A winding tooling and winding method for the heating wire of a molecular beam epitaxy source furnace

Abstract

This application relates to the technical field of heating tooling, and specifically relates to a heating wire winding tooling and winding method for a molecular beam epitaxy source furnace. The heating wire winding tooling includes: a fixed column, a first fixed plate, a second fixed plate, a first rotating ring, and a second rotating ring; the first fixed plate and the second fixed plate are parallel to each other and are respectively detachably connected to both ends of the fixed column. The circumferential surfaces of the first fixed plate and the second fixed plate are both provided with a plurality of positioning grooves arranged at intervals in a circumferential manner, and each positioning groove penetrates through both side surfaces of the first fixed plate or the second fixed plate in the thickness direction; the first rotating ring and the second rotating ring are respectively rotatably and detachably arranged on the circumferential surfaces of the first fixed plate and the second fixed plate. The first rotating ring and the second rotating ring are both provided with an opening that penetrates the inner and outer circumferential surfaces of the first rotating ring or the second rotating ring, and the size of the opening is adapted to the positioning groove; reduce the probability of the heating wire generating plastic deformation and effectively ensure the uniform distribution of the temperature field of the molecular beam epitaxy source furnace.

Description

Technical Field

[0001] The present application relates to the technical field of heating tooling, and in particular to a molecular beam epitaxy source furnace heating wire winding tooling and a winding method. Background Art

[0002] The molecular beam source furnace is the core component of molecular beam epitaxy technology. The molecular beam source furnace is heated by heating wires uniformly surrounding the furnace. The solid material to be deposited in the furnace is melted and evaporated by the high temperature, rising from the furnace and sprayed along the furnace mouth into the molecular beam epitaxy chamber, and finally deposited on the sample stage to form a uniform thin film. The stability and uniformity of the temperature field of the molecular beam source furnace directly affect the flow and uniformity of the molecular beam, and determine the quality of the film. Figure 1 As shown, Figure 1 The present invention is a structural diagram of a molecular beam source furnace in the prior art. The molecular beam source furnace includes a first heating wire 10 and a plurality of first support rings 20. The first heating wire 10 is wound around the plurality of first support rings 20 in a circuitous manner and is bent back at the outermost first support ring 20 to form a bent portion. When the first heating wire 10 is wound, in order to make the temperature field of the molecular beam source furnace uniform, in addition to ensuring that the radius of the bent portion is uniform, it is also necessary to ensure that the portions of the first heating wires 10 between the first support rings 20 remain straight. Since the first heating wires 10 are distributed relatively densely, the distance between two adjacent first heating wires is generally less than 3 mm. Therefore, a slight bend between the first heating wires 10 (except the bent portion) will also have a great influence on the uniformity of the overall temperature of the molecular beam source furnace. The winding method of the first heating wire 10 in the prior art is as follows Figure 2 As shown ( Figure 2 This is a simplified diagram for a clearer presentation and does not represent a specific physical image). Figure 2 The first heating wire 10 passes through the first support ring 20 ( Figure 2 The first heating filament 10 is bent after passing through the adjacent hole b2 (indicated by a rectangle in the figure), and then stretched below the hole b2 so that the radius of the bending portion from the hole b1 to the hole b2 meets the requirement. During this process, the first heating filament segment from the hole b1 to the hole b2 in state a1 will be bent (i.e., A1). Since the distance between the hole b1 and the hole b2 is relatively small, the curvature of the bending portion is relatively large, which will cause plastic deformation of the first heating filament 10 after bending. Even if it undergoes stretching in state a2 (during stretching, A1 will be stretched to A2) and finally stretched to A3 in state a3, the A3 segment will eventually be bent and difficult to correct, thereby affecting the uniformity of the temperature field distribution of the molecular beam source furnace.

[0003] There is currently no effective technical solution to the above problems. Summary of the Invention

[0004] The purpose of this application is to provide a winding tooling and winding method for the heating wire of a molecular beam epitaxy source furnace, aiming to solve the problem that the existing heating wire generates plastic deformation during the winding process, which affects the uniformity of the temperature field distribution of the molecular beam source furnace, and effectively reduce the plastic deformation generated by the heating wire during the winding process.

[0005] This application provides a winding tooling for the heating wire of a molecular beam epitaxy source furnace, including:

[0006] Fixed columns, a first fixing plate, a second fixing plate, a first rotating ring, and a second rotating ring;

[0007] The first fixing plate and the second fixing plate are parallel to each other and are respectively detachably connected to both ends of the fixed column. The circumferential surfaces of the first fixing plate and the second fixing plate are both provided with a plurality of positioning grooves at intervals in a circumferential manner, and each of the positioning grooves penetrates through the two side surfaces of the first fixing plate or the second fixing plate in the thickness direction;

[0008] The first rotating ring and the second rotating ring are respectively rotatably and detachably arranged on the circumferential surfaces of the first fixing plate and the second fixing plate. The first rotating ring and the second rotating ring are both provided with an opening, and the opening penetrates through the inner and outer circumferential surfaces of the first rotating ring or the second rotating ring. The size of the opening is adapted to the positioning groove.

[0009] For the winding tooling of the heating wire of the molecular beam epitaxy source furnace provided by this application, by setting positioning grooves on the circumferential surfaces of the first fixing plate and the second fixing plate, when winding the heating wire, the openings of the first rotating ring and the second rotating ring are respectively rotated to the positioning grooves, which is convenient for the heating wire to be directly pressed into the positioning grooves without passing the entire section of the heating wire through the positioning grooves. Therefore, during the bending process of the heating wire, only the part of the heating wire at the position to be bent is bent, and the heating wire of the remaining part does not need to undergo a large-curvature bending process. Therefore, the probability of the heating wire generating plastic deformation can be greatly reduced, thereby effectively ensuring the uniformity of the temperature field distribution of the molecular beam epitaxy source furnace.

[0010] Optionally, the first rotating ring and the second rotating ring are both provided with at least one first threaded through hole, and the first threaded through hole penetrates through the inner and outer circumferential surfaces of the first rotating ring or the second rotating ring and is used for installing locking screws.

[0011] Optionally, a first concave hole is further provided between any two adjacent positioning grooves, and the first concave hole is adapted to the first threaded through hole and is used for the locking screw to extend into to lock the first rotating ring or the second rotating ring.

[0012] By providing a first concave hole adapted to the first threaded through hole, when it is necessary to fix the first rotating ring or the second rotating ring, it is convenient for the locking screw to extend into the first concave hole, thereby more reliably locking the first rotating ring or the second rotating ring.

[0013] Optionally, the width of the opening gradually decreases from the outside to the inside, and the width of the inner end of the opening is equal to the width of the notch of the positioning groove.

[0014] By setting the width of the opening to gradually decrease from the outside to the inside, when the heating wire is pressed into the positioning groove, the heating wire only needs to be placed at the opening with the largest width, and the heating wire is guided along the side wall of the opening into the inner end of the opening and then into the positioning groove, without the need to precisely align the heating wire with the opening, and the winding efficiency is improved.

[0015] Optionally, both the first fixing plate and the second fixing plate are connected to the fixing post by at least one screw.

[0016] Optionally, four of the first threaded through holes are provided on both the first rotating ring and the second rotating ring.

[0017] Optionally, the outer peripheral surfaces of the first rotating ring and the second rotating ring are connected by a connecting rod, and both ends of the connecting rod are respectively connected to the first rotating ring and the second rotating ring by the locking screws, and the connecting rod is used to synchronously rotate the first rotating ring and the second rotating ring.

[0018] Optionally, the positioning groove is a U-shaped groove.

[0019] Optionally, the fixing post is a telescopic structure, and the length of the fixing post is adjustable.

[0020] In a second aspect, the present application provides a method for winding a heating wire of a molecular beam epitaxy source furnace. Based on the above-mentioned molecular beam epitaxy source furnace heating wire winding tooling, the method includes the steps:

[0021] A1. Overlap at least two support rings and align the respective third through holes, then sleeve them onto the fixing post, and then install the first fixing plate and the second fixing plate at both ends of the fixing post; a plurality of the third through holes are circumferentially arranged on the support ring, and the third through holes penetrate the support ring in the thickness direction.

[0022] A2. Install the first rotating ring and the second rotating ring on the first fixing plate and the second fixing plate respectively, align the openings of the first rotating ring and the second rotating ring with the same positioning groove group. After the heating wire passes through the third through-hole and is pressed into the positioning groove group in sequence, adjust the two openings to align with each positioning groove group in sequence. After each alignment, bend the heating wire and pass it through the corresponding third through-hole and press it into the corresponding positioning groove group in sequence. The positioning groove group includes two positioning grooves respectively arranged on the first fixing plate and the second fixing plate and located on the same straight line.

[0023] A3. After winding is completed, disassemble the first rotating ring and the second rotating ring, remove the heating wire from each positioning groove, move each support ring to the required position and fix it to the heating wire, and then disassemble the first fixing plate and the second fixing plate and take out the fixing column.

[0024] Beneficial effects

[0025] A winding tool for the heating wire of a molecular beam epitaxy source furnace provided by the present application sets positioning grooves on the circumferential surfaces of the first fixing plate and the second fixing plate. When winding the heating wire, rotate the openings of the first rotating ring and the second rotating ring to the positioning grooves respectively, which is convenient for directly pressing the heating wire into the positioning grooves without passing the entire heating wire through the positioning grooves. Therefore, during the bending process of the heating wire, only the part of the heating wire at the position to be bent is bent, and the heating wire in the remaining part does not need to undergo a large-curvature bending process. Therefore, the probability of plastic deformation of the heating wire can be greatly reduced, effectively ensuring the uniform distribution of the temperature field of the molecular beam epitaxy source furnace. Description of the drawings

[0026] Figure 1 It is a schematic structural diagram of a molecular beam source furnace in the prior art.

[0027] Figure 2 It is a schematic diagram of the winding method of the first heating wire in the prior art.

[0028] Figure 3 It is a schematic structural diagram of the winding tool for the heating wire of the molecular beam epitaxy source furnace provided by the present application.

[0029] Figure 4 It is a schematic diagram before the heating wire provided by the present application is bent.

[0030] Figure 5 It is a schematic diagram after the heating wire provided by the present application is bent.

[0031] Figure 6 It is a schematic structural diagram of the second fixing plate provided by the present application.

[0032] Figure 7 Schematic structural diagram of the first rotating ring provided by this application.

[0033] Figure 8 Schematic structural diagram of the fixation of the first fixing plate and the second fixing plate to the fixing column provided by this application.

[0034] Reference numeral description: 10, first heating wire; 20, first support ring; 100, fixing column; 201, first fixing plate; 202, second fixing plate; 203, positioning groove; 204, first concave hole; 301, first rotating ring; 302, second rotating ring; 303, opening; 304, first threaded through hole; 305, locking screw; 400, connecting rod; 500, heating wire; 600, support ring; 701, iron sheet; 702, magnetic absorption cap; 800, convex part. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Usually, the components of the embodiments of the present application described and shown in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application to be protected, but only represents the selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0036] It should be noted that: similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0037] Please refer to Figures 3 - 8 , Figure 3 , which is a schematic structural diagram of a winding tool for a heating wire of a molecular beam epitaxy source furnace in an embodiment of the present application, aiming at the problem that the existing heating wire generates plastic deformation during the winding process, affecting the uniformity of the temperature field distribution of the molecular beam source furnace, and effectively reducing the plastic deformation generated by the heating wire during the winding process.

[0038] A winding tool for a heating wire of a molecular beam epitaxy source furnace provided by the present application includes:

[0039] Fixing column 100, first fixing plate 201, second fixing plate 202, first rotating ring 301 and second rotating ring 302;

[0040] The first fixing plate 201 and the second fixing plate 202 are parallel to each other and are respectively detachably connected to both ends of the fixing column 100. A plurality of positioning grooves 203 are evenly distributed in a circumferential direction on the peripheral surfaces of the first fixing plate 201 and the second fixing plate 202, and each positioning groove 203 penetrates through both side surfaces of the first fixing plate 201 or the second fixing plate 202 in the thickness direction;

[0041] The first rotating ring 301 and the second rotating ring 302 are respectively rotatably and detachably arranged on the peripheral surfaces of the first fixing plate 201 and the second fixing plate 202. The first rotating ring 301 and the second rotating ring 302 are both provided with an opening 303. The opening 303 penetrates through the inner and outer peripheral surfaces of the first rotating ring 301 or the second rotating ring 302, and the size of the opening 303 is adapted to the positioning groove 203 (that is, the size of the first opening of the positioning groove 203 is the same as the size of the opening 303, so as to ensure that the heating wire 500 smoothly enters the positioning groove 203 from the opening 303).

[0042] Specifically, as Figure 3 shown, by providing the positioning grooves 203 on the peripheral surfaces of the first fixing plate 201 and the second fixing plate 202, when the heating wire 500 is wound, the openings 303 of the first rotating ring 301 and the second rotating ring 302 are respectively rotated to the positioning grooves 203; it is convenient for the heating wire 500 to be directly pressed into the positioning grooves 203 without passing the entire heating wire 500 through the positioning grooves 203, so that only the part of the heating wire 500 at the position to be bent is bent during the bending process of the heating wire 500, and the heating wire 500 in the remaining part does not need to go through a large-curvature bending process. Therefore, the probability of plastic deformation of the heating wire 500 can be greatly reduced, thereby effectively ensuring the uniform distribution of the temperature field of the molecular beam epitaxy source furnace.

[0043] Among them, the structures of the first rotating ring 301 and the second rotating ring 302 are the same, and the structures of the first fixing plate 201 and the second fixing plate 202 are the same.

[0044] In some embodiments, the first rotating ring 301 and the second rotating ring 302 are both provided with at least one first threaded through hole 304. The first threaded through hole 304 penetrates through the inner and outer peripheral surfaces of the first rotating ring 301 or the second rotating ring 302 and is used for installing the locking screw 305.

[0045] Specifically, as Figure 3 and Figure 7 shown, by providing at least one first threaded through hole 304, it is convenient for the locking screw 305 to pass through the first threaded through hole 304 to be fixed to the first fixing plate 201 or the second fixing plate 202.

[0046] In some embodiments, a first recessed hole 204 is further provided between any two adjacent positioning grooves 203. The first recessed hole 204 is adapted to the first threaded through hole 304 and is used for the locking screw 305 to extend therein to lock the first rotating ring 301 or the second rotating ring 302.

[0047] Specifically, as Figure 3 and Figure 6 shown, by providing the first recessed hole 204 adapted to the first threaded through hole 304, when it is necessary to fix the first rotating ring 301 or the second rotating ring 302, the locking screw 305 can conveniently extend into the first recessed hole 204, thereby more reliably locking the first rotating ring 301 or the second rotating ring 302.

[0048] In some embodiments, the width of the opening 303 gradually decreases from the outside to the inside, and the width of the inner end of the opening 303 (i.e., Figure 7 at A) is equal to the notch width of the positioning groove 203.

[0049] Specifically, as Figure 7 shown, by providing the width of the opening 303 to gradually decrease from the outside to the inside, when the heating wire 500 is pressed into the positioning groove 203, the heating wire 500 only needs to be placed at the opening 303 with the largest width (i.e., Figure 7 at B), and the heating wire 500 is guided along the side wall of the opening 303 into the inner end of the opening 303 and thus into the positioning groove 203, without the need to precisely align the heating wire 500 with the inner part of the opening 303 (i.e., Figure 7 at A), and the winding efficiency is improved.

[0050] In some embodiments, both the first fixing plate 201 and the second fixing plate 202 are connected to the fixing column 100 by at least one screw.

[0051] Specifically, to connect the first fixing plate 201 and the second fixing plate 202 to the fixing column 100 respectively, setting at least one screw can achieve the connection; preferably, to make the connection more stable, two screws can also be provided (as Figure 3 shown), and the number of screws can be set according to actual needs.

[0052] In some other embodiments, as Figure 8As shown, both ends of the fixed column 100 are provided with a protruding portion 800 and an iron sheet 701. Positioning holes adapted to the protruding portion 800 are provided on both the first fixing plate 201 and the second fixing plate 202. The protruding portions 800 at both ends of the fixed column 100 respectively pass through the positioning holes of the first fixing plate 201 and the second fixing plate 202 to achieve the positioning of the first fixing plate 201 and the second fixing plate 202. Both the first fixing plate 201 and the second fixing plate 202 are connected to the fixed column 100 through a magnetic attraction cap 702. The magnetic attraction cap 702 has magnetism and is sleeved on the end of the protruding portion 800 protruding from the first fixing plate 201 or the second fixing plate 202. The magnetic attraction cap 702 presses the first fixing plate 201 or the second fixing plate 202 against the end of the fixed column 100 by adsorbing the corresponding iron sheet 701. Through this setting, the first fixing plate 201 and the second fixing plate 202 can be quickly connected to the fixed column 100. When disassembly is required, just remove the magnetic attraction cap 702.

[0053] In some embodiments, both the first rotating ring 301 and the second rotating ring 302 are provided with four first threaded through holes 304.

[0054] Specifically, as Figure 3 and Figure 7 shown, by providing four first threaded through holes 304 on the first rotating ring 301 and the second rotating ring 302, the first rotating ring 301 or the second rotating ring 302 can be more reliably fixedly connected to the first fixing plate 201 or the second fixing plate 202.

[0055] In some embodiments, the outer peripheral surface of the first rotating ring 301 and the outer peripheral surface of the second rotating ring 302 are connected by a connecting rod 400. Both ends of the connecting rod 400 are respectively connected to the first rotating ring 301 and the second rotating ring 302 through locking screws 305. The connecting rod 400 is used to synchronously rotate the first rotating ring 301 and the second rotating ring 302.

[0056] Specifically, by providing the connecting rod 400, the first rotating ring 301 and the second rotating ring 302 can be synchronously rotated to respectively align with the positioning grooves 203, without the need to sequentially rotate the first rotating ring 301 and the second rotating ring 302, improving work efficiency. And when the heating wire 500 is wound and the tooling is disassembled, the connecting rod 400 is also easy to disassemble.

[0057] In some embodiments, the positioning groove 203 is a U-shaped groove.

[0058] Specifically, as Figure 6 shown, in order to facilitate the heating wire 500 to enter the positioning groove 203, the positioning groove 203 is set as a U-shaped groove.

[0059] In some embodiments, the fixed column 100 is a telescopic structure, and the length of the fixed column 100 is adjustable.

[0060] Specifically, by setting the fixed column 100 as a telescopic structure, the length of the fixed column 100 can be adjusted to meet the requirements of molecular beam epitaxy source furnaces with different lengths. Among them, the telescopic structure is a prior art and will not be specifically limited here.

[0061] As can be seen from the above, for the heating wire winding tooling of the molecular beam epitaxy source furnace provided by the present application, by arranging positioning grooves 203 on the circumferential surfaces of the first fixing plate 201 and the second fixing plate 202, when the heating wire 500 is wound, the openings 303 of the first rotating ring 301 and the second rotating ring 302 are respectively rotated to the positioning grooves 203, and the heated wire 500 is directly pressed into the positioning grooves 203 after being bent, which is convenient for the heating wire 500 to be directly pressed into the positioning grooves 203 without passing the entire heating wire 500 through the positioning grooves 203. Therefore, during the bending process of the heating wire 500, only the part of the heating wire 500 at the position to be bent needs to be bent, and the heating wire 500 in the remaining part does not need to undergo a large-curvature bending process. Therefore, the probability of plastic deformation of the heating wire 500 can be greatly reduced, thereby effectively ensuring the uniform distribution of the temperature field of the molecular beam epitaxy source furnace.

[0062] In a second aspect, the present application provides a method for winding the heating wire of a molecular beam epitaxy source furnace. Based on the above-mentioned heating wire winding tooling of the molecular beam epitaxy source furnace, the method includes the following steps:

[0063] A1. Overlap at least two support rings 600 and align the respective third through holes, then sleeved them onto the fixed column 100, and then install the first fixing plate 201 and the second fixing plate 202 at both ends of the fixed column 100; a plurality of third through holes (i.e., holes for the heating wire 500 to pass through) are circumferentially arranged on the support ring 600, and the third through holes penetrate the support ring 600 in the thickness direction;

[0064] A2. Install the first rotating ring 301 and the second rotating ring 302 on the first fixing plate 201 and the second fixing plate 202 respectively, align the openings 303 of the first rotating ring 301 and the second rotating ring 302 with the same positioning groove group. After the heating wire 500 passes through the third through holes and is successively pressed into the positioning groove group, adjust the two openings 303 to align with each positioning groove group in sequence, and after each alignment, bend the heating wire 500 and pass it through the corresponding third through hole and press it into the corresponding positioning groove group in sequence; the positioning groove group includes two positioning grooves 203 respectively arranged on the first fixing plate 201 and the second fixing plate 202 and located on the same straight line;

[0065] After winding is completed, remove the first rotating ring 301 and the second rotating ring 302, move the heating wire 500 out of each positioning groove 203, move each support ring 600 to the required position and fix it to the heating wire 500, and then remove the first fixing plate 201 and the second fixing plate 202 and take out the fixing post 100.

[0066] Among them, the specific removal method in step A3 is not limited and can be set according to actual needs. For example, when two support rings 600 are provided, first remove the first rotating ring 301, move the heating wire 500 out of the positioning groove 203 of the first fixing plate 201, then move one of the support rings 600 to the required position near one end of the first fixing plate 201 and fix it to the heating wire 500, then remove the second rotating ring 302, move the heating wire 500 out of the positioning groove 203 of the second fixing plate 202, then move the other support ring 600 to the required position near one end of the second fixing plate 202 and fix it to the heating wire 500, and finally remove the first fixing plate 201 and the second fixing plate 202 and take out the fixing post 100.

[0067] Specifically, align the openings 303 of the first rotating ring 301 and the second rotating ring 302 with the same positioning groove group (as Figure 3 shown), after the heating wire 500 passes through the third through-hole and is pressed into the positioning groove group in sequence, adjust the two openings 303 to align with the next positioning groove group in sequence, and after each alignment, bend the heating wire 500 and pass it through the corresponding third through-hole and press it into the corresponding positioning groove group in sequence. Since the heating wire 500 passes through the corresponding third through-hole after being bent, at this time the heating wire 500 does not pass through the corresponding positioning groove 203 (as Figure 4 shown), no deformation caused by bending will occur. After the heating wire 500 passes through the third through-hole, use an existing bending tool to directly bend the heating wire 500 at the position where it needs to be bent (forming a bending part with the same radius). During the bending process, only a part of the heating wire 500 at the position where it needs to be bent is bent, and the rest of the heating wire does not need to go through a large-curvature bending process. After the heating wire 500 is bent, it is pressed into the positioning groove group, and then rotate the first rotating ring 301 and the second rotating ring 302 to the next group of positioning groove groups (as Figure 5 shown). Therefore, the probability of plastic deformation of the heating wire 500 can be greatly reduced, thereby effectively ensuring the uniform temperature field distribution of the molecular beam epitaxy source furnace. It should be noted that, for a clearer expression of the structure and principle of this application, Figure 3 、 Figure 4 、 Figure 5 only show two support rings 600.

[0068] As can be seen from the above, the method for winding the heating wire of the molecular beam epitaxy source furnace provided by the present application can bend only a part of the heating wire 500 at the position to be bent during the bending process of the heating wire 500, and the heating wire 500 in the remaining part does not need to undergo a large-curvature bending process. Therefore, the probability of plastic deformation of the heating wire 500 can be greatly reduced, thereby effectively ensuring the uniform distribution of the temperature field of the molecular beam epitaxy source furnace.

[0069] In the embodiments provided by the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only illustrative. For example, the division of units is only a logical function division, and there can be other division methods in actual implementation. For another example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some communication interfaces. The indirect coupling or communication connection of devices or units can be in electrical, mechanical or other forms.

[0070] In addition, the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place, or they can be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0071] Furthermore, the functional modules in each embodiment of the present application can be integrated together to form an independent part, or each module can exist alone, or two or more modules can be integrated to form an independent part.

[0072] In this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0073] The above are only the embodiments of the present application and are not used to limit the protection scope of the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A winding tooling for a heating wire of a molecular beam epitaxy source furnace, characterized in that Including: A fixed column (100), a first fixing plate (201), a second fixing plate (202), a first rotating ring (301) and a second rotating ring (302); The first fixing plate (201) and the second fixing plate (202) are parallel to each other and are respectively detachably connected to both ends of the fixed column (100). A plurality of positioning grooves (203) are evenly distributed in a circumferential direction on the peripheral surfaces of the first fixing plate (201) and the second fixing plate (202), and each of the positioning grooves (203) penetrates through both side surfaces of the first fixing plate (201) or the second fixing plate (202) in the thickness direction; The first rotating ring (301) and the second rotating ring (302) are respectively rotatably and detachably arranged on the peripheral surfaces of the first fixing plate (201) and the second fixing plate (202). Each of the first rotating ring (301) and the second rotating ring (302) is provided with an opening (303), and the opening (303) penetrates through the inner and outer peripheral surfaces of the first rotating ring (301) or the second rotating ring (302). The size of the opening (303) is adapted to the positioning groove (203).

2. The molecular beam epitaxy source furnace heating wire winding tooling according to claim 1, characterized in that Each of the first rotating ring (301) and the second rotating ring (302) is provided with at least one first threaded through hole (304), and the first threaded through hole (304) penetrates through the inner and outer peripheral surfaces of the first rotating ring (301) or the second rotating ring (302) and is used for installing a locking screw (305).

3. The molecular beam epitaxy source furnace heating wire winding tooling according to claim 2, characterized in that, A first concave hole (204) is further provided between any two adjacent positioning grooves (203). The first concave hole (204) is adapted to the first threaded through hole (304) and is used for the locking screw (305) to extend into to lock the first rotating ring (301) or the second rotating ring (302).

4. The molecular beam epitaxy source furnace heating wire winding tooling according to claim 1, characterized in that The width of the opening (303) gradually decreases from outside to inside, and the width of the inner end of the opening (303) is equal to the notch width of the positioning groove (203).

5. The molecular beam epitaxy source furnace heating wire winding tooling according to claim 1, characterized in that, Both the first fixing plate (201) and the second fixing plate (202) are connected to the fixed column (100) by at least one screw.

6. The molecular beam epitaxy source furnace heating wire winding tooling according to claim 2, wherein, Each of the first rotating ring (301) and the second rotating ring (302) is provided with four first threaded through holes (304).

7. The molecular beam epitaxy source furnace heating wire winding tooling according to claim 2, wherein The outer peripheral surfaces of the first rotating ring (301) and the second rotating ring (302) are connected by a connecting rod (400). Both ends of the connecting rod (400) are respectively connected to the first rotating ring (301) and the second rotating ring (302) by the locking screw (305). The connecting rod (400) is used for synchronously rotating the first rotating ring (301) and the second rotating ring (302).

8. The molecular beam epitaxy source furnace heating wire winding tooling according to claim 1, characterized in that, The positioning groove (203) is a U-shaped groove.

9. The molecular beam epitaxy source furnace heating wire winding tooling according to claim 1, characterized in that The fixed column (100) is a telescopic structure, and the length of the fixed column (100) is adjustable.

10. A method for winding the heating wire of a molecular beam epitaxy source furnace, characterized in that, Based on the molecular beam epitaxy source furnace heating wire winding tooling according to any one of claims 1-9, the method includes the steps: A1. Overlap at least two support rings (600), align the respective third through-holes, and then slip them onto the fixing post (100). Then, install the first fixing plate (201) and the second fixing plate (202) at both ends of the fixing post (100). A plurality of the third through-holes are circumferentially arranged around the support ring (600), and the third through-holes penetrate the support ring (600) in the thickness direction. A2. Install the first rotating ring (301) and the second rotating ring (302) on the first fixing plate (201) and the second fixing plate (202) respectively, align the openings (303) of the first rotating ring (301) and the second rotating ring (302) with the same set of positioning grooves. After passing the heating wire (500) through the third through-holes and pressing it into the set of positioning grooves in sequence, adjust the two openings (303) to align with each set of positioning grooves in sequence. After each alignment, bend the heating wire (500) and pass it through the corresponding third through-hole and press it into the corresponding set of positioning grooves in sequence. The set of positioning grooves includes two positioning grooves (203) respectively arranged on the first fixing plate (201) and the second fixing plate (202) and located on the same straight line. A3. After winding is completed, disassemble the first rotating ring (301) and the second rotating ring (302), remove the heating wire (500) from each of the positioning grooves (203), move each support ring (600) to the required position and fix it to the heating wire (500). Then, disassemble the first fixing plate (201) and the second fixing plate (202) and remove the fixing post (100).

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