Plasma spraying device and plasma spray deposition system

Abstract

The present invention provides a plasma spraying device and a plasma spray deposition system. The power supply module in the device includes an integrated control unit, a power supply control unit, and a power supply unit, which are arranged in sequence. The power supply unit includes multiple plasma power supplies connected in parallel. The multiple plasma power supplies are connected to the anode of the plasma spray gun via a positive control connection unit and a first water-power cluster connection unit, and are connected to the cathode of the plasma spray gun via a negative control connection unit and a second water-power cluster connection unit. The multiple plasma power supplies in the device adopt a parallel control mode and balance the load through distributed logic self-rectification control. At the same time, integrated control is achieved through the integrated control unit and the power supply control unit, ensuring that the simultaneous output loads of multiple power supplies are absolutely balanced. In addition, the output mode can also be set through the connection module to meet the requirements of different plasma spray processes and plasma spray guns, thereby realizing the versatility of the power supply module and the interchangeability of different types of system equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal protective coating preparation technology, in particular to a plasma spraying device and a plasma spraying deposition system. Background Art

[0002] The main process technologies for the preparation of high-temperature protective coatings include slurry infiltration, vapor infiltration, chemical vapor deposition (CVD), physical vapor deposition (PVD) and thermal spraying (TS). Among them, thermal spraying technology has the advantages of low cost and high efficiency, and is widely used in various aspects such as high-temperature oxidation resistance coatings, thermal barrier coatings and environmental barrier coatings. For example, high-velocity oxygen-fuel spraying technology (HVOF) and plasma spraying technology (PS) use high-energy jet melting, softening and semi-molten coupling to deposit metal and ceramic powders, and are widely used in aviation, aerospace, metallurgy, petrochemical, heavy industry and other fields. Plasma spraying includes atmospheric plasma spraying (APS), inner plasma spraying (IPS), vacuum plasma spraying (VPS), plasma spraying-physical vapor deposition (PS-PVD), etc. In practical applications, plasma spraying uses a DC plasma power supply to power the plasma generator (plasma spray gun). The plasma spraying system requires the main power supply to have a low current ripple rate and fast dynamic response characteristics. When the plasma arc impedance changes, the output voltage can be quickly adjusted to maintain a constant current output state, thereby maintaining the stability of the plasma arc flame and obtaining a high-quality coating.

[0003] The various plasma processes mentioned above have different operating parameter ranges. For example, the APS process uses different plasma generators, with operating currents ranging from 100A to 1000A and operating voltages from 30V to 200V. There are also single plasma power supply and three plasma power supply modes (three-electrode plasma spraying). The PS-PVD process, due to its higher operating current (≤3000A), also uses a three-plasma power supply mode to accommodate the high-output current spraying mode. Therefore, there are two main types of plasma power supply outputs: 1. High voltage, low current. This increases the thermal enthalpy while using a lower plasma current to mitigate thermal corrosion and wear of the anode and cathode. This mode is typically used by high-power, high-enthalpy plasma spray guns. 2. Low voltage, high current, a common operating mode for conventional plasma spray guns. These plasma spray guns typically have shorter anode and cathode lifespans due to the high load current, which can easily lead to ablation. Operating currents typically range from 500A to 1000A, with PS-PVD spray guns having a maximum current of 3000A.

[0004] In response to the above-mentioned different plasma spraying process requirements, power supplies with rated power ranging from 80kW to 200kW have emerged in an endless stream to meet the needs of different preparation companies, resulting in difficulty, cycle and cost expenditure in design and development. In addition, power supplies for different plasma spraying systems are basically not interchangeable, which has caused great waste for engineering applications and user use. Therefore, the universalization of plasma power supplies (low ripple, high dynamic characteristics and high stability, high power) is of great significance. Among them, the universalization of plasma power supplies can reduce the interference and influence of the grid power supply output frequency and waveform on traditional thyristor power supplies and thyristor power supplies by optimizing the output stability and high-frequency output of different loads, thereby improving the output stability of plasma and improving energy utilization. The subsequent development of inverter power supplies and high-frequency chopper power supplies are all part of this technological development trend.

[0005] Since the plasma spraying system is also oriented towards integrated design and manufacturing (integration of main equipment and auxiliary equipment, devices), multi-functionality (one machine with multiple functions) and system modular integration (dividing the system into different modules and controlling different spraying processes through an integrated control system), and the plasma power supply as the core power supply device of the integrated multi-functional equipment is particularly critical, the plasma power supply and its combined control technology that are suitable for different types of plasma spraying processes (vacuum, inner hole, rotation, atmosphere, etc.) and different characteristics of atmospheric plasma spraying guns are problems that need to be solved urgently. Summary of the Invention

[0006] In view of this, the purpose of the present invention is to provide a plasma spraying device and a plasma spray deposition system to alleviate the above-mentioned technical problems. It not only ensures that the load output by multiple power supplies is absolutely balanced at the same time, but also meets the requirements of different plasma spraying processes and plasma spray guns, and realizes the versatility of the power supply module and the interchangeability of different types of system equipment.

[0007] In a first aspect, an embodiment of the present invention provides a plasma spraying device, comprising: a power module, a connection module, a water-power transfer box, a water chiller, and a plasma spray gun; wherein the power module comprises an integrated control unit, a power control unit, and a power unit arranged in sequence, and the power unit comprises a plurality of plasma power supplies connected in parallel; the connection module comprises a positive control connection unit and a negative control connection unit; the water-power transfer box comprises: a first water-power bundle connection unit and a second water-power bundle connection unit; the positive poles of the plurality of plasma power supplies are connected to one end of the positive control connection unit, and the negative poles of the plurality of plasma power supplies are connected to one end of the negative control connection unit; the other end of the positive control connection unit is connected to one end of the first water-power bundle connection unit, and the other end of the negative control connection unit is connected to one end of the second water-power bundle connection unit; the other end of the first water-power bundle connection unit is connected to the anode of the plasma spray gun, and the other end of the second water-power bundle connection unit is connected to the cathode of the plasma spray gun, and the first water-power bundle connection unit and the second water-power bundle connection unit are both connected to the water chiller.

[0008] Preferably, the plasma power supply is a high-power inverter power supply or a high-frequency chopper power supply.

[0009] Preferably, each plasma power supply is configured with a first output mode and a second output mode; wherein the first output mode is a high current and low voltage output mode, and the second output mode is a low current and high voltage output mode.

[0010] Preferably, the number of plasma power supplies is 3.

[0011] Preferably, the water chiller includes a water outlet and a water return port; wherein the water outlet is connected to the first water-power cluster connection unit through a first pipeline, and the water return port is connected to the second water-power cluster connection unit through a second pipeline.

[0012] Preferably, the device further comprises a collection module; wherein the collection module comprises a first collection unit and a second collection unit, the first collection unit is arranged on the first pipeline, and the second collection unit is arranged on the second pipeline.

[0013] Preferably, the first acquisition unit includes: an outlet water pressure sensor, an outlet water temperature sensor and an outlet water flow sensor; the second acquisition unit includes: a return water pressure sensor, a return water temperature sensor and a return water flow sensor.

[0014] Preferably, the plasma spray gun also includes an anode water cable and a cathode water cable; wherein, one end of the anode water cable is connected to the anode, and the other end is connected to the other end of the first water-power cluster connection unit, and one end of the cathode water cable is connected to the cathode, and the other end is connected to the other end of the second water-power cluster connection unit.

[0015] Preferably, the plasma spray gun comprises one of the following: an inner hole plasma spray gun, a rotary plasma spray gun, a single cathode and anode cascade plasma spray gun, a triple cathode plasma spray gun, a triple anode plasma spray gun, a triple electrode plasma spray gun and a vacuum plasma spray gun.

[0016] In a second aspect, an embodiment of the present invention further provides a plasma spray deposition system, which includes the plasma spray device of the first aspect.

[0017] The embodiments of the present invention bring the following beneficial effects:

[0018] Embodiments of the present invention provide a plasma spraying device and a plasma spray deposition system. Multiple plasma power supplies are connected to the anode of a plasma spray gun through a positive control connection unit and a first hydropower cluster connection unit, and are connected to the cathode of the plasma spray gun through a negative control connection unit and a second hydropower cluster connection unit. The multiple plasma power supplies in the device are controlled in parallel, and load is balanced through distributed logic self-rectification control. At the same time, integrated control is achieved through an integrated control unit and a power supply control unit, ensuring that the simultaneous output load of multiple power supplies is absolutely balanced. In addition, the output mode can also be set through the connection module, achieving stable current output, while meeting the requirements of different plasma spray processes and plasma spray guns, thereby greatly improving the adaptability of the power supply module and achieving the versatility and interchangeability of the power supply module with different types of system equipment.

[0019] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0020] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A schematic structural diagram of a plasma spraying device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0024] To facilitate understanding of this embodiment, the embodiment of the present invention is described in detail below.

[0025] An embodiment of the present invention provides a plasma spraying device, which includes at least: a power module, a connection module, a water-electricity transfer box, a water cooler, and a plasma spray gun.

[0026] like Figure 1 As shown, the power module includes an integrated control unit 11, a power control unit 12, and a power unit, which are arranged in sequence. The power unit includes multiple plasma power sources 13 connected in parallel. Preferably, the plasma power sources 13 are high-power inverter power sources or multi-phase interleaved high-frequency chopper power sources. A corresponding power control dedicated circuit 131 is also provided between each plasma power source 13 and the power control unit 12, so that the power control unit 12 can control the multiple plasma power sources 13 in parallel. Specifically, if the plasma power sources 13 are high-power inverter power sources, each plasma power source 13 has a rated power of 120kW, and each plasma power source 13 is configured with a first output mode and a second output mode. The first output mode is a high-current, low-voltage output mode, i.e., an output current range of 100A to 1000A and a voltage range of 12V to 120V. The second output mode is a low-current, high-voltage output mode, i.e., an output current range of 50A to 600A and a voltage range of 30V to 200V, to adapt to different process requirements. If the plasma power supply 13 is a multi-phase interleaved parallel high-frequency chopping power supply, it is preferably a three-phase interleaved or four-phase interleaved high-frequency chopping. Taking three-phase interleaving as an example, three independent power sub-modules are set inside each plasma power supply 13. The rated power of each power sub-module is 70kW. The three power sub-modules have three-phase interleaved output to achieve high-frequency chopping with a frequency of 8kHZ. At the same time, each phase adopts capacitor filtering to achieve low current ripple rate and smooth output.

[0027] In actual application, the number of the above-mentioned plasma power supplies 13 is 3, and they are controlled in parallel. Specifically, the parallel control method means that the three plasma power supplies 13 can output loads at the same time, or can flexibly select single power supply, dual power supply and triple power supply to output at the same time; that is, each plasma power supply 13 has an independent power supply output function, and the integrated control unit 11 monitors and calculates the output of the plasma spray gun, and determines the output form of the power load according to the plasma spray gun and the spraying process, and distributes the power output to the power control unit 12, so that the power control unit 12 controls the output of the three plasma power supplies 13. Here, the power control unit 12 uses the Modbus protocol to control the output of the three power loads, mainly controlling the output total spraying current (It ) is a single power supply, a dual-group output, or a triple-group output, and controls the output mode of a single plasma power supply 13. For example, when the maximum output It is 2800A, when It is less than 500A, a single power supply is used for output and the output mode of the single plasma power supply 13 is switched according to the voltage of the plasma spray gun; when 500A≤It≤1200A, a two-group power supply average output current mode is adopted; when 1200A<It≤2800A, a three-group power supply average output current mode is adopted; when a single plasma power supply 13 switches the output mode, it automatically switches the output mode when 80% of the maximum output current or maximum output voltage of the plasma power supply is reached.

[0028] It should be noted that the integrated control unit 11 is preferably a PLC (Programmable Logic Controller), and the power control unit 12 may also be referred to as a three-way power control dedicated circuit board) or a centralized power controller, and that the integrated control unit 11 and the power control unit 12 are communicatively connected. Furthermore, when dual or triple power outputs are provided, the power control unit 12 employs distributed logic self-rectification control to balance the load of each plasma power source 13 when multiple power outputs are provided. This means that the current load is automatically balanced among the multiple plasma power sources 13 according to the set current value, thereby achieving current balance.

[0029] The above-mentioned connection module includes a positive control connection unit 21 and a negative control connection unit 22; the positive control connection unit 21 is also called a three-way positive control connection unit, and the negative control connection unit 22 is also called a three-way negative control connection unit, that is, the connection module includes 3 positive poles and 3 negative poles, which not only meets the output of single power supply, dual power supply and three groups of power supplies, but also has the advantages of easy disassembly and installation, which is convenient for adapting to the conversion requirements of different groups of power outputs and different types of plasma spray guns.

[0030] The water-to-electricity transfer box includes a first water-to-electricity cluster connection unit 31 and a second water-to-electricity cluster connection unit 32, enabling combined output of single, dual, and triple power supplies, such as parallel output when three plasma power supplies are working together. It also features easy assembly and disassembly, allowing for separate outputs from the three plasma power supplies. It also utilizes a quick-plug method, sealing the waterway with a sealing ring and connecting the circuit with an insulated isolation connector, achieving water-to-electricity transfer. The water-to-electricity transfer box also includes a high-frequency device and circuit 33.

[0031] Specifically, for the above-mentioned device, the positive poles of multiple plasma power supplies 13 are connected to one end of the positive control connection unit 21, and the negative poles of multiple plasma power supplies 13 are connected to one end of the negative control connection unit 22; the other end of the positive control connection unit 21 is connected to one end of the first hydropower bundling connection unit 31, and the other end of the negative control connection unit 22 is connected to one end of the second hydropower bundling connection unit 32, and the other end of the first hydropower bundling connection unit 31 is connected to the anode of the plasma spray gun 40, and the other end of the second hydropower bundling connection unit 32 is connected to the cathode of the plasma spray gun 40, and the first hydropower bundling connection unit 31 and the second hydropower bundling connection unit 32 are both connected to the water chiller 50.

[0032] The water chiller 50 includes a water outlet and a water return port. The water outlet is connected to the first water-power cluster connection unit 31 via a first pipeline, and the water return port is connected to the second water-power cluster connection unit 32 via a second pipeline. Furthermore, the device includes a data collection module, which includes a first data collection unit and a second data collection unit. The first data collection unit is disposed on the first pipeline, and the second data collection unit is disposed on the second pipeline.

[0033] Preferably, the first data acquisition unit includes an outlet water pressure sensor 61, an outlet water temperature sensor 62, and an outlet water flow sensor 63; the second data acquisition unit includes a return water pressure sensor 64, a return water temperature sensor 65, and a return water flow sensor 66. It should be noted that the number of each sensor may be one or more, and the specific setting can be determined based on actual conditions.

[0034] In addition, the plasma spray gun 40 also includes an anode water cable 41 and a cathode water cable 42; wherein, one end of the anode water cable 41 is connected to the anode, and the other end is connected to the other end of the first water-power cluster connection unit 31, and one end of the cathode water cable 42 is connected to the cathode, and the other end is connected to the other end of the second water-power cluster connection unit 32. In actual applications, the plasma spray gun 40 is a spray gun adapted to different plasma spraying processes, including but not limited to: an inner hole plasma spray gun, a rotary plasma spray gun, a single cathode and anode cascade plasma spray gun, a three-cathode plasma spray gun, a three-anode plasma spray gun, and a three-electrode plasma spray gun adapted to ordinary atmospheric plasma spraying processes (covering different forms such as external surface and internal control spraying); a vacuum plasma spray gun adapted to vacuum plasma spraying processes; a high-power plasma spray gun adapted to plasma physical vapor deposition; a three-electrode plasma spray gun adapted to vacuum suspension spray deposition; and a plasma spray gun adapted to all other specific plasma spraying processes with an output power of less than 300kW, etc. Plasma spraying processes include but are not limited to vacuum plasma spraying, inner hole plasma spraying, rotary plasma spraying, plasma physical vapor deposition, conventional atmospheric plasma spraying, suspension plasma spraying and vacuum suspension plasma spraying, etc. Therefore, the plasma spraying process and the plasma spray gun can be specifically set according to actual conditions.

[0035] In addition, for single-cathode and single-electrode plasma spray guns with different plasma spraying processes, the first water-power cluster connection unit 31 and the second water-power cluster connection unit 32 are connected to automatically control the output of the plasma power supply 13 according to the load characteristics of the plasma spray gun; for three-cathode plasma spray guns, three-electrode plasma spray guns, and three-anode plasma spray guns, the connection of the first water-power cluster connection unit 31 and the second water-power cluster connection unit 32 is disassembled / installed to connect the positive or negative electrode in three ways.

[0036] For vacuum plasma spray guns and high-power plasma spray guns adapted for plasma physical vapor deposition, in actual applications, the plasma spray gun works in a vacuum chamber, and the first water-electricity cluster connection unit 31 and the second water-electricity cluster connection unit 32, as well as the positive control connection unit 21 and the negative control connection unit 22 require a vacuum penetration plate to connect the plasma spray gun and the water-electricity transfer box. Here, the vacuum penetration plate has 1 anode and 4 cathode water cable interfaces. The cathode water cable interface is used to connect to three plasma power supply outputs separately and 1 water-electricity cluster connection unit output. When the water cable is not connected, the interface is sealed with a metal sealing device equipped with a sealing ring.

[0037] Therefore, the above-mentioned plasma spraying device adopts a parallel control method for three groups of high-power plasma power supplies. The plasma power supplies use a centralized controller and distributed logic self-rectification to control the balanced load of each group of power supplies. At the same time, two water-power cluster connection units are set in the water-power transfer box at the front end of the plasma spray gun to achieve stable current output while meeting the needs of different plasma spray processes and plasma spray guns. That is, the embodiment of the present invention develops and applies an integrated device that integrates vacuum plasma, internal hole plasma, and atmospheric plasma spraying, and develops a plasma spray device with parallel control of multiple power supplies that is suitable for multi-process and multi-functional plasma spray deposition systems. This alleviates the technical problem of using different plasma power supplies to adapt to different plasma spray processes in the prior art, and realizes that a single power supply module can meet the needs of different types of plasma spray and spray guns. It can significantly improve the adaptability of the power supply unit and realize the versatility of the power supply unit and the interchangeability of different types of system equipment.

[0038] In summary, the plasma spraying device provided by the embodiment of the present invention has the following advantages:

[0039] (1) The power module can realize a variety of plasma spraying processes and plasma spray guns, that is, it has the technical characteristics of independent functions, strong adaptability, and high versatility. It can adapt to the plasma system equipment with a DC plasma spray power of less than 300kW that is currently known and will be developed in the future;

[0040] (2) The integrated control unit and power control unit optimize the power type and main parameters, and constrain the control method and the connection of the plasma spray gun. Through the dual protection of centralized control and independent power control, combined with the plasma spraying process, the output of balanced power load under multiple guarantees is achieved. In addition, the decentralized logic control form with uniform current distribution is adopted to improve the stability of current output; by constraining the high-frequency chopper power supply and inverter power supply, the overall performance of the power module is improved;

[0041] (3) Unlike the traditional plasma spraying system that is configured with a specific power supply, this power supply module can be used to build a multifunctional plasma spraying system that is suitable for all plasma spraying processes within a certain power range, which can greatly improve the utilization rate of the power supply and system;

[0042] (4) The output stability of the plasma spraying device is improved. When the plasma power supply outputs at full power or close to the rated power for a long time, the output stability is reduced. At the same time, the long-term high-load output affects the life of electronic components. By switching the output mode of multiple power supplies, the stability of the plasma spraying process can be improved while maintaining a stable output load within different process ranges.

[0043] Furthermore, based on the above-mentioned plasma spraying device, an embodiment of the present invention also provides a plasma spray deposition system, which includes the above-mentioned plasma spraying device. In addition, it also includes other devices, such as a vacuum device, a clamping device for clamping the plasma spray gun, etc. For details, please refer to the existing plasma spray deposition system, and the embodiment of the present invention will not be described in detail here.

[0044] The plasma spray deposition system provided in the embodiment of the present invention has the same technical features as the plasma spray device provided in the above embodiment, and therefore can also solve the same technical problems and achieve the same technical effects.

[0045] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working process of the system described above can refer to the corresponding process in the aforementioned device embodiment and will not be repeated here.

[0046] In addition, in the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0047] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0048] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the above-described embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily conceive of changes to the technical solutions described in the above-described embodiments within the technical scope disclosed by the present invention, or replace some of the technical features therein with equivalents. Such modifications, changes, or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A plasma spraying device, characterized in that: include: A power module, a connection module, a water-power transfer box, a water chiller, and a plasma spray gun; wherein the power module includes an integrated control unit, a power control unit, and a power unit arranged in sequence, and the power unit includes multiple plasma power supplies connected in parallel; the connection module includes a positive control connection unit and a negative control connection unit; the water-power transfer box includes: a first water-power bundle connection unit and a second water-power bundle connection unit; A corresponding power supply control dedicated circuit is further provided between each of the plasma power supplies and the power supply control unit, and the power supply control unit controls the multiple plasma power supplies in parallel via the multiple power supply control dedicated circuits; The positive electrodes of the plurality of plasma power supplies are connected to one end of the positive control connection unit, and the negative electrodes of the plurality of plasma power supplies are connected to one end of the negative control connection unit; the other end of the positive control connection unit is connected to one end of the first hydropower bundle connection unit, and the other end of the negative control connection unit is connected to one end of the second hydropower bundle connection unit, and the other end of the first hydropower bundle connection unit is connected to the anode of the plasma spray gun, and the other end of the second hydropower bundle connection unit is connected to the cathode of the plasma spray gun, and both the first hydropower bundle connection unit and the second hydropower bundle connection unit are connected to the water chiller.

2. The plasma spraying device according to claim 1, characterized in that: The plasma power supply is a high-power inverter power supply or a high-frequency chopping power supply.

3. The plasma spraying device according to claim 1, characterized in that: Each of the plasma power supplies is configured with a first output mode and a second output mode; wherein the first output mode is a high current and low voltage output mode, and the second output mode is a low current and high voltage output mode.

4. The plasma spraying device according to claim 1, characterized in that: The number of the plasma power supplies is 3.

5. The plasma spraying device according to claim 1, characterized in that: The water chiller includes a water outlet and a water return port; wherein the water outlet is connected to the first water-power bundle connection unit through a first pipeline, and the water return port is connected to the second water-power bundle connection unit through a second pipeline.

6. The plasma spraying device according to claim 5, characterized in that: The device further includes a collection module; wherein the collection module includes a first collection unit and a second collection unit, the first collection unit is arranged on the first pipeline, and the second collection unit is arranged on the second pipeline.

7. The plasma spraying device according to claim 6, characterized in that: The first acquisition unit includes: an outlet water pressure sensor, an outlet water temperature sensor and an outlet water flow sensor; the second acquisition unit includes: a return water pressure sensor, a return water temperature sensor and a return water flow sensor.

8. The plasma spraying device according to claim 1, characterized in that: The plasma spray gun also includes an anode water cable and a cathode water cable; wherein, one end of the anode water cable is connected to the anode, and the other end is connected to the other end of the first water-power bundle connection unit; one end of the cathode water cable is connected to the cathode, and the other end is connected to the other end of the second water-power bundle connection unit.

9. The plasma spraying device according to claim 1, characterized in that: The plasma spray gun includes one of the following: an inner hole plasma spray gun, a rotary plasma spray gun, a single cathode and anode cascade plasma spray gun, a triple cathode plasma spray gun, a triple anode plasma spray gun, a triple electrode plasma spray gun and a vacuum plasma spray gun.

10. A plasma spray deposition system, characterized in that: The system comprises the plasma spraying device according to any one of claims 1 to 9.

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