Earphone sound collecting device and earphone

Abstract

This application provides a headphone sound transmission device and a headphone. The headphone sound transmission device includes a sound transmitting element and a sound receiving element; the sound transmitting element has a first sound transmission channel and a second sound transmission channel that are interconnected, forming a sound transmission angle between the first and second sound transmission channels. The first sound transmission channel is connected to the inlet of the sound transmitting element, and the second sound transmission channel is connected to the outlet of the sound transmitting element. The sound receiving element is connected to the sound transmitting element and has a sound receiving port that is connected to the outlet of the sound transmitting element. When sound enters the sound transmitting element, it passes through the first and second sound transmission channels in sequence. The first and second sound transmission channels intersect each other, which attenuates and blocks high-frequency noise signals in the sound signal, thus reducing the high-frequency noise in the incoming sound and effectively improving the noise reduction capability against external noise.

Description

Technical Field

[0001] This invention relates to the field of headphone technology, and in particular to a headphone sound transmission device and a headphone. Background Technology

[0002] As headphone functions continue to diversify, active noise cancellation and call noise cancellation have become essential features for most headphones. The realization of these two functions relies on MEMS (Micro-Electro-Mechanical System) chips for picking up ambient noise input algorithms and the sealing of MEMS microphone components.

[0003] However, in traditional MEMS microphone designs, the microphone hole is directly connected to the outer casing to pick up ambient noise. When a strong wind passes by, it will excite the MEMS microphone itself to vibrate, thus generating pulsating noise and aerodynamic noise due to gaps between the outer casing and the microphone structure components. This will affect the user's functional experience in windy environments. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide an effective headphone transmission device and headphones that improve noise reduction capabilities.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A headphone sound transmission device includes: a sound transmitting element and a sound receiving element; the sound transmitting element has a first sound transmission channel and a second sound transmission channel that are interconnected, the first sound transmission channel and the second sound transmission channel forming a sound transmission angle, the first sound transmission channel being connected to the inlet of the sound transmitting element, and the second sound transmission channel being connected to the outlet of the sound transmitting element; the sound receiving element is connected to the sound transmitting element, the sound receiving element having a receiving port, and the receiving port being connected to the outlet of the sound transmitting element.

[0007] In one embodiment, the sound transmission angle is 68° to 118°.

[0008] In one embodiment, the first sound transmission channel and the second sound transmission channel are arranged perpendicular to each other.

[0009] In one embodiment, the sound transmitting device includes a sound transmitting box and a sound transmitting body. The sound transmitting body is disposed inside the sound transmitting box and has a first sound transmitting channel and a second sound transmitting channel inside. The sound transmitting box has an inlet and an outlet. The inlet is corresponding to the first sound transmitting channel and the outlet is corresponding to the second sound transmitting channel.

[0010] In one embodiment, the sound transmitting element further includes a gap reducing plate disposed inside the sound transmitting box. The gap reducing plate abuts against the inner wall of the sound transmitting box and the sound transmitting body. The gap reducing plate also has a first through hole communicating with the sound outlet, and the first through hole is also correspondingly disposed with the sound receiving port.

[0011] In one embodiment, the sound transmitting element further includes a first interference ring located between the gap reducing plate and the sound transmitting body, with the middle portion of the first interference ring communicating with the sound outlet.

[0012] In one embodiment, the sound box includes a box body and a vibration damping plate connected to each other. The vibration damping plate has the sound outlet and is located between the box body and the receiver. The vibration damping plate is used to reduce the sound vibration amplitude of the receiver.

[0013] In one embodiment, the sound transmitting element further includes a second interference ring located between the inner wall of the sound transmitting box and the sound transmitting body, with the middle portion of the second interference ring communicating with the sound inlet.

[0014] In one embodiment, the sound transmission element further includes a pickup tube connected to the sound transmission box, the interior of the pickup tube communicating with the sound inlet, and the pickup tube being used to connect to the housing of the player.

[0015] An earphone, comprising the earphone sound transmission device described in any of the above embodiments.

[0016] Compared with the prior art, the present invention has at least the following advantages:

[0017] When sound enters the sound transmission device, it passes through the first sound transmission channel and the second sound transmission channel in sequence. The first sound transmission channel and the second sound transmission channel intersect each other, which means that the high-frequency noise signal in the sound signal is attenuated, thus reducing the high-frequency noise in the incoming sound and effectively improving the noise reduction capability against external noise. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of an earphone sound transmission device in one embodiment;

[0020] Figure 2for Figure 1 A cross-sectional view of the headphone transmission device shown along the BB direction.

[0021] Figure 3 for Figure 1 The loss curve of the headphone transmission device is shown.

[0022] Figure 4 This is a schematic diagram of the connection between the earplug and the headphone sound transmission device in one embodiment;

[0023] Figure 5 for Figure 4 A diagram of a middle earbud;

[0024] Figure 6 for Figure 5 The earplug shown is a cross-sectional view along the AA direction. Detailed Implementation

[0025] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] This invention relates to a headphone sound transmission device. In one embodiment, the headphone sound transmission device includes a sound transmitting element and a sound receiving element. The sound transmitting element has a first sound transmission channel and a second sound transmission channel that are interconnected, forming a sound transmission angle between the first and second sound transmission channels. The first sound transmission channel is connected to the inlet of the sound transmitting element, and the second sound transmission channel is connected to the outlet of the sound transmitting element. The sound receiving element is connected to the sound transmitting element and has a sound receiving port that is connected to the outlet of the sound transmitting element. When sound enters the sound transmitting element, it passes through the first and second sound transmission channels in sequence. The first and second sound transmission channels intersect each other, thus attenuating and blocking high-frequency noise signals in the sound signal, thereby reducing high-frequency noise in the incoming sound and effectively improving the noise reduction capability against external noise.

[0029] Please see Figure 1 This is a schematic diagram of the structure of an earphone sound transmission device according to an embodiment of the present invention.

[0030] One embodiment of the headphone sound transmission device 110 includes a sound transmitting element 112 and a sound receiving element 114. Please refer to the following: Figure 2 The sound transmitting element 112 has a first sound transmitting channel 102 and a second sound transmitting channel 104 that are interconnected. A sound transmission angle is formed between the first sound transmitting channel 102 and the second sound transmitting channel 104. The first sound transmitting channel 102 is connected to the inlet of the sound transmitting element 112, and the second sound transmitting channel 104 is connected to the outlet of the sound transmitting element 112. The receiver 114 is connected to the sound transmitting element 112 and has a receiver port 106, which is connected to the outlet of the sound transmitting element 112.

[0031] In this embodiment, when sound enters the sound transmission device 112, it passes through the first sound transmission channel 102 and the second sound transmission channel 104 in sequence. The first sound transmission channel 102 and the second sound transmission channel 104 are intersecting each other, which means that the high-frequency noise signal in the sound signal is attenuated and blocked, so as to reduce the high-frequency noise in the sound signal and effectively improve the noise reduction capability against external noise.

[0032] In one embodiment, please refer to Figure 2The sound transmission angle is between 68° and 118°. In this embodiment, the sound transmission angle is formed between the first sound transmission channel 102 and the second sound transmission channel 104, that is, the sound transmission angle is formed at the connection position of the first sound transmission channel 102 and the second sound transmission channel 104, that is, the first sound transmission channel 102 and the second sound transmission channel 104 are inclined to each other. With the first sound transmission channel 102 and the second sound transmission channel 104 forming an intersecting channel structure, external sound first enters the first sound transmission channel 102, and then is redirected at the connection position of the first sound transmission channel 102 and the second sound transmission channel 104 to attenuate the external sound, so that the high-frequency noise signal in the external sound is greatly reduced, that is, the high-frequency noise caused by strong wind or gaps between components is attenuated, effectively reducing the impact of wind noise on the collected sound signal. In another embodiment, the sound transmission angle is 90°, meaning the first sound transmission channel 102 and the second sound transmission channel 104 are perpendicular to each other. When external sound enters the second sound transmission channel 104 from the first sound transmission channel 102, the loss of high-frequency noise signals reaches its maximum, maximizing the reduction of wind noise in the external sound and further improving the accuracy of sound signal acquisition. The formula for wind noise loss in the headphone sound transmission device is as follows:

[0033]

[0034] Where TL represents the loss of the sound signal after passing through the first and second transmission channels, and P... in P is the area of ​​the entrance aperture. out This refers to the area of ​​the sound outlet. Based on the high-frequency noise generated by strong winds and its own vibrations, this noise can be effectively eliminated, while human voices are largely preserved. Specifically, the loss is minimal for human voices in the 20Hz to 400Hz frequency range, but significant for high-frequency noise around 500Hz. See details... Figure 3 The continuous signal curve corresponds to a transmission loss of -continuous, while the square wave signal curve corresponds to a transmission loss of -1 / 3 octave band.

[0035] In one embodiment, please refer to Figure 2The sound transmitting element 112 includes a sound transmitting box 112a and a sound transmitting body 112b. The sound transmitting body 112b is disposed inside the sound transmitting box 112a. The sound transmitting body 112b has a first sound transmitting channel 102 and a second sound transmitting channel 104. The sound transmitting box 112a has an inlet 108 and an outlet 101. The inlet 108 is correspondingly disposed to the first sound transmitting channel 102, and the outlet 101 is correspondingly disposed to the second sound transmitting channel 104. In this embodiment, the sound transmitting box 112a serves as an external protective body for the sound transmitting element 112, housing the sound transmitting body 112b within it to reduce the influence of the external environment on the sound transmitting body 112b. The first sound transmission channel 102 and the second sound transmission channel 104 are formed within the sound transmitter 112b, so that the first sound transmission channel 102 and the second sound transmission channel 104 are protected by the sound box 112a, effectively reducing the ingress of dust or moisture from the external environment. Moreover, the first sound transmission channel 102 corresponds to the sound inlet 108, and the second sound transmission channel 104 corresponds to the sound outlet 101, which facilitates the reception of external sounds.

[0036] Further, please refer to Figure 2 The sound transmitting element 112 further includes a gap reducing plate 112c, which is disposed inside the sound transmitting box 112a. The gap reducing plate 112c abuts against the inner wall of the sound transmitting box 112a and the sound transmitting body 112b. The gap reducing plate 112c also has a first through hole communicating with the sound outlet 101, and the first through hole is also correspondingly disposed with the sound receiving port 106. In this embodiment, the gap-reducing plate 112c is located between the inner wall of the sound box 112a and the sound transmitter 112b. The gap-reducing plate 112c abuts against the inner wall of the sound box 112a and the sound transmitter 112b respectively. The gap-reducing plate 112c fills the gap between the inner wall of the sound box 112a and the sound transmitter 112b to reduce the gap between the inner wall of the sound box 112a and the sound transmitter 112b, thereby weakening the vibration between the sound transmitter 112b and the sound box 112a. This reduces the vibration noise generated by the vibration between the sound transmitter 112b and the sound box 112a, effectively reducing the impact on the collected sound signal.

[0037] Furthermore, please refer to Figure 2The sound transmitting element 112 further includes a first interference ring 112d, which is located between the gap reducing plate 112c and the sound transmitting body 112b, and the middle part of the first interference ring 112d communicates with the sound outlet 101. In this embodiment, one side of the first interference ring 112d contacts the gap reducing plate 112c, and the other side of the first interference ring 112d contacts the sound transmitting body 112b, thus filling the gap between the gap reducing plate 112c and the sound transmitting body 112b. The first interference ring 112d is located between the reducing plate 112c and the sound transmitter 112b, serving as an interference fit between them. This ensures that the connection between the reducing plate 112c and the sound transmitter 112b is an interference fit, thus improving the stability of the connection and further reducing the vibration between them. This effectively reduces the impact on the acquired sound signal.

[0038] Furthermore, please refer to Figure 2 The sound transmission box 112a includes a box body 1122 and a vibration damping plate 1124 connected to each other. The vibration damping plate 1124 has the sound outlet 101 and is located between the box body 1122 and the receiver 114. The vibration damping plate 1124 is used to reduce the sound vibration amplitude of the receiver 114. In this embodiment, the box body 1122 serves as the outer shell of the sound transmission box 112a, and the sound transmitter 112b is housed inside the box body 1122 for fixed installation. The vibration damping plate 1124 is close to the receiver 114; specifically, the vibration damping plate 1124 is located between the box body 1122 and the receiver 114. The sound outlet 101 corresponds to the second sound transmission channel 104, that is, the sound outlet 101 corresponds to the sound receiving port 106 of the receiver 114. After the sound signal passes through the second sound transmission channel 104, it also needs to pass through the sound outlet 101 to enter the receiver 114. At this time, the vibration damping plate 1124 weakens the vibration between the receiver 114 and the housing 1122, so as to reduce the vibration amplitude of the sound signal between the receiver 114 and the housing 1122 during sound reception, and further effectively reduces the impact on the collected sound signal.

[0039] Furthermore, please refer to Figure 2The sound transmitting element 112 further includes a second interference ring 112e, which is located between the inner wall of the sound transmitting box 112a and the sound transmitting body 112b. The middle part of the second interference ring 112e communicates with the sound inlet 108. In this embodiment, one side of the second interference ring 112e contacts the inner wall of the sound transmitting box 112a, and the other side of the second interference ring 112e contacts the sound transmitting body 112b. The second interference ring 112e fills the gap between the inner wall of the sound transmitting box 112a and the sound transmitting body 112b. The second interference ring 112e is located between the inner wall of the sound box 112a and the sound transmitter 112b, serving as an interference fit between them. Specifically, it forms an interference fit at the sound inlet 108 of the sound box 112a, ensuring an interference fit between the inner wall of the sound box 112a and the sound transmitter 112b. This interference fit enhances the stability of the connection between the inner wall of the sound box 112a and the sound transmitter 112b, further reducing vibrations between them and effectively minimizing the impact on the acquired sound signal.

[0040] Furthermore, please refer to Figure 2 The sound transmission element 112 further includes a pickup tube 112f connected to the sound transmission box 112a. The interior of the pickup tube 112f communicates with the sound inlet 108, and the pickup tube 112f is used to connect to the outer shell of the player. In this embodiment, the pickup tube 112f is located at the sound inlet 108. The pickup tube 112f serves as an input channel for external sound signals. The sound input direction of the pickup tube 112f is on the same straight line as the first sound transmission channel 102, which facilitates the rapid transmission of external sound signals and effectively improves the sound acquisition efficiency. The pickup tube 112f is perpendicular to the sound transmission box 112a, that is, the pickup tube 112f protrudes vertically from the sound transmission box 112a, effectively increasing the sound pickup directionality.

[0041] Understandably, after noise reduction, the sound transmission device of the headphones typically transmits external sound to the user's ear via earplugs. These earplugs also serve as the fixing components that ensure the headphones are worn on the user's ear. Earplugs are usually made of silicone, which is soft to the touch, has strong elasticity, and is very durable, making them very comfortable to wear. However, with traditional earplugs inserted into the ear canal, headphones cannot dissipate heat during prolonged use, easily causing stuffiness and compromising comfort.

[0042] To effectively improve heat dissipation performance, please refer to [link / reference]. Figure 4The headphone sound transmission device also includes an earplug 200. Please refer to the following: Figure 5 and Figure 6 The earplug 200 includes a heat-conducting plug body 210 and a soft filling medium 220. The heat-conducting plug body 210 is used to contact the wearer and is sleeved with the headphone sound transmission device 110. The heat-conducting plug body 210 has a sound outlet channel 202, which communicates with the sound outlet hole of the headphone sound transmission device 110. The heat-conducting plug body 210 also has an accommodating space 204, wherein the accommodating space 204 is isolated from the sound outlet channel 202, and the soft filling medium 220 is disposed within the accommodating space 204 to deform the surface of the heat-conducting plug body 210.

[0043] In this embodiment, when worn, the heat-conducting plug body 210 contacts the surface of the wearer, and the heat-conducting plug body 210 absorbs and conducts heat from the wearer, so that the heat at the wearing position of the wearer can be dissipated, and the heat can be easily conducted to the external environment, which effectively improves the heat dissipation performance of the earplug 200 wearing device. Moreover, the soft filling medium 220 is disposed in the heat-conducting plug body 210, making the heat-conducting plug body 210 easy to deform, which makes it easy to wear the heat-conducting plug body 210 on the wearer.

[0044] In one embodiment, please refer to Figure 6 The heat-conducting plug body 210 has a socket 206 communicating with the sound outlet channel 202, and a portion of the earphone sound transmission device 110 is fitted into the socket 206. In this embodiment, the heat-conducting plug body 210 serves as an extension of the earphone sound transmission device 110. The heat-conducting plug body 210 is used to contact the surface of the wearer, specifically, it is used to contact the skin inside the ear canal to absorb and dissipate heat from the ear canal. The socket 206 is formed on the heat-conducting plug body 210, with its opening facing the earphone sound transmission device 110. The socket 206 accommodates a portion of the earphone sound transmission device 110, facilitating the fitting of the earphone sound transmission device 110 onto the heat-conducting plug body 210 and effectively improving the stability of the heat-conducting plug body 210 on the earphone sound transmission device 110. Furthermore, the socket 206 is connected to the sound outlet channel 202, which facilitates the introduction of the audio signal played by the headphone transmission device 110 into the human ear canal.

[0045] In one embodiment, please refer to Figure 6The diameter of the sound outlet channel 202 away from the headphone transmitting device 110 is smaller than the diameter of the sound outlet channel 202 near the headphone transmitting device 110. In this embodiment, the sound outlet channel 202 is used for audio signal transmission. The diameter of the sound outlet channel 202 gradually decreases in the direction closer to the inner ear, facilitating the concentrated propagation of the audio signal and thus improving the audio quality played by the headphone transmitting device 110. Furthermore, the diameter of the heat-conducting plug body 210 also decreases synchronously; that is, the diameter of the heat-conducting plug body 210 away from the headphone transmitting device 110 is smaller than the diameter of the heat-conducting plug body 210 near the headphone transmitting device 110. This facilitates the insertion of the heat-conducting plug body 210 into the human ear canal, effectively improving the wearing stability of the earplug 200 wearing device.

[0046] In one embodiment, please refer to Figure 6 The heat-conducting plug body 210 has a limiting groove 208 communicating with the sound outlet channel 202. The sound outlet of the earphone sound transmission device 110 is disposed within the limiting groove 208, and the sound outlet of the earphone sound transmission device 110 abuts against the bottom of the limiting groove 208. In this embodiment, the limiting groove 208 is used to accommodate the sound outlet of the earphone sound transmission device 110. The bottom of the limiting groove 208 abuts against and limits the sound outlet of the earphone sound transmission device 110, preventing the sound outlet of the earphone sound transmission device 110 from falling off. This facilitates the fitting of the heat-conducting plug body 210 onto the earphone sound transmission device 110, further improving the connection stability between the heat-conducting plug body 210 and the earphone sound transmission device 110.

[0047] In one embodiment, please refer to Figure 5 The heat-conducting plug body 210 has a wearing slot 201 located on the outer surface of the heat-conducting plug body 210, which is used to accommodate a portion of the wearer. In this embodiment, the wearing slot 201 is disposed on the outer wall of the heat-conducting plug body 210. The recessed structure of the wearing slot 201 gives the heat-conducting plug body 210 a curved structure, thereby allowing the heat-conducting plug body 210 to match the structure of the human ear canal. Utilizing the soft filling medium 220's soft properties, the heat-conducting plug body 210 can fit various human ear canal structures, facilitating its wearing within the human ear canal.

[0048] In one embodiment, the heat-conducting plug body 210 is made of thermally conductive silicone. In this embodiment, the heat-conducting plug body 210 serves as the main heat-conducting component of the earplug 200 wearing device. The heat-conducting plug body 210 contacts the skin inside the human ear canal to conduct heat from the ear canal to the outside. Specifically, the portion of the heat-conducting plug body 210 in contact with the skin inside the ear canal absorbs heat, while the portion outside the ear canal dissipates heat. The heat-conducting plug body 210 is made of thermally conductive silicone. Utilizing the high thermal conductivity of the silicone itself, the heat from the contact between the heat-conducting plug body 210 and the skin inside the ear canal is quickly absorbed. Furthermore, the heat on the heat-conducting plug body 210 is quickly conducted to the outside through the thermally conductive silicone, thereby improving the heat conduction efficiency of the heat-conducting plug body 210. This facilitates the rapid removal and dissipation of heat from the ear canal, effectively improving the heat dissipation performance of the earplug 200 wearing device.

[0049] In one embodiment, the heat-conducting plug body 210 is a heat-conducting sponge, and the pores of the heat-conducting sponge are isolated from the accommodating space 204. In this embodiment, the heat-conducting plug body 210 serves as the main heat-conducting component of the earplug 200 wearing device. The heat-conducting plug body 210 contacts the skin inside the human ear canal to conduct heat from the ear canal to the outside. That is, the part of the heat-conducting plug body 210 in contact with the skin inside the ear canal absorbs heat, while the part of the heat-conducting plug body 210 outside the ear canal dissipates heat. The heat-conducting plug body 210 is made of heat-conducting sponge, which facilitates the conduction of heat from the ear canal due to its thermal conductivity. The heat-conducting sponge also has multiple pores, making its structure soft and easy to compress and deform, thus facilitating the insertion of the heat-conducting plug body 210 into the ear canal. Furthermore, the pores of the thermally conductive sponge are isolated from the accommodating space 204, sealing the interior of the thermally conductive plug body 210 with the soft filling medium 220. This enhances the flexibility of the thermally conductive plug body 210 and prevents leakage of the soft filling medium 220. In addition, the pores of the thermally conductive sponge facilitate the drainage of moisture from the ear canal. Specifically, after prolonged wear, the ear canal becomes hot and humid due to heat accumulation. The pores of the thermally conductive sponge effectively drain the heat and moisture from the ear canal, significantly improving the wearing comfort of the earplug 200.

[0050] In one embodiment, the flexible filling medium 220 includes at least one of a thermally conductive filling liquid and a thermally conductive inert gas. In this embodiment, the flexible filling medium 220 is located within the accommodating space 204, that is, the flexible filling medium 220 is housed within the thermally conductive plug body 210, specifically, the flexible filling medium 220 is housed within the inner wall of the thermally conductive plug body 210. The flexible filling medium 220 has a certain degree of flexibility, facilitating the deformation of the thermally conductive plug body 210, thereby improving the fit of the thermally conductive plug body 210 to the human ear canal. The thermally conductive filling liquid and the thermally conductive inert gas fill the accommodating space 204, making the structure of the thermally conductive plug body 210 flexible, thus making the thermally conductive plug body 210 easy to deform, effectively improving the wearing adaptability of the thermally conductive plug body 210, that is, the thermally conductive plug body 210 adapts to a variety of different human ear canal structures. In another embodiment, the thermally conductive filling liquid is a coolant, which is filled in the accommodating space 204 in a liquid state, making the thermally conductive plug body 210 easy to deform. Moreover, the coolant and the thermally conductive plug body 210 together conduct heat into the human ear canal, further improving the heat dissipation performance of the earplug 200 wearing device.

[0051] In one embodiment, this application also provides an earphone, including the earphone sound transmission device described in any of the above embodiments. In this embodiment, the earphone sound transmission device includes a sound transmitting element and a sound receiving element. The sound transmitting element has a first sound transmitting channel and a second sound transmitting channel that are interconnected, and a sound transmission angle is formed between the first sound transmitting channel and the second sound transmitting channel. The first sound transmitting channel is connected to the inlet of the sound transmitting element, and the second sound transmitting channel is connected to the outlet of the sound transmitting element. The sound receiving element is connected to the sound transmitting element, and the sound receiving element has a sound receiving port that is connected to the outlet of the sound transmitting element. When sound enters the sound transmitting element, it passes through the first sound transmitting channel and the second sound transmitting channel in sequence. The first sound transmitting channel and the second sound transmitting channel intersect each other, that is, high-frequency noise signals in the sound signal are attenuated and blocked, which facilitates the attenuation of high-frequency noise signals in the sound signal, thereby reducing the high-frequency noise in the incoming sound and effectively improving the noise reduction capability against external noise.

[0052] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A microphone apparatus for earphones, characterized by include: A sound transmitting element, wherein the sound transmitting element has a first sound transmitting channel and a second sound transmitting channel that are interconnected, and a sound transmitting angle is formed between the first sound transmitting channel and the second sound transmitting channel. The first sound transmitting channel is connected to the inlet of the sound transmitting element, and the second sound transmitting channel is connected to the outlet of the sound transmitting element. A receiver is connected to a sound transmitter, the receiver having a sound inlet and the sound outlet correspondingly connected to the sound outlet of the sound transmitter; An earplug, comprising a heat-conducting plug body and a soft filling medium, the heat-conducting plug body being for contact with a wearer, and the heat-conducting plug body being sleeved with a sound transmitting element and a sound receiving element; the heat-conducting plug body having a sound outlet channel communicating with a sound outlet, the heat-conducting plug body also having an accommodating space, wherein the accommodating space is isolated from the sound outlet channel, the soft filling medium being disposed within the accommodating space to deform the surface of the heat-conducting plug body; the heat-conducting plug body having a sleeve groove communicating with the sound outlet channel, and portions of the sound transmitting element and the sound receiving element being engaged within the sleeve groove.

2. The earphone sound receiving apparatus according to claim 1, wherein The sound transmission angle is between 68° and 118°.

3. The earphone sound receiving apparatus according to claim 2, wherein The first sound transmission channel and the second sound transmission channel are arranged perpendicular to each other.

4. The earphone sound receiving apparatus according to claim 1, wherein The sound transmission device includes a sound transmission box and a sound transmission body. The sound transmission body is disposed inside the sound transmission box. The sound transmission body has a first sound transmission channel and a second sound transmission channel. The sound transmission box has an inlet and an outlet. The inlet is corresponding to the first sound transmission channel, and the outlet is corresponding to the second sound transmission channel.

5. The earphone sound receiving apparatus according to claim 4, wherein The sound transmitting element also includes a gap reducing plate, which is disposed inside the sound transmitting box. The gap reducing plate abuts against the inner wall of the sound transmitting box and the sound transmitting body. The gap reducing plate also has a first through hole communicating with the sound outlet, and the first through hole is also correspondingly disposed with the sound receiving port.

6. The earphone sound receiving apparatus according to claim 5, wherein The sound transmission component further includes a first interference ring, which is located between the reducing plate and the sound transmission body, and the middle part of the first interference ring is connected to the sound outlet.

7. The earphone sound receiving apparatus according to claim 5, wherein The sound box includes interconnected housings and a vibration damping plate. The vibration damping plate has the sound outlet and is located between the housing and the receiver. The vibration damping plate is used to reduce the vibration amplitude of the receiver.

8. The earphone sound receiving apparatus according to claim 4, wherein The sound transmission element further includes a second interference ring, which is located between the inner wall of the sound transmission box and the sound transmission body, and the middle part of the second interference ring is connected to the sound inlet.

9. The earphone sound receiving apparatus according to claim 4, wherein The sound transmission device also includes a pickup tube connected to the sound transmission box. The interior of the pickup tube is in communication with the sound inlet. The pickup tube is used to connect to the outer shell of the player.

10. An earphone, characterized by Includes the headphone sound transmission device as described in any one of claims 1 to 9.

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