A ceramic assembly and a method of manufacturing the same, and a method of manufacturing a ceramic package housing

Abstract

This invention provides a ceramic component and its preparation method, as well as a method for preparing a ceramic encapsulation shell. The ceramic component includes a body with a multilayer ceramic substrate stacked structure. The body includes a finished product area and an auxiliary area. The surface of the finished product area has N electroplating areas with different electroplating parameters and which are not interconnected. The outer contour of the auxiliary area's cross-section parallel to the plane of the multilayer ceramic substrate is polygonal. At least N non-interconnected cathode conductive areas are provided on the sides of the polygonal auxiliary area. At least N electroplating lines are also provided on the ceramic substrate. Each cathode conductive area is electrically connected to only one electroplating area through an electroplating line. The ceramic component of this invention can be electroplated by sequentially connecting the cathode electroplating clamps to the cathode conductive areas on the sides of each auxiliary area, allowing for electroplating of areas with different electroplating requirements. The cathode conductive areas are located on the sides of the auxiliary areas, and their size is not limited by the finished product size. Ordinary electroplating fixtures can be used to clamp and electroplat the sides of the auxiliary areas, resulting in simple operation and high production efficiency.

Description

Technical Field

[0001] This invention relates to the field of ceramic packaging technology, and in particular to a ceramic component and its preparation method, and a method for preparing a ceramic packaging shell. Background Technology

[0002] Ceramic packaging shells are used for chip packaging and are typically made by stacking multiple ceramic substrates using semiconductor processes. The ceramic packaging shell has various plating areas, such as ground pads, signal pads, or metal sealing rings. A conductive plating substrate layer is printed on these plating areas. During plating, the plating areas of the workpiece are electrically connected by clamping them with a cathode plating fixture. The plating cathode, the workpiece, and the plating anode are all immersed in the plating solution to achieve plating. Multiple plating areas can be connected by plating lines, which are disconnected after plating is complete.

[0003] When different plating zones have different plating requirements, surface masking is typically used to achieve these requirements. For example, some areas may require nickel plating while others require nickel-gold plating. Usually, after nickel plating, adhesive is applied to the areas requiring only nickel plating before gold plating. The adhesive prevents the nickel-plated areas from contacting the gold plating solution, thus achieving different plating requirements by masking the surface. However, this adhesive application method is cumbersome, easily contaminates the plating solution, and is inefficient, making it unsuitable for mass production. Summary of the Invention

[0004] This invention provides a ceramic component and its preparation method, as well as a method for preparing a ceramic encapsulation shell, to solve the problem of low electroplating efficiency for ceramic encapsulation shells with various electroplating requirements.

[0005] In a first aspect, embodiments of the present invention provide a ceramic component, comprising: a body with a multilayer ceramic substrate stacked structure. The body includes a finished product area and an auxiliary area surrounding the finished product area. The surface of the finished product area has N electroplating areas with different electroplating parameters and not interconnected, wherein N is greater than or equal to 2. The outer contour of the cross-section of the auxiliary area parallel to the plane of the multilayer ceramic substrate is a polygon, wherein the number of sides of the polygon is greater than N. The sides of the polygonal auxiliary area have at least N non-interconnected cathode conductive areas. The ceramic substrate also has at least N electroplating lines, wherein one end of each electroplating line is electrically connected to the electroplating area and the other end is electrically connected to the cathode conductive area. Each cathode conductive area is electrically connected to only one electroplating area via an electroplating line.

[0006] In one possible implementation, the cathode conductive regions located on the same side are connected to the same electroplating region.

[0007] In one possible implementation, the polygon has 2N sides. At least one of the two opposing sides of the polygonal auxiliary area has a cathode conductive area. The cathode conductive areas on the two opposing sides of the polygonal auxiliary area are connected to the same electroplating area.

[0008] In one possible implementation, N is 2 and the polygon has 4 sides.

[0009] In one possible implementation, the electroplating area includes a metal ring electroplating area for nickel plating and a pad electroplating area for nickel-gold plating. The metal ring electroplating area is the outer surface of a metal ring sintered onto the finished product area.

[0010] In one possible implementation, the electroplating lines are located on the surface of the body.

[0011] In one possible implementation, the electroplating lines are disposed between the multilayer ceramic substrates.

[0012] Secondly, embodiments of the present invention provide a method for fabricating a ceramic component. The method includes: fabricating a body of a multilayer ceramic substrate stacked structure, wherein the body includes a finished product area and an auxiliary area surrounding the finished product area. The surface of the finished product area is provided with N electroplating areas with different electroplating parameters and not interconnected, wherein N is greater than or equal to 2. The outer contour of the cross-section of the auxiliary area parallel to the plane of the multilayer ceramic substrate is a polygon, wherein the number of sides of the polygon is greater than N. At least N non-interconnected cathode conductive areas are fabricated on the side surfaces of the polygonal auxiliary area. At least N electroplating lines are fabricated on the ceramic substrate, wherein one end of each electroplating line is electrically connected to the electroplating area and the other end is electrically connected to the cathode conductive area. Each cathode conductive area is electrically connected to only one electroplating area through the electroplating line.

[0013] Thirdly, embodiments of the present invention provide a method for preparing a ceramic encapsulation shell, wherein the ceramic encapsulation shell is formed based on a ceramic component as described in any possible implementation of the first aspect. The method includes: using an electroplating fixture to electrically connect the cathode conductive regions corresponding to each electroplating area one by one, and electroplating each electroplating area of ​​the ceramic component based on the electroplating parameters corresponding to each electroplating area. The auxiliary areas of the electroplated ceramic component are then removed to obtain the ceramic encapsulation shell.

[0014] In one possible implementation, the electroplating fixture has a multi-jaw structure. This multi-jaw electroplating fixture includes at least N+1 elastic jaws and a fixing section for securing each of the elastic jaws. The fixing section is used to connect to the cathode of the electroplating power supply. Each of the elastic jaws is used to electrically connect to a corresponding conductive area of ​​the cathode.

[0015] This invention provides a ceramic component and its preparation method, as well as a method for preparing a ceramic encapsulation shell. The ceramic component includes a body with a multilayer ceramic substrate stacked structure. The body includes a finished product area and an auxiliary area surrounding the finished product area. The surface of the finished product area has N electroplating areas with different electroplating parameters and which are not interconnected, where N is greater than or equal to 2. The outer contour of the cross-section of the auxiliary area parallel to the plane of the multilayer ceramic substrate is a polygon, where the number of sides of the polygon is greater than N. The sides of the polygonal auxiliary area have at least N non-interconnected cathode conductive areas. The ceramic substrate also has at least N electroplating lines, where one end of the electroplating line is electrically connected to the electroplating area and the other end is electrically connected to the cathode conductive area. Each cathode conductive area is electrically connected to only one electroplating area through the electroplating line. By setting up a polygonal auxiliary area around the finished product area and setting non-interconnected cathode conductive areas on the sides of the auxiliary area, each cathode conductive area is connected to an electroplating area with different electroplating requirements one-to-one through the electroplating lines. Electroplating of each electroplating area with different electroplating requirements can be performed by electrically connecting the cathode conductive areas on the sides of each auxiliary area one by one. After electroplating, the auxiliary area can be removed to obtain ceramic packaging shells with various electroplating requirements. The cathode conductive area is located on the side of the auxiliary area. The size of the cathode conductive area is not limited by the size of the finished product. Ordinary electroplating fixtures can be used to hold the auxiliary area for electroplating, which is simple to operate and has high production efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a top view of a ceramic component provided in an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of a cross-sectional structure of a ceramic component provided in an embodiment of the present invention;

[0019] Figure 3 This is a top view of another ceramic component provided in an embodiment of the present invention;

[0020] Figure 4 This is a top view of the third type of ceramic component provided in the embodiments of the present invention;

[0021] Figure 5 This is a schematic diagram of the internal electroplating line provided in an embodiment of the present invention;

[0022] Figure 6 This is a flowchart of a method for preparing a ceramic component according to an embodiment of the present invention;

[0023] Figure 7 This is a flowchart of a method for preparing a ceramic encapsulation shell according to an embodiment of the present invention;

[0024] Figure 8 This is a schematic diagram of the electroplating fixture provided in an embodiment of the present invention. Detailed Implementation

[0025] To enable those skilled in the art to better understand this solution, the technical solutions in the embodiments of this solution will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this solution, not all of them. Based on the embodiments of this solution, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this solution.

[0026] The term "comprising" and any other variations thereof in the specification, claims, and accompanying drawings of this invention mean "including but not limited to," and are intended to cover a non-exclusive inclusion, not limited to the examples listed herein. Furthermore, the terms "first" and "second," etc., are used to distinguish different objects, not to describe a specific order.

[0027] The implementation of the present invention will be described in detail below with reference to the accompanying drawings:

[0028] Ceramic package housings feature various plating areas, such as ground pads, signal pads, or metal sealing rings. Because ceramic is an insulator, a conductive plating substrate layer is typically printed on each plating area, along with plating lines connecting the areas. During plating, plating fixtures clamp the plating areas on the ceramic package housing; generally, it's sufficient to ensure the fixtures are electrically connected to any one plating area. Typically, the largest plating area on the ceramic package housing is clamped by the fixture. This method is suitable when the plating requirements for all plating areas on the ceramic package housing are the same.

[0029] When different plating areas have different requirements, the small size of the ceramic packaging shell and the large size of the plating fixture make it difficult to distinguish the location of each plating area and to accurately clamp different plating positions with the plating fixture. Surface masking is typically used to achieve different plating requirements. For example, if some areas require nickel plating and others require nickel-gold plating, nickel plating is usually performed first. After nickel plating, adhesive is applied to the areas requiring only nickel plating before gold plating. The adhesive prevents the nickel-plated areas from contacting the gold plating solution, thus achieving different plating requirements by masking the surface. As another example, if some areas require a thicker plating layer, overall plating is required first, followed by masking the areas with normal plating thickness with adhesive before plating. Due to the small size of the ceramic packaging shell, adhesive application usually requires manual application under a microscope using specialized tools, which is difficult and cumbersome. The adhesive contains solvents that are easily soluble in the plating solution, contaminating it. This adhesive application method is cumbersome, easily contaminates the plating solution, and is inefficient, making it unsuitable for mass production.

[0030] This invention provides a ceramic component and its preparation method, as well as a method for preparing a ceramic encapsulation shell, to solve the problem of low electroplating efficiency for ceramic encapsulation shells with various electroplating requirements.

[0031] Figure 1 This is a top view of a ceramic component provided in an embodiment of the present invention. Figure 2 This is a schematic cross-sectional view of a ceramic component provided in an embodiment of the present invention. (Refer to...) Figure 1 , Figure 2 The ceramic component includes:

[0032] The main body is constructed by stacking multiple ceramic substrates. The main body includes a finished product area 101 and an auxiliary area 102 surrounding the finished product area 101. The surface of the finished product area 101 has N electroplating areas 103 with different electroplating parameters and not interconnected, where N is greater than or equal to 2. The outer contour of the cross-section of the auxiliary area 102 parallel to the plane of the multilayer ceramic substrate is a polygon, where the number of sides of the polygon is greater than N. The sides of the polygonal auxiliary area 102 have at least N non-interconnected cathode conductive areas 104. The ceramic substrate also has at least N electroplating lines 105, one end of which is electrically connected to the electroplating area 103, and the other end is electrically connected to the cathode conductive area 104. Each cathode conductive area 104 is electrically connected to only one electroplating area 103 through the electroplating line 105.

[0033] The ceramic component is fabricated by stacking multiple ceramic substrates. The ceramic component is divided into a finished product area 101 and an auxiliary area 102 along a direction parallel to the plane of the ceramic substrates. The auxiliary area 102 surrounds the finished product area 101. The finished product area 101 contains internal circuitry connecting the upper and lower surfaces of the ceramic component, while the auxiliary area 102 does not contain such internal circuitry. The internal circuitry may include circuitry printed on the ceramic substrate and vertical metal vias connecting the upper and lower surfaces of the ceramic substrate. After electroplating of the ceramic component, removing the auxiliary area 102 yields the finished product, i.e., the ceramic encapsulation shell.

[0034] The surface of the finished product area 101 of the ceramic component is provided with an electroplating area 103 for electroplating. The electroplating area 103 can be a pad area for connecting internal circuits, such as a ground pad area or a signal pad area. Generally, a conductive electroplating substrate layer, such as tungsten metallization paste, is printed in the pad area. The electroplating area 103 can also be a metal sealing ring provided on the ceramic component. The electroplating area 103 is connected to the cathode of the electroplating power supply, and the ceramic component can be immersed in the electroplating solution for electroplating.

[0035] Electroplating parameters include the type of metal to be plated and / or the thickness of the metal plating. Different electroplating parameters include different types of metal to be plated and / or different thicknesses of metal plating. For example, among multiple electroplating areas 103, some electroplating areas 103 require nickel plating, while others require nickel-gold plating. As another example, multiple electroplating areas 103 may use the same type of metal, but the thickness of the metal plating in some areas 103 may be greater than in other areas 103.

[0036] There are multiple electroplating zones 103, each with different electroplating parameters, and these zones are not interconnected, i.e., they are not electrically connected to each other. For example, two electroplating zones 103 with different electroplating parameters are not electrically connected to each other through the aforementioned internal circuit.

[0037] The auxiliary area 102 has a polygonal outer contour, meaning the outer contour of its cross-section parallel to the plane of the multilayer ceramic substrate is polygonal. The auxiliary area 102 surrounds the finished product area 101, and the inner contour of the auxiliary area 102 is the same as the outer contour of the finished product area 101. The shape of the finished product area 101 is not limited and is typically cylindrical or rectangular. The auxiliary area 102 with its polygonal outer contour has a polygon with at least 3 sides and greater than N, which can be odd or even. The side lengths of its polygons can be the same or different.

[0038] The auxiliary area 102, with its polygonal outer contour, has sides that of the ceramic component. A cathode conductive area 104 is provided on the side of the auxiliary area 102. The cathode conductive area 104 is used for electrical connection to the cathode of the electroplating power supply. The cathode conductive area 104 can be an electroplating substrate layer printed on the side of the auxiliary area 102, such as tungsten metallization paste. At least N cathode conductive areas 104 are provided on the side of the auxiliary area 102. The cathode conductive areas 104 are not interconnected. Multiple cathode conductive areas 104 can be provided on one side of the auxiliary area 102, or only one cathode conductive area 104 can be provided. The cathode conductive areas 104 can be provided on all sides of the auxiliary area 102, or only on some sides of the auxiliary area 102. For example, the cathode conductive areas 104 can also be provided on the upper and lower surfaces of the auxiliary area 102.

[0039] The ceramic substrate is further provided with at least N electroplating lines 105. The electroplating lines 105 can be disposed on the upper or lower surface of the ceramic assembly, i.e., the upper surface of the top ceramic substrate or the lower surface of the bottom ceramic substrate. The electroplating lines 105 can also be disposed between ceramic substrate layers, i.e., inside the ceramic assembly. One end of the electroplating line 105 is electrically connected to the electroplating area 103, and the other end is electrically connected to the cathode conductive area 104. During electroplating, the cathode of the electroplating power supply is connected to the cathode conductive area 104, and the cathode conductive area 104 is connected to the electroplating area 103 through the electroplating line 105. After electroplating, the electroplating line 105 is disconnected by removing the auxiliary area 102. Each cathode conductive area 104 is electrically connected to only one electroplating area 103 through the electroplating line 105. Each electroplating area 103 can be connected to one cathode conductive area 104 through the electroplating line 105, or it can be connected to multiple cathode conductive areas 104 through the electroplating line 105.

[0040] This invention provides a ceramic component with a polygonal auxiliary area 102 surrounding a finished product area 101. The sides of the auxiliary area 102 are provided with non-interconnected cathode conductive areas 104. Each cathode conductive area 104 is connected to an electroplating area 103 with different electroplating requirements via an electroplating line 105. Electroplating of each electroplating area 103 with different requirements can be performed by electrically connecting the cathode conductive areas 104 on the sides of each auxiliary area 102 one by one using a cathode electroplating clamp. After electroplating, removing the auxiliary area 102 yields a ceramic encapsulation shell with various electroplating requirements. The cathode conductive areas 104 are located on the sides of the auxiliary area 102, and their size is not limited by the finished product size. Ordinary electroplating fixtures can be used to clamp and electroplat the sides of the auxiliary area 102, resulting in simple operation and high production efficiency.

[0041] The electroplating fixture clamps the side of the ceramic component, electrically connecting the cathode conductive area 104 to the cathode of the electroplating power source. The size of the electroplating fixture is usually larger than the size of the ceramic component. In actual operation, it is difficult to distinguish the different cathode conductive areas 104 on the side of the ceramic component, and it is also difficult to accurately clamp different positions on the side of the ceramic component using the electroplating fixture.

[0042] Figure 3 This is a top view of another ceramic component provided in an embodiment of the present invention. (Refer to...) Figure 3 :

[0043] In one possible implementation, cathode conductive regions 104 located on the same side are connected to the same electroplating region 103. For example, a cathode conductive region 104 is provided on one side of the auxiliary region 102, and this cathode conductive region 104 is connected to an electroplating region 103 via an electroplating line 105. For example, multiple cathode conductive regions 104 are provided on one side of the auxiliary region 102, and these multiple cathode conductive regions 104 are connected to the same electroplating region 103 via electroplating lines 105.

[0044] One or more cathode conductive areas 104 on the same side of the auxiliary area 102 are connected to the same electroplating area 103. By clamping the side of the ceramic component with electroplating clamps, it is only necessary to ensure that the electroplating clamps are in contact with one side of the auxiliary area 102, without distinguishing the specific contact position on that side.

[0045] Electroplating fixtures typically consist of two opposing metal plates. An elastic structure applies a force to move the two plates towards each other, achieving the clamping action. When the number of sides of the ceramic component is odd, the electroplating fixture does not hold the ceramic component securely. When the number of sides of the ceramic component is even, and the cathode conductive areas 104 on opposite sides are connected to different electroplating areas 103, an insulating pad can be added between one of the metal plates of the electroplating fixture and the ceramic component to achieve simultaneous electroplating of only one electroplating area 103. However, this method is cumbersome.

[0046] Figure 4 This is a top view of the third type of ceramic component provided in an embodiment of the present invention. (Refer to...) Figure 4 :

[0047] In one possible implementation, the polygon has 2N sides. At least one of the two opposing sides of the polygon auxiliary region 102 has a cathode conductive region 104. The cathode conductive regions 104 on the two opposing sides of the polygon auxiliary region 102 are connected to the same electroplating region 103.

[0048] For example, a cathode conductive area 104 is provided on one of the two opposing sides of the polygonal auxiliary area 102. For example, cathode conductive areas 104 are provided on both opposing sides of the polygonal auxiliary area 102. When cathode conductive areas 104 are provided on both opposing sides of the auxiliary area 102, the cathode conductive areas 104 on both sides are connected to the same electroplating area 103. N electroplating areas 103 with different electroplating parameters correspond to N sets of opposing sides, ensuring that when the electroplating fixture clamps any set of opposing sides, only one electroplating area 103 can be electroplated. In actual electroplating operation, it is only necessary to switch between clamping different sets of opposing sides to electroplat each electroplating area 103, which is convenient and has high electroplating efficiency.

[0049] In one possible implementation, N is 2, and the polygon has 4 sides. With 4 sides, the outer contour of the ceramic component is rectangular. Rectangular ceramic components are the most material-efficient in production and processing.

[0050] Metal rings for sealing can be welded onto ceramic encapsulation components. Typically, tungsten metallization paste is printed at the welding point to fix the metal ring to the welding point on the ceramic component, and then the metal ring is welded to the ceramic component through sintering. If the subsequent electroplating of the metal ring requires the same metal as other electroplating areas 103 of the ceramic component, for example, all requiring nickel-gold plating, then nickel-gold plating can be performed separately, and the metal ring can be welded to the ceramic component after electroplating. In this case, the welding point is a gold-gold interface, and conventional welding processes can be used. If the metal ring requires nickel plating, while other electroplating areas 103 of the ceramic component require nickel-gold plating, if they are electroplated separately before welding, the welding point will be a nickel-gold interface, making it difficult to ensure the welding effect. If ordinary adhesive is used for bonding, the adhesive has poor high-temperature resistance, resulting in a small temperature gradient for subsequent welding of the ceramic component. Therefore, welding is required before electroplating. That is, tungsten metallization paste is first printed at the welding point, the metal ring is fixed, and then sintered. Furthermore, because the sintering temperature is higher than the welding temperature of the gold-gold interface solder, the bonding strength between the sintered metal ring and the ceramic component is higher, and the temperature gradient for subsequent welding of the ceramic component is larger.

[0051] In one possible implementation, the electroplating area 103 includes a metal ring electroplating area for nickel plating and a pad electroplating area for nickel-gold plating. The metal ring electroplating area is the outer surface of a metal ring sintered onto the finished product area 101.

[0052] This invention provides a ceramic component by sintering a metal ring onto the surface of the ceramic component. Electroplating lines 105 connecting the metal ring to the cathode conductive area 104, and electroplating lines 105 connecting the solder pad electroplating area to the cathode conductive area 104, allow for separate electroplating of the metal ring and solder pad surfaces. This results in nickel plating on the metal ring and nickel-gold plating on the solder pads on the same ceramic component. This avoids the need for surface masking with adhesive, resulting in high electroplating efficiency. Furthermore, by sintering the metal ring onto the ceramic component first and then performing electroplating, a larger temperature gradient is achieved during subsequent soldering of the ceramic component.

[0053] In one possible implementation, the electroplating line 105 is provided on the surface of the body. (Refer to...) Figure 2 For example, the electroplating line 105 is disposed on the upper surface of the top ceramic substrate. The electroplating line 105 may also be disposed on the lower surface of the bottom ceramic substrate.

[0054] Figure 5 This is a schematic diagram of the internal electroplating line 105 provided in an embodiment of the present invention. (Refer to...) Figure 5 :

[0055] In one possible implementation, the electroplating lines 105 are disposed between the multilayer ceramic substrates. When there are many electroplating areas 103 and it is too complex to set the electroplating lines 105 on the surface of the ceramic component, an internal routing method can be used to place the electroplating lines 105 between the multilayer ceramic substrates. For example, the upper and lower surfaces of the ceramic substrates can be connected through vertical through-holes.

[0056] Figure 6 This is a flowchart illustrating a method for preparing a ceramic component according to an embodiment of the present invention. (Refer to...) Figure 6 The method includes:

[0057] In step S101, a body for fabricating a multilayer ceramic substrate stacked structure is prepared. The body includes a finished product region 101 and an auxiliary region 102 surrounding the finished product region 101. The surface of the finished product region 101 has N electroplating regions 103 with different electroplating parameters and which are not interconnected, where N is greater than or equal to 2. The outer contour of the cross-section of the auxiliary region 102 parallel to the plane of the multilayer ceramic substrate is a polygon, where the number of sides of the polygon is greater than N.

[0058] For example, single-layer ceramic substrates can be fabricated separately. Each single-layer ceramic substrate is divided into a finished product area 101 and an auxiliary area 102 surrounding the finished product area 101. Internal circuits are fabricated by printing circuits on the surface of the finished product area 101 and fabricating vertical metallized vias. The single-layer ceramic substrates are stacked and sintered to form a multilayer ceramic substrate stack structure. Conductive paste is printed on the pads of the finished product area 101 on the surface of the ceramic component to connect the internal circuits, forming an electroplating area 103.

[0059] In step S102, at least N non-interconnected cathode conductive regions 104 are prepared on the side of the polygonal auxiliary region 102.

[0060] For example, conductive paste is printed on multiple non-interconnected areas on the side of the polygonal auxiliary area 102 to form at least N non-interconnected cathode conductive areas 104.

[0061] In step S103, at least N electroplating lines 105 are prepared on the ceramic substrate, wherein one end of the electroplating line 105 is electrically connected to the electroplating area 103 and the other end is electrically connected to the cathode conductive area 104. Each cathode conductive area 104 is electrically connected to only one electroplating area 103 through the electroplating line 105.

[0062] For example, a linear conductive paste connecting the electroplating area 103 and the cathode conductive area 104 is printed on a ceramic substrate to form an electroplating line 105. For example, sintering and curing can be performed after the conductive paste is printed to form the electroplating area 103, the cathode conductive area 104 and the electroplating line 105.

[0063] The ceramic component preparation method provided in this embodiment of the invention involves forming a ceramic component by setting a polygonal auxiliary area 102 around the finished product area 101. Non-communicating cathode conductive areas 104 are set on the sides of the auxiliary area 102. Each cathode conductive area 104 is connected to an electroplating area 103 with different electroplating requirements via an electroplating line 105. Electroplating of each electroplating area 103 with different requirements can be performed by electrically connecting the cathode conductive areas 104 on the sides of each auxiliary area 102 one by one using a cathode electroplating clamp. After electroplating, the auxiliary area 102 is removed to obtain a ceramic encapsulation shell with various electroplating requirements. The cathode conductive areas 104 are located on the sides of the auxiliary area 102, and their size is not limited by the finished product size. Ordinary electroplating fixtures can be used to clamp and electroplat the sides of the auxiliary area 102, resulting in simple operation and high production efficiency.

[0064] Figure 7 This is a flowchart illustrating a method for fabricating a ceramic encapsulation shell according to an embodiment of the present invention. The ceramic encapsulation shell is formed based on a ceramic component as described in any of the possible implementations above, with reference to... Figure 7 The method includes:

[0065] In step S201, an electroplating fixture is used to electrically connect the cathode conductive area 104 corresponding to each electroplating area 103 one by one, and electroplating is performed on each electroplating area 103 of the ceramic component based on the electroplating parameters corresponding to each electroplating area 103.

[0066] For example, an electroplating fixture is used to electrically connect the cathode conductive area 104 corresponding to one electroplating area 103 to the cathode of the electroplating power supply, and the ceramic component is placed in the electroplating solution for electroplating. After electroplating is completed, the electroplating fixture is used to electrically connect the cathode conductive area 104 corresponding to another electroplating area 103 to the cathode of the electroplating power supply for electroplating.

[0067] In step S202, the auxiliary area 102 of the electroplated ceramic component is removed to obtain a ceramic encapsulation shell.

[0068] For example, the auxiliary area 102 is removed by laser cutting of the ceramic component. After the auxiliary area 102 is removed, the electroplating line 105 and the cathode conductive area 104 provided on the auxiliary area 102 are separated from the finished product area 101, and a ceramic encapsulation shell is obtained.

[0069] The electroplating fixture can be a two-claw structure. During electroplating, the fixture clamps two sides of the ceramic component and electrically connects to the cathode conductive area 104 for electroplating. After electroplating, the fixture clamps the other two sides of the ceramic component and electrically connects to another cathode conductive area 104 for electroplating. This process requires removing the ceramic component and re-fixing it with the electroplating fixture, which is inconvenient and inefficient.

[0070] Figure 8 This is a schematic diagram of the electroplating fixture provided in an embodiment of the present invention. (Refer to...) Figure 8 :

[0071] In one possible implementation, the electroplating fixture has a multi-jaw structure. The multi-jaw electroplating fixture includes at least N+1 elastic jaws 801 and a fixing section 802 for fixing each elastic jaw. The fixing section 802 is used to connect to the cathode of the electroplating power supply. Each elastic jaw 801 is used to electrically connect to each cathode conductive area 104 in a one-to-one correspondence.

[0072] For example, the above-described method of using an electroplating fixture to electrically connect each electroplating area 103 to the corresponding cathode conductive area 104, and electroplating each electroplating area 103 of the ceramic component based on the electroplating parameters corresponding to each electroplating area 103, includes: using an electroplating fixture with a multi-claw structure to clamp the side of each auxiliary area 102, wherein each elastic claw finger 801 is electrically connected to each cathode conductive area 104. Based on the electroplating parameters corresponding to each electroplating area 103, each electroplating area 103 of the ceramic component is electroplated one by one.

[0073] For example, each elastic claw finger 801 of the electroplating fixture is electrically connected to a fixed section 802, and the fixed section 802 is connected to the cathode of the electroplating power supply. By adding an insulating sheet between the elastic claw finger 801 and the cathode conductive area 104, the energization status and the electroplating of a specific cathode conductive area 104 can be determined.

[0074] For example, the fixing section 802 of the electroplating fixture includes multiple mutually insulated wires, one end of each wire being electrically connected to each elastic claw finger 801, and the other end of each wire being connected to the cathode of the electroplating power supply. Whether to energize and to electroplat a specific cathode conductive area 104 can be controlled by switching the connection between each wire and the cathode of the electroplating power supply.

[0075] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A ceramic component, characterized in that, include: The body of a multilayer ceramic substrate stacked structure; The main body includes a finished product area and an auxiliary area surrounding the finished product area; The surface of the finished product area is provided with N electroplating areas with different electroplating parameters and which are not interconnected, wherein N is greater than or equal to 2; The outer contour of the cross section of the auxiliary area parallel to the plane of the multilayer ceramic substrate is a polygon; The sides of the polygonal auxiliary area are provided with at least N non-interconnected cathode conductive areas; The ceramic substrate is further provided with at least N electroplating lines, wherein one end of the electroplating line is electrically connected to the electroplating area and the other end is electrically connected to the cathode conductive area; each cathode conductive area is electrically connected to only one of the electroplating areas through the electroplating line. The cathode conductive areas on the same side are connected to the same electroplating area; the polygon has 2N sides; at least one side of the two opposing sides of the polygon auxiliary area is provided with a cathode conductive area; the cathode conductive areas provided on the two opposing sides of the polygon auxiliary area are connected to the same electroplating area; wherein, the cathode conductive areas on the sides of the auxiliary area are used to be clamped one by one by the cathode electroplating fixture to realize electroplating of electroplating areas with different electroplating requirements respectively.

2. The ceramic component as described in claim 1, characterized in that, N is 2, and the polygon has 4 sides.

3. The ceramic component as described in claim 2, characterized in that, The electroplating area includes a metal ring electroplating area for nickel plating and a pad electroplating area for nickel-gold plating. The electroplating area of ​​the metal ring is the outer surface of the metal ring sintered on the finished product area.

4. The ceramic component as described in claim 1, characterized in that, The electroplating line is located on the surface of the body.

5. The ceramic component as described in claim 1, characterized in that, The electroplating lines are located between the multilayer ceramic substrates.

6. A method for preparing a ceramic component, characterized in that, The method includes: A body for fabricating a multilayer ceramic substrate stacked structure, wherein the body includes a finished product area and an auxiliary area surrounding the finished product area; the surface of the finished product area is provided with N electroplating areas with different electroplating parameters and which are not interconnected, wherein N is greater than or equal to 2; the outer contour of the cross section of the auxiliary area parallel to the plane of the multilayer ceramic substrate is a polygon. At least N non-interconnected cathode conductive regions are prepared on the side of the polygonal auxiliary region; At least N electroplating lines are prepared on the ceramic substrate, wherein one end of each electroplating line is electrically connected to the electroplating area and the other end is electrically connected to the cathode conductive area; each cathode conductive area is electrically connected to only one electroplating area through the electroplating line; cathode conductive areas on the same side are connected to the same electroplating area; the polygon has 2N sides; at least one side of the two opposing sides of the polygonal auxiliary area is provided with a cathode conductive area; the cathode conductive areas on the two opposing sides of the polygonal auxiliary area are connected to the same electroplating area; wherein the cathode conductive areas on the sides of the auxiliary area are used to be clamped one by one by a cathode electroplating fixture to realize electroplating of electroplating areas with different electroplating requirements.

7. A method for preparing a ceramic encapsulation shell, characterized in that, The ceramic encapsulation housing is formed based on a ceramic component as described in any one of claims 1 to 5, and the method includes: Electroplating fixtures are used to electrically connect the corresponding cathode conductive areas of each electroplating area one by one, and electroplating is performed on each electroplating area of ​​the ceramic component based on the electroplating parameters corresponding to each electroplating area. The auxiliary area of ​​the electroplated ceramic component is removed to obtain a ceramic encapsulation shell.

8. The method for preparing the ceramic encapsulation shell as described in claim 7, characterized in that, The electroplating fixture has a multi-jaw structure; The multi-claw electroplating fixture includes at least N+1 elastic claws and a fixing section for fixing each elastic claw; the fixing section is used to connect to the cathode of the electroplating power supply; each elastic claw is used to electrically connect to each cathode conductive area in a one-to-one correspondence.

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