PCB assembly

Abstract

Disclosed are PCB assemblies. According to an embodiment of the present invention, a PCB assembly is provided as a printed circuit board on which a plurality of devices are mounted, including: a power supply area arranged on one side of a main printed circuit board; a first area located in a direction of the other side of the main printed circuit board based on the power supply area and including a plurality of devices; a second area located in a direction of the other side of the main printed circuit board based on the first area and including a plurality of devices; a third area located in a direction of the other side of the main printed circuit board based on the second area and including a plurality of devices; and a bridge printed circuit board receiving power from the power supply area and arranged perpendicularly to the main printed circuit board, the bridge printed circuit board crossing the first area, the second area, and the third area and transferring power and signals to at least one area.

Description

Technical Field

[0001] This invention relates to PCB assemblies. More specifically, it relates to a PCB assembly capable of circumventing various electrical signals. Background Technology

[0002] The content described in this section is merely for providing background information for this invention and does not constitute prior art.

[0003] A PCB (Printed Circuit Board) contains multiple electronic components, each used to transmit and receive signals. However, when the number of signals to be transmitted and received increases, or when high-speed signal processing is required, the signal processing speed slows down, leading to a decrease in PCB performance.

[0004] To address the issue of slow signal processing speed, a common approach is to increase the number of PCB layers to expand component capacity. However, if the components need to process a large number of electrical signals or require high-speed signal processing, the PCB should ideally have multiple layers, such as twenty or more. Therefore, manufacturing such PCBs requires overcoming various technical challenges and incurs higher costs. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] This invention is proposed to solve the above-mentioned problems. Its purpose is to provide a PCB assembly that solves the problem of reduced signal processing speed by taking a detour of electrical signals without increasing the number of PCB layers.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, according to an embodiment of the present invention, a PCB assembly is provided as a printed circuit board on which multiple devices are mounted, comprising: a power supply area disposed on one side of a main PCB; a first area disposed on the other side of the main PCB based on the power supply area and including multiple devices; a second area disposed on the other side of the main PCB based on the first area and including multiple devices; a third area disposed on the other side of the main PCB based on the second area and including multiple devices; and a bridge printed circuit board that receives power supply from the power supply area and is disposed perpendicular to the main PCB, the bridge printed circuit board traversing the first area, the second area and the third area, and transmitting power and signal to at least one area.

[0009] (III) Beneficial Effects

[0010] As described above, according to this embodiment, by routing various electrical signals, the number of PCB layers can be reduced without increasing manufacturing costs, thus preventing bottlenecks. Attached Figure Description

[0011] Figure 1 This is a perspective view of a PCB assembly according to an embodiment of the present invention.

[0012] Figure 2 This is a top view of a PCB assembly according to an embodiment of the present invention.

[0013] Figure 3 This is a bottom view of a PCB assembly according to an embodiment of the present invention.

[0014] Figure 4 This is an exploded perspective view of one side of a bridging printed circuit board according to an embodiment of the present invention.

[0015] Figure 5 This is a cross-sectional view of the bridging printed circuit board and the card connector when the bridging printed circuit board is mounted on and removed from the card connector according to an embodiment of the present invention.

[0016] Figure 6 This is a cross-sectional view of the main printed circuit board and the bridging printed circuit board when the bridging printed circuit board is soldered onto the main printed circuit board according to an embodiment of the present invention. Detailed Implementation

[0017] Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings. When labeling the various figures, the same reference numerals are used as much as possible, even if the same constituent elements appear in different figures. Throughout this specification, detailed descriptions of known constituent elements and functions are omitted if it is believed that such detailed descriptions would obscure the subject matter of the present invention.

[0018] In describing the constituent elements according to embodiments of the present invention, symbols such as first, second, i), ii), a), and b) may be used. These symbols are used only to distinguish constituent elements from other constituent elements and are not intended to define the nature, order, or sequence of the corresponding constituent elements. In the specification, if a constituent element "comprises" or "possesses" another constituent element, unless explicitly stated otherwise, it shall be understood that the constituent element further includes the other constituent element, rather than that the constituent element excludes the other constituent element.

[0019] Figure 1 This is a perspective view of a PCB assembly according to an embodiment of the present invention.

[0020] Figure 2 This is a top view of a PCB assembly according to an embodiment of the present invention.

[0021] Figure 3 This is a bottom view of a PCB assembly according to an embodiment of the present invention.

[0022] Reference Figures 1 to 3 According to an embodiment of the present invention, a PCB assembly includes all or a portion of a main printed circuit board 100, a power supply area 140, a first area 110, a second area 120, a third area 130, a bridge printed circuit board 150, a plurality of filters 170, and a card connector 160.

[0023] Multiple devices may be mounted on the main printed circuit board 100. According to an embodiment of the present invention, the main printed circuit board 100 may be, for example, a board used in a communication antenna system, but is not necessarily limited thereto.

[0024] A power supply region 140 may be arranged on one side of the main printed circuit board 100. The power supply region 140 is configured to supply power to the main printed circuit board 100, and can supply different voltages depending on the various components mounted on the main printed circuit board 100. According to an embodiment of the present invention, the power supply region 140 supplies DC power.

[0025] The first region 110 is located on the opposite side of the main printed circuit board 100, based on the power supply region 140. That is, with one side of the main printed circuit board 100 as a reference, the power supply region 140 and the first region 110 are arranged in that order. The first region 110 may include multiple components 300. The multiple components 300 may be, for example, field-programmable gate arrays (FPGAs) or application-specific integrated circuits (ASICs), but are not necessarily limited to these.

[0026] The second region 120 is located on the opposite side of the main printed circuit board 100, based on the first region 110. That is, with one side of the main printed circuit board 100 as a reference, the power supply region 140, the first region 110, and the second region 120 are arranged in that order. The second region 120 may also include multiple components 300. The multiple components 300 may be, for example, FPGAs or ASICs, but are not necessarily limited to these.

[0027] The third region 130 is located on the opposite side of the main printed circuit board 100, based on the second region 120. That is, with one side of the main printed circuit board 100 as a reference, the third region 130 is arranged in the order of power supply region 140, first region 110, second region 120, and third region 130. The third region 130 may also include multiple components 300. The multiple components 300 may be, for example, FPGAs or ASICs, but are not necessarily limited to these.

[0028] The bridging printed circuit board 150 may be arranged perpendicularly to the main printed circuit board 100 and receive power from the power supply area 140. The bridging printed circuit board 150 may traverse the first area 110, the second area 120 and the third area 130 and transmit power and high-speed signals to at least one area.

[0029] If a bridging printed circuit board 150 is used, for example, when power needs to be supplied to the third region 130, it may not pass through the first region 110 and the second region 120. Therefore, no additional power connection lines need to be arranged on the main printed circuit board 100.

[0030] One or more bridging printed circuit boards 150 can be arranged on the main printed circuit board 100, and multiple components can be mounted on the bridging printed circuit board 150.

[0031] Multiple filters 170 may be located in a region close to at least one side of the first region 110, the second region 120, and the third region 130. Multiple filters 170 may extract signals from a specific frequency band. An amp may be provided at the lower end of the multiple filters 170.

[0032] When multiple filters 170 are arranged on the main printed circuit board 100, they can be arranged parallel to the bridging printed circuit board 150. That is, they are arranged parallel to the direction of signal transmission in the bridging printed circuit board 150. When the bridging printed circuit board 150 and the multiple filters 170 are arranged parallel to each other, the multiple filters 170 can be arranged spaced apart from two sides of the bridging printed circuit board 150.

[0033] Card connector 160 is installed in at least one of the first region 110, the second region 120, and the third region 130, and is configured to engage with bridging printed circuit board 150. For example, one card connector 160 may be installed in each of the first region 110, the second region 120, and the third region 130. Furthermore, card connector 160 may be configured to allow bridging printed circuit board 150 to be installed and removed.

[0034] When the card connector 160 is installed, it forms an electrical connection with a plurality of components 300 arranged on one side of the first region 110, the second region 120, and the third region 130. Furthermore, when the bridging printed circuit board 150 is attached to the card connector 160, the card connector 160 and the bridging printed circuit board 150 also form an electrical connection. Therefore, the bridging printed circuit board 150 forms an electrical connection with the plurality of components 300 through the card connector 160.

[0035] The PCB assembly according to an embodiment of the present invention may further include other areas (not shown).

[0036] Other regions are included in the main printed circuit board 100, and are located on the other side of the main printed circuit board 100 based on the third region 130, and include multiple components. That is, other additional components can be arranged on one side of the other regions to perform other functions.

[0037] When the main printed circuit board 100 includes other regions, the bridging printed circuit board 150 can traverse the first region 110, the second region 120, the third region 130 and other regions, and transmit power and signals to at least one region.

[0038] According to an embodiment of the present invention, a PCB assembly may include all or a portion of a main device 310 and a subdevice 320.

[0039] For example, the main component 310 may be arranged on one side of the second region 120, and the sub-component 320 may be arranged on one side of the first region 110 and the third region 130.

[0040] The main component 310 receives digital signals and performs operations, then uses the bridging printed circuit board 150 to transmit the digital signals based on the operation results to the sub-component 320. The signals transmitted by the main component 310 can be data signals, control signals, etc.

[0041] Sub-element 320 can receive signals from main element 310 and perform calculations, and can control multiple elements. For example, sub-element 320 can control multiple radio frequency integrated circuits (RFICs) arranged on the main printed circuit board 100.

[0042] Signals from the main component 310 and the sub-component 320 can be transmitted via the bridging printed circuit board 150. Therefore, signal transmission between components can be achieved via the bridging printed circuit board without passing through the main printed circuit board 100. For example, the main component 310 and the sub-component 320 can be mounted on the main printed circuit board 100 with more than 100 signal transmission pins. In this case, if all signals were transmitted through the main printed circuit board 100, it could lead to a decrease in the signal processing speed of the components; therefore, it is preferable that at least a portion of the signals be transmitted via the bridging printed circuit board 150.

[0043] The first region 110, the second region 120 and the third region 130 may each be arranged with one or more main components 310 and sub-components 320.

[0044] A PCB assembly according to an embodiment of the present invention includes all or part of the above-described components, thereby enabling signals to be routed around the main printed circuit board 100 and transmitted to a plurality of components 300. Therefore, it has the effect of preventing signal speed degradation.

[0045] Figure 4 This is an exploded perspective view of one side of a bridging printed circuit board according to an embodiment of the present invention.

[0046] Reference Figure 4According to an embodiment of the present invention, a PCB assembly may include a plurality of power supply bars (400). For illustration... Figure 4 The multiple power supply rods 400 shown are represented in a somewhat exaggerated and protruding form, but are not limited to the form described above.

[0047] Multiple power supply bars 400 are mounted on at least one side of the bridging printed circuit board 150. That is, multiple power supply bars 400 can also be mounted on both sides of the bridging printed circuit board 150, and the number of them can be changed as needed.

[0048] Multiple power supply rods 400 can distribute the power supplied by the power supply area 140 to the first area 110, the second area 120, and the third area 130. In addition, each power supply rod 400 can receive its own different voltage, and different voltages can be allocated according to the needs of each area.

[0049] As described above, the bridging printed circuit board 150 includes a plurality of power supply bars 400, thereby simplifying the power supply lines of the main printed circuit board 100.

[0050] Figure 5 This is a cross-sectional view of the bridging printed circuit board and the card connector when the bridging printed circuit board is mounted on and removed from the card connector according to an embodiment of the present invention.

[0051] Figure 6 This is a cross-sectional view of the main printed circuit board and the bridging printed circuit board when the bridging printed circuit board is soldered onto the main printed circuit board according to an embodiment of the present invention.

[0052] Reference Figure 5 and Figure 6 According to an embodiment of the present invention, the bridging printed circuit board 150 can be connected to the card connector 160, or it can be directly soldered to the main printed circuit board 100.

[0053] When the bridging printed circuit board 150 is connected to the card connector 160, the bridging printed circuit board 150 is detachably connected to the card connector 160. A card connector 160 may be provided with multiple connection points for the bridging printed circuit board 150 to connect to, and the bridging printed circuit board 150 is also configured to allow multiple connection points to be inserted.

[0054] When the bridging printed circuit board 150 is directly soldered to the main printed circuit board 100, a groove for the bridging printed circuit board 150 to be joined can be formed on one side of the main printed circuit board 100. The bridging printed circuit board 150 is soldered into the groove of the main printed circuit board 100, thereby electrically connecting to multiple components 300.

[0055] The PCB assembly according to an embodiment of the present invention may further include a bridge cover (not shown) to prevent the bridge printed circuit board 150 from detaching from the main printed circuit board 100 or the card connector 160.

[0056] The bridge cover is arranged to be mounted or dismounted on the main printed circuit board 100 or the card connector 160, and while covering the bridge printed circuit board 150, it can prevent the bridge printed circuit board 150 from detaching. For example, the bridge cover may be formed in a 'C' shape, but is not necessarily limited thereto.

[0057] As described above, the PCB assembly according to an embodiment of the present invention has the effect of preventing the signal processing speed from decreasing without increasing the number of layers of the PCB by detouring various electrical signals such as power supply, data signals, control signals, etc. without passing through the main printed circuit board 100.

[0058] The above description is only for exemplifying the technical idea of this embodiment. For those with ordinary knowledge in the technical field to which this embodiment belongs, various modifications and deformations can be made without exceeding the essential features of this embodiment. Therefore, this embodiment is not used to limit the technical idea of this embodiment but for explanation. The scope of the technical idea of this embodiment is not limited by the described embodiment. The protection scope of this embodiment should be interpreted based on the following claims, and all technical ideas within the equivalent scope should be interpreted as belonging to the scope of the rights of this embodiment.

[0059] [Description of Reference Numerals]

[0060] 100: Main printed circuit board 110: First region

[0061] 120: Second region 130: Third region

[0062] 140: Power supply region 150: Bridge printed circuit board

[0063] 160: Card connector 170: Filter

[0064] 300: Component 310: Main component

[0065] 320: Sub-component 400: Power supply bar

[0066] [Cross-reference to Related Applications]

[0067] This application is based on Korean Patent Application No. 10-2020-0063074, filed on May 26, 2020, and claims the priority of this Korean patent application. The entire content of this Korean patent application is incorporated herein by reference.

Claims

1. A PCB assembly, characterized by As a printed circuit board on which a plurality of components are mounted, comprising: a power supply area disposed on one side of a main printed circuit board; a first area including a plurality of components disposed on the other side of the main printed circuit board based on the power supply area; a second area including a plurality of components disposed on the other side of the main printed circuit board based on the first area; a third area including a plurality of components disposed on the other side of the main printed circuit board based on the second area; and a bridge printed circuit board receiving power from the power supply area and disposed perpendicularly to the main printed circuit board, the bridge printed circuit board passing through the first, second, and third areas disposed on the same side of the main printed circuit board to transfer power and signals to at least one area, one side of the second area being disposed with a main component, one side of the first and third areas being disposed with a sub component, the main component being used to control the sub component, the main component transferring at least a part of signals to the sub component using the bridge printed circuit board, the main printed circuit board further including at least one other area including a plurality of components disposed on the other side of the main printed circuit board based on the third area, the bridge printed circuit board passing through the first, second, third, and other areas to transfer power and signals to at least one area.

2. The PCB assembly of claim 1, further comprising: a card connector mounted in at least one of the first, second, and third areas and disposed to be coupled with the bridge printed circuit board.

3. The PCB assembly of claim 1, further comprising: a plurality of filters disposed in an area adjacent to at least one side of the first, second, and third areas.

4. The PCB assembly of claim 3, wherein: the plurality of filters are disposed in a direction parallel to the bridge printed circuit board.

5. The PCB assembly of claim 4, wherein: the plurality of filters are disposed apart from both sides of the bridge printed circuit board.

6. The PCB assembly of claim 1, further comprising: a plurality of power supply bars mounted to at least one side of the bridge printed circuit board and used to supply power of different voltages.

7. The PCB assembly of claim 1, wherein: the bridge printed circuit board is a plurality.

8. The PCB assembly of claim 1, wherein: the bridge printed circuit board is soldered to at least one of the first, second, and third areas.

9. The PCB assembly of claim 2, further comprising: a bridge cover disposed to be detachably mounted to the main printed circuit board or the card connector and preventing the bridge printed circuit board from being detached by covering the bridge printed circuit board.

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