of the laser beam 6211). This ensures that the distances (laser beams 6211) detected by each ranging element 621 (laser light source) around the assembly 20a to be unloaded are equal in length, thereby correcting the tilt angle of the loading and unloading working surface of the loading and unloading mechanism 62 and ensuring that the loading and unloading working surface is parallel to the assembly 20a to be unloaded. The control module can also store the information of the corrected loading and unloading working surface.

[0099] In step S31, "the robotic arm drives the image acquisition component to approach the pallet at an angle equal to the calibrated loading and unloading surface and acquires positional images of the assembly to be unloaded and each clamp," the control module drives the image acquisition component 61 on the robotic arm 6 to move above the assembly 20a to be unloaded at the same angle and direction as the calibrated loading and unloading surface. The image acquisition component 611 then acquires images of the surrounding area of ​​the assembly 20a to be unloaded (e.g., ...). Figure 8 (as shown), to confirm the position and status of the assembly 20a to be unloaded and each clamp 502.

[0100] In step S32, the control module adjusts the position of the image acquisition component 61 on the robotic arm 6 according to the image position difference of the assembly 20a to be unloaded, thereby correcting the position of its image-capturing surface and using the information of the corrected image-capturing surface to correct the loading and unloading operation surface so that it is aligned correctly and accurately with the assembly 20a to be unloaded. Figure 8 (As shown).

[0101] In one feasible embodiment, each clamp 502 has a positioning mark (not shown, but may be a cross scale or other marking structure) on a preset position around its periphery, and a corresponding relative mark (not shown, but may be a cross scale or other marking structure) can be set on the lens of the image capturing component 611 of the image capturing component 61; when the position of the image capturing component 61 is adjusted so that the relative mark coincides with the positioning mark, the position of the image capturing surface of the image capturing component 61 can be corrected.

[0102] Since the image acquisition component 61 captures images at the same tilt angle and direction as the corrected loading and unloading operation surface, after the position of the image acquisition surface is corrected, the control module can use the position of the corrected image acquisition surface to calculate and store the position information that the loading and unloading mechanism 62 needs to be corrected again, so that the control module can directly and quickly drive the loading and unloading mechanism 62 on the robotic arm 6 to move to the position that is accurately aligned with the assembly 20a to be unloaded in the positive direction.

[0103] In step S41, "unlocking each clamp via loading / unloading mechanism," the control module drives the loading / unloading mechanism 62 on the robotic arm 6 to move above the assembly 20a to be unloaded, and uses the clamp operating components 623 to release each clamp 502 (e.g., ...). Figure 9 (As shown).

[0104] In step S42, where the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part 121 (with a hollow hole) on the first base, the control module drives the loading and unloading mechanism 62 on the robotic arm 6 to clamp the assembly to be unloaded 20a with the clamping assembly 622, and then moves the assembly to be unloaded 20a to the assembly unloading part 121 (with a hollow hole) on the first base 12 (e.g., ...). Figure 10 , Figure 11 (As shown); At this time, the control module drives the support lifting assembly 133 of the first displacement mechanism 1 to raise the support 13 so as to pass through the unloading part 121 (cutout hole) of the assembly and support the wafer 3a, and make each suction hole 132 suck in air to adsorb and fix the wafer 3a, so as to avoid the wafer 3a from being displaced or damaged during subsequent transfer.

[0105] The step S43, "the loading and unloading mechanism disengages from the assembly to be unloaded, and the carrier rotates," occurs after the clamping assembly 622 moves and releases the assembly 20a to be unloaded. The control module then drives the pivoting assembly 53 of the second displacement mechanism 5 to pivot the carrier 50, causing the assembly bearing portion 501 of the moved assembly 20a to pivot and move to a side position. The other side assembly 20a moves to its original position to form another assembly 20a to be unloaded (e.g., ...). Figure 11 (as shown), so that each assembly 20a can be repeatedly moved onto the assembly unloading section 121 of the first seat 12.

[0106] In step S51, the "cover unloading mechanism moves and recycles the cover" is initiated by the control module, in which the cover moving component 43 of the cover unloading mechanism 4 moves the gripper assembly 433 closer to the top of the assembly unloading part 121 of the first seat 12 (e.g., ...). Figure 12 (As shown); the gripper assembly 433 uses the uppermost cover 4a of the assembly to be unloaded 20a to hold the annular protrusion 41a (as shown). Figure 13As shown), and with the lifting and lowering of the cover moving slide 432 and the lateral sliding of the cover moving guide rail 431, the cover 4a can be moved onto the cover returning seat 41 (as shown). Figure 14 (as shown); then, the gripper assembly 433 releases the annular protrusion 41a (as shown). Figure 15 As shown), the cover 4a is placed on the cover return seat 41; at this time, the wafer ring 2a and the wafer 3a remain in the assembly unloading part 121.

[0107] In practical applications, the cover lifting assembly 42 can work together to lift the cover return seat 41, so that the cover moving assembly 43 can more easily move the cover 4a onto the cover return seat 41.

[0108] In the "wafer unloading mechanism transfer and reclaim the wafer" S61 step, the first base 12 can be moved along the first guide rail 11 to a position close to the side of the wafer ring unloading mechanism 2 (or wafer unloading mechanism 3) as needed. Figure 16 (As shown); then the control module drives the support lifting assembly 133 of the first displacement mechanism 1 to move the support 13 to support the wafer 3a and raise it, so that the groove 131 of the support 13 is exposed to the outside (as shown). Figure 17 (As shown); Simultaneously, the control module drives the wafer unloading mechanism 3 to move the wafer transfer slide 332 of the wafer transfer assembly 33. In conjunction with the extension of the telescopic assembly 333, the wafer carrier 34 can extend into the groove 131 of the support base 13 to support the wafer 3a. At the same time, air is drawn from each vent hole 341 to adsorb and fix the wafer 3a (as shown). Figure 18 (as shown); then, each suction port 132 stops suction, and the support lifting assembly 133 drives the support 13 to descend and detach from the wafer 3a (as shown). Figure 19 (As shown); then the wafer transfer slide 332 of the wafer transfer assembly 33 moves, and in conjunction with the extension of the telescopic assembly 333, the wafer carrier 34 can stably transfer the wafer 3a into the wafer cassette 30a (as shown); Figure 20 , Figure 21 (as shown); at this time, the wafer ring 2a remains in the unloading section 121 of the assembly.

[0109] In practical applications, the wafer lifting assembly 32 can work together to lift the wafer return seat 31, so that the wafer carrier 34 can more easily move the wafer 3a to the appropriate height in the wafer cassette 30a.

[0110] In step S71, "the wafer ring unloading mechanism moves and recycles the wafer ring," the control module drives the wafer ring unloading mechanism 2, causing the wafer ring moving assembly 23 to bring the clamping assembly 233 closer to the top of the assembly unloading section 121 of the first base 12 (e.g., ...). Figure 22(as shown); the clamping assembly 233 clamps the wafer ring 2a on the unloading section 121 of the assembly (as shown). Figure 23 As shown); and with the rise and fall of the wafer ring transfer slide 232 and the lateral sliding of the wafer ring transfer guide rail 231, the wafer ring 2a can be moved onto the wafer ring return seat 21 (as shown). Figure 24 , Figure 25 (as shown); then, the clamping assembly 233 releases the wafer ring 2a, so that the wafer ring 2a is placed on the wafer ring return seat 21.

[0111] In practical applications, the wafer ring lifting assembly 22 can work together to lift the wafer ring return seat 21, so that the wafer ring moving assembly 23 can more easily move the wafer ring 2a onto the wafer ring return seat 21.

[0112] With the aforementioned unloading device and method, the present invention can decompose each of the processed assemblies 20a on the carrier disk 50 into components such as a cover 4a, a processed wafer 3a, and a wafer ring 2a, and respectively place them on the cover return seat 41, the wafer return seat 31, and the wafer ring return seat 21, forming a mechanized automatic unloading and recycling mechanism.

[0113] In summary, the unloading device and method for the pre-cure wafer carrier of the present invention can indeed achieve the effect of using a simple mechanism and operation to decompose an assembly into a wafer ring, a wafer, and a cover, and then recycle them separately.

Claims

1. An unloading device for a pre-cure wafer carrier, characterized in that, include: A tray has at least one assembly support portion on its surface for supporting an assembly, and a plurality of clamps are provided around the assembly support portion for fixing the assembly within the assembly support portion. A first displacement mechanism is connected to and driven by a control module. The first displacement mechanism has a first base that can reciprocate, and an assembly unloading part is provided on the first base. A robotic arm is connected to and driven by the control module. The robotic arm has a movable end that can move between the first base and the carrier. A loading and unloading mechanism that can carry and release the assembly is provided on the movable end. A cover unloading mechanism is provided next to the first displacement mechanism, connected to and driven by the control module. The cover unloading mechanism has a cover return seat for returning the cover removed from the assembly. A cover transfer component is provided next to the cover return seat. The cover transfer component can carry and release the cover and can move between the cover return seat and the assembly unloading part of the first seat. A wafer unloading mechanism is provided next to the first displacement mechanism, connected to and driven by the control module. The wafer unloading mechanism has a wafer return seat for returning the wafer unloaded from the assembly. A wafer transfer assembly is provided next to the wafer return seat. The wafer transfer assembly has a wafer carrier that can support the wafer, and the wafer carrier can be moved between the wafer return seat and the assembly unloading part of the first seat by the wafer transfer assembly. A wafer ring unloading mechanism is disposed next to the first displacement mechanism, connected to and driven by the control module. The wafer ring unloading mechanism has a wafer ring return seat for returning the wafer ring unloaded from the assembly. A wafer ring transfer assembly is disposed next to the wafer ring return seat. The wafer ring transfer assembly can carry and release the wafer ring and move between the wafer ring return seat and the assembly unloading part of the first seat.

2. The unloading device for the pre-cure wafer carrier as described in claim 1, characterized in that: The robotic arm's movable end is also equipped with an image acquisition component capable of acquiring images; the loading and unloading mechanism is respectively equipped with a clamping component capable of opening and closing relative to each other to hold the assembly, a plurality of clamping operation components that correspond to and unlock each clamp, and a plurality of distance measuring elements capable of measuring distance.

3. The unloading device for the pre-cure wafer carrier as described in claim 2, characterized in that: The multiple ranging elements are laser light sources capable of generating ranging laser beams, and are respectively disposed at at least three points around the loading and unloading mechanism.

4. The unloading device for the pre-cure wafer carrier as described in claim 1, characterized in that: A second displacement mechanism is provided on the side of the first displacement mechanism and is connected to and driven by the control module. The second displacement mechanism has a second seat that can reciprocate, and a pivot assembly that can support the carrier plate is provided on the second seat.

5. The unloading device for the pre-cure wafer carrier as described in claim 2, characterized in that: A second displacement mechanism is provided on the side of the first displacement mechanism and is connected to and driven by the control module. The second displacement mechanism has a second seat that can reciprocate, and a pivot assembly that can support the carrier plate is provided on the second seat.

6. The unloading device for the pre-cure wafer carrier as described in claim 1, characterized in that: The unloading part of the assembly is a hollow hole, and a support base is provided in the hollow hole. A groove is recessed on the top surface of the support base, and a plurality of air suction holes are provided on both sides of the groove. A support base lifting assembly is provided at the bottom of the support base, which can drive the support base to lift and lower. A plurality of air suction holes are provided on the top surface of the wafer tray.

7. The unloading device for the pre-cure wafer carrier as described in claim 2, characterized in that: The unloading part of the assembly is a hollow hole, and a support base is provided in the hollow hole. A groove is recessed on the top surface of the support base, and a plurality of air suction holes are provided on both sides of the groove. A support base lifting assembly is provided at the bottom of the support base, which can drive the support base to lift and lower. A plurality of air suction holes are provided on the top surface of the wafer tray.

8. The unloading device for the pre-cure wafer carrier as described in claim 4, characterized in that: The unloading part of the assembly is a hollow hole, and a support base is provided in the hollow hole. A groove is recessed on the top surface of the support base, and a plurality of air suction holes are provided on both sides of the groove. A support base lifting assembly is provided at the bottom of the support base, which can drive the support base to lift and lower. A plurality of air suction holes are provided on the top surface of the wafer tray.

9. The unloading device for the pre-cure wafer carrier as described in claim 5, characterized in that: The unloading part of the assembly is a hollow hole, and a support base is provided in the hollow hole. A groove is recessed on the top surface of the support base, and a plurality of air suction holes are provided on both sides of the groove. A support base lifting assembly is provided at the bottom of the support base, which can drive the support base to lift and lower. A plurality of air suction holes are provided on the top surface of the wafer tray.

10. The unloading device for a pre-cure wafer carrier as described in claim 1, 2, 3, 4, 5, 6, 7, 8, or 9, characterized in that: The first displacement mechanism has a plurality of parallel extending first guide rails. A wafer ring lifting assembly is located below the wafer ring return holder, which can drive the wafer ring return holder to move up and down. The wafer ring transfer assembly has a liftable wafer ring transfer slide, on which a wafer ring transfer guide rail capable of laterally reciprocating is provided. A clamping assembly capable of holding the wafer ring is provided on the wafer ring transfer guide rail. Below the wafer return holder, a wafer lifting assembly is located, which can drive the wafer return holder to move up and down. The wafer return holder has a wafer cassette for spaced-apart accommodating a plurality of wafers. The wafer transfer assembly has a plurality of wafer transfer guides parallel to the first guide rail, and a wafer transfer slide disposed on each of the wafer transfer guides and capable of reciprocating. A telescopic component capable of vertical lifting is provided on the wafer transfer slide, and the wafer holder is disposed at the movable end of the telescopic component. A cover lifting assembly is provided below the cover return seat, and the cover lifting assembly can drive the cover return seat to perform lifting and lowering actions. The cover transfer assembly has a cover transfer slide capable of lifting and lowering, and a cover transfer guide rail capable of horizontal reciprocating is provided on the cover transfer slide. A clamping jaw assembly capable of clamping the cover is provided on the cover transfer guide rail.

11. The unloading device for the pre-cure wafer carrier as described in claim 10, characterized in that: The cover has a ring protrusion in the center that can be gripped by the gripper assembly; the first seat is disposed on a plurality of parallel extending first guide rails.

12. A method for unloading a pre-drilled wafer carrier, using the unloading device for a pre-drilled wafer carrier as described in claim 1, characterized in that, include: The step of "transferring the tray to a transfer operation position" involves setting up an assembly fixed by a plurality of clamps on a tray and transferring the tray to a preset transfer operation position. A program called "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first seat" is executed by the control module, which drives the loading and unloading mechanism on the robotic arm to move the assembly to be unloaded from the tray to a preset assembly unloading part on the first seat. In the "cover unloading mechanism moves and recycles the cover" step, the control module drives the cover unloading mechanism to approach the top of the assembly unloading part of the first seat and moves the top cover of the assembly to be unloaded onto the cover return seat. In the "wafer unloading mechanism transfers and recycles the wafer" step, the control module drives the wafer unloading mechanism to move the wafer carrier of the wafer transfer assembly and place the wafer on the wafer return seat; In the "wafer ring unloading mechanism transfers and recycles the wafer ring" step, the control module drives the wafer ring unloading mechanism's wafer ring transfer component to approach the unloading part of the first base assembly and moves the wafer ring onto the wafer ring return base.

13. A method for unloading a pre-drilled wafer carrier, using the unloading device for a pre-drilled wafer carrier as described in claim 2, characterized in that, include: The step of "transferring the tray to a transfer operation position" involves setting up an assembly fixed by a plurality of clamps on a tray and transferring the tray to a preset transfer operation position. A "loading and unloading mechanism correction loading and unloading operation surface" program is implemented by the control module driving the loading and unloading mechanism on the robotic arm to adjust its position so that the distances measured by each ranging element on the periphery of the assembly to be unloaded at a position to be moved on the pallet are equal. The loading and unloading mechanism can be aligned with the assembly to be unloaded in a preset loading and unloading operation surface, so as to correct the tilt angle of the loading and unloading operation surface of the loading and unloading mechanism. The control module stores the information of the corrected loading and unloading operation surface. A program called "Image Capture Component Examines Images of Assemblies to be Unloaded on Cartridges and Corrects Image Capture Surface" is executed by the control module. The image capture component on the robotic arm is driven to examine the images of the assemblies to be unloaded and each clamp according to the tilt angle and direction of the loading and unloading operation surface after correction. The image capture component is adjusted so that the image capture surface is correctly aligned with the position of the assemblies to be unloaded and each clamp according to a preset image capture surface. The position of the image capture surface of the image capture component is corrected. The control module stores the information of the corrected image capture surface. At the same time, the control module uses the information of the corrected image capture surface to further correct the relative position of the loading and unloading operation surface so that the loading and unloading operation surface can accurately correspond to the position of the assemblies to be unloaded and each clamp. A program called "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first seat" is executed by the control module, which drives the loading and unloading mechanism on the robotic arm to move the assembly to be unloaded from the tray to a preset assembly unloading part on the first seat. In the "cover unloading mechanism moves and recycles the cover" step, the control module drives the cover unloading mechanism to approach the top of the assembly unloading part of the first seat and moves the top cover of the assembly to be unloaded onto the cover return seat. In the "wafer unloading mechanism transfers and recycles the wafer" step, the control module drives the wafer unloading mechanism to move the wafer carrier of the wafer transfer assembly and place the wafer on the wafer return seat; In the "wafer ring unloading mechanism transfers and recycles the wafer ring" step, the control module drives the wafer ring unloading mechanism's wafer ring transfer component to approach the unloading part of the first base assembly and moves the wafer ring onto the wafer ring return base.

14. The unloading method for the pre-cure wafer carrier as described in claim 13, characterized in that: The "loading and unloading mechanism alignment of loading and unloading operation surface" procedure has the following features: The step of "the robotic arm drives the loading and unloading mechanism to approach the pallet with a preset loading and unloading reference value, and the distance to the periphery of the assembly to be unloaded at a position to be moved is measured by the ranging element" is that the control module drives the loading and unloading mechanism on the robotic arm to move to the position to be moved on the pallet with a preset loading and unloading reference value in the direction and angle; and uses each ranging element to detect the distance to the periphery of the assembly to be unloaded at the position to be moved; The first step involves the control module adjusting the position of the loading and unloading mechanism via the robotic arm to ensure that the measuring distances of each ranging element are equal, thereby correcting the tilt angle of the loading and unloading working surface. This step involves the control module driving the loading and unloading mechanism on the robotic arm to adjust its position so that the distances detected by each ranging element to the periphery of the assembly to be unloaded are equal, ensuring that the loading and unloading working surface of the loading and unloading mechanism is positively and parallel to the assembly to be unloaded, thereby correcting the tilt angle of the loading and unloading working surface of the loading and unloading mechanism; and the control module stores the information of the corrected loading and unloading working surface. The "image acquisition component examines the image of the assembly to be unloaded on the carrier disk and corrects the image acquisition plane" program has the following features: The first step is to "drive the robotic arm to approach the tray at the same tilt angle as the corrected loading and unloading operation surface and obtain position images of the assembly to be unloaded and each clamp". The control module drives the image acquisition component on the robotic arm to move to above the position to be moved at the same direction and tilt angle as the corrected loading and unloading operation surface. The image acquisition component is used to obtain images of the surrounding area of ​​the assembly to be unloaded in order to confirm the position of the assembly to be unloaded and each clamp. The first step involves the control module adjusting the position of the image acquisition component via the robotic arm to correctly align it with the assembly to be unloaded, thereby correcting the position of its image-capturing surface. The control module then uses the corrected image-capturing surface information to correct the loading / unloading work surface, ensuring it is aligned correctly and accurately with the assembly to be unloaded. Specifically, the control module drives the image acquisition component on the robotic arm to adjust its position, ensuring its image-capturing surface is correctly aligned with the assembly to be unloaded and each clamp, thus correcting the position of the image-capturing surface. Furthermore, the control module stores the corrected image-capturing surface information and can calculate the corrected position information of the loading / unloading mechanism, so that the robotic arm can then move the loading / unloading mechanism to a position that is aligned correctly and evenly with the assembly to be unloaded.

15. The unloading method for the pre-cure wafer carrier as described in claim 13, characterized in that: The procedure for "the loading and unloading mechanism moving the assembly to be unloaded onto the first seat" has the following features: In the "unlocking of each clamp by the loading and unloading mechanism" step, the control module first drives the loading and unloading mechanism on the robotic arm to move above the assembly to be unloaded, and then uses the operating components of each clamp to release each clamp. In the step of "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first base", the control module drives the loading and unloading mechanism on the robotic arm to clamp the assembly to be unloaded with the clamping component and move the assembly to be unloaded to an assembly unloading part on the first base.

16. A method for unloading a pre-drilled wafer carrier, using the unloading device for a pre-drilled wafer carrier as described in claim 9, characterized in that, include: The step of "transferring the tray to a transfer operation position" involves setting up an assembly fixed by a plurality of clamps on a tray and transferring the tray to a preset transfer operation position. A "loading and unloading mechanism correction loading and unloading operation surface" program is implemented by the control module driving the loading and unloading mechanism on the robotic arm to adjust its position so that the distances measured by each ranging element on the periphery of the assembly to be unloaded at a position to be moved on the pallet are equal. The loading and unloading mechanism can be aligned with the assembly to be unloaded in a preset loading and unloading operation surface, so as to correct the tilt angle of the loading and unloading operation surface of the loading and unloading mechanism. The control module stores the information of the corrected loading and unloading operation surface. A program called "Image Capture Component Examines Images of Assemblies to be Unloaded on Cartridges and Corrects Image Capture Surface" is executed by the control module. The image capture component on the robotic arm is driven to examine the images of the assemblies to be unloaded and each clamp according to the tilt angle and direction of the loading and unloading operation surface after correction. The image capture component is adjusted so that the image capture surface is correctly aligned with the position of the assemblies to be unloaded and each clamp according to a preset image capture surface. The position of the image capture surface of the image capture component is corrected. The control module stores the information of the corrected image capture surface. At the same time, the control module uses the information of the corrected image capture surface to further correct the relative position of the loading and unloading operation surface so that the loading and unloading operation surface can accurately correspond to the position of the assemblies to be unloaded and each clamp. A program called "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first seat" is executed by the control module, which drives the loading and unloading mechanism on the robotic arm to move the assembly to be unloaded from the tray to a preset assembly unloading part on the first seat. In the "cover unloading mechanism moves and recycles the cover" step, the control module drives the cover unloading mechanism to approach the top of the assembly unloading part of the first seat and moves the top cover of the assembly to be unloaded onto the cover return seat. In the "wafer unloading mechanism transfers and recycles the wafer" step, the control module drives the wafer unloading mechanism to move the wafer carrier of the wafer transfer assembly and place the wafer on the wafer return seat; In the "wafer ring unloading mechanism transfers and recycles the wafer ring" step, the control module drives the wafer ring unloading mechanism's wafer ring transfer component to approach the unloading part of the first base assembly and moves the wafer ring onto the wafer ring return base.

17. The unloading method for the pre-cure wafer carrier as described in claim 16, characterized in that: The procedure for "the loading and unloading mechanism moving the assembly to be unloaded onto the first seat" has the following features: In the "unlocking of each clamp by the loading and unloading mechanism" step, the control module first drives the loading and unloading mechanism on the robotic arm to move above the assembly to be unloaded, and then uses the operating components of each clamp to release each clamp. In the step of "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first base", the control module drives the loading and unloading mechanism on the robotic arm to clamp the assembly to be unloaded with the clamping component and move the assembly to be unloaded to an assembly unloading part on the first base.

18. The unloading method for the pre-cure wafer carrier as described in claim 17, characterized in that: After the step of "the loading and unloading mechanism moves the assembly to be unloaded to the assembly unloading part on the first seat", there is a step of "the loading and unloading mechanism disengages from the assembly to be unloaded and the carrier rotates". This step involves loosening each clamping component from the assembly to be unloaded, and the control module drives the pivoting component to pivot the carrier, so that the part of the assembly that has been moved out pivots to a side position, and the assembly on the other side moves to the position to be moved, forming another assembly to be unloaded.

19. The unloading method for the pre-cure wafer carrier as described in claim 16, characterized in that: In the step of "moving the carrier to a transfer operation position", the carrier is placed on the second seat of the second displacement mechanism at the end away from the first displacement mechanism. Then, the control module drives the second seat of the second displacement mechanism to move the carrier to a transfer operation position close to the first displacement mechanism.

20. The unloading method for the pre-cure wafer carrier as described in claim 16, characterized in that: In the "wafer unloading mechanism transfers and recycles the wafer" step, before the wafer is transferred by the wafer carrier, the control module drives the support lifting assembly of the first displacement mechanism to lift the wafer in the unloading part of the assembly, and uses each suction hole to suck air to adsorb and fix the wafer, and exposes the groove of the support to the outside, so that the control module can drive the wafer transfer assembly of the wafer unloading mechanism to extend the wafer carrier into the groove of the support; then the suction holes of the wafer carrier adsorb the wafer, and each suction hole stops sucking air, and the support lifting assembly drives the support to descend, so that the wafer is supported and transferred by the wafer carrier.

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